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Description
Package: TO-220
Not to scale
VCC
D/ST
7.1 V
UVLO
REG
VREG
28.5 V
OVP
RST
ELP
TSD
RQ
DMAX 75%
PWM OSC
=1.6 mA
R
SQ
15.5 V/ 8.9 V
7.1 V
I startup
S
DRV
SQ
R
S2
Frequency
Modulation
FM/ELP
OLP
CK
S1
tOLP =
tFM 32 R
12 V
IDC
OCP
Soft Start
7.8 V
160 A
Feedback
Control
FB
Slope
Compensation
28103.54
LEB
S/OCP
GND
STR-W6253MD
Various protections:
Overcurrent Protection (OCP), pulse-by-pulse sensing
Overload Protection (OLP), auto restart after certain duration
External Latch Protection (ELP), latched
Overvoltage Protection (OVP), latched
Thermal Shut Down (TSD), latched
Externally-activated shut down protection (ELP) for
emergency system shut down
Auto-Burst Standby function (pin < 0.1 W at zero output load
condition)
TO-220 full-molded package with 6 pins
Selection Guide
Part Number
Packing
STRW6253MD
Pin-out Diagram
Name
D/ST
NC
S/OCP
Description
Functions
Drain/startup terminal
Clipped
No connection
Source/Overcurrent Protection
terminal
VCC
GND
Ground terminal
Ground
FB
Feedback terminal
FM/ELP
1 2 3 4 5 6 7
STR-W6253MD
Terminal
Rating
Unit
Drain Current1
Characteristic
IDpeak
1-3
Single Pulse
Note
10
IDMAX
1-3
TA = 20C to 125C
10
A
mJ
EAS
1-3
Single Pulse
86
ILpeak
1-3
VDD = 99 V, L = 20 mH
2.7
VOCP
3-5
6 to 6
VFM
7-5
0.3 to 12
IFM
7-5
mA
FB Terminal Voltage
VFB
6-5
0.3 to 9
VCC
4-5
0 to 32
PD1
1-3
27.5
Without heatsink
1.3
PD2
4-5
TF
Top
20 to 115
Storage Temperature
Tstg
40 to 125
TJ
150
Refer to TOP
0.8
20 to 115
1Refer
to figure 1
2I
DMAX is the drain current on the D/ST pin determined by the drive voltage of the IC and the threshold voltage, Vth, of the MOSFET
3Refer to figure 3
4Refer to figure 5
80
Drain Current, ID (A)
10.00
60
40
0.
it
lim n)
nt S(o
re R D
r
Cu e to
du
1.00
s
1m
100
0.10
20
Refer to figure 1 for MOSFET SOA
temperature derating coefficient
0.01
0
0
20
40
60
80
Temperature, TF (C)
100
120
10
100
1000
STR-W6253MD
80
60
40
20
1.00
0.10
0.01
0
25
50
75
100
125
150
10
100
1m
10m
100m
Time, t (s)
25
Power Dissipation, PD1 (W)
100
20
15
10
Without heatsink
PD1 = 1.3 W at TA 25C
0
0
20
40
60
80
100
120
140
160
STR-W6253MD
Symbol Terminal
Test Conditions
Min.
Typ.
Max
Units
VCC(ON)
4-5
13.9
15.5
17.1
VCC(OFF)
4-5
8.0
8.9
9.8
ICC(ON)
4-5
1.4
2.8
mA
ICC(STOP)
4-5
0.8
1.3
mA
ICC(OFF)
4-5
20
Start-up Current
Istartup
4-5
0.9
1.6
2.3
mA
VBIAS
4-5
13.6
15.2
16.8
VFM(H)
7-5
4.0
4.5
5.0
VFM(L)
7-5
2.4
2.8
3.2
VFM
7-5
1.4
1.7
1.8
17.4
13
8.6
Operating Characteristics
IFMsrc
7-5
IFMsink
7-5
8.6
13
17.4
fOSC(av)
1-5
60
67
74
kHz
1-5
4.8
6.9
kHz
DMAX
1-5
71
75
79
IFB(MAX)
6-5
220
160
100
VSTBY
6-5
0.99
1.10
1.21
DSLP
6-5
27
SLP
6-5
22
17
12
mV/s
STR-W6253MD
Symbol Terminal
Test Conditions
Min.
Typ.
Max
Units
0.71
0.78
0.86
Protection Operation
OCP Threshold Voltage at Zero
Duty Cycle (0% On-Duty)
VOCP1
3-5
DPC
1.5
1.9
2.3
mV/
DC%
VOCP2
3-5
0.82
0.93
1.04
tblank
1-5
280
400
520
ns
tOLP
1-5
400
ms
ICC (OLP)
4-5
1.2
1.9
mA
VCC(OVP)
4-5
27
28.5
30
ICC(La.H)
4-5
140
220
VCC(La.OFF)
4-5
6.4
7.1
7.8
VELP
7-5
6.4
7.1
7.8
IELP
7-5
55
100
TJTSD
135
VDSS
1-3
650
IDSS
1-3
300
ON-Resistance
RDS(ON)
1-3
1.9
Switching Time
tr
1-3
Measurement circuit 9
400
ns
Thermal Resistance
RJ-F
1.75
C/W
EAS
Measurement circuit 11
1Input
and output current polarity at the device pin; plus(+) represents sink and minus() represents source.
reference value when applying 47 nF between the FM/ELP terminal and GND.
3The latch circuit means a circuit operated ELP, OVP, TSD, and OLP.
2The
STR-W6253MD
Measurement Circuit 1
V CC(ON)
13.8V
STR-W6200D
D/ST
1
FB
6
FM/
ELP
V CC
V FM
0V
V FB
0V
V CC(OVP)
18V
5V
A
ICC
V DD 10V
1F
V FB
V CC
8V
V CC(OFF)
3.65V
V CCc(La.OFF)
V OFF(FM)
0V
2V
VD
100
32V
VD
V FM
ICC
ICC(OFF)
ICC(STOP)
ICC(La.H)
ICC(ON)
Measurement Circuit 2
18V
V CC
5V
V FB
STR-W6200D
D/ST
1
FB
6
FM/
ELP
VD
A
100
18V
V DD 10V
0V
0V
V FM
V FML
V FB
V FM
2.8Vtyp
Isrc(FM)
IFM
0A
Isnk(FM)
1F
V CC
V ELP
4.5Vtyp
V FMH
IFM
5V
t2
VD
f osc(Hi)
f osc(Lo)
f osc(av)
t1
Measurement Circuit 3
18V
V CC
5V
V FM
STR-W6200D
D/ST
1
FM/
ELP
2V
V FB
V STBY
0V
IFB
VD
+
100
18V
V DD 10V
FB
0V
V CC
VD
1F
V FM
V FB
I FB
IFB(MAX)
STR-W6253MD
Measurement Circuit 4
18V
V CC
5V
3.65V
V FM
STR-W6200D
D/ST
1
VD
100
FB
6
V FB
V DD 10V
V FB
V OCP
18V
FM/
ELP
1F
V FM
4V
V1
V1-0.04V
V OCP
t4
4V
V CC
VD
DSLP= t3 / t4 100
SLP = 0.02 / (t2-t1)
t1
t2
t3
t5(tblank)
Measurement Circuit 5
18V
V CC
5V
V FM
STR-W6200D
D/ST
1
VD
100
FB
6
FM/
ELP
7
3.65V
0V
2V
V OCP1
V OCP
0V
V OCP
tblank
18V
V DD 20V
1F
V FM
V CC
VD
V D(Lo)
Measurement Circuit 6
18 V
V CC
STR-W6200D
D/ST
1
VD
100
ICC
A
FM/
ELP
SW
V FM
t FM
SW ONOFF
V FB
1F
V DD 10V
FB
7.8 V typ
V FB
V FM
47nF
VD
V CC 18V
ICC(OLP)
ICC
t OLP(= t FM32)
STR-W6253MD
Measurement Circuit 7
650V
400V
V DD
18V
STR-W6200D
D/ST
1
ID
ICC
FB
6
V CC
FM/
ELP
13V
0V
V FM
V BIAS
5V
0V
A
ID
+
V DD
V CC
IDSS
V FM
ICC
1F
ISTARTUP
Measurement Circuit 8
STR-W6200D
D/ST
1
FB
6
FM/
ELP
7
Measurement Circuit 9
STR-W6200D
D/ST S/OCP
1
VD
VCC GND
4
FB
6
FM/
ELP
VD
10V
90%
VD
ID
300
A
18V
V FM
1F
47nF
V CC
100
18V
V DD 10V
10%
V FM
1F
47nF
V CC
tf
Measurement Circuit 10
18V
V CC
STR-W6200D
D/ST
1
FB
6
FM/
ELP
7
VD
V
ID
0.6A
5V
V FM
0V
18V
V CC
1F
V FM
VD
V D(Lo)
RDS(ON) =V D(Lo) / 1.2
STR-W6253MD
Measurement Circuit 11
Vcc
STR-W6200D
D/ST S/OCP
VCC GND
4
V DD
FB
6
FM/
ELP
18V
8V
V GS
V DSpeak
V DS 18V
V GS
IL
1F
V DD
V DS
V CC
O UT
V IN ( ac)
D/ST
VCC
S T R -W 6200D
FM /
S/O C P ELP
3
7
GND
5
FB
6
G ND
Option
10
STR-W6253MD
Branding
XXXXXXXX
XXXXXXXX
2.6 0.1
R
(2
+0.2
(5.4)
0.65 0.1
10.4 0.5
2.8
5.0 0.5
1)
0.74 0.15
3.2 0.2
16.9 0.3
2.8 0.2
7.9 0.2
Gate Burr
4.2 0.2
4 0.2
10.0 0.2
+0.2
View A
0.45 0.1
View B
5.08 0.6
Terminal dimension at lead tips
0.5 MAX
1 2 3 4 5 6 7
0.5 MAX
Deflection at pin tip
View B
11
STR-W6253MD
PACKING SPECIFICATIONS
Minimum packing option: Tube FM-205 E
4.8
+0.4
0
1.4
5.1
9 R0.6
35.0
(15.4)
9.50.1
+0.3
8.9
Side marked
ANTISTATIC
2.85
+0.3
(3.6)
1.3 0.2
14.3
Spacer
Carton
(side
view)
Tube
Spacer
620
125
Tube
All dimensions: mm
185
12
STR-W6253MD
WARNING These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Precautions must be
taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions.
Cautions for Storage
Ensure that storage conditions comply with the standard temperature (5C to 35C) and the standard relative humidity (around 40 to 75%); avoid
storage locations that experience extreme changes in temperature or humidity.
Avoid locations where dust or harmful gases are present and avoid direct sunlight.
Reinspect for rust in leads and solderability of products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device,
shorts between adjacent products, and shorts to the heatsink.
Remarks About Using Silicone Grease with a Heatsink
When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is
applied, it may produce stress.
Volatile-type silicone greases may produce cracks after long periods of time, resulting in reduced heat radiation effect. Silicone grease with low
consistency (hard grease) may cause cracks in the mold resin when screwing the product to a heatsink.
Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below:
Type
Suppliers
G746
YG6260
SC102
Dow Corning Toray Co., Ltd.
Soldering
When soldering the products, please be sure to minimize the working time, within the following limits:
2605C 10 s
3505C 3 s
Soldering iron should be at a distance of at least 1.5 mm from the body of the products
Electrostatic Discharge
When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 M of resistance to ground to prevent
shock hazard.
Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats.
When using measuring equipment such as a curve tracer, the equipment should be grounded.
When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them
from being applied to the products.
The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil.
Assembly
During soldering or other operations, the interior frame temperature of the device should never exceed 105C.
Recommended screw torque through the mounting tab is 0.588 to 0.785 N m (6 to 8 kgf cm)
13
STR-W6253MD
The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.
Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this
publication is current before placing any order.
When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users
responsibility.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products
at a certain rate is inevitable.
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems
against any possible injury, death, fires or damages to society due to device failure or malfunction.
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus
(home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation
hardness assurance (e.g., aerospace equipment) is not supported.
When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems
or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written
confirmation of your specifications.
The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.
The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are
given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property
rights, or any other rights of Sanken or Allegro or any third party that may result from its use.
Copyright 2007 Allegro MicroSystems, Inc.
This datasheet is based on Sanken datasheet SSE24071
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
14