ir:!

~ j ~[i]i ql; l

. . . . . :.:. . . . . .

Technical Developments
in 1998: Inorganic "Metallic" Finishes,
Processes, and Equipment
by Michael Murphy

his review covers developments !n the field

since the completion of the author s review for
1997, which appeared in the February 1998
issue of Metal Finishing. Reference citations are
provided in alphabetical order by author after each
section. In cases where two authors have the same
last name, references are further identified with a
Roman numeral after the author's name both in the
text and in the reference list.

S U R V E Y S A N D G E N E R A L REFERENCES

Mertens discussed the benefits of multifunctional

coatings, which combine pretreatment, plating, passivation, and sealing, for applications in the automotive industry. Plating engineering and control in
wafer manufacturing were addressed by Worwag.
Boodey considered the impact of the Fastener Quality Act on the electroplating community. Treatment
options for controlling torque and tension tbr fasteners were provided by Crotty. Sharma reviewed electrochemical coatings on aluminum, magnesium, and
magnesium-lithium alloys for thermal control applications in spacecraft. Trends in decorative finishing of
jewelry and eyeglass frames were noted by Akkaoui.
A "road map" for electronics packaging technology
was provided by Nihei. Tsukada et al. described bare
chip technology for multilayer printed circuit
boards. Corrosion control for metallized multichip
modules and hybrid circuits was discussed by
Baudrand. Green and Lewis offered suggestions for
controlling precious metal usage for cost-effective
connector plating. Trade-offs in the selection of
plated finishes for electrical contacts were noted by
van Dijk.
Platcow recommended a proactive approach to
design with incorporation of health, safety, and environmental systems. A software package for risk
assessment and accident prevention was described
by Farag et al. Saulter et al. noted the potential
electricity savings from deregulation of the power
industry.
References
Akkaoui, M., PMling ot~d Surface Filzishil~g, 84(12): 14; 1997
Baudrand, D., Plating and Surface Finishing, 85(41:24; 1998
10

Boodey, J.B., AESF SURBqN '98, Minneapolis, June 22-25, 1998,

Session G, p. 303
Crotty, D., SME Automotive Finishing '98, Detroit, June 9-11,
1998
Farag, I. et al., 19th AESF/EPA Pollution Prevention aim Control
Cont~rence, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 3
Green, R. and R. Lewis, Transactions of the II~,~'titute of Metal
Fil~ishing, 76(21:B20; 1998
Mertens, M., Metal Finishing, 96!5):10; 1998
Murphy, M., Metal Finishing, 96(2):10; 1998
Nihei, K., AESF/SFSJ Advanced Surface Technology Formn, Kamue|a, Hawaii, Oct. 8-9, 1998, p. 69
Plateow, P.A., AESF SUR/FIN '98, Minneapolis, June 22-25,
1998, Session N, p. 575
Saulter, K.J. et al.. Plating and Sur/bce Finishil~g, 84(12i:41;
1997
Sharma, A.K., AESF SUIUFIN '98. Minneapolis, June 22 25,
1998, Session O, p. 631
Tsukada, Y. et al., AESF/SFSJ Advanced Sm'face Technology
Forum, Kamuela, Hawaii, Oct. 8-9, 1998, p. 7
van Dijk, P., Trcmsaetiol~s ~/" the Institute o/' Metal teil~ishil~g.
7612):B25; 1998
Worwag, W., AESF SUIUF1N '98, Minneapolis, June 22 25, 1998,
Session D, p. 143
CLEANING AND DEGREASING

Cleaning metal components after the Montreal Protocol was the subject of a paper by Averill et al., who
reviewed the types of contaminants, methods for
evaluating cleanliness, replacement solvents, aqueous cleaning, and other cleaning processes. Options
for degn'easing and surface preparation were also
addressed by Kanegsberg. Engelsberg provided an
overview of laser-assisted cleaning.
Starkweather et al. suggested the use of laboratory studies to predict the outcome of cleaning processes and offi~red an example tbr handling stainless
steel. A method for removing soldering fluxes incorporating an aqueous cleaning composition was patented by Cala and Reynolds. Hayes et al. II) obtained a patent, for a neutral aqueous cleaning
composition.
An overview of aqueous washing systems, including soak, spray, soak with turbulation, vertical
agitation, and rotation devices, was provided by Tulinski. Smith discussed the advantages of incorporating computers in cleaning processes tbr control,
monitoring, data collection, and documentation.
Metal Finishing

Electric immersion heaters for precision cleaning

were described by Baichoo.
Schwenkler patented a method and apparatus for
cleaning and drying within a recirculation loop. An
apparatus for precision cleaning incorporating a
cleaning monitor garnered a patent for Schneider et
al. Meyer and Wueller received a patent for an
automated cleaning system with a workpiece transportation device and an air blow-off nozzle. A cleaning system for elongated objects won a patent for
Ransley et al.
Beck and Vennerbeck suggested the use of megasonic cleaning to provide submicron soil removal
from sensitive substrates. Variations in ultrasonic
frequencies to boost cleaning were discussed by Layton. Kolyer et al. showed how a l u m i n u m foil erosion
can be used to control and calibrate ultrasonic frequencies thereby eliminating damage to components. Ultrasonic cleaning machines were the subject of patents granted to Sakuta et al. and to Sasaki
and Kashiyama.
A study of economical (low tech) technologies for
soak cleaner oil separation was provided by Horton
and Mueller. Kurschner discussed the oil splitting
ability of aqueous surfactants. Amphoteric surfacrants compatible with ultrafiltration systems were
described by Ventura and Dahanayake. Savage suggested the use of vortex filtration to extend the life of
cleaners. Three systems (polymeric filter plates,
polymeric spiral membrane modules, and ceramic
membranes) for filtration of aqueous degreasers
were compared by Bahr and Gaydos. Scambos outlined an in-plant method for removal of oil from
aqueous cleaning solutions.
Bauer and Childers offered compliance options for
meeting the halogenated solvent cleaning NESHAP
regulations. A case study on cleaning aircraft galley
refrigeration equipment was provided by Petrulio et
al., who used a proprietary solvent with a modified
vapor degreaser. Low vapor pressure solvents for
compliant cleaning under the aerospace NESHAP
were discussed by Peck. Consiglio offered a case
study using hydrofluoroethers for cleaning cardiac
pacing systems in a vapor degreaser.
Technology for meeting exposure limits while continuing use of chlorinated solvents was reviewed by
Mertens (II). H6sel et al. patented a process tbr
vapor phase cleaning with an organic solvent. An
apparatus with an hermetic enclosure for treating a
workpiece with a solvent was patented by Sabatka
and Melin. Inada et al. received a patent for a
cleaning and drying method and apparatus utilizing
perfluorocarbons as a vapor drying agent. A process
for cleaning with solvating and rinsing agents won a
February 1999

patent for Hayes et al. (II). Tourigny and Jones

reviewed solvent options for vapor phase cleaning.
Mertens (I) discussed the benefits of new stabilizers for extending the life and enhancing the performance of chlorinated solvents in fully enclosed
degreaser systems. Methods for stabilizing halogenated solvents were also addressed by DeGroot.
Darvin and Lienhart reported recent developments
in surfactant additives for liquid carbon dioxide
cleaning. A mixture of stabilizers for chlorobromomethane-based solvent cleaners was patented by
Henry. Shubkin and Liimatta obtained a patent for
a stabilized solvent cleaning composition based on
n-propyl bromide and an alcohol. Terpene-based
cleaning compositions were the subject of patents
issued to Purcell et al. and to D'Muhala and Zietlow.
Machino and Lallier and Bignon also garnered patents for solvent cleaning compositions.
References
Averill, A.F. et al., Trcmsaetions of the D~stitute of Metal Finishing, 76(3):81; 1998
Bahr, M.J. and S.P. Gaydos, Precision Cleanb~g, 6(9):24; 1998
Baichoo. C., Precision Cleaning, 6(2):18:1998
Bauer, J. and D. Childers, AESF Aerospace/Airline Plating and
Metal Finishing Forum, San Antonio, Texas, March 24-26,
1998, p.223
Beck, M. and R.B. Vennerbeck, Precision Cleaning, 6(1):15; 1998
Cala, F.R. and R.A. Reynolds, U.S. P a t e n t 5,755,893; assignors to
Church & Dwight Co. I n c
Consiglio, R., Precision Cleaning, 6(2):14; 1998
D'Muhala, T.F. and T.C. Zietlow, U.S. P a t e n t 5,762,719; assignors to Corpex Technologies Inc.
Darvin, C.H. and R.B. Lienhart, Precision Cleaning, 6(2):28; 1998
DeGroot, R., Precision ClecmD~g, 6(2):25; 1998
Engelsberg, A.C., Preeisiol~ Cleaning, 6(5):39:1998
Hayes, M.E. et al. (I), U.S. P a t e n t 5,705,472; assignors to Petroferm Inc.
Hayes, M.E. et al. (II), U.S. P a t e n t 5,716,457; assignors to Petroform Inc.
Henry, R.G., U.S. P a t e n t 5,801,136; assignor to Advanced Chemical Design Inc.
Horton, M., Sr. and 15'. Mueller, 19th AESF/EPA Pollution Prevention and Control Conference, Lake Buena Vista, Fla., dan.
26-28, 1998, p. 237
HSsel, P. et al., U.S. P a t e n t 5,690,751 ; assignors to Dew Chemical
C o.

Inada, M. et al., U.S. P a t e n t 5,690,750; assignors to K.K. Toshiba

Kanegsberg, B., Plating al~d Surface Finishing, 85(1 ):48; 1998
Kolyer, J.M. et al., Precisiolz CleemiJ~g, 6(6]:19; 1998
Kurschner, L., Precision Cleat~ilq4, 615):25; 1998
Lallier, J-P. and D. Bignon, U.S. P a t e n t 5,749,977; assignors to
Elf Atochem S.A.
Layton, H.M., Precision Cleaning, 6(1):9; 1998
Machine, K., U.S. P a t e n t 5,716,458; assignor to Nikon Corp.
Mertens, J.A. (I), Metal Finishittg, 96(12):30; 1998
Mertens, J.A. (II), Plating and Surface Finishing, 85(1~:40; 1998
Meyer, O. and K-H. Wueller, U.S. P a t e n t 5,730,163; assignors to
Dtirr Ecoclean GmbH
Peck, P.M., Metal Finishing, 96(9):36; 1998
Petrulio, R. et al., Precisio~ Cleaning, 6(81:22; 1998
11

Purcell, K. et al., U.S. P a t e n t 5,691,289; assignors to Kay Chemical Co.

Ransley, G.F., et al., U.S. P a t e n t 5,788,907; assignors to DEC
International Inc.
Sabatka, W.E. and G. Melin, U.S. P a t e n t 5,799,677; assignors to
Finishing Equipment Inc.
Sakuta, S. et al., U.S. P a t e n t 5,803,099; assignors to Matsunmra
Oil Research Corp. and Furuno Electric Co.
Sasaki, T. and K. Kashiyama, U.S. P a t e n t 5,810,037; assignors to
Daido Metal Co. Ltd.
Savage, G.S., Precision Cleal~ing, 6(3):18; 1998
Scambos, J., 19th AESF/EPA Pollution Prevention and Control
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 243
Schneider, T.W. et al.. U.S. P a t e n t 5,706,840; assignors to Sandia
Corp.
Schwenkler, R.S., U.S. P a t e n t 5,752,532
Shubkin, R.L. and E.W. Liimatta, U.S. Patent 5,792,277; assignors to Albemarle Corp.
Smith, M., Precisior~ Cleaning, 6(4):21; 1998
Starkweather, B.A. et al., Precision Cleaning, 6(7):31; 1998
Tourigny, J. and M. Jones, Precision Cleaning, 6( 111:15; 1998
Tulinski, E.H., Metal Fil~ishing, 96{9):46; 1998
Ventura, M. and M. Dahanayake, Precision Cleaning, 6(7):14;
1998
BLASTING AND SHOT PEENING

A method for using abrasive blast media containing

a corrosion inhibitor was patented by Yam. Johnson
and Mikhailov obtained a patent for a method of
manufacturing an implantable electronic device using a pickling step and then bead blasting with a
metallic media. A composite shot consisting of a
tungsten-iron alloy garnered a patent for Amick.
Takehana et al. won a patent for a photosensitive
composition suitable as a sandblast resist.
Williford provided an overview on the advantages
and disadvantages of carbon dioxide snow cleaning.
Carbon dioxide snow process parameters and the
potential for automation were addressed by Sherman and DePalma. Hoenig noted the importance of
using purified carbon dioxide for dry ice jet cleaning.
A method of polishing ductile metal surfaces with a
carbon dioxide jet spray was patented by Brandt and
Simpson. Kosic obtained a patent for a carbon dioxide jet spray disk cleaning system. A carbon dioxide
cleaning nozzle garnered a patent for Goenka. Frederick and Hjerpe received a patent for a rotating
drum cryogenic shot blast deflashing system. A supersonic abrasive ice-blasting system earned a
patent for Settles.
A method for switching pressure between two
pressure tanks in an abrasive blasting apparatus
was patented by Tomioka. Coke and Coke obtained a
patent for an enclosed abrasive blasting apparatus.
Oscillating blast cleaning devices were the subject of
a pair of patents granted to Watkin (I and II). Burds
won a patent for a sandblasting apparatus. A resilient lifter for a wire coil blast cleaning apparatus
12

was patented by Pedersen. McPhee and N g u y e n

received a patent for a pressure-balanced vacuum
blast head. A blast gun assembly was patented by
Ashworth.
Leon patented a thrust-balanced turn base for the
nozzle assembly of an abrasive media blasting system. A blast nozzle was patented by LeCompte.
Bruns et al. received a patent for a removable nozzle
for a sandblaster. An abrasive throwing wheel assembly garnered a patent for MacMillan. Williams
won a patent for a cage for a blast wheel.
A case study on an alternative technology for
masking parts to be shot peened was reported by
Schoonover. Beals and Sauer obtained a patent for a
method for ceramic peening of orthopedic titanium
alloy implants. An apparatus for precision deep
peening with a mechanical indicator garnered a
patent for Bailey and Dunkman. Champaigne received a patent for a shot peening method incorporating conveying of the media at a predetermined
mass flow rate.
References
Amick, D.D., U.S. P a t e n t 5,713,981; assignor to Teledyne Industries inc.
Ashworth, T.I., U.S. P a t e n t 5,676,589; assignor to Vapormatt Ltd.
Bailey, RG. and D.D. Dunkman, U.S. P a t e n t 5~771,729; assignors
to General Electric Co.
Beals, N.B. and W.L. Sauer, U.S. P a t e n t 5,704,239; assignors to
Smith & Nephew Inc.
Brandt, E.S. and B.A. Simpson, U.S. Patent 5,765,578; assignors
to Eastman Kodak Co.
Bruns, C.R. et al., U.S. P a t e n t 5,765,759; assignors to Danville
Engineering
Burds, D.P., U.S. P a t e n t 5,685,767; assignor to Dentinite LLC
Champaigne, J.M., U.S. P a t e n t 5,702,289; assignor to Electronics
Inc.
Coke, D.A. and D.R. Coke, U.S. P a t e n t 5,775,979
Frederick, W.R. and M. Hjerpe, U.S. P a t e n t 5,676,588; assignors
to AGA AB
Goenka, L.N., U.S. P a t e n t 5,679,062; assignor to Ford Motor Co.
Hoenig, S., Precision Cleanil~g, 6(61:28; 1998
Johnson. L.M. and V. Mikhailov, U.S. P a t e n t 5,673,473; assignors
to Medtronic Inc.
Kosic. T.J., U.S. Patent 5,806.544; assignor to Eco-Snow Systems
Inc.
LeCompte, G.J., U.S. P a t e n t 5,704,825
Leon, R.M.. U.S. P a t e n t 5,795,214; assignor to Cold Jet Inc.
MacMillan, W.R., U.S. P a t e n t 5,759,091; assignor to Tilghman
Wheelabrator Ltd.
McPhee, W.S. and A. Nguyen. U.S. P a t e n t 5,709,590; assignors to
LTC Americas Inc.
Pedersen, J.A., U.S. P a t e n t 5,782,676; assignor to Blast Cleaning
Products Ltd.
Schoonover, T., AESF Aerospace/AMine Plating and Metal Finishing Forum, San Antonio, Texas, March 24-26, 1998, p. 115
Settles, G.S.. U.S. P a t e n t 5,5,785,581; assignor to The Penn State
Research Foundation
Shermam R. and P. DePalma, Precisio~t Clea~zing, 6(6):23; 1998

Metal Finishing

Takehana, H. et al., U.S. Patent 5,756,261; assignors to Matsushita Electronics Corp. and Tokyo Ohka Kogyo Co. Ltd.
Tomioka, N., U.S. Patent 5,800,246; assignor to Rich Hill Inc.
Watkin. R.B. (I), U.S. Patent 5,716,261; assignor to Wheelabrator
Corp.
Watkim R.B. !II), U.S. Patent 5,730,646; assignor to U.S. Filter
Corp.
Williams, N.L., U.S. Patent 5,688,162
Williford, J.F., Precision Cleaning, 6(6):12; 1998
Yam, B.S., U.S. Patent 5,681,205; assignor to Church & Dwight
Co. Inc.

PICKLING AND DESCALING

Kuhn provided an overview on past and present

methods for passivation of stainless steel including
chelant-based processes and showed how chromium/
iron ratios permit quantification of the extent of
passivation. An examination of the role of molybdehum in the passivation of stainless steels using AC
impedance spectroscopy was conducted by Jargelius-Pettersson and Pound. Englebert discussed the
importance of quality processing for obtaining the
required properties in passivated stainless steel
parts. An ellipsometric study of passive films on
stainless steel 304 was conducted by Phadnis et al.
Chemical polishing, electropolishing, and passivation of stainless steel were reviewed in a paper by
Ventura. Franck and Oreins obtained a patent for a
chemical polishing bath for stainless steel consisting
of a mixture of hydrochloric and nitric acids. A
passivation treatment for stainless steel comprising
contact with a solution of hydroxyacetic acid won a
patent for Shah and Kirchner. Henriet patented a
process for pickling stainless steel in a solution of
hydrofluoric acid, ferric salts, and an oxidizing agent
incorporating monitoring of the redox potential. Hydrogen peroxide-based pickling of stainless steel was
the subject of patents granted to Rodabaugh and
Leeker and to Leeker and Rodabaugh.
Zavattoni obtained a patent for a process of pickling stainless steel while continuously catalytically
reoxidizing ~he pickling solution. A process and
plant for pickling stainless steel materials wherein
the composition and concentration of the mixed acid
in the pickling bath is selecte~ a~d e ~ t i n u e u s l y
controlled was patented by Starcevic and Mahr.
Pempera et al. received a patent for a process and
apparatus for producing strip products from stainless steel including an electrolytic pickling step.
A spray method for pickling steel featuring continuous circulation and regeneration of the solution

were the subject of patents issued to Zednicek et al.

and to Lordo.
Branch provided an overview on the use of phosphoric-nitric and high sulfuric acid bright dips for
aluminum. A composition and process for desmutting and deoxidizing consisting of nitric acid, ferric
ions, and molybdate won a patent for Carlson and
Johnson. Murphy obtained a patent for a metal
brightening composition that does not damage glass.
A process for inhibition of lead leaching from brass
alloy plumbing fixtures garnered a patent for Joe.
Furic received a patent for a method of regenerating
spent solution containing hydrofluoric and nitric
acid from pickling zirconium alloy elements.
References
Angel, C. et al., U.S. Patent 5,810,939; assignors to EKA Chemieals AB
Branch, L.C, Metal Finishing, 96(12):24; 1998
Carlson, L.R. and P.M. Johnson, U.S. Patent 5,720,823; assignors
to Henkel Corp.
Englebert, D., Products Finishing, 63(2):70; 1998
Franck, C. and J-M. Oreins, U.S. Patent 5,762,819; assignors to
Solvay
Furic, B., U.S. Patent 5,788,935
Henriet, D., U.S. Patent 5,690,748; assignor to Ugine Aciers de
Chatillon et Gueugnon
Jargelius-Pettersson, R.F.A. and B.G. Pound, Journal of the Electrochemical Societ3, 145(5!:1462; 1998
Joe, S.L., U.S. Patent 5,707,421
Kuhn, A., Metal Finishing, 96(6!:100; 1998
Leeker, J.W. and R.D. Rodabaugh, U.S. Patent 5,743,968
Lordo, R., U.S. Patent 5,803,981; assignor to Danieli Wean
Murphy, D.P., U.S. Patent 5,810,938; assignor to Henkel Corp.
Pempera, F.G. et al., U.S. Patent 5,804,056; assignors to Mannesmann AG
Phadnis. S.V. et al., Transactions of the Institute of Metal Finishing, 76(6):235:1998
Rodabaugh, R.D. and J.W. Leeker, U.S. Patent 5,702,534
Saikin, J.L.. U.S. Patent 5,675,880; assignor to Bethlehem Steel
Corp.
Shah, S. and F. Kirchner, U.S. Patent 5,766,684; assignors to
Calgon Vesta[ Inc.
Starcevic, J. and E. Mahr. U.S. Patent 5,800,694; assignors to
Andritz-Patentverwaltungs GmbH
Ve~t,~ra, K)k., ~ESF SUR/FIN '98, Mh.~e~laati~s, .]~txe 2'Z-Zh,
1998, Session O, p. 611
pianti s.r.1.
Ze-~ieek, M. z-~ ok, U.S. Pa~e~ 5,71g,4,55; assiN~'~zs~ Ar,hrit~Patentve~,altungs GmbH
ETCHING

Processes for etching and activation of titanium and

titanium alloys prior to plating were investigated by
Yang et al. Wire used both qualitative and quanti~i~

cccet&e~ ~e c&~c~,teci~e tit~ce&cc~ ~ c ~ c ~ s ~

aC a.~. ~_(~~ t~aCett~e.~ a ~tteetk(~d ag de.~ca~fc~g s~ee~

utilizing high-pressure nozzles for directing the fluid

supply. Devices for continuous pickling of steel strip

plastic to improve adhesion of copper was described

by Zhao. Maki et al. patented a microetching method

for copper or copper alloys. An etching solution ibr

copper or copper alloys containing sulfuric acid, a
persulfate, and amidosulfuric acid or an aliphatic
sulfonic acid won a pat ent for Nakagawa. Smith and
Blakeslee received a pa t e nt for an a p p a r a t u s for
etching circuit boards.
P ap ap an ay io to u et al. investigated the effect of
benzotriazole on the anisotropic electrolytic etching
of copper using sulfuric acid. An electrochemical
graining method for al um i num plate, foil, or webs
won a p aten t for Amor. Covert et al. obtained a
p a t e n t for a composition based on ferric a m m o n i u m
sulthte for selective etching of nickel-iron alloys. A
process for roughening of metal surfaces comprising
applying a coating, which is a t e m p o r a r y barrier to
an e tch an t attacking the surf'ace, wherein the coating is gradually removed due to penetration of the
etchant, garnered a p a t e n t for Hinson.
Bell p aten ted an integrated process for removing
tin or tin-lead plated layers from a copper-based
substrate and recycling the mixed acid etchant. Prop ri etar y processes for recycling of ammoniacal
etchants for copper in the printed circuit board ind u s t r y were described by Ford and by Fujita et al.
Oxley et al. p atent e d an a p p a r a t u s and process for
electrolytically regenerating a copper chloride
etchant.
References
Amor, M.P., U.S. Patient 5,755,949; assignor to AGFA-Gewtert
AG
Bell, N.J., I!.S. P a t e n t 5,755,950; assignor to Dulin Metals Co.
Covert, K.L. et al., U.S. Patent 5,723,062; assignors to IBM Corp.
Ford, C., 19th AESF/EPA Pollution Prevention and Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 77
Ft0ita, Y. et al., AESF/SFSJ Advanced Surihce Technology Forum, Kamuela, Hawaii, Oct. 8-9, 1998, p. 49
ttins<m, D., U.S. Patent 5,705,082; assignor to Chromall<)y Gas
Turbine Corp.
Maki, Y. et al., U.S. P a t e n t 5,807,49,3; assignors to MEC Co. Ltd.
Nakagawa, T., U.S. P a t e n t 5,700,389; assignor to MEC Co. L~d.
Oxley, J.E. et al., U.S. P a t e n t 5,705,048; assignors to Oxley
Research Inc.
Papapanayiotou, D. eta/., Journal o['thc Elcctr~ctwmicctl Soricty,
145(9):3016; 1998
Smith, S.B. and G.A. Blakeslee, U.S. P a t e n t 5,766,685; assignors
to Atotech USA Inc.
Wire, R., AESF SUR/FIN '98, Minneapolis, J u n e 22-25, 1998,
Session M, p. 551
Yang, Z. et al., P/~tting c~nd Sur/bce Fi~i,shinA~, 84(12t:68, 1997
Zhao, Y.. Plating a~tl S~lr/bce Finishing, 85(9):98; 1998
POLISHING AND BUFFING

Plescia provided a review of' abrasive materials and

processes for surface conditioning and satin finishing. A composition and method for polishing titanium was p aten te d by Wang et al. Obeng received a
p a t e n t for a method of polishing a material by exFebruary 1999

posing it to a slurry, which contains an abrasive and

an hydroxylamine organic oxidant. A polishing
agent for copper or copper alloys won a p a t e n t for
Sasaki et al. Ueda et al. received a p a t e n t for a fine
particulate polishing agent comprising a solid solution of cerium oxide and silicon oxide.
A method for final finishing the surface of a metal
molded article using a soft buff was patented by Sakagami et al. Asai et al. received a patent for a method
of electrolyte composite buff machining. A solid buffing
compound composition won a patent for Tabata.
Schrtider et al. obtained a pat ent for an article
comprising a component and an abrasive coating on
a tip of the component for abrading during a stripping operation. A molded abrasive article won a
p a t e n t for Wiand. H a r m e r and Ho pat ent ed an abrasive article containing an inorganic phosphate. An
abrasive body comprising a mass of u l t r a h a r d abrasive particles consisting of diamond or cubic boron
nitride particles garnered a p a t e n t for Sigalas et al.
Martin et al. and Selifanov et al. pat ent ed abrasive
articles incorporating diamondlike carbon materials. A flexible abrasive article for wet grinding and
polishing containing metal and diamond particles
was pat ent ed by Klein.
A discrete, precisely shaped abrasive composite
earned a pat ent for Holmes et al. (II). Sanders patented an abrasive article formed by liquefying organic binder particles with interspersed abrasive
particles. An abrasive wheel containing silicon carbide abrasive grain and hollow ceramic spheres was
pat ent ed by Sheldon. Wu and Wu et al. received
patents for high-permeability grinding wheels. An
abrasive flap wheel garnered a p a t e n t for Emerson.
Johnson patented a molded abrasive brush. A
nonwoven rotary brush won a p a t e n t for Allan and
Brandley. Annis et al. were grant ed a p a t e n t for a
nonwoven fibrous web. A nonwoven abrasive material roll garnered a p a t e n t for Windisch et al. H e tte s
received a pat ent for a flap disk abrasive tool. An
abrasive tool was also pat ent ed by Mitchell and
Ellison. Coons described a vacuum shroud for handheld tools to reduce exposure to respirable dust.
Hoopman and Culler received a p a t e n t for an
abrasive article comprising a sheetlike s tru c tu re
with a plurality of individual, 3-dimensional composites deployed in fixed positions. A polishing pad
with a plurality of holes and grooves was p a te n te d
by Torii. U h h n a n n and S t r u t h p a t e n t e d a coated
abrasive belt. Coated abrasives were also the subject
of patents issued to Krech, to Benedict et al., to
Holmes et al. (I), to Kardys and Herrick, to Stoetzel
and Culler, to Ho and H a r m e r , to Law et al., to
Johnson, to Williamson and Kemmerer, to DeVoe et
15

.........

al., to Follett and George, to Farbstein et al., and to

Chesley and Melbye.
An abrasive grain comprising an alpha-aluminabased material and manganese oxide was patented
by Wood and Larmie. Ueda and Takeuchi obtained a
patent for an abrasive particle consisting of aluminum oxide, silicon oxide, and cerium oxide. Abrasive
grains were also patented by Wood (I and II) and by
Jayan et al.
An apparatus for in-line surface finishing of cylindrical parts, such as stainless steel tubing, was
the subject of a patent granted to McCoy. Barton
devised a microfinishing machine. A method of ultrasonically grinding a workpiece was patented by
Shibano. Kremen patented a method and device for
magnetic abrasive machining of parts.
References
Allan, J.M. and B.A. Brandley, U.S. P a t e n t 5,765,256; assignors
3M Co.
Annis, V.R. et al., U.S. P a t e n t 5,786,065; assignors to Dexter
Corp.
Asai, S. et al., U.S. P a t e n t 5,792,334; assignors to Asahi Tec Corp.
and BBF Yamate Corp.
Barton, K.A., U.S. P a t e n t 5,803,796
Benedict, H.W. et al., U.S. P a t e n t 5,681,612; assignors to 3M Co.
Chesley, J.A. and W.L. Melbye, U.S. P a t e n t 5,785,784; assignors
to 3M Co.
Coons, J., Metal Finishing, 96(7):25; 1998
DeVoe, R.J. et al., U.S. P a t e n t 5,766,277; assignors to 3M Co.
Emerson, G.W., U.S. P a t e n t 5,722,881; assignor to Merit Abrasive Products Inc.
Farbstein, B. et al., U.S. P a t e n t 5,782,939; assignors to Norton
Co.
Follett, G.J. and C.A. George, U.S. P a t e n t 5,776,290; assignors to
3M Co.
Harmer, W.L. and K-L. Ho, U.S. P a t e n t 5,738,695; assignors to
3M Co.
Hettes, F.J., U.S. P a t e n t 5,752,876; assignor to Weiler Brush Co.
Inc.
Ho, K-L. and W.L. Harmer, U.S. P a t e n t 5,702,811
Hohnes, G.L. et al. !I), U.S. P a t e n t 5,690,705; assignors to 3M Co.
Hohnes, G.L. et al. (II), U.S. P a t e n t 5,714,259; assignors to 3M
Co.
Hoopman, T.L. and S.R. Culler, U.S. P a t e n t 5,681.217; assignors
to 3M Co.
Jayan, P.S. et al., U.S. P a t e n t 5,782,940; assignors to Carborundum Universal Ltd.
Johnson, D.E. et al., U.S. P a t e n t 5,679,067; assignors to 3M Co.
Johnson, J.S., U.S. P a t e n t 5,711,840; assignor to Northeast At)rasives, Diamond and Tools Corp.
Kardys, G.J. and W.A. Herrick, U.S. P a t e n t 5,695,533; assignors
to Norton Co.
Klein, D.G., U.S. P a t e n t 5,792.544; assignor to Eastwind Lapidary Inc.
Krech, J.E., U.S. P a t e n t 5,674,122; assignor to 3M Co.
Krelnen, G., U.S. P a t e n t 5,813,901; assignor to Scientific Mfg.
Technologies Inc.
Law, K.W. et al., U.S. P a t e n t 5,704,952; assignors to 3M Co.
Martin, L.L. et al., U.S. P a t e n t 5,707,409; assignors to aM Co.
McCoy, T.E., U.S. P a t e n t 5,759,089
16

>

Mitchell, W.A. and A.E. Ellison, U.S. P a t e n t 5,707,279; assignors

to Even Cut Abrasive Co.
Obeng, Y.S., U.S. P a t e n t 5,735,963; Lucent Technologies Inc.
Plescia, M., Metal Finishing, 96(7):29; 1998
Sakagami, T. et al., U.S. P a t e n t 5,706,567; assignors to Asahi Tee
Corp. and BBF Yamate Corp.
Sanders, R.C., U.S. P a t e n t 5,681,361; assignor to 3M Co.
Sasaki, Y. et at., U.S. P a t e n t 5,770,095; assignors to K.K. Toshiba
Sehr6der et al., U.S. P a t e n t 5,756,217; assignors to Motoren und
Turbinen Union Mfinchen GmbH
Selifanov, O.V. et al.. U.S. P a t e n t 5,711,773; assignors to TEGO
Scientific and Engineering Center of Physics and Technology of
Thin Films
Sheldon, D.A., U.S. P a t e n t 5,711,774; assignor to Norton Co.
Shibano, Y., U.S. P a t e n t 5,746,646
SigMas, I. et al.. U.S. P a t e n t 5,690,706
Stoetzel, W.L. and S.R. Culler, U.S. P a t e n t 5,700,302, assignors
to 3M Co.
Tabata, T., U.S. P a t e n t 5,749,773
Torii, K., U.S. P a t e n t 5,725,420; assignor to NEC Corp.
Ueda, K and Y. Takeuchi, U.S. Patent 5,697,992; assignors to
Sumitomo Chemical Co. Ltd.
Ueda, N. et al., U.S. P a t e n t 5,766,279; assignors to Mitsui Mining
and Smelting Co. Ltd.
U h l m a n n , E. and G. Struth, U.S. P a t e n t 5,700,188; assignors to
Hermes Schleifmittet GmbH
Wang, tf-M. et al., U.S. P a t e n t 5,770,103; assignors to Rodel Inc.
Wiand, R.C., U.S. P a t e n t 5,681,362
Williamson, S.E. and R.R. Kemmerer; U.S. P a t e n t 5,730,764
Windisch, L.A. et al., U.S. P a t e n t 5,712,210; assignors to 3M Co.
Wood, W.P. (Ii, U.S. P a t e n t 5,776,214; assignor to 3M Co.
Wood, W.P. (II), U.S. P a t e n t 5,779,743; assignor to 3M Co.
Wood, W.P. and H.A. Larmie, U.S. P a t e n t 5,690,707; assignors to
3M Co.
Wu, M.. U.S. P a t e n t 5,738,696; assignor to Norton Co.
Wu, M. et al., U.S. P a t e n t 5,738,697; assignors to Norton Co.

MASS FINISHING

The benefits, applications, and caveats associated

with centrifugal disk finishing systems were explored by O'Connor. Nishimura et al. patented a dry
barrel finishing machine. Vibratory finishing devices were the subject of patents granted to Trahan,
to Ferrara and Astorino, and to Kobayashi and Izuhara. Park received a patent for a hard coated abrasire medium made of metallic material with abrasive grit bonded to the exterior surface. A mass
finishing compound formulation won a patent for
Elmblad.
References
Elmblad, K., U.S. P a t e n t 5,795,373; assignor to Roto-Finish Co.
Inc.
Ferrara, N.K. and G. Astorino, U.S. P a t e n t 5,803,233; assignors
to Ultramatic E q u i p m e n t Co.
Kobayashi, H. and K. Izuhara, U.S. P a t e n t 5,803,800; assignors
to Tipton Corp.
Nishimura, K. et al., U.S. P a t e n t 5,733,172; assignors to Sintobrator Ltd.
O'Connor, D., Meted Finis'hing, 96(7):27; 1998
Park, J., U.S. P a t e n t 5,730,645
Metal Finishing

Trahan, J.O., U.S. P a t e n t 5,743,790; assignor to Drilltech Technologies Inc.

ELECTROPOLISHING

A prototype tool for electropolishing and character

rounding of high-speed print bands to complement
buffing was described by Datta et al. (I). Datta et al.
(II) also discussed a process for microfinishing hardened stainless steels using a mixture of two parts by
volume phosphoric acid, one part sulfuric acid, and
one part glycerol at room temperature. A process
combining ultrasonics, electropolishing, and numerically controlled machining to polish stainless steel
was described by Zhenlong et al. Sun et al. reported
on an electropolishing process for hard passive metals such as molybdenum-, nickel-, and titaniumbased alloys. The electropolishing of titanium and
t i t a n i u m alloys in a sulfuric acid-methanol electrolyte was investigated by Piotrowski et al. (I and II).
Bliek and Brussee patented a method for electrochemically machining workpieces to provide
through holes. A process for cleaning the electrolyte
from an electrochemical machining process incorporating a centrifuge and filter press garnered a
patent for Frembgen. Schuurman and Faber received a patent for a method of removing iron and
chromium compounds from an aqueous electrolytic
solution used for electrochemical machining consisting of hydrogen peroxide t r e a t m e n t with pH adjustment to precipitate metal hydroxides.
References
Bliek, M. and M. Brussee, U.S. Patent 5,738,777; assignors to
U.S. Philips Corp.
Datta, M. et al. (I!, Journal of the Electro(heroical Society, 145(9):
3047; 1998
Datta, M. et al. ([I), Journal of the Electrochemiccll Society,
145t9):3052; 1998
Frembgen, F-H., U.S. P a t e n t 5,714,054
Piotrowski, O. et al. i I), Plating and Surface Finish ing, 85(5]: ] 15;
1998
Piotrowski, O. et at. (II}, Journal of the Electrochemical Socwty,
145(7):2362; 1998
Sehuurman, A. and J. Faber, U.S. P a t e n t 5,783,061; assignors to
U.S. Philips Corp.
Sun, J.J. et al., AESF SUR/FIN '98, Minneapolis, J u n e 22-25,
I998, Session T, p. 769
Zhenlong, W. et al., Metal Finishing, 96(7):22; 1998
ANODIZING

The effect of molybdate on AC sulfuric acid anodizing of 6063 aluminum alloys was investigated by
Sert~elik et al. S h a r m a et al. (I and II) determined
the influence of hydrochloric acid, nitric acid, and
ammonium nitrate as additives in the hard anodizing of high-strength 5124 a l u m i n u m alloys. A basic
introduction to pulse anodizing was provided by
Rasmussen. Lerner suggested using a combination
18

of AC and DC current to eliminate arcing in 2-step

architectural anodizing. The mechanism of spark
anodization was the subject of a paper presented by
Runge-Marchese and Nussbaum. Erokhine et al.
patented a pulse method for coating metal by anodic
t r e a t m e n t in an electrolyte containing passivating
and modifying agents.
Maejima et al. studied the abrasion resistance of
anodized coatings on aluminum alloys with an abrasive wheel wear tester. An anodizing electrolyte
comprising water, a polyethylene glycol dimethyl
ether, and phosphoric acid or a phosphate salt won a
patent fbr Melody et al. Bailey showed how to remove aluminum and other contaminants from sulthric acid anodizing baths using diffusion dialysis. A
sol-gel process with tailorable pore size and porosity
capable of accepting dyes or pigments to impart
decorative or functional surface characteristics was
described by Zheng et al., who offered it as an
alternative to anodization.
A lighting fixture with an anodized louver system
was patented by Robertson. Ueda received a patent
for a photosensitive member having an anodized
substrate. An anodized component with a dielectric
polymer filling ibr electronic applications was the
subject of a patent granted to Mahulikar et al.
Konuma et al. obtained a patent for a method of
producing a transistor using anodic oxidation. An
anodizing method and apparatus for forming electrodes of a thin film transistor garnered a patent for
Matsuda and Mori.
Paulet patented a process for continuously anodizing strips or wires of aluminum. A method and
apparatus for anodizing thin strips earned a patent
for Van Anglen et al. Tiner described an anodizing
rack featuring a cover to retrieve falling parts.
The efJhcts of"sealing and coloring on the abrasive
wear resistance of hard anodized Type III coatings
were discussed by Rasmussen and Olbrantz. Theohari and Tsangaraki-Kaplanoglou investigated the
DC electrodeposition of tin for coloration of alumin u m oxide fihns in the presence of malachite green
dye. Electrolytic DC coloration with transition metals, such as tin, nickel, and cobalt, was the subject of
a paper presented by Ventura. Anicai et al. compared AC coloring of coatings prepared from three
different anodizing electrolytes using silver-nitratebased electrolytes. A process ibr AC electrolytic coloring of aluminum won a patent for Patel.
Mansthld et al. (II) found t h a t boric-sulfuric anodized coatings could be sealed satisfactorily in rare
earth metal salt solutions, such as hot cerium nitrate or y t t r i u m sulfate, to provide corrosion resistance similar to chromate sealing. An evaluation of
Metal Finishing

[[

sealing methods for boric-sulfuric and sulfuric acid

anodized aluminum alloys using electrochemical impedance spectroscopy was conducted by Mansfeld et
al. (I). Lopez et al. determined the effect of aging at
room temperature and 50C on the quality of sealing
in a triethanolamine solution. The effect of temperature and triethanolamine addition on the kinetics
of sealing anodized aluminum was reported by Bau-.
tista et al.
Jakobson et al. (I) provided a review of zinc an-odizing including coating properties, operating con-ditions, and applications. The corrosion resistance,
structure, and composition of anodized magnesium
coatings were reported by Jakobson et al. (II). Kha.selev and Yahalom investigated constant voltage
anodizing of magnesium-aluminum alloys in potassium hydroxide-aluminum hydroxide solutions containing potassium fluoride and sodium phosphate. A
method for anodizing magnesium-based materials
in a solution containing 1% by volume of ammonia
and a phosphate compound was patented by Barton.
Melody et al. (II) studied the unlimited growth of
anodic oxide films on tantalum, titanium, and aluminum in glycerin- and mannitol-based electrolytes.
References
Anicai, L. et ah, Metal Finishing, 96(12):10; 1998
Bailey, D.E., Metal Finishing, 96(12):14; 1998
Barton, T.F., U.S. P a t e n t 5,792,335; assignor to Magnesium
Technology Ltd.
Bautista, A. et al., Plating and Surface Fir~ishing, 85(5): 110; 1998
Erokhine, A. et al., U.S. P a t e n t 5,720,866; assignors to ARA
Coating Inc.
Jakobson, S. et al. (I), Metal Finishing, 96(6):114; 1998
Jakobson, S. et al. (II), AESF SUPJFIN '98, MinneapoLis, June
22-25, 1998, Session M, p. 541
Khaselev, O. & J. Yahalom, Journal of ttw Electrochemical SoeicO', f~'5-tT~!fg0, f99~"

ductor Energy Laboratmy Co. Ltd.

Lerner, M., Plating and Surface Finishing, 85(11):245; 1998
Lopez, V. et al., Plating and Surface Finishing, 85(3):67:1998
Maejima, M. et al., Metal Finishing, 96(10):36; 1998
N[ahu~ikar, D'. e~ ai'., U.S. Pa~ent 5,68'8',66~; assignors- m (~i'i'a
Corp.
Mansfekt, F. et al. (I}, Plati~, and Surface Fin~s]*in~, 84t12>:72;
1997
Mansfeld~ F. et al. (II), Journal o[" the Electrochemical Society,
145(8):2792; 1998
Matsuda, K. and H. Marl, U.S. P a t e n t 5,733,420; assignors to
Casio Computer Co. Ltd.
Melody, B. et al. (I), U.S. P a t e n t 5,716,511; assignors to Kemet
Electronics Corp.

Rasmussen, J., AESF SUR/FIN '98, Minneapolis, June 22-25,

1998, Session T, p. 801
Rasmussen, J. and S. Olbrantz, AESF SUR/FIN '98, Minneapolis,
June 22-25, 1998, Session M, p. 525
Robertson, R.K., U.S. P a t e n t 5,678,922; assignor to H.E. Williams
Inc.
Runge-Marchese, J.M. and T. Nussbaum, AESF SUN/FIN '98,
Minneapolis, June 22-25, 1998, Session M, p. 531
Sert~elik, F. et al., Transactions of the Institute of Metal Finishing, 76(5!:179; 1998
Sharma, A.K. et al. (I), AESF SURflFIN '98, Minneapolis, June
22-25. 1998, Session Q, p. 679
Sharma, A.K. et al. (II), Plating and Surface Finishing, 85(7):55;
1998
Theohari, S. and I. Tsangaraki-Kaplanoglou, Transactions of the
b~stitute of Metal Finishing, 76(2):45; 1998
Tiner, N.A., Prod~cts Finisi~ing, 62(6):64; 1998
Ueda, H., U.S. P a t e n t 5,723,241; assignor to Minolta Co. Ltd.
Van Anglen, E.S. et al., U.S. P a t e n t 5,679,233; assignors to
Electroplating Technologies Ltd.
Ventura. X.A., AESF SUR/FIN '98, Minneapolis, June 22-25,
1998, Session Q, p. 699
Zheng, H. et al., Metal Finist~ing, 96(12):35, 1998
ELECTRODEPOSITED M E T A L S

Chromium
A colloquium on hard and decorative chromium plating was held at the School of Mines in St. Etienne.
The proceedings include 27 papers (half in English
and half in French) covering subjects from chromic
acid production to regulatory requirements and pallution prevention along with substitute finishes.
Durut et al. demonstrated the strong influence of
plating temperature on the microstructure and
properties of chromium electrodeposits and showed
that 40C is a critical temperature around which
hardness, stress, and crack density peak. The mechanism of electrodeposition of chromium coatings was

tion. A process for forming structured chromium

layers consisting of hemispheres was described by
reasLrtg yietds for hrigkt ekraraLum ptatirtg~ A
method for prediction of current distribution on
shaped cathodes with application to chromium plating was reported by Averill and Mahmood.
Current applications for chromium in the automotive industry were discussed by Snyder. Hall obtained a patent for an iron with a chromium-plated
skirt. A method for preparing oxidation-resistant
chromium-ruthenium-aluminum coatings incorpo-

ko_6; 1_998

Patel, P., U.S. P a t e n t 5,674,371; assignor to Clariant Finance

(BVI) Ltd.
Paulet, J-F., U.S. P a t e n t 5,693,208; assignor to Alusuisse Technology & Management Ltd.
February 1999

Jackson. Mandich used a quartz crystal microbalance to determine anodic dissolution efficiency in a
chromium plating bath.
19

A r e v i e w of e l e c t r o d e p o s i t i o n f r o m t r i v a l e n t chrom i u m e l e c t r o l y t e s w a s p r o v i d e d by P e a r s o n a n d
Long. I b r a h i m et al. r e p o r t e d t h e influence of m e t h anol a n d formic acid on t h e corrosion a n d w e a r
r e s i s t a n c e of t h i c k c h r o m i u m deposits o b t a i n e d f r o m
a u r e a - b a s e d t r i v a l e n t c h r o m i u m electrolyte. T h i c k
chromium plating from trivalent chromium baths
w a s t h e subject of a p a p e r p r e s e n t e d by K u d r y a v t s e v
et al., w h o n o t e d a c o r r e l a t i o n b e t w e e n l i m i t e d thickn e s s a n d d e p o s i t m o r p h o l o g y . P u l s e p l a t i n g of h a r d
c h r o m i u m f r o m a t r i v a l e n t c h r o m i u m b a t h w a s inv e s t i g a t e d by Song a n d Chin.
T h e p r a c t i c a l a n d t h e o r e t i c a l a s p e c t s of r e g e n e r ation of chromic acid p l a t i n g solutions v i a electrolytic p u r i f i c a t i o n (porous pot) w e r e c o n s i d e r e d by
M a n d i c h et al. L o r d i n v e s t i g a t e d t h e effect of pollution p r e v e n t i o n on t h e f u n c t i o n a l p r o p e r t i e s of h a r d
c h r o m e plate. A closed recycle s y s t e m for c h r o m i u m
p l a t i n g i n c o r p o r a t i n g filtration a n d electrolytic purification w a s p a t e n t e d by Iida.
S u b s t i t u t e s for c h r o m i u m p l a t i n g w e r e a d d r e s s e d
in a n u m b e r of p a p e r s . S h a h i n p r o p o s e d t h e use of
alloy e l e c t r o d e p o s i t s such as tin-nickel, tin-cobalt,
nickel-tungsten,
and cobalt-tungsten.
Thermal
s p r a y coatings w e r e s u g g e s t e d by S a r t w e l l et al. a n d
b y B o d g e r et al. H u n t et al. offered t h i n fihn c h e m ical v a p o r deposition coatings for a i r c r a f t applications.

References
2nd International Colloquium on Hard and Decorative Chromium Plating, St. Etienne, France, April 22
Averill, A.F. and H.S. Mahmood, Tralzsactions of the Institute of
Metal Finishing, 76(2):59; 1998
Bodger, B. et al., AESF Aerospace/Airline Plating and Metal
Finishing Forum, San Antonio, Texas, March 24-26, 1998, I).39
Bolch, T. et al., AESF SURIFIN '98, Minneapolis, June 22-25,
1998, Session E, p. 203
Durut, F. et al., Metal Finishing, 96(3i:52; 1998
Hall, S.M., U.S. Patent 5,782,021; assignor to Black & Decker Inc.
Horsthemke, H., AESF SURIFIN '98, Minneapolis, June 22-25,
1998, Session E, p. 195
Hunt, A. et al., AESF Aerospace/Airline Plating and Metal Finishing Forum, San Antonio, Texas, March 24-26, 1998, p.139
Ibrahim, S.K. et al., Transactions of the Institute of Metal Fimshittg, 76(4):156; 1998
Iida, H., U.S. Patent 5,766,428; assignor to Nichiei Hard Chrome
Industrial Co.
Jackson, M.R., U.S. Patent 5,759,380; assignor to General Electric Co.
Kudryavtsev, V.N. et al., AESF SUR/FIN '98, Minneapolis, June
22-25, 1998, Session E, p. 215
Lord, J., 19th AESF/EPA Pollution Prevention and Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 59
Mandich, N.V., AESF SUPdFIN '98, Minneapolis, June 22-25,
1.998, Session E, p. 165
Mandich, N.V. et al., Plating arm S~rface Finishing, 84(12):82;
1997
20

Pearson, T. and E. Long, Transactions of the Institute of Metal

Finishing, 76(6):B83
Sartwell, B. et al., AESF Aerospace/Airline Plating and Metal
Finishing Forum, San Antonio, Texas, March 24-26, 1998, p.97
Shahin, G.E., Plating and Surface Finishing, 85(8):8; 1998
Snyder, D., Plating and Surface Finishing, 85(9):38; 1998
Solovyeva, Z.A., Plating and Surface Finishing, 85(4):87; 1998
Song, Y. and D-T. Chin, AESF SUR/FIN '98, Minneapolis, June
22-25. 1998, Session B, p. 53

Copper and Copper Alloys

S t o y c h e v II) p r o v i d e d a r e v i e w on t h e role of polye t h y l e n e glycol a n d p o l y p r o p y l e n e glycol as additives in acid copper plating. T h e leveling a n d b r i g h t e n i n g effects of t h i o u r e a in acid copper p l a t i n g w e r e
i n v e s t i g a t e d by Alodan a n d Smyrl. Eliadis a n d
Alkire c o n d u c t e d in-situ s t u d i e s of acid copper deposition on gold in t h e p r e s e n c e of q u a t e r n a r y a m m o n i u m s a l t s u s i n g a t o m i c force m i c r o s c o p y a n d X - r a y
diffraction. T h e effect of codeposition of carbon, s u b
fur, n i t r o g e n , a n d h y d r o g e n on the m i c r o h a r d n e s s of
b r i g h t copper w a s r e p o r t e d by S t o y c h e v (I). M a r t i n
p a t e n t e d the u s e of a l k o x y l a t e d d i m e r c a p t a n e t h e r
a d d i t i v e s for i n h i b i t i n g t h e f o r m a t i o n of d e n d r i t e s
a n d nodules in copper plating. A m o n o v a l e n t alkaline copper p l a t i n g f o r m u l a t i o n g a r n e r e d a p a t e n t
for B r a s c h .
A m o d e l for d i f f u s i o n - l i m i t e d acid copper deposition w a s d e v e l o p e d by E l e z g a r a y et al. to d e t e r m i n e
t h e n a t u r e a n d origin of m o r p h o l o g i c a l instability.
T h e influence of w a t e r on m a s s t r a n s f e r in acid
copper p l a t i n g w a s t h e subject of a p a p e r p r e s e n t e d
by Koelzer, w h o s u g g e s t e d r a t i o s of m e t a l to acid to
m a x i m i z e m a s s t r a n s f e r . T h e u n d e r p o t e n t i a l deposition of copper on gold w a s s t u d i e d b y B o g u s l a v s k y
a n d B r u c k e n s t e i n u s i n g a r o t a t i n g r i n g disk elect r o d e a n d a n e l e c t r o c h e m i c a l q u a r t z c r y s t a l microbalance.
F u k u n a k a et al. f o u n d a significant difference in
t h e m o r p h o l o g y of acid copper d e p o s i t e d u n d e r freefall conditions. Direct p l a t i n g of t h r o u g h holes w i t h
copper w a s a d d r e s s e d by O s a k a . Z h a n g a n d Beilin
d e s c r i b e d p r e t r e a t m e n t p r i o r to copper p l a t i n g to fill
m i c r o v i a s for electronic applications. C u r r e n t evolution of e l e c t r o d e p o s i t e d c o p p e r b u m p s w i t h p h o t o r e sist sidewall a n g l e s w a s a d d r e s s e d by K o n d o a n d
Fukui.
Li et al. c o n d u c t e d a c o m p a r a t i v e s t u d y of copper
deposition onto silicon f r o m dilute a n d b u f f e r e d hydrofluoric acid solutions. E l e c t r o c h e m i c a l i m p e d ance s p e c t r o s c o p y w a s u s e d by C h e n g et al. to p r o b e
the m e c h a n i s m of c o p p e r deposition onto silicon
f r o m dilute hydrofluoric acid solutions. T h e y f o u n d
s e n s i t i v i t y to p a r t - p e r - b i l l i o n levels a n d p r o p o s e d
d e v e l o p m e n t of a s e n s o r to detect c o p p e r i m p u r i t i e s
in hydrofluoric acid.
Metal Finishing

+,

/ ; +

Eductors were used for agitation for printed circuit board production by Ward et al. to improve the
thickness distribution of copper deposits. A multipie-layered article having a bright copper layer was
patented by Cupolo et al. Oguro et al. received a
patent for a method of surface roughening copper
foil consisting of a repeated sequence of anodic dissolution to etch the foil and cathodic deposition to
attach nodules to the foil by electrodeposition. A
method of purifying copper electrolytic solutions in
electrorefining systems won a patent fbr Tomita et
al.
Kristof and Pritzker obtained a mirror-smooth
finish from an acid copper bath by combining pulsereverse plating with ultrasonic agitation. A model
for pulse-reverse copper electrodeposition of highaspect-ratio trenches and vias was developed by
West et al. Reed et al. investigated the effects of
various pulse waveforms on the thickness distribution and properties of deposits produced from acid
copper sulfate baths with and without additives. A
correlation between leveling performance and mechanical properties of DC- and pulse-plated copper
coatings was reported by Aroyo et al. Roy described
a method for producing compositionally modulated
alloys of copper and nickel using a pulse-displacement reaction scheme.
In-situ mass changes and stress measurements in
copper and nickel-iron electrodeposited multilayers
were investigated by Chassaing, who used a double
quartz crystal resonator technique. A stable citrate
electrolyte for electrodeposition of copper-nickel alloys was developed by Green et al., who found that a
pH level of 4 must be avoided due to solubility
problems. The electrodeposition of copper and copper-aluminum alloys from a room temperature chloroaluminate molten salt was reported by Tievney et
al. Bhattacharya et al. prepared copper-indium-gallium-selenium photovoltaic cells for solar energy
applications using binary and multinary electrodeposited precursors. A noncyanide brass plating bath
for making metallic foil based on a sodium polyphosphate-orthophosphate electrolyte was patented by
Ameen and Orloff.
References
Alodan, M.A. and W.H. Smyrl, Journal of the Electroehemicctl
Society, 145(3):957; 1998
Ameen, T.J. and G.L. Orloff, U.S. P a t e n t 5,762,778; assignors to
Gould Electronics Inc.
Aroyo, M. et al., AESF SUR]FIN '98, Minneapolis, J u n e 22-25,
1998, Session B, p. 61
Bhattacharya, R.N. et al., Journal of the Eleetroehemiccd Society,
145( 10):3435; 1998
Bogustavsky, I. and S. Bruckenstein, AESF SUR/F[N '98, Minneapolis, J u n e 22-25, 1998, Session H. p. 313

22

Brasch, W.R., U.S. P a t e n t 5,750,018; assignor to LeaRonal Inc.

Chassaing, E., Journal of the Electrochemical Society, 144(12):
L328; 1997
Cheng, Y. et al., Journal ~Jf the Electrochemical Society, 145( 1):
352; 1998
Cupolo, D.A. et al., U.S. P a t e n t 5,792,565, assignors to Avon
Products Inc.
Elezgaray, J. et al., Journal o/"the Eleetrachem ieal Soeiety, 145(6):
2016; 1998
Eliadis, E.D. and R.C. Alkire, Journal of the Electrochemical
Society. 145(4):1218; 1998
Fukunaka, Y. et al., Journal of the Electrochen,ical Society,
145(6):1876; 1998
Green, T.A. et al., Journal of the Electrochemical Society, 145(3):
875; 1998
Koelzer, S., AESF SUR/FIN '98, Minneapolis, J u n e 22-25, 1998,
Session T, p. 779
Kond(~, K. and K. Fukui, J<>urnal of the Electrochemical Society,
145(3):840; 1998
Kristot; P. and M. Pritzker, Plating and Surface Fb~ishing,
85(11):237; 1998
Li, G. el al., Journal of the Electrochemical Society, 145I 1):241;
1998
Martin, S., U.S. P a t e n t 5,730,854; assignor to Enthone-OMI Inc.
Oguro, R. et al., U.S. P a t e n t 5,792,333; assignors to Circuit Foil
J a p a n Co. Ltd.
Osaka, T., AESF/SFSJ Advanced Surface Technology Forum,
Kamuela, Hawaii, Oct. 8-9, 1998, p. 13
Reed, A.H. et aL, AESF SUR/FIN '98, Minneapolis, J u n e 22-25,
1998, Session T, p. 741
Roy, S., AESF SUR/FIN '98, Minneapolis, J u n e 22-25, 1998,
Session T, p. 747
Stoychev, D, ([), Transactiolzs of the Institute of Metal Finishing,
76(1):26; 1998
Stoychev, D. (II), Transactions of the Institute of Metal Finishilzg,
76(2):73; 1998
Tierney, B.J. et al., Journal of the EIectroehemical Society, 145(9):
3110; 1998
Tomita, M. et al., U.S. P a t e n t 5,783,057; assignors to Nippon
Mining & Metals Co. Ltd.
Ward, M. et al., Tralzsactions (>/'the Institute of Metal Fi~ishing,
76(4):121; 1998
West, A.C. et al., Journal of the Electrochemical Society, 145(9):
3070; 1998
Zhang, L. and. S. Beilin, AESF/SFSJ Advanced Surface Technolog2y Forum, Kamuela, Hawaii, Oct. 8-9, 1998, p. 75

Gold and Gold Alloys

Recent topics in gold plating for electronics applications, including noncyanide baths for soft gold plating on silicon wafers and hard gold for use at elevated temperatures, were addressed by Okinaka
and Hoshino. Okinaka also reviewed noncyanide
gold plating baths containing thiosulfate and sulfite
as mixed ligands for gold. Hemsley and Shiokawa
outlined applications for pure gold for microelectronics applications including ball grid arrays and flip
chip assemblies. Microball bumping technology for
flip chip and TAB interconnections was discussed by
Tatsumi et al. Langan offered guidelines for evaluating alternatives to hot-air solder leveling including nickel/gold.
Metal Finishing

A method for forming a gold plating electrode for

wire bonding was patented by Hail. Benebo et al.
obtained a patent for a method of electrodepositing
gold onto circuit board features. A method for plating a graphite-aluminum matrix composite material
with nickel and gold garnered a patent for Smith et
al. Holmbom et al. studied the electrodeposition,
growth morphology, and melting characteristics of
gold-tin eutectic alloys.
References
Benebo, B.a. et al., U.S. Patent 5,733,466; assignors to IBM Corp.
Hail, H., U.S. Patent 5,767,008; assignor to Matsushita Electric
Industrial Co. Ltd.
Hemsley, S.J. and K. Shiokawa, AESF SUR/FIN '98, Minneapolis, June 22-25, 1998, Session D, p. l l l
Holmbom, G. et al., Plating and Surfi~ce Finishing, 85(4):66; 1998
Langan, J.P., AESF SUR/FIN '98, Minneapolis, June 22-25,
1998, Session A, p. 1
Okinaka, Y., AESF/SFSJ Advanced Surface Technology Form'u,
Kamuela, Hawaii, Oct. 8-9, 1998, p. 1
Okinaka, Y. and M. Hoshino, Gold Bulletin 31(1):3; 1998
Smith, C.R. et al., U.S. Patent 5,730,853; assignors to Northrop
Grumman Corp.
Tatsumi, K. et al., AESF SURIFIN '98, Minneapolis, June 22-25,
1998, Session D, p. 123

Nickel a n d N i c k e l Alloys
Hadian and Gabe determined the effect of shaped
anodes on localized nickel deposit thickness from
nickel strike and nickel sulfamate solutions. Factors
influencing the deposit cflaracteristfcs of nickel t~om
sulfamate electrolytes were addressed by B a u d r a n d
and Weisenberger. Sara'bi and Singh investigated
the effects of current density, bath temperature, and
m-meM~g ~empm'a'm~e o~ ~ e c~a~ac'~er~s~ics ~
nickel deposited ~"rom a m'~xed solvent dectrolyte
containing nickel sulfamate, ethylene glycol, and
diethylene glycol. Metal d~str~bution in the p}at~ng
of nickel/chromium was studied by J a y a k r i s h n a n et
a[. M6bius described developments in the maintenance of bright nickel electrolytes.
ogy of nickel deposited by magnetoelectrolysis using
confocal laser microscopy. Magnetic field effects on
nickel electrodeposition from a Watts bath were
reported by Devos et al. (I and II). Madore et al.
developed a model for blocking inhibition by coumatin in a Watts bath using electrochemical impedance
spectroscopy. Flow modulation as a means of studying leveling agents was described by Cheng and
West, who used coumarin in nickel plating as an
example.
The eftbct of nickel diffusion coatings on 304
stainless steel was reported by Ogel and Sapcy.
Games and Kicking de>ermined ~he effect of nicke~
solution composition on the plating of silicon. A
February 1999

method for electroplating nickel on nickel ferrite

devices was patented by Law et al. Catonne et al.
patented a process for conditioning a copper or copper alloy mold surface prior to electroplating nickel
from a sulfamate bath. A process for preparing a
steel sheet for direct-on enameling won a patent for
Guillot et al.
Nickel-free technology for decorative plating applications was addressed by Hemsley and Sargent.
[gel et al. reported on a closed-loop system for plating bright nickel utilizing an insoluble anode and an
absorber polymer to eliminate build-up of nickel and
organic contaminants.
The preparation of nickel-boron amorphous electrodeposited alloys using a rotating electrode was
reported by Onoda et al. Johnson et al. obtained a
patent for an amidosulfonic acid aqueous solution
for electrodepositing metal-carbon alloys such as
nickel-carbon and nickel-tungsten-carbon. Nickel
and cobalt alloys were proposed as alternatives to
decorative chromium by Shahin et al. Kruglikov et
al. described a black nickel coating deposited from a
thiocyanate-free solution containing zinc. An electron microscopy study on the morphologT and crystal growth characteristics of black nickel deposits
was reported by Ananth.
Gadad and Harris studied oxygen incorporation
irae allays: ~cam cbdar~de-hased elecCr~ly~es. Tb.e
m o ~ ~ a( ~ab~a,aa~~O:c i ~ e a~d 9vg,~-revewe
plating of nickel-iron alloys from a sulfate bath by

posited nickel-iron alloys were characterized by Leith et aL Harris and St, Clair patented a method of
manufacturing a computer hard disk drive head
~si~g a ~ickel-ira~ electroly~e c ~ a i ~ i ~ g e t h y l
enediamine and diethylenetriamine. An investiga(nickel/cobalt/iron) and their binary alloys from sulfate electrolytes was reported by Sasaki and Talbot.
The mechanism of electrodeposition of nickel-molybdenum alloys from citrate baths was investigated
by Uekawa et al. A n a n t h and P a r t h a s a r a d h y used
an electron microscope to observe nickel-molybdenum-iron alloy coatings deposited from an ammoniacal citrate bath. A similar electrolyte was used by
Stepanova and Purovskaya to optimize conditions
for electrodeposition of nickel-based alloys of tungsten and molybdenum. The kinetics of electrodeposition and the properties of nickel-tungsten alloys
were reported by Ata~as~av and Brataeva. t~rataeva
and Atanassov also investigated the influence of
23

current density and temperature on nickel-tungsten

alloy electrodeposition from a sulfamate electrolyte.
Stephen and Purovskaya investigated the microstructure and properties of nickel-manganese electrodeposits plated onto stainless steel from a sulfate
electrolyte containing ammonium sulfate. Structural changes and the formation ofbunsenite (nickel
oxide) during recrystallization at 450'C of electrodeposited nickel-manganese-sulfur layers were discussed by Atanassov and Schils. Nakasuji et al.
obtained a patent for a nickel-titanium alloy wire
containing an electrodeposited nickel or nickel-cobalt layer.
References
Ananth, M.V., Transactions of the Institute of Metal Finishbtg,
76(6):224; 1998
Ananth, M.V. and N.V. P a r t h a s a r a d h y , Transactiorzs of the Institute of Metal Finishing, 76(1):35; 1998
Atanassov, N. and M. Bratoeva, Transactions of the Institute of
Metal Fitzishing, 76(1):39; 1998
Atanassov, N. and H.W. Schils, Plating and Sulface Fitzishi~g,
85(6):112; 1998
Baudrand, D. and L. Weisenberger, AESF Aerospace/Airline
Plating and Metal Finishing Forum, San Antonio, Texas,
March 24-26, 1998, p.77
Bratoeva M. and N. Atanassov, Metal Finishit~g, 96(6~:92; 1998
Catonne, J-C. et al., U.S. P a t e n t 5,788,824; assignors to Usinor
Sacilor and Thyssen Stahl AG
Cheng, C-C. and A.C. West, Journal of the Electrochemical Socie(v, 145(2):560; 1998
Devos, O. et al. (I), Jour~ml of the Electrochemical Saciety, 145(2):
401; 1998
Devos, O. et al. (II), Jourrzal of the Electrochemical Society,
145(12):4135; 1998
Gadad, S. and T.M. Harris, Journal of the Electrochemical Sodety, 145(11):3699; 1998
Gomes, C.R. and V.C. Kieling, Metal Finishing, 96(1A):49; 1998
Guillot, L. et al., U.S. P a t e n t 5,766,374; assignors to Sollac
Hadiam S.E. and D.R. Gabe, Metal FinishDzg, 96(3):46; 1998
Harris, T.M. and J.L. St. Clair, U.S. P a t e n t 5,683,568; assignors
to University of Tulsa
Hemsley, S.J. and J. Sargent, AESF SUR]FIN '98, Minneapolis,
J u n e 22-25, 1998, Session E, p. 185
Igel, O. et al., 19th AESF/EPA Pollution Prevention and Control
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 229
J a y a k r i s h n a n , S. et al., Transactions of the Institute of Metal
Finishing, 76(3):90; 1998
Johnson, C.E. et al., U.S. P a t e n t 5,759,24:3; assignors to U.S.A. as
represented by Secretary of Commerce
Kruglikov, S.S. et al., AESF SUP/FIN '98, Minneapolis, J u n e
22-25, 1998, Session E, p. 173
Law, H.H. et al., U.S. P a t e n t 5,779,873; assignors to Lucent
Technologies Inc.
Leith, S.D. et al., Journal of the Electrochemical Socie(v, 145(8):
2827:1998
Madore, C. et al., Journal of the Electrochemical Society, 145(5):
156I; 1998
M6bius, A., AESF S U t ~ I N '98, Minneapolis, J u n e 22-25, 1998,
Session E, p. 179
Nakasuji, K. et al., U.S. P a t e n t 5,733,667; assignors to Sumitomo
24

Metal Industries Ltd., Kanto Special Steel Works Ltd., and

Sanyo Special Alloys Ltd.
Ogel, B. and I.A. Sapci, AESF SUR/FIN '98, Minneapolis, J u n e
22-25, 1998, Session O, p. 605
Onoda, M. et al., Transactions of the Institute of Metal Finishing,
76(1):41; 1998
Sarabi, R.S. and V.B. Singh, Metal FinishDTg, 96(5!:26; 1998
Sasaki, K.Y. and J.B. Talbot, Jour~zal of the Electrochemical
Society, 145(3):981; 1998
Schultz, H. and M. Pritzker, JoarlTal of the Electrochemical Society, 145(6):2033; 1998
S h a h i n et al., AESF S U R e ' I N '98, Minneapolis, J u n e 22-25,
1998, Session E, p. 153
Shannon, J.C. et al., Journal of the Electrochen~ical Society,
144! 12):L314; 1997
Stepanova, L.I. and O.G. Purovskaya, Metal Finishing, 96( 11):50;
1998
Stephen. A. et al., Transactions of the Institute of Metal FirzishDzg,
76(3):111; 1998
Uekawa, E. et al., Journal of the Electroch.emical Society, 145(2):
523; 1998

Palladium and Palladium Alloys

Yang et al. determined the effect of bath composition
on the internal stress of palladium deposits and
tbund that pulse-reverse plating improves the deposit quality. The properties of palladium alloy electrodeposits were reviewed by Holmbom et al. Okuno
and Tanabe discussed the use of palladium-nickel
deposits with a flash of gold for connector applications. An ammonia-free palladium-nickel plating
process was described by Hemsley et al. Boguslavsky et al. reported on a palladium-cobalt finish for electronic applications with improved wear
resistance over palladium-nickel. Pulsed electrodeposition was used by Bryden and Ying to produce nanostructured palladium and palladium-iron
films for hydrogen separation membranes.
Blair et al. reviewed the current status of palladium-plated lead frames for integrated circuit assemblies. The corrosion-resistance properties of palladium electrodeposited lead frames were reported
by Kim et al. Burling compared preplated palladium
lead frames to spot selective silver- and solderplated lead frames and found the former was preferred. Wirebonding to palladium-nickel lead frames
was addressed by Fan et al. Moon patented a process
for plating palladium or palladium alloys onto ironnickel lead frames.
References
Blair, A. et al., AESF SURIFIN '98, Minneapolis, J u n e 22-25,
1998, Session P, p. 661
Boguslavsky, I. et al., AESF SUR/FIN '98. Minneapolis, J u n e
22-25, 1998, Session L, p. 479
Bryden, K.J. and J.Y. Ying, Journal of the Electrochemical Society, 145(10):3339; 1998
Burling, S., Tra~zsactions of the Institute of Metal Finishipzg,
76(2):B23; 1998
Metal Finishing

Fan, C. et al., AESF SUR/FIN '98, Minneapolis, J u n e 22-25,

1998, Session P, p. 655
Hemsley, S.J. et al., AESF SUR/FIN '98, Minneapolis, J u n e
22-25, 1998, Session L, p. 47I
Holmbom, G. et al., AESF SUR/FIN '98, Minneapolis, J u n e 2 2 25, 1998, Session L, p. 491
Kim, J-D. et al., AESF SUR/FIN '98, Minneapolis, J u n e 22-25,
1998, Session P, p. 637
Moon, S-S., U.S. P a t e n t 5,750,016
Okuno, K. and Y. Tanabe, AESF/SFSJ Advanced Surface Technolog57 Forum, Kamuela, Hawaii, Oct. 8-9, 1998, p. 23
Yang, F. et al., Transactions of the Institute of Metal Finishi~g,
76(6):238; 1998

Silver
The materials characterization of a succinimidebased noncyanide bath for electrodeposition of thick
silver deposits was reported by Dini et al. The operating conditions and properties of a methane sulfonate-succinimide bath for silver deposition stabilized with boric acid and using polyethyleneimine as
brightener to produce mirror-bright silver deposits
were studied by Masaki et al. (I). Masaki et al.(lI)
also investigated the dissolution behavior of silver
anodes in succinimide-silver complex baths. A
method of manufacturing a silver-plated a l u m i n u m
connector was patented by Montmirail. Hwang et al.
disclosed a method using a capillary ion analyzer to
simultaneously analyze the cyanide, surfactant, and
phosphate components of a silver cyanide plating
bath.
References
Dini, J.W. et al., Plating and Surface Finishing, 84(12):62; 1997
Hwang, K. et al., Plating and Sur/hce Finishing, 85(10):74; 1998
Masaki, S. et al. (I), Metal Finishing, 96(1A):16; 1998
Masaki, S. et al. (II), Metal Finishing, 96(5):52; 1998
Montmirail, N. U.S. P a t e n t 5,741,407; assignor to Axon Cable
S.A.

Tin a n d Tin Alloys

Zhang obtained a patent for a sulfonate-based tin
plating process incorporating pulsed current to control grain size. A method of acid sulfate tin plating
steel strip while suppressing the generation of
sludge was the subject of a patent granted to Ilgar.
Ino et al. received a patent for a method of treating
sludge from a tin plating bath containing haloids. A
process for removing iron from tin plating electrolytes using cation permeable membranes won a
patent for Vaughan. Fister et al. garnered a patent
for a tin-coated electrical connector with a coppernickel alloy barrier layer.
A bright acid tin bath based on m e t h a n e sulfonic
acid t h a t can be reflowed was described by Zhang et
al. (I and II). Chen et al. investigated the electrodeposition of tin-lead alloys from m e t h a n e sulfonic acid electrolytes using a rotating disk electrode.
26

Developments in lead-free tin alloys, such as tinbismuth, tin-silver, and tin-zinc, for electronics applications were addressed by Hayashi and by Nawafune et al. Bokisa patented an acid electrolyte for
electroplating tin and tin-bismuth alloys. Tin-bism u t h plating bath formulations were also the subject of patents issued to Sakurai and Yuasa, to
Sakurai et al., and to Cavallotti et al. Kondo et al.
investigated bright tin-silver alloy electrodeposition
from an organic sulfonate bath containing phosphate, iodide, and triethanolamine as chelating
agents. The properties and benefits of tin-zinc plating were discussed by Budman and Stevens.

References
Bokisa, G.S.. U.S. P a t e n t 5,698,087; assignor to McGean-Rohco
Inc.

Budman, E. and D. Stevens, Tran,sactiol~s of the ll~stitute of Mcta!

Finishing, 76(3):B34; 1998
Cavallotti, P.L. et al., U.S. P a t e n t 5,783,059; assignors to IBM
Corp.
Chen, C.S. el; al., Tralzsaetions of the b~stitute of Metal Finishilzg,
76(2):55; 1998
Fister, J.C. et a l , U.S. P a t e n t 5,780,172; assignors to Olin Corp.
Hayashi, T., AESF SUR/FIN '98, Minneapolis, J u n e 22-25, 1998.
Session L, p. 499
Ilgar, E., U.S. P a t e n t 5,814,202; assignor to USX Corp.
Ino, T. et al., U.S. P a t e n t 5,766,440; assignors to Kawasaki Steel
Corp. and Nihon Parkerizing Co. Ltd.
Kondo, T. et al., Plating at~d Sur/~ce Finishing, 8D 2):51; 1998
Nawathne, H., et al., AESF/SFSJ Advanced Surface Technology
Forum, Kamuela, Hawaii, Oct. 8-9, 1998, p. 29
Sakurai, H. and S. Yuasa, U.S. P a t e n t 5,674,374; assignors to
Dipsol Chemicals Co. Ltd.
Sakurai, H. et al.. U.S. P a t e n t 5,759,381; assignors to Dipsol
Chemicals Co. Ltd.
Vaughan, D.J., U.S. P a t e n t 5,785,833
Zhang, Y., U.S. P a t e n t 5,750,017; assignor to Lucent Technologies Inc.
Zhang, Y. et al. (I), AESF SUIUFIN '98, Minneapolis, J u n e 22-25,
1998, Session L, p. 517
Zhang, Y. el; al. (II), Plating and Surfc~ce Finishing, 85(6):105;
1998

Zinc a n d Zinc Alloys

Stevenson addressed the question of which zinc plating process to select for a particular plant. The
characteristics of an alkaline t a r t r a t e zinc plating
bath were investigated by Ravindran et al. Patents
related to high current density acid zinc plating
processes were granted to Martyak and McCaskie
and to M a r t y a k and Kasper. Trejo et al. determined
the influence of zinc chloride concentration on the
nucleation and growth of zinc deposits.
Ludwig and Holland provided a practical design
for and discussed the advantages of using zinc generator tanks for alkaline cyanide-free zinc plating. A
comparison of alkaline zinc plating with potassium
or sodium salts was offered by Crotty. Reddy reMetal Finishing

ported a case study on the control of zinc plating

thickness using Taguchi's methodology. A permanent media filter for removing iron from an acid zinc
plating bath was described by Reichert et al. Wery et
al. determined the amount of hydrogen thermally
evolved from barrel zinc plated steel using a gas
~roma tographi c method_
An overview on zinc alloy plating was provided by
Budman. Roman et al. offered a study on the corrosion resistance of several multilayer zinc alloy deposits. Conductivity measurements for zinc-iron and
zinc-manganese electrolytes were reported by Guvendik et al. Bozzini et al. conducted a pilot plant
experiment for the electrodeposition of zinc-manganese alloy on steel wire. Mechanistic studies on the
electrodeposition of zinc-tellurium alloys for solar
cells were the subject of a paper by Konigstein and
Neumann-Spallart. Ivanove e t a l . investigated the
anodic behavior of eleetrodepos~ted zi~c-t~ obeys.
The influence of current density and temperature
on the corrosion resistance and morphology of zinciron allqvs dq~osited from an alkaline zincate bath
was determined by Qun. Line et al. (I and II) studied
the deposition and morphology of zinc-iron alloys
using a chloride-based electrolyte and found t h a t
ammonium chloride acts as a grain refiner. Compositionally modified alloy electrodeposits of zinc-iron
were investigated by Jensen et al., by Yongzhong et
al., and by Liao et al. (III).
Bishop et al. noted the importance of the relationship between alloy phases and chromate receptivity
in zinc-nickel alloy plating. The characterization of
hydrogen permeation through zinc-nickel alloys under corroding condgtions was investigated by g~ris'nniyer et al, Chawa et al, reported the superior corrosion resistance of compositionally modified alloy
coatings of zinc-nickel. A method of treating copper
foil for printed circuits consisting oftbrming a plated
layer of zinc-nickel-cobalt was patented by Yano and
Takami.
Carpenter and Farr determined the structure and
morphology of zinc-cobalt alloys deposited from both
acid and alkaline electrolytes. The effects of bath
composition and operating conditions on zinc-cobalt
alloys deposited from an alkaline sulfate bath contataiag triethanatamine a n d gelatin were investigated by N a r a s i m h a m u r t h y and Sheshadri. Kansupada ar,~t Waldmar~ reperteg vn a H'all eel1 s i n @ of
zinc-cobalt deposition using a potassium hydroxide
electrolyte.

References
Bishop, C.V. et al., AESF SUR/FIN'98, Minneapolis,June 22-25,
1998, Session V, p. 857
February 1999

Bozzini, B. eta]., Transactions of the Institute of Metal .~DHshing,

76(5):171 ; 1998
Budman, E.. SME Automotive Finishing '98, Detroit, J u n e 9-11,
1998
Carpenter, E.O.S. and J.P.G. Farr, Transactions of the Institute of
iVIetal Finishing, 76(4):135; 1998
Chawa, G. et M., Transactions of the Institute of Metal Finishing,
76(3):117; 1998
Crattv, 0., &gSg S U R / g ( ~ "~8, ~iv~txeagn(is, .Irma 2'L-Zd, [~@8,
Session V, p. 815
Guvendik, G. et al., AESF SUR/FIN '98, Minneapolis, J u n e 2 2 25, 1998, Session V, p. 863
Ivanova, V. etal., Transactions of the Institute of Metal Finishing,
76(6):219; 1998
Jensen, J.D. et al., Transactions" o/'the Institute of Metal Finishing, 76(51:187; 1998
Kansupada, V.J. and V. Waldman, AESF SUR/FIN '98, Minneapolis, J u n e 22-25, 1998, Session V, p. 841
Konigstein, C. a n d M. Neumann-Spallart, Journal of the EIeeO'ochemical SoeieO', 145(1 ):337; 1998
Krisbniyer~ A. e t a l , AESF SUBJF2[N '98. Minneapolis, dime
22-25, 1998, Session B, p. 69
Lia~. Y. e t a]. ~,]1, P?~eitcg ~md Ne?~v~ F&~iehiccg, 85~,3~,:~,9;19~8
Line, Y. e t a l . (IlL Plating and Surface Finishing, 85(8):62; 1998
Liao, Y. et al. (liD, Plating and Surfcwe Finishing, 85[9):88; 1998
Ludwig, R. and R. Holland, Metal Finishing, 96(6):106; 1998
..~*Z.~:ak, .N.M , a ~ d A ~ ~t~'~CaskL< JY.~q_PxV.aa~sq .TJk ~gJd~'.ass~gnors to Ateteeh USA Inc.
Martyak, N.M. and M.M. Kasper, U.S. P a t e n t 5,788,822; assignors to Elf Atochem North America Inc,
Na*'as'kxxix'amv~{Vd, ~'. a'ad g.N. Glxe~av{,,i, i~fe~'flf Ft'nLs~'ff~,g,
96(4):24; 1998
Qun, Z.L., Metal Finishing, 96(11):54; 1998
Ravindran, V. et al., Metal Finishing, 96(10):10; 1998
Reddy, P.B.S., Metal Finishing, 96(10):24; 1998
Reichert, C.R. et al., AESF SUtUFIN '98, Minneapolis, J u n e
22-25, 1998, Session N, p. 589
Roman, L. et al., AESF/SFSJ Advanced Surface Technology Farina, Kamuela, Hawaii, Oct. 8-9, ]998, p. 33
Stevenson, M., Products Finishing, 62(6):72; 1998
'.P.r~ieO., .G. ,2t A~J..,.J..gJJ.*:o~]/.hi")Jd.~~~f.*).~'<of:].'l)2~)J~~f~qgwJ.~zt~'. J ~.12 ):
4090; 1998
Wery, M. et al., Plating end Sur/hee Finishing, 85(8):57; 1998
Yarm, M. a n d M. Takami. U.S. Patent 5,700,362; assignors to
F u k u d a Metal Foil and Powder Co. Ltd.
~ongflmng; L. et a~., ~ = ~ SDY~;,'~2~ 'Yd, ~ i n n e a p o ) i s , anne
22-25, 1998. Session V. p. 829

Other Metals and Alloys

The structure and properties of cobalt deposited by
ludsky. Celts et al. addressed the future for electrom~D~li*: ma**riM,s i~ mi~roe]eetronics as coming
from compositionally modified deposits such as cok,~-p~G~,
~*~-~k~-~%~:~,
~-~D~lt,
silver-copper, copper-nickel, and nickel-phosphorustin. The magnetoresistance effec~ in cobalt-silver
and cobalt-copper alloys prepared by electrodeposition was investigated by Zaman et al. Eskin et al.
proposed cobalt-tungsten alloys as replacements for
conventional hard chromium plating.
Hn and Xu deposited iron from a chloride bath
27

using initial AC deposition to prevent anodic etching

in the restoration of worn components. The effect of
AC superimposed on DC on the electroplating of
iron-cobalt alloys was investigated by Abd E1 Rehim
and Ibrahim. Troup-Packman patented a method for
plating iron-cobalt alloy onto a l u m i n u m alloy parts.
The electrodeposition of iron-cobalt-tungsten alloys
for fuel cells was reported by Ramesh et al.
The role of phosphate and hypophosphate in the
electrodeposition of platinum from P-salt electrolytes was determined by Hadian and Gabe. Saremi
et al. compared the hot corrosion behavior of electroplated and electron beam physical vapor deposited coatings of platinum-aluminum on nickel-based
superalloys and preferred the latter. A low-cost
method for fabricating thallium-bismuth-bariumcalcium-copper-silver oxide superconducting materials using electrodeposited precursors was described
by B h a t t a c h a r y a et al.
References
Abd E1 Rehim, S.S. and M.A.M. Ihrahim, Metal Finishing, 96( 11 ):
65; 1998
Bhattacharya, R.N. et al., Electrochemical and Solid-State Letters, 1(4):16,5; 1998
Celis, J-P. et al., Transactions of the Institute of Metal Fi~ffshing,
76(5):163; 1998
Eskin, S. et al., Plating and Surface Finishing, 85(4):79; 1998
Hadian, S.E. and D.R. Gabe, Transactions o/'the Institute o/'Metal
Finishing, 76t6):227; 1998
Hu, X. and X. Xu, Plating and Surfoce Finishing, 85(3):71; 1998
Ramesh, L. et al., Transactions of the Institute of Metal Finishing,
76(3~:101; 1998
Saremi, M. et al., AESF SUR/FIN '98, Minneapolis, J u n e 22-25,
1998, Session O, p. 601
Shtapenko, E.F. and V.A. Zabludsky, Transactions of the Institute
of Metal Finishing, 76(3):105; 1998
Troup-PaeMnan, S., U.S. P a t e n t 5,810,992; assignor to Hughes
Electronics Corp.
Zaman, H. et al., Journa[ of the Electrochemical Society, 145(2):
565; 1998

PHYSICAL V A P O R DEPOSITION ( V A C U U M COATING)

Progress in vacuum metallizing over the last 50

years was reported by Grtinwald et al. Tanner et al.
patented a process for gold plating of zinc substrates
by vacuum metallization. The use of physical vapor
deposition (PVD) as an alternative to cadmimn electroplating was discussed by S u n t h a k a r and Joshi.
Katsamberis et al. investigated a hollow cathode
activated deposition process to produce highly durable coatings for automotive polycarbonate glazing.
A base layer suitable for production of a "polished
brass" type of finish was described by Lee and Liu.
Moysan and Sugg (I, II, and III) received several
patents related to multilayer coatings to simulate
brass finishes. PVD coatings, such as TiA1CN,
TiCrN, and CrCN, for drills and tools for dry cutting
28

a l u m i n u m alloys and bronze were described by

Fleischer et al. (I). Li et al. (I) addressed low temperature deposition of ihnctional silicon dioxide bartier coatings on metal substrates. A process for insitu deposition of a Ti/TiN/Ti aluminum underlayer
garnered a patent for Besser and Tran.
Garside and Housden suggested lower cost electron beam evaporants to expand the applications for
PVD alternative coatings. A coating chamber and
substrate carrier for vacuum evaporation was patented by Dubs. Achtner and Klemm obtained a
patent for an evaporator boat. An apparatus for
vacuum metallizing compact disks won a patent for
LeBlanc et al. Li et al. (II) received a patent for a
deposition chamber capable of providing improved
thickness uniformity. A coating chamber planetary
gear mirror rotating system was patented by Born
and O'Connell.
Horsfall discussed a modified arc technology for
deposition of carbon films for production of cutting
tools and wear components. A method for ion plating
of t i t a n i u m oxide was patented by Knapp and
LeBlanc. Hanaguri et al. obtained a patent for an
arc ion plating apparatus. Vacuum arc deposition
devices garnered patents for Tamagaki et al. and for
Braendle and Kind. Dam and VanLanen received a
patent for a process tbr reducing particle defects in
arc vapor deposition coatings.
Fleischer et al. (II) described a series of decorative
PVD hardcoatings in a wide color range t h a t can be
formed on different substrate materials. A method of
coating multilayer TiA1N coatings was patented by
Kawata. Darning et al. studied the morphologies of
diamond-containing carbon thin films prepared by
magnetron sputtering. High-performance metalcontaining diamondlike coatings for precision con>
ponents were discussed by Bewilogua et al. Cermignani et al. investigated the processing, properties,
and performance of high-volume, sputter-deposited
boron-carbon coatings. The corrosion resistance of
niobium coatings on stainless steel grown by combined steered arc/unbalanced magnetron deposition
was determined by Paritong et al.
A method and apparatus for sputter depositing a
layer of metallic material on printed circuit boards
was patented by Statnikov et al. Hofmann et al.
described a short-cycle in-line machine for decorative hard coating of large volume production parts.
An apparatus for high-throughput sputtering won a
patent for Hollars et al. Haag obtained a patent for
a sputter coating station. Multichamber sputtering
devices were the subject of patents granted to Kamei
et al. and to Yoshida. Hollars and Zubeck received a
patent for a cylindrical carriage sputtering system.
Metal Finishing

Rotating cylindrical magnetron sputtering equipment won patents for Dickey and Bjornard and for
Lehan et al. Scherer (I and [Ij garnered a pair of
patents for hollow target sputtering devices. Sputtering devices were also the subject of patents
awarded to Demaray et al. (I), to Bfihr et al., to
Szczyrbowski et al., to Hershcovitch et al., to Daxinger and Haag, to Okubo et a'l., to Yamada and
Shinmura, to Obinata, to Patterson et al., to Kiyota,
to Lantsman and Licata, and to Szczyrbowski and
Teschner. Park and See obtained a patent for a
vacuum pumping system for a sputtering device.
Lo and Draper patented a method for fabricating
aluminum alloy sputtering targets. A chromium
sputtering target garnered a patent for Murata and
Taniguchi (I). Shindo and Suzuki obtained a patent
for a high-purity cobalt sputtering target. Cobalt
alloy sputtering targets won a patent for Schlott et
al. Kardokus devised a method of making highpurity copper sputtering targets. Titanium sputtering targets were the subject of patents awarded to
Sawada et al., to Murata and Taniguchi (II), and to
Masuda et al.
Satou et al. obtained a patent for a sputtering
target formed of refractory metallic silicide. Sputtering targets were also the subject of patents granted
to Hunt and Gilman, to Emigh and Willett, to

Born T.I). and I). O'Connell, U.S. P a t e n t 5,776,256; assignors

U.S.A. as represented by the Secretary of the Air Force
graend~e. H and 13. Kind, U.S. P a t e n t 5,799,784; assignors to
Balzers AG
Ceccaigaani, W. e~ aL, 4 [~ Ana~xa~ SVC Technical C~afere~ce,
Boston, April 18-23, 1998, p. 66
Dam. C.Q. and L.M. VanLanen, U.S. P a t e n t 5,738; assignors to
Caterpillar Inc.
Darning, Z. e~ al.~ 41s~ Annual SVC Technical Conference. Best.on,
April 18-23, 1998, p. 89
Daxinger, H. and W. Hang, U.S. Patent 5,733,419; assignors to
Balzers AG
Demaray, R.E. et hi. {I), U.S. P a t e n t 5,676,803
Demaray, R.E. et al. (II}, U.S. P a t e n t 5,799,860; assignors to
Applied Materials Inc.
Dickey, E.R. and E.J. Bjornard, U.S. Patent 5,725,746; assignors
to Viratec Thin Films Inc.
Dubs, M., U S . P a t e n t 5,738,729; assignor to Balzers AG
Emigh, R.A. and W.B. Wi/lett, U.S. P a t e n t 5,687,600: assignors
Johnson Matthey Electronics Inc.

et al., to Morita, and to Demaray et al. (II). Schwendener patented an arrangement for mounting and
dismounting a sputtering target or arc evaporation
source. A method and apparatus t~or cleaning a target source during material deposition won a patent
for Tepman.
sp,atteriag eathexle with u,aifer~Aty ee~apep,sation was patented by Hurwitt. Szczyrbowski and
Marquardt patented a cathode assembly. A sputtering cathode Mso won a patent for Bernick. Sleek
devised an anode structure for magnetron sputtering systems. An overview of current practices tbr
evaluation of decorative PVD finishes was provided
by van der Kolk et al. Meredith et al. obtained a
patent for a system for evaluating the reflectance of
thin film coatings.

Boston, April 18-23, 1998, p. 55

Hollars, D.R. and R.B. Zubeck, U.S. P a t e n t 5,753,092; assignors
to Velocidata Inc.

References
Achtner, W. and G. Klemm, U.S. Patent 5,788,769;
Balzers und Leybold Deutschland Holding AG
Bfihr et al., U.S. Patent 5,688,388; assignors to
Leybold Deutschland Holding AG
Bernick, M.A., U.S. Patent 5,736,019
Lae~:~,er, P.B. and K.Q. T r ~ , LT,S. P.~t~.~t5,72,8,917;
Advanced Micro Devices Inc.
Bewilogua, K. et al., 41st Annual SVC Technical
Boston, April 18-23, 1998, p. 75
30

assignors to
Balzers und

~.~sJg.~4,r.., t,o
Conference,

Boston. April 18-23, 1998, p. 80

Fleischer, W. et al. ~II1, 41st Annual SVC Technical C<mference,
Boston, April 18-23, 1998, p. 33
Garside, B. and J. Housden, 41st SVC Annual Technical Conference, Boston, April 18 23, 1998, p. 38
Boston, April 18-23, 1998, p. 98
Haag, W., U.S. P a t e n t 5,75:3,089; assignor to Balzers AG
Hanaguri, K. et ah, U.S. Patent 5,730,847; assignors to KK
Kobeseikosho
Hershcovitch, A.I. et ah, U.S. P a t e n t 5,733,418; assignors to PLD
Advanced Automation Systems Inc.

Peripherals Inc.
Horsfalh R . H , 41st Annual SVC Technical Conference, Boston,
April 18-23, 1998, p. 60
Hunt~ T. and RS. Gilman~ U.S. Pntent 5,674,367: assignors Sony
Corp. and Materials Research Corp.
Hurwiet, S.~ U.S. P a t e n t 5,783,048; assigltor to Tokyo Electron
Ltd.
Kamei, M. et hi., U.S. P a t e m 5,783,055; assignors to Hitachi Ltd.
Kardokus, J.K., U.S. P a t e n t 5,803,342; assignor to Johnson Matthey Electronics Inc.
Katsamberis, D. et al.. Progress in Organic Coating& 34( 1-4):130;
1998
Kawata. K., U.S. P a t e n t 5,679,448; assignor to Oriental Engineering Co. Ltd.
Kiyota, T., U.S. P a t e n t 5,770,025; assignor to Nihon Shinku
Oijutsu KK
Knapp, J. and L.A. LeBlanc, U.S. P a t e n t 5,753,319; assignors to
Corion Corp.
Lantsman, A.I). and T.J. Licata, U.S. P a t e n t 5,800,688; assignors
to Tokyo Electron Ltd.
LeBlanc, AR. et hi., U.S. P a t e n t 5,709,785; assignors to First
Light Technology Inc.
Lee, B...~d Y. L4~, 41at Ao~'~a) SVC Toet4~ieol~ Co~fere~g:e,
Boston, April 18-23, 1998, p. 51
Lehan, J. et al., U.S. P a t e n t 5,814,195; assignors to BOC Group
Inc.
Metal Finishing

Li, F. et al. (I), 41st A n n u a l SVC Technical Conference, Boston,

April 18-23, 1998, p. 94
Li, S. et al. (II), U.S. P a t e n t 5,772,771; assignors to Applied
Materials Inc.
Lo, C-F. and D. Draper, U.S. P a t e n t 5,766,380; assignors to Sony
Corp.
Masuda, K. et al., U.S. P a t e n t 5,807,443; assignors to Hitachi
Metals Ltd.
Meredith, W.A. et al., U.S. P a t e n t 5,772,861; assignors to Viratec
Thin Films Inc.
Morita, K., U.S. P a t e n t 5,798,029; assignor to Applied Materials
Inc.
Moysan, S.R. and R.W. Sugg (I), U.S. P a t e n t 5,693,427; assignors
to Baldwin Hardware Corp.
Moysan, S.R. and R.W. Sugg (IIl, U.S. P a t e n t 5,716,721; assignors to Baldwin Hardware Corp.
Moysan, S.R. and R.W. Sugg (III), II.S. P a t e n t 5,814,415; assignors to Baldwin Hardware Corp.
Murata, H. and S. Taniguchi (Ii, U.S. P a t e n t 5,718,778; assignors
to Hitachi Metals Ltd.
Murata, H. and S. Taniguehi (II), U.S. P a t e n t 5,798,005; assignors to Hitachi Metals Ltd.
Obinata, H., U.S. P a t e n t 5,753,090; assignor to Nihon Shinku
Gijutsu KK
Ohhashi, T. et al., assignors to J a p a n Energy Corp.
Okubo, M. et al., U.S. P a t e n t 5,744,011; assignors to KK Toshiba
Paritong, H. et al., Transactions of the Institute of Metal Finis/;ing, 76(4):144; 1998
Park, J-H. and K-K. Seo, U.S. P a t e n t 5,788,825; assignors to
Samsung Electronics Co. Ltd.
Patterson, J.A. et al., U.S. P a t e n t 5,755,937
Sanchez, L.E. and A.J. McDonald, U.S. P a t e n t 5,709,783; assignors to McDonnell Douglas Corp.
Satou, M. et al., U.S. P a t e n t 5,733,427; assignors to KK Toshiba
Sawada, S. et al., U.S. P a t e n t 5,772,860; assignors to J a p a n
Energy Corp.
Scherer, M. (I), U.S. P a t e n t 5,716,505; assignor to Balzers Prozess Systeme GmbH
Scherer, M. (II), U.S. P a t e n t 5,728,280; assignor to Balzers Prozess Systeme GmbH
Schlott. M. et al., U.S. P a t e n t 5,728,279; assignors to Leybold
Materials GmbH
Schwendener, U., U.S. P a t e n t 5,676,810; assignor to Balzers AG
Shindo, Y. and T. Suzuki, U.S. Patent 5,810,983; assignors to
J a p a n Energy Corp.
Sieck, P.A. et al., U.S. P a t e n t 5,683,558; assignors to BOC Group
Inc.
Statnikov, B.S. et al., U.S. P a t e n t 5,741,405; assignors to [PMMS
Strauss, D.P. et al., U.S. P a t e n t 5,738,770; assignors to Sony
Corp. and Materials Research Corp.
S u n t h a k a r , M.B. and S.D. Joshi, Transactions of the Institute of
Metal Finishing, 76(5):B71; 1998
Szczyrbowski, J. and D. Marquardt, U.S. P a t e n t 5,683,560; assignors to Balzers und Leybold Deutschland Holding AG
Szczyrbowski, J. and G. Teschner, U.S. P a t e n t 5,807,470; assignors to Balzers und Leybold Deutechland Holding AG
Szczyrbowski, J. et al., U.S. P a t e n t 5,718,815; assignors to Balzers und Leybold Deutschland Holding AG
Tamagaki, H. et al.. U.S. P a t e n t 5,744,017; assignors to KK Kobe
Seiko Sho
Tanner, J.W. et al., U.S. P a t e n t 5,683,756; assignors to Batesville
Casket Co. Inc.
Tepman, A., U.S, P a t e n t 5,772,858; assignor to Applied Materials
inc.
February 1999

v a n der Kolk, G.J. et al., 41st Annual SVC Technical Conference,

Boston, April 18-23, 1998, p. 44
Yamada, Y. and T. Shinmura, U.S. P a t e n t 5,744,016; assignors to
NEC Corp.
Yoshida, Y., U.S. P a t e n t 5,738,771; assignor to Canon KK
M E T A L L I Z A T I O N OF N O N C O N D U C T O R S A N D
ELECTROLESS PLATING

Sun et al. investigated the formation of catalytic

palladium on zinc oxide thin films for electroless
deposition. Activating catalytic solutions for electroless plating were the subject of a pair of patents
granted to Kanoh and Senda and to Kanoh et al.
Cane obtained a patent for a sensitizing solution for
metallizing a surface. A process for chemical reduction plating utilizing a spray technique was described by Karam and Stremsdoerfer (I).
A method for metallization of nonconductive substrates comprising applying a dispersion of copper
oxide, a solvent, and a binder won a patent for
Negrerie et al. Bressel et al. received a patent for a
metallization process utilizing deposition of an adherent, insoluble polymer from an aqueous solution.
A similar process using a solvent-based copolymer
garnered a patent for Dannenberg. Metallization
processes based on contact with carbon dispersions
were the subject of patents awarded to Kukanskis et
al., to Florio et al., to Thorn et al., to Ferrier et al., to
Sakamoto et al., and to Uemiya et al.
Desprez et al. used a perturbation analysis to
estimate the speed of coverage by metallizing polymers on surfaces composed of a combination of
highly conductive and highly resistive regions.
Methods for metallizing patterned substrates garnered patents for Svendsen et al., for Roh, for Legierse et al., and for Bhatt et al.
A method for the metallization of ceramics
through application of an adherent reducible layer
was patented by Jin et al. Farooq et al. obtained a
patent for a method of selectively depositing a metallic layer on a ceramic substrate. A metallized
ceramic substrate having a smooth plating layer
won a patent for Shimoda and Nakata.
Snyder described a direct metallization system
for decorative plating on plastic. A process for treating aramid surfaces to be plated was patented by
Burch and Hsu. Karam and Stremsdoerfer (II) investigated the activation of PTFE and fine graphite
particles prior to electroless plating. A method for
metallizing fluoropolymer substrates won a patent
for Vargo et al. Yang et al. were granted a patent for
a process of directly plating onto plastics utilizing
hydrocarbon or polymer treatments to enhance catalyst adsorption. Metallization of difficult-to-plate
plastics was addressed by Steppan and McClure,
31

who selected a plasma oxidation process as a pretreatment. The preparation of cyanate ester polymers and composites for metal plating won a patent
for Van Ast.
A selectively metallized plastic hold-down connector was the subject of a patent granted to Mitra and
Becker. Haslow et al. patented a method for selectively plating an organic substrate. A molded resin
composition suitable for plating consisting of polyether imide and polyphenylene ether was formulated by Mizoguchi and Iwafune. Goenka et al. patented a process for obtaining enhanced plating
adhesion through the use of metallized fillers in the
plastic substrate.
References
Bhatt, A.C. et al., U.S. P a t e n t 5,707,893; assignors to IBM Corp.
Bressel, B. et al., U.S. P a t e n t 5,693,209; assignors to Atotech
Deutschland GmbH
Burch, R.R. and C.H. Hsu, U.S. P a t e n t 5,773,089; assignors to
E.I. du Pont de Nemours and Co.
Cane, F.N., U.S. P a t e n t 5,770,032; assignor to Fidelity Chemical
Products Corp.
Dannenberg, R., U.S. P a t e n t 5,747,117; assignor to Servo Corp. of
America
Desprez, P. et al., Journal of the Electrochemical Society, I45(11:
165; 1998
Farooq, S. et al., U.S. P a t e n t 5,787,578; assignors to IBM Corp.
Ferrier, D. et al., U.S. P a t e n t 5,759,378; assignors to MacDermid
Inc.
Florio, S.M. et al., U.S. P a t e n t 5,683,565; assignors to Shipley Co.
LLC
Goenka, L.N. et al., U.S. P a t e n t 5,702,584; assignors to Ford
Motor Co.
Haslow, R.E. et al., U.S. P a t e n t 5,779,921; assignors to W.L. Gore
& Associates
Jin, S. et al., U.S. P a t e n t 5,725,938; assignors to Lucent Technol-

ogles Inc.
Kanoh, O. and A. Senda, U.S. P a t e n t 5,810,913; assignors to
Murata Mfg. Co. Ltd.
Kanoh, O. et al., U.S. P a t e n t 5,746,809; assignors to M u r a t a Mfg.
Co. Ltd.
Karam, A.F. and G. Stremsdoerfer (I), Platit~g and Sut'/'clce Finiski~zg, 85(1):88; 1998
Karam, A.F. and G. Stremsdoerfer (II), Transactions of the Itzstitute of MetaI Fi*~ishing, 76(2):69; 1998
Kukanskis, P. et al., U.S. P a t e n t 5,674,372; assignors to MacDermid Inc.
Legierse, P.E.J. et al., U.S. P a t e n t 5,798,138; assignors to U.S.
Philips Corp.
Mitra, N. and R. Bekker, U.S. P a t e n t 5,713,762; assignors to Berg
Technology Inc.
Mizoguchi, T. and M. Iwafune, U.S. P a t e n t 5,773,536; assignors
to Cosmo Research Institute and Cosmo Oil Co. Ltd.
Neg-cerie, M. et al., U.S. P a t e n t 5,674,373; assignors to Trefimetaux
Roh, J-W., U.S. P a t e n t 5,776,663; assignor to Daewoo Electronics
Co. Ltd.
Sakamoto, Y. et al., U.S. P a t e n t 5,788,830; assignors to MEC Co.
Ltd.
Shimoda, K. and H. Nakata, U.S. Patent 5,679,469; assignors to
Sumitomo Electric Industries Ltd.
February 1999

Snyder, D., AESF SUR/FIN '98, Minneapolis, June 22-25, 1998,

Session U, p. 807
Steppan, J.J. and B. McClure, AESF SURfFIN '98, Minneapolis,
J u n e 22-25, 1998, Session H, p. 375
Sun, R.D. et al.. Journal of the Electrochemical S~ciety, 145( 10):
3378; 1998
Svendsen, L.G. et al., U.S. P a t e n t 5,681,441; assignors to Elf
Technologies Inc.
Thorn, C.E. et al., U.S. P a t e n t 5,690.805; assignors to Electrochemicals Inc.
Uemiya, T. et al., U.S. P a t e n t 5,798,033; assignors to Sumitomo
Electric Industries Ltd., Sumitomo Electric Industries Toyama
Co. Ltd., and Nippon Graphite Industries Ltd.
Van Ast, C.I., U.S. P a t e n t 5.739,268; assignor to Hughes Aircraft
Vargo, T.G. et al., U.S. P a t e n t 5,696,207; assignors to Geo-Centers Inc.
Yang, C-H. et al., U.S. P a t e n t 5,762,777; assignors to Persee
Chemical Co. Ltd.

Copper
The electroless copper plating of small via holes was
addressed by Abe et al. Lee and Huang patented a
method for electroless copper plating of integrated
circuit structures. A method for selective electroless
copper plating of interconnect plugs won a patent for
Zhao et al. Duda investigated the effect of isomeric
dipyridyls on electroless copper deposition from
EDTA solutions. A concentrate for the electroless
deposition of copper coatings on iron and iron alloy
surfaces garnered a patent for Nittel and Nuss.
Yoshiki et al. studied the adhesion mechanism of
electroless copper formed on ceramics without etching using zinc oxide as an intermediate. The electroless copper plating of PZT ceramics was investigated
by Fujinami and Honma. Nawafune et al. (I) used
sulfonation and permanganate roughening to electroless copper plate thermosetting polyphenylene
ether resin laminates. The preparation and electrical resistance characteristics of electroless coppernickel-phosphorus and electroless copper-nickel alloy deposits were reported by Nawafune et al. (II).
References
Abe, S. et al., Trclnsactior~s of the Institute of Metal Finishil~g,
76( 1 ): 12:1998
Duda, L.L., Plating a~zd Sur/bce Finishil~g, 85(7):60; 1998
Fujinami, T. and H. Homna, Plating and S~lrface Fitzishing,
85t5):100:1998
Lee, C-Y. and T-H. Huang, U.S. P a t e n t 5.801,100; assignors to
Industrial Technology Research Institute
Nawafune, H. et al. (I), PlctH,zg and S,r[bce Finishir~g, 85(7):52;
1998
Nawafune, H. et al. (II), Tra~zsactiolzs of the h~stitute of Metal
Filzishilzg, 76(6):231; 1998
Nittel, K - D and K-H. Nuss, U.S. P a t e n t 5,776,2311; assignors to
Metallgesellschaft AG
Yoshiki. H. et al., Journal of the Electrochemical Soeiety, 145(5):
1430; 1998
Zhao, B. et al., U.S. P a t e n t 5,674,787; assignors to Sematech Inc.
33

Gold
T e c h n i q u e s including electroless gold plating for solder ball m o u n t i n g a n d finishing of ball grid a r r a y s
w e r e discussed by H a s h i m o t o . Yoshiki et al. investigated the p r e p a r a t i o n of electroless gold with high
adhesive s t r e n g t h to a l u m i n a u s i n g a t i t a n i u m dioxide-zinc oxide composite film w i t h o u t etching. A
m e t h o d for electroless gold p l a t i n g f e a t u r i n g air injection won a p a t e n t for Sone and Wachi. M u r a k a m i
et al. o b t a i n e d a p a t e n t for an electroless gold b a t h
comprised of gold sulfite, a complexing a g e n t selected from alkali m e t a l and a m m o n i u m salts of
sulfite, EDTA, polyvinyl pyrrolidone, and a r e d u c i n g
a g e n t consisting of ascorbic acid or its salts. A
m e t h o d for r e p l e n i s h m e n t of gold in an electroless
gold b a t h was p a t e n t e d by C h e n g and Shields.
References
Cheng, T-J. and D.B. Shields, U.S. Patent 5,728,433; assignors to
Engelhard Corp.
Hashimoto, S., AESF/SFSJ Advanced Surface Technology Forum,
Kamuela, Hawaii, Oct. 8-9, 1998, p. 89
Murakami, T. et al., U.S. Patent 5,803,957; assignors to C.
Uyemura & Co. Ltd.
Sone, T. and H. Wachi, U.S. Patent 5,691,003; assignors to Electroplating Engineers of Japan Ltd.
Yoshiki, H. et al., Electrochemical and Solid-State Letters, 1(4):
162; 1998
Nickel
B r e n n e r and Riddell's article "Nickel P l a t i n g on
Steel by Chemical Reduction" from 1946 was rep r i n t e d c o m m e m o r a t i n g the discovery of electroless
nickel p l a t i n g on the occasion of B r e n n e r ' s 90th
b i r t h d a y . F e l d s t e i n (III) discussed a novel a p p r o a c h
to the e l i m i n a t i o n of pitting in electroless nickel
plating t h r o u g h i n c o r p o r a t i o n of specific insoluble
p a r t i c u l a t e m a t t e r in the p l a t i n g bath. This m a t e r i a l
does not codeposit b u t will provide a leveling effect.
A review of electroless nickel p r o p e r t i e s and applications was provided by Bates. B a u d r a n d and
D u r k i n reviewed a u t o m o t i v e applications for electroless nickel. Electroless p l a t i n g technology tbr
electronics p a c k a g i n g was discussed by H o n m a and
W a t a n a b e . S h a r m a et al. i n v e s t i g a t e d electroless
nickel p l a t i n g onto m a g n e s i u m alloys for a e r o s p a c e
applications. T h e i m p o r t a n c e of s u b s t r a t e condition
in controlling the porosity of electroless nickel was
n o t e d by Reade et al.
A t r a n s m i s s i o n electron microscopic i n v e s t i g a t i o n
of electroless nickel on p u r e iron was conducted by
Yiyong et al. T r a c y et al. i n v e s t i g a t e d the use of
electroless nickel coatings on stainless steel tbr prev e n t i o n of stress-corrosion cracking. A c o m p a r a t i v e
s t u d y of crystallization kinetics a n d corrosion perf o r m a n c e of a m o r p h o u s electroless nickel-phospho34

rus alloys was r e p o r t e d by M e h t a et al. O s a k a et al.

d e t e r m i n e d s t r u c t u r a l changes due to h e a t t r e a t m e n t in high resistivity electroless nickel-phosphor u s - c a r b o n deposits.
T h e role of electroless p l a t i n g b a t h c o n s t i t u e n t s in
the catalytic oxidation of the h y p o p h o s p h i t e ion was
i n v e s t i g a t e d by Dirjal. H o r i k a w a described a longlife electroless nickel b a t h composed of nickel hypophosphite. An activation b a t h for electroless
nickel plating was p a t e n t e d by Tung. Itoh et al.
o b t a i n e d a p a t e n t for an electroless plating b a t h
f o r m u l a t i o n for forming black coatings.
D u r k i n provided a n overview on control of electroless nickel plating baths. Electroless nickel controls for t h r o u g h - h o l e p l a t i n g w e r e discussed by
Walsh et al. S m i t h and W a s s e r m a n (I and II) and
W a s s e r m a n and S m i t h described a r e a l - t i m e r a t e
m o n i t o r tbr control of electroless nickel plating. A
rapid electrochemical test for porosity in electroless
nickel coatings was the subject of a p a p e r by N a h l e
et al.
The c u r r e n t s t a t u s of composite electroless nickel
coatings was a d d r e s s e d by F e l d s t e i n (II), who also
r e p o r t e d on composite electroless nickel coatings for
the a e r o s p a c e a n d airline i n d u s t r y (I and IV). Shoeib
et al. i n v e s t i g a t e d the m e c h a n i c a l and corrosion
protection p r o p e r t i e s of electroless nickel-polymer
composite coatings c o n t a i n i n g polyvinyl alcohol,
pol:ywinyl chloride, or polyacrylamide. The influence
of s u r f a c t a n t s on the p r o p e r t i e s of an electroless
nickel coating with d i s p e r s e d high m o l e c u l a r w e i g h t
particles of p o l y e t h y l e n e was d e t e r m i n e d by Dob r e v a et al. Grosjean et al. discussed a m a t h e m a t i c a l
model for incorporation of silicon carbide particles in
an electroless nickel deposit. The s t r u c t u r e and
p r o p e r t i e s of electroless n i c k e l - p h o s p h o r u s - b o r o n
carbide w e r e r e p o r t e d by Ge et al.
References
Bates, J., Phltitzg arzd Su'/bec Finishb~g, 85(5):14; 1998
Baudrand, D. and B. Durkim Metal FiniskDzg. 96t5):20; 1998
Brenner, A. and G.E. Riddell, PlatD~g and Surface Fir~ishing,
85t 8):54; 1998
Dirjal, N.K., Platbzg alzd Slit/hoe Finishing, 85(4):74; 1998
Dobrewt, E, et al., AESF SUtUFIN '98. Minneapolis, June 22-25,
1998, Session 41st Annual Technical Conference, Boston, April
18-23, 1998, p. 281
Durkin, B., Prodlzcts Finishb~g, 63(1):55; 1998
Feldstein, M.D. (I), AESF Aerospace/Airline Plating and Metal
Finishing Forum, San Antonio, Texas, March 24-26, 1998, p.
69
Feldstein, M.D. (II), AESF SUPJFIN '98, Minneapolis, June 2225, 1998, Sessi~m F, p. 2'33
Feldstein, M.D. (III), AESF SUR/FIN '98, Minneapolis, June
22-25, 1998, Session F, p. 253
Feldstein, M.D. (IV), PlatD*g and Sur/ace FinishDlg, 85( 11):248:
1998
Metal Finishing

Ge, J-P. et al., Plating and Surface Finishing, 85(10):69; 1998

Grosjean, A. et al., Metal Finishil~g, 96(4):14; 1998
Honma, H. and H. Watanabe, AESF/SFSJ Advanced Surface
Technology Forum, Kamuela, Hawaii, Oct. 8-9, 1998, p. 73
Horikawa, K., AESF/SFSJ Advanced Surface Technology Forum,
Kamuela, Hawaii, Oct. 8-9, 1998, p. 55
Itoh, H. et al., U.S. P a t e n t 5,718,745; assignors to Japan Kanigen
Co. Ltd.
Mehta, S. et al., AESF SUR/FIN '98, Minneapolis, June 22-25,
1998, Session F, p. 271
Nahle, A.H. et al., Transactions of the Institute of Metal Finishi~g, 76(1):29; 1998
Osaka, T. et al., Journal of the Electrochemical Society, 145(7):
2419; 1998
Reade, G.W. et al., Transactions of the Institute of Metal Finishing, 76(4):176; 1998
Sharma, A.K. et al., Metal Finishing, 96(96(3):10; 1998
Shoeib, M.A. et al., Metal Finishing, 96(11):58; 1998
Smith, R. and A. Wasserman (I), 19th AESF/EPA Pollution Prevention and Control Conference, Lake Buena Vista, Fla., Jan.
26-28, 1998, p. 215
Smith, R. and A. W a s s e r m a n (II), AESF Aerospace/Airline Plating and Metal Finishing Forum, San Antonio, Texas, March
24-26, 1998, p.159
Tracy, R. et al., AESF SURIFIN '98, Minneapolis, June 22--25,
1998, Session F, p. 241
Tung, W., U.S. P a t e n t 5,753,304; assignor to Metal Arts Co. Inc.
Walsh, M. et al., AESF SUR/FIN '98, Minneapolis, June 22-25,
1998, Session A, p. 27
Wasserman, A. and R. Smith, AESF SUPJFIN '98, Minneapolis,
,June 22-25, 1998, Session F, p. 261
Yiyong, W. et al., Transactions of the Institute of Metal Finishing,
76(3):108; 1998

Other Metals and Alloys

Haran et al. investigated the use of electroless cobait-phosphorus coatings for microencapsulation of
hydrogen storage devices. The aging effects of electroless cobalt baths on the microstructure and magnetic properties of cobalt-phosphorus films were
studied by Kalu, who found that heating to 80 to
90C would decompose a cobalt complex and extend
bath life. Gradient control of magnetic properties in
electroless cobalt-nickel-phosphorus alloy films was
found possible by Homma et al. through control of
substrate rotational speed.
The development of electroless iron-phosphorus
films for use in soft magnetic devices was reported
by Matsuda et al. An electroless palladium plating
system for electronics applications was described by
Stacy et al. Djokic investigated a process for the
electroless deposition of silver onto copper particles.
An electroless silver bath for fbrming a wiring on a
.semiconductor device won a patent for Endo et al.
Sullivan and Kohl studied the electro-oxidation of
ascorbic acid in a citrate buffer to evaluate possible
application as a reductant in electroless plating. A
method for producing a metal-plated carbon material using an electroless plating solution garnered a
patent for Katsumata et al. Pourrezaei et al. ob36

tained a patent for a method of metallizing a medical

device incorporating an electroless plating step. An
eleetroless plating solution utilizing ethylene diamine disuccinic acid as a chelating agent was the
subject of a patent granted to MacMillan.
A method for selective electroless codeposition of
cylindrically shaped objects was patented by Feldstein. Feldstein and Feldstein received a patent for
eleetroless composite plating with a gradient of codeposited particles, Research on electroless composite
coatings of various metals with PTFE was reported
by Tang et al. (I and II).
References
Djokic, S., AESF SUR/FIN '98, Minneapolis, June 22-25, 1998,
Session F, p. 225
Endo, M. et al., U.S. P a t e n t 5,795,828; assignors to Matsushita
Electric Industrial Co. Ltd.
Feldstein, N., U.S. P a t e n t 5,674,631; assignor to Surface TechnologLy Inc.
Feldstein, N. and M.D. Feldstein, U.S. Patent 5,707,725; assignors to Surface Technology Inc.
Haran, B.S. et al., Journal of the Electrochemical Society. 145(9i:
3000; 1998
Homma, T. et al., JourlTal of the Electrochemical Society, 145( 1 ):
134; 1998
Kalu, E.E., Plating and Surface Firtishing, 85(3):74; 1998
Katsumata, M. et al., U.S. P a t e n t 5,677,009; assignors to Yazaki
Corp.
MacMillan, J.A., U.S. P a t e n t 5,738,914; assignor to Associated
Octel Co. Ltd.
Matsuda, It. et al., Transactions of the Institute of Metal Fi~zishitzg, 76(6!:241; 1998
Pourrezaei, K. et al., U.S. P a t e n t 5,685,961; assignors to P & D
Medical Coatings Inc.
Stacy, B.F. et al., AESF SUR/FIN '98, Minneapolis, June 22-25,
1998, Session D, p. 119
Sullivan, A.M. and P.A. Kohl, Plating al~d Surface Fil~ishDTg,
85(2i:56; 1998
Tang, J. et al. ([l, Platit~g al~d Surface Fb~ishing, 85(9):84; 1998
Tang, ,l. et al. (II), Plating al~d Sur/bee Finishb~g, 85~111:241;
1998
IMMERSION PLATING

The benefits of electroless nickel/immersion gold finishes for electronics applications were outlined by
Reed and Shechtmann. Czaja provided a troubleshooting guide for the electroless nickel/immersion
gold process. A regenerative approach to electroless
nickeUimmersion gold finishes for application to surface mount technology was offered by Milad and
Mayes.
Haynes discussed the fabrication of polymer
thick-film inks using immersion-plated silver-coated
particles. An immersion white tin process was described by Edgar. Maezono et al. patented a zincating process for aluminum alloys containing magnesium, silicon, and copper. A method for enhancing
the solderability of a surface using immersion platMetal Finishing

ing won a p a t e n t for F e r r i e r a n d Yakobson. J o s h i et

al. received a p a t e n t for a n o n f o r m a l d e h y d e i m m e r sion coating composition.
Czaja, J., AESF SUR/FIN '98, Minneapolis, June 22-25, 1998,
Session A, p. 21
Edgar, R., AESF SUR/FIN '98, Minneapolis, June 22-25, 1998,
Session A, p. 29
Ferrier, D. and E. Yakobson, U.S. Patent 5,733,599; assignors to
MacDermid Inc.
Haynes, R., AESF SUR/FIN '98, Minneapolis, June, 22-25, 1998,
Session H, p. 349
Joshi, N.E. et al., U.S. Patent 5,725,640; assignors to Atotech
USA Inc.
Maezono, S. et al., U.S. Patent 5,795,662; assignors to Kobe Alcoa
Transportation Products Ltd.
Milad, G. and R. Mayes, Metal FinislTing, 96(1A):42; 1998
Reed, A.H. and M. Shechtmann, AESF SUR/FIN '98, Minneapolis, June 22-25, 1998, Session A, p. 17

Sarmaitis and Survila investigated the mass

t r a n s f e r of c o m p o n e n t s in zinc c h r o m a t i n g solutions.
A composition a n d process for i m p a r t i n g a b r i g h t
blue color to z i n c - a l u m i n u m alloys was p a t e n t e d by
Ishii a n d Ogino. K i s h i k a w a a n d Y a m a m o t o o b t a i n e d
a p a t e n t for a black c h r o m a t e t r e a t m e n t for zincnickel alloys. An electrolytic conversion c o a t i n g form u l a t i o n g a r n e r e d a p a t e n t for T a n a k a et al.
T r e m m e l received a p a t e n t for a m e t h o d for chrom a t e p a s s i v a t i o n of electroplated t u n g s t e n alloys. A
sol for surface t r e a t m e n t of m e t a l s w a s p a t e n t e d by
B l o h o w i a k et al. B u c h h e i t a n d M a r t i n e z p a t e n t e d a
process for the corrosion p r o t e c t i o n of metallic materials c o n s i s t i n g of an applied alkaline c o a t i n g a n d
a seal. A m e t h o d of m o n i t o r i n g c o n s t i t u e n t s in conv e r s i o n coating b a t h s g a r n e r e d a p a t e n t for Ludwig.

CONVERSION C O A T I N G

References

W a l d r o p a n d K e n d i g i n v e s t i g a t e d the n u c l e a t i o n of
c h r o m a t e conversion coatings on 2024T3 a l u m i n u m
alloys u s i n g atomic force microscopy. R a m a n spectroscopy w a s u s e d by Zhao et al. to clarify the selfh e a l i n g m e c h a n i s m of c h r o m a t e conversion coatings
on 2024T3 a l u m i n u m alloys for aircraft applications.
The a n t i c o r r o s i o n m e c h a n i s m of c h r o m a t e conversion coatings on 2024T3 a l u m i n u m alloys w a s also
s t u d i e d by Xia a n d McCreery, w h o used i n f r a r e d a n d
R a m a n spectroscopy.
R e p l a c e m e n t s for h e x a v a l e n t c h r o m i u m for desm u t t i n g , deoxidizing, a n d conversion c o a t i n g of alum i n u m alloys were described by Rabbetts. Critchlow
offered a l t e r n a t i v e s to h e x a v a l e n t c h r o m i u m to enh a n c e the d u r a b i l i t y of b o n d e d a l u m i n u m joints. A
low-temperature,
corrosion-resistant
conversion
coating f o r m u l a t i o n for a l u m i n u m alloys b a s e d on
an alkali m e t a l p e r m a n g a n a t e won a p a t e n t for
Bibber. T o m l i n s o n obtained a p a t e n t for a chromiu m - f r e e conversion coating for a l u m i n u m a n d alum i n u m alloys. An a q u e o u s p h o s p h o r i c acid b o n d i n g
solution g a r n e r e d a p a t e n t for Mosser a n d Eddinger.
Price a n d M c G r a t h p a t e n t e d a process for f o r m i n g
a conversion coating composition on copper for
p r i n t e d circuit b o a r d applications. A m e t h o d for prod u c i n g a b r o c h a n t i t e p a t i n a on copper won a p a t e n t
for H o v e l i n g et al. Ainali et al. received a p a t e n t for
a p a t i n a t i o n a g e n t for c o p p e r - b e a r i n g m a t e r i a l s .
A m e t a l coloring process w a s p a t e n t e d by Williams et al. R u n d h a u g o b t a i n e d a p a t e n t for a proeess for p r o d u c i n g an o r n a m e n t a l r u s t finish on a
ferrous m e t a l surface. A c h r o m a t e d steel s h e e t with
h i g h corrosion resistance, i m p r o v e d lubricity, a n d
good electrical c o n d u c t i v i t y was t h e subject of a
p a t e n t g r a n t e d to M a n o et al.

Buchheit, R.G. and M.A. Martinez, U.S. Patent 5,756,218; assignors to Sandia Corp.
Critehlow, G.W., Transactions of the I~stitute of Mctal Finishing,
76(1 ):B6; 1998
Hoveling, S. et al., U.S. Patent 5,714,052; assignors to KM Europa Metal AG
Ishii, H. and T. Ogino, U.S. Patent 5,700,334; assignors to Henkel
Corp.
Kishikawa, S. and T. Yamamoto, U.S. Patent 5,735,972; assignors to Dipsol Chemicals Co. Ltd.
Ludwig, F.A., U.S. Patent 5,753,101
Mano, J. et al., U.S. Patent 5,700,561; assignors to Kawasaki
Steel Corp.
Mosser, M.F. and K.B. Eddinger, U.S. Patent 5,803,990; assignors to Sermatech International Inc.
Price, A.D. and P.T. McGrath. U.S. Patent 5,800,859
Rabbetts, A., Transactions o[" the hzstitute of Metal Finishing,
76(1):B4; 1998
Rundhaug, P.A., U.S. Patent 5,728,236; assignor to Chem-Pro
Sarmaitis, R. and A. Survila, Plating and Surface Finishing,
85( 10!:64; 1998
Tanaka, S. et al., U.S. Patent 5,772,865; assignors to Dipsol
Chemicals Co. Ltd.
Tomlinson, C.E., U.S. Patent 5,759,244; assignor to Natural Coating Systems LLC
Tremmel, R., U.S. Patent 5,730,809; assignors to Enthone-OMI
Inc.
Waldrop, J.R. and M.W. Kendig, Journal of the Electrochemical
Society, 145[1):Lll; 1998
Williams, R.K. et al., U.S. Patent 5,723,183; assignors to Birchwood Laboratories Inc.
Xia, L. and R.L. McCreery, Journal of the Electrochemical Society, 145(9):3083; 1998
Zhao, J. et al., Journal of the Electrochemical Society, 145(7):
2258; 1998

References

February 1999

Ainali, M.S. et al., U.S. Patent 5,691,001; assignors to Outokumpa Cooper Oy

Bibber, J.W., U.S. Patent 5,707,465; assignor to Sanchem Inc.
Blohowiak, K.Y. et al., U.S. Patent 5,814,137; assignors to Boeing
Co.

37

HOT-DIP C O A T I N G

A hot-dipped, aluminum-coated stainless steel sheet

was the subject of a patent granted to Maki et al.
Perdikaris obtained a patent for a long wearing roll
for guiding steel strip through a high-temperature
aluminizing bath. A laboratory study of the cathodic
protection afforded by 55% a h m i n u m - z i n c alloy
coating in comparison with a galvanized coating was
reported by Palma and Morcillo. Oki et al. described
a process for separation and recovery of a h m i n m n
and zinc from galvanized steels.
Isobe et al. patented a method for hot-dip galvanizing high-tensile steel strip with minimal bare
spots. A process for hot-dip galvanizing cold-rolled
steel strip with good formability was the subject of a
patent issued to Yoshinaga et al. Carey and Zamanzadeh were awarded a patent for a method of producing a metal strip with an alloy coating of tin and
zinc.
A method and apparatus for producing bright and
smooth galvanized coatings won a patent for Cook.
Ungar and Maitra obtained a patent for an apparatus for galvanizing a linear element. A device tbr hot
immersion coating of steel sheets garnered a patent
for Falia et al. Vignot and Abels received a patent tbr
an apparatus for guiding metal strip in a molten
metal bath.
Smith and Sadtler showed how to monitor and
control acid cleaning and preflux solutions prior to
galvanizing using thermometric titrations. A
method for producing zinc ammonium chloride galvanizing fluxes was patented by Cudahy and Myerson. Satsurai received a patent for a flux for hot-dip
tinning. A process for dezincing galvanized steel
won a patent for Morgan et al.
References
Carey, J.F. and M. Zamanzadeh, U.S. P a t e n t 5,695,822; assignors
to Louis B e r k m a n Co.
Cook, T.H., U.S. P a t e n t 5,814,126
Cudahy, M.W. and A.S. Myerson, U.S. P a t e n t 5,810,946; assignors to Metals Recycling Technologies Corp.
Falia, H.C. et al., U.S. P a t e n t 5,792,266; assignors to Comesi
S.A.I.C.
Isobe, M. et al., U,S. P a t e n t 5,677,005; assignors to Kawasaki
Steel Corp.
Maki, J. et at., U.S. P a t e n t 5,789,089; assignors to Nippon Steel
Corp.
Morgan, W.A. et al., U.S. P a t e n t 5,779,878; assignors to Metal
Recovery Industries (US) Inc.
Oki, T. et al., AESF SUR/FIN '98, Minneapolis, J u n e 22-25, 1998,
Session R, p. 717
Palma, E. and M. Morcillo, Platil~g and Surface Fmishiltg, 85!5):
105; 1998
Perdikaris, C., U.S. P a t e n t 5,759,142; assignor to Bender Machine Inc.
Satsurai, R., U.S. P a t e n t 5,798,000; assignor to Hoshizaki Denki
KK
38

Smith, T. and T. Sadtler, Metal Finishing, 96(7):20; 1998

Unger, C.H. and K.K. Maitra, U.S. P a t e n t 5,718,765; assignors to
Allied Tube & Conduit Corp.
Vignot. J.M. and H. Abels, U.S. P a t e n t 5,718,766; assignors to
Vesuvius Crucible Co.
Yoshinaga, N. et al., U.S. P a t e n t 5,690,755; assignors to Nippon
Steel Corp.
ELECTROFORMING

Parkinson provided a review of electroforming applications for everyday devices. The electroforming
of high aspect geometry microdevices in gold, copper, bronze, nickel, and nickel alloys was described
by Bonivert et al. Leisner et al. addressed the electroforming of micro&vices from different nickel sulfamate s o h t i o n s and using pulse-reversal procedures from a Watts nickel bath. A process for nickelcobalt alloy deposition from sulfamate electrolytes
with application to electroforming was discussed by
Golodnitsky et al. Bocking et al. used electroforming
for rapid prototyping with concurrent engineering of
tools.
An electroformed squeegee blade for surface
mount screen printing was patented by Fischbeck
and Marks. Herbert et al. (I) obtained a patent for
an encapsulated electroformed photoreceptor substrate. A method for electroforming an abrasion
shield won a patent for DuPree. Oyama received a
patent for a process for manufacturing a porous
electroformed shell. An electroformed multilayer
spray director garnered a patent for Marks et al.
Fedor et al. patented an electroforming process
for making copper wire. A magnetic-force-assisted
electroform separation method was patented by
Herbert et al. (II). Hendrix et al. were granted a
patent for a parting fixture for removal of a substrate from a mandrel. An electroforming apparatus
was the subject of a patent awarded to Greenspan.
References
Bocking, C. et al., Transactio~zs of the h~stitutc of Metal Finishing,
76(2):64; 1998
Bonivert, W.D. et al., AESF/SFSJ Advanced Surface Technology
Forum, Kanmela, Hawaii, Oct. 8-9, 1998, p. 15
DuPree, D.(L, U.S. P a t e n t 5,674,370; assignor to Optical Radiation Corp.
Fedor, R.J. et al., U.S. P a t e n t 5,679,232; assignors to ElectroCopper Products Ltd.
Fischbeck, K.W. and G.T. Marks, U.S. P a t e n t 5,746,127; assignors to AMTX Inc.
Golodnitsky, D. et al., Plating and Surface Finishing, 85(2):65;
1998
Greenspan, A., U.S. P a t e n t 5,785,826; assignor to Digital Matrix
Hendrix, L.E. et al.. U.S. P a t e n t 5,807,472; assiglaors to Xerox
Corp.
Herbert, W G . et al. (Ii, I_'.S. P a t e n t 5,681,440; assignors to Xerox
Corp.
Herbert, W.G. et al. III/, U.S. P a t e n t 5,723,037; assignors to
Xerox Corp.
Metal Finishing

Leisner, P. et al., AESF SURYFIN'98, Minneapolis, June 22-25~

1998, Session H, p. 307
Marks, G.T. et al., U.S. Patent 5,685,491; assignors to AMTXInc.
Oyama, K., U.S. Patent 5,728,284; assignor to KTX Co. I~td.
Parkinson, R., Plating and Surface Finishing, 84(12):8; 1997
C O M P O S I T E ELECTRODEPOSITS

Bouet et al. d eterm i ned the effect of spherical particles on the flow of c ur r e nt during composite electrodeposition to optimize the design of plating cells.
The e n t r a p m e n t plating of superabrasive materials
as clearance control coatings for turbine engine components was described by El-Shazly and Bush. Feldstein p a t e n t e d a method for selective codeposition of
particulate matter.
J u n e t al. d eter m i ne d the microstructure of nickel
matrix coatings with dispersed partially stabilized
zirconia. The electrical properties of nickel mat ri x
composite coatings with liquid containing capsules
deposited from a modified Watts bath were reported
by Dervos et al. Peng et al. studied the oxidation
behavior of nickel-lanthanum oxide codeposits. The
effect of superimposed AC on the characteristics of
nickel, copper, and copper-nickel alloy composites
with alpha-alumina and t i t ani um dioxide occlusions
was investigated by Fawzy and Abd El-Halim.
Cheng et al. discussed the electrochemical preparation and mechanical properties of amorphous nickelphosphorus-silicon carbide composite coatings. A
composite brush-plated coating consisting of nickelcobalt-zirconium oxide was the subject of an article
by Lin et al.
Podlaha and Landolt discussed a pulse-reverse
technique for plating nanocomposite thin films of
copper-aluminum oxide. A chromium-graphite electrodeposited composite coating for unlubricated sliding wear was described by Yang and Jiang. Hong et
al. developed iron matrix antifriction coatings including iron-nickel-molybdenum disulfide for t a n k
plating and iron-zinc-molybdenum disulfide for
brush plating. A process for producing antiwear
coatings consisting of a matrix of either tin or nickel
with particles of iron-carbon or iron-tungsten-carbon was p a t e n t e d by Kito et al. Fer r onat o pat ent ed
a flexible abrasive incorporating a composite electrodeposit.
References
Bouet, v. et al., Journal of the Electrochemical Socie(v, 145(2):
436:1998
Cheng, D.H. et al., Plating and Surface Finishing, 85(2~:61; 1998
Der~'os, C.T. et al., Transactions of the Institute of Metal Finishing, 76(4):127; 1998
El-Shaziy, M. and J. Bush, AESF Aerospace/Airline Plating and
Metal Finishing Forum, San Antonio, Texas, March 24-26,
1998, p.13
February 1999

Fawzy, M.H. and A.M. Abd El-Halim, Transactions of the Institute of Metal Finishing, 76(5~:193; 1998
Feldstein, N., U.S. Patent 5,702,763; assignor to Surface Technology Inc.
Ferronato, S.G.G., U.S. Patent 5,755,946
Hong, Q. et al., Metal Finishing, 96(10):16; 1998
Jun, L. et al., Transactions of the Institute of Metal Finishing,
76(4):131; 1998
Kito, S. ct al., U.S. Patent 5,779,872; assignors to ToyotaJidosha
KK and Nisshin Steel
Lin, W. et al., Metal Finishing, 96(5):46~ 1998
Peng, Y. et al., Journal of the Electrochemical Socie(v, 145(2):389;
1998
Podlaha, E.J. and D. Landolt, AESF SUR]F[N '98, Minneapolis,
June 22-25, 1998, Session T, p. 761
Yang, D. and C. Jiang, Plating and Surface Finishing, 85(1):110;
1998
S T R I P A N D SELECTIVE P L A T I N G

A method for zinc electroplating steel strip incorporating pickling in a tin-containing solution won a
p a t e n t for U r a k a w a et al. Shast ry et al. received a
pat ent for a process for improving the formability
and welding properties of zinc-coated steel sheet by
application of a buffered alkaline solution to form a
zinc oxide layer. A method for producing a zinccoated strip with improved fbrmability and surface
quality using a zinc oxalate film was pat e n te d by
Taffinger. Derule and Steinmetz pat ent ed a process
for surface t r e a t m e n t of zinc-coated steel sheet consisting of application of a corrosion inhibiting composition. A method and plant for regenerat in g zinc
sulfate electrolyte in a steel strip galvanizing process garnered a pat ent for K u h l m a n n and Gl~isker.
Olashuk and Shields p a t e n t e d a method for continuous cleaning of steel strip. A composite-coated
flat-rolled steel with a tin plate and electrolytically
applied chrome and chrome oxide passivation coating for use in fabrication of can stock e a rn e d a
pat ent for Saunders et al. O h m u r a et al. received a
pat ent for a method of m a n u f a c t u r i n g a nickelplated steel sheet or strip. A plant for electrolytic
coating of strip garnered a p a t e n t for Schimion.
Rischke and van Sprang p a t e n t e d a method for
continuous selective electroplating of a p e r t u r e d
metal or metallized products. An a p p a r a t u s for selectively electrolytically t reat i ng defined regions of a
continuously moving conductive workpiece won a
pat ent for Zwerner and Aparicio. Vaccaro et al. received a pat ent for a process for continuously electroplating a strip of reticulated foam having improved weight
distribution.
A method for
electrodepositing a material on a selected portion of
a wire g a r n e r e d a p a t e n t for Van Leth et al. Stadler
and Pernick obtained a p a t e n t for an a p p a r a t u s for
selectively coating metal parts.
An overview on brush plating was provided by
39

(a

W a c h t l e r (I a n d II). C r o c k e r a d d r e s s e d h a z a r d o u s
material replacements in the brush plating indust r y . Z i n c - t i n a l l o y s a s r e p l a c e m e n t s for c a d m i u m in.
brush plating operations were discussed by ttelwig
(I a n d II).
Wei patented a method of manufacturing a plated
vehicle wheel having nonplated tire bead seats. A
p r o c e s s for p l a t i n g t u r b i n e e n g i n e c o m p o n e n t s incor-.
porating injection of an organic maskant garnered a
p a t e n t for K a n g e t al. B i e r n a t h o b t a i n e d a p a t e n t for
a m e t h o d for e l e c t r i c a l l y i s o l a t i n g a r e a s o f a s u b s t r a t e c o m p r i s i n g m i c r o r i d g e a b r a s i o n . A p r o c e s s for
reducing or eliminating underplating without an
adhesion promoter was the subject of a patent
g r a n t e d to M c E l h a n o n a n d B u r n s .
A m e t h o d for i n s p e c t i n g c o p p e r or m o l y b d e n u m
l i n e s o n a s u b s t r a t e , w h i c h c o m p r i s e s s e l e c t i v e met.allization was patented by Lee and Viehbeck.
I m a m u r a o b t a i n e d a p a t e n t for a p r o c e s s o f f o r m i n g
a p a t t e r n o n a s e m i c o n d u c t o r s t r u c t u r e t h r o u g h selective electroplating. A method of plating noble
m e t a l e l e c t r o d e s to f o r m a c a p a c i t o r for a s e m i c o n d u c t o r d e v i c e g a r n e r e d a p a t e n t for A n d r i c a c o s e t al.
G o r r e l l a n d F i s c h e r p a t e n t e d a m e t h o d for f o r m i n g
raised metallic contacts on electrical circuits.
B e i l i n e t al. r e c e i v e d a p a t e n t for a t e c h n i q u e i b r
p l a t i n g h i g h - a s p e c t - r a t i o f e a t u r e s . M e t h o d s for p r o d u c i n g a p l a t e d t h r o u g h h o l e on a p r i n t e d c i r c u i t
b o a r d w o n p a t e n t s for B a c k a s c h a n d H o h m a n n a n d
for F l o r i o e t al. J u s k e y e t al. p a t e n t e d a p r o c e s s t b r
p l a t i n g a s u b s t r a t e to e l i m i n a t e t h e u s e o f a s o l d e r
m a s k . P r o c e s s e s for f a b r i c a t i n g c i r c u i t b o a r d s w e r e
a l s o t h e s u b j e c t o f p a t e n t s g r a n t e d to C o n w a y , to
L a r s o n , a n d to S a d a h i s a e t al.

Kang, D. et al., U.S. Patent 5,5,800,695; assignors to Chromalloy

Gas Turbine Corp.
Kuhlmann, J. and U. Gl~sker, U.S. Patent 5,690,804; assignors to
SMS
Larson, G.B., U.S. Patent 5,747,09& assignor to MacDermid Inc.
Lee, K-W. and A. Viehbeck, U.S. Patent 5,756,146; assignors to
IBM Corp.
McElhanon, R.W. and W.K. Burns, U.S. Patent 5,755,947; assignors to U.S.A. as represented by the Secretary of the Navy
Ohmura, H. et al., U.S. Patent 5.679,181; assignors to Toyo
Kohan Co. Ltd.
Olashuk, K.R. and L.R. Shields, U.S. Patent 5,776,258: assignors
to Weirton Steel Corp.
Rischke, J.W. and W.G.L. van Sprang, U.S. Patent 5,702,583:
assignors to Meco Equipment Engineers BV
Sadahisa, T. et al., U.S. Patent 5,766,492; assignors to Nippon
Paint Co. Ltd. and IBM Corp.
Saunders, W.T. et al., U.S. Patent 5,674,633; assignors to Weirton
Steel Corp.
Schimion, W., U.S. Patent 5.718,814; Schloemann-Siemag AG
Shastry, C.R. et al., U.S. Patent 5,714,049; assignors to Bethlehem Steel Corp.
Stadler, D.M. and J.R. Pernick, U.S. Patent 5,750,014; assignors
to International Hardeoat Inc.
Taffinger, B.M., U.S. Patent 5,795,661; assignor to Bethlehem
Steel Corp.
Urakawa, T. et al., U.S. Patent 5,810,991; assignors to NKK Corp.
Vaccaro, A.J. et al., U.S. Patent 5,804,053; assignors to Eltech
Systems Corp.
Van Leth, N.J.M. et al., U.S. Patent 5,714,051; assignors to U.S.
Philips Corp.
Wachtler, W.R. (I !, AESF SUR/FIN '98, Minneapolis, June 22-25,
1998, Session J, p. 401
Wachtler, W.R. (II), AESF/SFSJ Advanced Surface Technology
Forum. Kamuela, Hawaii, Oct. 8-9, 1998, p. 135
Wei, D.C., U.S. Patent 5,728,426; assignor to Hayes Wheels
International Inc.
Zwerner, E. and M. Aparicio, U.S. Patent 5,705,043; assignors to
Suntec Trading AG

References

The theoretical and practical aspects of electrodeposition of metal coatings with improved properties
using pulsing, agitation, and additives were add r e s s e d b y A r o y o a n d A r o y o e t al. Y i n p r o v i d e d a
theoretical analysis of the effect of inert blocking
i n h i b i t i n g a g e n t s on p u l s e p l a t i n g to c h a r a c t e r i z e
the nature of additives. Some successes and failures
i n p u l s e p l a t i n g r e g a r d i n g i m p r o v e m e n t of t h r o w i n g
power and control of alloy composition were discussed by Baldwin.
Bratoeva and Gurkovsky determined the influence of laser irradiation on metal electrodeposition
a n d o f f e r e d t h e p r o c e s s a s a p o s s i b i l i t y for m a s k l e s s
p r o d u c t i o n o f p r i n t e d c i r c u i t b o a r d s . C e l l d e s i g n for
metal deposition processes with complex geometry
w a s a d d r e s s e d b y Z o r i c e t al. K o n d o a n d F u k u i
c o n d u c t e d a n u m e r i c a l a n a l y s i s to i n v e s t i g a t e t h e
relationship between cavity shapes and current dist r i b u t i o n for e l e c t r o d e p o s i t i o n o f b u m p s w i t h d e e p

Andricacos, P.C. et al., U.S. Patent 5,789,320; assignors to IBM

Corp.
Backasch, W. and R. Hohmann, U.S. Patent 5,799,.393; assignors
to Blaupunkt-Werke GmbH
Beilin, S.I. et al., U.S. Patent 5,746,903; assignors to Fujitsu Ltd.
Biernath, R.W., U.S. Patent 5,736,191; assignor to 3M Co.
Conway, J.W., U.S. Patent 5,733,468
Crocker, D., AESF SUR/FIN '98, Minneapolis, June 22-25, 1998,
Session J, p. 417
Derule, H. and J. Steinmetz, U.S. Patent 5,683,751; assignors to
Sollac
Florio, S.M. et al., U.S. Patent 5,738,776; assignors to Shipley Co.
LLC
Gorrel[, R.E. and P.J. Fischer, U.S. Patent 5,747,358; assignors to
W.L. Gore & Associates Inc.
Helwig, C. (I), AESF Aerospace/Airline Plating and Metal Finishing Forum, San Antonio, Texas, March 24-26, 1998, p.107
Helwig, C. (II), AESF SUR/FIN '98, Minneapolis, June 22-25,
1998, Session J, p. 409
Imamura, T., U.S. Patent 5,679,234; assignor to NEC Corp.
Juskey, F. et al., U.S. Patent 5,716,760; assignors to Motorola Inc.
40

MISCELLANEOUS METHODS A N D EQUIPMENT

Metal Finishing

cavities. A process for p r o d u c i n g a c o n t i n u o u s p l a t e d

l a y e r on a h y d r i d e d m e t a l m a t e r i a l was p a t e n t e d by
L a w a n d Vyas.
W a t a n a b e et al. p a t e n t e d a m e t h o d for m a n u f a c t u r i n g a color filter by electrodeposition. M e t h o d s for
p l a t i n g a n d finishing cylinder blocks g a r n e r e d a pair
of p a t e n t s for I k e g a y a (II a n d III). S t e b l i a n k o a n d
Riabkov o b t a i n e d a p a t e n t for a process for cleaning
a n d coating u s i n g a flowing electrolyte. A m e t h o d fbr
e l e c t r o p l a t i n g m e t a l films i n c l u d i n g a c a t h o d e ring
i n s u l a t o r a n d t h i e f ring e a r n e d a p a t e n t for Ang,
A s y s t e m a t i c a p p r o a c h to the design, fabrication,
a n d i n s t a l l a t i o n of an electrochemical p r o c e s s i n g
facility was provided by S t e p p a n et al. LaVine described a n e w p l a t i n g b a r r e l design i n c o r p o r a t i n g a
h o n e y c o m b p a t t e r n , w h i c h p e r m i t s t h i n n e r walls
t h e r e b y i m p r o v i n g productivity, r e d u c i n g drag-out,
a n d s a v i n g energy. An e l e c t r o p l a t i n g s y s t e m featuring an e l e c t r o p l a t i n g d r u m for c o n t i n u o u s p a r t s processing w a s the subject of a p a t e n t g r a n t e d to L a z a r o
a n d T r e m m e l . Zecher p a t e n t e d a m e t h o d for the
surface t r e a t m e n t of p a r t s i n c o r p o r a t i n g a belt-type
conveyor
H o s t e n o b t a i n e d a p a t e n t for a device for processing flat workpieces, such as p r i n t e d circuit boards,
w h i c h are conveyed in the vertical position. An app a r a t u s for c o n t i n u o u s u n i f o r m electrolytic metallizing or e t c h i n g w a s p a t e n t e d by Schneider. B i l l m a n
received a p a t e n t for a vessel for e l e c t r o p l a t i n g dies
for p r o d u c i n g c o m p a c t a n d video disks. A p l a t i n g cell
for p l a n a r workpieces f e a t u r i n g a fluid wiper was
the subject of a p a t e n t issued to Reynolds. K a m m
p a t e n t e d a process and device for c o n t i n u o u s circulation of electrolyte in a p l a t i n g cell.
The benefits a n d l i m i t a t i o n s of c h l o r i n a t e d polyvinyl chloride as a m a t e r i a l of c o n s t r u c t i o n for fabr i c a t i n g finishing e q u i p m e n t were a d d r e s s e d by
M u k h e r j e e . C a m b r i a et al. s u g g e s t e d digital controls
for o p e r a t i o n of rectifiers. W a v e f o r m m o n i t o r i n g of
rectifiers was s u g g e s t e d by A n d e r s o n to detect m i n o r
failures before t h e y can lead to expensive r e p a i r s or
fires. Concerns in the selection of p u m p s a n d filters
were discussed by S u t h e r l a n d . Schillereff n o t e d the
benefits of p e r m a n e n t m i c r o n - r a t e d filters for plating b a t h m a i n t e n a n c e . P r e v e n t i v e m a i n t e n a n c e as
the k e y to e x t e n d i n g t h e life of i m m e r s i o n h e a t e r s
was the subject of a p a p e r by LeFebvre.
A m e t h o d and a p p a r a t u s for controlling the plating t h i c k n e s s of a workpiece c o m p r i s i n g directing a
portion of the c u r r e n t a w a y from the ends of the
c a t h o d e rack w a s p a t e n t e d by J o s h i et al. Rose
o b t a i n e d a p a t e n t for a device for c a r r y i n g c u r r e n t to
a workpiece. A c u r v e d lead anode for use in an
e l e c t r o p l a t i n g cell w a s p a t e n t e d by Fowler et al.
42

I k e g a y a (I) received a p a t e n t for an a n o d e a r r a n g e m e n t for p l a t i n g cylinder bores.

Poris g a r n e r e d a p a t e n t for an electrodeposition
a p p a r a t u s w i t h a v i r t u a l a n o d e for p r o c e s s i n g of a
semiconductor. A resonating electroplating anode
w o n a p a t e n t for Pop et al. Chin received a p a t e n t for
a n a n o d e holder for use in e l e c t r o p l a t i n g of c r a n k
pins. A n o d e b a s k e t s were the subject of p a t e n t s
g r a n t e d to Botts et al. (I a n d II) a n d to Mehler.

References
Anderson, H., Metal Finishing, 96(8):10; 1998
Ang, J., U.S. Patent 5,744,019; assignor to AIWA Research and
Development Inc.
Aroyo, M., Plating and Surface Finishing, 85(8):69; 1998
Aroyo, M. et al., Plating and Surface Finishing, 85(9):92; 1998
Baldwin. P.C., Metal Finishing, 96(7):12; 1998
Billman, A., U.S. Patent 5,676,809; assignor to Toolex Alpha AB
Botts, R.R. et al. (I), U.S. Patent 5,744,013; assignors to Mitsubishi Semiconductor America Inc.
Botts, R.R. et al. ill), U.S. Patent 5,776,327; assignors to Mitsubishi Semiconductor America Inc.
Bratoeva, M. and S. Gurkovsky, Pl~zting and Surface Finishing,
85(6):102; 1998
Cambria, P. et al., AESF SUR/FIN '98, Minneapolis, June 22 25,
1998, Session K, p. 425
Chin, R.Y.K., U.S. Patent 5,738,769
Fowler, H.K. et al., U.S. Patent 5,783,058; assignors to Elteeh
Systems Corp.
Hosten, D., U.S. Patent 5,772,765; assignor to Siemens SA
Ikegaya, H. (I), U.S. Patent 5,725,745; assignor to Yamaha Hatsudoki KK
Ikegaya, H. (II), U.S. Patent 5,806,481; assignor to Yamaha
Hatsudoki KK
Ikegaya, H. (III), U.S. Patent 5,810,990; assignor to Yamaha
Hatsudoki KK
Joshi, S.V. et al., U.S. Patent 5,788,829; assignors to Mitsubishi
Semiconductor Anmrica Inc.
Kamm, R., U.S. Patent 5,716,509; assignor to Ecograph AG
Kondo, K. and K. Fukui, Journal of the Electrochemical Society,
145(9~:3007; 1998
LaVine, M., Metal Finishing, 96i8):36; 1998
Law', H.H. and B. Vyas, U.S. Patent 5,766,688; assignors to
Lucent Technologies Inc.
Lazaro, A.E. and P.H. Tremmel, U.S. Patent 5,755,948; assignors
to Hardwood Line Mfg. Co.
LeFebw'e, F., Products Finishir~g, 63!2):42; 1998
Mehler, V.A.. IJ.S. Patent 5,766,430
Mukherjee, A., Metal Finishing, 96(8):41; 1998
Pop, M.G.M. et al., U.S. Patent 5,695,621; assignors to Framatone
Technologies Inc.
Poris. J., U.S. Patent 5,723,028
Reynolds, H.V., U.S. Patent 5,683,564; assignor to Reynolds Tech
Fabricators Inc.
Rose, M.F., U.S. Patent 5,759,363
Schillereff, l)., Metal Finishing, 96(6):90; 1998
Schneider, R., U.S. Patent 5,804,052; assignor to Atotech Deutschland GmbH
Steblianko, V.L. and V.M. Riabkov, U.S. Patent 5,700,366; assignors to Metal Technology Inc.
Steppan, J.J. et al., AESF SUR/FIN '98, Minneapolis, June 2225, 1998, Session K, p. 433
Sutherland, J.R., Products Finishing, 62(10):44; 1998
Metal Finishing

Watanabe, T. et al., U.S. P a t e n t 5,674,369; assignors to Sumitomo Chemical Co.

Yin, K-M., Journal of the Electrochemical Society, 145( 11):3851;
1998
Zecher, R.F., U.S. P a t e n t 5,753,096; assignor to Tumbleveyor Inc.
Zoric, J. et al., Plating and Surface Finishing, 85(11:102:1998
T E S T I N G .AND C O N T R O L

An overview on standards and specifications for

metal finishing was provided by DiBari (I). DiBari
(II and III) reviewed the technical basis of ASTM
standard B 456 and ISO standard 1456 on decorative
nickel plus chromium coatings. The value of nurturing
a Deming-based culture to support a quality program
was noted by Mueller. Schoonover discussed how a
basic total quality management program can be extended to provide environmental benefits. New soft:ware for process control was described by Vins.
Kadija et al. described a hydrodynamically controlled Hull cell with linear current density distribution. A computer model of transport processes in
Hull cells and rotating electrodes was provided by
Hsueh and Wei. Lee and Chapman used a curvilinear Hull cell with concentric cylindrical walls to
quantify throwing power.
A new approach to cyanide analysis employing
ligand-exchange reagents, a flow-injection analysis
system, and amperometric detection was described
by Straka. Konrad and Sinicki obtained a patent for
a method of analyzing gold electroplating solutions
for arsenic(III). A method for monitoring the constituents in electroless plating baths won a patent for
Ludwig et al.
Carroll discussed three mathematical techniques
to enhance the performance and capability of X-ray
fluorescence thickness and composition analyses. A
review of the use of scanning probe microscopy in
surface finishing was provided by Smith et al.
Krumbein and Newell outlined the practical aspects
of eoulometric reduction for the testing, characterization, and quality control of metallic finishes.
Color measurement and computer shade matching
were addressed by Gaddy. Henry and Bougneit described a submersible data logger that can be used to
profile and monitor plating baths.
References
Carroll, P., Metal Finishing, 96(61:88; 1998
DiBari, G.A. (I), AESF SURWIN '98, Minneapolis, J u n e 22-25,
1998, Session I, p. 385
DiBari, G.A. (II), AESF SUR/FIN '98, Minneapolis, J u n e 22-25,
1998, Session I, p. 389
DiBari, G.A. (III), Plating and Surface Finishing, 85( 101:12; 1998
Gaddy, T., AESF SUR/FIN '98, Minneapolis, J u n e 22-25, 1998,
Session Q, p. 673
Henry, C.A. and J. Bougneit, AESF SURIFIN '98, Minneapolis,
J u n e 22-25, 1998, Session K, p. 459
February 1999

Hsueh, K-L. and I-Y. Wei, AESF SUR]FIN '98, Minneapolis, J u n e

22-25, 1998, Session H, p. 371
Kadija, I.V. et al., AESF SUR/FIN '98, Minneapolis, J u n e 22-25,
1998, Session D, p. 135
Konrad, J.J. and R.A. Sinicki, U.S. Patent 5,723,339; assignors to
IBM Corp.
Krumbein, S.J. and B. Newell, AESF SUR/FIN '98. Minneapolis,
J u n e 22-25, 1998, Session H, p. 329
Lee, J. and T.W. Chapman, Journctl of the Electrochemical Socie(v, 145(9k3042; 1998
Ludwig, F.A. et al.. U.S. P a t e n t 5,755.954; assignors to Technic
Inc.
Muelter, F., AESF SUR/F1N '98, Minneapolis, J u n e 22-25, 1998,
Session G, p. 291
Sehoonover, T., AESF SUIUFIN '98. Minneapolis, J u n e 22-25,
1998, Session K, p. 451
Smith, J.R. et al., Transacticms of tlw D~stitt~tc of Metal Fil~ishing,
76(41:B54:1998
Straka, M., Metal Finishing, 96(11 ~:34; 1998
Vins, B., 19th AESF/EPA Pollution Prevention and Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 19!18, p. 199
AIR POLLUTION CONTROL

Lord and Gallerani reviewed methods for estimation

of air emissions for modeling in the characterization
of processes and for evaluating process changes. The
hidden pitfalls in EPA's chromium NESHAP and
means for avoiding them were discussed by Murphy.
Ferguson (I and II) addressed the use of mist suppressants in hard chromium tanks to meet the chromium MACT standard. Energy conservation and
process control utilizing covered tanks were the subject of several papers by Hankinson et al. (I, II, and
III).
References
Ferguson, D. ([), 19th AESF/EPA Pollution Prevention and Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p.
49
Ferguson, D. (II), 19th AESF/EPA Pollution Prevention and Control Cont~rence, Lake Buena Vista. Fla., Jan. 26-28, 1998, p.
173
Hankinson, K. et al, (iI, 19th AESF/EPA Pollution Prevention
and Control Conference, Lake Buena Vista, Fla., Jan. 26-28,
1998, p. 271
Hankinson, K.C. et al. (II). AESF Aerospace/Airline Plating and
Metal Finishing Forum, San Antonio, Texas, March 24-26,
1998, p.45
Hankinson, K.C. et al. dlI/, AESF/SFSJ Advanced Sur/hce Technology Forum, Kamuela. Hawaii, Oct. 8-9, 1998, p. 111
Lord, J .R. and P. Gallerani. Plati~ig c~ld Surface Finisl~ing, 85( 1 ):
93; 1998
Murphy, S.A., Plating arid Sat[bee Firzishing, 85(61:119; 1998
W A S T E T R E A T M E N T A N D RECOVERY

The integration of quality and environmental management systems through ISO 9000 and ISO 14000
was addressed by Childers. Clemencio and Curran
described a method to identify and r a n k environmental inputs in accordance with ISO 14000.
Changes in the approach of the metal-finishing in43

dustry in Ontario and future prospects regarding

ISO 14000 were discussed by MacDonald. Farag et
al. outlined a pollution prevention project initiated
by U.S. EPA in New England. A merit partnership
project for metal finishers in U.S. EPA's Region IX
was outlined by Bloch et al. wherein pollution prevention technologies are implemented and tested. A
change in viewpoint was suggested by Schoonover
and Johnson to mitigate regulatory influences and
reduce long-term liability. A model for computing
the cost and waste associated with printed wiring
board fabrication was provided by Sandborn.
Electrocoagulation technology for superior rinsing was suggested by Burford (I and II). M6bius
described an extraction hood with air blow-off to
reduce drag-out from barrel plating. An apparatus
and process for multispray countercurrent rinsing'
was patented by Yates. Rajagopolan et al. investigated methods for reducing wastes in a plant for
polishing memory disks. Pollution prevention case
studies were reported by Krages (II), by Olashuk et
al., and by Cartier.
Krages (I) discussed bad self-monitoring practices
including selective reporting, falsification, and use
of unapproved analytical methods, which should be
avoided. Case studies regarding removal credits for'
copper and nickel discharges to POTWs were the
subject of a paper presented by Hall and Hall.
Kanoff outlined the benefits of U.S. EPA's Supplement Environmental Projects Policy that. allows reduction of assessed civil penalties such as the costs.
associated with closed-loop operations.
A carbon adsorption method for selective removal
of chromate anion was described by Mandich et al.
Lewis patented a technique for recovery of metal
from wastewater comprising pH adjustment and a
bed of adsorption material. The use of immobilized
ligands for selective removal of metals from waste-.
waters was the subject of a paper presented by
Yazdani.
Riley provided an overview on the basics, technologies, and strategies for recycling process wastewater. The recovery and maintenance of process solutions in the electronics industry was addressed by
Reinhard and Deuschle. Hoffman (II) described several applications for chemical recovery by use of
crystallization. A method for recovering metals from
waste streams utilizing dimethyl dithiocarbamate
as a complexing agent garnered a patent for Kreisler. Bolser patented a process for recovering copper
from an aqueous solution by addition of iron particles. An apparatus for isolating precious and semiprecious metals from circuit boards for subsequent
recovery won a patent for Chapman.
44

McLay provided an overview on considerations

for selection of atmospheric and vacuum evaporators
for plating bath and rinsewater recovery. Operating
costs for evaporative systems were addressed by
Hoffman (I). Dapas and Perrone reported on a case
study tbr neutralization and evaporation of wastewater to eliminate permits, fees, and monitoring.
The electrolytic recovery of zinc from galvanizing
plant waste was the subject of a paper presented by
Harris and Codner. Anastasijevic et al. (II) patented
a process for the electrochemical recovery of copper,
zinc, lead, nickel, or cobalt using a plurality of vertical bipolar electrodes. A fluidized bed for electrowinning of copper won a patent for Nadkarni and
Kinneberg. Martin and Nebeker obtained a patent
for the use of polyacrylic acid additives for copper
electrorefining and electrowinning. An electrolytic
cell for recovery of metals from dilute solutions garnered a patent for Sunderland and Dalrymple.
Anastasijevic et al. (I) received a patent for an anode
for electrowinning.
Jangbarwala outlined procedures for sizing an ion
exchange system and predicting waste volume. Rinsewater recycling via ion exchange processes was
addressed by Mason and by White. Meyers (I and II)
described how chelating ion exchange resins behave.
Acid purification and recovery using resin sorption
technology was described by Pajunen. Perrone discussed how to handle salts, filtrates, and other concentrated by-products from in-line ion exchange systems.
A method for removing a metal salt from an
electrolyte comprising ion exchange resins and
membranes in an electrolytic cell was patented by
Zhou et al. Renz et al. (I and II) described a system
for in-process recycling of rinsewater in printed circuit board operations, which combines ion exchange
and electrowinning. A case study on a low regenerant ion exchange system for a printed circuit facility
was provided by Jangbarwala and Ohashi. Jangbarwala and Michaud obtained a patent for an ion
exchange regeneration system.
Ion exchange technology for purification of chromic acid plating baths was described by Dwyer.
Snukiskis et al. investigated a cation exchange systern for removal of nonionic surfactants and nickel
from wastewater. An ion exchange system for recycling nitric acid was discussed by Fecsik (I and II).
Riley et al. reported on a case study on the use of ion
exchange for treating wastes from a phosphating/
chromating operation.
Kruglikov described a system comprising immersion of an electrochemical cell with ion exchange
membranes into nonrunning rinse tanks to reduce
Metal Finishing

waste consumption and reclaim metals. An electrodialysis process for rejuvenation of electroless nickel
baths was discussed by Klingenberg and Schario.
Katselnik and Morcos reduced the level of nickel in
plating effluent through the use of nanofiltration.
~.~eth~d.~ f~ov sed.u~i.n.g th~ e e ~ a.~eei.a~ed, w,i~.
wastewater treatment by utilizing modern instrumentation were outlined by Martin (I and II}. Volle
described a system for electrolytic destruction of
cyanide-bearing wastes. A process for oxidizing cyanide by contact with oxygen, ozone, or hydrogen
peroxide in the presence of a catalytically effective
amount of manganese phosphate was the subject of
a patent awarded to Kurek et al. Kojima and Satomi
discussed wet oxidation processes for treatment of
cyanide, ammonia, phosphate, and electroless nickel
wastes. A process for removal of metal ions from
wastewater by contacting, in sequence, with a water-soluble polymer and a flocculant was patented by
Rothenberg.
Luo et al. (I and II) devised a model for sludge
reduction in cleaning and rinsing operations. A
method for sludge dewatering comprising step-wise
addition of a cationic polyamine was patented by
Vasconcellos et al. Higgins obtained a patent for a
filter press with weight-responsive bumping of the
filter plates. A drip-tray lock mechanism for a filter
press won a patent for Lucey. Pierce received a
patent for a method of treating solid hazardous
waste containing unacceptable levels of leachable
metals comprising addition of a phosphate compound and Portland cement.
References
Anastasijevic, N. et al. (I), U.S. P a t e n t 5,679,240; assignors to
Metallgesellschaft AG

Anastasijevic, N. et aL 014 U.S. Patent 5,720,867; assignors to

Metallgesellschaft AG
Bloch, L. et al., 19th AESF/EPA Pollution Prevention and Control
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 71
Bolser, D.G., U.S. P a t e n t 5,679,259; assignor to Great Western
Chemiea~ C*>.
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 33
Buribrd, R. (II), AESF SUR/FIN '98, Minneapolis, J u n e 22-25,
1998, Session N, p. 581
Cartier, R., 19th AESF/EPA Pollution Prevention and Control
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 313
Chapman, R., U.S. P a t e n t 5,678,775; assignor to Resource Coneepts Inc.
Conference, Lake Buena Vista, Fla., ,Jan. 26-28, 1998, p. 301

[')eme~x'io, A. a ~ P. Eurra~, 19~b AZSFUEPA Po))ui]o~ Prevention and Control Conference, Lake Buena Vista, Fla., Jan.
26-28, 1998, p. 167
Dapas, P. and S. Perrone, AESF Aerospace/Airline Plating and
Metal Finishing Forum, San Antonio, Texas, March 24-26,
1998, p.199
Fe~,.la~" ~999

Dwyer, J., AESF SUR/FIN '98, Minneapolis, J u n e 22-25, 1998,

Session N, p. 563
Farag, I. et al., 19th AESF/EPA Pollution Prevention and Control
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 321
Fecsik, P. (I), 19th AESF/EPA Pollution Prevention and Control
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 123
Fec~i.k,, P. (.!.!.), A ~ F Ae,~:e~gac.~/..M.~!i.:.-.~P!e,~i.~ a4,,d. Mc~M. Fi~.
ishing Forum, San Antonio, Texas, March 24-2(], 1998, p.181
Hall, J. and W. Hall, 19th AESF/EPA Pollution Prevention and
Control Conference, Lake B u e n a Vista, Fla., J a n . ~6-28.1.998,
p. 101
Harris, T,M. and V, Codaer, AESF SUR/FIN '98, Mimxeapalis,
J u n e 22-25, 1998, Session V, p. 823
Higgins, D.M., U.S. P a t e n t 5,674,384; assignor to JWI Inc.
Hoffman, F.W. (I), 19th AESF/EPA Pollution Prevention and
Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998,
p. 133
~ f f ~ , a . n , F.W..!~.), &.ES.F S . U . P ~ N '98, M.i.~.-.~apal.i~,-3~.;~ 122-25, 1998, Session K, p. 463
Jangbarwala, J., AESF SUR/FIN '98, Minneapolis, J u n e 22-25,
1998, Session R, p. 725
Jangbarwala, J. and C.F. Michaud, U.S. Patent 5,776,340; assignors to Hydromatix Inc.
Technology Forum, Kamuela, Hawaii, Oct. 8-9, 1998, p. 141
Kanoff, R., 19th AESF/EPA Pollution Prevention and Control
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 95
Katselnik, P. and S.Y. Morcos, Plating and Sur{6lee Finishing,
85(1):46; 1998
Klingenberg, M.L. and D. Schario, AESF Aerospace/Airline Plating and Metal Finishing Forum, San Antonio, Texas, March
24-26, 1998, p.203
Kojuna, R. and K. Satomi, AESF/SFSJ Advanced Surface Technology Forum, Kamuela, Hawaii, Oct. 8-9, 1998, p. 131
Krages, B.P. (I), Metal Finishing, 96(4):44; 1998
Krages, B.P. iIl), Metal Fi~lishing, 96(11):26; 1998
Kreisler, L., U.S. P a t e n t 5,753,125
Kruglikov, S.S., AESF SURPFIN '98, Minneapolis, J u n e 22-25,
1998, Session R, p. 733
Kurek, P.R. et al., U.S. P a t e n t 5,705,078, assignors to UOP
Lewis, T., U.S. P a t e n t 5,770,090
Lucey, D., U.S. P a t e n t 5,723,046; assignor to JWI Inc.
L~m, E,~. et. ak i~, 1915 AY,SYJEPA P~u~im~ Pre~em~on an:l
Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998,
p. 329
Luo, K.Q. et al. (II), Plating and Surface Fini.~hing, 85(10):59;
1998
MacOonatd, A., 1.gth AESF/EPA Potkttim~ Preventkux atxd CouCool' (?onfi!renee. {,a~:e ffuena Ufsga. F(a., ,fan. ~'(g-~6~. f~',q& ~.
335
Mandich, N.V. et al., Metal Finishing, 96(5):39; 1998
Martin, S. and N. Nebeker, U.S. P a t e n t 5,733,429; assignors to
Enthone-OMI Inc.
Martin, T.H. (I), 19th AESF/EPA Pollution Prevention and Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p.
189
Mason. S., Metal Finishing, 96(8):16; 1998
N~c'La>., 'y~.J., 19I.h AESFJEPA Po~h~hm) Preven~r~eJ~ ant5 Conir3l
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 157
Meyers, P.S. {I), 19th AESF/EPA Pollution Prevention and Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p.
111
Meyers, P.S. ilI), Plating a~d Surface Finishing, 85(10k22; 1998
45

M6bius, A., AESF/SFSJ Advanced Surthce Technology Forum,

Kamuela, Hawaii, Oct. 8-9, 1998, p. 39
Nadkarni, R.M. and D.J. Kinneberg, U.S. P a t e n t 5,695,629; assignors to Metalor USA Refining Corp.
Olashuk, J. et al., 19th AESF/EPA Pollution Prevention and
Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998,
p. 45
Pajunen, P., AESF/SFSJ Advanced Surthce Techmflogy Forum,
Kamuela, Hawaii, Oct. 8-9, 1998, p. 59
Perrone, S., 19th AESF/EPA Pollution Prevention and Control
Conference. Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 29
Pierce, S.A., U.S. P a t e n t 5,674,176; assignor to Entact Inc.
Rajagopalan, N. et al., Metal Fit~isl~ing, 96(11):18; 1998
Reinhard, F. and A. Deuschle, 19th AESF/EPA Pollution Prevention and Control Conference, Lake Buena Vista, Fla., Jan.
26-28, 1998, p. 89
Renz, R.P. et al. (I), 19th AESF/EPA Pollution Prevention and
Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998,
p. 147
Renz, R.P. et al. lII), AESF SURJFIN '98, Minneapolis, J u n e
22-25, 1998, Session A, p. 41
Riley, C., 19th AESF/EPA Pollution Prevention and Control Confbrence, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 15

Riley, C.T. et al., AESF SUR/FIN '98, Minneapolis, J u n e 22-25,

1998, Session N, p. 571
Rothenberg, A.S. and R.G. Ryles, U.S. P a t e n t 5,688,403
Sandborn, P., 19th AESF/EPA Pollution Prevention and Control
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 177
Schoonover, T. and B. Johnson, 19th AESF/EPA Pollution Prevention and Control Confi, rence, Lake Buena Vista, Fla., Jan.
26-28, 1998, p. 293
Snukiskis, J.J. et al., Trans~mtions of the h~stitute of Metal Finishing, 76(6):217; 1998
Sunderland, J.G. and I.M. Dalrymple, U.S. P a t e n t 5,690,806;
assignors to EA Technology Ltd.
Vasconcellos, S.R. et al., U.S. P a t e n t 5,720,887; assignors to
BetzDearborn Inc.
Voile, N., 19tll AESF/EPA Pollution Prevention and Control Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 139
White, G., 19th AESF/EPA Pollution Prevention and Control
Conference, Lake Buena Vista, Fla., Jan. 26-28, 1998, p. 21
Yates. W., U.S. P a t e n t 5,707,457
Yazdani, A., AESF/SFSJ Advanced Surface Technology Forum,
Kamuela, Hawaii, Oct. 8-9, 1998, p. 99
Zhou, C. et al., U.S. P a t e n t 5,804,057; assignors to Faraday
Technology Inc.
MF

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Metal Finishing