PIM Testing at

Rogers Corporation
Advanced Circuit Materials Division
Patricia LaFrance, Chris Caisse, & Allen F. Horn, III
Lurie R&D Center, Rogers, CT
John Coonrod, Ling Smith, & Art Aguayo
Rogers Advanced Circuit Materials Division, Chandler, AZ
Evan Yuan & Sharon Young
Rogers Suzhou & Shanghai, China

Discussion Outline

What is PIM?
PIM standard at IEC
Reverse vs. Forward PIM
Description of Rogers laminate PIM tests
PIM Test Repeatability & Statistics
PIM Processing Observations and Experiment
Conclusions

Intermodulation (IM)
In a ideal linear system (where V = IR perfectly) no new
frequencies can be generated. If f1 and f2 are input,
then only f1 and f2 will be output.
If a system is non-linear (like a power amplifier nearing
its saturation point) then IM products can be generated
at frequencies such as (f1 - f2), (2f1 - f2), (3f1 - f2), (3f1 2f2), (4f1 - f2), (4f1 - 2f2), (4f1 - 3f2)..
Only some odd IM products will occur in-band:
IM3: (2f1 - f2)
IM5: (3f1 - 2f2)
IM7: (4f1 - 3f2)

Intermodulation (IM)

Passive Intermodulation (PIM)

PIM is IM generated by a passive system or device,
such as a filter, power divider or antenna.
Power levels are extremely low. Even a very bad PIM
level of -133 dBc (referenced to 20 watts) is 10-12 W.
Typical sources of non-linearity:

Nearby ferrous metals

Metal particles on a planar circuit
Metal particles in connectors
Corroded connections
Stressed connectors

PIM is not a basic material property

Like insertion loss, antenna efficiency, gain, return loss,
and many other important electronic performance
measures, PIM is a property of a circuit or system, not of
a material. It also depends on input power and
frequency.
However, there are material properties such as copper
profile that when properly controlled, can result in
consistently lower PIM.
We build a certain Rogers internal standard circuit and
test it at standard conditions to assess the relative PIM
performance of different laminate materials.

PIM is not a basic material property

3rd order PIM is always highest in power, so if you
measure a value for IM3, you can be certain that IM5
and IM7 will be lower power.
IM3 depends on 3rd power of the current density.
Different circuit designs will exhibit very different PIM
values, even with the same material and connectors.
Example:
Rogers 50 ohm TL PIM circuit on 0.75 mm thick
RO4730JXR laminate exhibits a PIM of about -153 dBc.
A customer builds a filter on this laminate that exhibits PIM
of -168 dBc

PIM Testing at Rogers Standards Development

PIM Test Methods are addressed by the IEC

TC46 WG6 Document IEC 62037.
IEC 62037 does not address testing of copper
clad laminate materials
In general, IEC recommends testing Reverse
PIM when possible.
Rogers presently tests for PIM using a method
recommended by Summitek Instruments now
Kaelus.
8

Reverse vs. Forward PIM Measurements

If PIM is relatively high (e.g., -130 to 140 dBc) and
emanates from multiple point sources, the reverse PIM
measurement can result in cancellation, while the
forward measurement does not.
For low PIM and/or distributed sources, this is not an
issue.
Both Kaelus and IEC recommend measuring reverse
PIM when possible due to difficulties with the low power
PIM signal and the high power base signals incident on
the duplexer in the forward measurement.

PIM Testing at Rogers Method 2001 to present

Rogers PIM Test Method:
300 mm long 50 ohm microstrip transmission lines on
1.5 mm laminate, stiffened by lamination to 1.5
mm FR4.
DIN 7/16 coax to microstrip connectors soldered to
each end
Port 2 of the test sample is connected to a low-PIM
load.
43 dBm (20W),two-tone, swept, reflected
measurements with Summitek SI-1900b instrument at
1900 MHz

10

PIM Testing at Rogers Method

Rogers PIM Test Method - continued
Manipulate sample and connectors to get best
stable PIM value over the swept frequency
range (1930-1990 MHz)
Report average PIM value at 1870 MHz of the
up and down sweeps in dBc.
dBm = dBc + 43
PIM tester performance is checked before
and after each test session with a PIM source
and a low PIM load
11

Summitek 1900b PIM Tester

12

DIN 7/16 Connector

13

Next generation on PIM Testing at Rogers

DIN 7/16 currently used for many connections in a BTS
system, but most coax to microstrip connections are now
made through low PIM solder-plated braided jacket cable
and simple coax to microstrip connector.
Due to the very large growth in telecom industry since
2001 PIM testing equipment is much more widely used,
more user-friendly and less expensive
Rogers has added PIM testing capability at our Suzhou
and Chandler locations, with Kaelus iQA-1921c PIM
analyzers.

14

Next generation on PIM Testing at Rogers

1.5 mm thick 50 ohm TL circuits with 0.141 flexible
solder plated low PIM cables and light weight Coax-tomicrostrip soldered connectors.
We measure PIM versus time at 1870 MHz generated by
fixed 1990 MHz and 1930 MHz tones and manipulate
connections and stress to get best PIM levels.
We have shown we get same values on all three (two
new iQA-1921cs and our Summitek 1900B)

15

Kaelus iQA-1921c PIM Tester

16

New PIM test set up

17

Soldered connection from 0.141 low PIM cable

18

Rogers Reporting of PIM Testing

Sample #

Best PIM
IM3
dow
n

Best PIM
IM3
up

-154.9

-154.6

DH2

-166.4

Lot X08924
w/ 1 oz.
LoPro

Material

DJ1
Lot X08922
w/ 1 oz.
LoPro

Best PIM
IM3
dow
n

Best PIM
IM3
up

-154.8

-146.2

-146.7

-166.6

-166.5

-154.9

-154.2

-154.6

-155.9

-155.9

-155.9

-160.3

-160.9

-160.6

-159.3

-159.6

-159.5

-155.6

-155.5

-155.6

-156.4

-156.2

-156.3

-153.5

-153.6

-153.6

-160.2

-160.4

-160.3

-163.1

-162.1

-162.6

-160.1

-160.3

-160.2

-155.5

-155.9

-155.7

-159.8

-159.4

-159.6

-159.3

-158.8

-159.1

Average
up&dow
n

Average
up&down

Grand
AVG
-158.2

-158.4

19

PIM Testing at Rogers General results

Weve purposely obtained a wide range of data:

(-105 dBc to 175 dBc), with high profile foils,
added ferrous metals, and conductive particles
to help understand the test.
As long as the cladding is pure copper and
nothing is added to increase PIM, the major
controlling variable related to a laminate is foil
roughness.

20

Laminate PIM versus Copper foil Profile

(Rq - RMS profile - microns)
-120

PIM (dBc)

-130

-140

-150

-160

-170
0

0.5

1.5

2.5

3.5

4.5

Rq - RMS Profile - (microns)

21

Repeatability of PIM Test

Major concern is test repeatability

Repeatability of a PIM test is about 3 dBc,
without disconnecting sample.

This is consistent with what Kaelus specifies for

repeatability of their PIM sources.

22

Repeatability of PIM Test

Based on four sample measurements, the
repeatability of a laminate PIM test is about 6
dBc, including dis- and re-" connection when
measuring in the -155 to -170 dBc range.
Repeated samples/measurements are
necessary to understand material performance.

23

24

PIM Statistics

The repeatability of measurements affected by

normal random variation improves by a factor of
1/n where n is the number of measurements.
We have shown that the 95% confidence limit of
a single PIM measurement is +/- 12 dBc.
By measuring groups of 4 samples we improve
the 95% confidence limit to +/- 6 dBc.
More samples would reduce confidence limit
e.g., sets of 8 samples would be +/- 3 dBc
25

PIM Statistics

With a 95% confidence limit of +/6 dBc for the

groups of four samples, significant
measurement-induced variation is more
common than you might think.
As the following Monte Carlo simulation
demonstrates, if a group of four circuits is
measured on consecutive days and the results
compared, the most likely outcome is that one of
the days measurements has higher PIM by 3
dBc or more
26

PIM Statistics
The Monte Carlo method is so-named since it is
simulates a real gambling session.
Randomly select a group of 1000 values that fit
distribution of mean of -157 and sigma of 3 (this is the
first measurement).
Repeat random number generation for second
experiment.
If you average the differences between measurement 1
and measurement 2, it will be close to 0.
However, if you look at the absolute value of the
differences, result is quite different.
27

PIM Statistics
Last 10 Lines & Averages for PIM Statistic Simulation
Absolute
Trial Number
"Run 1"
"Run 2"
Difference Difference
990
-159.2
-154.3
4.92
4.9
991
-154.9
-149.0
5.86
5.9
992
-159.4
-156.3
3.08
3.1
993
-151.8
-156.1
-4.26
4.3
994
-157.5
-156.6
0.90
0.9
995
-157.7
-154.6
3.05
3.1
996
-155.3
-157.6
-2.33
2.3
997
-155.5
-151.4
4.12
4.1
998
-156.4
-152.6
3.80
3.8
999
-159.1
-153.9
5.21
5.2
1000
-160.8
-153.4
7.43
7.4
AVG
-156.97
-157.05
-0.08
3.35
Std. D.
2.91
3.05

28

PIM Statistics

29

PIM Statistics Conclusion:

If you really want to understand moderate

PIM differences, many measurements
must be made.

30

PIM Testing for Production Control

With purchase of new PIM testing equipment,

we are starting to regularly measure PIM as a
production reference test.

31

PIM & PROCESSING

OBSERVATIONS

32

PIM & Processing Observations

Due to the large measurement 95% confidence

limit of +/- 6 dBc, it is very time consuming to
collect significantly significant data comparing
effect of various factors on PIM.
Nonetheless, over the years, some things seem
to be significant.

33

Material & Connector Stress

Stress in the material, connector, and solder

joint can have a large effect on PIM.
We manipulate the sample and joints during
testing to obtain the lowest PIM values

34

PIM, current density, power level and thickness

The PIM values depend highly on the current
density on the conductors, with higher density
leading to higher PIM.
Standard input power level for many test
protocols (including Rogers) is 20 W (43 dBm)
on a 50 ohm transmission line on 1.5 mm
laminates.
Circuits that have a lower current density will
exhibit lower PIM than the value on this test
circuit.
35

PIM, current density, power level and thickness

Example:
A 50 ohm transmission line on 0.75mm
RO4730JXR laminate exhibits PIM of about 150 to -155 dBc with two 20 watt tones at 1870
MHz.

A customer routinely builds filters on 0.75 mm

RO4730JXR laminate that exhibit < -168 dBc with
two 20 watt tones at 1870 MHz.

36

PIM, current density, power level and thickness

Example:
A 300mm long 50 ohm transmission line on 1.5
mm RO4730JXR laminate can typically exhibit
a PIM value of -163 dBc.
A 300mm long 50 ohm transmission line on 0.75
mm RO4730JXR laminate can typically exhibit a
PIM value of -150 to -155 dBc.

37

PIM, current density, power level and thickness

RO4350B laminate with standard foil is a nonantenna grade that uses a high profile copper foil
and exhibits high PIM in our standard test.
However, RO4350B laminates can exhibit low PIM
at lower power levels.
PIM Levels with two tone inputs at power level listed below (dBc/dBm)
Material
0.060" RO4350B Std Foil
0.030" RO4350B Std Foil
0.020" RO4350B Std Foil

20 W
10W
5W
2W
1W
-145/-102
-133/-90 -137/-107 -144/-107 -147/-114 -151/-121
-135/-92 -138/-108 -137/-100 -145/-112 -152/-122

38

PIM & Processing observations

As an experiment we also added small amounts of Fe
powder (~1%) to the 0.08 mm thick dielectric layer in the
center of a 1.5 mm laminate.
Dk & Df were not affected.
However, PIM was -120 dBc
Without added Fe, PIM would have been <-157 dBc

39

PIM & Processing observations

Metallic powder on dielectric surface causes

very bad PIM.
Years ago, a colleague was going to show me
how removing Cu oxide would improve PIM.
As soon as he touched the surface with
sandpaper and generated Cu particles, there
was a large increase in PIM.

40

PIM & Processing observations

We routinely use sanding to generate a range of

bad PIM materials for our gauge analyses.
Start with a better than -160 dBc material.
Sand it a little to increase PIM to -143 dBc
Sand it more to increase PIM to -125 dBc.
Wipe the surface with a solvent-soaked rag to
remove the copper particles and one can see
the PIM improve significantly

41

PIM & Processing observations

Similarly if a sample is under-etched and

nodules of copper are left in the dielectric, you
would expect to see bad PIM.
Customers have told us that this happens.
However, Rogers has not been able to recreate
the effect in a controlled manner.

42

PIM & Etching Residue

Etching Residue on Surface causes poor PIM
We had installed a new etcher at R&D. Rinse section was not
functioning properly. Coupons exhibited poor PIM.
After the initial testing, the PIM coupons were cleaned by wiping
with 10% sulfuric acid and rinsed with DI water.
Significant improvement in PIM was seen.

43

PIM improvement with solder mask and immersion Sn

Samples are 300 mm 50 ohm TLs on 0.75 mm

laminates:

RO4534 Lot A bare Cu PIM = -144 dBc

RO4534 Lot A SM & immersion Sn PIM = -158 dBc
RO4534 Lot B bare Cu PIM = -150 dBc
RO4534 Lot B SM & immersion Sn PIM = -156 dBc
RO4730JXR bare Cu PIM = -154 dBc
RO4730JXR SM & immersion Sn PIM = -159 dBc

44

PIM & Processing observations

Customers report that ENIG results in poor PIM.

45

PIM Processing Experiment

We set up an systematic experiment to determine
the effects of various processing changes on PIM.
These included:

Slight under etch

Cupric chloride & ammoniacal etching chemistry
Combinations of solder mask, bare Cu, and tin plating
Plating finish
HASL, immersion silver and tin
Surface cleaning
Microetch vs. pumice scrub

46

PIM Processing Experiment

We were hoping that many of the factors that
had lead to improvements in PIM in the past
would be consistently demonstrated.
Unfortunately, the control circuits of 50 ohm TLs
on 1.5 mm RO4730JXR laminate exhibit PIM
of better than -160 dBc, so nothing could be
consistently better.
None of the factors we investigated showed a
significant difference.

47

Conclusions
PIM is not a material property. It is a circuit and system
property that depends on many variables.
Due to the high variability of PIM when testing near the
noise floor, multiple samples are required to differentiate
between relatively low PIM materials.
Laminate copper profile is a major variable affecting the
PIM of microstrip transmission lines.
Rogers is committed to monitoring PIM performance of
our antenna grade materials.

48

Rogers Low PIM PTFE Materials

Since copper roughness is normally the major
variable, Rogers PTFE-based materials with low
profile rolled foil have always exhibited low PIM
values.
RO3003, RO3203 and RO3035 laminates
are silica filled for low z-axis CTE, very low
temperature coefficient of dielectric constant,
and relatively high thermal conductivity.

49

Antenna Materials: PTFE based

Dk
10 GHz

Df
10 GHz

Thermal Conductivity
(W/m/K)

PIM
(dBc)

RT/duroid5880
Laminates

2.2 .04

0.0009

0.26

<-160

RO3003
Laminates

3.00 .04

0.0013

0.50

<-160

RO3203
Laminates

3.02 .04

0.0016

0.50

<-160

RO3035
Laminates

3.5 .05

0.0017

0.50

<-160

50

Rogers Low PIM RO4000 Thermoset Materials

The use of LoPro reverse-treated foil has

allowed the development of a family of low PIM
RO4000 laminates.
RO4500 and RO4700 antenna grade
laminates exhibit the rigidity, low CTE, low
TCDK, and low cost circuit processing that
typifies all RO4000 laminates.

51

RO4000 Antenna Materials

Dk
10 GHz

Df
(2.5/10)
GHz

Thermal Conductivity
(W/m/K)

PIM
(dBc)
typical

RO4533
Laminates

3.3

0.0020
0.0025

> 0.60

<-157

RO4534
Laminates

3.4

0.0021
0.0027

> 0.60

<-157

RO4535
Laminates

3.5

0.0031
0.0037

> 0.60
UL 94V0

<-157

RO4725JXR
Laminates

2.55

0.0023
0.0033

> 0.40

<-160

RO4730JXR
Laminates

3.0

0.0023
0.0033

> 0.40

<-160

52

Arlon low PIM AD WG-PTFE-ceramic laminates

In January, 2015, Rogers finalized the

acquisition of Arlon, LLC.
Arlons woven glass-PTFE-ceramic filled
laminates are widely used in telecom antenna
applications requiring low PIM.
The AD-C series is priced for high volume
applications
53

Arlon low PIM AD WG-PTFE-ceramic laminates

Dk
10 GHz

Df
10 GHz

Thermal Conductivity
(W/m/K)

PIM
(dBc)

AD250C
Laminates

2.50 .05

0.0014

0.30

<-160

AD255C
Laminates

2.55 .05

0.0014

0.30

<-160

AD300C
Laminates

2.97 .05

0.002

0.50

<-160

54

Smarter Solutions
for
Better Technology
The information contained in this presentation is intended to assist you in designing with Rogers products. It is not intended to and does not create any warranties, express
or implied, including any warranty of merchantability or fitness for a particular purpose or that the results shown on the design guide will be achieved by a user for a particular
purpose. The user should determine the suitability of Rogers products for each application.
RO4500, LoPro, RO3003, RO3203, RO3035, RO4534, RO4533, RO4535, RO4350B, RO4730JXR, RO4725JXR, RO4000, RT/duroid, The world runs better with Rogers.,
and the Rogers logo are licensed trademarks of Rogers Corporation.

Copyright 2015 Rogers Corporation. All Rights Reserved.

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