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Krishnamo0rthi.S *, K.Y Goh, Desmond Y.R.Chong **, R. Kapoor, Anthony Y.S. Sun
United Test & Assembly Center Ltd.
5 , Serangoon North Ave. 5,Singapore, 554916
Tel: 65-65511386 Fax: 65-65511366
Email: *krishnamoorthi s@utac.com.sg , **desmond chone&tac.com.sg
Abstract
This paper addresses the development of thermally
enhanced (advanced) Quad Flat No lead or QFN package.
The QFN package is a promising choice for portable
wireless applications such as Bluetootb and Home RF. This
package offers attractive attributes in terms of a near CSP
footprint, good electrical and thermal characteristics.
Thermal characterization of a new thermally enhanced QFN
type of package named as HQFN. The HQFN package
structure is similar to a normal QFN package except that it
has an exposed heat spreader attached to the active die using
a die-attach film (DA film) material. The study is done in
comparison with a normal QFN type of package using
commercial CFD simulation software and validated with
experiments. Sensitivity analysis is made for the effect of
DA film material thermal conductivity and effect of heat
spreader size.
The new HQFN package is able to achieve a better
thermal performance than normal QFN without thermally
saturating the PCB. Simulation results show that with a
metal housing attached to the top of the package, it is
possible to achieve thermal improvement of more than 20%
under airflow conditions, and around 10% improvement
under still-air conditions, when compared to a normal QFN
package under the same test conditions.
Keywords: HQFN, thermal resistance, CFD modelling and
simulation, Experimental program, thermal measurement
and thermal performance.
Nomenclature
Q = Die power,W
Oja=Junction to ambient thermal resistance, deg.C/W
Ojh=Junction to board thermal resistance, deg.C/W
%ja=Junctionto case thermal resistance, deg.C/W
Ojth=Thermal resistance, deg.C/W
Tj =Junction temperature, deg.C/W
Ta =Ambient temperature, deg.C/W
Tc =Package case temperature, deg.C/W
Q = Heat flow rate, W
K = Thermmal conductivity, W/mK
R = Thermal resistance, deg.C/W
A =Area of cross section, m**2
Material
Mold compound
Die-attach
Heat spreader adhesive
(HSA) material
- Lead frame
Heat spreader (Cu &Si)
PCB Dielectric
PCB Trace
S"lrlpr
1. Introduction
The role of semiconductor industries is targeting
towards to reach compactness in package size with high
thermal performance i.e. reducing physical miniaturization
in both in-plane dimension and out-of-plane dimension
without sacrificing the thermal performance. As in the
Thermal conductivity(W/m K)
0.75
1.4
0.3
262
262,117.5(temp. dependant*)
0.3
385
5n 4
485
A-Metal housing
B-Heat spreader adhesive
C-Heat spreader
Convection+Radiation
.(
486
I
Heat
spreader
cu
Si
N.A*
Without
metal
housing
2LPCB
N.A*
X
X
2LPCB
X
X
X
4LPCB
X
X
X
487
+Simulation
Max.9.1 %error
65
60
0
0.5
Ai: meed&)
2.5
I +Simulation
\\
0.5
Max.7.3 %
1
1.5
Air speed(m/s)
2.5
1 1
488
$37
?
3 36
9
*
35
2
+ 34
33
32
D.&.-F.-.D
35
I
0.4
0.8
1.2 1.6 2
2.4 2.8
Heat sureader size in mm
3.2
.--D.-p--a
HOFN at Omis
30
QFN at 2 d s
k-
1
2
3
HSA material thermal conductivity(W/m K)
-2
8 , -
0.4
0.8
1.2
1.6
2
2.4
Heat smeader size in mm
2.8
32
489
Acknowledgements
The authors would like to thank the management of
UTAC for their support in bringing out this paper. And also
the authors would like to thank Temasek Polytechnic
student Mr. Chew Keng Yeow for helping in dbing the
experiments.
References:
I. Kaveh Azar, Thermal measurements in eleclronics
cooling, CRC, Press, 1997.
2. Bruce M. Guenin, Packaging: designing for thermal
performance, Electronics cooling, May 1997, pp.14-19
3. EIAIJESD51-I,
Integrated
circuits
thermal
measurement method-Electrical Test Method (Single
semiconductor device), Dec 1995.
4. EIAIJESDS 1-2, Integrated circuits thermal test method
environmental conditions- Natural convection(Stil1
air), Dec 1995
5. EIAIJESDS 1-6, Integrated circuits thermal test method
environmental conditions- Forced convection(Moving
air), Mar 1999
6. EIAIJESDS1-4, Thermal test chip guideline, Feb
1997.
7. EIAIJESDSI-5, Extension of thermal test board
standards for packages with direct thermal attachment
mechanisms. Feb 1999.
8. J.P.Holman, Heat transfer (Fifth Edition), McCrawHill, 198I ,
9. Pecht, Micheal G, Electronic Packaging: Materials
and their properties, CRC Press, 1999
-C HQFN at 0s
HQFN at 2 d s
a
aJ
-m-
86
f
82
41:
r;j
0
78
-c
c.
sO 74
0
3.2
490