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LFS & Sleep Stack with Keeper : Two New Low-

Power leakage reduction Techniques


Pankaj Kr. Pal*, Ashwani K. Rana**

Abstract- For the most recent CMOS feature sizes (e.g., 90nm Power consumption of CMOS consists of dynamic and
and 65nm), leakage power dissipation has become an overriding static components. Dynamic power is consumed when
concern for VLSI circuit designers. ITRS reports that leakage transistors are switching, and static power is consumed
power dissipation may come to dominate total power regardless of transistor switching. Dynamic power
consumption [1]. We are doing comparable analysis of different consumption was previously (at 0.18μ technology and above)
low power, leakage current reduction techniques like SLEEP
the single largest concern for low-power chip designers since
approach, STACK, ZIGZAG & some new techniques like ,
dynamic power accounted for 90% or more of the total chip
SLEEPY–STACK, LEAKAGE FEEDBACK approach and
SLEEPY KEEPER techniques. And , after That to combine the power. Therefore, many previously proposed techniques, such
advantages of above written techniques, we propose two novel as voltage and frequency scaling, focused on dynamic power
approaches, named “Leakage Feedback with Stack (LFS)” & reduction. However, as the feature size shrinks, e.g., to 0.09μ
“Sleep Stack With Keeper (SSK)” which reduces leakage and 0.065μ, static power has become a great challenge for
current while saving exact logic state. But Based on simulations current and future technologies. Based on the International
result with a full adder circuit, “Sleep-Stack with keeper Technology Roadmap for Semiconductors (ITRS) [1], Kim et
approach” achieves up to 76% less power consumption.
al. report that sub-threshold leakage power dissipation of a
chip may exceed dynamic power dissipation at the 65nm
Keywords—low power design, leakage reduction,
feature size [11].
sleep, stack, sleepy-stack, keeper.
One of the main reasons causing the leakage power increase
I. INTRODUCTION is increase of sub-threshold leakage power. When technology
feature size scales down, supply voltage and threshold voltage
Power consumption is one of the top concerns of Very also scale down. Sub-threshold leakage power increases
Large Scale Integration (VLSI) circuit design, for which exponentially as threshold voltage decreases. Furthermore, the
Complementary Metal Oxide Semiconductor (CMOS) is the structure of the short channel device lowers the threshold
primary technology. Today’s focus on low power is not only voltage even lower. In addition to sub-threshold leakage,
because of the recent growing demands of mobile another contributor to leakage power is gate-oxide leakage
applications. Even before the mobile era, power consumption power due to the tunneling current through the gate-oxide
has been a fundamental problem. To solve the power insulator. Since gate-oxide thickness will be reduced as the
dissipation problem, many researchers have proposed technology decreases, in nano-scale technology, gate-oxide
different ideas from the device level to the architectural level leakage power may be comparable to sub-threshold leakage
and above. However, there is no universal way to avoid power if not handled properly. However, we assume other
tradeoffs between power, delay and area, and thus designers techniques will address gate-oxide leakage; for example, high-
are required to choose appropriate techniques that satisfy k dielectric gate insulators may provide a solution to reduce
application and product needs. gate-leakage [11]. Therefore, this project work focuses on
reducing sub-threshold leakage power consumption.

II. PREVIOUS WORK


* Pankaj Kr. Pal, M.Tech. Scholar, “VLSI Design Automation &
Techniques”, E&CED, National Institute of Technology, Hamirpur,
Himanchal Pradesh; E-mail: pankajpal86@ gmail.com . We here review previously proposed circuit level
approaches for sub-threshold leakage power reduction. The
** Ashwani K. Rana, Sr. Lecturer & Ph.d Research Scholar, E&CED,
most well-known traditional approach is the sleep approach
National Institute of Technology, Hamirpur, Himanchal Pradesh; E-mail:
ashwani@nitham.ac.in. [2][3]. In the sleep approach, both (i) an additional "sleep"
PMOS transistor is placed between VDD and the pull-up The sleepy stack approach combines the sleep and stack
network of a circuit and (ii) an additional "sleep" NMOS approaches [6][7]. The sleepy stack technique divides existing
transistor is placed between the pull-down network and GND. transistors into two half size transistors like the stack
These sleep transistors turn off the circuit by cutting off the approach.
power rails. Figure 1 shows its structure. The sleep transistors
are turned on when the circuit is active and turned off when
the circuit is idle. By cutting off the power source, this
technique can reduce leakage power effectively. However,
output will be floating after sleep mode, so the technique
results in destruction of state plus a floating output voltage.

A variation of the sleep approach, the zigzag approach,


reduces wake-up overhead caused by sleep transistors by
placement of alternating sleep transistors assuming a
particular pre-selected input vector [4]. In Figure 2, we
assume that, in sleep mode, the input of the logic is ‘0’ and
each logic stage reverses its input signal, i.e., the output is ‘1’
if the input is ‘0,’ and the output is ‘0’ is the input is ‘1.’ If the
output is ‘1,’ then a sleep transistor is added to the pull-down
Fig. 3 Stack Approach Fig. 4 Sleepy Stack Approach
network; if the output is ‘0’, then a sleep transistor is added to
the pull-up network. Thus, the zigzag approach uses fewer
sleep transistors than the original sleep approach.
Then sleep transistors are added in parallel to one of the
Furthermore, this approach still results in destruction of state
divided transistors. Figure 4 shows its structure. During sleep
(i.e., state is set to the particular pre-selected input vector),
mode, sleep transistors are turned off and stacked transistors
although the problem of floating output voltage is eliminated.
suppress leakage current while saving state. Each sleep
transistor, placed in parallel to the one of the stacked
transistors, reduces resistance of the path, so delay is
decreased during active mode. However, area penalty is a
significant matter for this approach since every transistor is
replaced by three transistors and since additional wires are
added for S and S’, which are sleep signals.

Fig. 1 Sleep approach Fig. 2 Zigzag Approach

Another technique for leakage power reduction is the stack


approach, which forces a stack effect by breaking down an
existing transistor into two half size transistors [5]. Figure 3
shows its structure. When the two transistors are turned off
together, induced reverse bias between the two transistors
results in sub-threshold leakage current reduction.
Fig. 5 Leakage feedback approach Fig. 6 Sleepy Keeper approach
The leakage feedback approach is based on the sleep transistors; on the other hand, low-Vth is applied to the
approach. However, the leakage feedback approach uses two remaining transistors to maintain logic performance [2]-[7].
additional transistors to maintain logic state during sleep
mode, and the two transistors are driven by the output of an
inverter which is driven by output of the circuit implemented III. MOTIVATION
utilizing leakage feedback [14]. As shown in Figure 5, a
PMOS transistor is placed in parallel to the sleep transistor (S) Currently, sub-threshold leakage seems to be the dominant
and a NMOS transistor is placed in parallel to the sleep contributor to overall leakage power [8]. Another possible
transistor (S'). The two transistors are driven by the output of contributor to leakage power is gate-oxide leakage. A possible
the inverter which is driven by the output of the circuit. solution widely reported is the potential use of high-k (high
During sleep mode, sleep transistors are turned off and one of dielectric constant) gate insulators [9]. In any case, this papers
the transistors in parallel to the sleep transistors keep the targets reduction of the sub-threshold leakage component of
connection with the appropriate power rail. static power consumption; other approaches should be
considered for reduction of gate oxide leakage. Do please
The basic problem with traditional CMOS is that the note, however, that all results reported in this paper include all
transistors are used only in their most efficient, and naturally sources of leakage power. With application of dual threshold
inverting, way: namely, PMOS transistors connect to VDD voltage (Vth) techniques, the sleep, zigzag and sleepy stack
and NMOS transistors connect to GND. It is well known that approaches result in orders of magnitude sub threshold
PMOS transistors are not efficient at passing GND; similarly, leakage power reduction [7] but in this papers we are not
it is well known that NMOS transistors are not efficient at using dual Vth approach. The major advantage of the sleepy
passing VDD. However, to maintain a value of ‘1’ in sleep stack approach over the sleep and zigzag approaches is that
mode, given that the ‘1’ value has already been calculated, the the sleepy stack approach saves exact logic state. However,
sleepy keeper approach uses this output value of ‘1’ and an the sleepy stack approach carries a nontrivial penalty: each
NMOS transistor connected to VDD to maintain output value transistor in the original, base case, traditional CMOS design
equal to ‘1’ when in sleep mode. As shown in Figure 6, an results in three transistors in the sleepy stack equivalent. The
additional single NMOS transistor placed in parallel to the goal of our new approach is to achieve the benefit of all above
pull-up sleep transistor connects VDD to the pull-up network. written techniques, and now we propose two novel
When in sleep mode, this NMOS transistor is the only source approaches, named “Leakage Feedback with Stack” & “Sleep
of VDD to the pull-up network since the sleep transistor is off. Stack With Keeper” which reduces leakage current while
Similarly, to maintain a value of ‘0’ in sleep mode, given that saving exact logic state.
the ‘0’ value has already been calculated, the sleepy keeper
approach uses this output value of ‘0’ and a PMOS transistor
IV. LFS & SLEEP STACK WITH KEEPER
connected to GND to maintain output value equal to ‘0’ when
in sleep mode. As shown in Figure 6, an additional single
PMOS transistor placed in parallel to the pull-down sleep In this section, we describe our new leakage reduction
transistor is the only source of GND to the pull-down network techniques ,in which we call the first one “Leakage feedback
which is the dual case of the output ‘1’ case explained above. with stack (LFS) ” approach and other is “Sleep-stack with
For this approach to work, all that is needed is for the NMOS Keeper” . This section explains the structure of the Leakage
connected to VDD and the PMOS connected to GND to be feedback with stack approach and Sleep-stack with Keeper.
able to maintain proper logic state. This seems likely to be
possible as other researchers have described ways to use far In First technique i.e. Leakage feedback with stack (LFS, we
lower VDD values to maintain logic state. For example, are combining the two low power techniques or taking
Flautner et al. propose some significantly reduced VDD advantage of two techniques i.e. Leakage feedback approach
values sufficient to maintain state [10]. due to less transistor than sleepy-stack in which we replaces
each transistor in base case into three transistors, and ultra low
For the sleep, zigzag, sleepy stack and leakage feedback power technique i.e. Stack approach. This is shown in fig. 7
approaches, sleepy keeper approach, dual Vth technology can
be applied to obtain greater leakage power reduction. Since In second approach i.e. Sleep-stack with Keeper, we are
high-Vth results in less leakage but lowers performance, high- combining the three different low power leakage reduction
Vth is applied only to leakage reduction transistors, which are techniques i.e sleep transistors, stack approach with keeper as
sleep transistors, and any transistors in parallel to the sleep shown in fig 8.
process as well as the Berkeley Predictive Technology Model
(BPTM) [12][13] approach for 0.18, 0.13, 0.10, and 0.07μm
processes. We use Tanner-SPICE ie T-SPICE simulation to
estimate only Average power consumption. The supply
voltages used by the technologies are tabulated in Table 1.

Technology 0.07 μ 0.1 μ 0.13 μ 0.18 μ


Vdd 1.0 V 1.3 V 1.6 V 2.0 V

Table 1. Supply voltages for different technologies

VI. SIMULATION RESULTS


Fig. 7 Leakage feedback with Stack
We measure only the average power consumption for nine
design approaches, which are the base case, sleep, zigzag,
stack, sleepy stack , leakage feedback and sleepy keeper
approaches with newly proposed approaches named “Leakage
Feedback with Stack” & “Sleep Stack With Keeper”. The
static power measurement for the leakage feedback approach
by using same method for all other approaches resulted in 10X
greater than the result of the base case. For this reason, we do
not show results for the leakage feedback approach.
.
A 1-bit Full-adder (mirror design) is chosen to compare our
Leakage Feedback with Stack & Sleep Stack approach to the
other considered approaches for four different technologies.
The simulations table for 1-bit Full-adder is shown below in
table 2.
Fig. 8 Sleep Stack with Keeper approach
For For For For
Techniques (70 nm) (100 nm) (130 nm) (180 nm)
V. EXPERIMENTAL METHODOLOGY Base Case 3.86E- 8.90E- 2.29E- 6.35E-
08 08 07 07
In order to compare the results of our new approach with Sleep 1.20E- 3.87E- 8.85E- 2.27E-
prior leakage reduction approaches, experiments include all 08 08 08 07
the techniques discussed in Section 2, namely, stack, sleep, Zigzag 1.46E- 4.47E- 9.89E- 2.55E-
zigzag, sleepy stack and leakage feedback & sleepy-Keeper 08 08 08 07
approaches. In addition, we consider a base case and the Stack 1.49E- 4.24E- 9.74E- 3.08E-
newly proposed novel approaches, named “Leakage Feedback 08 08 08 07
with Stack” & “Sleep Stack With Keeper”. Sleepy-stack 1.79E- 1.34E- 1.34E- 3.75E-
08 07 07 07
Schematics are designed for all considered techniques using Sleepy- 1.64E- 5.45E- 1.27E- 3.63E-
Schematics Editor i.e S-EDIT in T-SPICE targeting TSMC keeper 08 08 07 07
0.18μm technology . Schematics are used to obtain netlists of Sleepy- 7.91E- 2.79E- 6.39E- 1.57E-
test circuits, and the netlists are used to simulate and test stack-keeper 09 08 08 07
performance. LF with 1.69E- 5.21E- 1.29E- 3.32E-
Stack 08 08 07 07
Schematics are created based on TSMC 0.18um process
Table 2. Avg. Power consumed in watts
parameters. Netlists of test circuits for different techniques are
extracted from the schematics. The netlists are modified to fit
Now we are showing the simulations results of 1-bit Full
into all silicon technologies targeted using the TSMC 0.18μm
adder circuit with four different technology generations for all
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