Created By: Bing Han

Document Is No Longer Controlled After Printed

Document Name: Europa Board epair !or" Instruction
Last e#ised $n: %irst elease Document &: '()*+,-.)**+ E/: +
Appro#ed By:
'(
(0erry 'uo1
2A
/en"ates0 Pandit
3a4le of Contents
+ Purpose555555555555555555555555555555555556
6 (cope5555555555555555555555555555555555556
- e# History555555555555555555555555555555555776
, Document eferences555555555555555555555555555577-
8 3erms 9 Definitions5555555555555555555555555555577-
: Product Information5555555555555555555555555555577-
; e<or" Process =ap55555555555555555555555555555-
> Critical Components Information5555555555555555555555577,
. Component List for $rder In Ad#ance ?@niAue Part ListB555555555555778
+* Board epair Process 2ualification555555555555555555555578
++ Board epair Notes5555555555555555555555555555577 8
+6 (pecial epair Processes57755555555555555555555555557:
+- (+6*+ $pen 3race Inspection5555555555555555555555555;
Research In Motion Confidential Page 1 of 9
Created By: Bing Han
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Document Name: Europa Board epair !or" Instruction
Last e#ised $n: %irst elease Document &: '()*+,-.)**+ E/: +
Appro#ed By:
'(
(0erry 'uo1
2A
/en"ates0 Pandit
1. PropCsito:
Este documento tiene por objeto proporcionar una instruccin de trabajo para la
reparacin del modelo Europa.
It should not be used as detailed board repair procedure.
67 Alcance
This document applies to GRS and outsourcing facilities solder repair.
-7 e# History
e# & Description of C0ange
=odified Date Edited By Appro#ed By
1
Initial Revision Uploaded
Nov 20, 2007 Bing Han
Sherry Guo
Venkatesh Pandit
Research In Motion Confidential Page 2 of 9
Created By: Bing Han
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Document Name: Europa Board epair !or" Instruction
Last e#ised $n: %irst elease Document &: '()*+,-.)**+ E/: +
Appro#ed By:
'(
(0erry 'uo1
2A
/en"ates0 Pandit
,7 Document eferences:
IPC-A-610
IPC-7711A
SMT-00025-001
GRS-01431-001
Acceptability of Electronic Assemblies
Rework of Electronic Assemblies
PCB Assembly Lead-Free Rework Procedure
Procedure for Control of Moisture Sensitive Components
QA-RMA-2005001 Qualifcation Requirement by a Third Party for Repairing Blackberry
PCB Assembly
87 3erms 9 Definitions
B'A:
L'A:
2%N:
=(D:
Ball Grid Array
Land Grid Array
Quad Flat No Lead
Moisture Sensitive Device
:7 Product Information
LeadedDLead)%ree (older Paste PCB =aterial %inis0 Ne< Process
Lead-Free SAC305 FR-4 OSP 0201
;7 e<or" Process =ap
Research In Motion Confidential
%ig)+
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Created By: Bing Han
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Document Name: Europa Board epair !or" Instruction
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Appro#ed By:
'(
(0erry 'uo1
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/en"ates0 Pandit
%ig)6
>7 Critical Components Information
ef epair
Desig Le#el
Part & 3ype %ine Pitc0E @nderfilledE =(D Le#el
Heat
(ensiti#e
U301
U602
U603
U604
U801
U1103
C916
MIC1201
4
4
4
4
4
4
3
4
ANA-00338-001 QFN
DIG-00157-004 BGA
DIG-00176-004 BGA
ANA-00496-002 BGA
ANA-00401-001 QFN
ANA-00399-002 BGA
CAP-07008-001 CAP
XDR-00010-001 Unique
Y
Y
N
Y
Y
Y
N
N
N
Y
Y
N
N
N
N
N
3
3
3
3
2a
3
2
2
N
N
N
N
N
N
Y
Y
Note: %ollo< '()*+,-+)**+ Procedure for Control of =oisture (ensiti#e Components
to 0andle moisture sensiti#e components7
Research In Motion Confidential Page 4 of 9
Created By: Bing Han
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Document Name: Europa Board epair !or" Instruction
Last e#ised $n: %irst elease Document &: '()*+,-.)**+ E/: +
Appro#ed By:
'(
(0erry 'uo1
2A
/en"ates0 Pandit
.7 Component List for $rder In Ad#ance ?@niAue Part ListB
ef Desig Part & ef Desig Part &
SH1302
SH1303
SH1304
SH1305
SH1306
SH1307
SH1308
SH1309
SH1310
SH1311
Note
HDW-15191-001
HDW-15200-001
HDW-15192-001
HDW-15162-002
HDW-15193-001
HDW-15164-001
HDW-15194-001
HDW-15198-001
HDW-15195-001
HDW-15199-003
SH1312
U401
U602
U603
S1002
HDW-15196-001
ANA-00435-001
DIG-00157-004
DIG-00176-004
CON-00147-001
30is list is for I= internal prior material order only7 Its accuracy is not guaranteed7 All
material order must comply <it0 acti#e B$=7
+*7 Board epair Process 2ualification
Le#el Component
/isual
Inspection
F)ay
Inspection
%unction
3est
Cross)(ection
4
Note
U801 Y Y If necessary Y
This component may change due to manufacturing process change, material constraints or
any other unpredictable changes;
Board Repair Process Qualifcation will comply with QA-RMA-2005001:
Qualifcation Requirement by a Third Party for Repairing Blackberry PCB Assembly
++7 Board epair Notes
All solder repair operation must follow IPC-7711A Rework of Electronic Assemblies;
Baking process for boards from mass production line should follow the requirements of
SMT-00025-001, Section 9.0 ; all feld return boards must be baked 33 hours @ 90 C
degree before board repair;
Ear Jack S1201 has special instruction for inspection prior to S1201 repair. Refer to
Section 13-S1201 Open Trace Inspection;
C916 should be discharged before rework;
Any hot air applied repair must ensure the underfll areas temperature is not higher than
200 C degree. Heat shield should be applied if necessary;
Use as much solder iron for Shield Can placement;
Research In Motion Confidential Page 5 of 9