J STD 033B1

Level
Dry Before Bag
MBB With HIC
Desiccant
MSID* Label
Optional
Optional
Optional
Not Required
1
2
Optional
Required
Required
Required
2a-5a
Required
Required
Required
Required
Optional
Optional
Optional
Required
Caution Label
Not Required if classified at 220C - 225C Required** if
classified at other than 220C - 225C
Required
Required
Required
Indication at 2% RH Environment
Pink
Lavender (spot value) change 7%
hue
(wet)
5% Spot
Blue
(dry)
10% Spot
Blue
(dry)
Blue
(dry)
60% Spot
Blue
(dry)
Blue
(dry)
Pink
(wet)
Pink
Lavender (spot value) change 10%
hue
(wet)
Blue
(dry)
Blue
(dry)
Pink
(wet)
Pink
(wet)
Lavender (spot value) change 10% hue
Pink
(wet)
Pink
(wet)
Pink
(wet)
Package Body
Level
Bake @ 125C
Exceeding Floor
Life by >72 h
Thickness
1.4 mm
Thickness
>1.4 mm
2.0 mm
Thickness
>2.0 mm
4.5 mm
2-6
BGA package
>17 mm x 17 mm or any
stacked die package
(See Note 2)
Exceeding Floor
Life by 72 h
Bake @ 90C
5% RH
Exceeding Floor Exceeding Floor
Life by >72 h
Life by 72 h
Bake @ 40C
5% RH
Exceeding Floor
Life by >72 h
5 hours
3 hours
17 hours
11 hours
8 days
2a
7 hours
5 hours
23 hours
13 hours
9 days
9 hours
7 hours
33 hours
23 hours
13 days
11 hours
7 hours
37 hours
23 hours
15 days
12 hours
7 hours
41 hours
24 hours
17 days
5a
16 hours
10 hours
54 hours
24 hours
22 days
18 hours
15 hours
63 hours
2 days
25days
2a
21 hours
16 hours
3 days
2 days
29 days
27 hours
17 hours
4 days
2 days
37 days
34 hours
20 hours
5 days
3 days
47 days
40 hours
25 hours
6 days
4 days
57 days
5a
48 hours
40 hours
8 days
6 days
79 days
48 hours
48 hours
10 days
7 days
79 days
2a
48 hours
48 hours
10 days
7 days
79 days
48 hours
48 hours
10 days
8 days
79 days
48 hours
48 hours
10 days
10 days
79 days
48 hours
48 hours
10 days
10 days
79 days
5a
48 hours
48 hours
10 days
10 days
79 days
96 hours
As above per package thickness andNot
moisture
applicable
As above
levelper package thickness andNot
moisture
applicable
level
Bake @ 40C
5% RH
Exceeding Floor
Life by 72 h
5 days
7 days
9 days
9 days
10 days
10 days
20 days
22 days
23 days
28 days
35 days
56 days
67 days
67 days
67 days
67 days
67 days
67 days
As above per package thickness and moisture level
Table 4-1 Reference Conditions for Drying Mounted or Unmounted SMD P

(User Bake: Floor life begins counting at time = 0 after bake)
ounted or Unmounted SMD Packages
= 0 after bake)
Package Body Thickness

1.4 mm
>1.4 mm
2.0 mm
>2.0 mm
4.5 mm
MSL Level
2, 2a, 3, 4, 5, 5a
Level
2
2a
3
4
5
5a
2
2a
3
4
5
5a
2
2a
3
4
5
5a
Exposure Time @ Temp/Humidity
Floor Life
Bake @ 125C
Bake @ 150C
7 hours
8 hours
16 hours
21 hours
24 hours
28 hours
18 hours
23 hours
43 hours
48 hours
48 hours
48 hours
48 hours
48 hours
48 hours
48 hours
48 hours
48 hours
Desiccator Time @ Relative
Bake
Humidity
Anytime
40C/85% RH
> floor life
30C/60% RH
>12 hrs
30C/60% RH
reset
NA
Table 4.1
reset
NA
Table 4.1
reset
NA
Table 4.1
2, 2a, 3
12 hrs
reset
4, 5, 5a
30C/60% RH
>8 hrs
30C/60% RH
reset
NA
Table 4.1
8 hrs
reset
10X exposure time

5% RH
Anytime
10% RH
NA
2, 2a, 3, 4, 5, 5a
2, 2a, 3
4, 5, 5a
2, 2a, 3
30C/60% RH
Cumulative time
floor life
30C/60% RH
pause
5X exposure time
10% RH
NA
NA
3 hours
4 hours
8 hours
10 hours
12 hours
14 hours
9 hours
11 hours
21 hours
24 hours
24 hours
24 hours
24 hours
24 hours
24 hours
24 hours
24 hours
24 hours
Bake @ 150C
3 hours
4 hours
8 hours
10 hours
12 hours
14 hours
9 hours
11 hours
21 hours
24 hours
24 hours
24 hours
24 hours
24 hours
24 hours
24 hours
24 hours
24 hours
Reset Shelf Life
Dry Pack
Dry Pack
Dry Pack
NA
Dry Pack
NA
NA
Table 4-2 Default Baking Times Used Prior to Dry-Pack that were Exposed to Conditions 60%
(Supplier Bake: MET = 24 h)
Table 4-3 Resetting or Pausing the Floor Life Clock at User Site
osed to Conditions 60% RH
Level
1
2
2a
3
4
5
5a
6
Floor Life (out of bag) at factory ambient 30C/60% RH or as stated

Unlimited at 30C/85% RH
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label.
Table 5-1 Moisture Classication Level and Floor Life
Package Type and

Body Thickness
Body Thickness 3.1 mm

including
PQFPs >84 pins, PLCCs
(square) All MQFPs
or
All BGAs 1 mm
Moisture Sensitivity Level
Level 2a
Level 3
Level 4
5%
10%
3
5
6
8
2
4
5
7
Level 4
Level 5
Level 5a
26
33
42
57
16
28
36
47
6
8
10
13
6
7
9
12
6
7
9
12
8
10
13
17
7
9
11
14
1
1
2
3
1
1
2
3
1
1
2
2
5
7
9
11
3
4
5
6
1
2
2
3
4
5
7
9
2
3
4
5
1
1
2
2
9
12
15
19
3
4
5
7
2
3
3
5
1
1
2
2
1
1
2
3
58
86
148
4
5
7
9
2
3
4
6
1
1
2
3
8
11
14
20
3
4
5
7
2
2
3
5
1
1
2
2
Level 3
32
41
53
69
1
1
2
4
Level 2a
44
60
78
103
1
2
3
5
Body Thickness <2.1 mm

including
SOICs <18 pins All TQFPs,
TSOPs or
All BGAs <1 mm body
thickness
94
124
167
231
2
3
4
6
1
2
3
4
Level 5a
60%
2
3
5
7
1
2
3
5
Level 5
50%
2
4
5
7
2
2
4
5
Body
Level 2a
2.1 mm Thickness
<3.1 mm
including
Level 3
PLCCs (rectangular)
18-32 pins
SOICs (wide body) SOICs 20
Level 4
pins, PQFPs 80 pins
40%
3
4
5
7
2
3
4
6
Level 5a
30%
3
4
5
7
2
3
5
7
Level 5
20%
7
10
13
18
12
19
25
32
7
13
18
26
2
3
5
6
7
9
12
17
3
5
6
8
1
2
3
4
7
9
12
15
3
4
5
6
2
2
3
4
1
1
2
2
30
39
51
69
6
8
10
13
2
3
4
6
2
2
3
4
1
1
2
2
22
28
37
49
5
7
9
12
2
3
4
5
1
2
3
4
1
1
2
2
17
28
5
7
10
13
2
3
4
6
1
2
3
4
1
1
2
2
70%
80% 90%
7
10
14
19
5
7
10
13
4
6
8
10
35C
30C
25C
20C
4
5
7
10
3
4
6
8
3
4
5
7
35C
30C
25C
20C
2
3
3
5
1
2
2
3
1
2
3
4
1
1
2
3
1
2
3
4
1
1
2
3
35C
30C
25C
20C
35C
30C
25C
20C
1
1
1
2
3
4
6
8
2
3
5
7
1
2
3
4
1
1
2
3
1
1
1
2
1
1
2
2
1
1
2
2
1
1
2
2
1
1
2
2
1
1
1
2
1
1
1
2
2
3
4
5
2
2
3
5
1
2
2
3
1
1
1
3
0.5
0.5
1
2
0.5
1
1
2
0.5
1
1
2
0.5
1
1
2
0.5
1
1
2
0.5
1
1
2
1
1
1
2
1
2
3
4
1
2
3
4
1
1
2
3
1
1
1
2
0.5
0.5
1
1
0.5
1
1
1
0.5
1
1
1
0.5
1
1
1
0.5
1
1
1
0.5
0.5
1
1
35C
30C
25C
20C
35C
30C
25C
20C
35C
30C
25C
20C
35C
30C
25C
20C
35C
30C
25C
20C
35C
30C
25C
20C
35C
30C
25C
20C
35C
30C
25C
20C
35C
30C
25C
20C
35C
30C
25C
20C
35C
30C
25C
20C
Table 7-1 Recommended Equivalent Total Floor Life (days) @ 20C, 2
For ICs with Novolac, Biphenyl and Multifunctional Epoxies (Reow a
at which the component was classied) Maximum Percent Relative H
nt Total Floor Life (days) @ 20C, 25C & 30C, 35C
d Multifunctional Epoxies (Reow at same temperature
ied) Maximum Percent Relative Humidity

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Level

Dry Before Bag

MBB With HIC

Indication at 65% RH Environment

As above per package thickness and moisture level

Table 4-1 Reference Conditions for Drying Mounted or Unmounted SMD P

ounted or Unmounted SMD Packages

Package Body Thickness

10X exposure time

(Supplier Bake: MET = 24 h)

osed to Conditions 60% RH

Floor Life (out of bag) at factory ambient 30C/60% RH or as stated

Table 5-1 Moisture Classication Level and Floor Life

Package Type and

Body Thickness 3.1 mm

Moisture Sensitivity Level

Body Thickness <2.1 mm

Table 7-1 Recommended Equivalent Total Floor Life (days) @ 20C, 2

For ICs with Novolac, Biphenyl and Multifunctional Epoxies (Reow a

at which the component was classied) Maximum Percent Relative H

nt Total Floor Life (days) @ 20C, 25C & 30C, 35C

d Multifunctional Epoxies (Reow at same temperature

ied) Maximum Percent Relative Humidity

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