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Abstract
With mixing different sized SiC particles, high reinforcement content SiCp/Al composites (Vp 50; 60 and 70%) for electronic packaging
applications were fabricated by squeeze casting technology. The composites were free of porosity and SiC particles distributed uniformly in
the composite. The mean linear coefficients of thermal expansion (20 100 8C) of SiCp/Al composites ranged from 8.3 to 10.8 1026/8C and
decreased with an increase in volume fraction of SiC content. The experimental coefficients of thermal expansion agreed well with predicted
values based on Kerners model. The Brinell hardness increased from 188.6 to 258.0, and the modulus increased from 148 to 204 GPa for the
corresponding composites. The bending strengths were larger than 370 MPa, but no obvious trend between bending strength and SiC content
was observed.
q 2003 Elsevier Ltd. All rights reserved.
Keywords: A. Metalmatrix composites; A. Particle-reinforcement; B. Coefficient of thermal expansion; B. Mechanical properties; Squeeze casting
1. Introduction
Particles reinforced aluminum matrix composites
(PRAMCs) have received much recognition in electronic
packaging and thermal management (such as power module
base plates, printed wiring board cores, microprocessor lids,
or electric enclosures), for their flexible fabrication
techniques, tailorable thermo-physical properties and excellent specific mechanical properties [1 5]. Because temperature cycling often exists in the operating environment of
electronic components, a reinforcement volume fraction of
. 60% is necessary [1,5,6] for coefficient of thermal
expansion (CTE) matching with those of electronic
components or ceramic substrates to reduce thermally
induced stresses and increase the reliability of electronic
devices. The lifetime limitation of hybrid power modules
can be improved more than 10 times by replacing copper
with SiCp/Al baseplate [7].
Composites with 55 75 vol% particle reinforcements
are produced by powder metallurgy [4,8] or pressureless
infiltration process [9,10]. However, limitations of these two
* Corresponding author. Tel.: 86-451-864-2164; fax: 86-451-8643922.
E-mail address: zhang_tsiang@sina.com (Q. Zhang).
1359-835X/$ - see front matter q 2003 Elsevier Ltd. All rights reserved.
doi:10.1016/S1359-835X(03)00253-7
1024
Table 1
Chemical compositions of 4032Al (wt%)
4032Al
Si
Cu
Mg
Fe
Ni
Zn
Al
11.99
0.5 1.3
0.81.3
1.0
0.51.3
0.25
Bal.
Table 2
Properties of SiC particle [15] and 4032Al [16]
Youngs Shear
Bulk
Poissions
Density CTE
(g/cm3) ( 1026/ modulus modulus modulus ratio
8C)
(GPa)
(GPa)
(GPa)
SiC
3.18
4032Al 2.68
a
4.7
20.8a
By experiments.
450
69
192
29.7
225
77.5
0.17
0.33
1025
Fig. 2. SEM micrographs of SiCp/Al composites. (a) 50% SiCp/Al composite, (b) 60% SiCp/Al composite, (c) 70% SiCp/Al composite.
ac
Fig. 2 showed the SEM microstructure of as-fabricated
SiCp/Al composites. It was found that larger SiC particles
were necessary in larger volume fraction composites.
Though different SiC particles were used in the different
composites, SiC particles distributed uniformly in the
composite and fine SiC particles occupied the interstitial
positions around coarse particles efficiently. Three SiCp/Al
composites were all dense and macroscopically homogeneous, and seldom particles cluster was observed. A
dense microstructure was beneficial to electronic packaging
applications because of improvement in mechanical
strength and heat conductivity.
3.2. Thermal expansion analysis
The measured CTEs of SiCp/Al composites were 8.3, 9.7
and 10.8 1026/8C for the 70, 60 and 50% composites,
respectively. The CTEs were reduced with an increase in
volume fraction of SiC. In a SiCp/Al composite, the thermal
expansion behavior is influenced by the thermal expansion
of aluminum matrix and the tightened restriction of SiC
particles. Since the restriction of SiC increased with the
increasing of particles content, the CTEs of SiCp/Al
composites were reduced. The CTEs were slightly higher
than those of ceramic substrates, but the difference in CTE
was favorable since it would make the substrates in
compression when cooling from elevated temperature to
ambient temperature during welding. The compressive
forces could reduce the probability of component cracking.
Several theoretical models were proposed to predict the
CTE of particulate composite. If the matrix modulus is
much smaller than that of reinforcement, the CTE of a
composite is expressed as rule-of-mixture [17] (ROM):
ac am Vm ap Vp
am Km Vm ap Kp Vp
Km Vm Kp Vp
ac am Vm ap Vp Vp Vm ap 2 am
Kp 2 Km
Vm Km Vp Kp 3Kp Km =4Gm
1026
Table 3
Mechanical properties of SiCp/Al composites
Brinell hardness
50% SiCp/Al
60% SiCp/Al
70% SiCp/Al
188.8(6.0)
208.7(5.5)
258.0(7.2)
422.0(12.6)
371.8(10.1)
390.7(10.4)
Modulus (GPa)
Measured
H-S model
148(10.1)
165(7.3)
204(8.9)
164.3
193.8
231.4
90.1
85.1
88.2
Fig. 4. SEM bending fractographs of SiCp/Al composites (a) 50% SiCp/Al composite. (b) High magnification image of the framed area in (a). (c) 60% SiCp/Al
composite, (d) 70% SiCp/Al composite.
1027
Em Vm Ep Vp 1
Ep Vm Em Vp 1
4. Conclusions
1. With mixing proper volume fractions of different particle
sizes, 50, 60 and 70% SiCp/Al composites were
fabricated by squeeze casting process, then the composites were macroscopically dense and homogeneous.
2. The linear CTEs of SiCp/Al composites ranged from 8.3
to 10.8 1026/8C, depending on the volume fraction of