23rd INTERNATIONAL

CONFERENCE ON
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23rd INTERNATIONAL
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MIEL 2002
O OR RG GA AN NI IZ ZE ER RS S

2002 23rd INTERNATIONAL CONFERENCE ON
MICROELECTRONICS

12-15 May 2002
Ni, Yugoslavia

organized by
Yugoslavia IEEE Section ED/SSC Chapter

in cooperation with
Faculty of Electronic Engineering, University of Ni
Ei Holding Co. - Ni

under the co-sponsorship of
IEEE Electron Devices Society

with the cooperation of
IEEE Solid-State Circuit Society

under the auspices of
Serbian Ministry of Science, Technologies and Development
Yugoslav Secretariat of Development and Science
CONFERENCE
INFORMATION
Yugoslav Academy of Engineering
Yugoslav Society for ETRAN
City Assembly of Ni







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Asia & Pacific

23rd INTERNATIONAL
CONFERENCE ON
MICROELECTRONICS
PROCEEDINGS
Y.-I. Choi, Ajou University, Korea
S. Dimitrijev, Griffith University, Australia
H. Iwai, Tokyo Institute of Technology, Japan
C. Jagadish, Australian National University, Australia
C. Ling, National University of Singapore
B. Mo, Peking University, China
T. Ohmi, Tohoku University, Japan
S.C. Sun, Taiwan Semiconductor Mfg. Co., Taiwan
H. Wong, City University of Hong Kong, Hong Kong

Europe

H. Detter, Technical University of Vienna, Austria
G. Golan, ATCT Ltd., Israel
V. Liberali, University of Pavia, Italy
M. Ostling, Royal Institute of Technology, Sweden
V. Pershenkov, Moscow Physics Engineering Institute, Russia
R. Popovi, EPFL, Switzerland
P. Rossel, LAAS/CNRS, France
S. Selberherr, Technical University of Vienna, Austria
N. Stojadinovi, University of Ni, Yugoslavia
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America

V. Arora, Wilkes University, PA, USA
J.-P. Colinge, University of California at Davis, CA, USA
J. Liou, University of Central Florida, FL, USA
A. Nathan, University of Waterloo, Canada
A. Ortiz-Conde, University Simon Bolivar, Venezuela
A. Salama, University of Toronto, Canada
K. Shenai, University of Illinois at Chicago, IL, USA
A. Shibib, Lucent Technologies, Inc., PA, USA
R. Singh, Clemson University, SC, USA



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Chairman:
N. Stojadinovi, University of Ni, Yugoslavia

Vice-Chairmen:
S. Dimitrijev, Griffith University, Australia
H. Iwai, Tokyo Institute of Technology, Japan
R. Popovi, EPFL, Switzerland
K. Shenai, University of Illinois at Chicago, USA

Scientific Secretary:
I. Mani, University of Ni, Yugoslavia

Organization Secretary:
T. Pei, University of Ni, Yugoslavia
23rd INTERNATIONAL
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MIEL 2002

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K. Arshak, University of Limerick, Ireland
E. Atanassova, Bulgarian Academy of Sciences, Bulgaria
V. Benda, Technical University of Prague, Czech Republic
T. Broek, PDF Solutions, Inc., USA
G. Charitat, LAAS/CNRS, France
N. Dmitruk, Academy of Sciences of Ukraine, Ukraine
Z. Djuri, IHTM-CMTM, Yugoslavia
A. Dziedzic, Technical University of Wroclaw, Poland
T. Efland, Texas Instruments, USA
K. El-Shennawy, AASTMT, Egypt
F. Fantini, University of Parma, Italy
D. Fleetwood, Vanderbilt University, USA
D. Flores, National Centre of Microelectronics, Spain
G. Ghibaudo, ENSERG, France
P. Haba, Philips Semiconductors, The Netherlands
P. Hagouel, Aristoteles University of Thessaloniki, Greece
S. Haque, Philips, USA
S. Horita, Japan Advanced Institute of Science and Technology, Japan
H. Ishiwara, Tokyo Institute of Technology, Japan
N. Jankovi, University of Ni, Yugoslavia
M. Jevti, Institute of Physics, Yugoslavia
E.D. Kim, Korea Electrotechnology Research Institute, Korea
S. Koshevaya, National Institute of Astrophysics, Mexico
V. Litovski, University of Ni, Yugoslavia
J. Lutz, Technical University of Chemnitz, Germany
23rd INTERNATIONAL
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MIEL 2002

C CO OR RR RE ES SP PO ON ND DI IN NG G M ME EM MB BE ER RS S
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P. Mawby, University of Wales, UK
G. Meijer, Delf University of Technology, The Netherlands
E. Miranda, University of Buenos Aires, Argentina
T. Mouthaan, University of Twente, The Netherlands
A. Napieralski, Technical University of Lodz, Poland
J. Nicolics, Vienna University of Technology, Austria
P. Nikoli, University of Belgrade, Yugoslavia
P. Ohlckers, DAVIS and University of Oslo, Norway
V. Oklobdija, University of California at Berkeley, USA
R. Plana, LAAS/CNRS, France
M.K. Radhakrishnan, Philips Electronics, Singapore
G. Reeves, Royal Melbourne Institute of Technology, Australia
J. Reiner, BC Components, Germany
A. Rusu, Technical University of Bucharest, Romania
E.M. Shankar, De Montfort Universiy, United Kingdom
G. Shen, Beijing Polytechnic University, China
P. Spirito, University of Naples, Italy
J. ikula, Technical University of Brno, Czech Republic
D. Tjapkin, University of Belgrade, Yugoslavia
V. Tvaroek, Slovak Technical University, Slovak Republic
R. Ubar, Tallin Technical University, Estonia
K. Verhaege, Sarnoff Europe, Belgium
V. Vashchenko, National Semiconductor Corporation, USA
G. Wachutka, Technical University of Munchen, Germany
Y. Yamada, Kyushu Tokai University, Japan
M. Zwolinski, University of Southampton, United Kingdom
Lj. ivanov, University of Novi Sad, Yugoslavia
23rd INTERNATIONAL
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MIEL 2002

C CO OR RR RE ES SP PO ON ND DI IN NG G M ME EM MB BE ER RS S
CONFERENCE
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Left to right: P. Igi, A. Vujani, N. Stojadinovi (Conference Chairman), J. Nicolics and G. Boselli
23rd INTERNATIONAL
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MIEL 2002

M MI IE EL L 2 20 00 00 0 B BE ES ST T P PA AP PE ER R A AW WA AR RD DS S
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A. Vujani, N. Adamovi, M. Jakovljevi, W. Brenner, G. Popovi, H. Detter
for
Silicon Microstructure for Precise Measurements of Mechanical Moments 23rd INTERNATIONAL
CONFERENCE ON
MICROELECTRONICS
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A. Vujani accepts the award from N. Stojadinovi

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MIEL 2002
J. Nicolics, G. Hanreich, G. Stangl J. Nicolics, G. Hanreich, G. Stangl
for for
Investigation of the Thermal Performance of Micro-Whisker Structured Silicon Heatspreaders for Power Devices Investigation of the Thermal Performance of Micro-Whisker Structured Silicon Heatspreaders for Power Devices
23rd INTERNATIONAL
CONFERENCE ON
MICROELECTRONICS
PROCEEDINGS


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J. Nicolics accepts the award from N. Stojadinovi

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P. Igi, P. Mawby
for
Investigation of the Thermal Stress Field in a Multilevel Aluminium Metallization in VLSI Systems Using Finite Element
Modelling Approach



P. Igi accepts the award from N. Stojadinovi
23rd INTERNATIONAL
CONFERENCE ON
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MIEL 2002

M MI IE EL L 2 20 00 00 0 B BE ES ST T P PA AP PE ER R A AW WA AR RD DS S
CONFERENCE
INFORMATION
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on behalf of Microelectronics Reliability
G. Boselli, T. Mouthan, F. Kuper
for
Rise-Time Effects in ggnMOSt under TPL Stress



G. Boselli accepts the award from N. Stojadinovi

23rd INTERNATIONAL
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MIEL 2002

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23rd INTERNATIONAL
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MIEL 2002
24th INTERNATIONAL CONFERENCE ON
MICROELECTRONICS
CALL FOR PAPERS
Ni{, Yugoslavia
15-18 May 2004
pshboj{fe cz
Yugoslavia IEEE Section - ED/SSC Chapter
jo dp.pqfsbujpo xjui
Faculty of Electronic Engineering, University of Ni{
Ei - Holding Co. - Ni{
voefs uif dp.tqpotpstijq pg
IEEE Electron Devices Society
voefs uif bvtqjdft pg
Serbian Ministry of Science, Technologies and Development
Yugoslav Secretariat of Development and Science
Yugoslav Academy of Engineering
Yugoslav Society for ETRAN
City Assembly of Ni{
xjui uif dppqfsbujpo pg
IEEE Solid-State Circuits Society
Conference on Microelectronics is the bi-annual event which provides an international forum for the
presentation and discussion of the latest advances in the field of microelectronics.
(MIEL)
The technical programme of the Conference is dedicated but not limited to the following main areas of
interest:
MIEL 2004
materials and processes
technologies and devices
device physics and modeling
process and device simulation
circuit design and application
characterization and testing
quality and reliability
The deadline for submission of two-page extended abstract is the 30 September 2003.
For further information please contact:
Prof.Dr. N. Stojadinovi}
Conference Chairman
Faculty of Electronic Engineering
University of Ni{
Beogradska 14, 18000 Ni{
YUGOSLAVIA
Tel: +381 18 529-326
Fax: +381 18 46-180
E-mail: nstojadinovic @elfak.ni.ac.yu
system design and packaging
NI
MIEL 2004

M MI IE EL L 2 20 00 04 4 C CA AL LL L F FO OR R P PA AP PE ER RS S
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