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Voltage [V]
To avoid collapse, dimples were defmed for the second
level. Furthermore, these give the structure a more robust
mechanical stability. The dimples were designed using
the criteria for SUMMIT V [12] and 3D full-wave
electromagnetic field simulations for radio frequency
(RF), to obtain optimal results.
Figure 4(a) ilustrates a schematic of the MEMS
capacitor with all integrated elements (dimples and
holes).
Figure 4(b) shows stress simulations along the y axis.
The different shades in Figure 4(b) indicate the
distribution of mechanical stresses along the length of the
positive (mobile) electrode.
The MEMS capacitor was simulated under electrostatic
actuation, as is shown in Figure 4(c). The electrostatic
analysis was performed sweeping the applied voltage
from 0 to 24V, obtaining a variation of 0 to 3 microns
approximately. The effective stiffuess (Keg} can be
obtained from for mechanic-electrostatic analysis. This
has been extract from Coventorware simulations, and
also, was calculated in accordance to [9] and [10].
Fig. 3. Displacement of mobile electrode and capacitance as a
function of applied voltage.
(a)
(I)
(2)
A. MEMS Capacitor
The MEMS capacitor consists of two parallel plates
(two electrodes, one mobile-positive and one fixed-
negative), whose capacitance can be varied using the
electrostatic principle.
The MEMS capacitor can be fabricated using the
surface micromachining technique, and it can be
integrated in a CMOS chip. The process under
consideration here is composed of four materials and five
levels of masks on a silicon wafer (100 orientation,
p>4000 Q.cm) acting as the mechanical support.
Titanium (Ti) and Gold (Au) are used as structural
materials, with one suspended level for mechanical
structures, and SU8 is used as the sacrificial material.
Silicon dioxide SiOz and BenzoCyclobutene BCB are
used as dielectrics.
The capacitance between parallel plates is determined
by:
(b)
(c)
Fig. 4. Coventorware simulations (a) Sketch of MEMS
capacitor with dimples and holes, (b) MEMS capacitor stress
simulations along the y axis, and (c) Simulations along the z
axis of a parallel-plate capacitor with an applied voltage of24V.
III. SIMULATION RESULTS
In this paper, the smart antenna was simulated in HFSS
vlO from Ansoft Corporation using it as a 3D full-wave
electromagnetic field solver, using a high resistivity
silicon substrate and a gold conducting layer with a
thickness of 3 J.1m to reduce losses. The layout for the
antenna only (without an integrated DC bias line) using
an MTM-MEMS CRLH-TL basic cell of dimensions
1.397mm X 2.022mm, is shown in Fig. 5(a). It has a
1/37.02 "-0 x 1/25.5 "-0 footprint and is among the smallest
in the literature, where "-0 is the free space wavelength.
Figure 5(b) shows the details of the MEMS capacitor as a
tuning element. The dimple size is 15 x 15 J.1m for the
mobile electrode and is of 25 x 25 J.1m for the support
structure of the fixed electrode. The dimple base is
isolated. The hole size is 15 x 15 J.1m. Each MEMS
capacitor has ten holes.
The antenna, consisting of two double MEMS
capacitors and four inductors connected to ground,
presents the following characteristics: The capacitor uses
an area of 596J.1m x 596J.1m, and presents a nominal value
of 1.048pF. The spiral inductor dimension are 200f..lm X
200J.1m, with a strip width of 20J.1m and a line spacing of
10J.1m, and provides an inductance value of 1.31nH. This
structure was designed for a central frequency of 5.8GHz.
The coplanar line (CPW) is designed for a characteristic
impedance of 500. The line spacing is 50J.1m and the
signal line width is 78J.1m.
Figure 6(a) shows the simulation results for the SII
dispersion parameter. The simulated return losses at the
point m, = 5.8GHz is -16.10dB with a 4% bandwidth
(defined by ISIII < lOdB). This full wave simulation
considers the design aspects for the MEMS capacitors,
such as dimples and holes. This simulation shows greater
losses than the previous simulation shown in Figure 8.
Figure 6b shows the radiation pattern for the antenna
resonating at 5.8GHz.
(a)
Mobile Electrode
Holes
(b)
Fig. 5. (a) Layout of the smart antena of a cell MTM and (b)
Details distribuition of dimples and holes.
The dispersion curve of the MTM-MEMS cell antenna
is plotted in Figure 7 for a transition frequency of
5.8GHz, with Beta = O. It shows the typical characteristics
of a structured metamaterial ; the negative sign of the
slope demonstrates the existence of the negative phase
velocity.
The dispersion curve is obtained from a zero-resonator
structure using the unwrapped phase ofS
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