PROBLEM 9.

7
KNOWN: Large vertical plate with uniform surface temperature of 130C suspended in quiescent air
at 25C and atmospheric pressure.
FIND: (a) Boundary layer thickness at 0.25 m from lower edge, (b) Maximum velocity in boundary
layer at this location and position of maximum, (c) Heat transfer coefficient at this location, (d)
Location where boundary layer becomes turbulent.
SCHEMATIC:


ASSUMPTIONS: (1) Isothermal, vertical surface in an extensive, quiescent medium, (2) Boundary
layer assumptions valid.
PROPERTIES: Table A-4, Air ( ) ( )
T T T / 2 350K, 1 atm :
f s
= + =

=20.92 10
-6
m
2
/s, k =
0.030 W/mK, Pr =0.700.
ANALYSIS: (a) From the similarity solution results, Fig. 9.4 (see above right), the boundary layer
thickness corresponds to a value of 5. From Eqs. 9.13 and 9.12,
( )
1/ 4
y x Gr / 4
x

= (1)
( ) ( )
( )
2
m 1
3 2 3 6 2 9 3
Gr g T T x / 9.8 130 25 K x / 20.92 10 m / s 6.718 10 x
x s
2
350K
s


= = =

(2)
( ) ( )
1/ 4
3 9 2
y 5 0.25m 6.718 10 0.25 / 4 1.746 10 m 17.5 mm.

= =


(3) <
(b) From the similarity solution shown above, the maximum velocity occurs at 1 with
( ) f 0.275. = From Eq. 9.15, find
( ) ( )
6 2 1/ 2
2 2 20.92 10 m /s
3 1/2 9
u Gr f 6.718 10 0.25 0.275 0.47 m/s.
x
x 0.25m

= = =


<
The maximum velocity occurs at a value of =1; using Eq. (3), it follows that this corresponds to a
position in the boundary layer given as
( ) y 1/5 17.5 mm 3.5 mm.
max
= = <
(c) From Eq. 9.19, the local heat transfer coefficient at x =0.25 m is
( ) ( ) ( )
1/ 4
1/ 4 3 9
Nu h x/k Gr / 4 g Pr 6.718 10 0.25 / 4 0.50 35.7
x x x

= = = =




2
h Nu k/x 35.7 0.030 W/m K/0.25 m 4.3 W/m K.
x x
= = = <
The value for g(Pr) is determined from Eq. 9.20 with Pr =0.700.
(d) According to Eq. 9.23, the boundary layer becomes turbulent at x
c
given as
( )
1/3
9 9 9
Ra Gr Pr 10 x 10 / 6.718 10 0.700 0.60 m.
x,c x,c c

= =


<
COMMENTS: Note that =1/T
f
is a suitable approximation for air.
PROBLEM 9.17

KNOWN: Dimensions of vertical plate. Plate and ambient temperatures.

FIND: Preferred orientation to minimize convective heat transfer and convective heat transfer rate for
that orientation.

SCHEMATIC:










ASSUMPTIONS: (1) Steady-state conditions, (2) Constant properties, (3) Ideal gas, (4) Quiescent
environment.

PROPERTIES: Table A.4, air ( 60 C T = = 333 K): v =19.2110
-6
m
2
/s, =27.410
-6
m
2
/s, Pr =
0.702, k =0.0287 W/mK.

ANALYSIS: Note that the maximum value of the Rayleigh number is associated with Orientation B.


3 2 3
6
max
6 2 6 2
( ) 9.81m/s (1/333K) (100 20) C (0.5m)
560 10
19.21 10 m /s 27.4 10 m /s
s
g T T L
Ra





= = =



Since the maximum Rayleigh number is less than Ra
x,c
=10
9
, flow conditions are laminar for both
orientations. Hence, to minimize heat transfer from the plate, we wish to maximize the thickness of the
boundary layer and therefore maximize the plate length in the vertical direction. Therefore, Orientation
B is preferred. <

Selecting Eq. 9.27,

1/4
4/9
9/16
6 1/4
4/9 2
9/16
0.67
0.68
1 (0.492/ )
0.0287 W/(m K) 0.67 (560 10 ) W
= 0.68 4.57
0.5m m K
1 (0.492/0.702)
L
k Ra
h
L
Pr


= +

+



+ =

+


and

2
( ) 4.57W/m K (0.25m 0.50m) (100 20) 45.7 W
s
q hA T T C

= = = <

COMMENTS: 1. For Orientation A, Ra =7 10
7
, 5.48 h = W/m
2
K and q =54.8 W. Although the
Rayleigh and Nusselt numbers are smaller for Orientation A, the length scale in the Nusselt number is
half that of Orientation B, leading to an overall increase in the convection coefficient and heat transfer
rate. 2. Radiation heat transfer will be significant.
g
Orientation A
Orientation B
T
s
T
s
=100C
T

=20C
0.5 m
0.25 m
PROBLEM 9.29
KNOWN: Vertical circuit board dissipating 5W to ambient air.

FIND: (a) Maximum temperature of the board assuming uniform surface heat flux and (b)
Temperature of the board for an isothermal surface condition.

SCHEMATIC:


ASSUMPTIONS: (1) Either uniform
s
q or T
s
on the board, (2) Quiescent room air.

PROPERTIES: Table A-4, Air (T
f
=(T
L/2
+T

)/2 or (T
s
+T

)/2, 1 atm), values used in

iterations:

Iteration T
f
(K) 10
6
(m
2
/s) k10
3
(W/mK) 10
6
(m
2
/s) Pr

1 312 17.10 27.2 24.3 0.705
2 324 18.30 28.1 26.1 0.704
3 319 17.80 27.7 25.3 0.704
4 320 17.90 27.8 25.4 0.704

ANALYSIS: (a) For the uniform heat flux case (see Section 9.6.1), the heat flux is

s L /2 L /2 L /2
q h T where T T T

= = (1,2)

and ( )
2 2
s s
q q/ A 5W/ 0.150m 222W/ m . = = =

The maximum temperature on the board will occur at x =L and from Eq. 9.28 is
( )
1/5
x L /2
T 1.15 x/ L T = (3)


L max L / 2
T T T 1.15 T .

= = +

The average heat transfer coefficient h is estimated from a vertical (uniform T
s
) plate
correlation based upon the temperature difference T
L/2
. Recognize that an iterative
procedure is required: (i) assume a value of T
L/2
, use Eq. (2) to find T
L/2
; (ii) evaluate the
Rayleigh number


3
L L /2
Ra g T L / = (4)

and select the appropriate correlation (either Eq. 9.26 or 9.27) to estimate h; (iii) use Eq. (1)
with values of h and T
L/2
to find the calculated value of
s
q ; and (iv) repeat this procedure
until the calculated value for
s
q is close to
s
q =222 W/m
2
, the required heat flux.

Continued
PROBLEM 9.29 (Cont.)

To evaluate properties for the correlation, use the film temperature,
( )
f L /2
T T T / 2.

= + (5)
Iteration #1: Assume T
L/2
=50C and from Eqs. (2) and (5) find
( ) ( )
L f
/2
T 50 27 C 23 C T 50 27 C/ 2 312K. = = = + =
o o o

From Eq. (4), with =1/T
f
, the Rayleigh number is
( ) ( )
( ) ( )
2 6 2 6 2 6 3
L
Ra 9.8m/ s 1/ 312K 23 C 0.150m / 17.10 10 m / s 24.3 10 m / s 5.868 10 .

= =
o

Since
9
L
Ra 10 , < the flow is laminar and Eq. 9.27 is appropriate

( )
L
1/4
L
4/9
9/16
0.670Ra
hL
Nu 0.68
k
1 0.492/ Pr
= = +

+



( )
( )
1/ 4 4/ 9
6 2 9/16
L
0.0272W/ m K
h 0.68 0.670 5.868 10 / 1 0.492/ 0.705 4.71W/ m K.
0.150m

= + + =






Using Eq. (1), the calculated heat flux is

2 2
s
q 4.71W/ m K 23 C 108W/ m . = =
o

Since
s
q <222 W/m
2
, the required value, another iteration with an increased estimate for
T
L/2
is warranted. Further iteration results are tabulated.

Iteration T
L/2
(C) T
L/2
(C) T
f
(K) Ra
L

( )
2
h W/ m K
( )
2
s
q W/ m

2 75 48 324 1.02610
7
5.57 268
3 65 38 319 8.74910
6
5.29 201
4 68 41 320 9.32110
6
5.39 221

After Iteration 4, close agreement between the calculated and required
s
q is achieved with
T
L/2
=68C. From Eq. (3), the maximum board temperature is

( )
L max
T T 27 C 1.15 41 C 74 C. = = + =
o o o
<

(b) For the uniform temperature case, the procedure for estimation of the average heat transfer
coefficient is the same. Hence,

s
s L /2 q
T T 68 C.

= =
o
<
COMMENTS: In both cases, q =5W and
2
h 5.38W/ m . = However, the temperature
distributions for the two cases are quite
different as shown on the sketch. For
s
q =
constant, T
x
~x
1/5
according to Eq. 9.28.

PROBLEM 9.45
KNOWN: Diameter, thickness, emissivity and initial temperature of silicon wafer. Temperature of
air and surrounding.

FIND: (a) Initial cooling rate, (b) Time required to achieve prescribed final temperature.

SCHEMATIC:



ASSUMPTIONS: (1) Negligible heat transfer from side of wafer, (2) Large surroundings, (3) Wafer
may be treated as a lumped capacitance, (4) Constant properties, (5) Quiescent air.

PROPERTIES: Table A-1, Silicon (T =187C =460K): =2330 kg/m
3
, c
p
=813 J /kgK, k =87.8
W/mK. Table A-4, Air (T
f,i
=175C =448K): =32.15 10
-6
m
2
/s, k =0.0372 W/mK, =46.8
10
-6
m
2
/s, Pr =0.686, =0.00223 K
-1
.

SOLUTION: (a) Heat transfer is by natural convection and net radiation exchange from top and
bottom surfaces. Hence, with A
s
=D
2
/4 =0.0177 m
2
,


( )( )
( )
4 4
s t b i sur
i
q A h h T T 2 T T

= + +




where the radiation flux is obtained from Eq. 1.7, and with L =A
s
/P =0.0375m and Ra
L
=g (T
i
-
T

) L
3
/ =2.30 10
5
, the convection coefficients are obtained from Eqs. 9.30 and 9.32. Hence,


( )
1/ 4 2
t
L
k 0.0372W/ m K 11.8
h 0.54Ra 11.7W/ m K
L 0.0375m

= = =


( )
1/5 2
b L
k 0.0372W/ m K 6.14
h 0.52Ra 6.1W/ m K
L 0.0375m

= = =

( ) ( )
( )
2 2 8 2 4 4 4 4
q 0.0177m 11.7 6.1 W/ m K 300K 2 0.65 5.67 10 W/ m K 598 298 K

= + +




( )
2 2
q 0.0177m 5350 8845 W/ m 251W

= + =


<

(b) From the generalized lumped capacitance model, Eq. 5.15,


( )( )
( )
4 4
s t b sur s
dT
cA h h T T 2 T T A
dt

= + +





( )( )
( )
4 4
t b sur
T t
Ti 0
h h T T 2 T T
dT dt
c

+ +

=






Continued ..
PROBLEM 9.45 (Cont.)

Using the DER function of IHT to perform the integration, thereby accounting for variations in
t
h and
b
h with T, the time t
f
to reach a wafer temperature of 50C is found to be

( )
f
t T 323 K 179 s = = <
































As shown above, the rate at which the wafer temperature decays with increasing time decreases due to
reductions in the convection and radiation heat fluxes. Initially, the surface radiative flux (top or
bottom) exceeds the heat flux due to natural convection from the top surface, which is twice the flux
due to natural convection from the bottom surface. However, because
rad
q

and
cnv
q

decay
approximately as T
4
and T
5/4
, respectively, the reduction in
rad
q

with decreasing T is more

pronounced, and at t =181s,
rad
q

is well below
cnv,t
q

and only slightly larger than

cnv,b
q

.

COMMENTS: With ( )
( )
2 2 2
r,i i sur i sur
h T T T T 14.7W/ m K, = + + = the largest cumulative
coefficient of
2
tot r,i t,i
h h h 26.4W/ m K = + = corresponds to the top surface. If this coefficient is
used to estimate a Biot number, it follows that ( )
4
tot
Bi h / 2 / k 1.5 10 1

= = and the lumped
capacitance approximation is excellent.

0 20 40 60 80 100 120 140 160 180 200
Time, t(s)
25
75
125
175
225
275
325
W
a
f
e
r

t
e
m
p
e
r
a
t
u
r
e
,

T
(
C
)
0 20 40 60 80 100 120 140 160 180 200
Time, t(s)
0
500
1000
1500
2000
2500
3000
3500
4000
4500
S
u
r
f
a
c
e

h
e
a
t

f
l
u
x
e
s
,

q
'
'
(
W
/
m
^
2
)
Natural convection from top surface
Natural convection from bottom surface
Radiation from top or bottom surface