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November 1995

2N7000 / 2N7002 / NDS7002A


N-Channel Enhancement Mode Field Effect Transistor
General Description

Features
High density cell design for low RDS(ON).

These N-Channel enhancement mode field effect transistors


are produced using Fairchild's proprietary, high cell density,
DMOS technology. These products have been designed to
minimize on-state resistance while provide rugged, reliable,
and fast switching performance. They can be used in most
applications requiring up to 400mA DC and can deliver
pulsed currents up to 2A. These products are particularly
suited for low voltage, low current applications such as small
servo motor control, power MOSFET gate drivers, and other
switching applications.

Voltage controlled small signal switch.


Rugged and reliable.
High saturation current capability.

___________________________________________________________________________________________

D
G
S
TO-92

2N7000

(TO-236AB)
2N7002/NDS7002A

Absolute Maximum Ratings

TA = 25C unless otherwise noted


2N7000

2N7002

NDS7002A

Symbol

Parameter

VDSS

Drain-Source Voltage

60

VDGR

Drain-Gate Voltage (RGS < 1 M)

60

VGSS

Gate-Source Voltage - Continuous

20

40

- Non Repetitive (tp < 50s)


ID

Maximum Drain Current - Continuous

PD

Maximum Power Dissipation

- Pulsed
o

Derated above 25 C
TJ,TSTG

Operating and Storage Temperature Range

TL

Maximum Lead Temperature for Soldering


Purposes, 1/16" from Case for 10 Seconds

Units

200

115

280

500

800

1500

400

200

300

3.2

1.6
-55 to 150

2.4
-65 to 150

300

mA
mW
mW/C
C
C

THERMAL CHARACTERISTICS

RJA

Thermal Resistance, Junction-to-Ambient

1997 Fairchild Semiconductor Corporation

312.5

625

417

C/W

2N7000.SAM Rev. A1

Electrical Characteristics T
Symbol

= 25C unless otherwise noted

Parameter

Conditions

Type

Min

60

Typ

Max

Units

OFF CHARACTERISTICS

BVDSS

Drain-Source Breakdown Voltage

VGS = 0 V, ID = 10 A

All

IDSS

Zero Gate Voltage Drain Current

VDS = 48 V, VGS = 0 V

2N7000

TJ=125C
VDS = 60 V, VGS = 0 V
TJ=125C
IGSSF

IGSSR

Gate - Body Leakage, Forward

Gate - Body Leakage, Reverse

2N7002
NDS7002A

mA

0.5

mA

VGS = 15 V, VDS = 0 V

2N7000

10

nA

VGS = 20 V, VDS = 0 V

2N7002
NDS7002A

100

nA

VGS = -15 V, VDS = 0 V

2N7000

-10

nA

VGS = -20 V, VDS = 0 V

2N7002
NDS7002A

-100

nA

ON CHARACTERISTICS (Note 1)

VGS(th)

Gate Threshold Voltage

VDS = VGS, ID = 1 mA
VDS = VGS, ID = 250 A

RDS(ON)

2N7000

0.8

2.1

2N7002
NDS7002A

2.1

2.5

1.2

1.9

1.8

5.3

1.2

7.5

1.7

13.5

2N7000

Static Drain-Source On-Resistance VGS = 10 V, ID = 500 mA


TJ =125C
VGS = 4.5 V, ID = 75 mA

2N7002

VGS = 10 V, ID = 500 mA
TJ =100C
VGS = 5.0 V, ID = 50 mA
TJ =100C
VGS = 10 V, ID = 500 mA

NDS7002A

TJ =125C
VGS = 5.0 V, ID = 50 mA
TJ =125C
VDS(ON)

Drain-Source On-Voltage

VGS = 10 V, ID = 500 mA

2N7000

VGS = 4.5 V, ID = 75 mA
VGS = 10 V, ID = 500mA

2N7002

VGS = 5.0 V, ID = 50 mA
VGS = 10 V, ID = 500mA
VGS = 5.0 V, ID = 50 mA

NDS7002A

1.7

7.5

2.4

13.5

1.2

3.5

1.7

2.8

0.6

2.5

0.14

0.4

0.6

3.75

0.09

1.5

0.6

0.09

0.15

2N7000.SAM Rev. A1

Electrical Characteristics T
Symbol

= 25oC unless otherwise noted

Parameter

Conditions

Type

Min

Typ

Max

Units

ON CHARACTERISTICS Continued (Note 1)

ID(ON)

gFS

On-State Drain Current

Forward Transconductance

VGS = 4.5 V, VDS = 10 V

2N7000

75

600

VGS = 10 V, VDS > 2 VDS(on)

2N7002

500

2700

VGS = 10 V, VDS > 2 VDS(on)

NDS7002A

500

2700

VDS = 10 V, ID = 200 mA

2N7000

100

320

VDS > 2 VDS(on), ID = 200 mA

2N7002

80

320

VDS > 2 VDS(on), ID = 200 mA

NDS7002A

80

320

mA

mS

DYNAMIC CHARACTERISTICS

Ciss

Input Capacitance

Coss

Output Capacitance

Crss

Reverse Transfer Capacitance

ton

Turn-On Time

toff

Turn-Off Time

VDS = 25 V, VGS = 0 V,
f = 1.0 MHz

All

20

50

pF

All

11

25

pF

All

pF
ns

VDD = 15 V, RL = 25 ,
ID = 500 mA, VGS = 10 V,
RGEN = 25

2N7000

10

VDD = 30 V, RL = 150 ,
ID = 200 mA, VGS = 10 V,
RGEN = 25

2N7002
NDS7002A

20

VDD = 15 V, RL = 25 ,
ID = 500 mA, VGS = 10 V,
RGEN = 25

2N7000

10

VDD = 30 V, RL = 150 ,
ID = 200 mA, VGS = 10 V,
RGEN = 25

2N700
NDS7002A

20

ns

DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS

IS
ISM
VSD

Maximum Continuous Drain-Source Diode Forward Current


Maximum Pulsed Drain-Source Diode Forward Current
Drain-Source Diode Forward
Voltage

2N7002

115

NDS7002A

280

2N7002

0.8

NDS7002A

1.5

VGS = 0 V, IS = 115 mA (Note 1)

2N7002

0.88

1.5

VGS = 0 V, IS = 400 mA (Note 1)

NDS7002A

0.88

1.2

mA
A
V

Note:
1. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%.

2N7000.SAM Rev. A1

Typical Electrical Characteristics


2N7000 / 2N7002 / NDS7002A
2

V GS =4.0V

8.0
RDS(on) , NORMALIZED
DRAIN-SOURCE ON-RESISTANCE

9.0

7.0
1 .5

6.0
1

5.0
0 .5

4.0

, DRAIN-SOURCE CURRENT (A)

VGS = 10V

3.0

0
0

2
3
V DS , DRAIN-SOURCE VOLTAGE (V)

5 .0
6 .0

7 .0
8 .0

1 .5

9 .0
10
1

0 .5

0 .8
1 .2
I D , DRA IN CURRENT (A)

1 .6

Figure 2. On-Resistance Variation with Gate


Voltage and Drain Current

V GS = 10V

I D = 500m A
R DS(on) , NORMALIZED

1.75

1.5

1.25

0.75

0.5
-5 0

-2 5

0
25
50
75
100
TJ , JUNCTION T EMPERATURE (C)

125

DRAIN-SOURCE ON-RESISTANCE

R DS(ON) , NORMALIZED

DRAIN-SOURCE ON-RESISTANCE

0 .4

Figure 1. On-Region Characteristics

V GS = 10V
2 .5

TJ = 1 2 5 C

1 .5

25C
1

-55C
0 .5

150

Figure 3. On-Resistance Variation


with Temperature

0 .4

0 .8
1 .2
I D , DRAIN CURRENT (A)

1 .6

Figure 4. On-Resistance Variation with Drain


Current and Temperature

T J = -55C

25C
125C

1.6

1.2

0.8

0.4

0
0

2
V

GS

4
6
8
, GATE TO SOURCE VOLTAGE (V)

Figure 5. Transfer Characteristics

10

Vth , NORMALIZED
GATE-SOURCE THRESHOLD VOLTAGE

1 .1

VDS = 10V
ID , DRAIN CURRENT (A)

4 .5

2 .5

V DS = VGS

1 .0 5

I D = 1 mA

0 .9 5

0 .9

0 .8 5

0 .8
-50

-25

0
25
50
75
100
TJ , JUNCTION TEM PERATURE (C)

125

150

Figure 6. Gate Threshold Variation with


Temperature

2N7000.SAM Rev. A1

Typical Electrical Characteristics (continued)


2N7000 / 2N7002 /NDS7002A
2

I D = 250A

1.05
1.025
1
0.975
0.95
0.925
-50

-25

V GS = 0V

1.075

IS , REVERSE DRAIN CURRENT (A)

BV DSS , NORMALIZED

DRAIN-SOURCE BREAKDOWN VOLTAGE

1.1

0
25
50
75
100
TJ , JUNCTION TEM PERATURE (C)

125

0 .5

TJ = 1 2 5 C
0 .1

25C

0 .0 5

-5 5 C

0 .0 1
0 .0 0 5

0 .0 0 1
0 .2

150

0 .6
0 .8
1
1 .2
, BODY DIODE FORW A RD VOLTAGE (V)

1 .4

Figure 8. Body Diode Forward Voltage Variation with

Figure 7. Breakdown Voltage Variation


with Temperature

10

60

V DS = 2 5 V
VGS , GATE-SOURCE VOLTAGE (V)

40

C iss
20

CAPACITANCE (pF)

0 .4
V SD

C oss
10

C rss
f = 1 MHz

V GS = 0V

ID = 5 0 0 m A
4

280m A
115m A

0
1

3
V DS

5
10
20
, DRAIN TO SOURCE VOLTAGE (V)

30

50

Figure 9. Capacitance Characteristics

0 .4

0 .8
1 .2
Q g , GATE CHARGE (nC)

t d(on)

VGS

R GEN

tr

RL

t d(off)

tf
90%

90%

V OUT

Output, Vout

10%

10%

90%

DUT

Input, Vin
S

Figure 11.

t off

t on

Figure 10. Gate Charge Characteristics

VDD
V IN

1 .6

Inverted

50%

50%

10%

Pulse Width

Figure 12. Switching Waveforms

2N7000.SAM Rev. A1

3
2

3
2

0.5

S(

RD

Lim

)
ON

10

it

1m
10
ms
10
0m
s
1s

0.1
0.05

V GS = 10V

10
s
DC

SINGLE PULSE
T A = 25C

0.01

0u

ID , DRAIN CURRENT (A)

I D , DRAIN CURRENT (A)

Typical Electrical Characteristics (continued)


10

0.5
RD

1m

10

0.1

10

0.05

0.01

0m

0u

ms

1s
10
s
DC

VGS = 10V
SINGLE PULSE
T A = 25C

0.005

0.005
1

5
10
20
30
V DS , DRAIN-SOURCE VOLTAGE (V)

60

80

Figure 13. 2N7000 Maximum


Safe Operating Area
3
2
1
I D , DRAIN CURRENT (A)

S(O

Lim
N)

it

RD

S(O

N)

Lim

10
1m

0.5

0.1

10

0.05

V GS = 10V

60

80

0u

ms

1s
10
s
DC

SINGLE PULSE
T A = 25C

0.01

0m

5
10
20
30
V DS , DRAIN-SOURCE VOLTAGE (V)

Figure 14. 2N7002 Maximum


Safe Operating Area

it

10

0.005
1

5
10
20
30
V DS , DRAIN-SOURCE VOLTAGE (V)

60

80

Figure 15. NDS7000A Maximum


Safe Operating Area

TRANSIENT THERMAL RESISTANCE

r(t), NORMALIZED EFFECTIVE

1
D = 0.5

0.5

R JA (t) = r(t) * R JA
R JA = (See Datasheet)

0 .2

0.2

0.1

0.1

P(pk)
0.05

t1

0.05
0 .02
Single Pulse

0.02
0.01
0.0001

0.001

t2

TJ - T A = P * RJA (t)
Duty Cycle, D = t1 /t2

0.01

0.01

0.1
t 1, TIME (sec)

10

100

300

Figure 16. TO-92, 2N7000 Transient Thermal Response Curve

r(t), NORMALIZED EFFECTIVE

TRANSIENT THERMAL RESISTANCE

1
0.5

D = 0.5

0.2

0 .2

0.1
0.05

R JA (t) = r(t) * R JA
R JA = (See Datasheet)

0.1
0 .0 5
0 .0 2

P(pk)

0 .0 1

t1

0.01

t2

Single Pulse

TJ - T A = P * RJA (t)
Duty Cycle, D = t1 /t2

0.002
0.001
0.0001

0.001

0.01

0.1
t1 , TIME (sec)

10

100

300

Figure 17. SOT-23, 2N7002 / NDS7002A Transient Thermal Response Curve


2N7000.SAM Rev. A1

TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.

ACEx
Bottomless
CoolFET
CROSSVOLT
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E2CMOSTM
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FACT
FACT Quiet Series
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ISOPLANAR
MICROWIRE
OPTOLOGIC
OPTOPLANAR
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POP

PowerTrench
QFET
QS
QT Optoelectronics
Quiet Series
SILENT SWITCHER
SMART START
SuperSOT-3
SuperSOT-6
SuperSOT-8

SyncFET
TinyLogic
UHC
VCX

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
2. A critical component is any component of a life
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification

Product Status

Definition

Advance Information

Formative or
In Design

This datasheet contains the design specifications for


product development. Specifications may change in
any manner without notice.

Preliminary

First Production

This datasheet contains preliminary data, and


supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.

No Identification Needed

Full Production

This datasheet contains final specifications. Fairchild


Semiconductor reserves the right to make changes at
any time without notice in order to improve design.

Obsolete

Not In Production

This datasheet contains specifications on a product


that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.

Rev. G

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