8/16/2012

This presentation to be used in

conjunction with:

Spec Sheets: SA-GRSP10, SA-GRSP09, SA-GRSP11
Samples in DC-GROUND-KIT
1
8/16/2012
Network Bonding and Grounding:
TIA-607-B Generic Telecommunications Bonding and
Grounding (Earthing) for Customer Premises
2
Tom Turner
Product Manager, Power & Grounding
tom.turner@panduit.com
800-777-3300 x88290
Presentation objectives
Topics
Scope of TIA-607-B, Generic Telecommunications Bonding and Grounding
(Earthing) for Customer Premises
Grounding and bonding system implementation according to TIA-607-B,
including:
Data centers
Telecommunications closets

Throughout the presentation
Requirements from TIA-607-B and products that solve issues identified in the
standard
Common problems and how to avoid those issues

Order of presentation: start at equipment and work out to earth

3
BICSI credits available for this presentation
Qualifies for one credit:
RCDD CEC
Installer
Technician
Certified Trainer

Please make sure we have your:
Name, as you want it to appear on your certificate of course completion
Name of the company you work for
Your E-mail address (so we can send you the certificate)
4
Purpose and scope of TIA-607-B
TIA-607-B grounding is normative
and applies to entire building, not
just data center
TIA-607-B, Generic
Telecommunications
Bonding and
Grounding (Earthing)
for Customer
Premises, is now
approved!
Scope now
includes
grounding of
ITE
What is TIA-607-B?
Scope: Specifies requirements for a
generic telecommunications bonding
and grounding infrastructure, and its
interconnection to other systems, for
locations where telecommunications
equipment will be or are installed

Major revision of J-STD-607-A:
Includes G&B of telecommunications
spaces (distributors and computer
rooms)
Continued harmonization efforts (as
practicable) on terminology and
practices with international
standards
Scope of TIA-607-B
TBB
Distributors
Computer
Rooms
TGB
TMGB
Implementation of a telecommunications grounding and
bonding system per TIA-607-B
Bond the equipment to the racks/cabinets
Ensure that the racks/cabinets have electrical
continuity
Bond the racks/cabinets back to the electrical
panel
Bond nearby conductive items such as pathways
and building steel to the telecommunications
grounding and bonding system

Equipment in cabinets and racks
Rather than relying
on the ac power cord
ground wire, it is
desirable that
equipment be
grounded in a
verifiable manner as
described in this
Standard.
Figure 7Example of three methods to bond
equipment and racks to ground
TIA-607-B:
Implementing the equipment
grounding requirement
Bond equipment
with a jumper
when possible
Bonding screws have thread-
forming threads and
serrations under the head
that remove the paint off
mounting flanges and patch
panels (RGTBSG-C)
Bonding cage nuts have
teeth that cut paint when
installed (CBN4K)
9
Some equipment isnt designed for a supplemental
bonding system
Cant add a jumper
Cant add a bonding screw or a bonding cage nut

Thats OK. So long as the AC power system and the telecom bonding
system are bonded together, no safety issues result
Most servers cannot be
grounded directly to the
telecommunications
grounding system
Ground strip kits
Ground strips have same x-
sectional area as #6 AWG wire
Strips also future-proof against a
future installer bonding to the rack
without thread-forming screws
RGS Family
Install the
strip on the
vertical rail
and bond all
other
jumpers to it
TIA-607-B requires racks and cabinets to
be electrically continuous
Electrical continuity must be
confirmed through the use of
bonding jumpers, bonding
hardware, or the removal of paint
Bonding jumpers must be a
minimum of #12 AWG
Bare metal bonding tabs that
automatically create electrical
continuity when cabinet is assembled
All Panduit racks and
cabinets are electrically
continuous, eliminating the
need for jumpers
If the rack/cabinet is not electrically continuous, use a
busbar
Bond busbar to rack/cabinets
with thread-forming screws to
create electrical continuity
between the equipment
mounting rails
Bond to busbar with 2-hole lug
tongues for long-term
connection reliability
Thread-
forming
screws
2-hole lug
mounting
New terminology introduced by TIA-607-B:
Telecommunications Equipment Bonding
Conductor (TEBC)
The TEBC
connects the
TMGB/TGB to
equipment
racks/cabinets
Minimum
separation from
power and
telecom cables is
50 mm (2 in)
Example TEBCs routed along auxiliary cable brackets
(which help to maintain 50 mm separation)
TEBCs
TEBCs are bonded to the TGB
Acceptable telecommunications equipment bonding
conductor topologies for the telco closet, per TIA-607-B
Rack
bonding
conductor
(RBC)
Telecommunications
equipment bonding
conductor (TEBC)
Use two-hole lugs to bond to busbars and racks &
cabinets. Compression is required on busbars
One hole mechanical lug
Two hole compression lug
Connector considerations TIA-607-B
Mechanical connectors are
allowed for bonding the
TEBC/RGB to racks, but
Panduit recommends
compression to prevent
loosening
Mesh-BN: a collection of components (As per CENELEC documents, includes
TIA-942s Data Center Grounding Infrastructure as the Supplemental
Bonding Network and IEEE Std 1100 calls the MCBN), per TIA-607-B
Information
technology
equipment (ITE)
Racks and
cabinets
Cabling
pathways
(not shown)
Building steel
Supplemental
bonding grid
(SBG)
Conduits
Rack bonding
conductor
(RBC)
Watch for this common problem
Common Bonding Network
Jumper Kit (RGCBNJ660P22)
When you see a supplemental bonding grid (SBG) with nothing attached to
it, the customer intended to have grounding but got nothing!!! Making this
bond was in no ones scope of work...
(20% of the data centers have this problem)
Specify who
bonds the racks
to the SBG!
HTAP Crimping
HTCT HTAPs require 12
tons of compression
CT-2930/L is
recommended
Can use other
manufacturers tools
and retain UL
Listing/CSA Certification
Must use Panduit
locator dies
Patented
locating rib
guarantees full-
width crimp 1
st

time, every
time!
HTCT HTAP
CD-930H-250 Locator Die
CT-2930/L
Conductor sizing isnt only about electrical issues
Size matters!
Standards call for a minimum #6
AWG for mechanical strength
Source: Picture from Internet
Supplemental bonding grid construction per TIA-607-B
#6 AWG round wire or
2 wide copper strips
bonded at intersections
Minimum grid density is
3 m (10 ft) centers
Minimum 1/0 bond to
TGB/TMGB


Example supplemental bonding grid
Example SBG construction
Make aisle grounds
convenient to racks
and cabinets
Cross aisle grounds
every 10 feet
Use #6 AWG wire
Use pedestal
grounding clamps at
conductor
intersections
Bond to AC power
ground through a
local TGB
GPQC family of access floor grounding (Mesh-BN)
products
Up to two each of #6 AWG-2/0
conductors
Rated for fault current (not all
commonly installed access floor
connectors are)
Models for access floor
pedestals from to 2
diameters

Hinged U-bolt design allows
for no look installation
saving 67% of installation
time
Preventing loose busbar connections
25
Two-hole
compression
lugs required
on TGB &
TMGB

(Type LCC-W)
Telecommunications
Grounding Busbar
(TGB), BICSI/TIA-607
hole pattern

(Type GB2B, or Part GB2B0306TPI-1)
BICSI-607 stainless
steel TGB hardware
stack-up

(Parts HDW1/4-KT, HDW3/8-KT)
Operability testing of power
connectors
UL 486A, CSA 22.2
4 samples must pass all tests

Wire secureness test
Static heating test
Wire pull-out test

NEBS Level 3
Must be UL Listed
9 samples must pass all tests

Vibration test
Wire pull-out
Temp & humidity cycle
Hydrogen sulfide corrosion
30 day salt fog corrosion
Wire pull-out
AC fault current
Lightning test
Wire pull-out test
Stress corrosion cracking
Do you already own the tools?
Panduit lugs can be crimped with select competitors tools and
dies and still retain UL/CSA approvals and NEBS Level 3
performance
ASTM 545-97: Electroplated Coatings of Tin
Panduit doesnt restwhile others are
cheapening their lugs to compete
with foreign competition, Panduit is
improving quality by moving to Class
C plating as a standard offering*
28
* Running change, in process
Others
Panduit
What else needs to be bonded?
IEEE studies have indicated that the point of diminishing
financial returns with respect to lightning strikes is 2 meters
(6 feet)
Bond anything that could become charged that a person
could bump while working on a rack/cabinet for safety
Therefore, bond any conductive path within six feet of your
racks/cabinets
Bond cable tray and ladder rack sections
Split bolts use tin plated if
outdoors (Panduit SBC &
SBCT, respectively)

#6 AWG conductor,
green w/yellow jacket
OR
PANDUIT Wyr-Grid and
GRIDRUNNER hardware
automatically bonds sections,
eliminating the need for jumper
wires
Specify systems that
automatically bond to
reduce chances of error
Armored fiber cables per TIA-607-B
Armored fiber optic
cable
To grounding
system
Armored fiber grounding cable clamp
Mechanical clamp design is
entirely external to armorno
risk of damage to fibers
Clamp assembly has more
current-carrying capability
than the armor it attaches to
Mechanical
clamp
assembly
Cover protects
clamp and
provides neat
appearance
Telecommunications Bonding Backbone (TBB)
Purpose of TBB is to reduce
potential differences between
interconnected
telecommunications systems
on different floors
Originates at TMGB and
extends throughout building
using telecom pathways
Connects TGBs that exist in
each distributor
TBB and its bonds, adapted from Figure 32,
TIA-607-B
34
TIA-607-B TBB sizing
Specify current-rated connectors
(access floor)
Specify compression connectors
rather than mechanical
connectors (connections to
racks)
Panduit builds features into its
products that facilitate grounding
Panduit has a broad line of
power and grounding
connectors that are tested to the
most rigorous reliability
assurance standards. Specifying
these standards minimizes your
risk


35
Summary
Thank you! Questions?