Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Content
Existing Network Challenges
SingleRAN solution Proposal
Network modernization overview
Multi-mode BSC modernization solution
SingleRAN sites modernization solution
OSS system Modernization solution
What Modernization brings to Maroc Telecom network?
SON Solution: Evolution to the future
QoS/QoE Improvements
Innovative TCO solution
Page 2
CN
MGW
BSC
BSC
HISILICON SEMICONDUCTOR
BSC
Backhaul
Backhaul
Backhaul
Spectrum
Low reliability, no
R&D focus on
solving existing
problem
Low spectrum
efficiency, no tight
frequency reuse
solution
Capacity
Voice
Buy
Maintain
Inadequate voice
quality, no VQE
features
Bulks of equipments,
high CAPEX
Approaching end of
life-cycle, high
maintenance cost
High labor cost
Low
Performance
HISILICON SEMICONDUCTOR
Deploy
Operate
Page 4
Content
Existing Network Challenges
SingleRAN Solution Proposal
Network modernization overview
Multi-mode BSC modernization solution
SingleRAN sites modernization solution
OSS system Modernization solution
What Modernization brings to Maroc Telecom network?
SON Solution: Evolution to the future
QoS/QoE Improvements
Innovative TCO solution
HISILICON SEMICONDUCTOR
Page 5
HLR/Auc
MGW
GSM/UMTS CN
SGSN
Transmission Network
GSM OSS
MSC
GGSN
HLR/Auc
SGSN
MGW
UMTS OSS
Transmission Network
GSM/UMTS OSS
TRC
BSC
RNC
Multi-Mode BSC
Transmission
Network
Transmission
Network
ATM
Legend
Transmission
Network
IP
TDM
IP
ATM
GGSN
BTS
BTS
NodeB
NodeB
SingleRAN
BTS
HISILICON SEMICONDUCTOR
Page 6
SingleRAN
BTS
35pt
Color: R153 G0 B0
Corporate Font :
FrutigerNext LT Medium
nt to be used by customers
and
partners :
Arial
22pt
:
18pt
Color:Black
Corporate Font :
FrutigerNext LT Medium
nt to be used by customers
and
partners :
Arial
MSS/
MGW
Ethernet
GGSN/ MME/
SGSN S-GW
E1
CN
IP network
BSC6900
BSC6900
M2000(GSM/UMTS)
LTE traffic ,
bypass BSC
/Clock Server
IP network
Macro Sites
Mini Sites
HISILICON SEMICONDUCTOR
Macro Sites
Mini Sites
Site configuration
Min
Max
Site configuration
Min
Max
2740
4450
2740
4530
400
740
400
720
560
900
560
900
800
1200
800
1200
200
600
200
600
Total
4170
7890
Total
4170
7890
Multi-Mode BSC
Min
Max
Multi-Mode BSC
Min
Max
Type1
30
30
Type1
30
30
Type2
50
50
Type2
50
50
We provide quotation based on IAM required, the proposal solution is provided too.
HISILICON SEMICONDUCTOR
Page 8
BTS3900(indoor)/BTS3900A (Outdoor)
H*W*D: 700*600*480(3900A)
GSM: 72TRX
UMTS: 24 carriers
DL:1536CE/ UL:1536CE
Full Configuration: <=210kg
-40C - +55C
HISILICON SEMICONDUCTOR
0 foot print
GSM: 8 TRx(Omni)
UMTS: 4 carrier(Omni)
H*W*D: 600*400*390
Weight: <=50kg
E1/T1, STM-1, FE, GE
AC/DC input
RRU
BBU
0 footprint
GSM: 72 TRX
UMTS: 24 carriers
DL:1536CE/ UL:1536CE
Weight: BBU: 11kg, RRU: 19kg
Temperature: BBU: -20C - +55C; RRU: -40C +55C
Page 9
GSM900+UMTS900
The SWAP case is for
S444(G900)+S111(U900)+S222(G1800)
MWM
RR R
FF F
UU U
MRFU
Existing Battery
M
R
F
U
M
R
F
U
M
R
F
U
M
R
F
U
HISILICON SEMICONDUCTOR
Page 10
W WW
RRR
F FF
UUU
W WW W WW
RRRRRR
F FF F FF
UUUUUU
M
R
F
U
M
R
F
U
MM
RR
FF
UU
M
R
F
U
M
R
F
U
GSM1800
Existing Battery
Existing Battery
HISILICON SEMICONDUCTOR
Page 11
GSM1800
W WW W WW
RRR RRR
F F F F F F
UUU UUU
W WW
RRR
F F F
UUU
HISILICON SEMICONDUCTOR
GSM900
Page 12
M
R
F
U
M
R
F
U
M
R
F
U
M
R
F
U
M
R
F
U
M
R
F
U
DBS site(outdoor)
RRU
RRU
BBU
BBU
HISILICON SEMICONDUCTOR
Page 13
link budget shows that Uplink is the limiting link in most scenarios. Increasing base station power has no effect
on improving cell coverage. In typical scenarios, 20W will be sufficient for IAM in urban and rural areas
respectively.
increasing power is less effective in boosting capacity in urban areas than rural ones by theoretical
analysis and simulations analysis.
HISILICON SEMICONDUCTOR
Page 14
2100
900
2100
900
2100
900
Propagation Model
SPM
Okumura-Hata(Huawei)
SPM
Okumura-Hata(Huawei)
SPM
Okumura-Hata(Huawei)
0.33
0.84
0.71
1.71
1.97
3.59
1365.39
1041.83
1124.74
999.18
1317.04
924.07
Dense Urban
Urban
Suburban
HISILICON SEMICONDUCTOR
Page 15
GSM900
UMTS2100
GSM900/
UMTS900
GSM900/
UMTS900
GSM900
UMTS2100
DCS1800/
LTE1800
Page 16
Diplexer
GSM900
UMTS2100
No
GSM/
UMTS900
DCS1800
/LTE1800
UMTS2100
GSM/
UMTS900
UMTS2100
0.3dB
GSM/
DCS1800/
UMTS900 LTE1800
Diplexer
UMTS2100
New
Macro
Sites
SWAP
Mini Sites
New Mini
Sites
Min
IAM Requirement
Huawei proposal
70
600
1670
330
330
50
80
10
50
50
S444 (G900) + S222 (G1800) +HW Ready for S111 (U900) + S333 (U2100)
460
400
200
200
100
100
HISILICON SEMICONDUCTOR
Page 18
16 existing RNC
Expansion
UMTS
UMTS
Solution 3
UMTS
BSC 2400TRx
RNC4Gbps
6 existing BSC
Expansion
UMTS UMTS
GSM
BSC1960TRx
RNC4Gbps
Solution 2
UMTS
UMTS UMTS
UMTS
UMTS UMTS
BSC 1024TRx
RNC4Gbps
HISILICON SEMICONDUCTOR
GSM
Solution 4
3 existing RNC
UMTS UMTS
Expansion
UMTS
UMTS
GSM
GSM
UMTS GSM
UMTS
UMTS GSM
Deploy
17 New mBSC
GSM
BSC1500TRx
RNC4Gbps
Page 19
GSM
UMTS
2540site
6.3Mbps/
64QAM+MIMO
Cell Throughput
5.3Mbps/
16QAM
6.1Mbps/
64QAM+DC
6.97Mbps/
64QAM+DC+MIMO
5.3Mbps/
16QAM
5.3Mbps/
16QAM
6.1Mbps/
64QAM+DC
6.97Mbps/
64QAM+DC+MIMO
6.3Mbps/
64QAM+MIMO
HISILICON SEMICONDUCTOR
Page 20
6.3Mbps/
64QAM+MIMO
Solution two:
MSC Server
MSC Server
Ater-PT
BSC
TC
A-PT
MGW
TC
BSC
A-PT
MGW
TC
Page 21
RNC
16
Capacity improve
UO UMTS 1Gbps -> GU GSM 2400TRX UMTS 4Gbps
17
More than 70% handover failure is due to the interBSC handover. The inter-BSC handover will spend
more time for message exchange, radio link will be
failure before message response.
HISILICON SEMICONDUCTOR
Page 22
Standby
Common Model
N : 1 Disaster Recovery
Slave
Alarm/Configuration
Model
Performance
Model
Performance
Model
Standby server provide the hot backup service for master server and slave server at
the same time.
1.
2.
3.
4.
HISILICON SEMICONDUCTOR
Page 23
Master
Standby
EMS upgrade
Routine data
modification
HISILICON SEMICONDUCTOR
Page 24
Content
Existing Network Challenges
SingleRAN solution Proposal
Network modernization overview
Multi-mode BSC modernization solution
SingleRAN sites modernization solution
OSS system Modernization solution
What Modernization brings to Maroc Telecom network?
SON Solution: Evolution to the future
QoS/QoE Improvements
Innovative TCO solution
HISILICON SEMICONDUCTOR
Page 25
HISILICON SEMICONDUCTOR
Page 26
SON network
SON network for planning
SON network for operation
Green
SoN
QoS/
QoE
HISILICON SEMICONDUCTOR
Page 27
Content
Existing Network Challenges
SingleRAN solution Proposal
Network modernization overview
Multi-mode BSC modernization solution
SingleRAN sites modernization solution
OSS system Modernization solution
What Modernization brings to Maroc Telecom network?
SON Solution: Evolution to the future
QoS/QoE Improvements
Innovative TCO solution
HISILICON SEMICONDUCTOR
Page 28
HetNet SON
Keep
Innovating
SingleSON
Smart Network
Multi-layer
SingleRAN SON
Inter-RAT
LTE SON
Intra-RAT
HISILICON SEMICONDUCTOR
Page 29
HetNet
SingleRAN
LTE
SON
HISILICON SEMICONDUCTOR
Multi-layer ANR(TBD)
GU Refarming(TBD)
GUL Mobility optimization(TBD)
GUL load balance optimization
(TBD)
Inter-RAT Coordinated
shutdown (TBD)
SON
SON
Self- Optimization
Page 30
Self- Maintenance
GUL CODC(TBD)
CODC-LTE(TBD)
Automation
Site Survey
1.
Engineering Design
31%
2.
Engineering Management
40%
5%
14%
3%
7%
Installation
Commissioning
M2000
3.
4.
Accepetance test
MBTS discovery
Software &
configuration
download
Health check
Commissioning
report generation
Page 31
MBTS(GU
L)
Micro-eNB
(SON Scanner integrated)
Planning
Tool
M2000
Area1
Area2
Macro1/Conf1
Macro2/Conf2
Macro3/Conf3
Automatic Discovery
Micr
o
Micr
o
Area1
Micr
o
Area2
Micr
o
Automatic
Software
Download
Automatic Planning
Automatic
Configuration
No need high accuracy(5m) digital map for micro eNodeB detailed planning
Easy planning(only area parameters planning is required), minimize mistakes
HISILICON SEMICONDUCTOR
Page 32
SingleSON
Page 33
Load
Load
GU coverage overlapping
GL coverage overlapping
UL coverage overlapping
GSM
SingleSON
Site
Load
Duration
Power consumption
Per Hour
LTE
Power
Consumption
Intra-RAT
Power saving
Inter-RAT
Power saving
High
4 hours
1000Wh
Medium
14 hours
700Wh
Low
6 hours
410Wh
Per Day
16260Wh
Page 34
Setting
SON Features
Tracking
System Log
99.00%
0.260%
98.50%
0.240%
0.220%
98.00%
Evaluation
0.200%
97.50%
0.180%
97.00%
0.160%
96.50%
0.140%
96.00%
0.120%
95.50%
0.100%
2009-10-26
2009-10-31
2009-11-5
2009-11-10
2009-11-15
2009-11-20
HQI
2009-11-25
2009-11-30
Graphic KPI
HISILICON SEMICONDUCTOR
Page 35
Geographical View
Content
Existing Network Challenges
SingleRAN solution Proposal
Network modernization overview
Multi-mode BSC modernization solution
SingleRAN sites modernization solution
OSS system Modernization solution
What Modernization brings to Maroc Telecom network?
SON Solution: Evolution to the future
QoS/QoE Improvements
Innovative TCO solution
HISILICON SEMICONDUCTOR
Page 36
1. High
TRX
2. High throughput of RNC
3. High capacity of mBTS
4. 3.8MHz reframing saving
GSM frequency
High
capacity
Excellent
voice
quantity
Flexible
capacity
modify
Improve
indoor
coverage
1. High
1. MCPA technology
makes
easy to modify capacity
2. Power and Spectrum sharing
between G/U/L
3. Support of Iur-g interface
HISILICON SEMICONDUCTOR
transmit power to
enhance indoor coverage
2. Micro site and DBS site solution
improve indoor coverage
Page 37
Capacity RNC
No of cells
No of Erlangs
BHCA
Radio Part
HISILICON SEMICONDUCTOR
SRAN6.0
24Gbps
5100
100500
3720
Supported
Page 38
BSC
TC
Improved ratio
Per BSC
total
Per BSC
total
Number of TRX
750
11250
4096
40960
264%
4800
72000
24000
240000
234%
BHCA(K)
180
2700
5900
59000
2085%
1680
25200
16384
163840
550%
89%
10 sets BSC6900 can replace 15 sets Motos BSC, 89% foot-print, 200% capacity gain
Less BSCs, less inter-BSC HO, performance improved.
HISILICON SEMICONDUCTOR
PCU
Page 39
2G SGSN
2G
SGSN
WRNC
UMTS Cell
GBSC
BSC6900
GSM Cell
HISILICON SEMICONDUCTOR
UMTS Cell
No requirement on CN node
Internal cell load exchange, avoid unnecessary interRAT HO, HO successful rate increasing & signaling
saving
In NACC, ~10% HO delay reduction, user feeling
improvement
Page 40
Excellent
+0.3 MOS
WB-AMR
+0.3 MOS
+0.1MOS
Good
+0.1MOS
AMR Threshold
Adaptive Adjustment
+0.0MOS
Fair
+0.2 MOS
+0.2MOS
EAMR
+0.1MOS
+0.0MOS
AMR
+0.2MOS
+0.3MOS
EFR
+0.1MOS
A MOS
High CIR
FR
B MOS
Low CIR
3~5dB
UL&DL gain
Uplink Improvement
30%
Sites
reduced
40% Coverage
increased
30%
Investment
savings
1800MHz
50%~100% more
Downlink Improvement
Radius
20 % increase
PBT - 0~ 3dB gain.
MCPA - 0~ 3dB gain
Tx Diversity - 0~ 3dB gain
900MHz
8 dB -- downlink
900MHz
1800MHz
6 dB -- uplink
HISILICON SEMICONDUCTOR
~10% less
Page 42
Horizon(CTU2)
Horizon II
M-Cell
Huawei
Gain (dB)
Coverage
improve
S222(W/dBm)
43dBm
43dBm
46dBm
46dBm
~3dB
30%
S333(W/dBm)
40dBm
43dBm
43dBm
44.3dBm
~1.3dB
20%
S444(W/dBm)
40dBm
43dBm
43dBm
43dBm
0%
S555(W/dBm)
36.5dBm
39.5dBm
39.3dBm
40.8dBm
~1.5dB
20%
S666(W/dBm)
36.5dBm
39.5dBm
39.3dBm
40dBm
~0.7dB
10%
Rx sensitivity
-111dBm
-110dBm
-107dBm
-113.5dBm
-113.5dBm
Configuration
Talk family
Ultra site
Flexi EDGE
Huawei
Gain (dB)
Coverage
improve
S222(W/dBm)
44.5dBm
45.7
46dBm
46dBm
~0.3dB
5%
S333(W/dBm)
41
42
42.7dBm
44.3dBm
~2.3dB
25%
S444(W/dBm)
41
42
42.7dBm
43dBm
~1dB
15%
S555(W/dBm)
37.5
38.6
39.4dBm
40.8dBm
~3.2dB
30%
S666(W/dBm)
37.5
38.6
39.4dBm
40dBm
~2.5dB
25%
Rx sensitivity
-110.5
-112.5
-110.5
-113.5
-113.5dBm
HISILICON SEMICONDUCTOR
Page 43
Conventional solution
G222: 4.8Mhz
G444: 9.6Mhz
G555: 12Mhz
G111+U111: 7.4Mhz
G222+U111: 9.8Mhz
G444+U111: 14.6Mhz
G555+U111: 17Mhz
HISILICON SEMICONDUCTOR
UMTS
GSM
Total
G222: 3.6Mhz
G444: 5Mhz
G555: 5.9Mhz
G111+U111: 6.6Mhz
G222+U111: 7.8Mhz
G444+U111: 9.2Mhz
G555+U111: 10.1Mhz
Page 44
Total Power
UMTS Power
UMST2100 10M
HSPA Power
GSM900 5M
GSM900 10M
GSM Power
TCH Power
UMTS900 5M
TCH Power
BCCH Power
BCCH Power
UMTS
Page 45
Content
Existing Network Challenges
SingleRAN solution Proposal
Network modernization overview
Multi-mode BSC modernization solution
SingleRAN sites modernization solution
OSS system Modernization solution
What Modernization brings to Maroc Telecom network?
SON Solution: Evolution to the future
QoS/QoE Improvements
Innovative TCO solution
HISILICON SEMICONDUCTOR
Page 46
TCO Analysis
Deployment, 8%
Cost
Main
Equiptment,
34%
Aux., 15%
21.7
20
40%
10.4%
12.4
13
17%
20%
11.1
10
7.5
5.8
53%
7.5
3.5
Power, 24%
Deployment
Maintain, 10%
Rental, 9%
High
integration
CAPEX
OPEX
TCO=BuyDeployOperateMaintain
Auxiliary
Less cabinets
Less foot-print,
Less civil works
less A/C
MCPA
BTS No
combiner
Soft
Less foot
print, low
rental cost
Less auxiliary
expansion
Rental
Page 47
Power
Advance IC,
Less power
consumption
Software
expansion
no site visit
Modernization
Batteries
GSM
S2/2/2
UMTS
S1/1/1
Batteries
Huawei BTS3900A
GSM2/2/2 + UMTS1/1/1
Batteries
Existing BTS
Page 48
19%
Busy
Busy
Idle
Busy
Idle
TRX
state
Without
PA
Power
9%
2002
Busy
40%
PA Efficiency
TRX
Idle
45%
Busy
2005
2006
2008
Hardware
2010
Software
Power consumption
(16W output , 1800M, S2/2/2, 50% traffic )
1000W
570 W
456 W
Motorola
Current Solution
PA
Power
HISILICON SEMICONDUCTOR
With
Page 49
IP support
not support
Access
Transmission
Total Price
Expense
Means
Resource
(Month)
Saving
E1
4E1
$4400
IP
8M IP leased line
$350
92%
Abis Multiplex
Abis over IP
FE/GE
IP/MSTP/Data Network
Hybrid IP
BSC1
FE/GE
FE
E1/T1
N*E1
PDH/SDH
HISILICON SEMICONDUCTOR
Page 50
Effective
Solution
Network
Construction
Radio resource
Dynamic
Sharing
Site facility
Spectrum
Efficiency
40%
RF Hardware
Efficiency
Transmission
Efficiency
Network
Operation
Power
Efficiency
Operation
OM
Efficiency
60%
Resource Efficiency
20%
Deployment Efficiency
EasySite
Site
Efficiency
Transmission
20%
30%
Save ~50% Power consumption
Operation Efficiency
20%
Save 4463% Annual Cost
Efficient Transmission
Summary
Single OSS
HISILICON SEMICONDUCTOR
Cost Efficiency
Page 51
It is the only vendor can support 5 frequency band, 3 mode, 1 cabinet solution;
SingleRAN has 4 years commercial application experience, it is a mature solution;
HISILICON SEMICONDUCTOR
Page 52
Thank you