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VS
n-Si
VG
VD
D
n-Si
p-type silicon
source
SiO2
side view
gate
top view
drain
2
transistors
I1
black
box
control
terminal 4
terminal 2
MOSFET
SOI MOSFET
SB FET
FinFET
MODFET (HEMT)
bipolar transistor
JFET
heterojunction bipolar transistor
BTBT FET
SpinFET
circuit symbol
Gate
source
drain
silicon
ID
SiO2
Source
Drain
Body
B
(Texas Instruments, ~ 2000)
common source
Drain
D
ID
ID
Gate
Source
VGS
output
VDS
input
transfer
I D VG , VS , VD
output
IV characteristics: resistor
I
V R
less
resistance
I
R
more
resistance
V
V R
Ohms Law
I0
I0
V
V
I0
Lundstrom Fall 2012
IV characteristics: transistors
ID
D
ID
VGS1
G
S
VDS
n-channel
enhancement
mode MOSFET
gate voltage
gate voltage controlled
controlled resistor
current source
linear region
saturation region
I0
I 0 V R0
I0
R0
V
V
Lundstrom Fall 2012
10
IV characteristics: transistors
ID
D
ID
VGS1
G
S
VDS
n-channel
enhancement
mode MOSFET
11
ID
VGS
G
S
subthreshold region
n-channel
enhancement
mode MOSFET
linear region
VDS
saturation region
12
ID
transfer characteristics
high VDS
low VDS
VDS 2 ! VDS1
ID
G
S
VDS1
VDSAT
VDS
saturation voltage
VT
threshold voltage
VGS
13
applications of MOSFETs
symbol
amplifier
switch
D
G
G
S
S
14
input
signal
output
signal
S
p-MOSFET
ID
ID
0 VG ! VT VD ! 0
VS
n-Si
15
channel
n-Si
0 VG VT VD 0
VS
p-Si
channel
p-type silicon
n-type silicon
side view
side view
Lundstrom Fall 2012
p-Si
output resistance:
RON : Pm
rd
: Pm
ID
on-FXUUHQWP$P
mA Pm
I D VGS
VGS
VDS
VDD
transconductance
gm {
VDS
VDD
16
Lundstrom Fall 2012
'I D
'VGS
PS
VDS
Pm
ID
ION
mA Pm
VDS
off-current
VDD
VDS
0.05 V
VGS
VTSAT
17
threshold voltage
VTLIN
VDD
n
log10 I D
VDS
ION
VDD
mA Pm
VDS
0.05 V
mV V
off-current
subthreshold swing:
mV decade
VGS
VT
18
VDD
Lundstrom Fall 2012
summary
Given the measured characteristics of a MOSFET, you
should be able to determine:
1.
2.
3.
4.
5.
6.
7.
8.
9.
on-current: ION
off-current: IOFF
subthreshold swing, S
drain induced barrier lowering: DIBL
threshold voltage: VT (lin) and VT (sat)
on resistance: RON
drain saturation voltage: VDSAT
output resistance: ro
transconductance: gm
understanding MOSFETs
VGS ! VT
n-Si
VD
n-Si
y
p-Si
x
3S2
2P6
2S2
1S2
4
EG
EV
1.1 eV
r
E r
C
5
Lundstrom Fall 2012
r
E r
V
EF
EV
Fermi function
f0 E
1
1 eE EF kBT
f0 E | eEF E kBT
EF E
non-degenerate semiconductor
Boltzmann statistics
EC
EF
EV
n0
n0 p0
7
Lundstrom Fall 2012
E E
k T
N C e F C B L
ni2
EC
p0
EF
EV
n0 p0
8
Lundstrom Fall 2012
E E
k T
NV e V F B L
ni2
n-Si
n-Si
y
p-Si
x
EC
EC
EF
EF
EF
EV
EV
9
source
channel
Lundstrom Fall 2012
drain
EC
EF
EF
EF
EV
EV
source
channel
drain
10
q\ x
EC
EC 0 q\ x
EV
EV 0
EF
EC
EV
x
source
drain
channel
11
Lundstrom Fall 2012
q\ x
EC x
EC 0 q\ x
EV
EV 0
EF
EC
EV
x
source
12
channel
q\ x
EC x
EC 0 q\ x
EV
EV 0
drain
n-Si
n-Si
y
p-Si
x
13
Lundstrom Fall 2012
EC
EC 0 q\ s
EC
x
n0
NC eEF EC kBTL /cm 3
Qn \ S q n0 ydy C/cm 2
0
14
Lundstrom Fall 2012
EC
EF
EC
EC 0 q\ s
15
Lundstrom Fall 2012
E
EC x EC 0 q\ s x
EF 1
EC x
qVDS
EF 2
EF 2
16
Lundstrom Fall 2012
EF 1 qVDS
x
VGS
(Court
Courtesy, Shuji Ikeda, ATDF, Dec. 2007)
EC
17
Lundstrom Fall 2012
W Qn 0 X x (0)
EC x
0
In a well-designed
transistor, the height of
the energy barrier is
mostly controlled by the
gate voltage and only
weakly controlled by the
drain voltage.
18
n-Si
VD
n-Si
y
p-Si
x
(a)
a) device
(b)
(c)
c) equilibrium (S > 0)
(d)
d) non-equilibrium with VG and VD > 0
applied
20
FN
Lundstrom Fall
2012
20
S.M. Sze, Physics of Semiconductor
Devices,
1981 and Pao and Sah.
21
MOSFET IV characteristic
gate-voltage
controlled
current source
circuit
symbol
on-current
ID
VGS
VDS
VGS
S
gate-voltage
controlled
resistor
(Courtesy, Shuji Ikeda, ATDF, Dec. 2007)
2
Lundstrom Fall 2012
MOSFET IV
L
0
VGS ! VT
n-Si
VD
n-Si
ID
W Qn x X x ( x)
Q
C{
F
V
p-Si
V
Qn | Cox VGS VT
MOS electrostatics
Qn | 0
Cox
3
Lundstrom Fall 2012
H ox
tox
GS
F cm 2
C m2
VD
VGS
Qn x | Cox VGS VT
ID
W Qn x X x ( x)
Qn
Cox VGS VT
X x
4
Ex
PeffE x
VDS L
gate-voltage
controlled
resistor
ID
Lundstrom Fall 2012
W
Peff Cox VGS VT VDS
L
VGS ! VT
Qn x Cox VGS VT V( x)
Note: thickness of channel
illustrates the areal density of
electrons not the actual
thickness.
VD
V xpinch
VGS VT
Qn xpinch | 0
Electric field is very large in
the pinch-off region.
5
Lundstrom Fall 2012
E x
1 dEC x
dx
EC
VGS
6
Lundstrom Fall 2012
gate-voltage
controlled
current source
VD
V xpinch
VGS VT
VGS
Qi x Cox VGS VT V( x)
ID
W Qi x X x ( x)
W Qi 0 X x (0)
Qn 0 Cox VGS VT
X 0
7
PeffE x 0
ID
W
2
Peff Cox VGS VT
2L
velocity saturation
VGS VT |
velocity cm/s --->
1.0 V
| 3 u 10 5 V/cm
30 nm
107
X X sat
X PE
105
104
electric field V/cm --->
8
Lundstrom Fall 2012
VG
xpinch L
E x !! 10 4
ID
W Qn x X x ( x)
Qn
Cox VGS VT
Xx
X sat
VD
ID
9
Lundstrom Fall 2012
107
X X sat
X PE
104
105
ID
10
Lundstrom Fall 2012
Velocity (cm/s)
velocity overshoot
EC
Pm
X SAT
Pm
D. Frank, S. Laux, and M. Fischetti, Int. Electron Dev. Mtg., Dec., 1992.
11
Lundstrom Fall 2012
MOSFET: IV (re-cap)
I DLIN
W
Peff Cox VGS VT VDS
L
ID
I DSAT
VDSAT
12
VD
ID
VDSAT
VDSAT
VD d VDSAT : I D
I DLIN
VD ! VDSAT : I D
I DSAT
X SAT L
Peff
VD
I DLIN
W
Peff Cox VG VT VD
L
I DSAT
WCox X sat VG VT
discussion
The model we have outlined is based on physics that is valid
for long channel MOSFETs from the 1960s, 70s, and early
80s.
but:
1) Mobility is a concept that describes diffusive channels (many
MFPs long).
2) The velocity does not saturate in short, high-field regions (it
overshoots)
Lundstrom Fall 2012
14
discussion
15
16
Lundstrom Fall 2012
energy bands
E
n0
NC eEF EC kBTL
EC
EG
EF
EV
p0
n0 p0
ni2
NV eEV EF kBTL
y
Assumptions:
i) equilibrium, ii) Boltzmann carrier statistics, iii) uniform electrostatic potential
Lundstrom Fall 2012
electrostatic potential
VG ! 0
+
+
+
+
+
+
+
p0 x NA
p0 x | NA
y
0
n
\ y
\S
surface potential
y
Lundstrom Fall 2012
3
EC ( y) constant q\ ( y)
band bending
n0 ( y)
NC eEF EC ( y) kBTL
EC ( y) EC 0 q\ ( y)
EF
EV ( y) EC ( y) EG
p0 ( y)
NV eEV ( y) EF kBTL
y
increasing electrostatic potential
Lundstrom Fall 2012
V 0
V VG
V 0
V 0
y
Lundstrom Fall 2012
6
V 0
V VG
x
V 0
Lundstrom Fall 2012
7
SiO 2
EFM
0
EFM
qVG
EC
EFM
EF
EV
y
(Ignore metal-semi
workfunction differences for
now.)
q\ S
q\ y
EC \ y 0 (arbitrary reference)
EF
qVG ! 0
EFM
EV
EC ( y) constant q\ ( y)
\ ( y)
EC (f) EC ( y)
q
\S 0
qVG 0
EFM
EC
EF
p0 ( y)
EV
p-type Si
NV eEV ( y) EF kBTL
f
QS
q p0 ( y) NA dy C/cm 2
0
10
\S ! 0
EC
EF
qVG ! 0
EV
EFM
y
WD
p0 ( y)
NV eEV ( y) EF kBTL | 0
n0 ( y)
NC eEF EC ( y) kBTL | 0
U( y) | qNA
U( y) | 0
Lundstrom Fall 2012
y WD
y t WD
C cm 3
C cm 3
11
Poisson equation
d D y
U( y)
dy
\S ! 0
EC
dE
dy
EF
qVGc ! 0
U( y)
H Si
EV
EFM
y
WD
E y
d\ y
dy
d 2\
dy2
U( y)
H Si
12
depletion (ii)
dE
dy
U( y) qNA
U( y)
H Si
\S ! 0
ES
EC
dE
dy
qNA H Si
EF
qVGc ! 0
EV
WD
y
WD
Lundstrom Fall 2012
qNA
E y
WD y
H Si
qNAWD QS
ES
H Si
H Si
13
depletion (iii)
E
ES
ES
\S ! 0
dE
dy
qNAWD H Si
qNA H Si
EC
WD
EF
\ y E ( y) dy
EV
qVGc ! 0
\S
WD
WD
Lundstrom Fall 2012
1
E SWD
2
2H Si\ S qNA
14
depletion (iv)
2H Si\ S qNA
WD
\S ! 0
QS
qNAWD
2 qNAH Si\ S
EC
(depletion charge)
EF
qVGc ! 0
EV
QS | QD ~ \ S
(very close)
y
WD
Lundstrom Fall 2012
15
onset of inversion
Electron concentration in the bulk:
nB
\ S !! 0
ni2 NA pB
n0 ( y 0)
EC
n0 ( y 0) nBeq\ S
EF
EV
qVGc ! 0
y
WD
NC eEF EC (0) kBTL
kBTL
nBeq\ S
kBTL
NA
\S
\B
16
2\ B
kBTL NA
ln
q
ni
inversion
n
QS
QS
QD Qn
WT
\S
2\ B
\B
kBT NA
ln
q
ni
depletion
charge
inversion
charge
WT
2H Si 2\ B qNA
17
MOS electrostatics
accumulation
depletion/
inversion
flat band
q\ S 0
q\ S ! 0
EC
EC
EC
EF
EF
VG
EF
VG
VG
\S 0
EV
EV
EV
\S
\S ! 0
18
MOS electrostatics
log10 QS \ S
C/cm2
~ e q\ S / 2 kBT
EC
~ e q\ S / 2 kBT
VG
EF
EV
~ \S
\S
Lundstrom Fall 2012
\S
0
19
wrap up
1) The gate voltage bends the bands in the
semiconductor.
2) Charge results from accumulation, depletion, or
inversion.
3) To understand MOSFETs, we need to understand
how the inversion charge is related to the gate
voltage. (Or equivalently, how the surface potential is
related to the gate voltage.)
Lundstrom Fall 2012
20