ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

IPC-AC-62A
Aqueous Post Solder
Cleaning Handbook

IPC-AC-62A
January 1996
Supersedes IPC-AC-62

A standard developed by IPC

2215 Sanders Road, Northbrook, IL 60062-6135
Tel. 847.509.9700 Fax 847.509.9798
www.ipc.org

January 1996

IPC-AC-62A

Table of Contents
1.0

SCOPE ...................................................................... 1

1.1

Purpose .............................................................. 1

2.0 APPLICABLE IPC DOCUMENTS AND

REFERENCES.................................................................... 1

2.1

Joint Industry Standards .................................. 1

3.0

TERMS AND DEFINITIONS ..................................... 1

3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
4.0

Aqueous Cleaning.........................................
Wash or Washing......................................
Rinse or Rinsing.......................................
Drying ...........................................................
Gross Drying.................................................
Defluxing (Flux Removal or Post
Solder Cleaning) .............................................
Fine Cleaning................................................
Screen and Stencil Cleaning ........................
Semi-Aqueous Cleaning ...............................
Organic Solvent Cleaning ............................
Non-Reactive Additives................................
Reactive Additives or Reactants ..................
Organic Solvent Emulsions in Aqueous
Media...............................................................
Manual Cleaning...........................................
Batch Cleaning..............................................
In-Line Cleaning...........................................

1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2

INTRODUCTION ....................................................... 2

5.0 OBJECTIVES OF THE CLEANING PROCESS

DESIGN .............................................................................. 3
6.0 CONTAMINANT TYPES AND REMOVAL
CHARACTERISTICS .......................................................... 3

6.1
6.2
6.3
6.4

Polar Residues ...................................................

Non-Polar Water Soluble Residues...................
Non-Polar Water Insoluble Residues ................
Non-Solubilizable Residues ..............................

4
4
6
6

7.0 MECHANISMS AND EFFECTS OF AQUEOUS

CLEANING ......................................................................... 7

7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.3
7.4
7.4.1
7.4.2

Wetting of surfaces............................................
Dissolution .........................................................
Ionic Dissolution ...............................................
Non-Ionic Dissolution .......................................
Surface Agent Dissolution, Emulsification.......
Saponifier Dissolution .......................................
Chelation Dissolution ........................................
Solder Ball and Particulate Removal................
The Physics of Cleaning ...................................
Temperature .......................................................
Mechanical Agitation ........................................

7
7
7
7
7
7
7
8
8
8
8

7.4.3
7.5
7.6

Ultrasonic Agitation .......................................... 8

Rinsing ............................................................... 8
Drying ................................................................ 8

8.0 FACTORS THAT INFLUENCE SELECTION OF

WASH AND RINSE MEDIA, PROCESS CONDITIONS
AND APPLICATION EQUIPMENT .................................... 8

8.1

Environmental, Safety and Health

Aspects............................................................... 8
Waste Type and Quantity Generated,
Waste Management ........................................... 8
Conservation Efforts and Feasibility................. 9
Hazards and Controls ........................................ 9
Type of Flux and Contaminants to be
Removed .......................................................... 10
Degree of Cleanliness to be Achieved
and Volume to be Processed ........................... 10
Materials and Component Compatibility
with Media and Process .................................. 10
Equipment Compatibility with Media ............ 10
Part Geometry.................................................. 10
Process Cost..................................................... 11
Cost Model Elements ...................................... 11

8.1.1
8.1.2
8.1.3
8.2
8.3
8.4
8.5
8.6
8.7
8.7.1
9.0

WATER RESOURCES AND QUALITY ................. 11

9.1
9.1.1
9.1.2
9.2
9.3
9.3.1
9.3.2
9.3.3
9.3.4

Measurement of Water Purity ......................... 11

Non-Ionic ......................................................... 11
Ionic ................................................................. 12
Water Purity Standards.................................... 12
Water Purification Methods............................. 13
Mechanical Filtration ...................................... 13
Water Softening ............................................... 13
Dissolved Mineral Removal............................ 13
Miscellaneous Methods ................................... 14

10.0

WASH AND RINSE MEDIA ................................. 14

10.1
10.2
10.3
10.4
10.5
10.6

Water without Additives..................................

Surfactants and Other Non Reactive
Type Additives.................................................
Non Saponifier Reactive Additives.................
Saponifiers .......................................................
Organic Solvent Emulsions in Water..............
Rinse Water Parameters ..................................

11.0

THE WASH/RINSE/DRY PROCESS .................... 16

11.1
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5

Application Methods, Wash and Rinse...........

Brush................................................................
Immersion ........................................................
Spray in Air .....................................................
Spray Under Immersion ..................................
Centrifugal .......................................................

14
14
15
15
16
16

16
16
16
16
16
17
iii

IPC-AC-62A

11.1.6
11.2
11.2.1
11.2.2
11.2.3
11.2.4
11.2.5
11.2.6
11.3
11.3.1
11.3.2
11.3.3
11.3.4
11.3.5
11.3.6
11.4

Ultrasonics .......................................................
Drying ..............................................................
Gross and Fine Drying....................................
Air-knife and Forced Air Drying ....................
Radiation Drying .............................................
Vacuum Drying................................................
Organic Solvent Drying Agents ......................
Centrifugal .......................................................
Solder Flux Removal ......................................
Water Soluble Organic Acid Flux...................
Rosin Type Flux ..............................................
SA Type Flux...................................................
Low Residue/No-Clean Flux ..........................
Removal of Other Materials ...........................
Solder Paste Removal from Stencils ..............
Fine Cleaning ..................................................

January 1996

17
18
18
18
18
18
18
19
19
19
19
19
19
19
20
20

12.0 EFFECTS FROM AQUEOUS MEDIA,

APPLICATION AND DRYING METHOD ON
MATERIALS AND ELECTRICAL COMPONENTS ......... 20

12.1
12.1.1
12.1.2
12.2
12.3
12.4
12.5
12.6
13.0

13.1
13.1.1
13.1.2
13.1.3
13.2
13.2.1
13.2.2
13.2.3
13.3
13.4

Chemical Effects..............................................
Water without Additives..................................
Water with Additives.......................................
Thermal Effects ...............................................
Mechanical Effects from Spray
Impact ..............................................................
Effects from Ultrasonic Energy ......................
Effects from Centrifugal Forces......................
Electrostatic Discharge from Drying
Operations........................................................

20
20
20
20
20
20
21
21

14.1.2
14.1.3
14.2
14.2.1

Testing for Residues (Surface

Cleanliness)......................................................
Electrical/Environmental Testing ....................
Optimizing and Controlling Process
Parameters........................................................
Process Controls ..............................................

21
21
21
21
21
21
22
23
23
24

25
25

15.0 WASTE MANAGEMENT AND REGULATORY

ISSUES ............................................................................. 25

15.1
15.1.1
15.1.2
15.1.3
15.2
15.2.1
15.2.2
15.2.3

Environmental Issues ......................................

Air Emissions ..................................................
Wastewater.......................................................
Solid Waste ......................................................
Contamination Removal and
Treatment .........................................................
Air Emissions ..................................................
Wastewater.......................................................
Solid Waste ......................................................

25
26
26
27
27
27
27
30

Appendix A

................................................................. 32

Appendix B

................................................................. 37

Figures
Figure 41

Post Solder Assembly Cleaning Processes ............... 3

Figure 42

Flux/Cleaning Options............................................... 4

Figure 43

Cleaning Media Types ............................................... 5

Figure 151

Closed Loop Design without Chelating Agent....... 31

Figure 152

Closed Loop Design with Chelating Agent ............ 31

Figure A1

Basic Steps............................................................... 33

APPLICATION EQUIPMENT ............................... 21

Bench Top, Manual .........................................

Open Tank Cleaning........................................
Non-Immersion Cleaning ................................
Drying ..............................................................
Batch Type.......................................................
Single-Chamber Spray ....................................
Multi-Chamber Immersion..............................
Multi-Chamber Spray ....................................
In-Line Equipment ..........................................
Screen and Stencil Cleaners............................

24
25

Tables
Table 81

Ratings for Reactivity.............................................. 10

Table 82

Wash Media, Typical Cleaning Capability ............. 12

Table 151

Heavy Metal in Effluent ......................................... 27

Table 152

Separation Technologies ......................................... 29

Appendix A, Table One

High Ionics Reading After Cleaning... 34

Appendix A, Table Two

White Residue ...................................... 34

Appendix A, Table Three Incomplete Drying ............................... 35

Appendix A, Table Four

Water Recycling, short Mechanical

Filter Life ............................................. 35

Appendix A, Table Five

14.0 EVALUATION AND PROCESS

OPTIMIZATION ................................................................ 24

Water Recycling, Poor Organics

Removal ............................................... 35

Appendix A, Table Six

14.1
14.1.1

Water Recycling, Short Life of Ion

Exchange Resins .................................. 35

Appendix A, Table Seven Miscellaneous Anomalies .................... 36

iv

Evaluation and Data Collection ...................... 24

Material and Component
Compatibility ................................................... 24

January 1996

IPC-AC-62A

Aqueous Post Solder Cleaning Handbook

1.0 SCOPE

2.6.9.1, Test to Determine Sensitivity of Electronic

This handbook addresses aqueous cleaning of electrical/

electronic parts and application tools after soldering.

Assemblies to Ultrasonic Energy

1.1 Purpose The content of this text is intended to pro-

vide a basic understanding of the subject and to serve as a

guide to users or prospective users of aqueous cleaning
technology, allowing selection or improvement of aqueous
cleaning processes.
2.0 APPLICABLE DOCUMENTS

2.6.13, Assessment of Susceptibility to Metallic Dendritic

Growth : Uncoated Printed Wiring
2.6.14, Resistance to Electromigration, Polymer Solder-

mask
IPC-PE-740 Troubleshooting Guide for Printed Board
Manufacture and Assembly
2.1 Joint Industry Standards1

IPC-B-24

Surface Insulation Resistance Test Board

IPC-B-25

Standard Test Board

J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies

IPC-B-36

Cleaning Alternatives Test Board

NOTE:

IPC-T-50 Terms and Definitions

IPC-SC-60

Post Solder Solvent Cleaning

IPC-AC-61

Post Solder Semi-Aqueous Cleaning

IPC-CH-65

Guidelines for Cleaning of Printed Boards and

Assemblies
Organic Surface ContaminationIts Identification, Characterization, Record Effects on Surface Insulation Resistance and Conformal Coating Adhesion

IPC-TP-383

IPC-TM-650

Test Methods Manual

2.3.25, Resistivity of Solvent Extract (Manual)

2.3.26, Ionizable Detection of Surface Contaminants

(Dynamic Method)
2.3.26.1, Ionizable Detection of Surface Contaminants
(Static Method)
2.3.27, Cleanliness Test - Residual Rosin (UV Method)
2.3.27.1, Rosin Flux Residue Analysis, HPLC Method
2.3.28, Ionic Analysis of Circuit Boards, Ion Chromatography Method

For additional documents and references related to

general cleaning issues (IPC, DOD, EIA, UL, ASTM and
ANSI) the reader is referred to IPC-CH-65).

3.0 TERMS AND DEFINITIONS

All terms and definitions used throughout this handbook

are in compliance with IPC-T-50. Other basic terms and
definitions, essential for the discussion of the subject, are
provided below or are defined in appropriate sections of
this handbook.
3.1 Aqueous Cleaning a cleaning process that uses
an aqueous medium, consisting of more than one half of
water for washing, and water for subsequent rinsing.

the primary cleaning

operation that removes undesirable impurities (contaminants) from surfaces by chemical and physical effects.

3.2 Wash or Washing

a cleaning operation (usually following the wash step) where water replaces - via a
dilution mode - any residual contamination.

3.3 Rinse or Rinsing

3.4 Drying the process of removing surface and/or

absorbed water from the washed and rinsed parts.

2.3.38, Surface Organic Contaminant Detection Test (InHouse Method)

3.5 Gross Drying the removal of surface water.

2.3.39, Surface Organic Contaminant Detection Test

3.6 Defluxing (Flux Removal or Post Solder Clean-

(Infrared Analytical Method)

ing)

2.6.3.1, Moisture and Insulation Resistance - Polymeric

Soldermasks and Conformal Coatings

2.6.3.3 Corrosivity Testing

the cleaning process designed to remove solder

flux and by-products. Other objectives are removal of process residues and materials used as production aides, such
as water soluble maskants. Impurities left by board or component fabrication processes or other operations may or

1. IPC, 2215 Sanders Road, Northbrook, IL 60062. Phone: 847-509-9700.