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On Semiconductor is a company with driving energy efficient innovations, allow

customers to reduce global energy usage. The company offers a comprehensive portfolio
of energy efficient power and signal management, logic, discrete and custom solutions to
help design engineer solve their unique design challenges in automotive,
communications, computing, consumer, industrial, LED lighting, medical,
military/aerospace and power supply applications. ON Semiconductor operates a
responsive, reliable, world-class supply chain and quality program, and a network of
manufacturing facilities, sales offices and design centres in key markets throughout North
America, Europe, and the Asia Pacific regions. Global corporate headquarters are in
Phoenix, Arizona. The company operates a network of manufacturing facilities, sales
offices, and design centres in key markets throughout North America, Europe, and the
Asia Pacific regions.
There are many manufacturing facilities operated by On Semiconductor. One of the
manufacturing plants at Asia region is in Seremban, Malaysia. This facility is a high
volume probe, assembly and test factory. The products produce by this facilities are
Power and Small Surface Mount Packages including; QFN/DFN, DPAK, SM, TSOP, TO,
and Leadless.
There are 4 basic processes in making ICs, which are product design, front end process,
back end process and board assembly. Product design is the process design the IC and
simulates the circuit. Front end process is to fabricate wafer. Back end process is to do
wafer mount, wafer saw and wash, die attach, wire bond, mold, plating, trim and form,
electrical testing, mark, and tap and reel. Board Assemble is the process to do board
insertion, board testing and finish goods inventory.

Die Attach
Die attach is also known as die mount or die bond is the process of attaching the silicon
chip to the die pad or die cavity of the support structure. There are few types of die
attach, they are eutectic die attach, soft solder die attach, flip chip bonding, tape and other
die attach process and epoxy die attach. The die attach process that commonly used are
eutectic die attach and epoxy die attach.
The eutectic die attach process is a well-established bonding technique. This technique
has been used in the early days of semiconductors for the first transistors and integrated
circuits (IC). It is still widely used for small signal products manufactured by the millions
every day. Presently, eutectic die attach has regained importance in the field of packaging
optoelectronic components and high-power communication devices. Under high
temperature, the silicon-gold combination forms the eutectic bond. A scrub motion during
the bond process increases the strength and quality of the intermetallic connection
between the chip and substrate. For large chips, additional gold in ribbon form is used.
Because of the high temperature of the process (up to 450C), a protective forming gas
atmosphere (a nitrogen/ hydrogen combination) is needed to prevent oxidation of the lead
Epoxy die attach generally encompasses the use of other adhesives, such as polyimide- or
silicone-based materials. The adhesive is dispensed in paste form on the bond pad of the
lead frame or substrate before die placement. The wafer substrate or the silicon chip is
usually bonded to the lead frame using conductive silver or solder (tin/lead) based on
epoxy polymers. Some of the power product contain epoxy die attach material that
contain 88% - 95% lead.
The machine normally use for die attach is Die Bonder Esec 2100 SC. Die Bonder Esec
2100 SC is the most flexible 300 mm high speed platform, capable of running the smart
card tape. It is the most effortless system to run, assist and control production resulting in
a quantum leap in throughput and yield at the lowest cost of ownership.

Figure: die epoxy adhesive


Figure 2 : Datacon 2200


Figure 3: Die Attach Process