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SPM

MODULE DESIGN GUIDE


fairchildsemi.com
3
3
u
F
35
V
Z
24V
0
.5W
3
3
u
F
3
5
V
Z
24V
0.5W
3
3
u
F
3
5
V
Z
24V
0
.5W
Z2
4V
0.5
W
2
20
u
F
35
V
101
101
101
101
101
101
101
472
To Motor
Snubber
Capacitor
Power Source Copper
NW
U
V
W
P
VS ( W)
VCCL
VFO
CSC
R TH
COM
VIN ( WL )
VIN ( VL )
VIN ( UL )
VCCH
VIN ( WH )
VIN ( VH )
VIN ( UH )
NV
NU
VTH
VB ( W)
VS ( V)
VB ( V)
VS ( U)
VB ( U)
+

182
Shunt
Resistor
N
P
Main
Electrolytic
Capacitors
Connect signal GND and power
GND at only one point.
Dont make a loop in GND pattern.
Wiring between N
U
, N
V
, N
M
,
and the shunt resistor should
be as short as possible.
Use a plane to minimize the
impedance between the shunt
resistor and DC bus capacitors.
C
SC
wiring should be
short and begin from
the shunt resistor.
Connect C
SC
filters
capacitor to signal GND
(not to power GND).
The V
IN
RC filters need to
be placed close to SPM.
Capacitors between V
CC
and signal GND should
be placed close to SPM.
The V
IN
RC filters should
be placed close to SPM.
Isolation distance is
required among different
voltage potentials.
Capacitor and Zener
diode should be located
closely to terminals.
Use a plane to minimize the
impedance between the shunt
resistor and DC bus capacitors.
Place a snubber capacitor
between P and N terminals
and very close to SPM.
The main electrolytic
capacitors should be
placed very close to SPM.
Power GND
Copper
V
S
HVIC
LVIC
COM
V
DC
V
CC
( L)
V
B V
CC
( H)
V
B
VS
V
CC
IN( L)
IN( L)
V
CC
C
BS
C
VCC
D
BS
( Include R
BS )
COM
V
CC
COM
IN( H)
IN( H)
ON
OFF H
O
L
O
V
SL
Motion SPM


M
3
Ls1
Ls2 iGL
iO
VLS1
VSR1
VLS2
+
-
-
-
+
+
Q1
D1
Q2
D2
Ls3
Ls4
VLS3 + -
Ls5
R
SHUNT GND Noise
Measurement Points
31.58 V
5.94 V
GND Noise_5 V/Div
Phase Current (V)_5 A/Div
DC Link Current_5 A/Div
Surge Voltage @ Ls1 + Ls2 + Ls4 = 35 nH
Surge Voltage @ Ls1 + Ls2 + Ls4 = 120 nH
GND Noise_20 V/Div
DC Link Current_5 A/Div
100 ns/Div
100 ns/Div
Phase Current (V)_5 A/Div
Fairchild Semiconductor has the integrated and discrete devices for your consumer and industrial motor control
applications. Our solutions deliver high integration, power efciency, system reliability and functionality while
reducing engineering development time.
Typical Application Board Design Guide
Achieve High Efciency and System Reliability with These Design Guidelines
Recommendations for better board design that provide signicant reduction in electrical over-stress (EOS), consequently
achieving improved system reliability without sacricing efciency.
Minimized stray inductance (Ls1 + Ls2 + Ls4) can reduce ground noise (surge voltage)
Non-inductive resistor should be used for shunt resistor
Connect the power ground terminal with the signal ground at a single point, using non-loop ground pattern
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or their respective owners. For a listing of Fairchild Semiconductor trademarks and related
information, please see: www.fairchildsemi.com/legal
Lit. No.100055-001 2012 Fairchild Semiconductor. All Rights Reserved.
High-Efciency Motor Drive Solution SPM Module Real Size Package Reference
Dimensions (mm x mm) Features Packages 1:1 Ratio
SPM 5 Series (29 x 12 x 3.1)
Substrate: Full-pack
Lead Options: Different
lead options available
500 V/250 V
UVLO, BSD, TSU
MOSFETs solution
SPM5P-022 SPM5Q-023 SPM5N-023
SPM 45 Series (39 x 23 x 4.5)
Substrate: Ceramic
Lead Options: Different
lead options available
600 V, 5-20 A
NTC, UVLO, OCP, BSD
IGBTs solution
PFC SPM solution is
also available
in SPM 45 package
SPMAA-A26
SPM 3 Series (44 x 26.8 x 5.5)
Substrate: DBC, full-pack
600 V, 5-30 A
UVLO, OCP, BSD, TSD
IGBTs solution
PFC SPM solution
is also available
in SPM 3 package
SPMCA-027 SPMJA-027
SPM 2 Series (60 x 31 x 7.2)
Substrate: DBC
600 V, ~75 A
NTC, UVLO, OCP
Current sensing
with sensing IGBTs
IGBTs solution
PFC SPM solution is
also available in
SPM 2 package
SPMCA-B33
SPM 1 Series (96 x 55 x 7.2)
Substrate: DBC
600 V, ~75 A
NTC, UVLO, OCP
IGBTs solution
PFC and inverter
merged solution
is also available in
SPM 1 package
S40CD-040
Description of Integrated Functions in SPM Solution - BSD: Boot Strap Diode, OCP: Over Current Protection, TSD: Thermal Shut Down,
TSU: Thermal Sensing Unit, NTC: Negative Temperature Coefcient Thermistor
For data sheets, application notes, samples and more, please visit: www.fairchildsemi.com/applications/motor-control/

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