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This document provides information about Start T435 No Clean Wave Soldering Flux produced by Almit Technology Ltd. The flux has been formulated for lead-free soldering of printed circuit boards using alloys like SAC. It offers improved performance over other fluxes in areas such as solder balling and hole fill. Start T435 provides benefits like compatibility with both lead and lead-free solders and high thermal stability, resulting in reduced solder balls and increased yields. Specifications and processing guidelines are provided along with surface insulation test results showing the flux passes IPC SIR, IPC ECM, and Telcordia GR-78 tests.
This document provides information about Start T435 No Clean Wave Soldering Flux produced by Almit Technology Ltd. The flux has been formulated for lead-free soldering of printed circuit boards using alloys like SAC. It offers improved performance over other fluxes in areas such as solder balling and hole fill. Start T435 provides benefits like compatibility with both lead and lead-free solders and high thermal stability, resulting in reduced solder balls and increased yields. Specifications and processing guidelines are provided along with surface insulation test results showing the flux passes IPC SIR, IPC ECM, and Telcordia GR-78 tests.
This document provides information about Start T435 No Clean Wave Soldering Flux produced by Almit Technology Ltd. The flux has been formulated for lead-free soldering of printed circuit boards using alloys like SAC. It offers improved performance over other fluxes in areas such as solder balling and hole fill. Start T435 provides benefits like compatibility with both lead and lead-free solders and high thermal stability, resulting in reduced solder balls and increased yields. Specifications and processing guidelines are provided along with surface insulation test results showing the flux passes IPC SIR, IPC ECM, and Telcordia GR-78 tests.
Almit Technology Ltd, Unit 7 Forest Row Business Park, Station Road, Forest Row, East Sussex, RH18 5DW, UK Tel: +44 (0)1342 822844, Fax: +44 (0)1342 824155, email: info@almit.com, www.almit.com WWW. .COM Start T435 No Clean Wave Soldering Flux Introduction
Start T435 No Clean Wave Soldering Flux has been specifically formulated for the soldering of mixed technology and conventional through hole printed circuit board assemblies, using lead free alloys. The flux features an enhanced, thermally stable base which is essential when higher pre-heat and solder bath temperatures are used during the lead free soldering process.
Start T435 No Clean Wave Soldering Flux features improved performance over other fluxes in all critical areas including solder balling, hole fill, solderability and freedom from icicles and bridges. The flux can be used with all commonly used lead free alloys including, the SAC family, Sn Cu and its modified derivatives. The flux will also work equally with Sn Pb alloys. Start T435 is compatible with all PCB finishes and solder resists, producing shiny joints, and solder ball free, minimal resi- dues.
Features Benefits
Sn/Pb and Pb Free Compatibility Single Product Sourcing High Thermal Stability Reduced Solder Balls Excellent Soldering Performance Increased Yields No Clean Technology Eliminates Washing Process
Specification
Colour Clear Acid Value 351 Specific Gravity 0.830 @ 21C Solids Content 4.3% Flash Point 12C J-STD-004 Classification 0RL0 Almit Technology Ltd, Unit 7 Forest Row Business Park, Station Road, Forest Row, East Sussex, RH18 5DW, UK Tel: +44 (0)1342 822844, Fax: +44 (0)1342 824155, email: info@almit.com, www.almit.com Processing Guidelines
Start T435 No Clean Wave Soldering Flux should be applied by spray fluxer, the flux is not designed for foam application. Deposition rates of between 100 and 200 gm/cm 2 should provide the correct coverage for most board types. During pre- heating, topside board temperatures in excess of 130C are possible but particular attention should be paid to the board design and suitability. Conveyor speeds are likely to be in the range of 1-2 metres/min.
Packaging
Start T435 No Clean Wave Soldering Flux is supplied in 5 litre plastic containers.
Health and Safety
A MSDS is available for this product. Please contact Almit Technology Ltd. or your local distributor for details.
Start T435 Surface Insulation Test Results
IPC SIR Test
Test Pattern Boards 24 Hours 96 Hours 168 Hours
IPC B24 Control 6.45 x 10 9 7.85 x 10 9 6.37 x 10 9 Pattern Up 2.10 x 10 10 1.67 x 10 10 1.43 x 10 10 Pattern Down 2.25 x 10 10 4.13 x 10 9 4.68 x 10 9
IPC ECM/Telcordia EM Resistance Test
Test Pattern Boards 96 Hours 500 Hours
IPC B25A Control 9.96 x 10 10 9.03 x 10 10 Pattern Up 6.22 x 10 10 1.05 x 10 11 Pattern Down 4.57 x 10 9 5.76 x 10 10
Telcordia GR-78 SIR Test
Test Pattern Boards 24 Hours 96 Hours
IPC B25A Control 8.51 x 10 12 8.73 x 10 12 Pattern Up 2.44 x 10 11 2.82 x 10 11 0.0125 spacing Pattern Down 6.43 x 10 12 6.71 x 10 12