Intel® G31/P31 Express Chipset

Intel G31/P31 Express Chipset
Thermal and Mechanical Design Guidelines

For the Intel 82G31 Graphics and Memory Controller Hub
(GMCH) and Intel 82P31 Memory Controller Hub (MCH)
October 2007
Document Number: 317497-002
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for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them.
The Intel G31 and P31 Express Chipsets may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, Intel Core, Intel Inside, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright 2007 Intel Corporation
Contents
1
Introduction .....................................................................................................7
1.1
1.2
Product Specifications......................................................................................11
2.1
2.2
2.3
2.4
3
Package
2.1.1
Package
Thermal
2.3.1
Description..............................................................................11
Non-Grid Array Package Ball Placement ......................................11
Loading Specifications...............................................................12
Specifications ..........................................................................13
Thermal Design Power (TDP) ....................................................13
2.3.1.1
Definition ................................................................13
2.3.2
TDP Prediction Methodology ......................................................14
2.3.2.1
Pre-Silicon ...............................................................14
2.3.2.2
Post-Silicon..............................................................14
2.3.3
Thermal Specifications .............................................................14
Non-Critical to Function Solder Balls........................................................15
Thermal Metrology ..........................................................................................17

3.1
3.2
3.3
Terminology ..........................................................................................8
Reference Documents .............................................................................9
Case Temperature Measurements ...........................................................17

3.1.1
Thermocouple Attach Methodology.............................................17
Airflow Characterization ........................................................................19
Thermal Mechanical Test Vehicle ............................................................20
Reference Thermal Solution..............................................................................21

4.1
4.2
4.3
4.4
Operating Environment .........................................................................21

4.1.1
ATX Form Factor Operating Environment ....................................21
4.1.2
Balanced Technology Extended (BTX) Form Factor Operating
Environment...........................................................................23
Reference Design Mechanical Envelope ....................................................25
Thermal Solution Assembly....................................................................25
Environmental Reliability Requirements ...................................................27
Appendix A
Enabled Suppliers ...........................................................................................29
Appendix B
Mechanical Drawings .......................................................................................31
Figures
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
1.
2.
3.
4.
5.
(G)MCH Non-Grid Array......................................................................12

Package Height .................................................................................13
Non-Critical to Function Solder Balls .....................................................16
0 Angle Attach Methodology (top view, not to scale) .............................18
0 Angle Attach Heatsink Modifications (generic heatsink side and
bottom view shown, not to scale) ........................................................18
6. Airflow and Temperature Measurement Locations...................................19
10. ATX Boundary Conditions ..................................................................22
11. Side View of ATX Boundary Conditions ................................................22
12. Processor Heatsink Orientation to Provide Airflow to (G)MCH
Heatsink on an ATX Platform..............................................................23
13. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink
on a Balanced Technology Extended (BTX) Platform .............................24
14. Design Concept for ATX (G)MCH Heatsink - Installed on Board ...............26
15. Design Concept for Balanced Technology Extended (BTX) (G)MCH
Heatsink Design - Installed on Board...................................................26
18. Intel G31, P31 Express Chipset Package Drawing ................................32
19. Intel G31, P31 Express Chipset Component Keep-Out Restrictions
for ATX Platforms .............................................................................33
20. Intel G31, P31 Express Chipset Component Keep-Out Restrictions
for Balanced Technology Extended (BTX) Platforms ...............................34
21. Intel G31, P31 Express Chipset Reference Heatsink for
ATX Platforms Sheet 1 ...................................................................35
22. Intel G31, P31 Express Chipset Reference Heatsink for ATX
Platforms Sheet 2 ..........................................................................36
Platforms Anchor ..........................................................................37
Platforms Ramp Retainer Sheet 1....................................................38
Platforms Ramp Retainer Sheet 2.....................................................39
Platforms Wire Preload Clip .............................................................40
27. Intel G31, P31 Express Chipset Reference Heatsink for Balanced
Technology Extended (BTX) Platforms .................................................41
28. Intel G31, P31 Express Chipset Reference Heatsink for Balanced
Technology Extended (BTX) Platforms Clip ........................................42
Tables
Table
Table
Table
Table
Table
Table
Table
Table
1.
2.
5.
6.
Package Loading Specifications............................................................13

Thermal Specifications .......................................................................15
Projected Chassis Conditions by Case.....................................................24
ATX Reference Thermal Solution Environmental Reliability Requirements
(Board Level) ....................................................................................27
7. Balanced Technology Extended (BTX) Reference Thermal Solution
Environmental Reliability Requirements (System Level) ..........................28
8. ATX Intel Reference Heatsink Enabled Suppliers for the (G)MCH...............29
9. BTX Intel Reference Heatsink Enabled Suppliers for the (G)MCH...............29
10. Supplier Contact Information ..............................................................30
Revision History
Revision
Number
Description
Date
-001
Initial Release
July 2007
-002
Updated TC-MAX specification
October 2007
Introduction
Introduction
As the complexity of computer systems increases, so do power dissipation
requirements. The additional power of next generation systems must be properly
dissipated. Heat can be dissipated using improved system cooling, selective use of
ducting, and/or passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within functional limits. The functional
temperature limit is the range within which the electrical circuits can be expected to
meet specified performance requirements. Operation outside the functional limit can
degrade system performance, cause logic errors, or cause component and/or system
damage. Temperatures exceeding the maximum operating limits may result in
irreversible changes in the operating characteristics of the component.
This document is for the following devices:
Intel G31 Express Chipset GMCH (82G31 GMCH)
Intel P31 Express Chipset MCH (82P31 MCH)
This document presents the conditions and requirements to properly design a cooling
solution for systems that implement the (G)MCH. Properly designed solutions provide
adequate cooling to maintain the (G)MCH case temperature at or below thermal
specifications. This is accomplished by providing a low local-ambient temperature,
ensuring adequate local airflow, and minimizing the case to local-ambient thermal
resistance. By maintaining the (G)MCH case temperature at or below those
recommended in this document, a system designer can ensure the proper
functionality, performance, and reliability of this component.
Note: Unless otherwise specified the information in this document applies to all
configurations of Intel G31 and P31 Express Chipset. The Intel 82G31 GMCH will be
available with integrated graphics and associated SDVO and analog display ports. In
this document the integrated graphics version and may be referred to as GMCH. In
addition a version (82P31 MCH) will be offered using discrete graphics and is referred
to as the MCH. The term (G)MCH is used to when referring to all configurations.
Note: The (G)MCH is targeted for use with the Intel Core2 Duo processor family in the
LGA775 Land Grid Array Package and the Intel ICH7 in desktop platforms.
Note: In this document the use of the term chipset refers to the combination of the (G)MCH
and the Intel ICH7. For ICH7 thermal details, refer to the Intel I/O Controller Hub 7
(ICH7) Thermal Design Guidelines.
Introduction
1.1
Terminology
Term
Description
FC-BGA
Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a
die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls attached
to the substrate opposite the die. Note that the device arrives at the customer
with solder balls attached.
Intel ICH7
GMCH
Intel I/O Controller Hub 7. The chipset component that contains the primary
PCI interface, LPC interface, USB, ATA, and/or other legacy functions.
Graphic Memory Controller Hub. The chipset component that contains the
processor and memory interface and integrated graphics core.
TA
The local ambient air temperature at the component of interest. The ambient
temperature should be measured just upstream of airflow for a passive
heatsink or at the fan inlet for an active heatsink.
TC
The case temperature of the (G)MCH component. The measurement is made at

the geometric center of the die.
TC-MAX
The maximum value of
TC-MIN
The minimum valued of
TC.
TC.
TDP
Thermal Design Power is specified as the maximum sustainable power to be

dissipated by the (G)MCH. This is based on extrapolations in both hardware
and software technology. Thermal solutions should be designed to TDP.
TIM
Thermal Interface Material: thermally conductive material installed between

two surfaces to improve heat transfer and reduce interface contact resistance.
CA
Case-to-ambient thermal solution characterization parameter (Psi). A measure

of thermal solution performance using total package power. Defined as (TC
TA) / Total Package Power. Heat source size should always be specified for
measurements.
Introduction
1.2
Reference Documents
Document
Location
Intel G31/P31 Express Chipset Datasheet
http://www.intel.com
/design/chipsets/datashts/317495.
htm
Intel I/O Controller Hub 7 (ICH7) Thermal Design

Guidelines
http://developer.intel.com//design
/chipsets/designex/307015.htm
Balanced Technology Extended (BTX) Interface

Specification
http://www.formfactors.org
Various System Thermal Design Suggestions
Various Chassis Thermal and Mechanical Design

Suggestion
Introduction
10
Product Specifications
2.1
Package Description
The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid
Array (FC-BGA) package with 1226 solder balls. The die size is currently 10.41 mm
[0.410 in] x 10.41 mm [0.410 in] and is subject to change. A mechanical drawing of
the package is shown in Figure 13, Appendix B.
2.1.1
Non-Grid Array Package Ball Placement

The (G)MCH package uses a balls anywhere concept. Minimum ball pitch is 0.8 mm
[0.031 in], but ball ordering does not follow a 0.8 mm grid. Board designers should
ensure correct ball placement when designing for the non-grid array pattern.
11
Figure 1. (G)MCH Non-Grid Array

34 x 34mm Substrate [1.34 x 1.34 in]
1
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AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
R T
P
N
M
L
K
J
H
G
F
E
D
C
B
A
13 15 17
23
25
27 29 31 33
35 37 39 41 43
19 21
14 16 18 20
22
24 26 28 30 32
34 36 38 40 42
Non-standard grid ball pattern. Minimum Pitch 0.8mm [0.31 in]
2.2
Package Loading Specifications

Table 1 provides static load specifications for the package. This mechanical maximum
load limit should not be exceeded during heatsink assembly, shipping conditions, or
standard use conditions. Also, any mechanical system or component testing should
not exceed the maximum limit. The package substrate should not be used as a
mechanical reference or load-bearing surface for the thermal and mechanical solution.
12
Table 1.
Package Loading Specifications

Parameter
Maximum
Notes
Static
15 lbf
1,2,3
NOTES:
1.
These specifications apply to uniform compressive loading in a direction normal to the
package.
2.
This is the maximum force that can be applied by a heatsink retention clip. The clip
must also provide the minimum specified load on the package.
3.
These specifications are based on limited testing for design characterization. Loading
limits are for the package only.
To ensure the package static load limit is not exceeded, the designer should
understand the post reflow package height. Figure 2 shows the nominal post-reflow
package height assumed for calculation of a heatsink clip preload of the reference
design. Refer to the package drawing in Appendix B to perform a detailed analysis.
Figure 2. Package Height
2.38 mm
Top of (G)MCH
Solder Ball
2.3
PCB
Thermal Specifications
To ensure proper operation and reliability of the (G)MCH , the case temperature must
be at or below the maximum value specified in Table 2. System and component level
thermal enhancements are required to dissipate the heat generated and maintain the
(G)MCH within specifications. Chapter 3 provides the thermal metrology guidelines for
case temperature measurements.
2.3.1
2.3.1.1
Thermal Design Power (TDP)

Definition
Thermal design power (TDP) is the estimated power dissipation of the (G)MCH based
on normal operating conditions including VCC and TC-MAX while executing real worstcase power intensive applications. This value is based on expected worst-case data
traffic patterns and usage of the chipset and does not represent a specific software
application. TDP attempts to account for expected increases in power due to variation
in (G)MCH current consumption due to silicon process variation, processor speed,
DRAM capacitive bus loading and temperature. However, since these variations are
subject to change, there is no assurance that all applications will not exceed the TDP
value.
13
The system designer must design a thermal solution for the (G)MCH such that it
maintains TC below TC-MAX for a sustained power level equal to TDP. Note that the
TC-MAX specification is a requirement for a sustained power level equal to TDP, and that
the case temperature must be maintained at temperatures less than TC-MAX when
operating at power levels less than TDP. This temperature compliance is to ensure
component reliability. The TDP value can be used for thermal design if the thermal
protection mechanisms are enabled. The (G)MCH incorporate a hardware-based failsafe mechanism to keep the product temperature in spec in the event of unusually
strenuous usage above the TDP power.
2.3.2
2.3.2.1
TDP Prediction Methodology

Pre-Silicon
In order to determine TDP for pre-silicon products in development, it is necessary to
make estimates based on analytical models. These models rely on knowledge of the
past (G)MCH power dissipation behavior along with knowledge of planned architectural
and process changes that may affect TDP. Knowledge of applications available today
and their ability to stress various aspects of the (G)MCH is also included in the model.
The projection for TDP assumes (G)MCH operation at TC-MAX. The TDP estimate also
accounts for normal manufacturing process variation.
2.3.2.2
Post-Silicon
Once the product silicon is available, post-silicon validation is performed to assess the
validity of pre-silicon projections. Testing is performed on both commercially available
and synthetic high power applications and power data is compared to pre-silicon
estimates. Post-silicon validation may result in a small adjustment to pre-silicon TDP
estimates.
2.3.3
The data in Table 2 is based on post-silicon power measurements for the (G)MCH. The
TDP values are based on system configuration with one (1) DIMM per channel, DDR2
and the FSB operating at the top speed allowed by the chipset with a processor
operating at that system bus speed. Intel recommends designing the (G)MCH thermal
solution to the highest system bus speed and memory frequency for maximum
flexibility and reuse. The (G)MCH packages have poor heat transfer capability into the
board and have minimal thermal capability without thermal solutions. Intel requires
that system designers plan for an attached heatsink when using the (G)MCH.
14
Table 2.
Component
System
Bus
Speed
Memory
Frequency
Max Idle
Power
TDP
TC-MIN
TC-MAX
Notes
Intel G31 Express

Chipset
1066 MT/s
800 MT/s
7.4 W
15.5 W
0 C
106
C
1,2,3,4,
5
Intel P31 Express

Chipset
1066 MT/s
800 MT/s
7.6 W
15.5 W
0 C
106
C
1,2,3,4
NOTES:
1.
Thermal specifications assume an attached heatsink is present.
2.
Max Idle power is the worst case idle power in the system booted to Windows* with no
background applications running.
3.
For Intel G31/P31 Express Chipset TDP and Max Idle power are measured with DDR2
with 2 channels, 1 DIMM per channel.
4.
Max Idle data is measured on Intel G31 and P31 Express Chipset assumed no C2 /
ASPM enabled.
5.
When an external graphics card is installed in a system with the Intel G31 the TDP for
this part will assume the worst possible PCIe design and consume as much as P31 TDP
(15.5 W).
2.4
Non-Critical to Function Solder Balls

Intel has defined selected solder joints of the (G)MCH as non-critical to function
(NCTF) when evaluating package solder joints post environmental testing. The
(G)MCH signals at NCTF locations are typically redundant ground or non-critical
reserved, so the loss of the solder joint continuity at end of life conditions will not
affect the overall product functionality. Figure 3 identifies the NCTF solder joints of
the (G)MCH package.
15
Figure 3. Non-Critical to Function Solder Balls
BC
BB
BA
AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
BC1 BC2 BC3

FIDSAF1
BB1
BB2
AY2
11
10
BC7
BA11
AY6
AY4
AY7
AY9
BC18
BC16
BB15
BA15
AY12
AY15
AY13
AY17
BC26
BC24
BB25
BB23
BB24
BB22
BA21
BA19
BA18
BA14
AY11
BB21
BB20
BB18
BA17
BC22
BC20
BB19
BB17
BB16
BB14
BA13
BA10
BA5
AY19
AY20
AY21
BC28
BB27
BA27
AY24
AY25
BB32
AY29
BC39
BA38
AY33
AY32
AU1
AU4 AU5
AU2
AR3
AR2
AP1
AP2
AR4
AY35
AY37
AW12
AW13
AW15
AW17
AW18
AW20
AW21
AW23
AW24
AW26
AW27
AW29
AW31
AW32
AW33
AW35
AW37
AV11
AV12
AV13
AV15
AV17
AV18
AV20
AV21
AV23
AV24
AV26
AV27
AV29
AV31
AV32
AV33
AV35
AV37
AU6 AU7
AU9
AU11
AU12
AU13
AU15
AU17
AU18
AU20
AU21
AU23
AU24
AU26
AU27
AU29
AU31
AU32
AU33
AU35
AU37 AU38
AM4
AL2
AL4
AK1
AT11
AT12
AT13
AT15
AT17
AT18
AT20
AT21
AT23
AT24
AT26
AT27
AT29
AT31
AT32
AT33
AR11
AR12
AR13
AR15
AR17
AR18
AR20
AR21
AR23
AR24
AR26
AR27
AR29
AR31
AR32
AR33
AR9
AR35
AN5 AN6
AN7 AN8 AN9
AP12
AP13
AP15
AP17
AP18
AP20
AP21
AP23
AP24
AP26
AP27
AP29
AP31
AP32
AN12
AN13
AN15
AN17
AN18
AN20
AN21
AN23
AN24
AN26
AN27
AN29
AN31
AN32
AM13
AM15
AM17
AM18
AM20
AM21
AM23
AM24
AM26
AM27
AM29
AM31
AN11
AL6
AL9
AL7 AL8
AL11
AL10
AL15
AL13
AL12
AJ3
AF1
AG3 AG4
AF2
AE2
AD1
AC2
V
R T
P
N
T1
Y4
W3
U3
N3
L4
AF9
AF7 AF8
AJ14 AJ15
AL23
AL21
AL26
AL24
AL27
AL29
AL31
AK17
AK18
AK20
AK21
AK23
AK24
AK26
AK27
AK29 AK30
AJ17
AJ18
AJ20
AJ21
AJ23
AJ24
AJ26
AJ27
AJ29 AJ30
AG17 AG18 AG19 AG20 AG21 AG22 AG23 AG24 AG25 AG26 AG27
AG14
AG15
AG13
AF11
AF10
AN39
AN40
AL32
AJ31
AL33
AL35
AL34
AJ33
AJ32
AN41
AM39
AJ35
AJ34
AL36
AJ36
AL37
AJ37
AL38
AJ38
AL39
AL41
AJ40
AJ39
AJ41
AF12
AF19 AF20 AF21
AF17 AF18
AF13
AF15
AE17 AE18 AE19
AF14
AF22 AF23
AF24
AG29
AG31
AG30
AG33
AG35
AG34
AG36
AG37
AG38
AD10
AD11
AC7 AC8 AC9 AC10 AC11
AD12
AD13
AD15
AD18
AC17
AC12
AC13
AC14
AD19
AD17
AD14
AA5
AA6
AA9 AA10
AA7 AA8
AA11
AA12 AA13
AC15
AC18
AE24 AE25
AF36
AF34
AF32
AF35
AF33
AF31
AE26 AE27
AA14
AD20 AD21 AD22 AD23 AD24 AD25 AD26
AD29
AG40
AB24 AB25
Y6
Y7
Y8
Y9
Y10
Y11
Y12
Y13
Y14
Y15
V6
V7
V8
V9
V10
V11
V12
V13
V14
V15
AD33
AD35
AD34
AD32
AD36
AF38
AF37
AD37
AD38
AF39
AD39
AA24 AA25
AC30
AC31
AC34
AC32
AC33
AC35
AC36
AC37
AC38
U5
U6
U7
U8
U9
U10 U11 U12 U13
R5
R6
R7
R8
R9
R10 R11 R12 R13
Y17
Y18
Y19
Y20
Y21
Y22
Y23
Y24
Y25
Y26
Y27
W18
W19
W20
W21
W22
W23
W24
W25
W26
W27
AE41
AA30
AA31
AA32
AA33
AC40
N5
N6
N7
N8
N9
N10 N11 N12
M5
M6
M7
M8
M9
M10 M11
V17
V18
U17
U18
V19
V20
V21
V22
U19
U20
U21
U22
V23
V24
V25
V26
U24
U25
U26
Y30
Y31
Y32 Y33
Y34
Y35 Y36
Y37
Y38
Y39
V29
V30
V31
V32 V33
V34
V35 V36
V37
V38
V39
Y40
G4
Y42
R18
R20
R21
P14
R23
R24
V42
R27
R29 R30
U31 U32 U33 U34
U35 U36 U37 U38
U39
R31 R32 R33 R34
R35 R36 R37 R38
R39
P29
N35 N36 N37 N38
N39
L12
P17
P18
P20
P21
P23
P24
P26
P27
N17
N18
N20
N21
N23
N24
N26
N27
N29
M13
M15
M17
M18
M20
M21
M23
M24
M26
M27
M29
M31
L13
L15
L17
L18
L20
L21
L23
L24
L26
L27
L29
L31
P15
L5
L6
L7
J5
J6
J7
L8
U40 U41
G6
G5
N31
N32 N33 N34
D4
K12
K13
K15
K17
K18
K20
K21
K23
K24
K27
K26
N40 N41
K29
K32
K31
J11
J12
J13
J15
J17
J18
J20
J21
J23
J24
J26
J27
J29
J31
J32
J33
H11
H12
H13
H15
H17
H18
H20
H21
H23
H24
H26
H27
H29
H31
H32
H33
G27
L35 L36
L37
L38
L39
J35
J37
J38
J39
D6
G9
G11
G12
G13
G15
G17
G18
G20
G21
G23
G24
G26
G29
G31
G32
G33
G35
G37
F9
F11
F12
F13
F15
F17
F18
F20
F21
F23
F24
F26
F27
F29
F31
F32
F33
F35
F37
E9
E11
E12
E13
E15
E17
E18
E20
E21
E23
E24
E26
E27
E29
E31
E32
E33
E35
E37
3
4
B6
A7
7
6
D12 D13
C11
C13
D16
D17
B13
A12
11
10
B18
B16
B17
A16
D20
C19
C17
B15
A14
D19
C18
C15
B14
B12
B11
A10
D15
C14
B10
B9
A5
D11
C10
C9
B7
B5
B4
A3
D9
C22
B20
B19
A18
D23
D21
D27
C26
C25
B23
A22
D25
B24
B22
B21
A20
D24
C23
C21
C30
G38 G39
F40
A32
D40
B37
B34
G42
A37
B39
G43
F42
E42
D41
E43
D42
C42
C43
B41
B42
B43
A41
A42
A43
C40
B38
B35
A34
K43
J42
F41
E41
C39
C38
C35
B33
B31
A30
C34
C33
L42
K42
J41
G40
E39
D35 D37 D38
D33
B32
B30
B29
A28
D32
C31
C29
B27
A26
D31
D29
B28
B26
B25
A24
D28
C27
P43
R T
P
N
N42
L41
K41
F7
D7
V
U
M42 M43
L40
J40
E7
C6
R42
P42
P41
M40
J9
G7
R40 R41
F38
C5
C4
B3
T43
M33 M34 M35 M36 M37 M38 M39

L32
F6
E5
C2
U42
P30
L33
L9
V43
U27
R26
N15
N13
Y43
W40 W41 W42
L11
E3
D3
D2
AB43
T42
F4
F3
E2
AC42
AB42
AA35 AA36 AA37

AA39
AA41
AA38
AA34
AA40
AA42
Y29
U29 U30
U23
AD43
BC
BB
BA
AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
V27
U14 U15
R17
AF43
AE42
AD42
AB41
AA26 AA27
W17
R14 R15
AH43
AG42
AF42
AF41
AD40
AC39
AB26 AB27
AA29
AA20 AA21 AA22 AA23
AG41
AC41
AC29
AA17 AA18 AA19
V5
AD30
AC19 AC20 AC21 AC22 AC23 AC24 AC25 AC26 AC27
AA15
Y5
AD31
AD27
AB20 AB21 AB22 AB23
AJ42
AH42
AG39
AK43
AF25 AF26 AF27

AF29 AF30
AE20 AE21 AE22 AE23
AG32
AM43
AL42
AK42
AK41
AP43
AN42
AM42
AM40
AM38
AE40
AD7 AD8 AD9
J4
G2
F2
AF6
AD5 AD6
K3
J3
J2
AJ13
AG12
AG11
M4
K2
B2
AJ12
N4
L3
L2
C1
AN38
R4
P3
M2
E1
AN37
AM37
AM35
AU43
AR42
AP42
T4
N2
G1
AR41
AW43
AV42
AU42
V41
U4
R3
K1
AJ11
AJ10
W4
P2
M1
AN36
AM36
AM34
AM33
V3
T2
AJ9
AJ8
AB17 AB18 AB19
AA4
V2
R2
AJ7
AG5 AG6 AG7 AG8 AG9 AG10
AC4 AC5 AC6
Y2
P1
AJ6
AB3
AA3
U2
AJ5
AF5
AD4
AC3
W2
AR40
AR39
AE4
AB2
AA2
V1
AF3
AE3
AD2
AB1
AR38
AU40
AH4
AH2
AG2
Y1
AJ4
AL20
AL18
AL17
AK14 AK15
AJ2
AH1
AR37
AV41
AU39
AL40
AL5
AK3
AN35
AN33
AM5 AM6 AM7 AM8 AM9 AM10 AM11
AK2
AW41 AW42
AV40
AP41
AM1 AM2
AL3
AW39
AV38
AR7
BB43
AY41 AY42
AY40
AW11
AV9
AR5 AR6
BC43
BA42 BA43
AY38
AW9
AV7
AP3
AN3 AN4
AN2
BB41
BA40
BA39
AV6
AV3 AV4
BC42
BB42
BB39
BA35
BA34
AY31
BC41
BB40
BB38
BB37
BB34
BA33
BA31
BA30
AY27
BC37
BB35
BB33
BB31
BB30
BA29
BA26
AY23
BC34
BC32
BC30
BB29
BB28
BB26
BA25
BA23
BA22
AW7
AW5
AW3
BC14
BB13
BB12
BB10
BA9
13 15 17
19 21
23
25
27 29 31 33
35 37 39 41 43
34 36 38 40 42
14 16 18 20
22
24 26 28 30 32
BC12
BB11
BB7
BA6
12
BC10
BB9
BB6
BB5
AY3
AV2
J
H
G
F
E
D
C
B
A
BC5
BB4
BB3
BA2
AW1 AW2
BA4
BA1
AA
B40
A39
L
K
J
H
G
F
E
D
C
B
A
19 21
13 15 17
23
25
27 29 31 33
35 37 39 41 43
12 14 16 18 20
22
24 26 28 30 32
34 36 38 40 42
16
Thermal Metrology
Thermal Metrology
The system designer must measure temperatures in order to accurately determine the
thermal performance of the system. Intel has established guidelines for proper
techniques of measuring (G)MCH component case temperatures.
3.1
Case Temperature Measurements

To ensure functionality and reliability of the (G)MCH the TC must be maintained at or
below the maximum temperature listed in Table 2. The surface temperature measured
at the geometric center of the die corresponds to TC. Measuring TC requires special
care to ensure an accurate temperature reading.
Temperature differences between the temperature of a surface and the surrounding
local ambient air can introduce error in the measurements. The measurement errors
could be due to a poor thermal contact between the thermocouple bead and the
surface of the package, heat loss by radiation and/or convection, conduction through
thermocouple leads, or contact between the thermocouple cement and the heatsink
base (if a heatsink is used). To minimize these measurement errors a thermocouple
attach with a zero-degree methodology is recommended.
3.1.1
Thermocouple Attach Methodology

1.
Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base.
The milled hole should be approximately 1.5 mm [0.06 in] deep.
2.
Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole
to one edge of the heatsink. The slot should be in the direction parallel to the
heatsink fins (see Figure 5).
3.
Attach thermal interface material (TIM) to the bottom of the heatsink base.
4.
Cut out portions of the TIM to make room for the thermocouple wire and bead.
The cutouts should match the slot and hole milled into the heatsink base.
5.
Attach a 36 gauge or smaller K-type thermocouple bead to the center of the top
surface of the die using a cement with high thermal conductivity. During this step,
make sure no contact is present between the thermocouple cement and the
heatsink base because any contact will affect the thermocouple reading. It is
critical that the thermocouple bead makes contact with the die
(see Figure 4).
6.
Attach heatsink assembly to the (G)MCH, and route thermocouple wires out
through the milled slot.
17
Thermal Metrology
Figure 4. 0 Angle Attach Methodology (top view, not to scale)
Figure 5. 0 Angle Attach Heatsink Modifications (generic heatsink side and bottom
view shown, not to scale)
18
Thermal Metrology
3.2
Airflow Characterization
Figure 6 describes the recommended location for air temperature measurements
measured relative to the component. For a more accurate measurement of the
average approach air temperature, Intel recommends averaging temperatures
recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for
both a single thermocouple and a pair of thermocouples are presented.
Figure 6. Airflow and Temperature Measurement Locations
Airflow velocity can be measured using sensors that combine air velocity and
temperature measurements. Typical airflow sensor technology may include hot wire
anemometers. Figure 6 provides guidance for airflow velocity measurement locations
which should be the same as used for temperature measurement. These locations are
for a typical JEDEC test setup and may not be compatible with chassis layouts due to
the proximity of the processor to the (G)MCH. The user may have to adjust the
locations for a specific chassis. Be aware that sensors may need to be aligned
perpendicular to the airflow velocity vector or an inaccurate measurement may result.
Measurements should be taken with the chassis fully sealed in its operational
configuration to achieve a representative airflow profile within the chassis.
19
Thermal Metrology
3.3
Thermal Mechanical Test Vehicle

A Thermal Mechanical Test Vehicle (TMTV) is available for early thermal testing prior
to the availability of actual silicon. The TMTV contains a heater die and can be
powered up to a desired power level to simulate the heating of a (G)MCH package.
The TMTV also contains daisy chain functionality and can be used for mechanical
testing. The TMTV needs to be surface mounted to a custom board designed to
provide connectivity to the die heater and/or daisy chain depending on the needs of
the user. The package ball connections are provided so the user may design and build
a board to interface with the TMTV. Note that although the TMTV is designed to closely
match the (G)MCH package mechanical form and fit, it is recommended that final
validation be performed with actual production silicon. The TMTV mechanical features,
including die size, ball count, etc., may not reflect those of the final production
package.
20
Reference Thermal Solution

The design strategy for the reference thermal solution for the (G)MCH for use in ATX
platforms reuses the ramp retainer and MB anchors from the Intel G965 Express
Chipset thermal solution. The extrusion design and a wire preload clip requirements
are being evaluated for changes necessary to meet the (G)MCH thermal requirements.
The thermal interface material and keep out zone remains the same as used with the
Intel G965 Express Chipset, see Figure 14.
The BTX reference design for the (G)MCH will be similar to the Intel G965 Express
Chipset thermal solution. The thermal interface material, extrusion design and a wire
preload clip requirements are being evaluated for changes necessary to meet the
(G)MCH thermal requirements. The keep out zone remains the same as used with the
Intel G965 Express Chipset, see Figure 15.
This chapter provides detailed information on operating environment assumptions,
heatsink manufacturing, and mechanical reliability requirements for the (G)MCH.
4.1
Operating Environment
The operating environment of the (G)MCH will differ depending on system
configuration and motherboard layout. This section defines operating environment
boundary conditions that are typical for ATX and BTX form factors. The system
designer should perform analysis in the expected platform operating environment to
assess impact on thermal solution selection.
4.1.1
ATX Form Factor Operating Environment

In ATX platforms, an airflow speed of 1.21 m/s [240lfm] is assumed to be
approaching the heatsink at a 30 angle from the processor thermal solution, see
Figure 7 and Figure 8 for more details. The local ambient air temperature, TA,, at the
(G)MCH heatsink in an ATX platform is assumed to be 45.6C for the (G)MCH. The
airflow assumed above can be achieved by using a processor heatsink providing omni
directional airflow, such as a radial fin or X pattern heatsink. Such a heatsink can
deliver airflow to both the (G)MCH and other areas like the voltage regulator, as
shown in Figure 9. In addition, (G)MCH board placement should ensure that the
(G)MCH heatsink is within the air exhaust area of the processor heatsink.
Note that heatsink orientation alone does not guarantee that airflow speed
will be achieved. The system integrator should use analytical or experimental means
to determine whether a system design provides adequate airflow speed for a
particular (G)MCH heatsink.
The thermal designer must carefully select the location to measure airflow to get a
representative sampling. ATX platforms need to be designed for the worst-case
thermal environment, typically assumed to be 35 C ambient temperature external to
the system measured at sea level.
21
Figure 7. ATX Boundary Conditions
Figure 8. Side View of ATX Boundary Conditions
22
Figure 9. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an

ATX Platform
Other methods exist for providing airflow to the (G)MCH heatsink, including the use of
system fans and/or ducting, or the use of an attached fan (active heatsink).
4.1.2
Balanced Technology Extended (BTX) Form Factor

Operating Environment
This section provides operating environment conditions based on what has been
exhibited on the Intel micro-BTX reference design. On a BTX platform, the (G)MCH
obtains in-line airflow directly from the processor thermal module. Since the processor
thermal module provides lower inlet temperature airflow to the processor, reduced
inlet ambient temperatures are also often seen at the (G)MCH as compared to ATX. An
example of how airflow is delivered to the (G)MCH on a BTX platform is shown in
Figure 10.
A set of three system level boundary conditions will be established to determine
(G)MCH thermal solution requirement.
Low external ambient (23C)/ idle power for the components (Case 3). This covers
the system idle acoustic condition.
Low external ambient (23C)/ TDP for the components (Case 2). The TMA fan
speed is limited by the thermistor in the fan hub.
High ambient (35C)/ TDP for the components (Case 1). This covers the maximum
TMA fan speed condition.
23
In addition to the 3 cases listed above the analysis considered both microtower and
3-thick ePC chassis configurations to determine the worst case: The values in Table 3
correspond to the ePC configuration. For more details on the TMA airflow set points,
refer to the Balanced Technology Extended (BTX) System Design Guide.
Table 3. Projected Chassis Conditions by Case
TA into (G)MCH heatsink
(C)
Airflow into the (G)MCH

heatsink
(LFM)
Case 1
45.2
139
Case 2
42.0
68.8
Case 3
34.7
32.4
NOTES:
1. For all cases a thermal solution is required on the (G)MCH.
2. These values are supplied based on final design review.
The customer should analyze their system design to verify their applicable boundary
conditions prior to design. The thermal designer must carefully select the location to
measure airflow to get a representative sampling. BTX platforms need to be designed
for the worst-case thermal environment, typically assumed to be 35 C ambient
temperature external to the system measured at sea level.
Note: The local ambient air temperature is a projection based on the power on a 2007
platform, processor TDP up to 65 W, and is subject to change in the next revision of
this document.
Note: The risk of the solder ball fracture can be minimized with good chassis structure
design on a BTX platform, refer to the Balanced Technology Extended (BTX) Chassis
Design Guide (or Balanced Technology Extended (BTX) System Design Guide) for
detail chassis mechanical design.
Figure 10. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a
Balanced Technology Extended (BTX) Platform
24
4.2
Reference Design Mechanical Envelope

The motherboard component keep-out restrictions for the (G)MCH on an ATX platform
are included in Appendix B, Figure 14. The motherboard component keep-out
restrictions for the (G)MCH on a BTX platform are included in Appendix B, Figure 15.
4.3
Thermal Solution Assembly

The reference thermal solution for the (G)MCH for an ATX chassis is shown in
Figure 11 and is an aluminum extruded heatsink that uses two ramp retainers, a wire
preload clip, and four motherboard anchors. Refer to Appendix B for the mechanical
drawings. The heatsink is attached to the motherboard by assembling the anchors into
the board, placing the heatsink, with the wire preload clip over the (G)MCH and
anchors at each of the corners, and securing the plastic ramp retainers through the
anchor loops before snapping each retainer into the fin gap. Leave the wire preload
clip loose in the extrusion during the wave solder process. The assembly is then sent
through the wave process. Post wave, the wire preload clip is snapped into place on
the hooks located on each of the ramp retainers. The clip provides the mechanical
preload to the package. This mechanical preload is necessary to provide both
sufficient pressure to minimize thermal contact resistance and improvement for solder
ball joint reliability. The mechanical stiffness and orientation of the extruded heatsink
also provides protection to reduce solder ball reliability risk. A thermal interface
material (Honeywell PCM45F) is pre-applied to the heatsink bottom over an area
which contacts the package die.
The design concept for the (G)MCH in a BTX chassis is shown in Figure 12. The
heatsink is aluminum extruded and utilizes a Z-clip for attach. The clip is secured to
the system motherboard via two solder down anchors around the (G)MCH. The clip
helps to provide a mechanical preload to the package via the heatsink. A thermal
interface material (Honeywell PCM45F) will be pre-applied to the heatsink bottom over
an area in contact with the package die.
Note: To minimize solder ball joint reliability risk, the BTX Z-clip heatsink is intended to be
used with the Support Retention Mechanism (SRM) described in the Balanced
Technology Extended (BTX) Interface Specification. For additional information on
designing the BTX chassis to minimize solder ball joint reliability, refer to the Balanced
Technology Extended (BTX) Chassis Design Guide.
25
Figure 11. Design Concept for ATX (G)MCH Heatsink - Installed on Board
Figure 12. Design Concept for Balanced Technology Extended (BTX) (G)MCH Heatsink
Design - Installed on Board
26
4.4
Environmental Reliability Requirements

The environmental reliability requirements for the reference thermal solution are
shown in Table 4 and Table 5. These should be considered as general guidelines.
Validation test plans should be defined by the user based on anticipated use
conditions and resulting reliability requirements.
The ATX testing will be performed with the sample board mounted on a test fixture
and includes a processor heatsink with a mass of 550g. The test profiles are
unpackaged board level limits.
Table 4.
ATX Reference Thermal Solution Environmental Reliability Requirements

(Board Level)
Test1
Mechanical
Shock
Requirement
3 drops for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops)
Pass/Fail
Criteria2
Visual\Electrical
Check
Profile: 50 G, Trapezoidal waveform, 4.3 m/s

[170 in/s] minimum velocity change
Random
Vibration
Duration: 10 min/axis, 3 axes

Frequency Range: 5 Hz to 500 Hz
Visual/Electrical
Check
Power Spectral Density (PSD) Profile: 3.13 g RMS

Thermal
Cycling
-40 C to +85 C, TBD cycles
Thermal
Performance
Unbiased
Humidity
85 % relative humidity / 55 C, TBD hours
Visual Check
NOTES:
1.
The above tests should be performed on a sample size of at least 12 assemblies from 3
different lots of material.
2.
Additional Pass/Fail Criteria may be added at the discretion of the user.
The current plan for BTX reference solution testing is to mount the sample board
mounted in a representative BTX chassis with a thermal module assembly having a
mass of 900g. The test profiles are unpackaged system level limits.
27
Table 5.
Balanced Technology Extended (BTX) Reference Thermal Solution

Environmental Reliability Requirements (System Level)
Test1
Mechanical
Shock
Requirement
Pass/Fail
Criteria2
2 drops for + and - directions in each of 3

perpendicular axes (i.e., total 12 drops)
Visual\Electrical
Check
Profile: 25g, Trapezoidal waveform, 5.7 m/s [225

in/sec] minimum velocity change
Random
Vibration
Duration: 10 min/axis, 3 axes

Frequency Range: .001 g2/Hz @ 5Hz, ramping to .01
g2/Hz @20 Hz, .01 g2/Hz @ 20 Hz to 500 Hz
Visual/Electrical
Check
Power Spectral Density (PSD) Profile: 2.20 g RMS

Thermal
Cycling
-40 C to +85 C, TBD cycles
Thermal
Performance
Unbiased
Humidity
85 % relative humidity / 55 C, 500 hours
Visual Check
NOTES:
1.
The above tests should be performed on a sample size of at least 12 assemblies from 3
different lots of material.
2.
Additional Pass/Fail Criteria may be added at the discretion of the user.
3.
Mechanical Shock minimum velocity change is based on a system weight of 20 lbs to
29 lbs.
4.
For the chassis level testing the system will include: 1 HD, 1 ODD, 1 PSU, 2 DIMMs and
the I/O shield.
28
Enabled Suppliers
Appendix A Enabled Suppliers

Enabled suppliers for the (G)MCH reference thermal solution are listed in Table 6 and
Table 7. The supplier contact information is listed in Table 8.
Note: These vendors and devices are listed by Intel as a convenience to Intel's general
customer base, but Intel does not make any representations or warranties whatsoever
regarding quality, reliability, functionality, or compatibility of these devices. This list
and/or these devices may be subject to change without notice.
Table 6.
ATX Intel Reference Heatsink Enabled Suppliers for the (G)MCH

ATX
Items
Heatsink
& TIM
Table 7.
Intel PN
AVC
D77030-001
CCI
Foxconn
Wieson
S907C00002
Plastic
Clip
C85370-001
Wire Clip
D29082-001
Anchor
C85376-001
3EE77-002
P109000024
334C863501A
A208000233
334I833301A
3KS02-155
2Z802-015
G2100C888143
BTX Intel Reference Heatsink Enabled Suppliers for the (G)MCH

BTX Items
Intel PN
Heatsink assembly
(HS/TIM & Wire
Clip)
D75473-001
Anchor
(Lead Free)
A13494-008
AVC
Foxconn
Wieson
S906Z00001
HB9703E-DW
G2100C888-064H
29
Enabled Suppliers
Table 8. Supplier Contact Information

Supplier
AVC (Asia Vital

Components)
CCI (Chaun
Choung
Technology)
Foxconn
Wieson
Technologies
Contacts
Phone
Email
David Chao
+886-2-2299-6930 ext.
7619
david_chao@avc.com.tw
Raichel Hsu
+886-2-2299-6930 ext.
7630
raichel_hsi@avc.com.tw
Monica Chih
+886-2-2995-2666
monica_chih@ccic.com.tw
Harry Lin
(714) 739-5797
hlinack@aol.com
Jack Chen
(408) 919-6121
jack.chen@foxconn.com
Wanchi Chen
(408) 919-6135
wanchi.chen@foxconn.com
Beatrice
Chang
+886-2-2647-1896 ext.
6395
beatrice@wieson.com
Edwina Chu
+886-2-2647-1896 ext.
6390
edwina@wieson.com
30
Mechanical Drawings
Appendix B Mechanical Drawings

The following table lists the mechanical drawings available in this document.
Drawing Name
Intel G31, P31 Express Chipset Package Drawing
Page
Number
32
. Intel G31, P31 Express Chipset Component Keep-Out Restrictions for ATX Platforms
33
Intel G31, P31 Express Chipset Component Keep-Out Restrictions for Balanced
Technology Extended (BTX) Platforms
34
. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Sheet 1
35
36
. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Anchor
37
. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Ramp
Retainer Sheet 1
38
. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Ramp
Retainer Sheet 2
39
. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Wire Preload
Clip
40
Intel G31, P31 Express Chipset Reference Heatsink for Balanced Technology Extended
(BTX) Platforms
41
. Intel G31, P31 Express Chipset Reference Heatsink for Balanced Technology Extended
(BTX) Platforms Clip
42
. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Sheet 2
31
32
Figure 13. Intel G31, P31 Express Chipset Package Drawing
Mechanical Drawings
135
45.79
[ 1.803 ]
67
[ 2.638 ]
81
[ 3.189 ]
47
[ 1.85 ]
26.79
[ 1.055 ]
48
[ 1.890 ]
60.6
[ 2.386 ]
NORTH
4
[ .1575 ]
60.92
[ 2.398 ]
74
[ 2.9134 ]
DET AIL A
MAX 25 [1.000]
COMPONENT HEIGHT
MAX 1.27 [.050]

COMPONENT HEIGHT
(NON-MCH COMPONENT S)
COMPONENT CENT ER
EAST
4X 1.84
[ .072 ]
4X 5.08
[ .200 ]
0.97 [ .038 ] PLAT ED T HRU HOLE

8X 1.42[.056] T RACE KEEPOUT
NOT ES:
1 HOLE PLACEMENT FABRICAT ION
T OLERANCE PER INT EL 454979, CLASS 1,2,3
2. HEAT SINK COMPONENT HEIGHT NOT T O EXCEED
38.1MM ABOVE MOT HERBOARD SURFACE.
8X
DETAIL
SCALE
4X 8.76
[ .345 ]
4X 8.76
[ .345 ]
Primary Dimensions are in mm
NO COMPONENT S T HIS AREA
Figure 14. Intel G31, P31 Express Chipset Component Keep-Out Restrictions for ATX Platforms
Mechanical Drawings
33
34
Figure 15. Intel G31, P31 Express Chipset Component Keep-Out Restrictions for Balanced Technology Extended (BTX)
Platforms
Mechanical Drawings
4X EQUAL
SPACING
2X 80
[ 3.150 ]
36
[ 1.417 ]
2X 48 0.15
[ 1.890
.005 ]
47
[ 1.850 ]
0.15
.00 ]
0.15
.005 ]
2X 2.7 0.15
[ .106
.005 ]
3X 7.46
[ .29
2X 59.28
[ 2.334
3
35.5
[ 1.398 ]
3.75
0.15
[ .148
.005 ]
30.5
[ 1.201 ]
ZONE
A INITIAL RELEASE
REV
DWG. NO
REVISION HISTORY
DESCRIPTION
SHT.
REV
APPROVED
SEE DETAIL
8X 1.2 0.15
[ .047
.005 ]
4
[ .157 ]
6X EQUAL
SPACING
8X FULL ROUND
TOP
ITEM NO
PART NUMBER
D77030-001
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
QTY
SEE DETAIL
3 0.15
[ .118
.005 ]
08/07/06
DATE
08/07/06
DATE
DRAWN BY
KG TAN
CHECKED BY
FINISH
SEE NOTES
MATERIAL
08/17/06
FRED ANDERS
SEE NOTES
DATE
APPROVED BY
C BERMENSOLO 08/17/06
-
DATE
DESIGNED BY
DESCRIPTION
SIZE
A1
CORP.
D77030
DO NOT SCALE DRAWING
DRAWING NUMBER
SHEET
1 OF 2
REV
HS, PWSHS, GUARDFISH BW, ATX
PST
DEPARTMENT
TITLE
SCALE:
PARTS LIST
HSNK,EXTD,FBGA,8,AL
THIS DRAWING TO BE USED IN CONJUNCTION WITH THE SUPPLIED 3D

DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING
TAKE PRECEDENCE OVER SUPPLIED FILE.
ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY.
TOLERANCES SHALL BE CALCULATED FROM PRIMARY UNITS TO AVOID
TRUNCATION ERRORS.
CRITICAL TO FUNCTION DIMENSION
ANY TOOLING DESIGN SHALL BE SUBMITTED TO AND APPROVED BY
INTEL ENGINEERING PRIOR TO CONSTRUCTION OF THE TOOLS.
MARK ASSEMBLY WITH PART NUMBER AND VENDOR IDENTIFICATION
PER INTEL MARKING STANDARD 164997 APPROXIMATELY WHERE SHOWN.
REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMETER OF PART.
BREAK ALL SHARP CORNERS, EDGES, AND BURRS TO 0.10MM MAX.
SHARPNESS OF EDGES SUBJECT TO HANDLING ARE REQUIRED TO MEET
UL1439 TEST.
MATERIAL: 6063-T5 ALUMINUM
UNLESS OTHERWISE NOTED, TOLERANCES ON DIMENSIONED AND
UNDIMENSIONED FEATURES ARE AS FOLLOWS:
DIMENSIONS ARE IN MILLIMETERS.
TOLERANCES:
LINEAR
0.25
ANGULAR
1
FINISH: CHEMICAL ETCH
APPLY HONEYWELL TIM PCM45F (STD SIZE 20mm x 20mm) AT
CENTER OF HEAT SINK BASE
KG TAN
10
9.
7.
8.
6.
3
4.
2.
1.
NOTES:
2200 MISSION COLLEGE BLVD.

P.O. BOX 58119
SANTA CLARA, CA 95052-8119
09/08/06
DATE
D77030
ALL FINS IN OUTER COLUMN

MUST BE INLINE OR CONVEX
TO MIDDLE FINS
G
2X 58.6
[ 2.307 ]
ALL FINS IN OUTER COLUMN

MUST BE INLINE OR CONVEX
TO MIDDLE FINS
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
Figure 16. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Sheet 1
Mechanical Drawings
35
36
TYP DETAIL
SCALE 5
SIZE
DRAWING NUMBER
2X 0.6
[ .024 ]
D77030
SHT.
REV
REV
2 OF 2
DEPARTMENT

P.O. BOX 58119
DETAIL
SCALE
TYP 2.75
0.15
[ .108
.005 ]
D77030
SHEET
PST
CORP.
SCALE:
A1
1.5 0.15
[ .059
.005 ]
NO BURR ALL AROUND
6.72
0.15
[ .265
.005 ]
4X ALL AROUND 45
23
[ .906 ]
0.1 [.00]
BOTTOM VIEW
X 1 [.039]
TYP 4
[ .157 ]
DWG. NO
10
5
TYP R 1
[ .039 ]
4X R 0.5
[ .020 ]
20
[ .787 ]
TYP 135
66
[ 2.598 ]
G
13.5
[ .532 ]
20
[ .787 ]
Figure 17. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Sheet 2
Mechanical Drawings
0. 12
. 004 ]
5. 21
0. 12
[ . 205
. 004 ]
5. 08
0. 12
[ . 200
. 004 ]
4X 7. 83
[ . 308
2X 0. 75
[ . 030 ]
2X 4
[ . 157 ]
7. 62
0. 15
[ . 300
. 005 ]
0. 64
0. 12
. 004 ]
0
-0. 07
. 025 + . 000
-. 002
2X 10. 13
[ . 39 9
2. 5
0. 15
[ . 098
. 005 ]
0. 1
. 003 ]
2X 0. 5 0. 05
[ . 020
. 001 ]
2X 0. 77
[ . 030
45
X 0. 2 M I N
2X 3. 94
0. 15
[ . 155
. 005 ]
2X 45
0. 64 0
-0. 07
. 025 + . 000
-. 002
2X C H A M F E R A LL A R O U N D
C O N T A C T T O I N S U LA T O R I N T E R F A C E
A T S U P P LI E R S O P T I O N
1. T H I S D R A W I N G T O B E U S E D I N C O N J U N C T I O N W I T H S U P P LI E D 3D
D A T A B A S E F I LE . A LL D I M E N S I O N S A N D T O LE R A N C E S O N T H I S
D R A W I N G T A K E P R E C E D E N C E O V E R S U P P LI E D F I LE A N D A R E
A P P LI C A B LE A T P A R T F R E E , U N C O N S T R A I N E D S T A T E U N LE S S
INDICA T E D O T HE RW IS E .
2. T O LE R A N C E S O N D I M E N S I O N E D A N D U N D I M E N S I O N E D
F E A T U R E S U N LE S S O T H E R W I S E S P E C I F I E D :
D I M E N S I O N S A R E I N M I LLI M E T E R S .
F O R F E A T U R E S I Z E S < 10M M : LI N E A R
. 07
F O R F E A T U R E S I Z E S > 10M M : LI N E A R
. 08
A N G LE S :
0. 5
3. M A T E R I A LS :
I N S U LA T O R : P O LY C A R B O N A T E T H E R M O P LA S T I C , U L 94V -0, B LA C K (739)
(R E F . G E LE X A N 3412R -739)
C O N T A C T : B R A S S O R E Q U I V A LE N T U P O N I N T E L A P P R O V A L
C O N T A C T F I N I S H : . 000050u" M I N . N I C K E L U N D E R P LA T I N G ;
S O LD E R T A I LS , 0. 000100" M I N T I N O N LY S O LD E R (LE A D F R E E ).
5. M A R K W I T H I N T E L P / N A N D R E V I S I O N P E R I N T E L M A R K I N G
S T A N D A R D 164997; P E R S E C 3. 8 (P O LY E T H Y LE N E B A G )
6 CRIT ICA L T O F UNCT IO N DIM E NS IO N
7. A LL D I M E N S I O N S S H O W N S H A LL B E M E A S U R E D F O R F A I
8. N O T E R E M O V E D
9. D E G A T E : F LU S H T O 0. 35 B E LO W S T R U C T U R A L T H I C K N E S S
(G A T E W E LL O R G A T E R E C E S S A C C E P T A B LE )
10. F LA S H : 0. 15 M A X .
11. S I N K : 0. 25 M A X .
12. E J E C T O R M A R K S : F LU S H T O -0. 25
13. P A R T I N G LI N E M I S M A T C H N O T T O E X C E E D 0. 25.
14. E J E C T I O N P I N B O S S E S , G A T I N G , A N D T O O LI N G I N S E R T S R E Q U I R E
I N T E L'S A P P R O V A L P R I O R T O T O O L C O N S T R U C T I O N .
A LL E J E C T I O N P I N B O S S E S A N D G A T E F E A T U R E S S H O W N
A R E F O R R E F E R E N C E O N LY .
15. E D G E S S H O W N A S S H A R P R 0. 1 M A X .
16. T O O LI N G R E Q U I R E D T O M A K E T H I S P A R T S H A LL B E T H E
P R O P E R T Y O F I N T E L, A N D S H A LL B E P E R M A N E N T LY M A R K E D
W I T H I N T E L'S N A M E A N D A P P R O P R I A T E P A R T N U M B E R .
17. A LL S E C O N D A R Y U N I T D I M E N S I O N S A R E F O R R E F E R E N C E O N LY .
NO T E S :
Figure 18. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Anchor
Mechanical Drawings
37
38
2X 31. 1
[ 1. 225 ]
2X 27. 95
[ 1. 100 ]
3
[ . 118 ]
S E E DE T A IL
2 0. 05
[ . 079
. 001 ]
S E E DE T A IL
61. 51
6
[ 2. 422 ]
70. 49
[ 2. 775 ]
1. T H I S D R A W I N G T O B E U S E D I N C O N J U N C T I O N W I T H S U P P LI E D 3D
D A T A B A S E F I LE . A LL D I M E N S I O N S A N D T O LE R A N C E S O N T H I S
D R A W I N G T A K E P R E C E D E N C E O V E R S U P P LI E D F I LE A N D A R E
A P P LI C A B LE A T P A R T F R E E , U N C O N S T R A I N E D S T A T E U N LE S S
INDICA T E D O T HE RW IS E .
2. T O LE R A N C E S O N D I M E N S I O N E D A N D U N D I M E N S I O N E D
F E A T U R E S U N LE S S O T H E R W I S E S P E C I F I E D :
D I M E N S I O N S A R E I N M I LLI M E T E R S .
F O R F E A T U R E S I Z E S < 10M M : LI N E A R
. 07
F O R F E A T U R E S I Z E S B E T W E E N 10 A N D 25 M M : LI N E A R
. 08
F O R F E A T U R E S I Z E S B E T W E E N 25 A N D 50 M M : LI N E A R
. 10
F O R F E A T U R E S I Z E S > 50M M : LI N E A R
. 18
A N G LE S :
0. 5
3. M A T E R I A L:
A ) T Y P E : E N V I R O N M E N T A LLY C O M P LI A N T T H E R M O P LA S T I C O R
E Q U I V A LE N T U P O N I N T E L A P P R O V A L (R E F . G E LE X A N 500E C R -739)
B ) CRIT ICA L M E CHA NICA L M A T E RIA L P RO P E RT IE S
F O R E Q U I V A LE N T M A T E R I A L S E LE C T I O N :
T E N S I LE Y I E LD S T R E N G T H (A S T M D 638) > 57 M P a
T E N S I LE E LO N G A T I O N A T B R E A K (A S T M D 638) > = 46%
F LE X U R A L M O D U LU S (A S T M D 638) 3116 M P a
10%
S O F T E N I N G T E M P (V I C A T , R A T E B ): 154
C
C ) C O LO R : A P P R O X I M A T I N G B LA C K , (R E F G E 739)
D ) R E G R I N D : 25% P E R M I S S I B LE .
E ) V O LU M E - 1. 73e+ 03 C U B I C -M M (R E F )
W E I G H T - 2. 16 G R A M S (R E F )
5 M A RK P A RT W IT H INT E L P /N, RE V IS IO N, CA V IT Y NUM B E R
A ND DA T E CO DE A P P RO X W HE RE S HO W N P E R INT E L M A RK ING
S T A N D A R D 164997
6 CRIT ICA L T O F UNCT IO N DIM E NS IO N
7. A LL D I M E N S I O N S S H O W N S H A LL B E M E A S U R E D F O R F A I
8. N O T E R E M O V E D
9. D E G A T E : F LU S H T O 0. 35 B E LO W S T R U C T U R A L T H I C K N E S S
(G A T E W E LL O R G A T E R E C E S S A C C E P T A B LE )
10. F LA S H : 0. 15 M A X .
11. S I N K : 0. 25 M A X .
12. E J E C T O R M A R K S : F LU S H T O -0. 25
13. P A R T I N G LI N E M I S M A T C H N O T T O E X C E E D 0. 25.
14. E J E C T I O N P I N B O S S E S , G A T I N G , A N D T O O LI N G I N S E R T S R E Q U I R E
I N T E L'S A P P R O V A L P R I O R T O T O O L C O N S T R U C T I O N .
A LL E J E C T I O N P I N B O S S E S A N D G A T E F E A T U R E S S H O W N
A R E F O R R E F E R E N C E O N LY .
15. E D G E S S H O W N A S S H A R P R 0. 1 M A X .
16. T O O LI N G R E Q U I R E D T O M A K E T H I S P A R T S H A LL B E T H E
P R O P E R T Y O F I N T E L, A N D S H A LL B E P E R M A N E N T LY M A R K E D
W I T H I N T E L'S N A M E A N D A P P R O P R I A T E P A R T N U M B E R .
17. A LL S E C O N D A R Y U N I T D I M E N S I O N S A R E F O R R E F E R E N C E O N LY .
NO T E S :
Figure 19. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Ramp Retainer Sheet 1
Mechanical Drawings
3
[ . 118 ]
5. 2
[ . 205 ]
4. 7 5
6
[ . 187 ]
6. 55
[ . 258 ]
2. 75
[ . 108 ]
3. 15
[ . 124 ]
0. 5
[ . 020 ]
2X D E T A I L
S C A LE 20
1. 75
[ . 069 ]
1. 19
[ . 047 ]
SECT IO N
B -B
4
[ . 157 ]
2X 5. 76
[ . 227 ]
5. 56
[ . 219 ]
6. 4
[ . 252 ]
Figure 20. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Ramp Retainer Sheet 2
Mechanical Drawings
2X 2. 9
[ . 114 ]
DE T A IL C
S C A LE 10
39
40
Figure 21. Intel G31, P31 Express Chipset Reference Heatsink for ATX Platforms Wire Preload Clip
Mechanical Drawings
3
[ .118 ]
7
[ .276 ]
20
[ .787 ]
20
[ .787 ]
53.6
[ 2.110 ]
50.8
[ 2.000 ]
45.8
[ 1.803 ]
7X EQUAL SPACES
10
1.3
[ .051 ]
0.1 [.003]
3.6
[ .142 ]
14X MAX RADIUS 0.5
8X FULL ROUND
3
[ .118 ]
.007 ]
QTY
TOP
31.3
[ 1.232 ]
NOTES:
ZONE
A INITIAL RELEASE
REV
DWG. NO
REVISION HISTORY
DESCRIPTION
SHT.
REV
APPROVED
3 0.2
[ .118
PART NUMBER
D72182-001
THIRD ANGLE PROJECTION
UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
ITEM NO
DATE
08/07/06
DATE
DRAWN BY
KG TAN
CHECKED BY
FINISH
SEE NOTES
MATERIAL
08/17/06
FRED ANDERS
SEE NOTES
DATE
APPROVED BY
C BERMENSOLO 08/17/06
-
08/07/06
PARTS LIST
DATE
DESIGNED BY
KG TAN
SCALE:
CORP.
3:1
D72182
DRAWING NUMBER
SHEET
1 OF 1
REV
BEARLAKE-B MCH BTX HEAT SINK
PST
A1
SIZE
TITLE
DEPARTMENT
DESCRIPTION
THIS DRAWING TO BE USED IN CONJUNCTION WITH THE SUPPLIED 3D

DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING
TAKE PRECEDENCE OVER SUPPLIED FILE.
ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY.
TOLERANCES SHALL BE CALCULATED FROM PRIMARY UNITS TO AVOID
TRUNCATION ERRORS.
CRITICAL TO FUNCTION DIMENSION
ANY TOOLING DESIGN SHALL BE SUBMITTED TO AND APPROVED BY
INTEL ENGINEERING PRIOR TO CONSTRUCTION OF THE TOOLS.
AND VENDOR IDENTIFICATION
MARK ASSEMBLY WITH PART NUMBER
PER INTEL MARKING STANDARD 164997 APPROXIMATELY WHERE SHOWN.
REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMETER OF PART.
BREAK ALL SHARP CORNERS, EDGES, AND BURRS TO 0.10MM MAX.
SHARPNESS OF EDGES SUBJECT TO HANDLING ARE REQUIRED TO MEET
UL1439 TEST.
MATERIAL: 6063-T5 ALUMINUM
UNLESS OTHERWISE NOTED, TOLERANCES ON DIMENSIONED AND
UNDIMENSIONED FEATURES ARE AS FOLLOWS:
DIMENSIONS ARE IN MILLIMETERS.
TOLERANCES:
LINEAR
0.25
ANGULAR
1
FINISH: CHEMICAL ETCH
APPLY HONEYWELL TIM PCM45F (STD SIZE 20MM x 20MM) AT
CENTER OF HEAT SINK BASE WITH AN ASSEMBLY POSITIONAL TOLERANCE
OF 1.0MM
HTSNK,EXTD,FBGA,8,AL
10
9.
7.
8.
6.
3
4.
2.
1.

P.O. BOX 58119
08/17/06
DATE
D72182
8X 1 0.15
[ .039
.005 ]
49.8
[ 1.961 ]
Figure 22. Intel G31, P31 Express Chipset Reference Heatsink for Balanced Technology Extended (BTX) Platforms
Mechanical Drawings
41
42
Figure 23. Intel G31, P31 Express Chipset Reference Heatsink for Balanced Technology Extended (BTX) Platforms Clip
Mechanical Drawings

Intel® G31/P31 Express Chipset

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Thermal and Mechanical Design Guidelines

Document Number: 317497-002

Thermal and Mechanical Design Guidelines

Thermal Metrology ..........................................................................................17

Case Temperature Measurements ...........................................................17

Reference Thermal Solution..............................................................................21

Operating Environment .........................................................................21

Enabled Suppliers ...........................................................................................29

Mechanical Drawings .......................................................................................31

Thermal and Mechanical Design Guidelines

(G)MCH Non-Grid Array......................................................................12

Thermal and Mechanical Design Guidelines

Package Loading Specifications............................................................13

Thermal and Mechanical Design Guidelines

Updated TC-MAX specification

Thermal and Mechanical Design Guidelines

Intel G31 Express Chipset GMCH (82G31 GMCH)

Intel P31 Express Chipset MCH (82P31 MCH)

Thermal and Mechanical Design Guidelines

The case temperature of the (G)MCH component. The measurement is made at

The maximum value of

The minimum valued of

Thermal Design Power is specified as the maximum sustainable power to be

Thermal Interface Material: thermally conductive material installed between

Case-to-ambient thermal solution characterization parameter (Psi). A measure

Thermal and Mechanical Design Guidelines