Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Inside?
E-Textiles
Quanta-Exploring imaginations
The departments official
society-its missions and
visions
Circuit Simulators
Techno-Fun
Digitalizing India
CROSSWORD
Try it yourself
A lie detector
DIY module.
In conversation
About Us
The Editor-in-chief
Prof. Dinesh Chandra
(Head of the Department)
Editor
Mrs. Chhaya Grover
(Associate Professor)
Editorial Team
th
Designing Team
Shashank Raj(4th year)
Divyanshi Rastogi(3rd year)
Sparshi Jain(3rd year)
Asking questions.
Studying together.
Not blaming your Professor.
Being prepared to work hard but know your
limits.
Getting involved with the work.
Taking notes. (Do not use electronic devices)
Taking pride in your work.
Not underestimating yourself.
Management Team
CRUX OF EC DEPARTMENT
Anisha Srivastava (4th year)
Akshay Kumar (3rd year)
Aayush Singhal (3rd year)
CONTACT US
Email:
electrobytes.ec.jssaten14@gmail.com
https://m.facebook.com/eelectrobytee
The EC department follows a modular approach and comprises of four modules as seen below:
Interviewer: How does it feel when you look back upon the time that you spent in JSS?
KHNV Lakshmi: It feels great that I had served JSS for such a long time. I feel very
sad that I had to leave JSS.
Interviewer: How did you choose to be a teacher?
KHNV Lakshmi: I suppose its in my blood. I did not opt for teaching as my first job as I
believed that one needs to have practical exposure to be a good teacher. After working
in the industry for about 9yrs, I had the confidence that I would do justice to the
profession and hence started teaching.
Reminiscing
Memories with
Prof.KHNV
Lakshmi..
The Department bid
farewell to one of its most
promising professors on
12th May 2014.Here are
some excerpts from the
interview by Siddhartha
Agarwal, wherein she
shares some of her
profound memories.
The key to success is sincerity and discipline. Its al about competing with
yourself so do not compete with others compete with yourself and never get
disheartened by your failures.
Do not let your success go above your head. The more you learn the more
humble you are and cultivate the habit of lifelong learning. The best teacher is
the nature and your experience.
Waking up is hard to do. But a new kind of LED light bulbs could help to
ease those peaky transitions between night and day by coaxing
cooperation out of your melatonin levels. Melatonin is the hormone in
charge of making you feel sleepy , and your levels go up and down on a
24 hours cycle each day. When you wake up bright eyed and bushy
tailed, your melatonin levels tend to be low. But as the day gets longer
and the sun starts to go down, the hormone production will ramp up
again.
LED TO THE RESCUE:
The problem is if you are a graduate student, or you work the night
shift, or your bed happens to be on the International Space Station
(where the sun rises every 90 minutes),you dont have the luxury of
going to the bed when the sun goes down. Luckily, a company called
Lighting Science has an app for that.
Their smart bulb, called Rhythm Downlight ,works like this, as per the
popular science:You program your desired sleep schedule in the app,
which syncs up with the specially designed digital LED light bulb. When
its time to ramp up for your next shift ,the bulb will emit more light in
the blue spectrum ,which shuts down melatonin production ,helping
you to feel awake .But when its time to crash ,the blue light is no more,
allowing you to drift off. At this point the company produces a pro-wake
bulb and a pro sleep version. The rhythm Downlight version ,which
aims to alternate between the two, is due for release this summers.
rd
Somya Mogha ,3 year
1st Generation All Programmable 3D ICs: Xilinx 28nm homogeneous and heterogeneous 3D
ICs double the design capacity, system level performance, and level of systems integration relative
to what was possible with a pure monolithic solutioncreating an extra generation of value and
offering the manufacturing and time-to-volume advantages of smaller die.
Xilinx 3D IC
Devicesthan
Utilizing
Stacked
Enabling
More
MooreSystem
Scaling: To address
Silicon
the
typical challenges of interconnecting multiple FPGAs, Xilinx 3D IC
devices utilize Stacked Silicon Interconnect technology, enabling highbandwidth connectivity between multiple die and providing a 100x
improvement
in inter-die bandwidth
Interconnect Technology
package. SSI
technology
leverages
BENEFITS
Footprint:
More functionality fits into a small space. This extends Moore's
law and enables a new generation of tiny but powerful devices.
Cost:
Partitioning a large chip into multiple smaller dies with 3D
stacking can improve the yield and reduce the fabrication cost if
individual dies are tested separately.
Heterogeneous integration:
Circuit layers can be built with different processes, or even on
different types of wafers. This means that components can be
optimized to a much greater degree than if they were built
together on a single wafer. Moreover, components with
incompatible manufacturing could be combined in a single 3D IC.
Shorter interconnect:
The average wire length is reduced. Given that 3D wires have
much higher capacitance than conventional in-die wires, circuit
delay may or may not improve.
Power:
Keeping a signal on-chip can reduce its power consumption by
10100 times. Reducing the power budget leads to less heat
generation, extended battery life, and lower cost of operation.
CHALLENGES
Yield:
Each extra manufacturing step adds a risk for defects. In order for 3D
ICs to be commercially viable, defects could be repaired or tolerated,
or defect density can be improved.
Heat:
Heat building up within the stack must be dissipated. This is an
inevitable issue as electrical proximity correlates with thermal
proximity. Specific thermal hotspots must be more carefully managed.
Testing:
To achieve high overall yield and reduce costs, separate testing of
independent dies is essential. However, tight integration between
adjacent active layers in 3D ICs entails a significant amount of
interconnect between different sections of the same circuit module
that were partitioned to different dies.
Lack of standards:
There are few standards for TSV-based 3D-IC design manufacturing,
and packaging. Heterogeneous integration supply
chain
heterogeneously integrated systems, the delay of one part from one of
the different parts suppliers delays the delivery of the whole product,
and so delays the revenue for each of the 3D-IC part suppliers.
rd
Siddhartha Agarwal,3 year
E-TEXTILES
E-textile referred to as intelligent clothing or smart clothing
that allow for the incorporation of built-in technological
elements in everyday textiles and clothes. While not part of
the mainstream form of fashion, its popularity is increasing
and more research is being devoted to it. Smart fabrics are
ones which can change/react automatically to their
surroundings. Smart fabrics (- or intelligent textiles) are
being developed to be able to sense what is happening to
the wearer or its immediate surroundings.
In particular, integrating sensors and computational devices
into fabrics will enable the fabrics to provide a much richer
set of capabilities than is currently possible. These electronic
textiles (e-textiles) will allow us to build smart garments, as
well as home and office furnishings that look and feel like
their everyday counterparts while being able to sense our
CircuitLab:
individual needs.
presence, monitor our health, and dynamically adapt to our
individual needs. The field of e-textiles can be divided into
two main categories:
The field of e-textiles can be divided into two main
1) the first category involves mounting classical electronic
devices such as conducting wires, ICs, LEDs and conventional
batteries
into garments.
categories:
2) The second category involves creating electronic function
directly on the textile fibres . These functions can either be
passive such as pure wires, conducting textile fibres, or more
1) the first category involves mounting classical electronic
advanced functions such as transistors, diodes and solar
cells. The field of embedding advanced electronic
components onto textile fibres is sometimes referred to as
devices
such as conducting wires, ICs, LEDs and conventional
fibertronics.
Uses of conductive fibers and textiles include static
dissipation, EMI shielding, signal and power transfer in low
batteries
garments.
resistanceinto
versions,
and as a heating element in higher
resistance versions. Their benefits over solid or stranded
metal wires come from conductive fibers flexibility and
ability
use incategory
existing involves
textile machinery.
2) The to
second
creating electronic function
There is a wide range of applications for E-textiles like
Technical outdoor apparel (Trekking, mountaineering,
special task force etc.), Fire Brigade, metal casting
directly on the textile fibers. These functions can either be
industry,Commercial food-processing protection, Industrial
safety and protection.
The growth is attributed to the concerted industrys effort
passive
such as self-powered
pure wires, conducting
textileand
fibers,
on
developing
smart textiles
alsoortomore
the
improvement in energy harvesting mechanism in the coming
years. Smart textiles is poised to witness staggering growth
rd
in the coming
years.such as transistors,
Pujya pandey,3
advanced
functions
diodes andyear
solar
TECHNO-FUN
Solve the following Puzzle:
Your company is pretty tight on the budget this year and it
happens to have only Muxes to design with. You are required to
design a circuit equivalent to the one below, using minimum no.
of muxes.
CLUES:
DOWN
ACROSS
Word Search
TRY IT YOURSELF!
Steps:
1)
Interviewer: A life event that was inadvertent, but you still lure for
that moment?
Gaurav: Honestly, everything is happening inadvertently with me
since I took admission in JSS. I remember my last year's trip to
Rishikesh, I mean who bunks their sessionals just to experience the
thrill of an adventure. I really wish I could witness it once again.
too late. Find its usual time to cover the journey. Select the
right answer from the options given below.
(a) 45 min (b) 72 min (c) 40 min (d) 50 min
Q4. Ramans salary was decreased by 50% and
subsequently increased by 50%. How much percent does
he lose?
(a) 25%
Q5. Find the odd one out from the given series.
56, 72, 90, 110, 132, 150.
(a) 56
(b) 90
ANSWERS:
A1. (a)
A2. (c)
A3. (d)
A4. (a)
A5. (d)
EVENTS AT A GLANCE
Distribution Variation using AWAS electromagnetic
1.
2.
3.
2.
3.
4.
5.
6.
SEMINARS
1.
..
department
for the Technical staff from 17thA departmental seminar by Eigen Technologies team on
20th JuneTCAD
2014.Demonstration" was held on June 16,
"Sypnosis
2014.
FACULTY ACHIEVEMENT
1.
WORKSHOPS
1.
2.
3.
2.
3.
4.
PAPER PRESENTATIONS
1.
5.
STUDENT EVENTS
1.
PROUD MOMENTS
1.
2.