Kevin M.

Walsh, PhD
ECE543
Overview of Microtechnology
and MEMS
1
BACKGROUND -MEMS definition,
introduction, history, market survey, and
references
MATERIAL ISSUES
uFAB and uMACHINING PROCESSES
APPLICATIONS and EXAMPLES
CLEANROOM CONSIDERATIONS
FUTURE DIRECTIONS
Outline
2
Micro-Electro-Mechanical Systems (MEMS) is the
integration of mechanical elements, sensors, actuators, and
electronics on a common substrate through the utilization of
microfabrication technology or microtechnology.
So what exactly is MEMS?
3
Micromachining formally refers to the bulk
anisotropic etching of crystalline silicon using
traditional batch fabrication techniques.

Micromachining informally refers to the complete
combination of processing technologies used to
fabricate miniature MEMS-based devices and systems,
such as LOC systems.
and how about micromachining?
source: Sandia NL
Source: UofL
Source: UofL
4
MEMS and Micro-
machining Examples
pressure sensors
accelerometers
flow sensors
inkjet printers
deformable mirror devices
gas sensors
micromotors
microgears
lab-on-a-chip systems (LOC)
5
MEMS - the next evolutionary step on the microtechnology
ladder.
Microtechnology - refers to the miniaturization technology
that was originally developed for the fabrication of electronic
integrated circuits (ICs)
MEMS - resulted when microtechnology was applied to the
production of devices, structures, and systems that were
more than just electronic in functionality (1980)
Source: UW
Source: UofL
6
USA - MEMS (micro-electro-mechanical systems)

[name officially adopted in 1989 by a group of 80 researchers at Salt
Lake City for the Micro-Tele-Operated Robotics Workshop]

Europe - MST (micro-systems technology)

Japan - Micromachines
A ROSE is a rose !!
7
Why use micromachining?
miniaturization
cost/performance advantages (due to batch fabrication)
integration with electronics
faster devices (speed usually scales with size)
lower power consumption
improved accuracy, reliability, and reproducibility
new effects and products due to miniaturization/microfab

8
MEMS/Micromachining Texts
Micromechanics and MEMS: Classic and Seminal Papers to 1990 by W.
Trimmer (editor)
Micromachined Transducers Sourcebook by G. Kovacs
Fundamentals of Microfabrication by Marc J. Madou
Microsensors by Richard S. Muller, Roger T. Howe, Stephen D.
Senturia, R. Smith (editors)
An Introduction to MEMS Engineering by Nadim Maluf
Silicon Micromachining by Elwenspoek and Jansen
MEMS WWW Bookstore: http://mems.isi.edu/bookstore/
Handbook of Microlithography, Micromachining and
Microfabrication (Vol. 2) by P. Rai-Choudhury (editor)
9
MEMS/Micromachining Journals
Sensors and Actuators by Elsevier Science, Netherlands

Journal of MEMS by ASME and IEEE, USA

Sensors Magazine by Helmers Publishing, USA

Journal of Micromechanics and Microengineering by Institute of
Physics, United Kingdom

Micromachine Devices, a companion to R&D Magazine, by Cahners
Business Information, USA

IEEE Sensors Journal by IEEE, USA (new)
10
Dedicated MEMS/Micromachining Issues
Forbes ASAP, April 2, 2001

MRS Bulletin, Vol. 26, No. 4, April 2001

Proceedings of the IEEE, August 1998
Microengineering and MEMS by Dr. Daniel Banks
http://www.dbanks.demon.co.uk/ueng/

UofL MEMS Resources
http://mitghmr.spd.louisville.edu/mems_links.html

MEMS Clearinghouse http://mems.isi.edu/

MEMS Exchange - http://www.mems-exchange.org/

Various LOC Web Sites
Dedicated MEMS/Micromachining Web Sites
11
Traditional Microelectronic Fabrication Texts
Semiconductor Devices: Physics and Technology by S. M. Sze

Semiconductor Integrated Circuit Processing Technology by W. R.
Runyan and K. E. Bean

Introduction to Microelectronic Fabrication by Richard C. Jaeger

Silicon Processing for the VLSI Era: Volume 1 Process Technology
by S. Wolf and R. N. Tauber

The Science and Engineering of Microelectronic Fabrication by S.
A. Campbell (includes a chapter on MEMS)

Modern Semiconductor Fabrication Technology by P. Gise and R.
Blanchard

Microchip Fabrication by Peter Zant
12
MEMS
evolved from the Microelectronics Revolution
I C I ndustry Timeline
1999
10 million transistors
1947
single transistor
1958
first IC
History
13
MEMS Timeline
1980
2030
1999
(1.3 million micro-mirrors)
TI DMD
?
Bulk micromachined
pressure sensor
14
The Opportunity for MEMS Technology
15
MEMS compared to ICs
Source: Madou
2001 $14B (5% of IC market) $300B
2009
$100B
Source: Forbes
- 2000 BMW 740i has over 70 MEMS sensors -
16
MEMS Sectors and Forecast
Source:
Maluf
17
MEMS Technology: Materials Issues
Source: Madou
18
MEMS Technology: Materials Issues
Source: Madou
19
The MicroTechnology/MEMS Tool Set
cleanroom plus microfab processes
+
So, youre interested in MEMS; what do you need?
20
Standard IC Processes
Source:
CWRU
Source: Jaeger
1
2
3
21
Standard IC Processes
Sputtering
Evaporation
Thermal Oxidation
CVD (chemical vapor deposition)
Spinning
Epitaxy
(1) Deposit/Grow Thin Films
oxidation
spinning
sputtering sputtering
22
Standard IC Processes
Photolithography
Etching Techniques (wet, dry/RIE)
(2) Pattern Thin Films
RIE system
photolithography
patterned wafer
23
thermal diffusion
ion implantation
(3) Introduce Dopants - to form electrically-active
regions for resistors, diodes, transistors, etc.
thermal diffusion furnaces
solid source doping
Standard IC Processes
24
Example of Deposition
Thermal Oxidation
dry oxide slower growth, denser, better quality
wet oxide faster growth rate (~10x)
MEMS applications barrier masks for etching
and doping, dielectrics for devices
dry
wet
Source:
Jaeger
dry oxidation
25
Oxidation Kinetics
Source: Jaeger
Wet oxidation is faster because water
vapor has a higher solubility in
silicon dioxide than gaseous oxygen
(i.e larger N
0
in graph to right and
therefore larger flux, J)
26
Dry Oxidation
Source: Sze
note crystal orientation dependence
(111) Si has highest packing density
27
Wet Oxidation
Source: Sze
28
Techniques for Determining Oxide Thickness
Source: Campbell
ellipsometry laser polarization technique (expensive)
profilometry mechanical stylus technique (requires a step)
color chart - inexpensive
29
Sputtering
Thin film deposition technique in which energetic ions, typically Ar
+
,
bombard a target and displace atoms which are then transported to the
wafer surface, where deposition occurs. Both conductive and insulating
materials can be sputtered.
Source: Jaeger
30
Evaporation
Thin film deposition technique in which material is evaporated
from a solid source in a high vacuum environment using thermal
or e-beam energy.
Source: Sze (Semi Sensors)
31
Comparison of Evaporation and
Sputtering Deposition
Source: Gise
32
Spinning
Thin film deposition technique used for polymers (such as
photoresists), spin-on dopants and SOG (spin-on glass). Low
cost capital equipment $5-10K.
Source: Sze (Semi Sensors)
33
a) oxidation
b) spin resist
c) align/expose
d) develop
e) oxide etch (wet
or dry/RIE)
f) strip resist
g) patterned oxide
Photolithography
Source:
Jaeger
Thin Film Patterning
Typical Photolithographic
Steps
34
Photoresist Types
Source:
Zant
positive better resolution, less
pinholes, liftoff compatible
negative faster exposure, better
adhesion, cheaper
IR mask aligner
35
Other Photolithographic Issues
photomask polarity light or dark field
photoresist polarity positive or negative
etch vs liftoff
aligners - contact vs proximity vs projection (steppers)
aligners frontside vs backside (IR)
non-optical lithography e-beam, x-ray, soft
IR mask aligner
Liftoff
36
Example of Impurity Doping
Thermal Diffusion
liquid, solid, or gaseous dopant sources
highest doping concentration at surface
high temp process oxide masks
deep junction depths possible
MEMS applications piezoresistive
elements and p+ etch stops
Source:
Jaeger
diffusion furnaces
37
Source:
Jaeger
Thermal Diffusion Process
MEMS applications piezoresistive elements and p+ etch stops
38
Example of Impurity Doping
Ion Implantation
Source:
Jaeger
39
Ion Implantation
precise control of doping profile (through specie, dose, energy)
low temp process (can use resist as mask)
buried peak concentrations
expensive capital equipment
MEMS applications piezoresistive elements, p+ etch stops, SIMOX
Source: Jaeger
Source: Sze
40
Micromachining Processes
Source: Maluf
41
Micromachining Processes
subtractive (etching) process
wet vs dry etching
isotropic vs anisotropic etching
Bulk Micromachining
42
Typical Micromachining
Etch Profiles
Source: Maluf
RIE
RIE - reactive ion etch
43
Using (100) silicon wafer with SiO2 mask
Bulk Micromachining
44
Typical Bulk Micromachining
Etching Setup
45
Bulk Micromachining
using (100) silicon
Examples
Source: Maluf
Source: Madou
46
Bulk Micromachining Rules for (100) Si Rule 1
Features misaligned to the <110> wafer flat will be undercut
Source: UofC 47
Source: Elwenspoek
Bulk Micromachining Rules for (100) Si Rule 1b
Any feature will eventually result in the largest inverted pyramidal
rectangular pit that can be circumscribed around that feature
48
Source: Ristic
Bulk Micromachining Rules for (100) Si Rule 1b
Any feature will eventually result in the largest inverted pyramidal
rectangular pit that can be circumscribed around that feature
Source: UofL
49
Bulk Micromachining Rules for (100) Si Rule 2
Convex (outside) corners will be undercut due to fast-etching
exposed secondary planes
Source: Elwenspoek
50
Source: Ristic
Source: Ristic
Source: Ristic
Source: Wise
51
Micromachining Processes
Bulk Micromachining Corner Compensation
Source: Maluf Source: UofL
Technique for minimizing corner erosion by adding
additional mask features at the corners. Can result in near
perfect mesa structures.
52
Isotropic
HNA (hydroflouric, nitric and acetic acid)
also called poly-etch
Most Popular Silicon Bulk
Micromachining Wet Etchants
Anisotropic
Potassium Hydroxide (KOH)
EDP
Hydrazine
TMAH
53
Comparison of Silicon Micromachining Etchants
Source: Maluf
54
Etchants for Other MEMS Thin Films
Source: Maluf
55
Micromachining software
ACES PC based Micromachining Simulation Software
(http://galaxy.ccsm.uiuc.edu/aces/)
56
(a)
(b)
(c)
(d)
(e)
(f)
(g)
(h)
Micromachining Processes
Timed etch stop
Boron (p+) etch stop
Electrochemical (pn junction) etch stop
Buried oxide etch stop (BESOI, SIMOX)
Bulk Micromachining Etch Stop Techniques
57
Micromachining Processes
Boron (p+) Etch Stop Technique
Source: Sze (Semiconductor Sensors)
58
Boron (p+) Etch Stop Examples
Source: Sze (Semi Sensors)
59
Boron (p+) Etch Stop Examples
Source: Kovacs
60
Micromachining Processes
Electrochemical (pn junction) Etch Stop Technique
Source: Kovacs
61
Electrochemical Etch Stop Example
Source: Kovacs
Source: Maluf
62
Micromachining Processes
Similar to electrochemical etch stop process except the
p+ region is replaced with a buried oxide layer, which
functions as an etch stop to most anisotropic etchants.
Bonded and Etched-back Silicon On Insulator (BESOI)
Separation by Ion Implantation of Oxygen (SIMOX)
Requires no voltage bias.
Buried Oxide Etch Stop Technique
Source: Kovacs
oxide
63
Micromachining Processes
additive process
structural & sacrificial layers
Surface Micromachining
Source: Sandia
64
MUMPS (Cronos)
SAMPLES (Sandia)
Surface Micromachining Process
Source: Sze (Semi Sensors)
MEMS Foundries
65
Micromachining Processes
glass-Si anodic bonding
si-si fusion bonding (SFB)
eutectic bonding
low temp glass bonding
thermal compression
Wafer-Level Bonding
Source: EV
Source: Maluf
Source: UofL
66
glass-Si field assisted bonding technique
requirements
similar TCEs (Corning 7740)
clean & smooth surfaces
<1um rms roughness
slightly conductive glass
elevated temperature (200-500C)
high voltage (200-1000V)
Anodic or Electrostatic (ES) Bonding
Source: Sze
Source: UofL
67
Silicon Fusion Bonding (SFB)
Source: Sze
(Semi Sensors)
hydrophilic
surfaces
68
Micromachining Processes
Single Crystal Reactive
Etching and Metalization
CMOS compatible
used by EG&G IC for
accelerometers
20-30 um depth limit
SCREAM
Source: Maluf
Source: Elwenspoek
69
Micromachining Processes
high density ICP plasma
high aspect ratio Si structures
cost: $500K
vendors: STS, Alcatel, PlasmaTherm
Deep Reactive Ion Etching (DRIE)
Source: LucasNova
Source: AMMI Source: STS
Source: STS
70
DRIE Etching Process Gas Cycling
Source:
Kovacs
71
Micromachining Processes
electroless plating and electroplating
techniques for producing thick films
thick patterned resists used as molds
Plating
Source: Carl Suss
Copper
structures
72
Micromachining Processes
uses x-ray lithography (PMMA resist), electrodeposition and molding to
produce very high aspect ratio (>100) micro-structures up to 1000 um tall
(1986)
LIGA (lithographie, galvanoformung, abformtechnik)
Source: Madou
Source: Kovacs 73
Micromachining Processes
uses optical epoxy negative-resist developed by IBM to produce high
aspect ratio micro-structures (1995)
Poor Mans LIGA
Source: Maluf
UofL Micro-reaction wells: 150 um wide,
120 um tall, 50 um wall thickness
74
Ultra- High-Precision Micromilling
and Microdrilling
Vibration isolated
1 ton block of granite
Hydraulic suspension system
Computer-controlled laser-guided
positioning system
Air bearings
X-Y stage resolution < 10 nm
Z-axis resolution >50 nm
(Linear Encoder)
Spindle speed = 20,000 rpm
G-code programming language
Tools High Speed Tool Steel or Tungsten
Carbide

Source: Dover Instruments
75
Materials Micro-milled/drilled
Plastics:
PMMA (Top), Lexan,
Teflon, nylon, Epoxy, etc.
Metals:
Molybdenum (Bottom),
aluminum, copper,
stainless steel, mild steel,
gold, titanium, tantalum,
tungsten, graphite, etc.
Others:
PZT, silicon, Pyrex.

Source: Dover Instruments
76
bulk micromachining
silicon fusion bonding (SFB)
DRIE
Combining uMachining
Processes
Source: LucasNova
Source: Maluf
77
Micromachining Tricks
Source: Kovacs
78
Other Micromachining Processes
Chemical Vapor Deposition (CVD, LPCVD, PECVD)
Epitaxy
Vapor Phase Etching xenon diflouride non-plasma
isotropic dry etch
Laser Machining laser ablation process for primarily
polymers
Porous Silicon Formation
Chemical Mechanical Polishing (CMP)
Micro-embossing and Micro-stamping
Inkjet Printing
Soft Lithography with SAMs
79
MEMS Examples
Conventional Pressure Sensor
Source: Maluf
80
MEMS Examples
Conventional Pressure Sensor
Source: NovaSensor
0
10
20
30
40
50
60
0 20 40 60 80 100 120
Pressure (PSI)
O
u
t
p
u
t

V
o
l
t
a
g
e

(
m
V
)
UofL uFab Course Sensors
81
MEMS Examples
Conventional Pressure Sensor Packaging
Source: Madou
82
MEMS Examples
Pressure Sensor (ultra-miniature)
Source: NovaSensor
83
MEMS Examples
Pressure Sensor (ultra-miniature)
Source: UofL
84
MEMS Examples
Accelerometers
Source: UofL
85
MEMS Examples
Accelerometers
Sources: Analog Devices, Lucas NovaSensor, and EG&G IC Sensors
86
MEMS Examples
Flow Sensors
Source: UofL
87
MEMS Examples
Gas Sensors MicroMotors
Source: UofL
Source: Berkeley
88
MEMS Examples
Inkjet Technology side shooter
Source: Elwenspoek
(Microsensor)
89
MEMS Examples
Inkjet Technology top shooter
Source: Maluf 90
MEMS Examples
Micromotors
Source: MIT and Berkeley
91
MEMS Examples
Micro-structures using LIGA
Source: UW
92
MEMS Examples
Micro-Grippers
Source: Berkeley
93
MEMS Examples
Micro-Tweezers
Source: MEMS Precision Instruments
94
MEMS Examples
Neural Probes
Source: Mich (K. Wise) 95
MEMS Examples
Neural Interface Chip
Source: Stanford
96
MEMS Examples
Lab-on-a-Chip Systems
Source: Caliper
separation
dilution
mixing and dispensing
analysis
Source: Maluf
97
UofL NSF Lab-on-a-Chip Project
GOAL
Develop true portable microchip analysis systems
with electrochemical detection for broad practical
use
BACKGROUND
Current microanalysis devices with laser induced
fluorescence detection are successful but are neither
fully micro nor fully integrated
Electrodes can be fabricated directly on a microchip
in almost any size, shape, location, or composition
RESULTS
Developed portable electronics for CE/EC device
Fabricated and tested working CE/EC micro-chips
Modeled microfluidic flow using MEMCAD
TECHNOLOGICAL IMPACT
Produce self-contained lab-on-a-chip instruments
that fully utilize microfabrication technology for
optimum miniaturization, structural sophistication,
and ease of construction
Identify and define optimum chip configuration

Portable Electronics, Data
Acquisition and Display Unit
Disposable Micro-CE/EC
Plug- In Module
Micromachined Glass
Wafer
Microfabricated Glass Substrate
with Patterned Electrodes
Electrical Connections
Sample Inlet Reservoir
Sample Waste
Reservoir
Buffer Inlet Reservoir
Buffer Waste Reservoir
PC Interface
An Integrated Monolithic Capillary Electrophoresis (CE)
System with Electrochemical Detection (ECD)
98
Operation
Injection mode
Separation mode
A
A
A
Injection
Waste Sample
CE
Detection
A
A
Separation
A
Waste
CE
Sample
Detection
99
Results
Analyte
Dichlorofluorescein
(60 M, 420.1 g/mole)
Buffer
Phosphate
(10mM pH = 6.0)
Comments
Injection and separation
both at 1 kV (250 V/cm)
Average plug speed
372 13 um/sec (n=7)
Higher injection voltages
decreased the volume of the
plug did not affect the
speed. Spectra Physics 770
Argon-Ion laser (514 nm) at
2.5 W through a 2mm/5mm
diverging tip.
injection separation
simulation
100
Separation and EC Detection
On-chip separation and
electrochemical detection
has been realized
Photolithographically
patterned Pt electrodes
Dopamine and Catechol
used as analytes
Integrated with
miniaturized custom-
made power supply and
detection circuit
101
MEMS Examples
Channels, Nozzles, Flow Structures, and Load Cells
Source: EG&G IC Sensors
102
MEMS Examples
Micromachined Tips for FEDs and AFMs
Source: IBM
Source: Micron Technology
103
MEMS Examples
Optical MEMS (MOEMS)
Source: NIST, Simon Fraser, UCLA, and MCNC 104
MEMS Examples
Optical MEMS (MOEMS)
Source: IMC (Sweden), Maluf and TI
TIs DMD
105
physical sensors: pressure, acceleration, flow
lab-on-a-chip systems: uTAS using CE/EC
micro-pumps
bio-MEMS devices
RF MEMS for wireless communication
chemical and CNT sensors
microhotplates
MEMS-based microphones
inkjet microtechnology
MEOMS: optical MEMS
smart sensors
energy harvesting
nanotechnology
UofL MEMS Group
Research Areas
106
Future Direction
Commercial Successes Emerging Technologies
pressure sensors
accelerometers
gyros
flow sensors
radiation sensors
MEMS microphones
gas sensors
ink jet printheads
DMD micro-mirrors for
projection systems
LOC
optical switches
RF MEMS
microfluidics
micro pumps, valves and mixers
gnat robots
drug delivery
tissue engineering
micro-motors
NEMS
new fab technologies
2000 BMW 740i contains
over 70 MEMS sensors !
107
Cleanroom
Standards
Source: Zant
Class 100 no more than 100
particles of diameter .5 microns or
larger per cubic foot of air space.
Source: Zant
108
Cleanroom Configuration and Activities
Source: Zant
Table from Zant illustrating
increase in particle count due to
various cleanroom activities
109
The End
110