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1. Product profile
1.1 General description
NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages.
Table 1.
Product overview
Type number
Package
NXP
JEITA
JEDEC
PNP
complement
BC848B
SOT23
TO-236AB
BC858B
BC848W
SOT323
SC-70
BC858W
1.2 Features
General-purpose transistors
SMD plastic packages
1.3 Applications
General-purpose switching and amplification
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
30
IC
collector current
100
mA
hFE
DC current gain
BC848B
200
290
450
BC848W
110
800
VCE = 5 V;
IC = 2 mA
BC848 series
NXP Semiconductors
2. Pinning information
Table 3.
Pinning
Pin
Description
base
emitter
collector
Simplified outline
Symbol
3
3
1
2
006aaa144
2
sym021
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
BC848B
SOT23
BC848W
SC-70
SOT323
4. Marking
Table 5.
Marking codes
Type number
Marking code[1]
BC848B
1K*
BC848W
1M*
[1]
BC848_SER_7
2 of 12
BC848 series
NXP Semiconductors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
VCEO
collector-base voltage
open emitter
30
collector-emitter voltage
open base
30
VEBO
emitter-base voltage
open collector
IC
collector current
100
mA
ICM
single pulse;
tp 1 ms
200
mA
IBM
single pulse;
tp 1 ms
200
mA
Ptot
Tamb 25 C
SOT23
250
mW
SOT323
200
mW
[1]
Tj
junction temperature
150
Tamb
ambient temperature
65
+150
Tstg
storage temperature
65
+150
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
in free air
[1]
Min
Typ
Max
Unit
SOT23
500
K/W
SOT323
625
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
BC848_SER_7
[1]
3 of 12
BC848 series
NXP Semiconductors
7. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
Min
Typ
Max
Unit
15
nA
IEBO
emitter-base cut-off
current
VEB = 5 V; IE = 0 A
100
nA
hFE
DC current gain
VCE = 5 V; IC = 10 A
150
BC848B
200
290
450
BC848W
110
800
90
250
mV
ICBO
Conditions
VCE = 5 V; IC = 2 mA
VCEsat
VBEsat
VBE
collector-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
IC = 100 mA; IB = 5 mA
[1]
200
600
mV
base-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
[2]
700
mV
IC = 100 mA; IB = 5 mA
[2]
900
mV
base-emitter voltage
IC = 2 mA; VCE = 5 V
[3]
580
660
700
mV
IC = 10 mA; VCE = 5 V
[3]
770
mV
100
MHz
2.5
pF
10
dB
fT
transition frequency
VCE = 5 V; IC = 10 mA;
f = 100 MHz
Cc
NF
noise figure
VCE = 5 V; IC = 200 A;
RS = 2 k; f = 1 kHz;
B = 200 Hz
[1]
[2]
[3]
BC848_SER_7
4 of 12
BC848 series
NXP Semiconductors
mgt727
600
VBE
(mV)
1000
hFE
(1)
500
mgt728
1200
(1)
400
800
(2)
(2)
300
600
200
400
(3)
(3)
100
200
0
101
10
102
0
102
103
101
10
I C (mA)
VCE = 5 V
VCE = 5 V
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 1.
102
103
I C (mA)
104
VCEsat
(mV)
Fig 2.
1200
VBEsat
(mV)
1000
(1)
103
800
(2)
600
(3)
102
400
(1)
200
(3) (2)
10
101
10
102
0
101
103
IC/IB = 20
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 3.
102
103
Fig 4.
BC848_SER_7
10
I C (mA)
I C (mA)
5 of 12
BC848 series
NXP Semiconductors
8. Package outline
3.0
2.8
1.1
0.9
2.2
1.8
1.1
0.8
0.45
0.15
0.45
0.15
2.5 1.4
2.1 1.2
2.2 1.35
2.0 1.15
0.48
0.38
1.9
Dimensions in mm
Fig 5.
04-11-04
2
0.4
0.3
0.15
0.09
0.25
0.10
1.3
Dimensions in mm
Fig 6.
04-11-04
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
3000
10000
BC848B
SOT23
-215
-235
BC848W
SOT323
-115
-135
[1]
For further information and the availability of packing methods, see Section 14.
BC848_SER_7
Packing quantity
6 of 12
BC848 series
NXP Semiconductors
10. Soldering
2.90
2.50
solder lands
solder resist
2
0.85
1
2.70
1.30
3.00
0.85
occupied area
solder paste
0.60
(3x)
0.50 (3x)
0.60 (3x)
1.00
3.30
MSA439
Dimensions in mm
Fig 7.
MSA427
Dimensions in mm
Fig 8.
BC848_SER_7
7 of 12
BC848 series
NXP Semiconductors
2.65
0.75
1.325
1.30
solder lands
2
solder paste
0.60
2.35 0.85
(3)
0.50
(3) 1.90
solder resist
occupied area
Dimensions in mm
0.55
(3)
Fig 9.
2.40
msa429
3.65
2.10
2.70
solder lands
1
0.90
(2)
solder resist
occupied area
Dimensions in mm
msa419
BC848_SER_7
8 of 12
BC848 series
NXP Semiconductors
11. Mounting
43.4
43.4
0.6
0.7
0.6
40
0.6
0.55
40
0.7
0.5
Dimensions in mm
006aaa527
PCB thickness:
FR4 PCB = 1.6 mm
BC848_SER_7
0.5
Dimensions in mm
006aaa672
PCB thickness:
FR4 PCB = 1.6 mm
9 of 12
BC848 series
NXP Semiconductors
Revision history
Document ID
Release date
Change notice
Supersedes
BC848_SER_7
20091117
BC848_SER_6
Modifications:
BC848_SER_6
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
20060203
BC846_BC847_
BC848_5
BC846W_BC847W_
BC848W_4
BC846_BC847_BC848_5 20040206
Product specification
BC846_BC847_
BC848_4
BC846W_BC847W_
BC848W_4
Product specification
BC846W_847W_3
20020204
BC848_SER_7
10 of 12
BC848 series
NXP Semiconductors
Product status[3]
Development
This document contains data from the objective specification for product development.
Qualification
Production
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
BC848_SER_7
11 of 12
BC848 series
NXP Semiconductors
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.