Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Microelectronics
Packaging and
Assembly
Medical
Telecom
Computer
Aerospace
USA
Consumer
Software, Applications
Agenda
ic
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Transportation
Ba
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MPA
31
35
29.6
27.3
27.07
26.64
25.34
24.17
23.76
21.6
19.87
30
25
20
14.98
15
10.61
10
7.55
4.89
5 2.97 3.78
0
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
Other Electrical
Equipment
3%
Computer and
Peripherals
Equipment
7%
Plastic Products
3%
Mens and Boys
Garment
3%
Semiconductor and
Electronics
12%
Other Industries
65%
Apple iPhone
Source: http://news.cnet.com/2300-1041_3-6244920-1.html?tag=mncol
Sources: National Statistics Office
Bureau of Export Trade Promotion, DTI
460
500
438
450
402
376
400
350
315 307
335 346
280
300
Materials SME
Software SME
Instrumentation SME
250
250
Software Development
220
200
160
150
Fab Manufacturing
120
90
100 74 80
Sort Manufacturing
Assembly Manufacturing
50
Test Manufacturing
0
1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007
Sources: Philippine Board of Investments (BOI) &
Philippine Economic Zone Authority (PEZA)
ELECTRONIC SUB-ASSEMBLIES
CONSUMER ELECTRONICS
TELECOMMUNICATIONS
PC/OFFICE EQUIPMENT
Systems Manufacturing
Malaysia Others
2%
8%
Singapore 2%
Taiwan
4%
Philippines
28%
Europe
7%
NUMBER OF FIRMS
860 FIRMS
NATIONALITY:
US
9%
Korea
10%
AUTOMOTIVE ELECTRONICS
2004
Japan
30%
72% Foreign
28% Filipino
Sources: Philippine Board of Investments (BOI) &
Philippine Economic Zone Authority (PEZA)
U.S.
companies
are
shifting
manufacturing
from
Malaysia,
Philippines, Thailand, Indonesia, and
even Mexico to China. Toshiba Corp. (TOSBF
) is making its TVs on the mainland, and Sony Corp. (SNE
) is manufacturing its PlayStations there. Taiwan's
companies produce half of all their informationtechnology products in the country.
China's advantages are numerous. Its wage rates are a third
of Mexico's and Hungary's, and 5% of those in the U.S. or
Japan. China's investments in education and training are
attracting research facilities from companies such as IBM
(IBM ), Motorola (MOT ), and Microsoft (MSFT ). The
critical mass of factories, subcontractors, and specialized
vendors has created a manufacturing environment with
which few can compete. China is not just an export
platform, either; its large and expanding domestic market
is another attraction.
The Microelectronics
Revolution
Source: http://en.wikipedia.org/wiki/Transistor_radio
Source: http://www.ti.com/corp/docs/company/history/tihistory.shtml
In 1959 M. M. (John) Atalla and Dawon Kahng at Bell Labs achieved the first
successful insulated-gate field-effect transistor (FET).
By overcoming the surface states that
blocked electric fields from penetrating into
the semiconductor material. Investigating
thermally grown silicon-dioxide layers, they
found these states could be markedly
reduced at the interface between the
silicon and its oxide in a sandwich
comprising a layer of metal (M - the gate),
a layer of oxide (O - the insulation), and a
layer of silicon (S semiconductor). As
their prototype transistor was slow and
addressed no pressing needs of the
telephone system, it was not pursued
further at Bell Labs
Source: http://www.ti.com/corp/docs/company/history/tihistory.shtml
Moores Law
Gate Insulator
Gate
Source
Drain
The number of transistors per given area of silicon will double every
2 years
The number of transistors per given area of silicon will double every
2 years (Moores Law)
The number of transistors per given area of silicon will double every
2 years (Moores Law)
Intel 4004:
Nov 1971
10 micron technology
2,300 transistors
108 KHz clock
The number of transistors per given area of silicon will double every
2 years (Moores Law)
The number of transistors per given area of silicon will double every
2 years
Intel Pentium 4:
June 2002
0.13 micron technology
55 Million transistors
2.40 GHz clock
The number of transistors per given area of silicon will double every
2 years
Acceleration of Communication
The evolution of electronic assembly has reached the 3-D era. (Source: SiliconPipe)
Reference: An Alternative Approach to Circuit Design and Assembly for High Speed
Interconnections
Source: http://soccentral.com/results.asp?EntryID=10778
Polymers are the most interesting and versatile substances in the world of
material science offering an incredibly wide range of physical and chemical
properties.
Polymers can be viscous liquids, like silicones, or steel-like solids with high
temperature performance.
Although there are natural polymers, such as rubber, most of the thousands
of commercial products are synthesized. Our ability to design polymers with
specific properties is what makes them so useful.
Polymers are now the most critical ingredients for electronic circuitry and
packaging.
Power Distribution
Power Supply
Ground
Microelectronics Packaging
Signal Distribution
Data ( Transmit and/or Receive)
Address
Clock
Control
Traffic Cop, which routes power, ground and signals going into and/or coming
from the die. Interconnects the die to the rest of the system as quickly and with
as little added distortion as possible.
Firefighter, which draw performance-sapping and reliability limiting heat away
from the die to be absorbed by the surrounding environment; and.
Soldier, which protects the die from mechanical stresses and other
environmental effects (moisture, contamination, etc), while creating no
stresses of its own.
Reference: Silicon Contends with Stuffed and Shrinking Packages by Brian
Dipert. June 13, 2002, Electronics Design, Strategy News
Cap
Cap
IC
Wire (Au-Al)
Lead
Frame
Devitrifying
Glass
Base
PLCC
PDIP
Wire
Ceramic Lidded Chip Carrier
Die
Lead
Frame
Hybrid Packages
TSOP
Mold Compound
Die Pad
Interconnect Technology
Ball Grid Array (BGA)
Advanced IC package
for high density low
profile applications
Chip scale
(CSP)
package
Package Interconnect
Pin-Through-Hole (PTH)
The package serves as a space
transformer
from
the
chip
interconnection
to
the
board
interconnection.
First Level Interconnect connects the silicon die to the package. This maybe a
wirebond or a flip chip type interconnect
Second Level Interconnect is the connection between the package and the
system board. This may be in the form of leads, pins or balls arrays.
Wirebond
The pads on the IC chip and the adjoining I/O
signal, power and ground terminals are
connected one by one with Gold (Au) or
Aluminum (Al) wires
Flip Chip
The invention of the flip chip technology
allowed a breakthrough in increasing the
number of internal signal interconnect to
external package pins.
Pins are inserted into through-holes in the circuit board and soldered in
place from the opposite side of the board
Socket available
Manual pick and place possible
Packaging Trends
Reference:
Pentium 4 Processor High-Volume Land-Grid-Array Technology: Challenges and Future
Trends Intel Technology Journal, Volume 09Issue 04 November 9, 2005
Packaging Trends
Packaging Trends
Rents Rule
The biggest limitation of a modern digital IC: Large reduction in signal count
between on chip wires and package pins. Typical IC has:
N P K P N G
Peripheral-bonded chips.
Where:
NP is the number of pins
NG is the number of logic blocks
is Rents constant
KP is a proportionality constant
Rents Rule
Packaging Trends
Packaging Trends
Ball Pitch
Packaging Trends
Source: http://nepp.nasa.gov/index_nasa.cfm/779/
Reference: http://www.semiconductor.net/article/CA6492524.html
Wafer Mount
Wafer Inventory
To FOL
Wafer Saw
Wafer Thinning
Die Attach
Wirebond
Plasma Clean
To EOL
Plasma Clean
Optical Inspection
Encapsulation
B. Substrate
Preparation
A. Die Preparation
To Test Process
AVI
BUMP
REFLOW
WAFER
MOUNT
WAFER SAW
& WASH
APL
C. Assembly Process
CARRIER
TRAY LOAD
Marking
CAM
Test Processes
DEFLUX
EPOXY
Class Test
D. Test Process
Dry Pack
BURN IN
POST BURN
IN CHECK
E. Backend Process
LASER
MARK
Bake
FQA
BALL
ATTACH &
INSPECT
FVI
PACK
FQA