Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT

Introduction of MEMs
Introduction of MEMs
by by
Dr. Y.C. Chen Dr. Y.C. Chen
Oct. 2004 Oct. 2004
TFIT-2
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
What is MEMs ?
What is MEMs ?

Microelectromechanical
Microelectromechanical
Systems, or MEMS,
Systems, or MEMS,
are
are
integrated micro devices
integrated micro devices
or
or
systems
systems
combining electrical and mechanical
combining electrical and mechanical
components
components
.
.

They are fabricated using

They are fabricated using
integrated circuit
integrated circuit
(IC) batch processing techniques and can
(IC) batch processing techniques and can
range in size from
range in size from
micrometers to millimeters
micrometers to millimeters
.
.

These systems can sense, control and actuate

These systems can sense, control and actuate
on the micro scale, and function individually or
on the micro scale, and function individually or
in arrays to generate effects on the
in arrays to generate effects on the
macro
macro
scale
scale
.
.
TFIT-3
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
History of MEMS Technology (
History of MEMS Technology (

)
)
Richard Feynman says, Theres Plenty of Room at the Bottom
- Presentation given Decmber 26, 1959 at California Institute of Technology
- Tries to spur innovative miniature fabrication techniques for micromechanics
- Fails to generate a fundamentally new fabrication technique
Westinghouse creates the Resonant Gate FETin 1969
- Mechanical curiosity based on new microelectronics fabrication techniques
Bulk-etched silicon wafers used as pressure sensors in 1970s
Kurt Petersen published Silicon as a Structure Materialsin 1982
- Reference for materials properties and etched data for silicon
Early experiments in surface-micromachined polysilicon in 1980s
- First electrostatic comb drive actuators
- Micropositioning disc drive heads
Micromachining leverages microelectronics industry in late 1980s
- Widespread experimentation and documentation increases public interest
TFIT-4
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
History of MEMS Technology (
History of MEMS Technology (

)
)
Early transduction and actuation methods produce simple actuators
- Piezoresistive , capacitive , field emitters , electrostatic , bimorph , piezoelectric
Methods of micromachining aimed toward improving sensors
- Thermal and electrical isolation between layers with suspended structures
Government agencies start large MEMs support programs
- AFORS supports basic research in materials and MEMs research
- DARPA creates MUMPS foundry service with MCNC in 1993
- NIST supports commercial foundries for CMOS and MEMS
Chris Pister (UCLA) creates first micromachined hinge in 1992
- Hinged features open possibilities for pseudo-3D structure and assembly
Later actuation and fabrication methods produce advanced systems
- Deep reactive ion etching , laser machining , fluidics , tunneling , deep UV
shape memory alloys , magnetic materials , extrusion , combustion
TFIT-5
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Technology Trend and Roadmap
Technology Trend and Roadmap
TFIT-6
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Micromachine center
Market of MEMs (Japan)
Market of MEMs (Japan)
TFIT-7
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Market of MEMs (USA)
Market of MEMs (USA)
TFIT-8
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
MEMs
MEMs
of Electronics
of Electronics
TFIT-9
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Sensor and Actuator
Sensor and Actuator
TFIT-10
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Wordwide
Wordwide
MEMs Growth
MEMs Growth
TFIT-11
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
1.Hard disk driver heads
2.Inkjet printer heads
3.Heart pace makers
4.In-vitro diagnostic devices
5.Hearing aids
6.Pressure sensors
7.Chemical sensors
1.Drug-delivery systems
2.Optical switches
3.Lab-on chip system
4.Magneto-optical heads
5.Projection light valves
6.Coil-on-chip
7.Micro-relays
8.Micro-motors
1.IT peripherals
2.Medical / Biomedical Engineering application
3.Industry and automation
4.Tele-communications
5.Automotive applications
6.Environmental monitoring
2002

TFIT-12
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
TFIT-13
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
TFIT-14
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT

IC - , , ,
, ,
- , , ,

- , , , ,
-
-
()-, ..
()-, , , ,
()-, ,
- , ,
TFIT-15
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Application of MEMs Application of MEMs
TFIT-16
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT

Defense Application
Defense Application
TFIT-17
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Commercial Application
Commercial Application
TFIT-18
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
TFIT-19
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
TFIT-20
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Micro
Micro
-
-
Technology Classification
Technology Classification
TFIT-21
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Multi Multi - -technology for MEMS applications technology for MEMS applications
Mechanical
Chemical
Materials
Biological
Electronic
Physical
MEMs
Optical
TFIT-22
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Microsensors
Microsensors
of Classification
of Classification
Thermal sensors Thermal sensors
- -Thermocouples, Thermocouples, Thermoresistors Thermoresistors, Thermal flow , Thermal flow- -rate rate
sensors. sensors.
Radiation sensors Radiation sensors
- -Photodiodes, Phototransistors, Charge coupled devices Photodiodes, Phototransistors, Charge coupled devices
( (CCDs CCDs), ), Pyroelectric Pyroelectric sensors, Integrated optics. sensors, Integrated optics.
Magnetic sensors Magnetic sensors
Chemical sensors & biosensors Chemical sensors & biosensors
- -ISFET sensors, Enzyme ISFET sensors, Enzyme- -based biosensors, Microelectrodes based biosensors, Microelectrodes
for neurophysiology. for neurophysiology.
Mechanical sensors Mechanical sensors
- -Piezoresistors Piezoresistors, Piezoelectric sensors, Capacitive sensors, , Piezoelectric sensors, Capacitive sensors,
Optical sensors, Resonant sensors, Accelerometers, Optical sensors, Resonant sensors, Accelerometers,
Pressure sensors. Pressure sensors.
http:// http://www.dbanks.demon.co.uk/ueng www.dbanks.demon.co.uk/ueng/ /
TFIT-23
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Microactuator
Microactuator
of Classification
of Classification
Electrostatic actuators Electrostatic actuators
- -Comb Drives, Wobble Comb Drives, Wobble
motors motors
Magnetic actuators Magnetic actuators
Piezoelectric actuators Piezoelectric actuators
Thermal actuators Thermal actuators
Hydraulic actuators Hydraulic actuators
Microstimulators Microstimulators
http://www.dbanks.demon.co.uk/ueng/
TFIT-24
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Micro Flow Sensors
Micro Flow Sensors
TFIT-25
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Micro Cooling Systems
Micro Cooling Systems
TFIT-26
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
IC Processes IC Processes
Oxidation Oxidation
Diffusion Diffusion
LPCVD LPCVD
Photolith Photolith
Epitaxy Epitaxy
Sputtering Sputtering
etc etc
Micromachining Micromachining
Processes Processes
Bulk Micromachining Bulk Micromachining
Surface Micromachining Surface Micromachining
Wafer Bonding Wafer Bonding
Deep Silicon RIE Deep Silicon RIE
LIGA LIGA
Micromolding Micromolding
etc etc
MEMs Processes
MEMs Processes
MEMs
TFIT-27
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Silicon Crystal Structure
Silicon Crystal Structure
TFIT-28
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Microfabrication
Microfabrication
Processes
Processes
TFIT-29
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT

PVDLPCVDCVD

IC Fabrication
IC Fabrication
,.
,,
..
,...
TFIT-30
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Typical wafer oxidation furnace
Typical wafer oxidation furnace
* Thermal oxidation is a high temperature process.
* Used to grow a continuous layer of high-quality.
* Silicon dioxide on silicon substrate.
Dry Oxidation
Oxidation species is oxygen.
Wet Oxidation
Oxidation species is water
vapour.
http://www.memsnet.org/
TFIT-31
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
The spin casting process as used for The spin casting process as used for
photoresist photoresist in photolithography in photolithography
http://www.memsnet.org/
TFIT-32
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Typical Etching (wet etching)
Typical Etching (wet etching)
Wet Etching
This covers any form of etching where etching is
performed by immersing the wafer in a bath of the
chemical etchant. The chemical etchants can be split
into two types, isotropic and anisotropic. Isotropic
etchants will etch a given material at the same rate
what ever direction it is etching in, by
contrast anisotropic etchants will etch
at different rates in a given material
depending on a number of factors,
the most useful one being the crystal
structure and orientation.
Bulk Micromachining
http://www.tronics-mst.com
anisotropic etching
Anisotropic Isotropic
http://www.el.utwente.nl
TFIT-33
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Dry Etching
This type of etching does not use any chemicals directly
on the wafer, instead the most popular method involves
accelerating ions towards the wafer to be etched, these
ions will etch the most in the direction in which they are
travelling. This method is called reactive ion etching (RIE).
RIE is an anisotropic etching method
as the direction of the etching
controls the rate of etching.
Typical
Typical
Etchong
Etchong
(dry etching)
(dry etching)
http://www.tronics-mst.com
Surface Micromachining
TFIT-34
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Chemical Vapour Deposition (CVD) Process
CVD is capable of producing thick, dense, ductile, and good adhesive
coatings on metals and non-metals such as glass and plastic.
Contrasting to the PVD coating in the "line of sight", the CVD can coat
all surfaces of the substrate.
- APCVD,LPCVD, PECVD. MOCVD
Physical Vapour Deposition (PVD) Process
PVD coatings involve atom-by-atom, molecule-by-molecule, or ion
deposition of various materials on solid substrates in vacuum systems.
- Thermal evaporation, Sputtering
Thin Film Deposition
Thin Film Deposition
TFIT-35
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Processes
APCVD Atmospheric pressure CVD
LPCVD Low pressure CVD
PECVD Plasma enhanced CVD
Reaction Types
Heterogeneous reaction
- Chemical reaction takes place
- Very close to the surface
- Good quality films
Homogeneous reaction
- Chemical reaction takes place
- In the gas phase
- Poor quality films
Reaction Energy
Thermal
Photons
Electrons
Typical CVD system
Typical CVD system
TFIT-36
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Typical hot
Typical hot
-
-
wall LPCVD reactor
wall LPCVD reactor
Reaction rate limited operation
Operates at 0.1 to 1Torr pressure
Good quality films
Conformal coverage
Typically used for HTO, PolySi,
Some metal films and nitride
http://www.memsnet.org/
TFIT-37
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Typical system for e Typical system for e- -beam evaporation of beam evaporation of
materials materials
Provides very clean and
high purity metal films
http://www.memsnet.org/
TFIT-38
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Typical cold Typical cold- -wall vapor phase wall vapor phase epitaxial epitaxial reactor reactor

The same crystallographic

orientation.

An amorphous/polycrystalline
substrate.

The films of thick <100um.

The technology is primarily used for

deposition of silicon.
http://www.memsnet.org/
TFIT-39
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Typical RF,DC sputtering system
Typical RF,DC sputtering system
DC Sputtering -
DC voltage between target and substrate,
used for conductive targets (metal films)
RF Sputtering -
RF voltage between target and substrate,
used for insulators (dielectrics)
Magnetron Sputtering - Magnetic field confines electrons near the target,
increasing the number of electrons causing,
ionization collisions and, thereby, deposition rates,
Reactive Sputtering- Sputtering a target material in presence of a
reactive gas, thereby, depositing a compound.
http://www.memsnet.org/
TFIT-40
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Micromachining Processes
Micromachining Processes
LIGA
Surface
Micromachining
Bulk
Micromachining
TFIT-41
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Bulk Micro-machining
Si
Photoresist
Deep RIE (ICP-RIE)
Si
KOH, EDP, TMAH,
Surface Micro-machining
Thin Film Deposition and Etching
Si
Si
Si
Releasing
Structural Polysilicon
Photoresist
Sacrificial silicon oxide
Bulk & Surface Micromachining
Bulk & Surface Micromachining
TFIT-42
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Surface Micromachining
Surface Micromachining
TFIT-43
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Two kinds of Surface Micromachining
Two kinds of Surface Micromachining
TFIT-44
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Simple
Simple
Micromirror
Micromirror
Fabrication
Fabrication
TFIT-45
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
An electrostatic microengine output gear
coupled to a double-level gear train that
drives a rack and pinion slider. This gear
train provides a speed-reduction/torque-
multiplication ratio of 9.6 to 1.
A pin-in-maze microcombination lock. The
pin must be electrostatically deflected to
traverse the maze cut into the large gear.
Sandia Sandia Ultra Ultra- -planar Multi planar Multi- -level MEMS level MEMS
Technology ( Technology (SUMMiT SUMMiT ) )
TFIT-46
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Fusion Bonding and Deep Reactive Fusion Bonding and Deep Reactive- -Ion Etching Ion Etching
TFIT-47
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
LIGA LIGA ( (Lithographie Lithographie, , Galvanoformung Galvanoformung, , Abformung Abformung) ) Fabrication Fabrication
90,
TFIT-48
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Summary
Summary

(MEMS
CAD)
TFIT-49
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
References References
http://www.dbanks.demon.co.uk/ueng/
TFIT-50
Department of Electronics Engineering and Computer, TFIT Department of Electronics Engineering and Computer, TFIT
Questions or Comments
Thanks you !