1. What is opto-electronic packaging?

Opto-Electronic Packaging is the physical realization of electronic and information

technology products and systems. These products (or systems) have input and output
functions. They require energy to operate and generate waste heat that must be
removed.
2. What are the main functions of opto-electronic packaging ?

The primary functions of opto-electronic packaging are:

Signal Distribution including Input/Output

o Electrical interconnection
o Optical interconnection
Power Distribution including Input/Output
o Electrical interconnection
Mechanical interconnection.
Heat dissipation.
Housing and protection:
Temperature, humidity, dust, shock & vibration environment during shipping,
handling and customer usage.

3. List the various levels of interconnection in electronic packaging.

Integrated Circuit (IC) Package - the silicon chip is housed in an IC package;
electrical connections are made by thin gold, copper or aluminum wires (first
level of interconnection).

Printed circuit board - IC packages are placed on a circuit board and electrically
connected together (second level) with photo-etched conductor traces, typically
made of copper

Connectors on the circuit boards are inserted into contacts on a backplane,

providing interconnection between the different circuit boards.

The backplane & the circuit boards are housed in a shelf or a housing

Several shelves (or housings) along with power supplies and cables are housed
in a cabinet.

A cabinet may be a stand-alone product or several cabinets may be connected

together by cables to form a larger system.

Several large systems may be connected together to form a network, for

example, the telephone network or the IP network.

4. Make a list of the opto-electronic packaging building blocks from the first or the smallest
level to the whole communication network.

Level 0: IC chip (die)

Level 1: Packaged chip
Level 2: Printed Board
Level 3: Card-on-board
Level 4: Cabinet
Level 4: System
5. What are the key driving forces on electronic packaging design and manufacture?

Cost (cheaper).
Performance (more functions & faster).
Size (smaller, lighter)
Reliability (more rugged and less prone to down time)
Manufacturabilty. (can be manufactured in high volume, with high yield, with
minimum capital investment)
Industry standards and open interfaces

6. What is a through-hole IC package? List the various types of through-hole IC packages.

Through-hole
Single in line packages (SIPs)
Dual in line packages (DIPs).
Pin grid arrays (PGAs).

7. What is a surface mount IC package? List the various types of surface mount packages.

Surface mount.
Leadless chip carriers (QFNs)
Leaded chip carriers.
Quad flat packs (QFPs).
Small outline packages (SO).
Ball Grid Arrays (BGAs).
TAB (Tape automated bonding)

8. List the different types of IC packaging technologies commonly used in industry. Number
them in order of increasing cost, 1 being the lowest cost
9. List the assembly sequence of the most commonly used IC packaging technology starting
with wafer saw to a shippable device. List the approximate temperature of each process in the
assembly sequence.

Wafer Saw
Wafer Sort
Die Attach
(Mechanical
attachment of chip
to package)
Electrical
Connection Chip
to Package

Chip attached to
copper leadframe
with silver filled
epoxy, cured at
175C
Gold wire, 25 to 30
micron diameter,
thermo-sonic bond.

Package Seal or
Encapsulation
Lead Finish

(Copper wire is
beginning to replace
gold)
Mold with epoxy.
Cured at 175C.
Leads solder or tin
plated, trimmed,
and formed.

Visual inspection
Electrical Test
Burn In
Final Electrical
Test
Final Inspection &
Ship
10. What are the advantages and disadvantages of through hole versus surface mount package in
circuit board design and assembly? What has been the industry trend?
11. What is a hermetic IC package? Non-hermetic IC package? Give examples.
12. What are the consequences of using epoxy or any other organic substance as a chip attach
material in a hermetic IC package.