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OptiX OSN 3500 Intelligent Optical Transmission

System
V200R012C01

Hardware Description
Issue

02

Date

2013-01-18

HUAWEI TECHNOLOGIES CO., LTD.

Copyright Huawei Technologies Co., Ltd. 2013. All rights reserved.


No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions


and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.

Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees
or representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.


Address:

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Website:

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Email:

support@huawei.com

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About This Document

About This Document


Related Versions
The following table lists the product versions related to this document.
Product Name

Version

OptiX OSN 3500

V200R012C01

Intended Audience
This document describes the structure, composition, boards, and cables of the OptiX OSN
equipment.
The readers can have a comprehensive understanding of the hardware of the OptiX OSN
equipment through this document.
This document is intended for:

Network design and planning engineers

Hardware installation engineers

Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol

Description
DANGER indicates a hazard with a high level or medium
level of risk which, if not avoided, could result in death or
serious injury.
WARNING indicates a hazard with a low level of risk
which, if not avoided, could result in minor or moderate
injury.
CAUTION indicates a potentially hazardous situation that,
if not avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.

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Hardware Description

Symbol

About This Document

Description
Provides a tip that may help you solve a problem or save
time.
Provides additional information to emphasize or
supplement important points in the main text.

GUI Conventions
The GUI conventions that may be found in this document are defined as follows.
Convention

Description

Boldface

Buttons, menus, parameters, tabs, window, and dialog titles


are in boldface. For example, click OK.

>

Multi-level menus are in boldface and separated by the ">"


signs. For example, choose File > Create > Folder.

Change History
Updates between document issues are cumulative. Therefore, the latest document issue
contains all updates made in previous issues.

Updates in Issue 02 (2013-01-18) Based on Product Version


V200R012C01
This is the second document issue for the V200R012C01 product version. Compared with
Issue 01, Issue 02 includes the following updates in V200R012C01SPC100:

In chapter "EoS Boards", added the number of links that Ethernet virtual private line
(EVPL) services support.

In chapter "Cross-Connect Boards and System Control Boards", optimized the


description of GSCC board jumpers.

Updates in Issue 01 (2012-10-31) Based on Product Version


V200R012C01
This is the first document issue for the V200R012C01 product version. Compared with the
document issue for the V200R012C00 product version, this issue has the following updates:

Issue 02 (2013-01-18)

In chapter "Cabinet", added the description of DPD100-2-8 PDU and DPD63-8-8 PDU.
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OptiX OSN 3500 Intelligent Optical Transmission


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Hardware Description

About This Document

In chapter "EoS Boards", added the description of N2EFT8, N3EAS2, and N2EFT8A
boards.

In section "Functions and Features" for one-slot packet Ethernet boards, described
support for port mirroring.

In section "Functions and Features" for N1PEG8 and N1PEFF8 boards, described
support for single-fiber bidirectional optical modules.

Updates in Issue 02 (2012-07-31) Based on Product Version


V200R012C00
This is the second document issue for the V200R012C00 version. Compared with issue 01,
this issue has the following updates:

In chapter "Cross-Connect Boards and System Control Boards", changed the maximum
number of SNCP protection groups that a PSXCSA board supports.

In chapter "SDH Boards", optimized the description of PRBS support for each line
board.

Updates in Issue 01 (2012-04-30) Based on Product Version


V200R012C00
This is the first document issue for the V200R012C00 version. Compared with the document
issue for the V200R011C03 version, this issue has the following updates:

In section "SDH Boards", added the description of N1SF16E, N4SLQ16, N4SLO16,


N4SLD64, N4SFD64, and N4SF64 boards.

Deleted the section "Microwave Boards".

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Contents

Contents
1 Equipment Structure.......................................................................................................................1
2 Cabinet..............................................................................................................................................5
2.1 Types of Cabinets......................................................................................................................................................5
2.1 Types of Cabinets......................................................................................................................................................5
2.2 Configuration of the Cabinet..................................................................................................................................13
2.2 Configuration of the Cabinet..................................................................................................................................13
2.2.1 Indicators..........................................................................................................................................................14
2.2.1 Indicators..........................................................................................................................................................14
2.2.2 DC Power Distribution Unit.............................................................................................................................15
2.2.2 DC Power Distribution Unit.............................................................................................................................15
2.2.3 Other Configurations........................................................................................................................................21
2.2.3 Other Configurations........................................................................................................................................21

3 Subrack...........................................................................................................................................22
3.1 Subrack Structure...................................................................................................................................................23
3.1 Subrack Structure...................................................................................................................................................23
3.2 Slot Allocation........................................................................................................................................................24
3.2 Slot Allocation........................................................................................................................................................24
3.3 Slot Access Capacity in Packet Mode....................................................................................................................26
3.3 Slot Access Capacity in Packet Mode....................................................................................................................26
3.4 Slot Access Capacity in TDM Mode......................................................................................................................28
3.4 Slot Access Capacity in TDM Mode......................................................................................................................28
3.5 Ventilation Mode....................................................................................................................................................28
3.5 Ventilation Mode....................................................................................................................................................28
3.6 Cable Management.................................................................................................................................................29
3.6 Cable Management.................................................................................................................................................29
3.7 Mapping Policies of Power Consumption..............................................................................................................31
3.7 Mapping Policies of Power Consumption..............................................................................................................31
3.8 Technical Specifications.........................................................................................................................................32
3.8 Technical Specifications.........................................................................................................................................32

4 Overview of Boards.......................................................................................................................35
4.1 Appearances and Dimensions of the Boards..........................................................................................................35
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Contents

4.1 Appearances and Dimensions of the Boards..........................................................................................................35


4.2 Bar Codes of the Boards.........................................................................................................................................37
4.2 Bar Codes of the Boards.........................................................................................................................................37

5 Classification of Boards................................................................................................................39
6 Cross-Connect Boards and System Control Boards...................................................................52
6.1 SXCSA...................................................................................................................................................................52
6.1 SXCSA...................................................................................................................................................................52
6.1.1 Version Description..........................................................................................................................................52
6.1.1 Version Description..........................................................................................................................................52
6.1.2 Application........................................................................................................................................................52
6.1.2 Application........................................................................................................................................................52
6.1.3 Functions and Features.....................................................................................................................................53
6.1.3 Functions and Features.....................................................................................................................................53
6.1.4 Working Principle and Signal Flow..................................................................................................................54
6.1.4 Working Principle and Signal Flow..................................................................................................................54
6.1.5 Front Panel........................................................................................................................................................56
6.1.5 Front Panel........................................................................................................................................................56
6.1.6 Jumpers and DIP Switches...............................................................................................................................58
6.1.6 Jumpers and DIP Switches...............................................................................................................................58
6.1.7 Valid Slots.........................................................................................................................................................58
6.1.7 Valid Slots.........................................................................................................................................................58
6.1.8 Feature Code.....................................................................................................................................................58
6.1.8 Feature Code.....................................................................................................................................................58
6.1.9 Configuring and Commissioning the Board.....................................................................................................58
6.1.9 Configuring and Commissioning the Board.....................................................................................................58
6.1.10 Parameter Settings..........................................................................................................................................59
6.1.10 Parameter Settings..........................................................................................................................................59
6.1.11 Maintaining the Board....................................................................................................................................60
6.1.11 Maintaining the Board....................................................................................................................................60
6.1.12 List of Alarms.................................................................................................................................................60
6.1.12 List of Alarms.................................................................................................................................................60
6.1.13 List of Performance Events............................................................................................................................61
6.1.13 List of Performance Events............................................................................................................................61
6.1.14 Technical Specifications.................................................................................................................................61
6.1.14 Technical Specifications.................................................................................................................................61
6.2 PSXCS(A)..............................................................................................................................................................62
6.2 PSXCS(A)..............................................................................................................................................................62
6.2.1 Version Description..........................................................................................................................................62
6.2.1 Version Description..........................................................................................................................................62
6.2.2 Application........................................................................................................................................................63
6.2.2 Application........................................................................................................................................................63
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6.2.3 Functions and Features.....................................................................................................................................63


6.2.3 Functions and Features.....................................................................................................................................63
6.2.4 Working Principle and Signal Flow..................................................................................................................65
6.2.4 Working Principle and Signal Flow..................................................................................................................65
6.2.5 Front Panel........................................................................................................................................................66
6.2.5 Front Panel........................................................................................................................................................66
6.2.6 Jumpers and DIP Switches...............................................................................................................................68
6.2.6 Jumpers and DIP Switches...............................................................................................................................68
6.2.7 Valid Slots.........................................................................................................................................................68
6.2.7 Valid Slots.........................................................................................................................................................68
6.2.8 Feature Code.....................................................................................................................................................68
6.2.8 Feature Code.....................................................................................................................................................68
6.2.9 Configuring and Commissioning the Board.....................................................................................................68
6.2.9 Configuring and Commissioning the Board.....................................................................................................68
6.2.10 Parameter Settings..........................................................................................................................................69
6.2.10 Parameter Settings..........................................................................................................................................69
6.2.11 Maintaining the Board....................................................................................................................................70
6.2.11 Maintaining the Board....................................................................................................................................70
6.2.12 List of Alarms.................................................................................................................................................70
6.2.12 List of Alarms.................................................................................................................................................70
6.2.13 List of Performance Events............................................................................................................................73
6.2.13 List of Performance Events............................................................................................................................73
6.2.14 Technical Specifications.................................................................................................................................73
6.2.14 Technical Specifications.................................................................................................................................73
6.3 GSCC......................................................................................................................................................................74
6.3 GSCC......................................................................................................................................................................74
6.3.1 Version Description..........................................................................................................................................74
6.3.1 Version Description..........................................................................................................................................74
6.3.2 Application........................................................................................................................................................75
6.3.2 Application........................................................................................................................................................75
6.3.3 Functions and Features.....................................................................................................................................75
6.3.3 Functions and Features.....................................................................................................................................75
6.3.4 Working Principle and Signal Flow..................................................................................................................77
6.3.4 Working Principle and Signal Flow..................................................................................................................77
6.3.5 Front Panel........................................................................................................................................................79
6.3.5 Front Panel........................................................................................................................................................79
6.3.6 Jumpers and DIP Switches...............................................................................................................................81
6.3.6 Jumpers and DIP Switches...............................................................................................................................81
6.3.7 Valid Slots.........................................................................................................................................................85
6.3.7 Valid Slots.........................................................................................................................................................85
6.3.8 Feature Code.....................................................................................................................................................86
6.3.8 Feature Code.....................................................................................................................................................86
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6.3.9 Configuring and Commissioning the Board.....................................................................................................86


6.3.9 Configuring and Commissioning the Board.....................................................................................................86
6.3.10 Parameter Settings..........................................................................................................................................87
6.3.10 Parameter Settings..........................................................................................................................................87
6.3.11 Maintaining the Board....................................................................................................................................87
6.3.11 Maintaining the Board....................................................................................................................................87
6.3.12 List of Alarms.................................................................................................................................................88
6.3.12 List of Alarms.................................................................................................................................................88
6.3.13 List of Performance Events............................................................................................................................91
6.3.13 List of Performance Events............................................................................................................................91
6.3.14 Technical Specifications.................................................................................................................................91
6.3.14 Technical Specifications.................................................................................................................................91

7 Packet Processing Boards.............................................................................................................92


7.1 PEX1.......................................................................................................................................................................92
7.1 PEX1.......................................................................................................................................................................92
7.1.1 Version Description..........................................................................................................................................92
7.1.1 Version Description..........................................................................................................................................92
7.1.2 Application........................................................................................................................................................93
7.1.2 Application........................................................................................................................................................93
7.1.3 Functions and Features.....................................................................................................................................94
7.1.3 Functions and Features.....................................................................................................................................94
7.1.4 Working Principle and Signal Flow................................................................................................................100
7.1.4 Working Principle and Signal Flow................................................................................................................100
7.1.5 Front Panel......................................................................................................................................................102
7.1.5 Front Panel......................................................................................................................................................102
7.1.6 Jumpers and DIP Switches.............................................................................................................................104
7.1.6 Jumpers and DIP Switches.............................................................................................................................104
7.1.7 Valid Slots.......................................................................................................................................................104
7.1.7 Valid Slots.......................................................................................................................................................104
7.1.8 Feature Code...................................................................................................................................................105
7.1.8 Feature Code...................................................................................................................................................105
7.1.9 Configuring and Commissioning the Board...................................................................................................105
7.1.9 Configuring and Commissioning the Board...................................................................................................105
7.1.10 Configuring the Board Functions.................................................................................................................107
7.1.10 Configuring the Board Functions.................................................................................................................107
7.1.11 Parameter Settings........................................................................................................................................107
7.1.11 Parameter Settings........................................................................................................................................107
7.1.12 Maintaining the Board..................................................................................................................................108
7.1.12 Maintaining the Board..................................................................................................................................108
7.1.13 List of Alarms...............................................................................................................................................108
7.1.13 List of Alarms...............................................................................................................................................108
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7.1.14 List of Performance Events...........................................................................................................................110


7.1.14 List of Performance Events...........................................................................................................................110
7.1.15 Technical Specifications of PEX1................................................................................................................116
7.1.15 Technical Specifications of PEX1................................................................................................................116
7.2 PEX2.....................................................................................................................................................................119
7.2 PEX2.....................................................................................................................................................................119
7.2.1 Version Description.........................................................................................................................................119
7.2.1 Version Description.........................................................................................................................................119
7.2.2 Application......................................................................................................................................................119
7.2.2 Application......................................................................................................................................................119
7.2.3 Functions and Features...................................................................................................................................120
7.2.3 Functions and Features...................................................................................................................................120
7.2.4 Working Principle and Signal Flow................................................................................................................125
7.2.4 Working Principle and Signal Flow................................................................................................................125
7.2.5 Front Panel......................................................................................................................................................127
7.2.5 Front Panel......................................................................................................................................................127
7.2.6 Jumpers and DIP Switches.............................................................................................................................129
7.2.6 Jumpers and DIP Switches.............................................................................................................................129
7.2.7 Valid Slots.......................................................................................................................................................129
7.2.7 Valid Slots.......................................................................................................................................................129
7.2.8 Feature Code...................................................................................................................................................129
7.2.8 Feature Code...................................................................................................................................................129
7.2.9 Configuring and Commissioning the Board...................................................................................................129
7.2.9 Configuring and Commissioning the Board...................................................................................................129
7.2.10 Configuring the Board Functions.................................................................................................................131
7.2.10 Configuring the Board Functions.................................................................................................................131
7.2.11 Parameter Settings........................................................................................................................................131
7.2.11 Parameter Settings........................................................................................................................................131
7.2.12 Maintaining the Board..................................................................................................................................132
7.2.12 Maintaining the Board..................................................................................................................................132
7.2.13 List of Alarms...............................................................................................................................................132
7.2.13 List of Alarms...............................................................................................................................................132
7.2.14 List of Performance Events..........................................................................................................................134
7.2.14 List of Performance Events..........................................................................................................................134
7.2.15 Technical Specifications of PEX2................................................................................................................137
7.2.15 Technical Specifications of PEX2................................................................................................................137
7.3 PEG8.....................................................................................................................................................................139
7.3 PEG8.....................................................................................................................................................................139
7.3.1 Version Description........................................................................................................................................139
7.3.1 Version Description........................................................................................................................................139
7.3.2 Application......................................................................................................................................................140
7.3.2 Application......................................................................................................................................................140
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7.3.3 Functions and Features...................................................................................................................................140


7.3.3 Functions and Features...................................................................................................................................140
7.3.4 Working Principle and Signal Flow................................................................................................................146
7.3.4 Working Principle and Signal Flow................................................................................................................146
7.3.5 Front Panel......................................................................................................................................................148
7.3.5 Front Panel......................................................................................................................................................148
7.3.6 Jumpers and DIP Switches.............................................................................................................................149
7.3.6 Jumpers and DIP Switches.............................................................................................................................149
7.3.7 Valid Slots.......................................................................................................................................................149
7.3.7 Valid Slots.......................................................................................................................................................149
7.3.8 Feature Code...................................................................................................................................................150
7.3.8 Feature Code...................................................................................................................................................150
7.3.9 Configuring and Commissioning the Board...................................................................................................150
7.3.9 Configuring and Commissioning the Board...................................................................................................150
7.3.10 Configuring the Board Functions.................................................................................................................152
7.3.10 Configuring the Board Functions.................................................................................................................152
7.3.11 Parameter Settings........................................................................................................................................152
7.3.11 Parameter Settings........................................................................................................................................152
7.3.12 Maintaining the Board..................................................................................................................................152
7.3.12 Maintaining the Board..................................................................................................................................152
7.3.13 List of Alarms...............................................................................................................................................153
7.3.13 List of Alarms...............................................................................................................................................153
7.3.14 List of Performance Events..........................................................................................................................154
7.3.14 List of Performance Events..........................................................................................................................154
7.3.15 Technical Specifications of PEG8................................................................................................................158
7.3.15 Technical Specifications of PEG8................................................................................................................158
7.4 PEG16...................................................................................................................................................................161
7.4 PEG16...................................................................................................................................................................161
7.4.1 Version Description........................................................................................................................................161
7.4.1 Version Description........................................................................................................................................161
7.4.2 Application......................................................................................................................................................162
7.4.2 Application......................................................................................................................................................162
7.4.3 Functions and Features...................................................................................................................................162
7.4.3 Functions and Features...................................................................................................................................162
7.4.4 Working Principle and Signal Flow................................................................................................................167
7.4.4 Working Principle and Signal Flow................................................................................................................167
7.4.5 Front Panel......................................................................................................................................................169
7.4.5 Front Panel......................................................................................................................................................169
7.4.6 Jumpers and DIP Switches.............................................................................................................................171
7.4.6 Jumpers and DIP Switches.............................................................................................................................171
7.4.7 Valid Slots.......................................................................................................................................................171
7.4.7 Valid Slots.......................................................................................................................................................171
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7.4.8 Feature Code...................................................................................................................................................171


7.4.8 Feature Code...................................................................................................................................................171
7.4.9 Configuring and Commissioning the Board...................................................................................................171
7.4.9 Configuring and Commissioning the Board...................................................................................................171
7.4.10 Configuring the Board Functions.................................................................................................................173
7.4.10 Configuring the Board Functions.................................................................................................................173
7.4.11 Parameter Settings........................................................................................................................................174
7.4.11 Parameter Settings........................................................................................................................................174
7.4.12 Maintaining the Board..................................................................................................................................174
7.4.12 Maintaining the Board..................................................................................................................................174
7.4.13 List of Alarms...............................................................................................................................................175
7.4.13 List of Alarms...............................................................................................................................................175
7.4.14 List of Performance Events..........................................................................................................................176
7.4.14 List of Performance Events..........................................................................................................................176
7.4.15 Technical Specifications of PEG16..............................................................................................................178
7.4.15 Technical Specifications of PEG16..............................................................................................................178

8 Packet Interface Boards..............................................................................................................181


8.1 PETF8...................................................................................................................................................................181
8.1 PETF8...................................................................................................................................................................181
8.1.1 Version Description........................................................................................................................................182
8.1.1 Version Description........................................................................................................................................182
8.1.2 Application......................................................................................................................................................182
8.1.2 Application......................................................................................................................................................182
8.1.3 Functions and Features...................................................................................................................................182
8.1.3 Functions and Features...................................................................................................................................182
8.1.4 Working Principle and Signal Flow................................................................................................................187
8.1.4 Working Principle and Signal Flow................................................................................................................187
8.1.5 Front Panel......................................................................................................................................................188
8.1.5 Front Panel......................................................................................................................................................188
8.1.6 Jumpers and DIP Switches.............................................................................................................................190
8.1.6 Jumpers and DIP Switches.............................................................................................................................190
8.1.7 Valid Slots.......................................................................................................................................................190
8.1.7 Valid Slots.......................................................................................................................................................190
8.1.8 Feature Code...................................................................................................................................................190
8.1.8 Feature Code...................................................................................................................................................190
8.1.9 Configuring and Commissioning the Board...................................................................................................190
8.1.9 Configuring and Commissioning the Board...................................................................................................190
8.1.10 Parameter Settings........................................................................................................................................192
8.1.10 Parameter Settings........................................................................................................................................192
8.1.11 Maintaining the Board..................................................................................................................................192
8.1.11 Maintaining the Board..................................................................................................................................192
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8.1.12 List of Alarms...............................................................................................................................................193


8.1.12 List of Alarms...............................................................................................................................................193
8.1.13 List of Performance Events..........................................................................................................................195
8.1.13 List of Performance Events..........................................................................................................................195
8.1.14 Technical Specifications of PETF8...............................................................................................................199
8.1.14 Technical Specifications of PETF8...............................................................................................................199
8.2 PEFF8...................................................................................................................................................................200
8.2 PEFF8...................................................................................................................................................................200
8.2.1 Version Description........................................................................................................................................200
8.2.1 Version Description........................................................................................................................................200
8.2.2 Application......................................................................................................................................................200
8.2.2 Application......................................................................................................................................................200
8.2.3 Functions and Features...................................................................................................................................201
8.2.3 Functions and Features...................................................................................................................................201
8.2.4 Working Principle and Signal Flow................................................................................................................205
8.2.4 Working Principle and Signal Flow................................................................................................................205
8.2.5 Front Panel......................................................................................................................................................207
8.2.5 Front Panel......................................................................................................................................................207
8.2.6 Valid Slots.......................................................................................................................................................209
8.2.6 Valid Slots.......................................................................................................................................................209
8.2.7 Feature Code...................................................................................................................................................209
8.2.7 Feature Code...................................................................................................................................................209
8.2.8 Configuring and Commissioning the Board...................................................................................................209
8.2.8 Configuring and Commissioning the Board...................................................................................................209
8.2.9 Configuring the Board Functions...................................................................................................................211
8.2.9 Configuring the Board Functions...................................................................................................................211
8.2.10 Parameter Settings........................................................................................................................................211
8.2.10 Parameter Settings........................................................................................................................................211
8.2.11 Maintaining the Board..................................................................................................................................211
8.2.11 Maintaining the Board..................................................................................................................................211
8.2.12 List of Alarms...............................................................................................................................................212
8.2.12 List of Alarms...............................................................................................................................................212
8.2.13 List of Performance Events..........................................................................................................................213
8.2.13 List of Performance Events..........................................................................................................................213
8.2.14 Technical Specifications of PEFF8...............................................................................................................216
8.2.14 Technical Specifications of PEFF8...............................................................................................................216
8.3 CQ1.......................................................................................................................................................................219
8.3 CQ1.......................................................................................................................................................................219
8.3.1 Version Description........................................................................................................................................219
8.3.1 Version Description........................................................................................................................................219
8.3.2 Application......................................................................................................................................................219
8.3.2 Application......................................................................................................................................................219
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8.3.3 Functions and Features...................................................................................................................................220


8.3.3 Functions and Features...................................................................................................................................220
8.3.4 Working Principle and Signal Flow................................................................................................................221
8.3.4 Working Principle and Signal Flow................................................................................................................221
8.3.5 Front Panel......................................................................................................................................................223
8.3.5 Front Panel......................................................................................................................................................223
8.3.6 Jumpers and DIP Switches.............................................................................................................................224
8.3.6 Jumpers and DIP Switches.............................................................................................................................224
8.3.7 Valid Slots.......................................................................................................................................................224
8.3.7 Valid Slots.......................................................................................................................................................224
8.3.8 Feature Code...................................................................................................................................................224
8.3.8 Feature Code...................................................................................................................................................224
8.3.9 Configuring and Commissioning the Board...................................................................................................224
8.3.9 Configuring and Commissioning the Board...................................................................................................224
8.3.10 Parameter Settings........................................................................................................................................225
8.3.10 Parameter Settings........................................................................................................................................225
8.3.11 Maintaining the Board..................................................................................................................................226
8.3.11 Maintaining the Board..................................................................................................................................226
8.3.12 List of Alarms...............................................................................................................................................226
8.3.12 List of Alarms...............................................................................................................................................226
8.3.13 List of Performance Events..........................................................................................................................227
8.3.13 List of Performance Events..........................................................................................................................227
8.3.14 Technical Specifications of CQ1..................................................................................................................228
8.3.14 Technical Specifications of CQ1..................................................................................................................228
8.4 MD12....................................................................................................................................................................229
8.4 MD12....................................................................................................................................................................229
8.4.1 Version Description........................................................................................................................................229
8.4.1 Version Description........................................................................................................................................229
8.4.2 Application......................................................................................................................................................230
8.4.2 Application......................................................................................................................................................230
8.4.3 Functions and Features...................................................................................................................................230
8.4.3 Functions and Features...................................................................................................................................230
8.4.4 Working Principle and Signal Flow................................................................................................................233
8.4.4 Working Principle and Signal Flow................................................................................................................233
8.4.5 Front Panel......................................................................................................................................................234
8.4.5 Front Panel......................................................................................................................................................234
8.4.6 Jumpers and DIP Switches.............................................................................................................................236
8.4.6 Jumpers and DIP Switches.............................................................................................................................236
8.4.7 Valid Slots.......................................................................................................................................................237
8.4.7 Valid Slots.......................................................................................................................................................237
8.4.8 Feature Code...................................................................................................................................................237
8.4.8 Feature Code...................................................................................................................................................237
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8.4.9 Configuring and Commissioning the Board...................................................................................................237


8.4.9 Configuring and Commissioning the Board...................................................................................................237
8.4.10 Parameter Settings........................................................................................................................................238
8.4.10 Parameter Settings........................................................................................................................................238
8.4.11 Maintaining the Board..................................................................................................................................238
8.4.11 Maintaining the Board..................................................................................................................................238
8.4.12 List of Alarms...............................................................................................................................................239
8.4.12 List of Alarms...............................................................................................................................................239
8.4.13 List of Performance Events..........................................................................................................................240
8.4.13 List of Performance Events..........................................................................................................................240
8.4.14 Technical Specifications of MD12...............................................................................................................241
8.4.14 Technical Specifications of MD12...............................................................................................................241
8.5 MD75....................................................................................................................................................................242
8.5 MD75....................................................................................................................................................................242
8.5.1 Version Description........................................................................................................................................242
8.5.1 Version Description........................................................................................................................................242
8.5.2 Application......................................................................................................................................................242
8.5.2 Application......................................................................................................................................................242
8.5.3 Functions and Features...................................................................................................................................243
8.5.3 Functions and Features...................................................................................................................................243
8.5.4 Working Principle and Signal Flow................................................................................................................246
8.5.4 Working Principle and Signal Flow................................................................................................................246
8.5.5 Front Panel......................................................................................................................................................248
8.5.5 Front Panel......................................................................................................................................................248
8.5.6 Jumpers and DIP Switches.............................................................................................................................250
8.5.6 Jumpers and DIP Switches.............................................................................................................................250
8.5.7 Valid Slots.......................................................................................................................................................251
8.5.7 Valid Slots.......................................................................................................................................................251
8.5.8 Feature Code...................................................................................................................................................251
8.5.8 Feature Code...................................................................................................................................................251
8.5.9 Configuring and Commissioning the Board...................................................................................................251
8.5.9 Configuring and Commissioning the Board...................................................................................................251
8.5.10 Parameter Settings........................................................................................................................................252
8.5.10 Parameter Settings........................................................................................................................................252
8.5.11 Maintaining the Board..................................................................................................................................252
8.5.11 Maintaining the Board..................................................................................................................................252
8.5.12 List of Alarms...............................................................................................................................................253
8.5.12 List of Alarms...............................................................................................................................................253
8.5.13 List of Performance Events..........................................................................................................................254
8.5.13 List of Performance Events..........................................................................................................................254
8.5.14 Technical Specifications of MD75...............................................................................................................255
8.5.14 Technical Specifications of MD75...............................................................................................................255
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9 EoD Boards..................................................................................................................................257
9.1 EDQ41..................................................................................................................................................................257
9.1 EDQ41..................................................................................................................................................................257
9.1.1 Version Description........................................................................................................................................257
9.1.1 Version Description........................................................................................................................................257
9.1.2 Application......................................................................................................................................................257
9.1.2 Application......................................................................................................................................................257
9.1.3 Functions and Features...................................................................................................................................260
9.1.3 Functions and Features...................................................................................................................................260
9.1.4 Working Principle and Signal Flow................................................................................................................264
9.1.4 Working Principle and Signal Flow................................................................................................................264
9.1.5 Front Panel......................................................................................................................................................267
9.1.5 Front Panel......................................................................................................................................................267
9.1.6 Jumpers and DIP Switches.............................................................................................................................269
9.1.6 Jumpers and DIP Switches.............................................................................................................................269
9.1.7 Valid Slots.......................................................................................................................................................269
9.1.7 Valid Slots.......................................................................................................................................................269
9.1.8 Feature Code...................................................................................................................................................269
9.1.8 Feature Code...................................................................................................................................................269
9.1.9 Configuring and Commissioning the Board...................................................................................................270
9.1.9 Configuring and Commissioning the Board...................................................................................................270
9.1.10 Configuring the Board Functions.................................................................................................................271
9.1.10 Configuring the Board Functions.................................................................................................................271
9.1.11 Parameter Settings........................................................................................................................................271
9.1.11 Parameter Settings........................................................................................................................................271
9.1.12 Maintaining the Board..................................................................................................................................272
9.1.12 Maintaining the Board..................................................................................................................................272
9.1.13 List of Alarms...............................................................................................................................................274
9.1.13 List of Alarms...............................................................................................................................................274
9.1.14 List of Performance Events..........................................................................................................................276
9.1.14 List of Performance Events..........................................................................................................................276
9.1.15 Technical Specifications of EDQ41..............................................................................................................278
9.1.15 Technical Specifications of EDQ41..............................................................................................................278

10 SDH Boards................................................................................................................................280
10.1 SL1......................................................................................................................................................................283
10.1 SL1......................................................................................................................................................................283
10.1.1 Version Description......................................................................................................................................283
10.1.1 Version Description......................................................................................................................................283
10.1.2 Application....................................................................................................................................................283
10.1.2 Application....................................................................................................................................................283
10.1.3 Functions and Features.................................................................................................................................284
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10.1.3 Functions and Features.................................................................................................................................284


10.1.4 Working Principle and Signal Flow..............................................................................................................285
10.1.4 Working Principle and Signal Flow..............................................................................................................285
10.1.5 Front Panel....................................................................................................................................................287
10.1.5 Front Panel....................................................................................................................................................287
10.1.6 Jumpers and DIP Switches...........................................................................................................................289
10.1.6 Jumpers and DIP Switches...........................................................................................................................289
10.1.7 Valid Slots.....................................................................................................................................................289
10.1.7 Valid Slots.....................................................................................................................................................289
10.1.8 Feature Code.................................................................................................................................................289
10.1.8 Feature Code.................................................................................................................................................289
10.1.9 Configuring and Commissioning the Board.................................................................................................290
10.1.9 Configuring and Commissioning the Board.................................................................................................290
10.1.10 Parameter Settings......................................................................................................................................291
10.1.10 Parameter Settings......................................................................................................................................291
10.1.11 Maintaining the Board................................................................................................................................291
10.1.11 Maintaining the Board................................................................................................................................291
10.1.12 List of Alarms.............................................................................................................................................292
10.1.12 List of Alarms.............................................................................................................................................292
10.1.13 List of Performance Events........................................................................................................................295
10.1.13 List of Performance Events........................................................................................................................295
10.1.14 Technical Specifications.............................................................................................................................296
10.1.14 Technical Specifications.............................................................................................................................296
10.2 SL1A...................................................................................................................................................................297
10.2 SL1A...................................................................................................................................................................297
10.2.1 Version Description......................................................................................................................................297
10.2.1 Version Description......................................................................................................................................297
10.2.2 Application....................................................................................................................................................297
10.2.2 Application....................................................................................................................................................297
10.2.3 Functions and Features.................................................................................................................................298
10.2.3 Functions and Features.................................................................................................................................298
10.2.4 Working Principle and Signal Flow..............................................................................................................299
10.2.4 Working Principle and Signal Flow..............................................................................................................299
10.2.5 Front Panel....................................................................................................................................................301
10.2.5 Front Panel....................................................................................................................................................301
10.2.6 Valid Slots.....................................................................................................................................................303
10.2.6 Valid Slots.....................................................................................................................................................303
10.2.7 Feature Code.................................................................................................................................................303
10.2.7 Feature Code.................................................................................................................................................303
10.2.8 Parameter Settings........................................................................................................................................303
10.2.8 Parameter Settings........................................................................................................................................303
10.2.9 Technical Specifications...............................................................................................................................304
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10.2.9 Technical Specifications...............................................................................................................................304


10.3 SLQ1...................................................................................................................................................................306
10.3 SLQ1...................................................................................................................................................................306
10.3.1 Version Description......................................................................................................................................306
10.3.1 Version Description......................................................................................................................................306
10.3.2 Application....................................................................................................................................................307
10.3.2 Application....................................................................................................................................................307
10.3.3 Functions and Features.................................................................................................................................307
10.3.3 Functions and Features.................................................................................................................................307
10.3.4 Working Principle and Signal Flow..............................................................................................................308
10.3.4 Working Principle and Signal Flow..............................................................................................................308
10.3.5 Front Panel....................................................................................................................................................311
10.3.5 Front Panel....................................................................................................................................................311
10.3.6 Valid Slots.....................................................................................................................................................312
10.3.6 Valid Slots.....................................................................................................................................................312
10.3.7 Feature Code.................................................................................................................................................312
10.3.7 Feature Code.................................................................................................................................................312
10.3.8 Parameter Settings........................................................................................................................................313
10.3.8 Parameter Settings........................................................................................................................................313
10.3.9 Technical Specifications...............................................................................................................................313
10.3.9 Technical Specifications...............................................................................................................................313
10.4 SLQ1A................................................................................................................................................................315
10.4 SLQ1A................................................................................................................................................................315
10.4.1 Version Description......................................................................................................................................315
10.4.1 Version Description......................................................................................................................................315
10.4.2 Application....................................................................................................................................................315
10.4.2 Application....................................................................................................................................................315
10.4.3 Functions and Features.................................................................................................................................316
10.4.3 Functions and Features.................................................................................................................................316
10.4.4 Working Principle and Signal Flow..............................................................................................................317
10.4.4 Working Principle and Signal Flow..............................................................................................................317
10.4.5 Front Panel....................................................................................................................................................320
10.4.5 Front Panel....................................................................................................................................................320
10.4.6 Valid Slots.....................................................................................................................................................321
10.4.6 Valid Slots.....................................................................................................................................................321
10.4.7 Feature Code.................................................................................................................................................321
10.4.7 Feature Code.................................................................................................................................................321
10.4.8 Parameter Settings........................................................................................................................................321
10.4.8 Parameter Settings........................................................................................................................................321
10.4.9 Technical Specifications...............................................................................................................................322
10.4.9 Technical Specifications...............................................................................................................................322
10.5 SLO1...................................................................................................................................................................323
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10.5 SLO1...................................................................................................................................................................323
10.5.1 Version Description......................................................................................................................................323
10.5.1 Version Description......................................................................................................................................323
10.5.2 Application....................................................................................................................................................324
10.5.2 Application....................................................................................................................................................324
10.5.3 Functions and Features.................................................................................................................................324
10.5.3 Functions and Features.................................................................................................................................324
10.5.4 Working Principle and Signal Flow..............................................................................................................326
10.5.4 Working Principle and Signal Flow..............................................................................................................326
10.5.5 Front Panel....................................................................................................................................................328
10.5.5 Front Panel....................................................................................................................................................328
10.5.6 Valid Slots.....................................................................................................................................................330
10.5.6 Valid Slots.....................................................................................................................................................330
10.5.7 Feature Code.................................................................................................................................................330
10.5.7 Feature Code.................................................................................................................................................330
10.5.8 Parameter Settings........................................................................................................................................331
10.5.8 Parameter Settings........................................................................................................................................331
10.5.9 Technical Specifications...............................................................................................................................331
10.5.9 Technical Specifications...............................................................................................................................331
10.6 SLT1....................................................................................................................................................................332
10.6 SLT1....................................................................................................................................................................332
10.6.1 Version Description......................................................................................................................................332
10.6.1 Version Description......................................................................................................................................332
10.6.2 Application....................................................................................................................................................332
10.6.2 Application....................................................................................................................................................332
10.6.3 Functions and Features.................................................................................................................................333
10.6.3 Functions and Features.................................................................................................................................333
10.6.4 Working Principle and Signal Flow..............................................................................................................334
10.6.4 Working Principle and Signal Flow..............................................................................................................334
10.6.5 Front Panel....................................................................................................................................................336
10.6.5 Front Panel....................................................................................................................................................336
10.6.6 Valid Slots.....................................................................................................................................................338
10.6.6 Valid Slots.....................................................................................................................................................338
10.6.7 Feature Code.................................................................................................................................................338
10.6.7 Feature Code.................................................................................................................................................338
10.6.8 Parameter Settings........................................................................................................................................339
10.6.8 Parameter Settings........................................................................................................................................339
10.6.9 Technical Specifications...............................................................................................................................339
10.6.9 Technical Specifications...............................................................................................................................339
10.7 SLH1...................................................................................................................................................................341
10.7 SLH1...................................................................................................................................................................341
10.7.1 Version Description......................................................................................................................................341
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10.7.1 Version Description......................................................................................................................................341


10.7.2 Application....................................................................................................................................................341
10.7.2 Application....................................................................................................................................................341
10.7.3 Functions and Features.................................................................................................................................341
10.7.3 Functions and Features.................................................................................................................................341
10.7.4 Working Principle and Signal Flow..............................................................................................................343
10.7.4 Working Principle and Signal Flow..............................................................................................................343
10.7.5 Front Panel....................................................................................................................................................346
10.7.5 Front Panel....................................................................................................................................................346
10.7.6 Jumpers and DIP Switches...........................................................................................................................347
10.7.6 Jumpers and DIP Switches...........................................................................................................................347
10.7.7 Valid Slots.....................................................................................................................................................348
10.7.7 Valid Slots.....................................................................................................................................................348
10.7.8 Board Protection...........................................................................................................................................348
10.7.8 Board Protection...........................................................................................................................................348
10.7.9 Configuring and Commissioning the Board.................................................................................................350
10.7.9 Configuring and Commissioning the Board.................................................................................................350
10.7.10 Parameter Settings......................................................................................................................................351
10.7.10 Parameter Settings......................................................................................................................................351
10.7.11 Maintaining the Board................................................................................................................................351
10.7.11 Maintaining the Board................................................................................................................................351
10.7.12 List of Alarms.............................................................................................................................................353
10.7.12 List of Alarms.............................................................................................................................................353
10.7.13 List of Performance Events........................................................................................................................354
10.7.13 List of Performance Events........................................................................................................................354
10.7.14 Technical Specifications.............................................................................................................................355
10.7.14 Technical Specifications.............................................................................................................................355
10.8 SEP1...................................................................................................................................................................355
10.8 SEP1...................................................................................................................................................................355
10.8.1 Version Description......................................................................................................................................355
10.8.1 Version Description......................................................................................................................................355
10.8.2 Application....................................................................................................................................................355
10.8.2 Application....................................................................................................................................................355
10.8.3 Functions and Features.................................................................................................................................356
10.8.3 Functions and Features.................................................................................................................................356
10.8.4 Working Principle and Signal Flow..............................................................................................................358
10.8.4 Working Principle and Signal Flow..............................................................................................................358
10.8.5 Front Panel....................................................................................................................................................362
10.8.5 Front Panel....................................................................................................................................................362
10.8.6 Jumpers and DIP Switches...........................................................................................................................363
10.8.6 Jumpers and DIP Switches...........................................................................................................................363
10.8.7 Valid Slots.....................................................................................................................................................363
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Contents

10.8.7 Valid Slots.....................................................................................................................................................363


10.8.8 Board Protection...........................................................................................................................................363
10.8.8 Board Protection...........................................................................................................................................363
10.8.9 Feature Code.................................................................................................................................................366
10.8.9 Feature Code.................................................................................................................................................366
10.8.10 Configuring and Commissioning the Board...............................................................................................366
10.8.10 Configuring and Commissioning the Board...............................................................................................366
10.8.11 Parameter Settings......................................................................................................................................367
10.8.11 Parameter Settings......................................................................................................................................367
10.8.12 Maintaining the Board................................................................................................................................367
10.8.12 Maintaining the Board................................................................................................................................367
10.8.13 List of Alarms.............................................................................................................................................369
10.8.13 List of Alarms.............................................................................................................................................369
10.8.14 List of Performance Events........................................................................................................................370
10.8.14 List of Performance Events........................................................................................................................370
10.8.15 Technical Specifications.............................................................................................................................370
10.8.15 Technical Specifications.............................................................................................................................370
10.9 SL4......................................................................................................................................................................371
10.9 SL4......................................................................................................................................................................371
10.9.1 Version Description......................................................................................................................................371
10.9.1 Version Description......................................................................................................................................371
10.9.2 Application....................................................................................................................................................371
10.9.2 Application....................................................................................................................................................371
10.9.3 Functions and Features.................................................................................................................................372
10.9.3 Functions and Features.................................................................................................................................372
10.9.4 Working Principle and Signal Flow..............................................................................................................373
10.9.4 Working Principle and Signal Flow..............................................................................................................373
10.9.5 Front Panel....................................................................................................................................................376
10.9.5 Front Panel....................................................................................................................................................376
10.9.6 Valid Slots.....................................................................................................................................................377
10.9.6 Valid Slots.....................................................................................................................................................377
10.9.7 Feature Code.................................................................................................................................................377
10.9.7 Feature Code.................................................................................................................................................377
10.9.8 Parameter Settings........................................................................................................................................378
10.9.8 Parameter Settings........................................................................................................................................378
10.9.9 Technical Specifications...............................................................................................................................378
10.9.9 Technical Specifications...............................................................................................................................378
10.10 SL4A.................................................................................................................................................................379
10.10 SL4A.................................................................................................................................................................379
10.10.1 Version Description....................................................................................................................................379
10.10.1 Version Description....................................................................................................................................379
10.10.2 Application..................................................................................................................................................379
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10.10.2 Application..................................................................................................................................................379
10.10.3 Functions and Features...............................................................................................................................380
10.10.3 Functions and Features...............................................................................................................................380
10.10.4 Working Principle and Signal Flow............................................................................................................381
10.10.4 Working Principle and Signal Flow............................................................................................................381
10.10.5 Front Panel..................................................................................................................................................384
10.10.5 Front Panel..................................................................................................................................................384
10.10.6 Valid Slots...................................................................................................................................................385
10.10.6 Valid Slots...................................................................................................................................................385
10.10.7 Feature Code...............................................................................................................................................385
10.10.7 Feature Code...............................................................................................................................................385
10.10.8 Parameter Settings......................................................................................................................................386
10.10.8 Parameter Settings......................................................................................................................................386
10.10.9 Technical Specifications of SL4A..............................................................................................................386
10.10.9 Technical Specifications of SL4A..............................................................................................................386
10.11 SLD4.................................................................................................................................................................389
10.11 SLD4.................................................................................................................................................................389
10.11.1 Version Description.....................................................................................................................................389
10.11.1 Version Description.....................................................................................................................................389
10.11.2 Application..................................................................................................................................................390
10.11.2 Application..................................................................................................................................................390
10.11.3 Functions and Features...............................................................................................................................390
10.11.3 Functions and Features...............................................................................................................................390
10.11.4 Working Principle and Signal Flow............................................................................................................392
10.11.4 Working Principle and Signal Flow............................................................................................................392
10.11.5 Front Panel..................................................................................................................................................394
10.11.5 Front Panel..................................................................................................................................................394
10.11.6 Valid Slots...................................................................................................................................................396
10.11.6 Valid Slots...................................................................................................................................................396
10.11.7 Feature Code...............................................................................................................................................396
10.11.7 Feature Code...............................................................................................................................................396
10.11.8 Parameter Settings......................................................................................................................................397
10.11.8 Parameter Settings......................................................................................................................................397
10.11.9 Technical Specifications.............................................................................................................................397
10.11.9 Technical Specifications.............................................................................................................................397
10.12 SLD4A..............................................................................................................................................................399
10.12 SLD4A..............................................................................................................................................................399
10.12.1 Version Description....................................................................................................................................399
10.12.1 Version Description....................................................................................................................................399
10.12.2 Application..................................................................................................................................................399
10.12.2 Application..................................................................................................................................................399
10.12.3 Functions and Features...............................................................................................................................400
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10.12.3 Functions and Features...............................................................................................................................400


10.12.4 Working Principle and Signal Flow............................................................................................................401
10.12.4 Working Principle and Signal Flow............................................................................................................401
10.12.5 Front Panel..................................................................................................................................................404
10.12.5 Front Panel..................................................................................................................................................404
10.12.6 Valid Slots...................................................................................................................................................405
10.12.6 Valid Slots...................................................................................................................................................405
10.12.7 Feature Code...............................................................................................................................................405
10.12.7 Feature Code...............................................................................................................................................405
10.12.8 Parameter Settings......................................................................................................................................406
10.12.8 Parameter Settings......................................................................................................................................406
10.12.9 Technical Specifications.............................................................................................................................406
10.12.9 Technical Specifications.............................................................................................................................406
10.13 SLQ4.................................................................................................................................................................407
10.13 SLQ4.................................................................................................................................................................407
10.13.1 Version Description....................................................................................................................................407
10.13.1 Version Description....................................................................................................................................407
10.13.2 Application..................................................................................................................................................408
10.13.2 Application..................................................................................................................................................408
10.13.3 Functions and Features...............................................................................................................................408
10.13.3 Functions and Features...............................................................................................................................408
10.13.4 Working Principle and Signal Flow............................................................................................................410
10.13.4 Working Principle and Signal Flow............................................................................................................410
10.13.5 Front Panel..................................................................................................................................................412
10.13.5 Front Panel..................................................................................................................................................412
10.13.6 Valid Slots...................................................................................................................................................414
10.13.6 Valid Slots...................................................................................................................................................414
10.13.7 Feature Code...............................................................................................................................................414
10.13.7 Feature Code...............................................................................................................................................414
10.13.8 Parameter Settings......................................................................................................................................415
10.13.8 Parameter Settings......................................................................................................................................415
10.13.9 Technical Specifications.............................................................................................................................415
10.13.9 Technical Specifications.............................................................................................................................415
10.14 SLQ4A..............................................................................................................................................................417
10.14 SLQ4A..............................................................................................................................................................417
10.14.1 Version Description....................................................................................................................................417
10.14.1 Version Description....................................................................................................................................417
10.14.2 Application..................................................................................................................................................417
10.14.2 Application..................................................................................................................................................417
10.14.3 Functions and Features...............................................................................................................................418
10.14.3 Functions and Features...............................................................................................................................418
10.14.4 Working Principle and Signal Flow............................................................................................................419
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10.14.4 Working Principle and Signal Flow............................................................................................................419


10.14.5 Front Panel..................................................................................................................................................422
10.14.5 Front Panel..................................................................................................................................................422
10.14.6 Valid Slots...................................................................................................................................................423
10.14.6 Valid Slots...................................................................................................................................................423
10.14.7 Feature Code...............................................................................................................................................423
10.14.7 Feature Code...............................................................................................................................................423
10.14.8 Parameter Settings......................................................................................................................................423
10.14.8 Parameter Settings......................................................................................................................................423
10.14.9 Technical Specifications.............................................................................................................................424
10.14.9 Technical Specifications.............................................................................................................................424
10.15 SL16..................................................................................................................................................................425
10.15 SL16..................................................................................................................................................................425
10.15.1 Version Description....................................................................................................................................425
10.15.1 Version Description....................................................................................................................................425
10.15.2 Application..................................................................................................................................................426
10.15.2 Application..................................................................................................................................................426
10.15.3 Functions and Features...............................................................................................................................427
10.15.3 Functions and Features...............................................................................................................................427
10.15.4 Working Principle and Signal Flow............................................................................................................428
10.15.4 Working Principle and Signal Flow............................................................................................................428
10.15.5 Front Panel..................................................................................................................................................430
10.15.5 Front Panel..................................................................................................................................................430
10.15.6 Valid Slots...................................................................................................................................................432
10.15.6 Valid Slots...................................................................................................................................................432
10.15.7 Feature Code...............................................................................................................................................432
10.15.7 Feature Code...............................................................................................................................................432
10.15.8 Parameter Settings......................................................................................................................................432
10.15.8 Parameter Settings......................................................................................................................................432
10.15.9 Technical Specifications of SL16...............................................................................................................433
10.15.9 Technical Specifications of SL16...............................................................................................................433
10.16 SL16A...............................................................................................................................................................435
10.16 SL16A...............................................................................................................................................................435
10.16.1 Version Description....................................................................................................................................435
10.16.1 Version Description....................................................................................................................................435
10.16.2 Application..................................................................................................................................................436
10.16.2 Application..................................................................................................................................................436
10.16.3 Functions and Features...............................................................................................................................437
10.16.3 Functions and Features...............................................................................................................................437
10.16.4 Working Principle and Signal Flow............................................................................................................438
10.16.4 Working Principle and Signal Flow............................................................................................................438
10.16.5 Front Panel..................................................................................................................................................440
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10.16.5 Front Panel..................................................................................................................................................440


10.16.6 Jumpers and DIP Switches.........................................................................................................................442
10.16.6 Jumpers and DIP Switches.........................................................................................................................442
10.16.7 Valid Slots...................................................................................................................................................442
10.16.7 Valid Slots...................................................................................................................................................442
10.16.8 Feature Code...............................................................................................................................................442
10.16.8 Feature Code...............................................................................................................................................442
10.16.9 Configuring and Commissioning the Board...............................................................................................443
10.16.9 Configuring and Commissioning the Board...............................................................................................443
10.16.10 Parameter Settings....................................................................................................................................444
10.16.10 Parameter Settings....................................................................................................................................444
10.16.11 Maintaining the Board..............................................................................................................................444
10.16.11 Maintaining the Board..............................................................................................................................444
10.16.12 List of Alarms...........................................................................................................................................446
10.16.12 List of Alarms...........................................................................................................................................446
10.16.13 List of Performance Events......................................................................................................................449
10.16.13 List of Performance Events......................................................................................................................449
10.16.14 Technical Specifications of SL16A..........................................................................................................451
10.16.14 Technical Specifications of SL16A..........................................................................................................451
10.17 SLD16...............................................................................................................................................................454
10.17 SLD16...............................................................................................................................................................454
10.17.1 Version Description....................................................................................................................................454
10.17.1 Version Description....................................................................................................................................454
10.17.2 Application..................................................................................................................................................454
10.17.2 Application..................................................................................................................................................454
10.17.3 Functions and Features...............................................................................................................................455
10.17.3 Functions and Features...............................................................................................................................455
10.17.4 Working Principle and Signal Flow............................................................................................................456
10.17.4 Working Principle and Signal Flow............................................................................................................456
10.17.5 Front Panel..................................................................................................................................................459
10.17.5 Front Panel..................................................................................................................................................459
10.17.6 Jumpers and DIP Switches.........................................................................................................................460
10.17.6 Jumpers and DIP Switches.........................................................................................................................460
10.17.7 Valid Slots...................................................................................................................................................460
10.17.7 Valid Slots...................................................................................................................................................460
10.17.8 Feature Code...............................................................................................................................................460
10.17.8 Feature Code...............................................................................................................................................460
10.17.9 Configuring and Commissioning the Board...............................................................................................461
10.17.9 Configuring and Commissioning the Board...............................................................................................461
10.17.10 Parameter Settings....................................................................................................................................462
10.17.10 Parameter Settings....................................................................................................................................462
10.17.11 Maintaining the Board..............................................................................................................................462
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Hardware Description

Contents

10.17.11 Maintaining the Board..............................................................................................................................462


10.17.12 List of Alarms...........................................................................................................................................464
10.17.12 List of Alarms...........................................................................................................................................464
10.17.13 List of Performance Events......................................................................................................................465
10.17.13 List of Performance Events......................................................................................................................465
10.17.14 Technical Specifications...........................................................................................................................465
10.17.14 Technical Specifications...........................................................................................................................465
10.18 SLQ16...............................................................................................................................................................467
10.18 SLQ16...............................................................................................................................................................467
10.18.1 Version Description....................................................................................................................................467
10.18.1 Version Description....................................................................................................................................467
10.18.2 Application..................................................................................................................................................468
10.18.2 Application..................................................................................................................................................468
10.18.3 Functions and Features...............................................................................................................................468
10.18.3 Functions and Features...............................................................................................................................468
10.18.4 Working Principle and Signal Flow............................................................................................................470
10.18.4 Working Principle and Signal Flow............................................................................................................470
10.18.5 Front Panel..................................................................................................................................................472
10.18.5 Front Panel..................................................................................................................................................472
10.18.6 Jumpers and DIP Switches.........................................................................................................................475
10.18.6 Jumpers and DIP Switches.........................................................................................................................475
10.18.7 Valid Slots...................................................................................................................................................475
10.18.7 Valid Slots...................................................................................................................................................475
10.18.8 Feature Code...............................................................................................................................................475
10.18.8 Feature Code...............................................................................................................................................475
10.18.9 Configuring and Commissioning the Board...............................................................................................476
10.18.9 Configuring and Commissioning the Board...............................................................................................476
10.18.10 Parameter Settings....................................................................................................................................477
10.18.10 Parameter Settings....................................................................................................................................477
10.18.11 Maintaining the Board..............................................................................................................................477
10.18.11 Maintaining the Board..............................................................................................................................477
10.18.12 List of Alarms...........................................................................................................................................479
10.18.12 List of Alarms...........................................................................................................................................479
10.18.13 List of Performance Events......................................................................................................................481
10.18.13 List of Performance Events......................................................................................................................481
10.18.14 Technical Specifications of SLQ16..........................................................................................................482
10.18.14 Technical Specifications of SLQ16..........................................................................................................482
10.19 SLO16...............................................................................................................................................................485
10.19 SLO16...............................................................................................................................................................485
10.19.1 Version Description....................................................................................................................................486
10.19.1 Version Description....................................................................................................................................486
10.19.2 Application..................................................................................................................................................486
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Hardware Description

Contents

10.19.2 Application..................................................................................................................................................486
10.19.3 Functions and Features...............................................................................................................................487
10.19.3 Functions and Features...............................................................................................................................487
10.19.4 Working Principle and Signal Flow............................................................................................................489
10.19.4 Working Principle and Signal Flow............................................................................................................489
10.19.5 Front Panel..................................................................................................................................................491
10.19.5 Front Panel..................................................................................................................................................491
10.19.6 Jumpers and DIP Switches.........................................................................................................................492
10.19.6 Jumpers and DIP Switches.........................................................................................................................492
10.19.7 Valid Slots...................................................................................................................................................492
10.19.7 Valid Slots...................................................................................................................................................492
10.19.8 Feature Code...............................................................................................................................................492
10.19.8 Feature Code...............................................................................................................................................492
10.19.9 Configuring and Commissioning the Board...............................................................................................493
10.19.9 Configuring and Commissioning the Board...............................................................................................493
10.19.10 Parameter Settings....................................................................................................................................494
10.19.10 Parameter Settings....................................................................................................................................494
10.19.11 Maintaining the Board..............................................................................................................................494
10.19.11 Maintaining the Board..............................................................................................................................494
10.19.12 List of Alarms...........................................................................................................................................496
10.19.12 List of Alarms...........................................................................................................................................496
10.19.13 List of Performance Events......................................................................................................................498
10.19.13 List of Performance Events......................................................................................................................498
10.19.14 Technical Specifications of SLO16..........................................................................................................499
10.19.14 Technical Specifications of SLO16..........................................................................................................499
10.20 SF16..................................................................................................................................................................502
10.20 SF16..................................................................................................................................................................502
10.20.1 Version Description....................................................................................................................................502
10.20.1 Version Description....................................................................................................................................502
10.20.2 Application..................................................................................................................................................503
10.20.2 Application..................................................................................................................................................503
10.20.3 Functions and Features...............................................................................................................................503
10.20.3 Functions and Features...............................................................................................................................503
10.20.4 Working Principle and Signal Flow............................................................................................................504
10.20.4 Working Principle and Signal Flow............................................................................................................504
10.20.5 Front Panel..................................................................................................................................................507
10.20.5 Front Panel..................................................................................................................................................507
10.20.6 Valid Slots...................................................................................................................................................509
10.20.6 Valid Slots...................................................................................................................................................509
10.20.7 Feature Code...............................................................................................................................................509
10.20.7 Feature Code...............................................................................................................................................509
10.20.8 Parameter Settings......................................................................................................................................509
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System
Hardware Description

Contents

10.20.8 Parameter Settings......................................................................................................................................509


10.20.9 Technical Specifications of SF16...............................................................................................................510
10.20.9 Technical Specifications of SF16...............................................................................................................510
10.21 SF16E...............................................................................................................................................................512
10.21 SF16E...............................................................................................................................................................512
10.21.1 Version Description....................................................................................................................................512
10.21.1 Version Description....................................................................................................................................512
10.21.2 Application..................................................................................................................................................512
10.21.2 Application..................................................................................................................................................512
10.21.3 Functions and Features...............................................................................................................................513
10.21.3 Functions and Features...............................................................................................................................513
10.21.4 Working Principle and Signal Flow............................................................................................................514
10.21.4 Working Principle and Signal Flow............................................................................................................514
10.21.5 Front Panel..................................................................................................................................................517
10.21.5 Front Panel..................................................................................................................................................517
10.21.6 Jumpers and DIP Switches.........................................................................................................................519
10.21.6 Jumpers and DIP Switches.........................................................................................................................519
10.21.7 Valid Slots...................................................................................................................................................519
10.21.7 Valid Slots...................................................................................................................................................519
10.21.8 Feature Code...............................................................................................................................................519
10.21.8 Feature Code...............................................................................................................................................519
10.21.9 Configuring and Commissioning the Board...............................................................................................519
10.21.9 Configuring and Commissioning the Board...............................................................................................519
10.21.10 Parameter Settings....................................................................................................................................520
10.21.10 Parameter Settings....................................................................................................................................520
10.21.11 Maintaining the Board..............................................................................................................................521
10.21.11 Maintaining the Board..............................................................................................................................521
10.21.12 List of Alarms...........................................................................................................................................522
10.21.12 List of Alarms...........................................................................................................................................522
10.21.13 List of Performance Events......................................................................................................................523
10.21.13 List of Performance Events......................................................................................................................523
10.21.14 Technical Specifications of SF16E...........................................................................................................524
10.21.14 Technical Specifications of SF16E...........................................................................................................524
10.22 SL64..................................................................................................................................................................525
10.22 SL64..................................................................................................................................................................525
10.22.1 Version Description....................................................................................................................................525
10.22.1 Version Description....................................................................................................................................525
10.22.2 Application..................................................................................................................................................526
10.22.2 Application..................................................................................................................................................526
10.22.3 Functions and Features...............................................................................................................................526
10.22.3 Functions and Features...............................................................................................................................526
10.22.4 Working Principle and Signal Flow............................................................................................................528
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System
Hardware Description

Contents

10.22.4 Working Principle and Signal Flow............................................................................................................528


10.22.5 Front Panel..................................................................................................................................................530
10.22.5 Front Panel..................................................................................................................................................530
10.22.6 Jumpers and DIP Switches.........................................................................................................................533
10.22.6 Jumpers and DIP Switches.........................................................................................................................533
10.22.7 Valid Slots...................................................................................................................................................533
10.22.7 Valid Slots...................................................................................................................................................533
10.22.8 Feature Code...............................................................................................................................................533
10.22.8 Feature Code...............................................................................................................................................533
10.22.9 Configuring and Commissioning the Board...............................................................................................534
10.22.9 Configuring and Commissioning the Board...............................................................................................534
10.22.10 Parameter Settings....................................................................................................................................535
10.22.10 Parameter Settings....................................................................................................................................535
10.22.11 Maintaining the Board..............................................................................................................................536
10.22.11 Maintaining the Board..............................................................................................................................536
10.22.12 List of Alarms...........................................................................................................................................537
10.22.12 List of Alarms...........................................................................................................................................537
10.22.13 List of Performance Events......................................................................................................................540
10.22.13 List of Performance Events......................................................................................................................540
10.22.14 Technical Specifications of SL64.............................................................................................................542
10.22.14 Technical Specifications of SL64.............................................................................................................542
10.23 SLD64...............................................................................................................................................................547
10.23 SLD64...............................................................................................................................................................547
10.23.1 Version Description....................................................................................................................................547
10.23.1 Version Description....................................................................................................................................547
10.23.2 Application..................................................................................................................................................548
10.23.2 Application..................................................................................................................................................548
10.23.3 Functions and Features...............................................................................................................................548
10.23.3 Functions and Features...............................................................................................................................548
10.23.4 Working Principle and Signal Flow............................................................................................................550
10.23.4 Working Principle and Signal Flow............................................................................................................550
10.23.5 Front Panel..................................................................................................................................................552
10.23.5 Front Panel..................................................................................................................................................552
10.23.6 Jumpers and DIP Switches.........................................................................................................................554
10.23.6 Jumpers and DIP Switches.........................................................................................................................554
10.23.7 Valid Slots...................................................................................................................................................554
10.23.7 Valid Slots...................................................................................................................................................554
10.23.8 Feature Code...............................................................................................................................................554
10.23.8 Feature Code...............................................................................................................................................554
10.23.9 Configuring and Commissioning the Board...............................................................................................554
10.23.9 Configuring and Commissioning the Board...............................................................................................554
10.23.10 Parameter Settings....................................................................................................................................556
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Hardware Description

Contents

10.23.10 Parameter Settings....................................................................................................................................556


10.23.11 Maintaining the Board..............................................................................................................................556
10.23.11 Maintaining the Board..............................................................................................................................556
10.23.12 List of Alarms...........................................................................................................................................557
10.23.12 List of Alarms...........................................................................................................................................557
10.23.13 List of Performance Events......................................................................................................................559
10.23.13 List of Performance Events......................................................................................................................559
10.23.14 Technical Specifications of SLD64..........................................................................................................561
10.23.14 Technical Specifications of SLD64..........................................................................................................561
10.24 SF64..................................................................................................................................................................563
10.24 SF64..................................................................................................................................................................563
10.24.1 Version Description....................................................................................................................................563
10.24.1 Version Description....................................................................................................................................563
10.24.2 Application..................................................................................................................................................564
10.24.2 Application..................................................................................................................................................564
10.24.3 Functions and Features...............................................................................................................................564
10.24.3 Functions and Features...............................................................................................................................564
10.24.4 Working Principle and Signal Flow............................................................................................................566
10.24.4 Working Principle and Signal Flow............................................................................................................566
10.24.5 Front Panel..................................................................................................................................................568
10.24.5 Front Panel..................................................................................................................................................568
10.24.6 Jumpers and DIP Switches.........................................................................................................................571
10.24.6 Jumpers and DIP Switches.........................................................................................................................571
10.24.7 Valid Slots...................................................................................................................................................571
10.24.7 Valid Slots...................................................................................................................................................571
10.24.8 Feature Code...............................................................................................................................................571
10.24.8 Feature Code...............................................................................................................................................571
10.24.9 Configuring and Commissioning the Board...............................................................................................571
10.24.9 Configuring and Commissioning the Board...............................................................................................571
10.24.10 Parameter Settings....................................................................................................................................573
10.24.10 Parameter Settings....................................................................................................................................573
10.24.11 Maintaining the Board..............................................................................................................................573
10.24.11 Maintaining the Board..............................................................................................................................573
10.24.12 List of Alarms...........................................................................................................................................574
10.24.12 List of Alarms...........................................................................................................................................574
10.24.13 List of Performance Events......................................................................................................................577
10.24.13 List of Performance Events......................................................................................................................577
10.24.14 Technical Specifications of SF64.............................................................................................................578
10.24.14 Technical Specifications of SF64.............................................................................................................578
10.25 SF64A...............................................................................................................................................................581
10.25 SF64A...............................................................................................................................................................581
10.25.1 Version Description....................................................................................................................................581
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Hardware Description

Contents

10.25.1 Version Description....................................................................................................................................581


10.25.2 Application..................................................................................................................................................581
10.25.2 Application..................................................................................................................................................581
10.25.3 Functions and Features...............................................................................................................................581
10.25.3 Functions and Features...............................................................................................................................581
10.25.4 Working Principle and Signal Flow............................................................................................................583
10.25.4 Working Principle and Signal Flow............................................................................................................583
10.25.5 Front Panel..................................................................................................................................................585
10.25.5 Front Panel..................................................................................................................................................585
10.25.6 Valid Slots...................................................................................................................................................587
10.25.6 Valid Slots...................................................................................................................................................587
10.25.7 Parameter Settings......................................................................................................................................587
10.25.7 Parameter Settings......................................................................................................................................587
10.25.8 Technical Specifications of SF64A.............................................................................................................587
10.25.8 Technical Specifications of SF64A.............................................................................................................587
10.26 SFD64...............................................................................................................................................................589
10.26 SFD64...............................................................................................................................................................589
10.26.1 Version Description....................................................................................................................................589
10.26.1 Version Description....................................................................................................................................589
10.26.2 Application..................................................................................................................................................590
10.26.2 Application..................................................................................................................................................590
10.26.3 Functions and Features...............................................................................................................................590
10.26.3 Functions and Features...............................................................................................................................590
10.26.4 Working Principle and Signal Flow............................................................................................................592
10.26.4 Working Principle and Signal Flow............................................................................................................592
10.26.5 Front Panel..................................................................................................................................................594
10.26.5 Front Panel..................................................................................................................................................594
10.26.6 Jumpers and DIP Switches.........................................................................................................................596
10.26.6 Jumpers and DIP Switches.........................................................................................................................596
10.26.7 Valid Slots...................................................................................................................................................596
10.26.7 Valid Slots...................................................................................................................................................596
10.26.8 Feature Code...............................................................................................................................................596
10.26.8 Feature Code...............................................................................................................................................596
10.26.9 Configuring and Commissioning the Board...............................................................................................596
10.26.9 Configuring and Commissioning the Board...............................................................................................596
10.26.10 Parameter Settings....................................................................................................................................598
10.26.10 Parameter Settings....................................................................................................................................598
10.26.11 Maintaining the Board..............................................................................................................................598
10.26.11 Maintaining the Board..............................................................................................................................598
10.26.12 List of Alarms...........................................................................................................................................599
10.26.12 List of Alarms...........................................................................................................................................599
10.26.13 List of Performance Events......................................................................................................................600
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System
Hardware Description

Contents

10.26.13 List of Performance Events......................................................................................................................600


10.26.14 Technical Specifications of SFD64...........................................................................................................601
10.26.14 Technical Specifications of SFD64...........................................................................................................601
10.27 SLQ41...............................................................................................................................................................603
10.27 SLQ41...............................................................................................................................................................603
10.27.1 Version Description....................................................................................................................................604
10.27.1 Version Description....................................................................................................................................604
10.27.2 Application..................................................................................................................................................604
10.27.2 Application..................................................................................................................................................604
10.27.3 Functions and Features...............................................................................................................................604
10.27.3 Functions and Features...............................................................................................................................604
10.27.4 Working Principle and Signal Flow............................................................................................................606
10.27.4 Working Principle and Signal Flow............................................................................................................606
10.27.5 Front Panel..................................................................................................................................................608
10.27.5 Front Panel..................................................................................................................................................608
10.27.6 Jumpers and DIP Switches.........................................................................................................................610
10.27.6 Jumpers and DIP Switches.........................................................................................................................610
10.27.7 Valid Slots...................................................................................................................................................610
10.27.7 Valid Slots...................................................................................................................................................610
10.27.8 Feature Code...............................................................................................................................................610
10.27.8 Feature Code...............................................................................................................................................610
10.27.9 Configuring and Commissioning the Board...............................................................................................611
10.27.9 Configuring and Commissioning the Board...............................................................................................611
10.27.10 Parameter Settings....................................................................................................................................612
10.27.10 Parameter Settings....................................................................................................................................612
10.27.11 Maintaining the Board..............................................................................................................................612
10.27.11 Maintaining the Board..............................................................................................................................612
10.27.12 List of Alarms...........................................................................................................................................614
10.27.12 List of Alarms...........................................................................................................................................614
10.27.13 List of Performance Events......................................................................................................................615
10.27.13 List of Performance Events......................................................................................................................615
10.27.14 Technical Specifications of SLQ41..........................................................................................................615
10.27.14 Technical Specifications of SLQ41..........................................................................................................615
10.28 SLH41...............................................................................................................................................................620
10.28 SLH41...............................................................................................................................................................620
10.28.1 Version Description....................................................................................................................................620
10.28.1 Version Description....................................................................................................................................620
10.28.2 Application..................................................................................................................................................620
10.28.2 Application..................................................................................................................................................620
10.28.3 Functions and Features...............................................................................................................................621
10.28.3 Functions and Features...............................................................................................................................621
10.28.4 Working Principle and Signal Flow............................................................................................................622
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System
Hardware Description

Contents

10.28.4 Working Principle and Signal Flow............................................................................................................622


10.28.5 Front Panel..................................................................................................................................................624
10.28.5 Front Panel..................................................................................................................................................624
10.28.6 Jumpers and DIP Switches.........................................................................................................................627
10.28.6 Jumpers and DIP Switches.........................................................................................................................627
10.28.7 Valid Slots...................................................................................................................................................627
10.28.7 Valid Slots...................................................................................................................................................627
10.28.8 Feature Code...............................................................................................................................................628
10.28.8 Feature Code...............................................................................................................................................628
10.28.9 Configuring and Commissioning the Board...............................................................................................628
10.28.9 Configuring and Commissioning the Board...............................................................................................628
10.28.10 Parameter Settings....................................................................................................................................629
10.28.10 Parameter Settings....................................................................................................................................629
10.28.11 Maintaining the Board..............................................................................................................................630
10.28.11 Maintaining the Board..............................................................................................................................630
10.28.12 List of Alarms...........................................................................................................................................631
10.28.12 List of Alarms...........................................................................................................................................631
10.28.13 List of Performance Events......................................................................................................................632
10.28.13 List of Performance Events......................................................................................................................632
10.28.14 Technical Specifications of SLH41..........................................................................................................633
10.28.14 Technical Specifications of SLH41..........................................................................................................633
10.29 EU04.................................................................................................................................................................636
10.29 EU04.................................................................................................................................................................636
10.29.1 Version Description....................................................................................................................................636
10.29.1 Version Description....................................................................................................................................636
10.29.2 Application..................................................................................................................................................636
10.29.2 Application..................................................................................................................................................636
10.29.3 Functions and Features...............................................................................................................................636
10.29.3 Functions and Features...............................................................................................................................636
10.29.4 Working Principle and Signal Flow............................................................................................................636
10.29.4 Working Principle and Signal Flow............................................................................................................636
10.29.5 Front Panel..................................................................................................................................................637
10.29.5 Front Panel..................................................................................................................................................637
10.29.6 Valid Slots...................................................................................................................................................639
10.29.6 Valid Slots...................................................................................................................................................639
10.29.7 Technical Specifications.............................................................................................................................639
10.29.7 Technical Specifications.............................................................................................................................639
10.30 EU08.................................................................................................................................................................640
10.30 EU08.................................................................................................................................................................640
10.30.1 Version Description....................................................................................................................................640
10.30.1 Version Description....................................................................................................................................640
10.30.2 Application..................................................................................................................................................640
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Hardware Description

Contents

10.30.2 Application..................................................................................................................................................640
10.30.3 Functions and Features...............................................................................................................................640
10.30.3 Functions and Features...............................................................................................................................640
10.30.4 Working Principle and Signal Flow............................................................................................................640
10.30.4 Working Principle and Signal Flow............................................................................................................640
10.30.5 Front Panel..................................................................................................................................................641
10.30.5 Front Panel..................................................................................................................................................641
10.30.6 Valid Slots...................................................................................................................................................643
10.30.6 Valid Slots...................................................................................................................................................643
10.30.7 Technical Specifications.............................................................................................................................644
10.30.7 Technical Specifications.............................................................................................................................644
10.31 OU08................................................................................................................................................................644
10.31 OU08................................................................................................................................................................644
10.31.1 Version Description....................................................................................................................................645
10.31.1 Version Description....................................................................................................................................645
10.31.2 Application..................................................................................................................................................645
10.31.2 Application..................................................................................................................................................645
10.31.3 Functions and Features...............................................................................................................................645
10.31.3 Functions and Features...............................................................................................................................645
10.31.4 Working Principle and Signal Flow............................................................................................................645
10.31.4 Working Principle and Signal Flow............................................................................................................645
10.31.5 Front Panel..................................................................................................................................................646
10.31.5 Front Panel..................................................................................................................................................646
10.31.6 Valid Slots...................................................................................................................................................649
10.31.6 Valid Slots...................................................................................................................................................649
10.31.7 Technical Specifications.............................................................................................................................650
10.31.7 Technical Specifications.............................................................................................................................650

11 PDH Boards................................................................................................................................653
11.1 PQ1.....................................................................................................................................................................655
11.1 PQ1.....................................................................................................................................................................655
11.1.1 Version Description.......................................................................................................................................655
11.1.1 Version Description.......................................................................................................................................655
11.1.2 Application....................................................................................................................................................655
11.1.2 Application....................................................................................................................................................655
11.1.3 Functions and Features.................................................................................................................................656
11.1.3 Functions and Features.................................................................................................................................656
11.1.4 Working Principle and Signal Flow..............................................................................................................657
11.1.4 Working Principle and Signal Flow..............................................................................................................657
11.1.5 Front Panel....................................................................................................................................................660
11.1.5 Front Panel....................................................................................................................................................660
11.1.6 Jumpers and DIP Switches............................................................................................................................661
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Hardware Description

Contents

11.1.6 Jumpers and DIP Switches............................................................................................................................661


11.1.7 Valid Slots.....................................................................................................................................................661
11.1.7 Valid Slots.....................................................................................................................................................661
11.1.8 Feature Code.................................................................................................................................................662
11.1.8 Feature Code.................................................................................................................................................662
11.1.9 Board Protection...........................................................................................................................................662
11.1.9 Board Protection...........................................................................................................................................662
11.1.10 Configuring and Commissioning the Board...............................................................................................664
11.1.10 Configuring and Commissioning the Board...............................................................................................664
11.1.11 Parameter Settings......................................................................................................................................666
11.1.11 Parameter Settings......................................................................................................................................666
11.1.12 Maintaining the Board................................................................................................................................666
11.1.12 Maintaining the Board................................................................................................................................666
11.1.13 List of Alarms.............................................................................................................................................667
11.1.13 List of Alarms.............................................................................................................................................667
11.1.14 List of Performance Events.........................................................................................................................668
11.1.14 List of Performance Events.........................................................................................................................668
11.1.15 Technical Specifications.............................................................................................................................668
11.1.15 Technical Specifications.............................................................................................................................668
11.2 PQM....................................................................................................................................................................669
11.2 PQM....................................................................................................................................................................669
11.2.1 Version Description.......................................................................................................................................669
11.2.1 Version Description.......................................................................................................................................669
11.2.2 Application....................................................................................................................................................669
11.2.2 Application....................................................................................................................................................669
11.2.3 Functions and Features.................................................................................................................................670
11.2.3 Functions and Features.................................................................................................................................670
11.2.4 Working Principle and Signal Flow..............................................................................................................671
11.2.4 Working Principle and Signal Flow..............................................................................................................671
11.2.5 Front Panel....................................................................................................................................................673
11.2.5 Front Panel....................................................................................................................................................673
11.2.6 Jumpers and DIP Switches............................................................................................................................675
11.2.6 Jumpers and DIP Switches............................................................................................................................675
11.2.7 Valid Slots.....................................................................................................................................................675
11.2.7 Valid Slots.....................................................................................................................................................675
11.2.8 Feature Code.................................................................................................................................................675
11.2.8 Feature Code.................................................................................................................................................675
11.2.9 Board Protection...........................................................................................................................................676
11.2.9 Board Protection...........................................................................................................................................676
11.2.10 Configuring and Commissioning the Board...............................................................................................677
11.2.10 Configuring and Commissioning the Board...............................................................................................677
11.2.11 Parameter Settings......................................................................................................................................679
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System
Hardware Description

Contents

11.2.11 Parameter Settings......................................................................................................................................679


11.2.12 Maintaining the Board................................................................................................................................679
11.2.12 Maintaining the Board................................................................................................................................679
11.2.13 List of Alarms.............................................................................................................................................680
11.2.13 List of Alarms.............................................................................................................................................680
11.2.14 List of Performance Events.........................................................................................................................681
11.2.14 List of Performance Events.........................................................................................................................681
11.2.15 Technical Specifications.............................................................................................................................681
11.2.15 Technical Specifications.............................................................................................................................681
11.3 PFL1....................................................................................................................................................................681
11.3 PFL1....................................................................................................................................................................681
11.3.1 Version Description.......................................................................................................................................681
11.3.1 Version Description.......................................................................................................................................681
11.3.2 Application....................................................................................................................................................682
11.3.2 Application....................................................................................................................................................682
11.3.3 Functions and Features.................................................................................................................................682
11.3.3 Functions and Features.................................................................................................................................682
11.3.4 Working Principle and Signal Flow..............................................................................................................683
11.3.4 Working Principle and Signal Flow..............................................................................................................683
11.3.5 Front Panel....................................................................................................................................................685
11.3.5 Front Panel....................................................................................................................................................685
11.3.6 Jumpers and DIP Switches............................................................................................................................686
11.3.6 Jumpers and DIP Switches............................................................................................................................686
11.3.7 Valid Slots.....................................................................................................................................................686
11.3.7 Valid Slots.....................................................................................................................................................686
11.3.8 Feature Code.................................................................................................................................................686
11.3.8 Feature Code.................................................................................................................................................686
11.3.9 Configuring and Commissioning the Board.................................................................................................686
11.3.9 Configuring and Commissioning the Board.................................................................................................686
11.3.10 Parameter Settings......................................................................................................................................688
11.3.10 Parameter Settings......................................................................................................................................688
11.3.11 Maintaining the Board................................................................................................................................688
11.3.11 Maintaining the Board................................................................................................................................688
11.3.12 List of Alarms.............................................................................................................................................689
11.3.12 List of Alarms.............................................................................................................................................689
11.3.13 List of Performance Events.........................................................................................................................689
11.3.13 List of Performance Events.........................................................................................................................689
11.3.14 Technical Specifications.............................................................................................................................690
11.3.14 Technical Specifications.............................................................................................................................690
11.4 PL3......................................................................................................................................................................691
11.4 PL3......................................................................................................................................................................691
11.4.1 Version Description.......................................................................................................................................691
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Hardware Description

Contents

11.4.1 Version Description.......................................................................................................................................691


11.4.2 Application....................................................................................................................................................691
11.4.2 Application....................................................................................................................................................691
11.4.3 Functions and Features.................................................................................................................................692
11.4.3 Functions and Features.................................................................................................................................692
11.4.4 Working Principle and Signal Flow..............................................................................................................693
11.4.4 Working Principle and Signal Flow..............................................................................................................693
11.4.5 Front Panel....................................................................................................................................................696
11.4.5 Front Panel....................................................................................................................................................696
11.4.6 Jumpers and DIP Switches............................................................................................................................697
11.4.6 Jumpers and DIP Switches............................................................................................................................697
11.4.7 Valid Slots.....................................................................................................................................................697
11.4.7 Valid Slots.....................................................................................................................................................697
11.4.8 Feature Code.................................................................................................................................................697
11.4.8 Feature Code.................................................................................................................................................697
11.4.9 Board Protection...........................................................................................................................................697
11.4.9 Board Protection...........................................................................................................................................697
11.4.10 Configuring and Commissioning the Board...............................................................................................700
11.4.10 Configuring and Commissioning the Board...............................................................................................700
11.4.11 Parameter Settings......................................................................................................................................701
11.4.11 Parameter Settings......................................................................................................................................701
11.4.12 Maintaining the Board................................................................................................................................701
11.4.12 Maintaining the Board................................................................................................................................701
11.4.13 List of Alarms.............................................................................................................................................702
11.4.13 List of Alarms.............................................................................................................................................702
11.4.14 List of Performance Events.........................................................................................................................703
11.4.14 List of Performance Events.........................................................................................................................703
11.4.15 Technical Specifications.............................................................................................................................704
11.4.15 Technical Specifications.............................................................................................................................704
11.5 PL3A...................................................................................................................................................................705
11.5 PL3A...................................................................................................................................................................705
11.5.1 Version Description.......................................................................................................................................705
11.5.1 Version Description.......................................................................................................................................705
11.5.2 Application....................................................................................................................................................705
11.5.2 Application....................................................................................................................................................705
11.5.3 Functions and Features.................................................................................................................................706
11.5.3 Functions and Features.................................................................................................................................706
11.5.4 Working Principle and Signal Flow..............................................................................................................707
11.5.4 Working Principle and Signal Flow..............................................................................................................707
11.5.5 Front Panel....................................................................................................................................................709
11.5.5 Front Panel....................................................................................................................................................709
11.5.6 Jumpers and DIP Switches............................................................................................................................711
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Hardware Description

Contents

11.5.6 Jumpers and DIP Switches............................................................................................................................711


11.5.7 Valid Slots.....................................................................................................................................................711
11.5.7 Valid Slots.....................................................................................................................................................711
11.5.8 Feature Code.................................................................................................................................................711
11.5.8 Feature Code.................................................................................................................................................711
11.5.9 Configuring and Commissioning the Board.................................................................................................711
11.5.9 Configuring and Commissioning the Board.................................................................................................711
11.5.10 Parameter Settings......................................................................................................................................712
11.5.10 Parameter Settings......................................................................................................................................712
11.5.11 Maintaining the Board................................................................................................................................713
11.5.11 Maintaining the Board................................................................................................................................713
11.5.12 List of Alarms.............................................................................................................................................714
11.5.12 List of Alarms.............................................................................................................................................714
11.5.13 List of Performance Events.........................................................................................................................715
11.5.13 List of Performance Events.........................................................................................................................715
11.5.14 Technical Specifications.............................................................................................................................716
11.5.14 Technical Specifications.............................................................................................................................716
11.6 PD3.....................................................................................................................................................................717
11.6 PD3.....................................................................................................................................................................717
11.6.1 Version Description.......................................................................................................................................717
11.6.1 Version Description.......................................................................................................................................717
11.6.2 Application....................................................................................................................................................717
11.6.2 Application....................................................................................................................................................717
11.6.3 Functions and Features.................................................................................................................................718
11.6.3 Functions and Features.................................................................................................................................718
11.6.4 Working Principle and Signal Flow..............................................................................................................719
11.6.4 Working Principle and Signal Flow..............................................................................................................719
11.6.5 Front Panel....................................................................................................................................................721
11.6.5 Front Panel....................................................................................................................................................721
11.6.6 Valid Slots.....................................................................................................................................................723
11.6.6 Valid Slots.....................................................................................................................................................723
11.6.7 Board Protection...........................................................................................................................................723
11.6.7 Board Protection...........................................................................................................................................723
11.6.8 Parameter Settings........................................................................................................................................726
11.6.8 Parameter Settings........................................................................................................................................726
11.6.9 Technical Specifications...............................................................................................................................726
11.6.9 Technical Specifications...............................................................................................................................726
11.7 PQ3.....................................................................................................................................................................726
11.7 PQ3.....................................................................................................................................................................726
11.7.1 Version Description.......................................................................................................................................726
11.7.1 Version Description.......................................................................................................................................726
11.7.2 Application....................................................................................................................................................726
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System
Hardware Description

Contents

11.7.2 Application....................................................................................................................................................726
11.7.3 Functions and Features.................................................................................................................................727
11.7.3 Functions and Features.................................................................................................................................727
11.7.4 Working Principle and Signal Flow..............................................................................................................728
11.7.4 Working Principle and Signal Flow..............................................................................................................728
11.7.5 Front Panel....................................................................................................................................................730
11.7.5 Front Panel....................................................................................................................................................730
11.7.6 Valid Slots.....................................................................................................................................................732
11.7.6 Valid Slots.....................................................................................................................................................732
11.7.7 Board Protection...........................................................................................................................................732
11.7.7 Board Protection...........................................................................................................................................732
11.7.8 Parameter Settings........................................................................................................................................734
11.7.8 Parameter Settings........................................................................................................................................734
11.7.9 Technical Specifications...............................................................................................................................735
11.7.9 Technical Specifications...............................................................................................................................735
11.8 DX1.....................................................................................................................................................................735
11.8 DX1.....................................................................................................................................................................735
11.8.1 Version Description.......................................................................................................................................735
11.8.1 Version Description.......................................................................................................................................735
11.8.2 Application....................................................................................................................................................735
11.8.2 Application....................................................................................................................................................735
11.8.3 Functions and Features.................................................................................................................................736
11.8.3 Functions and Features.................................................................................................................................736
11.8.4 Working Principle and Signal Flow..............................................................................................................737
11.8.4 Working Principle and Signal Flow..............................................................................................................737
11.8.5 Front Panel....................................................................................................................................................738
11.8.5 Front Panel....................................................................................................................................................738
11.8.6 Jumpers and DIP Switches............................................................................................................................740
11.8.6 Jumpers and DIP Switches............................................................................................................................740
11.8.7 Valid Slots.....................................................................................................................................................740
11.8.7 Valid Slots.....................................................................................................................................................740
11.8.8 Feature Code.................................................................................................................................................740
11.8.8 Feature Code.................................................................................................................................................740
11.8.9 Board Protection...........................................................................................................................................741
11.8.9 Board Protection...........................................................................................................................................741
11.8.10 Configuring and Commissioning the Board...............................................................................................742
11.8.10 Configuring and Commissioning the Board...............................................................................................742
11.8.11 Parameter Settings......................................................................................................................................744
11.8.11 Parameter Settings......................................................................................................................................744
11.8.12 Maintaining the Board................................................................................................................................744
11.8.12 Maintaining the Board................................................................................................................................744
11.8.13 List of Alarms.............................................................................................................................................745
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System
Hardware Description

Contents

11.8.13 List of Alarms.............................................................................................................................................745


11.8.14 List of Performance Events.........................................................................................................................746
11.8.14 List of Performance Events.........................................................................................................................746
11.8.15 Technical Specifications.............................................................................................................................746
11.8.15 Technical Specifications.............................................................................................................................746
11.9 DXA....................................................................................................................................................................747
11.9 DXA....................................................................................................................................................................747
11.9.1 Version Description.......................................................................................................................................747
11.9.1 Version Description.......................................................................................................................................747
11.9.2 Application....................................................................................................................................................747
11.9.2 Application....................................................................................................................................................747
11.9.3 Functions and Features.................................................................................................................................747
11.9.3 Functions and Features.................................................................................................................................747
11.9.4 Working Principle and Signal Flow..............................................................................................................748
11.9.4 Working Principle and Signal Flow..............................................................................................................748
11.9.5 Front Panel....................................................................................................................................................749
11.9.5 Front Panel....................................................................................................................................................749
11.9.6 Valid Slots.....................................................................................................................................................751
11.9.6 Valid Slots.....................................................................................................................................................751
11.9.7 Parameter Settings........................................................................................................................................751
11.9.7 Parameter Settings........................................................................................................................................751
11.9.8 Technical Specifications...............................................................................................................................751
11.9.8 Technical Specifications...............................................................................................................................751
11.10 SPQ4.................................................................................................................................................................751
11.10 SPQ4.................................................................................................................................................................751
11.10.1 Version Description.....................................................................................................................................751
11.10.1 Version Description.....................................................................................................................................751
11.10.2 Application..................................................................................................................................................752
11.10.2 Application..................................................................................................................................................752
11.10.3 Functions and Features...............................................................................................................................752
11.10.3 Functions and Features...............................................................................................................................752
11.10.4 Working Principle and Signal Flow............................................................................................................753
11.10.4 Working Principle and Signal Flow............................................................................................................753
11.10.5 Front Panel..................................................................................................................................................757
11.10.5 Front Panel..................................................................................................................................................757
11.10.6 Jumpers and DIP Switches..........................................................................................................................759
11.10.6 Jumpers and DIP Switches..........................................................................................................................759
11.10.7 Valid Slots...................................................................................................................................................759
11.10.7 Valid Slots...................................................................................................................................................759
11.10.8 Feature Code...............................................................................................................................................759
11.10.8 Feature Code...............................................................................................................................................759
11.10.9 Board Protection.........................................................................................................................................759
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System
Hardware Description

Contents

11.10.9 Board Protection.........................................................................................................................................759


11.10.10 Configuring and Commissioning the Board.............................................................................................762
11.10.10 Configuring and Commissioning the Board.............................................................................................762
11.10.11 Parameter Settings....................................................................................................................................763
11.10.11 Parameter Settings....................................................................................................................................763
11.10.12 Maintaining the Board..............................................................................................................................763
11.10.12 Maintaining the Board..............................................................................................................................763
11.10.13 List of Alarms...........................................................................................................................................764
11.10.13 List of Alarms...........................................................................................................................................764
11.10.14 List of Performance Events.......................................................................................................................766
11.10.14 List of Performance Events.......................................................................................................................766
11.10.15 Technical Specifications...........................................................................................................................767
11.10.15 Technical Specifications...........................................................................................................................767
11.11 D12B.................................................................................................................................................................767
11.11 D12B.................................................................................................................................................................767
11.11.1 Version Description.....................................................................................................................................767
11.11.1 Version Description.....................................................................................................................................767
11.11.2 Application..................................................................................................................................................767
11.11.2 Application..................................................................................................................................................767
11.11.3 Functions and Features...............................................................................................................................767
11.11.3 Functions and Features...............................................................................................................................767
11.11.4 Working Principle and Signal Flow............................................................................................................768
11.11.4 Working Principle and Signal Flow............................................................................................................768
11.11.5 Front Panel..................................................................................................................................................768
11.11.5 Front Panel..................................................................................................................................................768
11.11.6 Valid Slots...................................................................................................................................................770
11.11.6 Valid Slots...................................................................................................................................................770
11.11.7 Technical Specifications.............................................................................................................................771
11.11.7 Technical Specifications.............................................................................................................................771
11.12 D12S.................................................................................................................................................................772
11.12 D12S.................................................................................................................................................................772
11.12.1 Version Description.....................................................................................................................................772
11.12.1 Version Description.....................................................................................................................................772
11.12.2 Application..................................................................................................................................................772
11.12.2 Application..................................................................................................................................................772
11.12.3 Functions and Features...............................................................................................................................772
11.12.3 Functions and Features...............................................................................................................................772
11.12.4 Working Principle and Signal Flow............................................................................................................772
11.12.4 Working Principle and Signal Flow............................................................................................................772
11.12.5 Front Panel..................................................................................................................................................773
11.12.5 Front Panel..................................................................................................................................................773
11.12.6 Valid Slots...................................................................................................................................................775
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System
Hardware Description

Contents

11.12.6 Valid Slots...................................................................................................................................................775


11.12.7 Technical Specifications.............................................................................................................................776
11.12.7 Technical Specifications.............................................................................................................................776
11.13 D75S.................................................................................................................................................................777
11.13 D75S.................................................................................................................................................................777
11.13.1 Version Description.....................................................................................................................................777
11.13.1 Version Description.....................................................................................................................................777
11.13.2 Application..................................................................................................................................................777
11.13.2 Application..................................................................................................................................................777
11.13.3 Functions and Features...............................................................................................................................777
11.13.3 Functions and Features...............................................................................................................................777
11.13.4 Working Principle and Signal Flow............................................................................................................777
11.13.4 Working Principle and Signal Flow............................................................................................................777
11.13.5 Front Panel..................................................................................................................................................779
11.13.5 Front Panel..................................................................................................................................................779
11.13.6 Valid Slots...................................................................................................................................................781
11.13.6 Valid Slots...................................................................................................................................................781
11.13.7 Technical Specifications.............................................................................................................................781
11.13.7 Technical Specifications.............................................................................................................................781
11.14 D34S.................................................................................................................................................................782
11.14 D34S.................................................................................................................................................................782
11.14.1 Version Description.....................................................................................................................................782
11.14.1 Version Description.....................................................................................................................................782
11.14.2 Application..................................................................................................................................................782
11.14.2 Application..................................................................................................................................................782
11.14.3 Functions and Features...............................................................................................................................782
11.14.3 Functions and Features...............................................................................................................................782
11.14.4 Working Principle and Signal Flow............................................................................................................782
11.14.4 Working Principle and Signal Flow............................................................................................................782
11.14.5 Front Panel..................................................................................................................................................783
11.14.5 Front Panel..................................................................................................................................................783
11.14.6 Valid Slots...................................................................................................................................................785
11.14.6 Valid Slots...................................................................................................................................................785
11.14.7 Technical Specifications.............................................................................................................................785
11.14.7 Technical Specifications.............................................................................................................................785
11.15 C34S..................................................................................................................................................................786
11.15 C34S..................................................................................................................................................................786
11.15.1 Version Description.....................................................................................................................................786
11.15.1 Version Description.....................................................................................................................................786
11.15.2 Application..................................................................................................................................................786
11.15.2 Application..................................................................................................................................................786
11.15.3 Functions and Features...............................................................................................................................786
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System
Hardware Description

Contents

11.15.3 Functions and Features...............................................................................................................................786


11.15.4 Working Principle and Signal Flow............................................................................................................786
11.15.4 Working Principle and Signal Flow............................................................................................................786
11.15.5 Front Panel..................................................................................................................................................787
11.15.5 Front Panel..................................................................................................................................................787
11.15.6 Valid Slots...................................................................................................................................................789
11.15.6 Valid Slots...................................................................................................................................................789
11.15.7 Technical Specifications.............................................................................................................................789
11.15.7 Technical Specifications.............................................................................................................................789
11.16 MU04................................................................................................................................................................790
11.16 MU04................................................................................................................................................................790
11.16.1 Version Description.....................................................................................................................................790
11.16.1 Version Description.....................................................................................................................................790
11.16.2 Application..................................................................................................................................................790
11.16.2 Application..................................................................................................................................................790
11.16.3 Functions and Features...............................................................................................................................790
11.16.3 Functions and Features...............................................................................................................................790
11.16.4 Working Principle and Signal Flow............................................................................................................790
11.16.4 Working Principle and Signal Flow............................................................................................................790
11.16.5 Front Panel..................................................................................................................................................791
11.16.5 Front Panel..................................................................................................................................................791
11.16.6 Valid Slots...................................................................................................................................................793
11.16.6 Valid Slots...................................................................................................................................................793
11.16.7 Technical Specifications.............................................................................................................................793
11.16.7 Technical Specifications.............................................................................................................................793
11.17 DM12................................................................................................................................................................794
11.17 DM12................................................................................................................................................................794
11.17.1 Version Description.....................................................................................................................................794
11.17.1 Version Description.....................................................................................................................................794
11.17.2 Application..................................................................................................................................................794
11.17.2 Application..................................................................................................................................................794
11.17.3 Functions and Features...............................................................................................................................794
11.17.3 Functions and Features...............................................................................................................................794
11.17.4 Working Principle and Signal Flow............................................................................................................794
11.17.4 Working Principle and Signal Flow............................................................................................................794
11.17.5 Front Panel..................................................................................................................................................795
11.17.5 Front Panel..................................................................................................................................................795
11.17.6 Valid Slots...................................................................................................................................................798
11.17.6 Valid Slots...................................................................................................................................................798
11.17.7 Technical Specifications.............................................................................................................................799
11.17.7 Technical Specifications.............................................................................................................................799
11.18 TSB4.................................................................................................................................................................799
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OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

Contents

11.18 TSB4.................................................................................................................................................................799
11.18.1 Version Description.....................................................................................................................................799
11.18.1 Version Description.....................................................................................................................................799
11.18.2 Application..................................................................................................................................................800
11.18.2 Application..................................................................................................................................................800
11.18.3 Functions and Features...............................................................................................................................800
11.18.3 Functions and Features...............................................................................................................................800
11.18.4 Working Principle and Signal Flow............................................................................................................800
11.18.4 Working Principle and Signal Flow............................................................................................................800
11.18.5 Front Panel..................................................................................................................................................801
11.18.5 Front Panel..................................................................................................................................................801
11.18.6 Valid Slots...................................................................................................................................................801
11.18.6 Valid Slots...................................................................................................................................................801
11.18.7 Technical Specifications.............................................................................................................................803
11.18.7 Technical Specifications.............................................................................................................................803
11.19 TSB8.................................................................................................................................................................803
11.19 TSB8.................................................................................................................................................................803
11.19.1 Version Description.....................................................................................................................................803
11.19.1 Version Description.....................................................................................................................................803
11.19.2 Application..................................................................................................................................................803
11.19.2 Application..................................................................................................................................................803
11.19.3 Functions and Features...............................................................................................................................803
11.19.3 Functions and Features...............................................................................................................................803
11.19.4 Working Principle and Signal Flow............................................................................................................804
11.19.4 Working Principle and Signal Flow............................................................................................................804
11.19.5 Front Panel..................................................................................................................................................804
11.19.5 Front Panel..................................................................................................................................................804
11.19.6 Valid Slots...................................................................................................................................................805
11.19.6 Valid Slots...................................................................................................................................................805
11.19.7 Technical Specifications.............................................................................................................................809
11.19.7 Technical Specifications.............................................................................................................................809

12 EoS Boards.................................................................................................................................810
12.1 EFT8...................................................................................................................................................................811
12.1 EFT8...................................................................................................................................................................811
12.1.1 Version Description......................................................................................................................................812
12.1.1 Version Description......................................................................................................................................812
12.1.2 Application....................................................................................................................................................812
12.1.2 Application....................................................................................................................................................812
12.1.3 Functions and Features.................................................................................................................................813
12.1.3 Functions and Features.................................................................................................................................813
12.1.4 Working Principle and Signal Flow..............................................................................................................817
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System
Hardware Description

Contents

12.1.4 Working Principle and Signal Flow..............................................................................................................817


12.1.5 Front Panel....................................................................................................................................................819
12.1.5 Front Panel....................................................................................................................................................819
12.1.6 Jumpers and DIP Switches...........................................................................................................................822
12.1.6 Jumpers and DIP Switches...........................................................................................................................822
12.1.7 Valid Slots.....................................................................................................................................................822
12.1.7 Valid Slots.....................................................................................................................................................822
12.1.8 Feature Code.................................................................................................................................................822
12.1.8 Feature Code.................................................................................................................................................822
12.1.9 Configuring and Commissioning the Board.................................................................................................822
12.1.9 Configuring and Commissioning the Board.................................................................................................822
12.1.10 Configuring the Board Functions...............................................................................................................823
12.1.10 Configuring the Board Functions...............................................................................................................823
12.1.11 Parameter Settings......................................................................................................................................824
12.1.11 Parameter Settings......................................................................................................................................824
12.1.12 Maintaining the Board................................................................................................................................824
12.1.12 Maintaining the Board................................................................................................................................824
12.1.13 List of Alarms.............................................................................................................................................825
12.1.13 List of Alarms.............................................................................................................................................825
12.1.14 List of Performance Events........................................................................................................................827
12.1.14 List of Performance Events........................................................................................................................827
12.1.15 Technical Specifications of EFT8...............................................................................................................829
12.1.15 Technical Specifications of EFT8...............................................................................................................829
12.2 EFT8A................................................................................................................................................................833
12.2 EFT8A................................................................................................................................................................833
12.2.1 Version Description......................................................................................................................................834
12.2.1 Version Description......................................................................................................................................834
12.2.2 Application....................................................................................................................................................834
12.2.2 Application....................................................................................................................................................834
12.2.3 Functions and Features.................................................................................................................................835
12.2.3 Functions and Features.................................................................................................................................835
12.2.4 Working Principle and Signal Flow..............................................................................................................839
12.2.4 Working Principle and Signal Flow..............................................................................................................839
12.2.5 Front Panel....................................................................................................................................................841
12.2.5 Front Panel....................................................................................................................................................841
12.2.6 Jumpers and DIP Switches...........................................................................................................................843
12.2.6 Jumpers and DIP Switches...........................................................................................................................843
12.2.7 Valid Slots.....................................................................................................................................................843
12.2.7 Valid Slots.....................................................................................................................................................843
12.2.8 Feature Code.................................................................................................................................................843
12.2.8 Feature Code.................................................................................................................................................843
12.2.9 Configuring and Commissioning the Board.................................................................................................843
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Technologies Co., Ltd.

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OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

Contents

12.2.9 Configuring and Commissioning the Board.................................................................................................843


12.2.10 Configuring the Board Functions...............................................................................................................844
12.2.10 Configuring the Board Functions...............................................................................................................844
12.2.11 Parameter Settings......................................................................................................................................845
12.2.11 Parameter Settings......................................................................................................................................845
12.2.12 Maintaining the Board................................................................................................................................845
12.2.12 Maintaining the Board................................................................................................................................845
12.2.13 List of Alarms.............................................................................................................................................846
12.2.13 List of Alarms.............................................................................................................................................846
12.2.14 List of Performance Events........................................................................................................................848
12.2.14 List of Performance Events........................................................................................................................848
12.2.15 Technical Specifications of EFT8A............................................................................................................850
12.2.15 Technical Specifications of EFT8A............................................................................................................850
12.3 EGT2..................................................................................................................................................................855
12.3 EGT2..................................................................................................................................................................855
12.3.1 Version Description......................................................................................................................................855
12.3.1 Version Description......................................................................................................................................855
12.3.2 Application....................................................................................................................................................855
12.3.2 Application....................................................................................................................................................855
12.3.3 Functions and Features.................................................................................................................................856
12.3.3 Functions and Features.................................................................................................................................856
12.3.4 Working Principle and Signal Flow..............................................................................................................860
12.3.4 Working Principle and Signal Flow..............................................................................................................860
12.3.5 Front Panel....................................................................................................................................................861
12.3.5 Front Panel....................................................................................................................................................861
12.3.6 Jumpers and DIP Switches...........................................................................................................................864
12.3.6 Jumpers and DIP Switches...........................................................................................................................864
12.3.7 Valid Slots.....................................................................................................................................................864
12.3.7 Valid Slots.....................................................................................................................................................864
12.3.8 Feature Code.................................................................................................................................................865
12.3.8 Feature Code.................................................................................................................................................865
12.3.9 Configuring and Commissioning the Board.................................................................................................865
12.3.9 Configuring and Commissioning the Board.................................................................................................865
12.3.10 Configuring the Board Functions...............................................................................................................867
12.3.10 Configuring the Board Functions...............................................................................................................867
12.3.11 Parameter Settings......................................................................................................................................867
12.3.11 Parameter Settings......................................................................................................................................867
12.3.12 Maintaining the Board................................................................................................................................867
12.3.12 Maintaining the Board................................................................................................................................867
12.3.13 List of Alarms.............................................................................................................................................868
12.3.13 List of Alarms.............................................................................................................................................868
12.3.14 List of Performance Events........................................................................................................................869
Issue 02 (2013-01-18)

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System
Hardware Description

Contents

12.3.14 List of Performance Events........................................................................................................................869


12.3.15 Technical Specifications.............................................................................................................................873
12.3.15 Technical Specifications.............................................................................................................................873
12.4 EFS0...................................................................................................................................................................882
12.4 EFS0...................................................................................................................................................................882
12.4.1 Version Description......................................................................................................................................882
12.4.1 Version Description......................................................................................................................................882
12.4.2 Application....................................................................................................................................................882
12.4.2 Application....................................................................................................................................................882
12.4.3 Functions and Features.................................................................................................................................883
12.4.3 Functions and Features.................................................................................................................................883
12.4.4 Working Principle and Signal Flow..............................................................................................................889
12.4.4 Working Principle and Signal Flow..............................................................................................................889
12.4.5 Front Panel....................................................................................................................................................892
12.4.5 Front Panel....................................................................................................................................................892
12.4.6 Jumpers and DIP Switches...........................................................................................................................893
12.4.6 Jumpers and DIP Switches...........................................................................................................................893
12.4.7 Valid Slots.....................................................................................................................................................893
12.4.7 Valid Slots.....................................................................................................................................................893
12.4.8 Feature Code.................................................................................................................................................894
12.4.8 Feature Code.................................................................................................................................................894
12.4.9 Board Protection...........................................................................................................................................894
12.4.9 Board Protection...........................................................................................................................................894
12.4.10 Configuring and Commissioning the Board...............................................................................................895
12.4.10 Configuring and Commissioning the Board...............................................................................................895
12.4.11 Configuring the Board Functions...............................................................................................................896
12.4.11 Configuring the Board Functions...............................................................................................................896
12.4.12 Parameter Settings......................................................................................................................................897
12.4.12 Parameter Settings......................................................................................................................................897
12.4.13 Maintaining the Board................................................................................................................................897
12.4.13 Maintaining the Board................................................................................................................................897
12.4.14 List of Alarms.............................................................................................................................................898
12.4.14 List of Alarms.............................................................................................................................................898
12.4.15 List of Performance Events........................................................................................................................901
12.4.15 List of Performance Events........................................................................................................................901
12.4.16 Technical Specifications.............................................................................................................................907
12.4.16 Technical Specifications.............................................................................................................................907
12.5 EFS0A................................................................................................................................................................915
12.5 EFS0A................................................................................................................................................................915
12.5.1 Version Description......................................................................................................................................915
12.5.1 Version Description......................................................................................................................................915
12.5.2 Application....................................................................................................................................................915
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System
Hardware Description

Contents

12.5.2 Application....................................................................................................................................................915
12.5.3 Functions and Features.................................................................................................................................916
12.5.3 Functions and Features.................................................................................................................................916
12.5.4 Working Principle and Signal Flow..............................................................................................................921
12.5.4 Working Principle and Signal Flow..............................................................................................................921
12.5.5 Front Panel....................................................................................................................................................924
12.5.5 Front Panel....................................................................................................................................................924
12.5.6 Jumpers and DIP Switches...........................................................................................................................925
12.5.6 Jumpers and DIP Switches...........................................................................................................................925
12.5.7 Valid Slots.....................................................................................................................................................925
12.5.7 Valid Slots.....................................................................................................................................................925
12.5.8 Feature Code.................................................................................................................................................926
12.5.8 Feature Code.................................................................................................................................................926
12.5.9 Board Protection...........................................................................................................................................926
12.5.9 Board Protection...........................................................................................................................................926
12.5.10 Configuring and Commissioning the Board...............................................................................................927
12.5.10 Configuring and Commissioning the Board...............................................................................................927
12.5.11 Configuring the Board Functions...............................................................................................................928
12.5.11 Configuring the Board Functions...............................................................................................................928
12.5.12 Parameter Settings......................................................................................................................................929
12.5.12 Parameter Settings......................................................................................................................................929
12.5.13 Maintaining the Board................................................................................................................................929
12.5.13 Maintaining the Board................................................................................................................................929
12.5.14 List of Alarms.............................................................................................................................................930
12.5.14 List of Alarms.............................................................................................................................................930
12.5.15 List of Performance Events........................................................................................................................931
12.5.15 List of Performance Events........................................................................................................................931
12.5.16 Technical Specifications.............................................................................................................................932
12.5.16 Technical Specifications.............................................................................................................................932
12.6 EFS4...................................................................................................................................................................936
12.6 EFS4...................................................................................................................................................................936
12.6.1 Version Description......................................................................................................................................936
12.6.1 Version Description......................................................................................................................................936
12.6.2 Application....................................................................................................................................................937
12.6.2 Application....................................................................................................................................................937
12.6.3 Functions and Features.................................................................................................................................938
12.6.3 Functions and Features.................................................................................................................................938
12.6.4 Working Principle and Signal Flow..............................................................................................................943
12.6.4 Working Principle and Signal Flow..............................................................................................................943
12.6.5 Front Panel....................................................................................................................................................946
12.6.5 Front Panel....................................................................................................................................................946
12.6.6 Jumpers and DIP Switches...........................................................................................................................948
Issue 02 (2013-01-18)

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System
Hardware Description

Contents

12.6.6 Jumpers and DIP Switches...........................................................................................................................948


12.6.7 Valid Slots.....................................................................................................................................................948
12.6.7 Valid Slots.....................................................................................................................................................948
12.6.8 Feature Code.................................................................................................................................................948
12.6.8 Feature Code.................................................................................................................................................948
12.6.9 Configuring and Commissioning the Board.................................................................................................948
12.6.9 Configuring and Commissioning the Board.................................................................................................948
12.6.10 Configuring the Board Functions...............................................................................................................950
12.6.10 Configuring the Board Functions...............................................................................................................950
12.6.11 Parameter Settings......................................................................................................................................950
12.6.11 Parameter Settings......................................................................................................................................950
12.6.12 Maintaining the Board................................................................................................................................950
12.6.12 Maintaining the Board................................................................................................................................950
12.6.13 List of Alarms.............................................................................................................................................951
12.6.13 List of Alarms.............................................................................................................................................951
12.6.14 List of Performance Events........................................................................................................................953
12.6.14 List of Performance Events........................................................................................................................953
12.6.15 Technical Specifications.............................................................................................................................957
12.6.15 Technical Specifications.............................................................................................................................957
12.7 EGS2...................................................................................................................................................................966
12.7 EGS2...................................................................................................................................................................966
12.7.1 Version Description......................................................................................................................................966
12.7.1 Version Description......................................................................................................................................966
12.7.2 Application....................................................................................................................................................966
12.7.2 Application....................................................................................................................................................966
12.7.3 Functions and Features.................................................................................................................................967
12.7.3 Functions and Features.................................................................................................................................967
12.7.4 Working Principle and Signal Flow..............................................................................................................973
12.7.4 Working Principle and Signal Flow..............................................................................................................973
12.7.5 Front Panel....................................................................................................................................................975
12.7.5 Front Panel....................................................................................................................................................975
12.7.6 Jumpers and DIP Switches...........................................................................................................................978
12.7.6 Jumpers and DIP Switches...........................................................................................................................978
12.7.7 Valid Slots.....................................................................................................................................................978
12.7.7 Valid Slots.....................................................................................................................................................978
12.7.8 Feature Code.................................................................................................................................................979
12.7.8 Feature Code.................................................................................................................................................979
12.7.9 Configuring and Commissioning the Board.................................................................................................979
12.7.9 Configuring and Commissioning the Board.................................................................................................979
12.7.10 Configuring the Board Functions...............................................................................................................981
12.7.10 Configuring the Board Functions...............................................................................................................981
12.7.11 Parameter Settings......................................................................................................................................981
Issue 02 (2013-01-18)

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Technologies Co., Ltd.

xlviii

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

Contents

12.7.11 Parameter Settings......................................................................................................................................981


12.7.12 Maintaining the Board................................................................................................................................981
12.7.12 Maintaining the Board................................................................................................................................981
12.7.13 List of Alarms.............................................................................................................................................982
12.7.13 List of Alarms.............................................................................................................................................982
12.7.14 List of Performance Events........................................................................................................................984
12.7.14 List of Performance Events........................................................................................................................984
12.7.15 Technical Specifications.............................................................................................................................987
12.7.15 Technical Specifications.............................................................................................................................987
12.8 EMS2..................................................................................................................................................................996
12.8 EMS2..................................................................................................................................................................996
12.8.1 Version Description......................................................................................................................................996
12.8.1 Version Description......................................................................................................................................996
12.8.2 Application....................................................................................................................................................996
12.8.2 Application....................................................................................................................................................996
12.8.3 Functions and Features.................................................................................................................................997
12.8.3 Functions and Features.................................................................................................................................997
12.8.4 Working Principle and Signal Flow............................................................................................................1002
12.8.4 Working Principle and Signal Flow............................................................................................................1002
12.8.5 Front Panel..................................................................................................................................................1005
12.8.5 Front Panel..................................................................................................................................................1005
12.8.6 Jumpers and DIP Switches.........................................................................................................................1007
12.8.6 Jumpers and DIP Switches.........................................................................................................................1007
12.8.7 Valid Slots...................................................................................................................................................1008
12.8.7 Valid Slots...................................................................................................................................................1008
12.8.8 Feature Code...............................................................................................................................................1008
12.8.8 Feature Code...............................................................................................................................................1008
12.8.9 Configuring and Commissioning the Board...............................................................................................1009
12.8.9 Configuring and Commissioning the Board...............................................................................................1009
12.8.10 Configuring the Board Functions.............................................................................................................1010
12.8.10 Configuring the Board Functions.............................................................................................................1010
12.8.11 Parameter Settings....................................................................................................................................1010
12.8.11 Parameter Settings....................................................................................................................................1010
12.8.12 Maintaining the Board..............................................................................................................................1011
12.8.12 Maintaining the Board..............................................................................................................................1011
12.8.13 List of Alarms...........................................................................................................................................1012
12.8.13 List of Alarms...........................................................................................................................................1012
12.8.14 List of Performance Events......................................................................................................................1013
12.8.14 List of Performance Events......................................................................................................................1013
12.8.15 Technical Specifications...........................................................................................................................1014
12.8.15 Technical Specifications...........................................................................................................................1014
12.9 EMS4................................................................................................................................................................1023
Issue 02 (2013-01-18)

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System
Hardware Description

Contents

12.9 EMS4................................................................................................................................................................1023
12.9.1 Version Description....................................................................................................................................1023
12.9.1 Version Description....................................................................................................................................1023
12.9.2 Application..................................................................................................................................................1023
12.9.2 Application..................................................................................................................................................1023
12.9.3 Functions and Features...............................................................................................................................1024
12.9.3 Functions and Features...............................................................................................................................1024
12.9.4 Working Principle and Signal Flow............................................................................................................1029
12.9.4 Working Principle and Signal Flow............................................................................................................1029
12.9.5 Front Panel..................................................................................................................................................1032
12.9.5 Front Panel..................................................................................................................................................1032
12.9.6 Jumpers and DIP Switches.........................................................................................................................1035
12.9.6 Jumpers and DIP Switches.........................................................................................................................1035
12.9.7 Valid Slots...................................................................................................................................................1035
12.9.7 Valid Slots...................................................................................................................................................1035
12.9.8 Feature Code...............................................................................................................................................1035
12.9.8 Feature Code...............................................................................................................................................1035
12.9.9 Board Protection.........................................................................................................................................1036
12.9.9 Board Protection.........................................................................................................................................1036
12.9.10 Configuring and Commissioning the Board.............................................................................................1040
12.9.10 Configuring and Commissioning the Board.............................................................................................1040
12.9.11 Configuring the Board Functions.............................................................................................................1042
12.9.11 Configuring the Board Functions.............................................................................................................1042
12.9.12 Parameter Settings....................................................................................................................................1042
12.9.12 Parameter Settings....................................................................................................................................1042
12.9.13 Maintaining the Board..............................................................................................................................1042
12.9.13 Maintaining the Board..............................................................................................................................1042
12.9.14 List of Alarms...........................................................................................................................................1043
12.9.14 List of Alarms...........................................................................................................................................1043
12.9.15 List of Performance Events......................................................................................................................1045
12.9.15 List of Performance Events......................................................................................................................1045
12.9.16 Technical Specifications...........................................................................................................................1046
12.9.16 Technical Specifications...........................................................................................................................1046
12.10 EGS4...............................................................................................................................................................1055
12.10 EGS4...............................................................................................................................................................1055
12.10.1 Version Description..................................................................................................................................1055
12.10.1 Version Description..................................................................................................................................1055
12.10.2 Application................................................................................................................................................1055
12.10.2 Application................................................................................................................................................1055
12.10.3 Functions and Features.............................................................................................................................1056
12.10.3 Functions and Features.............................................................................................................................1056
12.10.4 Working Principle and Signal Flow..........................................................................................................1061
Issue 02 (2013-01-18)

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OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

Contents

12.10.4 Working Principle and Signal Flow..........................................................................................................1061


12.10.5 Front Panel................................................................................................................................................1064
12.10.5 Front Panel................................................................................................................................................1064
12.10.6 Jumpers and DIP Switches.......................................................................................................................1067
12.10.6 Jumpers and DIP Switches.......................................................................................................................1067
12.10.7 Valid Slots.................................................................................................................................................1067
12.10.7 Valid Slots.................................................................................................................................................1067
12.10.8 Feature Code.............................................................................................................................................1067
12.10.8 Feature Code.............................................................................................................................................1067
12.10.9 Board Protection.......................................................................................................................................1067
12.10.9 Board Protection.......................................................................................................................................1067
12.10.10 Configuring and Commissioning the Board...........................................................................................1071
12.10.10 Configuring and Commissioning the Board...........................................................................................1071
12.10.11 Configuring the Board Functions...........................................................................................................1073
12.10.11 Configuring the Board Functions...........................................................................................................1073
12.10.12 Parameter Settings..................................................................................................................................1073
12.10.12 Parameter Settings..................................................................................................................................1073
12.10.13 Maintaining the Board............................................................................................................................1074
12.10.13 Maintaining the Board............................................................................................................................1074
12.10.14 List of Alarms.........................................................................................................................................1075
12.10.14 List of Alarms.........................................................................................................................................1075
12.10.15 List of Performance Events....................................................................................................................1078
12.10.15 List of Performance Events....................................................................................................................1078
12.10.16 Technical Specifications.........................................................................................................................1082
12.10.16 Technical Specifications.........................................................................................................................1082
12.11 EAS2...............................................................................................................................................................1092
12.11 EAS2...............................................................................................................................................................1092
12.11.1 Version Description...................................................................................................................................1092
12.11.1 Version Description...................................................................................................................................1092
12.11.2 Application................................................................................................................................................1092
12.11.2 Application................................................................................................................................................1092
12.11.3 Functions and Features.............................................................................................................................1093
12.11.3 Functions and Features.............................................................................................................................1093
12.11.4 Working Principle and Signal Flow..........................................................................................................1099
12.11.4 Working Principle and Signal Flow..........................................................................................................1099
12.11.5 Front Panel................................................................................................................................................1100
12.11.5 Front Panel................................................................................................................................................1100
12.11.6 Jumpers and DIP Switches........................................................................................................................1102
12.11.6 Jumpers and DIP Switches........................................................................................................................1102
12.11.7 Valid Slots.................................................................................................................................................1102
12.11.7 Valid Slots.................................................................................................................................................1102
12.11.8 Feature Code.............................................................................................................................................1102
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OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

Contents

12.11.8 Feature Code.............................................................................................................................................1102


12.11.9 Configuring and Commissioning the Board.............................................................................................1102
12.11.9 Configuring and Commissioning the Board.............................................................................................1102
12.11.10 Configuring the Board Functions............................................................................................................1104
12.11.10 Configuring the Board Functions............................................................................................................1104
12.11.11 Parameter Settings...................................................................................................................................1104
12.11.11 Parameter Settings...................................................................................................................................1104
12.11.12 Maintaining the Board............................................................................................................................1104
12.11.12 Maintaining the Board............................................................................................................................1104
12.11.13 List of Alarms.........................................................................................................................................1105
12.11.13 List of Alarms.........................................................................................................................................1105
12.11.14 List of Performance Events.....................................................................................................................1107
12.11.14 List of Performance Events.....................................................................................................................1107
12.11.15 Technical Specifications of EAS2...........................................................................................................1110
12.11.15 Technical Specifications of EAS2...........................................................................................................1110
12.12 EFF8................................................................................................................................................................1115
12.12 EFF8................................................................................................................................................................1115
12.12.1 Version Description...................................................................................................................................1115
12.12.1 Version Description...................................................................................................................................1115
12.12.2 Application................................................................................................................................................1115
12.12.2 Application................................................................................................................................................1115
12.12.3 Functions and Features.............................................................................................................................1115
12.12.3 Functions and Features.............................................................................................................................1115
12.12.4 Working Principle and Signal Flow..........................................................................................................1115
12.12.4 Working Principle and Signal Flow..........................................................................................................1115
12.12.5 Front Panel................................................................................................................................................1116
12.12.5 Front Panel................................................................................................................................................1116
12.12.6 Valid Slots.................................................................................................................................................1118
12.12.6 Valid Slots.................................................................................................................................................1118
12.12.7 Technical Specifications...........................................................................................................................1119
12.12.7 Technical Specifications...........................................................................................................................1119
12.13 EFF8A.............................................................................................................................................................1120
12.13 EFF8A.............................................................................................................................................................1120
12.13.1 Version Description...................................................................................................................................1120
12.13.1 Version Description...................................................................................................................................1120
12.13.2 Application................................................................................................................................................1120
12.13.2 Application................................................................................................................................................1120
12.13.3 Functions and Features.............................................................................................................................1120
12.13.3 Functions and Features.............................................................................................................................1120
12.13.4 Working Principle and Signal Flow..........................................................................................................1120
12.13.4 Working Principle and Signal Flow..........................................................................................................1120
12.13.5 Front Panel................................................................................................................................................1121
Issue 02 (2013-01-18)

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Technologies Co., Ltd.

lii

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

Contents

12.13.5 Front Panel................................................................................................................................................1121


12.13.6 Valid Slots.................................................................................................................................................1123
12.13.6 Valid Slots.................................................................................................................................................1123
12.13.7 Technical Specifications...........................................................................................................................1123
12.13.7 Technical Specifications...........................................................................................................................1123
12.14 ETF8...............................................................................................................................................................1124
12.14 ETF8...............................................................................................................................................................1124
12.14.1 Version Description...................................................................................................................................1124
12.14.1 Version Description...................................................................................................................................1124
12.14.2 Application................................................................................................................................................1124
12.14.2 Application................................................................................................................................................1124
12.14.3 Functions and Features.............................................................................................................................1125
12.14.3 Functions and Features.............................................................................................................................1125
12.14.4 Working Principle and Signal Flow..........................................................................................................1125
12.14.4 Working Principle and Signal Flow..........................................................................................................1125
12.14.5 Front Panel................................................................................................................................................1125
12.14.5 Front Panel................................................................................................................................................1125
12.14.6 Valid Slots.................................................................................................................................................1127
12.14.6 Valid Slots.................................................................................................................................................1127
12.14.7 Technical Specifications...........................................................................................................................1128
12.14.7 Technical Specifications...........................................................................................................................1128
12.15 ETF8A............................................................................................................................................................1129
12.15 ETF8A............................................................................................................................................................1129
12.15.1 Version Description...................................................................................................................................1129
12.15.1 Version Description...................................................................................................................................1129
12.15.2 Application................................................................................................................................................1129
12.15.2 Application................................................................................................................................................1129
12.15.3 Functions and Features.............................................................................................................................1129
12.15.3 Functions and Features.............................................................................................................................1129
12.15.4 Working Principle and Signal Flow..........................................................................................................1129
12.15.4 Working Principle and Signal Flow..........................................................................................................1129
12.15.5 Front Panel................................................................................................................................................1130
12.15.5 Front Panel................................................................................................................................................1130
12.15.6 Valid Slots.................................................................................................................................................1131
12.15.6 Valid Slots.................................................................................................................................................1131
12.15.7 Technical Specifications...........................................................................................................................1132
12.15.7 Technical Specifications...........................................................................................................................1132
12.16 ETS8...............................................................................................................................................................1132
12.16 ETS8...............................................................................................................................................................1132
12.16.1 Version Description...................................................................................................................................1132
12.16.1 Version Description...................................................................................................................................1132
12.16.2 Application................................................................................................................................................1133
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System
Hardware Description

Contents

12.16.2 Application................................................................................................................................................1133
12.16.3 Functions and Features.............................................................................................................................1133
12.16.3 Functions and Features.............................................................................................................................1133
12.16.4 Working Principle and Signal Flow..........................................................................................................1133
12.16.4 Working Principle and Signal Flow..........................................................................................................1133
12.16.5 Front Panel................................................................................................................................................1134
12.16.5 Front Panel................................................................................................................................................1134
12.16.6 Valid Slots.................................................................................................................................................1135
12.16.6 Valid Slots.................................................................................................................................................1135
12.16.7 Technical Specifications...........................................................................................................................1136
12.16.7 Technical Specifications...........................................................................................................................1136

13 ATM Boards.............................................................................................................................1138
13.1 ADL4................................................................................................................................................................1138
13.1 ADL4................................................................................................................................................................1138
13.1.1 Version Description.....................................................................................................................................1138
13.1.1 Version Description.....................................................................................................................................1138
13.1.2 Application..................................................................................................................................................1139
13.1.2 Application..................................................................................................................................................1139
13.1.3 Functions and Features...............................................................................................................................1140
13.1.3 Functions and Features...............................................................................................................................1140
13.1.4 Working Principle and Signal Flow............................................................................................................1141
13.1.4 Working Principle and Signal Flow............................................................................................................1141
13.1.5 Front Panel..................................................................................................................................................1143
13.1.5 Front Panel..................................................................................................................................................1143
13.1.6 Jumpers and DIP Switches..........................................................................................................................1145
13.1.6 Jumpers and DIP Switches..........................................................................................................................1145
13.1.7 Valid Slots...................................................................................................................................................1145
13.1.7 Valid Slots...................................................................................................................................................1145
13.1.8 Feature Code...............................................................................................................................................1145
13.1.8 Feature Code...............................................................................................................................................1145
13.1.9 Configuring and Commissioning the Board...............................................................................................1145
13.1.9 Configuring and Commissioning the Board...............................................................................................1145
13.1.10 Parameter Settings....................................................................................................................................1147
13.1.10 Parameter Settings....................................................................................................................................1147
13.1.11 Maintaining the Board..............................................................................................................................1147
13.1.11 Maintaining the Board..............................................................................................................................1147
13.1.12 List of Alarms...........................................................................................................................................1148
13.1.12 List of Alarms...........................................................................................................................................1148
13.1.13 List of Performance Events.......................................................................................................................1149
13.1.13 List of Performance Events.......................................................................................................................1149
13.1.14 Technical Specifications...........................................................................................................................1150
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Hardware Description

Contents

13.1.14 Technical Specifications...........................................................................................................................1150


13.2 ADQ1................................................................................................................................................................1151
13.2 ADQ1................................................................................................................................................................1151
13.2.1 Version Description.....................................................................................................................................1151
13.2.1 Version Description.....................................................................................................................................1151
13.2.2 Application..................................................................................................................................................1151
13.2.2 Application..................................................................................................................................................1151
13.2.3 Functions and Features...............................................................................................................................1153
13.2.3 Functions and Features...............................................................................................................................1153
13.2.4 Working Principle and Signal Flow............................................................................................................1154
13.2.4 Working Principle and Signal Flow............................................................................................................1154
13.2.5 Front Panel..................................................................................................................................................1156
13.2.5 Front Panel..................................................................................................................................................1156
13.2.6 Jumpers and DIP Switches..........................................................................................................................1158
13.2.6 Jumpers and DIP Switches..........................................................................................................................1158
13.2.7 Valid Slots...................................................................................................................................................1158
13.2.7 Valid Slots...................................................................................................................................................1158
13.2.8 Feature Code...............................................................................................................................................1158
13.2.8 Feature Code...............................................................................................................................................1158
13.2.9 Configuring and Commissioning the Board...............................................................................................1159
13.2.9 Configuring and Commissioning the Board...............................................................................................1159
13.2.10 Parameter Settings....................................................................................................................................1160
13.2.10 Parameter Settings....................................................................................................................................1160
13.2.11 Maintaining the Board..............................................................................................................................1160
13.2.11 Maintaining the Board..............................................................................................................................1160
13.2.12 List of Alarms...........................................................................................................................................1161
13.2.12 List of Alarms...........................................................................................................................................1161
13.2.13 List of Performance Events.......................................................................................................................1162
13.2.13 List of Performance Events.......................................................................................................................1162
13.2.14 Technical Specifications...........................................................................................................................1163
13.2.14 Technical Specifications...........................................................................................................................1163
13.3 IDL4..................................................................................................................................................................1164
13.3 IDL4..................................................................................................................................................................1164
13.3.1 Version Description.....................................................................................................................................1164
13.3.1 Version Description.....................................................................................................................................1164
13.3.2 Application..................................................................................................................................................1164
13.3.2 Application..................................................................................................................................................1164
13.3.3 Functions and Features...............................................................................................................................1165
13.3.3 Functions and Features...............................................................................................................................1165
13.3.4 Working Principle and Signal Flow............................................................................................................1166
13.3.4 Working Principle and Signal Flow............................................................................................................1166
13.3.5 Front Panel..................................................................................................................................................1168
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Hardware Description

Contents

13.3.5 Front Panel..................................................................................................................................................1168


13.3.6 Jumpers and DIP Switches..........................................................................................................................1170
13.3.6 Jumpers and DIP Switches..........................................................................................................................1170
13.3.7 Valid Slots...................................................................................................................................................1170
13.3.7 Valid Slots...................................................................................................................................................1170
13.3.8 Feature Code...............................................................................................................................................1170
13.3.8 Feature Code...............................................................................................................................................1170
13.3.9 Board Protection.........................................................................................................................................1170
13.3.9 Board Protection.........................................................................................................................................1170
13.3.10 Configuring and Commissioning the Board.............................................................................................1171
13.3.10 Configuring and Commissioning the Board.............................................................................................1171
13.3.11 Parameter Settings....................................................................................................................................1172
13.3.11 Parameter Settings....................................................................................................................................1172
13.3.12 Maintaining the Board..............................................................................................................................1173
13.3.12 Maintaining the Board..............................................................................................................................1173
13.3.13 List of Alarms...........................................................................................................................................1173
13.3.13 List of Alarms...........................................................................................................................................1173
13.3.14 List of Performance Events.......................................................................................................................1175
13.3.14 List of Performance Events.......................................................................................................................1175
13.3.15 Technical Specifications...........................................................................................................................1175
13.3.15 Technical Specifications...........................................................................................................................1175
13.4 IDQ1.................................................................................................................................................................1177
13.4 IDQ1.................................................................................................................................................................1177
13.4.1 Version Description.....................................................................................................................................1177
13.4.1 Version Description.....................................................................................................................................1177
13.4.2 Application..................................................................................................................................................1177
13.4.2 Application..................................................................................................................................................1177
13.4.3 Functions and Features...............................................................................................................................1177
13.4.3 Functions and Features...............................................................................................................................1177
13.4.4 Working Principle and Signal Flow............................................................................................................1179
13.4.4 Working Principle and Signal Flow............................................................................................................1179
13.4.5 Front Panel..................................................................................................................................................1181
13.4.5 Front Panel..................................................................................................................................................1181
13.4.6 Jumpers and DIP Switches..........................................................................................................................1183
13.4.6 Jumpers and DIP Switches..........................................................................................................................1183
13.4.7 Valid Slots...................................................................................................................................................1183
13.4.7 Valid Slots...................................................................................................................................................1183
13.4.8 Feature Code...............................................................................................................................................1183
13.4.8 Feature Code...............................................................................................................................................1183
13.4.9 Board Protection.........................................................................................................................................1184
13.4.9 Board Protection.........................................................................................................................................1184
13.4.10 Configuring and Commissioning the Board.............................................................................................1184
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System
Hardware Description

Contents

13.4.10 Configuring and Commissioning the Board.............................................................................................1184


13.4.11 Parameter Settings....................................................................................................................................1185
13.4.11 Parameter Settings....................................................................................................................................1185
13.4.12 Maintaining the Board..............................................................................................................................1186
13.4.12 Maintaining the Board..............................................................................................................................1186
13.4.13 List of Alarms...........................................................................................................................................1186
13.4.13 List of Alarms...........................................................................................................................................1186
13.4.14 List of Performance Events.......................................................................................................................1188
13.4.14 List of Performance Events.......................................................................................................................1188
13.4.15 Technical Specifications...........................................................................................................................1188
13.4.15 Technical Specifications...........................................................................................................................1188

14 RPR Boards..............................................................................................................................1191
14.1 EGR2................................................................................................................................................................1191
14.1 EGR2................................................................................................................................................................1191
14.1.1 Version Description.....................................................................................................................................1191
14.1.1 Version Description.....................................................................................................................................1191
14.1.2 Application..................................................................................................................................................1191
14.1.2 Application..................................................................................................................................................1191
14.1.3 Functions and Features...............................................................................................................................1192
14.1.3 Functions and Features...............................................................................................................................1192
14.1.4 Working Principle and Signal Flow............................................................................................................1195
14.1.4 Working Principle and Signal Flow............................................................................................................1195
14.1.5 Front Panel..................................................................................................................................................1198
14.1.5 Front Panel..................................................................................................................................................1198
14.1.6 Jumpers and DIP Switches.........................................................................................................................1200
14.1.6 Jumpers and DIP Switches.........................................................................................................................1200
14.1.7 Valid Slots...................................................................................................................................................1200
14.1.7 Valid Slots...................................................................................................................................................1200
14.1.8 Feature Code...............................................................................................................................................1200
14.1.8 Feature Code...............................................................................................................................................1200
14.1.9 Configuring and Commissioning the Board...............................................................................................1201
14.1.9 Configuring and Commissioning the Board...............................................................................................1201
14.1.10 Configuring the Board Functions.............................................................................................................1202
14.1.10 Configuring the Board Functions.............................................................................................................1202
14.1.11 Parameter Settings....................................................................................................................................1202
14.1.11 Parameter Settings....................................................................................................................................1202
14.1.12 Maintaining the Board..............................................................................................................................1203
14.1.12 Maintaining the Board..............................................................................................................................1203
14.1.13 List of Alarms...........................................................................................................................................1203
14.1.13 List of Alarms...........................................................................................................................................1203
14.1.14 List of Performance Events......................................................................................................................1204
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Hardware Description

Contents

14.1.14 List of Performance Events......................................................................................................................1204


14.1.15 Technical Specifications...........................................................................................................................1208
14.1.15 Technical Specifications...........................................................................................................................1208
14.2 EMR0................................................................................................................................................................1213
14.2 EMR0................................................................................................................................................................1213
14.2.1 Version Description....................................................................................................................................1213
14.2.1 Version Description....................................................................................................................................1213
14.2.2 Application..................................................................................................................................................1213
14.2.2 Application..................................................................................................................................................1213
14.2.3 Functions and Features...............................................................................................................................1214
14.2.3 Functions and Features...............................................................................................................................1214
14.2.4 Working Principle and Signal Flow............................................................................................................1217
14.2.4 Working Principle and Signal Flow............................................................................................................1217
14.2.5 Front Panel..................................................................................................................................................1220
14.2.5 Front Panel..................................................................................................................................................1220
14.2.6 Jumpers and DIP Switches.........................................................................................................................1222
14.2.6 Jumpers and DIP Switches.........................................................................................................................1222
14.2.7 Valid Slots...................................................................................................................................................1222
14.2.7 Valid Slots...................................................................................................................................................1222
14.2.8 Feature Code...............................................................................................................................................1223
14.2.8 Feature Code...............................................................................................................................................1223
14.2.9 Configuring and Commissioning the Board...............................................................................................1223
14.2.9 Configuring and Commissioning the Board...............................................................................................1223
14.2.10 Configuring the Board Functions.............................................................................................................1225
14.2.10 Configuring the Board Functions.............................................................................................................1225
14.2.11 Parameter Settings....................................................................................................................................1225
14.2.11 Parameter Settings....................................................................................................................................1225
14.2.12 Maintaining the Board..............................................................................................................................1225
14.2.12 Maintaining the Board..............................................................................................................................1225
14.2.13 List of Alarms...........................................................................................................................................1226
14.2.13 List of Alarms...........................................................................................................................................1226
14.2.14 List of Performance Events......................................................................................................................1227
14.2.14 List of Performance Events......................................................................................................................1227
14.2.15 Technical Specifications...........................................................................................................................1231
14.2.15 Technical Specifications...........................................................................................................................1231

15 SAN/Video Boards...................................................................................................................1239
15.1 MST4................................................................................................................................................................1239
15.1 MST4................................................................................................................................................................1239
15.1.1 Version Description....................................................................................................................................1239
15.1.1 Version Description....................................................................................................................................1239
15.1.2 Application..................................................................................................................................................1239
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System
Hardware Description

Contents

15.1.2 Application..................................................................................................................................................1239
15.1.3 Functions and Features...............................................................................................................................1240
15.1.3 Functions and Features...............................................................................................................................1240
15.1.4 Working Principle and Signal Flow............................................................................................................1241
15.1.4 Working Principle and Signal Flow............................................................................................................1241
15.1.5 Front Panel..................................................................................................................................................1243
15.1.5 Front Panel..................................................................................................................................................1243
15.1.6 Jumpers and DIP Switches.........................................................................................................................1245
15.1.6 Jumpers and DIP Switches.........................................................................................................................1245
15.1.7 Valid Slots...................................................................................................................................................1245
15.1.7 Valid Slots...................................................................................................................................................1245
15.1.8 Feature Code...............................................................................................................................................1245
15.1.8 Feature Code...............................................................................................................................................1245
15.1.9 Configuring and Commissioning the Board...............................................................................................1246
15.1.9 Configuring and Commissioning the Board...............................................................................................1246
15.1.10 Parameter Settings....................................................................................................................................1247
15.1.10 Parameter Settings....................................................................................................................................1247
15.1.11 Maintaining the Board..............................................................................................................................1247
15.1.11 Maintaining the Board..............................................................................................................................1247
15.1.12 List of Alarms...........................................................................................................................................1248
15.1.12 List of Alarms...........................................................................................................................................1248
15.1.13 List of Performance Events......................................................................................................................1249
15.1.13 List of Performance Events......................................................................................................................1249
15.1.14 Technical Specifications...........................................................................................................................1249
15.1.14 Technical Specifications...........................................................................................................................1249
15.2 VST4.................................................................................................................................................................1251
15.2 VST4.................................................................................................................................................................1251
15.2.1 Version Description....................................................................................................................................1251
15.2.1 Version Description....................................................................................................................................1251
15.2.2 Application..................................................................................................................................................1251
15.2.2 Application..................................................................................................................................................1251
15.2.3 Functions and Features...............................................................................................................................1251
15.2.3 Functions and Features...............................................................................................................................1251
15.2.4 Working Principle and Signal Flow............................................................................................................1252
15.2.4 Working Principle and Signal Flow............................................................................................................1252
15.2.5 Front Panel..................................................................................................................................................1254
15.2.5 Front Panel..................................................................................................................................................1254
15.2.6 Jumpers and DIP Switches.........................................................................................................................1256
15.2.6 Jumpers and DIP Switches.........................................................................................................................1256
15.2.7 Valid Slots...................................................................................................................................................1256
15.2.7 Valid Slots...................................................................................................................................................1256
15.2.8 Feature Code...............................................................................................................................................1256
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System
Hardware Description

Contents

15.2.8 Feature Code...............................................................................................................................................1256


15.2.9 Configuring and Commissioning a Board..................................................................................................1256
15.2.9 Configuring and Commissioning a Board..................................................................................................1256
15.2.10 Parameter Settings....................................................................................................................................1257
15.2.10 Parameter Settings....................................................................................................................................1257
15.2.11 Maintaining the Board..............................................................................................................................1257
15.2.11 Maintaining the Board..............................................................................................................................1257
15.2.12 List of Alarms...........................................................................................................................................1258
15.2.12 List of Alarms...........................................................................................................................................1258
15.2.13 List of Performance Events......................................................................................................................1259
15.2.13 List of Performance Events......................................................................................................................1259
15.2.14 Technical Specifications...........................................................................................................................1259
15.2.14 Technical Specifications...........................................................................................................................1259

16 WDM Boards...........................................................................................................................1261
16.1 CMR2...............................................................................................................................................................1262
16.1 CMR2...............................................................................................................................................................1262
16.1.1 Version Description....................................................................................................................................1262
16.1.1 Version Description....................................................................................................................................1262
16.1.2 Application..................................................................................................................................................1262
16.1.2 Application..................................................................................................................................................1262
16.1.3 Functions and Features...............................................................................................................................1262
16.1.3 Functions and Features...............................................................................................................................1262
16.1.4 Working Principle and Signal Flow............................................................................................................1263
16.1.4 Working Principle and Signal Flow............................................................................................................1263
16.1.5 Front Panel..................................................................................................................................................1264
16.1.5 Front Panel..................................................................................................................................................1264
16.1.6 Valid Slots...................................................................................................................................................1266
16.1.6 Valid Slots...................................................................................................................................................1266
16.1.7 Feature Code...............................................................................................................................................1266
16.1.7 Feature Code...............................................................................................................................................1266
16.1.8 Technical Specifications.............................................................................................................................1266
16.1.8 Technical Specifications.............................................................................................................................1266
16.2 CMR4...............................................................................................................................................................1267
16.2 CMR4...............................................................................................................................................................1267
16.2.1 Version Description....................................................................................................................................1268
16.2.1 Version Description....................................................................................................................................1268
16.2.2 Application..................................................................................................................................................1268
16.2.2 Application..................................................................................................................................................1268
16.2.3 Functions and Features...............................................................................................................................1268
16.2.3 Functions and Features...............................................................................................................................1268
16.2.4 Working Principle and Signal Flow............................................................................................................1268
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System
Hardware Description

Contents

16.2.4 Working Principle and Signal Flow............................................................................................................1268


16.2.5 Front Panel..................................................................................................................................................1270
16.2.5 Front Panel..................................................................................................................................................1270
16.2.6 Valid Slots...................................................................................................................................................1271
16.2.6 Valid Slots...................................................................................................................................................1271
16.2.7 Feature Code...............................................................................................................................................1271
16.2.7 Feature Code...............................................................................................................................................1271
16.2.8 Technical Specifications.............................................................................................................................1272
16.2.8 Technical Specifications.............................................................................................................................1272
16.3 CMD2...............................................................................................................................................................1273
16.3 CMD2...............................................................................................................................................................1273
16.3.1 Version Description....................................................................................................................................1273
16.3.1 Version Description....................................................................................................................................1273
16.3.2 Application..................................................................................................................................................1273
16.3.2 Application..................................................................................................................................................1273
16.3.3 Functions and Features...............................................................................................................................1274
16.3.3 Functions and Features...............................................................................................................................1274
16.3.4 Working Principle and Signal Flow............................................................................................................1274
16.3.4 Working Principle and Signal Flow............................................................................................................1274
16.3.5 Front Panel..................................................................................................................................................1275
16.3.5 Front Panel..................................................................................................................................................1275
16.3.6 Valid Slots...................................................................................................................................................1277
16.3.6 Valid Slots...................................................................................................................................................1277
16.3.7 Feature Code...............................................................................................................................................1277
16.3.7 Feature Code...............................................................................................................................................1277
16.3.8 Configuring and Commissioning the Board...............................................................................................1277
16.3.8 Configuring and Commissioning the Board...............................................................................................1277
16.3.9 Parameter Settings......................................................................................................................................1278
16.3.9 Parameter Settings......................................................................................................................................1278
16.3.10 Maintaining the Board..............................................................................................................................1278
16.3.10 Maintaining the Board..............................................................................................................................1278
16.3.11 List of Alarms...........................................................................................................................................1279
16.3.11 List of Alarms...........................................................................................................................................1279
16.3.12 List of Performance Events......................................................................................................................1279
16.3.12 List of Performance Events......................................................................................................................1279
16.3.13 Technical Specifications...........................................................................................................................1279
16.3.13 Technical Specifications...........................................................................................................................1279
16.4 MR2..................................................................................................................................................................1280
16.4 MR2..................................................................................................................................................................1280
16.4.1 Version Description....................................................................................................................................1281
16.4.1 Version Description....................................................................................................................................1281
16.4.2 Application..................................................................................................................................................1281
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System
Hardware Description

Contents

16.4.2 Application..................................................................................................................................................1281
16.4.3 Functions and Features...............................................................................................................................1281
16.4.3 Functions and Features...............................................................................................................................1281
16.4.4 Working Principle and Signal Flow............................................................................................................1281
16.4.4 Working Principle and Signal Flow............................................................................................................1281
16.4.5 Front Panel..................................................................................................................................................1283
16.4.5 Front Panel..................................................................................................................................................1283
16.4.6 Valid Slots...................................................................................................................................................1284
16.4.6 Valid Slots...................................................................................................................................................1284
16.4.7 Feature Code...............................................................................................................................................1284
16.4.7 Feature Code...............................................................................................................................................1284
16.4.8 Technical Specifications.............................................................................................................................1285
16.4.8 Technical Specifications.............................................................................................................................1285
16.5 MR2A...............................................................................................................................................................1286
16.5 MR2A...............................................................................................................................................................1286
16.5.1 Version Description....................................................................................................................................1286
16.5.1 Version Description....................................................................................................................................1286
16.5.2 Application..................................................................................................................................................1286
16.5.2 Application..................................................................................................................................................1286
16.5.3 Functions and Features...............................................................................................................................1286
16.5.3 Functions and Features...............................................................................................................................1286
16.5.4 Working Principle and Signal Flow............................................................................................................1288
16.5.4 Working Principle and Signal Flow............................................................................................................1288
16.5.5 Front Panel..................................................................................................................................................1289
16.5.5 Front Panel..................................................................................................................................................1289
16.5.6 Valid Slots...................................................................................................................................................1290
16.5.6 Valid Slots...................................................................................................................................................1290
16.5.7 Technical Specifications.............................................................................................................................1290
16.5.7 Technical Specifications.............................................................................................................................1290
16.6 MR2C...............................................................................................................................................................1291
16.6 MR2C...............................................................................................................................................................1291
16.6.1 Version Description....................................................................................................................................1291
16.6.1 Version Description....................................................................................................................................1291
16.6.2 Application..................................................................................................................................................1291
16.6.2 Application..................................................................................................................................................1291
16.6.3 Functions and Features...............................................................................................................................1292
16.6.3 Functions and Features...............................................................................................................................1292
16.6.4 Working Principle and Signal Flow............................................................................................................1293
16.6.4 Working Principle and Signal Flow............................................................................................................1293
16.6.5 Front Panel..................................................................................................................................................1294
16.6.5 Front Panel..................................................................................................................................................1294
16.6.6 Valid Slots...................................................................................................................................................1296
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System
Hardware Description

Contents

16.6.6 Valid Slots...................................................................................................................................................1296


16.6.7 Technical Specifications.............................................................................................................................1296
16.6.7 Technical Specifications.............................................................................................................................1296
16.7 MR4..................................................................................................................................................................1297
16.7 MR4..................................................................................................................................................................1297
16.7.1 Version Description....................................................................................................................................1297
16.7.1 Version Description....................................................................................................................................1297
16.7.2 Application..................................................................................................................................................1297
16.7.2 Application..................................................................................................................................................1297
16.7.3 Functions and Features...............................................................................................................................1298
16.7.3 Functions and Features...............................................................................................................................1298
16.7.4 Working Principle and Signal Flow............................................................................................................1298
16.7.4 Working Principle and Signal Flow............................................................................................................1298
16.7.5 Front Panel..................................................................................................................................................1300
16.7.5 Front Panel..................................................................................................................................................1300
16.7.6 Valid Slots...................................................................................................................................................1301
16.7.6 Valid Slots...................................................................................................................................................1301
16.7.7 Feature Code...............................................................................................................................................1301
16.7.7 Feature Code...............................................................................................................................................1301
16.7.8 Technical Specifications.............................................................................................................................1302
16.7.8 Technical Specifications.............................................................................................................................1302
16.8 LWX.................................................................................................................................................................1303
16.8 LWX.................................................................................................................................................................1303
16.8.1 Version Description....................................................................................................................................1303
16.8.1 Version Description....................................................................................................................................1303
16.8.2 Application..................................................................................................................................................1303
16.8.2 Application..................................................................................................................................................1303
16.8.3 Functions and Features...............................................................................................................................1303
16.8.3 Functions and Features...............................................................................................................................1303
16.8.4 Working Principle and Signal Flow............................................................................................................1304
16.8.4 Working Principle and Signal Flow............................................................................................................1304
16.8.5 Front Panel..................................................................................................................................................1306
16.8.5 Front Panel..................................................................................................................................................1306
16.8.6 Valid Slots...................................................................................................................................................1308
16.8.6 Valid Slots...................................................................................................................................................1308
16.8.7 Feature Code...............................................................................................................................................1308
16.8.7 Feature Code...............................................................................................................................................1308
16.8.8 Parameter Settings......................................................................................................................................1308
16.8.8 Parameter Settings......................................................................................................................................1308
16.8.9 Technical Specifications.............................................................................................................................1309
16.8.9 Technical Specifications.............................................................................................................................1309
16.9 FIB....................................................................................................................................................................1312
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Hardware Description

Contents

16.9 FIB....................................................................................................................................................................1312
16.9.1 Version Description....................................................................................................................................1312
16.9.1 Version Description....................................................................................................................................1312
16.9.2 Application..................................................................................................................................................1312
16.9.2 Application..................................................................................................................................................1312
16.9.3 Functions and Features...............................................................................................................................1312
16.9.3 Functions and Features...............................................................................................................................1312
16.9.4 Working Principle and Signal Flow............................................................................................................1313
16.9.4 Working Principle and Signal Flow............................................................................................................1313
16.9.5 Front Panel..................................................................................................................................................1313
16.9.5 Front Panel..................................................................................................................................................1313
16.9.6 Valid Slots...................................................................................................................................................1315
16.9.6 Valid Slots...................................................................................................................................................1315
16.9.7 Technical Specifications.............................................................................................................................1315
16.9.7 Technical Specifications.............................................................................................................................1315

17 Auxiliary Boards......................................................................................................................1316
17.1 AUX..................................................................................................................................................................1316
17.1 AUX..................................................................................................................................................................1316
17.1.1 Version Description....................................................................................................................................1316
17.1.1 Version Description....................................................................................................................................1316
17.1.2 Application..................................................................................................................................................1316
17.1.2 Application..................................................................................................................................................1316
17.1.3 Functions and Features...............................................................................................................................1316
17.1.3 Functions and Features...............................................................................................................................1316
17.1.4 Working Principle and Signal Flow............................................................................................................1318
17.1.4 Working Principle and Signal Flow............................................................................................................1318
17.1.5 Jumpers.......................................................................................................................................................1319
17.1.5 Jumpers.......................................................................................................................................................1319
17.1.6 Front Panel..................................................................................................................................................1321
17.1.6 Front Panel..................................................................................................................................................1321
17.1.7 Valid Slots...................................................................................................................................................1328
17.1.7 Valid Slots...................................................................................................................................................1328
17.1.8 Technical Specifications.............................................................................................................................1329
17.1.8 Technical Specifications.............................................................................................................................1329
17.2 FAN...................................................................................................................................................................1329
17.2 FAN...................................................................................................................................................................1329
17.2.1 Version Description....................................................................................................................................1329
17.2.1 Version Description....................................................................................................................................1329
17.2.2 Application..................................................................................................................................................1329
17.2.2 Application..................................................................................................................................................1329
17.2.3 Functions and Features...............................................................................................................................1329
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Hardware Description

Contents

17.2.3 Functions and Features...............................................................................................................................1329


17.2.4 Working Principle and Signal Flow............................................................................................................1330
17.2.4 Working Principle and Signal Flow............................................................................................................1330
17.2.5 Front Panel..................................................................................................................................................1331
17.2.5 Front Panel..................................................................................................................................................1331
17.2.6 Valid Slots...................................................................................................................................................1332
17.2.6 Valid Slots...................................................................................................................................................1332
17.2.7 Technical Specifications.............................................................................................................................1332
17.2.7 Technical Specifications.............................................................................................................................1332

18 Optical Amplifier Boards and Dispersion Compensation Boards......................................1333


18.1 BA2...................................................................................................................................................................1334
18.1 BA2...................................................................................................................................................................1334
18.1.1 Version Description....................................................................................................................................1334
18.1.1 Version Description....................................................................................................................................1334
18.1.2 Application..................................................................................................................................................1334
18.1.2 Application..................................................................................................................................................1334
18.1.3 Functions and Features...............................................................................................................................1334
18.1.3 Functions and Features...............................................................................................................................1334
18.1.4 Working Principle and Signal Flow............................................................................................................1335
18.1.4 Working Principle and Signal Flow............................................................................................................1335
18.1.5 Front Panel..................................................................................................................................................1337
18.1.5 Front Panel..................................................................................................................................................1337
18.1.6 Valid Slots...................................................................................................................................................1340
18.1.6 Valid Slots...................................................................................................................................................1340
18.1.7 Feature Code...............................................................................................................................................1341
18.1.7 Feature Code...............................................................................................................................................1341
18.1.8 Technical Specifications.............................................................................................................................1341
18.1.8 Technical Specifications.............................................................................................................................1341
18.2 BPA...................................................................................................................................................................1342
18.2 BPA...................................................................................................................................................................1342
18.2.1 Version Description....................................................................................................................................1342
18.2.1 Version Description....................................................................................................................................1342
18.2.2 Application..................................................................................................................................................1342
18.2.2 Application..................................................................................................................................................1342
18.2.3 Functions and Features...............................................................................................................................1343
18.2.3 Functions and Features...............................................................................................................................1343
18.2.4 Working Principle and Signal Flow............................................................................................................1343
18.2.4 Working Principle and Signal Flow............................................................................................................1343
18.2.5 Front Panel..................................................................................................................................................1345
18.2.5 Front Panel..................................................................................................................................................1345
18.2.6 Valid Slots...................................................................................................................................................1347
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Hardware Description

Contents

18.2.6 Valid Slots...................................................................................................................................................1347


18.2.7 Feature Code...............................................................................................................................................1347
18.2.7 Feature Code...............................................................................................................................................1347
18.2.8 Technical Specifications.............................................................................................................................1347
18.2.8 Technical Specifications.............................................................................................................................1347
18.3 COA..................................................................................................................................................................1348
18.3 COA..................................................................................................................................................................1348
18.3.1 Version Description....................................................................................................................................1349
18.3.1 Version Description....................................................................................................................................1349
18.3.2 Application..................................................................................................................................................1349
18.3.2 Application..................................................................................................................................................1349
18.3.3 Functions and Features...............................................................................................................................1349
18.3.3 Functions and Features...............................................................................................................................1349
18.3.4 Working Principle and Signal Flow............................................................................................................1352
18.3.4 Working Principle and Signal Flow............................................................................................................1352
18.3.5 Front Panel..................................................................................................................................................1354
18.3.5 Front Panel..................................................................................................................................................1354
18.3.6 Valid Slots...................................................................................................................................................1358
18.3.6 Valid Slots...................................................................................................................................................1358
18.3.7 Feature Code...............................................................................................................................................1359
18.3.7 Feature Code...............................................................................................................................................1359
18.3.8 Technical Specifications.............................................................................................................................1359
18.3.8 Technical Specifications.............................................................................................................................1359
18.4 RPC01...............................................................................................................................................................1360
18.4 RPC01...............................................................................................................................................................1360
18.4.1 Version Description....................................................................................................................................1361
18.4.1 Version Description....................................................................................................................................1361
18.4.2 Application..................................................................................................................................................1361
18.4.2 Application..................................................................................................................................................1361
18.4.3 Functions and Features...............................................................................................................................1361
18.4.3 Functions and Features...............................................................................................................................1361
18.4.4 Working Principle and Signal Flow............................................................................................................1361
18.4.4 Working Principle and Signal Flow............................................................................................................1361
18.4.5 Front Panel..................................................................................................................................................1363
18.4.5 Front Panel..................................................................................................................................................1363
18.4.6 Valid Slots...................................................................................................................................................1364
18.4.6 Valid Slots...................................................................................................................................................1364
18.4.7 Jumpers and DIP Switches.........................................................................................................................1364
18.4.7 Jumpers and DIP Switches.........................................................................................................................1364
18.4.8 Feature Code...............................................................................................................................................1365
18.4.8 Feature Code...............................................................................................................................................1365
18.4.9 Parameter Settings......................................................................................................................................1365
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System
Hardware Description

Contents

18.4.9 Parameter Settings......................................................................................................................................1365


18.4.10 Technical Specifications...........................................................................................................................1366
18.4.10 Technical Specifications...........................................................................................................................1366
18.5 RPC02...............................................................................................................................................................1367
18.5 RPC02...............................................................................................................................................................1367
18.5.1 Version Description....................................................................................................................................1367
18.5.1 Version Description....................................................................................................................................1367
18.5.2 Application..................................................................................................................................................1367
18.5.2 Application..................................................................................................................................................1367
18.5.3 Functions and Features...............................................................................................................................1367
18.5.3 Functions and Features...............................................................................................................................1367
18.5.4 Working Principle and Signal Flow............................................................................................................1368
18.5.4 Working Principle and Signal Flow............................................................................................................1368
18.5.5 Front Panel..................................................................................................................................................1370
18.5.5 Front Panel..................................................................................................................................................1370
18.5.6 Valid Slots...................................................................................................................................................1371
18.5.6 Valid Slots...................................................................................................................................................1371
18.5.7 Jumpers and DIP Switches.........................................................................................................................1371
18.5.7 Jumpers and DIP Switches.........................................................................................................................1371
18.5.8 Feature Code...............................................................................................................................................1372
18.5.8 Feature Code...............................................................................................................................................1372
18.5.9 Parameter Settings......................................................................................................................................1372
18.5.9 Parameter Settings......................................................................................................................................1372
18.5.10 Technical Specifications...........................................................................................................................1373
18.5.10 Technical Specifications...........................................................................................................................1373
18.6 OBU1................................................................................................................................................................1374
18.6 OBU1................................................................................................................................................................1374
18.6.1 Version Description....................................................................................................................................1374
18.6.1 Version Description....................................................................................................................................1374
18.6.2 Application..................................................................................................................................................1374
18.6.2 Application..................................................................................................................................................1374
18.6.3 Functions and Features...............................................................................................................................1374
18.6.3 Functions and Features...............................................................................................................................1374
18.6.4 Working Principle and Signal Flow............................................................................................................1375
18.6.4 Working Principle and Signal Flow............................................................................................................1375
18.6.5 Front Panel..................................................................................................................................................1377
18.6.5 Front Panel..................................................................................................................................................1377
18.6.6 Valid Slots...................................................................................................................................................1379
18.6.6 Valid Slots...................................................................................................................................................1379
18.6.7 Feature Code...............................................................................................................................................1379
18.6.7 Feature Code...............................................................................................................................................1379
18.6.8 Parameter Settings......................................................................................................................................1379
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System
Hardware Description

Contents

18.6.8 Parameter Settings......................................................................................................................................1379


18.6.9 Technical Specifications.............................................................................................................................1380
18.6.9 Technical Specifications.............................................................................................................................1380
18.7 OBU2................................................................................................................................................................1382
18.7 OBU2................................................................................................................................................................1382
18.7.1 Version Description....................................................................................................................................1382
18.7.1 Version Description....................................................................................................................................1382
18.7.2 Application..................................................................................................................................................1382
18.7.2 Application..................................................................................................................................................1382
18.7.3 Functions and Features...............................................................................................................................1382
18.7.3 Functions and Features...............................................................................................................................1382
18.7.4 Working Principle and Signal Flow............................................................................................................1383
18.7.4 Working Principle and Signal Flow............................................................................................................1383
18.7.5 Front Panel..................................................................................................................................................1385
18.7.5 Front Panel..................................................................................................................................................1385
18.7.6 Valid Slots...................................................................................................................................................1387
18.7.6 Valid Slots...................................................................................................................................................1387
18.7.7 Feature Code...............................................................................................................................................1387
18.7.7 Feature Code...............................................................................................................................................1387
18.7.8 Parameter Settings......................................................................................................................................1387
18.7.8 Parameter Settings......................................................................................................................................1387
18.7.9 Technical Specifications.............................................................................................................................1388
18.7.9 Technical Specifications.............................................................................................................................1388
18.8 DCU..................................................................................................................................................................1390
18.8 DCU..................................................................................................................................................................1390
18.8.1 Version Description....................................................................................................................................1390
18.8.1 Version Description....................................................................................................................................1390
18.8.2 Application..................................................................................................................................................1390
18.8.2 Application..................................................................................................................................................1390
18.8.3 Functions and Features...............................................................................................................................1391
18.8.3 Functions and Features...............................................................................................................................1391
18.8.4 Working Principle and Signal Flow............................................................................................................1391
18.8.4 Working Principle and Signal Flow............................................................................................................1391
18.8.5 Front Panel..................................................................................................................................................1392
18.8.5 Front Panel..................................................................................................................................................1392
18.8.6 Valid Slots...................................................................................................................................................1395
18.8.6 Valid Slots...................................................................................................................................................1395
18.8.7 Feature Code...............................................................................................................................................1395
18.8.7 Feature Code...............................................................................................................................................1395
18.8.8 Technical Specifications.............................................................................................................................1396
18.8.8 Technical Specifications.............................................................................................................................1396

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System
Hardware Description

Contents

19 Power Boards...........................................................................................................................1398
19.1 UPM..................................................................................................................................................................1398
19.1 UPM..................................................................................................................................................................1398
19.1.1 Version Description....................................................................................................................................1398
19.1.1 Version Description....................................................................................................................................1398
19.1.2 Application..................................................................................................................................................1398
19.1.2 Application..................................................................................................................................................1398
19.1.3 Functions and Features...............................................................................................................................1399
19.1.3 Functions and Features...............................................................................................................................1399
19.1.4 Working Principle and Signal Flow............................................................................................................1401
19.1.4 Working Principle and Signal Flow............................................................................................................1401
19.1.5 Front Panel..................................................................................................................................................1402
19.1.5 Front Panel..................................................................................................................................................1402
19.1.6 Valid Slots...................................................................................................................................................1405
19.1.6 Valid Slots...................................................................................................................................................1405
19.1.7 Technical Specifications.............................................................................................................................1405
19.1.7 Technical Specifications.............................................................................................................................1405
19.2 PIU....................................................................................................................................................................1406
19.2 PIU....................................................................................................................................................................1406
19.2.1 Version Description....................................................................................................................................1406
19.2.1 Version Description....................................................................................................................................1406
19.2.2 Application..................................................................................................................................................1407
19.2.2 Application..................................................................................................................................................1407
19.2.3 Functions and Features...............................................................................................................................1407
19.2.3 Functions and Features...............................................................................................................................1407
19.2.4 Working Principle and Signal Flow............................................................................................................1408
19.2.4 Working Principle and Signal Flow............................................................................................................1408
19.2.5 Front Panel..................................................................................................................................................1408
19.2.5 Front Panel..................................................................................................................................................1408
19.2.6 Valid Slots...................................................................................................................................................1410
19.2.6 Valid Slots...................................................................................................................................................1410
19.2.7 Technical Specifications.............................................................................................................................1410
19.2.7 Technical Specifications.............................................................................................................................1410
19.3 PIUA.................................................................................................................................................................1410
19.3 PIUA.................................................................................................................................................................1410
19.3.1 Version Description....................................................................................................................................1410
19.3.1 Version Description....................................................................................................................................1410
19.3.2 Application..................................................................................................................................................1410
19.3.2 Application..................................................................................................................................................1410
19.3.3 Functions and Features...............................................................................................................................1411
19.3.3 Functions and Features...............................................................................................................................1411
19.3.4 Working Principle and Signal Flow............................................................................................................1411
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System
Hardware Description

Contents

19.3.4 Working Principle and Signal Flow............................................................................................................1411


19.3.5 Front Panel..................................................................................................................................................1412
19.3.5 Front Panel..................................................................................................................................................1412
19.3.6 Valid Slots...................................................................................................................................................1414
19.3.6 Valid Slots...................................................................................................................................................1414
19.3.7 Technical Specifications.............................................................................................................................1414
19.3.7 Technical Specifications.............................................................................................................................1414
19.4 PIUB.................................................................................................................................................................1414
19.4 PIUB.................................................................................................................................................................1414
19.4.1 Version Description....................................................................................................................................1414
19.4.1 Version Description....................................................................................................................................1414
19.4.2 Application..................................................................................................................................................1415
19.4.2 Application..................................................................................................................................................1415
19.4.3 Functions and Features...............................................................................................................................1415
19.4.3 Functions and Features...............................................................................................................................1415
19.4.4 Working Principle and Signal Flow............................................................................................................1416
19.4.4 Working Principle and Signal Flow............................................................................................................1416
19.4.5 Front Panel..................................................................................................................................................1416
19.4.5 Front Panel..................................................................................................................................................1416
19.4.6 Valid Slots...................................................................................................................................................1418
19.4.6 Valid Slots...................................................................................................................................................1418
19.4.7 Technical Specifications.............................................................................................................................1418
19.4.7 Technical Specifications.............................................................................................................................1418

20 Pluggable Optical Module......................................................................................................1420


20.1 Overview..........................................................................................................................................................1420
20.1 Overview..........................................................................................................................................................1420
20.2 SFP/eSFP/SFP+................................................................................................................................................1422
20.2 SFP/eSFP/SFP+................................................................................................................................................1422
20.3 XFP...................................................................................................................................................................1428
20.3 XFP...................................................................................................................................................................1428
20.4 CWDM/DWDM...............................................................................................................................................1429
20.4 CWDM/DWDM...............................................................................................................................................1429

21 Pluggable Electrical Module...................................................................................................1444


22 Cables........................................................................................................................................1446
22.1 Fiber Jumper.....................................................................................................................................................1446
22.1 Fiber Jumper.....................................................................................................................................................1446
22.1.1 Categories of the Fiber Jumpers.................................................................................................................1446
22.1.1 Categories of the Fiber Jumpers.................................................................................................................1446
22.1.2 Connector....................................................................................................................................................1447
22.1.2 Connector....................................................................................................................................................1447
22.2 Power Cable and Ground Cable.......................................................................................................................1450
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Hardware Description

Contents

22.2 Power Cable and Ground Cable.......................................................................................................................1450


22.2.1 Power Cable of the Cabinet........................................................................................................................1450
22.2.1 Power Cable of the Cabinet........................................................................................................................1450
22.2.2 Ground Cable of the Cabinet Door.............................................................................................................1454
22.2.2 Ground Cable of the Cabinet Door.............................................................................................................1454
22.2.3 Subrack Power Cable..................................................................................................................................1455
22.2.3 Subrack Power Cable..................................................................................................................................1455
22.2.4 COA Power Cable......................................................................................................................................1457
22.2.4 COA Power Cable......................................................................................................................................1457
22.2.5 RPC Power Cable.......................................................................................................................................1459
22.2.5 RPC Power Cable.......................................................................................................................................1459
22.3 Alarm Cable......................................................................................................................................................1460
22.3 Alarm Cable......................................................................................................................................................1460
22.3.1 Cabinet Indicator Cable..............................................................................................................................1460
22.3.1 Cabinet Indicator Cable..............................................................................................................................1460
22.3.2 Indicator Cascading Cable Between Subracks or Alarm Cascading Cable Between the OptiX OSN
Equipment..............................................................................................................................................................1462
22.3.2 Indicator Cascading Cable Between Subracks or Alarm Cascading Cable Between the OptiX OSN
Equipment..............................................................................................................................................................1462
22.3.3 Alarm Cascading Cable Between the OptiX OSN Equipment and the Other Huawei Transmission
Equipment..............................................................................................................................................................1463
22.3.3 Alarm Cascading Cable Between the OptiX OSN Equipment and the Other Huawei Transmission
Equipment..............................................................................................................................................................1463
22.3.4 Alarm Input/Output Cable..........................................................................................................................1465
22.3.4 Alarm Input/Output Cable..........................................................................................................................1465
22.4 Management Cable...........................................................................................................................................1466
22.4 Management Cable...........................................................................................................................................1466
22.4.1 OAM Serial Cable......................................................................................................................................1467
22.4.1 OAM Serial Cable......................................................................................................................................1467
22.4.2 Serial 1 to 4/F1/F&f Serial Cable...............................................................................................................1468
22.4.2 Serial 1 to 4/F1/F&f Serial Cable...............................................................................................................1468
22.4.3 RS-232/RS-422 Serial Cable......................................................................................................................1469
22.4.3 RS-232/RS-422 Serial Cable......................................................................................................................1469
22.4.4 Ordinary Telephone Line............................................................................................................................1471
22.4.4 Ordinary Telephone Line............................................................................................................................1471
22.4.5 COA Cascading Cable................................................................................................................................1472
22.4.5 COA Cascading Cable................................................................................................................................1472
22.4.6 Straight-Through Cable..............................................................................................................................1473
22.4.6 Straight-Through Cable..............................................................................................................................1473
22.4.7 Crossover Cable..........................................................................................................................................1474
22.4.7 Crossover Cable..........................................................................................................................................1474
22.5 Signal Cable......................................................................................................................................................1476
22.5 Signal Cable......................................................................................................................................................1476
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System
Hardware Description

Contents

22.5.1 75-ohm 8xE1 Cable....................................................................................................................................1476


22.5.1 75-ohm 8xE1 Cable....................................................................................................................................1476
22.5.2 120-ohm 8xE1 Cable..................................................................................................................................1479
22.5.2 120-ohm 8xE1 Cable..................................................................................................................................1479
22.5.3 E3/T3/STM-1 Cable...................................................................................................................................1481
22.5.3 E3/T3/STM-1 Cable...................................................................................................................................1481
22.5.4 Framed E1 Cable........................................................................................................................................1482
22.5.4 Framed E1 Cable........................................................................................................................................1482
22.5.5 Nx64 kbit/s Cable.......................................................................................................................................1482
22.5.5 Nx64 kbit/s Cable.......................................................................................................................................1482
22.6 Clock Cable......................................................................................................................................................1500
22.6 Clock Cable......................................................................................................................................................1500
22.6.1 75-ohm/120-ohm Clock Cable...................................................................................................................1500
22.6.1 75-ohm/120-ohm Clock Cable...................................................................................................................1500
22.6.2 One-Channel Clock Transit Cable and Two-Channel Clock Transit Cable................................................1502
22.6.2 One-Channel Clock Transit Cable and Two-Channel Clock Transit Cable................................................1502

23 Indicators..................................................................................................................................1505
23.1 Indicators on the Cabinet..................................................................................................................................1505
23.1 Indicators on the Cabinet..................................................................................................................................1505
23.2 Alarm Indicators on the Boards........................................................................................................................1506
23.2 Alarm Indicators on the Boards........................................................................................................................1506

24 Labels........................................................................................................................................1511
24.1 Safety Labels.....................................................................................................................................................1511
24.1 Safety Labels.....................................................................................................................................................1511
24.1.1 Label Description........................................................................................................................................1511
24.1.1 Label Description........................................................................................................................................1511
24.1.2 Label Position.............................................................................................................................................1513
24.1.2 Label Position.............................................................................................................................................1513
24.2 Engineering Labels...........................................................................................................................................1515
24.2 Engineering Labels...........................................................................................................................................1515

25 Board Information Quick Reference.....................................................................................1519


25.1 Board Version Replacement.............................................................................................................................1520
25.1 Board Version Replacement.............................................................................................................................1520
25.2 Quick Reference Table for Optical Interfaces..................................................................................................1525
25.2 Quick Reference Table for Optical Interfaces..................................................................................................1525
25.2.1 Common Parameters Specified for Optical Interfaces of SDH Boards......................................................1525
25.2.1 Common Parameters Specified for Optical Interfaces of SDH Boards......................................................1525
25.2.2 Parameters Specified for the Optical Ports of PDH Boards.......................................................................1533
25.2.2 Parameters Specified for the Optical Ports of PDH Boards.......................................................................1533
25.2.3 Common Parameters Specified for Optical Interfaces of Packet Boards...................................................1534
25.2.3 Common Parameters Specified for Optical Interfaces of Packet Boards...................................................1534
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System
Hardware Description

Contents

25.2.4 Common Parameters Specified for Optical Interfaces of Packet Boards...................................................1537


25.2.4 Common Parameters Specified for Optical Interfaces of Packet Boards...................................................1537
25.2.5 Common Parameters Specified for Optical Interfaces of Data Boards......................................................1537
25.2.5 Common Parameters Specified for Optical Interfaces of Data Boards......................................................1537
25.3 Quick Reference of Board Functions...............................................................................................................1540
25.3 Quick Reference of Board Functions...............................................................................................................1540
25.3.1 Information Quick Reference of SDH Boards...........................................................................................1540
25.3.1 Information Quick Reference of SDH Boards...........................................................................................1540
25.3.2 Information Quick Reference of PDH Boards...........................................................................................1543
25.3.2 Information Quick Reference of PDH Boards...........................................................................................1543
25.3.3 Information Quick Reference of Data Boards............................................................................................1544
25.3.3 Information Quick Reference of Data Boards............................................................................................1544
25.3.4 Information Quick Reference of Packet Boards.........................................................................................1548
25.3.4 Information Quick Reference of Packet Boards.........................................................................................1548
25.4 Loopback Capability of the Boards..................................................................................................................1553
25.4 Loopback Capability of the Boards..................................................................................................................1553
25.5 Protection Schemes Supported by Each Board................................................................................................1564
25.5 Protection Schemes Supported by Each Board................................................................................................1564
25.6 Quick Reference of Power Consumption and Weight of Each Board..............................................................1571
25.6 Quick Reference of Power Consumption and Weight of Each Board..............................................................1571

26 Parameter Settings..................................................................................................................1577
26.1 Packet Processing Boards.................................................................................................................................1578
26.1 Packet Processing Boards.................................................................................................................................1578
26.1.1 General Attributes.......................................................................................................................................1578
26.1.1 General Attributes.......................................................................................................................................1578
26.1.2 Flow Control...............................................................................................................................................1579
26.1.2 Flow Control...............................................................................................................................................1579
26.1.3 Layer 2 Attributes.......................................................................................................................................1580
26.1.3 Layer 2 Attributes.......................................................................................................................................1580
26.1.4 Layer 3 Attributes.......................................................................................................................................1582
26.1.4 Layer 3 Attributes.......................................................................................................................................1582
26.1.5 Advanced Attributes...................................................................................................................................1583
26.1.5 Advanced Attributes...................................................................................................................................1583
26.2 EoD Boards.......................................................................................................................................................1586
26.2 EoD Boards.......................................................................................................................................................1586
26.3 Packet Interface Boards....................................................................................................................................1586
26.3 Packet Interface Boards....................................................................................................................................1586
26.3.1 SDH Parameters.........................................................................................................................................1587
26.3.1 SDH Parameters.........................................................................................................................................1587
26.3.2 Channelized STM-1 Port............................................................................................................................1588
26.3.2 Channelized STM-1 Port............................................................................................................................1588
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System
Hardware Description

Contents

26.3.3 E1 Port........................................................................................................................................................1591
26.3.3 E1 Port........................................................................................................................................................1591
26.4 Data Boards......................................................................................................................................................1594
26.4 Data Boards......................................................................................................................................................1594
26.4.1 SDH Parameters.........................................................................................................................................1595
26.4.1 SDH Parameters.........................................................................................................................................1595
26.4.2 Ethernet Parameters....................................................................................................................................1596
26.4.2 Ethernet Parameters....................................................................................................................................1596
26.4.3 ATM Parameters.........................................................................................................................................1607
26.4.3 ATM Parameters.........................................................................................................................................1607
26.5 SDH Processing Boards....................................................................................................................................1607
26.5 SDH Processing Boards....................................................................................................................................1607
26.6 PDH Boards......................................................................................................................................................1608
26.6 PDH Boards......................................................................................................................................................1608
26.7 WDM Boards....................................................................................................................................................1611
26.7 WDM Boards....................................................................................................................................................1611
26.8 Cross-Connect and Timing Units.....................................................................................................................1618
26.8 Cross-Connect and Timing Units.....................................................................................................................1618
26.9 Optical Amplifier Boards..................................................................................................................................1622
26.9 Optical Amplifier Boards..................................................................................................................................1622

27 Task Collection.........................................................................................................................1629
27.1 Querying the Protection Subnet........................................................................................................................1630
27.1 Querying the Protection Subnet........................................................................................................................1630
27.2 Troubleshooting Service Unavailability...........................................................................................................1630
27.2 Troubleshooting Service Unavailability...........................................................................................................1630
27.3 Troubleshooting the Clock Tracing Failure......................................................................................................1631
27.3 Troubleshooting the Clock Tracing Failure......................................................................................................1631
27.4 Configuring the F&f Debugging Serial Port and OAM NM Port....................................................................1632
27.4 Configuring the F&f Debugging Serial Port and OAM NM Port....................................................................1632
27.5 Testing the Frequency Accuracy of the Free-Run Clock..................................................................................1633
27.5 Testing the Frequency Accuracy of the Free-Run Clock..................................................................................1633
27.6 Testing the Clock Holdover Accuracy..............................................................................................................1634
27.6 Testing the Clock Holdover Accuracy..............................................................................................................1634
27.7 Checking Board Parameters.............................................................................................................................1635
27.7 Checking Board Parameters.............................................................................................................................1635
27.8 Testing the SAN Service Channel....................................................................................................................1638
27.8 Testing the SAN Service Channel....................................................................................................................1638
27.9 Testing the SDI Service Channel......................................................................................................................1640
27.9 Testing the SDI Service Channel......................................................................................................................1640

A Glossary.....................................................................................................................................1642

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Hardware Description

1 Equipment Structure

Equipment Structure

The OptiX OSN 3500 equipment consists of the cabinet, cabinet doors, DC power distribution
unit (PDU), subracks, orderwire phone fixing frame, boards, and cables. The OptiX OSN
3500 subrack can be installed in a 300 mm or 600 mm ETSI cabinet.
Figure 1-1 shows the appearance of the OptiX OSN 3500 that is installed in the 300 mm ETSI
cabinet.

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Figure 1.1 Appearance of the OptiX OSN 3500 that is installed in the 300 mm ETSI cabinet
1

7
7

7
H
D

1. DC PDU

2. Side panel

3. Cable distribution plate

4. Orderwire phone fixing frame

5. Subrack

6. Cabinet

7. Fiber management tray

8. Front door

Figure 1-2 shows the appearance of the general OptiX OSN 3500 subrack and enhanced
OptiX OSN 3500 subrack (1100 W).

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Figure 1.2 Appearance of the general OptiX OSN 3500 subrack and enhanced OptiX OSN 3500
subrack (1100 w)

4
1. Interface board area

2. Fan area

3. Processing board area

4. Cable routing area

Figure 1-3 shows the appearance of the OptiX OSN 3500 type III subrack (2300 W).

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Figure 1.3 Appearance of the OptiX OSN 3500 type III subrack (2300 W)

4
1. Interface board area

2. Fan area

3. Processing board area

4. Cable routing area

The difference between a general subrack and a type III subrack (2300 W) is with regard to applicable
power boards. With different power boards, the two types of subracks support different maximum power
consumption values.

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Cabinet

About This Chapter


Subracks are installed in a cabinet. OptiX OSN subracks need to be installed in appropriate
cabinets.
2.1 Types of Cabinets
The OptiX OSN 3500 subrack can be installed in the 300 mm or 600 mm ETSI cabinet.2600
mm high T63 cabinets are discontinued. For details, see the released product change notice.
2.2 Configuration of the Cabinet
An ETSI cabinet has indicators and a DC PDU at the top.

2.1 Types of Cabinets


The OptiX OSN 3500 subrack can be installed in the 300 mm or 600 mm ETSI cabinet.2600
mm high T63 cabinets are discontinued. For details, see the released product change notice.
The cabinets described in this topic are provided by Huawei.

The 300 mm ETSI cabinet is available in two types, namely, T63 cabinet and N63E cabinet.
Figure 2-1 shows the appearances of the T63 cabinet and N63E cabinet.

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Figure 1.1 Appearances of the T63 cabinet and N63E cabinet

T63 Cabinet

N63E Cabinet

1.1.1.1.1 Comparison Between the Specifications of the T63 Cabinet and the

Specifications of the N63E Cabinet


Table 2-1 describes the comparison between the specifications of the T63 cabinet and the
specifications of the N63E cabinet.
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Figure 1.1 Comparison between the specifications of the T63 cabinet and the specifications of the
N63E cabinet
Cabinet

Dimensions (mm)

Weight (kg)

300 mm ETSI cabinet (T63)

600 (W) x 300 (D) x 2000 (H)

58

600 (W) x 300 (D) x 2200 (H)

63

600 (W) x 300 (D) x 2600 (H)

73

600 (W) x 300 (D) x 2000 (H)

41

600 (W) x 300 (D) x 2200 (H)

45

300 mm ETSI cabinet (N63E)

1.1.1.1.2 T63 Cabinet


The specifications of the T63 cabinet comply with the ETSI standard. The T63 cabinet is 600
mm wide and 300 mm deep.
There are two ground bolts on the frame at the top of the T63 cabinet. Figure 2-2 shows the
locations of the cable holes at the top of the T63 cabinet. Figure 2-3 shows the locations of the
cable holes at the bottom of the T63 cabinet.
Figure 1.2 Locations of the cable holes at the top of the T63 cabinet
600mm
200mm

106mm

Cabling hole
15mm

160mm

200mm

295mm

106mm

110mm

110mm

Power cable hole Cabniet grounding terminal

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Figure 1.3 Locations of the cable holes at the bottom of the T63 cabinet
600mm
106mm

Cabling hole
15mm

200mm

200mm

160mm

295mm

106mm

Cabniet installtion hole

110mm

Power cable hole

1.1.1.1.3 N63E Cabinet


The specifications of the N63E cabinet comply with the ETSI standard. The N63E cabinet is
600 mm wide and 300 mm deep.
There are two ground bolts on the frame at the top of the N63E cabinet. Figure 2-4 shows the
locations of the cable holes at the top of the N63E cabinet. Figure 2-5 shows the locations of
the cable holes at the bottom of the N63E cabinet.
Figure 1.4 Locations of the cable holes at the top of the N63E cabinet
Cable hole Cable hole

Cable hole Cable hole

600mm
143mm

155mm

62mm

81mm

188mm

300mm

66mm

251mm
Fiber hole

Grounding bolt

Fiber hole

Power cable hole

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Figure 1.5 Locations of the cable holes at the bottom of the N63E cabinet
Cable hole

Cable hole

184mm

360mm
Fiber hole

Fiber hole

The difference between the cable routing in the case of the T63 cabinet and the cable routing
in the case of the N63E cabinet is with regard to the cable routing at the top and bottom cable
holes. The cable routing in the T63 cabinet is the same as the cable routing in the N63E
cabinet.
The T63 cabinet is approximately 16 mm deeper than the N63E cabinet. When you install the
mounting ears of the components, select proper mounting holes according to the type of
cabinet on site.

1.1.1.1.4 Enclosure Frame


Only the 2000 mm and 2200 mm high N63E cabinets are available. If the 2600 mm high
N63E cabinet is required, you need to place a 400 mm high enclosure frame on the top of the
2200 mm high N63E cabinet.
Figure 2-6 shows the picture and dimensions of the enclosure frame.

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Figure 1.6 Picture and dimensions of the enclosure frame

60

0m
m

400mm

mm
00

1.1.1.1.5 N66T Cabinet


The 600 mm ETSI cabinet is called the N66T cabinet. The N66T cabinet uses both the front
and rear columns, and it has a single front door and a single rear door. Figure 2-7 shows the
appearance of the N66T cabinet.
The N66T cabinet supports back-to-back installation of one ordinary OptiX OSN 3500 subrack and one
enhanced OptiX OSN 3500 subrack (1,100 W).

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Figure 1.7 Appearance of the N66T cabinet

Table 2-2 lists the specifications of the N66T cabinet.


Figure 1.1 Specifications of the N66T cabinet
Cabinet

Dimensions (mm)

Weight (kg)

N66T cabinet

600 (W) x 600 (D) x 2000 (H)

71

600 (W) x 600 (D) x 2200 (H)

76

There are two ground bolts on the frame at the top of the N66T cabinet. Figure 2-8 shows the
locations of the cable holes at the top of the N66T cabinet. Figure 2-9 shows the locations of
the cable holes at the bottom of the N66T cabinet.

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Figure 1.8 Locations of the cable holes at the top of the N66T cabinet
600 mm

95 mm

95 mm

95 mm

215 mm

Cabling hole

17.8 mm

600 mm

95 mm

17.8 mm

224 mm

Power cable hole

Cabniet grounding terminal

224 mm

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Figure 1.9 Locations of the cable holes at the bottom of the N66T cabinet

Cabling hole

2.2 Configuration of the Cabinet


An ETSI cabinet has indicators and a DC PDU at the top.
Figure 2-10 shows the positions of the indicators and the DC PDU.

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Figure 1.1 ETSI cabinet


1
2
PowerCritical MajorMinor

Power distribution unit

H
W

1. Indicators

2. DC PDU

2.2.1 Indicators
The ETSI cabinet has one power indicator and three alarm severity indicators.
Table 2-3 describes the meanings of the status of the indicators.
Figure 1.2 Meanings of the status of the indicators
Indicator

Status

Meaning

Power indicator - Power (green)

On

Power is supplied to
the equipment.

Off

Power is not supplied


to the equipment.

On

A critical alarm occurs


on the equipment.

Off

No critical alarm
occurs on the
equipment.

On

A major alarm occurs


on the equipment.

Off

No major alarm occurs


on the equipment.

On

A minor alarm occurs

Critical alarm indicator - Critical (red)

Major alarm indicator - Major (orange)

Minor alarm indicator - Minor (yellow)


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Indicator

Status

Meaning
on the equipment.

Off

No minor alarm occurs


on the equipment.

The status of the indicators is controlled by the AUX on the subrack. The indicators work only
after the cables of the indicators are correctly connected and the subrack is powered on.

2.2.2 DC Power Distribution Unit


The DC power distribution unit (PDU) is located on the top of a cabinet and is used to supply
power to the equipment.

1.1.1.1.6 DC Power Distribution Unit N1PDU


Figure 2-11 shows the front panel of the general cabinet DC PDU, N1PDU.
Figure 1.1 Front panel of the N1PDU

3
2
OUTPUT

2 3 4 5

ON

3
2
OUTPUT

ON
RTN1(+) RTN2(+) NEG1(-) NEG2(-)

OFF
32A

32A

20A

INPUT

OFF
32A

20A

32A

20A

1. Terminal block (A)

2. Power ground cable RTN1(+)

3. Power ground cable RTN2(+)

4. Power cable NEG1(-)

5. Power cable NEG2(-)

6. Terminal block (B)

7. PGND

8. Power switch

20A

In the case of the OptiX OSN 3500, the output terminal block on side A supplies power to the
power interface board on side A of the subrack, and the output terminal block on side B
supplies power to the power interface board on side B of the subrack. Table 2-4 shows the
connections of the output terminal blocks on side A and side B.

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Figure 1.1 Connections of the output terminal blocks on side A and side B
Terminal
Block on Side
A

Corresponding Subrack
and Power Interface
Board

Terminal
Block on
Side B

Corresponding Subrack
and Power Interface
Board

Power interface board on


side A of the first subrack

Power interface board on


side B of the first subrack

Power interface board on


side A of the second
subrack

Power interface board on


side B of the second
subrack

Power interface board on


side A of the third subrack

Power interface board on


side B of the third subrack

Power interface board on


side A of the fourth subrack

Power interface board on


side B of the fourth subrack

In the case of an enhanced subrack, the two power inputs work in load-sharing mode (each input carries
16 A). In the telecommunications room, however, the PDU needs to provide power supply of 34 A to an
entire subrack. In the case of a general subrack, the two power inputs work in load-sharing mode (each
input carries 10 A). In the telecommunications room, however, the PDU needs to provide power supply
of 20 A to an entire subrack. In this case, power failure will not occur if either of the power inputs fails.

In the case of the OptiX OSN 3500, the first and second terminal blocks are used. The third
and fourth terminal blocks supplies power to other equipment such as case-shaped optical
amplifiers. The number of the subracks increases from the bottom up.
The DPD100-2-8 PDU can substitute for the N1PDU.

1.1.1.1.7 DC Power Distribution Unit DPD100-2-8 PDU


The DPD100-2-8 is installed at the top of the cabinet, and is divided into two parts, namely,
part A and part B that back up each other. Part A and part B each receive one -48 V power
input and provide four power outputs to subracks inside the cabinet.
Figure 2-12 and Figure 2-13 show the front panel of the DPD100-2-8 PDU.
Figure 1.2 Front panel of the DPD100-2-8 PDU (covered)

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Figure 1.3 Front panel of the DPD100-2-8 PDU (uncovered)

Power output area: On both sides of the DC PDU, there are respectively four output
terminal blocks that are used to connect to the power cables of subracks.

Power input area: INPUT A and INPUT B are each connected to one -48 V DC power
cable and one power ground cable, that is, two -48 V DC power cables and two power
ground cables in total.

Power switch area: On both sides of the DC PDU, there are respectively four power
output switches that correspond to the output terminal blocks. The power output switches
control power supply to the corresponding subracks.

1.1.1.1.8 DC Power Distribution Unit TN51PDU


The TN51PDU is installed at the top of the cabinet, and is divided into two parts, namely, part
A and part B that back up each other. Part A and part B respectively access four -48 V power
supplies. Among them:

Connections of main power supply: Part A is connected to RTN(+) and NEG(-).

Connections of standby power supply: Part B is connected to RTN(+) and NEG(-).


RTN(+)s and NEG(-)s are located at the upper layer and lower layer of the power input area
respectively.

The TN51PDU provides eight power output interfaces, supplying power to the subracks
inside the cabinet. Figure 2-14 shows the front panel of the TN51PDU.
Figure 1.4 Front panel of the TN51PDU

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terminal blocks that are used to connect to the power cables of subracks.

Power input area: The TN51PDU supports corresponding power input capability based
on the power supply capacity of the telecommunications room.

When the telecommunications room provides four power inputs not less than 63 A,
part A and part B can respectively be connected to four -48 V DC power cables and
four power ground cables, that is, eight -48 V DC power cables and eight power
ground cables in total.

When the telecommunications room provides two power inputs not less than 125 A,
part A and part B can respectively be connected to two -48 V DC power cables and
two power ground cables, that is, four-48 V DC power cables and four power ground
cables in total.

Power switch area: On both sides of the DC PDU, there are respectively four power
output switches that correspond to the output terminal blocks. The power output switches
control power supply to the corresponding subracks.

1.1.1.1.9 DC Power Distribution Unit DPD63-8-8 PDU


The DPD63-8-8 PDU is installed at the top of the cabinet, and is divided into two parts,
namely, part A and part B that back up each other. Part A and part B each receive four -48 V
power inputs and provide four power outputs subracks inside the cabinet.
Figure 2-15 and Figure 2-16 show the front panel of the DPD63-8-8 PDU.
Figure 1.5 Front panel of the DPD63-8-8 PDU (covered)

Figure 1.6 Front panel of the DPD63-8-8 PDU (uncovered)

Power output area: On both sides of the DC PDU, there are respectively four output
terminal blocks that are used to connect to the power cables of subracks.

Power input area: INPUT A and INPUT B are each connected to four -48 V DC power
cables and four power ground cables, that is, eight -48 V DC power cables and eight

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power ground cables in total.

Power switch area: On both sides of the DC PDU, there are respectively four power
output switches that correspond to the output terminal blocks. The power output switches
control power supply to the corresponding subracks.
Each of part A and part B needs to be connected to only two -48 V DC power cables and two power
ground cables.
The DPD63-8-8 PDU can substitute for the TN51PDU.
By default, one DPD63-8-8 PDU provides eight inputs and eight outputs. It can provide four inputs and
eight outputs with a short-circuiting copper bar installed.

1.1.1.1.10 Power Distribution Scheme


The DC PDU provides two groups (left and right) of power output at the same time. Table 2-5
lists the power distribution scheme of the N1PDU. Table 2-6 lists the power distribution
scheme of the TN51PDU. Table 2-7 lists the power distribution scheme of the DPD100-2-8
PDU.Table 2-8 lists the power distribution scheme of the DPD63-8-8 PDU.
Figure 1.1 Power distribution scheme of the N1PDU
Input/Out
put

Group
No.

Power

Ground
Cable

Remarks

Power
input

INPUT

NEG1(-)

RTN1(+)

External power supply 1

NEG2(-)

RTN2(+)

External power supply 2

Power
output

32 A
power
supply
group

1(-)

1(+)

Two outputs, providing 1+1 hot backup


of 32 A power to the subrack

2(-)

2(+)

Two outputs, providing 1+1 hot backup


of 32 A power to the subrack

20 A
power
supply
group

3(-)

3(+)

Two outputs, providing 1+1 hot backup


of 20 A power to the subrack

4(-)

4(+)

Two outputs, providing 1+1 hot backup


of 20 A power to the subrack

Connected to the protection ground of


the cabinet

Protection
ground

Figure 1.2 Power distribution scheme of the TN51PDU


Input/Output

Group No.

Remarks

Power input
(short-circuiting
copper bar not
installed)

INPUT A

Two 63 A power inputs and two 32 A power inputs

INPUT B

Two 63 A power inputs and two 32 A power inputs

Power input
(short-circuiting
copper bar

INPUT A

One 125 A power input and two 32 A power inputs

INPUT B

One 125 A power input and two 32 A power inputs

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Input/Output

2 Cabinet

Group No.

Remarks

63 A power
supply group

Four outputs, providing 1+1 hot backup of 63 A power


to the subrack

32 A power
supply group

Four outputs, providing 1+1 hot backup of 32 A power


to the subrack

Connected to the protection ground of the cabinet

installed)
Power output

Protection
ground

Figure 1.3 Power distribution scheme of the DPD100-2-8 PDU


Input/Output

Group No.

Remarks

Power input

INPUT A

One 100 A power input

INPUT B

One 100 A power input

OUTPUT A

Four outputs, providing two 32 A power inputs and


two 20 A power inputs to subracks

OUTPUT B

Four outputs, providing 1+1 hot backup for the two 32


A power inputs and two 20 A power inputs to subracks

Connected to the protection ground of the cabinet

Power output

Protection
ground

Figure 1.4 Power distribution scheme of the DPD63-8-8 PDU


Input/Output

Group No.

Remarks

Power input
(short-circuiting
copper bar not
installed)

INPUT A

Two 63 A power inputs and two 32 A power inputs

INPUT B

Two 63 A power inputs and two 32 A power inputs

Power input
(short-circuiting
copper bar
installed)

INPUT A

One 125 A power input and one 63 A power input

INPUT B

One 125 A power input and one 63 A power input

Power output

OUTPUT A

Four outputs, providing two 63 A power inputs and


two 32 A power inputs to subracks

OUTPUT B

Four outputs, providing 1+1 hot backup for the two 63


A power inputs and two 32 A power inputs to subracks

Connected to the protection ground of the cabinet

Protection
ground

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1.1.1.1.11 Technical Specifications


Figure 1.1 Technical specifications of the PDU
Board

Dimensions
(mm)

Single-Cabinet
Input Voltage
(V)

Single-Cabinet
Output Voltage
(V)

Output Current
(A)

DPD1002-8 PDU

44.2 (W) x 79.6


(D) x 110 (H)

-48 (DC)

-38.4 to -57.6

4x32 A

-60 (DC)

-48 to -72

4x20 A

N1PDU

530 (W) x 97 (D)


x 133 (H)

-48 (DC)

-38.4 to -57.6

4x32 A

-60 (DC)

-48 to -72

4x20 A

DPD63-88 PDU

44.2 (W) x 79.6


(D) x 110 (H)

-48 (DC)

-38.4 to -57.6

4x63 A

-60 (DC)

-48 to -72

4x32 A

TN51PDU

535 (W) x 147


(D) x 133 (H)

-48 (DC)

-38.4 to -57.6

4x63 A

-48 to -72

4x32 A

-60 (DC)

NOTE
Two power inputs that back up each other need to be provided, and they work in load-sharing mode.

In the telecommunications room, it is required that the PDU needs to provide power supply for an
entire subrack. In this case, normal power supply can be guaranteed when either of the power inputs
fails.

2.2.3 Other Configurations


In addition to subracks, external case-shaped devices can be installed in a cabinet as required.

Uninterruptible power module (UPM)

Roman pump amplifiers RPC01 and RPC02

Orderwire phone

Dispersion compensation module (DCM)

Case-shaped optical amplifier (COA)

Fiber management tray

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3 Subrack

Subrack

About This Chapter


This topic describes the structure, capacity, slot layout, and technical specifications of the
subrack.
3.1 Subrack Structure
An OptiX OSN 3500 subrack has a two-layer structure. The subrack consists of an interface
board area, a processing board area, a fan area, and a cable routing area.
3.2 Slot Allocation
An OptiX OSN 3500 subrack consists of an upper layer and a lower layer. The upper layer,
where 19 slots are available, is the slot area for interface boards. The lower layer, where 18
slots are available, is the slot area for processing boards.
3.3 Slot Access Capacity in Packet Mode
When different cross-connect boards are used, the access capacity of each slot on the
equipment varies.
3.4 Slot Access Capacity in TDM Mode
When different cross-connect boards are used, the access capacity of each slot on the
equipment varies.
3.5 Ventilation Mode
The subrack of the equipment has many minute air vents and houses fans. The air enters from
the front and exits from the back, and the air flows from the bottom to the top. In this manner,
the equipment has good performance in heat dissipation.
3.6 Cable Management
This topic describes the function of the cable distribution plate and fiber spool box and the
overall scheme for cable routing.
3.7 Mapping Policies of Power Consumption
The increasing features supported by the equipment cause higher power consumption. To
ensure the normal operation of the equipment, the internal power supply system provides
different mapping policies of power consumption according to different power consumption
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requirements.
3.8 Technical Specifications
The technical specifications of the subrack include the dimensions, weight, and maximum
power consumption.

3.1 Subrack Structure


An OptiX OSN 3500 subrack has a two-layer structure. The subrack consists of an interface
board area, a processing board area, a fan area, and a cable routing area.
Figure 3-1 shows the structure of an OptiX OSN 3500 subrack.
Figure 1.1 Structure of an OptiX OSN 3500 subrack

1. Interface board area

2. Fan area

3. Processing board area

4. Cable routing area

The functions of the areas are as follows:

Interface board area: This area houses the interface boards of the OptiX OSN 3500.

Fan area: This area houses three fan modules, which dissipate heat generated by the
equipment.

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Processing board area: This area houses the processing boards of the OptiX OSN 3500.

Cable routing area: This area houses fiber jumpers in a subrack.


An interface board is also called an access board or a transit board. An interface board provides physical
interfaces for optical signals and electrical signals, and transmits the optical signals or electrical signals
to the corresponding processing board.

3.2 Slot Allocation


An OptiX OSN 3500 subrack consists of an upper layer and a lower layer. The upper layer,
where 19 slots are available, is the slot area for interface boards. The lower layer, where 18
slots are available, is the slot area for processing boards.
Figure 3-2 shows the single-slot layout of an OptiX OSN 3500 subrack.
Figure 1.1 Slot layout of an OptiX OSN 3500 subrack

S
L
O
T
1
9

S
L
O
T
2
0

S
L
O
T
2
1

S
L
O
T
2
2

S
L
O
T
2
3

S
L
O
T
2
4

S
L
O
T
2
5

S
L
O
T
2
6

S
L
O
T
2
7

S
L
O
T
2
8

P
I
U

P
I
U

FAN
SLOT 38

S
L
O
T
1

S S S S
L L L L
O O O O
T T T T
2 3 4 5

S
L
O
T
2
9

S
L
O
T
3
0

S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S S
L L
O O
T T
7 8

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
7

A
U
X

FAN
SLOT 39

S
L
O
T
6

S
L
O
T
3
4

S
L
O
T
9

S
L
O
T
1
0

X
C
S

X
C
S

S
L
O
T
1
1

FAN
SLOT 40

S S S S
L L L L
O O O O
T T T T
1 1 1 1
2 3 4 5

S
L
O
T
1
6

S
L
O
T
1
7

S
L
O
T
1
8

G
S
C
C

G
S
C
C

Fiber routing trough

Figure 3-3 shows the dual-slot layout of an OptiX OSN 3500 subrack.

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Figure 1.2 Dual-slot layout of an OptiX OSN 3500 subrack

The slots in an OptiX OSN 3500 subrack are allocated as follows:

Slots for service interface boards: slots 19-26 and 29-36

Slots for service processing boards: slots 1-8 and 11-17

Slots for cross-connect and timing boards: slots 9-10

Slots for system control and communication boards: slots 17-18 (slot 17 can also house a
processing board)

Slots for power interface boards: slots 27-28

Slot for an auxiliary interface board: slot 37

Slots for fan boards: slots 38-40


In an OptiX OSN 3500 subrack, dual-slot boards and single-slot boards cannot be installed at the same
time.

1.1.1.1.12 Mapping Between Slots for Interface Boards and Slots for Processing Boards
Table 3-1 lists the mapping between slots for interface boards and slots for processing boards.
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Figure 1.1 Mapping between slots for interface boards and slots for processing boards
Slot for
Processing
Board

Dual-Slot for
Processing Board

Slot for Corresponding Interface Board

Slot 2

Slots 19 and 20

Slot 3

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slot 5

Slots 25 and 26

Slot 13

Slot 13

Slot 29 and 30

Slot 14

Slot 31 and 32

Slot 15

Slot 15

Slot 33 and 34

Slot 16

Slot 35 and 36

1.1.1.1.13 Paired Slots


If overhead bytes pass through the backplane bus between two slots, the two slots are called
paired slots. Paired slots achieves automatic transparent transmission of overhead bytes such
as K bytes, D bytes, and E1 overhead bytes. This improves multiplex section protection
(MSP) switching performance and protects orderwire and DCC communication with other
NEs even after the system control board on the local NE cannot be detected. Table 3-2 lists
paired slots.
Figure 1.1 Paired slots
Cross-Connect Capacity

Paired Slot

200 Gbit/s

(Slot 2, Slot 17)


(Slot 3, Slot 16)
(Slot 4, Slot 15)
(Slot 5, Slot 14)
(Slot 6, Slot 13)
(Slot 7, Slot 12)
(Slot 8, Slot 11)

3.3 Slot Access Capacity in Packet Mode


When different cross-connect boards are used, the access capacity of each slot on the
equipment varies.
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When the N1PSXCS board is used, one service processing board occupies two slots. In this
case, adjacent slots can be merged, as shown in Figure 3-4.
Figure 1.1 Slot access capacity of the OptiX OSN 3500 when the N1PSXCS board is used (dualslot)

S
L
O
T
1
3

S
L
O
T
1
5

S S
L L
O O
T T
1 1
7 8

GSCC

S
L
O
T
1
1

GSCC

10Gbit/s

S
L
O
T
1
0

7.5Gbit/s

10Gbit/s

S
L
O
T
9

10Gbit/s

S
L
O
T
7

10Gbit/s

S
L
O
T
5

FAN

XCS

S
L
O
T
3

XCS

S
L
O
T
1

7.5Gbit/s

FAN

5Gbit/s

FAN

Cable routing area

Figure 3-5 shows the slot access capacity of the OptiX OSN 3500 when the N2PSXCSA or
N3PSXCSA board is used.
Figure 1.2 Slot access capacity of the OptiX OSN 3500 when the N2PSXCSA/N3PSXCSA board
is used (single slots)

XCS

20Gbit/s

10Gbit/s

GSCC

XCS

S S S S
L L L L
O O O O
T T T T
1 1 1 1
5 6 7 8

GSCC

20Gbit/s

S
L
O
T
1
4

5Gbit/s

S S
L L
O O
T T
1 1
2 3

2.5Gbit/s

S
L
O
T
1
1

5Gbit/s

S
L
O
T
1
0

5Gbit/s

S
L
O
T
9

5Gbit/s

S
L
O
T
8

5Gbit/s

S
L
O
T
7

5Gbit/s

S S S S S
L L L L L
O O O O O
T T T T T
2 3 4 5 6

2.5Gbit/s

S
L
O
T
1

10Gbit/s

FAN

2.5Gbit/s

FAN

2.5Gbit/s

FAN

Cable routing

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3.4 Slot Access Capacity in TDM Mode


When different cross-connect boards are used, the access capacity of each slot on the
equipment varies.
Figure 3-6 shows the slot access capacity of the OptiX OSN 3500.
Figure 1.1 Slot access capacity of the OptiX OSN equipment

S S
L L
O O
T T
1 1
2 3

S
L
O
T
1
4

20Gbit/s

20Gbit/s

XCS

XCS

20Gbit/s

20Gbit/s

10Gbit/s
5Gbit/s

S S S S
L L L L
O O O O
T T T T
1 1 1 1
5 6 7 8

GSCC

S
L
O
T
1
1

5Gbit/s or GSCC

S
L
O
T
1
0

5Gbit/s

S
L
O
T
9

10Gbit/s

S
L
O
T
8

10Gbit/s

S
L
O
T
7

5Gbit/s

S S S S S
L L L L L
O O O O O
T T T T T
2 3 4 5 6

5Gbit/s

S
L
O
T
1

10Gbit/s

FAN

5Gbit/s

FAN

5Gbit/s

FAN

Cable routing

3.5 Ventilation Mode


The subrack of the equipment has many minute air vents and houses fans. The air enters from
the front and exits from the back, and the air flows from the bottom to the top. In this manner,
the equipment has good performance in heat dissipation.
Make smooth ventilation of the air pipe of the cabinet. Do not block the air intake vents and air exhaust
vents of the subrack. Do not place any sundries in the upper part of the subrack to ensure that air can
flow through the subrack.

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Figure 1.1 Ventilation mode of the OptiX OSN 3500

AIR OUT

AIR OUT

AIR OUT

AIR IN

When the arrow color changes from a cool color to a warm color, air temperature increases.

3.6 Cable Management


This topic describes the function of the cable distribution plate and fiber spool box and the
overall scheme for cable routing.

1.1.1.1.14 Cable Distribution Plate


One subrack needs to have one cable distribution plate installed on its top. Figure 3-8 shows
the appearance of the cable distribution plate. The function of the cable distribution plate is to
fix the equipment cable to avoid the difficulty that the board may not be easily reseated or that
the air vents of the equipment are blocked and therefore the heat dissipation of the equipment
is poor.

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Figure 1.1 Appearance of the cable distribution plate

1.1.1.1.15 Fiber Spool Box


The fiber spool box is used to coil the redundant optical fibers inside the cabinet, and is
installed under a subrack by default. Figure 3-9 shows the appearance of a fiber spool box.
Figure 1.2 Appearance of a fiber spool box

Cable-through
hole

Fiber spool
box

For the installation position of the fiber spool box and cable distribution plate in the cabinet,
see 1 Equipment Structure.

1.1.1.1.16 Overall Scheme for Fiber Jumper Routing

The fiber jumpers of the equipment are routed through the front vertical columns at the
two sides of the cabinet.

The fiber jumpers of the equipment are led out through the fiber hole of the cabinet.

The fiber jumpers between the cabinet and the ODF are protected with a protection pipe.
The two ends of the protective pipe should be extended 10 cm into the cabinet and the
ODF.

The fiber jumpers are secured smoothly and interconnected reliably in the ODF. The
redundant fiber jumpers are coiled tidily.

When the internal fiber jumpers are routed, the redundant fibers are coiled tidily in the
fiber spool box.

The routing and connection of the fiber jumpers should be consistent with the design.
The optical attenuators are added according to the requirements of the engineering
design.

The bend radius of the fiber jumper must be greater than its minimum curvature radius.

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Specifically, the minimum curvature radius for the 2 mm fiber jumper is 40 mm, and that
for the 3 mm fiber jumper is 60 mm.

1.1.1.1.17 Overall Scheme for Cable Routing

The external power cables and ground cables are arranged separately from the signal
cables, with a space more than 3 cm.

The power cables of the subrack are bundled under the cable distribution plate. The
power cables of the subrack are routed separately towards the back of the two sides of
the cabinet, and are routed along the back of the side panels to reach the power box.

In the case of overhead cabling, the signal cables of the upper subrack are led out from
the cable-through holes in the top middle of the cabinet, and the signal cables of the
lower subrack are led out from the cable-through holes on the two sides of the top of the
cabinet.

In the case of underfloor cabling, the signal cables of the upper and lower subracks are
led out from the cable-through holes on the two sides of the bottom of the cabinet.

3.7 Mapping Policies of Power Consumption


The increasing features supported by the equipment cause higher power consumption. To
ensure the normal operation of the equipment, the internal power supply system provides
different mapping policies of power consumption according to different power consumption
requirements.
The internal power supply system consists of PDU and PIU. Table 3-3 shows different
mapping policies of power consumption.
Figure 1.1 Mapping policies of power consumption on the OptiX OSN 3500
Type of
Subrack

Label of Subrack

Mappin
g PDU

Mappin
g PIU

Mappin
g UPM

Maximu
m
Power
Consum
ption

Fuse
Capacit
y of
Circuit
Breaker
s in a
DC PDU

Standard
OptiX
OSN
3500
subrack

N1PDU,
DPD100
-2-8
PDU

N1PIU,
N1PIU
A

EPS754815AF

720 W

20 A

Enhance
d OptiX
OSN
3500
subrack
(1100
W)

N1PDU,
DPD100
-2-8
PDU

N1PIU
A

EPS754815AF

1100 W

32 A

OptiX
OSN

TN51PD
U,

N1PIUB

EPS754815AF

2300 W

63 A

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Type of
Subrack

3 Subrack

Label of Subrack

3500
type III
subrack
(2300
W)

Mappin
g PDU

Mappin
g PIU

Mappin
g UPM

Maximu
m
Power
Consum
ption

Fuse
Capacit
y of
Circuit
Breaker
s in a
DC PDU

DPD638-8 PDU

When the type III subrack (2300 W) is configured with N1PDU/DPD100-2-8 PDU, the
maximum power consumption of the equipment is 1100 W. Therefore, it is recommended that
the type III subrack (2300 W) be configured with 51PDU/DPD63-8-8 PDU.
The service boards supported by various subracks are the same. However, for a specific type
of service board, the maximum number of boards that can be configured per subrack is related
to the power consumption of the subrack.

3.8 Technical Specifications


The technical specifications of the subrack include the dimensions, weight, and maximum
power consumption.
Table 3-4 lists the technical specifications of the OptiX OSN 3500 subrack.
Figure 1.2 Technical specifications of the OptiX OSN 3500 subrack
Dimensions (mm)

Weight (kg)

497 (W) x 295 (D) x 722 (H)

23 (net weight of the subrack that is not


installed with boards or fans)

Table 3-5 lists the maximum power consumption of the OptiX OSN 3500 subrack.
Figure 1.3 Maximum power consumption of the OptiX OSN 3500 subrack
Subrack
Type

Maximum
Power
Consumpti
ona

Fuse
Capaci
ty

Typical Configuration
Typical Power
Consumption

Typical Configuration

General
OptiX
OSN

720 W

20 A

496 W

Two N1SLD64 (S-64.2b, LC)


boards

Two N2SLQ4 (S-4.1, LC)

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Subrack
Type

Maximum
Power
Consumpti
ona

3 Subrack

Fuse
Capaci
ty

Typical Configuration
Typical Power
Consumption

3500
subrack

Enhanced
OptiX
OSN
3500
subrack

OptiX
OSN
3500
type-III
subrack

Typical Configuration
boards

1100 W

2300 W

32 A

63 A

534 W

718 W

Two N1SLQ16 (L-16.2, LC)


boards

Two N1SLH1 (S-1.1, LC)


boards

Four N1OU08 boards

Two N2EGT2 boards

Two N1PSXCS boards

One N4GSCC board

One N1AUX board

Two N1PIU boards

Two N1SL64 (S-64.2b, LC)


boards

Two N2SLQ4 (S-4.1, LC)


boards

One N1SLT1 (S-1.1, LC)


board

Two N1PEG8 boards

Two N1PEX2 boards

Two N1PETF8 boards

Two N2PSXCSA boards

One N1AUX board

Two N1PIUA boards

Five N1PEG8 boards

Two N1PEX2 boards

Two N2PEX1 boards

Three N1PETF8 boards

Two N2PSXCSA boards

One N1AUX board

Two N1PIUB boards

a: The maximum power consumption refers to the maximum power consumption


configuration that the subrack can support and the maximum heat dissipation capability of
the subrack. In the actual application, the value is much higher than the power consumption
of the subrack in typical configuration.

In the case of transmission equipment, power consumption is generally transformed into heat
consumption. Hence, heat consumption (BTU/h) and power consumption (W) can be converted to each
other in the formula: Heat consumption (BTU/h) = Power consumption (W) / 0.2931 (Wh).

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3 Subrack

Table 3-6 lists the predicted reliability specifications of the OptiX OSN equipment.
Figure 1.4 Equipment predicted reliability
System
Availability

Mean Time to Repair (MTTR)

Mean Time Between Failures


(MTBF)

0.9999964

1 hour

31.83 years

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4 Overview of Boards

Overview of Boards

About This Chapter


This topic describes the appearances, dimensions, bar codes, and classification of the boards
used on the OptiX OSN systems.
4.1 Appearances and Dimensions of the Boards
Different boards have different appearances and dimensions.
4.2 Bar Codes of the Boards
The bar code on the front panel of a board indicates the version, name, and feature code of the
board.

4.1 Appearances and Dimensions of the Boards


Different boards have different appearances and dimensions.
Table 4-1 provides information about the appearances and dimensions of the boards used on
the OptiX OSN 3500.
Figure 1.5 Appearances and dimensions of the boards used on the OptiX OSN 3500
Parameter

Appearance and Dimensions

Board
appearance

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4 Overview of Boards

Parameter

Appearance and Dimensions

Board
classificatio
n

Optical interface board


(for example, SL16)

Service processing
board (for example,
PQ1)

Service interface board


(for example, D75S)

Height
(mm)

261.4

261.4

261.4

Depth (mm)

235.2

235.2

125.2

Width (mm)

25.4

25.4

22.0

Board
classificatio
n

Cross-connect and
timing board

System auxiliary
interface board (AUX)

Power interface board


(PIU)

Height
(mm)

261.4

261.4

261.4

Depth (mm)

235.2

125.2

125.2

Width (mm)

40.0

44.0

44.0

Board
appearance

Board
appearance

Board
classificatio
n

Board that occupies two


slots (such as the
N1PEG16)

Height
(mm)

261.4

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4 Overview of Boards

Parameter

Appearance and Dimensions

Depth (mm)

235.2

Width (mm)

50.3

Note: The figure in the right cell shows the three


dimensions. "H" and "W" indicate the height and width of
the front panel respectively and "D" indicates the depth of
the printed circuit board (PCB).

H
D

Wear an ESD wrist strap when holding a board. To prevent the static discharge from
damaging the board, ensure that the ESD wrist strap is grounded properly.

Do not look directly at the optical interface board or optical interface. The laser beams inside
the fiber can damage your eyes.

A level optical module cannot be directly connected to an optical attenuator. If an optical


attenuator is required, use the attenuator on the optical distribution frame (ODF) side.

If an optical attenuator is required, insert the attenuator in the IN interface instead of the
OUT interface.

Add an attenuator when performing a loopback at an optical interface to prevent the


optical module from being damaged.

4.2 Bar Codes of the Boards


The bar code on the front panel of a board indicates the version, name, and feature code of the
board.
Two types of bar codes are used for the boards of the OptiX OSN 3500, which are as follows:

16-digit manufacturing code + board version + board name + board feature code

20-digit manufacturing code + board version + board name + board feature code

The bar code is attached to the front panel of a board. Figure 4-1 shows the bar code with a
16-digit manufacturing code.

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Figure 1.1 Bar code of a board

Bar code

0364401055000015 -SSN3SL16A01

Last six digits of the BOM code


Internal code
Board version
Board name
5 Board feature code

The positions of bar codes vary according to boards. For details on the feature code of a board, see the
topic that describes the feature code of the board.

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5 Classification of Boards

Classification of Boards

Boards are functionally classified into cross-connect boards and system control boards, packet
processing boards, packet interface boards, SDH boards, PDH boards, WDM boards, optical
amplifier boards and dispersion compensation boards, auxiliary boards, and power boards.
For details on the board version replacement relationship between boards, see 25.1 Board Version
Replacement .

1.1.1.1.18 Cross-Connect Boards and System Control Boards


Table 5-1 lists all cross-connect boards and system control boards and their applicable
products.
Figure 1.1 List of cross-connect boards and system control boards
Board

Description

Applicable Product

TNN1SCA

System control and auxiliary


processing board

OptiX OSN 7500 II

TNN1PSXCS

Super Cross-connect and


Synchronous Timing Board

OptiX OSN 7500 II

T1PSXCSA,
T2PSXCSA

Super dual-plane crossconnect and synchronous


timing board

OptiX OSN 7500

N4GSCC,
N6GSCC

System Control and


Communication Board

OptiX OSN 7500, OptiX OSN 3500

N1PSXCS,
N2PSXCSA,
N3PSXCSA

Super Cross-connect and


Synchronous Timing Board
(supporting packet features)

OptiX OSN 3500

N1SXCSA

Super cross-connect and


synchronous timing board
(only applicable in TDM
mode)

OptiX OSN 3500

R1PCXLN

SCC unit, cross-connect

OptiX OSN 1500

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Board

Description

5 Classification of Boards

Applicable Product

unit, and optical interface


unit integrated board
(supporting the packet
feature)

Only the T2PSXCSA, TNN1PSXCS, and N3PSXCSA boards support MPLS-TP OAM and centralized
MPLS OAM.

1.1.1.1.19 Packet Processing Boards


Table 5-2 lists all packet processing boards and their applicable products.
Figure 1.1 List of packet processing boards
Board

Description

Applicable Product

TNN1EX2

2x10GE processing board

OptiX OSN 7500 II

N1PEX2

2-port 10 Gigabit Ethernet


switching processing board

OptiX OSN 7500, OptiX OSN 3500

N1PEX1

1x10GE Ethernet processing


board

OptiX OSN 3500

N2PEX1

1x10GE Ethernet processing


board

OptiX OSN 7500, OptiX OSN 3500

N1PEG16

16xGE Ethernet processing


board

OptiX OSN 3500

TNN1EG16

16xGE Ethernet processing


board

OptiX OSN 7500 II

TNN1EG8

8xGE processing board

OptiX OSN 7500 II

N1PEG8

8-port Gigabit Ethernet


switching processing board

OptiX OSN 7500, OptiX OSN 3500

Q1PEGS2

2xGE processing board

OptiX OSN 1500A, OptiX OSN 1500B

R1PEGS1

1xGE processing board

OptiX OSN 1500A, OptiX OSN 1500B

R1PEFS8

8xFE processing board

OptiX OSN 1500A, OptiX OSN 1500B

R1PEF4F

4xFE optical processing


board

OptiX OSN 1500A, OptiX OSN 1500B

R1ML1

Multi-protocol 16xE1
electrical processing board

OptiX OSN 1500A, OptiX OSN 1500B

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5 Classification of Boards

1.1.1.1.20 Packet Interface Boards


Table 5-3 lists all packet interface boards and their applicable products.
Figure 1.1 List of packet interface boards
Board

Description

Applicable Product

TNN1CO1

8-port channelized STM-1


CES optical interface board

OptiX OSN 7500 II

N1CQ1

4-port channelized STM-1


CES optical interface board

OptiX OSN 7500, OptiX OSN 3500

TNN1D75E

32-port 75-ohm E1 interface


board

OptiX OSN 7500 II

TNN1D12E

32-port 120-ohm E1
interface board

OptiX OSN 7500 II

TNN1ETMC

8xFE+4xFE/GE electrical
interface board

OptiX OSN 7500 II

TNN1AFO1

8-port ATM STM-1 service


interface board

OptiX OSN 7500 II

TNN1EFF8

8-port FE optical interface


board

OptiX OSN 7500 II

N1PEFF8

8-port FE optical interface


board

OptiX OSN 7500, OptiX OSN 3500

N1PETF8

8xFE electrical interface


board

OptiX OSN 7500, OptiX OSN 3500

N1CQ1

4-channel channelized
STM-1 CES optical
interface board

OptiX OSN 7500, OptiX OSN 3500

N1MD12

Multi-protocol 32xE1
interface board (120 ohms)

OptiX OSN 7500, OptiX OSN 3500

N1MD75

Multi-protocol 32xE1
interface board (75 ohms)

OptiX OSN 7500, OptiX OSN 3500

1.1.1.1.21 EoD Boards


Table 5-4 lists all EoD boards and their applicable products.
Figure 1.1 List of EoD boards
Board

Description

Applicable Product

N1EDQ41

4-port 622/155 Mbit/s SDH


optical interface Ethernet
dual-mode multi-function

OptiX OSN 7500, OptiX OSN 3500

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Hardware Description

Board

Description

5 Classification of Boards

Applicable Product

processing board

1.1.1.1.22 SDH Boards


Table 5-5 lists all SDH boards and their applicable products.
Figure 1.1 List of SDH boards
Board

Description

Applicable Product

N4SLD64

2xSTM-64 optical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

N1SLD64

2xSTM-64 optical interface


board

OptiX OSN 7500, OptiX OSN 3500

N4SFD64

2xSTM-64 optical interface


board with the FEC function

OptiX OSN 7500, OptiX OSN 3500

T2SL64,
T2SL64A

1xSTM-64 optical interface


board

OptiX OSN 7500

N1SF64,
N1SF64A,
N4SF64

1xSTM-64 optical interface


board (with the forward
error correction (FEC)
function)

OptiX OSN 7500, OptiX OSN 3500

N1SL64

1xSTM-64 optical interface


board

OptiX OSN 7500, OptiX OSN 3500

N2SL64

1xSTM-64 optical interface


board

OptiX OSN 3500

N4SL64

1xSTM-64 optical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

N4SLO16

8xSTM-16 optical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

N1SLO16

8xSTM-16 optical interface


board

OptiX OSN 7500, OptiX OSN 3500

N4SLQ16

4xSTM-16 optical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

N1SLQ16,
N2SLQ16

4xSTM-16 optical interface


board

OptiX OSN 7500, OptiX OSN 3500

N1SLD16

2xSTM-16 optical interface


board

OptiX OSN 3500

N3SL16,
N3SL16A

1xSTM-16 optical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

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Hardware Description

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Board

Description

Applicable Product

N1SL16,
N1SL16A,
N2SL16,
N2SL16A

1xSTM-16 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1SF16

1xSTM-16 optical interface


board (with the outband
FEC function)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1SF16E

1xSTM-16 optical interface


board (with the outband
EFEC function)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N3SLH41

16xSTM-4/STM-1 optical
interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

N3SLQ41

4xSTM-4/STM-1 optical
interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

N1SLQ4,
N2SLQ4

4xSTM-4 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1SLQ4A

4xSTM-4 optical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

N1SLD4,
N2SLD4,
N1SLD4A

2xSTM-4 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

R1SLD4

2xSTM-4 optical interface


board (divided slot)

OptiX OSN 1500A, OptiX OSN 1500B

R1SL4

1xSTM-4 optical interface


board (divided slot)

OptiX OSN 1500A, OptiX OSN 1500B

N1SL4, N2SL4,
N1SL4A

1xSTM-4 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1SLH1

16xSTM-1 signal processing


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

N1SLT1

12xSTM-1 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EU08

8xSTM-1 electrical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1OU08

8xSTM-1 optical/electrical
interface board (LC)

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N2OU08

8xSTM-1 optical interface


board (SC)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N2SLO1,
N3SLO1

8xSTM-1 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

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Hardware Description

5 Classification of Boards

Board

Description

Applicable Product

N1SLQ1,
N2SLQ1

4xSTM-1 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1SLQ1A

4xSTM-1 optical interface


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

R1SLQ1

4xSTM-1 optical interface


board (divided slot)

OptiX OSN 1500A, OptiX OSN 1500B

N1EU04

4xSTM-1 electrical interface


board

OptiX OSN 3500, OptiX OSN 1500B

N1SEP1

2xSTM-1 line processing


board when interfaces are
available on the front panel

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

8xSTM-1 line processing


board when interfaces are
available on the
corresponding interface
board
N1SL1, N2SL1,
N1SL1A

1xSTM-1 optical interface


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

R1SL1

1xSTM-1 optical interface


board (divided slot)

OptiX OSN 1500A, OptiX OSN 1500B

1.1.1.1.23 PDH Boards


Table 5-6 lists all PDH boards and their applicable products.
Figure 1.1 List of PDH boards
Board

Description

Applicable Product

N1SPQ4

4xE4/STM-1 electrical
processing board

OptiX OSN 3500, OptiX OSN 1500B

N2SPQ4

4xE4/STM-1 electrical
processing board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1MU04

4xE4/STM-1 electrical
interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N2PQ3

12xE3/T3 service
processing board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1D34S

6xE3/T3 electrical switching


interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1C34S

3xE3/T3 electrical switching


interface board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

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Hardware Description

5 Classification of Boards

Board

Description

Applicable Product

N1PD3, N2PD3

6xE3/T3 service processing


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1PL3, N2PL3

3xE3/T3 service processing


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1PL3A,
N2PL3A

3xE3/T3 service processing


board (Interfaces are
available on the front panel.)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1PQ1

63xE1 service processing


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N2PQ1

63xE1 service processing


board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1PQM

63xE1/T1 service
processing board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1D12B

32xE1/T1 electrical
switching interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1D12S

32xE1/T1 electrical
switching interface board
(120 ohms)

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1D75S

32xE1 electrical switching


interface board (75 ohms)

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

R1PD1, R2PD1

32xE1 service processing


board

OptiX OSN 1500A, OptiX OSN 1500B

R1PL1

16xE1 service processing


board

OptiX OSN 1500A, OptiX OSN 1500B

R1L12S

16xE1/T1 electrical
switching interface board
(120 ohms)

OptiX OSN 1500A

R1L75S

16xE1 electrical switching


interface board (75 ohms)

OptiX OSN 1500A

N1PFL1

8xE1 optical processing


board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1TSB8

8-port electrical switching


interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1TSB4

4-port electrical switching


interface board

OptiX OSN 3500, OptiX OSN 1500B

N1DX1

DDN service accessing and


converging board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1DXA

DDN service converging


and processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1DM12

DDN service interface board

OptiX OSN 7500, OptiX OSN 3500,

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Hardware Description

Board

Description

5 Classification of Boards

Applicable Product
OptiX OSN 1500B

1.1.1.1.24 EoS Boards


Table 5-7 lists all EoS boards and their applicable products.
Figure 1.1 List of EoS boards
Board

Description

Applicable Product

N1EFT8

8xFE/16xFE transparent
transmission board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N2EFT8

8xFE/16xFE transparent
transmission board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EFT8A

8xFE transparent
transmission board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N2EFT8A

8xFE transparent
transmission board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EFS0A

16xFE switching and


processing board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1EFS0

8xFE switching and


processing board

OptiX OSN 3500, OptiX OSN 1500B

N2EFS0,
N4EFS0,
N5EFS0

8xFE switching and


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1EFS4,
N2EFS4,
N3EFS4

4xFE switching and


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

R1EFT4

4xFE transparent
transmission board (divided
slot)

OptiX OSN 1500A, OptiX OSN 1500B

N1EAS2

2x10GE Layer 2 switching


and processing board

OptiX OSN 7500, OptiX OSN 3500

N3EAS2

2x10GE Layer 2 switching


and processing board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

N1EMS4

4xGE and 16xFE switching


and processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EMS2

2xGE and 16xFE switching


and processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EGS4,
N3EGS4

4xGE switching and


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

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Hardware Description

5 Classification of Boards

Board

Description

Applicable Product

N1EGT2,
N2EGT2

2xGE transparent
transmission board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N2EGS2,
N3EGS2

2xGE switching and


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1EFF8

8x100M Ethernet optical


interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1EFF8A

8x100M Ethernet optical


interface board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1ETF8

8x100M Ethernet twistedpair interface board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1ETF8A

8x100M Ethernet twistedpair interface board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1ETS8

8x10/100M Ethernet twisted


pair interface switching
board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

1.1.1.1.25 ATM Boards


Table 5-8 lists all ATM boards and their applicable products.
Figure 1.1 List of ATM boards
Board

Description

Applicable Product

N1ADL4,
N1IDL4

1xSTM-4 ATM service


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1ADQ1,
N1IDQ1

4xSTM-1 ATM service


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

1.1.1.1.26 RPR Boards


Table 5-9 lists all PRP boards and their applicable products.
Figure 1.1 List of RPR boards
Board

Description

Applicable Product

N2EGR2

2xGE ring processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N2EMR0

12xFE and 1xGE ring


processing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

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Hardware Description

5 Classification of Boards

1.1.1.1.27 SAN/Video Boards


Table 5-10 lists all SAN/video boards and their applicable products.
Figure 1.1 List of SAN/video boards
Board

Description

Applicable Product

N1VST4

4-port video service


transparent transmission
board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

N1MST4

4-port multi-service
transparent transmission
board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

1.1.1.1.28 WDM Boards


Table 5-11 lists all WDM boards and their applicable products.
Figure 1.1 List of WDM boards
Board

Description

Applicable Product

TN11CMR4

4-channel optical add/drop


multiplexing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

TN11CMR2,
TN11MR2
N1MR2A

2-channel optical add/drop


multiplexing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1MR2C

2-channel optical add/drop


multiplexing board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500B

N1MR2B

2-channel optical add/drop


multiplexing board

OptiX OSN 1500A, OptiX OSN 1500B

TN11MR2

2-port optical add/drop


multiplexing board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

TN11MR4

4-port optical add/drop


multiplexing board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

N1CMD2

2-channel bidirectional
optical multiplexer and
demultiplexer board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500B

N1LWX

Arbitrary bit rate


wavelength conversion
board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1FIB

Filter isolating board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

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Hardware Description

5 Classification of Boards

1.1.1.1.29 Auxiliary Boards


Table 5-12 lists all auxiliary boards and their applicable products.
Figure 1.1 List of auxiliary boards
Board

Description

Applicable Product

T1EOW

Orderwire processing board

OptiX OSN 7500

R1EOW

Orderwire processing board

OptiX OSN 1500A, OptiX OSN 1500B

T1AUX

System auxiliary interface


board

OptiX OSN 7500

N1AUX

System auxiliary interface


board

OptiX OSN 3500

R1AUX,
R2AUX

System auxiliary interface


board

OptiX OSN 1500A, OptiX OSN 1500B

R1AMU

Orderwire processing or
alarm cascading board

OptiX OSN 1500A, OptiX OSN 1500B

TN81FAN

Fan board

OptiX OSN 7500 II

N1FANA

Fan board (high power)

OptiX OSN 7500

N1FAN

Fan board

OptiX OSN 3500

R1FAN

Fan board

OptiX OSN 1500A, OptiX OSN 1500B

1.1.1.1.30 Optical Amplifier Boards and Dispersion Compensation Boards


Table 5-13 lists all optical amplifier boards and dispersion compensation boards and their
applicable products.
Figure 1.1 List of optical amplifier boards and dispersion compensation boards
Board

Description

Applicable Product

N1BPA

One-channel power
amplifier and one-channel
pre-amplifier board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N2BPA

One-channel power
amplifier and one-channel
pre-amplifier board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500, OptiX OSN 1500A,
OptiX OSN 1500B

N1COA,
61COA, 62COA

Case-shaped optical
amplifier

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1DCU

Dispersion compensation
board

OptiX OSN 7500, OptiX OSN 3500

N2DCU

Dispersion compensation
board

OptiX OSN 7500 II, OptiX OSN 7500,


OptiX OSN 3500

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Hardware Description

5 Classification of Boards

Board

Description

Applicable Product

TN11OBU1

Optical booster amplifier


board

OptiX OSN 7500, OptiX OSN 3500

TN12OBU1

Optical booster amplifier


board

OptiX OSN 7500 II

TN12OBU2

Optical booster amplifier


board

OptiX OSN 7500, OptiX OSN 3500

N1BA2

Two-channel power
amplifier board

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1RPC01

Forward Raman driving


board (external)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

N1RPC02

Backward Raman driving


board (external)

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

1.1.1.1.31 Power Boards


Table 5-14 lists all power boards and their applicable products.
Figure 1.1 List of power boards
Board

Description

Applicable Product

TN81PIU

Power interface board

OptiX OSN 7500 II

UPM

Uninterruptible power
module

OptiX OSN 7500, OptiX OSN 3500,


OptiX OSN 1500A, OptiX OSN 1500B

T1PIU

Power interface board


(supporting standard
subracks)

OptiX OSN 7500

T1PIUB

Power interface board


(supporting type III
subracks)

OptiX OSN 7500

N1PIUA

Power interface board


(supporting 1100 W
enhanced subrack.)

OptiX OSN 3500

N1PIUB

Power interface board


(supporting type III
subracks)

OptiX OSN 3500

R1PIU

Power interface board


(supporting OptiX OSN
1500B subrack)

OptiX OSN 1500B

R1PIUA

Power interface board


(supporting OptiX OSN
1500A subrack)

OptiX OSN 1500A

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Hardware Description

5 Classification of Boards

Board

Description

Applicable Product

R1PIUB

Power interface board


(supporting enhanced OptiX
OSN 1500B subrack)

OptiX OSN 1500B

R1PIUC

Power interface board


(supporting enhanced OptiX
OSN 1500A subrack)

OptiX OSN 1500A

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Hardware Description

6 Cross-Connect Boards and System Control Boards

Cross-Connect Boards and System Control


Boards

About This Chapter


This topic describes the system control boards and the cross-connect boards that have
different capacities.
6.1 SXCSA
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SXCSA (super cross-connect and synchronous timing board).
This topic also describes how to configure and commission the SXCSA.
6.2 PSXCS(A)
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PSXCS(A) (super dual-plane cross-connect and timing board).
This topic also describes how to configure and commission the PSXCS(A).
6.3 GSCC
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the GSCC (system control and communication board). This topic
also describes how to configure and commission the GSCC.

6.1 SXCSA
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SXCSA (super cross-connect and synchronous timing board).
This topic also describes how to configure and commission the SXCSA.

6.1.1 Version Description


The SXCSA is available in one functional version, namely, N1.

6.1.2 Application
The SXCSA is a super cross-connect and synchronous timing board. The SXCSA provides
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service grooming and clock input/output functions in the OptiX OSN system.
The cross-connect and synchronous timing board provides the other boards in the system with
the timing information and grooms the services between line boards or tributary boards.
Figure 6-1 shows the position of the cross-connect and synchronous timing board in the
OptiX OSN system.
Figure 1.1 Position of the cross-connect and synchronous timing board in the system
Line

Line
SDH

Cross-connect and timing board

PDH

RPR

FE/GE

ATM

SAN

6.1.3 Functions and Features


The SXCSA grooms services and inputs/outputs clock signals.

1.1.1.1.32 Cross-Connect Unit


Table 6-1 provides the functions and features of the cross-connect unit of the SXCSA.
Figure 1.1 Functions and features of the cross-connect unit of the SXCSA
Function and
Feature

SXCSA

Basic functions

Realizes 200 Gbit/s higher order cross-connection at the VC-4 level,


20 Gbit/s lower order cross-connection at the VC-3 or VC-12 level,
and 155 Gbit/s access.

Service processing

Supports the flexible service grooming and supports the fully


non-blocking cross-connect, multicast, and broadcast services.

Enables the communication between the SXCSA and the other


boards.

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Function and
Feature

6 Cross-Connect Boards and System Control Boards

SXCSA

Supports the tact switch and performs the protection switching


without interrupting services.

Supports the SNCP protection at the VC-4-4c, VC-4-8c, VC-416c, VC-4-64c, VC-4, VC-12, VC-3, and AU-3 levels.

Supports VC-4-4c, VC-4-8c, VC-4-16c, and VC-4-64c


concatenation services.

Supports a maximum of 40 linear MSP groups.

Supports a maximum of 12 ring MSP groups.

Supports a maximum of 2016 SNCP groups.

Supports a maximum of 592 SNCMP groups.

Supports a maximum of 512 SNCTP groups.

Protection schemes

Supports the 1+1 Hot Backup for the Cross-Connect and Timing
Units (non-revertive, by default).

Maintenance
features

Supports the PRBS function in the line direction.

1.1.1.1.33 Clock Unit


Table 6-2 provides the functions and features of the clock unit of the SXCSA.
Figure 1.1 Functions and features of the clock unit of the SXCSA
Function and
Feature

SXCSA

Basic functions

Provides the standard system synchronization clock.

Other functions

Supports the processing of the S1 byte to realize the clock


protection switching.

Supports the extraction, insertion, and management of the SSM


and clock ID.

Provides the real-time clock (RTC).

Input and output

Through the AUX board:

Inputs/Outputs two-channel 2 MHz or 2048 kbit/s timing signals


(75-ohm) and allows selection of external timing sources.

Inputs/Outputs two-channel 2 MHz or 2048 kbit/s timing signals


(120-ohm) and allows selection of external timing sources.

6.1.4 Working Principle and Signal Flow


The SXCSA consists of the synchronous timing module, cross-connect module,
communication and control module, and power module.
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Figure 6-2 shows the functional block diagram of the SXCSA.


Figure 1.1 Functional block diagram of the SXCSA
Matrix
HPC

622 Mbit/s or 2.5 Gbit/s

SNCP
LPC

Service unit

Cross-connect module

T0

Communication
and conrol
module

Communication

Synchronous
timing module
(SETS)

T1
T2
T3
SETG
Clock external
output
T4
T0
Frame header
T0 (reference clock)

38 MHz
OSC

+3.3 V

Power
module

Fuse

SCCunit

SDH unit
PDH unit
AUX
AUX
Service unit
Service unit
-48 V/-60 V
-48 V/-60 V

SETG: synchronous equipment timing generation function

The functional modules of the cross-connect and synchronous timing boards are described
below.

1.1.1.1.34 Synchronous Timing Module


The synchronous timing module uses the centralized timing allocation mode as the clock
mode. The synchronous timing module also selects one clock source from reference clock
sources as the reference clock for the timing module. The reference clock sources are from the
line board, the tributary board, or the external synchronous clock source. The synchronous
clock source and 2 Mbit/s or 2 MHz external synchronous clock source are then generated.
The precise 38 MHz oscillator ensures that the reference clock complies with ITU-T standards
in free-run mode.
The SDH clock (SETS) can work in the following modes:

Lock mode

Hold-over mode

Free-run mode

When working in lock mode, the SETS extracts the clock from three types of timing signals:
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Timing signal (T1) from the STM-N line

Timing signal (T2) from the PDH line

Reference signal (T3) from the external synchronous clock source (2 MHz or 2 Mbit/s)

The timing module outputs the following timing signals:

T0, system clock

T4, external timing output signal (2 Mbit/s or 2 MHz)

1.1.1.1.35 Cross-Connect Module


The cross-connect module consists of two parts:

SNCP module, which tests relative alarms and reports the alarms to the software to
trigger the protection switching such as the SNCP switching and MSP switching.

Higher order and lower order cross-connect module, which performs the functions of
higher order and lower order cross-connect units.

1.1.1.1.36 Communication and Control Module


The communication and control module is a sub-system provided by the pinch board. It
consists of the CPU, register, Ethernet port, HDLC controller, FPGA loading controller, and
bus driver. This module is connected to external circuits through buses to manage and
configure other units of the boards.

1.1.1.1.37 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

6.1.5 Front Panel


The front panel of the SXCSA has indicators and a bar code.

1.1.1.1.38 Diagram of the Front Panel


Figure 6-3 shows the appearance of the front panel of the SXCSA.

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Figure 1.1 Front panel of the SXCSA

SXCSA
STAT
ACT
PROG
SRV
SYNC

SXCSA

1.1.1.1.39 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Synchronization clock status indicator (SYNC) two colors (red and green)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.40 Interfaces
The front panel of the SXCSA has no interface. The AUX provides the SXCSA with the
external clock interface that can be set in 2048 kHz mode or 2048 kbit/s mode. The AUX
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provides two BITS clock interfaces with 120-ohm or 75-ohm impedance. For details, see
AUX.

6.1.6 Jumpers and DIP Switches


The SXCSA does not have any jumpers or DIP switches that are used for board settings.

6.1.7 Valid Slots


The SXCSA must be installed in a valid slot in the subrack. Otherwise, the SXCSA cannot
work normally.
The SXCSA can be installed in slots 9 and 10 in the subrack. By default, slot 9 houses the
active board and slot 10 houses the standby board.

6.1.8 Feature Code


The SXCSA does not have the feature code.

6.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.41 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the active board and standby board are installed in the correct slots.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check the status of the indicators of the board when and after the board is powered
on. For the meanings of the status of the indicators, see 23 Indicators.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
Step 6 Required: Check the micro switch of the board. When the front panels of the active and
standby cross-connect boards are locked, the active/standby switching can be realized if you
unlock the front panel of the active board.
----End

1.1.1.1.42 Configuring the Board


Step 1 Add the logical board. For details, see Adding Boards.
Step 7 Set parameters for the XCS on the . The following main parameters need to be set:
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Clock synchronization status

Clock source priority

Phase-locked source output by external clock

Clock source switching

Clock subnet configuration

For information about more parameters and the method for setting the parameters, see
Configuring Clocks.
----End

1.1.1.1.43 Commissioning the Board


Step 1 Optional: Test the frequency accuracy of the free-run clock. For details, see 27.5 Testing the
Frequency Accuracy of the Free-Run Clock.
Step 8 Optional: Test the clock holdover accuracy. For details, see 27.6 Testing the Clock Holdover
Accuracy.
Step 9 Required: Test the protection switching of the cross-connection. For details, see Testing the
1+1 Protection of the Cross-Connect and Timing Board.
----End

1.1.1.1.44 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 10 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

6.1.10 Parameter Settings


You can set parameters for the SXCSA by using the U2000.
You can set the following parameters for the SXCSA by using the U2000:

Clock synchronization status

Clock source priority

Clock source switching

Clock subnet configuration

Phase-locked source output by external clock

For the description of each parameter, see 26.8 Cross-Connect and Timing Units.

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6.1.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.45 Troubleshooting
Table 6-3 lists the faults that occur on the SXCSA frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the SXCSA frequently
Fault Symptom

Common Fault
Cause

Service unavailable

The type of logical


board is not
consistent with the
type of the board
that is installed on
the NE.

The service
configuration is
incorrect.

The running status


of the other boards
on the NE is
incorrect.

The clock source


priority table is
incorrectly
configured.

Clock tracing failure

Troubleshooting Method
See 27.2 Troubleshooting Service
Unavailability.

See 27.3 Troubleshooting the


Clock Tracing Failure.

1.1.1.1.46 Replacing the Board


For information on how to replace the SXCSA, see Replace a Cross-Connect and Timing
Board.
See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

6.1.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

6.1.12.1 Alarms of N1SXCSA


APS_FAIL

APS_INDI

BD_STATUS

CHIP_FAIL

BUS_ERR

CHIP_ABN

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EXT_SYNC_LOS

CLK_NO_TRACE_MODE

COMMUN_FAIL

HSC_UNAVAIL

FPGA_ABN

HARD_BAD

LPS_UNI_BI_M

K1_K2_M

K2_M

NO_BD_SOFT

LTI

MS_APS_INDI_EX

PRBS_TEST

OOL

POWER_ABNORMAL

S1_SYN_CHANGE

SWITCH_DISABLE

SYN_BAD

SYNC_C_LOS

SYNC_F_M_SWITCH

SYNC_LOCKOFF

TEMP_OVER

TEST_STATUS

W_OFFLINE

TIME_NOT_SUPPORT

W_R_FAIL

PATCH_NOT_CONFIRM

TIME_FORCE_SWITCH

SWDL_PKG_NOBDSOFT

TIME_NO_TRACE_MOD
E

OTH_HARD_FAIL

TIME_LOS

EXT_TIME_LOC

PATCHFILE_NOTEXIST

OTH_BD_STATUS

PATCH_ERR

6.1.13 List of Performance Events


None.

6.1.14 Technical Specifications


The technical specifications of the SXCSA include the cross-connect capacity, clock access
capability, mechanical specifications, and power consumption.

1.1.1.1.47 Cross-Connect Capacity


Item

SXCSA

Higher order cross-connect capacity (Gbit/s)

200

Lower order cross-connect capacity (Gbit/s)

20

Access capacity (Gbit/s)

155

1.1.1.1.48 Clock Access Capability


The clock access capability of the SXCSA is as follows:

External input clock: two channels of 2048 kbit/s or 2048 kHz external clock signals

External output clock: two channels of 2048 kbit/s or 2048 kHz external clock signals

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1.1.1.1.49 Mechanical Specifications


The mechanical specifications of the SXCSA are as follows:

Dimensions (mm): 40.0 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 2.2

1.1.1.1.50 Power Consumption


The maximum power consumption of the SXCSA at room temperature (25C) is 63 W.

6.2 PSXCS(A)
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PSXCS(A) (super dual-plane cross-connect and timing board).
This topic also describes how to configure and commission the PSXCS(A).

6.2.1 Version Description


PSXCS(A) is available in the following functional versions: N3PSXCSA, N1PSXCS and
N2PSXCSA. The N1PSXCS and N2PSXCSA are discontinued.
Table 6-4 provides version description of PSXCS(A).
Figure 1.1 Versions of the PSXCS(A) board
Item

Description

Functional versions

PSXCS(A) is available in the following functional versions:


N1PSXCS, N2PSXCSA, and N3PSXCSA.

Differences

Basic functions: cross-connect capacity.

Service processing: the number of SNCP protection


groups.

Others:

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N1PSXCS boards cannot work


with single-slot packet data
boards.

N2PSXCSA/N3PSXCSA
boards configured as
N1PSXCS cannot work with
single-slot packet data boards.

N2PSXCSA boards configured


as N2PSXCSA cannot work
with two-slot packet data
boards.

N3PSXCSA boards configured


as N3PSXCSA or N2PSXCSA
cannot work with two-slot
packet data boards.

The N1PSXCS/N2PSXCSA
supports only distributed
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Description
MPLS OAM, whereas the
N3PSXCSA supports
distributed MPLS OAM,
centralized MPLS OAM, and
MPLS-TP OAM.

Substitution

N2PSXCSA can substitute for N1PSXCS and N1SXCSA.


N3PSXCSA can substitute for N2PSXCSA, N1PSXCS, and
N1SXCSA.

6.2.2 Application
The PSXCS(A) is a super cross-connect and synchronous timing board. The PSXCS(A)
provides service grooming and clock input/output functions in the OptiX OSN system.
The cross-connect and synchronous timing board provides the timing information to the other
boards in the system and grooms the services between SDH line boards, packet boards, or
tributary boards.
Figure 6-4 shows the position of The cross-connect and synchronous timing board in the
system.
Figure 1.1 Position of the cross-connect and synchronous timing board in the system
Packet data

SDH/PDH
service

Higher order/
Lower order
cross-connect
unit

Packet data

Clock
unit

Packet data
processing
unit

Auxillary
unit

PIU

Auxillary
interface

-48 V/-60 V

XCS

6.2.3 Functions and Features


The PSXCS(A) board grooms services and inputs/outputs clock signals.

1.1.1.1.51 Cross-Connect Unit


Table 6-5 provides the functions and features of the cross-connect unit of the PSXCS(A)
board.

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Figure 1.1 Functions and features of the cross-connect unit of the PSXCS(A)
Functions
and Features

Description

Basic
functions

Cross-Connect Capacity

N1PSXCS

N2PSXCSA/N3PSXCS
A

Higher order crossconnect capacity (Gbit/s)

200

200

Lower order crossconnect capacity (Gbit/s)

20

20

Packet switching capacity


(Gbit/s)

80

160

Service
access
capacity

TDM mode
(Gbit/s)

155

155

Packet
mode
(Gbit/s)

60

100

Service
processing

Supports the flexible service grooming and supports the fully nonblocking cross-connect, multicast, and broadcast services.

Communicates with other boards.

Supports the tact switch and performs the protection switching without
service interruption.

Supports the SNCP protection at the levels of VC-4-4c, VC-4-8c, VC4-16c, VC-4-64c, VC-4, VC-12, VC-3, and AU-3.

Supports VC-4, VC-12, VC-3, and AU-3 services.

Supports VC-4-4c, VC-4-8c, VC-4-16c, and VC-4-64c concatenation


services.

Supports a maximum of 40 linear MSP groups.

Supports a maximum of 12 ring MSP groups.

The N1PSXCS board supports a maximum of 8064 SNCP pairs.

The N2PSXCSA/N3PSXCSA board supports a maximum of 8904


SNCP pairs.

Supports a maximum of 592 SNCMP pairs.

Supports a maximum of 512 SNCTP pairs.

Protection
Scheme

Supports 1+1 hot standby. The default protection mode is the nonrevertive switching mode.

Maintenance
features

Supports the PRBS function in the line direction.

Others

Supports querying and reporting the working temperature of the crossconnect and timing board and the entire equipment.

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1.1.1.1.52 Clock Unit


Table 6-6 provides the functions and features of the clock unit of the PSXCS(A) board.
Figure 1.1 Functions and features of the clock unit of the PSXCS(A) board
Functions and
Features

Description

Basic functions

Provides the standard system synchronization clock.

Other functions

Supports the processing of the S1 byte to perform clock


protection switching.

Supports the extraction, insertion, and processing of the SSM


and clock ID.

Supports IEEE 1588v2 time and clock synchronization.

N2PSXCSA and N3PSXCSA boards support frequency


deviation detection.

Input and output

Through the AUX board:

Inputs/Outputs two-channel 2 MHz or 2048 kbit/s timing signals


(75-ohm) and allows selection of external timing sources.

Inputs/Outputs two-channel 2 MHz or 2048 kbit/s timing signals


(120-ohm) and allows selection of external timing sources.

6.2.4 Working Principle and Signal Flow


The PSXCS(A) consists of the higher order cross-connect matrix, lower order cross-connect
matrix, packet cross-connect matrix, communication and control module, clock module, and
power module.
Figure 6-5 shows the functional block diagram of the PSXCS(A).
Figure 1.1 Functional block diagram of the PSXCS(A)
Backpl ane
Lower order crossconnect matri x
Hi gher order
cross-connect
matri x

Packet crossconnect matri x

Cl ock
modul e

Servi ce uni t/SCC


uni t/AUX

Communi cati on and


control modul e

+3. 3 V

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The board and system

Power
modul e

Fuse

SCC uni t
-48 V/-60 V
-48 V/-60 V

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1.1.1.1.53 Higher Order Cross-Connect Matrix


Realizes higher order cross-connection at the VC-4 level.

1.1.1.1.54 Lower Order Cross-Connect Matrix


Realizes lower order cross-connection at the VC-3 or VC-12 level.

1.1.1.1.55 Packet Cross-Connect Matrix


Cross-connects the packet data.

1.1.1.1.56 Communication and Control Module


Communicates with the SCC unit and other boards, ensures communication with the other
boards when the GSCC cannot be detected, and generates the other control signals for the
PSXCS and system.

1.1.1.1.57 Clock Module


The clock module performs the following functions:

Traces external clock sources, line clock sources, or tributary clock sources, and provides
the PSXCS and the system with a synchronization clock source.

Through system timing, provides the nodes in the data stream of the system with the
clock signals that have proper frequency and phase. In this way, the components at each
node can meet the requirements regarding data setup and data holding during data
receiving.

Provides the system with the frame indication signal that is used to indicate the position
of the frame header in the data.

Supports the IEEE 1588v2 clock.

1.1.1.1.58 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the PSXCS require.

6.2.5 Front Panel


The front panel of the PSXCS(A) has indicators and a bar code.

1.1.1.1.59 Diagram of the Front Panel


Figure 6-6 shows the appearance of the front panel of the PSXCS(A).

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Figure 1.1 Front panel of the PSXCS(A)

PSXCS

PSXCSA

STAT
ACT
PROG
SRV
SYNC

STAT
ACT
PROG
SRV
SYNC

PSXCS

PSXCSA

N1PSXCS

N2PSXCSA/N3PSXCSA

1.1.1.1.60 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) three colors (red, green, and yellow)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Synchronization clock status indicator (SYNC) two colors (red and green)

For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the Boards.

1.1.1.1.61 Interfaces
The front panel of the PSXCS(A) has no interface. The AUX provides the PSXCS(A) with the
external clock interface that can be set in 2048 kHz mode or 2048 kbit/s mode. The AUX
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provides two BITS clock interfaces with 120-ohm or 75-ohm impedance. For details, see the
topic that describes the interfaces of the AUX.

6.2.6 Jumpers and DIP Switches


The PSXCS(A) does not have any jumpers or DIP switches that are used for board settings.

6.2.7 Valid Slots


The PSXCS(A) can be installed in slots 9 and 10 in the subrack.
By default, slot 9 is the slot for the working board, and slot 10 is the slot for the protection
board.

6.2.8 Feature Code


The PSXCS(A) does not have the feature code.

6.2.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.62 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the active board and standby board are installed in the correct slots.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check the status of the indicators of the board when and after the board is powered
on. For the meanings of the status of the indicators, see 23 Indicators.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
Step 6 Required: Check the micro switch of the board. When the front panels of the active and
standby cross-connect boards are locked, the active/standby switching can be realized if you
unlock the front panel of the active board.
----End

1.1.1.1.63 Configuring the Board


Step 1 Add the logical board. For details, see Adding Boards.
Step 7 Set parameters for the XCS on the U2000. The following main parameters need to be set:
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Clock synchronization status

Clock source priority

Phase-locked source output by external clock

Clock source switching

Clock subnet configuration

For information about more parameters and the method for setting the parameters, see
Configuring Clocks.
----End

1.1.1.1.64 Commissioning the Board


Step 1 Optional: Test the frequency accuracy of the free-run clock. For details, see 27.5 Testing the
Frequency Accuracy of the Free-Run Clock.
Step 8 Optional: Test the clock holdover accuracy. For details, see 27.6 Testing the Clock Holdover
Accuracy.
Step 9 Required: Test the protection switching of the cross-connection. For details, see Testing the
1+1 Protection of the Cross-Connect and Timing Board.
----End

1.1.1.1.65 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 10 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

6.2.10 Parameter Settings


You can set parameters for the PSXCS(A) by using the U2000.
You can set the following principal parameters for the PSXCS(A) by using the U2000:

Clock synchronization status

Clock source priority

Phase-locked source output by external clock

Clock source switching

Clock subnet configuration

For more parameters and the description of the parameters, see 26.8 Cross-Connect and
Timing Units.

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6.2.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.66 Troubleshooting
Table 6-7 lists the faults that occur on the PSXCS(A) frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the PSXCS(A) frequently
Fault Symptom

Common Fault
Cause

Service unavailable

The type of logical


board is not
consistent with the
type of the board
that is installed on
the NE.

The service
configuration is
incorrect.

The running status


of the other boards
on the NE is
incorrect.

The clock source


priority table is
incorrectly
configured.

Clock tracing failure

Troubleshooting Method
See 27.2 Troubleshooting Service
Unavailability.

See 27.3 Troubleshooting the


Clock Tracing Failure.

1.1.1.1.67 Replacing the Board


For information on how to replace the PSXCS(A), see Replace a Cross-Connect and Timing
Board.
See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

6.2.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

6.2.12.1 Alarms of N1PSCXS(A)


APS_FAIL

APS_INDI

BD_STATUS

BDID_ERROR

BUS_ERR

CHIP_ABN

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CHIP_FAIL

CLK_NO_TRACE_MODE

COMMUN_FAIL

EXT_SYNC_LOS

PATCH_ERR

HARD_BAD

HSC_UNAVAIL

K1_K2_M

K2_M

LPS_UNI_BI_M

LTI

MS_APS_INDI_EX

NO_BD_SOFT

PATCH_NOT_CONFIRM

TIME_NOT_SUPPORT

APS_MANUAL_STOP

OOL

OTH_BD_STATUS

PATCHFILE_NOTEXIST

POWER_ABNORMAL

PRBS_TEST

S1_SYN_CHANGE

SWITCH_DISABLE

SYN_BAD

SYNC_C_LOS

SYNC_F_M_SWITCH

SYNC_LOCKOFF

TEMP_OVER

TEST_STATUS

TIME_FORCE_SWITCH

TIME_LOS

TIME_NO_TRACE_MOD
E

W_OFFLINE

W_R_FAIL

EXT_TIME_LOC

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

6.2.12.2 Alarms of N2PSCXS(A)


APS_FAIL

APS_INDI

BD_STATUS

BDID_ERROR

BUS_ERR

CHIP_ABN

CHIP_FAIL

CLK_NO_TRAC
E_MODE

COMMUN_FAIL

EXT_SYNC_LOS

PATCH_ERR

HARD_BAD

HSC_UNAVAIL

K1_K2_M

K2_M

LPS_UNI_BI_M

LTI

MS_APS_INDI_EX

NO_BD_SOFT

CES_LPS_UNI_B
I_M

APS_MANUAL_STOP

PATCH_NOT_CO
NFIRM

OOL

OTH_BD_STATUS

PATCHFILE_NO
TEXIST

POWER_ABNOR
MAL

PRBS_TEST

S1_SYN_CHAN
GE

SWITCH_DISAB
LE

SYN_BAD

SYNC_C_LOS

SYNC_F_M_SWI
TCH

SYNC_LOCKOFF

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TEMP_OVER

TEST_STATUS

TIME_FORCE_SWITCH

TIME_LOS

TIME_NO_TRA
CE_MODE

W_OFFLINE

W_R_FAIL

EXT_TIME_LOC

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

TIME_NOT_SUP
PORT

CES_K1_K2_M

CES_K2_M

CES_APS_INDI

CES_APS_FAIL

CES_MS_APS_I
NDI_EX

6.2.12.3 Alarms of N3PSCXS(A)


APS_FAIL

APS_INDI

BD_STATUS

BDID_ERROR

BUS_ERR

CHIP_ABN

CHIP_FAIL

CLK_NO_TRACE_MODE

COMMUN_FAIL

EXT_SYNC_LOS

PATCH_ERR

HARD_BAD

HSC_UNAVAIL

K1_K2_M

K2_M

LPS_UNI_BI_M

LTI

MS_APS_INDI_EX

NO_BD_SOFT

OOL

OTH_BD_STATUS

PATCHFILE_NOTEXIST

POWER_ABNORMAL

PRBS_TEST

S1_SYN_CHANGE

SWITCH_DISABLE

SYN_BAD

SYNC_C_LOS

SYNC_F_M_SWITCH

SYNC_LOCKOFF

TEMP_OVER

TEST_STATUS

TIME_FORCE_SWITCH

TIME_LOS

TIME_NO_TRACE_MODE

W_OFFLINE

W_R_FAIL

EXT_TIME_LOC

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

TIME_NOT_SUPPORT

CES_K1_K2_M

CES_K2_M

CES_APS_INDI

CES_APS_FAIL

CES_MS_APS_INDI_EX

CES_LPS_UNI_BI_M

APS_MANUAL_STOP

PATCH_NOT_CONFIRM

ETH_APS_LOST

ETH_APS_PATH_MISMAT
CH

ETH_APS_SWITCH_FAI
L

ETH_APS_TYPE_MISMAT
CH

MPLS_PW_AIS

MPLS_PW_BDI

MPLS_PW_Excess

MPLS_PW_LOCV

MPLS_PW_MISMATCH

MPLS_PW_MISMERGE

MPLS_PW_OAMFAIL

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MPLS_PW_RDI

MPLS_PW_SD

MPLS_PW_SF

MPLS_PW_UNEXPMEG

MPLS_PW_UNEXPMEP

MPLS_PW_UNEXPPER

MPLS_PW_UNKNOWN

MPLS_TUNNEL_AIS

MPLS_TUNNEL_BDI

MPLS_TUNNEL_Excess

MPLS_TUNNEL_FDI

MPLS_TUNNEL_LOCV

MPLS_TUNNEL_MISMA
TCH

MPLS_TUNNEL_MISMER
GE

MPLS_TUNNEL_OAMFAI
L

MPLS_TUNNEL_RDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

MPLS_TUNNEL_UNEXP
MEG

MPLS_TUNNEL_UNEXPM
EP

MPLS_TUNNEL_UNEXPP
ER

MPLS_TUNNEL_UNKN
OWN

PWAPS_LOST

PWAPS_PATH_MISMATC
H

PWAPS_SWITCH_FAIL

PWAPS_TYPE_MISMATC
H

TUNNEL_APS_DEGRADE
D

MPLS_PW_LCK

MPLS_PW_LOCK

MPLS_TUNNEL_LOCK

MPLS_PW_CSF

TUNNEL_APS_OUTAGE

6.2.13 List of Performance Events


None.

6.2.14 Technical Specifications


The technical specifications of the PSXCS(A) include the cross-connect capacity, clock
access capability, mechanical specifications, and power consumption.

1.1.1.1.68 Cross-Connect Capacity


Item

N1PSXCS

N2PSXCSA/N3PSXC
SA

Higher order cross-connect capacity


(Gbit/s)

200

200

Lower order cross-connect capacity


(Gbit/s)

20

20

Packet switching capability (Gbit/s)

80

160

Access
capacity

TDM mode (Gbit/s)

155

155

Packet mode (Gbit/s)

60

100

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1.1.1.1.69 Clock Access Capability


The clock access capability of the PSXCS(A) is as follows:

External input clock:

one channel of 75-ohm 2 MHz or 2048 kbit/s timing signals

one channel of 120-ohm 2 MHz or 2048 kbit/s timing signals

External output clock:

one channel of 75-ohm 2 MHz or 2048 kbit/s timing signals

one channel of 120-ohm 2 MHz or 2048 kbit/s timing signals

1.1.1.1.70 External Time Access Capability


The external time access capability of the PSXCS(A) board is as follows:

External input time: one channel of 1PPS+TOD

External output time: one channel of 1PPS+TOD

1.1.1.1.71 Mechanical Specifications


The mechanical specifications of the N1PSXCS are as follows:

Dimensions (mm): 40.0 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 2.1

The mechanical specifications of the N2PSXCSA are as follows:

Dimensions (mm): 40.0 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.2

The mechanical specifications of the N3PSXCSA are as follows:

Dimensions (mm): 40.0 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.5

1.1.1.1.72 Power Consumption


The maximum power consumption of the N1PSXCS at room temperature (25C) is 90 W.
The maximum power consumption of the N2PSXCSA at room temperature (25C) is 80 W.
The maximum power consumption of the N3PSXCSA at room temperature (25C) is 74 W.

6.3 GSCC
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the GSCC (system control and communication board). This topic
also describes how to configure and commission the GSCC.

6.3.1 Version Description


The GSCC is available in several functional versions. The functions provided by the
functional versions are different.
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Table 6-8 describes the versions of the GSCC.


Figure 1.1 Versions of the GSCC
Item

Description

Function
al
versions

The GSCC is available in the following functional versions: N4 and N6.

Differen
ces

Packet performance specifications differ between the N4GSCC and the


N6GSCC. For details, see Packet System Performance.

Substitut
ion

The GSCC boards of different versions cannot directly substitute for each other.
If the GSCC of a later version needs to substitute for the GSCC of an earlier
version, the NE software needs to be upgraded accordingly.

6.3.2 Application
The GSCC is the intelligent system control board. The GSCC works with the to manage the
boards on the equipment and realize the communication between different pieces of
equipment.
Figure 6-7 shows the position of the GSCC in the system.
Figure 1.1 Position of the GSCC in the system
Auxiliary interface
Auxiliary unit
SCC unit
Other boards

PIU
-48 V/-60 V

6.3.3 Functions and Features


The GSCC supports the system control, orderwire, communication, and system power supply
monitoring.
Table 6-9 provides the functions and features of the GSCC.

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Figure 1.2 Functions and features of the GSCC


Function and
Feature

GSCC

Basic functions

Performs the service configuration function and service grooming


function, monitors the service performance, and collects information
about performance events and alarms.

Interfaces

Provides the 10M/100M Ethernet port, which is used for


communicating with the NMS. The Ethernet port is accessed
through the AUX.

Provides the F&f interface, which is accessed through the AUX and
is used to manage the COA.

Provides one 64 kbit/s synchronous data port F1, which is accessed


through the AUX.

Provides the RS232 OAM interface, which is used for connecting a


PC or workstation, and supports the remote maintenance by using a
modem that uses the RS232 DCE interface. The OAM interface is
accessed through the AUX.

DCC
communication

Processes a maximum of 160 DCCs (D1D3). In this manner, the link


is provided for transmitting the NM information.

Overhead
processing

Processes the E1, E2, F1, and serial1serial4 bytes.

Clock function

Provides the RTC.

Supports the high-precision clock synchronization feature, and


complies with the IEEE 1588 V2 protocol. The N4GSCC receives
the time information through interfaces S1S4 of the AUX. The S1,
S3 and ALMI4 interfaces receive the first channel of time
information, and the S2, S4 and ALMI4 interfaces receive the
second channel of time information.

Supports service performance monitoring and collects information


about performance events and alarms.

Provides 16 alarm inputs and four alarm outputs through the AUX.

Provides one 4-output alarm cascading port through the AUX.

Controls the four cabinet indicators through the AUX.

Supports intelligent fan speed control and manages the fan alarms.

Supports simulation package loading and diffused loading.

Supports the function of detecting whether a packet data board is in


position.

Power supply
management

Supports the monitoring of the 48 V or 60 V power supply.

Supports the in-service check function for the PIU board and
supports the failure check function for the lightning protection
module of the PIU.

Protection
schemes

Supports the 1+1 Hot Backup for the SCC Unit. When the active board
is faulty, services are switched to the standby board automatically.

Alarms and
maintenance
features

NOTE

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Function and
Feature

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GSCC
If GSCC boards are used in packet systems, two N4GSCC/N6GSCC boards of
the same version need to be configured in 1+1 backup mode.

Packet function

The N4GSCC and N6GSCC support the packet function.


For information about the performance of the packet system, see Packet
System Performance.

6.3.4 Working Principle and Signal Flow


The GSCC consists of the communication and control module, OHP module, and power
module.
Figure 6-8 shows the functional block diagram of the GSCC.
Figure 1.1 Functional block diagram of the GSCC
Backplane
Other
units
V1
V2
Phone
S1-S4
F1

OH
manager

OHP

OHP module

Reset
ALM CUT
Boot
ROM
RAM

Communication
and control
module

AUX interface
16-input/4-output
alarm control
ETH port
OAM interface
F&f interface
COM interface

NVRAM
Flash

PIU
interface
+3.3 V

Power
module

AUX power monitor


and reset control

AUX unit

Input/Output alarm
ETH
OAM
F&f
COM
Control of subrack
indicators
Inter-board
communication
Power monitor
PIU test

Other
units

PIU unit
-48 V/-60 V

1.1.1.1.73 Communication and Control Module


The communication and control module controls and manages the boards, realizes the
communication between NEs, manages the network, and performs other functions.

The system control module communicates with the boards in the subrack, manages the
boards, monitors the performance events and alarms of the boards, collects the status
information about the other functional modules, and performs the corresponding
management operations.

The communication and control module provides the function that NEs communicate
with each other through DCCs. The communication module transfers the OAM
information to other NEs through DCCs, reports the alarms and performance data of the

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equipment to the network management terminal, and responds to the commands issued
by the network management terminal.

The communication and control module configures and operates the NE.
The service protection is realized by the cross-connect and timing board. When services are switched,
the switching event is reported to the GSCC, which then reports the switching event to the NMS.

When the communication and control module fails, the following situations occur:

Communication failure
The communication and control module cannot manage the boards in the subrack,
monitor the performance events and alarms of the boards, collect the status information
about the other functional modules, or perform the corresponding management
operations.

DCC failure
The communication and control module cannot transfer the OAM information to other
NEs through the local NE, report the alarms and performance data of the equipment to
the network management terminal, or respond to the commands issued by the network
management terminal.

1.1.1.1.74 OHP Module

Receives overhead signals from the line slot.

Processes such bytes as E1, E2, F1 and serial14serial

Sends overhead signals to the line board.

Provides the following external interfaces:

One orderwire interface

Two SDH NNI audio interfaces

Interface F1

Broadcast data ports serial14serial

Figure 6-9 shows the orderwire bytes in the SDH frame.

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Figure 1.2 Position of these orderwire bytes in the SDH frame


A1

A1

A1

A2

A2

A2

J0

B1

E1

F1

D1

D2

D3

Serial 1 Serial2

AU_PTR
B2

B2

D4

Serial 4

B2

K1

K2

D5

D6

D7

D8

D9

D10

D11

D12

S1

M1

Serial3

E2

1.1.1.1.75 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

6.3.5 Front Panel


The front panel of the GSCC has indicators and a bar code.

1.1.1.1.76 Diagram of the Front Panel


Figure 6-10 shows the appearance of the N4GSCC/N6GSCC.

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Figure 1.1 Front panel of the N4GSCC/N6GSCC

GSCC
STAT
ACT
PROG
SRV
PWRA
PWRB
PWRC
ALMC

RESET

ALM CUT

GSCC

1.1.1.1.77 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

48 V power supply indicator of channel A (PWRA) two colors (red and green)

48 V power supply indicator of channel B (PWRB) two colors (red and green)

+3.3 V backup power supply indicator of the system (PWRC) two colors (red and
green)

Alarm mute indicator (ALMC) one color (yellow)

For the meanings of the status of the indicators, see 23 Indicators.


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1.1.1.1.78 Interfaces
The front panel of the GSCC has no interface. The AUX provides interfaces for the GSCC.
For details, see AUX.
The front panel of the N4GSCC/N6GSCC has one warm reset switch and one alarm cut
switch. Table 6-10 describes the types and usage of the switches
Figure 1.1 Types and usage of the switches of the GSCC
Switch

Type of
Switch

Usage

RESET

Warm reset
switch

Press the switch to perform a warm reset for the SCC unit.

ALM CUT

Alarm cut
switch

Press the switch to mute the alarm. Press the switch for
five seconds to mute the alarm permanently. Press the
switch again for five seconds to resume the alarm sound.

6.3.6 Jumpers and DIP Switches


The GSCC has jumpers, which are used to set the input voltage and running state of the
equipment.

The jumpers are used for test and maintenance. Do not change the setting of jumpers at
random. Otherwise, the board may become faulty.

1.1.1.1.79 N4GSCC
Figure 6-11 shows the layout of the J2101, J7100, J3201, and J3202 jumpers on the N4GSCC.

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Figure 1.1 Position of the jumpers of the N4GSCC

Power
module

J3202
J3201

CPU

J7100

J2101

1
2
3

Table 6-11 lists the jumpers of the N4GSCC.


Figure 1.1 Jumpers of the N4GSCC
Jumper

Function

Description

J2101

To enable the
battery

12: If jumper bits (positions) 1 and 2 are capped, the


database and clock are cleared.
23: If jumper bits (positions) 2 and 3 are capped, the
battery is enabled. It is the default state.

J7100

To set the running


state of the board

Jumper J7100 is a group of two-pin jumpers located


in five rows. The jumper in the lowest row is reserved
and does not need to be set. In the case of the jumpers
in the top four rows, the value of a jumper bit is
defined as follows:
If a jumper bit is not capped, the value is 0.
If a jumper bit is capped, the value is 1.
The jumper bit values are queued from bottom to top
and from the higher bit to the lower bit, and form a
four-bit binary number. For details, refer to Table 612.

J3202 and
J3201

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To set the input


voltage of the
equipment

When the jumpers are not capped, the equipment is


supplied with the 60 V power.
When the jumpers are capped, the equipment is
supplied with the 48 V power. It is the default state.

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Set J3202 and J3201 correctly based on the power voltage provided in the
telecommunications room. If J3202 and J3201 are set incorrectly, the POWER_ABNORMAL
alarm is generated.
Figure 1.2 Jumper J7100
Value

Description

0b0000

Indicates the running state when the watchdog is started. It is the


default state.

0b0001

Changes to the self-test state of the SDRAM Burst.

0b0011

Indicates the commissioning state.

0b0100

Indicates the running state when the watchdog is stopped.

0b0101

The software is in the BIOS state. The SCC does not work even
though the NE software exists. The IP address of the parameter area,
however, is not changed, which is for querying.

0b0110

The software enters the exhibition mode.

0b1001

Indicates the running state when the watchdog is started.

0b1011

Erases the database.

0b1100

Erases the NE software, including the patches.

0b1101

Erases the database and NE software, including the patches.

0b1110

Erases the database, NE software, and NE.ini file.

0b1111

Erases the extended BIOS and system parameter area in the file
system and flash memory.

1.1.1.1.80 N6GSCC
Figure 6-12 shows the layout of the J18, J11, J30, and J31 jumpers on the N6GSCC.

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Figure 1.2 Position of the jumpers of the N6GSCC

Power
module

J30

321
J31

32 1

CPU

J18

123

J11

Table 6-13 lists the jumpers of the N6GSCC.


Figure 1.1 Jumpers of the N6GSCC
Jumper

Function

Description

J18

To enable the
battery

12: If jumper bits (positions) 1 and 2 are capped, the


database and clock are cleared.
23: If jumper bits (positions) 2 and 3 are capped, the
battery is enabled. It is the default state.

J11

To set the running


state of the board

Jumper J11 is a group of two-pin jumpers located in


five rows. The jumper in the left-most row is reserved
and does not need to be set. In the case of the jumpers
in the right four rows, the value of a jumper bit is
defined as follows:
If a jumper bit is not capped, the value is 0.
If a jumper bit is capped, the value is 1.
The jumper bit values are queued from left to right
and from the higher bit to the lower bit, and form a
four-bit binary number. For details, refer to Table 614.

J30 and J31


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To set the input


voltage of the

23 or jumpers are not capped: If jumper bits


(positions) 2 and 3 are capped or jumpers are not

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Jumper

6 Cross-Connect Boards and System Control Boards

Function

Description

equipment

capped, the equipment is supplied with the 60 V


power.
12: If jumper bits (positions) 2 and 3 are capped, the
equipment is supplied with the 48 V power. It is the
default state.

Set J30 and J31 correctly based on the power voltage provided in the telecommunications
room. If J30 and J31 are set incorrectly, the POWER_ABNORMAL alarm is generated.
Figure 1.2 Jumper J11
Value

Description

0b0000

Indicates the running state when the watchdog is started. It is the


default state.

0b0001

Changes to the self-test state of the SDRAM Burst.

0b0011

Indicates the commissioning state.

0b0100

Indicates the running state when the watchdog is stopped.

0b0101

The software is in the BIOS state. The SCC does not work even
though the NE software exists. The IP address of the parameter area,
however, is not changed, which is for querying.

0b0110

The software enters the exhibition mode.

0b1001

Indicates the running state when the watchdog is started.

0b1011

Erases the database.

0b1100

Erases the NE software, including the patches.

0b1101

Erases the database and NE software, including the patches.

0b1110

Erases the database, NE software, and NE.ini file.

0b1111

Erases the extended BIOS and system parameter area in the file
system and flash memory.

6.3.7 Valid Slots


The GSCC must be installed in a valid slot in the subrack. Otherwise, the GSCC cannot work
normally.
The GSCC can be installed in slots 17 and 18 in the subrack. By default, slot 18 houses the
active board and slot 17 houses the standby board.

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6.3.8 Feature Code


The GSCC does not have the feature code.

6.3.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.81 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the active board and standby board are installed in the correct slots.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check the status of the indicators of the board when and after the board is powered
on. For the meanings of the status of the indicators, see 23 Indicators.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
Step 6 Required: Check the status of the ALM switch.
1.

Press the switch to mute the current alarm sound.

2.

Press the switch for five seconds to mute the alarm sound permanently. In this case, the
alarm mute indicator (ALMC) turns on (in yellow).

3.

Press the switch again for five seconds to resume the alarm sound. In this case, the
ALMC indicator turns off.

----End

1.1.1.1.82 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 7 Required: If the parameter settings of the GSCC are available on the , download the
parameter settings to the GSCC. Otherwise, perform the following operations:

Set the NE ID. For details, see Setting the NE ID.

Set the NE name, date, and time. For details, see Setting the NE Name, Date, and Time.

----End

1.1.1.1.83 Commissioning the Board


Step 1 Check the setting of the jumper that controls the debugging status of the board. For the
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description of the jumper, see 6.3.6 Jumpers and DIP Switches.


Step 8 Check and commission the circuit status on the data ports, including the F&f debugging serial
port and OAM NM port. For details, see 27.4 Configuring the F&f Debugging Serial Port and
OAM NM Port.
Step 9 Check the configurations of the data ports.

For the configuration of the broadcast data port, see Configuring the Broadcast Data
Service.

For the configuration of the F1 codirectional data port, see Configuring the F1 Data
Service.

----End

1.1.1.1.84 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 10 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

6.3.10 Parameter Settings


You can set parameters for the GSCC by using the U2000.
You can set the following parameters for the GSCC by using the U2000:

NE ID

NE name, date, and time

F&f debugging serial port

OAM NM port

Broadcast data port

F1 data port

6.3.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.85 Troubleshooting
Table 6-15 lists the faults that occur on the GSCC frequently and the troubleshooting
methods.

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Figure 1.1 Methods used to troubleshoot the faults that occur on the GSCC frequently
Fault Symptom

Common Fault Cause

ECC failure

The running status


of the board
becomes abnormal.

The optical fibers


are incorrectly
connected.

Power supply alarm

The jumper that


controls the input
voltage is incorrectly
set.

Connection failure
between the NMS
computer and the
equipment

An incorrect
network cable is
used to connect the
NMS computer to
the equipment.

The IP address of
the NMS computer
and the IP address
of the equipment are
not in the same
network segment.

Repetitive GSCC resets

The GSCC is faulty.

Troubleshooting Method

Check whether the running status


of the board is correct. See 23.2
Alarm Indicators on the Boards to
obtain the meanings of the status
of the indicators.

Check whether the optical fibers


are correctly connected.

For information on how to set the


jumper, see 6.3.6 Jumpers and DIP
Switches.

For information on the connection


of the network cable, see Checking
Connection Between the U2000
Computer and the Equipment.

Ensure that the IP address of the


NMS computer and the IP address
of the equipment are correctly set.
For details, see Setting the IP
Address of the PC.

Replace the GSCC. For information


on how to replace the GSCC, see
Replacing a GSCC Board.

1.1.1.1.86 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the GSCC, see Replacing a GSCC Board.

6.3.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

6.3.12.1 Alarms of N4GSCC


APS_MANUAL_S
TOP

BD_AT_LOWPO
WER

BD_NOT_INSTALLED

BD_STATUS

BOOTROM_BAD

CFCARD_FAILED

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CFCARD_OFFLIN
E

CFCARD_W_R_D
ISABLED

CHIP_ABN

COMMUN_FAIL

DBMS_ERROR

DBMS_PROTECT_MODE

LAN_LOC

FPGA_ABN

HARD_BAD

SYSLOG_COMM_
FAIL

MSSW_DIFFERE
NT

NE_POWER_OVER

NESF_LOST

NESTATE_INSTA
LL

PATCH_ACT_TIMEOUT

PATCH_ERR

PATCH_NOT_CO
NFIRM

PATCHFILE_NOTEXIST

POWER_ABNOR
MAL

POWER_FAIL

REG_MM

RINGMAPM_MM

RTC_FAIL

SECU_ALM

SQUTABM_MM

SWDL_ACTIVAT
ED_TIMEOUT

SWDL_AUTOMATCH_INH

SWDL_INPROCE
SS

SWDL_CHGMNG
_NOMATCH

SWDL_COMMIT_FAIL

SWDL_NEPKGCH
ECK

SWDL_ROLLBA
CK_FAIL

SYNC_FAIL

TEMP_OVER

WRG_FANTYPE

WRG_BD_TYPE

CFCARD_FULL

BIOS_STATUS

DCC_CHAN_LACK

PATCH_PKGERR

DBMS_DELETE

STORM_CUR_QUENUM_OVER

PATCH_DEACT_T
IMEOUT

Ext_COMM_FAIL

LCS_DAYS_OF_GRACE

LCS_EXPIRED

LCS_FILE_NOT_
EXIST

FEATURE_WITHOUT_LICENSE

SYNC_DISABLE

DCNSIZE_OVER

MEM_OVER

CPC_NODE_ID_E
RR

SWDL_PKG_NOB
DSOFT

CES_APS_MANUAL_STOP

NE_CFG_CONFLI
CT

NTP_SYNC_FAIL

DB_RESTORE_FAIL

PASSWORD_NEE
D_CHANGE

SEC_RADIUS_FA
IL

SSL_CERT_NOENC

SUBNET_RT_CO
NFLICT

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6.3.12.2 Alarms of N6GSCC


APS_MANUAL_S
TOP

BD_AT_LOWPO
WER

BD_NOT_INSTALLED

BD_STATUS

BOOTROM_BAD

CFCARD_FAILED

CFCARD_OFFLIN
E

CFCARD_W_R_D
ISABLED

CHIP_ABN

COMMUN_FAIL

DBMS_ERROR

DBMS_PROTECT_MODE

LAN_LOC

FPGA_ABN

HARD_BAD

SYSLOG_COMM_
FAIL

MSSW_DIFFERE
NT

NE_POWER_OVER

NESF_LOST

NESTATE_INSTA
LL

PATCH_ACT_TIMEOUT

PATCH_ERR

PATCH_NOT_CO
NFIRM

PATCHFILE_NOTEXIST

POWER_ABNOR
MAL

POWER_FAIL

REG_MM

RINGMAPM_MM

RTC_FAIL

SECU_ALM

SQUTABM_MM

SWDL_ACTIVAT
ED_TIMEOUT

SWDL_AUTOMATCH_INH

SWDL_INPROCE
SS

SWDL_CHGMNG
_NOMATCH

SWDL_COMMIT_FAIL

SWDL_NEPKGCH
ECK

SWDL_ROLLBA
CK_FAIL

SYNC_FAIL

TEMP_OVER

WRG_FANTYPE

WRG_BD_TYPE

CFCARD_FULL

BIOS_STATUS

DCC_CHAN_LACK

PATCH_PKGERR

DBMS_DELETE

STORM_CUR_QUENUM_OVER

PATCH_DEACT_T
IMEOUT

Ext_COMM_FAIL

LCS_DAYS_OF_GRACE

LCS_EXPIRED

LCS_FILE_NOT_
EXIST

FEATURE_WITHOUT_LICENSE

SYNC_DISABLE

DCNSIZE_OVER

MEM_OVER

CPC_NODE_ID_E
RR

SWDL_PKG_NOB
DSOFT

CES_APS_MANUAL_STOP

NE_CFG_CONFLI
CT

NTP_SYNC_FAIL

DB_RESTORE_FAIL

PASSWORD_NEE
D_CHANGE

SEC_RADIUS_FA
IL

SSL_CERT_NOENC

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SUBNET_RT_CO
NFLICT

6.3.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

6.3.13.1 Performance Events of N4GSCC


XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

6.3.13.2 Performance Events of N6GSCC


XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

6.3.14 Technical Specifications


The technical specifications of the GSCC include the mechanical specifications and power
consumption.

1.1.1.1.87 Mechanical Specifications


The mechanical specifications of the GSCC are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N4GSCC (kg): 1.0

Weight of the N6GSCC (kg): 0.9

1.1.1.1.88 Power Consumption


The maximum power consumption of the N4GSCC at room temperature (25C) is 19 W.
The maximum power consumption of the N6GSCC at room temperature (25C) is 35 W.

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7 Packet Processing Boards

Packet Processing Boards

About This Chapter


The packet processing boards include the PEX1, PEX2, PEG16, and PEG8. They achieve the
packet switching function in the packet domain.
7.1 PEX1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEX1 (1x10GE Ethernet processing board). This topic also
describes how to configure and commission the PEX1.
7.2 PEX2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEX2 (2-port 10 Gigabit Ethernet switching processing board).
This topic also describes how to configure and commission the PEX2.
7.3 PEG8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEG8 (8-Port Gigabit Ethernet switching processing board).
This topic also describes how to configure and commission the PEG8
7.4 PEG16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEG16 (16xGE Ethernet processing board). This topic also
describes how to configure and commission the PEG16.

7.1 PEX1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEX1 (1x10GE Ethernet processing board). This topic also
describes how to configure and commission the PEX1.

7.1.1 Version Description


The PEX1 is available in N1 and N2. The N1PEX1 is discontinued.
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Table 7-1 describes the versions of the PEX1.


Figure 1.1 Versions of the PEX1
Item

Description

Functional versions

The PEX1 is available in two functional versions, namely,


N1 and N2.

Differences

Regarding interface specifications: interface types,


working modes, unidirectional-mode setting.

Regarding service specifications: tunnel specifications,


Ethernet service capability.

Regarding protection schemes: MPLS PW APS, MCLAG.

Regarding clock synchronization: IEEE 1588v2.

Regarding maintenance features: distributed MPLS


OAM/centralized MPLS OAM, MPLS-TP OAM,
loopback capability.

Regarding other points: The N1PEX1 occupies two


slots, but the N2PEX1 occupies only one slot. Therefore,
the N1PEX1 and N2PEX1 boards cannot be used
interchangeably.

Substitution

None

7.1.2 Application
The PEX1 is mainly used in the packet data transmission field to transmit/receive data
packets, manage bandwidths, and realize switching of data packets.
Figure 7-1 shows the typical networking and application of the PEX1. The PEX1 works with
the cross-connect board that provides the packet switching function to meet the requirement
of packet features. With this board, the TDM domain can be overlapped with the packet
domain on the OptiX OSN equipment to transmit data in the two domains. In this way, the
equipment realizes the smooth evolution from the MSTP network to the packet switching
network.

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Figure 1.1 Networking and application of the PEX1


OptiX OSN 3500/
7500
NMS

OptiX OSN 3500/


7500

OptiX OSN 3500/


7500
PSN
10GE ring

OptiX OSN 1500

OptiX OSN 1500


PSN
GE ring

OptiX OSN 1500

PSN
GE ring
OptiX OSN
3500/7500
OptiX OSN 1500

Traffic direction
FE interface board/FE processing board

GE convergence board

GE processing board

10GE processing board

Dual-domain (TDM domain and packet


domain) cross-connect board
PSN: packet switched network

7.1.3 Functions and Features


PEX1 boards process and forward 1x10 Gbit/s Ethernet services and support QoS functions
such as traffic management, congestion control, and queue scheduling for data packets.
Table 7-2 lists the functions and features supported by PEX1 boards.
Figure 1.2 Functions and features supported by PEX1 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Provides one 10GE optical port to receive/transmit and process 1x10 GE services
independently.

Port
types

N1PEX1 boards support 10GBASE-SR (LAN), 10GBASE-SW (WAN),


10GBASE-LR (LAN), 10GBASE-LW (WAN), 10GBASE-ER (LAN),
10GBASE-EW (WAN), 10GBASE-ZR (LAN), and 10GBASE-ZW (WAN)
Ethernet optical ports. The optical ports use LC connectors and support the
transmission distances of 0.3 km, 10 km, 40 km, and 80 km.

(N2PEX1) Supports 10GBASE-LR (LAN), 10GBASE-ER (LAN), and


10GBASE-ZR (LAN) Ethernet optical ports. The optical ports use LC
connectors and support the transmission distances of 10 km, 40 km, and 80
km.

(N2PEX1) Supports CWDM and DWDM colored optical ports. The optical
ports use LC connectors. CWDM optical ports support the transmission

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Funct
ion
and
Featu
re

7 Packet Processing Boards

Description

distance of 70 km. DWDM optical ports support the transmission distance of


40/80 km.
Functi
ons
when
being
used
with
an
interfa
ce
board

A PEX1 board does not support an interface board, and provides one 10GE port
on the front panel.

Port
charac
teristic
s

Pluggable optical
module

Supports XFP optical modules.

Single-fiber
bidirectional
optical module

Not supported

Working modes

N1PEX1 boards support 10GE full-duplex in both LAN


(default) and WAN mode.
N2PEX1 boards support 10GE full-duplex in LAN mode.

Flow control at
ports

Servic
e
specifi
cation
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Autonegotiati
on mode

Not supported

Nonautonego
tiation
mode

Not supported by N1PEX1 boards but supported


by N2PEX1 boards

Query/Setting of
port status

Supported

Query of port
types

Supported

Query/Setting of
optical power
thresholds

Supported

Query/Setting of
unidirectionalmode

Not supported by N1PEX1 boards but supported by


N2PEX1 boards

Processing
capability

Processes 10 Gbit/s services in full-duplex mode.

Service bearing

MPLS

Supported

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Funct
ion
and
Featu
re

Description

modes

PW specifications

Tunnel
specifications

7 Packet Processing Boards

QinQ

Supported

Port

Supported

Maximu
m
number
of PWs

16K

Maximu
m
number
of MSPWs

8K

Unidirec
tional

Number of unidirectional MPLS tunnels (with


tunnels shared):
N1PEX1: 4K
N2PEX1:

Bidirecti
onal

When working with the N4GSCC: 4K

When working with the N6GSCC: 16K

Number of bidirectional MPLS tunnels (with


tunnels shared):
N1PEX1: 2K
N2PEX1:

MTU

When working with the N4GSCC: 2K

When working with the N6GSCC: 8K

MTU for
ports

Supports the setting of the packet length, which


ranges from 960 bytes to 9600 bytes. After the
setting becomes valid, the length of the packets
that enter or exit the ports is restricted by the
preset MTU.

MTU for
services

For packet services carried by PWs, N1PEX1


boards support the setting of the packet length,
which ranges from 64 bytes to 9000 bytes. For
packet services carried in other modes, N1PEX1
boards support the setting of the packet length,
which ranges from 64 bytes to 9000 bytes.
For packet services carried by PWs, N2PEX1
boards support the setting of the packet length,
which ranges from 64 bytes to 9600 bytes. For
packet services carried in other modes, N2PEX1
boards do not support the setting of the packet
length.

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Funct
ion
and
Featu
re

Description

Ethernet service
capability

Protec
tion
schem
es

7 Packet Processing Boards

Tunnel APS

E-Line
service

Number of supported E-Line services:

When working with an N4GSCC board: 4K

When working with an N6GSCC board: 8K

E-LAN
service

Number of supported E-LAN services: 1020

EAGGR
service

An N1PEX1 board supports four E-AGGR


services, each of which supports 127 leaf ports.
An N2PEX1 board does not support E-AGGR
services.

Formats
of
Ethernet
data
frames

Supports the encapsulation in IEEE 802.3


format, Ethernet II format, or IEEE 802.1q/p
format.

Maximu
m
number
of QinQ
links

1K

Jumbo
frame

Supports a jumbo frame with a maximum length


of 9600 bytes.

Number of static MAC addresses in E-LAN


services: 2K

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dualended) tunnel APS in compliance with ITU-T Y.1720 and
ITU-T G.8131.
Number of supported tunnel APS protection groups: 1K

PW APS

Supports the 1+1 (single-ended/dual-ended), 1:1 (dualended) PW APS and PW FPS (single-ended) PW APS (only
on N2PEX1 boards).
Supports a maximum of 1K PW APS protection groups, and
a PW protection group can bind a maximum of 512 members
(only on N2PEX1 boards) in compliance with ITU-T Y.1720
and ITU-T G.8131.
NOTE
PW APS and tunnel APS share the protection resources.

LAG

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Supports manual link aggregation and static link


aggregation.

Supports the load sharing mode and load non-sharing


mode.

Complies with IEEE 802.3ad and IEEE 802.1AX.

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Funct
ion
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Description

MC-LAG

Supported only on N2PEX1 boards, which complies with


IEEE 802.3ad and IEEE 802.1AX.

MSTP

Supported only on N2PEX1 boards, which complies with


IEEE 802.1s.

LPT

Point-topoint
LPT

Supported

Point-tomultipoi
nt LPT

Supported

Synch
roniza
tion

Synchronous
Ethernet Clock

Supports one channel of synchronous Ethernet clock signals.

1588v2

Supports one channel of the IEEE 1588v2 time


synchronization and clock synchronization (only on
N2PEX1 boards).

Maint
enanc
e
featur
es

ETH OAM

Ethernet
service
OAMa

Supports CC, LB and LT. These functions


comply with IEEE 802.1ag.
Supports LM and 2DM. These functions comply
with ITU-T Y.1731.
Number of services that support Ethernet OAM
(ETH OAM): 2K

Ethernet
port
OAMa

Supports OAM auto-discovery, remote loopback,


fault detection, and link performance monitoring.
These functions comply with IEEE 802.3ah.
Number of ports that support ETH OAM: 2K

Distributed MPLS
OAM/Centralized
MPLS OAM
NOTE
N1PEX1 boards
support only
distributed MPLS
tunnel OAM.

MPLS
tunnel
OAMa

Supports CV, FFD, BDI, FDI, Tunnel ping, and


Tunnel traceroute. These functions comply with
ITU-T Y.1711.
Number of MPLS tunnels that support OAM: 2K

MPLS
PW
OAMa

Supports CV, FFD, BDI, FDI, PW traceroute,


and PW ping. These functions comply with ITUT Y.1711.
Number of PWs that support MPLS PW OAM:
2K.

MPLS-TP OAM
NOTE
Only N2PEX1
boards support
MPLS-TP OAM.

Issue 02 (2013-01-18)

MPLSTP
tunnel
OAMa

Supports CC, RDI, AIS, LB, LT, LM, 1DM,


TST, LCK, and 2DM. These functions comply
with ITU-T G.8113.1.
Number of tunnels that support MPLS-TP OAM:
2K

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and
Featu
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7 Packet Processing Boards

Description

MPLSTP PW
OAMa

Supports CC, RDI, AIS, LB, LT, LM, 1DM,


TST, LCK, CSF, and 2DM. These functions
comply with ITU-T G.8113.1.
Number of PWs that support MPLS-TP OAM:
2K

Loopback
capability

PHY
layer at
Ethernet
ports

N1PEX1: Supports inloops and outloops.

MAC
layer at
Ethernet
ports

N1PEX1: Supports inloops.

N2PEX1: Not support loopbacks.

N2PEX1: Supports inloops and outloops.

RMON

Supported

Port mirroring

Supports ingress mirroring.

Inban
d
DCN

Supported

HQoS

Supports service WRED policies, WFQ policies, PW polices, QinQ polices, VUNI ingress policies, V-UNI egress policies, port policies, port shaping.

IGMP
snoopi
ng

Protocol enabling

Supported

Port aging time

Supported

Fast leave

Supported

Discarding of
unknown
broadcast packets

Supported

Static broadcast
entry

Supported

Query
of
electro
nic
labels

Supported

NOTE
a: MPLS tunnel OAM, MPLS PW OAM, MPLS-TP tunnel OAM, MPLS-TP PW OAM, and ETH OAM
share OAM resources.

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7.1.4 Working Principle and Signal Flow


The PEX1 consists of the network processing module, transmission management module,
switching network buffering module, CPU management module, logic control module,
temperature and voltage detecting module, clock module, and power module.
Figure 7-2 shows the functional block diagram of the PEX1.
Figure 1.1 Functional block diagram of the PEX1
Backplane
Two system clock signals

Working clock
IEEE 1588 V2 packet

Modules of the board

Synchronous Ethernet clock

1x10GE signals

Data processing
module
Packet forwarding
module
Network processing
module

Service
signal

Upstream transmission
module

Synchronous Ethernet clock


Service Upstream scheduling
module
signal

Downstream
transmission module

Downstream
scheduling module

Transmission
management module

Switching network
buffering module

Parallel management bus

Parallel management bus

CPU
management
module

PSXCSA

IEEE 1588 V2 packet

Clock
module

PSXCSA
PSXCSA

Service
signal
PSXCSA

Parallel management bus

Data backup bus


Inter-board communication bus

GSCC
GSCC

Parallel management bus


Logic control
module

Modules of the
board

Temperature and voltage


detecting signals

Temperature and
voltage detecting
signals
- 48V / - 60 V

Power
module
- 48V / - 60 V

1.1.1.1.89 Receive Direction


The network processing module receives the 10xGE optical signals, decodes the signals, and
converts the serial signals into parallel signals. Then, the network processing module
performs route searching or address matching for the data packets, and transmits the
corresponding packets to the transmission management module. The transmission
management module buffers and grooms the packets, slices the packets into cells that the
switching network requires, and sends the cells to the switching network buffering module.
The switching network buffering module buffers the cells and sends the cells to the crossconnect unit.

1.1.1.1.90 Transmit Direction


The switching network buffering module processes the cells sent by the cross-connect unit
and sends the cells to the transmission management module. The transmission management
module rearranges the cells to form packets, performs buffering and QoS management for the
packets, and sends the packets to the network processing module. The network processing
module converts the parallel signals into serial signals and sends the signals to the 10xGE
optical interface.

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1.1.1.1.91 Network Processing Module


The network processing module performs route searching, address matching, and other
functions for data packets. The network processing module of the PEX1 can process the 10
Gbit/s data packets in full-duplex mode.

1.1.1.1.92 Transmission Management Module


The transmission management module slices packets into cells, and performs QoS
management and large volume buffering for the cells.

QoS management: The transmission management module provides the scheduling


function at five levels including the flow queue and port queue, the bandwidth restricting
function, and the corresponding statistical information.

Large volume buffering: The transmission management module supports traffic of 10


Gbit/s and can buffer data for 17 ms in both the upstream direction and downstream
direction.

1.1.1.1.93 Switching Network Buffering Module


The switching network buffering module performs cell buffering, queue management,
scheduling, and other functions. This module and the cross-connect unit form a three-level
switching network to switch cells.

1.1.1.1.94 CPU Management Module


The CPU management module provides the parallel management bus, Ethernet bus, and other
buses to manage the modules of the PEX1. The CPU management module also monitors
alarms and performance events and reports the alarms and performance events to the SCC
unit.

1.1.1.1.95 Logic Control Module


The logic control module controls the logic of the PEX1. The PEX1 occupies two slots. Each
board part that occupies one slot has the control part. The control logic of the PEX1 is
realized on the board part that occupies the slot with a smaller slot number between the two
slots that house the PEX1.

1.1.1.1.96 Temperature and Voltage Detecting Module


The temperature and voltage detecting module monitors the temperature and voltage.

1.1.1.1.97 Clock Module


The clock module performs the following functions:

Provides the clock signal for each module of the PEX1.

Supports the IEEE 1588v2 clock.

Supports the synchronous Ethernet clock.

1.1.1.1.98 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the PEX1 require.
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7.1.5 Front Panel


The front panel of the PEX1 has indicators, an interface, a bar code, and a laser safety class
label.

1.1.1.1.99 Diagram of the Front Panel


Figure 7-3 shows the appearance of the front panel of the N1PEX1.
Figure 1.1 Front panel of the N1PEX1

PEX1
STAT
ACT
PROG
SRV
LINK
ACT

CLASS 1
LASER
PRODUCT

OUT1
IN1

PEX1

Figure 7-4 shows the appearance of the N2PEX1.

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Figure 1.2 Front panel of the N2PEX1

PEX1
STAT
ACT
PROG
SRV
LINK
ACT
CLASS 1
LASER
PRODUCT

OUT1

IN1

PEX1

1.1.1.1.100 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the Boards.

1.1.1.1.101 Interfaces
The front panel of the PEX1 has one optical interface. Table 7-3 describes the type and usage
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of the optical interface of the PEX1.


Figure 1.1 Optical interface of the PEX1
Interface

Type of Interface

Usage

IN1

LC (pluggable)

Receives 10GE signals.

OUT1

LC (pluggable)

Transmits 10GE signals.

7.1.6 Jumpers and DIP Switches


The PEX1 does not have any jumpers or DIP switches that are used for board settings.

7.1.7 Valid Slots


The PEX1 must be installed in a valid slot in the subrack. Otherwise, the PEX1 fails to work
normally.
The N1PEX1 occupies two slots, and it can be installed in slots 18, and 1116. The PEX1
slot displayed on the NMS is the slot that has a smaller slot number between the two slots that
house the PEX1. For example, if the PEX1 is installed in slots 1 and 2, the PEX1 slot
displayed on the NMS is slot 1. The mapping relationships between the valid slots for the
PEX1 and the allocated bandwidths are as follows:

Slot 1: 5 Gbit/s

Slot 3: 7.5 Gbit/s

Slot 5, 7, 11, or 13: 10 Gbit/s

Slot 15: 7.5 Gbit/s

Table 7-4 lists the slots valid for the PEX1 and the corresponding logical slots of the N1PEX1
on the NMS.
Figure 1.2 Slots valid for the N1PEX1 and the corresponding logical slots of the N1PEX1 on the
NMS
Slot Valid for the PEX1

Corresponding Logical Slot

Slots 1 and 2

Slot 1

Slots 3 and 4

Slot 3

Slots 5 and 6

Slot 5

Slots 7 and 8

Slot 7

Slots 11 and 12

Slot 11

Slots 13 and 14

Slot 13

Slots 15 and 16

Slot 15

The N2PEX1 occupies one slot, and it can be installed in slots 18, and 1116. The mapping
relationships between the valid slots for the N2PEX1 and the allocated bandwidths are as
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follows:

Slots 13, and 16: 2.5 Gbit/s

Slots 46, and 1315: 5 Gbit/s

Slots 7 and 12: 10 Gbit/s

Slots 8 and 11: 20 Gbit/s

Two-slot boards can work only with cross-connect boards whose logical boards are N1PSXCS.

One-slot boards cannot work with cross-connect boards whose logical boards are N1PSXCS.

Two-slot boards and one-slot boards cannot be configured at the same time.

When working with an EDQ41 board, a two-slot board cannot be installed in slot 1 or slot 15.

7.1.8 Feature Code


The PEX1 does not have the feature code.

7.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.102 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the
board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.103 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
Step 7 Required: Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment are

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required to work in the same fixed working mode. If the working modes on two sides do
not match, packets may be lost or the bit rate may decrease. In the case of large volume
of traffic, services may be completely interrupted.
For details, see Parameter Description.
For more information about the parameters of the board, see 26.1 Packet Processing Boards.

Step 8 Required: Configure services. The following Ethernet services can be configured according
to actual requirements:

Configure the E-line service. For details, see Configuring E-Line Services.

Configure the E-LAN service. For details, see Configuring E-LAN Services.

Configure the E-AGGR service (only on the N1PEX1). For details, see Configuring EAGGR Services.

Step 9 Optional: Configure the OAM:

Configure the MPLS OAM, For details, see Configuring the MPLS OAM and
Configuring PW OAM.

Configure the MPLS-TP OAM, For details, see Configuring MPLS-TP Tunnel OAM and
Configuring MPLS-TP PW OAM(Only N2PEX1 boards support MPLS-TP OAM).

Step 10 Optional: Configure the MPLS tunnel protection group. For details, see Configuring Tunnel
APS on a Per-NE Basis.
Step 11 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 12 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 13 Optional: Configure the IEEE 1588v2 time and clock (only on the N2PEX1). For details, see
Configuring the IEEE 1588v2 Time Synchronization and Clock Synchronization.
Step 14 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

1.1.1.1.104 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.105 Checking the Operation of the Board


Step 1 Required: Check Ethernet services.

Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.

Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.

Check the E-AGGR service (only on the N1PEX1). For details, see Verifying the
Correctness of E-AGGR Service Configuration.

Step 15 Required: Check the status of the indicators on the front panel of the board to ensure that the
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board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 16 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

7.1.10 Configuring the Board Functions


The PEX1 supports the packet switching function and provides multiple packet switchingspecific functions and features, such as HQoS, LAG, and ETH OAM. Configure the functions
according to actual requirements.
You can configure the following packet switching functions for the N1PEX1 and N2PEX1 by
using the :

HQoS

LAG

ETH OAM

Tunnel APS

MPLS OAM

IGMP Snooping

Inband DCN

LPT

The N2PEX1 also provides the following packet switching functions:

MPLS-TP OAM

PW APS

MC-LAG

MSTP

MS-PW
The N1PEX1 supports only the MPLS Tunnel OAM function.

7.1.11 Parameter Settings


You can set parameters for the PEX1 by using the U2000.

1.1.1.1.106 Displayed Slots


The N1PEX1 occupies two slots in the subrack. The logical slot of the N1PEX1 displayed on
the U2000 is the slot that has a smaller slot number between the two slots that house the
PEX1.
For the logical slots of the N1PEX1 displayed on the U2000, refer to Table 7-4.
The N2PEX1 occupies one slot in the subrack. The logical slot of the N2PEX1 displayed on
the NMS corresponds to the installation slot.
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1.1.1.1.107 Board Parameters


You can set the following principal parameter for the PEX1 by using the U2000:

Ethernet interface

For more parameters and the description of the parameters, see 26.1 Packet Processing
Boards.

7.1.12 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.108 Troubleshooting
Table 7-5 lists the faults that occur on the PEX1 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the PEX1 frequently
Fault Symptom

Common Fault
Cause

Service
troubleshooting

The service is
interrupted.

The service loses


packets or has
errored packets.

The tunnel APS


switching fails.

The PW APS
switching fails.

The MC-LAG
switching fails.

Protection switching
fault

Troubleshooting Method
See Troubleshooting Packet Service
Interruptions.

See Failure of Packet Service Protection


Switching.

1.1.1.1.109 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PEX1, see Replacing a Packet Processing Board.

7.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

7.1.13.1 Alarms of N1PEX1


ALM_ALS

BD_STATUS

ETH_APS_LOST

BUS_ERR

COMMUN_FAIL

ETH_APS_TYPE_MISMATC

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H
ETH_APS_PATH_MISMATCH

ETH_APS_SWIT
CH_FAIL

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_LOC

ETH_EFM_DF

ETH_EFM_EVENT

ETH_CFM_UNE
XPERI

ETH_EFM_REMFAULT

ETH_LINK_DOWN

ETH_EFM_LOO
PBACK

FDBSIZEALM_ELAN

FLOW_OVER

ETH_LOS

HARD_BAD

HARD_ERR

IN_PWR_ABN

LAG_DOWN

LAG_MEMBER_DOWN

LASER_MOD_E
RR

LASER_SHUT

LOOP_ALM

LSR_BCM_ALM

LSR_NO_FITED

LSR_WILL_DIE

MAC_FCS_EXC

MPLS_TUNNEL_BDI

MPLS_TUNNEL_Excess

MPLS_TUNNEL
_FDI

MPLS_TUNNEL_LOCV

MPLS_TUNNEL_MISMATCH

MPLS_TUNNEL
_MISMERGE

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

MPLS_TUNNEL
_UNKNOWN

NO_BD_SOFT

POWER_ABNORMAL

TEMP_OVER

PW_EXC_TRAFFIC

OUT_PWR_ABN

TEST_STATUS

TEM_HA

TEM_LA

PW_NO_TRAFF
IC

W_OFFLINE

TR_LOC

IN_PWR_LOW

LPT_CFG_CLOSEPORT

WRG_BD_TYPE

IN_PWR_HIGH

ETHOAM_SELF_LOOP

TUNNEL_APS_DEGRADED

TUNNEL_APS_
OUTAGE

7.1.13.2 Alarms of N2PEX1


TEMP_OVER

COMMUN_FAIL

TR_LOC

BUS_ERR

NO_BD_SOFT

TEST_STATUS

HARD_BAD

HARD_ERR

POWER_ABNORMAL

BD_STATUS

PW_NO_TRAFFIC

WRG_BD_TYPE

LSR_NO_FITED

LASER_MOD_ERR

LASER_SHUT

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ALM_ALS

LSR_WILL_DIE

IN_PWR_ABN

OUT_PWR_ABN

TEM_HA

TEM_LA

LSR_BCM_ALM

FLOW_OVER

LOOP_ALM

ETH_LOS

ETH_LINK_DOWN

MPLS_TUNNEL_LOCV

MAC_FCS_EXC

FDBSIZEALM_ELAN

MPLS_TUNNEL_MISME
RGE

MPLS_TUNNEL_Excess

MPLS_TUNNEL_MISMATC
H

MPLS_TUNNEL_FDI

MPLS_TUNNEL_UNKN
OWN

MPLS_TUNNEL_BDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

ETH_CFM_UNEXPERI

PW_EXC_TRAFFIC

ETH_CFM_MISMERGE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOPBACK

ETH_EFM_REMFAULT

ETH_EFM_EVENT

ETH_APS_SWITCH_FAIL

ETH_APS_TYPE_MISMA
TCH

ETH_APS_PATH_MISM
ATCH

LAG_DOWN

ETH_APS_LOST

LAG_MEMBER_DOWN

MPLS_PW_MISMATCH

MPLS_PW_LOCV

MPLS_PW_Excess

MPLS_PW_BDI

MPLS_PW_MISMERGE

MPLS_PW_UNKNOWN

MPLS_PW_SD

MCLAG_CFG_MISMATC
H

MPLS_PW_SF

MCSP_PATH_LOCV

LPT_CFG_CLOSEPORT

IN_PWR_HIGH

IN_PWR_LOW

PWAPS_TYPE_MISMATC
H

PWAPS_PATH_MISMAT
CH

PWAPS_SWITCH_FAIL

PWAPS_LOST

ETHOAM_SELF_LOOP

TUNNEL_APS_DEGRADED

PORT_EXC_TRAFFIC

BWUTILIZATION_OVE
R

SRV_SHUTDOWN_LD

MPLS_TUNNEL_OAMFA
IL

MPLS_PW_OAMFAIL

DROPRATIO_OVER

PW_DROPPKT_EXC

ETH_NO_FLOW

TUNNEL_APS_OUTAGE

7.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

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7.1.14.1 Performance Events of N1PEX1


Figure 1.1 SDH
BDTEMPCUR

BDTEMPMAX

BDTEMPMIN

CPUUSAGECUR

CPUUSAGEMAX

CPUUSAGEMIN

MEMUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_UAS

ETH_CFM_CSLS

Figure 1.2 ETH OAM 802.1ag

Figure 1.3 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Figure 1.4 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TUNNEL_REVERSE_SN
DPKTS

TUNNEL_REVERSE_SNDB
YTES

TUNNEL_REVERSE_RC
VPKTS

TUNNEL_REVERSE_RC
VBYTES

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_TX_
BPS

TUNNEL_REVERSE_RX_
PPS

TUNNEL_REVERSE_TX_P
PS

TUNNEL_REVERSE_RX
_BPS

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Figure 1.5 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILISATI
ON

PW_RX_BPS

PW_TX_BPS

PW_RX_PPS

PW_TX_PPS

Figure 1.6 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

Figure 1.7 Statistics of RMON basic performance


RXPKTS

RXOCTETS

RXBRDCAST

RXMULCAST

RXPKT64

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

ETHOVER

Figure 1.8 Statistics of RMON extended performance


TXPKTS

TXOCTETS

TXBGOOD

TXUNICAST

TXBRDCAST

TXMULCAST

TXPKT64

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

RXBGOOD

RXUNICAST

RXPAUSE

RXPKT1519

PKT64

PKT65

PKT128

PKT256

PKT512

PKT1024

PKT1519

PORT_RX_BYTES_AVAI
LABILITY

RXBPS

TXBPS

RXPPS

TXPPS

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7.1.14.2 Performance Events of N2PEX1


Figure 1.9 SDH
CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

Figure 1.10 ETH OAM 802.1ag


ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_CSLS

ETH_CFM_UAS

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

Figure 1.11 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Figure 1.12 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATIO
N

TUNNEL_REVERSE_SND
PKTS

TUNNEL_REVERSE_SNDB
YTES

TUNNEL_REVERSE_R
CVPKTS

TUNNEL_REVERSE_RCV
BYTES

TNL_REVERSE_BW_UTILIS
ATION

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_RX_
BPS

TUNNEL_REVERSE_TX_BP
S

TUNNEL_REVERSE_R
X_PPS

TUNNEL_REVERSE_TX_
PPS

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Figure 1.13 MPLS PW OAM


MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Figure 1.14 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILISA PW_DROPPKTS
TION

PW_DROPBYTES

PW_RX_BPS

PW_RX_PPS

PW_TX_PPS

PW_TX_BPS

Figure 1.15 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

VUNI_TX_UTILIZATION

VLAN_RCVPKTS

VLAN_RCVBYTES

VLAN_SNDPKTS

VLAN_SNDBYTES

VUNI_SND_DROPPKTS

VUNI_SND_DROPBYTES

VUNI_SND_DROPRATIO

VLAN_RX_BPS

VLAN_TX_BPS

VLAN_RX_PPS

VLAN_TX_PPS

Figure 1.16 Statistics of RMON basic performance


RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHUNDER

ETHOVER

ETHFRG

RXPKT64

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

Figure 1.17 Statistics of RMON extended performance


RXPKT1519
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TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

PKT64

PKT65

PKT128

PKT256

PKT512

PKT1024

PKT1519

RXUNICAST

TXUNICAST

TXMULCAST

TXBRDCAST

RXPAUSE

ETHFCS

ETHUTILIZ

RXCTLPKTS

TXETHOVER

TXPKTS

TXOCTETS

PORT_RX_BYTES_AVAILABILI
TY

PORT_RX_BW_UTILIZ
ATION

PORT_TX_BW_UTILI
ZATION

TX_DROP_RATIO

RXBPS

TXBPS

RXPPS

TXPPS

Figure 1.18 QoS


QOS_STRM_MATCHPKT
S

QOS_STRM_MATCHBYT
ES

QOS_CARGRNPKTS

QOS_CARGRNBYTES

QOS_CARYLWPKTS

QOS_CARYLWBYTES

QOS_CARREDPKTS

QOS_CARREDBYTES

QOS_CARREDRATIO

FLOW_RX_UTILIZATION

QOS_PRI_DROPPKTS

QOS_PRI_DROPBYTES

PORT_PRI_SNDPKTS

PORT_PRI_SNDBYTES

PWQUEUE_SNDDROPPK
TS

PWQUEUE_SNDDROPBY
TES

PWQUEUE_SNDDROPRA
TIO

TNL_SNDDROPPKTS

TNL_SNDDROPBYTES

TNL_SNDDROPRATIO

TNL_REVERSE_SNDDRO
PPKTS

TNL_REVERSE_SNDDRO
PBYTES

TNL_REVERSE_SNDDRO
PRATIO

VUNIQUEUE_SNDDROPP
KTS

VUNIQUEUE_SNDDROP
BYTES

VUNIQUEUE_SNDDROP
RATIO

VUNIGROUP_SNDDROPP
KTS

VUNIGROUP_SNDDROP
BYTES

VUNIGROUP_SNDDROP
RATIO

QOS_PORTQUEUE_DROP
RATIO

VUNIGROUP_SNDPKTS

VUNIGROUP_SNDBYTES

VGROUP_TX_UTILIZATI
ON

PORT_PRI_TX_BPS

PORT_PRI_TX_PPS

PWQUEUE_TX_BPS

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PWQUEUE_TX_PPS

7.1.15 Technical Specifications of PEX1


The technical specifications of the PEX1 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.110 Parameters Specified for Optical Interfaces


Table 7-24 lists the parameters specified for the optical interfaces of the N1PEX1.
Figure 1.1 Parameters specified for the optical interfaces of the N1PEX1
Parameter

Value

Type of
interface

10GBASE-SR
(LAN)

10GBASE-LR
(LAN)

10GBASE-ER
(LAN)

10GBASE-ZR
(LAN)

10GBASE-SW
(WAN)

10GBASE-LW
(WAN)

10GBASE-EW
(WAN)

10GBASE-ZW
(WAN)

Transmission
distance (km)

0.3

10

40

80

Type of fiber

Multi-mode LC

Single-mode LC

Single-mode
LC

Single-mode
LC

Launched
optical power
range (dBm)

-1.3 to -7.3

-6 to -1

-1 to 2

0 to 4

Operating
wavelength
range (nm)

840 to 860

1260 to 1330

1530 to 1565

1530 to 1565

Minimum
overload (dBm)

-1

0.5

-1

-7

Receiver
sensitivity
(dBm)

-7.5

-11

-15

-24

Minimum
extinction ratio
(dB)

8.2

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

30

30

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Table 7-25 lists the parameters specified for the optical interfaces of the N2PEX1.
Figure 1.2 Parameters specified for the optical interfaces of the N2PEX1
Parameter

Value

Type of interface

10GBASE-LR
(LAN)

10GBASE-ER
(LAN)

10GBASE-ZR
(LAN)

Transmission
distance (km)

10

40

80

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Launched optical
power range (dBm)

-6 to -1

-1 to 2

0 to 4

Operating
wavelength range
(nm)

1260 to 1330

1530 to 1565

1530 to 1565

Minimum overload
(dBm)

0.5

-1

-7

Receiver sensitivity
(dBm)

-11

-15

-24

Minimum extinction
ratio (dB)

8.2

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

30

30

30

Table 7-26 and Table 7-27 lists the parameters specified for the colored optical interfaces of
the N2PEX1.
Figure 1.3 CWDM parameters specified for the colored optical interfaces of the N2PEX1
Parameter

Value
CWDM

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

70

Launched optical power range


(dBm)

0 to 4

Operating wavelength range


(nm)

1471 to 1611, in steps of 20

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Parameter

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Value
CWDM

Receiver sensitivity (dBm)

1451nm to 1551nm: -23

1571nm: -22

1591nm to 1611nm: -21

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

1400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

Figure 1.4 DWDM parameters specified for the colored optical interfaces of the N2PEX1
Parameter

Value
DWDM

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission
distance (km)

40

80

Launched optical
power range
(dBm)

-1 to 2

-1 to 3

Central frequency
(THz)

192.10 to 196.00

192.10 to 196.00

Central frequency
deviation (GHz)

10

10

Receiver
sensitivity (dBm)

-17

-24

Minimum
overload (dBm)

-1

-9

Maximum
allowed dispersion
(ps/nm)

800

1600

Minimum
extinction ratio

9.5

8.2

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Parameter

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Value
DWDM

(dB)
Maximum -20 dB
spectral width
(nm)

0.3

0.3

Minimum side
mode suppression
ratio (dB)

35

30

1.1.1.1.111 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.112 Mechanical Specifications


The mechanical specifications of the N1PEX1 are as follows:

Dimensions (mm): 50.3 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 2.4

The mechanical specifications of the N2PEX1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.4

1.1.1.1.113 Power Consumption


The maximum power consumption of the N1PEX1 at room temperature (25C) is 107 W.
The maximum power consumption of the N2PEX1 at room temperature (25C) is 48 W.

7.2 PEX2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEX2 (2-port 10 Gigabit Ethernet switching processing board).
This topic also describes how to configure and commission the PEX2.

7.2.1 Version Description


The PEX2 is available in one functional version, namely, N1.

7.2.2 Application
The PEX2 is mainly used in the packet data transmission field to transmit/receive data
packets, manage bandwidths, and implement switching of data packets.

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Figure 7-5 shows the typical networking and application of the PEX2. The PEX2 works with
the cross-connect board that provides the packet switching function to meet the requirement
of packet features. With this board, the TDM domain can be overlapped with the packet
domain on the OptiX OSN equipment so that the data can be transmitted in the two domains.
In this manner, an MSTP network can smoothly evolve to a packet switching network.
Figure 1.1 Networking and application of the PEX2
OptiX OSN 3500/
7500
NMS

OptiX OSN 3500/


7500

OptiX OSN 3500/


7500
PSN
10GE ring

OptiX OSN 1500

OptiX OSN 1500


PSN
GE ring

OptiX OSN 1500

PSN
GE ring
OptiX OSN
3500/7500
OptiX OSN 1500

Traffic direction
FE interface board/FE processing board

GE convergence board

GE processing board

10GE processing board

Dual-domain (TDM domain and packet


domain) cross-connect board
PSN: packet switched network

7.2.3 Functions and Features


PEX2 boards process and forward 2x10 Gbit/s Ethernet services and support QoS functions
such as traffic management, congestion control, and queue scheduling for data packets.
Table 7-28 lists the functions and features supported by PEX2 boards.
Figure 1.1 Functions and features supported by PEX2 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 2x10 GE services.

Port
types

Supports 10GBASE-LR (LAN), 10GBASE-ER (LAN), and 10GBASE-ZR


(LAN) Ethernet optical ports. The optical ports use LC connectors and support
the transmission distances of 10 km, 40 km, and 80 km.

Supports CWDM and DWDM colored optical ports. The optical ports use LC
connectors. CWDM optical ports support the transmission distance of 70 km.

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ion
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Featu
re

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Description

DWDM optical ports support the transmission distance of 40/80 km.


Functi
ons
when
being
used
with
an
interfa
ce
board

A PEX2 board does not support an interface board, and provides two 10GE ports
on the front panel.

Port
charac
teristic
s

Pluggab
le
optical
module

Supports XFP optical modules.

Singlefiber
bidirecti
onal
optical
module

Not supported

Workin
g modes

10GE full-duplex (only in LAN mode)

Flow
control
at ports

Autonegotiation
mode

Not supported

Nonautonegotia
tion mode

Supported

Issue 02 (2013-01-18)

Query/S
etting of
port
status

Supported

Query
of port
types

Supported

Query/S
etting of
optical
power
threshol
ds

Supported

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Funct
ion
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Featu
re

Servic
e
specifi
cation
s

Description

Query/S
etting of
unidirec
tionalmode

Supported

Processi
ng
capabili
ty

Processes 20 Gbit/s services in full-duplex mode.

Service
bearing
modes

MPLS

Supported

QinQ

Supported

Port

Supported

Maximum
number of
PWs

16K

Maximum
number of
MS-PWs

8K

Unidirectio
nal

Number of unidirectional MPLS tunnels (with tunnels


shared):

PW
specific
ations

Tunnel
specific
ations

Bidirection
al

MTU

Ethernet
service
capabili

Issue 02 (2013-01-18)

7 Packet Processing Boards

When working with the N4GSCC: 4K

When working with the N6GSCC: 16K

Number of bidirectional MPLS tunnels (with tunnels


shared):

When working with the N4GSCC: 2K

When working with the N6GSCC: 8K

MTU for
ports

Supports the setting of the packet length, which ranges


from 960 bytes to 9600 bytes. After the setting becomes
valid, the length of the packets that enter or exit the ports
is restricted by the preset MTU.

MTU for
services

For packet services carried by PWs, PEX2 boards


support the setting of the packet length, which ranges
from 64 bytes to 9600 bytes. For packet services carried
in other modes, PEX2 boards do not support the setting
of the packet length.

E-Line
service

Number of supported E-Line services:

When working with the N4GSCC: 4K

When working with the N6GSCC: 8K

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Funct
ion
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Featu
re

Description

ty

Protec
tion
schem
es

7 Packet Processing Boards

Tunnel
APS

E-LAN
service

Number of supported E-LAN services: 1020

E-AGGR
service

Not supported

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format,


Ethernet II format, or IEEE 802.1q/p format.

Maximum
number of
QinQ links

1K

Jumbo
frame

Supports a jumbo frame with a maximum length of 9600


bytes.

Number of static MAC addresses in E-LAN services: 2K

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended)


tunnel APS in compliance with ITU-T Y.1720 and ITU-T G.8131.
Number of supported tunnel APS protection groups: 1K

PW
APS

Supports the PW FPS (single-ended), 1+1 (single-ended/dual-ended)


and 1:1 (dual-ended) PW APS in compliance with ITU-T Y.1720 and
ITU-T G.8131.
Supports a maximum of 1K PW APS protection groups, and a PW
protection group can bind a maximum of 512 members.
NOTE
PW APS and tunnel APS share the protection resources.

LAG

Synch
roniza
tion

Issue 02 (2013-01-18)

Supports manual link aggregation and static link aggregation.

Supports the load sharing mode and load non-sharing mode.

Complies with IEEE 802.3ad and IEEE 802.1AX.

MCLAG

Supported, which complies with IEEE 802.3ad and IEEE 802.1AX.

MSTP

Supported, which complies with IEEE 802.1s.

LPT

Point-topoint LPT

Supported

Point-tomultipoint
LPT

Supported

Synchro
nous
Ethernet
Clock

Supports two channels of synchronous Ethernet clock signals.

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Funct
ion
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Featu
re

Maint
enanc
e
featur
es

7 Packet Processing Boards

Description

1588v2

Supports two channels of IEEE 1588v2 time synchronization and clock


synchronization.

ETH
OAM

Ethernet
service
OAMa

Supports CC, LB and LT. These functions comply with


IEEE 802.1ag.
Supports LM and 2DM. These functions comply with
ITU-T Y.1731.
Number of services that support Ethernet OAM (ETH
OAM): 2K

Ethernet
port OAMa

Supports OAM auto-discovery, remote loopback, and


link performance monitoring. These functions comply
with IEEE 802.3ah.
Number of ports that support ETH OAM: 2K

Distribu
ted
MPLS
OAM/C
entraliz
ed
MPLS
OAM

MPLS
tunnel
OAMa

Supports CV, FFD, BDI, FDI, Tunnel ping, and Tunnel


traceroute. These functions comply with ITU-T Y.1711.

MPLS PW
OAMa

Supports CV, FFD, BDI, FDI, PW traceroute, and PW


ping. These functions comply with ITU-T Y.1711.

MPLSTP
OAM

MPLS-TP
tunnel
OAMa

Number of MPLS tunnels that support OAM: 2K

Number of MPLS PWs that support OAM: 2K


Supports CC, RDI, AIS, LB, LT, LM, 1DM, TST, LCK,
and 2DM. These functions comply with ITU-T
G.8113.1.
Number of tunnels that support MPLS-TP OAM: 2K
MPLS-TP
PW OAMa

Supports CC, RDI, AIS, LB, LT, LM, 1DM, TST, LCK,
CSF, and 2DM. These functions comply with ITU-T
G.8113.1.
Number of PWs that support MPLS-TP OAM: 2K

Inban
d
Issue 02 (2013-01-18)

Loopba
ck
capabili
ty

PHY layer
at Ethernet
ports

Not supported

MAC layer
at Ethernet
ports

Supports inloops and outloops.

RMON

Supported

Port
mirrorin
g

Supports ingress mirroring.

Supported

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Description

DCN
HQoS

Supports service WRED policies, WFQ policies, PW polices, QinQ polices, VUNI ingress policies, V-UNI egress policies, port policies, port shaping.

IGMP
snoopi
ng

Protocol
enablin
g

Supported

Port
aging
time

Supported

Fast
leave

Supported

Discardi
ng of
unknow
n
broadca
st
packets

Supported

Static
broadca
st entry

Supported

Query
of
electro
nic
labels

Supported

NOTE
a: MPLS tunnel OAM, MPLS PW OAM, MPLS-TP tunnel OAM, MPLS-TP PW OAM, and ETH OAM
share OAM resources.

7.2.4 Working Principle and Signal Flow


The PEX2 consists of the network processing module, transmission management module,
switching network buffering module, CPU management module, logic control module,
temperature and voltage detecting module, clock module, and power module.
Figure 7-6 shows the functional block diagram of the PEX2.

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Figure 1.1 Functional block diagram of the PEX2


Working clock

Modules of the board

Clock
module

IEEE 1588 V2 packet


Synchronous Ethernet clock

2x10GE signals

Backplane
Two system clock signals
PSXCSA
IEEE 1588 V2 packet
PSXCSA
Synchronous Ethernet clock
PSXCSA

Upstream transmission
Service Upstream scheduling Service
module
module
signal
signal
Downstream
Downstream
transmission module
scheduling module
Transmission
Switching network
management module
buffering module
Parallel management bus
Parallel management bus Parallel management
bus
Data backup bus
CPU

Data processing
module
Packet forwarding
module
Network processing
module

Service
signal

management
module

Inter-board communication bus

PSXCSA

GSCC
GSCC

Parallel management bus


Logic control
module

Modules of the board

Temperature and
voltage detecting
signals

Temperature and
voltage detecting
signals
- 48V / - 60V

Power
module

- 48V / - 60V

1.1.1.1.114 Receive Direction


The network processing module receives 2x10GE optical signals, decodes the signals, and
converts the serial signals into parallel signals. Then, the network processing module
performs route searching or address matching for the data packets, and transmits the
corresponding packets to the transmission management module. The transmission
management module buffers and schedules the packets, slices the packets into cells that the
switching network requires, and sends the cells to the switching network buffering module.
The switching network buffering module buffers the cells and sends the cells to the crossconnect unit.

1.1.1.1.115 Transmit Direction


The switching network buffering module processes the cells sent by the cross-connect unit
and sends the cells to the transmission management module. The transmission management
module rearranges the cells to form packets, performs buffering and QoS management for the
packets, and sends the packets to the network processing module. The network processing
module converts the parallel signals into serial signals and sends the signals to the 10xGE
optical interface.

1.1.1.1.116 Network Processing Module


The network processing module performs route searching, address matching, and other
functions for data packets. The network processing module of the PEX2 can process the 20
Gbit/s data packets in full-duplex mode.

1.1.1.1.117 Transmission Management Module


The transmission management module slices packets into cells, and performs QoS
management and large volume buffering for the cells.
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QoS management: The transmission management module provides the scheduling


function at five levels for the flow queue and port queue, and the bandwidth restricting
function, and provides the corresponding statistics information.

Large volume buffering: The transmission management module supports traffic of 20


Gbit/s and can buffer data for 17 ms in both the upstream direction and downstream
direction.

1.1.1.1.118 Switching Network Buffering Module


The switching network buffering module performs cell buffering, queue management,
scheduling, and other functions. This module and the cross-connect unit form a three-level
switching network to switch cells.

1.1.1.1.119 CPU Management Module


The CPU management module provides the parallel management bus, Ethernet bus, and other
buses to manage the modules of the board. The CPU management module also monitors
alarms and performance events and reports the alarms and performance events to the SCC
unit.

1.1.1.1.120 Logic Control Module


The logic control module controls the logic of the PEX2. It performs the following functions:

Decodes the address signals of the peripheral modules, allocates the registers, and
controls the logic.

Reports and controls the board status, for example, the shutdown or startup of the laser.

Controls the logic of the CPU module and decodes the address signals of the CPU
module.

Configures services, queries the performance, and controls alarms.

Implements some clock functions.

1.1.1.1.121 Temperature and Voltage Detecting Module


The temperature and voltage detecting module monitors the temperature and voltage.

1.1.1.1.122 Clock Module


The clock module performs the following functions:

Provides clock signals for each module of the PEX2.

Supports the IEEE 1588v2 clock.

Supports the synchronous Ethernet clock.

1.1.1.1.123 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the PEX2 require.

7.2.5 Front Panel


The front panel of the PEX2 has indicators, interfaces, a bar code, and a laser safety class
label.
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1.1.1.1.124 Diagram of the Front Panel


Figure 7-7 shows the appearance of the front panel of the PEX2.
Figure 1.1 Front panel of the PEX2

PEX2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1

IN1

OUT2

IN2

PEX2

1.1.1.1.125 Indicators

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the Boards.

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1.1.1.1.126 Interfaces
The front panel of the PEX2 has two optical interfaces. Table 7-29 describes the type and
usage of the optical interfaces of the PEX2.
Figure 1.1 Optical interfaces of the PEX2
Interface

Type of Interface

Usage

IN1-IN2

LC (pluggable)

Receives 10GE signals.

OUT1OUT2

LC (pluggable)

Transmits 10GE signals.

7.2.6 Jumpers and DIP Switches


The PEX2 does not have any jumpers or DIP switches that are used for board settings.

7.2.7 Valid Slots


The PEX2 must be installed in a valid slot in the subrack. Otherwise, the PEX2 fails to work
normally.
The following part lists the valid slots of the PEX2 and the corresponding bandwidths:

Slots 1-3, and 16 (2.5 Gbit/s)

Slots 4-6 and 13-15 (5 Gbit/s)

Slots 7 and 12 (10 Gbit/s)

Slots 8 and 11 (20 Gbit/s)


One-slot boards cannot work with cross-connect boards whose logical boards are N1PSXCS.

7.2.8 Feature Code


The PEX2 does not have the feature code.

7.2.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.127 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the
board.
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Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.128 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
Step 7 Required: Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do
not match, packets may be lost or the bit rate may decrease. In the case of large volume
of traffic, services may be completely interrupted.

For details, see Parameter Description.


For more information about the parameters of the board, see 26.1 Packet Processing Boards.

Step 8 Required: Configure services. The following Ethernet services can be configured according
to actual requirements:

Configure the E-line service. For details, see Configuring E-Line Services.

Configure the E-LAN service. For details, see Configuring E-LAN Services.

Step 9 Optional: Configure the OAM:

Configure the MPLS OAM, For details, see Configuring the MPLS OAM and
Configuring PW OAM.

Configure the MPLS-TP OAM, For details, see Configuring MPLS-TP Tunnel OAM and
Configuring MPLS-TP PW OAM.

Step 10 Optional: Configure the MPLS tunnel protection group. For details, see Configuring Tunnel
APS on a Per-NE Basis.
Step 11 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 12 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 13 Optional: Configure the IEEE 1588v2 time and clock. For details, see Configuring the IEEE
1588v2 Time Synchronization and Clock Synchronization.
Step 14 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

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1.1.1.1.129 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.130 Checking the Operation of the Board


Step 1 Required: Check Ethernet services.

Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.

Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.

Step 15 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 16 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

7.2.10 Configuring the Board Functions


The PEX2 supports the packet switching function and provides multiple packet-specific
functions and features, such as HQoS, LAG, and ETH OAM. Configure the functions
according to actual requirements.
You can configure the following packet functions for the PEX2 by using the U2000:

HQoS

ETH OAM

MPLS OAM

MPLS-TP OAM

IGMP Snooping

Inband DCN

LPT

Tunnel APS

PW APS

LAG

MC-LAG

MS-PW

MSTP

7.2.11 Parameter Settings


You can set the parameters for the PEX2 by using the U2000.
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You can set the following parameters for the PEX2 by using the U2000:

Ethernet interface

For information about more parameters and the description of each parameter, see 26.1 Packet
Processing Boards.

7.2.12 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.131 Troubleshooting
Table 7-30 lists the faults that occur on the PEX2 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the PEX2 frequently
Fault Symptom

Common Fault
Cause

Service
troubleshooting

The service is
interrupted.

The service loses


packets or has
errored packets.

The tunnel APS


switching fails.

The PW APS
switching fails.

The MC-LAG
switching fails.

Protection switching
fault

Troubleshooting Method
See Troubleshooting Packet Service
Interruptions.

See Failure of Packet Service Protection


Switching.

1.1.1.1.132 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PEX2, see Replacing a Packet Processing Board.

7.2.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

7.2.13.1 Alarms of N1PEX2


TEMP_OVER

COMMUN_FAIL

TR_LOC

BUS_ERR

NO_BD_SOFT

TEST_STATUS

HARD_BAD

HARD_ERR

POWER_ABNORMAL

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BD_STATUS

PW_NO_TRAFFIC

WRG_BD_TYPE

LSR_NO_FITED

LASER_MOD_ERR

LASER_SHUT

ALM_ALS

LSR_WILL_DIE

IN_PWR_ABN

OUT_PWR_ABN

TEM_HA

TEM_LA

LSR_BCM_ALM

FLOW_OVER

LOOP_ALM

ETH_LOS

ETH_LINK_DOWN

MPLS_TUNNEL_LOCV

MAC_FCS_EXC

FDBSIZEALM_ELAN

MPLS_TUNNEL_MISME
RGE

MPLS_TUNNEL_Excess

MPLS_TUNNEL_MISMATC
H

MPLS_TUNNEL_FDI

MPLS_TUNNEL_UNKN
OWN

MPLS_TUNNEL_BDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

ETH_CFM_UNEXPERI

PW_EXC_TRAFFIC

ETH_CFM_MISMERGE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOPBACK

ETH_EFM_REMFAULT

ETH_EFM_EVENT

ETH_APS_SWITCH_FAIL

ETH_APS_TYPE_MISMA
TCH

ETH_APS_PATH_MISM
ATCH

LAG_DOWN

ETH_APS_LOST

LAG_MEMBER_DOWN

MPLS_PW_MISMATCH

MPLS_PW_LOCV

MPLS_PW_Excess

MPLS_PW_BDI

MPLS_PW_MISMERGE

MPLS_PW_UNKNOWN

MPLS_PW_SD

MCLAG_CFG_MISMATC
H

MPLS_PW_SF

MCSP_PATH_LOCV

LPT_CFG_CLOSEPORT

IN_PWR_HIGH

IN_PWR_LOW

PWAPS_TYPE_MISMATC
H

PWAPS_PATH_MISMAT
CH

PWAPS_SWITCH_FAIL

PWAPS_LOST

ETHOAM_SELF_LOOP

TUNNEL_APS_DEGRADED

PORT_EXC_TRAFFIC

BWUTILIZATION_OVE
R

SRV_SHUTDOWN_LD

MPLS_TUNNEL_OAMFA
IL

MPLS_PW_OAMFAIL

DROPRATIO_OVER

PW_DROPPKT_EXC

ETH_NO_FLOW

TUNNEL_APS_OUTAGE

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7.2.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the NMS.

7.2.14.1 Performance Events of N1PEX2


Figure 1.1 SDH
CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

Figure 1.2 ETH OAM 802.1ag


ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_CSLS

ETH_CFM_UAS

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

Figure 1.3 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Figure 1.4 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATIO
N

TUNNEL_REVERSE_SND
PKTS

TUNNEL_REVERSE_SNDB
YTES

TUNNEL_REVERSE_R
CVPKTS

TUNNEL_REVERSE_RCV
BYTES

TNL_REVERSE_BW_UTILIS
ATION

TUNNEL_RX_BPS

TUNNEL_TX_BPS

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TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_RX_
BPS

TUNNEL_REVERSE_TX_BP
S

TUNNEL_REVERSE_R
X_PPS

TUNNEL_REVERSE_TX_
PPS

Figure 1.5 MPLS PW OAM


MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Figure 1.6 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILISA PW_DROPPKTS
TION

PW_DROPBYTES

PW_RX_BPS

PW_RX_PPS

PW_TX_PPS

PW_TX_BPS

Figure 1.7 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

VUNI_TX_UTILIZATION

VLAN_RCVPKTS

VLAN_RCVBYTES

VLAN_SNDPKTS

VLAN_SNDBYTES

VUNI_SND_DROPPKTS

VUNI_SND_DROPBYTES

VUNI_SND_DROPRATIO

VLAN_RX_BPS

VLAN_TX_BPS

VLAN_RX_PPS

VLAN_TX_PPS

Figure 1.8 Statistics of RMON basic performance


RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHUNDER

ETHOVER

ETHFRG

RXPKT64

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024
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Figure 1.9 Statistics of RMON extended performance


RXPKT1519

TXPKT64

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

PKT64

PKT65

PKT128

PKT256

PKT512

PKT1024

PKT1519

RXUNICAST

TXUNICAST

TXMULCAST

TXBRDCAST

RXPAUSE

ETHFCS

ETHUTILIZ

RXCTLPKTS

TXETHOVER

TXPKTS

TXOCTETS

PORT_RX_BYTES_AVAILABILI
TY

PORT_RX_BW_UTILIZ
ATION

PORT_TX_BW_UTILI
ZATION

TX_DROP_RATIO

RXBPS

TXBPS

RXPPS

TXPPS

Figure 1.10 QoS


QOS_STRM_MATCHPKT
S

QOS_STRM_MATCHBYT
ES

QOS_CARGRNPKTS

QOS_CARGRNBYTES

QOS_CARYLWPKTS

QOS_CARYLWBYTES

QOS_CARREDPKTS

QOS_CARREDBYTES

QOS_CARREDRATIO

FLOW_RX_UTILIZATION

QOS_PRI_DROPPKTS

QOS_PRI_DROPBYTES

PORT_PRI_SNDPKTS

PORT_PRI_SNDBYTES

PWQUEUE_SNDDROPPK
TS

PWQUEUE_SNDDROPBY
TES

PWQUEUE_SNDDROPRA
TIO

TNL_SNDDROPPKTS

TNL_SNDDROPBYTES

TNL_SNDDROPRATIO

TNL_REVERSE_SNDDRO
PPKTS

TNL_REVERSE_SNDDRO
PBYTES

TNL_REVERSE_SNDDRO
PRATIO

VUNIQUEUE_SNDDROPP
KTS

VUNIQUEUE_SNDDROP
BYTES

VUNIQUEUE_SNDDROP
RATIO

VUNIGROUP_SNDDROPP
KTS

VUNIGROUP_SNDDROP
BYTES

VUNIGROUP_SNDDROP
RATIO

QOS_PORTQUEUE_DROP
RATIO

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VUNIGROUP_SNDPKTS

VUNIGROUP_SNDBYTES

VGROUP_TX_UTILIZATI
ON

PORT_PRI_TX_BPS

PORT_PRI_TX_PPS

PWQUEUE_TX_BPS

PWQUEUE_TX_PPS

7.2.15 Technical Specifications of PEX2


The technical specifications of the PEX2 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.133 Parameters Specified for Optical Interfaces


Table 7-41 lists the parameters specified for the optical interfaces of the PEX2.
Figure 1.1 Parameters specified for the optical interfaces of the PEX2
Parameter

Value

Type of interface

10GBASE-LR
(LAN)

10GBASE-ER
(LAN)

10GBASE-ZR
(LAN)

Transmission
distance (km)

10

40

80

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Launched optical
power range (dBm)

-6 to -1

-1 to 2

0 to 4

Operating
wavelength range
(nm)

1260 to 1330

1530 to 1565

1530 to 1565

Minimum overload
(dBm)

0.5

-1

-7

Receiver sensitivity
(dBm)

-11

-15

-24

Minimum extinction
ratio (dB)

8.2

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

30

30

30

Table 7-42 and Table 7-43 lists the parameters specified for the 10GE colored optical
interfaces of the PEX2.

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Figure 1.2 CWDM parameters specified for the colored optical interfaces of the PEX2
Parameter

Value
CWDM

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

70

Launched optical power range


(dBm)

0 to 4

Operating wavelength range


(nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

1451nm to 1551nm: -23

1571nm: -22

1591nm to 1611nm: -21

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

1400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

Figure 1.3 DWDM parameters specified for the colored optical interfaces of the PEX2
Parameter

Value
DWDM

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission
distance (km)

40

80

Launched optical
power range
(dBm)

-1 to 2

-1 to 3

Central frequency
(THz)

192.10 to 196.00

192.10 to 196.00

Central frequency
deviation (GHz)

10

10

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Parameter

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Value
DWDM

Receiver
sensitivity (dBm)

-17

-24

Minimum
overload (dBm)

-1

-9

Maximum
allowed dispersion
(ps/nm)

800

1600

Minimum
extinction ratio
(dB)

9.5

8.2

Maximum -20 dB
spectral width
(nm)

0.3

0.3

Minimum side
mode suppression
ratio (dB)

35

30

1.1.1.1.134 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.135 Mechanical Specifications


The mechanical specifications of the PEX2 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.4

1.1.1.1.136 Power Consumption


The maximum power consumption of the PEX2 at room temperature (25C) is 49 W.

7.3 PEG8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEG8 (8-Port Gigabit Ethernet switching processing board).
This topic also describes how to configure and commission the PEG8

7.3.1 Version Description


The PEG8 is available in one functional version, namely, N1.

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7.3.2 Application
The PEG8 is mainly used in the packet data transmission field to transmit/receive data
packets, manage bandwidths, and realize switching of data packets.
Figure 7-8 shows the typical networking and application of the PEG8. The PEG8 works with
the cross-connect board that provides the packet switching function to meet the requirement
of packet features. With this board, the TDM domain can be overlapped with the packet
domain on the OptiX OSN equipment so that the data can be transmitted in the two domains.
In this manner, an MSTP network can smoothly evolve to a packet switching network.
8.1.2 Application describes the typical networking and application when the PEG8 works with
the PETF8.
8.2.2 Application describes the typical networking and application when the PEG8 works with
the PEFF8.
8.3.2 Application describes the typical networking and application when the PEG8 works with
the CQ1.
8.4.2 Application describes the typical networking and application when the PEG8 works with
the MD12.
8.5.2 Application describes the typical networking and application when the PEG8 works with
the MD75.
Figure 1.1 Networking and application of the PEG8
OptiX OSN 3500/
7500
NMS

OptiX OSN 3500/


7500

OptiX OSN 3500/


7500
PSN
10GE ring

OptiX OSN 1500

OptiX OSN 1500


PSN
GE ring

OptiX OSN 1500

PSN
GE ring
OptiX OSN
3500/7500
OptiX OSN 1500

Traffic direction
FE interface board/FE processing board

GE convergence board

GE processing board

10GE processing board

Dual-domain (TDM domain and packet


domain) cross-connect board
PSN: packet switched network

7.3.3 Functions and Features


PEG8 boards process and forward 8xGE services and support QoS functions such as traffic
management, congestion control, and queue scheduling for data packets.
Table 7-44 lists the functions and features supported by PEG8 boards.
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Figure 1.1 Functions and features supported by PEG8 boards


Funct
ion
and
Featu
re

Description

Basic
functi
ons

Provides eight GE optical/electrical ports on the front panel to receive/transmit


and process 8xGE signals.

Port
types

Supports 1000BASE-SX, 1000BASE-LX, 1000BASE-VX, and 1000BASEZX optical ports. The optical ports use LC connectors and support the
transmission distances of 0.5 km, 10 km, 40 km, and 80 km.

Supports CWDM colored optical ports. The optical ports use LC connectors
and support the transmission distances of 40 km and 80 km.

Supports DWDM colored optical ports. The optical ports use LC connectors
and support the transmission distance of 120 km.

Supports GE electrical ports. The electrical ports use RJ45 connectors and
meet the specifications of the 1000BASE-T physical layer provided in IEEE
802.3.

Functi
ons
when
being
used
with
an
interfa
ce
board

Works with the interface board PETF8/PEFF8/CQ1/MD12/MD75. One PEG8


board can receive/transmit the FE/channelized E1/STM-1 CES services from a
maximum of two interface boards.

Works with the interface board MD12/MD75. One PEG8 board can
receive/transmit the ATM/IMA services from a maximum of two interface
boards.

Port
charac
teristic
s

Pluggab
le
optical/
electrica
l
module

Supports SFP optical/electrical modules.

Singlefiber
bidirecti
onal
optical
module

Supports SFP single-fiber bidirectional optical modules.

Workin
g modes

1000M full-duplex and auto-negotiation for GE optical ports

Flow
control
at ports

Autonegotiation
mode

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Auto-negotiation for GE electrical ports (The negotiation result can


only be 1000M full-duplex.)
Supported

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Funct
ion
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Featu
re

Description

Nonautonegotia
tion mode

Servic
e
specifi
cation
s

Supported

Query/S
etting of
port
status

Supported

Query
of port
types

Supported

Query/S
etting of
optical
power
threshol
ds

Supported

Query/S
etting of
unidirec
tionalmode

Not supported

Processi
ng
capabili
ty

The processing capability varies according to slots.

Service
bearing
modes

MPLS

Supported

QinQ

Supported

Port

Supported

Maximum
number of
PWs

16K

Maximum
number of
MS-PWs

8K

Unidirectio
nal

Number of unidirectional MPLS tunnels (with tunnels


shared):

PW
specific
ations

Tunnel
specific
ations

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7 Packet Processing Boards

When a PEG8 is installed in any slot of slots 1-3 and 16, it


processes 2.5 Gbit/s services in full-duplex mode.

When a PEG8 is installed in any slot of slots 4-6 and 13-15, it


processes 5 Gbit/s services in full-duplex mode.

When working with the N4GSCC: 4K

When working with the N6GSCC: 16K

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Bidirection
al

MTU

Etherne
t service
capabili
ty

Protec
tion
schem
es

7 Packet Processing Boards

Tunnel
APS

Number of bidirectional MPLS tunnels (with tunnels


shared):

When working with the N4GSCC: 2K

When working with the N6GSCC: 8K

MTU for
ports

Supports the setting of the packet length, which ranges


from 960 bytes to 9600 bytes. After the setting becomes
valid, the length of the packets that enter or exit the ports
is restricted by the preset MTU.

MTU for
services

For packet services carried by PWs, PEG8 boards


support the setting of the packet length, which ranges
from 64 bytes to 9600 bytes. For packet services carried
in other modes, PEG8 boards do not support the setting
of the packet length.

E-Line
service

Number of supported E-Line services:

When working with the N4GSCC: 4K

When working with the N6GSCC: 8K

E-LAN
service

Number of supported E-LAN services: 1020

E-AGGR
service

Not supported

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format,


Ethernet II format, or IEEE 802.1q/p format.

Maximum
number of
QinQ links

1K

Jumbo
frame

Supports a jumbo frame with a maximum length of 9600


bytes.

Number of static MAC addresses in E-LAN services: 2K

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended)


tunnel APS in compliance with ITU-T Y.1720 and ITU-T G.8131.
Number of supported tunnel APS protection groups: 1K

PW
APS

Supports the PW FPS (single-ended), 1+1 (single-ended/dual-ended)


and 1:1 (dual-ended) PW APS in compliance with ITU-T Y.1720 and
ITU-T G.8131.
Supports a maximum of 1K PW APS protection groups, and a PW
protection group can bind a maximum of 512 members.
NOTE
PW APS and tunnel APS share the protection resources.

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LAG

Synch
roniza
tion

Maint
enanc
e
featur
es

7 Packet Processing Boards

Supports manual link aggregation and static link aggregation.

Supports the load sharing mode and load non-sharing mode.

Complies with IEEE 802.3ad and IEEE 802.1AX.

MCLAG

Supported, which complies with IEEE 802.3ad and IEEE 802.1AX.

MSTP

Supported, which complies with IEEE 802.1s.

LPT

Point-topoint LPT

Supported

Point-tomultipoint
LPT

Supported

Synchro
nous
Etherne
t Clock

Supports eight channels of synchronous Ethernet clock signals (only by


GE optical ports).

1588v2

Supports eight channels of IEEE 1588v2 time synchronization and


clock synchronization (only by GE optical ports).

ETH
OAM

Ethernet
service
OAMa

Supports CC, LB and LT. These functions comply with


IEEE 802.1ag.
Supports LM and 2DM. These functions comply with
ITU-T Y.1731.
Number of services that support Ethernet OAM (ETH
OAM): 2K

Ethernet
port OAMa

Supports OAM auto-discovery, remote loopback, fault


detection, and link performance monitoring. These
functions comply with IEEE 802.3ah.
Number of ports that support ETH OAM: 2K

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Distribu
ted
MPLS
OAM/C
entraliz
ed
MPLS
OAM

MPLS
tunnel
OAMa

Supports CV, FFD, BDI, FDI, Tunnel ping, and Tunnel


traceroute. These functions comply with ITU-T Y.1711.

MPLS PW
OAMa

Supports CV, FFD, BDI, FDI, PW traceroute, and PW


ping. These functions comply with ITU-T Y.1711.

MPLSTP
OAM

MPLS-TP
tunnel
OAMa

Supports CC, RDI, AIS, LB, LT, LM, 1DM, TST, LCK,
and 2DM. These functions comply with ITU-T G.8113.1.

MPLS-TP

Supports CC, RDI, AIS, LB, LT, LM, 1DM, TST, LCK,

Number of MPLS tunnels that support OAM: 2K

Number of MPLS PWs that support OAM: 2K

Number of tunnels that support MPLS-TP OAM: 2K

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Description

PW OAMa

CSF, and 2DM. These functions comply with ITU-T


G.8113.1.
Number of PWs that support MPLS-TP OAM: 2K

Loopba
ck
capabili
ty

PHY layer
at Ethernet
ports

Not supported

MAC layer
at Ethernet
ports

Supports inloops and outloops.

RMON

Supported

Port
mirrorin
g

Supports ingress mirroring.

Inban
d
DCN

Supported

HQoS

Supports service WRED policies, WFQ policies, PW polices, QinQ polices, VUNI ingress policies, V-UNI egress policies, port policies, port shaping.

IGMP
snoopi
ng

Protoco
l
enablin
g

Supported

Port
aging
time

Supported

Fast
leave

Supported

Discard
ing of
unknow
n
broadca
st
packets

Supported

Static
broadca
st entry

Supported

Query
of
electro
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Supported

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Description

nic
labels
NOTE
a: MPLS tunnel OAM, MPLS PW OAM, MPLS-TP tunnel OAM, MPLS-TP PW OAM, and ETH OAM
share OAM resources.

7.3.4 Working Principle and Signal Flow


The PEG8 consists of the network processing module, transmission management module,
switching network buffering module, CPU management module, clock module, and power
module.
Figure 7-9 shows the functional block diagram of the PEG8.
Figure 1.1 Functional block diagram of the PEG8
Backplane

GE signals

Interface board

IEEE 1588 V2 packet


Interface board
Data processing
module
8xGE signals

Service
signal

Packet forwarding
module
Network processing
module

Upstream
transmission module

Downstream
scheduling module

Transmission
management module

Switching network
buffering module

Parallel management bus

CPU
management
module

Service
signal
PSXCSA

Parallel
management bus

Ethernet communication bus


Inter-board communication bus

GSCC
Other boards

System clock

Working clock
Interface board
Synchronous Ethernet clock
Interface board/Eight GE signals
IEEE 1588 V2 packet
Interface board/Eight GE signals
Modules of the board

Upstream
scheduling module

Downstream
transmission module

Parallel management bus

Modules of the board

Service
signal

Two system clock signals


Clock module

Synchronous Ethernet
clock
IEEE 1588 V2 packet

Power
module

PSXCSA
PSXCSA
PSXCSA
- 48 V / - 60 V
- 48 V / - 60 V

Interface board

1.1.1.1.137 Receive Direction


The network processing module receives the signals sent from the GE interface on the front
panel or the interface board, decodes the signals, and converts the serial signals into parallel
signals. Then, the network processing module performs route searching or address matching
for the data packets, and sends the corresponding packets to the transmission management
module. The transmission management module buffers and schedules the packets, slices the
packets into cells that the switching network requires, and sends the cells to the switching
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network buffering module. The switching network buffering module buffers the cells and
sends the cells to the cross-connect unit.

1.1.1.1.138 Transmit Direction


The switching network buffering module processes the cells sent by the cross-connect unit
and sends the cells to the transmission management module. The transmission management
module rearranges the cells to form packets, performs buffering and QoS management for the
packets, and sends the packets to the network processing module. The network processing
module converts the parallel signals into serial signals, and sends the signals to the GE
interface on the front panel of the board or the corresponding interface board through the
backplane.

1.1.1.1.139 Network Processing Module


The network processing module performs route searching, address matching, and other
functions for data packets. The network processing module of the PEG8 can process 5 Gbit/s
data packets in full-duplex mode.

1.1.1.1.140 Transmission Management Module


The transmission management module slices packets into cells, and performs QoS
management and large volume buffering for the cells.

QoS management: The transmission management module provides the scheduling


function at five levels for the flow queue and port queue, and the bandwidth restricting
function, and provides the corresponding statistics information.

Large volume buffering: The transmission management module supports traffic of 5


Gbit/s and can buffer data for 17 ms in both the upstream direction and downstream
direction.

1.1.1.1.141 Switching Network Buffering Module


The switching network buffering module performs cell buffering, queue management,
scheduling, and other functions. This module and the cross-connect unit form a three-level
switching network to switch cells.

1.1.1.1.142 CPU Management Module


The CPU management module provides the parallel management bus, Ethernet bus, and other
buses to manage the modules of the PEG8 and the interface board to which the PEG8
corresponds. The CPU management module also monitors alarms and performance events and
reports the alarms and performance events to the SCC unit.

1.1.1.1.143 Clock Module


The clock module performs the following functions:

Provides the clock signal for each module of the board.

Supports the transparent transmission of the IEEE 1588v2 packets from the interface
board or the 8xGE signals to the PSXCSA.

Selects a clock source from the two system clocks sent from the PSXCSA and sends the
selected clock to the interface board and the modules of the PEG8.

Selects a clock source from the synchronous Ethernet clock signals accessed by the

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interface board or the 8xGE signals and sends the selected clock to the PSXCSA.

1.1.1.1.144 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.

7.3.5 Front Panel


The front panel of the PEG8 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.145 Diagram of the Front Panel


Figure 7-10 shows the appearance of the front panel of the PEG8.
Figure 1.1 Front panel of the PEG8 with optical interfaces

PEG8
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

TX1
RX1
TX2
RX2
TX3
RX3
TX4
RX4
TX5
RX5
TX6
RX6
TX7
RX7
TX8
RX8

PEG8

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1.1.1.1.146 Indicators

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the Boards.

1.1.1.1.147 Interfaces
The front panel of the PEG8 has eight optical/electrical interfaces. Table 7-45 describes the
type and usage of the interface of the PEG8.
Figure 1.1 Interfaces of the PEG8
Interface

Type of Interface

Usage

RX1-RX8

LC/RJ-45 (pluggable)

Receives GE signals.

TX1-TX8

LC/RJ-45 (pluggable)

Transmits GE signals.

7.3.6 Jumpers and DIP Switches


The PEG8 does not have any jumpers or DIP switches that are used for board settings.

7.3.7 Valid Slots


The PEG8 must be installed in a valid slot in the subrack. Otherwise, the PEG8 fails to work
normally.
The PEG8 can be installed in slots 16, and 1316 in the subrack.

When the PEG8 is installed in slots 1-3, and 16, the bandwidth is 2.5 Gbit/s.

When the PEG8 is installed in slots 4-6 and 13-15, the bandwidth is 5 Gbit/s.

When the PEG8 works with the interface board PETF8/PEFF8/CQ1/MD12/MD75, one PEG8
can work with a maximum of two PETF8/PEFF8/CQ1/MD12/MD75 boards. In this case, all
the optical interfaces on the PEG8 can be used. Table 7-46 lists the slots valid for the PEG8
and the corresponding slots for the interface boards.
Figure 1.2 Slots valid for the PEG8 and the corresponding slots for the interface board
Slot Valid for the PEG8

Corresponding Slot for the Interface Board

Slot 1

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

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Slot Valid for the PEG8

Corresponding Slot for the Interface Board

Slot 6

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

One-slot boards cannot work with cross-connect boards whose logical boards are N1PSXCS.

7.3.8 Feature Code


The PEG8 does not have the feature code.

7.3.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.148 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
interface board and the cable match the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.149 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
Step 7 Required: Set the Ethernet interface as follows:

Issue 02 (2013-01-18)

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port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do
not match, packets may be lost or the bit rate may decrease. In the case of large volume
of traffic, services may be completely interrupted.

For details, see Parameter Description.


For more information about the parameters of the board, see 26.1 Packet Processing Boards.

Step 8 Required: Configure services. The following services can be configured according to actual
requirements:

Configure the E-line service. For details, see Configuring E-Line Services.

Configure the E-LAN service. For details, see Configuring E-LAN Services.

Configure ATM/IMA service. For details, see Configuring ATM Services

Step 9 Optional: Configure the OAM:

Configure the MPLS OAM, For details, see Configuring the MPLS OAM and
Configuring PW OAM.

Configure the MPLS-TP OAM, For details, see Configuring MPLS-TP Tunnel OAM and
Configuring MPLS-TP PW OAM.

Step 10 Optional: Configure the MPLS tunnel protection group. For details, see Configuring Tunnel
APS on a Per-NE Basis.
Step 11 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 12 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 13 Optional: Configure the IEEE 1588v2 time and clock. For details, see Configuring the IEEE
1588v2 Time Synchronization and Clock Synchronization.
Step 14 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

1.1.1.1.150 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
Step 15 Required: Test the ATM/IMA service. For details, see Testing ATM Services.
----End

1.1.1.1.151 Checking the Operation of the Board


Step 1 Required: Check Ethernet services.

Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.

Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.

Step 16 Required: Check the status of the indicators on the front panel of the board to ensure that the
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board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 17 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

7.3.10 Configuring the Board Functions


The PEG8 supports the packet switching function and provides multiple packet-specific
functions and features, such as HQoS, LAG, and ETH OAM. Configure the functions
according to actual requirements.
You can configure the following packet functions for the PEG8 by using the U2000:

HQoS

ETH OAM

MPLS OAM

MPLS-TP OAM

IGMP Snooping

Inband DCN

LPT

Tunnel APS

PW APS

LAG

MC-LAG

MS-PW

MSTP

7.3.11 Parameter Settings


You can set the parameters for the PEG8 by using the U2000.
You can set the following parameters for the PEG8 by using the U2000:

Ethernet interface

For information about more parameters and the description of each parameter, see 26.1 Packet
Processing Boards.

7.3.12 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.152 Troubleshooting
Table 7-47 lists the faults that occur on the PEG8 frequently and the troubleshooting methods.
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Figure 1.1 Methods used to troubleshoot the faults that occur on the PEG8 frequently
Fault Symptom

Common Fault
Cause

Service
troubleshooting

The service is
interrupted.

The service loses


packets or has
errored packets.

The tunnel APS


switching fails.

The PW APS
switching fails.

The MC-LAG
switching fails.

Protection switching
fault

Troubleshooting Method
See Troubleshooting Packet Service
Interruptions.

See Failure of Packet Service Protection


Switching.

1.1.1.1.153 Replacing the Optical/Electrical Module


The OptiX OSN equipment supports pluggable optical/electrical modules. If an
optical/electrical module is faulty, replace only the faulty optical/electrical module instead of
the associated board.
For information on how to replace an optical/electrical module, see Replacing a Pluggable
Optical/Electrical Module.

1.1.1.1.154 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PEG8, see Replacing a Packet Processing Board.

7.3.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

7.3.13.1 Alarms of N1PEG8


TEMP_OVER

COMMUN_FAIL

TR_LOC

BUS_ERR

NO_BD_SOFT

TEST_STATUS

HARD_BAD

HARD_ERR

POWER_ABNORMAL

BD_STATUS

PW_NO_TRAFFIC

WRG_BD_TYPE

LSR_NO_FITED

LASER_MOD_ERR

LASER_SHUT

ALM_ALS

LSR_WILL_DIE

IN_PWR_ABN

OUT_PWR_ABN

TEM_HA

TEM_LA

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LSR_BCM_ALM

FLOW_OVER

LOOP_ALM

ETH_LOS

ETH_LINK_DOWN

MPLS_TUNNEL_LOCV

MAC_FCS_EXC

FDBSIZEALM_ELAN

MPLS_TUNNEL_MISME
RGE

MPLS_TUNNEL_Excess

MPLS_TUNNEL_MISMATC
H

MPLS_TUNNEL_FDI

MPLS_TUNNEL_UNKN
OWN

MPLS_TUNNEL_BDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

ETH_CFM_UNEXPERI

PW_EXC_TRAFFIC

ETH_CFM_MISMERGE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOPBACK

ETH_EFM_REMFAULT

ETH_EFM_EVENT

ETH_APS_SWITCH_FAIL

ETH_APS_TYPE_MISMA
TCH

ETH_APS_PATH_MISM
ATCH

LAG_DOWN

ETH_APS_LOST

LAG_MEMBER_DOWN

MPLS_PW_MISMATCH

MPLS_PW_LOCV

MPLS_PW_Excess

MPLS_PW_BDI

MPLS_PW_MISMERGE

MPLS_PW_UNKNOWN

MPLS_PW_SD

MCLAG_CFG_MISMATC
H

MPLS_PW_SF

MCSP_PATH_LOCV

LPT_CFG_CLOSEPORT

IN_PWR_HIGH

IN_PWR_LOW

PWAPS_TYPE_MISMATC
H

PWAPS_PATH_MISMAT
CH

PWAPS_SWITCH_FAIL

PWAPS_LOST

ETHOAM_SELF_LOOP

TUNNEL_APS_DEGRADED

PORT_EXC_TRAFFIC

BWUTILIZATION_OVE
R

SRV_SHUTDOWN_LD

MPLS_TUNNEL_OAMFA
IL

MPLS_PW_OAMFAIL

DROPRATIO_OVER

PW_DROPPKT_EXC

ETH_NO_FLOW

TUNNEL_APS_OUTAGE

7.3.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the NMS.

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7.3.14.1 Performance Events of N1PEG8


Figure 1.1 SDH
CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

Figure 1.2 ETH OAM 802.1ag


ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_CSLS

ETH_CFM_UAS

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

Figure 1.3 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Figure 1.4 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATION

TUNNEL_REVERSE_SND
PKTS

TUNNEL_REVERSE_SND
BYTES

TUNNEL_REVERSE_RC
VPKTS

TUNNEL_REVERSE_RCV
BYTES

TNL_REVERSE_BW_UTI
LISATION

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_RX_
BPS

TUNNEL_REVERSE_TX_
BPS

TUNNEL_REVERSE_RX_
PPS

TUNNEL_REVERSE_TX_
PPS

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Figure 1.5 MPLS PW OAM


MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Figure 1.6 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILISA PW_DROPPKTS
TION

PW_DROPBYTES

PW_RX_BPS

PW_RX_PPS

PW_TX_PPS

PW_TX_BPS

Figure 1.7 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

VUNI_TX_UTILIZATION

VLAN_RCVPKTS

VLAN_RCVBYTES

VLAN_SNDPKTS

VLAN_SNDBYTES

VUNI_SND_DROPPKTS

VUNI_SND_DROPBYTES

VUNI_SND_DROPRATIO

VLAN_RX_BPS

VLAN_TX_BPS

VLAN_RX_PPS

VLAN_TX_PPS

Figure 1.8 Statistics of RMON basic performance


RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHUNDER

ETHOVER

ETHFRG

ETHJAB

RXPKT64

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

Figure 1.9 Statistics of RMON extended performance


RXPKT1519
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TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

PKT64

PKT65

PKT128

PKT256

PKT512

PKT1024

PKT1519

TXMULCAST

TXBRDCAST

RXPAUSE

ETHALI

ETHFCS

ETHUTILIZ

RXCTLPKTS

TXPKTS

TXOCTETS

PORT_RX_BYTES_AVAILABILI
TY

PORT_RX_BW_UTILIZ
ATION

PORT_TX_BW_UTILI
ZATION

TX_DROP_RATIO

RXBPS

TXBPS

RXPPS

TXPPS

Figure 1.10 QoS


QOS_STRM_MATCHPKT
S

QOS_STRM_MATCHBYT
ES

QOS_CARGRNPKTS

QOS_CARGRNBYTES

QOS_CARYLWPKTS

QOS_CARYLWBYTES

QOS_CARREDPKTS

QOS_CARREDBYTES

QOS_CARREDRATIO

FLOW_RX_UTILIZATION

QOS_PRI_DROPPKTS

QOS_PRI_DROPBYTES

PORT_PRI_SNDPKTS

PORT_PRI_SNDBYTES

PWQUEUE_SNDDROPPK
TS

PWQUEUE_SNDDROPBY
TES

PWQUEUE_SNDDROPRA
TIO

TNL_SNDDROPPKTS

TNL_SNDDROPBYTES

TNL_SNDDROPRATIO

TNL_REVERSE_SNDDRO
PPKTS

TNL_REVERSE_SNDDRO
PBYTES

TNL_REVERSE_SNDDRO
PRATIO

VUNIQUEUE_SNDDROPP
KTS

VUNIQUEUE_SNDDROP
BYTES

VUNIQUEUE_SNDDROP
RATIO

VUNIGROUP_SNDDROPP
KTS

VUNIGROUP_SNDDROP
BYTES

VUNIGROUP_SNDDROP
RATIO

QOS_PORTQUEUE_DROP
RATIO

VUNIGROUP_SNDPKTS

VUNIGROUP_SNDBYTES

VGROUP_TX_UTILIZATI
ON

PORT_PRI_TX_BPS

PORT_PRI_TX_PPS

PWQUEUE_TX_BPS

PWQUEUE_TX_PPS

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7.3.15 Technical Specifications of PEG8


The technical specifications of the PEG8 include the Ethernet performance specifications,
laser safety class, parameters specified for optical interfaces, mechanical specifications, and
power consumption.

1.1.1.1.155 Parameters Specified for Optical Interfaces


Table 7-58 lists the parameters specified for the optical interfaces of the PEG8.
Figure 1.1 Parameters specified for the optical interfaces of the PEG8
Parameter

Value

Type of
interface

1000BASE-SX

1000BASE-LX

1000BASEVX

1000BASE-ZX

Transmission
distance (km)

0.5

10

40

80

Type of fiber

Multi-mode LC

Single-mode LC

Single-mode
LC

Single-mode LC

Launched
optical power
range (dBm)

-9.5 to -2.5

-9 to -3

-5 to 0

-2 to 5

Operating
wavelength
range (nm)

770 to 860

1270 to 1355

1270 to 1355

1500 to 1580

Minimum
overload
(dBm)

-3

-3

-3

Receiver
sensitivity
(dBm)

-17

-20

-23

-23

Minimum
extinction ratio
(dB)

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

Table 7-59 lists the parameters specified for the single-fiber bidirectional optical interfaces of
the PEG8.

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Figure 1.2 Parameters specified for the single-fiber bidirectional optical interfaces of the PEG8
Parameter

Value

Type of
interface

1000BASELX

1000BASE-LX

1000BASE-VX

1000BASE-VX

Transmissi
on distance
(km)

10

10

40

40

Type of
fiber

Single-mode
LC

Single-mode LC

Single-mode LC

Single-mode LC

Operating
transmit
wavelength
(nm)

1490

1310

1490

1310

Operating
receive
wavelength
(nm)

1310

1490

1310

1490

Launched
optical
power
range
(dBm)

-9 to -3

-9 to -3

-2 to 3

-2 to 3

Receiver
sensitivity
(dBm)

-19.5

-19.5

-23

-23

Minimum
overload
(dBm)

-3

-3

Minimum
extinction
ratio (dB)

Table 7-60 and Table 7-61 lists the parameters specified for the GE colored optical interfaces
of the PEG8.
Figure 1.3 CWDM parameters specified for the colored optical interfaces of the PEG8
Parameter

Value
CWDM

Nominal bit rate

1250000 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

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Parameter

7 Packet Processing Boards

Value
CWDM

Launched optical power range


(dBm)

0 to 5

0 to 5

Operating wavelength range


(nm)

1471 to 1611, in steps of


20

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-19

-28

Minimum overload (dBm)

-3

-9

Maximum allowed dispersion


(ps/nm)

800

1600

Minimum extinction ratio (dB)

8.2

8.2

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

30

Figure 1.4 DWDM parameters specified for the colored optical interfaces of the PEG8
Parameter

Value
DWDM

Nominal bit rate

1250000 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.1 to 196.0

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

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Parameter

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Value
DWDM

Minimum side mode


suppression ratio (dB)

30

1.1.1.1.156 Parameters Specified for Electrical Interfaces


Table 7-62 lists the parameters specified for the electrical interfaces of the PEG8.
Figure 1.1 Parameters specified for the electrical interfaces of the PEG8
Parameter

Value

Nominal bit rate

1000 Mbit/s

Code pattern

4D-PAM5

Type of interface

RJ-45

1.1.1.1.157 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.158 Mechanical Specifications


The mechanical specifications of the PEG8 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.2

1.1.1.1.159 Power Consumption


The maximum power consumption of the PEG8 at room temperature (25C) is 47 W.

7.4 PEG16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEG16 (16xGE Ethernet processing board). This topic also
describes how to configure and commission the PEG16.

7.4.1 Version Description


The PEG16 is available in one functional version, namely, N1. The PEG16 is discontinued.

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7.4.2 Application
The PEG16 is mainly used in the packet data transmission field to transmit/receive data
packets, manage bandwidths, and realize switching and aggregation of data packets.
Figure 7-11 shows the typical networking and application when the PEG16 works with the
other boards on the network. The PEG16 works with the cross-connect board that provides the
packet switching function to meet the requirement of packet features. With this board, the
TDM domain can be overlapped with the packet domain on the OptiX OSN equipment to
transmit data in the two domains. In this way, the equipment realizes the smooth evolution
from the MSTP network to the packet switching network.
For the typical networking and application when the PEG16 works with the PETF8, see 8.1.2
Application.
Figure 1.1 Networking and application of the PEG16
OptiX OSN 3500/
7500
NMS

OptiX OSN 3500/


7500

OptiX OSN 3500/


7500
PSN
10GE ring

OptiX OSN 1500

OptiX OSN 1500


PSN
GE ring

OptiX OSN 1500

PSN
GE ring
OptiX OSN
3500/7500
OptiX OSN 1500

Traffic direction
FE interface board/FE processing board

GE convergence board

GE processing board

10GE processing board

Dual-domain (TDM domain and packet


domain) cross-connect board
PSN: packet switched network

7.4.3 Functions and Features


PEG16 boards receive/transmit and forward 16xGE services, and support the QoS functions
such as traffic measurement, congestion control, and queue scheduling for data packets.
Table 7-63

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Figure 1.1 Functions and features supported by PEG16 boards


Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 16xGE services.

Port
types

Supports 1000BASE-SX, 1000BASE-LX, 1000BASE-VX, and 1000BASEZX optical ports. The optical ports use LC connectors and support the
transmission distances of 0.5 km, 10 km, 40 km, and 80 km.

Supports CWDM colored optical ports. The optical ports use LC connectors
and support the transmission distance of 40 km.

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides ports on the front panel or works with the interface board PETF8. One
PEG16 board can receive/transmit the FE services of a maximum of two interface
boards.

Port
charac
teristic
s

Pluggab
le
optical
module

Supports SFP optical modules.

Singlefiber
bidirecti
onal
optical
module

Not supported

Workin
g modes

Full-duplex and auto-negotiation for GE ports

Flow
control
at ports

Autonegotiation
mode

Not supported

Nonautonegotia
tion mode

Not supported

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Query/S
etting of
port
status

Supported

Query

Supported
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ion
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Featu
re

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Description

of port
types

Servic
e
specifi
cation
s

Query/S
etting of
optical
power
threshol
ds

The setting of input optical power thresholds is supported.

Query/S
etting of
unidirec
tionalmode

Not supported

Processi
ng
capabili
ty

Processes 10 Gbit/s services in full-duplex mode.

Service
bearing
modes

MPLS

Supported

QinQ

Supported

Port

Supported

Maximum
number of
PWs

16K

Maximum
number of
MS-PWs

8K

Tunnel
specific
ations

Unidirectio
nal

Number of unidirectional MPLS tunnels (with tunnels


shared): 4K

Bidirection
al

Number of bidirectional MPLS tunnels (with tunnels


shared): 2K

MTU

MTU for
ports

Supports the setting of the packet length, which ranges


from 960 bytes to 9600 bytes. After the setting becomes
valid, the length of the packets that enter or exit the ports
is restricted by the preset MTU.

MTU for
services

Supports the setting of the packet length, which ranges


from 64 bytes to 9000 bytes.

E-Line
service

Number of supported E-Line services:

PW
specific
ations

Ethernet
service

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When working with the N4GSCC: 4K

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Funct
ion
and
Featu
re

Description

capabili
ty

Protec
tion
schem
es

Synch
roniza
tion

Maint
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Tunnel
APS

When working with the N6GSCC: 8K

E-LAN
service

Number of supported E-LAN services: 1020.

E-AGGR
service

4, each of which supports 127 leaf ports

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format,


Ethernet II format, or IEEE 802.1q/p format.

Maximum
number of
QinQ links

1K

Jumbo
frame

Supports a jumbo frame with a maximum length of 9000


bytes.

Number of static MAC addresses in E-LAN services:


2K.

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended)


tunnel APS in compliance with ITU-T Y.1720 and ITU-T G.8131.
Number of supported Tunnel APS protection groups:1K

PW
APS

Not supported

LAG

Supports manual link aggregation and static link aggregation.

Supports the load sharing mode and load non-sharing mode.

Complies with IEEE 802.3ad and IEEE 802.1AX.

MCLAG

Not supported

MSTP

Not supported

LPT

Point-topoint LPT

Supported

Point-tomultipoint
LPT

Supported

Synchro
nous
Ethernet
Clock

Provides two GE optical ports (only by the first two optical ports) that
support the synchronous Ethernet clock feature.

IEEE
1588v2

Not supported

ETH

Ethernet

Supports CC, LB and LT. These functions comply with

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Funct
ion
and
Featu
re

Description

enanc
e
featur
es

OAM

service
OAMa

7 Packet Processing Boards

IEEE 802.1ag.
Supports LM and 2DM. These functions comply with
ITU-T Y.1731.
Number of services that support Ethernet OAM (ETH
OAM): 2K

Ethernet
port OAMa

Supports OAM auto-discovery, remote loopback, fault


detection, and link performance monitoring. These
functions comply with IEEE 802.3ah.
Number of ports that support ETH OAM: 2K

Distribu
ted
MPLS
OAM/C
entraliz
ed
MPLS
OAM

MPLS
tunnel
OAMa

Supports CV, FFD, BDI, FDI, Tunnel ping, and Tunnel


traceroute. These functions comply with ITU-T Y.1711.

MPLS PW
OAM

Not supported

MPLS-TP
tunnel
OAM

Not supported

MPLS-TP
PW OAM

Not supported

Loopba
ck
capabili
ty

PHY layer
at Ethernet
ports

Supports inloops and outloops.

MAC layer
at Ethernet
ports

Supports inloops.

RMON

Supported

Port
mirrorin
g

Not supported

Number of MPLS tunnels that support OAM: 2K

NOTE
PEG16
boards
support
only
distribu
ted
MPLS
OAM.

MPLSTP
OAM

Inban
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Funct
ion
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Featu
re

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Description

d
DCN
HQoS

Supports service WRED policies, WFQ policies, PW polices, QinQ polices, VUNI ingress policies, V-UNI egress policies, port policies.

IGMP
snoopi
ng

Protocol
enablin
g

Supported

Port
aging
time

Supported

Fast
leave

Supported

Discardi
ng of
unknow
n
broadca
st
packets

Supported

Static
broadca
st entry

Supported

Query
of
electro
nic
labels

Supported

NOTE
For MPLS tunnel OAM and ETH OAM share OAM resources.

7.4.4 Working Principle and Signal Flow


The PEG16 consists of the network processing module, transmission management module,
switching network buffering module, CPU management module, clock module, and power
module.
Figure 7-12 shows the functional block diagram of the PEG16.

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Figure 1.1 Functional block diagram of the PEG16


Backplane

GE signals

Interface board

IEEE 1588 V2 packet


Interface board
Data processing
module
16xGE signals

Service Upstream transmission


module
signal

Service
signal

Upstream
scheduling module

Packet forwarding
module

Downstream
transmission module

Downstream
scheduling module

Network processing
module

Transmission
management module

Switching network
buffering module

Parallel management bus

Parallel management bus

Service
signal
PSXCSA

Parallel
management bus

Ethernet communication bus


CPU management

module
Modules of the board

Other boards

System clock

Working clock
Interface board
Synchronous Ethernet clock
Interface board/First two GE signals
IEEE 1588 V2 packet
Interface board/First two GE signals
Modules of the board

GSCC

Inter-board communication bus

Two system clock signals


Clock module

PSXCSA

Synchronous Ethernet
clock

PSXCSA
PSXCSA

IEEE 1588 V2 packet

Power
module

- 48 V / - 60 V
- 48 V / - 60 V

Interface board

1.1.1.1.160 Receive Direction


The network processing module receives the signals sent from the GE interface on the front
panel or the interface board, decodes the signals, and converts the serial signals into parallel
signals. Then, the network processing module performs route searching or address matching
for the data packets, and sends the corresponding packets to the transmission management
module. The transmission management module buffers and grooms the packets, slices the
packets into cells that the switching network requires, and sends the cells to the switching
network buffering module. The switching network buffering module buffers the cells and
sends the cells to the cross-connect unit.

1.1.1.1.161 Transmit Direction


The switching network buffering module processes the cells sent by the cross-connect unit
and sends the cells to the transmission management module. The transmission management
module rearranges the cells to form packets, performs buffering and QoS management for the
packets, and sends the packets to the network processing module. The network processing
module converts the parallel signals into serial signals, and sends the signals to the GE
interface on the front panel of the PEG16 or the corresponding interface board through the
backplane.

1.1.1.1.162 Network Processing Module


The network processing module performs route searching, address matching, and other
functions for data packets. The network processing module of the PEG16 can process the 10
Gbit/s data packets in full-duplex mode.

1.1.1.1.163 Transmission Management Module


The transmission management module slices packets into cells, and performs QoS
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management and large volume buffering for the cells.

QoS management: The transmission management module provides the scheduling


function at five levels including the flow queue and port queue, the bandwidth restricting
function, and the corresponding statistical information.

Large volume buffering: The transmission management module supports traffic of 10


Gbit/s and can buffer data for 17 ms in both the upstream direction and downstream
direction.

1.1.1.1.164 Switching Network Buffering Module


The switching network buffering module performs cell buffering, queue management,
scheduling, and other functions. This module and the cross-connect unit form a three-level
switching network to switch cells.

1.1.1.1.165 CPU Management Module


The CPU management module provides the parallel management bus, Ethernet bus, and other
buses to manage the modules of the PEG16 and the interface board to which the PEG16
corresponds. The CPU management module also monitors alarms and performance events and
reports the alarms and performance events to the SCC unit.

1.1.1.1.166 Clock Module


The clock module performs the following functions:

Provides the clock signal for each module of the PEG16.

Supports the transparent transmission of the IEEE 1588v2 packets from the interface
board or the first two channels of GE signals to the PSXCS.

Selects a clock source from the two system clocks sent from the PSXCS and sends the
selected clock to the interface board and the modules of the PEG16.

Selects a clock source from the synchronous Ethernet clock signals accessed by the
interface board or the first two channels of GE signals and sends the selected clock to the
PSXCS.

1.1.1.1.167 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the PEG16 require.

7.4.5 Front Panel


The front panel of the PEG16 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.168 Diagram of the Front Panel


Figure 7-13 shows the appearance of the front panel of the PEG16.

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Figure 1.1 Front panel of the PEG16

PEG16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT9
OUT1
IN9 OUT10 IN10 OUT11 IN11 OUT12 IN12
IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4
OUT1
OUT13 IN13 OUT14 IN14
IN15 OUT16 IN16
5
OUT5 IN5
OUT6 IN6 OUT7 IN7 OUT8 IN8

PEG16

1.1.1.1.169 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the Boards.

1.1.1.1.170 Interfaces
The front panel of the PEG16 has sixteen GE optical interfaces. Table 7-64 describes the
types and usage of the optical interfaces of the PEG16.

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Figure 1.1 Optical interfaces of the PEG16


Interface

Type of Interface

Usage

IN1IN16

LC (pluggable)

Receives GE signals.

OUT1
OUT16

LC (pluggable)

Transmits GE signals.

7.4.6 Jumpers and DIP Switches


The PEG16 does not have any jumpers or DIP switches that are used for board settings.

7.4.7 Valid Slots


The PEG16 occupies two slots and can be installed in any two adjacent slots among slots 16
and 1316. The PEG16 slot displayed on the is the slot that has a smaller slot number
between the two slots that house the PEG16. For example, if the PEG16 is installed in slots 1
and 2, the PEG16 slot displayed on the is slot 1.
When the PEG16 works with the interface board PETF8, one PEG16 board can work with a
maximum of two PETF8 boards. In this case, all the optical interfaces on the PEG16 can be
used. Table 7-65 lists the slots valid for the PEG16 and the corresponding slots for the PETF8.
Figure 1.2 Slots valid for the PEG16 and the corresponding slots for the PETF8
Slot Valid for the
PEG16

Corresponding Logical Slot

Corresponding Slot for the


PETF8

Slots 1 and 2

Slot 1

Slots 3 and 4

Slot 3

Slots 21 and 22

Slots 5 and 6

Slot 5

Slots 25 and 26

Slots 13 and 14

Slot 13

Slots 29 and 30

Slots 15 and 16

Slot 15

Slots 33 and 34

Two-slot boards can work only with cross-connect boards whose logical boards are N1PSXCS.

The dual-slot board PEG16 cannot be configured together with the single-slot board
N2PEX1/N1PEX2/PEG8.

When working with the cross-connect board N1PSXCS and the EDQ41 board, the dual-slot board
PEG16 cannot be housed in slot 1 or slot 15.

7.4.8 Feature Code


The PEG16 does not have the feature code.

7.4.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
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board, commissioning the board, and checking the operation of the board.

1.1.1.1.171 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
interface board and the cable match the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.172 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
Step 7 Required: Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do
not match, packets may be lost or the bit rate may decrease. In the case of large volume
of traffic, services may be completely interrupted.

For details, see Parameter Description.


For more information about the parameters of the board, see 26.1 Packet Processing Boards.

Step 8 Required: Configure services. The following Ethernet services can be configured according
to actual requirements:

Configure the E-line service. For details, see Configuring E-Line Services.

Configure the E-LAN service. For details, see Configuring E-LAN Services.

Configure the E-AGGR service. For details, see Configuring E-AGGR Services.

Step 9 Optional: Configure the MPLS OAM. For details, see Configuring the MPLS OAM.
Step 10 Optional: Configure the MPLS tunnel protection group. For details, see Configuring Tunnel
APS on a Per-NE Basis.
Step 11 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
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Step 12 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 13 Optional: Configure the IEEE 1588v2 time and clock. For details, see Configuring the IEEE
1588v2 Time Synchronization and Clock Synchronization.
Step 14 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

1.1.1.1.173 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.174 Checking the Operation of the Board


Step 1 Required: Check Ethernet services.

Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.

Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.

Check the E-AGGR service. For details, see Verifying the Correctness of E-AGGR
Service Configuration.

Step 15 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 16 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

7.4.10 Configuring the Board Functions


The PEG16 supports the packet switching function and provides multiple packet switchingspecific functions and features, such as HQoS, LAG, and ETH OAM. Configure the functions
according to actual requirements.
You can configure the following packet switching functions for the PEG16 by using the
U2000:

HQoS

ETH OAM

MPLS OAM

IGMP Snooping

Inband DCN

LPT

Tunnel APS

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LAG

MS-PW

7 Packet Processing Boards

7.4.11 Parameter Settings


You can set parameters for the PEG16 by using the U2000.

1.1.1.1.175 Displayed Slots


The PEG16 occupies two slots in the subrack. The logical slot of the PEG16 displayed on the
U2000 is the slot that has a smaller slot number between the two slots that house the PEG16.
For the logical slots of the PEG16 displayed on the U2000, refer to Table 7-65.

1.1.1.1.176 Board Parameters


You can set the following principal parameter for the PEG16 by using the U2000:

Ethernet interface

For more parameters and the description of the parameters, see 26.1 Packet Processing
Boards.

7.4.12 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.177 Troubleshooting
Table 7-66 lists the faults that occur on the PEG16 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the PEG16 frequently
Fault Symptom

Common Fault
Cause

Service
troubleshooting

The service is
interrupted.

The service loses


packets or has
errored packets.

Protection switching
fault

The MPLS APS


switching fails.

Troubleshooting Method
See Troubleshooting Packet Service
Interruptions.

See Troubleshooting.

1.1.1.1.178 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PEG16, see Replacing a Packet Processing Board.
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7.4.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

7.4.13.1 Alarms of N1PEG16


ALM_ALS

BD_STATUS

ETH_APS_LOST

BUS_ERR

COMMUN_FAIL

ETH_APS_TYPE_MISMATC
H

ETH_APS_PATH_MISMATCH

ETH_APS_SWIT
CH_FAIL

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_LOC

ETH_EFM_DF

ETH_EFM_EVENT

ETH_CFM_UNE
XPERI

ETH_EFM_REMFAULT

ETH_LINK_DOWN

ETH_EFM_LOO
PBACK

FDBSIZEALM_ELAN

FLOW_OVER

ETH_LOS

HARD_BAD

HARD_ERR

IN_PWR_ABN

LAG_DOWN

LAG_MEMBER_DOWN

LASER_MOD_E
RR

LASER_SHUT

LOOP_ALM

LSR_BCM_ALM

LSR_NO_FITED

LSR_WILL_DIE

MAC_FCS_EXC

MPLS_TUNNEL_BDI

MPLS_TUNNEL_Excess

MPLS_TUNNEL
_FDI

MPLS_TUNNEL_LOCV

MPLS_TUNNEL_MISMATCH

MPLS_TUNNEL
_MISMERGE

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

MPLS_TUNNEL
_UNKNOWN

NO_BD_SOFT

POWER_ABNORMAL

TEMP_OVER

PW_EXC_TRAFFIC

OUT_PWR_ABN

TEST_STATUS

TEM_HA

TEM_LA

PW_NO_TRAFF
IC

W_OFFLINE

TR_LOC

IN_PWR_LOW

LPT_CFG_CLOSEPORT

WRG_BD_TYPE

IN_PWR_HIGH

ETHOAM_SELF_LOOP

TUNNEL_APS_DEGRADED

TUNNEL_APS_
OUTAGE

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7.4.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

7.4.14.1 Performance Events of N1PEG16


Figure 1.1 SDH
BDTEMPCUR

BDTEMPMAX

BDTEMPMIN

CPUUSAGECUR

CPUUSAGEMAX

CPUUSAGEMIN

MEMUSAGECUR

MEMUSAGEMAX

MEMUSAGEMIN

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_UAS

ETH_CFM_CSLS

Figure 1.2 ETH OAM 802.1ag

Figure 1.3 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Figure 1.4 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TUNNEL_REVERSE_SN
DPKTS

TUNNEL_REVERSE_SNDB
YTES

TUNNEL_REVERSE_RC
VPKTS

TUNNEL_REVERSE_RC
VBYTES

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_TX_

TUNNEL_REVERSE_RX_

TUNNEL_REVERSE_TX_P

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BPS

7 Packet Processing Boards

PPS

PS

TUNNEL_REVERSE_RX
_BPS

Figure 1.5 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILISATI
ON

PW_RX_BPS

PW_TX_BPS

PW_RX_PPS

PW_TX_PPS

Figure 1.6 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

Figure 1.7 Statistics of RMON basic performance


RXPKTS

RXOCTETS

RXBRDCAST

RXMULCAST

RXPKT64

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

ETHUNDER

ETHJAB

ETHOVER

Figure 1.8 Statistics of RMON extended performance


TXPKTS

TXOCTETS

TXBGOOD

TXUNICAST

TXBRDCAST

TXMULCAST

TXPKT64

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

TXDEFFRM

RXBGOOD

RXUNICAST

RXPAUSE

RXPKT1519

PKT64

PKT65

PKT128

PKT256

PKT512

PKT1024

PKT1519

ETHFCS

ETHCARERR

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ETHLATECOL

ETHEXCCOL

ETHMULCOL

ETHUNICOL

PORT_RX_BYTES_AV
AILABILITY

RXBPS

TXBPS

RXPPS

TXPPS

7.4.15 Technical Specifications of PEG16


The technical specifications of the PEG16 include the Ethernet performance specifications,
laser safety class, parameters specified for optical interfaces, mechanical specifications, and
power consumption.

1.1.1.1.179 Parameters Specified for Optical Interfaces


Table 7-75 lists the parameters specified for the optical interfaces of the PEG16.
Figure 1.1 Parameters specified for the optical interfaces of the PEG16
Parameter

Value

Type of
interface

1000BASE-SX

1000BASE-LX

1000BASEVX

1000BASE-ZX

Transmission
distance (km)

0.5

10

40

80

Type of fiber

Multi-mode LC

Single-mode LC

Single-mode
LC

Single-mode LC

Launched
optical power
range (dBm)

-9.5 to -2.5

-9 to -3

-5 to 0

-2 to 5

Operating
wavelength
range (nm)

770 to 860

1270 to 1355

1270 to 1355

1500 to 1580

Minimum
overload
(dBm)

-3

-3

-3

Receiver
sensitivity
(dBm)

-17

-20

-23

-23

Minimum
extinction ratio
(dB)

Maximum -20
dB spectral
width (nm)

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Parameter

Value

Minimum side
mode
suppression
ratio (dB)

7 Packet Processing Boards

30

30

Table 7-76 lists the parameters specified for the colored optical interfaces of the PEG16.
Figure 1.2 Parameters specified for the colored optical interfaces of the PEG16
Parameter

Value
CWDM

Nominal bit rate

1250000 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

Launched optical power range


(dBm)

0 to 5

Operating wavelength range


(nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-19

Minimum overload (dBm)

-3

Maximum allowed dispersion


(ps/nm)

800

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

1.1.1.1.180 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.181 Mechanical Specifications


The mechanical specifications of the PEG16 are as follows:

Dimensions (mm): 50.3 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 2.3

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1.1.1.1.182 Power Consumption


The maximum power consumption of the PEG16 at room temperature (25C) is 137 W.

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Packet Interface Boards

About This Chapter


The packet interface boards include the PETF8, PEFF8, CQ1, MD12, and MD75. They
provide packet switching boards with cable input/output interfaces for myriad signals.
8.1 PETF8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PETF8 (8xFE electrical interface board). This topic also
describes how to configure and commission the PETF8.
8.2 PEFF8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEFF8 (8-port fast Ethernet optical interface processing board).
This topic also describes how to configure and commission the PEFF8.
8.3 CQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the CQ1 (4-channel channelized STM-1 CES optical interface
board).
8.4 MD12
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MD12 (multi-protocol 32-channels E1 interface processing
board). This topic also describes how to configure and commission the MD12.
8.5 MD75
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MD75 (multi-protocol 32-channels E1 interface processing
board). This topic also describes how to configure and commission the MD75.

8.1 PETF8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PETF8 (8xFE electrical interface board). This topic also
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describes how to configure and commission the PETF8.

8.1.1 Version Description


The PETF8 is available in one functional version, namely, N1.

8.1.2 Application
The PETF8 is mainly used in the packet data transmission field to transmit/receive data
packets, manage bandwidths, and realize switching of data packets.
Figure 8-1 shows the typical networking and application of the PETF8. The PETF8 works
with the cross-connect board that provides the packet switching function to meet the
requirement of packet features. With this board, the TDM domain can be overlapped with the
packet domain on the OptiX OSN equipment to transmit data in the two domains. In this way,
the equipment realizes the smooth evolution from the MSTP network to the packet switching
network.
Figure 1.1 Networking and application of the PETF8

NMS

NE1

User A2
NE2

PSN

NE4

NE3

User B2
Traffic direction

User B1

PEG8/PEG16
PETF8
Dual-domain (TDM domain
and packet domain) cross- User A1
connect board
PSN: packet switched network

8.1.3 Functions and Features


PETF8 boards receive/transmit 8xFE electrical signals and work with PEG8/PEG16 boards to
process services.

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Table 8-1 lists the functions and features supported by PETF8 boards. 7.3.3 Functions and
Features lists the functions and features supported by PETF8 boards that work with PEG8
boards. 8.1.3 Functions and Features lists the functions and features supported by PETF8
boards that work with PEG16 boards.
Figure 1.1 Functions and features supported by PETF8 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 8xFE electrical signals.

Port
types

Uses the RJ45 connector and meets the specifications of the 100BASE-TX
physical layer provided in IEEE 802.3.

Port
charac
teristic
s

Pluggab
le
optical
module

Not supported

Singlefiber
bidirecti
onal
optical
module

Not supported

Workin
g modes

100 Mbit/s full-duplex or auto-negotiation for FE electrical ports (In


auto-negotiation mode, only the 100 Mbit/s full-duplex working mode
is supported.)

Flow
control
at ports

Autonegotiation
mode

Not supported

Nonautonegotia
tion mode

Not supported

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Query/S
etting of
port
status

Supported

Query
of port
types

Not supported

Query/S
etting of
optical
power
threshol

Not supported

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Funct
ion
and
Featu
re

8 Packet Interface Boards

Description

ds

Servic
e
specifi
cation
s

Query/S
etting of
unidirec
tionalmode

Not supported

Service
bearing
modes

MPLS

Supported

QinQ

Supported

Port

Supported

MTU for
ports

When working with PEG16 boards, PETF8 boards do


not support the setting of the packet length, which takes
the default value of 9600 bytes. When working with
PEG8 boards, PETF8 boards support the setting of the
packet length, which ranges from 960 bytes to 1976
bytes. After the setting becomes valid, the length of a
packet that enters or exits a port is restricted by the MTU
preset for the port.

MTU for
services

For packet services carried by PWs, PETF8 boards


support the setting of the packet length, which ranges
from 64 bytes to 9600 bytes. For packet services carried
in other modes, PETF8 boards do not support the setting
of the packet length.

E-Line
service

Supported

E-LAN
service

Supported

E-AGGR
service

When working with PEG16 boards, PETF8 boards


support the E-AGGR service.

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format,


Ethernet II format, or IEEE 802.1q/p format.

Jumbo
frame

When working with PEG8 boards, PETF8 boards


support a jumbo frame with a maximum length of 1976
bytes.

MTU

Ethernet
service
capabili
ty

When working with PEG16 boards, PETF8 boards


support a jumbo frame with a maximum length of 9600
bytes.

Protec
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MS-PW

Supports static MS-PWs.

Tunnel

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended)


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Funct
ion
and
Featu
re

Description

tion
schem
es

APS

tunnel APS in compliance with ITU-T Y.1720 and ITU-T G.8131.

PW
APS

Supports the PW FPS (single-ended), 1+1 (single-ended/dual-ended)


and 1:1 (dual-ended) PW APS when working with the PEG8 in
compliance with ITU-T Y.1720 and ITU-T G.8131.
Does not support PW APS when working with the PEG16.

LAG

MCLAG

Supports manual link aggregation and static link aggregation.

Supports the load sharing mode and load non-sharing mode.

Complies with IEEE 802.3ad and IEEE 802.1AX.

Supports MC-LAG when working with the PEG8 in compliance with


802.3ad and IEEE 802.1AX.
Does not support MC-LAG when working with the PEG16.

Synch
roniza
tion

Maint
enanc
e
featur
es

Issue 02 (2013-01-18)

MSTP

Supported, which complies with IEEE 802.1s.

LPT

Point-topoint LPT

Supported

Point-tomultipoint
LPT

Supported

Synchro
nous
Ethernet
Clock

PETF8 boards support eight channels of synchronous Ethernet clocks.

1588v2

PETF8 boards support eight channels of IEEE 1588v2 time


synchronization and clock synchronization.

ETH
OAM

Ethernet
service
OAMa

Supports CC, LB and LT. These functions comply with


IEEE 802.1ag.

Ethernet
port OAMa

Supports OAM auto-discovery, fault detection, and link


performance monitoring. These functions comply with
IEEE 802.3ah.

Distribu
ted
MPLS
OAM/C
entraliz
ed
MPLS
OAM

MPLS
tunnel
OAMa

Supports CV, FFD, BDI, FDI, Tunnel ping, and Tunnel


traceroute. These functions comply with ITU-T Y.1711.

MPLS PW
OAMa

Supports CV, FFD, BDI, FDI, PW traceroute, and PW


ping. These functions comply with ITU-T Y.1711.

MPLS-

MPLS-TP

Supports CC, RDI, AIS, LB, LT, LM, 1DM, TST, LCK,

Supports LM and 2DM. These functions comply with


ITU-T Y.1731.

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Funct
ion
and
Featu
re

8 Packet Interface Boards

Description

TP
OAM

tunnel
OAMa

and 2DM. These functions comply with ITU-T


G.8113.1.

NOTE
When
workin
g with
PEG8
boards,
PETF8
boards
support
MPLSTP
OAM.

MPLS-TP
PW OAMa

Supports CC, RDI, AIS, LB, LT, LM, 1DM, TST, LCK,
CSF, and 2DM. These functions comply with ITU-T
G.8113.1.

Loopba
ck
capabili
ty

PHY layer
at Ethernet
ports

Supports inloops.

MAC layer
at Ethernet
ports

Supports inloops and outloops.

RMON

Supported

Port
mirrorin
g

Supports ingress mirroring.

Inban
d
DCN

Supported

HQoS

Supports service WRED policies, WFQ policies, PW polices, QinQ polices, VUNI ingress policies, V-UNI egress policies, port policies, port shaping.

IGMP
snoopi
ng

Protocol
enablin
g

Supported

Port
aging
time

Supported

Fast
leave

Supported

Discardi
ng of
unknow
n
broadca
st

Supported

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Funct
ion
and
Featu
re

8 Packet Interface Boards

Description

packets
Static
broadca
st entry
Query
of
electro
nic
labels

Supported

Supported

NOTE
a: MPLS tunnel OAM, MPLS PW OAM, MPLS-TP tunnel OAM, MPLS-TP PW OAM, and ETH OAM
share OAM resources.

8.1.4 Working Principle and Signal Flow


The PETF8 consists of the access and converging module, control and driving module,
voltage detecting module, clock module, and power module.
Figure 8-2 shows the functional block diagram of the PETF8.
Figure 1.1 Functional block diagram of the PETF8
Voltage detecting
module

8xFE electrical
signals

Access and
converging
module

Voltage detecting
signal
GE
Management bus
IEEE
Control and
GE service
1588 V2 driving module
signal

Backplane

IEEE
Working
1588 V2
clock signal
signal
One system clock
Working clock
signal
Synchronous Ethernet clock
Clock
module
IEEE 1588 V2 packet

Synchronous
clock

PEG16/PEG8
PEG16/PEG8

PEG16/PEG8
PEG16/PEG8
PEG16/PEG8

Modules of
the board
Modules of
the board

Power
module

Fuse
Fuse

PEG16/PEG8
+3.3 V backup power

1.1.1.1.183 Upstream Direction


The services in the upstream direction are accessed by the FE ports. The service packets are
added with different VLAN tags according to the ingress ports. Then, the services are
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transmitted to the GE port on the backplane side. As a result, the FE services are converged
into the GE services. After the PEG16 receives the packets, the PEG8/PEG16 identifies the
ports to which the services correspond according to the VLAN tags and strips the VLAN tags.

1.1.1.1.184 Downstream Direction


The services in the downstream direction are added with VLAN tags on the PEG8/PEG16
according to the destination ports. Then, the services are accessed by the GE port on the
backplane side. The VLAN tags indicate the destination ports of the service packets. The
service packets are sent to the destination ports after the VLAN tags are stripped.

1.1.1.1.185 Access and Converging Module


The access and converging module performs the following functions:

Transmits/Receives 8xFE electrical signals.

Converges 8xFE services into 1xGE services on the backplane side.

Extracts the IEEE 1588v2 clock information.

1.1.1.1.186 Control and Driving Module


The control and driving module performs the following functions:

Detects the system status through the management control bus.

Checks whether the board is properly inserted.

Detects the voltage of the PETF8.

Realizes the hot-swappable function of the PETF8.

1.1.1.1.187 Voltage Detecting Module


The voltage detecting module monitors the voltage.

1.1.1.1.188 Clock Module


The clock module performs the following functions:

Provides the working clock signal for each module of the PETF8.

Supports the synchronous Ethernet clock.

Supports the IEEE 1588v2 clock.

1.1.1.1.189 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the PETF8 require.

8.1.5 Front Panel


The front panel of the PETF8 has indicators, interfaces, and a bar code.

1.1.1.1.190 Diagram of the Front Panel


Figure 8-3 shows the appearance of the front panel of the PETF8.
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Figure 1.1 Front panel of the PETF8

PETF8
STAT
ACT
SRV

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8

PETF8

1.1.1.1.191 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Service alarm indicator (SRV) two colors (red and green)

Connection status indicator (LINK) one color (green and located on the RJ45
connector)

Data receiving and transmission indicator (ACT) one color (orange and located on the
RJ45 connector)

For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the Boards.

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1.1.1.1.192 Interfaces
The front panel of the PETF8 has eight FE electrical interfaces. Table 8-2 describes the types
and usage of the electrical interfaces of the PETF8.
Figure 1.1 Electrical interfaces of the PETF8
Interface

Type of Interface

Usage

FE1FE8

RJ-45

Transmits and receives FE signals.

8.1.6 Jumpers and DIP Switches


The PETF8 does not have any jumpers or DIP switches that are used for board settings.

8.1.7 Valid Slots


The PETF8 must be installed in a valid slot on the subrack. Otherwise, the PETF8 fails to
work normally.
The PETF8 can be installed in slots 1926, and 2936 in the subrack.
The PETF8 works as the interface board for the PEG8 and PEG16. For the slots valid for the
PEG8 and PEG16 and the corresponding slots for the PETF8, refer to Table 7-46 and Table 765.

8.1.8 Feature Code


The PETF8 does not have the feature code.

8.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.193 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the
board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
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----End

1.1.1.1.194 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
Step 7 Required: Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do
not match, packets may be lost or the bit rate may decrease. In the case of large volume
of traffic, services may be completely interrupted.

For details, see Parameter Description.


For more information about the parameters of the board, see 26.1 Packet Processing Boards.

Step 8 Required: Configure services. The following Ethernet services can be configured according
to actual requirements:

Configure the E-line service. For details, see Configuring E-Line Services.

Configure the E-LAN service. For details, see Configuring E-LAN Services.

Step 9 Optional: Configure the OAM:

Configure the MPLS OAM, For details, see Configuring the MPLS OAM and
Configuring PW OAM.

Configure the MPLS-TP OAM, For details, see Configuring MPLS-TP Tunnel OAM and
Configuring MPLS-TP PW OAM.

Step 10 Optional: Configure the MPLS tunnel protection group. For details, see Configuring Tunnel
APS on a Per-NE Basis.
Step 11 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 12 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 13 Optional: Configure the IEEE 1588v2 time and clock. For details, see Configuring the IEEE
1588v2 Time Synchronization and Clock Synchronization.
Step 14 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

1.1.1.1.195 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

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1.1.1.1.196 Checking the Operation of the Board


Step 1 Required: Check Ethernet services.

Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.

Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.

Step 15 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 16 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

8.1.10 Parameter Settings


You can set the parameters for the PETF8 by using the U2000.
You can set the following parameters for the PETF8 by using the U2000:

Ethernet interface

For more parameters the description of the parameters, see 26.1 Packet Processing Boards.

8.1.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.197 Troubleshooting
Table 8-3 lists the faults that occur on the PETF8 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the PETF8 frequently
Fault Symptom

Common Fault
Cause

Service
troubleshooting

The service is
interrupted.

The service loses


packets or has
errored packets.

The tunnel APS


switching fails.

The PW APS
switching fails.

Protection switching
fault

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Troubleshooting Method
See Troubleshooting Packet Service
Interruptions.

See Failure of Packet Service Protection


Switching.

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Common Fault
Cause

Troubleshooting Method

The MC-LAG
switching fails.

1.1.1.1.198 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PETF8, see Replacing a Packet Interface Board.

8.1.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

8.1.12.1 Alarms of N1PETF8


Table 8-4 provides the alarms supported by the N1PETF8 when the N1PETF8 works together with the
PEG8..

Figure 1.1 Alarms


TEMP_OVER

HARD_BAD

HARD_ERR

POWER_ABNORMAL

BD_STATUS

WRG_BD_TYPE

FLOW_OVER

LOOP_ALM

ETH_LOS

ETH_LINK_DOWN

MAC_FCS_EXC

FDBSIZEALM_ELAN

MPLS_TUNNEL_LOCV

MPLS_TUNNEL_Excess

MPLS_TUNNEL_MISMA
TCH

MPLS_TUNNEL_MISMER
GE

MPLS_TUNNEL_UNKNO
WN

MPLS_TUNNEL_BDI

MPLS_TUNNEL_FDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

ETH_CFM_UNEXPERI

PW_EXC_TRAFFIC

ETH_CFM_MISMERGE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOPBACK

ETH_EFM_REMFAULT

ETH_EFM_EVENT

ETH_APS_LOST

ETH_APS_TYPE_MISMA
TCH

ETH_APS_SWITCH_FAIL

LAG_MEMBER_DOWN

PW_NO_TRAFFIC

LPT_CFG_CLOSEPORT

MPLS_PW_Excess

LAG_DOWN

MPLS_PW_LOCV

MPLS_PW_UNKNOWN

MPLS_PW_MISMATCH

MPLS_PW_MISMERGE

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MPLS_PW_SF

MPLS_PW_BDI

MPLS_PW_SD

PWAPS_SWITCH_FAIL

PWAPS_TYPE_MISMATC
H

PWAPS_PATH_MISMATC
H

MCLAG_CFG_MISMATC
H

PWAPS_LOST

MCSP_PATH_LOCV

ETHOAM_SELF_LOOP

PORTMODE_MISMATCH

TUNNEL_APS_DEGRAD
ED

PORT_EXC_TRAFFIC

BWUTILIZATION_OVER

SRV_SHUTDOWN_LD

MPLS_TUNNEL_OAMFAI
L

MPLS_PW_OAMFAIL

DROPRATIO_OVER

ETH_NO_FLOW

PW_DROPPKT_EXC

ETH_APS_PATH_MISMA
TCH

TUNNEL_APS_OUTAGE

Table 8-5 provides the alarms supported by the N1PETF8 when the N1PETF8 works together with the
PEG16..

Figure 1.2 Alarms


TEMP_OVER

HARD_BAD

HARD_ERR

POWER_ABNORMAL

BD_STATUS

WRG_BD_TYPE

FLOW_OVER

LOOP_ALM

ETH_LOS

ETH_LINK_DOWN

MAC_FCS_EXC

FDBSIZEALM_ELAN

MPLS_TUNNEL_LOCV

MPLS_TUNNEL_Excess

MPLS_TUNNEL_MISMA
TCH

MPLS_TUNNEL_MISMER
GE

MPLS_TUNNEL_UNKNO
WN

MPLS_TUNNEL_BDI

MPLS_TUNNEL_FDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

ETH_CFM_UNEXPERI

PW_EXC_TRAFFIC

ETH_CFM_MISMERGE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOPBACK

ETH_EFM_REMFAULT

ETH_EFM_EVENT

ETH_APS_LOST

ETH_APS_TYPE_MISMA
TCH

ETH_APS_SWITCH_FAIL

LAG_MEMBER_DOWN

PW_NO_TRAFFIC

LPT_CFG_CLOSEPORT

LAG_DOWN

ETH_APS_PATH_MISMAT
CH

TUNNEL_APS_DEGRAD
ED

ETHOAM_SELF_LOOP

PORTMODE_MISMATCH

TUNNEL_APS_OUTAGE

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8.1.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

8.1.13.1 Performance Events of N1PETF8


Figure 1.3 SDH
BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

Figure 1.4 ETH OAM 802.1ag


ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_CSLS

ETH_CFM_UAS

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

Figure 1.5 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Table 8-9 provides the statistical items of tunnel supported by the N1PETF8 when the N1PETF8 works
together with the PEG8.

Figure 1.6 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATIO
N

TUNNEL_REVERSE_SND
PKTS

TUNNEL_REVERSE_SNDB
YTES

TUNNEL_REVERSE_R
CVPKTS

TUNNEL_REVERSE_RCV
BYTES

TNL_REVERSE_BW_UTILI
SATION

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_RX_
BPS

TUNNEL_REVERSE_TX_B
PS

TUNNEL_REVERSE_R
X_PPS

TUNNEL_REVERSE_TX_
PPS

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Table 8-10 provides the statistical items of tunnel supported by the N1PETF8 when the N1PETF8 works
together with the PEG8.

Figure 1.7 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TUNNEL_REVERSE_SN
DPKTS

TUNNEL_REVERSE_SNDB
YTES

TUNNEL_REVERSE_RC
VPKTS

TUNNEL_REVERSE_RC
VBYTES

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_TX_
BPS

TUNNEL_REVERSE_RX
_PPS

TUNNEL_REVERSE_TX_P
PS

TUNNEL_REVERSE_RX_
BPS

Table 8-11 provides the statistical items of MPLS PW OAM supported by the N1PETF8 when the
N1PETF8 works together with the PEG8. When working together with the PEG16, the N1PETF8 does
not support MPLS PW OAM performance measurement.

Figure 1.8 MPLS PW OAM


MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Table 8-12 provides the statistical items of PW supported by the N1PETF8 when the N1PETF8 works
together with the PEG8.

Figure 1.9 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UT
ILISATION

PW_DROPPKTS

PW_DROPBYTES

PW_RX_BPS

PW_TX_BPS

PW_RX_PPS

PW_TX_PPS

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Table 8-13 provides the statistical items of PW supported by the N1PETF8 when the N1PETF8 works
together with the PEG16.

Figure 1.10 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILI
SATION

PW_RX_BPS

PW_TX_BPS

PW_RX_PPS

PW_TX_PPS

Table 8-14 provides the statistical items of L2VPN supported by the N1PETF8 when the N1PETF8
works together with the PEG8.

Figure 1.11 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

VUNI_TX_UTILIZATION

VLAN_RCVPKTS

VLAN_RCVBYTES

VLAN_SNDPKTS

VLAN_SNDBYTES

VUNI_SND_DROPPKTS

VUNI_SND_DROPBYTES

VUNI_SND_DROPRATIO

VLAN_RX_BPS

VLAN_TX_BPS

VLAN_RX_PPS

VLAN_TX_PPS

Table 8-15 provides the statistical items of L2VPN supported by the N1PETF8 when the N1PETF8
works together with the PEG16.

Figure 1.12 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

Table 8-16 and Table 8-17 provide the statistical items supported by the N1PETF8 when the N1PETF8
works together with the PEG8.

Figure 1.13 Statistics of RMON basic performance


RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHUNDER

RXPKT64

RXPKT128

RXPKT256

RXPKT512

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RXPKT1024

Figure 1.14 Statistics of RMON extended performance


RXPKT1519

TXPKT64

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

PKT64

PKT128

PKT256

PKT512

PKT1024

PKT1519

RXUNICAST

TXUNICAST

TXMULCAST

TXBRDCAST

ETHFCS

TXPKTS

TXOCTETS

PORT_RX_BW_UTILIZA
TION

PORT_TX_BW_UTILIZATI
ON

TX_DROP_RATIO

RXBPS

TXBPS

RXPPS

TXPPS

Table 8-18 and Table 8-19 provide the statistical items supported by the N1PETF8 when the N1PETF8
works together with the PEG16.

Figure 1.15 Statistics of RMON basic performance


RXPKTS

RXOCTETS

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

RXBRDCAST

RXMULCAST

ETHUNDER

Figure 1.16 Statistics of RMON extended performance


TXPKTS

TXOCTETS

TXUNICAST

TXBRDCAST

TXMULCAST

TXPKT65

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

RXUNICAST

RXPKT1519

PKT1519

ETHFCS

PKT65

PKT128

PKT256

PKT512

PKT1024

PORT_RX_BYTES_AVAI

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LABILITY
TX_DROP_RATIO

RXBPS

RXPPS

TXPPS

TXBPS

Table 8-20 provides the statistical items of QoS and VUNI supported by the N1PETF8 when the
N1PETF8 works together with the PEG8.

Figure 1.17 QoS


QOS_STRM_MATCHPKT
S

QOS_STRM_MATCHBYT
ES

QOS_CARGRNPKTS

QOS_CARGRNBYTES

QOS_CARYLWPKTS

QOS_CARYLWBYTES

QOS_CARREDPKTS

QOS_CARREDBYTES

QOS_CARREDRATIO

FLOW_RX_UTILIZATION

QOS_PRI_DROPPKTS

QOS_PRI_DROPBYTES

PORT_PRI_SNDPKTS

PORT_PRI_SNDBYTES

PWQUEUE_SNDDROPPK
TS

PWQUEUE_SNDDROPBY
TES

PWQUEUE_SNDDROPRA
TIO

TNL_SNDDROPPKTS

TNL_SNDDROPBYTES

TNL_SNDDROPRATIO

TNL_REVERSE_SNDDRO
PPKTS

TNL_REVERSE_SNDDRO
PBYTES

TNL_REVERSE_SNDDRO
PRATIO

VUNIQUEUE_SNDDROPP
KTS

VUNIQUEUE_SNDDROP
BYTES

VUNIQUEUE_SNDDROP
RATIO

VUNIGROUP_SNDDROPP
KTS

VUNIGROUP_SNDDROP
BYTES

VUNIGROUP_SNDDROP
RATIO

QOS_PORTQUEUE_DROP
RATIO

VUNIGROUP_SNDPKTS

VUNIGROUP_SNDBYTES

VGROUP_TX_UTILIZATI
ON

PORT_PRI_TX_BPS

PORT_PRI_TX_PPS

PWQUEUE_TX_BPS

PWQUEUE_TX_PPS

8.1.14 Technical Specifications of PETF8


The technical specifications of the PETF8 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.199 Parameters Specified for Electrical Interfaces


Table 8-21 lists the parameters specified for the electrical interfaces of the PETF8.
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Figure 1.1 Parameters specified for the electrical interfaces of the PETF8
Parameter

Value

Nominal bit rate

100 Mbit/s

Type of electrical interface

RJ-45

Line code pattern

MLT-3 encoding signal (100M)

Specifications of the
interface

Complies with IEEE 802.3u.

1.1.1.1.200 Mechanical Specifications


The mechanical specifications of the PETF8 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.201 Power Consumption


The maximum power consumption of the PETF8 at room temperature (25C) is 6 W.

8.2 PEFF8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PEFF8 (8-port fast Ethernet optical interface processing board).
This topic also describes how to configure and commission the PEFF8.

8.2.1 Version Description


The PEFF8 is available in one functional version, namely, N1.

8.2.2 Application
The PEFF8 is mainly used in the packet data transmission field to transmit/receive data
packets, manage bandwidths, and implement switching of data packets.
Figure 8-4 shows the typical networking and application of the PEFF8. The PEFF8 works
with the cross-connect board that provides the packet switching function to meet the
requirement of packet features. With this board, the TDM domain can be overlapped with the
packet domain on the OptiX OSN equipment so that the data can be transmitted in the two
domains. In this manner, an MSTP network can smoothly evolve to a packet switching
network.

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Figure 1.1 Networking and application of the PEFF8

NMS

NE1

User A2
NE2

PSN

NE4

NE3

User B2
Traffic direction

User B1

PEG8
PEFF8
Dual-domain (TDM domain
and packet domain) cross- User A1
connect board
PSN: packet switched network

8.2.3 Functions and Features


PEFF8 boards receive/transmit 8xFE optical signals and work with the PEG8 to process
services.
Table 8-22 lists the functions and features supported by PEFF8 boards. When working with
PEG8 boards, PEFF8 boards support the functions and features as described in 7.3.3
Functions and Features.
Figure 1.1 Functions and features supported by PEFF8 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 8xFE optical signals.

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Funct
ion
and
Featu
re

Description

Port
types

Supports 100Base-FX/LX/VX/ZX Ethernet optical ports. The optical ports use LC


connectors and support the transmission distances of 2 km, 15 km, 40 km, and 80
km.

Port
charac
teristic
s

Pluggab
le
optical
module

Supports SFP optical modules.

Singlefiber
bidirecti
onal
optical
module

Supports SFP single-fiber bidirectional optical modules.

Workin
g modes

100M full-duplex

Flow
control
at ports

Autonegotiation
mode

Not supported

Nonautonegotia
tion mode

Not supported

Servic
e
specifi
Issue 02 (2013-01-18)

Query/S
etting of
port
status

Supported

Query
of port
types

Supported

Query/S
etting of
optical
power
threshol
ds

Supported

Query/S
etting of
unidirec
tionalmode

Not supported

Service
bearing

MPLS

Supported

QinQ

Supported

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Funct
ion
and
Featu
re

Description

cation
s

modes

Port

Supported

MTU

MTU for
ports

Supports the setting of the packet length, which ranges


from 960 bytes to 1976 bytes. After the setting becomes
valid, the length of the packets that enter or exit the ports
is restricted by the preset MTU.

MTU for
services

For packet services carried by PWs, PEFF8 boards


support the setting of the packet length, which ranges
from 64 bytes to 9600 bytes. For packet services carried
in other modes, PEFF8 boards do not support the setting
of the packet length.

E-Line
service

Supported

E-LAN
service

Supported

E-AGGR
service

Not supported

Formats of
Ethernet
data frames

Supports the encapsulation in IEEE 802.3 format,


Ethernet II format, or IEEE 802.1q/p format.

Jumbo
frame

Supports the Jumbo frame with a length not more than


1976 bytes.

Ethernet
service
capabili
ty

Protec
tion
schem
es

Issue 02 (2013-01-18)

MS-PW

Supports static MS-PWs.

Tunnel
APS

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended)


MPLS Tunnel APS in compliance with ITU-T Y.1720 and ITU-T
G.8131.

PW
APS

Supports the PW FPS (single-ended), 1+1 (single-ended/dual-ended)


and 1:1 (dual-ended) MPLS PW APS in compliance with ITU-T
Y.1720 and ITU-T G.8131.

LAG

Supports manual link aggregation and static link aggregation.

Supports the load sharing mode and load non-sharing mode.

Complies with IEEE 802.3ad and IEEE 802.1AX.

MCLAG

Supported when working with a PEG8 board in compliance with


802.3ad and IEEE 802.1AX.

MSTP

Supported, which complies with IEEE 802.1s.

LPT

Point-topoint LPT

Supported

Point-to-

Supported

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Description

multipoint
LPT
Synch
roniza
tion

Maint
enanc
e
featur
es

Inban
Issue 02 (2013-01-18)

Synchro
nous
Ethernet
Clock

Supports eight channels of synchronous Ethernet clock signals.

1588v2

Supports eight channels of IEEE 1588v2 time synchronization and


clock synchronization.

ETH
OAM

Ethernet
service
OAMa

Supports CC, LB and LT. These functions comply with


IEEE 802.1ag.

Ethernet
port OAMa

Supports OAM auto-discovery, remote loopback, fault


detection, link performance monitoring, and selfloop
test. These functions comply with IEEE 802.3ah.

Distribu
ted
MPLS
OAM/C
entraliz
ed
MPLS
OAM

MPLS
tunnel
OAMa

Supports CV, FFD, BDI, FDI, Tunnel ping, and Tunnel


traceroute. These functions comply with ITU-T Y.1711.

MPLS PW
OAMa

Supports CV, FFD, BDI, FDI, PW traceroute, and PW


ping. These functions comply with ITU-T Y.1711.

MPLSTP
OAM

MPLS-TP
tunnel
OAMa

Supports CC, RDI, AIS, LB, LT, LM, 1DM, TST, LCK,
and 2DM. These functions comply with ITU-T
G.8113.1.

MPLS-TP
PW OAMa

Supports CC, RDI, AIS, LB, LT, LM, 1DM, TST, LCK,
CSF, and 2DM. These functions comply with ITU-T
G.8113.1.

Loopba
ck
capabili
ty

PHY layer
at Ethernet
ports

Supports inloops.

MAC layer
at Ethernet
ports

Supports inloops and outloops.

RMON

Supported

Port
mirrorin
g

Supports ingress mirroring.

Supports LM and 2DM. These functions comply with


ITU-T Y.1731.

Supported
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Description

d
DCN
HQoS

Supports service WRED policies, WFQ policies, PW polices, QinQ polices, VUNI ingress policies, V-UNI egress policies, port policies, port shaping.

IGMP
snoopi
ng

Protocol
enablin
g

Supported

Port
aging
time

Supported

Fast
leave

Supported

Discardi
ng of
unknow
n
broadca
st
packets

Supported

Static
broadca
st entry

Supported

Query
of
electro
nic
labels

Supported

NOTE
a: MPLS tunnel OAM, MPLS PW OAM, MPLS-TP tunnel OAM, MPLS-TP PW OAM, and ETH OAM
share OAM resources.

8.2.4 Working Principle and Signal Flow


The PEFF8 consists of the access and converging module, control and driving module,
temperature and voltage detecting module, clock module, and power module.
Figure 8-5 shows the functional block diagram of the PEFF8.

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Figure 1.1 Functional block diagram of the PEFF8


Voltage detecting
module
Voltage detecting signal
GE
8xFE optical
signals

Access and
converging
module

Synchronous
clock

IEEE
1588v2
signal

Control and
driving module

IEEE1588v2 signal
Working clock
signal

Backplane

Management bus
GE service

PEG8
PEG8

Working clock signal


One channel of system clock

Clock
module

Synchronous Ethernet clock


IEEE 1588 V2 packet

PEG8
PEG8
PEG8

Each module of board


Each module
of board

Power
module

Fuse
Fuse

PEG8
+3.3 V backup power

1.1.1.1.202 Upstream direction


The services in the upstream direction are accessed by the FE ports. The service packets are
added with different VLAN tags based on the ingress ports. Then, the services are transmitted
to the GE port on the backplane side. As a result, the FE services are converged into the GE
services. After receiving the packets, the PEG8 identifies the ports to which the services
correspond based on the VLAN tags and strips the VLAN tags.

1.1.1.1.203 Downstream direction


The services in the downstream direction are added with VLAN tags on the PEG8 based on
the destination ports. Then, the services are accessed by the GE port on the backplane side.
The destination ports of the service packets are determined based on the VLAN tags. After the
destination ports of the service packets are determined, the VLAN tags are striped and the
services are sent to the destination ports.

1.1.1.1.204 Access and Converging Module


The access and converging module performs the following functions:

Transmits/Receives 8xFE optical signals.

Converges 8xFE services into 1xGE services on the backplane side.

Extracts IEEE 1588v2 clock information.

1.1.1.1.205 Control and Driving Module


The control and driving module performs the following functions:

Issue 02 (2013-01-18)

Detects the system status through the management control bus.

Checks whether the board is properly inserted.

Tests the voltage status.

Implements the hot-pluggable function of the PEFF8.


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1.1.1.1.206 Voltage Test Module


The voltage test module mainly provides the voltage monitoring function.

1.1.1.1.207 Clock Module


The clock module performs the following functions:

Provides the working clock signal for each module of the PEFF8.

Supports the synchronous Ethernet clock.

Supports the IEEE 1588v2 clock.

1.1.1.1.208 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.

8.2.5 Front Panel


The front panel of the PEFF8 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.209 Diagram of the Front Panel


Figure 8-6 shows the appearance of the front panel of the PEFF8.

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Figure 1.1 Front panel of the PEFF8

PEFF8
STAT
ACT
SRV
CLASS 1
LASER
PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4


OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8
L/A 1
L/A 2
L/A 3
L/A 4
L/A 5
L/A 6
L/A 7
L/A 8

PEFF8

1.1.1.1.210 Indicators

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Service alarm indicator (SRV) two colors (red and green)

Connection status indicator (L/A1-L/A8) two colors (yellow and green)

For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the Boards.

1.1.1.1.211 Interfaces
The front panel of the PEFF8 has eight FE optical interfaces. Table 8-23 describes the
interfaces of the PEFF8.

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Figure 1.1 Interfaces of the PEFF8


Interface

Type of Interface

Usage

IN1-IN8

LC (pluggable)

Receives FE signals.

OUT1OUT8

LC (pluggable)

Transmits FE signals.

8.2.6 Valid Slots


The PEFF8 must be installed in a valid slot on the subrack. Otherwise, the PEFF8 fails to
work normally.
The PEFF8 can be installed in slots 1926, and 2936 in the subrack.
The PEFF8 works as the interface board of the PEG8. For the slots valid for the PEG8, see
Table 7-46.

8.2.7 Feature Code


The PEFF8 does not have the feature code.

8.2.8 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.212 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the
board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.213 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Optional: Configure the inband DCN. For details, see Configuring the Inband DCN.
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Step 7 Required: Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board, the
port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment are
required to work in the same fixed working mode. If the working modes on two sides do
not match, packets may be lost or the bit rate may decrease. In the case of large volume
of traffic, services may be completely interrupted.

For details, see Parameter Description.


For more information about the parameters of the board, see 26.1 Packet Processing Boards.

Step 8 Required: Configure services. The following Ethernet services can be configured according
to actual requirements:

Configure the E-line service. For details, see Configuring E-Line Services.

Configure the E-LAN service. For details, see Configuring E-LAN Services.

Step 9 Optional: Configure the OAM:

Configure the MPLS OAM, For details, see Configuring the MPLS OAM and
Configuring PW OAM.

Configure the MPLS-TP OAM, For details, see Configuring MPLS-TP Tunnel OAM and
Configuring MPLS-TP PW OAM.

Step 10 Optional: Configure the MPLS tunnel protection group. For details, see Configuring Tunnel
APS on a Per-NE Basis.
Step 11 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Configuring an Ethernet LAG.
Step 12 Optional: Configure the QoS. For details, see Configuring the HQoS.
Step 13 Optional: Configure the IEEE 1588v2 time and clock. For details, see Configuring the IEEE
1588v2 Time Synchronization and Clock Synchronization.
Step 14 Optional: Configure the IGMP Snooping. For details, see Configuring the IGMP Snooping.
----End

1.1.1.1.214 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.215 Checking the Operation of the Board


Step 1 Required: Check Ethernet services.

Check the E-line service. For details, see Verifying the Correctness of E-Line Service
Configuration.

Check the E-LAN service. For details, see Verifying the Correctness of E-LAN Service
Configuration.

Step 15 Required: Check the status of the indicators on the front panel of the board to ensure that the
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board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 16 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

8.2.9 Configuring the Board Functions


The PEFF8 supports the packet switching function and multiple packet functions and features,
such as HQoS, LAG, and ETH OAM. Configure the functions according to actual
requirements.
You can configure the following packet functions for the PEFF8 by using the U2000:

HQoS

ETH OAM

MPLS OAM

MPLS-TP OAM

IGMP Snooping

Inband DCN

LPT

Tunnel APS

PW APS

LAG

MC-LAG

MS-PW

MSTP

8.2.10 Parameter Settings


You can set the parameters for the PEFF8 by using the U2000.
You can set the following parameters for the PEFF8 by using the U2000.

Ethernet interface

For information about more parameters and the description of each parameter, see 26.1 Packet
Processing Boards.

8.2.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.216 Troubleshooting
Table 8-24 lists the faults that occur on the PEFF8 frequently and the troubleshooting
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methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the PEFF8 frequently
Fault Symptom

Common Fault
Cause

Service
troubleshooting

The service is
interrupted.

The service loses


packets or has
errored packets.

The tunnel APS


switching fails.

The PW APS
switching fails.

The MC-LAG
switching fails.

Protection switching
fault

Troubleshooting Method
See Troubleshooting Packet Service
Interruptions.

See Failure of Packet Service Protection


Switching.

1.1.1.1.217 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PEFF8, see Replacing a Packet Interface Board.

8.2.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

8.2.12.1 Alarms of N1PEFF8


TEMP_OVER

HARD_BAD

HARD_ERR

POWER_ABNORMA
L

BD_STATUS

WRG_BD_TYPE

LSR_NO_FITED

LASER_MOD_ER
R

LASER_SHUT

ALM_ALS

LSR_WILL_DIE

IN_PWR_ABN

OUT_PWR_ABN

TEM_HA

TEM_LA

LSR_BCM_ALM

FLOW_OVER

LOOP_ALM

ETH_LOS

ETH_LINK_DOW
N

MCLAG_CFG_MISMATCH

FDBSIZEALM_ELA
N

MPLS_TUNNEL_
LOCV

MPLS_TUNNEL_Excess

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MPLS_TUNNEL_MI
SMATCH

MPLS_TUNNEL_
MISMERGE

MPLS_TUNNEL_UNKNOWN

MPLS_TUNNEL_BD
I

MPLS_TUNNEL_
FDI

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

ETH_CFM_UNEX
PERI

PW_EXC_TRAFFIC

ETH_CFM_MISMER
GE

ETH_EFM_DF

ETH_CFM_LOC

ETH_CFM_RDI

ETH_EFM_LOOP
BACK

ETH_EFM_REMFAULT

ETH_EFM_EVENT

ETH_APS_SWIT
CH_FAIL

ETH_APS_TYPE_MISMATCH

ETH_APS_PATH_MI
SMATCH

LAG_DOWN

ETH_APS_LOST

LAG_MEMBER_DO
WN

IN_PWR_LOW

PW_NO_TRAFFIC

IN_PWR_HIGH

MPLS_PW_Exces
s

MPLS_PW_MISMATCH

MPLS_PW_LOCV

MPLS_PW_UNK
NOWN

MPLS_PW_BDI

MPLS_PW_MISMER
GE

PWAPS_TYPE_M
ISMATCH

MPLS_PW_SD

MPLS_PW_SF

PWAPS_LOST

PWAPS_PATH_MISMATCH

PWAPS_SWITCH_F
AIL

LPT_CFG_CLOS
EPORT

MCSP_PATH_LOCV

ETHOAM_SELF_LO
OPSSN1PEFF8

MAC_FCS_EXC

TUNNEL_APS_DEGRADED

PORT_EXC_TRAFFI
C

BWUTILIZATION
_OVER

SRV_SHUTDOWN_LD

MPLS_TUNNEL_OA
MFAIL

MPLS_PW_OAM
FAIL

DROPRATIO_OVER

PW_DROPPKT_EXC

ETH_NO_FLOW

TUNNEL_APS_OUTAGE

8.2.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the NMS.

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8.2.13.1 Performance Events of N1PEFF8


Figure 1.1 SDH
BDTEMPMIN

BDTEMPCUR

BDTEMPMAX

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

ETH_CFM_LS

ETH_CFM_SLS

ETH_CFM_CSLS

ETH_CFM_UAS

ETH_CFM_FLR

ETH_CFM_FL

ETH_CFM_FD

ETH_CFM_FDV

Figure 1.2 ETH OAM 802.1ag

Figure 1.3 MPLS Tunnel OAM


MPLS_TUNNEL_LS

MPLS_TUNNEL_SLS

MPLS_TUNNEL_CSLS

MPLS_TUNNEL_UAS

MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Figure 1.4 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATIO
N

TUNNEL_REVERSE_SND
PKTS

TUNNEL_REVERSE_SNDB
YTES

TUNNEL_REVERSE_R
CVPKTS

TUNNEL_REVERSE_RCV
BYTES

TNL_REVERSE_BW_UTILI
SATION

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_RX_
BPS

TUNNEL_REVERSE_TX_B
PS

TUNNEL_REVERSE_R
X_PPS

TUNNEL_REVERSE_TX_
PPS

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Figure 1.5 MPLS PW OAM


MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Figure 1.6 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UT
ILISATION

PW_DROPPKTS

PW_DROPBYTES

PW_RX_BPS

PW_TX_BPS

PW_RX_PPS

PW_TX_PPS

Figure 1.7 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES

VUNI_TX_UTILIZATION

VLAN_RCVPKTS

VLAN_RCVBYTES

VLAN_SNDPKTS

VLAN_SNDBYTES

VUNI_SND_DROPPKTS

VUNI_SND_DROPBYTES

VUNI_SND_DROPRATIO

VLAN_RX_BPS

VLAN_TX_BPS

VLAN_RX_PPS

VLAN_TX_PPS

Figure 1.8 Statistics of RMON basic performance


RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

ETHUNDER

RXPKT64

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

Figure 1.9 Statistics of RMON extended performance


RXPKT1519

TXPKT64

TXPKT128

TXPKT256

TXPKT512

TXPKT1024

TXPKT1519

PKT64

PKT128

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PKT256

PKT512

PKT1024

PKT1519

RXUNICAST

TXUNICAST

TXMULCAST

TXBRDCAST

ETHFCS

TXPKTS

TXOCTETS

PORT_RX_BW_UTILIZA
TION

PORT_TX_BW_UTILIZATI
ON

TX_DROP_RATIO

RXBPS

TXBPS

RXPPS

TXPPS

Figure 1.10 QoS


QOS_STRM_MATCHPKT
S

QOS_STRM_MATCHBYT
ES

QOS_CARGRNPKTS

QOS_CARGRNBYTES

QOS_CARYLWPKTS

QOS_CARYLWBYTES

QOS_CARREDPKTS

QOS_CARREDBYTES

QOS_CARREDRATIO

FLOW_RX_UTILIZATION

QOS_PRI_DROPPKTS

QOS_PRI_DROPBYTES

PORT_PRI_SNDPKTS

PORT_PRI_SNDBYTES

PWQUEUE_SNDDROPPK
TS

PWQUEUE_SNDDROPBY
TES

PWQUEUE_SNDDROPRA
TIO

TNL_SNDDROPPKTS

TNL_SNDDROPBYTES

TNL_SNDDROPRATIO

TNL_REVERSE_SNDDRO
PPKTS

TNL_REVERSE_SNDDRO
PBYTES

TNL_REVERSE_SNDDRO
PRATIO

VUNIQUEUE_SNDDROPP
KTS

VUNIQUEUE_SNDDROP
BYTES

VUNIQUEUE_SNDDROP
RATIO

VUNIGROUP_SNDDROPP
KTS

VUNIGROUP_SNDDROP
BYTES

VUNIGROUP_SNDDROP
RATIO

QOS_PORTQUEUE_DROP
RATIO

VUNIGROUP_SNDPKTS

VUNIGROUP_SNDBYTES

VGROUP_TX_UTILIZATI
ON

PORT_PRI_TX_BPS

PORT_PRI_TX_PPS

PWQUEUE_TX_BPS

PWQUEUE_TX_PPS

8.2.14 Technical Specifications of PEFF8


The technical specifications of the PEFF8 include the specifications specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

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1.1.1.1.218 Specifications Specified for Optical Interfaces


Table 8-35 provides the specifications of the optical interfaces on the PEFF8.
Figure 1.1 Specifications of the electrical interfaces
Item

Value

Type of
interface

100BASE-FX

100BASE-LX

100BASEVX

100BASE-ZX

Transmission
distance (km)

15

40

80

Type of fiber

Multi-mode LC

Single-mode LC

Single-mode
LC

Single-mode
LC

Launched
optical power
range (dBm)

-19 to -14

-15 to -8

-5 to 0

-5 to 0

Operating
wavelength
range (nm)

1270 to 1380

1261 to 1360

1263 to 1360

1480 to 1580

Minimum
overload
(dBm)

-14

-8

-10

-10

Receiver
sensitivity
(dBm)

-30

-28

-34

-34

Minimum
extinction
ratio (dB)

10

8.2

10

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

Table 8-36 lists the parameters specified for the single-fiber bidirectional optical interfaces of
the PEFF8.
Figure 1.2 Parameters specified for the single-fiber bidirectional optical interfaces of the PEFF8
Parameter

Value

Type of
interface

100BASE-LX

100BASE-LX

100BASE-VX

100BASE-VX

Transmissi

15

15

40

40

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Parameter

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Value

on distance
(km)
Type of
fiber

Single-mode
LC

Single-mode LC

Single-mode LC

Single-mode LC

Operating
transmit
wavelength
(nm)

1550

1310

1550

1310

Operating
receive
wavelength
(nm)

1310

1550

1310

1550

Launched
optical
power
range
(dBm)

-8 to -15

-8 to -15

-5 to 0

-5 to 0

Receiver
sensitivity
(dBm)

-32

-32

-32

-32

Minimum
overload
(dBm)

-8

-8

-10

-10

Minimum
extinction
ratio (dB)

8.5

8.5

10

10

1.1.1.1.219 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.220 Mechanical Specifications


The mechanical specifications of the PEFF8 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight: 0.5 kg

1.1.1.1.221 Power Consumption


The maximum power consumption of the PEFF8 at room temperature (25C) is 13 W.

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8.3 CQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the CQ1 (4-channel channelized STM-1 CES optical interface
board).

8.3.1 Version Description


The CQ1 is available in one functional version, namely, N1.

8.3.2 Application
The CQ1 directly receives channelized STM-1 services from the TDM domain, transmits the
channelized STM-1 services on the packet ring, and directly separates the channelized STM-1
services from other services on the Base Station Controller (BSC) side. In this manner, the
smooth evolution from the TDM domain to the packet domain is implemented.
Figure 8-7 shows the application of the CQ1. The CQ1 works with the PEG8 to transmit
channelized STM-1 services on the packet ring.
Figure 1.1 Networking and application of the CQ1
BSC

NMS
STM-1

CQ1
PEX2

PEX2

PEG8

10GE Ring

TDM ring
FE

Traffic direction
Dual-domain (TDM
domain and packet
domain) crossconnect board

PEG8

PEG8
MD75

E1

FE

E1

NodeB
BTS

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STM1/STM-4
Ring

PEG8

PEG8
MD12

PEG8

Packet ring

GE Ring

GE Ring

PEG8

STM1/STM-4
Ring

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8.3.3 Functions and Features


The CQ1 receives four-port channelized STM-1 services, and works with the PEG8 to process
CES service signals.
Table 8-37 provides the functions and features of the CQ1.
Figure 1.1 Functions and features of the CQ1
Function and
Feature

CQ1

Basic functions

Transmits and receives four-port channelized STM-1 optical signals,


and works with the PEG8 to process four-port channelized STM-1 CES
services.

Interface types

Supports different types of standard optical interfaces, namely, S-1.1,


L-1.1, and L-1.2 to meet requirements for transmission distances. The
characteristics of the optical interfaces comply with ITU-T G.957.

Interface
characteristics

ALS

Not supported

Loopback types of the port

Inloops and outloops at STM-1


ports
Inloops and outloops on VC-12
paths

CES

Auto disabling of port loopback

Supported

Detection and query of optical


module information

Supported

Hot insertion and removal of SFP


optical modules

Supported

Supported CES services

252

Supported emulation mode

CESoPSN
SAToP
NOTE
For CES services in CESoPSN mode,
CQ1 boards can compress idle
timeslots to improve the bandwidth
utilization on the NNI side.

Jitter buffering time

0.375 ms to 16 ms; increment:


0.125 ms

Packet loading time

0.25 ms TO 5 ms; increment:


0.125 ms
NOTE
The packet loading time needs to
be set to the same value for the
NEs at both ends.

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the packet loading time.

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Function and
Feature

CQ1

Protection
scheme

Supports the 1+1 and 1:1 Packet-based linear MSP.

SSM protocol

Supported

PRBS

Not supported

Query of laser
transmission
distance

Supported

8.3.4 Working Principle and Signal Flow


The CQ1 consists of the line processing module, CES service processing module,
management module, clock module, and power module.
Figure 8-8 shows the functional block diagram of the CQ1.
Figure 1.1 Functional block diagram of the CQ1
Backplane
4-port channelized
STM-1 signals

Line
processing
module

CES service
processing
module

Service signal

Management bus

3.3. V
.
.

1.2 V

.
.
.

Clock
module

PEG8

Management bus
Management bus

Management
module

Line clock

Service
signal

Line clock
System clock

Power
module

PEG8

PEG8

PEG8
+3.3 V backup
power supply

1.1.1.1.222 Receive Direction


In the receive direction, the line processing module receives four-channel channelized STM-1
services through the interfaces on the front panel of the CQ1 board. The line processing
module demultiplexes STM-1 signals into VC-12 signals, and demaps the VC-12 signals into
E1 signals. Then, the line processing module processes the overhead bytes, pointers, and
alarm signals, and sends the E1 signals to the CES service processing module. Then, the CES
service processing module rearranges the E1 frames, processes the rearranged signals based
on the service type, and performs PWE3 encapsulation and PW scheduling. Finally, the CES
service processing module sends the processed signals to the PEG8 through the interface on
the backplane.
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1.1.1.1.223 Transmit Direction


In the transmit direction, the CES service processing module receives service signals from the
PEG8, identifies the service type, and performs PWE3 decapsulation and queue scheduling.
Then, the CES service processing module sends the processed signals to the line processing
module. The line processing module maps the E1 service signals into VC-12 signals, and
multiplexes the VC-12 signals into STM-1 signals. Then, the line processing module
processes the overhead bytes, pointers, and alarm signals, and sends out the STM-1 signals
through the interface on the front panel of the CQ1.

1.1.1.1.224 Line Processing Module


The line processing module performs the following functions.

In the receive direction, the line processing module receives four-port channelized STM1 services, demultiplexes STM-1 signals into VC-12 signals, and demaps the VC-12
signals into E1 signals. Then, the line processing module processes the overhead bytes,
pointers, and alarm signals.

In the transmit direction, the line processing module receives E1 signals from the PEG8,
maps the E1 service signals into VC-12 signals, and multiplexes the VC-12 signals into
STM-1 signals. Then, the line processing module processes the overhead bytes, pointers,
and alarm signals, and sends out the STM-1 signals through the interface on the front
panel of the CQ1.

In the case of a service fault, the line processing module implements the LMSP, and
performs service switching.

The line processing module extracts and restores line clock signals.

1.1.1.1.225 CES Service processing module


The CES service processing module performs the following functions.

In the receive direction, the CES service processing module receives signals from the
line processing module, rearranges the E1 frames, and processes the signals (for
example, compresses timeslots for the CES service). Then, the CES service processing
module performs PWE3 encapsulation and PW scheduling, and sends the processed
signals to the PEG8 through the interface on the backplane.

In the transmit direction, the CES service processing module receives signals from the
PEG8, performs interface conversion, and performs PWE3 decapsulation and service
scheduling. Then, the CES service processing module processes the signals, and sends
the processed signals to the line processing module.

1.1.1.1.226 Management Module


The management module manages and controls the modules on the CQ1.

1.1.1.1.227 Clock Module


The clock module provides clock information for the modules on the CQ1.

1.1.1.1.228 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.
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8.3.5 Front Panel


The front panel of the CQ1 has indicators, interfaces, a bar code, and a laser safety class label.

1.1.1.1.229 Diagram of the Front Panel


Figure 8-9 shows the appearance of the front panel of the CQ1.
Figure 1.1 Front panel of the CQ1

CQ1
STAT
ACT
SRV

OUT1 IN1OUT2 IN2 OUT3 IN3OUT4 IN4

CQ1

1.1.1.1.230 Indicators

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the Boards.

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1.1.1.1.231 Interfaces
The front panel of the CQ1 has four optical interfaces. Table 8-38 describes the type and
usage of the optical interfaces of the CQ1.
Figure 1.1 Interfaces of the CQ1
Optical
Interface

Type of Interface

Usage

IN1-IN4

LC (pluggable)

Channelized STM-1 signal input interface

OUT1OUT4

LC (pluggable)

Channelized STM-1 signal output interface

8.3.6 Jumpers and DIP Switches


The CQ1 does not have any jumpers or DIP switches that are used for board settings.

8.3.7 Valid Slots


The CQ1 must be installed in a valid slot on the subrack. Otherwise, the CQ1 fails to work
normally.
The CQ1 can be installed in any slot of slots 19-26 and slots 29-36.
The CQ1 needs to be used with the PEG8. Table 7-46 lists the slots valid for the PEG8 and
the corresponding slots for the CQ1.

8.3.8 Feature Code


The CQ1 does not have any feature code.

8.3.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.232 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the
board.
Step 4 Required: Install the board. For information on how to install the board, see Replacing
Boards Onsite. Ensure that the board is in proper contact with the bottom of the subrack and
that the front panel of the board is properly locked.

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Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

1.1.1.1.233 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure the CES service interface. For details, see Configuring CES Ports.
For more information about the parameters of the board, see 26.3 Packet Interface Boards.

Step 7 Required: Configure services. For details, see Operation Tasks for Configuring CES
Services.
Based on the actual requirements, you can configure the following CES services:

UNI-UNI CES services (For the configuration example, see Configuration Example
(UNI-UNI CES Services).)

UNI-NNI CES services (For the configuration example, see Configuration Example
(UNI-NNI CES Services).)

Step 8 Optional: Configure linear MSP. For details, see Creating Packet-Based Linear MSP.
----End

1.1.1.1.234 Commissioning the Board


Step 1 Required: Test the CES service channel. For details, see Testing CES Services.
----End

1.1.1.1.235 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

8.3.10 Parameter Settings


You can set the parameters for the CQ1 by using the U2000.
You can set the following parameters for the CQ1 by using the U2000.

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J1

J2

C2

V5

SDH interface

8 Packet Interface Boards

For more parameters and the description of the parameters, see 26.3 Packet Interface Boards.

8.3.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.236 Troubleshooting
Table 8-39 lists the faults that occur on the CQ1 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the CQ1 frequently
Fault Symptom

Common Fault
Cause

Service fault

The service is
interrupted.

Bit errors are


generated in the
service.

Troubleshooting Method
See CES Service Troubleshooting.

1.1.1.1.237 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the CQ1, see Replacing a Packet Interface Board.

8.3.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

8.3.12.1 Alarms of N1CQ1


CES_LOSPKT_EXC

CES_MISORDERPKT_EX
C

CES_STRAYPKT_EXC

CES_MALPKT_EXC

CES_JTRUDR_EXC

CES_JTROVR_EXC

CES_RDI

CESPW_OPPOSITE_RAI

CESPW_OPPOSITE_ACF
AULT

R_OOF

R_LOS

R_LOF

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B2_SD

R_LOC

B2_EXC

BIP_SD

B3_EXC

B3_SD

BIP_EXC

ALM_E1RAI

AU_AIS

BD_STATUS

HP_SLM

J0_MM

AU_LOP

HP_REI

HP_UNEQ

HP_TIM

HP_LOM

HARD_BAD

HP_RDI

IN_PWR_LOW

IN_PWR_ABN

HARD_ERR

LFA

LASER_MOD_ERR

IN_PWR_HIGH

LP_RDI_VC12

LMFA

LASER_SHUT

LP_SLM_VC12

LP_REI_VC12

LOOP_ALM

LSR_BCM_ALM

LP_TIM_VC12

LP_RFI

MS_AIS

LSR_NO_FITED

LP_UNEQ_VC12

OUT_PWR_ABN

MS_RDI

LSR_WILL_DIE

TEM_LA

POWER_ABNORMAL

MS_REI

TU_AIS_VC12

TEMP_OVER

TEM_HA

V5_VCAIS

TU_LOP_VC12

TF

WRG_BD_TYPE

UP_E1_AIS

8.3.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the U2000.

8.3.13.1 Performance Events of N1CQ1


Figure 1.1 SDH
RSBBE

RSES

RSSES

RSUAS

RSCSES

MSES

MSUAS

MSBBE

MSSES

MSFEBBE

MSCSES

MSFESES

MSFEUAS

MSFEES

AUPJCHIGH

AUPJCLOW

MSFECSES

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

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HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

LPBBE

LPES

LPSES

LPUAS

LPCSES

LPFEBBE

LPFEES

LPFESES

LPFEUAS

LPFECSES

MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

Figure 1.2 CES


CES_LOSPKTS

CES_MISORDERPKTS

CES_STRAYPKTS

CES_MALPKTS

CES_JTRUDR

CES_JTROVR

8.3.14 Technical Specifications of CQ1


The technical specifications of the CQ1 include the specifications of optical interfaces, laser
safety class, mechanical specifications, and power consumption.

1.1.1.1.238 Specifications of Optical Interfaces


Table 8-42 provides the specifications of the optical interfaces on the CQ1.
Figure 1.1 Specifications of the optical interfaces on the CQ1
Item

Value

Nominal bit rate

155520 kbit/s

Line code

NRZ

Type of optical
interface

S-1.1

L-1.1

L-1.2

Type of Fiber

Single-mode LC

Single-mode LC

Single-mode LC

Transmission
distance (km)

2 to 15

15 to 40

40 to 80

Operating
wavelength range
(nm)

1261 to 1360

1263 to 1360

1480 to 1580

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Item

Value

Launched optical
power range
(dBm)

-15 to -8

-5 to 0

-5 to 0

Receiver
sensitivity (dBm)

-28

-34

-34

Minimum
overload (dBm)

-8

-10

-10

Minimum
extinction ratio
(dB)

8.2

10

10

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

1.1.1.1.239 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.240 Mechanical Specifications


The mechanical specifications of the N1CQ1 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight: 0.5 kg

1.1.1.1.241 Power Consumption


The maximum power consumption of the N1CQ1 at the room temperature (25C) is 10 W.

8.4 MD12
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MD12 (multi-protocol 32-channels E1 interface processing
board). This topic also describes how to configure and commission the MD12.
The interface on the MD12 is a 120-ohm E1 interface.

8.4.1 Version Description


The MD12 is available in one functional version, namely, N1.
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8.4.2 Application
The MD12 directly receives E1 services from the TDM domain, transmits the E1 services on
the packet ring, and directly separates the E1 services from other services on the BSC side. In
this manner, the smooth evolution from the TDM domain to the packet domain is
implemented.
Figure 8-10 shows the application of the MD12. The MD12 works with the PEG8 to transmit
E1 services on the packet ring.
Figure 1.1 Networking and application of the MD12
BSC

NMS
STM-1

CQ1
PEX2

PEX2

PEG8

10GE Ring

TDM ring
FE

Traffic direction
Dual-domain (TDM
domain and packet
domain) crossconnect board

PEG8
MD75

E1

FE

E1

PEG8

STM1/STM-4
Ring

PEG8

PEG8
MD12

PEG8

Packet ring

GE Ring

GE Ring

PEG8

STM1/STM-4
Ring

NodeB
BTS

NodeB

BTS

8.4.3 Functions and Features


The MD12 receives and transmits 32xE1 signals and works with the PEG8 to process E1 CES
and ATM/IMA services.
Table 8-43 provides the functions and features of the MD12.

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Figure 1.1 Functions and features of the MD12


Function
and
Feature

MD12

Basic
functions

Transmits and receives 32xE1 signals, and works with the PEG8 to process E1
CES and ATM/IMA services.

Interface
types

Supports 120-ohm E1 electrical interface. The electrical interface uses the


DB44 connector.

Interface
characteri
stics

Loopba
ck
types of
the port

Inloop

Auto
disablin
g of
port
loopbac
k

Supported

Numbe
r of
CES
service
s

32

Emulati
on
mode

CESoPSN, SAToP

Jitter
compen
sation
bufferin
g time

The jitter compensation buffering time of CES services can be set to


a value in the range of 0.375 ms to 16 ms with a step of 0.125 ms.

Packet
loading
time

The packet loading time of CES services can be set to a value in the
range of 0.125 ms to 5 ms with a step of 0.125 ms.

CES

Outloop
Non-loopback

NOTE
The packet loading time needs to be set to the same value for the NEs at
both ends.

ATM/IM
A

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Numbe
r of
IMA
groups

32

Maxim
um
number
of E1
links in

16

The jitter compensation buffering time needs to be more than at least two
times of the packet loading time.

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Function
and
Feature

8 Packet Interface Boards

MD12

each
IMA
group

Clock
function

Numbe
r of VUNI
ports

512

Numbe
r of VNNI
ports

128

Cell
concate
nation

Type

Concatenation, non-concatenation

Quantit
y

31

ATM
OAM

Type

CC, LB, RDI, AIS

Quantit
y

512

Service
categor
ies

CBR, UBR, UBR+, rt-VBR, nrt-VBR

ATM
QoS

Supported

Restores four CES adaptive clock recover (ACR) clocks.


Clocks that are recovered from services over ports 1 and 9 can be added to the
clock priority list.
NOTE
Clock recovery over ports 1 to 16 is independent of clock recovery over ports 17 to 32.
That is, clocks that are recovered from services over ports 1 to 16 can be transmitted out
of ports 1 to 16 and clocks that are recovered from services over ports 17 to 32 can be
transmitted out of ports 17 to 32.

Clock
mode

Line Clock Mode and Null.

Line code
of E1 link

HDB3 code

Frame
format of
E1 link

Unframed format, double-framed format, or E1 CRC-4 multiframe format


(default value)

Maintena
nce
features

Supports the query of the board manufacturer information.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting services.

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MD12

Supports the tributary PRBS function.

8.4.4 Working Principle and Signal Flow


The MD12 consists of the tributary processing module, service processing module,
management module, clock module, and power supply module.
Figure 8-11 shows the functional block diagram of the MD12.
Figure 1.1 Functional block diagram of the MD12
Backplane
32xE1
signals

Tributary
processing
module

Service
processing
module

Service signal

Management bus

3.3. V
.
.

1.2 V

.
.
.

Clock
module

PEG8

Management bus
Management bus

Management
module

Line clock

Service
signal

PEG8

Line clock
System clock

Power
module

PEG8

PEG8
+3.3 V backup
power supply

1.1.1.1.242 Receive Direction


The tributary processing module receives E1 signals, and performs the functions of
impedance matching, signal equalization, level conversion, clock recovery, de-jitter, and
decoding. After the tributary processing module processes the E1 signals, the signals are sent
to the service processing module for framing, PWE3 encapsulation and mapping, and PW
scheduling. Then, the signals are sent to the PEG8 through the backplane interface module.

1.1.1.1.243 Transmit Direction


The cross-connect unit receives packets from the backplane interface module, and sends the
packets to the service processing module. The service processing module decapsulates the
packets, buffers the data in queues, schedules the queues based on service types, and then
processes and converts the data. The converted data is sent to the tributary processing module.
The tributary processing module performs the functions of coding, dejitter, pulse shaping, and
line drive, and then sends the services to E1 interfaces.
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1.1.1.1.244 Tributary Processing Module


The tributary processing module consists of 32 independent receive channels and transmit
channels.

The receive channels implement the functions of impedance matching, signal


equalization, level conversion, clock recovery, de-jitter, and decoding.

The transmit channels implement the functions of coding, dejitter, pulse shaping, and
line drive.

1.1.1.1.245 Service Processing Module


The service processing module performs the following functions:

In the receive direction, the service processing module obtains the PW information of
each E1 service, performs PWE3 encapsulation and PW scheduling, and then sends the
signals to the PEG8 through the backplane interface.

In the transmit direction, the service processing module receives the services from the
PEG8, identifies different service types, and performs PWE3 decapsulation and service
scheduling.

1.1.1.1.246 Management Module


The management module manages and controls the modules on the MD12.

1.1.1.1.247 Clock Module


Provides the clock signal for each module of the MD12.

1.1.1.1.248 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.

8.4.5 Front Panel


The front panel of the MD12 has interfaces and a bar code.

1.1.1.1.249 Diagram of the Front Panel


Figure 8-12 shows the appearance of the front panel of the MD12.

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Figure 1.1 Front panel of the MD12

MD12

MD12

1.1.1.1.250 Interfaces
The front panel of the MD12 has four DB44 interfaces. Table 8-44 describes the types and
usage of the interfaces of the MD12.
Figure 1.1 Interfaces of the MD12
Interface

Type of Interface

Usage

1-8

DB44

Receives E1 signals from the 1st channel to the 8th


channel.

9-16

DB44

Receives E1 signals from the 9th channel to the


16th channel.

17-24

DB44

Receives E1 signals from the 17th channel to the


24th channel.

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Interface

Type of Interface

Usage

25-32

DB44

Receives E1 signals from the 25th channel to the


32nd channel.

Table 8-45 lists the pins of the DB44 interface.


Figure 1.2 Pin description of the DB44 interfaces on the MD12
Front View
30

15

44

Pin

Usage

Pin

Usage

38

R1 to receive
the first channel
of signals

34

R5 to receive the
fifth channel of
signals

R2 to receive
the second
channel of
signals

33

R3 to receive
the third channel
of signals

32

R4 to receive
the fourth
channel of
signals

31

T1 to transmit
the first channel
of signals

11

T2 to transmit
the second
channel of
signals

10

T3 to transmit
the third channel
of signals

T4 to transmit
the fourth
channel of
signals

23
37
22
36
21
35

31
16

20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

R6 to receive the
sixth channel of
signals
R7 to receive the
seventh channel of
signals
R8 to receive the
eighth channel of
signals
T5 to transmit the
fifth channel of
signals
T6 to transmit the
sixth channel of
signals
T7 to transmit the
seventh channel of
signals
T8 to transmit the
eighth channel of
signals

8.4.6 Jumpers and DIP Switches


The MD12 does not have any jumpers or DIP switches that are used for board settings.

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8.4.7 Valid Slots


The MD12 must be installed in a valid slot in the subrack. Otherwise, the MD12 fails to work
normally.
The MD12 can be installed in any slot of slots 19-26 and slots 29-36.
The MD12 needs to be used with the PEG8. Table 7-46 lists the slots valid for the PEG8 and
the corresponding slots for the MD12.

8.4.8 Feature Code


The MD12 does not have the feature code.

8.4.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.251 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the
board.
Step 4 Required: Install the board. For information on how to install the board, see Replacing
Boards Onsite. Ensure that the board is in proper contact with the bottom of the subrack and
that the front panel of the board is properly locked.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

1.1.1.1.252 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure the CES service. For details, see Configuring CES Ports. Configure the
ATM port. For details, see Configuring ATM Interfaces
For more information about the parameters of the board, see 26.3 Packet Interface Boards.

Step 7 Required: Configure services. Based on the actual requirements, you can configure the
following CES services:

UNI-UNI CES services (For the configuration example, see Configuration Example
(UNI-UNI CES Services).)

UNI-NNI CES services (For the configuration example, see Configuration Example

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(UNI-NNI CES Services).)

UNI-UNI ATM services (For the configuration example, see Configuration Example
(UNI-UNI ATM Services).)

UNI-NNI ATM services (For the configuration example, see Configuration Example
(UNIs-NNI ATM Services).)

----End

1.1.1.1.253 Commissioning the Board


Step 1 Required: Test the CES service channel. For details, see Testing CES Services.
----End

1.1.1.1.254 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 8 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

8.4.10 Parameter Settings


You can set the parameters for the MD12 by using the U2000.
You can set the PDH interfaces parameters for the MD12 by using the U2000.
For the description of the PDH interfaces parameter, see 26.3 Packet Interface Boards.

8.4.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.255 Troubleshooting
Table 8-46 lists the faults that occur on the MD12 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the MD12 frequently
Fault Symptom

Common Fault Cause

CES service fault

The service is interrupted.

Bit errors are generated in the service.

The service is interrupted.

ATM/IMA service fault


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Fault Symptom

Common Fault Cause

Bit errors are generated in the service.

1.1.1.1.256 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the MD12, see Replacing a Packet Interface Board.

8.4.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

8.4.12.1 Alarms of N1MD12


TEMP_OVER

HARD_BAD

POWER_ABNORMAL

BD_STATUS

ALM_E1RAI

WRG_BD_TYPE

CES_LOSPKT_EXC

CES_MISORDERPKT_EX
C

CES_STRAYPKT_EXC

CES_MALPKT_EXC

CES_JTRUDR_EXC

CES_JTROVR_EXC

CES_RDI

CESPW_OPPOSITE_RAI

CESPW_OPPOSITE_ACFA
ULT

T_ALOS

UP_E1_AIS

E1_LOC

LFA

LMFA

HARD_ERR

IMA_GROUP_RE_DOW
N

IMA_TXCLK_MISMATCH
ALM_IMA_LIF

IMA_GROUP_LE_DOWN

ALM_IMA_LODS

ALM_IMA_RFI

ALM_IMA_RE_TX_UNUS
ABLE

ALM_IMA_RE_RX_UN
USABLE

ATMPW_LOSPKT_EXC

ATMPW_MISORDERPKT_
EXC

ATMPW_UNKNOWNCE
LL_EXC

CES_ACR_LOCK_ABN

VP_AIS

VP_RDI

VC_AIS

VC_RDI

VP_LOC

VC_LOC

OCD

LCD

UHCS

CHCS

LOOP_ALM

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8.4.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the U2000.

8.4.13.1 Performance Events of N1MD12


Figure 1.1 SDH
BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

E1_LCV_SDH

E1_LES_SDH

E1_LSES_SDH

E1_LLOSS_SDH

MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

Figure 1.2 CES


CES_LOSPKTS

CES_MISORDERPKTS

CES_STRAYPKTS

CES_MALPKTS

CES_JTRUDR

CES_JTROVR

MPLS_PW_FL

MPLS_PW_FD

PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILIS
ATION

CES_RX_PKTS

Figure 1.3 MPLS PW OAM


MPLS_PW_FLR
MPLS_PW_FDV

Figure 1.4 PW

Figure 1.5 ATM


ATM_UNI1_INCELLS

ATM_UNI1_OUTCELLS

ATM_UNI2_INCELLS

ATM_UNI2_OUTCELLS

ATM_CORRECTED_HCSER
R

ATM_UNCORRECTED_H
CSERR

ATM_RCVCELLS

ATM_RCVIDLECELLS

ATM_SNDCELLS

ATM_IF_INRATE_MAX

ATM_IF_INRATE_MIN

ATM_IF_INRATE_AVG

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ATM_IF_OUTRATE_MA
X

ATM_IF_OUTRATE_MIN

ATM_IF_OUTRATE_AVG

ATM_CELL_AVAILABI
LITY

ATM_UNI1_INRATE_MAX

ATM_UNI1_INRATE_MIN

ATM_UNI1_INRATE_AV
G

ATM_UNI1_OUTRATE_MA
X

ATM_UNI1_OUTRATE_M
IN

ATM_UNI1_OUTRATE_
AVG

ATM_UNI2_INRATE_MAX

ATM_UNI2_INRATE_MIN

ATM_UNI2_INRATE_AV
G

ATM_UNI2_OUTRATE_MA
X

ATM_UNI2_OUTRATE_M
IN

ATM_UNI2_OUTRATE_
AVG

PORT_RX_BW_UTILIZATI
ON

PORT_TX_BW_UTILIZAT
ION

Figure 1.6 ATM PWE3


ATMPW_SNDCELLS

ATMPW_RCVCELLS

ATMPW_UNKNOWN
CELLS

8.4.14 Technical Specifications of MD12


The technical specifications of the MD12 include the specifications of electrical interfaces,
mechanical specifications, and power consumption.

1.1.1.1.257 Specifications of Electrical Interfaces


Figure 1.1 Specifications of the electrical interfaces of the MD12
Item

Value

Nominal bit rate

2048 kbit/s

Type of electrical interface

DB44

Code pattern

HDB3 code

Signal bit rate at the output port

Compliant with ITU-T G.703

Permitted frequency deviation at the


input port
Allowed attenuation at the input port
Input jitter tolerance
Impedance (ohm)

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1.1.1.1.258 Mechanical Specifications


The mechanical specifications of the MD12 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight: 0.5 kg

1.1.1.1.259 Power Consumption


The maximum power consumption of the MD12 at the room temperature (25C) is 12 W.

8.5 MD75
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MD75 (multi-protocol 32-channels E1 interface processing
board). This topic also describes how to configure and commission the MD75.
The interface on the MD12 is a 120-ohm E1 interface.

8.5.1 Version Description


The MD75 is available in one functional version, namely, N1.

8.5.2 Application
The MD75 directly receives E1 services from the TDM domain, transmits the E1 services on
the packet ring, and directly separates the E1 services from other services on the BSC side. In
this manner, the smooth evolution from the TDM domain to the packet domain is
implemented.
Figure 8-13 shows the application of the MD75. The MD75 works with the PEG8 to transmit
E1 services on the packet ring.

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Figure 1.1 Networking and application of the MD75


BSC

NMS
STM-1

CQ1
PEX2

PEX2

PEG8

10GE Ring

TDM ring
FE

Traffic direction

PEG8

PEG8
MD75

E1

FE

E1

Dual-domain (TDM
domain and packet
domain) crossconnect board

STM1/STM-4
Ring

PEG8

PEG8
MD12

PEG8

Packet ring

GE Ring

GE Ring

PEG8

STM1/STM-4
Ring

NodeB
BTS

NodeB

BTS

8.5.3 Functions and Features


The MD75 receives and transmits 32xE1 signals and works with the PEG8 to process E1 CES
and ATM/IMA services.
Table 8-54 provides the functions and features of the MD75.
Figure 1.1 Functions and features of the MD75
Function
and
Feature

MD75

Basic
functions

Transmits and receives 32xE1 signals, and works with the PEG8 to process E1
CES and ATM/IMA services.

Interface
types

Supports 75-ohm E1 electrical interface. The electrical interface uses the DB44
connector.

Interface
character

Loo
pbac
k

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Function
and
Feature

MD75

istics

type
s of
the
port

Non-loopback

Auto
disa
blin
g of
port
loop
back

Supported

Num
ber
of
CES
servi
ces

32

Emu
latio
n
mod
e

CESoPSN, SAToP

Jitter
com
pens
ation
buff
erin
g
time
of
CES
servi
ces

The jitter compensation buffering time of CES services can be set to a


value in the range of 0.375 ms to 16 ms with a step of 0.125 ms.

Pack
et
loadi
ng
time
of
CES
pack
ets

The packet loading time of CES services can be set to a value in the
range of 0.125 ms to 5 ms with a step of 0.125 ms.

Num
ber
of
IMA

32

CES

ATM/IM
A

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The packet loading time needs to be set to the same value for the NEs at both
ends.

The jitter compensation buffering time needs to be more than at least two times
of the packet loading time.

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MD75

grou
ps

Clock
function
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Max
imu
m
num
ber
of
E1
links
in
each
IMA
grou
p

16

Num
ber
of
VUNI
ports

512

Num
ber
of
VNNI
ports

128

Cell
conc
aten
ation

Type

Concatenation, non-concatenation

Quanti
ty

31

AT
M
OA
M

Type

CC, LB, RDI, AIS

Quanti
ty

512

Serv
ice
cate
gori
es

CBR, UBR, UBR+, rt-VBR, nrt-VBR

AT
M
QoS

Supported

Recovers four CES ACR clocks.


Clocks that are recovered from services over ports 1 and 9 can be added to the
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clock priority list.


NOTE
Clock recovery over ports 1 to 16 is independent of clock recovery over ports 17 to 32.
That is, clocks that are recovered from services over ports 1 to 16 can be transmitted out
of ports 1 to 16 and clocks that are recovered from services over ports 17 to 32 can be
transmitted out of ports 17 to 32.

Clock
mode

Line Clock Mode and Null.

Line
code of
E1 link

HDB3 code

Frame
format of
E1 link

Unframed format, double-framed format, or E1 CRC-4 multiframe format


(default value)

Loopbac
k mode

Inloop, outloop, or non-loopback (default value)

Maintena
nce
features

Supports the query of the board manufacturer information.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting services.

Supports the tributary PRBS function.

8.5.4 Working Principle and Signal Flow


The MD75 consists of the tributary processing module, service processing module,
management module, clock module, and power supply module.
Figure 8-14 shows the functional block diagram of the MD75.

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Figure 1.1 Functional block diagram of the MD75


Backplane
32xE1
signals

Tributary
processing
module

Service
processing
module

Service signal

Management bus

3.3. V
.
.

1.2 V

.
.
.

Clock
module

PEG8

Management bus
Management bus

Management
module

Line clock

Service
signal

PEG8

Line clock
System clock

Power
module

PEG8

PEG8
+3.3 V backup
power supply

1.1.1.1.260 Receive Direction


The tributary processing module receives E1 signals, and performs the functions of
impedance matching, signal equalization, level conversion, clock recovery, de-jitter, and
decoding. After the tributary processing module processes the E1 signals, the signals are sent
to the service processing module for framing, PWE3 encapsulation and mapping, and PW
scheduling. Then, the signals are sent to the PEG8 through the backplane interface module.

1.1.1.1.261 Transmit Direction


The cross-connect unit receives packets from the backplane interface module, and sends the
packets to the service processing module. The service processing module decapsulates the
packets, buffers the data in queues, schedules the queues based on service types, and then
processes and converts the data. The converted data is sent to the tributary processing module.
The tributary processing module performs the functions of coding, dejitter, pulse shaping, and
line drive, and then sends the services to E1 interfaces.

1.1.1.1.262 Tributary Processing Module


The tributary processing module consists of 32 independent receive channels and transmit
channels.

The receive channels implement the functions of impedance matching, signal


equalization, level conversion, clock recovery, de-jitter, and decoding.

The transmit channels implement the functions of coding, dejitter, pulse shaping, and
line drive.

1.1.1.1.263 Service Processing Module


The service processing module performs the following functions:

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In the receive direction, the service processing module obtains the PW information of
each E1 service, performs PWE3 encapsulation and PW scheduling, and then sends the
signals to the PEG8 through the backplane interface.

In the transmit direction, the service processing module receives the services from the
PEG8, identifies different service types, and performs PWE3 decapsulation and service
scheduling.

1.1.1.1.264 Management Module


The management module manages and controls the modules on the MD75.

1.1.1.1.265 Clock Module


Provides the clock signal for each module of the MD75.

1.1.1.1.266 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.

8.5.5 Front Panel


The front panel of the MD75 has interfaces and a bar code.

1.1.1.1.267 Diagram of the Front Panel


Figure 8-15 shows the appearance of the front panel of the MD75.

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Figure 1.1 Front panel of the MD75

MD75

MD75

1.1.1.1.268 Interfaces
The front panel of the MD75 has four DB44 interfaces. Table 8-55 describes the types and
usage of the interfaces of the MD75.
Figure 1.1 Interfaces of the MD75
Interface

Type of Interface

Usage

1-8

DB44

Receives E1 signals from the 1st channel to the 8th


channel.

9-16

DB44

Receives E1 signals from the 9th channel to the


16th channel.

17-24

DB44

Receives E1 signals from the 17th channel to the


24th channel.

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Interface

Type of Interface

Usage

25-32

DB44

Receives E1 signals from the 25th channel to the


32nd channel.

Table 8-56 lists the pins of the DB44 interface.


Figure 1.2 Pin description of the DB44 interfaces on the MD75
Front View
30

15

44

Pin

Usage

Pin

Usage

38

R1 to receive
the first channel
of signals

34

R5 to receive the
fifth channel of
signals

R2 to receive
the second
channel of
signals

33

R3 to receive
the third channel
of signals

32

R4 to receive
the fourth
channel of
signals

31

T1 to transmit
the first channel
of signals

11

T2 to transmit
the second
channel of
signals

10

T3 to transmit
the third channel
of signals

T4 to transmit
the fourth
channel of
signals

23
37
22
36
21
35

31
16

20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

R6 to receive the
sixth channel of
signals
R7 to receive the
seventh channel of
signals
R8 to receive the
eighth channel of
signals
T5 to transmit the
fifth channel of
signals
T6 to transmit the
sixth channel of
signals
T7 to transmit the
seventh channel of
signals
T8 to transmit the
eighth channel of
signals

8.5.6 Jumpers and DIP Switches


The MD75 does not have any jumpers or DIP switches that are used for board settings.

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8.5.7 Valid Slots


The MD75 must be installed in a valid slot in the subrack. Otherwise, the MD75 fails to work
normally.
The MD75 can be installed in any slot of slots 19-26 and slots 29-36.
The MD75 needs to be used with the PEG8. Table 7-46 lists the slots valid for the PEG8 and
the corresponding slots for the MD75.

8.5.8 Feature Code


The MD75 does not have any feature code.

8.5.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.269 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the
board.
Step 4 Required: Install the board. For information on how to install the board, see Replacing
Boards Onsite. Ensure that the board is in proper contact with the bottom of the subrack and
that the front panel of the board is properly locked.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the U2000 software. Ensure that the version of the board software
is correct.
----End

1.1.1.1.270 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure the CES service. For details, see Configuring CES Ports. Configure the
ATM port. For details, see Configuring ATM Interfaces
For more information about the parameters of the board, see 26.3 Packet Interface Boards.

Step 7 Required: Configure services. Based on the actual requirements, you can configure the
following CES services:

UNI-UNI CES services (For the configuration example, see Configuration Example
(UNI-UNI CES Services).)

UNI-NNI CES services (For the configuration example, see Configuration Example

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(UNI-NNI CES Services).)

UNI-UNI ATM services (For the configuration example, see Configuration Example
(UNI-UNI ATM Services).)

UNI-NNI ATM services (For the configuration example, see Configuration Example
(UNIs-NNI ATM Services).)

----End

1.1.1.1.271 Commissioning the Board


Step 1 Required: Test the CES service channel. For details, see Testing CES Services.
----End

1.1.1.1.272 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 8 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

8.5.10 Parameter Settings


You can set the parameters for the MD75 by using the U2000.
You can set the PDH interfaces parameters for the MD75 by using the U2000.
For the description of the PDH interfaces parameter, see 26.3 Packet Interface Boards.

8.5.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.273 Troubleshooting
Table 8-57 lists the faults that occur on the MD75 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the MD75 frequently
Fault Symptom

Common Fault Cause

Service fault

The service is interrupted.

Bit errors are generated in the service.

The service is interrupted.

ATM/IMA service fault


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Fault Symptom

Common Fault Cause

Bit errors are generated in the service.

1.1.1.1.274 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the MD75, see Replacing a Packet Interface Board.

8.5.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

8.5.12.1 Alarms of N1MD75


TEMP_OVER

HARD_BAD

POWER_ABNORMAL

BD_STATUS

ALM_E1RAI

WRG_BD_TYPE

CES_LOSPKT_EXC

CES_MISORDERPKT_EX
C

CES_STRAYPKT_EXC

CES_MALPKT_EXC

CES_JTRUDR_EXC

CES_JTROVR_EXC

CES_RDI

CESPW_OPPOSITE_RAI

CESPW_OPPOSITE_ACFA
ULT

T_ALOS

UP_E1_AIS

E1_LOC

LFA

LMFA

HARD_ERR

IMA_GROUP_RE_DOW
N

IMA_TXCLK_MISMATCH
ALM_IMA_LIF

IMA_GROUP_LE_DOWN

ALM_IMA_LODS

ALM_IMA_RFI

ALM_IMA_RE_TX_UNUS
ABLE

ALM_IMA_RE_RX_UN
USABLE

ATMPW_LOSPKT_EXC

ATMPW_MISORDERPKT_
EXC

ATMPW_UNKNOWNCE
LL_EXC

CES_ACR_LOCK_ABN

VP_AIS

VP_RDI

VC_AIS

VC_RDI

VP_LOC

VC_LOC

OCD

LCD

UHCS

CHCS

LOOP_ALM

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8.5.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the U2000.

8.5.13.1 Performance Events of N1MD75


Figure 1.1 SDH
BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

E1_LCV_SDH

E1_LES_SDH

E1_LSES_SDH

E1_LLOSS_SDH

MPLS_PW_LS

MPLS_PW_SLS

MPLS_PW_CSLS

MPLS_PW_UAS

Figure 1.2 CES


CES_LOSPKTS

CES_MISORDERPKTS

CES_STRAYPKTS

CES_MALPKTS

CES_JTRUDR

CES_JTROVR

MPLS_PW_FL

MPLS_PW_FD

PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILIS
ATION

CES_RX_PKTS

Figure 1.3 MPLS PW OAM


MPLS_PW_FLR
MPLS_PW_FDV

Figure 1.4 PW

Figure 1.5 ATM


ATM_UNI1_INCELLS

ATM_UNI1_OUTCELLS

ATM_UNI2_INCELLS

ATM_UNI2_OUTCELLS

ATM_CORRECTED_HCSER
R

ATM_UNCORRECTED_H
CSERR

ATM_RCVCELLS

ATM_RCVIDLECELLS

ATM_SNDCELLS

ATM_IF_INRATE_MAX

ATM_IF_INRATE_MIN

ATM_IF_INRATE_AVG

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ATM_IF_OUTRATE_MA
X

ATM_IF_OUTRATE_MIN

ATM_IF_OUTRATE_AVG

ATM_CELL_AVAILABI
LITY

ATM_UNI1_INRATE_MAX

ATM_UNI1_INRATE_MIN

ATM_UNI1_INRATE_AV
G

ATM_UNI1_OUTRATE_MA
X

ATM_UNI1_OUTRATE_M
IN

ATM_UNI1_OUTRATE_
AVG

ATM_UNI2_INRATE_MAX

ATM_UNI2_INRATE_MIN

ATM_UNI2_INRATE_AV
G

ATM_UNI2_OUTRATE_MA
X

ATM_UNI2_OUTRATE_M
IN

ATM_UNI2_OUTRATE_
AVG

PORT_RX_BW_UTILIZATI
ON

PORT_TX_BW_UTILIZAT
ION

Figure 1.6 ATM PWE3


ATMPW_SNDCELLS

ATMPW_RCVCELLS

ATMPW_UNKNOWN
CELLS

8.5.14 Technical Specifications of MD75


The technical specifications of the MD75 include the specifications of electrical interfaces,
mechanical specifications, and power consumption.

1.1.1.1.275 Specifications of Electrical Interfaces


Figure 1.1 Specifications of the electrical interfaces of the MD75
Item

Value

Nominal bit rate

2048 kbit/s

Type of electrical interface

DB44

Code pattern

HDB3 code

Signal bit rate at the output port

Compliant with ITU-T G.703

Permitted frequency deviation at the input


port
Allowed attenuation at the input port
Input jitter tolerance
Impedance (ohm)

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1.1.1.1.276 Mechanical Specifications


The mechanical specifications of the MD75 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight: 0.5 kg

1.1.1.1.277 Power Consumption


The maximum power consumption of the MD75 at room temperature (25C) is 12 W.

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EoD Boards

About This Chapter


The OptiX OSN equipment supports the EoD (Ethernet over Dual Domains) board EDQ41,
which bridges Ethernet services between the TDM domain and packet domain.
9.1 EDQ41
This topic describes the version, application, functions, working principle, front panel, valid
slots, and technical specifications of the EDQ41 (4-port 622/155 Mbit/s SDH optical interface
Ethernet double domain multiple function processing board).

9.1 EDQ41
This topic describes the version, application, functions, working principle, front panel, valid
slots, and technical specifications of the EDQ41 (4-port 622/155 Mbit/s SDH optical interface
Ethernet double domain multiple function processing board).

9.1.1 Version Description


The EDQ41 is available in one functional version, namely, N1.

9.1.2 Application
The EDQ41 is mainly used for interoperation between the SDH network and the packet
network. The board converges the TDM signals and Ethernet packets from the SDH access
network and deconverges the TDM signals to the SDH ring and the Ethernet packets to the
packet ring. In this manner, the board achieves the interoperation between the TDM domain
and the packet domain, facilitating the smooth evolution of the network.
Figure 9-1 shows the typical networking and application of the EDQ41.

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Figure 1.1 Networking and application of the EDQ41

RNC

BSC

STM-16/STM-64 ring

10GE ring
EDQ41

E1

GE ring

FE
FE
STM-1/STM-4 ring
Networking in the
TDM domain

Networking in the
packet domain

TDM traffic direction

Packet traffic direction

The EDQ41 is applicable in five typical networking scenarios. Figure 9-2 shows the service
signal flow in each application scenario.

Application 1: The EDQ41 receives EoS services from other NEs and then converts the
EoS services to packet services, therefore implementing transition from the STM1/STM-4 SDH network to the GE/10GE packet network.

Application 2: The EDQ41 receives EoS services from line boards on the same NE and
then converts the EoS services to packet services, therefore implementing transition from
the SDH network to the GE/10GE packet network.

Application 3: The EDQ41 board receives SDH services (including SDH services and
EoS services) from SDH line board, processes and then distributes the services to
GE/10GE packet networks and STM-1/STM-4 SDH networks.

Application 4: The EDQ41 board receives packet services from the local NE, processes
and then sends the services directly to the GE/10GE network. In this case, the EDQ41
board functions like a packet processing board.

Application 5: The EDQ41 board receives SDH services (including pure SDH services
and EoS services) from SDH line boards, processes and then sends the services directly
to the SDH network. In this case, the EDQ41 board functions like an SDH line board.
The EDQ41 supports the maximum processing capacity of 2.5 Gbit/s. Therefore, only 2.5 Gbit/s
services of the services received from STM-N (1N64) line boards can be processed and sent to the
packet network.

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Figure 1.2 Service signal flow on the EDQ41

Application 1:
STM-1/STM-4
(EoS service)

EDQ41
board

Packet
core

Packet
board

GE/10GE

TDM
core

Application 2:
EDQ41
board
STM-N
(EoS service)

SDH
board

Packet
core

Packet
board

GE/10GE

TDM
core

Application 3:
Packet
core
STM-N
(SDH/EoS service)

SDH board

TDM core

Packet board

Packet
core

Packet
board

EDQ41 board

GE/10GE

STM-1/STM-4

Application 4:
GE/10GE

EDQ41 board

GE/10GE

TDM core

Application 5:
Packet
core
STM-N
(SDH/EoS service)

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SDH board

TDM core

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9.1.3 Functions and Features


EDQ41 boards process 4x155 Mbit/s or 4x622 Mbit/s SDH services and 2.5 Gbit/s EoS
services at the same time.
As a dual-domain board, EDQ41 boards are applicable in the case of SDH services, packet
services, and EoS services. Table 9-1, Table 9-2, and Table 9-3 provide the functions and
features supported by EDQ41 boards in each service application scenario.
Figure 1.1 Functions and features supported by EDQ41 boards
Function and
Feature

Description

Basic functions

Transmits and receives 4xSTM-1/STM-4 optical signals.

Port specifications

The STM-1 or STM-4 optical module can be used.

When the STM-1 optical module is used, the standard S-1.1, L1.1, and L-1.2 optical ports are supported. The optical ports
comply with ITU-T G.957.

When the STM-4 optical module is used, the standard S-4.1, L4.1, L-4.2, and Ve-4.2 optical ports are supported. The optical
ports of the S-4.1, L-4.1, and L-4.2 types comply with ITU-T
G.957. The optical ports of the Ve-4.2 type comply with the
standards defined by Huawei.

Supports the detection and query of the information about


optical modules.

Supports the usage and detection of SFP pluggable optical


modules, facilitating the maintenance of optical modules.

Provides the ALS function. The optical ports support the


function of setting the on/off state of a laser.

Supports VC-12/VC-3/VC-4 services when the STM-1 optical


module is used.

Supports VC-12/VC-3/VC-4/VC-4-4c services when the STM-4


optical module is used.

Processes the section overheads of STM-4/STM-1 signals.

Processes path overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports the ECC communication.

Supports inloops and outloops at optical ports.

Supports inloops and outloops at the VC-4 level.

Optical module
specifications

Service processing

Overhead processing

Loopback function
Alarms and
performance events

Reports various alarms and performance events, which facilitates


the management and maintenance of the equipment.

Protection scheme

Supports Two-fiber ring MSP.

Supports Four-fiber ring MSP.

Supports Linear MSP.

Supports SNCP.

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Feature

9 EoD Boards

Description

Maintenance
features

Supports SNCMP.

Supports SNCTP.

Supports fiber-shared virtual trail protection.

Supports warm resets and cold resets. Warm resets do not affect
services.

Supports the PRBS function in the line direction.

Supports the alarm detection function and reports various alarms


and performance events, which facilitates the management and
maintenance of the equipment.

Figure 1.2 Packet features supported by EDQ41 boards


Func
tion
and
Feat
ure

Description

Basic
funct
ions

Bridges a maximum of 2.5 Gbit/s EoS services to the packet domain.

Form
at of
servi
ce
fram
es

Supports the encapsulation in IEEE 802.3 format, Ethernet II format, or IEEE


802.1q/p format.

Supports a jumbo frame with a maximum length of 9600 bytes.

Maxi
mum
uplin
k
band
widt
h

2.5 Gbit/s

MTU

MTU for
ports

Supports the query of the MTUs specified for ports but does not
support MTU setting. The default MTU specified for ports is 9600
bytes.

MTU for
services

Supports the setting of the packet length, which ranges from 64 bytes
to 9600 bytes.

Type
of
Ether
net
servi
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Supports point-to-point E-Line services.

Supports multipoint-to-multipoint E-LAN services.

NOTE
EDQ41 boards support only PW-carried E-Line and E-LAN services on the NNI side.

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Func
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Feat
ure

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Description

ces
Num
ber
of
supp
orted
ELine
servi
ces

When working with the N4GSCC: 4K

When working with the N6GSCC: 8K

Num
ber
of
supp
orted
ELAN
servi
ces

1K

HQo
S

Supports service WRED policies, WFQ policies, V-UNI ingress policies, and VUNI egress policies on the UNI side.
Supports service WRED policies, WFQ policies, and PW polices on the NNI side.

Prote
ction
sche
me

Tunnel
APS

Supports the 1+1 (single-ended/dual-ended) and 1:1 (dual-ended)


tunnel APS in compliance with ITU-T Y.1720 and ITU-T G.8131.
Number of supported tunnel APS protection groups: 1K

PW APS

Supports the 1+1 (single-ended/dual-ended), 1:1 (dual-ended), and PW


FPS (single-ended) PW APS in compliance with ITU-T Y.1720 and
ITU-T G.8131.
Number of supported PW APS protection groups: 1K

LAG

Main
tenan
ce
featu
res

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Supports manual link aggregation.

Supports the load non-sharing mode.

Complies with IEEE 802.3ad.

MCLAG

Supported, which complies with IEEE 802.3ad.

ETH
OAM

Not supported

Distribut
ed MPLS

MPLS tunnel
OAMa

NOTE
EDQ41 boards do not support creation of maintenance points but support
transparent transmission of ETH OAM packets.

Supports CV, FFD, BDI, FDI, Tunnel ping, and


Tunnel traceroute. These functions comply with

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ure

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Description

OAM/Ce
ntralized
MPLS
OAM

MPLSTP OAM

ITU-T Y.1711.
Number of MPLS tunnels that support OAM:
2K
MPLS PW OAMa

Supports CV, FFD, BDI, FDI, PW traceroute,


and PW ping. These functions comply with ITUT Y.1711. The number of supported MPLS PW
OAM is 2K.

MPLS-TP tunnel
OAMa

Supports CC, RDI, AIS, LB, LT, LM, 1DM,


TST, LCK, and 2DM. These functions comply
with ITU-T G.8113.1.
Number of tunnels that support MPLS-TP
OAM: 2K

MPLS-TP PW
OAMa

Supports CC, RDI, AIS, LB, LT, LM, 1DM,


TST, LCK, CSF, and 2DM. These functions
comply with ITU-T G.8113.1.
Number of PWs that support MPLS-TP OAM:
2K

MST
P

Not supported

IGM
P
Snoo
ping

Not supported

NOTE
a: MPLS tunnel OAM, MPLS PW OAM, MPLS-TP tunnel OAM, and MPLS-TP PW OAM share OAM
resources.

Figure 1.3 EoS data features supported by EDQ41 boards


Function and
Feature

EDQ41

Basic function

Supports transparent transmission of Ethernet services.

Encapsulation
format

Supports the GFP-F protocol.

EPL

Supports transparent transmission of PORT-based EPL services.

Number of
VCTRUNKs

Binds a maximum of 63 VCTRUNKs, equivalent to 504 VC-12s, 48


VC-3s, or 16 VC-4s.
Configuration features:

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Function and
Feature

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EDQ41

The first eight VC-4s (including VC-3s and VC-12s in the VC4s) and the last eight VC-4s (including VC-3s and VC-12s in the
VC-4s) cannot be bound to the same VCTRUNK.

Only 5th to 8th and the 13th to 16th VC-4s can bind VC-12
paths. In addition, VC-12s in the 5th to 8th VC-4s cannot be
bound to the same VCTRUNK as the VC-12s in the 13th to 16th
VC-4s.

VC-3 and VC-4 signals can be bound to any of the 1st to 16th
VC-4s.

VCTRUNK1 to VCTRUNK63 can be bound to any of the 1st to


16th VC-4s.

VCTRUNK1 to VCTRUNK8 each can be bound to a maximum


of eight VC-4s. VCTRUNK9 to VCTRUNK63 each can be
bound to a maximum of one VC-4, three VC-3s, or 63 VC-12s.

A VC-4 cannot bind VC-3 and VC-12 paths at the same time.

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

Test frames

Supports the transmitting and receiving of GFP test frames or


Ethernet test frames.

9.1.4 Working Principle and Signal Flow


The EDQ41 consists of network processing module, encapsulation/mapping and SDH
overhead processing module, clock module, logic control module, O/E converting module,
SDH overhead processing module, and power module.
Figure 9-3 shows the functional block diagram of the EDQ41.

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Figure 1.1 Functional block diagram of the EDQ41


Backplane
Packet
switching unit
Encapsulation/
mapping and
SDH overhead
processing
module

Network
processing
module

Communication unit
Clock
module

Logic control
module
Reference clock and
frame header unit

O/E
converting
module

4xSTM1/STM-4

Power
module

SCC
SCC

SDH crossconnect unit


(pure SDH
services)

SDH
overhead
processing
module

+3.3 V

SDH crossconnect unit


(EoS services)

Power
module

Fuse

-48 V/-60 V
-48 V/-60 V

1.1.1.1.278 Services in the SDH Domain

In the transmit direction: The O/E converting module converts the received STM1/STM-4 optical signals into electrical signals and sends the electrical signals to the SDH
overhead processing module. Then, the SDH overhead processing module extracts and
processes the overheads, converts the signals into a format that applies to the backplane
bus, and then sends the signals to the SDH cross-connect unit.

In the receive direction: The SDH overhead processing module inserts overhead bytes
into the electrical signals from the SDH cross-connect unit, and sends the electrical
signals to the E/O converting module. The E/O converting module converts the STM1/STM-4 electrical signals into optical signals, and then sends the optical signal to fibers
for transmission.

1.1.1.1.279 Services Transmitted from the SDH Domain to the Packet Domain
The mapping module demaps the signals from the SDH cross-connect module and
compensates the delay of virtual concatenation. The mapping module decapsulates the packets
through alignment and sends the data to the network processing module. The network
processing module processes the data according to service types and configuration
requirements, and then sends Ethernet services to the packet switching unit.
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1.1.1.1.280 Services Transmitted from the Packet Domain to the SDH Domain
The network processing module processes the Ethernet services from the packet switching
unit, and then sends the services to the mapping module. The mapping module encapsulates
the Ethernet services in LAPS or GFP format and concatenates the services. Then, the
mapping unit converts the Ethernet services into STM-16 signals and sends the signals to the
SDH cross-connect unit.

1.1.1.1.281 Network Processing Module


The network processing module performs the functions at the MAC layer, including code
conversion, Ethernet packet framing, CRC check, and Ethernet performance statistics. In
addition, the network processing module classifies the services according to service types and
configuration requirements. Then, the module encapsulates or decapsulates frames. The
module supports the Ethernet/VLAN encapsulation formats.
The module supports the following functions:

Traffic detection and traffic classification

Unicast, multicast, and broadcast of flows

Priorities of data

Weighted fair queuing (WFQ) scheduling

Three service classes

1.1.1.1.282 Encapsulation/Mapping and SDH Overhead Processing Module


The encapsulation/mapping and SDH overhead processing module performs
encapsulation/mapping functions and processes SDH overheads.

In the upstream direction, the mapping module encapsulates Ethernet signals in LAPS,
GFP-F, or HDLC format and then performs concatenation. The module supports LCAS.
Then, the mapping module converts Ethernet signals into SDH signals.

In the downstream direction, the mapping module demaps SDH signals and compensates
the delay of virtual concatenation. The mapping module decapsulates packets
accordingly through the alignment operation. The decapsulated data is finally transmitted
to the network processing module.

1.1.1.1.283 Logic Control Module


The logic control module is connected to external circuits through the bus. The logic control
module performs the following functions:

Manages and configures the other modules on the local board.

Implements inter-board communication through the internal Ethernet interface.

1.1.1.1.284 O/E Converting Module

In the receive direction, the O/E converting unit converts the received optical signals into
electrical signals.

In the transmit direction, the O/E converting unit converts the received electrical signals
into SDH optical signals and transmits the optical signals to optical fibers.

This module also detects the R_LOS alarm and provides the ALS function.

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1.1.1.1.285 SDH Overhead Processing Module


The SDH overhead processing module includes the RST, MST, MSA, and HPT sub-modules.
This module provides the inloop and outloop functions.

RST sub-module

In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first row of the RSOH, restores and checks the J0 byte, and checks the B1
byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first row of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the MSOH. That is, the
MST sub-module generates the MS_AIS or MS_RDI alarm after detecting the K2
byte. In addition, the sub-module generates the B2_SD or B2_EXC alarm after
checking the B2 byte and sends the MS_REI alarm to the opposite end.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves AUGs, divides an AUG
into N AU-4s, detects the AU_LOP and AU_AIS alarms, and performs pointer
justifications.

In the transmit direction, the MSA sub-module adds the AU-PTR to a VC-4 to
generate an AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the POH. That is, the HPT
sub-module sends the HP_REI alarm to the opposite end after detecting byte B3. In
addition, the sub-module generates the HP_TIM and HP_SLM alarms, and sends the
HP_RDI alarm to the opposite end after detecting bytes J1 and C2 (the sub-module
also generates the HP_UNEQ alarm if it detects the VC-4 path unequipped).

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.286 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip.

1.1.1.1.287 Power Module


The power module converts the accessed DC voltage into the DC voltages that the modules of
the board require.

9.1.5 Front Panel


The front panel of the EDQ41 has indicators, interfaces, a bar code, and a laser safety class
label.

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1.1.1.1.288 Diagram of the Front Panel


Figure 9-4 shows the front panel of the EDQ41.
Figure 1.1 Front panel of the EDQ41

EDQ41
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

EDQ41

1.1.1.1.289 Indicators

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the indicators, see 23.2 Alarm Indicators on the Boards.

1.1.1.1.290 Interfaces
The front panel of the EDQ41 has four optical interfaces. Table 9-4 lists the types and usage
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of the optical interfaces of the EDQ41.


Figure 1.1 Interfaces of the EDQ41
Interface

Type of Interface

Usage

IN1-IN4

LC (pluggable)

Receives the STM-1/STM-4 optical signals.

OUT1OUT4

LC (pluggable)

Transmits the STM-1/STM-4 optical signals.

9.1.6 Jumpers and DIP Switches


The EDQ41 does not have any jumpers or DIP switches for board settings.

9.1.7 Valid Slots


The EDQ41 must be installed in a valid slot in the subrack. Otherwise, the EDQ41 fails to
work normally.
EDQ41 can be housed in any of slots 4-8 and slots 11-14. The bandwidth of SDH services in
all slots is 2.5 Gbit/s, and the bandwidth of packet services in all slots is 2.5 Gbit/s.
The EDQ41 cannot work with a cross-connect board whose logical board is configured as N1PSXCS.

9.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the
EDQ41. The feature code of the EDQ41 indicates the type of optical interface.
Table 9-5 provides the relationship between the feature code of the EDQ41 and types of
optical interfaces.
Figure 1.2 Relationship between the feature code of the EDQ41 and types of optical interfaces
Board

Feature Code

Type of Optical Interface

SSN1EDQ4103

03

S-1.1

SSN1EDQ4104

04

L-1.1

SSN1EDQ4105

05

L-1.2

SSN1EDQ4108

08

S-4.1

SSN1EDQ4109

09

L-4.1

SSN1EDQ4110

10

L-4.2

SSN1EDQ4111

11

Ve-4.2

SSN1EDQ4112

12

S-1.1x2/S-4.1x2a

a: Port 1 and port 2 operate at 622 Mbit/s, port 3 and port 4 operate at 155 Mbit/s.

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9.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.291 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the cable matches the board. Ensure that the cable matches the
board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.292 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Add the ports. For details, see Querying and Configuring Ports on Boards.
Step 7 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 byte to be sent is
HuaWei SBS and the default value of the J0 byte to be received is Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 byte to be sent is HuaWei
SBS and the default value of the J1 byte to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.5 SDH Processing Boards.

Step 8 Optional: Create the protection subnet. For details, see Configuring the Protection Subnet.
Step 9 Required: Configure services. For details, see Configuring Cross-Domain Services.
Step 10 Optional: Configure the manual LAG. For details, see Configuring an Ethernet LAG.
Step 11 Optional: Configure test frames. For details, see Configuring Test Frames.
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----End

1.1.1.1.293 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 12 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 13 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
Step 14 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.294 Checking the Operation of the Board


Step 1 Required: Check the dual-domain services. For details, see Testing Cross-domain Services.
Step 15 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 16 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

9.1.10 Configuring the Board Functions


The EDQ41 supports the packet switching function and multiple Ethernet features, such as
HQoS, LAG, and LCAS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EDQ41 by using the U2000:

HQoS

LAG

MC-LAG

LCAS

Test Frame

MPLS OAM

MPLS-TP OAM

9.1.11 Parameter Settings


You can set the parameters for the EDQ41 by using the U2000.
You can set the following parameters for the EDQ41 by using the U2000:

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1.1.1.1.295 SDH Parameters

J0

J1

J2

C2

For the description of parameters, see 26.5 SDH Processing Boards.

1.1.1.1.296 Packet Data Parameters

VCTRUNK interfaces

For information about more parameters and the description of each parameter, see 26.1 Packet
Processing Boards.

1.1.1.1.297 EoS Parameters

Working mode

Enabling LCAS

Maximum frame length

Mapping protocol

For more parameters and the description of the parameters, see 26.4.2 Ethernet Parameters.

9.1.12 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.298 Troubleshooting
Table 9-6 lists the faults that occur on the EDQ41 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EDQ41 frequently
Fault Symptom

Common Fault
Cause

SDH service
interruption

The optical fiber


or connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The services on a
single Ethernet
port are

EoS service
interruption

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Troubleshooting Method
See Service Interruption on a Board or a
Port.

See Interruption of an Ethernet Service.

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Fault Symptom

Common Fault
Cause

9 EoD Boards

Troubleshooting Method

interrupted.

Transient EoS
service interruption

The services on
all the Ethernet
ports are
interrupted.

The services on a
single Ethernet
port are
transiently
interrupted.

The protocol
becomes
abnormal.

Packet service fault

The packet Ethernet


services are faulty.

Bit error

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

The MC-LAG
switching fails.

A single NE
becomes
unreachable to
the U2000.

All the NEs in a


subnet become
unreachable to
the U2000.

Pointer justification

Protection switching
failure

NEs being
unreachable to the
U2000

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See Troubleshooting Transient Service


Interruptions.

See Troubleshooting Packet Service


Interruptions.
See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

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Fault Symptom

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Common Fault
Cause

Equipment
interconnection fault

Troubleshooting Method

An NE becomes
unreachable to
the U2000
frequently.

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

1.1.1.1.299 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EDQ41, see Replacing an EoD board.

9.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

9.1.13.1 Alarms of N1EDQ41


ALM_ALS

ALM_GFP_dCSF

ALM_GFP_dLFD

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_EXC_VC4

B3_SD

B3_SD_VC3

B3_SD_VC4

BD_STATUS

BIP_EXC

BIP_SD

BUS_ERR

C2_PDI

C2_VCAIS

COMMUN_FAIL

DCN_FAIL

FCS_ERR

FSELECT_STG

HARD_BAD

HARD_ERR

HP_LOM

HP_REI

HP_SLM

HP_RDI

HP_UNEQ

IN_PWR_ABN

HP_TIM

IN_PWR_LOW

J0_MM

IN_PWR_HIGH

LAG_MEMBER_DOWN

LASER_MOD_ERR

LAG_DOWN

LCAS_FOPR

LCAS_FOPT

LASER_SHUT

LCAS_PLCT

LCAS_TLCR

LCAS_PLCR

LOOP_ALM

LP_RDI_VC12

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LCAS_TLCT

LP_REI_VC12

LP_REI_VC3

LP_RDI_VC3

LP_SLM_VC3

LP_TIM_VC12

LP_SLM_VC12

LP_UNEQ_VC12

LP_UNEQ_VC3

LP_TIM_VC3

LSR_COOL_ALM

LSR_NO_FITED

LSR_BCM_ALM

MCLAG_CFG_MISMATC
H

MCSP_PATH_LOCV

LSR_WILL_DIE

MS_AIS

MS_RDI

MOD_TYPE_MISMATCH

NO_BD_SOFT

NO_LSR_PARA_FILE

MS_REI

OUT_PWR_ABN

POWER_ABNORMAL

OH_LOOP

PS

R_LOC

R_LOF

R_LOS

SLAVE_WORKING

T_LOSEX

TEM_HA

TEM_LA

TEMP_OVER

TEST_STATUS

TF

TIME_NOT_SUPPORT

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

WRG_BD_TYPE

ETH_APS_LOST

ETH_APS_PATH_MISMA
TCH

ETH_APS_SWITCH_FAIL

ETH_APS_TYPE_MISMA
TCH

MPLS_PW_BDI

MPLS_PW_Excess

MPLS_PW_LOCV

MPLS_PW_MISMATCH

MPLS_PW_MISMERGE

MPLS_PW_OAMFAIL

MPLS_PW_SD

MPLS_PW_SF

MPLS_PW_UNKNOWN

MPLS_TUNNEL_BDI

MPLS_TUNNEL_Excess

MPLS_TUNNEL_FDI

MPLS_TUNNEL_LOCV

MPLS_TUNNEL_MISMAT
CH

MPLS_TUNNEL_MISME
RGE

MPLS_TUNNEL_OAMFAI
L

MPLS_TUNNEL_SD

MPLS_TUNNEL_SF

MPLS_TUNNEL_UNKNO
WN

PW_EXC_TRAFFIC

PW_NO_TRAFFIC

PWAPS_LOST

PWAPS_PATH_MISMATC
H

PWAPS_SWITCH_FAIL

PWAPS_TYPE_MISMATC
H

TUNNEL_APS_DEGRADE
D

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TUNNEL_APS_OUTAGE

9.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the NMS.

9.1.14.1 Performance Events of N1EDQ41


Figure 1.1 SDH
LPBBE

LPES

LPSES

LPUAS

LPCSES

LPFEBBE

LPFEES

LPFESES

LPFEUAS

LPFECSES

CPUUSAGEMAX

CPUUSAGEMIN

CPUUSAGECUR

BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

VC3BBE

VC3ES

VC3SES

VC3UAS

VC3CSES

VC3FEBBE

VC3FEES

VC3FESES

VC3FECSES

VC3FEUAS

MEMUSAGEMAX

MEMUSAGEMIN

MEMUSAGECUR

RSBBE

RSES

RSSES

RSUAS

RSCSES

OSPITMPCUR

RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

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OSPITMPMIN

Figure 1.2 MPLS Tunnel OAM


MPLS_TUNNEL_FLR

MPLS_TUNNEL_FL

MPLS_TUNNEL_FD

MPLS_TUNNEL_FDV

Figure 1.3 Tunnel


TUNNEL_RCVPKTS

TUNNEL_RCVBYTES

TUNNEL_SNDPKTS

TUNNEL_SNDBYTES

TNL_BW_UTILISATION

TUNNEL_REVERSE_SND
PKTS

TUNNEL_REVERSE_SND
BYTES

TUNNEL_REVERSE_R
CVPKTS

TUNNEL_REVERSE_RCV
BYTES

TNL_REVERSE_BW_UTIL
ISATION

TUNNEL_RX_BPS

TUNNEL_TX_BPS

TUNNEL_RX_PPS

TUNNEL_TX_PPS

TUNNEL_REVERSE_RX_
BPS

TUNNEL_REVERSE_TX_B
PS

TUNNEL_REVERSE_R
X_PPS

TUNNEL_REVERSE_TX_P
PS

Figure 1.4 MPLS PW OAM


MPLS_PW_FLR

MPLS_PW_FL

MPLS_PW_FD

MPLS_PW_FDV

Figure 1.5 PW
PW_RCVPKTS

PW_RCVBYTES

PW_SNDPKTS

PW_SNDBYTES

PW_BANDWIDTH_UTILISA PW_RX_BPS
TION

PW_TX_BPS

PW_RX_PPS

PW_TX_PPS

Figure 1.6 L2VPN


VUNI_RCVPKTS

VUNI_RCVBYTES

VUNI_SNDPKTS

VUNI_SNDBYTES
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Figure 1.7 Statistics of RMON basic performance


ETHUNDER

ETHOVER

Figure 1.8 Statistics of RMON extended performance


RXPKTS

TXPKTS

RXBBAD

TXBBAD

RXPPS

TXPPS

9.1.15 Technical Specifications of EDQ41


The technical specifications of the EDQ41 include the specifications of optical interfaces,
mechanical specifications, and power consumption.

1.1.1.1.300 Specifications of Optical Interfaces


The EDQ41 supports the STM-1/STM-4 optical modules.
Table 9-15 provides the specifications of STM-1 optical interfaces on the EDQ41.
Figure 1.1 Specifications of STM-1 optical interfaces on the EDQ41
Item

Value

Nominal bit rate

155520 kbit/s

Line code

NRZ

Type of optical
interface

S-1.1

L-1.1

L-1.2

Type of Fiber

Single-mode LC

Single-mode LC

Single-mode LC

Transmission
distance (km)

2 to 15

15 to 40

40 to 80

Operating
wavelength range
(nm)

1261 to 1360

1263 to 1360

1480 to 1580

Launched optical
power range
(dBm)

-15 to -8

-5 to 0

-5 to 0

Receiver
sensitivity (dBm)

-28

-34

-34

Minimum
overload (dBm)

-8

-10

-10

Minimum

8.2

10

10

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Item

9 EoD Boards

Value

extinction ratio
(dB)

Table 9-16 provides the specifications specified for STM-4 optical interfaces on the EDQ41.
Figure 1.2 Specifications of STM-4 optical interfaces on the EDQ41
Item

Value

Nominal bit rate

622080 kbit/s

Line code

NRZ

Type of optical
interface

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

2 to 15

15 to 40

40 to 80

80 to 100

Operating
wavelength range
(nm)

1274 to 1356

1280 to 1335

1480 to 1580

1480 to 1580

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Single-mode
LC

Launched optical
power range (dBm)

-15 to -8

-3 to -2

-3 to -2

-3 to -2

Receiver sensitivity
(dBm)

-28

-28

-28

-34

Minimum Overload
(dBm)

-8

-8

-8

-13

Minimum extinction
ratio (dB)

8.2

10

10

10.5

1.1.1.1.301 Mechanical Specifications


The mechanical specifications of the EDQ41 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight: 1.0 kg

1.1.1.1.302 Power Consumption


The maximum power consumption of the EDQ41 at room temperature (25C) is 70 W.

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10

SDH Boards

About This Chapter


This topic describes the SDH boards that operate at the STM-64, STM-16, STM-4, and STM1 rates.
10.1 SL1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL1 (1xSTM-1 optical interface board). This topic also
describes how to configure and commission the SL1.
10.2 SL1A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL1A (1xSTM-1 optical interface board).
10.3 SLQ1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ1 (4xSTM-1 optical interface board).
10.4 SLQ1A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ1A (4xSTM-1 optical interface board).
10.5 SLO1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLO1 (8xSTM-1 optical interface board).
10.6 SLT1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLT1 (12xSTM-1 optical interface board).
10.7 SLH1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLH1 (16xSTM-1 signal processing board). This topic also
describes how to configure and commission the SLH1.
10.8 SEP1
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This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SEP1 (8xSTM-1 line processing board). This topic also
describes how to configure and commission the SEP1.
10.9 SL4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL4 (1xSTM-4 optical interface board).
10.10 SL4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL4A (1xSTM-4 optical interface board).
10.11 SLD4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLD4 (2xSTM-4 optical interface board).
10.12 SLD4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLD4A (2xSTM-4 optical interface board).
10.13 SLQ4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ4 (4xSTM-4 optical interface board).
10.14 SLQ4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ4A (4xSTM-4 optical interface board).
10.15 SL16
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL16 (1xSTM-16 optical interface board).
10.16 SL16A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL16A (1xSTM-16 optical interface board). This topic also
describes how to configure and commission the SL16A.
10.17 SLD16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLD16 (2xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLD16.
10.18 SLQ16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLQ16 (4xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLQ16.
10.19 SLO16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLO16 (8xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLO16.
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10.20 SF16
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SF16 (1xSTM-16 optical interface board with the out-band
FEC function).
10.21 SF16E
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SF16E (1xSTM-16 optical interface board with the out-band
EFEC function).
10.22 SL64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL64 (1xSTM-64 optical interface board). This topic also
describes how to configure and commission the SL64.
10.23 SLD64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLD64 (2xSTM-64 optical interface board). This topic also
describes how to configure and commission the SLD64.
10.24 SF64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SF64 (1xSTM-64 optical interface board with the FEC
function). This topic also describes how to configure and commission the SF64.
10.25 SF64A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SF64A (1xSTM-64 optical interface board with the FEC
function).
10.26 SFD64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SFD64 (2xSTM-64 optical interface board with the FEC
function). This topic also describes how to configure and commission the SFD64.
10.27 SLQ41
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLQ41 (4xSTM-4/STM-1 optical interface board). This topic
also describes how to configure and commission the SLQ41.
10.28 SLH41
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLH41 (16xSTM-1/STM-4 optical interface board with the
variable rate). This topic also describes how to configure and commission the SLH41.
10.29 EU04
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EU04 (4xSTM-1 electrical interface board).
10.30 EU08
This topic describes the version, functions, working principle, front panel, valid slots, and
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technical specifications of the EU08 (8xSTM-1 electrical interface board).


10.31 OU08
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the N1OU08 (8xSTM-1 optical/electrical interface board) and the
N2OU08 (8xSTM-1 optical interface board).

10.1 SL1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL1 (1xSTM-1 optical interface board). This topic also
describes how to configure and commission the SL1.

10.1.1 Version Description


The SL1 is available in several functional versions. The functions provided by the functional
versions are different.
The SL1 is available in the following functional versions: N1 and N2. The difference between
the functional versions is with regard to whether they support the tandem connection
monitoring (TCM) function and AU-3 services.
The N1SL1 is no longer manufactured.
Table 10-1 describes the versions of the SL1.
Figure 1.1 Versions of the SL1
Item

Description

Functional versions

The SL1 is available in the following functional versions: N1 and


N2.

Differences

Service processing: AU-3 service processing.

Maintenance features: loopbacks on VC-4 paths and TCM


function.

Substitution

Through the board version replacement function, the N1SL1A can


substitute for the N1SL1.

When you configure the multiplex section protection (MSP) or sub-network connection protection
(SNCP), you cannot configure the N1SL1 as the protection board if the working board is the N2SL1 on
which the TCM function is enabled or AU-3 services are configured. Otherwise, the services are
interrupted when a switching operation is performed.

10.1.2 Application
The SL1 is a line board. The SL1 can be used on the OptiX OSN equipment series to transmit
and receive STM-1 optical signals. The SL1 converts the received optical signals into
electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SL1 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
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Figure 10-1 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

The SL1 does not support the two-fiber bidirectional ring MSP.

10.1.3 Functions and Features


The SL1 transmits and receives STM-1 optical signals, performs O/E conversion for the
STM-1 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-2 provides the functions and features of the SL1.
Figure 1.2 Functions and features of the SL1
Function and
Feature

SL1

Basic functions

Transmits and receives 1xSTM-1 optical signals.

Specifications
of the optical
interface

Supports different types of standard optical interfaces, namely, the I1, S-1.1, L-1.1, L-1.2, and Ve-1.2.

The characteristics of the optical interfaces of the I-1, S-1.1, L-1.1,


and L-1.2 types comply with ITU-T G.957.

The characteristics of the optical interface of the Ve-1.2 type comply


with the standards defined by Huawei.

Supports the detection and query of the information about the optical
module.

Supports the usage and detection of the small form-factor pluggable


(SFP) optical module, which facilitates the maintenance of the
optical module.

Provides the automatic laser shutdown (ALS) function. The optical

Specifications
of the optical
module

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Function and
Feature

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SL1
interface supports the setting of the on/off state of a laser.

Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

The N2SL1 supports the AU-3 services.

Overhead
processing

Processes the section overheads of the STM-1 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one channel of ECC communication.

Alarms and
performance
events

Provides various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

Supports the SNCTP.

Supports inloops and outloops at optical interfaces.

The N1SL1 supports inloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

The N2SL1 supports the TCM function.

Supports the press-to-collect function in fault data collection.

Maintenance
features

10.1.4 Working Principle and Signal Flow


The SL1 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-2 shows the functional block diagram of the SL1.

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Figure 1.1 Functional block diagram of the SL1


155 MHz

O/E
155 Mbit/s

E/O

155
Mbit/s
SPI

E/O

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

....

155 Mbit/s

155
Mbit/s

Backplane
Reference clock
Cross-connect
unit

155 Mbit/s

....
O/E

CDR

155 MHz
PLL

RST MST MSA HPT

CDR
SPI

High-speed
bus
DCC

155 Mbit/s
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
control module Communication

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

CDR: clock data restoration

1.1.1.1.303 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.304 CDR Module


This module restores the clock signal.

1.1.1.1.305 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

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RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
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sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.306 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.307 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.1.5 Front Panel


The front panel of the SL1 has indicators, interfaces, and a bar code.
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1.1.1.1.308 Diagram of the Front Panel


Figure 10-3 shows the appearance of the front panel of the SL1.
Figure 1.1 Front panel of the SL1

SL1
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1

SL1

1.1.1.1.309 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

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1.1.1.1.310 Interfaces
The front panel of the SL1 has one optical interface. Table 10-3 describes the types and usage
of the optical interfaces of the SL1.
Figure 1.1 Optical interfaces of the SL1
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.1.6 Jumpers and DIP Switches


The SL1 does not have any jumpers or DIP switches that are used for board settings.

10.1.7 Valid Slots


The SL1 must be installed in a valid slot in the subrack. Otherwise, the SL1 cannot work
normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SL1 vary with the cross-connect capacity of the subrack. The slots
valid for the board are as follows:

When the cross-connect capacity is 200 Gbit/s, the SL1 can be installed in slots 18 and
1117.

10.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL1 indicates the type of optical interface.
Table 10-4 provides the relationship between the feature code of the SL1 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SL1 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SL110 and
SSN2SL110

10

S-1.1

SSN1SL111 and
SSN2SL111

11

L-1.1

SSN1SL112 and
SSN2SL112

12

L-1.2

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Board

Feature Code

Type of Optical Interface

SSN1SL113 and
SSN2SL113

13

Ve-1.2

SSN1SL114 and
SSN2SL114

14

I-1

10.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.311 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.312 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
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Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.313 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.314 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.1.10 Parameter Settings


You can set parameters for the SL1 by using the U2000.
You can set the following parameters for the SL1 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.1.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.315 Troubleshooting
Table 10-5 lists the faults that occur on the SL1 frequently and the troubleshooting methods.
The SL1 uses the SFP optical module. When the SL1 operates and an abnormal alarm occurs on the
optical interface, check whether the optical module is properly installed. To check whether the optical
module is properly installed, you can re-seat the optical module.

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Figure 1.1 Methods used to troubleshoot the faults that occur on the SL1 frequently
Fault
Symptom

Common Fault Cause

Service
interruption

The optical fiber or connector


becomes abnormal.

An incorrect operation is
performed.

The types or settings of the


boards are inconsistent.

The optical power becomes


abnormal.

The equipment becomes faulty.

The clock configuration is


incorrect.

The precision of the external


clock source is very low.

Protection
switching
failure

The MSP switching fails.

The SNCP switching fails.

The clock protection switching


fails.

NEs being
unreachable to
the

A single NE becomes
unreachable to the .

All the NEs in a subnet become


unreachable to the .

An NE becomes unreachable to
the frequently.

Bit error

Pointer
justification

Equipment
interconnection
fault

An SDH overhead interconnection


fault occurs.

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer


Justification.

See Troubleshooting Protection


Switching Faults.

See Troubleshooting the NEs


Being Unreachable.

See Troubleshooting Device


Interconnection Faults.

1.1.1.1.316 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SL1, see Replacing an SDH Board.

10.1.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

10.1.12.1 Alarms of N1SL1


ALM_ALS
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AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_FAIL

C2_PDI

C2_VCAIS

FSELECT_STG

COMMUN_FAIL

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LASER_MOD_ERR

IN_PWR_ABN

J0_MM

LP_RDI_VC12

LASER_SHUT

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LSR_WILL_DIE

LSR_COOL_ALM

LSR_NO_FITED

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

R_LOF

POWER_ABNORMAL

OUT_PWR_ABN

SLAVE_WORKING

R_LOS

R_LOC

TEM_HA

SPARE_PATH_ALM

R_OOF

TF

TEM_LA

T_LOSEX

TU_AIS_VC3

TR_LOC

TEST_STATUS

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

TU_LOP_VC3

TIME_NOT_SUPPORT

PS

PATCH_ERR

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.1.12.2 Alarms of N2SL1


ALM_ALS

ALM_AU3AIS

ALM_AU3B3OVER

ALM_AU3B3SD

ALM_AU3LOP

ALM_AU3RDI

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ALM_AU3REI

ALM_AU3SLM

ALM_AU3TIM

ALM_AU3UNEQ

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_FAIL

C2_PDI

C2_VCAIS

FSELECT_STG

COMMUN_FAIL

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LASER_MOD_ERR

IN_PWR_ABN

J0_MM

LP_RDI_VC12

LASER_SHUT

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LSR_WILL_DIE

LSR_COOL_ALM

LSR_NO_FITED

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

R_LOF

POWER_ABNORMAL

OUT_PWR_ABN

SLAVE_WORKING

R_LOS

R_LOC

TC_DEG

SPARE_PATH_ALM

R_OOF

TC_LTC

TC_EXC

T_LOSEX

TC_RDI

TC_ODI

TC_INCAIS

TC_UNEQ

TC_REI

TC_OEI

TEST_STATUS

TEM_HA

TC_TIM

TU_AIS_VC12

TF

TEM_LA

TU_LOP_VC3

TU_AIS_VC3

TR_LOC

PATCH_ERR

W_R_FAIL

TU_LOP_VC12

SWDL_PKG_NOBDSOFT

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

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10.1.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

10.1.13.1 Performance Events of N1SL1


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.1.13.2 Performance Events of N2SL2


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

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RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.1.14 Technical Specifications


The technical specifications of the SL1 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

1.1.1.1.317 Parameters Specified for Optical Interfaces


Table 10-6 lists the parameters specified for the optical interfaces of the SL1.
Figure 1.1 Parameters specified for the optical interfaces of the SL1
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code
pattern

Non-return to zero (NRZ)

Application
code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Single-mode
LC

Single-mode LC

Single-mode
LC

Single-mode LC

Single-mode LC

Operating
wavelength
range (nm)

1260 to 1360

1261 to 1360

1263 to 1360

1480 to 1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

Receiver
sensitivity
(dBm)

-23

-28

-34

-34

-34

Minimum
overload (dBm)

-8

-8

-10

-10

-10

Minimum
extinction ratio

8.2

8.2

10

10

10

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Parameter

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Value

(dB)
Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

1.1.1.1.318 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.319 Mechanical Specifications


The mechanical specifications of the N1SL1 and N2SL1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1SL1 (kg): 0.6

Weight of the N2SL1 (kg): 1.0

1.1.1.1.320 Power Consumption


The maximum power consumption of the N1SL1 at room temperature (25C) is 17 W.
The maximum power consumption of the N2SL1 at room temperature (25C) is 14 W.

10.2 SL1A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL1A (1xSTM-1 optical interface board).

10.2.1 Version Description


The SL1A is available in one functional version, namely, N1.

10.2.2 Application
The SL1A is a line board. The SL1A can be used on the OptiX OSN equipment series to
transmit and receive STM-1 optical signals. The SL1A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SL1A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-4 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.2.3 Functions and Features


The SL1A transmits and receives STM-1 optical signals, performs O/E conversion for the
STM-1 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-7 provides the functions and features of the SL1A.
Figure 1.1 Functions and features of the SL1A
Function and
Feature

SL1A

Basic functions

Transmits and receives 1xSTM-1 optical signals.

Specifications
of the optical
interface

Supports different types of standard optical interfaces, namely, the I1, S-1.1, L-1.1, L-1.2, and Ve-1.2.

The characteristics of the optical interfaces of the I-1, S-1.1, L-1.1,


and L-1.2 types comply with ITU-T G.957.

The characteristics of the optical interface of the Ve-1.2 type comply


with the standards defined by Huawei.

Supports the detection and query of the information about the optical
module.

Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Supports the single-fiber bidirectional optical module, and the singlefiber bidirectional optical module does not support loopbacks as the
optical interface by using fiber jumpers.

Specifications
of the optical
module

Service
processing
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Supports the VC-12 services, VC-3 services, and VC-4 services.

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Function and
Feature

SL1A

Overhead
processing

Processes the section overheads of the STM-1 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one channel of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Maintenance
features

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

10.2.4 Working Principle and Signal Flow


The SL1A consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-5 shows the functional block diagram of the SL1A.

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Figure 1.1 Functional block diagram of the SL1A


155 MHz

O/E
155 Mbit/s

E/O

155
Mbit/s
SPI

E/O

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

....

155 Mbit/s

155
Mbit/s

Backplane
Reference clock
Cross-connect
unit

155 Mbit/s

....
O/E

CDR

155 MHz
PLL

RST MST MSA HPT

CDR
SPI

High-speed
bus
DCC

155 Mbit/s
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
control module Communication

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

1.1.1.1.321 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.322 CDR Module


This module restores the clock signal.

1.1.1.1.323 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

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RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
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sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.324 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.325 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.2.5 Front Panel


The front panel of the SL1A has indicators, interfaces, a bar code, and a laser safety class
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label.

1.1.1.1.326 Diagram of the Front Panel


Figure 10-6 shows the appearance of the front panel of the SL1A.
Figure 1.1 Front panel of the SL1A

SL1A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1

SL1A

1.1.1.1.327 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.


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1.1.1.1.328 Interfaces
The front panel of the SL1A has one optical interface. Table 10-8 describes the types and
usage of the optical interfaces of the SL1A.
Figure 1.1 Optical interfaces of the SL1A
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.2.6 Valid Slots


The slots valid for the SL1A vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SL1A are as follows:

When the cross-connect capacity is 200 Gbit/s, the SL1A can be installed in slots 18
and 1117.

10.2.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL1A indicates the type of optical interface.
Table 10-9 provides the relationship between the feature code of the SL1A and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SL1A and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SL1A10

10

S-1.1

SSN1SL1A11

11

L-1.1

SSN1SL1A12

12

L-1.2

SSN1SL1A13

13

Ve-1.2

SSN1SL1A14

14

I-1

10.2.8 Parameter Settings


You can set the parameters for the SL1A by using the U2000.
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You can set the following parameters for the SL1A by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.2.9 Technical Specifications


The technical specifications of the SL1A include the parameters specified for optical
interfaces, laster safety class, mechanical specifications, and power consumption.

1.1.1.1.329 Parameters Specified for Optical Interfaces


Table 10-10 lists the parameters specified for the optical interfaces of the SL1A.
Figure 1.1 Parameters specified for the optical interfaces of the SL1A
Parameter

Value

Nominal bit
rate

155520 kbit/s

Line code
pattern

NRZ

Application
code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Transmissio
n distance
(km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of
fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Single-mode
LC

Single-mode
LC

Operating
wavelength
range (nm)

1260 to 1360

1261 to 1360

1263 to
1360

1480 to 1580

1480 to 1580

Launched
optical
power range
(dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

Receiver
sensitivity
(dBm)

-23

-28

-34

-34

-34

Minimum
overload
(dBm)

-8

-8

-10

-10

-10

Minimum
extinction

8.2

8.2

10

10

10

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Value

ratio (dB)
Maximum
-20 dB
spectral
width (nm)

Minimum
side mode
suppression
ratio (dB)

30

30

Table 10-11 lists the parameters specified for the single-fiber bidirectional optical interfaces
of the SL1A.
Figure 1.2 Parameters specified for the single-fiber bidirectional optical interfaces of the SL1A
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Type of optical interface

S-1.1

S-1.1

L-1.1

L-1.1

Transmission distance
(km)

2 to 15

2 to 15

15 to 40

15 to 40

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Singlemode LC

Operating transmit
wavelength (nm)

1550

1310

1550

1310

Operating receive
wavelength (nm)

1310

1550

1310

1550

Launched optical power


range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

Receiver sensitivity
(dBm)

-32

-32

-32

-32

Minimum overload
(dBm)

-8

-8

-10

-10

Minimum extinction
ratio (dB)

8.5

8.5

10

10

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio (dB)

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1.1.1.1.330 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.331 Mechanical Specifications


The mechanical specifications of the SL1A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.6

1.1.1.1.332 Power Consumption


The maximum power consumption of the SL1A at room temperature (25C) is 17 W.

10.3 SLQ1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ1 (4xSTM-1 optical interface board).

10.3.1 Version Description


The SLQ1 is available in two functional versions, namely, N1 and N2. The difference
between the two versions is with regard to whether they support the TCM function and AU-3
services. The N1SLQ1 is no longer manufactured.
Table 10-12 describes the versions of the SLQ1.
Figure 1.1 Versions of the SLQ1
Item

Description

Functional
versions

The SLQ1 is available in two functional versions, namely, N1 and N2.

Differences

Specifications of optical modules: single-fiber bidirectional optical


modules.

Service processing: AU-3 service processing.

Maintenance features: loopbacks on VC-4 paths.

Substitution

Through the board version replacement function, the N3SLQ41 can


substitute for the N1SLQ1 and N2SLQ1 at the same line rate.

When you configure the MSP or SNCP, you cannot configure the N1SLQ1 as the protection board if the
working board is the N2SLQ1 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

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10.3.2 Application
The SLQ1 is a line board. The SLQ1 can be used on the OptiX OSN equipment series to
transmit and receive STM-1 optical signals. The SLQ1 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLQ1 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-7 shows the application of the SDH processing boards. The SDH processing boards
can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.3.3 Functions and Features


The SLQ1 transmits and receives 4xSTM-1 optical signals, performs O/E conversion for the
STM-1 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-13 provides the functions and features of the SLQ1.
Figure 1.2 Functions and features of the SLQ1
Function and
Feature

SLQ1

Basic functions

Transmits and receives 4xSTM-1 optical signals.

Specifications
of the optical
interface

Supports different types of standard optical interfaces, namely, the I1, S-1.1, L-1.1, L-1.2, Ie-1, and Ve-1.2.

The characteristics of the optical interfaces of the I-1, S-1.1, L-1.1,


and L-1.2 types comply with ITU-T G.957.

The characteristics of the optical interfaces of the Ie-1 and Ve-1.2


types comply with the standards defined by Huawei.

Supports the detection and query of the information about the optical
module.

Specifications
of the optical
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Function and
Feature

SLQ1

module

Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Supports the usage and detection of the SFP optical module, which
facilitates the maintenance of the optical module.

The N1SLQ1 supports the single-fiber bidirectional optical module,


and the single-fiber bidirectional optical module does not support
loopbacks at the optical interface by using fiber jumpers.

Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

The N2SLQ1 supports the AU-3 services.

Overhead
processing

Processes the section overheads of the STM-1 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one to four channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Maintenance
features

Supports inloops and outloops at optical interfaces.

The N1SLQ1 supports inloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

The N2SLQ1 supports the TCM function.

Supports the press-to-collect function in fault data collection.

10.3.4 Working Principle and Signal Flow


The SLQ1 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-8 shows the functional block diagram of the SLQ1.

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Figure 1.1 Functional block diagram of the SLQ1


155 MHz

O/E
155 Mbit/s

E/O

155
Mbit/s
SPI

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

....

E/O

155
Mbit/s

Backplane
Reference clock
Cross-connect
unit

155 Mbit/s

....
O/E

155 Mbit/s

CDR

155 MHz
PLL

RST MST MSA HPT

CDR
SPI

High-speed
bus
DCC

155 Mbit/s
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
Communication
control module

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

The functional modules of the STM-1 units are described as follows:

1.1.1.1.333 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.334 CDR Module


This module restores the clock signal.

1.1.1.1.335 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

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In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.
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In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.336 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.337 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

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10.3.5 Front Panel


The front panel of the SLQ1 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.338 Diagram of the Front Panel


Figure 10-9 shows the appearance of the front panel of the SLQ1.
Figure 1.1 Front panel of the SLQ1

SLQ1
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ1

1.1.1.1.339 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.340 Interfaces
The front panel of the SLQ1 has four optical interfaces. Table 10-14 describes the types and
usage of the optical interfaces of the SLQ1.
Figure 1.1 Optical interfaces of the SLQ1
Interface

Type of Interface

Usage

IN1-IN4

LC

Receives optical signals.

OUT1-OUT4

LC

Transmits optical signals.

10.3.6 Valid Slots


The slots valid for the SLQ1 vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SLQ1 are as follows:

When the cross-connect capacity is 200 Gbit/s, the SLQ1 can be installed in slots 18
and 1117 in the subrack.

10.3.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ1 indicates the type of optical interface.
Table 10-15 provides the relationship between the feature code of the SLQ1 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLQ1 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SLQ110 and
SSN2SLQ110

10

S-1.1

SSN1SLQ111 and
SSN2SLQ111

11

L-1.1

SSN1SLQ112 and
SSN2SLQ112

12

L-1.2

SSN1SLQ113 and
SSN2SLQ113

13

Ve-1.2

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Board

Feature Code

Type of Optical Interface

SSN1SLQ114 and
SSN2SLQ114

14

I-1

SSN1SLQ115

15

Ie-1

10.3.8 Parameter Settings


You can set the parameters for the SLQ1 by using the U2000.
You can set the following parameters for the SLQ1 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.3.9 Technical Specifications


The technical specifications of the SLQ1 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.341 Parameters Specified for Optical Interfaces


Table 10-16 lists the parameters specified for the optical interfaces of the SLQ1.
Figure 1.1 Parameters specified for the optical interfaces of the SLQ1
Parameter

Value

Nominal bit
rate

155520 kbit/s

Line code
pattern

NRZ

Application
code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Ie-1

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

0 to 2

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode
LC

Multi-mode LC

Operating
wavelength
range (nm)

1260 to
1360

1261 to
1360

1263 to
1360

1480 to
1580

1480 to 1580

1270 to 1380

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

-19 to -14

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Parameter

Value

Receiver
sensitivity
(dBm)

-23

-28

-34

-34

-34

-30

Minimum
overload (dBm)

-8

-8

-10

-10

-10

-14

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

Table 10-17 lists the parameters specified for the single-fiber bidirectional optical interfaces
of the SLQ1.
Figure 1.2 Parameters specified for the single-fiber bidirectional optical interfaces of the SLQ1
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Type of optical interface

S-1.1

S-1.1

L-1.1

L-1.1

Transmission distance
(km)

2 to 15

2 to 15

15 to 40

15 to 40

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Singlemode LC

Operating transmit
wavelength (nm)

1550

1310

1550

1310

Operating receive
wavelength (nm)

1310

1550

1310

1550

Launched optical power


range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

Receiver sensitivity
(dBm)

-32

-32

-32

-32

Minimum overload
(dBm)

-8

-8

-10

-10

Minimum extinction

8.5

8.5

10

10

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Parameter

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Value

ratio (dB)
Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio (dB)

1.1.1.1.342 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.343 Mechanical Specifications


The mechanical specifications of the N1SLQ1 and N2SLQ1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.344 Power Consumption


The maximum power consumption of the N1SLQ1 at room temperature (25C) is 15 W.
The maximum power consumption of the N2SLQ1 at room temperature (25C) is 15 W.

10.4 SLQ1A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ1A (4xSTM-1 optical interface board).

10.4.1 Version Description


The SLQ1A is available in one functional version, namely, N1.
Through the board version replacement function, the N1SLQ1 can substitute for the
N1SLQ1A.

10.4.2 Application
The SLQ1A is a line board. The SLQ1A can be used on the OptiX OSN equipment series to
transmit and receive STM-1 optical signals. The SLQ1A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLQ1A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-10 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.

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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.4.3 Functions and Features


The SLQ1A transmits and receives STM-1 optical signals, performs O/E conversion for the
STM-1 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-18 provides the functions and features of the SLQ1A.
Figure 1.1 Functions and features of the SLQ1A
Function and
Feature

SLQ1A

Basic functions

Transmits and receives 4xSTM-1 optical signals.

Specifications
of the optical
interface

Supports different types of standard optical interfaces, namely, the I1, S-1.1, L-1.1, L-1.2, Ie-1, and Ve-1.2.

The characteristics of the optical interfaces of the I-1, S-1.1, L-1.1,


and L-1.2 types comply with ITU-T G.957.

The characteristics of the optical interfaces of the Ie-1 and Ve-1.2


types comply with the standards defined by Huawei.

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Specifications
of the optical
module

Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

Processes the section overheads of the STM-1 signals.

Supports the transparent transmission and termination of the path

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SLQ1A
overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one to four channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Maintenance
features

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

10.4.4 Working Principle and Signal Flow


The SLQ1A consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-11 shows the functional block diagram of the SLQ1A.

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Figure 1.1 Functional block diagram of the SLQ1A


155 MHz

155 Mbit/s
155 Mbit/s

O/E
E/O

S
P
I

155
Mbit/s

CDR

E/O

S
P
I

155
Mbit/s

CDR

Cross-connect unit

K1 and K2
Cross-connect unit

K1 and K2 insertion/extraction
High-speed
bus

....

155 Mbit/s

O/E

155
Mbit/s
155
Mbit/s

....

155 Mbit/s

Reference clock

155 MHz
PLL

RST

155
Mbit/s

MS
T

MS
A

HPT

High-speed
bus

155
Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shutdown

Logic and
control
module
+3.3 V

DC/DC
converter

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit A

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

1.1.1.1.345 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.346 CDR Module


This module restores the clock signal.

1.1.1.1.347 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

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In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.
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In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.348 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.349 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

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10.4.5 Front Panel


The front panel of the SLQ1A has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.350 Diagram of the Front Panel


Figure 10-12 shows the appearance of the front panel of the SLQ1A.
Figure 1.1 Front panel of the SLQ1A

SLQ1A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ1A

1.1.1.1.351 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.352 Interfaces
The front panel of the SLQ1A has four optical interfaces. Table 10-19 describes the types and
usage of the optical interfaces of the SLQ1A.
Figure 1.1 Optical interfaces of the SLQ1A
Interface

Type of Interface

Usage

IN1IN4

LC

Receives optical signals.

OUT1OUT4

LC

Transmits optical signals.

10.4.6 Valid Slots


The SLQ1A must be installed in a valid slot in the subrack. Otherwise, the SLQ1A fails to
work normally.
The slots valid for the SLQ1A are as follows:

The SLQ1A can be installed in slots 18 and 1117 in the subrack.

10.4.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ1A indicates the type of optical interface.
Table 10-20 provides the relationship between the feature code of the SLQ1A and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLQ1A and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SLQ1A10

10

S-1.1

SSN1SLQ1A11

11

L-1.1

SSN1SLQ1A12

12

L-1.2

SSN1SLQ1A13

13

Ve-1.2

SSN1SLQ1A14

14

I-1

SSN1SLQ1A15

15

Ie-1

10.4.8 Parameter Settings


You can set the parameters for the SLQ1A by using the U2000.
You can set the following parameters for the SLQ1A by using the U2000:
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J0

J1

J2

C2

10 SDH Boards

For the description of each parameter, see 26 Parameter Settings.

10.4.9 Technical Specifications


The technical specifications of the SLQ1A include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.353 Parameters Specified for Optical Interfaces


Table 10-21 lists the parameters specified for the optical interfaces of the SLQ1A.
Figure 1.1 Parameters specified for the optical interfaces of the SLQ1A
Parameter

Value

Nominal bit
rate

155520 kbit/s

Line code
pattern

NRZ

Application
code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Ie-1

Transmissio
n distance
(km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

0 to 2

Type of
fiber

Singlemode
LC

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Multi-mode
LC

Operating
wavelength
range (nm)

1260 to
1360

1261 to
1360

1263 to
1360

1480 to
1580

1480 to
1580

1270 to
1380

Launched
optical
power range
(dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

-19 to -14

Receiver
sensitivity
(dBm)

-23

-28

-34

-34

-34

-30

Minimum
overload
(dBm)

-8

-8

-10

-10

-10

-14

Minimum
extinction
ratio (dB)

8.2

8.2

10

10

10

10

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Parameter

Value

Maximum
-20 dB
spectral
width (nm)

Minimum
side mode
suppression
ratio (dB)

30

30

1.1.1.1.354 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.355 Mechanical Specifications


The mechanical specifications of the SLQ1A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.356 Power Consumption


The maximum power consumption of the SLQ1A at room temperature (25C) is 15 W.

10.5 SLO1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLO1 (8xSTM-1 optical interface board).

10.5.1 Version Description


The SLO1 is available in two functional versions, namely, N2 and N3. The difference
between the two versions is with regard to whether they support the TCM function and AU-3
services. The N3SLO1 is discontinued.
Table 10-22 describes the versions of the SLO1.
Figure 1.1 Versions of the SLO1
Item

Description

Functional
versions

The SLO1 is available in two functional versions, namely, N2 and N3.

Differences

Service processing: AU-3 service processing.

Maintenance features: loopbacks on VC-4 paths, TCM function, and


PRBS function.

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Item

Description

Substitution

When the N2SLO1 is not configured with the TCM function and AU-3
services, the N3SLO1 can substitute for the N2SLO1.

When you configure the MSP or SNCP, you cannot configure the N3SLO1 as the protection board if the
working board is the N2SLO1 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

10.5.2 Application
The SLO1 is a line board. The SLO1 can be used on the OptiX OSN equipment series to
transmit and receive STM-1 optical signals. The SLO1 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLO1 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-13 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.5.3 Functions and Features


The SLO1 transmits and receives 8xSTM-1 optical signals, performs O/E conversion for the
STM-1 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-23 provides the functions and features of the SLO1.

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Figure 1.2 Functions and features of the SLO1 board


Function and
Feature

SLO1

Basic functions

Receives and transmits 8xSTM-1 optical signals.

Specifications of
the optical
interface

Supports different types of standard optical interfaces, namely, the


I-1, S-1.1, L-1.1, L-1.2, and Ve-1.2.

The characteristics of the optical interfaces of the I-1, S-1.1, L1.1, and L-1.2 types comply with ITU-T G.957.

The characteristics of the optical interface of the Ve-1.2 type


comply with the standards defined by Huawei.

Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

Supports the usage and detection of the SFP optical module,


which facilitates the maintenance and upgrading of the optical
module.

Supports the VC-12 services, VC-3 services, and VC-4 services.

The N2SLO1 supports the AU-3 services.

Processes the section overheads of the STM-1 signals.

Processes the path overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one to eight channels of ECC communication.

Specifications of
the optical module

Service processing
Overhead
processing

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Maintenance
features

Supports inloops and outloops at optical interfaces.

The N3SLO1 supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

The N2SLO1 supports the TCM function.

The N3SLO1 supports the PRBS function in the line direction,


cross-connect direction and Cause by Cross function.

Supports the press-to-collect function in fault data collection.

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10.5.4 Working Principle and Signal Flow


The SLO1 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-14 shows the functional block diagram of the SLO1.
Figure 1.1 Functional block diagram of the SLO1
Backplane
155 MHz

O/E
155 Mbit/s

E/O

155
Mbit/s
SPI

Cross-connect
unit

K1 and K2

Cross-connect
unit

K1 and K2
insertion/extraction

High-speed
bus

....

E/O

Reference clock

155 Mbit/s

....
O/E

155 Mbit/s

CDR

155
Mbit/s

155 MHz
PLL

RST MST MSA HPT

CDR
SPI

High-speed
bus
DCC

155 Mbit/s
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
Communication
control module

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

1.1.1.1.357 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.358 CDR Module


This module restores the clock signal.

1.1.1.1.359 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
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RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.360 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

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1.1.1.1.361 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.5.5 Front Panel


The front panel of the SLO1 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.362 Diagram of the Front Panel


Figure 10-15 and Figure 10-16 show the appearance of the front panel of the SLO1.
Figure 1.1 Front panel of the SLO1 (with level optical interfaces)

SLO1
STAT
ACT
PROG
SRV

O U T 1 IN 1 O U T 2 IN 2
O U T 3 IN 3
O U T 4 IN 4
O U T 5 IN 5
O U T 6 IN 6
O U T 7 IN 7
O U T 8 IN 8
CLASS 1
LASER
PRODUCT

SLO1

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Figure 1.2 Front panel of the SLO1 (with slanting optical interfaces)

SLO1
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

TX1
RX1
TX2
RX2
TX3
RX3
TX4
RX4
TX5
RX5
TX6
RX6
TX7
RX7
TX8
RX8

SLO1

1.1.1.1.363 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.364 Interfaces
The front panel of the SLO1 has eight optical interfaces. Table 10-24 describes the types and
usage of the optical interfaces of the SLO1.

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Figure 1.1 Optical interfaces of the SLO1


Interface

Type of
Interface

Usage

IN1-IN8/RX1-RX8

LC

Receives optical signals.

OUT1-OUT8/TX1TX8

LC

Transmits optical signals.

For SLO1 boards with level optical interfaces, use optical attenuators only on the ODF side.

10.5.6 Valid Slots


The slots valid for the SLO1 vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SLO1 are as follows:

When the cross-connect capacity is 200 Gbit/s, the SLO1 can be installed in slots 18
and 1117. In this case, eight optical interfaces can be configured.

10.5.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLO1 indicates the type of optical interface.
Table 10-25 provides the relationship between the feature code of the SLO1 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLO1 and the type of optical interface
Board

Feature Code

Type of Optical interface

SSN2SLO110 and
SSN3SLO110

10

S-1.1

SSN2SLO111 and
SSN3SLO111

11

L-1.1

SSN2SLO112 and
SSN3SLO112

12

L-1.2

SSN2SLO113 and
SSN3SLO113

13

Ve-1.2

SSN2SLO114 and
SSN3SLO114

14

I-1

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10.5.8 Parameter Settings


You can set the parameters for the SLO1 by using the U2000.
You can set the following parameters for the SLO1 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.5.9 Technical Specifications


The technical specifications of the SLO1 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.365 Parameters Specified for Optical Interfaces


Table 10-26 lists the parameters specified for the optical interfaces of the SLO1.
Figure 1.1 Parameters specified for the optical interfaces of the SLO1
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Application code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Operating
wavelength range
(nm)

1261 to
1360

1261 to
1360

1263 to
1360

1480 to
1580

1480 to
1580

Launched optical
power range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

Receiver sensitivity
(dBm)

-23

-28

-34

-34

-34

Minimum overload
(dBm)

-8

-8

-10

-10

-10

Minimum extinction
ratio (dB)

8.2

8.2

10

10

10

Maximum -20 dB
spectral width (nm)

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Parameter

Value

Minimum side
mode suppression
ratio (dB)

10 SDH Boards

30

30

1.1.1.1.366 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.367 Mechanical Specifications


The mechanical specifications of the N2SLO1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.1

The mechanical specifications of the N3SLO1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.2

1.1.1.1.368 Power Consumption


The maximum power consumption of the N2SLO1 at room temperature (25C) is 26 W.
The maximum power consumption of the N3SLO1 at room temperature (25C) is 20 W.

10.6 SLT1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLT1 (12xSTM-1 optical interface board).

10.6.1 Version Description


The SLT1 is available in one functional version, namely, N1.

10.6.2 Application
The SLT1 is a line board. The SLT1 can be used on the OptiX OSN equipment series to
transmit and receive STM-1 optical signals. The SLT1 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLT1 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-17 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.

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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.6.3 Functions and Features


The SLT1 transmits and receives STM-1 optical signals, performs O/E conversion for the
STM-1 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-27 provides the functions and features of the SLT1.
Figure 1.1 Functions and features of the SLT1
Function and
Feature

SLT1

Basic functions

Transmits and receives 12xSTM-1 optical signals.

Specifications
of the optical
interface

Supports S-1.1, L-1.1 and L-1.2 standard optical interfaces whose


characteristics comply with ITU-T G.957.

Specifications
of the optical
module

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Supports the usage and detection of the SFP optical module, which
facilitates the maintenance of the optical module.

Supports the single-fiber bidirectional optical module, and the


single-fiber bidirectional optical module does not support loopbacks
at the optical interface by using fiber jumpers.

Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

Processes the section overheads of the STM-1 signals.

Supports the transparent transmission and termination of the path


overheads.

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Feature

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SLT1

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one to twelve channels of ECC communication. Port 1 to


port 8 support the ECC communication by using bytes D1D12. Port
9 to port 12 support the ECC communication by using bytes D1D3.

Supports the time synchronization feature and transmission of the


time information by using the section overhead bytes.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Maintenance
features

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the Cause by Cross function.

Supports the press-to-collect function in fault data collection.

10.6.4 Working Principle and Signal Flow


The SLT1 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module. The external services are accessed by
the external interface boards EU08 and OU08. The EU08 is an electrical interface board and
the OU08 is an optical interface board.
Figure 10-18 shows the functional block diagram of the SLT1.

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Figure 1.1 Functional block diagram of the SLT1


155 MHz

O/E
155 Mbit/s

E/O

155
Mbit/s
SPI

E/O

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

....

155 Mbit/s

155
Mbit/s

Backplane
Reference clock
Cross-connect
unit

155 Mbit/s

....
O/E

CDR

155 MHz
PLL

RST MST MSA HPT

CDR
SPI

High-speed
bus
DCC

155 Mbit/s
SDH overhead
processing module

O/E converting
module

Frame header
Logic and
control module Communication

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

1.1.1.1.369 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.370 CDR Module


This module restores the clock signal.

1.1.1.1.371 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

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RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
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sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.372 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.373 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.6.5 Front Panel


The front panel of the SLT1 has indicators, interfaces, a bar code, and a laser safety class
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label.

1.1.1.1.374 Diagram of the Front Panel


Figure 10-19 shows the appearance of the front panel of the SLT1.
Figure 1.1 Front panel of the SLT1

SLT1
STAT
ACT
PROG
SRV

O U T 1 IN 1 O U T 2 IN 2
O U T 3 IN 3
O U T 4 IN 4
O U T 5 IN 5
O U T 6 IN 6
O U T 7 IN 7
O U T 8 IN 8
O U T 9 IN 9 O U T 1 0 IN 1 0 O U T 1 1 IN 1 1 O U T 1 2 IN 1 2
CLASS 1
LASER
PRODUCT

SLT1

1.1.1.1.375 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.


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1.1.1.1.376 Interfaces
The front panel of the SLT1 has 12 optical interfaces. Table 10-28 describes the types and
usage of the optical interfaces of the SLT1.
Figure 1.1 Optical interfaces of the SLT1
Interface

Type of
Interface

Usage

IN1IN12

LC

Receives optical signals.

OUT1OUT12

LC

Transmits optical signals.

The optical interfaces of the SLT1 are level optical interfaces. Hence, use an optical attenuator
only on the ODF side.

10.6.6 Valid Slots


The slots valid for the SLT1 vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

When the cross-connect capacity is 200 Gbit/s, the SLT1 can be installed in slots 18 and
1116. When the SLT1 is installed in slots 14, 15, and 16, one to eight optical interfaces
can be configured. When the SLT1 is installed in slots 58 and 1114, one to twelve
optical interfaces can be configured.

10.6.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLT1 indicates the type of optical interface.
Table 10-29 provides the relationship between the feature code of the SLT1 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLT1 and the type of optical interface
Board

Feature Code

Type of Optical interface

SSN1SLT123

23

S-1.1

SSN1SLT124

24

L-1.1

SSN1SLT125

25

L-1.2

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10.6.8 Parameter Settings


You can set the parameters for the SLT1 by using the U2000.
You can set the following parameters for the SLT1 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.6.9 Technical Specifications


The technical specifications of the SLT1 include the parameters specified for optical
interfaces, dimensions, weight, and power consumption.

1.1.1.1.377 Parameters Specified for Optical Interfaces


Table 10-30 lists the parameters specified for the optical interfaces of the SLT1.
Figure 1.1 Parameters specified for the optical interfaces of the SLT1
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Application code

S-1.1

L-1.1

L-1.2

Transmission distance (km)

2 to 15

15 to 40

40 to 80

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Operating wavelength range


(nm)

1261 to 1360

1263 to 1360

1480 to 1580

Launched optical power


range (dBm)

-15 to -8

-5 to 0

-5 to 0

Receiver sensitivity (dBm)

-28

-34

-34

Minimum overload (dBm)

-8

-10

-10

Minimum extinction ratio


(dB)

8.2

10

10

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

Table 10-31 lists the parameters specified for the single-fiber bidirectional optical interfaces
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of the SLT1.
Figure 1.2 Parameters specified for the single-fiber bidirectional optical interfaces of the SLT1
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Type of optical interface

S-1.1

S-1.1

L-1.1

L-1.1

Transmission distance
(km)

2 to 15

2 to 15

15 to 40

15 to 40

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Singlemode LC

Operating transmit
wavelength (nm)

1550

1310

1550

1310

Operating receive
wavelength (nm)

1310

1550

1310

1550

Launched optical power


range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

Receiver sensitivity
(dBm)

-32

-32

-32

-32

Minimum overload
(dBm)

-8

-8

-10

-10

Minimum extinction
ratio (dB)

8.5

8.5

10

10

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio (dB)

1.1.1.1.378 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.379 Mechanical Specifications


The mechanical specifications of the SLT1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.3

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1.1.1.1.380 Power Consumption


The maximum power consumption of the SLT1 at room temperature (25C) is 22 W.

10.7 SLH1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLH1 (16xSTM-1 signal processing board). This topic also
describes how to configure and commission the SLH1.

10.7.1 Version Description


The SLH1 is available in one functional version, namely, N1.

10.7.2 Application
The SLH1 is a line board. The SLH1 can be used on the OptiX OSN equipment series to
transmit and receive STM-1 optical/electrical signals. The SLH1 converts the received optical
signals into electrical signals and sends the electrical signals to the cross-connect side, or
directly sends the received electrical signals to the cross-connect side. In addition, the SLH1
converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-20 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.7.3 Functions and Features


The SLH1 processes STM-1 optical and electrical signals.
Table 10-32 provides the functions and features of the SLH1.

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Figure 1.1 Functions and features of the SLH1


Function and
Feature

SLH1

Basic functions

Processes 16xSTM-1 signals.

Specifications of
the optical
module

Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Supports the single-fiber bidirectional optical module, and the


single-fiber bidirectional optical module does not support loopbacks
at the optical interface by using fiber jumpers.

Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

Processes the section overheads of the STM-1 signals.

Supports the transparent transmission and termination of the path


overheads. Supports the setting and query of the J0, J1, and C2
bytes.

Supports one to sixteen channels of ECC communication. Port 1 to


port 8 support the ECC communication by using bytes D1-D12.
Port 9 to port 16 support the ECC communication by using bytes
D1-D3.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

Supports the SNCTP.

Supports the TPS protection when used with the interface board and
the switching and bridging board.

Supports inloops and outloops at optical interfaces.

Supports inloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

Maintenance
features

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When the SLH1 works with different interface boards and electrical interface switching
boards, the access capabilities for the STM-1 signals are different. For details, refer to Table
10-33.
Figure 1.2 Access capabilities of the SLH1 when the SLH1 works with different interface boards
and electrical interface switching boards
Interface Board

SLH1

None

The SLH1 cannot transmit/receive signals.

EU08

Transmits/Receives and processes 8-channel or 16-channel electrical


signals.

OU08

Transmits/Receives and processes 8-channel or 16-channel optical


signals.

EU08 + OU08

Transmits/Receives and processes 8-channel electrical signals and 8channel optical signals.

EU08 + TSB8

Transmits/Receives and processes 8-channel or 16-channel STM-1


electrical signals, and realizes the 1:N (N3) TPS protection.

10.7.4 Working Principle and Signal Flow


The SLH1 consists of the CDR module, SDH overhead processing module, logic and control
module, and power module. The external services are accessed by the external interface
boards EU08 and OU08. The EU08 is an electrical interface board and the OU08 is an optical
interface board.
Figure 10-21 shows the functional block diagram of the SLH1 when the SLH1 works with the
EU08 by describing how to process 1xSTM-1 signals.

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Figure 1.1 Functional block diagram of the SLH1 when the SLH1 works with the EU08
Backplane
155 MHz
PLL

155 MHz
SPI

EU08
155 Mbit/s

155
Mbit/s

Encode/
Decode

K1 and K2

Cross-connect
unit

K1 and K2
insertion/extraction

High-s peed
bus

....

155 Mbit/s

CDR

Cross-connect
unit

155 Mbit/s

CMI
Transformer

155
Mbit/s

Reference clock

RST MST MSA HPT

High-s peed
bus

CDR

DCC

155 Mbit/s

SDH overhead
processing module
Frame header

Logic and
control module

LOS

+3.3 V
Power
module

Communication

Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V

Fuse

Power
module

Cross-connect
unit A

-48 V/-60 V
Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

CDR: clock data restoration

Figure 10-22 shows the functional block diagram of the SLH1 when the SLH1 works with the
OU08 by describing how to process 1xSTM-1 signals.
Figure 1.2 Functional block diagram of the SLH1 when the SLH1 works with the OU08
Backplane
155 MHz
PLL

155 MHz
155
155
Mbit/s CDR Mbit/s

OU08
155 Mbit/s

K1 and K2

Cross-connect
unit

K1 and K2
insertion/extraction

....

SPI

High-speed
bus
RST

MST MSA HPT

CDR

E/O

SDH overhead
processing module

LOS
Laser shutdown

Frame header
Logic and
Communication
control module
+3.3 V

Power
module

PLL: phase-locked loop

High-speed
bus
DCC

155 Mbit/s

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Cross-connect
unit

155 Mbit/s
O/E

155 Mbit/s

Reference clock

Power
module

SPI: SDH physical interface

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Fuse

Cross-connect
unit A
Cros s-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

SDH: synchronous digital


hierarchy
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RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

CDR: clock data restoration

1.1.1.1.381 CDR Module


This module restores the clock signal.

1.1.1.1.382 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

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RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
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sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.383 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.384 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.7.5 Front Panel


The front panel of the SLH1 has indicators and a bar code.

1.1.1.1.385 Diagram of the Front Panel


The front panel of the SLH1 does not have an interface. Hence, the SLH1 must be used with
the EU08 or OU08. Figure 10-23 shows the appearance of the front panel of the SLH1.

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Figure 1.1 Front panel of the SLH1

SLH1
STAT
ACT
PROG
SRV

SLH1

1.1.1.1.386 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

10.7.6 Jumpers and DIP Switches


The SLH1 does not have any jumpers or DIP switches that are used for board settings.

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10.7.7 Valid Slots


The SLH1 must be installed in a valid slot in the subrack. Otherwise, the SLH1 fails to work
normally.
The slots valid for the SLH1 vary with the cross-connect capacity of the subrack. The SLH1
needs to work with the OU08/EU08 and TSB8. The slots valid for the SLH1 are as follows:

When the cross-connect capacity is 200 Gbit/s, the SLH1 can be installed in slots 25
and 1316.

10.7.8 Board Protection


The SLH1 supports the 1:N (N3) tributary protection switching (TPS) protection.

1.1.1.1.387 Protection Principle


The TPS protection is equipment-level protection. When the working board fails, the accessed
signals are switched to the protection board. Hence, complex network-level protection
operations such as the MSP and SNCP are not triggered. In addition, the reliability of the
equipment is enhanced.
The SLH1 can work with the EU08 and TSB8 to realize one 1:N (N3) TPS protection group
for 8xSTM-1 or 16xSTM-1 electrical signals. Figure 10-24 shows the TPS protection
provided by the SLH1.
Figure 1.1 TPS protection provided by the SLH1
Service signal

Service signal
Switching
control bus

Crossconnect and
timing board

Interface board N

Working board N

Working board

Working board 1

Protection board

Interface board

Interface board 1

Protection
switching board

Failed

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the corresponding working board through position 1 of the control switch on the
interface board.

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Switching state
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When a working board detects a failure and requires the switching operation, the control
switch of the corresponding interface board switches from position 1 to position 2. At the
same time, the control switch of the protection switching board switches to the
corresponding position so that the protection board can protect the failed working board.
TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing
board. Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

1.1.1.1.388 Hardware Configuration


Figure 10-25 shows the slot configuration for two 1:3 TPS protection groups for 16xSTM-1
signals of the SLH1.

PIU

S
L
O
T
3
1

S
L
O
T
3
4

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
7

AUX

PIU

S
L
O
T
3
0

S
L
O
T
3
3

S
L
O
T
9

S
L
O
T
1
0

Working 1

Working 1

XCS

XCS

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8
Working 2

S S S S
L L L L
O O O O
T T T T
5 6 7 8

Working 2

S
L
O
T
4

FAN

Working 2

S S S
L L L
O O O
T T T
1 2 3

Working 1

S
L
O
T
3
2

FAN

Protection 1

FAN

S
L
O
T
2
9

GSCC

S
L
O
T
2
8

TSB8

S
L
O
T
2
7

TSB8

S
L
O
T
2
6

EU08

S
L
O
T
2
3

Protection 2

S
L
O
T
2
5

EU08

S
L
O
T
2
2

EU08
EU08
EU08
EU08

S
L
O
T
2
4

TSB8
EU08
EU08
EU08
EU08

S
L
O
T
2
1

EU08

S
L
O
T
2
0

EU08

S
L
O
T
1
9

TSB8

Figure 1.2 Slot configuration for two 1:3 TPS protection groups of the SLH1

Fiber routing area

In Figure 10-25, the board in slot 2 protects the boards in slots 3-5. The board in slot 16
protects the boards in slots 13-15.
Table 10-34 lists the slots for the SLH1, EU08, and TSB8.

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Figure 1.1 Slots for the SLH1, EU08, and TSB8


Board

Protection Group 1

Protection Group 2

SLH1 (protection
board)

Slot 2

Slot 16

TSB8

Slots 19-20

Slots 35-36

SLH1 (working
board)

Slots 3-5

Slots 13-15

EU08

Slots 21-26

Slots 29-34

When the equipment is configured for two 1:3 TPS protection groups for 8xSTM-1 signals of the SLH1,
the TSB8 and EU08 can be inserted only in the odd slots.

10.7.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.389 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.390 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

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Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.391 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.392 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.7.10 Parameter Settings


You can set the parameters for the SLH1 by using the U2000.
You can set the following parameters for the SLH1 by using the U2000:

J0

J1

C2

For the description of each parameter, see 26 Parameter Settings.

10.7.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

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1.1.1.1.393 Troubleshooting
Table 10-35 lists the faults that occur on the SLH1 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the SLH1 frequently
Fault Symptom

Common Fault
Cause

Service interruption

The optical fiber,


cable, or
connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become
unreachable to
the .

Bit error

Pointer justification

Protection switching
failure

NEs being
unreachable to the

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

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Fault Symptom

10 SDH Boards

Common Fault
Cause

Equipment
interconnection fault

Troubleshooting Method

An NE becomes
unreachable to
the frequently.

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

1.1.1.1.394 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLH1, see Replacing an SDH Board.

10.7.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

10.7.12.1 Alarms of N1SLH1(B)


ALM_ALS

AU_LOP

AU_AIS

AU_CMM

B2_EXC

B1_EXC

B1_SD

B3_EXC_VC3

B2_SD

B3_EXC

BD_STATUS

B3_SD

B3_SD_VC3

BIP_SD

BIP8_ECC

BIP_EXC

C2_VCAIS

CHIP_FAIL

C2_PDI

FSELECT_STG

HP_LOM

COMMUN_FAIL

HP_REI

HP_SLM

HP_RDI

HP_UNEQ

IN_PWR_ABN

HP_TIM

LASER_MOD_ERR

LASER_SHUT

J0_MM

LP_RDI_VC12

LP_RDI_VC3

LOOP_ALM

LP_REI_VC3

LP_SLM_VC12

LP_REI_VC12

LP_TIM_VC12

LP_TIM_VC3

LP_SLM_VC3

LP_UNEQ_VC3

LSR_COOL_ALM

LP_UNEQ_VC12

LSR_WILL_DIE

MS_AIS

LSR_NO_FITED

MS_REI

R_LOF

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MS_RDI

NO_BD_SOFT

RELAY_FAIL

OH_LOOP

OUT_PWR_ABN

SUBCARD_ABN

POWER_ABNORMAL

R_LOC

TEM_LA

R_LOS

R_OOF

TPS_ALM

SLAVE_WORKING

SPARE_PATH_ALM

TU_AIS_VC3

T_LOSEX

TEM_HA

W_R_FAIL

TEST_STATUS

TF

PATCH_NOT_CONFIRM

TR_LOC

TU_AIS_VC12

MOD_TYPE_MISMATCH

TU_LOP_VC12

TU_LOP_VC3

SWDL_PKG_NOBDSOFT

PS

PATCH_ERR

PATCHFILE_NOTEXIST

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.7.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

10.7.13.1 Performance Events of N1SLH1(B)


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

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TPLCUR

10 SDH Boards

TPLMAX

10.7.14 Technical Specifications


The technical specifications of the SLH1 include the parameters specified for optical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.395 Parameters Specified for Interfaces


The OU8 or EU08 provides interfaces for the SLH1. For the parameters specified for the
interfaces, see Technical Specifications of the EU08 and Technical Specifications of the
OU08.

1.1.1.1.396 Mechanical Specifications


The mechanical specifications of the SLH1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.397 Power Consumption


The maximum power consumption of the SLH1 at room temperature (25C) is 27 W.

10.8 SEP1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SEP1 (8xSTM-1 line processing board). This topic also
describes how to configure and commission the SEP1.

10.8.1 Version Description


The SEP1 is available in one functional version, namely, N1.

10.8.2 Application
The SEP1 is a line board. The SEP1 can be used on the OptiX OSN equipment series to
transmit and receive STM-1 optical/electrical signals. The SEP1 converts the received optical
signals into electrical signals and sends the electrical signals to the cross-connect side, or
directly sends the received electrical signals to the cross-connect side. In addition, the SEP1
converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-26 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.

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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.8.3 Functions and Features


The SEP1 processes STM-1 signals. When the interfaces are available on the front panel of
the SEP1 (the logical board of the SEP1 is displayed as SEP1 on the U2000), the SEP1
processes 2xSTM-1 electrical signals. When the SEP1 is used with the interface board (the
logical board of the SEP1 is displayed as SEP on the U2000), the SEP1 processes 8xSTM-1
optical/electrical signals or 4xSTM-1 electrical signals. The physical boards of the two types
of logical boards (SEP1 and SEP) are the SEP1. When the logical boards do not need to be
differentiated, both the SEP1 and SEP are defined as SEP1.
Table 10-36 provides the functions and features of the SEP1.
Figure 1.1 Functions and features of the SEP1
Function and
Feature

SEP1

Basic functions

Processes 2xSTM-1 signals when the interfaces are available on the


front panel.

Processes 8xSTM-1 or 4xSTM-1 signals when the SEP1 works with


an interface board.

Service
processing

Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

Processes the section overheads of the STM-1 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one or two channels of ECC communication.

Alarms and
performance
events

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Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

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Function and
Feature

SEP1

Protection
schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

Supports the SNCTP.

Supports the TPS protection when used with the interface board and
the switching and bridging board.

Supports inloops and outloops at optical interfaces.

Supports inloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

Maintenance
features

When the SEP1 works with different interface boards and electrical interface switching
boards, the access capabilities for the STM-1 signals are different. For details, refer to Table
10-37.
Figure 1.2 Access capabilities of the SEP1 when the SEP1 works with different interface boards
and electrical interface switching boards
Interface Board

SEP1

None

Transmits/Receives and processes 2xSTM-1 electrical signals, but


does not support the TPS protection.

EU04

Transmits/Receives and processes 4xSTM-1 electrical signals.

EU08

Transmits/Receives and processes 8xSTM-1 electrical signals.

OU08

Transmits/Receives and processes 8xSTM-1 optical signals.

EU04 + TSB4

Transmits/Receives and processes 4xSTM-1 electrical signals, and


supports the TPS protection.

EU08 + TSB8

Transmits/Receives and processes 8xSTM-1 electrical signals, and


supports the TPS protection.

EU04 + TSB8

Transmits/Receives and processes 4xSTM-1 electrical signals, and


supports the TPS protection.

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One SEP1 can transmit/receive services from only one interface board. When the SEP1 works with an
interface board, the two interfaces on the front panel of the SEP1 are invalid.

10.8.4 Working Principle and Signal Flow


The SEP1 consists of the line interface module, CDR module, SDH overhead processing
module, logic and control module, and power module. The external services are accessed by
the external interface boards EU04//EU08/OU08. The EU04/EU08 is an electrical interface
board and the OU08 is an optical interface board.
Figure 10-27 shows the functional block diagram of the SEP1.
Figure 1.1 Functional block diagram of the SEP1
155 MHz
PLL

155 MHz
SPI
Port 1

155 Mbit/s

Port 2

CMI

155 Mbit/s
155 Mbit/s

CDR

Transformer

Encode/
Decode

155
Mbit/s

K1 and K2
insertion/extraction

K1 and K2

155 Mbit/s
....

155 Mbit/s

CMI Encode/
Decode
Transform er

NRZ

Backplane
Reference clock
Cross-connect
unit

NRZ CDR

High-speed
bus

155
Mbit/s

RST MST

MSA HPT

High-speed
bus
DCC

155 Mbit/s

SDH overhead
processing module

LOS

Logic and
control module
+3.3 V
Power
module

Frame header
Communication
Fuse

Power
module

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

CDR: clock data restoration

Figure 10-28 shows the functional block diagram of the SEP when the SEP works with the
EU08. When the SEP works with the EU04, the function block diagram is the same except
that the number of signals accessed and processed by the SEP is different.

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Figure 1.2 Functional block diagram of the SEP when the SEP works with the EU08
Backplane
155 MHz
PLL

Reference clock

K1 and K2
insertion/extraction

EU08

SPI

155 Mbit/s
CMI
Encode/
Port 1
Transformer
155 Mbit/s
Decode

155 Mbit/s
CDR
155 Mbit/s

155 Mbit/s
CMI
Port 8
Encode/
155 Mbit/s Transformer
Decode

CDR

155 Mbit/s

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus

155 Mbit/s

DCC
SDH overhead
processing module

LOS

Logic and
control module
+3.3 V
Power
module

Frame header
Communication
Fuse

Power
module

Fuse

Cross-connect
unit

Cross-connect
unit

Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

CDR: clock data restoration

Figure 10-29 shows the functional block diagram of the SEP when the SEP works with the
OU08.

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Figure 1.3 Functional block diagram of the SEP when the SEP works with the OU08
Backplane
155 MHz
PLL

155 OU08
Mbit/s
O/E
155
Port 1 Mbit/s
E/O
155
Mbit/s O/E
Port 8 155
E/O
Mbit/s

Reference clock

K1 and K2
insertion/extraction
NRZ
SP
I
NRZ

K1 and K2

155
Mbit/s

CDR
155 Mbit/s
155
Mbit/s
CDR
155 Mbit/s

High-speed
bus
RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

Logic and
control module

LOS
Laser shutdown

+3.3 V
Power
module

Frame header
Communication

Power
module

Fuse

Cross-connect
unit

Cross-connect
unit

Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

CDR: clock data restoration

If the SEP works with the OU08 that uses electrical modules, it works in the same way as it does when it
works with the EU08.

1.1.1.1.398 Line Interface Module and CDR Module

In the receive direction, the received electrical signals (CMI codes) are isolated through
the converter and then transmitted to the decoding unit. The CDR module restores the
clock signals after decoding.

In the transmit direction, the SDH signals, which are processed by the SDH overhead
processing module, are transmitted to the encoding unit. The converter isolates the 155
Mbit/s electrical signals (CMI codes) and sends the signals. The encoding and decoding
units monitor R_LOS alarms.

1.1.1.1.399 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.
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RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.400 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

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1.1.1.1.401 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.8.5 Front Panel


The front panel of the SEP1 has indicators, interfaces, and a bar code.

1.1.1.1.402 Diagram of the Front Panel


Figure 10-30 shows the appearance of the front panel of the SEP1.
Figure 1.1 Front panel of the SEP1

SEP1
STAT
ACT
PROG
SRV

AOUT
AIN
BOUT
BIN

SEP1

1.1.1.1.403 Indicators
The front panel of the board has the following indicators:
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Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.404 Interfaces
The front panel of the SEP1 has two pairs of electrical interfaces. Table 10-38 describes the
types and usage of the electrical interfaces of the SEP1.
Figure 1.1 Electrical interfaces of the SEP1
Interface

Type of Interface

Usage

AINBIN

75-ohm SMB

Receives the STM-1 signals.

AOUTBOUT

75-ohm SMB

Transmits the STM-1 signals.

Note: The SEP1 can be used with the interface board EU04, EU08, or OU08. In this case,
the SEP1 is defined as SEP. When the SEP1 is used with the interface board, the two
interfaces on the front panel are invalid.

10.8.6 Jumpers and DIP Switches


The SEP1 does not have any jumpers or DIP switches that are used for board settings.

10.8.7 Valid Slots


The SEP1 must be installed in a valid slot in the subrack. Otherwise, the SEP1 cannot work
normally.
When the SEP1 is used with the interface board, the logical board of the SEP1 is displayed as SEP on
the .

The slots valid for the SEP1 are as follows:

When the SEP1 is connected to cables by using the interfaces on its front panel, the
SEP1 can be installed in slots 16 and 1316 in the subrack.

When the SEP1 is used with the interface board, the SEP1 can be installed in slots 25
and 1316 in the subrack.

10.8.8 Board Protection


The TPS protection is equipment-level protection. When the working board fails, the accessed
services are switched to the protection board. Hence, complex network-level protection
operations such as the MSP and SNCP are not triggered. In addition, the reliability of the
equipment is enhanced.
When the SEP1 is used with the interface board, the logical board of the SEP1 is displayed as SEP on
the .

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1.1.1.1.405 Protection Principle


The SEP can work with the EU08 and TSB8 to provide two 1:N (N3) TPS protection groups
for 8xSTM-1 electrical signals.
The SEP can also work with the EU04 and TSB4 to provide two 1:N (N3) TPS protection
groups for 4xSTM-1 electrical signals.
When the SEP works with the EU08 and TSB8 to realize the TPS protection, the protection
principle and valid slots of the involved boards are the same as the protection principle and
valid slots of the involved boards when the SEP works with the EU04 and TSB4 to realize the
TPS protection. Figure 10-31 shows the TPS protection provided by the SEP.
Figure 1.1 TPS protection provided by the SEP
Service signal

Service signal
Switching
control bus

Crossconnect and
timing board

Interface board N

Working board N

Working board

Working board 1

Protection board

Interface board

Interface board 1

Protection
switching board

Failed

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the corresponding working board through position 1 of the control switch on the
interface board.

Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding interface board switches from position 1 to position 2. At the
same time, the control switch of the protection switching board switches to the
corresponding position so that the protection board can protect the failed working board.
TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing
board. Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

1.1.1.1.406 Hardware Configuration


Figure 10-32 shows the slot configuration for the two 1:3 TPS protection groups of the SEP.

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S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
9

S
L
O
T
1
0

Working 1

Working 1

XCS

XCS

S
L
O
T
3
7

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

GSCC

S S S S
L L L L
O O O O
T T T T
5 6 7 8

S
L
O
T
3
6

FAN

Working 2

S
L
O
T
4

S
L
O
T
3
5

AUX

S
L
O
T
3
2

TSB8

S
L
O
T
3
1

Working 2

S S S
L L L
O O O
T T T
1 2 3

Working 1

S
L
O
T
3
0

FAN

Protection 1

FAN

S
L
O
T
2
9

Working 2

S
L
O
T
2
8

Protection 2

S
L
O
T
2
7

EU08

S
L
O
T
2
6

EU08

S
L
O
T
2
5

EU08

S
L
O
T
2
4

PIU

S
L
O
T
2
3

EU08

S
L
O
T
2
2

EU08

S
L
O
T
2
1

EU08

S
L
O
T
2
0

TSB8

S
L
O
T
1
9

PIU

Figure 1.2 Slot configuration for the two 1:3 TPS protection groups of the SEP

Fiber routing area

In Figure 10-32, the board in slot 2 protects the boards in slots 3-5. The board in slot 16
protects the boards in slots 13-15.
Table 10-39 lists the slots for the SEP, EU08, and TSB8.
Figure 1.1 Slots for the SEP, EU08, and TSB8
Board

Protection Group 1

Protection Group 2

SEP (working board)

Slot 2

Slot 16

TSB8

Slot 19

Slot 35

SEP (working board)

Slots 3-5

Slots 13-15

EU08

Slots 21, 23, and 25

Slots 29, 31, and 33

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10.8.9 Feature Code


The IFSD1 does not have a feature code.

10.8.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

When the SEP1 works with the EU08, ensure that the EU08 is installed before the SEP1.
Otherwise, the opposite end may receive the R_LOF alarm.

1.1.1.1.407 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.408 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

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Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.409 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.410 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.8.11 Parameter Settings


You can set the parameters for the SEP1 by using the U2000.
You can set the following parameters for the SEP1 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.8.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.411 Troubleshooting
Table 10-40 lists the faults that occur on the SEP1 frequently and the troubleshooting
methods.

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Figure 1.1 Methods used to troubleshoot the faults that occur on the SEP1 frequently
Fault Symptom

Common Fault
Cause

Service interruption

The optical fiber,


cable, or
connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become
unreachable to
the .

An NE becomes
unreachable to
the frequently.

Bit error

Pointer justification

Protection switching
failure

NEs being
unreachable to the

Equipment
interconnection fault
Issue 02 (2013-01-18)

An SDH overhead
interconnection fault

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

See Troubleshooting Device Interconnection


Faults.

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Fault Symptom

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Common Fault
Cause

Troubleshooting Method

occurs.

1.1.1.1.412 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SEP1, see Replacing an SDH Board.

10.8.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

10.8.13.1 Alarms of N1SEP1


AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_FAIL

C2_PDI

C2_VCAIS

FSELECT_STG

COMMUN_FAIL

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LP_RDI_VC12

J0_MM

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

POWER_ABNORMAL

R_LOC

R_LOF

R_LOS

R_OOF

SLAVE_WORKING

SPARE_PATH_ALM

T_LOSEX

TEST_STATUS

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

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TU_LOP_VC3

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

PS

SWDL_PKG_NOBDSOF
T

MOD_TYPE_MISMATCH

WRG_BD_TYPE

10.8.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

10.8.14.1 Performance Events of N1SEP1


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSOFS

RSUAS

RSSES

10.8.15 Technical Specifications


The technical specifications of the SEP1 include the parameters specified for interfaces,
mechanical specifications, and power consumption.

1.1.1.1.413 Parameters Specified for Interfaces


Table 10-41 lists the parameters specified for the interfaces of the SEP1.
Figure 1.1 Parameters specified for the interfaces of the SEP1
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

CMI and NRZ

Connector

SMB

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1.1.1.1.414 Mechanical Specifications


The mechanical specifications of the SEP1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.415 Power Consumption


The maximum power consumption of the SEP1 at room temperature (25C) is 17 W.

10.9 SL4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL4 (1xSTM-4 optical interface board).

10.9.1 Version Description


The SL4 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to whether they support the TCM function and AU-3 services.
The N1SL4 is no longer manufactured.
Table 10-42 describes the versions of the SL4.
Figure 1.1 Versions of the SL4
Item

Description

Functional versions

The SL4 is available in two functional versions, namely, N1 and


N2.

Differences

Service processing: AU-3 service processing.

Maintenance features: loopbacks on VC-4 paths.

Substitution

Through the board version replacement function, the N1SL4A can


substitute for the N1SL4.

When you configure the MSP or SNCP, you cannot configure the N1SL4 as the protection board if the
working board is the N2SL4 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

10.9.2 Application
The SL4 is a line board. The SL4 can be used on the OptiX OSN equipment series to transmit
and receive STM-4 optical signals. The SL4 converts the received optical signals into
electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SL4 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-33 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.9.3 Functions and Features


The SL4 transmits and receives 1xSTM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-43 provides the functions and features of the SL4.
Figure 1.2 Functions and features of the SL4
Function and
Feature

SL4

Basic functions

Receives and transmits 1xSTM-4 optical signals, and processes


1xSTM-4 standard or concatenation services.

Specifications of
the optical
interface

Supports different types of standard optical interfaces, namely, the


I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2.

The characteristics of the optical interfaces of the I-4, S-4.1, L-4.1,


and L-4.2 types comply with ITU-T G.957.

The characteristics of the optical interface of the Ve-4.2 type


comply with the standards defined by Huawei.

Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

Supports the usage and monitoring of the SFP optical module,


which facilitates the maintenance and upgrading of the optical
module.

Supports the VC-12 services, VC-3 services, VC-4 services, and


VC-4-4c concatenation services.

The N2SL4 supports the AU-3 services.

Specifications of
the optical
module

Service
processing

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Function and
Feature

SL4

Overhead
processing

Processes the section overheads of the STM-4 signals.

Supports the transparent transmission and termination of the path


overheads. Supports the setting and query of the J0, J1, J2, and C2
bytes.

Supports one channel of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Supports the fiber-shared MSP and SNCP and processes two sets of
K bytes. One SL4 supports a maximum of two MSP protection
rings.

Supports inloops and outloops at optical interfaces.

The N1SL4 supports inloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

The N2SL4 supports the TCM function.

Supports the press-to-collect function in fault data collection.

Maintenance
features

10.9.4 Working Principle and Signal Flow


The SL4 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-34 shows the functional block diagram of the .SL4

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Figure 1.1 Functional block diagram of the SL4


155 MHz

622 Mbit/s
622 Mbit/s

O/E
E/O

S
P
I

622
Mbit/s

CDR

Reference clock

155 MHz
PLL

622
Mbit/s

K1 and K2

K1 and K2 insertion/extraction

Cross-connect unit

Cross-connect unit

622 Mbit/s
High-speed bus

622 Mbit/s

O/E
E/O

S
P
I

....

....

622 Mbit/s

Cross-connect unit A

622
Mbit/s

CDR

622
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

622 Mbit/s

DCC
SDH overhead processing module

IIC

Logic and
control
module

LOS
Laser shutdown

+3.3 V

DC/DC
converter

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

The functional modules of the STM-4 units are described as follows:

1.1.1.1.416 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.417 CDR Module


This module restores the clock signal.

1.1.1.1.418 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

Issue 02 (2013-01-18)

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
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(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.419 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.420 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.9.5 Front Panel


The front panel of the SL4 has indicators, interfaces, a bar code, and a laser safety class label.

1.1.1.1.421 Diagram of the Front Panel


Figure 10-35 shows the appearance of the front panel of the SL4.
Figure 1.1 Front panel of the SL4

SL4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1

SL4

1.1.1.1.422 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

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For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.423 Interfaces
The front panel of the SL4 has one optical interface. Table 10-44 describes the types and
usage of the optical interfaces of the SL4.
Figure 1.1 Optical interfaces of the SL4
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

The SL4 can use the swappable optical modules to facilitate maintenance.

10.9.6 Valid Slots


The slots valid for the SL4 vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SL4 are as follows:

When the cross-connect capacity is 200 Gbit/s, the SL4 can be installed in slots 18 and
1117.

10.9.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL4 indicates the type of optical interface.
Table 10-45 provides the relationship between the feature code of the SL4 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SL4 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SL410 and
SSN2SL410

10

S-4.1

SSN1SL411 and
SSN2SL411

11

L-4.1

SSN1SL412 and
SSN2SL412

12

L-4.2

SSN1SL413 and
SSN2SL413

13

Ve-4.2

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Board

Feature Code

Type of Optical Interface

SSN1SL414 and
SSN2SL414

14

I-4

10.9.8 Parameter Settings


You can set the parameters for the SL4 by using the U2000.
You can set the following parameters for the SL4 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.9.9 Technical Specifications


The technical specifications of the SL4 include the parameters specified for optical interfaces,
laser safety class, mechanical specifications, and power consumption.

1.1.1.1.424 Parameters Specified for Optical Interfaces


Table 10-46 lists the parameters specified for the optical interfaces of the SL4.
Figure 1.1 Parameters specified for the optical interfaces of the SL4
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Application code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Single-mode
LC

Single-mode
LC

Singlemode LC

Singlemode LC

Singlemode LC

Operating
wavelength range
(nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to
1580

Launched optical
power range
(dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver
sensitivity (dBm)

-23

-28

-28

-28

-34

Minimum

-8

-8

-8

-8

-13

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Parameter

10 SDH Boards

Value

overload (dBm)
Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20 dB
spectral width
(nm)

Minimum side
mode
suppression ratio
(dB)

30

30

30

1.1.1.1.425 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.426 Mechanical Specifications


The mechanical specifications of the N1SL4 and N2SL4 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1SL4 (kg): 0.6

Weight of the N2SL4 (kg): 1.0

1.1.1.1.427 Power Consumption


The maximum power consumption of the N1SL4 at room temperature (25C) is 17 W.
The maximum power consumption of the N2SL4 at room temperature (25C) is 15 W.

10.10 SL4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL4A (1xSTM-4 optical interface board).

10.10.1 Version Description


The SL4A is available in one functional version, namely, N1.

10.10.2 Application
The SL4A is a line board. The SL4A can be used on the OptiX OSN equipment series to
transmit and receive STM-4 optical signals. The SL4A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SL4A converts the electrical signals sent from the cross-connect side into optical signals and
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transmits the optical signals.


Figure 10-36 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.10.3 Functions and Features


The SL4A transmits and receives 1xSTM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-47 provides the functions and features of the SL4A.
Figure 1.1 Functions and features of the SL4A
Function and
Feature

SL4A

Basic functions

Receives and transmits 1xSTM-4 optical signals, and processes


1xSTM-4 standard or concatenation services.

Specifications of
the optical
interface

Supports different types of standard optical interfaces, namely, the I-4,


S-4.1, L-4.1, L-4.2, and Ve-4.2. The characteristics of the optical
interfaces of the I-4, S-4.1, L-4.1, and L-4.2 types comply with ITU-T
G.957. The characteristics of the optical interface of the Ve-4.2 type
comply with the standards defined by Huawei.
Supports the CWDM and DWDM colored optical interfaces. The
optical interface uses the LC connector. The CWDM optical interface
supports the transmission distance of 80 km, and the DWDM optical
interface supports the transmission distance of 120 km.

Specifications of
the optical
module

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Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

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Feature

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SL4A

Supports the usage and monitoring of the SFP optical module,


which facilitates the maintenance and upgrading of the optical
module.

Supports the single-fiber bidirectional optical module, and the


single-fiber bidirectional optical module does not support
loopbacks at the optical interface by using fiber jumpers.

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, and VC-44c concatenation services.

Overhead
processing

Processes the section overheads of the STM-4 signals.

Supports the transparent transmission and termination of the path


overheads. Supports the setting and query of the J0, J1, J2, and C2
bytes.

Supports one channel of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Supports the fiber-shared MSP and SNCP and processes two sets of
K bytes. One SL4A supports a maximum of two MSP protection
rings.

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

Maintenance
features

10.10.4 Working Principle and Signal Flow


The SL4A consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, power module.
Figure 10-37 shows the functional block diagram of the SL4A.

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Figure 1.1 Functional block diagram of the SL4A


155 MHz

622 Mbit/s
622 Mbit/s

O/E
E/O

S
P
I

622
Mbit/s

CDR

Reference clock

155 MHz
PLL

622
Mbit/s

K1 and K2

K1 and K2 insertion/extraction

Cross-connect unit

Cross-connect unit

622 Mbit/s
High-speed bus

622 Mbit/s

O/E
E/O

S
P
I

....

....

622 Mbit/s

Cross-connect unit A

622
Mbit/s

CDR

622
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

622 Mbit/s

DCC
SDH overhead processing module

IIC

Logic and
control
module

LOS
Laser shutdown

+3.3 V

DC/DC
converter

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

The functional modules of the STM-4 units are described as follows:

1.1.1.1.428 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.429 CDR Module


This module restores the clock signal.

1.1.1.1.430 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

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In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
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(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.431 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.432 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.10.5 Front Panel


The front panel of the SL4A has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.433 Diagram of the Front Panel


Figure 10-38 shows the appearance of the front panel of the SL4A.
Figure 1.1 Front panel of the SL4A

SL4A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1

SL4A

1.1.1.1.434 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.435 Interfaces
The front panel of the SL4A has one optical interface. Table 10-48 describes the types and
usage of the optical interfaces of the SL4A.
Figure 1.1 Optical interfaces of the SL4A
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

The SL4A can use the swappable optical modules to facilitate maintenance.

10.10.6 Valid Slots


The slots valid for the SL4A vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SL4A are as follows:

When the cross-connect capacity is 200 Gbit/s, the SL4A can be installed in slots 18
and 1117.

10.10.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL4A indicates the type of optical interface.
Table 10-49 provides the relationship between the feature code of the SL4A and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SL4A and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SL4A10

10

S-4.1

SSN1SL4A11

11

L-4.1

SSN1SL4A12

12

L-4.2

SSN1SL4A13

13

Ve-4.2

SSN1SL4A14

14

I-4

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10.10.8 Parameter Settings


You can set the parameters for the SL4A by using the U2000.
You can set the following parameters for the SL4A by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.10.9 Technical Specifications of SL4A


The technical specifications of the SL4A include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.436 Parameters Specified for Optical Interfaces


Table 10-50 lists the parameters specified for the optical interfaces of the SL4A.
Figure 1.1 Parameters specified for the optical interfaces of the SL4A
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Application code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Single-mode
LC

Single-mode
LC

Singlemode LC

Singlemode LC

Singlemode LC

Operating
wavelength range
(nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to
1580

Launched optical
power range
(dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver
sensitivity (dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

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Parameter

Value

Maximum -20 dB
spectral width
(nm)

Minimum side
mode
suppression ratio
(dB)

30

30

30

Table 10-51 lists the parameters specified for the single-fiber bidirectional optical interfaces
of the SL4A.
Figure 1.2 Parameters specified for the single-fiber bidirectional optical interfaces of the SL4A
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Type of optical
interface

S-4.1

S-4.1

Transmission
distance (km)

10

10

Type of fiber

Single-mode LC

Single-mode LC

Operating transmit
wavelength (nm)

1490

1310

Operating receive
wavelength (nm)

1310

1490

Launched optical
power range (dBm)

-9 to -3

-9 to -3

Receiver sensitivity
(dBm)

-19.5

-28

Minimum overload
(dBm)

-3

-3

Minimum extinction
ratio (dB)

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

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Table 10-52 and Table 10-53 list the parameters specified for the colored optical interfaces of
the SL4A.
Figure 1.3 CWDM parameters specified for the colored optical interfaces of the SL4A
Parameter

Value
CWDM

Nominal bit rate

622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

80

Launched optical power range


(dBm)

0 to 5

Operating wavelength range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

1600

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode suppression


ratio (dB)

30

Figure 1.4 DWDM parameters specified for the colored optical interfaces of the SL4A
Parameter

Value
DWDM

Nominal bit rate

622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.10 to 196.00

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

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Parameter

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Value
DWDM

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

1.1.1.1.437 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.438 Mechanical Specifications


The mechanical specifications of the SL4A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.6

1.1.1.1.439 Power Consumption


The maximum power consumption of the SL4A at room temperature (25C) is 17 W.

10.11 SLD4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLD4 (2xSTM-4 optical interface board).

10.11.1 Version Description


The SLD4 is available in two functional versions, namely, N1 and N2. The difference
between the two versions is with regard to whether they support the TCM function and AU-3
services. The N1SLD4 is no longer manufactured.
Table 10-54 describes the versions of the SLD4.
Figure 1.1 Versions of the SLD4
Item

Description

Functional
versions

The SLD4 is available in two functional versions, namely, N1 and N2.

Differences

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Specifications of optical modules: single-fiber bidirectional optical

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Item

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Description
modules.

Substitution

Service processing: AU-3 service processing.

Maintenance features: loopbacks on VC-4 paths and TCM function.

The versions cannot be substituted with each other.

When you configure the MSP or SNCP, you cannot configure the N1SLD4 as the protection board if the
working board is the N2SLD4 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

10.11.2 Application
The SLD4 is a line board. The SLD4 can be used on the OptiX OSN equipment series to
transmit and receive STM-4 optical signals. The SLD4 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLD4 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-39 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.11.3 Functions and Features


The SLD4 transmits and receives 2xSTM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-55 provides the functions and features of the SLD4.

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Figure 1.2 Functions and features of the SLD4


Function and
Feature

SLD4

Basic functions

Receives and transmits 2xSTM-4 optical signals, and processes


2xSTM-4 standard or concatenation services.

Specifications of
the optical
interface

Supports different types of standard optical interfaces, namely, the


I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2.

The characteristics of the optical interfaces of the I-4, S-4.1, L-4.1,


and L-4.2 types comply with ITU-T G.957.

The characteristics of the optical interface of the Ve-4.2 type


comply with the standards defined by Huawei.

Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

Supports the usage and monitoring of the SFP optical module,


which facilitates the maintenance and upgrading of the optical
module.

The N1SLD4 supports the single-fiber bidirectional optical


module, and the single-fiber bidirectional optical module does not
support loopbacks at the optical interface by using fiber jumpers.

Supports the VC-12 services, VC-3 services, VC-4 services, and


VC-4-4c concatenation services.

The N2SLD4 supports the AU-3 services.

Processes the section overheads of the STM-4 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one or two channels of ECC communication.

Specifications of
the optical
module

Service
processing
Overhead
processing

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Supports the fiber-shared MSP and SNCP and processes four sets
of K bytes. A single optical interface supports two MSP protection
rings, and one SLD4 supports a maximum of four MSP protection
rings.

Supports inloops and outloops at optical interfaces.

The N1SLD4 supports inloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Maintenance
features

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SLD4

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

The N2SLD4 supports the TCM function.

Supports the press-to-collect function in fault data collection.

10.11.4 Working Principle and Signal Flow


The SLD4 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-40 shows the functional block diagram of the SLD4.
Figure 1.1 Functional block diagram of the SLD4
155 MHz

622 Mbit/s
622 Mbit/s

O/E
E/O

S
P
I

622
Mbit/s

CDR

Reference clock

155 MHz
PLL

622
Mbit/s

K1 and K2

K1 and K2 insertion/extraction

Cross-connect unit

Cross-connect unit

622 Mbit/s
High-speed bus

622 Mbit/s

O/E
E/O

S
P
I

....

....

622 Mbit/s

Cross-connect unit A

622
Mbit/s

CDR

622
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

622 Mbit/s

DCC
SDH overhead processing module

IIC

Logic and
control
module

LOS
Laser shutdown

+3.3 V

DC/DC
converter

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

The functional modules of the STM-4 units are described as follows:

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1.1.1.1.440 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.441 CDR Module


This module restores the clock signal.

1.1.1.1.442 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

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RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.
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1.1.1.1.443 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.444 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.11.5 Front Panel


The front panel of the SLD4 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.445 Diagram of the Front Panel


Figure 10-41 shows the appearance of the front panel of the SLD4.

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Figure 1.1 Front panel of the SLD4

SLD4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

SLD4

1.1.1.1.446 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.447 Interfaces
The front panel of the SLD4 has two optical interfaces. Table 10-56 describes the types and
usage of the optical interfaces of the SLD4.

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Figure 1.1 Optical interfaces of the SLD4


Interface

Type of Interface

Usage

IN1-IN2

LC

Receives optical signals.

OUT1-OUT2

LC

Transmits optical signals.

The SLD4 can use the swappable optical modules to facilitate maintenance.

10.11.6 Valid Slots


The slots valid for the SLD4 vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SLD4 are as follows:

When the cross-connect capacity is 200 Gbit/s, the SLD4 can be installed in slots 18
and 1117.

10.11.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLD4 indicates the type of optical interface.
Table 10-57 provides the relationship between the feature code of the SLD4 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLD4 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SLD410 and
SSN2SLD410

10

S-4.1

SSN1SLD411 and
SSN2SLD411

11

L-4.1

SSN1SLD412 and
SSN2SLD412

12

L-4.2

SSN1SLD413 and
SSN2SLD413

13

Ve-4.2

SSN1SLD414 and
SSN2SLD414

14

I-4

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10.11.8 Parameter Settings


You can set the parameters for the SLD4 by using the U2000.
You can set the following parameters for the SLD4 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.11.9 Technical Specifications


The technical specifications of the SLD4 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.448 Parameters Specified for Optical Interfaces


Table 10-58 lists the parameters specified for the optical interfaces of the SLD4.
Figure 1.1 Parameters specified for the optical interfaces of the SLD4
Parameter

Value

Nominal bit
rate

622080 kbit/s

Line code
pattern

NRZ

Application
code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver
sensitivity
(dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

Minimum

8.2

8.2

10

10

10.5

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Parameter

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Value

extinction ratio
(dB)
Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

30

Table 10-59 lists the parameters specified for the single-fiber bidirectional optical interfaces
of the N1SLD4.
Figure 1.2 Parameters specified for the single-fiber bidirectional optical interfaces of the N1SLD4
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Type of optical
interface

S-4.1

S-4.1

Transmission
distance (km)

10

10

Type of fiber

Single-mode LC

Single-mode LC

Operating transmit
wavelength (nm)

1490

1310

Operating receive
wavelength (nm)

1310

1490

Launched optical
power range (dBm)

-9 to -3

-9 to -3

Receiver sensitivity
(dBm)

-19.5

-28

Minimum overload
(dBm)

-3

-3

Minimum extinction
ratio (dB)

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

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1.1.1.1.449 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.450 Mechanical Specifications


The mechanical specifications of the N1SLD4 and N2SLD4 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1SLD4 (kg): 0.6

Weight of the N2SLD4 (kg): 1.0

1.1.1.1.451 Power Consumption


The maximum power consumption of the N1SLD4 at room temperature (25C) is 17 W.
The maximum power consumption of the N2SLD4 at room temperature (25C) is 15 W.

10.12 SLD4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLD4A (2xSTM-4 optical interface board).

10.12.1 Version Description


The SLD4A is available in one functional version, namely, N1.
Through the board version replacement function, the N1SLD4 can substitute for the
N1SLD4A.

10.12.2 Application
The SLD4A is a line board. The SLD4A can be used on the OptiX OSN equipment series to
transmit and receive STM-4 optical signals. The SLD4A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLD4A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-42 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.

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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.12.3 Functions and Features


The SLD4A transmits and receives STM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-60 provides the functions and features of the SLD4A.
Figure 1.1 Functions and features of the SLD4A
Function and
Feature

SLD4A

Basic functions

Receives and transmits 2xSTM-4 optical signals, and processes


2xSTM-4 standard or concatenation services.

Specifications of
the optical
interface

Supports different types of standard optical interfaces, namely, the


I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2.

The characteristics of the optical interfaces of the I-4, S-4.1, L-4.1,


and L-4.2 types comply with ITU-T G.957.

The characteristics of the optical interface of the Ve-4.2 type


comply with the standards defined by Huawei.

Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

Supports the usage and monitoring of the SFP optical module,


which facilitates the maintenance and upgrading of the optical
module.

Specifications of
the optical
module

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, and VC4-4c concatenation services.

Overhead

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Processes the section overheads of the STM-4 signals.

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Function and
Feature

SLD4A

processing

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one or two channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Supports the fiber-shared MSP and SNCP and processes four sets
of K bytes. A single optical interface supports two MSP protection
rings, and one SLD4A supports a maximum of four MSP
protection rings.

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

Maintenance
features

10.12.4 Working Principle and Signal Flow


The SLD4A consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-43 shows the functional block diagram of the SLD4A.

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Figure 1.1 Functional block diagram of the SLD4A


155 MHz

622 Mbit/s
622 Mbit/s

O/E
E/O

S
P
I

622
Mbit/s

CDR

Reference clock

155 MHz
PLL

622
Mbit/s

K1 and K2

K1 and K2 insertion/extraction

Cross-connect unit

Cross-connect unit

622 Mbit/s
High-speed bus

622 Mbit/s

O/E
E/O

S
P
I

....

....

622 Mbit/s

Cross-connect unit A

622
Mbit/s

CDR

622
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

622 Mbit/s

DCC
SDH overhead processing module

IIC

Logic and
control
module

LOS
Laser shutdown

+3.3 V

DC/DC
converter

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

The functional modules of the STM-4 units are described as follows:

1.1.1.1.452 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.453 CDR Module


This module restores the clock signal.

1.1.1.1.454 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

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In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
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(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.455 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.456 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.12.5 Front Panel


The front panel of the SLD4A has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.457 Diagram of the Front Panel


Figure 10-44 shows the appearance of the front panel of the SLD4A.
Figure 1.1 Front panel of the SLD4A

SLD4A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

SLD4A

1.1.1.1.458 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.459 Interfaces
The front panel of the SLD4A has two optical interfaces. Table 10-61 describes the types and
usage of the optical interfaces of the SLD4A.
Figure 1.1 Optical interfaces of the SLD4A
Interface

Type of Interface

Usage

IN1IN2

LC

Receives optical signals.

OUT1OUT2

LC

Transmits optical signals.

The SLD4A can use the swappable optical modules to facilitate maintenance.

10.12.6 Valid Slots


The slots valid for the SLD4A vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SLD4A are as follows:

When the cross-connect capacity is 200 Gbit/s, the SLD4A can be installed in slots 18
and 1117.

10.12.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLD4A indicates the type of optical interface.
Table 10-62 provides the relationship between the feature code of the SLD4A and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLD4A and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SLD4A10

10

S-4.1

SSN1SLD4A11

11

L-4.1

SSN1SLD4A12

12

L-4.2

SSN1SLD4A13

13

Ve-4.2

SSN1SLD4A14

14

I-4

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10.12.8 Parameter Settings


You can set the parameters for the SLD4A by using the U2000.
You can set the following parameters for the SLD4A by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.12.9 Technical Specifications


The technical specifications of the SLD4A include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.460 Parameters Specified for Optical Interfaces


Table 10-63 lists the parameters specified for the optical interfaces of the SLD4A.
Figure 1.1 Parameters specified for the optical interfaces of the SLD4A
Parameter

Value

Nominal bit
rate

622080 kbit/s

Line code
pattern

NRZ

Application
code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver
sensitivity
(dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

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Parameter

Value

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

30

1.1.1.1.461 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.462 Mechanical Specifications


The mechanical specifications of the SLD4A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.6

1.1.1.1.463 Power Consumption


The maximum power consumption of the SLD4A at room temperature (25C) is 17 W.

10.13 SLQ4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ4 (4xSTM-4 optical interface board).

10.13.1 Version Description


The SLQ4 is available in two functional versions, namely, N1 and N2. The difference
between the two versions is with regard to whether they support the TCM function and AU-3
services. The N1SLQ4 is no longer manufactured.
Table 10-64 describes the versions of the SLQ4.
Figure 1.1 Versions of the SLQ4
Item

Description

Functional
versions

The SLQ4 is available in two functional versions, namely, N1 and N2.

Differences

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Specifications of optical modules: single-fiber bidirectional optical


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Item

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Description
modules.

Substitution

Service processing: AU-3 service processing.

Maintenance features: loopbacks on VC-4 paths and TCM function.

Through the board version replacement function, the N3SLQ41 can


substitute for the N1SLQ4 and N2SLQ4 at the same line rate.

When you configure the MSP or SNCP, you cannot configure the N1SLQ4 as the protection board if the
working board is the N2SLQ4 on which the TCM function is enabled or AU-3 services are configured.
Otherwise, the services are interrupted when a switching operation is performed.

10.13.2 Application
The SLQ4 is a line board. The SLQ4 can be used on the OptiX OSN equipment series to
transmit and receive STM-4 optical signals. The SLQ4 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLQ4 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-45 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.13.3 Functions and Features


The SLQ4 transmits and receives STM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-65 provides the functions and features of the SLQ4.

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Figure 1.2 Functions and features of the SLQ4


Function and
Feature

SLQ4

Basic functions

Transmits and receives 4xSTM-4 optical signals.

Specifications
of the optical
interface

Supports different types of standard optical interfaces, namely, the I4, S-4.1, L-4.1, L-4.2, and Ve-4.2.

The characteristics of the optical interfaces of the I-4, S-4.1, L-4.1,


and L-4.2 types comply with ITU-T G.957.

The characteristics of the optical interface of the Ve-4.2 type comply


with the standards defined by Huawei.

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Supports the usage and monitoring of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

The N1SLQ4 supports the single-fiber bidirectional optical module,


and the single-fiber bidirectional optical module does not support
loopbacks at the optical interface by using fiber jumpers.

Supports the VC-12 services, VC-3 services, VC-4 services, and VC4-4c concatenation services.

The N2SLQ4 supports the AU-3 services.

Processes the section overheads of the STM-4 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one to four channels of ECC communication.

Specifications
of the optical
module

Service
processing
Overhead
processing

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Supports the fiber-shared MSP and SNCP and processes eight sets of
K bytes. A single optical interface supports two MSP protection
rings, and one SLQ4 supports a maximum of eight MSP protection
rings.

Supports inloops and outloops at optical interfaces.

The N1SLQ4 supports inloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting

Maintenance
features

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SLQ4
services.

The N2SLQ4 supports the TCM function.

Supports the press-to-collect function in fault data collection.

10.13.4 Working Principle and Signal Flow


The SLQ4 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-46 shows the functional block diagram of the SLQ4.
Figure 1.1 Functional block diagram of the SLQ4
155 MHz

622 Mbit/s
622 Mbit/s

O/E
E/O

S
P
I

622
Mbit/s

CDR

Reference clock

155 MHz
PLL

622
Mbit/s

K1 and K2

K1 and K2 insertion/extraction

Cross-connect unit

Cross-connect unit

622 Mbit/s
High-speed bus

622 Mbit/s

O/E
E/O

S
P
I

....

....

622 Mbit/s

Cross-connect unit A

622
Mbit/s

CDR

622
Mbit/s

RST

MST

MSA

HPT

High-speed
bus

622 Mbit/s

DCC
SDH overhead processing module

IIC

Logic and
control
module

LOS
Laser shutdown

+3.3 V

DC/DC
converter

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B
SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

The functional modules of the STM-4 units are described as follows:

1.1.1.1.464 O/E Converting Module

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Converts the received optical signals into electrical signals, in the receive direction.
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Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.465 CDR Module


This module restores the clock signal.

1.1.1.1.466 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

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RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

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1.1.1.1.467 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.468 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.13.5 Front Panel


The front panel of the SLQ4 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.469 Diagram of the Front Panel


Figure 10-47 shows the appearance of the front panel of the SLQ4.

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Figure 1.1 Front panel of the SLQ4

SLQ4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ4

1.1.1.1.470 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.471 Interfaces
The front panel of the SLQ4 has four optical interfaces. Table 10-66 describes the types and
usage of the optical interfaces of the SLQ4.

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Figure 1.1 Optical interfaces of the SLQ4


Interface

Type of Interface

Usage

IN1-IN4

LC

Receives optical signals.

OUT1-OUT4

LC

Transmits optical signals.

The SLQ4 can use the swappable optical modules to facilitate maintenance.

10.13.6 Valid Slots


The SLQ4 can be installed in slots 18 and 1116 in the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

When the cross-connect capacity is 200 Gbit/s, the SLQ4 can be installed in slots 18
and 1116. When the SLQ4 is installed in slots 14, 15, and 16, two optical interfaces
can be configured. When the SLQ4 is installed in slots 58 and 1114, four optical
interfaces can be configured.

10.13.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ4 indicates the type of optical interface.
Table 10-67 provides the relationship between the feature code of the SLQ4 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLQ4 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SLQ410 and
SSN2SLQ410

10

S-4.1

SSN1SLQ411 and
SSN2SLQ411

11

L-4.1

SSN1SLQ412 and
SSN2SLQ412

12

L-4.2

SSN1SLQ413 and
SSN2SLQ413

13

Ve-4.2

SSN1SLQ414 and
SSN2SLQ414

14

I-4

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10.13.8 Parameter Settings


You can set the parameters for the SLQ4 by using the U2000.
You can set the following parameters for the SLQ4 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.13.9 Technical Specifications


The technical specifications of the SLQ4 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.472 Parameters Specified for Optical Interfaces


Table 10-68 lists the parameters specified for the optical interfaces of the SLQ4.
Figure 1.1 Parameters specified for the optical interfaces of the SLQ4
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code
pattern

NRZ

Application
code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver
sensitivity
(dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

Minimum
extinction ratio

8.2

8.2

10

10

10.5

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Parameter

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Value

(dB)
Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

30

Table 10-69 lists the parameters specified for the single-fiber bidirectional optical interfaces
of the N1SLQ4.
Figure 1.2 Parameters specified for the single-fiber bidirectional optical interfaces of the N1SLQ4
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Type of optical
interface

S-4.1

S-4.1

Transmission
distance (km)

10

10

Type of fiber

Single-mode LC

Single-mode LC

Operating transmit
wavelength (nm)

1490

1310

Operating receive
wavelength (nm)

1310

1490

Launched optical
power range (dBm)

-9 to -3

-9 to -3

Receiver sensitivity
(dBm)

-19.5

-28

Minimum overload
(dBm)

-3

-3

Minimum extinction
ratio (dB)

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

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1.1.1.1.473 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.474 Mechanical Specifications


The mechanical specifications of the SLQ4 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.475 Power Consumption


The maximum power consumption of the N1SLQ4 at room temperature (25C) is 17 W.
The maximum power consumption of the N2SLQ4 at room temperature (25C) is 16 W.

10.14 SLQ4A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SLQ4A (4xSTM-4 optical interface board).

10.14.1 Version Description


The SLQ4A is available in one functional version, namely, N1.
Through the board version replacement function, the N1SLQ4 can substitute for the
N1SLQ4A.

10.14.2 Application
The SLQ4A is a line board. The SLQ4A can be used on the OptiX OSN equipment series to
transmit and receive STM-4 optical signals. The SLQ4A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLQ4A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-48 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.

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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.14.3 Functions and Features


The SLQ4A transmits and receives STM-4 optical signals, performs O/E conversion for the
STM-4 optical signals, extracts and inserts overhead bytes, and generates alarm signals on the
line.
Table 10-70 provides the functions and features of the SLQ4A.
Figure 1.1 Functions and features of the SLQ4A
Function and
Feature

SLQ4A

Basic functions

Transmits and receives 4xSTM-4 optical signals.

Specifications
of the optical
interface

Supports different types of standard optical interfaces, namely, the I4, S-4.1, L-4.1, L-4.2, and Ve-4.2.

The characteristics of the optical interfaces of the I-4, S-4.1, L-4.1,


and L-4.2 types comply with ITU-T G.957.

The characteristics of the optical interface of the Ve-4.2 type comply


with the standards defined by Huawei.

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Supports the usage and monitoring of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Specifications
of the optical
module

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, and VC-44c concatenation services.

Overhead
processing

Processes the section overheads of the STM-4 signals.

Supports the transparent transmission and termination of the path

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SLQ4A
overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one to four channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Supports the fiber-shared MSP and SNCP and processes eight sets of
K bytes. A single optical interface supports two MSP protection
rings, and one SLQ4A supports a maximum of eight MSP protection
rings.

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

Maintenance
features

10.14.4 Working Principle and Signal Flow


The SLQ4A consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
Figure 10-49 shows the functional block diagram of the SLQ4A.

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Figure 1.1 Functional block diagram of the SLQ4A


155 MHz

622 Mbit/s
622 Mbit/s

O/E
E/O

S
P
I

622
Mbit/s

622 Mbit/s

E/O

S
P
I

K1 and K2

K1 and K2 insertion/extraction

High-speed
bus

....

O/E

622
Mbit/s

622 Mbit/s

....

622 Mbit/s

CDR

Reference clock

155 MHz
PLL

622
Mbit/s

RST

622
CDR Mbit/s

MST

MSA

HPT

High-speed
bus

622 Mbit/s

Cross-connect
unit

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B

DCC

SCC unit

SDH overhead processing module

IIC
LOS
Laser shutdown

Logic and
control
module
+3.3
V

DC/DC
converter

DC/DC
converter

Frame header
Communication

Fuse
Fuse

Cross-connect
unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V
+3.3 V

+3.3 V backup
power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

CDR: clock and data


recovery

The functional modules of the STM-4 units are described as follows:

1.1.1.1.476 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.477 CDR Module


This module restores the clock signal.

1.1.1.1.478 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

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In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
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(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.479 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.480 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.14.5 Front Panel


The front panel of the SLQ4A has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.481 Diagram of the Front Panel


Figure 10-50 shows the appearance of the front panel of the SLQ4A.
Figure 1.1 Front panel of the SLQ4A

SLQ4A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ4A

1.1.1.1.482 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.483 Interfaces
The front panel of the SLQ4A has four optical interfaces. Table 10-71 describes the types and
usage of the optical interfaces of the SLQ4A.
Figure 1.1 Optical interfaces of the SLQ4A
Interface

Type of Interface

Usage

IN1IN4

LC

Receives optical signals.

OUT1OUT4

LC

Transmits optical signals.

The SLQ4A can use the swappable optical modules to facilitate maintenance.

10.14.6 Valid Slots


The SLQ4A can be installed in slots 18 and 1116 in the subrack.

When the cross-connect capacity is 200 Gbit/s, the SLQ4A can be installed in slots 18
and 1116. When the SLQ4A is installed in slots 14, 15, and 16, two optical interfaces
can be configured. When the SLQ4A is installed in slots 58 and 1114, four optical
interfaces can be configured.

10.14.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ4A indicates the type of optical interface.
Table 10-72 provides the relationship between the feature code of the SLQ4A and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLQ4A and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SLQ4A10

10

S-4.1

SSN1SLQ4A11

11

L-4.1

SSN1SLQ4A12

12

L-4.2

SSN1SLQ4A13

13

Ve-4.2

SSN1SLQ4A14

14

I-4

10.14.8 Parameter Settings


You can set the parameters for the SLQ4A by using the U2000.

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You can set the following parameters for the SLQ4A by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.14.9 Technical Specifications


The technical specifications of the SLQ4A include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.484 Parameters Specified for Optical Interfaces


Table 10-73 lists the parameters specified for the optical interfaces of the SLQ4A.
Figure 1.1 Parameters specified for the optical interfaces of the SLQ4A
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code
pattern

NRZ

Application
code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver
sensitivity
(dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20
dB spectral

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Parameter

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Value

width (nm)
Minimum side
mode
suppression
ratio (dB)

30

30

30

1.1.1.1.485 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.486 Mechanical Specifications


The mechanical specifications of the SLQ4A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.487 Power Consumption


The maximum power consumption of the SLQ4A at room temperature (25C) is 17 W.

10.15 SL16
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SL16 (1xSTM-16 optical interface board).

10.15.1 Version Description


The SL16 is available in three functional versions, namely, N1, N2, and N3. The difference
between the three versions is with regard to whether they support the TCM function and AU-3
services. The N1SL16 and N2SL16 are discontinued.
Table 10-74 describes the versions of the SL16.
Figure 1.1 Versions of the SL16
Item

Description

Functional
versions

The SL16 is available in three functional versions, namely, N1, N2, and N3.

Differences

Specifications of optical interfaces: DWDM colored optical interfaces.

Service processing: AU-3 service processing.

REG specifications: REG function.

Maintenance features: loopbacks on VC-4 paths and TCM function.

Substitutio
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The N1SL16 and N2SL16 cannot be substituted with each other.


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Item

Description

The N3SL16 supports the board version replacement function.

The N3SL16 can substitute for the N1SL16.

When the AU-3 services are not required, the N3SL16 can substitute for
the N2SL16.

After the N3SL16 substitutes for the N1SL16 or N2SL16, the configuration
and service status of the N3SL16 are the same as the configuration and
service status of the N1SL16 or N2SL16.

In the case of the board of different versions, adhere to the following principles when configuring the
MSP or SNCP:

You cannot configure the N1SL16 as the protection board if the working board is the N2SL16 or
N3SL16 on which the TCM function is enabled. Otherwise, the services are interrupted when a
switching operation is performed.

You cannot configure the N1SL16 or N3SL16 as the protection board if the working board is the
N2SL16 on which the AU-3 services are configured. Otherwise, the services are interrupted when a
switching operation is performed.

10.15.2 Application
The SL16 is a line board. The SL16 can be used on the OptiX OSN equipment series to
transmit and receive STM-16 optical signals. The SL16 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SL16 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-51 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

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10.15.3 Functions and Features


The SL16 receives and transmits 1xSTM-16 optical signals and processes overhead bytes.
Table 10-75 provides the functions and features of the SL16.
Figure 1.2 Functions and features of the SL16
Function and
Feature

SL16

Basic functions

Transmits and receives 1xSTM-16 optical signals.

Specifications
of the optical
interface

Supports different types of standard optical interfaces, namely, the L16.2, L-16.2Je, V-16.2Je (with the booster amplifier (BA)), and U16.2Je (with the BA and pre-amplifier (PA)). The characteristics of
the optical interface of the L-16.2 type comply with ITU-T G.957
and ITU-T G.692. The characteristics of the optical interfaces of the
L-16.2Je, V-16.2Je (with the BA), and U-16.2Je (with the BA and
PA) types comply with the standards defined by Huawei.

Supports the output of the standard wavelengths that comply with


ITU-T G.692. The U-16.2Je optical interface can be directly
connected to the dense wavelength division multiplexing (DWDM)
equipment.

The N3SL16 supports DWDM colored optical interfaces, which use


LC connectors and support the transmission distances of 170 km and
640 km.

Specifications
of the optical
module

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, and VC-416c concatenation services.

The N2SL16 supports the AU-3 services.

Processes the section overheads of the STM-16 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one channel of ECC communication.

Overhead
processing

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Specifications
of the REG

The N2SL16/N3SL16 board supports the setting and query of the REG
working mode.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCMP, and SNCTP.

Supports the fiber-shared MSP and SNCP and processes two sets of
K bytes. One SL16 supports a maximum of two MSP protection

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Function and
Feature

10 SDH Boards

SL16
rings.

Maintenance
features

Supports inloops and outloops at optical interfaces.

The N1SL16 supports inloops on VC-4 paths. The N3SL16 board


supports inloops and outloops on paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

The N2SL16 and N3SL16 support the TCM function.

Supports the upgrade of the board software without affecting


services.

The N2SL16/N3SL16 board supports the TCM function.

The N3SL16 board supports the PRBS function in the line direction
and Cause by Cross function.

Supports the press-to-collect function in fault data collection.

10.15.4 Working Principle and Signal Flow


The SL16 consists of the O/E converting module, MUX/DEMUX module, SDH overhead
processing module, logic and control module, power module.
Figure 10-52 shows the functional block diagram of the SL16.
Figure 1.1 Functional block diagram of the SL16
155 MHz

2.488
Gbit/s

O/E

SPI 2.488 DEMUX 16x155


E/O
Gbit/s
Mbit/s
. .
. .

2.488
Gbit/s

O/E
E/O

SPI

O/E
converting
module

2.488
Gbit/s

MUX

16x155
Mbit/s

155 MHz
PLL
K1 and K2
insertion/extraction

IIC
LOS
Laser shutdown

High-speed
bus
RST MST MSA HPT

High-speed
bus
DCC

Logic and
control module
+3.3 V
Power
module

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K1 and K2

SDH overhead
processing module

MUX/
DEMUX

PLL: phase-locked loop

Backplane
Reference clock
Cross-connect
unit

Power
module

Frame header
Communication
Fuse

Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

SPI: SDH physical interface

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Cross-connect
unit

+3.3 V backup power

SDH: synchronous digital


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hierarchy
RST: regenerator section
termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

1.1.1.1.488 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.489 MUX/DEMUX Module

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

1.1.1.1.490 SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

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RST sub-module

In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the MSOH. That is, the
MST sub-module generates the MS_AIS alarm and detects the MS_RDI alarm after
detecting the K2 byte, and detects the MS_REI alarm and generates the B2_EXC
alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the AUG, divides an
AUG into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs
pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
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In the receive direction, the HPT sub-module terminates the POH. That is, the HPT
sub-module detects the HP_REI alarm after checking the B3 byte, generates the
HP_TIM alarm and the HP_SLM alarm and detects the HP_RDI alarm after detecting
the J1 and C2 bytes, and generates the HP_UNEQ alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.491 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.492 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.15.5 Front Panel


The front panel of the SL16 has indicators, interfaces, a bar code, a laser safety class label,
and an APD alarm label.

1.1.1.1.493 Diagram of the Front Panel


Figure 10-53 shows the appearance of the front panel of the SL16.

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Figure 1.1 Front panel of the SL16

SL16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

OUT

IN

SL16

1.1.1.1.494 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.495 Interfaces
The front panel of the SL16 has one optical interface. Table 10-76 describes the types and
usage of the optical interfaces of the SL16.

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Figure 1.1 Optical interfaces of the SL16


Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.15.6 Valid Slots


The slots valid for the SL16 vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SL16 are as follows:

When the cross-connect capacity is 200 Gbit/s, the SL16 can be installed in slots 58 and
1114.

10.15.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL16 indicates the type of optical interface.
Table 10-77 describes the relationship between the feature code of the SL16 and the type of
optical interface
Figure 1.2 Relationship between the feature code of the SL16 and the type of optical interface
Board

Feature Code

Type of Optical
Interface

SSN1SL1600, SSN3SL1600

00

Fixed-wavelength
optical interface

SSN1SL1601, SSN2SL1601, and SSN3SL1601

01

L-16.2

SSN1SL1602, SSN2SL1602, and SSN3SL1602

02

L-16.2Je

SSN1SL1603, SSN2SL1603, and SSN3SL1603

03

V-16.2Je

SSN1SL1604, SSN2SL1604, and SSN3SL1604

04

U-16.2

10.15.8 Parameter Settings


You can set the parameters for the SL16 by using the U2000.
You can set the following parameters for the SL16 by using the U2000:

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J0
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J1

J2

C2

10 SDH Boards

For the description of each parameter, see 26 Parameter Settings.

10.15.9 Technical Specifications of SL16


The technical specifications of the SL16 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.496 Parameters Specified for Optical Interfaces


Table 10-78 lists the parameters specified for the optical interfaces of the SL16.
Figure 1.1 Parameters specified for the optical interfaces of the SL16
Parameter

Value

Nominal bit
rate

2488320 kbit/s

Line code
pattern

NRZ

Application
code

L-16.2

L-16.2Je

V-16.2Je (BA)

U-16.2Je (BA+PA)

Transmissio
n distance
(km)

50 to 80

80 to 100

100 to 140

140 to 170

Type of fiber

Singlemode LC

Singlemode LC

Single-mode LC

Single-mode LC

Operating
wavelength
range (nm)

1500 to
1580

1530 to
1560

1530 to 1565

1550.12

Launched
optical
power range
(dBm)

-2 to +3

5 to 7

-2 to +3
(without
the BA)

-2 to +3
(without
the BA
or PA)

15 to 18
(with the
BA)

Receiver
sensitivity
(dBm)

-28

-28

-28

-28
(without
the PA
or BA)

-32 (with
the PA)

Minimum
overload
(dBm)

-9

-9

-9

-9
(without
the PA
or BA)

-10 (with
the PA)

Dispersion
tolerance
(ps/nm)

1600

2000

2800

3400

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BA)

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Parameter

Value

Minimum
extinction
ratio (dB)

8.2

8.2

8.2

8.2

Maximum
-20 dB
spectral
width (nm)

Minimum
side mode
suppression
ratio (dB)

30

30

30

30

Note: The optical interface of the Le-16.2 type is the same as the optical interface of the L16.2Je type.
The launched optical power of the optical interface of the V-16.2Je type is measured when
the BA is added. The launched optical power of the optical interface of the U-16.2Je type is
measured when the BA and PA are added. When no amplifier is added, the launched optical
power of the optical interfaces of the V-16.2Je and U-16.2Je types ranges from -2 dBm to 3
dBm.

Table 10-79 lists the parameters specified for the colored optical interfaces of the N3SL16.
Figure 1.2 Parameters specified for the colored optical interfaces of the N3SL16
Parameter

Value
DWDM

Nominal bit rate

2488320 kbit/s

Type of fiber

Single-mode LC

Dispersion-limited distance (km)

170

640

Launched optical power range


(dBm)

-2 to +3

-5 to -1

Receiver sensitivity (dBm)

-28

-28

Minimum overload (dBm)

-9

-9

Maximum allowed dispersion


(ps/nm)

3400

10880

Minimum extinction ratio (dB)

8.2

10

Central frequency deviation (GHz)

20

20

Minimum side mode suppression


ratio (dB)

30

35

Maximum -20 dB spectral width


(nm)

0.4

0.2

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Value
DWDM

Maximum optical path penalty (dB)

Optical signal-to-noise ratio (dB)

20

20

1.1.1.1.497 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.498 Mechanical Specifications


The mechanical specifications of the SL16 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.1

1.1.1.1.499 Power Consumption


The maximum power consumption of the N1SL16 and N2SL16 at room temperature (25C)
is 19 W.
The maximum power consumption of the N3SL16 at room temperature (25C) is 22 W.

10.16 SL16A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL16A (1xSTM-16 optical interface board). This topic also
describes how to configure and commission the SL16A.

10.16.1 Version Description


The SL16A is available in the following functional versions: N3, N2, and N1. The N1SL16A
and N2SL16A are discontinued.
Table 10-80 describes the versions of the SL16A.
Figure 1.1 Versions of the SL16
Item

Description

Functional versions

The SL16A is available in the following functional versions: N3,


N2, and N1. The N1SL16A and N2SL16A are discontinued.

Differences

Specifications of optical interfaces: DWDM colored optical


interfaces.

Service processing: AU-3 service processing.

REG specifications: REG function.

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Description

Substitution

Maintenance features: loopbacks on VC-4 paths and TCM


function.

The N1SL16A and N2SL16A cannot be substituted with each


other.

The N3SL16A supports the board version replacement function.

The N3SL16A can substitute for the


N1SL16A.

When the AU-3 services are not


configured, the N3SL16A can
substitute for the N2SL16A.

After the N3SL16A substitutes for the N1SL16A or N2SL16A,


the configuration and service status of the N3SL16A are the
same as the configuration and service status of the N1SL16A or
N2SL16A.

In the case of the board of different versions, adhere to the following principles when configuring the
MSP or SNCP:

You cannot configure the N1SL16A as the protection board if the working board is the N2SL16A or
N3SL16A on which only the TCM function is enabled. Otherwise, the services are interrupted when
a switching operation is performed.

You cannot configure the N3SL16A or N1SL16A as the protection board if the working board is the
N2SL16A on which only the AU-3 services are configured. Otherwise, the services are interrupted
when a switching operation is performed.

10.16.2 Application
The SL16A is a line board. The SL16A can be used on the OptiX OSN equipment series to
transmit and receive STM-16 optical signals. The SL16A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SL16A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-54 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.

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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.16.3 Functions and Features


The SL16A receives and transmits 1xSTM-16 optical signals, processes overhead bytes, and
performs the MSP.
Table 10-81 describes the functions and features of the SL16A.
Figure 1.2 Functions and features of the SL16A
Function and
Feature

SL16A

Basic functions

Transmits and receives 1xSTM-16 optical signals.

Specifications of the
optical interface

Supports different types of standard optical interfaces, namely, the


I-16, S-16.1, L-16.1, and L-16.2. The characteristics of the optical
interfaces comply with ITU-T G.957 and ITU-T G.692.
The N3SL16A supports the CWDM and DWDM colored optical
interfaces. The optical interface uses the LC connector. The
CWDM optical interface supports the transmission distance of 80
km, and the DWDM optical interface supports the transmission
distance of 120 km.

Specifications of the
optical module

Service processing

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Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

Supports the usage and monitoring of the SFP optical module,


which facilitates the maintenance and upgrading of the optical
module.

Supports the VC-12 services, VC-3 services, VC-4 services,


VC-4-4c concatenation services, VC-4-8c concatenation
services, and VC-4-16c concatenation services.

The N2SL16A supports the AU-3 services.

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Function and
Feature

SL16A

Overhead processing

Processes the section overheads of the STM-16 signals.

Supports the transparent transmission and termination of the


path overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one channel of ECC communication.

Alarms and
performance events

Reports various alarms and performance events, which facilitates


the management and maintenance of the equipment.

Specifications of the
REG

The N2SL16A/N3SL16A board supports the setting and query of


the REG working mode.

Protection schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

Supports the SNCTP.

Supports the fiber-shared virtual trail protection.

Supports the fiber-shared MSP and processes two sets of K


bytes. One SL16A supports a maximum of two MSP rings.

Supports inloops and outloops at optical interfaces.

The N1SL16A supports inloops on VC-4 paths. The N3SL16A


board supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the


board.

Supports the in-service loading of the FPGA.

The N2SL16A/N3SL16A board supports the TCM function.

Supports the upgrade of the board software without affecting


services.

The N3SL16A board supports the PRBS function in the line


direction and Cause by Cross function.

Supports the press-to-collect function in fault data collection.

Maintenance features

10.16.4 Working Principle and Signal Flow


The N1SL16A/N2SL16A/N3SL16A consists of the O/E converting module, MUX/DEMUX
module, SDH overhead processing module, logic and control module, and power module.
Figure 10-55 shows the functional block diagram of the N1SL16A/N2SL16A/N3SL16A.

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Figure 1.1 Functional block diagram of the N1SL16A/N2SL16A/N3SL16A


155 MHz

2.488
Gbit/s

2.488
Gbit/s

O/E

16x155
DEMUX
Mbit/s

SPI
2.488
Gbit/s

E/O

2.488
Gbit/s

O/E
converting
module

MUX

16x155
Mbit/s

155 MHz
PLL

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX

Frame header
Logic and
control module Communication

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

1.1.1.1.500 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.501 MUX/DEMUX Module

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

1.1.1.1.502 SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

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In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
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except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the MSOH. That is, the
MST sub-module generates the MS_AIS alarm and detects the MS_RDI alarm after
detecting the K2 byte, and detects the MS_REI alarm and generates the B2_EXC
alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the AUG, divides an
AUG into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs
pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the POH. That is, the HPT
sub-module detects the HP_REI alarm after checking the B3 byte, generates the
HP_TIM alarm and the HP_SLM alarm and detects the HP_RDI alarm after detecting
the J1 and C2 bytes, and generates the HP_UNEQ alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.503 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.504 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.16.5 Front Panel


The front panel of the SL16A has indicators, interfaces, a bar code, a laser safety class label,
and an APD alarm label.

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1.1.1.1.505 Diagram of the Front Panel


Figure 10-56 shows the appearance of the front panel of the SL16A.
Figure 1.1 Front panel of the SL16A

SL16A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

OUT
IN

SL16A

1.1.1.1.506 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

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1.1.1.1.507 Interfaces
The front panel of the SL16A has one optical interface. Table 10-82 describes the types and
usage of the optical interfaces of the SL16A.
Figure 1.1 Optical interfaces of the SL16A
Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.16.6 Jumpers and DIP Switches


The SL16A does not have any jumpers or DIP switches that are used for board settings.

10.16.7 Valid Slots


The SL16A must be installed in a valid slot in the subrack. Otherwise, the SL16A fails to
work normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SL16A vary with the cross-connect capacity of the subrack. The slots
valid for the SL16A are as follows:

When the cross-connect capacity is 200 Gbit/s, the SL16A can be installed in slots 58
and 1114.

10.16.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL16A indicates the type of optical interface.
Table 10-83 describes the relationship between the feature code of the SL16A and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SL16A and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SL16A01,
SSN2SL16A01,
SSN3SL16A01

01

I-16

SSN1SL16A02,
SSN2SL16A02,
SSN3SL16A02

02

S-16.1

SSN1SL16A03,

03

L-16.1

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Feature Code

Type of Optical Interface

SSN1SL16A04,
SSN2SL16A04,
SSN3SL16A04

04

L-16.2

SSN3SL16A06

06

I-16

SSN3SL16A07

07

S-16.1

SSN3SL16A08

08

L-16.1

SSN3SL16A09

09

L-16.2

SSN2SL16A03,
SSN3SL16A03

10.16.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.508 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.509 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

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Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.510 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.511 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.16.10 Parameter Settings


You can set the parameters for the SL16A by using the U2000.
You can set the following parameters for the SL16A by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.16.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.
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1.1.1.1.512 Troubleshooting
Table 10-84 lists the faults that occur on the SL16A frequently and the troubleshooting
methods.
The SL16A uses the SFP optical module. When the SL16A operates and an abnormal alarm occurs on
the optical interface, check whether the optical module is properly installed. To check whether the
optical module is properly installed, you can re-seat the optical module.

Figure 1.1 Methods used to troubleshoot the faults that occur on the SL16A frequently
Fault Symptom

Common Fault
Cause

Service interruption

The optical fiber


or connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become

Bit error

Pointer justification

Protection switching
failure

NEs being
unreachable to the

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

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Fault Symptom

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Common Fault
Cause

Troubleshooting Method

unreachable to
the .

Equipment
interconnection fault

An NE becomes
unreachable to
the frequently.

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

1.1.1.1.513 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SL16A, see Replacing an SDH Board.

10.16.12 List of Alarms


This topic lists the alarms that may occur when the board operates.

10.16.12.1 Alarms of N1SL16A


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_FAIL

C2_PDI

C2_VCAIS

FSELECT_STG

COMMUN_FAIL

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LASER_MOD_ERR

IN_PWR_ABN

J0_MM

LP_RDI_VC12

LASER_SHUT

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LSR_WILL_DIE

LSR_COOL_ALM

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LSR_NO_FITED

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

R_LOF

POWER_ABNORMAL

OUT_PWR_ABN

SLAVE_WORKING

R_LOS

R_LOC

TEM_HA

SPARE_PATH_ALM

R_OOF

TF

TEM_LA

T_LOSEX

TU_AIS_VC3

TR_LOC

TEST_STATUS

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

TU_LOP_VC3

MOD_TYPE_MISMATCH

PS

PATCH_ERR

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.16.12.2 Alarms of N2SL16A


ALM_ALS

ALM_AU3AIS

ALM_AU3B3OVER

ALM_AU3B3SD

ALM_AU3LOP

ALM_AU3RDI

ALM_AU3REI

ALM_AU3SLM

ALM_AU3TIM

ALM_AU3UNEQ

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_FAIL

C2_PDI

C2_VCAIS

FSELECT_STG

COMMUN_FAIL

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LASER_MOD_ERR

IN_PWR_ABN

J0_MM

LP_RDI_VC12

LASER_SHUT

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

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LP_UNEQ_VC12

LSR_WILL_DIE

LSR_COOL_ALM

LSR_NO_FITED

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

R_LOF

POWER_ABNORMAL

OUT_PWR_ABN

SLAVE_WORKING

R_LOS

R_LOC

TC_DEG

SPARE_PATH_ALM

R_OOF

TC_LTC

TC_EXC

T_LOSEX

TC_RDI

TC_ODI

TC_INCAIS

TC_UNEQ

TC_REI

TC_OEI

TEST_STATUS

TEM_HA

TC_TIM

TU_AIS_VC12

TF

TEM_LA

TU_LOP_VC3

TU_AIS_VC3

TR_LOC

PATCH_ERR

W_R_FAIL

TU_LOP_VC12

SWDL_PKG_NOBDSOFT

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

MOD_TYPE_MISMATCH

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.16.12.3 Alarms of N3SL16A


ALM_ALS

ALM_AU3AIS

ALM_AU3B3OVER

ALM_AU3B3SD

ALM_AU3LOP

ALM_AU3RDI

ALM_AU3REI

ALM_AU3SLM

ALM_AU3TIM

ALM_AU3UNEQ

AU_LOP

AU_AIS

AU_CMM

B2_EXC

B1_EXC

B1_SD

B3_EXC_VC3

B2_SD

B3_EXC

BD_STATUS

B3_SD

B3_SD_VC3

BIP_SD

BIP8_ECC

BIP_EXC

C2_VCAIS

CHIP_ABN

C2_PDI

COMMUN_FAIL

FPGA_ABN

CHIP_FAIL

HP_LOM

HP_RDI

FSELECT_STG

HP_SLM

HP_TIM

HP_REI

IN_PWR_ABN

J0_MM

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HP_UNEQ

LASER_SHUT

LOOP_ALM

LASER_MOD_ERR

LP_RDI_VC3

LP_REI_VC12

LP_RDI_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_REI_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LP_TIM_VC12

LSR_COOL_ALM

LSR_NO_FITED

LP_UNEQ_VC3

MS_AIS

MS_RDI

LSR_WILL_DIE

NO_BD_SOFT

OH_LOOP

MS_REI

R_LOS

POWER_ABNORMAL

OUT_PWR_ABN

SPARE_PATH_ALM

R_LOC

R_LOF

TC_EXC

T_LOSEX

SLAVE_WORKING

TC_ODI

TC_INCAIS

TC_DEG

TC_REI

TC_OEI

TC_LTC

TEM_HA

TC_TIM

TC_RDI

TEST_STATUS

TEM_LA

TC_UNEQ

TU_AIS_VC12

TF

TEMP_OVER

TU_LOP_VC3

TU_AIS_VC3

TR_LOC

PATCH_NOT_CONFIRM

W_R_FAIL

TU_LOP_VC12

SWDL_PKG_NOBDSOFT

PATCHFILE_NOTEXIST

PATCH_ERR

TIME_NOT_SUPPORT

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.16.13 List of Performance Events


This topic lists the performance events that may occur when the board operates.

10.16.13.1 Performance Events of N1SL16A


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

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MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.16.13.2 Performance Events of N2SL16A


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.16.13.3 Performance Events of N3SL16A


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

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HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.16.14 Technical Specifications of SL16A


The technical specifications of the SL16A include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.514 Parameters Specified for Optical Interfaces


Table 10-85 lists the parameters specified for the optical interfaces of the SL16A.
Figure 1.1 Parameters specified for the optical interfaces of the SL16A
Parameter

Value

Nominal bit
rate

2488320 kbit/s

Line code
type

NRZ

Application
code

I-16

S-16.1

L-16.1

L-16.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode LC

Single-mode LC

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Parameter

Value

Operating
wavelength
range (nm)

1266 to 1360

1260 to 1360

1280 to 1335

1500 to 1580

Launched
optical power
range (dBm)

-10 to -3

-5 to 0

-2 to +3

-2 to +3

Receiver
sensitivity
(dBm)

-18

-18

-27

-28

Minimum
overload
(dBm)

-3

-9

-9

Dispersion
tolerance
(ps/nm)

12

1600

Minimum
extinction
ratio (dB)

8.2

8.2

8.2

8.2

Maximum
-20 dB
spectral width
(nm)

Minimum
side mode
suppression
ratio (dB)

30

30

30

Table 10-86 and Table 10-87 list the parameters specified for the colored optical interfaces of
the N3SL16A.
Figure 1.2 CWDM parameters specified for the colored optical interfaces of the N3SL16A
Parameter

Value
CWDM

Nominal bit rate

2488320 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

80

Launched optical power range


(dBm)

0 to 5

Operating wavelength range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-28

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Parameter

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Value
CWDM

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

1600

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode suppression


ratio (dB)

30

Figure 1.3 DWDM parameters specified for the colored optical interfaces of the N3SL16A
Parameter

Value
DWDM

Nominal bit rate

2488320 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.10 to 196.00

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

1.1.1.1.515 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).
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1.1.1.1.516 Mechanical Specifications


The mechanical specifications of the SL16A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1SL16A (kg): 0.6

Weight of the N2SL16A (kg): 1.1

Weight of the N3SL16A (kg): 0.9

1.1.1.1.517 Power Consumption


The maximum power consumption of the N1SL16A at room temperature (25C) is 20 W.
The maximum power consumption of the N2SL16A at room temperature (25C) is 20 W.
The maximum power consumption of the N3SL16A at room temperature (25C) is 22 W.

10.17 SLD16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLD16 (2xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLD16.

10.17.1 Version Description


The SLD16 is available in one functional version, namely, N1. The N1SLD16 is discontinued.

10.17.2 Application
The SLD16 is a line board. The SLD16 can be used on the OptiX OSN equipment series to
transmit and receive STM-16 optical signals. The SLD16 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLD16 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-57 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.

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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.17.3 Functions and Features


The SLD16 receives and transmits 2xSTM-16 optical signals, processes overhead bytes, and
performs the MSP.
Table 10-88 provides the functions and features of the SLD16.
Figure 1.1 Functions and features of the SLD16
Function and
Feature

SLD16

Basic functions

Transmits and receives 2xSTM-16 optical signals.

Specifications
of the optical
interface

Supports different types of standard optical interfaces, namely, the I16, S-16.1, L-16.1, and L-16.2. The characteristics of the optical
interfaces comply with ITU-T G.957 and ITU-T G.692.

Supports the output of the standard wavelengths that comply with


ITU-T G.692.

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Supports the usage and detection of the SFP optical module, which
facilitates the maintenance and upgrading of the optical module.

Specifications
of the optical
module

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, and VC-4-16c
concatenation services.

Overhead
processing

Processes the section overheads of the STM-16 signals.

Supports the transparent transmission and termination of the path


overheads.

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Function and
Feature

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SLD16

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one or two channels of ECC communication.

Supports the time synchronization feature and transmission of the


time information by using the section overhead bytes.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Specifications
of the REG

Does not support the REG.

Protection
schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

Supports the SNCTP.

Supports the fiber-shared virtual trail protection.

Supports the fiber-shared MSP and processes four sets of K bytes. A


single optical interface can process two sets of K bytes. One SLD16
supports a maximum of four MSP rings.

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

Maintenance
features

10.17.4 Working Principle and Signal Flow


The SLD16 consists of the O/E converting module, MUX/DEMUX module, SDH overhead
processing module, logic and control module, and power module.
Figure 10-58 shows the functional block diagram of the SLD16 by describing how to process
1xSTM-16 signals.

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Figure 1.1 Functional block diagram of the SLD16


155 MHz

2.488
Gbit/s

O/E

SPI 2.488 DEMUX 16x155


E/O
Gbit/s
Mbit/s
. .
. .

2.488
Gbit/s

O/E
E/O

SPI

2.488
Gbit/s

MUX

16x155
Mbit/s

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX

O/E
converting
module

155 MHz
PLL

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

1.1.1.1.518 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.519 MUX/DEMUX Module

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

1.1.1.1.520 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

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In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
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(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.521 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.522 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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10.17.5 Front Panel


The front panel of the SLD16 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.523 Diagram of the Front Panel


Figure 10-59 shows the appearance of the front panel of the SLD16.
Figure 1.1 Front panel of the SLD16

SLD16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

SLD16

1.1.1.1.524 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

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Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.525 Interfaces
The front panel of the SLD16 has two optical interfaces. Table 10-89 describes the types and
usage of the optical interfaces of the SLD16.
Figure 1.1 Optical interfaces of the SLD16
Interface

Type of Interface

Usage

IN1IN2

LC

Receives optical signals.

OUT1OUT2

LC

Transmits optical signals.

10.17.6 Jumpers and DIP Switches


The SLD16 does not have any jumpers or DIP switches that are used for board settings.

10.17.7 Valid Slots


The SLD16 must be installed in a valid slot in the subrack. Otherwise, the SLD16 cannot
work normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SLD16 vary with the cross-connect capacity of the subrack. The slots
valid for the SLD16 are as follows:

When the cross-connect capacity is 200 Gbit/s, the SLD16 can be installed in slots 7, 8,
11, and 12.

10.17.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLD16 indicates the type of optical interface.
Table 10-90 provides the relationship between the feature code of the SLD16 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLD16 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SLD1600

00

SSN1SLD1601

01

I-16

SSN1SLD1602

02

S-16.1

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Board

Feature Code

Type of Optical Interface

SSN1SLD1603

03

L-16.1

SSN1SLD1604

04

L-16.2

10.17.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.526 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.527 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.

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----End

1.1.1.1.528 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.529 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.17.10 Parameter Settings


You can set the parameters for the SLD16 by using the U2000.
You can set the following parameters for the SLD16 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.17.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.530 Troubleshooting
Table 10-91 lists the faults that occur on the SLD16 frequently and the troubleshooting
methods.
The SLD16 uses the SFP optical module. When the SLD16 operates and an abnormal alarm occurs on
the optical interface, check whether the optical module is properly installed. To check whether the
optical module is properly installed, you can re-seat the optical module.

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Figure 1.1 Methods used to troubleshoot the faults that occur on the SLD16 frequently
Fault Symptom

Common Fault
Cause

Service interruption

The optical fiber


or connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become
unreachable to
the .

An NE becomes
unreachable to
the frequently.

Bit error

Pointer justification

Protection switching
failure

NEs being
unreachable to the

Equipment
interconnection fault

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An SDH overhead
interconnection fault
occurs.

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

See Troubleshooting Device Interconnection


Faults.

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1.1.1.1.531 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLD16, see Replacing an SDH Board.

10.17.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

10.17.12.1 Alarms of N1SLD16


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FSELECT_STG

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FPGA_ABN

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_NO_FITED

LP_UNEQ_VC3

LSR_COOL_ALM

MS_RDI

LSR_WILL_DIE

MS_AIS

R_LOF

MS_REI

NO_BD_SOFT

SPARE_PATH_ALM

OH_LOOP

OUT_PWR_ABN

TEM_LA

POWER_ABNORMAL

R_LOC

TF

R_LOS

SLAVE_WORKING

TU_AIS_VC3

T_LOSEX

TEM_HA

W_R_FAIL

TEMP_OVER

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TEST_STATUS

PATCH_NOT_CONFIRM

TR_LOC

TU_AIS_VC12

TIME_NOT_SUPPORT

TU_LOP_VC12

TU_LOP_VC3

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

PATCH_ERR

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.17.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

10.17.13.1 Performance Events of N1SLD16


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.17.14 Technical Specifications


The technical specifications of the SLD16 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.532 Parameters Specified for Optical Interfaces


Table 10-92 lists the parameters specified for the optical interfaces of the SLD16.
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Figure 1.1 Parameters specified for the optical interfaces of the SLD16
Parameter

Value

Nominal bit
rate

2488320 kbit/s

Line code
type

NRZ

Application
code

I-16

S-16.1

L-16.1

L-16.2

Transmissio
n distance
(km)

0 to 2

2 to 15

15 to 40

40 to 80

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode LC

Single-mode LC

Operating
wavelength
range (nm)

1266 to 1360

1260 to 1360

1280 to 1335

1500 to 1580

Launched
optical
power range
(dBm)

-10 to -3

-5 to 0

-2 to +3

-2 to +3

Receiver
sensitivity
(dBm)

-18

-18

-27

-28

Minimum
overload
(dBm)

-3

-9

-9

Dispersion
tolerance
(ps/nm)

12

1600

Minimum
extinction
ratio (dB)

8.2

8.2

8.2

8.2

Maximum
-20 dB
spectral
width (nm)

Minimum
side mode
suppression
ratio (dB)

30

30

30

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1.1.1.1.533 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.534 Mechanical Specifications


The mechanical specifications of the SLD16 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.9

1.1.1.1.535 Power Consumption


The maximum power consumption of the SLD16 at room temperature (25C) is 23 W.

10.18 SLQ16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLQ16 (4xSTM-16 optical interface board). This topic also
describes how to configure and commission the SLQ16.

10.18.1 Version Description


The SLQ16 is available in three functional versions, namely, N1, N2, and N4.The N2SLQ16
is discontinued.
Table 10-93 describes the versions of the SLQ16.
Figure 1.1 Versions of the SLQ16
Item

Description

Functional versions

The SLQ16 is available in three functional versions, namely, N1,


N2, and N4.

Differences

Specifications of optical interfaces: CWDM and DWDM


colored optical interfaces.

Specifications of optical modules: single-fiber bidirectional


optical modules.

Service processing: AU-3 service processing.

Maintenance features: loopbacks on VC-4 paths and TCM


function.

Substitution

When the AU-3 services and TCM function are not required, the
N1SLQ16 and N2SLQ16 can be substituted with each other.
The N4SLQ16 supports the board version replacement function to
substitute for the N1SLQ16/N2SLQ16.

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When you configure the MSP or SNCP, you cannot configure the N1SLQ16 as the protection board if
the working board is the N2SLQ16 on which the TCM function is enabled or AU-3 services are
configured. Otherwise, the services are interrupted when a switching operation is performed.

10.18.2 Application
The SLQ16 is a line board. The SLQ16 can be used on the OptiX OSN equipment series to
transmit and receive STM-16 optical signals. The SLQ16 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLQ16 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-60 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.18.3 Functions and Features


The SLQ16 receives and transmits 4xSTM-16 optical signals, processes overhead bytes, and
performs the MSP.
Table 10-94 describes the functions and features of the SLQ16.
Figure 1.2 Functions and features of the SLQ16
Function and
Feature

SLQ16

Basic functions

Transmits and receives 4xSTM-16 optical signals.

Specifications of
the optical
interface

Supports different types of standard optical interfaces, namely, the I16, S-16.1, L-16.1, and L-16.2. The characteristics of the optical
interfaces comply with ITU-T G.957 and ITU-T G.692.
The N4SLQ16 supports the CWDM and DWDM colored optical
interfaces. The optical interface uses the LC connector. The CWDM
optical interface supports the transmission distance of 80 km, and the

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SLQ16
DWDM optical interface supports the transmission distances of 120
km.

Specifications of
the optical module

Service processing

Overhead
processing

Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

Supports the usage and detection of the SFP optical module,


which facilitates the maintenance and upgrading of the optical
module.

The N4SLQ16 supports the single-fiber bidirectional optical


module, and the single-fiber bidirectional optical module does not
support loopbacks at the optical interface by using fiber jumpers.

Supports the VC-12 services, VC-3 services, VC-4 services, VC4-4c concatenation services, VC-4-8c concatenation services, and
VC-4-16c concatenation services.

The N2SLQ16 supports the AU-3 services.

Processes the section overheads of the STM-16 signals.

Supports the configuration of the D1-D12, E1, and E2 bytes as


transparent transmission bytes or into other unused overheads
bytes.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one to four channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Specifications of
the REG

Does not support the REG.

Protection schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

Supports the SNCTP.

Supports the fiber-shared virtual trail protection.

Supports the fiber-shared MSP and processes eight sets of K


bytes. A single optical interface can process two sets of K bytes.
One SLQ16 supports a maximum of eight MSP rings.

Supports inloops and outloops at optical interfaces.

The N1SLQ16 supports inloops and outloops on VC-4 paths.

Maintenance
features

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SLQ16

The N4SLQ16 supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

The N2SLQ16 supports the TCM function.

The N4SLQ16 supports detection and query of the voltage.

The N4SLQ16 supports the PRBS function in the line direction


and Cause by Cross function.

10.18.4 Working Principle and Signal Flow


The SLQ16 consists of the O/E converting module, MUX/DEMUX module, SDH overhead
processing module, logic and control module, and power module.
Figure 10-61 shows the functional block diagram of the SLQ16 by describing how to process
1xSTM-16 signals.
Figure 1.1 Functional block diagram of the SLQ16
155 MHz

2.488
Gbit/s

O/E

SPI 2.488 DEMUX 16x155


E/O
Gbit/s
Mbit/s
. .
. .

2.488
Gbit/s

O/E
E/O

SPI

O/E
converting
module

2.488
Gbit/s

MUX

16x155
Mbit/s

155 MHz
PLL

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX
IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section

MST: multiplex section

MSA: multiplex section

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termination

termination

adaptation

HPT: higher order path


termination

1.1.1.1.536 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.537 MUX/DEMUX Module

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

1.1.1.1.538 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module detects K2 bytes, and upon errors,
generates MS_AIS or MS_RDI alarms; it also verifies B2 bytes, and upon errors,
generates B2_SD or B2_EXC alarms and sends MS_REI signals to its opposite end.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

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In the receive direction, the HPT sub-module terminates the path overhead (POH).
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That is, the HPT sub-module verifies B3 bytes, and upon errors, sends HP_REI
signals to its opposite end; it also detects J1 and C2 bytes, and upon errors, generates
HP_TIM, HP_SLM, or HP_UNEQ (if VC-4 paths are unloaded) alarms.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.539 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.540 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.18.5 Front Panel


The front panel of the SLQ16 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.541 Diagram of the Front Panel


Figure 10-62 shows the appearance of the front panel of the N1SLQ16/N4SLQ16.

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Figure 1.1 Front panel of the N1SLQ16/N4SLQ16

SLQ16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

SLQ16

Figure 10-63 shows the appearance of the front panel of the N2SLQ16.

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Figure 1.2 Front panel of the N2SLQ16

SLQ16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

SLQ16

1.1.1.1.542 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.543 Interfaces
The front panel of the SLQ16 has four optical interfaces. Table 10-95 describes the types and
usage of the optical interfaces of the SLQ16.

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Figure 1.1 Optical interfaces of the SLQ16


Interface

Type of Interface

Usage

IN1-IN4

LC

Receives optical signals.

OUT1-OUT4

LC

Transmits optical signals.

10.18.6 Jumpers and DIP Switches


The SLQ16 does not have any jumpers or DIP switches that are used for board settings.

10.18.7 Valid Slots


The SLQ16 must be installed in a valid slot in the subrack. Otherwise, the SLQ16 fails to
work normally.
The slots valid for the SLQ16 are as follows:

The SLQ16 can be installed in slots 14, 15, and 16. In this case, two optical interfaces
can be configured.

The SLQ16 can be installed in slots 58 and 1114. In this case, four optical interfaces
can be configured.

10.18.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ16 indicates the type of optical interface.
Table 10-96 describes the relationship between the feature code of the SLQ16 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLQ16 and the type of optical interface
Board

Feature
Code

Type of Optical
Interface

SSN1SLQ1601, SSN2SLQ1601

01

I-16

SSN1SLQ1602, SSN2SLQ1602

02

S-16.1

SSN1SLQ1603, SSN2SLQ1603

03

L-16.1

SSN1SLQ1604, SSN2SLQ1604

04

L-16.2

SSN1SLQ16A10

10

I-16

SSN1SLQ16A11

11

S-16.1

SSN1SLQ16A12

12

L-16.1

SSN1SLQ16A13

13

L-16.2

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10.18.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.544 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.545 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.546 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
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Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.547 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.18.10 Parameter Settings


You can set the parameters for the SLQ16 by using the U2000.
You can set the following parameters for the SLQ16 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.18.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.548 Troubleshooting
Table 10-97 lists the faults that occur on the SLQ16 frequently and the troubleshooting
methods.
The SLQ16 uses the SFP optical module. When the SLQ16 operates and an abnormal alarm occurs on
the optical interface, check whether the optical module is properly installed. To check whether the
optical module is properly installed, you can re-seat the optical module.

Figure 1.1 Methods used to troubleshoot the faults that occur on the SLQ16 frequently
Fault Symptom

Common Fault
Cause

Service interruption

Issue 02 (2013-01-18)

The optical fiber


or connector
becomes

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

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Fault Symptom

Common Fault
Cause

10 SDH Boards

Troubleshooting Method

abnormal.

Bit error

Pointer justification

Protection switching
failure

NEs being
unreachable to the

Equipment
interconnection fault

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An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become
unreachable to
the .

An NE becomes
unreachable to
the frequently.

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

See Troubleshooting Device Interconnection


Faults.

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1.1.1.1.549 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLQ16, see Replacing an SDH Board.

10.18.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

10.18.12.1 Alarms of N1SLQ16


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FSELECT_STG

CHIP_FAIL

COMMUN_FAIL

HP_RDI

HP_REI

HP_LOM

HP_TIM

HP_UNEQ

HP_SLM

J0_MM

LASER_MOD_ERR

IN_PWR_ABN

LOOP_ALM

LP_RDI_VC12

LASER_SHUT

LP_REI_VC12

LP_REI_VC3

LP_RDI_VC3

LP_SLM_VC3

LP_TIM_VC12

LP_SLM_VC12

LP_UNEQ_VC12

LP_UNEQ_VC3

LP_TIM_VC3

LSR_NO_FITED

LSR_WILL_DIE

LSR_COOL_ALM

MS_RDI

MS_REI

MS_AIS

PATCH_NOT_CONFIRM

OH_LOOP

NO_BD_SOFT

R_LOF

POWER_ABNORMAL

PATCH_ERR

SLAVE_WORKING

PATCHFILE_NOTEXIST

OUT_PWR_ABN

TEM_HA

R_LOS

R_LOC

TEST_STATUS

R_OOF

T_LOSEX

TU_AIS_VC12

SPARE_PATH_ALM

TEM_LA

TU_LOP_VC3

TF

TEMP_OVER

TIME_NOT_SUPPORT

TU_AIS_VC3

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TR_LOC

W_R_FAIL

TU_LOP_VC12

PS

SWDL_PKG_NOBDSOFT

MOD_TYPE_MISMATCH

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.18.12.2 Alarms of N4SLQ16


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FPGA_ABN

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_INVALID

LP_UNEQ_VC3

LSR_COOL_ALM

MOD_TYPE_MISMATCH

LSR_NO_FITED

LSR_WILL_DIE

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

OUT_PWR_ABN

R_LOC

POWER_ABNORMAL

PATCHFILE_NOTEXIST

R_OOF

R_LOF

PS

T_LOSEX

SLAVE_WORKING

R_LOS

TEMP_OVER

TEM_HA

SPARE_PATH_ALM

TIME_NOT_SUPPORT

TEST_STATUS

TEM_LA

TU_AIS_VC3

TR_LOC

TF

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W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

TU_LOP_VC3

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.18.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

10.18.13.1 Performance Events of N1SLQ16


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

10.18.13.2 Performance Events of N4SLQ16


RSBBE

RSES

RSSES

RSUAS

RSCSES

INVOLTCUR

RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

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AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

INVOLTMAX

INVOLTMIN

10.18.14 Technical Specifications of SLQ16


The technical specifications of the SLQ16 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.550 Parameters Specified for Optical Interfaces


Table 10-98 lists the parameters specified for the optical interfaces of the SLQ16.
Figure 1.1 Parameters specified for the optical interfaces of the SLQ16
Parameter

Value

Nominal bit rate

2488320 kbit/s

Line code type

NRZ

Application code

I-16

S-16.1

L-16.1

L-16.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode LC

Single-mode
LC

Operating
wavelength range
(nm)

1266 to 1360

1260 to
1360

1280 to 1335

1500 to 1580

Launched optical
power range (dBm)

-10 to -3

-5 to 0

-2 to +3

-2 to +3

Receiver sensitivity
(dBm)

-18

-18

-27

-28

Minimum overload
(dBm)

-3

-9

-9

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Parameter

Value

Dispersion tolerance
(ps/nm)

12

1600

Minimum extinction
ratio (dB)

8.2

8.2

8.2

8.2

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

30

30

30

Table 10-99 lists the parameters specified for the single-fiber bidirectional optical interfaces
of the N4SLQ16.
Figure 1.2 Parameters specified for the single-fiber bidirectional optical interfaces of the
N4SLQ16
Parameter

Value

Nominal bit rate

2488320 kbit/s

Line code pattern

NRZ

Type of optical
interface

S-16.1

S-16.1

Transmission
distance (km)

2 to 15

2 to 15

Type of fiber

Single-mode LC

Single-mode LC

Operating transmit
wavelength (nm)

1490

1310

Operating receive
wavelength (nm)

1310

1490

Launched optical
power range (dBm)

-5 to 0

-5 to 0

Receiver sensitivity
(dBm)

-18

-18

Minimum overload
(dBm)

Maximum allowed
dispersion (ps/nm)

Minimum extinction
ratio (dB)

8.2

8.2

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Parameter

Value

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

Table 10-100 and Table 10-101 list the parameters specified for the colored optical interfaces
of the N4SLQ16.
Figure 1.3 CWDM parameters specified for the colored optical interfaces of the N4SLQ16
Parameter

Value
CWDM

Nominal bit rate

2488320 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

80

Launched optical power range


(dBm)

0 to 5

Operating wavelength range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

1600

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode suppression


ratio (dB)

30

Figure 1.4 DWDM parameters specified for the colored optical interfaces of the N4SLQ16
Parameter

Value
DWDM

Nominal bit rate

2488320 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

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Parameter

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Value
DWDM

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.10 to 196.00

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

1.1.1.1.551 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.552 Mechanical Specifications


The mechanical specifications of the SLQ16 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1SLQ16 (kg): 0.9

Weight of the N2SLQ16 (kg): 1.3

Weight of the N4SLQ16 (kg): 0.7

1.1.1.1.553 Power Consumption


The maximum power consumption of the N1SLQ16 at room temperature (25C) is 20 W.
The maximum power consumption of the N2SLQ16 at room temperature (25C) is 35 W.
The maximum power consumption of the N4SLQ16 at room temperature (25C) is 12 W.

10.19 SLO16
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLO16 (8xSTM-16 optical interface board). This topic also
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describes how to configure and commission the SLO16.

10.19.1 Version Description


The SLO16 is available in the following functional versions: N1 and N4.
Table 10-102 describes the versions of the SLO16.
Figure 1.1 Versions of the SLO16
Item

Description

Functional versions

The SLO16 is available in the following functional versions: N1


and N4.

Differences

Interface specifications:

The N4SLO16 supports CWDM and DWDM colored optical


interfaces, whereas the N1SLO16 does not.

The N4SLO16 supports single-fiber bidirectional optical


modules, whereas the N1SLO16 does not.

Others:

The N4SLO16 detects and reports voltage performance, whereas


the N1SLO16 does not.

The N4SLO16 supports the PRBS function, whereas the


N1SLO16 does not.

10.19.2 Application
The SLO16 is a line board. The SLO16 can be used on the OptiX OSN equipment series to
transmit and receive STM-16 optical signals. The SLO16 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLO16 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-64 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.

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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.19.3 Functions and Features


The SLO16 receives and transmits 8xSTM-16 optical signals, processes overhead bytes, and
performs the MSP protection.
Table 10-103 provides the functions and features of the SLO16.
Figure 1.2 Functions and features of the SLO16
Function and
Feature

SLO16

Basic functions

Transmits and receives 8xSTM-16 optical signals.

Specifications of
the optical
interface

Supports different types of standard optical interfaces, namely, the I16, S-16.1, L-16.1, and L-16.2. The characteristics of the optical
interfaces comply with ITU-T G.957 and ITU-T G.692.
The N4SLO16 supports the CWDM and DWDM colored optical
interfaces. The optical interface uses the LC connector. The CWDM
optical interface supports the transmission distance of 80 km, and the
DWDM optical interface supports the transmission distances of 120
km.

Specifications of
the optical module

Service processing
Issue 02 (2013-01-18)

Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

Supports the usage and detection of the SFP optical module,


which facilitates the maintenance and upgrading of the optical
module.

The N4SLO16 supports the single-fiber bidirectional optical


module, and the single-fiber bidirectional optical module does not
support loopbacks as the optical interface by using fiber jumpers.

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c

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SLO16
concatenation services, VC-4-8c concatenation services, and VC-416c concatenation services.

Overhead
processing

Processes the section overheads of the STM-16 signals.

Supports the configuration of the D1D12, E1, and E2 bytes as


transparent transmission bytes or into other unused overheads
bytes.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one to eight channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Specifications of
the REG

Does not support the REG.

Protection schemes

Supports Two-fiber ring MSP.

Supports Four-fiber ring MSP.

Supports Linear MSP.

Supports SNCP.

Supports SNCMP.

Supports SNCTP.

Supports the fiber-shared virtual trail protection.

Supports the fiber-shared MSP and processes 16 sets of K bytes. A


single optical interface can process two sets of K bytes. One
SLO16 supports a maximum of 16 MSP rings.

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

The N4SLO16 supports detection and query of the voltage.

The N4SLO16 supports the PRBS function in the line direction


and Cause by Cross function.

Maintenance
features

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10.19.4 Working Principle and Signal Flow


The SLO16 consists of the O/E converting module, MUX/DEMUX module, SDH overhead
processing module, logic and control module, and power module.
Figure 10-65 shows the functional block diagram of the SLO16 by describing how to process
1xSTM-16 signals.
Figure 1.1 Functional block diagram of the SLO16
155 MHz

2.488
Gbit/s

O/E

SPI 2.488 DEMUX 16x155


E/O
Gbit/s
Mbit/s
. .
. .

2.488
Gbit/s

O/E
E/O

SPI

2.488
Gbit/s

MUX

16x155
Mbit/s

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX

O/E
converting
module

155 MHz
PLL

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

1.1.1.1.554 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.555 MUX/DEMUX Module

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

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1.1.1.1.556 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module detects K2 bytes, and upon errors,
generates MS_AIS or MS_RDI alarms; it also verifies B2 bytes, and upon errors,
generates B2_SD or B2_EXC alarms and sends MS_REI signals to its opposite end.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module verifies B3 bytes, and upon errors, sends HP_REI
signals to its opposite end; it also detects J1 and C2 bytes, and upon errors, generates
HP_TIM, HP_SLM, or HP_UNEQ (if VC-4 paths are unloaded) alarms.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.557 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

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1.1.1.1.558 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.19.5 Front Panel


The front panel of the SLO16 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.559 Diagram of the Front Panel


Figure 10-66 shows the appearance of the front panel of the SLO16.
Figure 1.1 Front panel of the SLO16

SLO16
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

TX1
RX1
TX2
RX2
TX3
RX3
TX4
RX4
TX5
RX5
TX6
RX6
TX7
RX7
TX8
RX8

SLO16

1.1.1.1.560 Indicators
The front panel of the board has the following indicators:
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Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.561 Interfaces
The front panel of the SLO16 has eight optical interfaces. Table 10-104 describes the types
and usage of the optical interfaces of the SLO16.
Figure 1.1 Optical interfaces of the SLO16
Interface

Type of Interface

Usage

RX1RX8

LC

Receives optical signals.

TX1TX8

LC

Transmits optical signals.

10.19.6 Jumpers and DIP Switches


The SLO16 does not have any jumpers or DIP switches that are used for board settings.

10.19.7 Valid Slots


The SLO16 must be installed in a valid slot in the subrack. Otherwise, the SLO16 cannot
work normally.
The SLO16 can be installed in slots 7, 8, 11, and 12 in the subrack.

10.19.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLO16 indicates the type of optical interface.
Table 10-105 provides the relationship between the feature code of the SLO16 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLO16 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SLO1610

10

I-16

SSN1SLO1611

11

S-16.1

SSN1SLO1612

12

L-16.1

SSN1SLO1613

13

L-16.2

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10.19.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.562 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.563 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.564 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
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Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.565 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.19.10 Parameter Settings


You can set the parameters for the SLO16 by using the U2000.
You can set the following parameters for the SLO16 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.19.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.566 Troubleshooting
Table 10-106 lists the faults that occur on the SLO16 frequently and the troubleshooting
methods.
The SLO16 uses the SFP optical module. When the SLO16 operates and an abnormal alarm occurs on
the optical interface, check whether the optical module is properly installed. To check whether the
optical module is properly installed, you can re-seat the optical module.

Figure 1.1 Methods used to troubleshoot the faults that occur on the SLO16 frequently
Fault Symptom

Common Fault
Cause

Service interruption

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The optical fiber


or connector
becomes

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

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Fault Symptom

Common Fault
Cause

10 SDH Boards

Troubleshooting Method

abnormal.

Bit error

Pointer justification

Protection switching
failure

NEs being
unreachable to the

Equipment
interconnection fault

Issue 02 (2013-01-18)

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become
unreachable to
the .

An NE becomes
unreachable to
the frequently.

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

See Troubleshooting Device Interconnection


Faults.

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1.1.1.1.567 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLO16, see Replacing an SDH Board.

10.19.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

10.19.12.1 Alarms of N1SLO16


ALM_ALS

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

C2_PDI

BIP_EXC

BIP_SD

COMMUN_FAIL

C2_VCAIS

CHIP_ABN

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_NO_FITED

LP_UNEQ_VC3

LSR_COOL_ALM

MS_RDI

LSR_WILL_DIE

MS_AIS

PATCH_ERR

MS_REI

NO_BD_SOFT

R_LOC

OH_LOOP

OUT_PWR_ABN

SLAVE_WORKING

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

PS

POWER_ABNORMAL

R_LOF

R_LOS

T_LOSEX

TEM_HA

TEST_STATUS

TEM_LA

TEMP_OVER

TU_AIS_VC12

TF

TR_LOC

TU_LOP_VC3

R_OOF

DCN_FAIL

BIP8_ECC

TU_AIS_VC3

TU_LOP_VC12

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LSR_INVALID

SWDL_PKG_NOBDSOFT

MOD_TYPE_MISMATC
H

AU_CMM

CHIP_FAIL

SPARE_PATH_ALM

W_R_FAIL

IN_PWR_HIGH

IN_PWR_LOW

WRG_BD_TYPE

10.19.12.2 Alarms of N4SLO16


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FPGA_ABN

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_INVALID

LP_UNEQ_VC3

LSR_COOL_ALM

MOD_TYPE_MISMATCH

LSR_NO_FITED

LSR_WILL_DIE

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

OUT_PWR_ABN

R_LOC

POWER_ABNORMAL

PATCHFILE_NOTEXIST

R_OOF

R_LOF

PS

T_LOSEX

SLAVE_WORKING

R_LOS

TEMP_OVER

TEM_HA

SPARE_PATH_ALM

TIME_NOT_SUPPORT

TEST_STATUS

TEM_LA

TU_AIS_VC3

TR_LOC

TF

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W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

TU_LOP_VC3

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.19.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

10.19.13.1 Performance Events of N1SLO16


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

XCSTMPMIN

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

XCSTMPCUR

XCSTMPMAX

10.19.13.2 Performance Events of N4SLO16


RSBBE

RSES

RSSES

RSUAS

RSCSES

INVOLTCUR

RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

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MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

INVOLTMAX

INVOLTMIN

10.19.14 Technical Specifications of SLO16


The technical specifications of the SLO16 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.568 Parameters Specified for Optical Interfaces


Table 10-107 lists the parameters specified for the optical interfaces of the SLO16.
Figure 1.1 Parameters specified for the optical interfaces of the SLO16
Parameter

Value

Nominal bit rate

2488320 kbit/s

Line code pattern

NRZ

Application code

I-16

S-16.1

L-16.1

L-16.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode LC

Single-mode
LC

Operating
wavelength range
(nm)

1266 to 1360

1260 to
1360

1280 to 1335

1500 to 1580

Launched optical
power range (dBm)

-10 to -3

-5 to 0

-2 to +3

-2 to +3

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Parameter

Value

Receiver sensitivity
(dBm)

-18

-18

-27

-28

Minimum overload
(dBm)

-3

-9

-9

Dispersion tolerance
(ps/nm)

12

1600

Minimum extinction
ratio (dB)

8.2

8.2

8.2

8.2

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio
(dB)

30

30

30

Table 10-108 lists the parameters specified for the optical interfaces of the N4SLO16.
Figure 1.2 Parameters specified for the single-fiber bidirectional optical interfaces of the
N4SLO16
Parameter

Value

Nominal bit rate

2488320kbit/s

Line code pattern

NRZ

Type of optical
interface

S-16.1

S-16.1

Transmission distance
(km)

2 to 15

2 to 15

Type of fiber

Single-mode LC

Single-mode LC

Operating transmit
wavelength (nm)

1310

1490

Operating receive
wavelength (nm)

1490

1310

Launched optical
power range (dBm)

-5 to 0

-5 to 0

Receiver sensitivity
(dBm)

-18

-18

Minimum overload
(dBm)

Maximum allowed
dispersion (ps/nm)

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Parameter

Value

Minimum extinction
ratio (dB)

8.2

8.2

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio (dB)

Figure 1.3 CWDM parameters specified for the colored optical interfaces of the N4SLO16
Parameter

Value
CWDM

Nominal bit rate

2488320 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

80

Launched optical power range


(dBm)

0 to 5

Operating wavelength range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

1600

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode suppression


ratio (dB)

30

Figure 1.4 DWDM parameters specified for the colored optical interfaces of the N4SLO16
Parameter

Value
DWDM

Nominal bit rate

2488320 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

Launched optical power range

-1 to 3

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Parameter

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Value
DWDM

(dBm)
Central frequency (THz)

192.10 to 196.00

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

1.1.1.1.569 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.570 Mechanical Specifications


The mechanical specifications of the SLO16 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.571 Power Consumption


The maximum power consumption of the N1SLO16 at room temperature (25C) is 38 W.
The maximum power consumption of the N4SLO16 at room temperature (25C) is 21 W.

10.20 SF16
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SF16 (1xSTM-16 optical interface board with the out-band
FEC function).

10.20.1 Version Description


The SF16 is available in one functional version, namely, N1.
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10.20.2 Application
The SF16 is a line board. The SF16 can be used on the OptiX OSN equipment series to
transmit and receive STM-16 optical signals. The SF16 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SF16 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-67 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.20.3 Functions and Features


The SF16 receives and transmits 1xSTM-16 optical signals (2.666 Gbit/s with the out-band
FEC function) and processes overhead bytes.
Table 10-111 provides the functions and features of the SF16.
Figure 1.1 Functions and features of the SF16
Function and
Feature

SF16

Basic
functions

Receives and transmits 1xSTM-16 optical signals (2.666 Gbit/s with


the out-band FEC function).

Supports the enabling or disabling of the FEC function.

Supports different types of standard optical interfaces, namely, the Ue16.2c, Ue-16.2d, and Ue-16.2f. The characteristics of the optical
interfaces comply with the standards defined by Huawei.

Supports the output of the standard wavelengths that comply with


ITU-T G.692 and can be directly connected to the DWDM equipment.

Supports the DWDM colored optical interfaces. The optical interface


uses the LC connector. The DWDM optical interface supports the

Specifications
of the optical
interface

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Function and
Feature

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SF16
transmission distance of 640 km.

Specifications
of the optical
module

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, and VC-416c concatenation services.

Encapsulates and encodes the signals with the FEC function, and
processes overhead bytes, which comply with ITU-T G.709.

Processes the section overheads of the STM-16 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one channel of ECC communication.

Overhead
processing

Alarms and
performance
events

Reports various alarms and performance events.

Specifications
of the REG

Does not support the REG.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Supports the fiber-shared MSP and SNCP and processes two sets of K
bytes. One SF16 supports a maximum of two MSP protection rings.

Supports inloops and outloops at optical interfaces.

Supports inloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting services.

Supports the press-to-collect function in fault data collection.

Maintenance
features

10.20.4 Working Principle and Signal Flow


The SF16 consists of the O/E converting module, MUX/DEMUX module, FEC module, SDH
overhead processing module, logic and control module, and power module.
Figure 10-68 shows the functional block diagram of the SF16.

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Figure 1.1 Functional block diagram of the SF16


Backplane
2.666 Gbit/s

O/E
conversion

DEMUX

2.666 Gbit/s

E/O
conversion

MUX

EFEC
processing
module

SDH
overhead
processing
module

Logic and
control module
+3.3 V
Power
module

Power
module

Cross-connect unit
Cross-connect unit

SCC unit

Fuse
Fuse

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

The functional modules are described as follows:

1.1.1.1.572 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.573 MUX/DEMUX Module

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

1.1.1.1.574 FEC Module

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In the upstream direction, the reverse process is performed. The FEC encoding and
decoding module receives the 2.666 Gbit/s signals from the DEMUX module. After
frame searching, FEC encoding, data packets encapsulation, and scrambling in the FEC
module, the 2.488 Gbit/s signals are recovered and then transmitted to the SDH overhead
processing module. The frame format of the 2.666 Gbit/s signals complies with ITU
G.709.
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In the downstream direction, the FEC encoding and decoding module receives 2.488
Gbit/s SDH signals, which are sent by the SDH overhead processing module. After
frame searching, FEC encoding, data packet encapsulation, and scrambling, the 2.488
Gbit/s SDH signals are converted into 2.666 Gbit/s signals and then transmitted to the
MUX module.

The FEC processing module is connected to the logic and control module through a CPU
bus. The CPU controls the working modes of the FEC module by configuring the
internal register. The working mode can be the regenerator mode, namely, REG mode.
The CPU can monitor the performance through the internal register.

1.1.1.1.575 SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the MSOH. That is, the
MST sub-module generates the MS_AIS alarm and detects the MS_RDI alarm after
detecting the K2 byte, and detects the MS_REI alarm and generates the B2_EXC
alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the AUG, divides an
AUG into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs
pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the POH. That is, the HPT
sub-module detects the HP_REI alarm after checking the B3 byte, generates the
HP_TIM alarm and the HP_SLM alarm and detects the HP_RDI alarm after detecting
the J1 and C2 bytes, and generates the HP_UNEQ alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.576 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

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Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.577 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.20.5 Front Panel


The front panel of the SF16 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.578 Diagram of the Front Panel


Figure 10-69 shows the appearance of the front panel of the SF16.

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Figure 1.1 Front panel of the SF16

SF16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT

IN

SF16

1.1.1.1.579 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.580 Interfaces
The front panel of the SF16 has one optical interface. Table 10-112 describes the types and
usage of the optical interfaces of the SF16.

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The SF16 uses the unswappable optical module.

Figure 1.1 Optical interfaces of the SF16


Interface

Type of
Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.20.6 Valid Slots


The slots valid for the SF16 vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SF16 are as follows:

When the cross-connect capacity is 200 Gbit/s, the SF16 can be installed in slots 58 and
1114.

10.20.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SF16 indicates the type of optical interface.
Table 10-113 provides the relationship between the feature code of the SF16 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SF16 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SF1600

00

Colored optical interface

SSN1SF1601

01

Ue-16.2c/Ue-16.2d/Ue-16.2f

10.20.8 Parameter Settings


You can set the parameters for the SF16 by using the U2000.
You can set the following parameters for the SF16 by using the U2000:

J0

J1

J2

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C2

For the description of each parameter, see 26 Parameter Settings.

10.20.9 Technical Specifications of SF16


The technical specifications of the SF16 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.581 Parameters Specified for Optical Interfaces


Table 10-114 lists the parameters specified for the optical interfaces of the SF16.
Figure 1.1 Parameters specified for the optical interfaces of the SF16
Parameter

Value

Nominal bit rate

2666057.143 kbit/s

Processing capability

1xSTM-16 standard services or concatenation services

Line code pattern

NRZ

Application codea

Ue-16.2c

Ue-16.2d

Ue-16.2f

FEC + BA (14)
+ PA

FEC + BA (17) +
PA

FEC + BA (17) + RA + PA

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Operating
wavelength range
(nm)

1550.12

Launched optical
power range (dBm)b

-5 to -1

-5 to -1

-5 to -1

Launched optical
power range (dBm)c

13 to 15

13 to 15

15 to 18

Receiver sensitivity
(dBm)b

-27.5

-27.5

-27.5

Receiver sensitivity
(dBm)d

-37

-37

-42

Minimum overload
(dBm)d

-10

-10

-10

Minimum extinction
ratio (dB)b

10

10

10

Dispersion tolerance
(ps/nm)

12800

12800

12800

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio

30

30

30

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Parameter

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Value

(dB)
a: The numbers in the brackets indicate the corresponding parameter values. For example,
"BA (14)" indicates that the optical power amplified by the BA is 14 dBm. "FEC + BA +
PA + RA" indicates that the specifications of the optical interface are measured when the
FEC, BA, PA, and Raman amplifier are used.
b: The parameter values are applicable only to the optical modules. The parameter values of
the amplifier are not provided.
c: The parameter values are applicable to the BA.
d: The parameter values are applicable to the PA.

Table 10-115 lists the parameters specified for the colored optical interfaces of the SF16.
Figure 1.2 Parameters specified for the colored optical interfaces of the SF16
Parameter

Value
DWDM

Nominal bit rate

2666057.143 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

640

Launched optical power range (dBm)

-2 to 2.5

Central frequency (THz)

192.1 to 196.0

Central frequency deviation (GHz)

20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion (ps/nm)

10880

Minimum extinction ratio (dB)

10

Maximum -20 dB spectral width (nm)

0.1

Minimum side mode suppression ratio


(dB)

35

Optical signal-to-noise ratio (dB)

With the FEC: 16


Without the FEC: 21

1.1.1.1.582 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).
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1.1.1.1.583 Mechanical Specifications


The mechanical specifications of the SF16 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.1

1.1.1.1.584 Power Consumption


The maximum power consumption of the SF16 at room temperature (25C) is 26 W.

10.21 SF16E
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SF16E (1xSTM-16 optical interface board with the out-band
EFEC function).

10.21.1 Version Description


The SF16E is available in one functional version, namely, N1.

10.21.2 Application
SF16E boards are line boards. They can transmit and receive STM-16 optical signals when
being used on the OptiX OSN equipment, and can achieve ultra-long distance transmission
when working with BPA, OBU1, OBU2, RPC01, or RPC02 boards.
SF16E boards can be used in four typical scenarios, as shown in Figure 10-70.

Application 1: SF16E boards can achieve 72 dB span transmission if working with


OBU1/OBU2 boards, RPC02 boards, and PAs.

Application 2: SF16E boards can achieve 67 dB span transmission if working with


OBU1/OBU2 boards and PAs.

Application 3: SF16E boards can achieve 75 dB span transmission if working with BAs,
RPC01 boards, RPC02 boards, and PAs.

Application 4: SF16E boards can achieve 61 dB span transmission if working with BAs
and PAs.

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Figure 1.1 Typical networking and application of SF16E boards


Appl i cati on 1:

Appl i cati on 2:
67 dB

72 dB
RPC
02

OBU1/
OBU2

OBU1/
OBU2

PA
SF16E

SF16E
PA

SF16E

OBU1/
OBU2

RPC
02

Appl i cati on 4:
75 dB

61 dB
RPC
02

RPC
01

BA

PA

SF16E

SF16E
PA

OBU1/
OBU2

PA

Appl i cati on 3:

BA

PA

SF16E

RPC
02

RPC
01

PA
SF16E

SF16E

BA

PA

BA

10.21.3 Functions and Features


The SF16E receives and transmits 1xSTM-16 optical signals (2.666 Gbit/s with the out-band
EFEC function) and processes overhead bytes.
Table 10-116 provides the functions and features of the SF16E.
Figure 1.1 Functions and features of the SF16E
Function and
Feature

SF16E

Basic
functions

Receives and transmits 1xSTM-16 optical signals (2.666 Gbit/s with


the out-band EFEC function).

Supports the enabling or disabling of the EFEC function.

Specifications
of the optical
interface

Supports the output of the standard wavelengths that comply with


ITU-T G.692 and can be directly connected to the DWDM equipment.

Supports the DWDM colored optical interfaces. The optical interface


uses the LC connector. The DWDM optical interface supports the
transmission distance of 120 km.

Specifications
of the optical
module

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the setting
of the on/off state of a laser.

Service
processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, and VC-416c concatenation services.

Encapsulates and encodes the signals with the EFEC function, and
processes overhead bytes, which comply with ITU-T G.709.

Processes the section overheads of the STM-16 signals.

Overhead
processing
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SF16E

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one channel of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events.

Specifications
of the REG

Supported.

Protection
schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Supports the fiber-shared MSP and SNCP and processes two sets of K
bytes. One SF16E supports a maximum of two MSP protection rings.

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting services.

Supports the press-to-collect function in fault data collection.

Supports the PRBS function in the line direction and Cause by Cross
function.

Maintenance
features

10.21.4 Working Principle and Signal Flow


The SF16E consists of the O/E converting module, MUX/DEMUX module, EFEC module,
SDH overhead processing module, logic and control module, and power module.
Figure 10-71 shows the functional block diagram of the SF16E.

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Figure 1.1 Functional block diagram of the SF16E


Backplane
2.666 Gbit/s

O/E
conversion

DEMUX

2.666 Gbit/s

E/O
conversion

MUX

EFEC
processing
module

SDH
overhead
processing
module

Logic and
control module
+3.3 V
Power
module

Power
module

Cross-connect unit
Cross-connect unit

SCC unit

Fuse
Fuse

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

The functional modules are described as follows:

1.1.1.1.585 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.586 MUX/DEMUX Module

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

1.1.1.1.587 EFEC Module

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In the upstream direction, the reverse process is performed. The EFEC encoding and
decoding module receives the 2.666 Gbit/s signals from the DEMUX module. After
frame searching, EFEC encoding, data packets encapsulation, and scrambling in the
EFEC module, the 2.488 Gbit/s signals are recovered and then transmitted to the SDH
overhead processing module. The frame format of the 2.666 Gbit/s signals complies with
ITU G.709.
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In the downstream direction, the EFEC encoding and decoding module receives 2.488
Gbit/s SDH signals, which are sent by the SDH overhead processing module. After
frame searching, EFEC encoding, data packet encapsulation, and scrambling, the 2.488
Gbit/s SDH signals are converted into 2.666 Gbit/s signals and then transmitted to the
MUX module.

The EFEC processing module is connected to the logic and control module through a
CPU bus. The CPU controls the working modes of the EFEC module by configuring the
internal register. The CPU can monitor the performance through the internal register.

1.1.1.1.588 SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module detects K2 bytes, and upon errors,
generates MS_AIS or MS_RDI alarms; it also verifies B2 bytes, and upon errors,
generates B2_SD or B2_EXC alarms and sends MS_REI signals to its opposite end.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the AUG, divides an
AUG into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs
pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module verifies B3 bytes, and upon errors, sends HP_REI
signals to its opposite end; it also detects J1 and C2 bytes, and upon errors, generates
HP_TIM, HP_SLM, or HP_UNEQ (if VC-4 paths are unloaded) alarms.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.589 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

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Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.590 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.21.5 Front Panel


The front panel of the SF16E has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.591 Diagram of the Front Panel


Figure 10-72 shows the appearance of the front panel of the SF16E.

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Figure 1.1 Front panel of the SF16E

SF16E
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT

IN

SF16E

1.1.1.1.592 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.593 Interfaces
The front panel of the SF16E has one optical interface. Table 10-117 describes the types and
usage of the optical interfaces of the SF16E.

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Figure 1.1 Optical interfaces of the SF16E


Interface

Type of
Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.21.6 Jumpers and DIP Switches


The SF16E does not have any jumpers or DIP switches that are used for board settings.

10.21.7 Valid Slots


The SF16E must be installed in a valid slot in the subrack. Otherwise, the SF16E cannot work
properly.
The SF16E can be installed in slots 5-8 and 11-14 in a subrack.

10.21.8 Feature Code


SF16E boards do not have feature codes.

10.21.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.594 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.595 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

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J0 byte: Generally, use the default value. The default value of the J0 to be received is
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Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.596 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.597 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.21.10 Parameter Settings


You can set the parameters for the SF16E by using the U2000.
You can set the following parameters for the SF16E by using the U2000:

J0

J1

J2

C2

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For the description of each parameter, see 26 Parameter Settings.

10.21.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.598 Troubleshooting
Table 10-118 lists the faults that occur on the SF16E frequently and the troubleshooting
methods.
The SF16E uses the SFP optical module. When the SF16E operates and an abnormal alarm occurs on the
optical interface, check whether the optical module is properly installed. To check whether the optical
module is properly installed, you can re-seat the optical module.

Figure 1.1 Methods used to troubleshoot the faults that occur on the SF16E frequently
Fault Symptom

Common Fault
Cause

Service interruption

The optical fiber


or connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection

Bit error

Pointer justification

Protection switching
failure

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

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Fault Symptom

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Common Fault
Cause

Troubleshooting Method

switching fails.
NEs being
unreachable to the

Equipment
interconnection fault

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become
unreachable to
the .

An NE becomes
unreachable to
the frequently.

An SDH overhead
interconnection fault
occurs.

See Troubleshooting the NEs Being


Unreachable.

See Troubleshooting Device Interconnection


Faults.

1.1.1.1.599 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SF16E, see Replacing an SDH Board.

10.21.12 List of Alarms


This topic lists the alarms that may occur when the board operates.

10.21.12.1 Alarms of N1SF16E


ALM_ALS

AU_AIS

AU_LOP

B1_SD

B1_EXC

BIP_EXC

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP_SD

BEFFEC_EXC

CHIP_FAIL

C2_VCAIS

FEC_LOF

COMMUN_FAIL

FSELECT_STG

HP_TIM

HP_SLM

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

J0_MM

LOOP_ALM

LASER_SHUT

LP_SLM_VC3

LP_TIM_VC3

LP_TIM_VC12

LP_SLM_VC12

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LP_UNEQ_VC12

LP_UNEQ_VC3

LSR_WILL_DIE

LSR_COOL_ALM

LSR_NO_FITED

NO_BD_SOFT

MS_RDI

MS_REI

MS_AIS

DCN_FAIL

ODU_AIS

PATCH_NOT_CONFIRM

ODU_OCI

OH_LOOP

ODU_LCK

OTU_LOF

OTU_LOM

OTU_AIS

PM_BIP8_OVER

PM_BDI

PS

POWER_ABNORMAL

PM_BIP8_SD

PM_BEI

R_LOS

R_LOC

PM_TIM

SM_BIP8_SD

SM_BEI

SLAVE_WORKING

SM_BDI

SM_IAE

SM_BIP8_OVER

SM_TIM

T_LOSEX

TEM_HA

TF

TEM_LA

R_LOF

TU_AIS_VC3

TR_LOC

TEST_STATUS

TU_LOP_VC3

TU_LOP_VC12

TU_AIS_VC12

PATCHFILE_NOTEXIST

PATCH_ERR

IN_PWR_LOW

IN_PWR_HIGH

WRG_BD_TYPE

TEMP_OVER

LASER_MOD_ERR

MOD_TYPE_MISMATCH

10.21.13 List of Performance Events


This topic lists the performance events that may occur when the board operates.

10.21.13.1 Performance Events of N1SF16E


AUPJCHIGH

AUPJCLOW

AUPJCNEW

FEC_AFT_COR_ER

FEC_BEF_COR_ER

FEC_COR_0BIT_CNT

FEC_COR_1BIT_CNT

FEC_COR_BYTE_CNT

FEC_UNCOR_BLOCK_CNT

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

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MSSES

MSUAS

ODU2PMBIP8

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

OTU2SMBIP8

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

INVOLTCUR

INVOLTMAX

INVOLTMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.21.14 Technical Specifications of SF16E


The technical specifications of the SF16E include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.600 Parameters Specified for Optical Interfaces


Table 10-119 lists the parameters specified for the fixed colored optical interfaces of the
SF16E.
Figure 1.1 Parameters specified for the fixed colored optical interfaces of the SF16E
Parameter

Value
DWDM

Nominal bit rate

2666057.143 kbit/s

Type of optical interface

Single-mode LC

Transmission distance (km)

120

Launched optical power range (dBm)

0 to 4

Central frequency (THz)

193.4

Central frequency deviation (GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-8

Maximum allowed dispersion (ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width (nm)

0.3

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Value
DWDM

Minimum side mode suppression ratio


(dB)

30

1.1.1.1.601 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is lower than 10 dBm (10 mW).

1.1.1.1.602 Mechanical Specifications


The mechanical specifications of the SF16E are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.6

1.1.1.1.603 Power consumption


The maximum power consumption of the SF16E at room temperature (25C) is 26 W.

10.22 SL64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SL64 (1xSTM-64 optical interface board). This topic also
describes how to configure and commission the SL64.

10.22.1 Version Description


The SL64 is available in several functional versions. The N2SL64 is discontinued. The
functions provided by the functional versions are different.
Table 10-120 describes the versions of the SL64.
Figure 1.1 Versions of the SL64
Item

Description

Functional versions

The SL64 is available in the following functional versions: N4, N2


and N1.

Differences

The N1SL64/N4SL64 supports the board version replacement


function, but does not support the TCM function or AU-3
services.

The N2SL64 does not support the board version replacement


function, but supports the TCM function and AU-3 services, the
TCM function and AU-3 services cannot be available at the
same time.

The N4SL64 supports pluggable XFP optical modules.

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Description

Substitution

The N4SL64 detects and reports voltage performance.

SL64 boards of different versions support different loopback


functions. For details, see 10.22.3 Functions and Features.

When the TCM function and AU-3 services are not required, the
N1SL64 can substitute for the N2SL64.
The N4SL64 supports the board version replacement function to
substitute for the N1SL64/N2SL64.

When you configure the MSP or SNCP, you cannot configure the N1SL64 as the protection board if
the working board is the N2SL64 on which the TCM function is enabled or AU-3 services are
configured. Otherwise, the services are interrupted when a switching operation is performed.

10.22.2 Application
The SL64 is a line board. The SL64 can be used on the OptiX OSN equipment series to
transmit and receive STM-64 optical signals. The SL64 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SL64 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-73 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.22.3 Functions and Features


The SL64 receives and transmits 1xSTM-64 optical signals and processes overhead bytes.
Table 10-121 describes the functions and features of the SL64.

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Figure 1.2 Functions and features of the SL64


Function
and Feature

SL64

Basic
functions

Transmits and receives 1xSTM-64 optical signals.

Specifications
of the optical
interface

The N1SL64/N2SL64 supports different types of standard optical


interfaces, namely, the I-64.1, I-64.2, S-64.2b, L-64.2b (BA), Le-64.2,
Ls-64.2, and V-64.2b (BA + PA + dispersion compensation unit
(DCU)). The characteristics of the optical interfaces of the S-64.2b, L64.2b, Ls-64.2, and V-64.2b types comply with ITU-T G.691 and ITUT G.692. The characteristics of the optical interface of the Le-64.2 type
comply with the standards defined by Huawei.

The N4SL64 supports different types of standard optical interfaces,


namely, the I-64.1, S-64.2b, Le-64.2, P1L1-2D2, and V-64.2b (BA + PA
+ DCU). The characteristics of the optical interfaces of the I-64.1, S64.2b, Le-64.2, and V-64.2b types comply with ITU-T G.691. The
characteristics of the optical interface of the P1L1-2D2 type comply
with ITU-T G.959.

The N1SL64/N2SL64 supports the DWDM colored optical interfaces,


which use LC connectors. The DWDM optical interface supports the
transmission distance of 40 km.

The N4SL64 supports the CWDM and DWDM colored optical


interfaces. The optical interface uses the LC connector. The CWDM
optical interface supports the transmission distance of 70 km, and the
DWDM optical interface supports the transmission distance of 40 km
and 80 km.

Supports the output of the standard wavelengths that comply with ITUT G.692 and can be directly connected to the WDM equipment.

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the setting of
the on/off state of a laser.

The N4SL64 supports the usage and detection of the pluggable XFP
optical module, which facilitates the maintenance and upgrading of the
optical module.

Supports the VC-12 services, VC-3 services, and VC-4 services.

The N1SL64 and N2SL64 support the VC-4-4c concatenation services,


VC-4-8c concatenation services, Vc-4-16c concatenation services, and
VC-4-64c concatenation services.

The N2SL64 supports the AU-3 services.

Processes the section overheads of the STM-64 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one channel of ECC communication.

Reports various alarms and performance events.

Specifications
of the optical
module

Service
processing

Overhead
processing

Alarms and
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10 SDH Boards

SL64

performance
events
Specifications
of the REG

Supports the setting and query of the REG working mode.

Protection
schemes

Supports Two-fiber ring MSP.

Supports Four-fiber ring MSP.

Supports Linear MSP.

Supports SNCP.

Supports SNCMP.

Supports SNCTP.

Supports the fiber-shared virtual trail protection.

Supports the fiber-shared MSP and processes two sets of K bytes. One
SL64 supports a maximum of two MSP rings.

Supports inloops and outloops at optical interfaces.

The N1SL64/N4SL64 supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

The N2SL64 supports the TCM function.

Supports the upgrade of the board software without affecting services.

Supports the press-to-collect function in fault data collection.

The N4SL64 detects and reports voltage performance.

The N4SL64 supports the PRBS function in the line direction and
Cause by Cross function.

Maintenance
features

10.22.4 Working Principle and Signal Flow


The SL64 consists of the O/E converting module, MUX/DEMUX Module, SDH overhead
processing module, logic and control module, and power module.
Figure 10-74 shows the functional block diagram of the N1SL64/N2SL64/N4SL64.

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Figure 1.1 Functional block diagram of the N1SL64/N2SL64/N4SL64


622 MHz

9.953
Gbit/s

9.953
Gbit/s

O/E

DEMUX 16x622
Mbit/s

SPI
9.953
Gbit/s

E/O

9.953
Gbit/s

O/E
converting
module

MUX

16x622
Mbit/s

MUX/
DEMUX

622 MHz
PLL

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module
Frame header
Logic and
control module Communication

IIC
LOS
Laser shutdown

+3.3 V
Power
module

Power
module

Fuse

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

1.1.1.1.604 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.605 MUX/DEMUX Module

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

1.1.1.1.606 SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

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In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
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except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module detects K2 bytes, and upon errors,
generates MS_AIS or MS_RDI alarms; it also verifies B2 bytes, and upon errors,
generates B2_SD or B2_EXC alarms and sends MS_REI signals to its opposite end.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the AUG, divides an
AUG into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs
pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module verifies B3 bytes, and upon errors, sends HP_REI
signals to its opposite end; it also detects J1 and C2 bytes, and upon errors, generates
HP_TIM, HP_SLM, or HP_UNEQ (if VC-4 paths are unloaded) alarms.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.607 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.608 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.22.5 Front Panel


The front panel of the SL64 has indicators, interfaces, a bar code, a laser safety class label,
and an APD alarm label.

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1.1.1.1.609 Diagram of the Front Panel


Figure 10-75 shows the appearance of the front panel of the N1SL64/N2SL64.
Figure 1.1 Appearance of the front panel of the N1SL64/N2SL64

SL64
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

OUT

IN

SL64

Figure 10-76 shows the appearance of the N4SL64.

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Figure 1.2 Appearance of the front panel of the N4SL64

SL64
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

OUT

IN

SL64

1.1.1.1.610 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.611 Interfaces
The front panel of the SL64 has one optical interface. Table 10-122 describes the types and
usage of the optical interfaces of the SL64.

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Figure 1.1 Optical interfaces of the SL64


Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.22.6 Jumpers and DIP Switches


The SL64 does not have any jumpers or DIP switches that are used for board settings.

10.22.7 Valid Slots


The SL64 must be installed in a valid slot in the subrack. Otherwise, the SL64 fails to work
normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SL64 vary with the cross-connect capacity of the subrack. The slots
valid for the SL64 are as follows:

When the cross-connect capacity is 200 Gbit/s, the N1SL64 can be installed in slots 7, 8,
11, and 12; the N4SL64 can be installed in slots 5-8 and 11-14.

10.22.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL64 indicates the type of optical interface.
Table 10-123 describes the relationship between the feature code of the SL64 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SL64 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SL6400

00

Fixed-wavelength optical
interface

SSN4SL6401M01

01M01

Fixed-wavelength optical
interface

SSN1SL6401

01

I-64.2

SSN1SL6402,
SSN4SL6402

02

S-64.2b

SSN1SL6403

03

Le-64.2

SSN1SL6404

04

Ls-64.2

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Board

Feature Code

Type of Optical Interface

SSN1SL6405

05

L-64.2b

SSN1SL6406

06

V-64.2b

SSN2SL6400

00

Fixed-wavelength optical
interface

SSN2SL6411

11

I-64.2

SSN2SL6412

12

S-64.2b

SSN2SL6413

13

Le-64.2

SSN2SL6404

04

Ls-64.2

SSN2SL6415

15

L-64.2b

SSN2SL6416

16

V-64.2b

SSN4SL6401

01

I-64.1

SSN4SL6403

03

P1L1-2D2

SSN4SL6404

04

V-64.2b

SSN4SL6405

05

Le-64.2

10.22.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.612 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.613 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
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Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.614 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.615 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.22.10 Parameter Settings


You can set the parameters for the SL64 by using the U2000.
You can set the following parameters for the SL64 by using the U2000:

J0

J1

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J2

C2

10 SDH Boards

For the description of each parameter, see 26 Parameter Settings.

10.22.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.616 Troubleshooting
Table 10-124 lists the faults that occur on the SL64 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the SL64 frequently
Fault Symptom

Common Fault
Cause

Service interruption

The optical fiber


or connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

Bit error

Pointer justification

Protection switching
failure

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

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Fault Symptom

Common Fault
Cause

NEs being
unreachable to the

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become
unreachable to
the .

An NE becomes
unreachable to
the frequently.

Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

Troubleshooting Method
See Troubleshooting the NEs Being
Unreachable.

See Troubleshooting Device Interconnection


Faults.

1.1.1.1.617 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SL64, see Replacing an SDH Board.

10.22.12 List of Alarms


This topic lists the alarms that may occur when the board operates.

10.22.12.1 Alarms of N1SL64


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FPGA_ABN

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

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LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_NO_FITED

LP_UNEQ_VC3

LSR_COOL_ALM

MS_RDI

LSR_WILL_DIE

MS_AIS

R_LOF

MS_REI

NO_BD_SOFT

SLAVE_WORKING

OH_LOOP

OUT_PWR_ABN

TC_DEG

POWER_ABNORMAL

R_LOC

TC_LTC

R_LOS

R_OOF

TC_RDI

SPARE_PATH_ALM

T_LOSEX

TC_UNEQ

TC_EXC

TC_INCAIS

TEMP_OVER

TC_ODI

TC_OEI

TR_LOC

TC_REI

TC_TIM

TU_LOP_VC12

TEM_HA

TEM_LA

PATCHFILE_NOTEXIST

TEST_STATUS

TF

PS

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC3

PATCH_NOT_CONFIRM

W_R_FAIL

PATCH_ERR

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

MOD_TYPE_MISMATCH

10.22.12.2 Alarms of N2SL64


ALM_ALS

ALM_AU3AIS

ALM_AU3B3OVER

ALM_AU3B3SD

ALM_AU3LOP

ALM_AU3RDI

ALM_AU3REI

ALM_AU3SLM

ALM_AU3TIM

ALM_AU3UNEQ

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

DID_ERROR

BIP_EXC

BIP_SD

BIP8_ECC

C2_PDI

C2_VCAIS

CHIP_FAIL

COMMUN_FAIL

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FPGA_ABN

FSELECT_STG

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

J0_MM

LASER_MOD_ERR

LASER_SHUT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LSR_COOL_ALM

LSR_NO_FITED

LSR_WILL_DIE

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

R_LOF

OH_LOOP

OUT_PWR_ABN

SLAVE_WORKING

POWER_ABNORMAL

R_LOC

TC_DEG

R_LOS

R_OOF

TC_LTC

SPARE_PATH_ALM

T_LOSEX

TC_RDI

TC_EXC

TC_INCAIS

TC_UNEQ

TC_ODI

TC_OEI

TEST_STATUS

TC_REI

TC_TIM

TU_AIS_VC12

TEM_HA

TEM_LA

TU_LOP_VC3

TF

TR_LOC

PATCH_ERR

TU_AIS_VC3

TU_LOP_VC12

SWDL_PKG_NOBDSOFT

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_NOT_CONFIRM

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.22.12.3 Alarms of N4SL64


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

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C2_VCAIS

FPGA_ABN

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_INVALID

LP_UNEQ_VC3

LSR_COOL_ALM

MOD_TYPE_MISMATCH

LSR_NO_FITED

LSR_WILL_DIE

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

OUT_PWR_ABN

R_LOC

POWER_ABNORMAL

PATCHFILE_NOTEXIST

R_OOF

R_LOF

PS

T_LOSEX

SLAVE_WORKING

R_LOS

TEMP_OVER

TEM_HA

SPARE_PATH_ALM

TIME_NOT_SUPPORT

TEST_STATUS

TEM_LA

TU_AIS_VC3

TR_LOC

TF

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

TU_LOP_VC3

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.22.13 List of Performance Events


This topic lists the performance events that may occur when the board operates.

10.22.13.1 Performance Events of N1SL64


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

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MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.22.13.2 Performance Events of N2SL64


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TCBBE

TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

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10.22.13.3 Performance Events of N4SL64


RSBBE

RSES

RSSES

RSUAS

RSCSES

INVOLTCUR

RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

INVOLTMAX

INVOLTMIN

10.22.14 Technical Specifications of SL64


The technical specifications of the SL64 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.618 Parameters Specified for Optical Interfaces


Table 10-125 and Table 10-126 list the parameters specified for the optical interfaces of the
SL64.
Figure 1.1 Parameters specified for the optical interfaces of the N1SL64/N2SL64
Paramete
r

Value

Nominal
bit rate

9953280 kbit/s

Line code
type

NRZ

Applicati
on code

I-64.1

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I-64.2

S64.2b

L-64.2b (BA)

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V-64.2b (BA +
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Paramete
r

Value

Transmiss
ion
distance
(km)

0 to 2

0 to
25

2 to
40

35 to 80

35 to
60

55 to
80

80 to 120

Type of
fiber

Singl
emode
LC

Singl
emode
LC

Single
-mode
LC

Single-mode
LC

Singl
emode
LC

Singl
emode
LC

Single-mode LC

Operating
wavelengt
h range
(nm)

1290
to
1330

1530
to
1565

1530
to
1565

1530 to 1565

1530
to
1565

1530
to
1565

1550.12

Mean
launched
optical
power
(dBm)

-6 to
-1

-5 to
-1

-1 to
+2

-4 to +2
(without the
BA)

0 to 4

4 to 7

-4 to -1 (without
the BA, PA, or
DCU)

Receiver
sensitivity
(dBm)

-11

Minimum
overload
(dBm)

-1

-1

-1

-1

-8

-8

-1

Minimum
extinction
ratio (dB)

8.2

8.2

8.2

8.2

8.2

8.2

Dispersio
n
tolerance
(ps/nm)

6.6

500

800

1600

1200

1600

2040

Maximum
-20 dB
spectral
width
(nm)

Minimum
side mode
suppressi
on ratio
(dB)

30

30

30

30

30

30

30

13 to 15 (with
the BA)
-14

-14

-14

13 to 15 (with the
BA)
-21

-21

-14 (without the


PA, BA, or DCU)
-26 (with the PA)

"BA + PA + DCU" indicates that the specifications of the V-64.2b optical interface are
measured when the BA, PA, and DCU are used.
The dispersion coefficient is 17 ps/nm when signals are transmitted by the G.652 fibers at
the wavelength of 1550.12 nm. Hence, the dispersion tolerance is 2040 ps/nm for a 120-km
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Paramete
r

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Value

distance.

Figure 1.2 Parameters specified for the optical interfaces of the SL64
Parameter

Value

Nominal bit
rate

9953280 kbit/s

Line code type

NRZ

Application
code

I-64.1

S-64.2b

Le-64.2

P1L12D2

V-64.2b (BA + PA +
DCU)

Transmission
distance (km)

0 to 2

2 to 40

35 to 60

40 to 80

80 to 120

Type of fiber

Singlemode LC

Singlemode LC

Singlemode
LC

Singlemode
LC

Single-mode LC

Operating
wavelength
range (nm)

1290 to
1330

1530 to
1565

1530 to
1565

1530 to
1565

1550.12

Mean
launched
optical power
(dBm)

-6 to -1

-1 to +2

0 to 4

0 to 4

-4 to -1 (without the BA,


PA, or DCU)

Receiver
sensitivity
(dBm)

-11

Minimum
overload
(dBm)

-1

-1

-8

-7

-1

Minimum
extinction ratio
(dB)

8.2

8.2

8.2

Dispersion
tolerance
(ps/nm)

200

800

1600

1600

800

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression

30

30

30

30

30

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13 to 15 (with the BA)


-14

-21

-24

-14 (without the PA, BA,


or DCU)
-26 (with the PA)

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Value

ratio (dB)
"BA + PA + DCU" indicates that the specifications of the V-64.2b optical interface are
measured when the BA, PA, and DCU are used.

Table 10-127 lists the parameters specified for the colored optical interfaces of the N1SL64
and N2SL64.
Table 10-128 and Table 10-129 list the parameters specified for the colored optical interfaces
of the N4SL64.
Figure 1.3 Parameters specified for the colored optical interfaces of the N1SL64 and N2SL64
Parameter

Value
DWDM

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

Launched optical power range (dBm)

-4 to -1

Central frequency (THz)

192.1 to 196.0

Central frequency deviation (GHz)

12.5

Receiver sensitivity (dBm)

-14

Minimum overload (dBm)

-1

Maximum allowed dispersion (ps/nm)

800

Minimum extinction ratio (dB)

10

Maximum -20 dB spectral width (nm)

0.3

Minimum side mode suppression ratio (dB)

35

Optical signal-to-noise ratio (dB)

22

Figure 1.4 CWDM parameters specified for the colored optical interfaces of the N4SL64
Parameter

Value
CWDM

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

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Parameter

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Value
CWDM

Transmission distance
(km)

70

Launched optical power


range (dBm)

0 to 4

Operating wavelength
range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

1451 to 1551 nm: -23

1571 nm: -22

1591 to 1611 nm: -21

Minimum overload (dBm)

-9

Maximum allowed
dispersion (ps/nm)

1400

Minimum extinction ratio


(dB)

8.2

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

Figure 1.5 DWDM parameters specified for the colored optical interfaces of the N4SL64
Parameter

Value
DWDM

Nominal bit rate

9953280kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

80

Launched optical power


range (dBm)

-1 to 2

-1 to 3

Central frequency (THz)

192.1 to 196.0

192.1 to 196.0

Central frequency deviation


(GHz)

10

10

Receiver sensitivity (dBm)

-17

-24

Minimum overload (dBm)

-1

-9

Maximum allowed
dispersion (ps/nm)

800

1600

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Parameter

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Value
DWDM

Minimum extinction ratio


(dB)

9.5

8.2

Maximum -20 dB spectral


width (nm)

0.3

0.3

Minimum side mode


suppression ratio (dB)

35

30

1.1.1.1.619 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.620 Mechanical Specifications


The mechanical specifications of the SL64 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.1

1.1.1.1.621 Power Consumption


The maximum power consumption of the N1SL64 at room temperature (25C) is 30 W.
The maximum power consumption of the N2SL64 at room temperature (25C) is 32 W.
The maximum power consumption of the N4SL64 at room temperature (25C) is 15 W.

10.23 SLD64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLD64 (2xSTM-64 optical interface board). This topic also
describes how to configure and commission the SLD64.

10.23.1 Version Description


The SLD64 is available in the following functional versions: N1 and N4.
Table 10-130 describes the versions of the SLD64.
Figure 1.1 Versions of the SLD64
Item

Description

Functional versions

The SLD64 is available in the following functional versions: N1


and N4.

Differences

Interface specifications:

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Item

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Description

The N4SLD64 supports CWDM and DWDM colored optical


interfaces, whereas the N1SLD64 does not.

The N4SLD64 supports single-fiber bidirectional optical


modules, whereas the N1SLD64 does not.

Others:

Substitution

The N4SLD64 detects and reports voltage performance, whereas


the N1SLD64 does not.

The N4SLD64 supports the PRBS function, whereas the


N1SLD64 does not.

None

10.23.2 Application
The SLD64 is a line board. The SLD64 can be used on the OptiX OSN equipment series to
transmit and receive STM-64 optical signals. The SLD64 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SLD64 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-77 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.23.3 Functions and Features


The SLD64 receives and transmits 2xSTM-64 optical signals, processes overhead bytes, and
performs the MSP protection.
Table 10-131 describes the functions and features of the SLD64.

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Figure 1.2 Functions and features of the SLD64


Function and
Feature

SLD64

Basic functions

Provides two optical interfaces to transmit and receive 2xSTM-64


optical signals. Processes 2xSTM-64 standard services or
concatenated services, which are encapsulated in XFP format.

Specifications of
the optical
interface

Supports different types of standard optical interfaces, namely, the I64.1 and S-64.2b. The characteristics of the optical interfaces comply
with ITU-T G.691.
The N4SLD64 provides standard P1L1-2D2 optical ports, whose
specifications comply with ITU-T G.959.
The N4SLD64 supports the CWDM and DWDM colored optical
interfaces. The optical interface uses the LC connector. The CWDM
optical interface supports the transmission distance of 70 km, and the
DWDM optical interface supports the transmission distances of 80
km.

Specifications of
the optical module

Supports the query of the manufacturing information of the


optical module. The SLD64 also reports the performance events
that indicate the performance of the optical module.

Supports the default off state of the laser, and the setting and
query of the on/off state of the laser.

Supports the usage and detection of the XFP optical module,


therefore facilitating maintenance of the optical module.

Service processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, VC-4-16c
concatenation services, and VC-4-64c concatenation services.

Overhead
processing

Processes the section overheads of the STM-64 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports two channels of ECC communication.

Alarms and
performance events

Reports various alarms and performance events.

Specifications of
the REG

Does not support the REG.

Protection schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

Supports the SNCTP.

Supports the fiber-shared virtual trail protection.

Supports the fiber-shared MSP and processes four sets of K bytes.


A single optical interface can process two sets of K bytes. One

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SLD64
SLD64 supports a maximum of four MSP rings.

Maintenance
features

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

The N4SLD64 supports detection and query of the voltage.

The N4SLD64 supports the PRBS function in the line direction


and Cause by Cross function.

10.23.4 Working Principle and Signal Flow


The SLD64 consists of the O/E converting module, MUX/DEMUX module, SDH overhead
processing module, logic and control module, and power module.
Figure 10-78 shows the functional block diagram of the SLD64.
Figure 1.1 Functional block diagram of the SLD64
Backplane
622 MHz

9.953
Gbit/s

O/E

SPI 9.953
E/O
Gbit/s

DEMUX 16x622
Mbit/s

. .
. .

9.953
Gbit/s

O/E

9.953
SPI Gbit/s

MUX

16x622
Mbit/s

E/O
O/E
converting
module

622 MHz
PLL

Reference clock

Cross-connect
unit

K1 and K2

Cross-connect
unit

K1 and K2
insertion/extraction

High-speed
bus
RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/
DEMUX
IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse

Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section

MST: multiplex section

MSA: multiplex section

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termination

termination

adaptation

HPT: higher order path


termination

1.1.1.1.622 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.623 MUX/DEMUX Module

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

1.1.1.1.624 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module detects K2 bytes, and upon errors,
generates MS_AIS or MS_RDI alarms; it also verifies B2 bytes, and upon errors,
generates B2_SD or B2_EXC alarms and sends MS_REI signals to its opposite end.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

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In the receive direction, the HPT sub-module terminates the path overhead (POH).
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That is, the HPT sub-module verifies B3 bytes, and upon errors, sends HP_REI
signals to its opposite end; it also detects J1 and C2 bytes, and upon errors, generates
HP_TIM, HP_SLM, or HP_UNEQ (if VC-4 paths are unloaded) alarms.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.625 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.626 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.23.5 Front Panel


The front panel of the SLD64 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.627 Diagram of the Front Panel


Figure 10-79 shows the appearance of the front panel of the SLD64.

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Figure 1.1 Front panel of the SLD64

SLD64
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1

IN1
OUT2

IN2

SLD64

1.1.1.1.628 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.629 Interfaces
The front panel of the SLD64 has two optical interfaces. Table 10-132 describes the types and
usage of the optical interfaces of the SLD64.

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Figure 1.1 Optical interfaces of the SLD64


Interface

Type of Interface

Usage

IN1IN2

LC

Receives optical signals.

OUT1OUT2

LC

Transmits optical signals.

10.23.6 Jumpers and DIP Switches


The SLD64 does not have any jumpers or DIP switches that are used for board settings.

10.23.7 Valid Slots


The SLD64 must be installed in a valid slot in the subrack. Otherwise, the SLD64 fails to
work normally.
The SLD64 can be installed in slots 7, 8, 11, and 12.

10.23.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLD64 indicates the type of optical interface.
Table 10-133 describes the relationship between the feature code of the SLD64 and the type
of optical interface.
Figure 1.2 Relationship between the feature code of the SLD64 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SLD6401

01

I-64.1

SSN1SLD6402

02

S-64.2b

10.23.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.630 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
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Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.631 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.632 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.633 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End
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10.23.10 Parameter Settings


You can set the parameters for the SLD64 by using the U2000.
You can set the following parameters for the SLD64 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.23.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.634 Troubleshooting
Table 10-134 lists the faults that occur on the SLD64 frequently and the troubleshooting
methods.
The SLD64 uses the XFP optical module. When the SLD64 operates and an abnormal alarm occurs on
the optical interface, check whether the optical module is properly installed. To check whether the
optical module is properly installed, you can re-seat the optical module.

Figure 1.1 Methods used to troubleshoot the faults that occur on the SLD64 frequently
Fault Symptom

Common Fault
Cause

Service interruption

The optical fiber


or connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

Bit error

Pointer justification

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

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Fault Symptom

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Common Fault
Cause

Protection switching
failure

NEs being
unreachable to the

Equipment
interconnection fault

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become
unreachable to
the .

An NE becomes
unreachable to
the frequently.

An SDH overhead
interconnection fault
occurs.

Troubleshooting Method

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

See Troubleshooting Device Interconnection


Faults.

1.1.1.1.635 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLD64, see Replacing an SDH Board.

10.23.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

10.23.12.1 Alarms of N1SLD64


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

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BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FSELECT_STG

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FPGA_ABN

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_NO_FITED

LP_UNEQ_VC3

LSR_COOL_ALM

MS_RDI

LSR_WILL_DIE

MS_AIS

R_LOF

MS_REI

NO_BD_SOFT

SPARE_PATH_ALM

OH_LOOP

OUT_PWR_ABN

TEM_LA

POWER_ABNORMAL

R_LOC

TF

R_LOS

SLAVE_WORKING

TU_AIS_VC3

T_LOSEX

TEM_HA

W_R_FAIL

TEMP_OVER

TEST_STATUS

PATCH_NOT_CONFIRM

TR_LOC

TU_AIS_VC12

TIME_NOT_SUPPORT

TU_LOP_VC12

TU_LOP_VC3

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

PATCH_ERR

PS

MOD_TYPE_MISMATCH

IN_PWR_LOW

IN_PWR_HIGH

WRG_BD_TYPE

DCN_FAIL

10.23.12.2 Alarms of N4SLD64


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

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BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FPGA_ABN

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_INVALID

LP_UNEQ_VC3

LSR_COOL_ALM

MOD_TYPE_MISMATCH

LSR_NO_FITED

LSR_WILL_DIE

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

OUT_PWR_ABN

R_LOC

POWER_ABNORMAL

PATCHFILE_NOTEXIST

R_OOF

R_LOF

PS

T_LOSEX

SLAVE_WORKING

R_LOS

TEMP_OVER

TEM_HA

SPARE_PATH_ALM

TIME_NOT_SUPPORT

TEST_STATUS

TEM_LA

TU_AIS_VC3

TR_LOC

TF

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

TU_LOP_VC3

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.23.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

10.23.13.1 Performance Events of N1SLD64


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

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HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.23.13.2 Performance Events of N4SLD64


RSBBE

RSES

RSSES

RSUAS

RSCSES

INVOLTCUR

RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

INVOLTMAX

INVOLTMIN

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10.23.14 Technical Specifications of SLD64


The technical specifications of the SLD64 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.636 Parameters Specified for Optical Interfaces


Table 10-135 lists the parameters specified for the optical interfaces of the SLD64.
SLD64 boards only of the N4 version support P1L1-2D2 interfaces.

Figure 1.1 Parameters specified for the optical interfaces of the SLD64
Parameter

Value

Nominal bit rate

9953280 kbit/s

Line code type

NRZ

Application code

I-64.1

S-64.2b

P1L1-2D2

Transmission distance
(km)

0 to 2

2 to 40

40 to 80

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Operating wavelength
range (nm)

1290 to 1330

1530 to 1565

1530 to 1565

Mean launched optical


power (dBm)

-6 to -1

-1 to +2

0 to 4

Receiver sensitivity
(dBm)

-11

-14

-24

Minimum overload
(dBm)

-1

-1

-7

Minimum extinction ratio


(dB)

8.2

Dispersion tolerance
(ps/nm)

6.6

800

1600

Minimum side mode


suppression ratio (dB)

30

30

30

Maximum -20 dB
spectral width (nm)

Table 10-136 and Table 10-137 list the parameters specified for the colored optical interfaces
of the N4SLD64.

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Figure 1.2 CWDM parameters specified for the colored optical interfaces of the N4SLD64
Parameter

Value
CWDM

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission distance
(km)

70

Launched optical power


range (dBm)

0 to 4

Operating wavelength
range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

1451 to 1551 nm: -23

1571 nm: -22

1591 to 1611 nm: -21

Minimum overload (dBm)

-9

Maximum allowed
dispersion (ps/nm)

1400

Minimum extinction ratio


(dB)

8.2

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

Figure 1.3 DWDM parameters specified for the colored optical interfaces of the N4SLD64
Parameter

Value
DWDM

Nominal bit rate

9953280 kbit/s

Type of fiber

Single-mode LC

Transmission distance
(km)

80

Launched optical power


range (dBm)

-1 to 3

Central frequency (THz)

192.1 to 196.0

Central frequency
deviation (GHz)

10

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Parameter

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Value
DWDM

Receiver sensitivity
(dBm)

-24

Minimum overload
(dBm)

-9

Maximum allowed
dispersion (ps/nm)

1600

Minimum extinction
ratio (dB)

8.2

Maximum -20 dB
spectral width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

1.1.1.1.637 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.638 Mechanical Specifications


The mechanical specifications of the SLD64 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.2

1.1.1.1.639 Power Consumption


The maximum power consumption of the N1SLD64 at room temperature (25C) is 41 W.
The maximum power consumption of the N4SLD64 at room temperature (25C) is 20 W.

10.24 SF64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SF64 (1xSTM-64 optical interface board with the FEC
function). This topic also describes how to configure and commission the SF64.

10.24.1 Version Description


The SF64 is available in the following functional versions: N1 and N4.
Table 10-138 describes the versions of the SF64.

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Figure 1.1 Versions of the SF64


Item

Description

Functional versions

The SF64 is available in two functional versions, namely, N1 and


N4.

Differences

Specifications of optical interfaces: DWDM colored optical


interfaces.

Specifications of optical modules: pluggable XFP optical


modules.

Maintenance features: voltage monitoring and reporting, and


PRBS function.

Substitution

The N4SF64 supports the board version replacement function to


substitute for the N1SF64.

10.24.2 Application
The SF64 is a line board. The SF64 can be used on the OptiX OSN equipment series to
transmit and receive STM-64 optical signals. The SF64 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SF64 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-80 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

The SF64 can be interconnected with the WDM equipment.

10.24.3 Functions and Features


The SF64 receives and transmits 1xSTM-64 optical signals and processes overhead bytes.
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Table 10-139 describes the functions and features of the SF64.


Figure 1.2 Functions and features of the SF64
Function and
Feature

SF64

Basic functions

Transmits and receives 1xSTM-64 optical signals.

Supports the enabling or disabling of the FEC function.

Supports different types of standard optical interfaces, namely, the


Ue-64.2c, Ue-64.2d, and Ue-64.2e. The characteristics of the
optical interfaces comply with the standards defined by Huawei.

Supports the output of the standard wavelengths that comply with


ITU-T G.692 and can be directly connected to the DWDM
equipment.

The N1SF64/N4SF64 supports the DWDM colored optical


interfaces. The optical interface uses the LC connector. The
DWDM optical interface supports the transmission distance of 40
km.

Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

The N4SF64 supports the usage and detection of the XFP optical
module, therefore facilitating maintenance of the optical module.

Specifications of
the optical
interface

Specifications of
the optical module

Service processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, VC-4-16c
concatenation services, and VC-4-64c concatenation services.

Overhead
processing

Processes the section overheads of the STM-64 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one channel of ECC communication.

Alarms and
performance events

Reports various alarms and performance events.

Specifications of
the REG

Supports the setting and query of the REG working mode.

Protection schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

Supports the SNCTP.

Supports the fiber-shared virtual trail protection.

Supports the fiber-shared MSP and processes two sets of K bytes.

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Function and
Feature

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SF64
One SF64 supports a maximum of two MSP rings.

Maintenance
features

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the press-to-collect function in fault data collection.

The N4SF64 supports detection and query of the voltage.

The N4SF64 supports the PRBS function in the line direction and
Cause by Cross function.

10.24.4 Working Principle and Signal Flow


The SF64 consists of the O/E converting module, MUX/DEMUX module, FEC module, SDH
overhead processing module, logic and control module, and power module.
Figure 10-81 shows the functional block diagram of the SF64.
Figure 1.1 Functional block diagram of the SF64
622 MHz
622 MHz
PLL
10.71
Gbit/s

10.71
Gbit/s

O/E

DEMU 16x669
X
Mbit/s

SPI
10.71
Gbit/s

E/O
O/E
converting
module

10.71
Gbit/s

MUX

16x622
Mbit/s

FEC 16x622
16x669
Mbit/s
Mbit/s

622 MHz
PLL

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/DE
MUX
669 MHz
PLL

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse
Fuse +3.3 V

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60
V
-48 V/-60 V
+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

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HPT: higher order path


termination

10 SDH Boards

1.1.1.1.640 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.641 MUX/DEMUX Module

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

1.1.1.1.642 FEC Module

In the upstream direction, the reverse process is performed. The FEC encoding and
decoding module receives the 2.666 Gbit/s signals from the DEMUX module. After
frame searching, FEC encoding, data packets encapsulation, and scrambling in the FEC
module, the 2.488 Gbit/s signals are recovered and then transmitted to the SDH overhead
processing module. The frame format of the 2.666 Gbit/s signals complies with ITU
G.709.

In the downstream direction, the FEC encoding and decoding module receives 2.488
Gbit/s SDH signals, which are sent by the SDH overhead processing module. After
frame searching, FEC encoding, data packet encapsulation, and scrambling, the 2.488
Gbit/s SDH signals are converted into 2.666 Gbit/s signals and then transmitted to the
MUX module.

The FEC processing module is connected to the logic and control module through a CPU
bus. The CPU controls the working modes of the FEC module by configuring the
internal register. The working mode can be the regenerator mode, namely, REG mode.
The CPU can monitor the performance through the internal register.

1.1.1.1.643 SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

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In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module detects K2 bytes, and upon errors,
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generates MS_AIS or MS_RDI alarms; it also verifies B2 bytes, and upon errors,
generates B2_SD or B2_EXC alarms and sends MS_REI signals to its opposite end.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the AUG, divides an
AUG into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs
pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module verifies B3 bytes, and upon errors, sends HP_REI
signals to its opposite end; it also detects J1 and C2 bytes, and upon errors, generates
HP_TIM, HP_SLM, or HP_UNEQ (if VC-4 paths are unloaded) alarms.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.644 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.645 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.24.5 Front Panel


The front panel of the SF64 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.646 Diagram of the Front Panel


Figure 10-82 shows the appearance of the front panel of the N1SF64.

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Figure 1.1 Front panel of the N1SF64

SF64
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT

IN

SF64

Figure 10-83 shows the appearance of the front panel of the N4SF64.

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Figure 1.2 Front panel of the N4SF64

SF64
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

OUT

IN

SF64

1.1.1.1.647 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.648 Interfaces
The front panel of the SF64 has one optical interface. Table 10-140 describes the types and
usage of the optical interfaces of the SF64.

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Figure 1.1 Optical interfaces of the SF64


Interface

Type of Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.24.6 Jumpers and DIP Switches


The SF64 does not have any jumpers or DIP switches that are used for board settings.

10.24.7 Valid Slots


The SF64 must be installed in a valid slot in the subrack. Otherwise, the SF64 fails to work
normally.
The slots valid for the SF64 are as follows:

The N1SF64 can be installed in slots 7, 8, 11, and 12.

The N4SF64 can be installed in slots 5-6, 7-8, 11-12, and 13-14.

10.24.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SF64 indicates the type of optical interface.
Table 10-141 provides the relationship between the feature code of the SF64 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SF64 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1SF6400,
SSN4SF6400

00

Fixed-wavelength optical
interface

SSN1SF6401,
SSN4SF6401

01

Ue-64.2c, Ue-64.2d, and Ue64.2e

10.24.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.649 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

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All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.650 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.651 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.652 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
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Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.24.10 Parameter Settings


You can set the parameters for the SF64 by using the U2000.
You can set the following parameters for the SF64 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.24.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.653 Troubleshooting
Table 10-142 lists the faults that occur on the SF64 frequently and the troubleshooting
methods.
The N4SF64 uses the XFP optical module. When the N4SF64 operates and an abnormal alarm occurs on
the optical interface, check whether the optical module is properly installed. To check whether the
optical module is properly installed, you can re-seat the optical module.

Figure 1.1 Methods used to troubleshoot the faults that occur on the SF64 frequently
Fault Symptom

Common Fault
Cause

Service interruption

The optical fiber


or connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes

Bit error

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See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

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Fault Symptom

Common Fault
Cause

10 SDH Boards

Troubleshooting Method

abnormal.

Pointer justification

Protection switching
failure

NEs being
unreachable to the

Equipment
interconnection fault

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become
unreachable to
the .

An NE becomes
unreachable to
the frequently.

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

See Troubleshooting Device Interconnection


Faults.

1.1.1.1.654 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SF64, see Replacing an SDH Board.

10.24.12 List of Alarms


This topic lists the alarms that may occur when the board operates.

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10.24.12.1 Alarms of N1SF64


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP_SD

BEFFEC_EXC

BIP_EXC

C2_VCAIS

BIP8_ECC

C2_PDI

FEC_LOF

CHIP_FAIL

COMMUN_FAIL

FSELECT_STG

FEC_OOF

FPGA_ABN

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LASER_MOD_ERR

IN_PWR_ABN

J0_MM

LP_RDI_VC12

LASER_SHUT

LOOP_ALM

LP_REI_VC3

LP_RDI_VC3

LP_REI_VC12

LP_TIM_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LSR_WILL_DIE

LSR_COOL_ALM

LSR_NO_FITED

MS_REI

MS_AIS

MS_RDI

ODU_AIS

NO_BD_SOFT

ODU_OCI

OH_LOOP

ODU_LCK

OTU_LOF

OTU_LOM

OTU_AIS

PM_BIP8_OVER

PM_BDI

OUT_PWR_ABN

POWER_ABNORMAL

PM_BIP8_SD

PM_BEI

R_LOS

R_LOC

PM_TIM

SM_BDI

R_OOF

R_LOF

SM_BIP8_SD

SM_BEI

SLAVE_WORKING

SPARE_PATH_ALM

SM_IAE

SM_BIP8_OVER

TC_EXC

T_LOSEX

SM_TIM

TC_ODI

TC_INCAIS

TC_DEG

TC_REI

TC_OEI

TC_LTC

TEM_HA

TC_TIM

TC_RDI

TF

TEM_LA

TC_UNEQ

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TU_AIS_VC3

TR_LOC

TEST_STATUS

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

PATCHFILE_NOTEXIST

PATCH_ERR

TU_LOP_VC3

CHIP_ABN

TEMP_OVER

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

PS

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

MOD_TYPE_MISMATCH

10.24.12.2 Alarms of N4SF64


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FPGA_ABN

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_INVALID

LP_UNEQ_VC3

LSR_COOL_ALM

MOD_TYPE_MISMATCH

LSR_NO_FITED

LSR_WILL_DIE

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

OUT_PWR_ABN

R_LOC

POWER_ABNORMAL

PATCHFILE_NOTEXIST

R_OOF

R_LOF

PS

T_LOSEX

SLAVE_WORKING

R_LOS

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TEMP_OVER

TEM_HA

SPARE_PATH_ALM

TIME_NOT_SUPPORT

TEST_STATUS

TEM_LA

TU_AIS_VC3

TR_LOC

TF

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

FEC_OOF

BEFFEC_EXC

TU_LOP_VC3

ODU_OCI

ODU_AIS

FEC_LOF

OTU_LOM

OTU_AIS

ODU_LCK

PM_BIP8_OVER

PM_BDI

OTU_LOF

SM_BDI

PM_BIP8_SD

PM_BEI

SM_BIP8_SD

SM_BEI

PM_TIM

SM_TIM

SM_IAE

SM_BIP8_OVER

10.24.13 List of Performance Events


This topic lists the performance events that may occur when the board operates.

10.24.13.1 Performance Events of N1SF64


AUPJCHIGH

AUPJCLOW

AUPJCNEW

FEC_AFT_COR_ER

FEC_BEF_COR_ER

FEC_COR_0BIT_CNT

FEC_COR_1BIT_CNT

FEC_COR_BYTE_CNT

FEC_UNCOR_BLOCK_CNT

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

ODU2PMBIP8

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

OTU2SMBIP8

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TCBBE

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TCFEBBE

TCOBBE

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.24.13.2 Performance Events of N4SF64


RSBBE

RSES

RSSES

RSUAS

RSCSES

ODU2PMBIP8

RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

INVOLTMAX

INVOLTMIN

INVOLTCUR

FEC_COR_0BIT_CNT

FEC_COR_1BIT_CNT

FEC_COR_BYTE_CNT

FEC_UNCOR_BLOCK_CN
T

FEC_BEF_COR_ER

FEC_AFT_COR_ER

OTU2SMBIP8

10.24.14 Technical Specifications of SF64


The technical specifications of the SF64 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.655 Parameters Specified for Optical Interfaces


Table 10-143 lists the parameters specified for the optical interfaces of the SF64.
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Figure 1.1 Specifications of optical interfaces of the SF64


Parameter

Value

Nominal bit
rate

10709225kbit/s

Line code type

NRZ

Application
code

Ue-64.2c

Ue-64.2d

Ue-64.2e

FEC + BA (14 dB)


+ PA + DCU (60 +
80)

FEC + BA (17 dB) + PA


+ DCU (80 x 2)

FEC + BA (17 dB) +


RA + PA + DCU (60
x 3)

Operating
wavelength
range (nm)

1550.12

Type of fiber

Single-mode LC

Launched
optical power
range (dBm)

-3 to 2

Receiver
sensitivity
(dBm)

-14

Minimum
overload (dBm)

-1

Minimum
extinction ratio
(dB)

10

Maximum
allowed
dispersion
(ps/nm)

800

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

NOTE
The numbers in the brackets indicate the corresponding parameter values. For example, "BA (14 dB)"
indicates that the optical power amplified by the BA is 14 dBm. "FEC + BA + PA + RA" indicates that
the specifications of the optical interface are measured when the FEC, BA, PA, and Raman amplifier are
used.
The parameters are only for the optical modules. The parameters of the amplifier are not provided.

Table 10-144 lists the parameters specified for the colored optical interfaces of the SF64.
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Figure 1.2 Parameters specified for the colored optical interfaces of the SF64
Parameter

Value
DWDM

Nominal bit rate

10709225 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

40

Launched optical power range (dBm)

-4 to -1

Central frequency (THz)

192.1 to 196.0

Central frequency deviation (GHz)

12.5

Receiver sensitivity (dBm)

-14

Minimum overload (dBm)

-1

Maximum allowed dispersion (ps/nm)

800

Minimum extinction ratio (dB)

10

Maximum -20 dB spectral width (nm)

0.3

Minimum side mode suppression ratio


(dB)

35

Optical signal-to-noise ratio (dB)

With the FEC: 20


Without the FEC: 22

1.1.1.1.656 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.657 Mechanical Specifications


The mechanical specifications of the SF64 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1SF64 (kg): 1.1

Weight of the N4SF64 (kg): 1.2

1.1.1.1.658 Power Consumption

At room temperature (25C), the maximum power consumption of the N1SF64 is 33 W.

At room temperature (25C), the maximum power consumption of the N4SF64 is 26 W.

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10.25 SF64A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the SF64A (1xSTM-64 optical interface board with the FEC
function).

10.25.1 Version Description


The SF64A is available in one functional version, namely, N1.

10.25.2 Application
The SF64A is a line board. The SF64A can be used on the OptiX OSN equipment series to
transmit and receive STM-64 optical signals. The SF64A converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SF64A converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
The SF64A can also be used for interconnecting with the WDM equipment.
Figure 10-84 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

The SF64A can also be used for interconnecting with the WDM equipment.

10.25.3 Functions and Features


The SF64A receives and transmits 1xSTM-64 optical signals and processes overhead bytes.
Table 10-145 provides the functions and features of the SF64A.

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Figure 1.1 Functions and features of the SF64A


Function and
Feature

SF64A

Basic functions

Transmits and receives 1xSTM-64 optical signals.

Supports the enabling or disabling of the FEC function.

Supports different types of standard optical interfaces, namely, the


Ue-64.2c, Ue-64.2d, and Ue-64.2e. The characteristics of the
optical interfaces comply with the standards defined by Huawei.

Supports the output of the standard wavelengths that comply with


ITU-T G.692 and can be directly connected to the DWDM
equipment. Supports the variable-wavelength DWDM.

Supports the DWDM colored optical interfaces. The optical


interface uses the LC connector. The DWDM optical interface
supports the transmission distance of 40 km.

Supports the detection and query of the information about the


optical module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

Specifications of
the optical
interface

Specifications of
the optical module

Service processing

Supports the VC-12 services, VC-3 services, VC-4 services, VC-4-4c


concatenation services, VC-4-8c concatenation services, VC-4-16c
concatenation services, and VC-4-64c concatenation services.

Overhead
processing

Processes the section overheads of the STM-64 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one channel of ECC communication.

Alarms and
performance events

Reports various alarms and performance events.

Specifications of
the REG

Supports the setting and query of the REG working mode.

Protection schemes

Supports the two-fiber ring MSP, four-fiber ring MSP, linear MSP,
SNCP, SNCTP, and SNCMP.

Supports the fiber-shared MSP and SNCP and processes two sets
of K bytes. One SF64A supports a maximum of two MSP
protection rings.

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Maintenance
features

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Function and
Feature

10 SDH Boards

SF64A

Supports the press-to-collect function in fault data collection.

10.25.4 Working Principle and Signal Flow


The SF64A consists of the O/E converting module, MUX/DEMUX module, FEC module,
SDH overhead processing module, logic and control module, power module.
Figure 10-85 shows the functional block diagram of the SF64A.
Figure 1.1 Functional block diagram of the SF64A
622 MHz
622 MHz
PLL
10.71
Gbit/s

10.71
Gbit/s

O/E
SPI

10.71
Gbit/s

E/O
O/E
converting
module

16x622
Mbit/s

DEMU 16x669
X
Mbit/s

10.71
Gbit/s

MUX

FEC 16x622
16x669
Mbit/s
Mbit/s

622 MHz
PLL

Backplane
Reference clock
Cross-connect
unit

K1 and K2
insertion/extraction

K1 and K2
High-speed
bus

RST MST MSA HPT

High-speed
bus
DCC

SDH overhead
processing module

MUX/DE
MUX
669 MHz
PLL

IIC
LOS
Laser shutdown

Logic and
control module
+3.3 V
Power
module

Power
module

Frame header
Communication
Fuse
Fuse +3.3 V

Cross-connect
unit
Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60
V
-48 V/-60 V
+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

IIC: inter-integrated circuit

The functional modules are described as follows:

1.1.1.1.659 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

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1.1.1.1.660 CDR Module


This module restores the clock signal.

1.1.1.1.661 FEC Module

In the downstream direction, the FEC encoding and decoding module receives 2.488
Gbit/s SDH signals, which are sent by the SDH overhead processing module. After
frame searching, FEC encoding, data packet encapsulation, and scrambling, the 2.488
Gbit/s SDH signals are converted into 2.666 Gbit/s signals and then transmitted to the
MUX module.

In the upstream direction, the reverse process is performed. The FEC encoding and
decoding module receives the 2.666 Gbit/s signals from the DEMUX module. After
frame searching, FEC encoding, data packets encapsulation, and scrambling in the FEC
module, the 2.488 Gbit/s signals are recovered and then transmitted to the SDH overhead
processing module. The frame format of the 2.666 Gbit/s signals complies with ITU
G.709.

The FEC processing module is connected to the logic and control module through a CPU
bus. The CPU controls the working modes of the FEC module by configuring the
internal register. The working mode can be the regenerator mode, namely, REG mode.
The CPU can monitor the performance through the internal register.

1.1.1.1.662 SDH Overhead Processing Module


This module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

In the receive direction, the RST sub-module terminates the RSOH. That is, the RST
sub-module detects the frame alignment bytes (A1 and A2), descrambles all the bytes
except the first line of the RSOH, restores and checks the J0 byte, and checks the B1
byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the MSOH. That is, the
MST sub-module generates the MS_AIS alarm and detects the MS_RDI alarm after
detecting the K2 byte, and detects the MS_REI alarm and generates the B2_EXC
alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the AUG, divides an
AUG into N AU-4s, detects the AU_LOP alarm and the AU_AIS alarm, and performs
pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

Issue 02 (2013-01-18)

In the receive direction, the HPT sub-module terminates the POH. That is, the HPT
sub-module detects the HP_REI alarm after checking the B3 byte, generates the
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HP_TIM alarm and the HP_SLM alarm and detects the HP_RDI alarm after detecting
the J1 and C2 bytes, and generates the HP_UNEQ alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.663 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.664 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.25.5 Front Panel


The front panel of the SF64A has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.665 Diagram of the Front Panel


Figure 10-86 shows the appearance of the front panel of the SF64A.

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Figure 1.1 Front panel of the SF64A

SF64A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT

IN

SF64A

1.1.1.1.666 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.667 Interfaces
The front panel of the SF64A has one optical interface. Table 10-146 describes the types and
usage of the optical interfaces of the SF64A.

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Figure 1.1 Optical interfaces of the SF64A


Interface

Type of
Interface

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

10.25.6 Valid Slots


The slots valid for the SF64A vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SF64A are as follows:

When the cross-connect capacity is 200 Gbit/s, the SF64A can be installed in slots 7, 8,
11, and 12.

10.25.7 Parameter Settings


You can set the parameters for the SF64A by using the U2000.
You can set the following parameters for the SF64A by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.25.8 Technical Specifications of SF64A


The technical specifications of the SF64A include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.668 Parameters Specified for Optical Interfaces


Table 10-147 lists the parameters specified for the optical interfaces of the SF64A.
Figure 1.1 Specifications of optical interfaces of the SF64A
Parameter

Value

Nominal bit rate

10709225 kbit/s

Line code type

DRZ

Application code

Ue-64.2c

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Parameter

Value

Meaning of the
code

FEC + BA (14 dB)


+ PA + DCU (60 +
80)

FEC + BA (17 dB) +


PA + DCU (80 x 2)

FEC + BA (17 dB) +


RA + PA + DCU (60
x 3)

Operating
wavelength range
(nm)

1550.12

1550.12

1550.12

Type of fiber

Single-mode LC

Launched optical
power range
(dBm)

-4 to -1

-4 to -1

-4 to -1

Receiver
sensitivity (dBm)

-14

-14

-14

Minimum
overload (dBm)

-1

-1

-1

Minimum
extinction ratio
(dB)

10

10

10

Dispersion
tolerance (ps/nm)

800

800

800

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

30

30

NOTE
The numbers in the brackets indicate the corresponding parameter values. For example, "BA (14 dB)"
indicates that the optical power amplified by the BA is 14 dBm. "FEC + BA + PA + RA" indicates that
the specifications of the optical interface are measured when the FEC, BA, PA, and Raman amplifier
(RA) are used.
The parameter values are applicable only to the optical modules. The parameter values of the amplifier
and dispersion compensation unit (DCU) are not provided.

Table 10-148 list the parameters specified for the colored optical interfaces of the SF64A.
Figure 1.2 Parameters specified for the colored optical interfaces of the SF64A
Parameter

Value
DWDM

Nominal bit rate

10709225 kbit/s

Type of fiber

Single-mode LC

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Parameter

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Value
DWDM

Transmission distance (km)

40

Launched optical power range (dBm)

-4 to -1

Central frequency (THz)

192.1 to 196.0

Central frequency deviation (GHz)

12.5

Receiver sensitivity (dBm)

-14

Minimum overload (dBm)

-1

Maximum allowed dispersion (ps/nm)

800

Minimum extinction ratio (dB)

10

Maximum -20 dB spectral width (nm)

0.3

Minimum side mode suppression ratio


(dB)

35

Optical signal-to-noise ratio (dB)

With the FEC: 20


Without the FEC: 22

1.1.1.1.669 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.670 Mechanical Specifications


The mechanical specifications of the SF64A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.1

1.1.1.1.671 Power Consumption


At room temperature (25C), the maximum power consumption of the SF64A is 33 W.

10.26 SFD64
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SFD64 (2xSTM-64 optical interface board with the FEC
function). This topic also describes how to configure and commission the SFD64.

10.26.1 Version Description


The SFD64 is available in one functional version, namely, N4.
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10.26.2 Application
The SFD64 is a line board. The SFD64 can be used on the OptiX OSN equipment series to
transmit and receive STM-64 optical signals. The SFD64 converts the received optical signals
into electrical signals and sends the electrical signals to the cross-connect side. In addition, the
SFD64 converts the electrical signals sent from the cross-connect side into optical signals and
transmits the optical signals.
Figure 10-87 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

The SFD64 can also be used for interconnecting with the WDM equipment.

10.26.3 Functions and Features


The SFD64 receives and transmits 2xSTM-64 optical signals and processes overhead bytes.
Table 10-149 provides the functions and features of the SFD64.
Figure 1.1 Functions and features of the SFD64
Functions and
Features

Value

Basic functions

Transmits and receives 2xSTM-64 optical signals.

Enables and disables the FEC function.

Supports the optical interfaces compliant with Ue-64.2c, Ue-64.2d,


and Ue-64.2e system specifications. The optical interfaces compliant
with Ue-64.2c, Ue-64.2d, and Ue-64.2e system specifications are
defined by Huawei.

Supports the standard wavelength output compliant with ITU-T


G.692 and the direct access of the WDM equipment.

Supports the DWDM colored optical interfaces. The optical interface


uses the LC connector. The DWDM optical interface supports the

Specifications
of the optical
interface

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Value
transmission distance of 40 km.

Specifications
of the optical
module

Supports the usage and detection of the XFP optical module,


facilitating the maintenance of the optical module.

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the


function of setting the on/off state of a laser.

Service
processing

Supports VC-12/VC-3/VC-4 services, VC-4-4c, VC-4-8c, VC-4-16c,


and VC-4-64c concatenation services.

Overhead
processing

Processes the section overheads of STM-64 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports two channels of ECC communication.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

REG
specifications

Not supported.

Protection
schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

Supports the SNCTP.

Supports fiber-shared virtual trail protection.

Supports optical-path-shared MSP. Each optical interface can process


two sets of K bytes. One SFD64 can support a maximum of four
MSP rings.

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports the warm reset and cold reset. The warm reset does not
affect services.

Supports the query of the manufacturing information about a board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports detection and query of the voltage.

Supports the PRBS function in the line direction and Cause by Cross
function.

Maintenance
features

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Supports the press-to-collect function in fault data collection.

10.26.4 Working Principle and Signal Flow


The SFD64 consists of the O/E converting module, MUX/DEMUX module, FEC module,
SDH overhead processing module, logic and control module, and power module.
Figure 10-88 shows the functional block diagram of the SFD64.
Figure 1.1 Functional block diagram of the SFD64
622MHz

622 MHz PLL


10.71
Gbit/s
10.71
Gbit/s

O/E

E/O

S
P
I

10.71
Gbit/s

10.71
Gbit/s

O/E
conversion
module

DEMUX

MUX
MUX/
DEMUX
module

IIC
LOS
ALS

4x2.67
Gbit/s
4x2.67
Gbit/s

4x2.5
Gbit/s
FEC

4x2.5
Gbit/s

Reference Backplane
clock
Clock unit

622MHz PLL

Insertion and extraction


of K1 and K2

K1 and K2
Highspeed bus

RST MST MSA HPT

High-speed
bus
DCC

SDH OH processing module


669 MHz PLL
Logic and
control module
+3.3V
Power
module

Power
module

Frame header
Communication
Fuse
Fuse +3.3V

SCC unit

Cross-connect unit A
Cross-connect unit B
SCC unit

Clock unit
SCC unit
-48V/-60V
-48V/-60V
+3.3V standby
power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

1.1.1.1.672 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.673 MUX/DEMUX Module

Issue 02 (2013-01-18)

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals
into multiple parallel electrical signals, and recovers the clock signal at the same time.
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In the transmit direction, the MUX part multiplexes the parallel electrical signals
received from the SDH overhead processing module into high rate electrical signals.

1.1.1.1.674 FEC Module

In the downstream direction, the FEC encoding and decoding module receives 2.488
Gbit/s SDH signals, which are sent by the SDH overhead processing module. After
frame searching, FEC encoding, data packet encapsulation, and scrambling, the 2.488
Gbit/s SDH signals are converted into 2.666 Gbit/s signals and then transmitted to the
MUX module.

In the upstream direction, the reverse process is performed. The FEC encoding and
decoding module receives the 2.666 Gbit/s signals from the DEMUX module. After
frame searching, FEC encoding, data packets encapsulation, and scrambling in the FEC
module, the 2.488 Gbit/s signals are recovered and then transmitted to the SDH overhead
processing module. The frame format of the 2.666 Gbit/s signals complies with ITU
G.709.

The FEC processing module is connected to the logic and control module through a CPU
bus. The CPU controls the working modes of the FEC module by configuring the
internal register. The working mode can be the regenerator mode, namely, REG mode.
The CPU can monitor the performance through the internal register.

1.1.1.1.675 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module detects K2 bytes, and upon errors,
generates MS_AIS or MS_RDI alarms; it also verifies B2 bytes, and upon errors,
generates B2_SD or B2_EXC alarms and sends MS_REI signals to its opposite end.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

Issue 02 (2013-01-18)

In the receive direction, the HPT sub-module terminates the path overhead (POH).
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That is, the HPT sub-module verifies B3 bytes, and upon errors, sends HP_REI
signals to its opposite end; it also detects J1 and C2 bytes, and upon errors, generates
HP_TIM, HP_SLM, or HP_UNEQ (if VC-4 paths are unloaded) alarms.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.676 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.677 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.26.5 Front Panel


The front panel of the SFD64 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.678 Diagram of the Front Panel


Figure 10-89 shows the appearance of the front panel of the SFD64.

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Figure 1.1 Front panel of the SFD64

SFD64
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

TX1
RX1
TX2
RX2

SFD64

1.1.1.1.679 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.680 Interfaces
The front panel of the SFD64 has two optical interfaces. Table 10-150 describes the types and
usage of the optical interfaces of the SFD64.

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Figure 1.1 Description of the optical interfaces of the SFD64


Interface

Type of Interface

Usage

RX1-RX2

LC

Receives optical signals.

TX1-TX2

LC

Transmits optical signals.

10.26.6 Jumpers and DIP Switches


The SFD64 does not have any jumpers or DIP switches that are used for board settings.

10.26.7 Valid Slots


The SFD64 must be installed in a valid slot in the subrack. Otherwise, the SFD64 fails to
work normally.
The SFD64 can be installed in any of slots 7-8 and slots 11-12.

10.26.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SFD64 indicates the type of optical interface.
Table 10-151 provides the relationship between the feature code of the SFD64 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SFD64 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN4SFD6400

00

Fixed-wavelength optical
interface

SSN4SFD6401

01

Ue-64.2c, Ue-64.2d, Ue-64.2e

10.26.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.681 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
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Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.682 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.683 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.684 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End
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10.26.10 Parameter Settings


You can set the parameters for the SFD64 by using the U2000.
You can set the following parameters for the SFD64 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.26.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.685 Troubleshooting
Table 10-152 lists the faults that occur on the SFD64 frequently and the troubleshooting
methods.
The SFD64 uses the SFP optical module. When the SFD64 operates and an abnormal alarm occurs on
the optical interface, check whether the optical module is properly installed. To check whether the
optical module is properly installed, you can re-seat the optical module.

Figure 1.1 Methods used to rectify the faults that occur on the SFD64 frequently
Symptom

Common Cause

Service interruption

The optical fiber


or connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external

Bit error

Pointer justification

Issue 02 (2013-01-18)

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

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Symptom

10 SDH Boards

Common Cause

Troubleshooting Method

clock source is
very low.
Protection switching
failure

NEs being
unreachable to the
NMS

Equipment
interconnection fault

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

A single NE
becomes
unreachable to
the NMS.

All the NEs in a


subnet become
unreachable to
the NMS.

An NE becomes
unreachable to
the NMS
frequently.

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

See Troubleshooting Device Interconnection


Faults.

1.1.1.1.686 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SFD64, see Replacing an SDH Board.

10.26.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

10.26.12.1 Alarms of N4SFD64


ALM_ALS

AU_AIS

AU_CMM

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BIP8_ECC

BIP_EXC

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BIP_SD

CHIP_ABN

C2_PDI

C2_VCAIS

FPGA_ABN

CHIP_FAIL

COMMUN_FAIL

HP_RDI

FSELECT_STG

HP_LOM

HP_TIM

HP_REI

HP_SLM

J0_MM

HP_UNEQ

IN_PWR_ABN

LOOP_ALM

LASER_MOD_ERR

LASER_SHUT

LP_REI_VC12

LP_RDI_VC12

LP_RDI_VC3

LP_SLM_VC3

LP_REI_VC3

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_INVALID

LP_UNEQ_VC3

LSR_COOL_ALM

MOD_TYPE_MISMATCH

LSR_NO_FITED

LSR_WILL_DIE

MS_REI

MS_AIS

MS_RDI

OH_LOOP

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

OUT_PWR_ABN

R_LOC

POWER_ABNORMAL

PATCHFILE_NOTEXIST

R_OOF

R_LOF

PS

T_LOSEX

SLAVE_WORKING

R_LOS

TEMP_OVER

TEM_HA

SPARE_PATH_ALM

TIME_NOT_SUPPORT

TEST_STATUS

TEM_LA

TU_AIS_VC3

TR_LOC

TF

W_R_FAIL

TU_LOP_VC12

TU_AIS_VC12

FEC_OOF

BEFFEC_EXC

TU_LOP_VC3

ODU_OCI

ODU_AIS

FEC_LOF

OTU_LOM

OTU_AIS

ODU_LCK

PM_BIP8_OVER

PM_BDI

OTU_LOF

SM_BDI

PM_BIP8_SD

PM_BEI

SM_BIP8_SD

SM_BEI

PM_TIM

SM_TIM

SM_IAE

SM_BIP8_OVER

10.26.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the NMS.
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10.26.13.1 Performance Events of N4SFD64


RSBBE

RSES

RSSES

RSUAS

RSCSES

ODU2PMBIP8

RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

INVOLTMAX

INVOLTMIN

INVOLTCUR

FEC_COR_0BIT_CNT

FEC_COR_1BIT_CNT

FEC_COR_BYTE_CNT

FEC_UNCOR_BLOCK_CN
T

FEC_BEF_COR_ER

FEC_AFT_COR_ER

OTU2SMBIP8

10.26.14 Technical Specifications of SFD64


The technical specifications of the SFD64 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.687 Parameters Specified for Optical Interfaces


Table 10-153 lists the parameters specified for the optical interfaces of the SFD64.
Figure 1.1 Parameters specified for the optical interfaces of the SFD64
Parameter

Value

Nominal bit rate

10709225 kbit/s

Line code type

NRZ

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Parameter

Value

Application code

Ue-64.2c

Ue-64.2d

Ue-64.2e

Meaning of the
code

FEC + BA (14 dB)


+ PA + DCU (60 +
80)

FEC + BA (17 dB) +


PA + DCU (80 x 2)

FEC + BA (17 dB) +


RA + PA + DCU (60
x 3)

Operating
wavelength range
(nm)

1550.12

1550.12

1550.12

Type of fiber

Single-mode LC

Launched optical
power range
(dBm)

-4 to -1

-4 to -1

-4 to -1

Receiver
sensitivity (dBm)

-14

-14

-14

Minimum
overload (dBm)

-1

-1

-1

Minimum
extinction ratio
(dB)

10

10

10

Dispersion
tolerance (ps/nm)

800

800

800

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

30

30

NOTE
The numbers in the brackets indicate the corresponding parameter values. For example, "BA (14 dB)"
indicates that the optical power amplified by the BA is 14 dBm. "FEC + BA + PA + RA" indicates that
the specifications of the optical interface are measured when the FEC, BA, PA, and Raman amplifier
(RA) are used.
The parameter values are applicable only to the optical modules. The parameter values of the amplifier
and dispersion compensation unit (DCU) are not provided.

Table 10-154 lists the parameters specified for the colored optical interfaces of the SFD64.
Figure 1.2 Parameters specified for the colored optical interfaces of the SFD64
Parameter

Value
DWDM

Nominal bit rate

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10709225 kbit/s

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Parameter

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Value
DWDM

Type of fiber

Single-mode LC

Transmission distance (km)

40

Launched optical power range


(dBm)

-1 to +2

Central frequency (THz)

192.1 to 196.0

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-17

Minimum overload (dBm)

-1

Maximum allowed dispersion


(ps/nm)

800

Minimum extinction ratio (dB)

9.5

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

35

1.1.1.1.688 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.689 Mechanical Specifications


The mechanical specifications of the SFD64 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight: 1.1 kg

1.1.1.1.690 Power Consumption


At room temperature (25C), the maximum power consumption of the SFD64 is 37 W.

10.27 SLQ41
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLQ41 (4xSTM-4/STM-1 optical interface board). This topic
also describes how to configure and commission the SLQ41.

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10.27.1 Version Description


The SLQ41 is available in one functional version, namely, N3. The SLQ41 supports the autosensing of optical interfaces.

10.27.2 Application
The SLQ41 is a line board. The SLQ41 can be used on the OptiX OSN equipment series to
transmit and receive STM-1/STM-4 optical signals. The SLQ41 converts the received optical
signals into electrical signals and sends the electrical signals to the cross-connect side. In
addition, the SLQ41 converts the electrical signals sent from the cross-connect side into
optical signals and transmits the optical signals.
Figure 10-90 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.
Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.27.3 Functions and Features


The SLQ41 transmits and receives STM-1 or STM-4 optical signals, performs O/E
conversion for the STM-1 or STM-4 optical signals, extracts and inserts overhead bytes, and
generates alarm signals on the line.
Table 10-155 provides the functions and features of the SLQ41.
Figure 1.1 Functions and features of the SLQ41
Function and
Feature

SLQ41

Basic functions

Transmits and receives 4xSTM-1 or 4xSTM-4 optical signals.

Specifications of the
optical interface

The STM-1 optical module or STM-4 optical module can be used.

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When the STM-1 optical module is used, the SLQ41 supports


different types of standard optical interfaces, namely, the I-1, S1.1, L-1.1, L-1.2, and Ve-1.2. The characteristics of the optical

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SLQ41
interfaces of the I-1, S-1.1, L-1.1, and L-1.2 types comply with
ITU-T G.957. The characteristics of the optical interface of the
Ve-1.2 type comply with the standards defined by Huawei.

When the STM-4 optical module is used, the SLQ41 supports


different types of standard optical interfaces, namely, the I-4, S4.1, L-4.1, L-4.2, and Ve-4.2. The characteristics of the optical
interfaces of the I-4, S-4.1, L-4.1, and L-4.2 types comply with
ITU-T G.957. The characteristics of the optical interface of the
Ve-4.2 type comply with the standards defined by Huawei.

Supports the CWDM and DWDM colored optical interfaces. The


optical interface uses the LC connector. The CWDM optical
interface supports the transmission distance of 80 km, and the
DWDM optical interface supports the transmission distance of 120
km.
Specifications of the
optical module

Service processing

Overhead processing

Supports the detection and query of the information about the


optical module.

Supports the usage and detection of the SFP optical module,


which facilitates the maintenance and upgrading of the optical
module.

Provides the ALS function. The optical interface supports the


setting of the on/off state of a laser.

The SLQ41 supports the single-fiber bidirectional optical


module, and the single-fiber bidirectional optical module does
not support loopbacks at the optical interface by using fiber
jumpers.

When the STM-1 optical module is used, the SLQ41 supports


the VC-12 services, VC-3 services, and VC-4 services.

When the STM-4 optical module is used, the SLQ41 supports


the VC-12 services, VC-3 services, VC-4 services, and VC-4-4c
concatenation services.

Processes the section overheads of the STM-1 signals or STM-4


signals.

Supports the transparent transmission and termination of the


path overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one to four channels of ECC communication.

Alarms and
performance events

Reports various alarms and performance events, which facilitates


the management and maintenance of the equipment.

Protection schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

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SLQ41

Maintenance
features

Supports the SNCTP.

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the


board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the PRBS function in the line direction, cross-connect


direction and Cause by Cross function.

Supports the press-to-collect function in fault data collection.

10.27.4 Working Principle and Signal Flow


The SLQ41 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
This topic describes the working principle and signal flow of the SLQ41 by describing how to
process STM-1/STM-4 signals.
Figure 10-91 shows the functional block diagram of the SLQ41.
Figure 1.1 Functional block diagram of the SLQ41
Backplane
155 MHz
PLL

STM-1/
STIM-4

O/E
E/O

SPI

O/E
E/O

SPI

Cross-connect
unit

K1 and K2

Cross-connect
unit

K1 and K2
insertion/extraction

CDR

High-speed
bus

....

....

STM-1/
STIM-4

Reference clock

RST MST MSA HPT

CDR

High-speed
bus
DCC

SDH overhead
processing module

O/E converting
module

Frame header
Logic and
control module Communication

IIC
LOS
Laser shutdown

+3.3 V
Power
module

PLL: phase-locked loop


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Power
module

SPI: SDH physical interface

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Fuse

Cross-connect
unit A
Cross-connect
unit B
SCC unit

Cross-connect
unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse +3.3 V

+3.3 V backup power

SDH: synchronous digital


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hierarchy
RST: regenerator section
termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

CDR: clock data restoration

1.1.1.1.691 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.692 CDR Module


This module restores the clock signal.

1.1.1.1.693 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

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RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module
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In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.694 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.695 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.27.5 Front Panel


The front panel of the SLQ41 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.696 Diagram of the Front Panel


Figure 10-92 shows the appearance of the front panel of the SLQ41.

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Figure 1.1 Front panel of the SLQ41

SLQ41
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ41

1.1.1.1.697 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.698 Interfaces
The front panel of the SLQ41 has four optical interfaces. Table 10-156 describes the types and
usage of the optical interfaces of the SLQ41.

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Figure 1.1 Optical interfaces of the SLQ41


Interface

Type of Interface

Usage

IN1IN4

LC

Receives optical signals.

OUT1OUT4

LC

Transmits optical signals.

10.27.6 Jumpers and DIP Switches


The SLQ41 does not have any jumpers or DIP switches that are used for board settings.

10.27.7 Valid Slots


The SLQ41 must be installed in a valid slot in the subrack. Otherwise, the SLQ41 cannot
work normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

When the cross-connect capacity is 200 Gbit/s, the slots valid for the SLQ41 are as
follows:

The SLQ41 can be installed in slots 14, 15, and 16. In this case, one or two optical
interfaces can be configured.

The SLQ41 can be installed in slots 58 and 1114. In this case, one to four optical
interfaces can be configured.

10.27.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLQ41 indicates the type of optical interface.
Table 10-157 provides the relationship between the feature code of the SLQ41 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLQ41 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN3SLQ414

14

I-4

SSN3SLQ410

10

S-4.1

SSN3SLQ411

11

L-4.1

SSN3SLQ412

12

L-4.2

SSN3SLQ413

13

Ve-4.2

SSN3SLQ114

14

I-1

SSN3SLQ110

10

S-1.1

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Board

Feature Code

Type of Optical Interface

SSN3SLQ111

11

L-1.1

SSN3SLQ112

12

L-1.2

SSN3SLQ113

13

Ve-1.2

10.27.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.699 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.700 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.

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Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.701 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.702 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.27.10 Parameter Settings


You can set the parameters for the SLQ41 by using the U2000.
You can set the following parameters for the SLQ41 by using the U2000:

J0

J1

J2

C2

For the description of each parameter, see 26 Parameter Settings.

10.27.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.703 Troubleshooting
Table 10-158 lists the faults that occur on the SLQ41 frequently and the troubleshooting
methods.

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The SLQ41 uses the SFP optical module. When the SLQ41 operates and an abnormal alarm occurs on
the optical interface, check whether the optical module is properly installed. To check whether the
optical module is properly installed, you can re-seat the optical module.

Figure 1.1 Methods used to troubleshoot the faults that occur on the SLQ41 frequently
Fault Symptom

Common Fault
Cause

Service interruption

The optical fiber


or connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection
switching fails.

A single NE
becomes
unreachable to
the .

All the NEs in a


subnet become
unreachable to
the .

An NE becomes
unreachable to

Bit error

Pointer justification

Protection switching
failure

NEs being
unreachable to the

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

See Troubleshooting the NEs Being


Unreachable.

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Fault Symptom

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Common Fault
Cause

Troubleshooting Method

the frequently.
Equipment
interconnection fault

An SDH overhead
interconnection fault
occurs.

See Troubleshooting Device Interconnection


Faults.

1.1.1.1.704 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLQ41, see Replacing an SDH Board.

10.27.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

10.27.12.1 Alarms of N3SLQ41


ALM_ALS

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

C2_PDI

BIP_EXC

BIP_SD

COMMUN_FAIL

C2_VCAIS

CHIP_ABN

HP_LOM

FPGA_ABN

FSELECT_STG

HP_SLM

HP_RDI

HP_REI

IN_PWR_ABN

HP_TIM

HP_UNEQ

LASER_SHUT

J0_MM

LASER_MOD_ERR

LP_SLM_VC3

LOOP_ALM

LP_SLM_VC12

LP_UNEQ_VC12

LP_TIM_VC12

LP_TIM_VC3

LSR_NO_FITED

LP_UNEQ_VC3

LSR_COOL_ALM

MS_RDI

LSR_WILL_DIE

MS_AIS

PATCH_ERR

MS_REI

NO_BD_SOFT

R_LOF

OH_LOOP

OUT_PWR_ABN

T_LOSEX

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

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POWER_ABNORMAL

PS

R_LOS

SLAVE_WORKING

TEM_LA

TF

TU_AIS_VC12

TEM_HA

DCN_FAIL

TU_LOP_VC3

TEMP_OVER

TEST_STATUS

TR_LOC

TU_AIS_VC3

TU_LOP_VC12

SWDL_PKG_NOBDSOF
T

R_LOC

MOD_TYPE_MISMATCH

WRG_BD_TYPE

IN_PWR_HIGH

IN_PWR_LOW

10.27.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

10.27.13.1 Performance Events of N3SLQ41


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSOFS

TPLMIN

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

10.27.14 Technical Specifications of SLQ41


The technical specifications of the SLQ41 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.
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1.1.1.1.705 Parameters Specified for Optical Interfaces


The SLQ41 supports the STM-1 and STM-4 optical modules.
Table 10-159 lists the parameters specified for the optical interfaces of the SLQ41 when the
STM-1 optical module is used.
Figure 1.1 Parameters specified for the optical interfaces of the SLQ41 when the STM-1 optical module is used
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code
pattern

NRZ

Application
code

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Type of fiber

Single-mode
LC

Single-mode LC

Single-mode
LC

Single-mode LC

Single-mode LC

Operating
wavelength
range (nm)

1260 to 1360

1261 to 1360

1263 to 1360

1480 to 1580

1480 to 1580

Launched
optical power
range (dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-3 to 0

Receiver
sensitivity
(dBm)

-23

-28

-34

-34

-34

Minimum
overload (dBm)

-8

-8

-10

-10

-10

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

Table 10-160 lists the parameters specified for the optical interfaces of the SLQ41 when the
STM-4 optical module is used.

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Figure 1.2 Parameters specified for the optical interfaces of the SLQ41 when the STM-4 optical
module is used
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Application code

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Transmission
distance (km)

0 to 2

2 to 15

15 to 40

40 to 80

80 to 100

Operating
wavelength range
(nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to
1580

Type of fiber

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Singlemode LC

Mean launched
optical power
(dBm)

-15 to -8

-15 to -8

-3 to -2

-3 to -2

-3 to -2

Receiver
sensitivity (dBm)

-23

-28

-28

-28

-34

Minimum
overload (dBm)

-8

-8

-8

-8

-13

Minimum
extinction ratio
(dB)

8.2

8.2

10

10

10.5

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

30

30

Table 10-161 lists the parameters specified for the single-fiber bidirectional optical interfaces
of the SLQ41.
Figure 1.3 Parameters specified for the single-fiber bidirectional optical interfaces of the SLQ41
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Type of optical
interface

S-1.1

S-1.1

L-1.1

L-1.1

S-4.1

S-4.1

Transmission

2 to 15

2 to 15

15 to 40

15 to

2 to 15

2 to 15

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Parameter

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Value

distance (km)

40

Type of fiber

Singlemode LC

Singlemode LC

Singlemode
LC

Singlemode
LC

Singlemode LC

Singlemode LC

Operating
transmit
wavelength (nm)

1550

1310

1550

1310

1490

1310

Operating
receive
wavelength (nm)

1310

1550

1310

1550

1310

1490

Launched optical
power range
(dBm)

-15 to -8

-15 to -8

-5 to 0

-5 to 0

-9 to -3

-9 to -3

Receiver
sensitivity (dBm)

-32

-32

-32

-32

-19.5

-28

Minimum
overload (dBm)

-8

-8

-10

-10

-3

-3

Minimum
extinction ratio
(dB)

8.5

8.5

10

10

Maximum -20
dB spectral width
(nm)

Minimum side
mode
suppression ratio
(dB)

Table 10-162 and Table 10-163 list the parameters specified for the colored optical interfaces
of the SLQ41.
Figure 1.4 CWDM parameters specified for the colored optical interfaces of the SLQ41
Parameter

Value
CWDM

Nominal bit rate

155520 kbit/s or 622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

80

Launched optical power range


(dBm)

0 to 5

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Parameter

Value
CWDM

Operating wavelength range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

1600

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode suppression


ratio (dB)

30

Figure 1.5 DWDM parameters specified for the colored optical interfaces of the SLQ41
Parameter

Value
DWDM

Nominal bit rate

155520 kbit/s or 622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.10 to 196.00

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

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1.1.1.1.706 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.707 Mechanical Specifications


The mechanical specifications of the SLQ41 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.6

1.1.1.1.708 Power Consumption


The maximum power consumption of the SLQ41 at room temperature (25C) is 12 W.

10.28 SLH41
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SLH41 (16xSTM-1/STM-4 optical interface board with the
variable rate). This topic also describes how to configure and commission the SLH41.

10.28.1 Version Description


The functional version of the SLH41 is N3.

10.28.2 Application
The SLH41 is a line board. The SLH41 can be used on the OptiX OSN equipment series to
transmit and receive STM-1/STM-4 optical signals. The SLH41 converts the received optical
signals into electrical signals and sends the electrical signals to the cross-connect side. In
addition, the SLH41 converts the electrical signals sent from the cross-connect side into
optical signals and transmits the optical signals.
Figure 10-93 shows the application of the SDH processing boards. The SDH processing
boards can form a ring network or a chain network in the system.

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Figure 1.1 Networking and application of the SDH processing boards

NE1
NE2

NE4

NE3

Service flow
Line board
Cross-connect and timing board

10.28.3 Functions and Features


The SLH41 is used to transmit and receive 16xSTM-1/STM-14 optical signals, to perform
O/E conversion for the STM-1/STM-4 optical signals, to extract or insert overhead bytes, and
to report alarms generated on the line.
Table 10-164 provides the functions and features of the SLH41.
Figure 1.1 Functions and features of the SLH41
Functions and
Features

Value

Basic functions

Transmits and receives 16xSTM-1/STM-4 optical signals.

Specifications
of the optical
interface

The STM-1/STM-4 optical module can be used, which supports the


adaptive modulation (AM) technology.

When the STM-1 optical module is used, the standard S-1.1 and L1.1 optical interfaces are supported. The optical interfaces of the S1.1 and L-1.1 types comply with ITU-T G.957.

When the STM-4 optical module is used, the standard S-4.1 optical
interface is supported. The optical interface of the S-4.1 type
complies with ITU-T G.957.

Supports the CWDM and DWDM colored optical interfaces. The optical
interface uses the LC connector. The CWDM optical interface supports
the transmission distance of 80 km, and the DWDM optical interface
supports the transmission distance of 120 km.
Specifications
of the optical
module

Service
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Uses the SFP optical module.

Supports the detection and query of the information about the optical
module.

Provides the ALS function. The optical interface supports the


function of setting the on/off state of a laser.

When the STM-1 optical module is used, the SLH41 supports VC-12

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Functions and
Features

Value

processing

Overhead
processing

10 SDH Boards

services, VC-3 services, and VC-4 services.

When the STM-4 optical module is used, the SLH41 supports VC-12
services, VC-3 services, VC-4 services, and VC-4-4c concatenation
services.

Processes the section overheads of the STM-1/STM-4 signals.

Supports the transparent transmission and termination of the path


overheads.

Supports the setting and query of the J0, J1, J2, and C2 bytes.

Supports one to sixteen channels of ECC communication. The first


eight optical interfaces support the ECC communication in D1-D12
mode. The last eight optical interfaces support the ECC
communication in D4-D12 mode.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Protection
schemes

Supports the Two-fiber ring MSP.

Supports the Four-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Supports the SNCMP.

Supports the SNCTP.

Supports inloops and outloops at optical interfaces.

Supports inloops and outloops on VC-4 paths.

Supports the warm reset and cold reset. The warm reset does not
affect services.

Supports the query of the manufacturing information about a board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Supports the PRBS function in the line direction and Cause by


Cross function.

Supports the press-to-collect function in fault data collection.

Maintenance
features

10.28.4 Working Principle and Signal Flow


The SLH41 consists of the O/E converting module, CDR module, SDH overhead processing
module, logic and control module, and power module.
This topic describes the working principle and signal flow of the SLH41 by describing how to
process STM-1/STM-4 signals.
Figure 10-94 shows the functional block diagram of the SLH41.
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Figure 1.1 Functional block diagram of the SLH41


Backplane
Reference clock
Clock unit
155 MHz PLL

O/E

STM-1/
STM-4

E/O

S
P
I

E/O

S
P
I

K1 and K2
High-speed
bus

....

....
O/E

STM-1/
STM-4

Insertion and extraction of


K1 and K2

CDR

RST MST MSA HPT

High-speed
bus

CDR

DCC
SDH OH processing module

O/E
conversion module
IIC
LOS

Logic and
control module

SCC unit

Cross-connect unit A
Cross-connect unit B
SCC unit

Frame header

Clock unit

Communication

SCC unit

ALS
+3.3V
Power
module

Power
module

Fuse

-48V/-60V
-48V/-60V

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital


hierarchy

RST: regenerator section


termination

MST: multiplex section


termination

MSA: multiplex section


adaptation

HPT: higher order path


termination

1.1.1.1.709 O/E Converting Module

Converts the received optical signals into electrical signals, in the receive direction.

Converts the electrical signals into SDH optical signals, and then sends the SDH optical
signals to fibers for transmission, in the transmit direction.

The SPI detects the R_LOS alarm and provides the laser shut down function.

1.1.1.1.710 CDR Module


This module restores the clock signal.

1.1.1.1.711 SDH Overhead Processing Module


this module includes the RST, MST, MSA, and HPT sub-modules. This module provides the
inloop and outloop functions.

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RST sub-module

In the receive direction, the RST sub-module terminates the regenerator section
overhead (RSOH). That is, the RST sub-module detects the frame alignment bytes
(A1 and A2), descrambles all the bytes except the first line of the RSOH, restores and
checks the regenerator section trace byte (J0), and checks the B1 byte.

In the transmit direction, the RST sub-module generates the RSOH. That is, the RST
sub-module writes bytes such as A1, A2, and J0, calculates and writes the B1 byte,
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and scrambles all the bytes except the first line of the RSOH.

MST sub-module

In the receive direction, the MST sub-module terminates the multiplex section
overhead (MSOH). That is, the MST sub-module generates the multiplex sectionalarm indication signal (MS_AIS) alarm and detects the multiplex section-remote
defect indication (MS_RDI) alarm after detecting the K2 byte, and detects the
multiplex section-remote error indication (MS_REI) alarm and generates the B2excessive errors (B2_EXC) alarm after checking the B2 byte.

In the transmit direction, the MST sub-module generates the MSOH. That is, the
MST sub-module writes bytes such as E2, D4-D12, K1, K2, S1, and M1, and
calculates and writes the B2 byte.

MSA sub-module

In the receive direction, the MSA sub-module de-interleaves the administration unit
group (AUG), divides an AUG into N AU-4s, detects the administration unit-loss of
pointer (AU_LOP) alarm and the administration unit-alarm indication signal
(AU_AIS) alarm, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4. N AU-4s are multiplexed into an AUG through byte interleaving.

HPT sub-module

In the receive direction, the HPT sub-module terminates the path overhead (POH).
That is, the HPT sub-module detects the higher order path-remote error indication
(HP_REI) alarm after checking the B3 byte, generates the higher order path-trace
identifier mismatch (HP_TIM) alarm and the higher order path-signal label mismatch
(HP_SLM) alarm and detects the higher order path-remote defect indication
(HP_RDI) alarm after detecting the J1 and C2 bytes, and generates the higher order
path-unequipped (HP_UNEQ) alarm after detecting the C2 byte.

In the transmit direction, the HPT sub-module generates the POH. That is, the HPT
sub-module writes bytes such as J1 and C2, and calculates and writes the B3 byte.

1.1.1.1.712 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Controls the laser.

Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC is not in position.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.713 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

10.28.5 Front Panel


The front panel of the SLH41 has indicators, interfaces, a bar code, and a laser safety class
label.
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1.1.1.1.714 Diagram of the Front Panel


Figure 10-95 shows the appearance of the front panel of the SLH41.
Figure 1.1 Front panel of the SLH41
SM SFP W ORK WITH
G.657B FIBER ONLY

G.657B

SLH41
STAT
ACT
PROG
SRV
RX 1

2 TX

TX 15

16 RX

1.1.1.1.715 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

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1.1.1.1.716 Interfaces
The front panel of the SLH41 has 16 optical interfaces. A silkscreen "16SFP" is marked below
the indicators.

Table 10-165 describes the types and usage of the optical interfaces of the SLH41.
Figure 1.1 Description of the optical interfaces of the SLH41
Interface

Type of interface

Usage

RX1-RX16

LC

Receives optical signals.

TX1-TX16

LC

Transmits optical signals.

The G.657B fiber jumper rather than the G.652D fiber jumper is used if an optical attenuator is inserted
into the transmit port. Otherwise, the cabinet door cannot be closed. Figure 10-96 shows the G.657B
fiber jumper and G.652D fiber jumper.

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Figure 1.2 G.657B fiber jumper and G.652D fiber jumper

G.652D fiber jumper

58.25
50.75

G.657B fiber jumper

42.5

10.28.6 Jumpers and DIP Switches


The SLH41 does not have any jumpers or DIP switches that are used for board settings.

10.28.7 Valid Slots


The SLH41 must be installed in a valid slot on the subrack. Otherwise, the SLH41 fails to
work normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the SLH41 vary with the cross-connect capacity of the equipment. The
slots valid for the SLH41 are as follows:

When the cross-connect capacity is 40 Gbit/s or 80 Gbit/s, the SLH41 cannot be installed
on the subrack.

When the cross-connect capacity is 200 Gbit/s, the SLH41 can be installed in any of slots
5-8 and slots 11-14.

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10.28.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SLH41 indicates the type of optical interface.
Table 10-166 provides the relationship between the feature code of the SLH41 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the SLH41 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN3SLH4101

01

12xS-1.1, 4xS-4.1

SSN3SLH4102

02

8xS-1.1, 8xS-4.1

SSN3SLH4103

03

16xS-1.1

SSN3SLH4104

04

4xL-1.1, 12xS-4.1

SSN3SLH4106

05

16xS-4.1

The G.657B fiber jumper is required because the single-mode optical module is used over
the interface.

10.28.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.717 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 3 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.718 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 4 Required: Set the SDH interface.

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J0 byte: Generally, use the default value. The default value of the J0 to be received is
Disabled.

J1 byte: The setting of the J1 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J1 to be received is Disabled.

C2 byte: The setting of the C2 byte on the interconnected equipment must be consistent.
Set the C2 byte according to the actual service type. Generally, use the default value,
which is TUG structure.

Laser status: Set this parameter to Open when you configure and commission the board.

For details, see 27.7 Checking Board Parameters.


For the other parameters to be set, see 26.5 SDH Processing Boards.

Step 5 Required: Configure a protection subnet. For details, see Configuring the Protection Subnet.
Step 6 Required: Configure services. For details, see Configuring the SDH Services.
----End

1.1.1.1.719 Commissioning the Board


Step 1 Required: Test the specifications of the optical interface. For details, see Testing
Specifications of Optical Interfaces.
Step 7 Required: Test the network protection switching. For details, see Testing SDH Network
Protection Switching.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.720 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

10.28.10 Parameter Settings


You can set the parameters for the SLH41 by using the U2000.
You can set the following parameters for the SLH41 by using the U2000:

J0

J1

J2

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C2

For the description of each parameter, see 26 Parameter Settings.

10.28.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.721 Troubleshooting
Table 10-167 lists the faults that occur on the SLH41 frequently and the troubleshooting
methods.
The SLH41 uses the SFP optical module. When the SLH41 operates and an abnormal alarm occurs on
the optical interface, check whether the optical module is properly installed. To check whether the
optical module is properly installed, you can re-seat the optical module.

Figure 1.1 Methods used to troubleshoot the faults that occur on the SLH41 frequently
Symptom

Common Cause

Service interruption

The optical fiber


or connector
becomes
abnormal.

An incorrect
operation is
performed.

The types or
settings of the
boards are
inconsistent.

The optical
power becomes
abnormal.

The equipment
becomes faulty.

The clock
configuration is
incorrect.

The precision of
the external
clock source is
very low.

The MSP
switching fails.

The SNCP
switching fails.

The clock
protection

Bit error

Pointer justification

Protection switching
failure

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

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Symptom

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Common Cause

Troubleshooting Method

switching fails.
NEs being
unreachable to the
NMS

Equipment
interconnection fault

A single NE
becomes
unreachable to
the NMS.

All the NEs in a


subnet become
unreachable to
the NMS.

An NE becomes
unreachable to
the NMS
frequently.

An SDH overhead
interconnection fault
occurs.

See Troubleshooting the NEs Being


Unreachable.

See Troubleshooting Device Interconnection


Faults.

1.1.1.1.722 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SLH41, see Replacing an SDH Board.

10.28.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the NMS.

10.28.12.1 Alarms of N3SLH41


R_LOS

WRG_BD_TYPE

R_LOF

R_OOF

R_LOC

B1_EXC

B1_SD

J0_MM

B2_EXC

B2_SD

MS_AIS

MS_RDI

MS_REI

TF

IN_PWR_ABN

OUT_PWR_ABN

LSR_WILL_DIE

LSR_COOL_ALM

TEM_HA

TEM_LA

LASER_SHUT

LSR_NO_FITED

LASER_MOD_ERR

ALM_ALS

SPARE_PATH_ALM

TEST_STATUS

OH_LOOP

FSELECT_STG

NO_BD_SOFT

TR_LOC

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T_LOSEX

COMMUN_FAIL

W_R_FAIL

CHIP_FAIL

POWER_ABNORMAL

BIP8_ECC

BD_STATUS

AU_AIS

AU_LOP

HP_TIM

HP_SLM

HP_UNEQ

HP_RDI

HP_REI

B3_EXC

B3_SD

AU_CMM

C2_VCAIS

C2_PDI

FPGA_ABN

SLAVE_WORKING

HP_LOM

PATCHFILE_NOTEXIST

PATCH_ERR

LSR_INVALID

PATCH_NOT_CONFIRM

CHIP_ABN

LOOP_ALM

LP_RDI_VC12

LP_REI_VC12

LP_SLM_VC12

LP_TIM_VC12

LP_UNEQ_VC12

TU_AIS_VC12

TU_LOP_VC12

BIP_SD

BIP_EXC

TEMP_OVER

LP_RDI_VC3

LP_REI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

TU_AIS_VC3

TU_LOP_VC3

B3_EXC_VC3

B3_SD_VC3

TIME_NOT_SUPPORT

PS

MOD_TYPE_MISMATCH

IN_PWR_HIGH

IN_PWR_LOW

DCN_FAIL

10.28.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the NMS.

10.28.13.1 Performance Events of N3SLH41


RSBBE

RSES

RSSES

RSUAS

RSCSES

INVOLTCUR

RSOFS

MSBBE

MSES

MSUAS

MSCSES

MSSES

MSFEBBE

MSFEES

MSFESES

MSFEUAS

MSFECSES

AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPES

HPSES

HPUAS

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HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

INVOLTMAX

INVOLTMIN

10.28.14 Technical Specifications of SLH41


The technical specifications of the SLH41 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.723 Parameters Specified for Optical Interfaces


Table 10-168 lists the parameters specified for the optical interfaces of the SLH41 when the
STM-1 optical module is used.
Figure 1.1 Parameters specified for the optical interfaces of the SLH41 when the STM-1 optical
module is used
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Application code

S-1.1

L-1.1

Transmission distance (km)

0 to 15

15 to 40

Type of fiber

Single-mode LC

Single-mode LC

Operating wavelength range


(nm)

1261 to 1360

1263 to 1360

Launched optical power


range (dBm)

-15 to -8

-5 to 0

Receiver sensitivity (dBm)

-28

-34

Overload optical power


(dBm)

-8

-10

Minimum extinction ratio


(dB)

8.2

10

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Table 10-169 lists the parameters specified for the optical interfaces of the SLH41 when the
STM-4 optical module is used.
Figure 1.2 Parameters specified for the optical interfaces of the SLH41 when the STM-4 optical
module is used
Parameter

Value

Nominal bit rate

622080 kbit/s

Line code pattern

NRZ

Application code

S-4.1

Transmission distance (km)

0 to 15

Operating wavelength range


(nm)

1274 to 1356

Type of fiber

Single-mode LC

Launched optical power


range (dBm)

-15 to -8

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-8

Minimum extinction ratio


(dB)

8.2

Table 10-170 and Table 10-171 list the parameters specified for the colored optical interfaces
of the SLH41.
Figure 1.3 CWDM parameters specified for the colored optical interfaces of the SLH41
Parameter

Value
CWDM

Nominal bit rate

155520 kbit/s or 622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

80

Launched optical power range


(dBm)

0 to 5

Operating wavelength range (nm)

1471 to 1611, in steps of 20

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

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Parameter

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Value
CWDM

Maximum allowed dispersion


(ps/nm)

1600

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral width


(nm)

Minimum side mode suppression


ratio (dB)

30

Figure 1.4 DWDM parameters specified for the colored optical interfaces of the SLH41
Parameter

Value
DWDM

Nominal bit rate

155520 kbit/s or 622080 kbit/s

Type of fiber

Single-mode LC

Transmission distance (km)

120

Launched optical power range


(dBm)

-1 to 3

Central frequency (THz)

192.10 to 196.00

Central frequency deviation


(GHz)

10

Receiver sensitivity (dBm)

-28

Minimum overload (dBm)

-9

Maximum allowed dispersion


(ps/nm)

2400

Minimum extinction ratio (dB)

8.2

Maximum -20 dB spectral


width (nm)

0.3

Minimum side mode


suppression ratio (dB)

30

1.1.1.1.724 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

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1.1.1.1.725 Mechanical Specifications


The mechanical specifications of the SLH41 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight: 1.5 kg

1.1.1.1.726 Power Consumption


The maximum power consumption of the SLH41 at room temperature (25C) is 49 W.

10.29 EU04
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EU04 (4xSTM-1 electrical interface board).

10.29.1 Version Description


The EU04 is available in one functional version, namely, N1.

10.29.2 Application
The EU04 is an STM-1 electrical interface board. The EU04 can be used on the OptiX OSN
equipment series to transmit and receive signals for the STM-1 electrical processing board.

10.29.3 Functions and Features


The EU04 receives and transmits 4xSTM-1 electrical signals. The EU04 must work with the
SEP.

10.29.4 Working Principle and Signal Flow


The EU04 consists of the interface module, switch matrix module, and power module.
Figure 10-97 shows the functional block diagram of the EU04 by describing how to process
1xSTM-1 signals.

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Figure 1.1 Functional block diagram of the EU04


Backplane
Cross-connect board
STM-1 electrical
signal

Interface
module

Switch
matrix
module

STM-1 electrical
signal

+3.3 V

Power
module

Fuse

SEP
TSB4/TSB8
TSB4/TSB8
SEP

+3.3 V power

1.1.1.1.727 Interface Module


The interface module receives and transmits the STM-1 electrical signals.

1.1.1.1.728 Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the SEP. When the TPS is performed, the switch matrix module
transmits the signal to the TSB4 or TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.729 Power Module


The power module provides all the modules of the EU04 with the required DC voltages.

10.29.5 Front Panel


The front panel of the EU04 has interfaces and a bar code.

1.1.1.1.730 Diagram of the Front Panel


Figure 10-98 shows the appearance of the front panel of the EU04.

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Figure 1.1 Front panel of the EU04

EUO4

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

EUO4

1.1.1.1.731 Interfaces
The front panel of the EU04 has four pairs of electrical interfaces.
Table 10-172 describes the types and usage of the interfaces of the EU04.
Figure 1.1 Interfaces of the EU04
Interface

Type of Interface

Usage

IN1IN4

SMB

Receives the 1st to the 4th channels of STM-1


electrical signals.

OUT1OUT4

SMB

Transmits the 1st to the 4th channels of STM-1


electrical signals.

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10.29.6 Valid Slots


The EU04 can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the subrack and works
as the interface board of the SEP.
Table 10-173 lists the slots valid for the SEP and the corresponding slots for the EU04.
Figure 1.2 Slots valid for the SEP and the corresponding slots for the EU04
Slot Valid for the SEP

Corresponding Slot for the EU04

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

10.29.7 Technical Specifications


The technical specifications of the EU04 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.732 Parameters Specified for Electrical Interfaces


Table 10-174 lists the parameters specified for the electrical interfaces of the EU04.
Figure 1.1 Parameters specified for the electrical interfaces of the EU04
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

CMI

Signal bit rate at the output interface

Complies with ITU-T G.703.

Allowed frequency deviation at the input


interface
Allowed attenuation at the input interface

1.1.1.1.733 Mechanical Specifications


The mechanical specifications of the EU04 are as follows:
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Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.734 Power Consumption


The maximum power consumption of the EU04 at room temperature (25C) is 6 W.

10.30 EU08
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EU08 (8xSTM-1 electrical interface board).

10.30.1 Version Description


The EU08 is available in one functional version, namely, N1.

10.30.2 Application
The EU08 is an STM-1 electrical interface board. The EU08 can be used on the OptiX OSN
equipment series to transmit and receive signals for the STM-1 electrical processing board.

10.30.3 Functions and Features


The EU08 receives and transmits 8xSTM-1 electrical signals. The EU08 must work with the
SLH1 or SEP1.

10.30.4 Working Principle and Signal Flow


The EU08 consists of the interface module, switch matrix module, and power module.
Figure 10-99 shows the functional block diagram of the EU08.
Figure 1.1 Functional block diagram of the EU08
Backplane
Cross-connect board
STM-1 electrical
signal

Interface
module

Switch
matrix
module

STM-1 electrical
signal
+3.3 V

Power
module

Fuse

SEP/SLH1
TSB8
TSB8
SEP/SLH1

+3.3 V power

1.1.1.1.735 Interface Module


The interface module receives and transmits the STM-1 electrical signals.
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1.1.1.1.736 Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the SLH1 or SEP. When the TPS is performed, the switch
matrix module transmits the signal to the TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.737 Power Module


The power module provides all the modules of the EU08 with the required DC voltages.

10.30.5 Front Panel


The front panel of the EU08 has interfaces and a bar code.

1.1.1.1.738 Diagram of the Front Panel


Figure 10-100 shows the appearance of the front panel of the EU08.

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Figure 1.1 Front panel of the EU08

EUO8
OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6
OUT7
IN7
OUT8
IN8

EUO8

1.1.1.1.739 Interfaces
The front panel of the EU08 has eight pairs of electrical interfaces.
Table 10-175 describes the types and usage of the interfaces of the EU08.
Figure 1.1 Interfaces of the EU08
Interface

Type of
Interface

Usage

IN1IN8

SMB

Receives the 1st to the 8th channels of STM-1


electrical signals.

OUT1OUT8

SMB

Transmits the 1st to the 8th channels of STM-1


electrical signals.

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10.30.6 Valid Slots


The slots valid for the EU08 vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the EU08 are as follows:

When the cross-connect capacity is 200 Gbit/s, the EU08 can be installed in slots 19-26
and 29-36.

Table 10-176 lists the slots valid for the SLH1 and the corresponding slots for the EU08. The
EU08 installed in the slot with a smaller number transmits/receives the 1st to the 8th channels
of STM-1 electrical signals. The EU08 installed in the slot with a larger number
transmits/receives the 9th to the 16th channels of STM-1 electrical signals.
Figure 1.2 Slots valid for the SLH1 and the corresponding slots for the EU08
Slot Valid for the SLH1

Corresponding Slot for the EU08

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

Table 10-177 lists the slots valid for the SEP and the corresponding slots for the EU08.
Figure 1.3 Slots valid for the SEP and the corresponding slots for the EU08
Slot Valid for the SEP

Corresponding Slot for the EU08

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

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Slot Valid for the SEP

Corresponding Slot for the EU08

Slot 15

Slot 33

Slot 16

Slot 35

10.30.7 Technical Specifications


The technical specifications of the EU08 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.740 Parameters Specified for Electrical Interfaces


Table 10-178 lists the parameters specified for the electrical interfaces of the EU08.
Figure 1.1 Parameters specified for the electrical interfaces of the EU08
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

CMI

Signal bit rate at the output interface

Complies with ITU-T G.703.

Allowed frequency deviation at the


input interface
Allowed attenuation at the input
interface
Input jitter tolerance

1.1.1.1.741 Mechanical Specifications


The mechanical specifications of the EU08 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.742 Power Consumption


The maximum power consumption of the EU08 at room temperature (25C) is 11 W.

10.31 OU08
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the N1OU08 (8xSTM-1 optical/electrical interface board) and the
N2OU08 (8xSTM-1 optical interface board).

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10.31.1 Version Description


The OU08 is available in the following functional versions: N1 and N2. The difference
between the two versions is with regard to the connector type for the optical/electrical
interfaces and whether the optical/electrical module is swappable.
Table 10-179 describes the versions of the OU08.
Figure 1.1 Versions of the OU08
Item

Description

Functional versions

The OU08 is available in two functional versions, namely, N1 and


N2.

Common points

The working principle of the N1OU08 is the same as the working


principle of the N2OU08.

Differences

The optical interface of the N1OU08 uses the LC connector, whereas


the optical interface of the N2OU08 uses the SC connector.
The N1OU08 uses the swappable optical/electrical module, whereas
the N2OU08 does not use the swappable optical/electrical module.
The N1OU08 supports optical power query when using pluggable
optical modules, whereas the N2OU08 does not.

Substitution

None

10.31.2 Application
The N1OU08 is an STM-1 optical/electrical interface board, and the N2OU08 is an STM-1
optical interface board. The OU08 can be used on the OptiX OSN equipment series to
transmit and receive signals for the STM-1 optical processing board.

10.31.3 Functions and Features


The N1OU08 receives and transmits 8xSTM-1 optical/electrical signals, and the N2OU08
receives and transmits 8xSTM-1 optical signals. The OU08 must work with the SLH1 or
SEP1.

10.31.4 Working Principle and Signal Flow


The OU08 consists of the interface module and power module.
Figure 10-101 shows the functional block diagram of the N1OU08/N2OU08.

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Figure 1.1 Functional block diagram of the N1OU08/N2OU08


Backplane
STM-1
optical/electrical
signal

SEP/SLH1

Interface
module

STM-1
optical/electrical
signal

SEP/SLH1

+3.3 V

Power
module

Fuse

+3.3 V power

N2OU08 boards receive and transmit 8xSTM-1 optical signals but do not receive or transmit electrical
signals, whereas N1OU08 boards receive and transmit 8xSTM-1 optical and electrical signals.

1.1.1.1.743 Interface Module


In the receive direction, the interface module performs O/E conversion for STM-1 signals and
transmits the signals to the SLH1 or SEP.
In the transmit direction, the interface module performs E/O conversion for STM-1 signals
and transmits the signals to an optical/electrical interface.
If an electrical module is installed, the interface module does not perform O/E conversion in both the
receive and transmit directions.

1.1.1.1.744 Power Module


The power module provides all the modules of the OU08 with the required DC voltages.

10.31.5 Front Panel


The front panel of the OU08 has interfaces and a bar code.

1.1.1.1.745 Diagram of the Front Panel


Figure 10-102 shows the appearance of the front panel of the N1OU08. Figure 10-103 shows
the appearance of the front panel of the N2OU08.

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Figure 1.1 Front panel of the N1OU08 with optical interfaces

OU08

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4
OUT5 IN5
OUT6 IN6
OUT7 IN7
OUT8 IN8
CLASS 1
LASER
PRODUCT

OU08

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Figure 1.2 Front panel of the N2OU08

OU08
OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6
OUT7
IN7
OUT8
IN8

OU08

1.1.1.1.746 Interfaces
The front panel of the N1OU08 has eight optical/electrical interfaces. The front panel of the
N2OU08 has eight optical interfaces.
Table 10-180 describes the types and usage of the interfaces of the N1OU08. Table 10-181
describes the types and usage of the interfaces of the N2OU08.
Figure 1.1 Interfaces of the N1OU08
Interface

Type of
Interface

Usage

IN1IN8

LC/SAA

Receives the first to the eighth channels of STM-1


optical/electrical signals.

OUT1OUT8

LC/SAA

Transmits the first to the eight channels of STM-1

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Interface

Type of
Interface

10 SDH Boards

Usage
optical/electrical signals.

Figure 1.2 Interfaces of the N2OU08


Interface

Type of
Interface

Usage

IN1IN8

SC

Receives the first to the eighth channels of STM-1


optical signals.

OUT1OUT8

SC

Transmits the first to the eighth channels of STM-1


optical signals.

10.31.6 Valid Slots


The slots valid for the OU08 vary with the cross-connect capacity of the subrack.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

When the cross-connect capacity is 200 Gbit/s, the OU08 can be installed in slots 1926
and 2936.

Table 10-182 lists the slots valid for the SLH1 and the corresponding slots for the OU08. The
OU08 installed in the slot with a smaller number transmits/receives the 1st to the 8th channels
of STM-1 optical signals. The OU08 installed in the slot with a larger number
transmits/receives the 9th to the 16th channels of STM-1 optical signals.
Figure 1.3 Slots valid for the SLH1 and the corresponding slots for the OU08
Slot Valid for the SLH1

Corresponding Slot for the OU08

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

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Table 10-183 lists the slots valid for the SEP1 and the corresponding slots for the OU08.
Figure 1.4 Slots valid for the SEP1 and the corresponding slots for the OU08
Slot Valid for the SEP1

Corresponding Slot for the OU08

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

10.31.7 Technical Specifications


The technical specifications of the OU08 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.747 Parameters Specified for Optical Interfaces


Table 10-184 lists the parameters specified for the optical interfaces of the OU08.
Figure 1.1 Parameters specified for the optical interfaces of the OU08
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Application code

S-1.1

Operating wavelength
range (nm)

N1OU08: 1260-1360

Type of fiber

Single-mode LC

Mean launched optical


power (dBm)

-15 to -8

Receiver sensitivity
(dBm)

-28

N2OU08: 1261-1360

Table 10-185 lists the parameters specified for the single-fiber bidirectional optical interfaces
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of the OU08.
Figure 1.2 Parameters specified for the Single-fiber Bidirectional optical interfaces of the OU08
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

NRZ

Optical interface type

S-1.1

S-1.1

Transmission distance (km)

2 to 15

2 to 15

Fiber type

Single-mode LC

Single-mode LC

Operating transmit wavelength


(nm)

1550

1310

Operating receive wavelength


(nm)

1310

1550

Launched optical power range


(dBm)

-15 to -8

-15 to -8

Receiver sensitivity (dBm)

-32

-32

Minimum overload (dBm)

-8

-8

Minimum extinction ratio (dB)

8.5

8.5

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

1.1.1.1.748 Parameters Specified for Electrical Interfaces


Table 10-186 lists the parameters specified for the electrical interfaces of the N1OU08.
Figure 1.1 Parameters specified for the electrical interfaces of the N1OU08
Parameter

Value

Nominal bit rate

155520 kbit/s

Line code pattern

CMI

Type of interface

SAA

Signal bit rate at the


output port

Complies with ITU-T G.703.

Allowed frequency
deviation at the input
interface
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Parameter

10 SDH Boards

Value

Allowed attenuation at
the input interface
Input jitter tolerance

1.1.1.1.749 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.750 Mechanical Specifications


The mechanical specifications of the OU08 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.751 Power Consumption


The maximum power consumption of the OU08 at room temperature (25C) is 6 W.

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11

PDH Boards

About This Chapter


The PDH boards include the PDH service interface boards and PDH service processing
boards, to transmit/receive and process E1/T1 signals, E3/T3 signals, E4/STM-1 electrical
signals, and DDN signals.
11.1 PQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PQ1 (63xE1 service processing board). This topic also
describes how to configure and commission the PQ1.
11.2 PQM
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PQM (63xE1/T1 service processing board). This topic also
describes how to configure and commission the PQM.
11.3 PFL1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PFL1 (8xE1 optical processing board). This topic also describes
how to configure and commission the PFL1.
11.4 PL3
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PL3 (3xE3/T3 service processing board). This topic also
describes how to configure and commission the PL3.
11.5 PL3A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PL3A (3xE3/T3 service processing board with the interfaces on
the front panel). This topic also describes how to configure and commission the PL3A.
11.6 PD3
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PD3 (6xE3/T3 service processing board).
11.7 PQ3
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This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PQ3 (12xE3/T3 service processing board).
11.8 DX1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the DX1 (DDN service accessing and converging board). This
topic also describes how to configure and commission the DX1.
11.9 DXA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DXA (DDN service converging and processing board).
11.10 SPQ4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SPQ4 (4xE4/STM-1 electrical processing board). This topic
also describes how to configure and commission the SPQ4.
11.11 D12B
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D12B (32xE1/T1 access board).
11.12 D12S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D12S (32xE1/T1 switching access board).
11.13 D75S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D75S (32xE1 switching access board).
11.14 D34S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D34S (6xE3/T3 switching access board).
11.15 C34S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the C34S (3xE3/T3 switching access board).
11.16 MU04
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MU04 (4xE4/STM-1 electrical interface board).
11.17 DM12
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DM12 (DDN service interface board).
11.18 TSB4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TSB4 (4-channel electrical interface protection switching
board).
11.19 TSB8
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This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TSB8 (8-channel electrical interface protection switching
board).

11.1 PQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PQ1 (63xE1 service processing board). This topic also
describes how to configure and commission the PQ1.

11.1.1 Version Description


The PQ1 is available in the following functional versions: N1 and N2. The functions provided
by the functional versions are different. The N1PQ1 is discontinued.
Depending on the port impedance, the PQ1 is available in PQ1A (75 ohms) and PQ1B (120 ohms).
Except this, the two boards are the same in function and feature. When the port impedance does not need
to be present, the PQ1A and PQ1B are referred to as the PQ1.

Table 11-1 describes the versions of the PQ1.


Figure 1.1 Versions of the PQ1
Item

Description

Functional versions

The PQ1 is available in the following functional versions: N1 and


N2.

Differences

Service processing: E13 function.

Maintenance features: CRC function.

Substitution

When the tributary re-timing function is not required, the N1PQ1A


can be replaced with the N2PQ1A.
When the tributary re-timing function is not required, the N1PQ1B
can be replaced with the N2PQ1B.

Note: The PQ1 boards are classified into the PQ1A boards (75 ohms) and PQ1B boards
(120 ohms) according to the interface impedance. When the interface impedance is not
considered, the PQ1A and PQ1B are called PQ1 hereafter.

11.1.2 Application
The PQ1 is a PDH processing board. The PQ1 can be used on the OptiX OSN equipment
series to add and drop PDH signals. To transmit/receive and process 63xE1 signals, the PQ1
must be used with the interface board.
Figure 11-1 shows the application of the PDH processing boards. The PDH processing boards
add tributary signals to line signals and drops tributary signals to line signals.

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Figure 1.1 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.1.3 Functions and Features


The PQ1 processes E1 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-2 provides the functions and features of the PQ1.
Figure 1.2 Functions and features of the PQ1
Function
and
Feature

PQ1
N1PQ1

N2PQ1

Basic
functions

Processes 63xE1
signals.

Processes 63xE1 signals.

Service
processing

Processes 63xE1
electrical signals
when working with
the interface board.

Processes 63xE1 electrical signals when working


with the interface board.

Supports the E13 function, which is used to


converge E1 services into E3 services.

Overhead
processing

Supports the processing of the path overheads at the VC-12 level, such as the
J2 byte.

Alarms and
performanc
e events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenan
ce features

Supports inloops and outloops at electrical interfaces.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

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Function
and
Feature

PQ1
N1PQ1

N2PQ1

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting services.

The N1PQ1 supports the PRBS test in the tributary direction and in the
cross-connect direction.

The N2PQ1:

Protection
schemes

11 PDH Boards

Supports the PRBS test in the tributary direction


and in the cross-connect direction in the normal
mode.

Does not support the PRBS test in the MUX


mode or Server mode.

The N1PQ1 does not support the CRC function, but the N2PQ1 supports
the CRC function.

Supports the TPS protection when working with the interface board.

The N1PQ1 supports hybrid protection. When the working board is the
N1PQ1, the protection board can be the N1PQ1, N2PQ1, or N1PQM.

The N2PQ1 does not support hybrid protection. When the working board
is the N2PQ1, the protection board can only be the N2PQ1.

11.1.4 Working Principle and Signal Flow


The PQ1 consists of the interface module, mapping/demapping module, interface converting
module, logic and control module, and power module.
Figure 11-2 shows the functional block diagram of the PQ1.

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Figure 1.1 Functional block diagram of the PQ1


Backplane
155 MHz
PLL

2 MHz
OSC

E1

63x2 Mbit/s

LIU
PPI

E1

LIU

Mapping/
Demapping
module
63x2 Mbit/s

155 Mbit/s

155 Mbit/s

Reference
clock

High-speed
bus

Interface
converting
High-speed
module
bus

Cross-connect
unit

Cross-connect
unit A
Cross-connect
unit B

Interface
module

LOS
Outloop/Inloop
control

Cross-connect
unit

Frame header
Communication

Logic and
control module
+3.3 V
Power
module

Power
module

SCC unit

Fuse

-48 V/-60 V
-48V/-60V

Fuse

+3.3 V backup power

LIU: logic interface unit

PPI: PDH physical interface

OSC: oscillator

Figure 11-3 shows the functional block diagram of the mapping/demapping module.
Figure 1.2 Functional block diagram of the mapping/demapping module
Mapping/demapping module
E1

LPA

PDH AIS
detector

E1
LPA

LPT

LPOH(V5/J2/N2/
K4) insertion
LPOH(V5/J2/N2/
K4) extraction

LPT

HPA

HPT

STM-1

TU-AIS/TULOP detector

HPA

HPT

STM-1

1.1.1.1.752 Interface Module


The interface module consists of LIUs and provides the inloop and outloop functions. The
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interface module performs the following functions:

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the PDH LOS signals.

1.1.1.1.753 Mapping/Demapping Module

LPA sub-module
The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be
adapted so that the stream can be transported to the synchronous network for check of
the PDH AIS.

LPT sub-module
The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C-12 container and POH. The POH contains nine octets equally distributed within the
frame bytes for VC-12, namely, V5, J2, N2, and K4.

HPA sub-module
The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-12s, which are located and isolated in TU-12s.
The TU-PTR is processed. TU-AIS and TU-LOP alarms are monitored. In the transmit
direction, VC-12s are located precisely and added with the TU-PTR. Sixty-three TU-12s
are multiplexed into a VC-4 by bytes interleaving. The sequence is as follows: TUG2>TUG3->VC-4

HPT sub-module
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module


These sub-modules are required to create a proprietary STM1 signal so that the E1
mapping/demapping module can interface with the multiplex unit.

1.1.1.1.754 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.755 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Control the indicators on the board.

1.1.1.1.756 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.
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11.1.5 Front Panel


The front panel of the PQ1 has indicators.

1.1.1.1.757 Diagram of the Front Panel


Figure 11-4 shows the appearance of the front panel of the PQ1.
Figure 1.1 Front panel of the PQ1

PQ1
STAT
ACT
PROG
SRV

PQ1

1.1.1.1.758 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

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For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.759 Interfaces
The front panel of the PQ1 does not have an interface.
The D75S, D12S, and D12B provide 75-ohm or 120-ohm E1 interfaces for the PQ1. For
details, see the topics that describe the D75S, D12S, and D12B.

11.1.6 Jumpers and DIP Switches


The PQ1 does not have any jumpers or DIP switches that are used for board settings.

11.1.7 Valid Slots


The PQ1 must be installed in a valid slot in the subrack. Otherwise, the PQ1 fails to work
normally.
The PQ1 can be installed in slots 15 and 1316 in the main subrack.
Table 11-3 lists the slots valid for the PQ1 and the corresponding slots for the D75S, D12S,
and D12B in the main subrack.
Figure 1.1 Slots valid for the PQ1 and the corresponding slots for the D75S, D12S, and D12B in
the main subrack
Slot Valid for the PQ1

Corresponding Slots for the D75S, D12S, and


D12B

Slot 1

Without an interface board

Slot 2

Slot 19 (132 channels of services)


Slot 20 (3363 channels of services)

Slot 3

Slot 21 (132 channels of services)


Slot 22 (3363 channels of services)

Slot 4

Slot 23 (132 channels of services)


Slot 24 (3363 channels of services)

Slot 5

Slot 25 (132 channels of services)


Slot 26 (3363 channels of services)

Slot 13

Slot 29 (132 channels of services)


Slot 30 (3363 channels of services)

Slot 14

Slot 31 (132 channels of services)


Slot 32 (3363 channels of services)

Slot 15

Slot 33 (132 channels of services)


Slot 34 (3363 channels of services)

Slot 16

Slot 35 (132 channels of services)


Slot 36 (3363 channels of services)

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Slot 1 can house a protection board for the TPS protection. The board in slot 1 protects the boards in
slots 25 and 1316.

If the interface board for the boards in slots 25 and 1316 is the D12B, the boards in slots 25 and
1316 cannot be protected by the TPS protection scheme.

11.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the PQ1 indicates the type of interface impedance.
Table 11-4 provides the relationship between the feature code of the PQ1 and the type of
interface impedance.
Figure 1.2 Relationship between the feature code of the PQ1 and the type of interface impedance
Board

Feature Code

Type of Interface Impedance

SSN1PQ1A01 and SSN2PQ1A01

A01

75-ohm

SSN1PQ1B01 and SSN2PQ1B01

B01

120-ohm

11.1.9 Board Protection


The PQ1 supports the 1:N TPS protection.

1.1.1.1.760 Protection Principle


The PQ1 boards work with the D75S or D12S boards to realize one 1:N (N8) TPS protection
group.
Figure 11-5 shows the TPS protection provided by the PQ1. When the cross-connect and
timing board detects that a working PQ1 is faulty, the cross-connect and timing board issues a
service switching command to control the interface board to switch the services from the
faulty PQ1 to the protection PQ1, which realizes the protection of the services.

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Figure 1.1 TPS protection provided by the PQ1


Service signal

Service signal
Switching
control bus

Interface board

Protection bus
Protection bus

Crossconnect and
timing board

Interface board

Interface board

Interface board

Interface board

Interface board

Working board N

Working board

Working board 1

Protection board

Failed

TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing
board. Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

1.1.1.1.761 Hardware Configuration


Table 11-5 shows the slot configuration for the 1:8 TPS protection of the PQ1.
Figure 1.1 Slot configuration for the 1:8 TPS protection of the PQ1
Working Board

Protection Board

Slot Configuration

PQ1A (75-ohm)

PQ1A (75-ohm)

PQ1B (120-ohm)

PQ1B (120-ohm) or PQM

Slot 1 can house a protection board.


The board in slot 1 protects the
boards in slots 2-5 and 13-16. Figure
11-6 shows the slot configuration for
the 1:8 TPS protection of the PQ1.

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PIU

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
9

S
L
O
T
1
0

XCS

S
L
O
T
1
1

S
L
O
T
1
2

S
L
O
T
3
7

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

Working

S S S S
L L L L
O O O O
T T T T
5 6 7 8

S
L
O
T
3
6

FAN

Working

S
L
O
T
4

XCS

FAN

S
L
O
T
3
5

AUX

PIU

S
L
O
T
3
1

Working

Working

Working

Protection

S S S
L L L
O O O
T T T
1 2 3

S
L
O
T
3
0

Working

FAN

S
L
O
T
2
9

GSCC

S
L
O
T
2
8

D12S

S
L
O
T
2
7

D12S

S
L
O
T
2
4

Working

S
L
O
T
2
6

D12S
D12S
D12S
D12S
D12S

S
L
O
T
2
3

Working

S
L
O
T
2
5

D12S

S
L
O
T
2
2

D12S
D12S
D12S
D12S
D12S

S
L
O
T
2
1

D12S

S
L
O
T
2
0

D12S

S
L
O
T
1
9

D12S

Figure 1.2 Slot configuration for the 1:8 TPS protection of the PQ1

Fiber routing area

11.1.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.762 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
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locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.763 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 5 Required: Set the PDH interface.

J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.

V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.

Service load indication: When a service channel does not process its carried services,
select Non-Loaded. When the service channel processes its carried services, select
Load.

For details, see 27.7 Checking Board Parameters.


Step 6 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 7 Required: Configure services. For details, see Configuring the SDH Services.

Before you configure services, learn the type of protection subnet configured for the ring network. For
the method for querying the protection subnet, see 27.1 Querying the Protection Subnet.

Step 8 Set parameters on the . For the parameters to be set, see 26.6 PDH Boards.
----End

1.1.1.1.764 Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 9 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 10 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.765 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
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Step 11 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

11.1.11 Parameter Settings


You can set parameters for the PQ1 by using the U2000.
You can set the following parameters for the PQ1 by using the U2000:

J2 byte

V5 byte

Tributary loopback

Service loading indication

For the description of each parameter, see 26 Parameter Settings.

11.1.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.766 Troubleshooting
Table 11-6 lists the faults that occur on the PQ1 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the PQ1 frequently
Fault
Symptom

Common Fault Cause

Service
interruption

The cable or connector


becomes abnormal.

An incorrect operation
is performed.

The types or settings of


the boards are
inconsistent.

Bit error

The equipment becomes


faulty.

Pointer
justification

The clock configuration


is incorrect.

The precision of the


external clock source is
very low.

Protection
switching
failure
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The TPS fails.

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.


See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

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1.1.1.1.767 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PQ1, see Replacing a PDH Board.

11.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

11.1.13.1 Alarms of N1PQ1


BD_STATUS

BIP_EXC

BIP_SD

CHIP_FAIL

COMMUN_FAIL

DOWN_E1_AIS

E1_LOC

LOOP_ALM

LP_RDI

LP_REI

LP_RFI

LP_SIZE_ERR

LP_SLM

LP_TIM

LP_UNEQ

NO_BD_SOFT

SWDL_PKG_NOBDSOFT

POWER_ABNORMAL

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

T_ALOS

T_LOSEX

TEST_STATUS

TPS_ALM

TR_LOC

TU_AIS

TU_LOP

UP_E1_AIS

V5_VCAIS

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

WRG_BD_TYPE

11.1.13.2 Alarms of N2PQ1


B3_EXC

B3_SD

BD_STATUS

BIP_EXC

BIP_SD

C2_VCAIS

CHIP_ABN

CHIP_FAIL

COMMUN_FAIL

CRC4_ERR_OVER

DOWN_E1_AIS

LFA

LMFA

LOOP_ALM

LP_RDI

LP_REI

LP_RFI

LP_SLM

LP_UNEQ

NO_BD_SOFT

P_AIS

P_LOF

P_RAI

LP_TIM

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POWER_ABNORMAL

SLAVE_WORKING

SUBCARD_ABN

T_ALOS

T_LOSEX

TEMP_OVER

TEST_STATUS

TPS_ALM

TR_LOC

TU_AIS

TU_LOP

UP_E1_AIS

V5_VCAIS

PATCH_ERR

SWDL_PKG_NOBDSOFT

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

WRG_BD_TYPE

11.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

11.1.14.1 Performance Events of N1PQ1


LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

TUPJCHIGH

TUPJCLOW

11.1.14.2 Performance Events of N2PQ1


CRC4_ERR

E1_LCV_SDH

E1_LES_SDH

E1_LLOSS_SDH

E1_LSES_SDH

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

TUPJCHIGH

TUPJCLOW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

11.1.15 Technical Specifications


The technical specifications of the PQ1 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

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1.1.1.1.768 Parameters Specified for Electrical Interfaces


The D75S, D12S, or D12B provides electrical interfaces for the PQ1. For the parameters
specified for the electrical interfaces, see Technical Specifications of the D75S, Technical
Specifications of the D12S and Technical Specifications of the D12B.

1.1.1.1.769 Mechanical Specifications


The mechanical specifications of the PQ1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.770 Power Consumption


The maximum power consumption of the N1PQ1 at room temperature (25C) is 19 W.
The maximum power consumption of the N2PQ1 at room temperature (25C) is 13 W.

11.2 PQM
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PQM (63xE1/T1 service processing board). This topic also
describes how to configure and commission the PQM.

11.2.1 Version Description


The PQM is available in one functional version, namely, N1.

11.2.2 Application
The PQM is a PDH processing board. The PQM can be used on the OptiX OSN equipment
series to add and drop PDH signals. To transmit/receive and process 63xE1/T1 signals, the
PQM must be used with the interface board.
Figure 11-7 shows the application of the PDH processing boards. The PDH processing boards
add tributary signals to line signals and drops tributary signals to line signals.

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Figure 1.1 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.2.3 Functions and Features


The PQM processes E1/T1 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-7 provides the functions and features of the PQM.
Figure 1.1 Functions and features of the PQM
Function and
Feature

PQM

Basic
functions

Processes 63xE1/T1 signals.

Service
processing

Transmits/Receives and processes 63xE1/T1 electrical signals when


working with the interface board. Each channel can be configured as E1 or
T1.

Overhead
processing

Supports the processing of the path overheads at the VC-12 level, such as
the J2 byte.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

Supports inloops and outloops at electrical interfaces.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting services.

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Feature

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PQM

Protection
schemes

Supports the PRBS test in the tributary direction and in the crossconnect direction.

Supports the CRC function.

Supports the TPS Protection when working with the interface board.

When the working board is the N1PQ1, the protection board can be the
N1PQ1, N2PQ1 or N1PQM. In this case, the hybrid protection is
provided.

When the working board is the N1PQM, the protection board can only
be the N1PQM.

11.2.4 Working Principle and Signal Flow


The PQM consists of the interface module, mapping/demapping module, interface converting
module, logic and control module, and power module.
Figure 11-8 shows the functional block diagram of the PQM.
Figure 1.1 Functional block diagram of the PQM
Backplane
155 MHz
PLL

1.5 MHz/2 MHz


OSC

E1/T1

63x1.5 Mbit/s
63x2 Mbit/s

LIU
PPI

E1/T1

LIU

Mapping/
Demapping
63x1.5 Mbit/s
module
63x2 Mbit/s

155 Mbit/s

155 Mbit/s

Reference
clock

High-speed
bus

Interface
converting
module High-speed
bus

Cross-connect
unit

Cross-connect
unit A
Cross-connect
unit B

Interface
module

LOS
Outloop/Inloop
control

Frame header
Communication

Logic and
control module
+3.3 V
Power
module

Power
module

Fuse
Fuse

LIU: logic interface unit

PPI: PDH physical interface

OSC: oscillator

Cross-connect
unit
SCC unit
-48 V/-60 V
-48V/-60V
+3.3 V backup power

Figure 11-9 shows the functional block diagram of the mapping/demapping module.
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Figure 1.2 Functional block diagram of the mapping/demapping module


Mapping/demapping module
E1/T1

LPA

PDH AIS
detector

HPA

LPT

LPOH(V5/J2/N2/
K4) insertion
LPOH(V5/J2/N2/
K4) extraction

STM-1

TU-AIS/TULOP detector

E1/T1
LPT

LPA

HPT

HPA

HPT

STM-1

1.1.1.1.771 Interface Module


The interface module consists of LIUs and provides the inloop and outloop functions. The
interface module performs the following functions:

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the PDH LOS signals.

1.1.1.1.772 Mapping/Demapping Module

LPA sub-module
The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be
adapted so that the stream can be transported to the synchronous network for check of
the PDH AIS.

LPT sub-module
The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C-12 container and POH. The POH contains nine octets equally distributed within the
frame bytes for VC-12, namely, V5, J2, N2, and K4.

HPA sub-module
The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-12s, which are located and isolated in TU-12s.
The TU-PTR is processed. TU-AIS and TU-LOP alarms are monitored. In the transmit
direction, VC-12s are located precisely and added with the TU-PTR. Sixty-three TU-12s
are multiplexed into a VC-4 by bytes interleaving. The sequence is as follows: TUG2>TUG3->VC-4

HPT sub-module
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

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These sub-modules are required to create a proprietary STM1 signal so that the E1
mapping/demapping module can interface with the multiplex unit.

1.1.1.1.773 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.774 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Control the indicators on the board.

1.1.1.1.775 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

11.2.5 Front Panel


The front panel of the PQM has indicators.

1.1.1.1.776 Diagram of the Front Panel


Figure 11-10 shows the appearance of the front panel of the PQM.

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Figure 1.1 Front panel of the PQM

PQM
STAT
ACT
PROG
SRV

PQM

1.1.1.1.777 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.778 Interfaces
The front panel of the PQM does not have an interface. The D12S and D12B provide 120ohm E1 interfaces or 100-ohm T1 interfaces for the PQM. For details, see the topics that
describe the D12S and D12B.
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11.2.6 Jumpers and DIP Switches


The PQM does not have any jumpers or DIP switches that are used for board settings.

11.2.7 Valid Slots


The PQM must be used with the D12S or D12B. In addition, the PQM must be installed in a
valid slot in the subrack. Otherwise, the PQM fails to work normally.
The PQM board can be installed in slots 15 and 1316 in the main subrack.
Table 11-8 lists the slots valid for the PQM and the corresponding slots for the D12S and
D12B in the main subrack.
Figure 1.1 Slots valid for the PQM and the corresponding slots for the D12S and D12B in the
main subrack
Slot Valid for the PQM

Corresponding Slots for the D12S and D12B

Slot 1

Without an interface board

Slot 2

Slot 19 (132 channels of services)


Slot 20 (3363 channels of services)

Slot 3

Slot 21 (132 channels of services)


Slot 22 (3363 channels of services)

Slot 4

Slot 23 (132 channels of services)


Slot 24 (3363 channels of services)

Slot 5

Slot 25 (132 channels of services)


Slot 26 (3363 channels of services)

Slot 13

Slot 29 (132 channels of services)


Slot 30 (3363 channels of services)

Slot 14

Slot 31 (132 channels of services)


Slot 32 (3363 channels of services)

Slot 15

Slot 33 (132 channels of services)


Slot 34 (3363 channels of services)

Slot 16

Slot 35 (132 channels of services)


Slot 36 (3363 channels of services)

Slot 1 can house a protection board for the TPS protection. The board in slot 1 protects the boards in
slots 25 and 1316.

If the interface board for the boards in slots 25 and 1316 is the D12B, the boards in slots 25 and
1316 cannot be protected by the TPS protection scheme.

11.2.8 Feature Code


The PQM does not have a feature code.
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11.2.9 Board Protection


The PQM supports the 1:N TPS protection.

1.1.1.1.779 Protection Principle


The PQM boards can work with the D12S boards to realize one 1:N (N8) TPS protection
group.
Figure 11-11 shows the TPS protection provided by the PQM.
Figure 1.1 TPS protection provided by the PQM (E1 services are provided as an example)
Service signal

Service signal
Switching
control bus

Interface board

Protection bus
Protection bus

Crossconnect and
timing board

Interface board

Interface board

Interface board

Interface board

Interface board

Working board N

Working board

Working board 1

Protection board

Failed

When the cross-connect and timing board detects that a working PQM is faulty, the crossconnect and timing board issues a service switching command. Then, the interface board
switches the services from the faulty PQM to the protection PQM, which realizes the
protection of the services.
TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing
board. Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

1.1.1.1.780 Hardware Configuration


Table 11-9 shows the slot configuration for the 1:8 TPS protection of the PQM.
Figure 1.1 Slot configuration for the 1:8 TPS protection of the PQM
Working
Board

Protection Board

Slot Configuration

PQM (E1)

PQM (E1)

PQM (T1)

PQM (T1)

Slot 1 can house a protection board. The


board in slot 1 protects the boards in slots 2-5
and 13-16. Figure 11-12 shows the slot

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Working
Board

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Protection Board

Slot Configuration
configuration for the 1:8 TPS protection of
the PQM.

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
7

AUX

S
L
O
T
3
1

S
L
O
T
3
4

S
L
O
T
1
0

Working

Working

XCS

XCS

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

GSCC

S
L
O
T
9

Working

S S S S
L L L L
O O O O
T T T T
5 6 7 8

FAN

Working

S
L
O
T
4

Working

S S S
L L L
O O O
T T T
1 2 3

Working

S
L
O
T
3
0

FAN

Protection

FAN

S
L
O
T
2
9

D12S

S
L
O
T
2
8

D12S
D12S

S
L
O
T
2
7

Working
Working

S
L
O
T
2
6

D12S
D12S
D12S

S
L
O
T
2
4

D12S
D12S

S
L
O
T
2
5

PIU

S
L
O
T
2
3

PIU

S
L
O
T
2
2

D12S

S
L
O
T
2
1

D12S
D12S
D12S

S
L
O
T
2
0

D12S
D12S

S
L
O
T
1
9

D12S
D12S

Figure 1.2 Slot configuration for the 1:8 TPS protection of the PQM

Fiber routing area

11.2.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.781 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

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The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.782 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 5 Required: Set the PDH interface.

J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.

V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.

Service load indication: When a service channel does not process its carried services,
select Non-Loaded. When the service channel processes its carried services, select
Load.

For details, see 27.7 Checking Board Parameters.


Step 6 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 7 Required: Configure services. For details, see Configuring the SDH Services.

Before you configure services, learn the type of protection subnet configured for the ring network. For
the method for querying the protection subnet, see 27.1 Querying the Protection Subnet.

Step 8 Set parameters on the . For the parameters to be set, see 26.6 PDH Boards.
----End

1.1.1.1.783 Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 9 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 10 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End
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1.1.1.1.784 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 11 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

11.2.11 Parameter Settings


You can set the parameters for the PQM by using the U2000.
You can set the following parameters for the PQM by using the U2000:

J2 byte

V5 byte

Tributary loopback

For the description of each parameter, see 26 Parameter Settings.

11.2.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.785 Troubleshooting
Table 11-10 lists the faults that occur on the PQM frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the PQM frequently
Fault
Symptom

Common Fault Cause

Service
interruption

The cable or connector


becomes abnormal.

An incorrect operation
is performed.

The types or settings of


the boards are
inconsistent.

Bit error

The equipment becomes


faulty.

Pointer
justification

The clock configuration


is incorrect.

The precision of the

Issue 02 (2013-01-18)

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.


See Troubleshooting Pointer Justification.

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Fault
Symptom

11 PDH Boards

Common Fault Cause

Troubleshooting Method

external clock source is


very low.
Protection
switching
failure

The TPS fails.

See Troubleshooting Protection Switching


Faults.

1.1.1.1.786 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PQM, see Replacing a PDH Board.

11.2.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

11.2.13.1 Alarms of N1PQM


BIP_EXC

BD_STATUS

BIP_SD

CHIP_FAIL

COMMUN_FAIL

CRC4_ERR_OVER

CRC6_ERR_OVER

DOWN_E1_AIS

DOWN_T1_AIS

E1_LOC

LFA

LMFA

LOOP_ALM

LP_RDI

LP_REI

LP_SIZE_ERR

LP_SLM

LP_RFI

LP_TIM

LP_UNEQ

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

RMFA

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

T_ALOS

T_LOSEX

TEST_STATUS

TPS_ALM

TR_LOC

TS16_AIS

TU_AIS

TU_LOP

UP_E1_AIS

UP_T1AIS

V5_VCAIS

RFA

SWDL_PKG_NOBDSOFT

POWER_ABNORMAL

WRG_BD_TYPE

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11.2.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

11.2.14.1 Performance Events of N1PQM


CRC4_ERR

CRC6_ERR

E1_LCV_SDH

E1_LES_SDH

E1_LSES_SDH

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

T1_LCV_SDH

T1_LES_SDH

T1_LSES_SDH

TUPJCHIGH

TUPJCLOW

11.2.15 Technical Specifications


The technical specifications of the PQM include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.787 Parameters Specified for Electrical Interfaces


The D12S or D12B provides electrical interfaces for the PQM. For the parameters specified
for the electrical interfaces, see Technical Specifications of the D12S and Technical
Specifications of the D12B.

1.1.1.1.788 Mechanical Specifications


The mechanical specifications of the PQM are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.789 Power Consumption


The maximum power consumption of the PQM at room temperature (25C) is 22 W.

11.3 PFL1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PFL1 (8xE1 optical processing board). This topic also describes
how to configure and commission the PFL1.

11.3.1 Version Description


The PFL1 is available in one functional version, N1.
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11.3.2 Application
The PFL1 is a PDH processing board. The PFL1 can be used on the OptiX OSN equipment
series to receive/transmit and process 8xE1 optical signals.
Figure 11-13 shows the application of the PDH processing boards. The PDH processing
boards add tributary signals to line signals and drops tributary signals to line signals.
Figure 1.1 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.3.3 Functions and Features


The PFL1 processes E1 optical signals and overheads, and supports alarms, performance
events, and maintenance features.
Table 11-11 provides the functions and features of the PFL1.
Figure 1.1 Functions and features of the PFL1
Function and
Feature

PFL1

Basic functions

Processes 8xE1 optical signals.

Service
processing

Receives/Transmits and processes 8xE1 optical signals.

Optical port
specifications

Supports I-2M optical ports, which comply with standards defined by


Huawei.

Optical module
specifications

Supports the detection and query of information about an optical


module.

Allows setting the on/off state of a laser and supports the automatic
laser shutdown (ALS) function.

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Function and
Feature

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PFL1

Supports the usage and monitoring of eSFP optical modules,


facilitating optical module maintenance.

Overhead
processing

Processes path overheads at the VC-12 level, such as J2 bytes.

Alarms and
performance
events

Provides various alarms and performance events, facilitating equipment


management and maintenance.

Maintenance
features

Supports inloops and outloops at optical ports.

Supports warm resets and cold resets. Warm resets do not affect
ongoing services.

Supports the query of board manufacturer information.

Supports in-service FPGA loading.

Supports board software upgrades without affecting ongoing services.

Supports the PRBS test in the tributary direction and in the crossconnect direction.

Protection
scheme

TPS protection is not supported.

11.3.4 Working Principle and Signal Flow


The PFL1 consists of the client-side receive/transmit module, mapping/demapping module,
interface converting module, logic and control module, clock module, and power module.
Figure 11-14 shows the functional block diagram of the PFL1.

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Figure 1.1 Functional block diagram of the PFL1


Backplane

E1

Clientside
interface
module

Interface
converting
module

Mapping/Demappi
ng module

Cross-connect
unit A/B
Cross-connect
unit A/B

Communication
Logic and control module
32 MHz
38 MHz
58 MHz
66 MHz

Clock
module

Reference clock and frame header

+3.3 V
Power
module

Power
module

Fuse
Fuse

SCC unit
Cross-connect
unit A/B

-48 V/-60 V
-48 V/-60 V
+3.3 V backup
power

1.1.1.1.790 Client-Side Receive/Transmit Module


The client-side receive/transmit module performs the following functions:

In the receive direction, converts received optical signals into electrical signals.

In the transmit direction, converts received electrical signals into E1 optical signals.

Detects the T_ALOS alarm and provides the ALS function.

1.1.1.1.791 Mapping/Demapping Module


The mapping/demapping module maps 8xE1 signals into VC-4 signals or demaps VC-4
signals into 8xE1 signals by using asynchronous mapping.

1.1.1.1.792 Interface Converting Module


The interface converting module converts the signal bus into a parallel bus. The interface
converting module connects the high-rate backplane interface to the low-rate interface chip of
the transmit system.

1.1.1.1.793 Logic and Control Module


The logic control module collects and reports information about board status. This module
contains basic logic units and performs the following functions:

Recovers clock signals from an optical module.

Realizes inter-board communication using internal Ethernet interfaces.

Selects and traces clock signals from the active and standby cross-connect units.

Selects clock signals and frame header signals from the active and standby cross-connect
units.

Controls board indicators.

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1.1.1.1.794 Clock Module


The clock module provides the desired reference clock to boards.

1.1.1.1.795 Power Module


The power module converts the -48 V/-60 V power supply into required DC voltages.

11.3.5 Front Panel


The front panel of the PFL1 has indicators.

1.1.1.1.796 Diagram of the Front Panel


Figure 11-15 shows the front panel of the PFL1.
Figure 1.1 Front panel of the PFL1

PFL1
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

TX1 RX1
TX2 RX2
TX3 RX3
TX4 RX4
TX5 RX5
TX6 RX6
TX7 RX7
TX8 RX8
PFL1

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1.1.1.1.797 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.798 Interfaces
The front panel of the PFL1 has eight optical interfaces. Table 11-12 describes the types and
usage of the optical interfaces on the PFL1.
Figure 1.1 Electrical ports on the PFL1
Port

Port Type

Usage

RX1-RX8

LC

Receives optical signals.

TX1-TX8

LC

Transmits optical signals.

11.3.6 Jumpers and DIP Switches


The PFL1 does not have any jumpers or DIP switches for board settings.

11.3.7 Valid Slots


The PFL1 must be installed in a valid slot in the subrack. Otherwise, the PFL1 fails to work
properly.
The PFL1 can be installed in slots 1-8 and slots 11-16.

11.3.8 Feature Code


The PFL1 does not have a feature code.

11.3.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the board hardware, configuring the board,
commissioning the board, and checking the operation of the board.

1.1.1.1.799 Checking the Board Hardware


Step 1 Required: Check the board hardware.

The labels on the front panel of the board are correct and clear.

The daughter board of the board is properly installed.

All the components on both surfaces of the board are available and intact.

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Step 2 Required: Verify that cables match the board.


Step 3 Required: Insert the board. For details, see Replacing Boards Onsite. Ensure that the board is
in proper contact with the bottom of the subrack and the front panel of the board is properly
locked.
Step 4 Required: Verify that the version of the board software matches the version of the NE
software and the version of the U2000 software.
----End

1.1.1.1.800 Configuring the Board


Step 1 Required: Add a logical board. For details, see Adding Boards.
Step 5 Required: Set the PDH port.

J2 byte: The settings of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.

V5 byte: The settings of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.

Service load indication: If a service channel does not process its carried services, select
Non-Loaded. If a service channel processes its carried services, select Load.

For details, see 27.7 Checking Board Parameters.


Step 6 Required: Configure services. For details, see Configuring the SDH Services.
Step 7 Optional: Set parameters on the U2000. For details, see 26.6 PDH Boards.
----End

1.1.1.1.801 Commissioning the Board


Step 1 Required: Test the optical port specifications. For details, see Testing Specifications of
Optical Interfaces.
Step 8 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.802 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

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11.3.10 Parameter Settings


You can set parameters for the PFL1 by using the U2000.
You can set the following parameters for the PFL1 by using the U2000:

J2 byte

V5 byte

Tributary loopback

For the description of each parameter, see 26 Parameter Settings.

11.3.11 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.803 Troubleshooting
Table 11-13 lists the faults that occur on the PFL1 frequently and the troubleshooting
methods.
The PFL1 uses an SFP optical module. If the PFL1 operates and an abnormal alarm occurs on the optical
interface, check whether the optical module is properly installed. To check whether the optical module is
properly installed, you can reseat the optical module.

Figure 1.1 Methods used to rectify the faults that occur on the PFL1 frequently
Fault
Symptom

Common Fault Cause

Service
interruption

The optical fiber or


connector is faulty.

An incorrect operation
is performed.

The types or settings of


the boards are
inconsistent.

The equipment
becomes faulty.

The optical power


becomes abnormal.

The clock configuration


is incorrect.

The precision of the


external clock source is
very low.

Bit error

Pointer
justification

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.

See Troubleshooting Pointer Justification.

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1.1.1.1.804 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information about how to replace the PFL1, see Replacing a PDH Board.

11.3.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

11.3.12.1 Alarms of N1PFL1


T_ALOS

LP_SIZE_ERR

UP_E1_AIS

BIP_EXC

BIP_SD

LP_RFI

TU_AIS

TU_LOP

LP_UNEQ

LP_TIM

LP_SLM

LP_RDI

LP_REI

LOOP_ALM

CHIP_FAIL

NO_BD_SOFT

POWER_ABNORMAL

TEST_STATUS

T_LOSEX

TR_LOC

V5_VCAIS

SLAVE_WORKING

DOWN_E1_AIS

COMMUN_FAIL

BD_STATUS

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

TF

IN_PWR_ABN

OUT_PWR_ABN

LSR_WILL_DIE

LSR_COOL_ALM

TEM_HA

TEM_LA

LASER_SHUT

LSR_NO_FITED

LASER_MOD_ERR

ALM_ALS

WRG_BD_TYPE

11.3.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the U2000.

11.3.13.1 Performance Events of N1PFL1


LPBBE

LPES

LPUAS

LPCSES

LPSES

LPFEBBE

LPFEES

LPFESES

LPFEUAS

LPFECSES

TUPJCHIGH

TUPJCLOW

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TLBMAX

TLBMIN

TLBCUR

OSPICCVMAX

OSPICCVMIN

OSPICCVCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

11.3.14 Technical Specifications


The technical specifications of the PFL1 include the parameters specified for optical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.805 Parameters Specified for Optical Interfaces


Table 11-14 lists the parameters specified for the optical interfaces of the PFL1.
Figure 1.1 Parameters specified for the optical interfaces of the PFL1
Parameter

Value

Nominal bit rate

2048 kbit/s

Code type

NRZ

Type of optical interface

I-2M

Transmission distance (km)

0 to 2

Operating wavelength range


(nm)

1260 to 1360

Type of fiber

Single-mode LC

Launched optical power


(dBm)

-15 to -8

Optical receiver sensitivity


(dBm)

-23

Minimum overload (dBm)

-8

Minimum extinction ratio


(dB)

8.2

Maximum -20 dB spectral


width (nm)

Side mode suppression ratio


(dB)

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1.1.1.1.806 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.807 Mechanical Specifications


The mechanical specifications of the PFL1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.808 Power consumption


The maximum power consumption of the PFL1 at room temperature (25C) is 17 W.

11.4 PL3
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PL3 (3xE3/T3 service processing board). This topic also
describes how to configure and commission the PL3.

11.4.1 Version Description


The PL3 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to their functions. The N1PL3 is discontinued.
Table 11-15 describes the versions of the PL3.
Figure 1.1 Versions of the PL3
Item

Description

Functional versions

The PL3 is available in two functional versions, namely, N1 and


N2.

Differences

Service processing: E13 function and M13 function.

Maintenance features: PRBS function and CRC function.

Substitution

The N2PL3 can replace the N1PL3.

11.4.2 Application
The PL3 is a PDH processing board. The PL3 can be used on the OptiX OSN equipment
series to add and drop PDH signals. To transmit/receive and process 3xE3/T3 signals, the PL3
must be used with the interface board.
Figure 11-16 shows the application of the PDH processing boards. The PDH processing
boards add tributary signals to line signals and drops tributary signals to line signals.

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Figure 1.1 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.4.3 Functions and Features


The PL3 processes E3/T3 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-16 provides the functions and features of the PL3.
Figure 1.2 Functions and features of the PL3
Function and
Feature

PL3

Basic functions

Processes 3xE3/T3 signals.

Service processing

Transmits/Receives and processes 3xE3/T3 electrical signals.


The N2PL3 supports the E13 function, which is used to converge E1
services into E3 services.
The N2PL3 supports the M13 function, which is used to converge T1
services into T3 services.

Overhead
processing

Supports the setting and query of all the path overhead bytes at the
VC-3 level.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

Supports inloops and outloops at electrical interfaces.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

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Function and
Feature

PL3

Supports the upgrade of the board software without affecting


services.

The N1PL3 supports the PRBS test in only the tributary direction.

The N2PL3:

Protection
schemes

11 PDH Boards

Supports the PRBS test in the tributary


direction and in the cross-connect
direction in the normal mode.

Does not support the PRBS test in the


Server mode.

Support the PRBS test in the electrical


interface direction in the MUX mode.

The N1PL3 does not support the CRC function, but the N2PL3
supports the CRC function.

Supports the TPS protection when working with the interface board
and the switching and bridging board.

11.4.4 Working Principle and Signal Flow


The PL3 consists of the interface module, mapping/demapping module, interface converting
module, logic and control module, and power module.
Figure 11-17 shows the functional block diagram of the PL3.

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Figure 1.1 Functional block diagram of the PL3


Backplane
155 MHz
PLL

34 MHz/45 MHz
OSC

E3/T3

3x34 Mbit/s
3x45 Mbit/s

LIU
PPI

E3/T3

LIU

2x155 Mbit/s

Mapping/
Demapping
3x34 Mbit/s
2x155 Mbit/s
module
3x45 Mbit/s

Reference
clock

High-speed
bus

Interface
converting
High-speed
module
bus

Cross-connect
unit

Cross-connect
unit A
Cross-connect
unit B

Interface
module

LOS
Outloop/Inloop
control

Cross-connect
unit

Frame header
Communication

Logic and
control module
+3.3 V
Power
module

Power
module

SCC unit

Fuse

-48 V/-60 V
-48V/-60V

Fuse

+3.3 V backup power

LIU: logic interface unit

PPI: PDH physical interface

OSC: oscillator

Figure 11-18 shows the functional block diagram of the mapping/demapping module.
Figure 1.2 Functional block diagram of the mapping/demapping module
Mapping/demapping module
E3/T3

LPA

PDH AIS
detector

E3/T3
LPA

LPT

LPOH (J1/C2/
B3) insertion
LPOH (J1/C2/
B3) extraction

LPT

HPA

HPT

STM-1

TU-AIS/TULOP detector

HPA

HPT

STM-1

LPA: low order path adaptation

LPT: low order path termination

HPA: high order path adaptation

HPT: high order path termination

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1.1.1.1.809 Interface Module


The interface module consists of LIUs and provides the inloop and outloop functions. The
interface module performs the following functions:

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the P_LOS alarm.

1.1.1.1.810 Mapping/Demapping Module

LPA sub-module
The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be
adapted so that the stream can be transported to the synchronous network.

LPT sub-module
The virtual container (VC-3) is formatted. The VC-3 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C-3 container and POH. The POH contains nine octets equally distributed within the
frame bytes for VC-3, namely, J1, B3, C2, G1, F2, H4, F3, K3, and N1.

HPA sub-module
The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-3s, which are located and isolated in TU-3s. The
TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added
with the TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The
sequence is as follows: TU-3->TUG3->VC-4

HPT sub-module
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module


These sub-modules are required to create a proprietary STM1 signal so that the
interface converting module can be connected.

1.1.1.1.811 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.812 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.813 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
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require.

11.4.5 Front Panel


The front panel of the PL3 has indicators.

1.1.1.1.814 Diagram of the Front Panel


Figure 11-19 shows the appearance of the front panel of the PL3.
Figure 1.1 Front panel of the PL3

PL3
STAT
ACT
PROG
SRV

PL3

1.1.1.1.815 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

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Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.816 Interfaces
The front panel of the PL3 does not have an interface.
The C34S provides E3/T3 interfaces for the PL3. For details, see the topic that describes the
C34S.

11.4.6 Jumpers and DIP Switches


The PL3 does not have any jumpers or DIP switches that are used for board settings.

11.4.7 Valid Slots


The PL3 must be used with the C34S. In addition, the PL3 must be installed in a valid slot in
the subrack. Otherwise, the PL3 cannot work normally.
The PL3 can be installed in slots 25 and 1316 in the main subrack.
The PL3 must be used with the C34S.
Table 11-17 lists the slots valid for the PL3 and the corresponding slots for the C34S in the
main subrack.
Figure 1.1 Slots valid for the PL3 and the corresponding slots for the C34S in the main subrack
Slot Valid for the PL3

Corresponding Slot for the C34S

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

11.4.8 Feature Code


The IFSD1 does not have a feature code.

11.4.9 Board Protection


The PL3 supports the 1:N TPS protection.

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1.1.1.1.817 Protection Principle


The PL3 can be configured into two 1:N (N3) TPS protection groups when the PL3 works
with the C34S and TSB8/TSB4.
Figure 11-20 shows the TPS protection provided by the PL3.
Figure 1.1 TPS protection provided by the PL3 in the OptiX OSN 1500B subrack
Service signal

Service signal
Switching
control bus

Crossconnect and
timing board

Interface board N

Working board N

Working board

Working board 1

Protection board

Interface board

Interface board 1

Protection
switching board

Failed

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the corresponding working board through position 1 of the control switch on the
interface board.

Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding interface board switches from position 1 to position 2. At the
same time, the control switch of the protection switching board switches to the
corresponding position so that the protection board can protect the failed working board.
TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing
board. Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

1.1.1.1.818 Hardware Configuration


Table 11-18 shows the slot configuration for the 1:3 TPS protection of the PL3.
Figure 1.1 Slot configuration for the 1:3 TPS protection of the PL3
Working
Board

Protection Board

Slot Configuration

PL3 (E3)

PL3 (E3)/PD3 (E3)

If the working board is the PL3, the PD3

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Working
Board

Protection Board

Slot Configuration

PL3 (T3)

PL3 (T3)/PD3 (T3)

can be the protection board. Figure 11-21


shows the slot configuration for the 1:3
TPS protection of the PL3.

S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
3
7

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

GSCC

Working 1

S
L
O
T
1
0

S
L
O
T
3
6

FAN

Working 2

Working 1

S
L
O
T
9

S
L
O
T
3
5

AUX

S
L
O
T
3
2

TSB8/TSB4

S
L
O
T
3
1

Working 2

S S S S
L L L L
O O O O
T T T T
5 6 7 8

XCS

S
L
O
T
4

XCS

S S S
L L L
O O O
T T T
1 2 3

Working 1

S
L
O
T
3
0

FAN

Protection 1

FAN

S
L
O
T
2
9

Working 2

S
L
O
T
2
8

Protection 2

S
L
O
T
2
7

C34S

S
L
O
T
2
6

C34S

S
L
O
T
2
5

C34S

S
L
O
T
2
4

PIU

S
L
O
T
2
3

C34S

S
L
O
T
2
2

C34S

S
L
O
T
2
1

C34S

S
L
O
T
2
0

TSB8/TSB4

S
L
O
T
1
9

PIU

Figure 1.2 Slot configuration for the two 1:3 TPS protection groups of the PL3

Fiber routing area

In Figure 11-21, the board in slot 2 protects the boards in slots 3-5. The board in slot 16
protects the boards in slots 13-15.
Table 11-19 lists the slots for the PL3, C34S, and TSB8/TSB4.
Figure 1.2 Slots for the PL3, C34S, and TSB8/TSB4
Board

Protection Group 1

Protection Group 2

PL3 (working board)

Slots 3, 4, and 5

Slots 13, 14, and 15

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Board

Protection Group 1

Protection Group 2

PL3 (protection board)

Slot 2

Slot 16

TSB8/TSB4

Slot 19

Slot 35

C34S

Slots 21, 23, and 25

Slots 29, 31, and 33

11.4.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.819 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.820 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 5 Required: Set the PDH interface.

J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.

V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.

Service load indication: When a service channel does not process its carried services,
select Non-Loaded. When the service channel processes its carried services, select
Load.

For details, see 27.7 Checking Board Parameters.


Step 6 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 7 Required: Configure services. For details, see Configuring the SDH Services.
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Before you configure services, learn the type of protection subnet configured for the ring network. For
the method for querying the protection subnet, see 27.1 Querying the Protection Subnet.

Step 8 Set parameters on the . For the parameters to be set, see 26.6 PDH Boards.
----End

1.1.1.1.821 Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 9 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 10 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.822 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 11 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

11.4.11 Parameter Settings


You can set the parameters for the PL3 by using the U2000.
You can set the following parameters for the PL3 by using the U2000:

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For the description of each parameter, see 26 Parameter Settings.

11.4.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

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1.1.1.1.823 Troubleshooting
Table 11-20 lists the faults that occur on the PL3 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the PL3 frequently
Fault
Symptom

Common Fault Cause

Service
interruption

The cable or connector


becomes abnormal.

An incorrect operation
is performed.

The types or settings of


the boards are
inconsistent.

Bit error

The equipment becomes


faulty.

Pointer
justification

The clock configuration


is incorrect.

The precision of the


external clock source is
very low.

Protection
switching
failure

The TPS fails.

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.


See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

1.1.1.1.824 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PL3, see Replacing a PDH Board.

11.4.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

11.4.13.1 Alarms of N1PL3


A_LOC

B3_EXC

B3_SD

BD_STATUS

BDID_ERROR

C2_VCAIS

CHIP_FAIL

COMMUN_FAIL

FPGA_ABN

LOOP_ALM

LP_R_FIFO

LP_RDI

LP_REI

LP_SLM

LP_T_FIFO

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LP_TIM

LP_UNEQ

NO_BD_SOFT

P_AIS

P_LOS

PLL_FAIL

POWER_ABNORMAL

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

T_LOSEX

TEST_STATUS

TPS_ALM

TR_LOC

TU_AIS

TU_LOP

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

11.4.13.2 Alarms of N2PL3


B3_EXC

B3_SD

BD_STATUS

BIP_EXC

BIP_SD

C2_VCAIS

CHIP_ABN

CHIP_FAIL

COMMUN_FAIL

CRC6_ERR_OVER

DOWN_E1_AIS

DOWN_T1_AIS

DS3_IDLE

CRC4_ERR_OVER

LFA

LMFA

LOOP_ALM

LP_RFI

LP_RDI

LP_REI

LP_TIM

LP_SLM

NO_BD_SOFT

P_AIS

LP_UNEQ

P_LOF

P_LOS

P_RAI

SUBCARD_ABN

POWER_ABNORMAL

SLAVE_WORKING

TEST_STATUS

T_LOSEX

TEMP_OVER

TU_AIS

TPS_ALM

TR_LOC

UP_T1AIS

TU_LOP

UP_E1_AIS

PATCH_NOT_CONFIRM

V5_VCAIS

PATCH_ERR

SWDL_PKG_NOBDSOF
T

PATCHFILE_NOTEXIST

P_FFM

WRG_BD_TYPE

11.4.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

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11.4.14.1 Performance Events of N1PL3


E3_LCV_SDH

E3_LES_SDH

E3_LSES_SDH

T3_LCV_SDH

T3_LES_SDH

T3_LSES_SDH

TUPJCHIGH

TUPJCLOW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

11.4.14.2 Performance Events of N2PL3


CRC4_ERR

CRC6_ERR

E3_LCV_SDH

E3_LES_SDH

E3_LSES_SDH

LPBBE

LPES

LPFEBBE

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

T3_LCV_SDH

T3_LES_SDH

T3_LSES_SDH

TUPJCHIGH

TUPJCLOW

TUPJCNEW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

VC3FECSES

LPCSES

LPFECSES

11.4.15 Technical Specifications


The technical specifications of the PL3 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.825 Parameters Specified for Electrical Interfaces


The C34S provides electrical interfaces for the PL3. For the parameters specified for the
electrical interfaces, see Technical Specifications of the C34S.

1.1.1.1.826 Mechanical Specifications


The mechanical specifications of the PL3 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1PL3 (kg): 1.0

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Weight of the N2PL3 (kg): 0.9

1.1.1.1.827 Power Consumption


The maximum power consumption of the N1PL3 at room temperature (25C) is 15 W.
The maximum power consumption of the N2PL3 at room temperature (25C) is 12 W.

11.5 PL3A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the PL3A (3xE3/T3 service processing board with the interfaces on
the front panel). This topic also describes how to configure and commission the PL3A.

11.5.1 Version Description


The PL3A is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to whether they support the E13/M13 function. The N1PL3A
is discontinued.
Table 11-21 describes the versions of the PL3A.
Figure 1.1 Versions of the PL3A
Item

Description

Functional versions

The PL3A is available in two functional versions, namely, N1 and


N2.

Differences

Service processing: E13 function and M13 function.

Maintenance features: PRBS function and CRC function.

Substitution

The N2PL3A can replace the N1PL3A.

11.5.2 Application
The PL3A is a PDH processing board. The PL3A can be used on the OptiX OSN equipment
series to add and drop PDH signals. To transmit/receive and process 3xE3/T3 signals, the
PL3A uses the interfaces on its front panel.
Figure 11-22 shows the application of the PDH processing boards. The PDH processing
boards add tributary signals to line signals and drops tributary signals to line signals.

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Figure 1.1 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.5.3 Functions and Features


The PL3A processes E3/T3 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-22 provides the functions and features of the PL3A.
Figure 1.2 Functions and features of the PL3A
Function and
Feature

PL3A

Basic functions

Processes 3xE3/T3 signals.

Service processing

Transmits/Receives and processes 3xE3/T3 electrical signals.


The N2PL3A supports the E13 function, which is used to converge
E1 services into E3 services.
The N2PL3A supports the M13 function, which is used to converge
T1 services into T3 services.

Overhead
processing

Supports the setting and query of all the path overhead bytes at the
VC-3 level.

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

Supports inloops and outloops at electrical interfaces.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the


board.

Supports the in-service loading of the FPGA.

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Feature

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PL3A

Supports the upgrade of the board software without affecting


services.

The N1PL3A supports the PRBS test in only the tributary


direction.

The N2PL3A:

Supports the PRBS test in the tributary


direction and in the cross-connect
direction in the normal mode.

Does not support the PRBS test in the


Server mode.

Support the PRBS test in the electrical


interface direction in the MUX mode.

The N1PLS3A does not support the CRC function, but the
N2PL3A supports the CRC function.

11.5.4 Working Principle and Signal Flow


The PL3A consists of the interface module, mapping/demapping module, interface converting
module, logic and control module, and power module.
Figure 11-23 shows the functional block diagram of the PL3A.
Figure 1.1 Functional block diagram of the PL3A
Backplane
155 MHz
PLL

34 MHz/45 MHz
OSC

E3/T3

3x34 Mbit/s
3x45 Mbit/s

LIU
PPI

E3/T3

LIU

2x155 Mbit/s

Mapping/
Demapping
3x34 Mbit/s
2x155 Mbit/s
module
3x45 Mbit/s

Reference
clock

High-speed
bus

Interface
converting
module High-speed
bus

Cross-connect
unit

Cross-connect
unit A
Cross-connect
unit B

Interface
module

LOS
Outloop/Inloop
control

+3.3 V
Power
module

LIU: logic interface unit


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Frame header
Communication

Logic and
control module

Power
module

Fuse
Fuse

Cross-connect
unit
SCC unit
-48 V/-60 V
-48V/-60V
+3.3 V backup power

PPI: PDH physical interface

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OSC: oscillator

Figure 11-24 shows the functional block diagram of the mapping/demapping module.
Figure 1.2 Functional block diagram of the mapping/demapping module
Mapping/demapping module
E3/T3

LPA

HPA

LPT

LPOH (J1/C2/
B3) insertion

PDH AIS
detector

LPOH (J1/C2/
B3) extraction

E3/T3

STM-1

TU-AIS/TULOP detector

HPA

LPT

LPA

HPT

HPT

STM-1

LPA: low order path adaptation

LPT: low order path termination

HPA: high order path adaptation

HPT: high order path termination

1.1.1.1.828 Interface Module


The interface module consists of LIUs and provides the inloop and outloop functions. The
interface module performs the following functions:

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the P_LOS alarm.

1.1.1.1.829 Mapping/Demapping Module

LPA sub-module
The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be
adapted so that the stream can be transported to the synchronous network.

LPT sub-module
The virtual container (VC-3) is formatted. The VC-3 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C-3 container and POH. The POH contains nine octets equally distributed within the
frame bytes for VC-3, namely, J1, B3, C2, G1, F2, H4, F3, K3, and N1.

HPA sub-module
The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-3s, which are located and isolated in TU-3s. The
TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added

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with the TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The
sequence is as follows: TU-3->TUG3->VC-4

HPT sub-module
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module


These sub-modules are required to create a proprietary STM1 signal so that the
interface converting module can be connected.

1.1.1.1.830 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.831 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.832 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

11.5.5 Front Panel


The front panel of the PL3A has indicators and interfaces.

1.1.1.1.833 Diagram of the Front Panel


Figure 11-25 shows the appearance of the front panel of the PL3A.

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Figure 1.1 Front panel of the PL3A

PL3A
STAT
ACT
PROG
SRV

OUT1
IN1
OUT2
IN2
OUT3
IN3

PL3A

1.1.1.1.834 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.835 Interfaces
The front panel of the PL3A has three pairs of 75-ohm unbalanced interfaces, which are of the
SMB type.

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11.5.6 Jumpers and DIP Switches


The PL3A does not have any jumpers or DIP switches that are used for board settings.

11.5.7 Valid Slots


The PL3A must be installed in a valid slot in the subrack. Otherwise, the PL3A cannot work
normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the PL3A vary with the cross-connect capacity of the subrack. The slots
valid for the PL3A are as follows:

When the cross-connect capacity is 200 Gbit/s, the PL3A can be installed in slots 18
and 1117 in the main subrack.

11.5.8 Feature Code


The IFSD1 does not have a feature code.

11.5.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.836 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.837 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
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Step 5 Required: Set the PDH interface.

J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.

V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.

Service load indication: When a service channel does not process its carried services,
select Non-Loaded. When the service channel processes its carried services, select
Load.

For details, see 27.7 Checking Board Parameters.


Step 6 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 7 Required: Configure services. For details, see Configuring the SDH Services.

Before you configure services, learn the type of protection subnet configured for the ring network. For
the method for querying the protection subnet, see 27.1 Querying the Protection Subnet.

Step 8 Set parameters on the . For the parameters to be set, see 26.6 PDH Boards.
----End

1.1.1.1.838 Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 9 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 10 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.839 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 11 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

11.5.10 Parameter Settings


You can set the parameters for the PL3A by using the U2000.

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You can set the following parameters for the PL3A by using the U2000:

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For the description of each parameter, see 26 Parameter Settings.

11.5.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.840 Troubleshooting
Table 11-23 lists the faults that occur on the PL3A frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the PL3A frequently
Fault
Symptom

Common Fault Cause

Service
interruption

The cable or connector


becomes abnormal.

An incorrect operation
is performed.

The types or settings of


the boards are
inconsistent.

Bit error

The equipment becomes


faulty.

Pointer
justification

The clock configuration


is incorrect.

The precision of the


external clock source is
very low.

Protection
switching
failure

The TPS fails.

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Bit Errors.


See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

1.1.1.1.841 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the PL3A, see Replacing a PDH Board.
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11.5.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

11.5.12.1 Alarms of N1PL3A


A_LOC

B3_EXC

B3_SD

BD_STATUS

BDID_ERROR

C2_VCAIS

CHIP_FAIL

COMMUN_FAIL

FPGA_ABN

LOOP_ALM

LP_R_FIFO

LP_RDI

LP_REI

LP_SLM

LP_T_FIFO

LP_TIM

LP_UNEQ

NO_BD_SOFT

P_AIS

P_LOS

PLL_FAIL

POWER_ABNORMAL

SLAVE_WORKING

T_LOSEX

TEST_STATUS

TR_LOC

TU_AIS

TU_LOP

W_R_FAIL

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSO
FT

WRG_BD_TYPE

11.5.12.2 Alarms of N2PL3A


BD_STATUS

B3_EXC

B3_SD

BIP_SD

C2_VCAIS

BIP_EXC

CHIP_FAIL

COMMUN_FAIL

CHIP_ABN

CRC6_ERR_OVER

DOWN_E1_AIS

CRC4_ERR_OVER

DS3_IDLE

LOOP_ALM

DOWN_T1_AIS

LMFA

LP_REI

LFA

LP_RDI

NO_BD_SOFT

LP_RFI

LP_SLM

P_LOF

LP_TIM

LP_UNEQ

P_AIS

P_FFM

P_RAI

TPS_ALM

UP_E1_AIS

SLAVE_WORKING

SUBCARD_ABN

P_LOS

TEMP_OVER

TEST_STATUS

POWER_ABNORMAL

TU_AIS

TU_LOP

T_LOSEX

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V5_VCAIS

PATCH_ERR

TR_LOC

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

UP_T1AIS

PATCH_NOT_CONFIRM

WRG_BD_TYPE

11.5.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

11.5.13.1 Performance Events of N1PL3A


E3_LCV_SDH

E3_LES_SDH

E3_LSES_SDH

T3_LCV_SDH

T3_LES_SDH

T3_LSES_SDH

TUPJCHIGH

TUPJCLOW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

TUPJCNEW

11.5.13.2 Performance Events of N2PL3A


CRC4_ERR

CRC6_ERR

E3_LCV_SDH

E3_LES_SDH

E3_LSES_SDH

LPBBE

LPES

LPFEBBE

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

T3_LCV_SDH

T3_LES_SDH

T3_LSES_SDH

TUPJCHIGH

TUPJCLOW

TUPJCNEW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

VC3FECSES

LPCSES

LPFECSES

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11.5.14 Technical Specifications


The technical specifications of the PL3A include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.842 Parameters Specified for Electrical Interfaces


Table 11-24 lists the parameters specified for the electrical interfaces of the PL3A.
Figure 1.1 Parameters specified for the electrical interfaces of the PL3A
Nominal bit rate

34368 kbit/s

44736 kbit/s

Line code pattern

HDB3

B3ZS

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the
input interface
Allowed frequency deviation
at the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T


G.823.

Complies with ITU-T


G.824.

Anti-interference capability at
the input interface

Complies with ITU-T


G.703.

Reflection attenuation at the


input/output interface
Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter

Complies with ITU-T G.783.

Combined jitter
Jitter transfer function

Complies with ITU-T


G.751.

Impedance (ohm)

75

1.1.1.1.843 Mechanical Specifications


The mechanical specifications of the PL3A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1PL3A (kg): 1.0

Weight of the N2PL3A (kg): 0.9

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1.1.1.1.844 Power Consumption


The maximum power consumption of the N1PL3A at room temperature (25C) is 15 W.
The maximum power consumption of the N2PL3A at room temperature (25C) is 12 W.

11.6 PD3
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PD3 (6xE3/T3 service processing board).

11.6.1 Version Description


The PD3 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to whether they support the E13/M13 function. The N1PD3 is
no longer manufactured.
Table 11-25 describes the versions of the PD3.
Figure 1.1 Versions of the PD3
Item

Description

Functional
versions

The PD3 is available in two functional versions, namely, N1 and N2.

Differences

Service processing: E13 function and M13 function.

Maintenance features: CRC function.

Substitution

The N2PD3 can replace the N1PD3.

11.6.2 Application
The PD3 is a PDH processing board. The PD3 can be used on the OptiX OSN equipment
series to add and drop PDH signals. To transmit/receive and process 6xE3/T3 signals, the PD3
must be used with the interface board.
Figure 11-26 shows the application of the PDH processing boards. The PDH processing
boards add tributary signals to line signals and drops tributary signals to line signals.

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Figure 1.1 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.6.3 Functions and Features


The PD3 processes E3/T3 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-26 provides the functions and features of the PD3.
Figure 1.2 Functions and features of the PD3
Function and
Feature

PD3

Basic
functions

Processes 6xE3/T3 signals.

Service
processing

Transmits/Receives and processes 6xE3/T3 electrical signals.

The N2PD3 supports the E13 function, which is used to converge E1


services into E3 services.

The N2PD3 supports the M13 function, which is used to converge T1


services into T3 services.

Overhead
processing

Supports the setting and query of all the path overhead bytes at the VC-3
level.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

Supports inloops and outloops at electrical interfaces.

Supports warm resets and cold resets. The warm reset does not affect
services.

Supports the query of the manufacturing information of the board.

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Function and
Feature

PD3

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting services.

The N1PD3 supports the PRBS test in only the tributary direction.

The N2PD3:

Protection
schemes

11 PDH Boards

Supports the PRBS test in the tributary


direction and in the cross-connect direction in
the normal mode.

Does not support the PRBS test in the MUX


mode or Server mode.

The N1PD3 does not support the CRC function, but the N2PD3
supports the CRC function.

Supports the TPS protection when working with the interface board and
the switching and bridging board.

11.6.4 Working Principle and Signal Flow


The PD3 consists of the PPI module, E3/T3 mapping/demapping module, interface converting
module, logic and control module, DC/DC converter, and other modules.
Figure 11-27 shows the functional block diagram of the PD3.
Figure 1.1 Functional block diagram of the PD3
34 MHz/
45 MHz
OSC

E3/T3
E3/T3

LIU

LIU

P
I

155 MHz
PLL

6x34 Mbit/s/
6x45 Mbit/s

2x155 Mbit/s
E3/T3
Interface
mapping/
converting
6x34 Mbit/s/
demapping
module
2x155 Mbit/s
6x45 Mbit/s
module

LOS
Outloop/Inloop
control

+3.3 V

OSC: Oscillator

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DC/DC
converter

Cross-connect unit

Highspeed bus

Cross-connect unit A

Highspeed bus

Cross-connect unit B

Frame header
Communication

Logic and
control module

DC/DC
converter

Reference
clock

Fuse
Fuse

Cross-connect unit
SCC Unit
-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

PPI: PDH physical interface

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Figure 11-28 shows the functional block diagram of the E3/T3 mapping/demapping module.
Figure 1.2 Functional block diagram of the E3/T3 mapping/demapping module
Mapping/demapping module
E3/T3

LPA

HPA

LPT

LPOH (J1/C2/
B3) insertion

PDH AIS
detector

LPOH (J1/C2/
B3) extraction

E3/T3

STM-1

TU-AIS/TULOP detector

HPA

LPT

LPA

HPT

HPT

STM-1

LPA: Low order path adaptation

LPT: Low order path termination

HPA: High order path adaptation

HPT: High order path termination

The functional modules are described as follows:

1.1.1.1.845 PPI Module


The PPI module consists of LIUs and provides the inloop and outloop functions. The PPI
module performs the following functions:

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the P_LOS alarm.

1.1.1.1.846 E3/T3 Mapping/Demapping Module

LPA sub-module

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be


adapted so that the stream can be transported to the synchronous network.

LPT sub-module

The virtual container (VC-3) is formatted. The VC-3 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
VC-3 container and POH. The POH contains nine octets equally distributed within the
frame bytes for VC-3, namely, J1, B3, C2, G1, F2, H4, F3, K3, and N1.

HPA sub-module

The HPA sub-module generates and processes the channel-level TU-PTR. In the receive
direction, the signals are split into VC-3s, which are located and isolated in TU-3s. The
TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added
with the TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The
sequence is as follows: TU-3->TUG3->VC-4

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HPT sub-module

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module

These sub-modules are required to create a proprietary STM1 signal so that the
interface converting module can be connected.

1.1.1.1.847 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.848 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.849 DC/DC Converter


It converts the 48/60 V power supply into the DC voltages that the modules of the board
require.

11.6.5 Front Panel


The front panel of the PD3 has indicators.

1.1.1.1.850 Diagram of the Front Panel


Figure 11-29 shows the appearance of the front panel of the PD3.

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Figure 1.1 Front panel of the PD3

PD3
STAT
ACT
PROG
SRV

PD3

1.1.1.1.851 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.852 Interfaces
The front panel of the PD3 does not have an interface.
The D34S provides E3/T3 interfaces for the PD3. For details, see the topic that describes the
D34S.
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11.6.6 Valid Slots


The PD3 must be used with the D34S.
The PD3 can be installed in slots 25 and 1316 in the main subrack.
Table 11-27 lists the slots valid for the PD3 and the corresponding slots for the D34S in the
main subrack.
Figure 1.1 Slots valid for the PD3 and the corresponding slots for the D34S in the main subrack
Slot Valid for the PD3

Corresponding Slot for the D34S

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

11.6.7 Board Protection


The PD3 supports the 1:N TPS protection.

1.1.1.1.853 Protection Principle


The PD3 can be configured into two 1:N (N3) TPS protection groups when the PD3 works
with the D34S and TSB8. Figure 11-30 shows the TPS protection provided by the PD3.

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Figure 1.1 TPS protection provided by the PD3


6xE3/T3

TSB8

6xE3/T3

D34S

6xE3/T3

Sw itching
control
D34S
signal

D34S

Crossconnect
and timing
board
Slot 9/10
Protection
PD3

Working
PD3

Working
PD3

Working
PD3

Failed
Slot 2

Slot 3

Slot 4

Slot 5

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the PD3 through position 1 of the control switch on the D34S.

Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding D34S switches from position 1 to position 2. At the same
time, the control switch of the TSB8 switches to the corresponding position so that the
protection board can protect the failed working board.
TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing
board. Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

1.1.1.1.854 Hardware Configuration


Table 11-28 shows the slot configuration for the 1:3 TPS protection of the PD3.
Figure 1.1 Slot configuration for the 1:3 TPS protection of the PD3
Working
Board

Protection Board

Slot Configuration

PD3 (E3)

PD3 (E3)

PD3 (T3)

PD3 (T3)

Figure 11-31 shows the slot configuration


for the 1:3 TPS protection of the PD3.

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S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
3
7

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

GSCC

Working 1

S
L
O
T
1
0

S
L
O
T
3
6

FAN

Working 2

Working 1

S
L
O
T
9

S
L
O
T
3
5

AUX

S
L
O
T
3
2

TSB8

S
L
O
T
3
1

Working 2

S S S S
L L L L
O O O O
T T T T
5 6 7 8

XCS

S
L
O
T
4

XCS

S S S
L L L
O O O
T T T
1 2 3

Working 1

S
L
O
T
3
0

FAN

Protection 1

FAN

S
L
O
T
2
9

Working 2

S
L
O
T
2
8

Protection 2

S
L
O
T
2
7

D34S

S
L
O
T
2
6

D34S

S
L
O
T
2
5

D34S

S
L
O
T
2
4

PIU

S
L
O
T
2
3

D34S

S
L
O
T
2
2

D34S

S
L
O
T
2
1

D34S

S
L
O
T
2
0

TSB8

S
L
O
T
1
9

PIU

Figure 1.2 Slot configuration for the 1:3 TPS protection of the PD3

Fiber routing area

In Figure 11-31, the board in slot 2 protects the boards in slots 3-5. The board in slot 16
protects the boards in slots 13-15.
Table 11-29 lists the slots for the PD3, D34S, and TSB8.
Figure 1.2 Slots for the PD3, D34S, and TSB8
Board

Protection Group 1

Protection Group 2

PD3 (working board)

Slots 3-5

Slots 13-15

PD3 (protection board)

Slot 2

Slot 16

TSB8

Slot 19

Slot 35

D34S

Slots 21, 23, and 25

Slots 29, 31, and 33

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11.6.8 Parameter Settings


You can set the parameters for the PD3 by using the U2000.
You can set the following parameters for the PD3 by using the U2000:

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For the description of each parameter, see 26 Parameter Settings.

11.6.9 Technical Specifications


The technical specifications of the PD3 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.855 Parameters Specified for Electrical Interfaces


The C34S provides electrical interfaces for the PD3. For the parameters specified for the
electrical interfaces, see Technical Specifications of the D34S.

1.1.1.1.856 Mechanical Specifications


The mechanical specifications of the PD3 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.1

1.1.1.1.857 Power Consumption


The maximum power consumption of the N1PD3 at room temperature (25C) is 19 W.
The maximum power consumption of the N2PD3 at room temperature (25C) is 12 W.

11.7 PQ3
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PQ3 (12xE3/T3 service processing board).

11.7.1 Version Description


The PQ3 is available in one functional version, namely, N2.

11.7.2 Application
The PQ3 is a PDH processing board. The PQ3 can be used on the OptiX OSN equipment
series to add and drop PDH signals. To transmit/receive and process 12xE3/T3 signals, the
PQ3 must be used with the interface board.
Figure 11-32 shows the application of the PDH processing boards. The PDH processing
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boards add tributary signals to line signals and drops tributary signals to line signals.
Figure 1.1 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.7.3 Functions and Features


The PQ3 processes E3/T3 signals, processes overhead bytes, reports alarms and performance
events, provides maintenance features, and supports the TPS protection.
Table 11-30 provides the functions and features of the PQ3.
Figure 1.1 Functions and features of the PQ3
Function and
Feature

PQ3

Basic
functions

Processes 12xE3/T3 signals.

Service
processing

Transmits/Receives and processes 12xE3/T3 electrical signals.

Supports the E13 function, which is used to converge E1 services into


E3 services.

Supports the M13 function, which is used to converge T1 services into


T3 services.

Overhead
processing

Supports the setting and query of all the path overhead bytes at the VC-3
level.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

Supports inloops and outloops at electrical interfaces.

Supports warm resets and cold resets. The warm reset does not affect

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Feature

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PQ3
services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting services.

PRBS function:

Protection
schemes

Supports the PRBS test in the tributary


direction and in the cross-connect direction
in the normal mode.

Does not support the PRBS test in the Server


mode.

Support the PRBS test in the electrical


interface direction in the MUX mode.

Supports the CRC function.

Supports the TPS protection when working with the interface board and
the switching and bridging board.

11.7.4 Working Principle and Signal Flow


The PQ3 consists of the PPI module, E3/T3 mapping/demapping module, interface converting
module, logic and control module, DC/DC converter, and other modules.
Figure 11-33 shows the functional block diagram of the PQ3.
Figure 1.1 Functional block diagram of the PQ3
34 MHz/
45 MHz
OSC

E3/T3
E3/T3

LIU

LIU

P
I

155 MHz
PLL

12x34 Mbit/s/
12x45 Mbit/s

2x155 Mbit/s
E3/T3
Interface
mapping/
converting
12x34 Mbit/s/
demapping
module
2x155 Mbit/s
12x45 Mbit/s
module

LOS
Outloop/Inloop
control

+3.3 V

OSC: Oscillator
Issue 02 (2013-01-18)

DC/DC
converter

Cross-connect unit

Highspeed bus

Cross-connect unit A

Highspeed bus

Cross-connect unit B

Frame header
Communication

Logic and
control module

DC/DC
converter

Reference
clock

Fuse
Fuse

Cross-connect unit
SCC Unit
-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

PPI: PDH physical interface


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Figure 11-34 shows the functional block diagram of the E3/T3 mapping/demapping module.
Figure 1.2 Functional block diagram of the E3/T3 mapping/demapping module
Mapping/demapping module
E3/T3

LPA

HPA

LPT

LPOH (J1/C2/
B3) insertion

PDH AIS
detector

LPOH (J1/C2/
B3) extraction

E3/T3

STM-1

TU-AIS/TULOP detector

HPA

LPT

LPA

HPT

HPT

STM-1

LPA: Low order path adaptation

LPT: Low order path termination

HPA: High order path adaptation

HPT: High order path termination

The functional modules are described as follows:

1.1.1.1.858 PPI Module


The PPI module consists of LIUs and provides the inloop and outloop functions. The PPI
module performs the following functions:

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the P_LOS alarm.

1.1.1.1.859 E3/T3 Mapping/Demapping Module

LPA sub-module

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be


adapted so that the stream can be transported to the synchronous network.

LPT sub-module

The virtual container (VC-3) is formatted. The VC-3 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
VC-3 container and POH. The POH contains nine octets equally distributed within the
frame bytes for VC-3, namely, J1, B3, C2, G1, F2, H4, F3, K3, and N1.

HPA sub-module

The HPA sub-module generates and processes the channel-level TU-PTR. In the receive

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direction, the signals are split into VC-3s, which are located and isolated in TU-3s. The
TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added
with the TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The
sequence is as follows: TU-3->TUG3->VC-4

HPT sub-module

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST sub-module and RST sub-module

These sub-modules are required to create a proprietary STM1 signal so that the
interface converting module can be connected.

1.1.1.1.860 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.861 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.862 DC/DC Converter


It converts the 48/60 V power supply into the DC voltages that the modules of the board
require.

11.7.5 Front Panel


The front panel of the PQ3 has indicators.

1.1.1.1.863 Diagram of the Front Panel


Figure 11-35 shows the appearance of the front panel of the PQ3.

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Figure 1.1 Front panel of the PQ3

PQ3
STAT
ACT
PROG
SRV

PQ3

1.1.1.1.864 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.865 Interfaces
The front panel of the PQ3 does not have an interface.
The D34S provides E3/T3 interfaces for the PQ3. For details, see the topic that describes the
D34S.
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11.7.6 Valid Slots


The PQ3 can be installed in slots 25 and 1316, and must be used with the D34S.
Table 11-31 lists the slots valid for the PQ3 and the corresponding slots for the D34S.
Figure 1.1 Slots valid for the PQ3 and the corresponding slots for the D34S
Slot Valid for the PQ3

Corresponding Slot for the D34S

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

11.7.7 Board Protection


The PQ3 supports the 1:N TPS protection.

1.1.1.1.866 Protection Principle


The PQ3 boards can be configured into two 1:N (N3) TPS protection groups when the PQ3
boards work with two D34S boards and two TSB8 boards. Figure 11-36 shows the TPS
protection provided by the PQ3.

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Figure 1.1 TPS protection provided by the PQ3


12xE3/T3 12xE3/T3 12xE3/T3 12xE3/T3 12xE3/T3 12xE3/T3

TSB8

3 2

TSB8

D34S

D34S

D34S

D34S

Sw itching
control
D34S signal

D34S

Crossconnect
and timing
board
Slot 9/10

Protection

Working

PQ3

PQ3

Slot 2

Slot 3

Working
PQ3

Working

Failed
Slot 4

PQ3

Slot 5

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the PQ3 through position 1 of the control switch on the D34S.

Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding D34S switches from position 1 to position 2. At the same
time, the control switch of the TSB8 switches to the corresponding position so that the
protection board can protect the failed working board.
TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing
board. Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

1.1.1.1.867 Hardware Configuration


When you configure the N2PQ3 as the TPS protection board, two TSB8 boards are required.

Table 11-32 shows the slot configuration for the 1:3 TPS protection of the PQ3.
Figure 1.1 Slot configuration for the 1:3 TPS protection of the PQ3
Working
Board

Protection Board

Slot Configuration

PQ3 (E3)

PQ3 (E3)

PQ3 (T3)

PQ3 (T3)

Figure 11-37 shows the slot configuration


for the 1:3 TPS protection of the PQ3.

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S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
7

AUX

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8
Working 2

S
L
O
T
1
0

Working 2

S
L
O
T
9

FAN

Working 2

S S S S
L L L L
O O O O
T T T T
5 6 7 8

XCS

FAN

GSCC

PIU

S
L
O
T
3
2

TSB8

PIU

S
L
O
T
3
1

XCS

Working 1

Working 1

Protection 1

S S S S
L L L L
O O O O
T T T T
1 2 3 4

S
L
O
T
3
0

Working 1

FAN

S
L
O
T
2
9

TSB8

S
L
O
T
2
8

Protection 2

S
L
O
T
2
7

D34S

S
L
O
T
2
4

D34S

S
L
O
T
2
6

D34S
D34S
D34S
D34S
D34S

S
L
O
T
2
3

D34S

S
L
O
T
2
5

TSB8

S
L
O
T
2
2

D34S
D34S

S
L
O
T
2
1

D34S

S
L
O
T
2
0

D34S

S
L
O
T
1
9

TSB8

Figure 1.2 Slot configuration for the two 1:3 TPS protection groups of the PQ3

Fiber routing area

In Figure 11-37, the board in slot 2 protects the boards in slots 3-5. The board in slot 16
protects the boards in slots 13-15.
Table 11-33 lists the slots for the PQ3, D34S, and TSB8.
Figure 1.2 Slots for the PQ3, D34S, and TSB8
Board

Protection Group 1

Protection Group 2

PQ3 (working board)

Slots 3-5

Slots 13-15

PQ3 (protection board)

Slot 2

Slot 16

TSB8

Slots 19 and 20

Slots 35 and 36

D34S

Slots 21-26

Slots 29-34

11.7.8 Parameter Settings


You can set the parameters for the PQ3 by using the U2000.
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You can set the following parameters for the PQ3 by using the U2000:

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For the description of each parameter, see 26 Parameter Settings.

11.7.9 Technical Specifications


The technical specifications of the PQ3 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.868 Parameters Specified for Electrical Interfaces


The D34S provides electrical interfaces for the PQ3. For the parameters specified for the
electrical interfaces, see Technical Specifications of the D34S.

1.1.1.1.869 Mechanical Specifications


The mechanical specifications of the PQ3 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.9

1.1.1.1.870 Power Consumption


The maximum power consumption of the PQ3 at room temperature (25C) is 13 W.

11.8 DX1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the DX1 (DDN service accessing and converging board). This
topic also describes how to configure and commission the DX1.

11.8.1 Version Description


The DX1 is available in one functional version, namely, N1.

11.8.2 Application
The DX1 is a DDN service processing board. The DX1 can be used on the OptiX OSN
equipment series to add and converge the DDN services. To receive eight channels of Nx64
kbit/s signals and eight channels of framed E1 services and to cross-connect the 48 channels
of Nx64 kbit/s signals on the system side, the DX1 must be used with the interface board.
Figure 11-38 shows the application of the DDN service processing boards. The DDN service
processing boards add DDN service signals to line signals and drops line signals to DDN
service signals.

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Figure 1.1 Networking and application of the DDN service processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.8.3 Functions and Features


The DX1 cross-connects 48xE1 signals at the 64 kbit/s level on the system side.
Table 11-34 provides the functions and features of the DX1.
Figure 1.1 Functions and features of the DX1
Function
and Feature

DX1

Basic
functions

Processes eight channels of Nx64 kbit/s services and eight channels of


framed E1 services.

Cross-connects 48 channels of Nx64 kbit/s signals on the system side.

Transmits/Receives eight channels of Nx64 kbit/s and eight channels of


framed E1 services and realizes the 1:N TPS protection when working
with the DM12.

One DX1 board needs to work with two DM12 boards.

Service
processing

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

Supports inloops and outloops at electrical interfaces.

Supports the PRBS test in the cross-connect direction and in the


electrical interface direction.

Supports the CRC function.

Connectors

Issue 02 (2013-01-18)

The DB28 connectors and DB44 connectors are present on the front panel
of the DM12. The DB28 connector is used for the Nx64 kbit/s signals, and
the DB44 connector is used for the framed E1 signals.
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Function
and Feature

DX1

Protection
schemes

Supports the TPS protection when working with the interface board.

11.8.4 Working Principle and Signal Flow


The DX1 consists of the interface and frame processing module, encoding/decoding module,
timeslot cross-connect module, framing/deframing module, mapping/demapping module,
logic and control module, and power module.
Figure 11-39 shows the functional block diagram of the DX1.
Figure 1.1 Functional block diagram of the DX1
Backplane
DM12
8xFrame E1

Framed E1
interface
module

4xNx64 kbit/s

Nx64 kbit/s
interface
module

DX1 Framed E1
encoding/
decoding and
frame processing
module

Power
DM12
4xNx64 kbit/s

Backplane

Nx64 kbit/s
interface
module

Nx64 kbit/s
interface
and frame
processing
module

64 kbit/s
timeslot
cross-connect
module

Framing/
Deframing
module

Logic and
control module

Power
Framed E1
interface
module

+3.3 V
Power
module

Power
module

Mapping/
Demapping
module for
48 channels
of signals

Cross-connect
unit

SCC unit

Fuse

-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V backup power

1.1.1.1.871 In the Transmit Direction


The mapping/demapping module demaps the VC-4 signals sent from the SDH cross-connect
unit and sends the demapped signals to the framing/deframing module. Then, the
framing/deframing module converts the signals into the framed E1 signals and sends the
framed E1 signals to the timeslot cross-connect module. Finally, the timeslot cross-connect
module cross-connects and grooms the signals at the 64 kbit/s granularity, and transmits the
signals that need to be dropped on the local NE to the interface module.

1.1.1.1.872 In the Receive Direction


The DX1 transmits/receives eight channels of framed E1 signals from the framed E1 interface
module of the DM12 and eight channels of Nx64 kbit/s signals from the Nx64 kbit/s interface
module of the DM12. In addition, the DX1 restores the data signal and clock signal.
In the case of the framed E1 signals, the DX1 decodes the signals and processes the frames. In
the case of the Nx64 kbit/s signals, the DX1 converts the signals and processes the frames.
Then, the DX1 transmits the signals to the 64 kbit/s timeslot cross-connect module. The
timeslot cross-connect module cross-connects and grooms the signals at the 64 kbit/s
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granularity, and transmits the signals to the framing/deframing module. Finally, the
framing/deframing module maps the signals into VC-4s and transmits the signals to the SDH
cross-connect unit.

1.1.1.1.873 Logic and Control Module


The logic and control module performs the board communication, board control, and service
configuration functions. In addition, the logic and control module traces and selects the clock
signals and frame header signals sent from the active and standby cross-connect boards.

1.1.1.1.874 Power Module


The power module provides all the modules of the DX1 with the required DC voltages.

11.8.5 Front Panel


The front panel of the DX1 has indicators.

1.1.1.1.875 Diagram of the Front Panel


Figure 11-40 shows the appearance of the front panel of the DX1.

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Figure 1.1 Front panel of the DX1

DX1
STAT
ACT
PROG
SRV

DX1

1.1.1.1.876 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.877 Interfaces
The front panel of the DX1 does not have an interface.
One DX1 board needs to work with two DM12 boards to receive and transmit the framed E1
signals and Nx64 kbit/s signals. For details, see the topic that describes the DM12.

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11.8.6 Jumpers and DIP Switches


The DX1 does not have any jumpers or DIP switches that are used for board settings.

11.8.7 Valid Slots


The DX1 must be used with the DM12. In addition, the DX1 must be installed in a valid slot
in the subrack. Otherwise, the DX1 cannot work normally.
The DX1 can be installed in slots 15 and 1316.
Table 11-35 lists the slots valid for the DX1 and the corresponding slots for the DM12.
Figure 1.1 Slots valid for the DX1 and the corresponding slots for the DM12
Slot Valid for the DX1

Corresponding Slot for the DM12

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

Slot 1 can house a protection board for the TPS protection. The board in slot 1 protects the boards in
slots 25 and 1316.

One DX1 needs to work with two DM12 boards to transmit/receive eight channels of Nx64 kbit/s
signals. The DM12 in the slot with a smaller slot number is used to transmit/receive eight channels
of framed E1 signals and four channels of Nx64 kbit/s signals. The DM12 in the slot with a larger
slot number is used to transmit/receive four channels of Nx64 kbit/s signals.

11.8.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the DX1 indicates the type of interface impedance.
Table 11-36 provides the relationship between the feature code of the DX1 and the type of
interface impedance.
Figure 1.2 Relationship between the feature code of the DX1 and the type of interface impedance
Board

Feature Code

Type of Interface Impedance

SSN1DX1A01

A01

75-ohm

SSN1DX1B01

B01

120-ohm

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11.8.9 Board Protection


The DX1 supports the 1:N TPS protection.

1.1.1.1.878 Protection Principle


The DX1 can be configured into one 1:N (N8) TPS protection group when the DX1 works
with the DM12.
Figure 11-41 shows the TPS protection provided by the DX1.
Figure 1.1 TPS protection provided by the DX1
Service signal

Service signal
Switching
control bus

Interface board

Protection bus
Protection bus

Crossconnect and
timing board

Interface board

Interface board

Interface board

Interface board

Interface board

Working board N

Working board

Working board 1

Protection board

Failed

When the cross-connect and timing board detects that a working DX1 is faulty, the crossconnect and timing board issues a service switching command to control the interface board
to switch the services from the faulty board to the protection board, which realizes the
protection of the services.

1.1.1.1.879 Hardware Configuration


Figure 11-42 shows the slot configuration for the 1:8 TPS protection of the DX1.

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S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8
Working

Working

S
L
O
T
1
0

FAN

Working

Working

S
L
O
T
9

XCS

S S S S
L L L L
O O O O
T T T T
5 6 7 8

S
L
O
T
3
7

AUX

PIU

S
L
O
T
3
2

DM12

PIU

S
L
O
T
3
1

XCS

S
L
O
T
4

Working

S S S
L L L
O O O
T T T
1 2 3

Working

S
L
O
T
3
0

FAN

Protection

FAN

S
L
O
T
2
9

GSCC

S
L
O
T
2
8

DM12

S
L
O
T
2
7

Working

S
L
O
T
2
6

DM12

S
L
O
T
2
3

Working

S
L
O
T
2
5

DM12

S
L
O
T
2
2

DM12
DM12
DM12

S
L
O
T
2
4

DM12
DM12
DM12
DM12
DM12

S
L
O
T
2
1

DM12

S
L
O
T
2
0

DM12
DM12

S
L
O
T
1
9

DM12

Figure 1.2 Slot configuration for the 1:8 TPS protection of the DX1

Fiber routing area

In Figure 11-42, the board in slot 1 protects the boards in slots 25 and 1316.
Table 11-37 lists the slots for the DX1 and DM12.
Figure 1.1 Slots for the DX1 and DM12
Board

Protection Group

DX1 (working board)

Slots 25 and 1316

DX1 (protection board)

Slot 1

DM12

Slots 1926 and 2936

11.8.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.
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1.1.1.1.880 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.881 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 5 Required: Set the PDH interface.

J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.

V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.

Service load indication: When a service channel does not process its carried services,
select Non-Loaded. When the service channel processes its carried services, select
Load.

For details, see 27.7 Checking Board Parameters.


Step 6 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 7 Required: Configure services. For details, see Configuring the SDH Services.

Before you configure services, learn the type of protection subnet configured for the ring network. For
the method for querying the protection subnet, see 27.1 Querying the Protection Subnet.

Step 8 Set parameters on the . For the parameters to be set, see 26.6 PDH Boards.
----End

1.1.1.1.882 Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 9 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
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Electrical Interfaces.
Step 10 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.883 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 11 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

11.8.11 Parameter Settings


You can set the parameters for the DX1 by using the U2000.
You can set the following parameters for the DX1 by using the U2000:

J2 byte

Tributary loopback

Service loading indication

Protocol mode of serial ports

DDN clock source management

For the description of each parameter, see 26 Parameter Settings.

11.8.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.884 Troubleshooting
Table 11-38 lists the faults that occur on the DX1 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the DX1 frequently
Fault
Symptom

Common Fault Cause

Service
interruption

The cable or connector


becomes abnormal.

An incorrect operation
is performed.

The types or settings of


the boards are

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Symptom

11 PDH Boards

Common Fault Cause

Troubleshooting Method

inconsistent.
Bit error

The equipment becomes


faulty.

Pointer
justification

The clock configuration


is incorrect.

The precision of the


external clock source is
very low.

Protection
switching
failure

The TPS fails.

See Troubleshooting Bit Errors.


See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

1.1.1.1.885 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the DX1, see Replacing a PDH Board.

11.8.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

11.8.13.1 Alarms of N1DX1


BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

CHIP_ABN

CHIP_FAIL

COMMUN_FAIL

CRC4_ERR_OVER

CTS

DCD

DDN_AIS

DDN_ALOS

DDN_CRC4_ERR_OVER

DDN_LFA

DDN_LMFA

DDN_LOOP_ALM

DDN_RFA

DDN_RMFA

DOWN_E1_AIS

DSR

DTR

E1_LOC

FPGA_ABN

LFA

LMFA

LOOP_ALM

LP_R_FIFO

LP_RDI

LP_REI

LP_RFI

LP_SLM

LP_T_FIFO

LP_TIM

LP_UNEQ

NO_BD_SOFT

PLL_FAIL

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POWER_ABNORMAL

R_FIFO_E

RFA

RMFA

RTS

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

TEMP_OVER

T_FIFO_E

T_LOSEX

TR_LOC

TEST_STATUS

TPS_ALM

UP_E1_AIS

TU_AIS

TU_LOP

PATCH_NOT_CONFIRM

V5_VCAIS

PATCH_ERR

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

11.8.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

11.8.14.1 Performance Events of N1DX1


LPBBE

LPCSES

LPFECSES

LPFEUAS

LPES

LPSES

LPUAS

LPFEBBE

LPFEES

LPFESES

TUPJCHIGH

TUPJCLOW

CRC4_ERR

DDN_CRC4_ERR

11.8.15 Technical Specifications


The technical specifications of the DX1 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.886 Parameters Specified for Electrical Interfaces


The DM12 provides electrical interfaces for the DX1. For the parameters specified for the
electrical interfaces, see Technical Specifications of the DM12.

1.1.1.1.887 Mechanical Specifications


The mechanical specifications of the DX1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.888 Power Consumption


The maximum power consumption of the DX1 at room temperature (25C) is 15 W.
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11.9 DXA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DXA (DDN service converging and processing board).

11.9.1 Version Description


The DXA is available in one functional version, namely, N1.

11.9.2 Application
The DXA is a DDN service processing board. The DXA can be used on the OptiX OSN
equipment series to transmit/receive and converge DDN services. To cross-connect the 63
channels of Nx64 kbit/s signals and framed E1 signals on the system side.
Figure 11-43 shows the application of the DDN service processing boards. The DDN service
processing boards add DDN service signals to line signals and drops line signals to DDN
service signals.
Figure 1.1 Networking and application of the DDN service processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.9.3 Functions and Features


The DXA cross-connects 63xE1 signals at the 64 kbit/s level on the system side.
Table 11-39 provides the functions and features of the DXA.
Figure 1.1 Functions and features of the DXA
Function and
Feature

DXA

Basic functions

Cross-connects 63 channels of framed E1 signals.

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Function and
Feature

DXA

Alarms and
performance events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

Supports inloops and outloops.


Supports the CRC function.

11.9.4 Working Principle and Signal Flow


The DXA consists of the timeslot cross-connect module, framing/deframing module,
mapping/demapping module, logic and control module, and power module.
Figure 11-44 shows the functional block diagram of the DXA.
Figure 1.1 Functional block diagram of the DXA
Backplane

64 kbit/s
timeslot
crossconnect
module

Framing/
Deframing
module

Signal
mapping/
demapping
module

Logic and
control module
+3.3 V
Power
module

Power
module

Crossconnect unit

SCC unit
Fuse
Fuse

-48 V/-60 V
-48 V/-60 V
+3.3 V
backup power

1.1.1.1.889 In the Transmit Direction


The mapping/demapping module demaps the VC-4 signals sent from the SDH cross-connect
unit and sends the demapped signals to the framing/deframing module. Then, the
framing/deframing module converts the signals into the framed E1 signals and sends the
framed E1 signals to the timeslot cross-connect module. Finally, the timeslot cross-connect
module cross-connects and grooms the signals at the 64 kbit/s granularity.

1.1.1.1.890 In the Receive Direction


The timeslot cross-connect module cross-connects and grooms the signals at the 64 kbit/s
granularity, and transmits the signals to the framing/deframing module. Then, the
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framing/deframing module maps the signals into VC-4s and transmits the signals to the SDH
cross-connect unit.

1.1.1.1.891 Logic and Control Module


The logic and control module performs the board communication, board control, and service
configuration functions. In addition, the logic and control module traces and selects the clock
signals and frame header signals sent from the active and standby cross-connect boards.

1.1.1.1.892 Power Module


The power module provides all the modules of the DX1 with the required DC voltages.

11.9.5 Front Panel


The front panel of the DXA has indicators.

1.1.1.1.893 Diagram of the Front Panel


Figure 11-45 shows the appearance of the front panel of the DXA.

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Figure 1.1 Front panel of the DXA

DXA
STAT
ACT
PROG
SRV

DXA

1.1.1.1.894 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.895 Interfaces
The front panel of the DXA does not have an interface.

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11.9.6 Valid Slots


The slots valid for the DXA vary with the cross-connect capacity of the subrack.
The slots valid for the DXA are as follows:

When the cross-connect capacity is 200 Gbit/s, the DXA can be installed in slots 18 and
1117.

11.9.7 Parameter Settings


You can set the parameters for the DXA by using the U2000.
You can set the following parameters for the DXA by using the U2000:

J2 byte

Tributary loopback

Service loading indication

Protocol mode of serial ports

DDN clock source management

For the description of each parameter, see 26 Parameter Settings.

11.9.8 Technical Specifications


The technical specifications of the DXA include the mechanical specifications and power
consumption.

1.1.1.1.896 Mechanical Specifications


The mechanical specifications of the DXA are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.8

1.1.1.1.897 Power Consumption


The maximum power consumption of the DXA at room temperature (25C) is 10 W.

11.10 SPQ4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the SPQ4 (4xE4/STM-1 electrical processing board). This topic
also describes how to configure and commission the SPQ4.

11.10.1 Version Description


The SPQ4 is available in two functional versions, namely, N1 and N2. The difference between
the two versions is with regard to their functions. The N1SPQ4 is discontinued.
Table 11-40 describes the versions of the SPQ4.

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Figure 1.1 Versions of the SPQ4


Item

Description

Functional versions

The SPQ4 is available in two functional versions, namely, N1 and


N2.

Differences

The equipment of the V100R001 and V100R002 versions supports


the N1SPQ4. The equipment of the V100R003 and later versions
supports the N2SPQ2.

Substitution

The N1SPQ4 can be replaced with the N2SPQ4. When the N1SPQ4
is replaced with the N2SPQ4, the NE software needs to be
upgraded.

11.10.2 Application
The SPQ4 is a PDH processing board. The SPQ4 can be used on the OptiX OSN equipment
series to transmit and receive E4/STM-1 electrical signals. To transmit/receive and process
4xE4/STM-1 electrical signals, the SPQ4 must be used with the interface board.
Figure 11-46 shows the application of the PDH processing boards. The PDH processing
boards add tributary signals to line signals and drops tributary signals to line signals.
Figure 1.1 Networking and application of the PDH processing boards

NE1

NE2

NE4
NE3

Service flow
Line board
Tributary board
Cross-connect and timing board

11.10.3 Functions and Features


The SPQ4 processes 4xE4/STM-1 electrical signals, processes overhead bytes, reports alarms
and performance events, provides maintenance features, and supports protection schemes.
Table 11-41 provides the functions and features of the SPQ4.

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Figure 1.2 Functions and features of the SPQ4


Function and
Feature

SPQ4

Basic functions

Processes 4xSTM-1/E4 signals.

Service
processing

Transmits/Receives and processes 4xE4/STM-1 electrical signals. The


E4 signals and STM-1 signals are compatible on each channel.
Supports the VC-12 services, VC-3 services, and VC-4 services.

Overhead
processing

Processes the section overheads of the STM-1 signals, such as B1,


B2, K1, K2, M1, F1, and D1D12.

Supports the transparent transmission and termination of the path


overhead bytes including J1, B3, C2, G1, and H4.

Supports the setting and query of the J0, J1, and C2 bytes.

Alarms and
performance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Maintenance
features

Supports inloops and outloops at optical interfaces.

Supports warm resets and cold resets. The warm reset does not
affect services.

Supports the query of the manufacturing information of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting


services.

Does not support the CRC function.

Supports the TPS protection when working with the interface board
and the switching and bridging board.

Supports the Two-fiber ring MSP.

Supports the Linear MSP.

Supports the SNCP.

Protection
schemes

11.10.4 Working Principle and Signal Flow


The SPQ4 consists of the interface module, mapping/demapping module, SDH overhead
processing module, interface converting module, logic and control module, and power
module.
Figure 11-47 shows the functional block diagram of the SPQ4. Figure 11-48 shows the
functional block diagram of the mapping/demapping module. Figure 11-49 shows the
functional block diagram of the SDH overhead processing module.

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Figure 1.1 Functional block diagram of the SPQ4

155 MHz
PLL

34 MHz
OSC

LIU

LIU

4x139 Mbit/s
PPI/SPI

E4/STM-1

4x155 Mbit/s

Interface
module

Mapping/
Demapping 4x155 Mbit/s
module
SDH
overhead
processing
module

4x155 Mbit/s

Logic and
control module

Outloop/Inloop control

High-speed
bus
Interface
converting
module High-speed
bus

Cross-connect
unit A
Cross-connect
unit B

DCC
K1 and K2

EN 140 Mbit/s/155 Mbit/s


LOS

Backplane
Reference
Cross-connect
clock
unit

+3.3 V
Power
module

SCC unit
Cross-connect
unit
Frame header
Communication

Cross-connect
unit
SCC unit

Power
module

Fuse
Fuse

LIU: logic interface unit

PPI: PDH physical interface

OSC: oscillator

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

Figure 1.2 Functional block diagram of the mapping/demapping module


Mapping/demapping module
139 Mbit/s

155 Mbit/s
LPA

HPT

PDH AIS E4 AIS


detector insertion

139 Mbit/s

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PG

J1/C2/B3

E4 AIS
insertion

LPA

HPT

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RST

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Figure 1.3 Functional block diagram of the SDH overhead processing module
SDH overhead processing module
K1 and K2 insertion/
extraction

Cross-connect unit

155 Mbit/s

155 Mbit/s

155 Mbit/s
RST

MST

MSA

HPT
155 Mbit/s

DCC

SCC unit

1.1.1.1.898 Interface Module


The PPI module consists of LIUs and provides the inloop and outloop functions. The PPI
module performs the following functions:

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the PDH LOS signals.

The SPI module consists of LIUs and provides the inloop and outloop functions. The SPI
module performs the following functions:

Encodes and decodes signals.

Restores the data signal and the clock signal.

Processes the R_LOS signals.

1.1.1.1.899 SDH Overhead Processing Module (155 Mbit/s SDH Signals)


The SDH overhead processing module performs the functions that are required to manage 155
Mbit/s SDH signals.

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RST Sub-Module

In the receive direction, the RST sub-module detects the frame alignment bytes (A1
and A2), restores the regenerator section trace byte (J0), detects a J0 mismatch, and
counts BIP-8 errored blocks.

In the transmit direction, the RST sub-module inserts the frame alignment bytes,
inserts the J0 byte, and performs BIP-8 calculation and byte insertion.

MST Sub-Module

In the receive direction, the MST sub-module counts BIP-24 errored blocks, restores
the MS_REI, and detects the MS_RDI and MS_AIS.

In the transmit direction, the MST sub-module performs BIP-24 calculation and
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insertion and inserts the MS_REI, MS_RDI, and MS_AIS.

The MST sub-module extracts or inserts the K1 byte and K2 byte.

MSA Sub-Module

In the receive direction, the MSA sub-module interprets the AU-4 pointer, detects the
LOP and AIS, and performs pointer justifications.

In the transmit direction, the MSA sub-module assembles the AUG and generates the
AU-4 pointer and the AU_AIS.

HPT Sub-Module

Terminates the overheads.

Restores the J1 path trace message.

Restores the REI information.

Detects the HP_RDI (monitors the status of the path).

Detects the UNEQ and AIS (monitors the signal label).

Counts the VC-4 BIP-8 errored blocks.

1.1.1.1.900 Mapping/Demapping Module (140 Mbit/s PDH Signals)


The mapping/demapping module performs the functions that are required to manage 140
Mbit/s PDH signals.

LPA Sub-Module
The 140 Mbit/s plesiochronous stream is inserted in a C4 container to be adapted so that
the stream can be transported to the synchronous network. The PDH AIS is monitored
and the E4 AIS in inserted.

HPT Sub-Module
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH. The POH contains nine octets equally distributed within the
frame. The following overhead bytes can be extracted: J1, B3. C2, G1, F2, H4, F3, K3,
and N1. The E4 AIS can be inserted in the downstream direction.

Pointer generator (PG)


A fixed pointer value is inserted into the SOH to structure the AU-4 signal.

MST Sub-Module and RST Sub-Module


These sub-modules are required to create a proprietary STM1 signal so that the
interface converting module can be connected. In the receive direction, these submodules detect the frame alignment bytes (A1 and A2).

1.1.1.1.901 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.902 Logic and Control Module

Manages and configures the other modules of the board.

Performs inter-board communication through the internal Ethernet interface.

Traces the clock signal from the active and standby cross-connect units.

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Passes the orderwire and ECC bytes through an ADM that consists of two paired slots
when the GSCC cannot be detected.

Selects the clock signal and frame header signal from the active and standby crossconnect units.

Controls the indicators on the board.

1.1.1.1.903 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

11.10.5 Front Panel


The front panel of the SPQ4 has indicators.

1.1.1.1.904 Diagram of the Front Panel


Figure 11-50 shows the appearance of the front panel of the SPQ4.

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Figure 1.1 Front panel of the SPQ4

SPQ4
STAT
ACT
PROG
SRV

SPQ4

1.1.1.1.905 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.906 Interfaces
The front panel of the SPQ4 does not have an interface. Hence, the SPQ4 needs to work with
the MU04 to receive and transmit the E4/STM-1 signals. For details, see the topic that
describes the MU04.
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11.10.6 Jumpers and DIP Switches


The SPQ4 does not have any jumpers or DIP switches that are used for board settings.

11.10.7 Valid Slots


The SPQ4 must be used with the MU04. In addition, the SPQ4 must be installed in a valid
slot in the subrack. Otherwise, the SPQ4 fails to work normally.
The SPQ4 can be installed in slots 25 and 1316.
Table 11-42 lists the slots valid for the SPQ4 and the corresponding slots for the MU04.
Figure 1.1 Slots valid for the SPQ4 and the corresponding slots for the MU04
Slot Valid for the SPQ4

Corresponding Slot for the MU04

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

11.10.8 Feature Code


The SPQ4 does not have a feature code.

11.10.9 Board Protection


The SPQ4 supports the 1:N TPS protection.

1.1.1.1.907 Protection Principle


The SPQ4 can be configured into two 1:N (N3) TPS protection groups when the SPQ4
works with the MU04 and TSB8/TSB4.
Figure 11-51 shows the TPS protection provided by the SPQ4.

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Figure 1.1 TPS protection provided by the SPQ4


Service signal

Service signal
Switching
control bus

Crossconnect and
timing board

Interface board N

Working board N

Working board

Working board 1

Protection board

Interface board

Interface board 1

Protection
switching board

Failed

Normal state
When each working board functions normally, the traffic signal is directly transmitted to
the working board through position 1 of the control switch on the interface board.

Switching state
When a working board detects a failure and requires the switching operation, the control
switch of the corresponding interface board switches from position 1 to position 2. At the
same time, the control switch of the protection switching board switches to the
corresponding position so that the protection board can protect the failed working board.
TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing
board. Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

1.1.1.1.908 Hardware Configuration


Figure 11-52 shows the slot configuration for the 1:3 TPS protection of the SPQ4.

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S
L
O
T
3
3

S
L
O
T
3
4

S
L
O
T
9

S
L
O
T
1
0

Working 1

Working 1

XCS

XCS

S
L
O
T
3
7

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

GSCC

S S S S
L L L L
O O O O
T T T T
5 6 7 8

S
L
O
T
3
6

FAN

Working 2

S
L
O
T
4

S
L
O
T
3
5

AUX

S
L
O
T
3
2

TSB8/TSB4

S
L
O
T
3
1

Working 2

S S S
L L L
O O O
T T T
1 2 3

Working 1

S
L
O
T
3
0

FAN

Protection 1

FAN

S
L
O
T
2
9

Protection 2

S
L
O
T
2
8

Working 2

S
L
O
T
2
7

MU04

S
L
O
T
2
6

MU04

S
L
O
T
2
5

MU04

S
L
O
T
2
4

PIU

S
L
O
T
2
3

MU04

S
L
O
T
2
2

MU04

S
L
O
T
2
1

MU04

S
L
O
T
2
0

TSB8/TSB4

S
L
O
T
1
9

PIU

Figure 1.2 Slot configuration for the two 1:3 TPS protection groups of the SPQ4

Fiber routing area

In Figure 11-52, the board in slot 2 protects the boards in slots 3-5. The board in slot 16
protects the boards in slots 13-15.
Table 11-43 lists the slots for the SPQ4, MU04, and TSB8/TSB4.
Figure 1.1 Slots for the SPQ4, MU04, and TSB8/TSB4
Board

Protection Group 1

Protection Group 2

SPQ4 (working
board)

Slots 3-5

Slots 13-15

SPQ4 (protection
board)

Slot 2

Slot 16

MU04

Slots 21, 23, and 25

Slots 29, 31, and 33

TSB8/TSB4

Slot 19

Slot 35

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11.10.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.909 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the interface board and cable match the board. Ensure that the
impedance of the cable matches the impedance of the board.
Step 3 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 4 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.910 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 5 Required: Set the PDH interface.

J2 byte: The setting of the J2 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the J2 to be sent is HuaWei SBS
and the default value of the J2 to be received is Disabled.

V5 byte: The setting of the V5 byte on the interconnected equipment must be consistent.
Generally, use the default value. The default value of the V5 byte is Asynchronous.

Service load indication: When a service channel does not process its carried services,
select Non-Loaded. When the service channel processes its carried services, select
Load.

For details, see 27.7 Checking Board Parameters.


Step 6 Optional: Create the protection. For details, see Creating a TPS Protection Group for Boards.
Step 7 Required: Configure services. For details, see Configuring the SDH Services.

Before you configure services, learn the type of protection subnet configured for the ring network. For
the method for querying the protection subnet, see 27.1 Querying the Protection Subnet.

Step 8 Set parameters on the . For the parameters to be set, see 26.6 PDH Boards.
----End
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1.1.1.1.911 Commissioning the Board


Step 1 Required: Test the connection between the cable and the service interface. For details, see
Testing Connection Between the Cables and the PDH Service Interfaces.
Step 9 Optional: Test the TPS of the electrical interface. For details, see Testing the TPS of the
Electrical Interfaces.
Step 10 Required: Test the point-to-point BER. For details, see Testing the Point-to-Point BER.
----End

1.1.1.1.912 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 11 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

11.10.11 Parameter Settings


You can set the parameters for the SPQ4 by using the U2000.
You can set the following parameters for the SPQ4 by using the U2000:

J1 byte

C2 byte

For the description of each parameter, see 26 Parameter Settings.

11.10.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.913 Troubleshooting
Table 11-44 lists the faults that occur on the SPQ4 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the SPQ4 frequently
Fault
Symptom

Common Fault Cause

Service
interruption

The cable or connector


becomes abnormal.

An incorrect operation

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Fault
Symptom

11 PDH Boards

Common Fault Cause

Troubleshooting Method

is performed.

The types or settings of


the boards are
inconsistent.

Bit error

The equipment becomes


faulty.

Pointer
justification

The clock configuration


is incorrect.

The precision of the


external clock source is
very low.

Protection
switching
failure

The TPS fails.

See Troubleshooting Bit Errors.


See Troubleshooting Pointer Justification.

See Troubleshooting Protection Switching


Faults.

1.1.1.1.914 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the SPQ4, see Replacing a PDH Board.

11.10.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

11.10.13.1 Alarms of N1SPQ4


AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

BIP8_ECC

C4_R_LAISD

C4_T_LAISD

CHIP_FAIL

COMMUN_FAIL

EXT_LOS

FPGA_ABN

FSELECT_STG

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

J0_MM

LOOP_ALM

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LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OH_LOOP

PLL_FAIL

POWER_ABNORMAL

R_LOC

R_LOF

R_LOS

R_OOF

RELAY_FAIL

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

T_LOSEX

TEST_STATUS

TPS_ALM

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

BIP8_ECC

C4_R_LAISD

C4_T_LAISD

CHIP_FAIL

COMMUN_FAIL

EXT_LOS

FPGA_ABN

FSELECT_STG

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

J0_MM

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OH_LOOP

PLL_FAIL

POWER_ABNORMAL

R_LOC

11.10.13.2 Alarms of N2SPQ4

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R_LOF

R_LOS

R_OOF

RELAY_FAIL

SLAVE_WORKING

SPARE_PATH_ALM

SUBCARD_ABN

T_LOSEX

TEST_STATUS

TPS_ALM

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

PS

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

11.10.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

11.10.14.1 Performance Events of N1SPQ4


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSOFS

RSSES

RSUAS

11.10.14.2 Performance Events of N2SPQ4


AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

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MSFEES

MSFESES

MSFEUAS

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSOFS

RSSES

RSUAS

11.10.15 Technical Specifications


The technical specifications of the SPQ4 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.915 Parameters Specified for Electrical Interfaces


The MU04 provides electrical interfaces for the SPQ4. For the parameters specified for the
electrical interfaces, see Technical Specifications of the MU04.

1.1.1.1.916 Mechanical Specifications


The mechanical specifications of the SPQ4 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.9

1.1.1.1.917 Power Consumption


The maximum power consumption of the SPQ4 at room temperature (25C) is 24 W.

11.11 D12B
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D12B (32xE1/T1 access board).

11.11.1 Version Description


The D12B is available in one functional version, namely, N1.

11.11.2 Application
The D12B is a PDH interface board. The D12B can be used on the OptiX OSN equipment
series to transmit and receive signals for the PDH processing board. To transmit/receive and
process signals, the interface board must be used with its corresponding processing board.

11.11.3 Functions and Features


The D12B receives and transmits 32xE1/T1 electrical signals. The D12B must work with the
PQ1, or PQM.

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11.11.4 Working Principle and Signal Flow


The D12B has the interface module.
Figure 11-53 shows the functional block diagram of the D12B by describing how to process
1xE1/T1 signals.
Figure 1.1 Functional block diagram of the D12B
Backplane

PQ1/PQM/PO1

E1/T1 electrical signal


Interface
module
E1/T1 electrical signal

PQ1/PQM/PO1

1.1.1.1.918 Interface Module


The interface module receives and transmits the E1/T1 electrical signals.

11.11.5 Front Panel


The front panel of the D12B has interfaces and a bar code.

1.1.1.1.919 Diagram of the Front Panel


Figure 11-54 shows the appearance of the front panel of the D12B.

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Figure 1.1 Front panel of the D12B

D12B

1~8
9~16
17~24
25~32

D12B

1.1.1.1.920 Interfaces
The front panel of the D12B has four DB44 interfaces. Table 11-45 describes the types and
usage of the interfaces of the D12B.
Figure 1.1 Interfaces of the D12B
Interface

Type of
Interface

Usage

18

DB44

Receives the 1st to the 8th channels of E1/T1


signals.

916

DB44

Receives the 9th to the 16th channels of E1/T1


signals.

1724

DB44

Receives the 17th to the 24th channels of E1/T1

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Type of
Interface

Usage
signals.

2532

DB44

Receives the 25th to the 32nd channels of E1/T1


signals.

Table 11-46 provides the pin assignments of the DB44 interface.


Figure 1.2 Pin assignments of the DB44 interface
Front View
30

15

44

Pin

Usage

Pin

Usage

38

Receives the 1st


channel of
signals (R1).

34

Receives the 5th


channel of signals
(R5).

Receives the 2nd


channel of
signals (R2).

33

Receives the 3rd


channel of
signals (R3).

32

Receives the 4th


channel of
signals (R4).

31

Transmits the 1st


channel of
signals (T1).

11

Transmits the
2nd channel of
signals (T2).

10

Transmits the 3rd


channel of
signals (T3).

Transmits the 4th


channel of
signals (T4).

23
37
22
36
21
35

31
16

20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

Receives the 6th


channel of signals
(R6).
Receives the 7th
channel of signals
(R7).
Receives the 8th
channel of signals
(R8).
Transmits the 5th
channel of signals
(T5).
Transmits the 6th
channel of signals
(T6).
Transmits the 7th
channel of signals
(T7).
Transmits the 8th
channel of signals
(T8).

11.11.6 Valid Slots


The D12B can work as the interface board of the PQ1, or PQM.
The D12B can be installed in slots 1926 and 2936 in the main subrack.
Table 11-47 lists the slots valid for the PQ1/PQM and the corresponding slots for the D12B.
The D12B installed in the slot with a smaller number transmits/receives the 1st to the 32nd
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channels of E1/T1 electrical signals. The D12B installed in the slot with a larger number
transmits/receives the 33rd to the 63rd channels of E1/T1 electrical signals.
Figure 1.3 Slots valid for the PQ1/PQM and the corresponding slots for the D12B
Slot Valid for the PQ1/PQM

Corresponding Slot for the D12B

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

11.11.7 Technical Specifications


The technical specifications of the D12B include the parameters specified for the electrical
interfaces, mechanical specifications and power consumption.

1.1.1.1.921 Parameters Specified for Electrical Interfaces


Figure 1.1 Parameters specified for the electrical interfaces of the D12B
Nominal bit rate

1544 kbit/s

2048 kbit/s

Line code pattern

B8ZS and AMI

HDB3

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the
input interface
Allowed frequency deviation at
the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T


G.824.

Complies with ITU-T


G.823.

Anti-interference capability at
the input interface

Complies with ITU-T


G.703.

Reflection attenuation at the


input/output interface
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Nominal bit rate

1544 kbit/s

2048 kbit/s

Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter

Complies with ITU-T G.783.

Combined jitter
Jitter transfer function

Impedance (ohm)

75/120 (E1), 100 (T1)

Complies with ITU-T


G.742.

1.1.1.1.922 Mechanical Specifications


The mechanical specifications of the D12B are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.3

1.1.1.1.923 Power Consumption


The maximum power consumption of the D12B at room temperature (25C) is 0 W.

11.12 D12S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D12S (32xE1/T1 switching access board).

11.12.1 Version Description


The D12S is available in one functional version, namely, N1.

11.12.2 Application
The D12S is a PDH interface switching board. The D12S can be used on the OptiX OSN
equipment series to transmit and receive signals for the PDH processing board. In addition,
when the corresponding PDH processing board is configured with the TPS protection, the
interface switching board is required to perform the TPS protection.

11.12.3 Functions and Features


The D12S receives and transmits 32xE1/T1 electrical signals. The D12S must work with the
PQ1, or PQM.

11.12.4 Working Principle and Signal Flow


The D12S consists of the interface module, switch matrix module, and power access circuit.
Figure 11-55 shows the functional block diagram of the D12S by describing how to process
1xE1/T1 signals.

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Figure 1.1 Functional block diagram of the D12S


Backplane
Cross-connect board
E1/T1 electrical
signal

Interface
module

Switch
matrix
module

E1/T1 electrical
signal

PQ1/PQM/PO1

PQ1/PQM/PO1

+3.3 V

Fuse

+3.3 V power

1.1.1.1.924 Interface Module


The interface module receives and transmits the E1/T1 electrical signals.

1.1.1.1.925 Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the PQ1 or PQM. When the TPS is performed, the switch
matrix module transmits the signal to the protection board for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.926 Power Access Circuit


The power access circuit provides all the modules of the D12S with the required DC voltages.

11.12.5 Front Panel


The front panel of the D12S has interfaces and a bar code.

1.1.1.1.927 Diagram of the Front Panel


Figure 11-56 shows the appearance of the front panel of the D12S.

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Figure 1.1 Front panel of the D12S

D12S

1~8
9~16
17~24
25~32

D12S

1.1.1.1.928 Interfaces
The front panel of the D12S has four DB44 interfaces. Table 11-49 describes the types and
usage of the interfaces of the D12S.
Figure 1.1 Interfaces of the D12S
Interface

Type of
Interface

Usage

18

DB44

Receives the 1st to the 8th channels of E1/T1


signals.

916

DB44

Receives the 9th to the 16th channels of E1/T1


signals.

1724

DB44

Receives the 17th to the 24th channels of E1/T1

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Interface

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Type of
Interface

Usage
signals.

2532

DB44

Receives the 25th to the 32nd channels of E1/T1


signals.

Table 11-50 provides the pin assignments of the DB44 interface.


Figure 1.2 Pin assignments of the DB44 interface
Front View
30

15

44

Pin

Usage

Pin

Usage

38

Receives the 1st


channel of signals
(R1).

34

Receives the 5th


channel of signals
(R5).

Receives the 2nd


channel of signals
(R2).

33

Receives the 3rd


channel of signals
(R3).

32

Receives the 4th


channel of signals
(R4).

31

Transmits the 1st


channel of signals
(T1).

11

Transmits the 2nd


channel of signals
(T2).

10

Transmits the 3rd


channel of signals
(T3).

Transmits the 4th


channel of signals
(T4).

23
37
22
36
21
35

31
16

20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

Receives the 6th


channel of signals
(R6).
Receives the 7th
channel of signals
(R7).
Receives the 8th
channel of signals
(R8).
Transmits the 5th
channel of signals
(T5).
Transmits the 6th
channel of signals
(T6).
Transmits the 7th
channel of signals
(T7).
Transmits the 8th
channel of signals
(T8).

11.12.6 Valid Slots


The D12S can be installed in slots 1926 and 2936 in the main subrack. The D12S works as
the interface board of the PQ1, or PQM.
Table 11-51 lists the slots valid for the PQ1/PQM and the corresponding slots for the D12S.
The D12S installed in the slot with a smaller number transmits/receives the 1st to the 32nd
channels of E1/T1 electrical signals. The D12S installed in the slot with a larger number
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transmits/receives the 33rd to the 63rd channels of E1/T1 electrical signals.


Figure 1.3 Slots valid for the PQ1/PQM and the corresponding slots for the D12S
Slot Valid for the PQ1/PQM

Corresponding Slot for the D12S

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

11.12.7 Technical Specifications


The technical specifications of the D12S include the parameters specified for the electrical
interfaces, mechanical specifications and power consumption.

1.1.1.1.929 Parameters Specified for Electrical Interfaces


Figure 1.1 Parameters specified for the electrical interfaces of the D12S
Nominal bit rate

1544 kbit/s

2048 kbit/s

Line code pattern

B8ZS and AMI

HDB3

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the
input interface
Allowed frequency deviation at
the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T


G.824.

Complies with ITU-T


G.823.

Anti-interference capability at
the input interface

Complies with ITU-T


G.703.

Reflection attenuation at the


input/output interface
Output jitter
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Complies with ITU-T G.823 and G.824.


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Nominal bit rate

1544 kbit/s

Mapping jitter

Complies with ITU-T G.783.

2048 kbit/s

Combined jitter
Jitter transfer function

Impedance (ohm)

120 (E1), 100 (T1)

Complies with ITU-T


G.742.

1.1.1.1.930 Mechanical Specifications


The mechanical specifications of the D12S are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.931 Power Consumption


At room temperature (25C), the maximum power consumption of the D12S is 0 W.

11.13 D75S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D75S (32xE1 switching access board).

11.13.1 Version Description


The D75S is available in one functional version, namely, N1.

11.13.2 Application
The D75S is a PDH interface switching board. The D75S can be used on the OptiX OSN
equipment series to transmit and receive signals for the PDH processing board. In addition,
when the corresponding PDH processing board is configured with the TPS protection, the
interface switching board is required to perform the TPS protection.

11.13.3 Functions and Features


The D75S receives and transmits 32xE1 electrical signals. The D75S must work with the
PQ1.

11.13.4 Working Principle and Signal Flow


The D75S consists of the interface module, switch matrix module, and power access circuit.
Figure 11-57 shows the functional block diagram of the D75S by describing how to process
1xE1 signals.

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Figure 1.1 Functional block diagram of the D75S


Backplane
Cross-connect board
E1 electrical signal
Interface
module

Switch
matrix
module

E1 electrical signal

PQ1/PD1

PQ1/PD1

+3.3 V

Fuse

+3.3 V power

Backplane
Cross-connect board
E1 electrical signal
Interface
module

Switch
matrix
module

E1 electrical signal

PQ1

PQ1

+3.3 V

Fuse

+3.3 V power

1.1.1.1.932 Interface Module


The interface module receives and transmits the E1 electrical signals.

1.1.1.1.933 Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the PQ1. When the TPS is performed, the switch matrix
module transmits the signal to the protection board for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.934 Power Access Circuit


The power access circuit provides all the modules of the D75S with the required DC voltages.

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11.13.5 Front Panel


The front panel of the D75S has interfaces and a bar code.

1.1.1.1.935 Diagram of the Front Panel


Figure 11-58 shows the appearance of the front panel of the D75S.
Figure 1.1 Front panel of the D75S

D75S

1~8
9~16
17~24
25~32

D75S

1.1.1.1.936 Interfaces
The front panel of the D75S has four DB44 interfaces. Table 11-53 describes the types and
usage of the interfaces of the D75S.

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Figure 1.1 Interfaces of the D75S


Interface

Type of
Interface

Usage

18

DB44

Receives the 1st to the 8th channels of E1 signals.

916

DB44

Receives the 9th to the 16th channels of E1 signals.

1724

DB44

Receives the 17th to the 24th channels of E1


signals.

2532

DB44

Receives the 25th to the 32nd channels of E1


signals.

Table 11-54 provides the pin assignments of the DB44 interface.


Figure 1.2 Pin assignments of the DB44 interface
Front View
30

15

44

Pin

Usage

Pin

Usage

38

Receives the 1st


channel of
signals (R1).

34

Receives the 5th


channel of signals
(R5).

Receives the 2nd


channel of
signals (R2).

33

Receives the 3rd


channel of
signals (R3).

32

Receives the 4th


channel of
signals (R4).

31

Transmits the 1st


channel of
signals (T1).

11

Transmits the
2nd channel of
signals (T2).

10

Transmits the 3rd


channel of
signals (T3).

Transmits the 4th


channel of
signals (T4).

23
37
22
36
21
35

31
16

20
15
30
14
29
13
28
12
27

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19

18

17

16

26

25

24

Receives the 6th


channel of signals
(R6).
Receives the 7th
channel of signals
(R7).
Receives the 8th
channel of signals
(R8).
Transmits the 5th
channel of signals
(T5).
Transmits the 6th
channel of signals
(T6).
Transmits the 7th
channel of signals
(T7).
Transmits the 8th
channel of signals
(T8).

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11.13.6 Valid Slots


The D75S can work as the interface board of the PQ1.
The D75S can be installed in slots 1926 and 2936 in the main subrack.
Table 11-55 lists the slots valid for the PQ1 and the corresponding slots for the D75S. The
D75S installed in the slot with a smaller number transmits/receives the 1st to the 32nd
channels of E1 electrical signals. The D75S installed in the slot with a larger number
transmits/receives the 33rd to the 63rd channels of E1 electrical signals.
Figure 1.3 Slots valid for the PQ1 and the corresponding slots for the D75S
Slot Valid for the PQ1

Corresponding Slot for the D75S

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

11.13.7 Technical Specifications


The technical specifications of the D75S include the parameters specified for the electrical
interfaces, mechanical specifications and power consumption.

1.1.1.1.937 Parameters Specified for Electrical Interfaces


Figure 1.1 Parameters specified for the electrical interfaces of the D75S
Nominal bit rate

2048 kbit/s

Line code pattern

HDB3

Waveform at the output interface

Complies with ITU-T G.703.

Signal bit rate at the output interface


Allowed attenuation at the input interface
Allowed frequency deviation at the input
interface

Complies with ITU-T G.823.

Input jitter tolerance


Anti-interference capability at the input
interface
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Complies with ITU-T G.703.

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Nominal bit rate

11 PDH Boards

2048 kbit/s

Reflection attenuation at the input/output


interface
Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter

Complies with ITU-T G.783.

Combined jitter
Jitter transfer function

Complies with ITU-T G.742.

Impedance (ohm)

75

1.1.1.1.938 Mechanical Specifications


The mechanical specifications of the D75S are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.939 Power Consumption


At room temperature (25C), the maximum power consumption of the D75S is 0 W.

11.14 D34S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the D34S (6xE3/T3 switching access board).

11.14.1 Version Description


The D34S is available in one functional version, namely, N1.

11.14.2 Application
The D34S is a PDH interface switching board. The D34S can be used on the OptiX OSN
equipment series to transmit and receive signals for the PDH processing board. In addition,
when the corresponding PDH processing board is configured with the TPS protection, the
interface switching board is required to perform the TPS protection.

11.14.3 Functions and Features


The D34S receives and transmits 6xE3/T3 electrical signals. The D34S must work with the
PD3 or PQ3.

11.14.4 Working Principle and Signal Flow


The D34S consists of the interface module, switch matrix module, and power access circuit.
Figure 11-59 shows the functional block diagram of the D34S by describing how to process
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1xE3/T3 signals.
Figure 1.1 Functional block diagram of the D34S
Backplane
Cross-connect board
E3/T3 electrical
signal

Interface
module

Switch
matrix
module

+3.3 V

Fuse

E3/T3 electrical
signal

PD3/PQ3
TSB8
TSB8
PD3/PQ3

+3.3 V power

1.1.1.1.940 Interface Module


The interface module receives and transmits the E3/T3 electrical signals.

1.1.1.1.941 Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the PD3 or PQ3. When the TPS is performed, the switch matrix
module transmits the signal to the TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.942 Power Access Circuit


The power access circuit provides all the modules of the D34S with the required DC voltages.

11.14.5 Front Panel


The front panel of the D34S has interfaces and a bar code.

1.1.1.1.943 Diagram of the Front Panel


Figure 11-60 shows the appearance of the front panel of the D34S.

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Figure 1.1 Front panel of the D34S

D34S

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6

D34S

1.1.1.1.944 Interfaces
The front panel of the D34S has six pairs of electrical interfaces.
Table 11-57 describes the types and usage of the interfaces of the D34S.
Figure 1.1 Interfaces of the D34S
Interface

Type of
Interface

Usage

IN1IN6

SMB

Receives the 1st to the 6th channels of E3/T3


electrical signals.

OUT1OUT6

SMB

Transmits the 1st to the 6th channels of E3/T3


electrical signals.

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11.14.6 Valid Slots


The D34S can be installed in slots 1926 and 2936 in the subrack.

11.14.7 Technical Specifications


The technical specifications of the D34S include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.945 Parameters Specified for Electrical Interfaces


Table 11-58 lists the parameters specified for the electrical interfaces of the D34S.
Figure 1.1 Parameters specified for the electrical interfaces of the D34S
Nominal bit rate

34368 kbit/s

44736 kbit/s

Line code pattern

HDB3

B3ZS

Waveform at the output


interface
Signal bit rate at the output
interface
Allowed attenuation at the
input interface
Allowed frequency deviation at
the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T


G.823.

Complies with ITU-T


G.824.

Anti-interference capability at
the input interface

Complies with ITU-T


G.703.

Reflection attenuation at the


input/output interface
Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter
Combined jitter
Jitter transfer function

Complies with ITU-T


G.751.

Impedance (ohm)

75

1.1.1.1.946 Mechanical Specifications


The mechanical specifications of the D34S are as follows:

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Weight (kg): 0.4

1.1.1.1.947 Power Consumption


At room temperature (25C), the maximum power consumption of the D34S is 0 W.

11.15 C34S
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the C34S (3xE3/T3 switching access board).

11.15.1 Version Description


The C34S is available in one functional version, namely, N1.

11.15.2 Application
The C34S is a PDH interface switching board. The C34S can be used on the OptiX OSN
equipment series to transmit and receive signals for the PDH processing board. In addition,
when the corresponding PDH processing board is configured with the TPS protection, the
interface switching board is required to perform the TPS protection.

11.15.3 Functions and Features


The C34S receives and transmits 3xE3/T3 electrical signals. The C34S must work with the
PL3.

11.15.4 Working Principle and Signal Flow


The C34S consists of the interface module, switch matrix module, and power access circuit.
Figure 11-61 shows the functional block diagram of the C34S by describing how to process
1xE3/T3 signals.
Figure 1.1 Functional block diagram of the C34S
Backplane
Cross-connect board
E3/T3 electrical
signal

Interface
module

Switch
matrix
module

E3/T3 electrical
signal
+3.3 V

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PL3
TSB4/TSB8
TSB4/TSB8
PL3

+3.3 V power

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1.1.1.1.948 Interface Module


The interface module receives and transmits the E3/T3 electrical signals.

1.1.1.1.949 Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the PL3. When the TPS is performed, the switch matrix module
transmits the signal to the TSB4 or TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.950 Power Access Circuit


The power access circuit provides all the modules of the C34S with the required DC voltages.

11.15.5 Front Panel


The front panel of the C34S has interfaces and a bar code.

1.1.1.1.951 Diagram of the Front Panel


Figure 11-62 shows the appearance of the front panel of the C34S.

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Figure 1.1 Front panel of the C34S

C34S

OUT1
IN1
OUT2
IN2
OUT3
IN3

C34S

1.1.1.1.952 Interfaces
The front panel of the C34S has three pairs of electrical interfaces.
Table 11-59 describes the type and usage of the interface of the C34S.
Figure 1.1 Interfaces of the C34S
Interface

Type of Interface

Usage

IN1IN3

SMB

Receives the 1st to the 3rd channels of E3/T3


electrical signals.

OUT1OUT3

SMB

Transmits the 1st to the 3rd channels of E3/T3


electrical signals.

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11.15.6 Valid Slots


The C34S can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the main subrack.
Table 11-60 lists the slots valid for the PL3 and the corresponding slots for the C34S.
Figure 1.2 Slots valid for the PL3 and the corresponding slots for the C34S
Slot Valid for the PL3

Corresponding Slot for the C34S

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

11.15.7 Technical Specifications


The technical specifications of the C34S include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.953 Parameters Specified for Electrical Interfaces


Table 11-61 lists the parameters specified for the electrical interfaces of the C34S.
Figure 1.1 Parameters specified for the electrical interfaces of the C34S
Nominal bit rate

34368 kbit/s

44736 kbit/s

Line code pattern

HDB3

B3ZS

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the
input interface
Allowed frequency deviation at
the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T


G.823.

Complies with ITU-T


G.824.

Anti-interference capability at

Complies with ITU-T

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Nominal bit rate

34368 kbit/s

the input interface

G.703.

44736 kbit/s

Reflection attenuation at the


input/output interface
Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter
Combined jitter
Jitter transfer function

Complies with ITU-T


G.751.

Impedance (ohm)

75

1.1.1.1.954 Mechanical Specifications


The mechanical specifications of the C34S are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.3

1.1.1.1.955 Power Consumption


At room temperature (25C), the maximum power consumption of the C34S is 0 W.

11.16 MU04
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MU04 (4xE4/STM-1 electrical interface board).

11.16.1 Version Description


The MU04 is available in one functional version, namely, N1.

11.16.2 Application
The MU04 is an E4/STM-1 electrical interface board. The MU04 can be used on the OptiX
OSN equipment series to transmit and receive signals for the E4/STM-1 electrical processing
board.

11.16.3 Functions and Features


The MU04 receives and transmits 4xE4/STM-1 electrical signals. The MU04 must work with
the SPQ4.

11.16.4 Working Principle and Signal Flow


The MU04 consists of the interface module, switch matrix module, and power module.
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Figure 11-63 shows the functional block diagram of the MU04 by describing how to process
1xE4/STM-1 signals.
Figure 1.1 Functional block diagram of the MU04
Backplane
Cross-connect board
E4/STM-1 electrical
signal
Interface
module
E4/STM-1 electrical
signal
+3.3 V

Switch
matrix
module

Power
module

Fuse

SPQ4
TSB4/TSB8
TSB4/TSB8
SPQ4

+3.3 V power

1.1.1.1.956 Interface Module


The interface module receives and transmits the E4/STM-1 electrical signals.

1.1.1.1.957 Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the SPQ4. When the TPS is performed, the switch matrix
module transmits the signal to the TSB4 or TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.958 Power Module


The power module provides all the modules of the MU04 with the required DC voltages.

11.16.5 Front Panel


The front panel of the MU04 has interfaces and a bar code.

1.1.1.1.959 Diagram of the Front Panel


Figure 11-64 shows the appearance of the front panel of the MU04.

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Figure 1.1 Front panel of the MU04

MUO4

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

MUO4

1.1.1.1.960 Interfaces
The front panel of the MU04 has four pairs of electrical interfaces.
Table 11-62 describes the types and usage of the interfaces of the MU04.
Figure 1.1 Interfaces of the MU04
Interface

Type of
Interface

Usage

IN1IN4

SMB

Receives the 1st to the 4th channels of E4/STM-1


electrical signals.

OUT1OUT4

SMB

Transmits the 1st to the 4th channels of E4/STM-1


electrical signals.

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11.16.6 Valid Slots


The MU04 can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the subrack and works
as the interface board of the SPQ4.
Table 11-63 lists the slots valid for the SPQ4 and the corresponding slots for the MU04.
Figure 1.2 Slots valid for the SPQ4 and the corresponding slots for the MU04
Slot Valid for the SPQ4

Corresponding Slot for the MU04

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

11.16.7 Technical Specifications


The technical specifications of the MU04 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.961 Parameters Specified for Electrical Interfaces


Table 11-64 lists the parameters specified for the electrical interfaces of the MU04.
Figure 1.1 Parameters specified for the electrical interfaces of the MU04
Nominal bit rate

139264 kbit/s

155520 kbit/s

Line code pattern

CMI

CMI

Waveform at the output


interface

Complies with ITU-T G.703.

Signal bit rate at the output


interface
Allowed attenuation at the
input interface
Allowed frequency deviation
at the input interface

Complies with ITU-T G.823.

Input jitter tolerance

Complies with ITU-T


G.823.

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Complies with ITU-T


G.825.
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Nominal bit rate

139264 kbit/s

155520 kbit/s

Anti-interference capability at
the input interface

Reflection attenuation at the


input/output interface

Complies with ITU-T G.703.

Output jitter

Complies with ITU-T G.823 and G.824.

Mapping jitter

Complies with ITU-T


G.783.

Jitter transfer function

Complies with ITU-T


G.751.

Impedance (ohm)

75

Combined jitter

1.1.1.1.962 Mechanical Specifications


The mechanical specifications of the MU04 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.963 Power Consumption


The maximum power consumption of the MU04 at room temperature (25C) is 2 W.

11.17 DM12
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DM12 (DDN service interface board).

11.17.1 Version Description


The DM12 is available in one functional version, namely, N1.

11.17.2 Application
The DM12 is a DDN service interface board. The DM12 can be used on the OptiX OSN
equipment series to transmit and receive electrical signals of the DDN service.

11.17.3 Functions and Features


The DM12 receives and transmits four channels of Nx64 kbit/s signals and eight channels of
framed E1 electrical signals. The DM12 must work with the DX1.

11.17.4 Working Principle and Signal Flow


The DM12 consists of the interface module, switch matrix module, and power module.
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Figure 11-65 shows the functional block diagram of the DM12 by describing how to process
one channel of Nx64 kbit/s or framed E1 electrical signals.
Figure 1.1 Functional block diagram of the DM12
Backplane
Cross-connect board
Nx64 kbit/s/
Framed E1
electrical signal

Switch
matrix
module

Interface
module

Nx64 kbit/s/
Framed E1
electrical signal

+3.3 V

Power
module

Fuse

DX1

DX1

+3.3 V backup power

1.1.1.1.964 Interface Module


The interface module receives and transmits the Nx64 kbit/s or framed E1 electrical signals.

1.1.1.1.965 Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the DX1. When the TPS is performed, the switch matrix
module transmits the signal to the protection DX1 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.966 Power Module


The power module provides all the modules of the DM12 with the required DC voltages.

11.17.5 Front Panel


The front panel of the DM12 has interfaces and a bar code.

1.1.1.1.967 Diagram of the Front Panel


Figure 11-66 shows the appearance of the front panel of the DM12.

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Figure 1.1 Front panel of the DM12

DM12

E1(1-8)
DDN1
DDN2
DDN3
DDN4

DM12

1.1.1.1.968 Interfaces
The front panel of the DM12 has DB44 and DB28 interfaces. Table 11-65 describes the types
and usage of the interfaces of the DM12.
Figure 1.1 Interfaces of the DM12
Interface

Type of
Interface

Usage

E1 (18)

DB44

Transmits/Receives eight channels of framed E1


signals.

DDN1DDN4

DB28

Transmits/Receives the 1st to the 4th channels of


Nx64 kbit/s signals.

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Table 11-66 provides the pin assignments of the DB44 interface.


Figure 1.2 Pin assignments of the DB44 interface
Front View

Pin
30
44

30
15
29
14
28
13
27

31
16

12
26
11
25
10
24
9
38
23
37
22

Usage

Pin

Usage

Transmits the
1st channel of
signals (T1).

Transmits the 8th


channel of signals
(T8).

Transmits the
2nd channel of
signals (T2).

36

Transmits the
3rd channel of
signals (T3).

35

Transmits the
4th channel of
signals
(T4).
1

34

Transmits the
5th channel of
signals (T5).

33

Transmits the
6th channel of
signals (T6).

32

Transmits the
7th channel of
signals (T7).

31

Receives the
1st channel of
signals (R1).

4439 and
61

15

Receives the 3rd


channel of signals
(R3).

21

Receives the 4th


channel of signals
(R4).

20

Receives the 5th


channel of signals
(R5).

19

Receives the 6th


channel of signals
(R6).

18

Receives the 7th


channel of signals
(R7).

17

Receives the 8th


channel of signals
(R8).

16

Grounding

Receives the
2nd channel of
signals (R2).

Table 11-67 provides the pin assignments of the DB28 interface.


Figure 1.3 Pin assignments of the DB28 interface
Front View

Pin

Usage

Pin

Usage

Transmits data
signals.

19

Receives data
signals.

Transmits
clock signals.

21

Grounding

22

Receives the
loopback control

2
3
4

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Pin

Usage

Pin

Usage
signal.

28

11
12
13
14
15
16

17
18

Detects the
carrier.

23

Requests for
transmission.

25

Receives the
clock to be
used in the
transmit
1
direction
from
the external
equipment.

27

Receives clock
signals.

24

26

28

Permits the
transmission.
Receives the DCE
ready signal.
Transmits the DTE
ready signal.

11.17.6 Valid Slots


The DM12 can be installed in slots 1926 and 2936 in the subrack and works as the interface
board of the DX1.
Table 11-68 lists the slots valid for the DX1 and the corresponding slots for the DM12. The
DM12 installed in the slot with a smaller number transmits/receives eight channels of framed
E1 signals and four channels of Nx64 kbit/s signals. The DM12 installed in the slot with a
larger number transmits/receives only four channels of Nx64 kbit/s signals.
Figure 1.4 Slots valid for the DX1 and the corresponding slots for the DM12
Slot Valid for the DX1

Corresponding Slot for the DM12

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

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11.17.7 Technical Specifications


The technical specifications of the DM12 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.969 Parameters Specified for Electrical Interfaces


Table 11-69 lists the parameters specified for the electrical interfaces of the DM12.
Figure 1.1 Parameters specified for the electrical interfaces of the DM12
Interface Type

Description of the Interface

Specification of the Interface

Framed E1
interface (DB44)

Framed E1 signals

The physical and electrical


characteristics of the interface
comply with ITU-T G.703. The
frame structure of the interface
complies with ITU-T G.704.

NX64 kbit/s
interface (DB28)

V.35 interface

Complies with ITU-T V.35.

V.24 interface

Complies with ITU-T V.24.

X.21 interface

Complies with ITU-T X.21.

RS-449 interface

Complies with EIA RS-449 (RS423A and RS-422A).

RS-530 interface

Complies with EIA RS-530.

RS-530A interface

Complies with EIA RS-530A.

1.1.1.1.970 Mechanical Specifications


The mechanical specifications of the DM12 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.971 Power Consumption


At room temperature (25C), the maximum power consumption of the DM12 is 0 W.

11.18 TSB4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TSB4 (4-channel electrical interface protection switching
board).

11.18.1 Version Description


The TSB4 is available in one functional version, namely, N1.
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11.18.2 Application
The TSB4 is a PDH electrical interface protection switching board. The TSB4 can be used on
the OptiX OSN equipment series to realize the TPS protection on the PDH board.

11.18.3 Functions and Features


The TSB4 is used to provide the TPS protection.
The TSB4 can work with the MU04, C34S, or EU04 to realize the TPS protection on different
processing boards.

The TSB4 can work with the MU04 to realize the TPS protection on the SPQ4.

The TSB4 can work with the C34S to realize the TPS protection on the PL3.

The TSB4 can work with the EU04 to realize the TPS protection on the SEP.

11.18.4 Working Principle and Signal Flow


The TSB4 consists of the switch matrix module and power module.
Figure 11-67 shows the functional block diagram of the TSB4.
Figure 1.1 Functional block diagram of the TSB4
Backplane

Backplane
Cross-connect board

Interface board 1
Interface board 2

Standby processing board

Interface board 3
Switch matrix
module
+3.3 V

Power
module

Fuse

+3.3 V backup power

1.1.1.1.972 Switch Matrix Module


In the receive direction, the switch matrix module selects signals from one of the three
interface boards according to the TPS protection control signal sent from the cross-connect
board, and transmits the signals to the standby processing board.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.973 Power Module


The power module provides all the modules of the TSB4 with the required DC voltages.

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11.18.5 Front Panel


The front panel of the TSB4 has a bar code.

1.1.1.1.974 Diagram of the Front Panel


Figure 11-68 shows the appearance of the front panel of the TSB4.
Figure 1.1 Front panel of the TSB4

TSB4

TSB4

11.18.6 Valid Slots


When the TSB4 works with different processing boards and interface boards to realize the
TPS protection, the TSB4 can be installed in different slots.
The TSB4 can be installed in slots 19 and 35 in the main subrack.
Table 11-70 lists the slots valid for the TSB4 and the corresponding slots for the SPQ4 and
MU04.
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Figure 1.1 Slots valid for the TSB4 and the corresponding slots for the SPQ4 and MU04
Slot Valid for the TSB4

Slot Valid for the SPQ4

Corresponding Slot for the


MU04

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 35

Table 11-71 lists the slots valid for the TSB4 and the corresponding slots for the SEP1 and
EU04.
Figure 1.2 Slots valid for the TSB4 and the corresponding slots for the SEP1 and EU04
Slot Valid for the TSB4

Slot Valid for the SEP1

Corresponding Slot for the


EU04

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 6

Slot 29

Slot 13

Slot 31

Slot 14

Slot 33

Slot 35

The SEP1 is displayed as SEP or SEP1 on the U2000. When the interfaces are available on the front
panel of the SEP1, the SEP1 is displayed as SEP1 on the U2000. When the SEP1 works with the
interface board to realize the TPS protection, the SEP1 is displayed as SEP on the U2000.

Table 11-72 lists the slots valid for the TSB4 and the corresponding slots for the PL3 and
C34S.
Figure 1.3 Slots valid for the TSB4 and the corresponding slots for the PL3 and C34S
Slot Valid for the TSB4

Slot Valid for the PL3

Corresponding Slot for the


C34S

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 35
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Slot Valid for the TSB4

11 PDH Boards

Slot Valid for the PL3

Corresponding Slot for the


C34S

Slot 14

Slot 31

Slot 15

Slot 33

11.18.7 Technical Specifications


The technical specifications of the TSB4 include the mechanical specifications and power
consumption.

1.1.1.1.975 Mechanical Specifications


The mechanical specifications of the TSB4 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.3

1.1.1.1.976 Power Consumption


The maximum power consumption of the TSB4 at room temperature (25C) is 3 W.

11.19 TSB8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TSB8 (8-channel electrical interface protection switching
board).

11.19.1 Version Description


The TSB8 is available in one functional version, namely, N1.

11.19.2 Application
The TSB8 is a PDH electrical interface protection switching board. The TSB8 can be used on
the OptiX OSN equipment series to realize the TPS protection on the PDH board.

11.19.3 Functions and Features


The TSB8 is used to provide the TPS protection.
The TSB8 can work with the C34S, EU04, EU08, ETS8, MU04 and D34S to realize the TPS
protection on different processing boards.

The TSB8 can work with the MU04 to realize the TPS protection on the SPQ4.

The TSB8 can work with the C34S to realize the TPS protection on the PL3.

The TSB8 can work with the D34S to realize the TPS protection on the PD3.

The TSB8 can work with the D34S to realize the TPS protection on the PQ3.

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The TSB8 can work with the EU04 to realize the TPS protection on the SEP1.

The TSB8 can work with the EU08 to realize the TPS protection on the SLH1/SEP1.

The TSB8 can work with the ETS8 to realize the TPS protection on the EFS0.

The TSB8 can work with the ETS8 to realize the TPS protection on the EFS0A.

11.19.4 Working Principle and Signal Flow


The TSB8 consists of the switch matrix module and power module.
Figure 11-69 shows the functional block diagram of the TSB8 by describing how to process
one channel of signals.
Figure 1.1 Functional block diagram of the TSB8
Backplane

Backplane
Cross-connect board

Interface board 1
Interface board 2

Standby processing board

Interface board 3
Switch matrix
module
+3.3 V

Power
module

Fuse

+3.3 V backup power

1.1.1.1.977 Switch Matrix Module


In the receive direction, the switch matrix module selects signals from one of the three
interface boards according to the TPS protection control signal sent from the cross-connect
board, and transmits the signals to the standby processing board.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.978 Power Module


The power module provides all the modules of the TSB8 with the required DC voltages.

11.19.5 Front Panel


The front panel of the TSB8 has a bar code.

1.1.1.1.979 Diagram of the Front Panel


Figure 11-70 shows the appearance of the front panel of the TSB8.

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Figure 1.1 Front panel of the TSB8

TSB8

TSB8

11.19.6 Valid Slots


The TSB8 can be installed in slots 19, 20, 35, and 36 in the main subrack.
Table 11-73 lists the slots valid for the TSB8 and the corresponding slots for the SPQ4 and
MU04.
Figure 1.1 Slots valid for the TSB8 and the corresponding slots for the SPQ4 and MU04
Slot Valid for the TSB8

Slot Valid for the SPQ4

Corresponding Slot for the


MU04

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

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Slot Valid for the TSB8

Slot Valid for the SPQ4

Corresponding Slot for the


MU04

Slot 35

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Table 11-74 lists the slots valid for the TSB8 and the corresponding slots for the PL3 and
C34S.
Figure 1.2 Slots valid for the TSB8 and the corresponding slots for the PL3 and C34S
Slot Valid for the TSB8

Slot Valid for the PL3

Corresponding Slot for the


C34S

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 35

Table 11-75 lists the slots valid for the TSB8 and the corresponding slots for the PD3 and
D34S.
Figure 1.3 Slots valid for the TSB8 and the corresponding slots for the PD3 and D34S
Slot Valid for the TSB8

Slot Valid for the PD3

Corresponding Slot for the


D34S

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 35

Table 11-76 lists the slots valid for the TSB8 and the corresponding slots for the PQ3 and
D34S.

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Figure 1.4 Slots valid for the TSB8 and the corresponding slots for the PQ3 and D34S
Slot Valid for the TSB8

Slot Valid for the PQ3

Corresponding Slot for the


D34S

Slots 19 and 20

Slots 25

Slots 2126

Slots 35 and 36

Slots 1316

Slots 2934

Table 11-77 lists the slots valid for the TSB8 and the corresponding slots for the SEP1 and
EU04.
Figure 1.5 Slots valid for the TSB8 and the corresponding slots for the SEP1 and EU04
Slot Valid for the TSB8

Slot Valid for the SEP1

Corresponding Slot for the


EU04

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 35

Table 11-78 lists the slots valid for the TSB8 and the corresponding slots for the SEP1 and
EU08.
Figure 1.6 Slots valid for the TSB8 and the corresponding slots for the SEP1 and EU08
Slot Valid for the TSB8

Slot Valid for the SEP1

Corresponding Slot for the


EU08

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 6

Slot 29

Slot 13

Slot 31

Slot 14

Slot 33

Slot 35

Table 11-79 lists the slots valid for the TSB8 and the corresponding slots for the SLH1 and
EU08.

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Figure 1.7 Slots valid for the TSB8 and the corresponding slots for the SLH1 and EU08
Slot Valid for the TSB8

Slot Valid for the SLH1

Corresponding Slot for the


EU08

Slot 19 and 20

Slot 3

Slot 21 and 22

Slot 4

Slot 23 and 24

Slot 5

Slot 25 and 26

Slot 6

Slot 29 and 30

Slot 13

Slot 31 and 32

Slot 14

Slot 33 and 34

Slot 35 and 36

The SEP1 is displayed as SEP or SEP1 on the U2000. When the interfaces are available on the front
panel of the SEP1, the SEP1 is displayed as SEP1 on the U2000. When the SEP1 works with the
interface board to realize the TPS protection, the SEP1 is displayed as SEP on the U2000.

Table 11-80 lists the slots valid for the TSB8 and the corresponding slots for the EFS0 and
ETS8.
Figure 1.8 Slots valid for the TSB8 and the corresponding slots for the EFS0 and ETS8
Slot Valid for the TSB8

Slot Valid for the EFS0

Corresponding Slot for the


ETS8

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 6

Slot 29

Slot 13

Slot 31

Slot 14

Slot 33

Slot 35

Table 11-81 lists the slots valid for the TSB8 and the corresponding slots for the EFS0A and
ETS8.
Figure 1.9 Slots valid for the TSB8 and the corresponding slots for the EFS0A and ETS8
Slot Valid for the TSB8

Slot Valid for the EFS0A

Corresponding Slot for the


ETS8

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 6

Slot 29

Slot 35
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Slot Valid for the TSB8

11 PDH Boards

Slot Valid for the EFS0A

Corresponding Slot for the


ETS8

Slot 13

Slot 31

Slot 14

Slot 33

11.19.7 Technical Specifications


The technical specifications of the TSB8 include the mechanical specifications and power
consumption.

1.1.1.1.980 Mechanical Specifications


The mechanical specifications of the TSB8 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.3

1.1.1.1.981 Power Consumption


At room temperature (25C), the maximum power consumption of the TSB8 is 0 W.

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12

EoS Boards

About This Chapter


The EoS boards include the interface boards and processing boards for FE and GE services.
12.1 EFT8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFT8 (8xFE/16xFE transparent transmission board). This topic
also describes how to configure and commission the EFT8.
12.2 EFT8A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFT8A (8xFE transparent transmission board). This topic also
describes how to configure and commission the EFT8A.
12.3 EGT2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGT2 (2xGE transparent transmission board). This topic also
describes how to configure and commission the EGT2.
12.4 EFS0
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS0 (8xFE switching and processing board). This topic also
describes how to configure and commission the EFS0.
12.5 EFS0A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS0A (16xFE switching and processing board). This topic
also describes how to configure and commission the EFS0A.
12.6 EFS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS4 (4xFE switching and processing board). This topic also
describes how to configure and commission the EFS4.
12.7 EGS2

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This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGS2 (2xGE switching and processing board). This topic also
describes how to configure and commission the EGS2.
12.8 EMS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMS2 (2xGE and 16xFE switching and processing board). This
topic also describes how to configure and commission the EMS2.
12.9 EMS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMS4 (4xGE and 16xFE switching and processing board). This
topic also describes how to configure and commission the EMS4.
12.10 EGS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGS4 (4xGE switching and processing board). This topic also
describes how to configure and commission the EGS4.
12.11 EAS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EAS2 (2-port 10xGE switching and processing board). This
topic also describes how to configure and commission the EAS2.
12.12 EFF8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EFF8 (8x100M Ethernet optical interface board).
12.13 EFF8A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EFF8A (8x100M Ethernet optical interface board).
12.14 ETF8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETF8 (8x100M Ethernet twisted pair interface board).
12.15 ETF8A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETF8A (8x100M Ethernet twisted pair interface board).
12.16 ETS8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETS8 (8x10/100M Ethernet twisted pair interface switching
board).

12.1 EFT8
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFT8 (8xFE/16xFE transparent transmission board). This topic
also describes how to configure and commission the EFT8.
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12.1.1 Version Description


The EFT8 is available in the following functional versions: N1 and N2.
Table 12-1 describes the versions of the EFT8.
Figure 1.1 Versions of the EFT8
Item

Description

Functional
versions

The EFT8 is available in the following functional versions: N1 and N2.

Differences

Regarding service specifications: frame length

Regarding protection schemes: LPT

Regarding maintenance features: ETH OAM

Regarding other points:

Substitution

The N2EFT8 supports the alarm


indicating that the traffic crosses the
associated threshold.

The N2EFT8 supports the command for


loading MAC addresses in a unified
manner.

The N2EFT8 can substitute for the N1EFT8.

12.1.2 Application
The EFT8 is used to transmit/receive Ethernet services, manage bandwidths, and converge
Ethernet services.
Figure 12-1 shows the typical networking and application of the Ethernet transparent
transmission board. The Ethernet transparent transmission board realizes point-to-point
transparent transmission of Ethernet services. The Ethernet transparent transmission board
provides the following functions by using the interfaces on the board: data receipt, data
transmission, data mapping, and traffic control. In addition, the Ethernet transparent
transmission board performs port-based point-to-point transparent transmission,
encapsulation/decapsulation, overhead bytes and pointers processing, virtual concatenation,
SDH mapping/demapping, and LCAS function.

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Figure 1.1 Networking and application of the Ethernet transparent transmission board

NMS

User A2
NE1

PORT 1
NE2

MSP ring

PORT 2

NE4

NE3

User B2

Service flow
Line board

PORT 1

PORT 2

Data board
Cross-connect and
timing board

User B1

User A1

12.1.3 Functions and Features


EFT8 boards support the transparent transmission of Ethernet services, LCAS function, and
test frames.
Table 12-2 lists the functions and features supported by EFT8 boards.
Figure 1.2 Functions and features supported by EFT8 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Transparently transmits 8xFE or 16xFE services.

Port
types

Supports 10BASE-T/100BASE-TX signals. The electrical ports comply with


IEEE 802.3u.

Supports 10BASE-T/100BASE-TX signals when working with an ETF8


board. The electrical ports comply with IEEE 802.3u.

Supports 100BASE-FX/100BASE-LX signals when working with an EFF8


board. The optical ports comply with IEEE 802.3u.

Provides 16 electrical ports to receive/transmit Ethernet signals when working

Functi
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Funct
ion
and
Featu
re
ons
when
being
used
with
an
interfa
ce
board
Port
charac
teristic
s

12 EoS Boards

Description

with an ETF8 board.

Provides 8 optical ports and 8 electrical ports to receive/transmit Ethernet


signals when working with an EFF8 board.

Working
modes

100M full-duplex, 10M full-duplex, auto-negotiation

Traffic
control at
ports

Auto-negotiation mode

Not supported

Non-autonegotiation mode

Supported

Query/Se
tting of
port
status

Supported

Query of
port
types

Supported

Setting
of optical
power
threshold
s

Not supported

Pluggabl
e optical
module

Not supported

Servic
e
catego
ries

EPL
service

Supports PORT-based transparent transmission.

Servic
e
specifi
cation
s

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1q TAG

Supported

Frame
length
range

Issue 02 (2013-01-18)

N1EFT8 boards support the setting of the packet length, which


ranges from 1518 bytes to 1535 bytes. Ports 1-4 and 9-12 on the
board support a jumbo frame with a maximum length of 6144
bytes, whereas ports 5-8 and 13-16 support a jumbo frame with a

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Funct
ion
and
Featu
re

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Description

maximum length of 9600 bytes.

Issue 02 (2013-01-18)

N2EFT8 boards support the setting of the packet length, which


ranges from 1518 bytes to 9600 bytes.

N2EFT8 boards support a jumbo frame with a maximum length of


9600 bytes.

Bound
bandwidt
h

24xVC-3, or 126xVC-12 + 18xVC-3

Concaten
ation
granulari
ties

Supports VC-12, VC-3, VC-12-Xv (X 63), and VC-3-Xv (X 3)


granularities.

Encapsul
ation
formats

HDLC

Supported

LAPS

Supported

GFP-F

Supported

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports VLAN transparent transmission.

Maximu
m uplink
bandwidt
h

The maximum uplink bandwidth is 1.25 Gbit/s. An EFT8 board can


adapt to the bandwidth of its slot.

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 16


Configuration principles are as follows:

A VCTRUNK can be bound with a maximum of three VC-3s or a


maximum of 63 VC-12s.

A VCTRUNK can be bound with the VC-12 path or VC-3 path at


one time. A VCTRUNK should not be bound with VC-12 and VC3 paths at the same time.

Different VCTRUNKs can be bound with paths at different levels.

VCTRUNK 1-VCTRUNK 8 can be bound with VC-3s 1-12 or


VC-12s 1-63.

VCTRUNK 9-VCTRUNK 16 can be bound with VC-3s 13-24 or


VC-12s 64-126.

A VCTRUNK cannot be bound with VC-12s numbered 1-63 and


VC-3s numbered 10-12 at the same time. In addition, a

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Description

VCTRUNK cannot be bound with VC-12s numbered 64-126 and


VC-3s numbered 22-24 at the same time.

Protec
tion
schem
es

VC-4s numbered 4 and 8 support the binding of VC-3 and VC-12


paths. The other VC-4s support the binding of VC-3 paths only.

In the case of the configuration of cross-connection, VC-12s


numbered 163 should be configured into the fourth VC-4, and
VC-12s numbered 64126 should be configured into the eighth
VC-4.

TPS

Not supported

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT, which comply with ITU-T G.7042.

LAG

Not supported

Clock
synchr
onizati
on

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported

Maint
enanc
e
featur
es

ETH
OAM

N1EFT8 boards do not support the ETH OAM function.

N2EFT8 boards support OAM auto-discovery, link performance


detection, fault detection, remote loopback and selfloop test. These
functions comply with IEEE 802.3ah.
Test
Frame

Supports test frames in GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

Not supported

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Supports inloops.

MAC layer at Ethernet ports

Supports inloops.

VC-4 level

Not supported

VC-3 level

Supports inloops and outloops.

VC-12 level

Not supported

RMON
Issue 02 (2013-01-18)

N2EFT8 boards support CC, LB, LT. These functions comply with
IEEE 802.1ag.

Supports Ethernet performance monitoring at the port level.


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Funct
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Description

Warm
resets

Supported (Warm resets do not affect services.)

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

QoS

Not supported

Traffic
contro
l

Supports the FE port-based traffic control function that complies with IEEE
802.3x.

12.1.4 Working Principle and Signal Flow


The EFT8 consists of the Ethernet access module, mapping module, interface converting
module, logic and control module, clock module, and power module.
Figure 12-2 shows the functional block diagram of the EFT8 by describing how to process
1xFE signals.

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Figure 1.1 Functional block diagram of the EFT8


Backplane

FE

Cross-connect unit

ENCP

Ethernet
access
module

Interface
converting
module

VCP
DENCP

Cross-connect unit

Mapping module
Laser
shutdown

LOS

Logic and
control module

Communication
Reference clock and frame header

+3.3 V
Clock module
50 77 125 155
MHz MHz MHz MHz

Power
module

ENCP: data encapsulation module

Power
module

SCC unit
SCC unit
Fuse

-48 V/-60 V
-48 V/-60 V

+3.3 V

+3.3 V backup power

Fuse

DENCP: decapsulation module

VCP: virtual concatenation processing module

1.1.1.1.982 Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or
routers are converted into electrical signals. If the signals are accessed through electrical
interfaces, O/E conversion is not required. At the PHY layer, the electrical signals are decoded
and the ETH_LOS alarm is detected. The electrical signals are converted from serial signals
into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded and converted from electrical signals to optical signals.

1.1.1.1.983 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, HDLC, or
GFP format. The concatenation is performed. Then, the Ethernet signals are converted into
SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

1.1.1.1.984 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
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of the transmit system through the interface converting module.

1.1.1.1.985 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

1.1.1.1.986 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

1.1.1.1.987 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.1.5 Front Panel


The front panel of the EFT8 has indicators, interfaces, and a bar code.

1.1.1.1.988 Diagram of the Front Panel


Figure 12-3 shows the appearance of the front panel of the EFT8.

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Figure 1.1 Front panel of the EFT8

EFT8
STAT
ACT
PROG
SRV
FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8

1.1.1.1.989 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.990 Interfaces
The front panel of the EFT8 has eight FE interfaces. Table 12-3 describes the types and usage
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of the interfaces of the EFT8. For information about the cables connected to the interfaces, see
22.4.6 Straight-Through Cable and 22.4.7 Crossover Cable.
Figure 1.1 Interfaces of the EFT8
Interface

Type of
Interface

Usage

FE1

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE2

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE3

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE4

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE5

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE6

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE7

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE8

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

Table 12-4 describes the pins of the RJ45 connector.


Figure 1.2 Pins of the RJ45 connector
Pin

Description

Positive data transmit end

Negative data transmit end

Positive data receive end

Grounding

Grounding

Negative data receive end

Grounding

Grounding

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12.1.6 Jumpers and DIP Switches


The EFT8 does not have any jumpers or DIP switches that are used for board settings.
The daughter board of the N1EFT8 has only one push-button switch, which is used for resetting the
N1EFT8. When the N1EFT8 operates normally, do not push the switch. Otherwise, a cold reset is
performed on the N1EFT8 and the services may be lost.

12.1.7 Valid Slots


The EFT8 must be installed in a valid slot in the subrack. Otherwise, the EFT8 cannot work
normally.
The slots valid for an EFT8 board are determined by whether the EFT8 board works with an
interface board.
The slots valid for the EFT8 are as follows:

When the EFT8 does not work with an interface board:


the EFT8 can be installed in slots 16 and 1316. In this case, the bandwidth is 622
Mbit/s.

When the EFT8 works with an interface board: the EFT8 can be installed in slots 25
and 1316. In this case, the bandwidth is 1.25 Gbit/s.

12.1.8 Feature Code


The EFT8 does not have the feature code.

12.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.991 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

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1.1.1.1.992 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring EPL Services on Ethernet
Transparent Transmission Board.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J1/J2 byte: The setting of the J1/J2 byte on the interconnected equipment must be
consistent. Generally, use the default value. The default mode of the J1/J2 to be sent
is 16-Byte CRC Mode and the default value of the J1/J2 to be sent is HuaWei SBS
; the default mode of the J1/J2 to be received is Single-Byte Mode and the default
value of the J1/J2 to be received is 0x00.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

1.1.1.1.993 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.994 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

12.1.10 Configuring the Board Functions


The EFT8 supports multiple Ethernet functions and features such as LCAS and LPT.
Configure the functions according to actual requirements.
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You can configure the following Ethernet functions for the EFT8 by using the U2000:

LCAS

LPT

Test Frame

12.1.11 Parameter Settings


You can set parameters for the EFT8 by using the U2000.
You can set the following main parameters for the EFT8 by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

12.1.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.995 Troubleshooting
Table 12-5 lists the faults that occur on the EFT8 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EFT8 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

The negotiated working mode


of the Ethernet ports is the
half-duplex mode.

Bit errors occur on the line


side.

Transient service
interruption

Packet loss

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


Packet Loss.

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Fault Symptom

Common Fault Cause

Interconnection
fault

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Troubleshooting Method
See Troubleshooting Device
Interconnection Faults.

1.1.1.1.996 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EFT8, see Replacing an EOS Board.

12.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

12.1.13.1 Alarms of N1EFT8


ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

BOOTROM_BAD

COMMUN_FAIL

ETH_LOS

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FPGA_ABN

HARD_BAD

HP_LOM

LCAS_BAND_DECREAS
ED

LASER_MOD_ERR

LCAS_PLCR

LCAS_FOPR

LCAS_FOPT

LCAS_TLCT

LCAS_PLCT

LCAS_TLCR

LP_RDI_VC3

LOOP_ALM

LP_RDI_VC12

LP_SLM_VC12

LP_REI_VC12

LP_REI_VC3

LP_TIM_VC3

LP_SLM_VC3

LP_TIM_VC12

LP_UNEQ_VC12

LP_UNEQ_VC3

LPT_INEFFECT

LPT_RFI

LSR_NO_FITED

MSSW_DIFFERENT

NO_BD_SOFT

SLAVE_WORKING

SUBCARD_ABN

TEST_STATUS

TU_AIS_VC12

TU_AIS_VC3

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TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

W_R_FAIL

TR_LOC

T_LOSEX

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

ETH_NO_FLOW

SWDL_PKG_NOBDSOFT

ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

BOOTROM_BAD

COMMUN_FAIL

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_F
AULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CN
FLCT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_LOM

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LPT_INEFFECT

LPT_RFI

LSR_NO_FITED

NESOFT_MM

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

SLAVE_WORKING

SUBCARD_ABN

T_LOSEX

TEST_STATUS

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

WRG_BD_TYPE

12.1.13.2 Alarms of N2EFT8

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VCTRUNK_NO_FLOW

W_R_FAIL

PORTMODE_MISMATCH

12.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

12.1.14.1 Performance Events of N1EFT8


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Figure 1.2 RMON alarm

Figure 1.3 Statistics of RMON basic performance


Broadcast Packets
Received(packets)

Multicast Packets
Received(packets)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Fragments(packets)

Packets Received and


Transmitted(64 Octets in
Length)(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received(256~511
Octets in Length)(packets)

Packets
Received(512~1023 Octets
in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

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Figure 1.4 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets
Transmitted(128~255
Octets in Length)(packets)

Packets
Transmitted(256~511
Octets in Length)(packets)

Packets
Transmitted(512~1023 Octets
in Length)(packets)

Packets
Transmitted(1024~1518
Octets in Length)(packets)

Packets Received and


Transmitted(64 Octets in
Length)(packets)

Packets Received and


Transmitted(65~127 Octets in
Length)(packets)

Packets Received and


Transmitted(128~255
Octets in Length)(packets)

Packets Received and


Transmitted(256~511
Octets in Length)(packets)

Packets Received and


Transmitted(512~1023 Octets
in Length)(packets)

Packets Received and


Transmitted(1024~1518
Octets in Length)(packets)

Unicast Packets
Received(packets)

Unicast Packets
Transmitted(packets)

Pause Frames
Received(frames)

Pause Frames
Transmitted(frames)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Good Octets
Received(Byte)

Good Octets
Transmitted(Byte)

Bad Octets Received(Byte)

Bad Octets
Transmitted(Byte)

FCS Errors(frames)

12.1.14.2 Performance Events of N2EFT8


Figure 1.5 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

HPFEUAS

LPFEUAS

BDTEMPCUR

BDTEMPMAX

BDTEMPMIN

Figure 1.6 RMON alarm


UndersizePkts

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Figure 1.7 Statistics of RMON basic performance


ETHFRG

ETHOVER

ETHUNDER

RXBRDCAST

RXMULCAST

RXPKT1024

RXPKT128

RXPKT256

RXPKT512

RXPKT64

RXPKT65

Figure 1.8 Statistics of RMON extended performance


ETHFCS

PKT1024

PKT128

PKT256

PKT512

PKT64

PKT65

RXBBAD

RXBGOOD

RXPAUSE

RXUNICAST

TXBBAD

TXBGOOD

TXBRDCAST

TXMULCAST

TXPAUSE

TXPKT1024

TXPKT128

TXPKT256

TXPKT512

TXPKT64

TXPKT65

TXUNICAST

12.1.15 Technical Specifications of EFT8


The technical specifications of the EFT8 include the Ethernet performance specifications,
mechanical specifications, and power consumption.

1.1.1.1.997 Parameters Specified for Electrical Interfaces


Table 12-14 lists the parameters specified for the electrical interfaces of the EFT8.
Figure 1.1 Parameters specified for the optical interfaces of the EFT8
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

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1.1.1.1.998 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFT8 board of the N1 version.

Figure 12-4 shows the connection for testing the throughput specifications, packet loss ratio in
the case of overloading, and latency specifications of the EFT8.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, and latency specifications
Port 1
Tested
equipment 1

Tested
equipment 2
Port 2

Port 1

Port 2

Data network
performance
analyzer

Figure 12-5 shows the connection for testing the back-to-back specifications of the EFT8.
Figure 1.2 Connection for testing the back-to-back specifications
Tested
equipment 1

Port 1

Port 2

Data network
performance
analyzer

Table 12-15 lists the throughput specifications of the EFT8. Table 12-16 lists the packet loss
ratio in the case of overloading of the EFT8. Table 12-17 lists the latency specifications of the
EFT8. Table 12-18 lists the back-to-back specifications of the EFT8.

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The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and 63 VC-12s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-15 lists the throughput specifications of the EFT8. The values are obtained when the
SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Figure 1.1 Throughput specifications of the EFT8


Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,01,02)
(pks/sec)

(01,01,02) to
(01,01,01)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

297620

128

100.00

84459

84459

168918

256

100.00

45290

45290

90580

512

100.00

23496

23496

46992

1024

100.00

11973

11973

23946

1280

100.00

9615

9615

19230

1518

100.00

8127

8127

16254

Table 12-16 lists the packet loss ratio in the case of overloading of the EFT8. The values are
obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

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Figure 1.2 Packet loss ratio in the case of overloading of the EFT8
Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) (%)

(01,01,02) to
(01,01,01) (%)

Average (%)

64

100.00

0.000

0.000

0.000

128

100.00

0.000

0.000

0.000

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

Table 12-17 lists the latency specifications of the EFT8. The values are obtained when the
SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

Figure 1.3 Latency specifications of the EFT8


Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,01) to
(01,01,02) (us)CT (us)

Average
(CT) (us)

(01,01,01) to
(01,01,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

506.4

506.4

501.2

501.2

128

100.00

518.8

518.8

508.5

508.5

256

100.00

536.2

536.2

515.8

515.8

512

100.00

578.9

578.9

538.0

538.0

1024

100.00

653.4

653.4

571.4

571.4

1280

100.00

688.1

688.1

585.6

585.6

1518

100.00

720.6

720.6

599.1

599.1

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Table 12-18 lists the back-to-back specifications of the EFT8. The values are obtained when
the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Figure 1.4 Back-to-back specifications of the EFT8


Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) Burst
Size (Number of
Frames)

(01,01,02) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

297620

297620

595240

128

100.00

168918

168918

337836

256

100.00

90580

90580

181160

512

100.00

46992

46992

93984

1024

100.00

23946

23946

47892

1280

100.00

19230

19230

38460

1518

100.00

16254

16254

32508

1.1.1.1.999 Mechanical Specifications


The mechanical specifications of the EFT8 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.1000 Power Consumption


The maximum power consumption of the EFT8 at room temperature (25C) is 26 W.

12.2 EFT8A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFT8A (8xFE transparent transmission board). This topic also
describes how to configure and commission the EFT8A.

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12.2.1 Version Description


The EFT8A is available in the following functional version: N1 and N2.
Table 12-19 describes the versions of the EFT8A.
Figure 1.1 Versions of the EFT8A
Item

Description

Functional
versions

The EFT8A is available in the following functional versions: N1 and


N2.

Differences

Regarding service specifications: frame length

Regarding protection schemes: LPT

Regarding maintenance features: ETH OAM

Regarding other points:

Substitution

The N2EFT8A supports the alarm


indicating that the traffic crosses the
associated threshold.

The N2EFT8A supports the command for


loading MAC addresses in a unified
manner.

The N2EFT8A can substitute for the N1EFT8A.

12.2.2 Application
The EFT8A is used to transmit/receive Ethernet services, manage bandwidths, and converge
Ethernet services.
Figure 12-6 shows the typical networking and application of the Ethernet transparent
transmission board. The Ethernet transparent transmission board realizes point-to-point
transparent transmission of Ethernet services. The Ethernet transparent transmission board
provides the following functions by using the interfaces on the board: data receipt, data
transmission, data mapping, and traffic control. In addition, the Ethernet transparent
transmission board performs port-based point-to-point transparent transmission,
encapsulation/decapsulation, overhead bytes and pointers processing, virtual concatenation,
SDH mapping/demapping, and LCAS function.

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Figure 1.1 Networking and application of the Ethernet transparent transmission board

NMS

User A2
NE1

PORT 1
NE2

MSP ring

PORT 2

NE4

NE3

User B2

Service flow
Line board

PORT 2

PORT 1

Data board
Cross-connect and
timing board

User B1

User A1

12.2.3 Functions and Features


EFT8A boards support the transparent transmission of Ethernet services, LCAS function, and
test frames.
Table 12-20 lists the functions and features supported by EFT8A boards.
Figure 1.2 Functions and features supported by EFT8A boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Transparently transmits 8xFE services.

Port
types

Supports 10BASE-T/100BASE-TX signals.

Electrical ports comply with IEEE 802.3u.

Functi
ons
when
being
used

Provides ports on the front panel to receive/transmit 8xFE signals.

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ion
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Featu
re

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Description

with
an
interfa
ce
board
Port
charac
teristic
s

Working
modes

100M full-duplex, 10M full-duplex, and auto-negotiation

Traffic
control at
ports

Auto-negotiation mode

Not supported

Non-autonegotiation mode

Supported

Query/Se
tting of
port
status

Supported

Query of
port
types

Supported

Setting
of optical
power
threshold
s

Not supported

Pluggabl
e optical
module

Not supported

Servic
e
catego
ries

EPL
service

Supports PORT-based transparent transmission.

Servic
e
specifi
cation
s

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1q TAG

Supported

Frame
length
range

EFT8A boards support the setting of the method used for


processing frames with less than 64 bytes or error frames.

N1EFT8A boards support the setting of the packet length, which


ranges from 1518 bytes to 1535 bytes. The first four ports support
a jumbo frame with a maximum length of 6144 bytes, whereas the
last four ports support a jumbo frame with a maximum length of
9600 bytes.

N2EFT8A boards support the setting of the packet length, which

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Featu
re

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Description

ranges from 1518 bytes to 9600 bytes.

Protec

Issue 02 (2013-01-18)

N2EFT8A boards support a jumbo frame with a maximum length


of 9600 bytes.

Bound
bandwidt
h

12xVC-3, or 63xVC-12 + 9xVC-3

Concaten
ation
granulari
ties

Supports VC-12, VC-3, VC-12-Xv (X 63), and VC-3-Xv (X 3)


granularities.

Encapsul
ation
formats

HDLC

Supported

LAPS

Supported

GFP-F

Supported

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports VLAN transparent transmission.

Maximu
m uplink
bandwidt
h

622 Mbit/s

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 8

TPS

Configuration principles are as follows:

A VCTRUNK can be bound with a maximum of three VC-3s or a


maximum of 63 VC-12s.

A VCTRUNK can be bound with the VC-12 path or VC-3 path at


one time. A VCTRUNK should not be bound with VC-12 and VC3 paths at the same time.

Different VCTRUNKs can be bound with paths at different levels.

A VCTRUNK cannot be bound with VC-12s numbered 1-63 and


VC-3s numbered 10-12 at the same time.

VC-4 numbered 4 supports the binding of VC-3 and VC-12 paths.


The other VC-4s support the binding of VC-3 paths only.

VCTRUNK 1VCTRUNK 8 can be bound with VC-3s numbered


112 or VC-12s numbered 163.

Not supported

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Funct
ion
and
Featu
re

Description

tion
schem
es

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT in compliance with ITU-T G.7042.

LAG

Not supported

Clock
synchr
onizati
on

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported

Maint
enanc
e
featur
es

ETH
OAM

Not supported by N1EFT8A boards

Issue 02 (2013-01-18)

N2EFT8A boards support CC, LB, and LT. These functions comply
with IEEE 802.1ag.
N2EFT8A boards support OAM auto-discovery, link performance
monitoring, fault detection, remote loopback tests, and self-loop tests.
These functions comply with IEEE 802.3ah.

Test
Frame

Supports test frames in GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

Not supported

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Supports inloops.

MAC layer at Ethernet ports

Supports inloops.

VC-4 level

Not supported

VC-3 level

Supports inloops and outloops.

VC-12 level

Not supported

RMON

Supports Ethernet performance monitoring at the port level.

Warm
resets

Supported (Warm resets do not affect services.)

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

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Funct
ion
and
Featu
re

Description

QoS

Not supported

Traffic
contro
l

Supports the FE port-based traffic control function that complies with IEEE
802.3x.

12.2.4 Working Principle and Signal Flow


The EFT8A consists of the Ethernet access module, mapping module, interface converting
module, logic and control module, clock module, and power module.
Figure 12-7 shows the functional block diagram of the EFT8A by describing how to process
1xFE signals.
Figure 1.1 Functional block diagram of the EFT8A
Backplane

FE

ENCP

Ethernet
access
module

Interface
converting
module

VCP
DENCP

Cross-connect unit
Cross-connect unit

Mapping module
LOS
Logic and
control module

Communication
Reference clock and frame header

SCC unit
SCC unit

Fuse

-48 V/-60 V

+3.3 V
Clock
module

Power
module

50 77 125 155
MHz MHz MHz MHz

Power
module

-48 V/-60 V
+3.3 V

Fuse

+3.3 V backup power

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

1.1.1.1.1001 Ethernet Access Module


In the receive direction, the Ethernet access module receives the Ethernet electrical signals
from Ethernet equipment such as switches or routers. At the PHY layer, the electrical signals
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are decoded and the ETH_LOS alarm is detected. The electrical signals are converted from
serial signals into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded.

1.1.1.1.1002 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, HDLC, or
GFP format. The concatenation is performed. Then, the Ethernet signals are converted into
SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

1.1.1.1.1003 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1004 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Implements communication.

Controls indicators.

1.1.1.1.1005 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

1.1.1.1.1006 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

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12.2.5 Front Panel


The front panel of the EFT8A has indicators, interfaces, and a bar code.

1.1.1.1.1007 Diagram of the Front Panel


Figure 12-8 shows the appearance of the front panel of the EFT8A.
Figure 1.1 Front panel of the EFT8A

EFT8A
STAT
ACT
PROG
SRV
FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8A

1.1.1.1.1008 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

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Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1009 Interfaces
The front panel of the EFT8A has eight FE interfaces. Table 12-21 describes the types and
usage of the interfaces of the EFT8A. For information about the cables connected to the
interfaces, see 22.4.6 Straight-Through Cable and 22.4.7 Crossover Cable.
Figure 1.1 Interfaces of the EFT8A
Interface

Type of
Interface

Usage

FE1

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE2

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE3

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE4

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE5

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE6

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE7

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE8

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

Table 12-22 describes the pins of the RJ45 connector.


Figure 1.2 Pins of the RJ45 connector
Pin

Description

Positive data transmit end

Negative data transmit end

Positive data receive end

Grounding

Grounding

Negative data receive end

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Pin

Description

Grounding

Grounding

12 EoS Boards

12.2.6 Jumpers and DIP Switches


The EFT8A does not have any jumpers or DIP switches that are used for board settings.
The daughter board of the N1EFT8A has only one push-button switch, which is used for resetting the
N1EFT8A. When the N1EFT8A operates normally, do not push the switch. Otherwise, a cold reset is
performed on the N1EFT8A and the services may be lost.

12.2.7 Valid Slots


The EFT8A must be installed in a valid slot in the subrack. Otherwise, the EFT8A cannot
work normally.
The EFT8A can be installed in slots 18 and 1116 in the subrack. In this case, the bandwidth
is 622 Mbit/s.

12.2.8 Feature Code


The EFT8A does not have the feature code.

12.2.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1010 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

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1.1.1.1.1011 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring EPL Services on Ethernet
Transparent Transmission Board.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J1/J2 byte: The setting of the J1/J2 byte on the interconnected equipment must be
consistent. Generally, use the default value. The default mode of the J1/J2 to be sent
is 16-Byte CRC Mode and the default value of the J1/J2 to be sent is HuaWei SBS
; the default mode of the J1/J2 to be received is Single-Byte Mode and the default
value of the J1/J2 to be received is 0x00.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

1.1.1.1.1012 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.1013 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

12.2.10 Configuring the Board Functions


The EFT8A supports multiple Ethernet functions and features such as LCAS and LPT.
Configure the functions according to actual requirements.
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You can configure the following Ethernet functions for the EFT8A by using the U2000:

LCAS

LPT

Test Frame

12.2.11 Parameter Settings


You can set parameters for the EFT8A by using the U2000.
You can set the following main parameters for the EFT8A by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

Byte packet

CRC error frame

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

12.2.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1014 Troubleshooting
Table 12-23 lists the faults that occur on the EFT8A frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EFT8A frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

The negotiated working mode


of the Ethernet ports is the

Transient service
interruption

Packet loss

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


Packet Loss.
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Common Fault Cause

Troubleshooting Method

half-duplex mode.

Interconnection
fault

Bit errors occur on the line


side.

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

See Troubleshooting Device


Interconnection Faults.

1.1.1.1.1015 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EFT8A, see Replacing an EOS Board.

12.2.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

12.2.13.1 Alarms of N1EFT8A


ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

BOOTROM_BAD

COMMUN_FAIL

ETH_LOS

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNFL
CT

FCS_ERR

FPGA_ABN

HARD_BAD

HP_LOM

LCAS_BAND_DECREASE
D

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LPT_INEFFECT

LPT_RFI

NO_BD_SOFT

SLAVE_WORKING

TEST_STATUS

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TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

W_R_FAIL

TR_LOC

T_LOSEX

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

ETH_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.2.13.2 Alarms of N2EFT8A


ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BDID_ERROR

BIP_EXC

BIP_SD

BOOTROM_BAD

COMMUN_FAIL

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_F
AULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CN
FLCT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_LOM

LCAS_FOPR

LCAS_FOPT

LPT_INEFFECT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LPT_RFI

NO_BD_SOFT

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

SLAVE_WORKING

TU_LOP_VC3

T_LOSEX

TEST_STATUS

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

PORTMODE_MISMATCH

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

W_R_FAIL

WRG_BD_TYPE

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12.2.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

12.2.14.1 Performance Events of N1EFT8A


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Figure 1.2 SDH

Figure 1.3 RMON alarm

Figure 1.4 Statistics of RMON basic performance


Broadcast Packets
Received(packets)

Multicast Packets
Received(packets)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Fragments(packets)

Packets Received and


Transmitted(64 Octets in

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Length)(packets)
Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets
Received(512~1023 Octets
in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Packets Received(256~511
Octets in Length)(packets)

Figure 1.5 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets
Transmitted(128~255
Octets in Length)(packets)

Packets
Transmitted(256~511
Octets in Length)(packets)

Packets
Transmitted(512~1023 Octets
in Length)(packets)

Packets
Transmitted(1024~1518
Octets in Length)(packets)

Packets Received and


Transmitted(64 Octets in
Length)(packets)

Packets Received and


Transmitted(65~127 Octets in
Length)(packets)

Packets Received and


Transmitted(128~255
Octets in Length)(packets)

Packets Received and


Transmitted(256~511
Octets in Length)(packets)

Packets Received and


Transmitted(512~1023 Octets
in Length)(packets)

Packets Received and


Transmitted(1024~1518
Octets in Length)(packets)

Unicast Packets
Received(packets)

Unicast Packets
Transmitted(packets)

Pause Frames
Received(frames)

Pause Frames
Transmitted(frames)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Good Octets
Received(Byte)

Good Octets
Transmitted(Byte)

Bad Octets Received(Byte)

Bad Octets
Transmitted(Byte)

FCS Errors(frames)

12.2.14.2 Performance Events of N2EFT8A


Figure 1.6 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

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HPFEUAS

LPFEUAS

BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

Figure 1.7 RMON alarm


UndersizePkts

OversizePkts

Fragments

Figure 1.8 Statistics of RMON basic performance


ETHFRG

ETHOVER

ETHUNDER

RXBRDCAST

RXMULCAST

RXPKT1024

RXPKT128

RXPKT256

RXPKT512

RXPKT64

RXPKT65

Figure 1.9 Statistics of RMON extended performance


ETHFCS

PKT1024

PKT128

PKT256

PKT512

PKT64

PKT65

RXBBAD

RXBGOOD

RXPAUSE

RXUNICAST

TXBBAD

TXBGOOD

TXBRDCAST

TXMULCAST

TXPAUSE

TXPKT1024

TXPKT128

TXPKT256

TXPKT512

TXPKT64

TXPKT65

TXUNICAST

12.2.15 Technical Specifications of EFT8A


The technical specifications of the EFT8A include the Ethernet performance specifications,
mechanical specifications, and power consumption.

1.1.1.1.1016 Parameters Specified for Electrical Interfaces


Table 12-33 lists the parameters specified for the electrical interfaces of the EFT8A.

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Figure 1.1 Parameters specified for the optical interfaces of the EFT8A
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

1.1.1.1.1017 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFT8A board of the N1 version.

Figure 12-9 shows the connection for testing the throughput specifications, packet loss ratio in
the case of overloading, and latency specifications of the EFTA.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, and latency specifications
Port 1
Tested
equipment 1

Tested
equipment 2
Port 2

Port 1

Port 2

Data network
performance
analyzer

Figure 12-10 shows the connection for testing the back-to-back specifications of the EFT8A.

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Figure 1.2 Connection for testing the back-to-back specifications


Tested
equipment 1

Port 1

Port 2

Data network
performance
analyzer

Table 12-34 lists the throughput specifications of the EFT8A. Table 12-35 lists the packet loss
ratio in the case of overloading of the EFT8A. Table 12-36 lists the latency specifications of
the EFT8A. Table 12-37 lists the back-to-back specifications of the EFT8A.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and 63 VC-12s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-34 lists the throughput specifications of the EFT8A. The values are obtained when
the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Figure 1.1 Throughput specifications of the EFT8A


Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,01,02)
(pks/sec)

(01,01,02) to
(01,01,01)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

297620

128

100.00

84459

84459

168918

256

100.00

45290

45290

90580

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Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,01,02)
(pks/sec)

(01,01,02) to
(01,01,01)
(pks/sec)

Total (pks/sec)

512

100.00

23496

23496

46992

1024

100.00

11973

11973

23946

1280

100.00

9615

9615

19230

1518

100.00

8127

8127

16254

Table 12-35 lists the packet loss ratio in the case of overloading of the EFT8A. The values are
obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Figure 1.2 Packet loss ratio in the case of overloading of the EFT8A
Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) (%)

(01,01,02) to
(01,01,01) (%)

Average (%)

64

100.00

0.000

0.000

0.000

128

100.00

0.000

0.000

0.000

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

Table 12-36 lists the latency specifications of the EFT8A. The values are obtained when the
SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input

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port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.
Figure 1.3 Latency specifications of the EFT8A
Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,01) to
(01,01,02) (us)CT (us)

Average
(CT) (us)

(01,01,01) to
(01,01,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

506.4

506.4

501.2

501.2

128

100.00

518.8

518.8

508.5

508.5

256

100.00

536.2

536.2

515.8

515.8

512

100.00

578.9

578.9

538.0

538.0

1024

100.00

653.4

653.4

571.4

571.4

1280

100.00

688.1

688.1

585.6

585.6

1518

100.00

720.6

720.6

599.1

599.1

Table 12-37 lists the back-to-back specifications of the EFT8A. The values are obtained when
the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Figure 1.4 Back-to-back specifications of the EFT8A


Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) Burst
Size (Number of
Frames)

(01,01,02) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

297620

297620

595240

128

100.00

168918

168918

337836

256

100.00

90580

90580

181160

512

100.00

46992

46992

93984

1024

100.00

23946

23946

47892

1280

100.00

19230

19230

38460

1518

100.00

16254

16254

32508

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1.1.1.1.1018 Mechanical Specifications


The mechanical specifications of the EFT8A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.1019 Power Consumption


The maximum power consumption of the EFT8A at room temperature (25C) is 26 W.

12.3 EGT2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGT2 (2xGE transparent transmission board). This topic also
describes how to configure and commission the EGT2.

12.3.1 Version Description


The EGT2 is available in two functional versions, namely, N1 and N2.
Table 12-38 describes the versions of the EGT2.
Figure 1.1 Versions of the EGT2
Item

Description

Functional versions

The EGT2 is available in two functional versions, namely, N1 and


N2.

Differences

Regarding interface specifications: interface types, interface


characteristics

Regarding service specifications: VCTRUNK specifications,


Mapping granularities

Regarding maintenance features: ETH OAM

Substitution

The N2EGT2 can substitute for the N1EGT2.

12.3.2 Application
The EGT2 is used to transmit/receive Ethernet services, manage bandwidths, and converge
Ethernet services.
Figure 12-11 shows the typical networking and application of the Ethernet transparent
transmission board. The Ethernet transparent transmission board realizes point-to-point
transparent transmission of Ethernet services. The Ethernet transparent transmission board
provides the following functions by using the interfaces on the board: data receipt, data
transmission, data mapping, and traffic control. In addition, the Ethernet transparent
transmission board performs port-based point-to-point transparent transmission,
encapsulation/decapsulation, overhead bytes and pointers processing, virtual concatenation,
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SDH mapping/demapping, and LCAS function.


Figure 1.1 Networking and application of the Ethernet transparent transmission board

NMS

User A2
NE1

PORT 1
NE2

MSP ring

PORT 2

NE4

NE3

User B2

Service flow
Line board

PORT 1

PORT 2

Data board
Cross-connect and
timing board

User B1

User A1

12.3.3 Functions and Features


EGT2 boards support the transparent transmission of Ethernet services, LCAS function, and
test frames.
Table 12-39 lists the functions and features supported by EGT2 boards.
Figure 1.2 Functions and features supported by EGT2 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Transparently transmits 2xGE services.

Port
types

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EGT2 boards support 1000BASE-SX/LX/ZX/VX Ethernet optical ports. The


optical ports support the auto-negotiation function in compliance with IEEE
802.3z. The optical ports use SFP optical modules and support hot swapping.
When the multi-mode optical fiber is used, the maximum transmission
distance is 550 m. When the single-mode optical fiber is used, the maximum
transmission distance is 10 km. The optical modules that can meet different
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ion
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Featu
re

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Description

requirements for the transmission distance such as 40 km and 80 km can also


be used.

N2EGT2 boards also support 1000BASE-T RJ-45 Ethernet electrical ports.


The electrical ports support the 1000M full-duplex working mode. N2EGT2
boards use SFP electrical ports and support hot swapping. The maximum
transmission distance is 100 m.

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides ports on the front panel.

Port
charac
teristic
s

Working
modes

1000M full-duplex and auto-negotiation

Traffic
control at
ports

Auto-negotiation mode

Not supported

Non-autonegotiation mode

Supported

Query/Se
tting of
port
status

Supported

Query of
port
types

Supported

Setting
of optical
power
threshold
s

Not supported

Pluggabl
e optical
module

Supports SFP optical modules.

EPL
servic
e

Supports PORT-based transparent transmission.

Servic
e
specifi

Formats
of
Ethernet

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IEEE 802.3

Supported

Ethernet II

Supported

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Funct
ion
and
Featu
re

Description

cation
s

data
frames

IEEE 802.1q TAG

Frame
length
range

Supports the setting of the packet length, which ranges from 1518
bytes to 9600 bytes.

Supports a jumbo frame with a maximum length of 9600 bytes.

Bound
bandwidt
h

16xVC-4, or 48xVC-3

Concaten
ation
granulari
ties

Supports VC-3, VC-4, VC-3-Xv (X 24), and VC-4-Xv (X 8)


granularities.

Encapsul
ation
formats

HDLC

Supported

LAPS

Supported

GFP-F

Supported

Protec
tion
schem
es

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Supported

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports VLAN transparent transmission.

Maximu
m uplink
bandwidt
h

The maximum uplink bandwidth is 2.5 Gbit/s. An EGT2 board can


adapt to the bandwidth of its slot.

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 2


Configuration principles are as follows:

A VCTRUNK can be bound with a maximum of eight VC-4s or a


maximum of 24 VC-3s. A VCTRUNK can be bound with VC-4s
numbered 1-16 or VC-3s numbered 1-48.

The virtual concatenation modes of the two VCTRUNKs of the


board should be the same. That is, the two VCTRUNKs should be
of the VC-4 virtual concatenation or of the VC-3 virtual
concatenation.

TPS

Not supported

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT in compliance with ITU-T G.7042.


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Funct
ion
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Featu
re

Synch
roniza
tion

Maint
enanc
e
featur
es

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Description

LAG

Not supported

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported

ETH
OAM

N1EGT2 boards do not support the ETH OAM function.

N2EGT2 boards support CC, LB test, and LT test. These functions


comply with IEEE 802.1ag.

Test
Frame

Supports test frames in GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

Not supported

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Supports inloops.

MAC layer at Ethernet ports

Supports inloops.

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

RMON

Supports Ethernet performance monitoring at the port level.

Warm
resets

Supported (Warm resets do not affect services.)

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

QoS

Not supported

Traffic
contro
l

Supports the GE port-based traffic control function that complies with IEEE
802.3x.

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12.3.4 Working Principle and Signal Flow


The EGT2 consists of the Ethernet access module, mapping module, interface converting
module, logic and control module, clock module, and power module.
Figure 12-12 shows the functional block diagram of the EGT2 by describing how to process
1xGE signals.
Figure 1.1 Functional block diagram of the EGT2
Backplane

GE

ENCP

Ethernet
access
module

VCP
DENCP

Interface
converting
module

Cross-connect unit
Cross-connect unit

Mapping module
Laser
shutdown

LOS

Logic and
control module

Communication
Reference clock and frame header

+3.3 V
Clock module

Power
module

50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module

Power
module

SCC unit
SCC unit

Fuse

-48 V/-60 V
-48 V/-60 V

+3.3 V

+3.3 V backup power

Fuse

DENCP: decapsulation module

VCP: virtual concatenation processing module

1.1.1.1.1020 Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or
routers are converted into electrical signals. If the signals are accessed through electrical
interfaces, O/E conversion is not required. At the PHY layer, the electrical signals are decoded
and the ETH_LOS alarm is detected. The electrical signals are converted from serial signals
into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded and converted from electrical signals to optical signals.

1.1.1.1.1021 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, HDLC, or
GFP format. The concatenation is performed. Then, the Ethernet signals are converted into
SDH signals.
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In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

1.1.1.1.1022 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1023 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

1.1.1.1.1024 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

1.1.1.1.1025 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.3.5 Front Panel


The front panel of the EGT2 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1026 Diagram of the Front Panel


Figure 12-13 shows the appearance of the front panel of the N1EGT2/N2EGT2 that has the
GE optical interface.

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Figure 1.1 Front panel of the N1EGT2/N2EGT2 that has the GE optical interface

EGT2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

EGT2

The N2EGT2 can also be installed with the GE electrical interface. Figure 12-14 shows the
appearance of the front panel of the N2EGT2 that has the GE electrical interface.

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Figure 1.2 Front panel of the N2EGT2 that has the GE electrical interface

EGT2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

OUT1
IN1
OUT2
IN2

EGT2

1.1.1.1.1027 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1028 Interfaces
The front panel of the N1EGT2/N2EGT2 has two GE optical interfaces. Table 12-40
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describes the types and usage of the optical interfaces of the N1EGT2/N2EGT2.
Figure 1.1 Optical interfaces of the N1EGT2/N2EGT2
Interface

Type of Interface

Usage

IN1/OUT1

LC (swappable)

Transmits and receives 1000BASESX/LX/ZX/VX signals.

IN2/OUT2

LC (swappable)

Transmits and receives 1000BASESX/LX/ZX/VX signals.

The two GE electrical interfaces of the N2EGT2 are of the same type and have the same
usage. Table 12-41 describes the types and usage of the electrical interfaces of the N2EGT2.
Figure 1.2 Electrical interfaces of the N2EGT2
Interface

Type of Interface

Usage

GE

RJ-45 (swappable)

Transmits and receives 1000BASE-T


signals.

Table 12-42 provides the pin assignments of the RJ-45 interface of the N2EGT2.
Figure 1.3 Pin assignments of the RJ-45 interface of the N2EGT2
Pin

Description

BI_DA+

BI_DA

BI_DB+

BI_DC+

BI_DC

BI_DB

BI_DD+

BI_DD

12.3.6 Jumpers and DIP Switches


The EGT2 does not have any jumpers or DIP switches that are used for board settings.

12.3.7 Valid Slots


The EGT2 must be installed in a valid slot in the subrack. Otherwise, the EGT2 cannot work
normally.
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The N1EGT2 can be installed in slots 14, 58, 1114, and 1516. When the N1EGT2 is
installed in slots 14 and 1516, the bandwidth is 1.25 Gbit/s. When the N1EGT2 is installed
in slots 58 and 1114, the bandwidth is 2.5 Gbit/s.
The N2EGT2 can be installed in slots 18 and 1116. In this case, the bandwidth is 2.5 Gbit/s.

12.3.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EGT2 indicates the type of interface.
Table 12-43 provides the relationship between the feature code of the EGT2 and the type of
interface.
Figure 1.4 Relationship between the feature code of the EGT2 and the type of interface
Board

Feature Code

Type of Interface

SSN1EGT210 and
SSN2EGT210

10

1000BASE-SX (0.5 km)

SSN1EGT211 and
SSN2EGT211

11

1000BASE-LX (10 km)

SSN1EGT212 and
SSN2EGT212

12

1000BASE-VX (40 km)

SSN1EGT213 and
SSN2EGT213

13

1000BASE-ZX (80 km)

SSN2EGT214

14

1000BASE-T (100 m)

12.3.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1029 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
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correct.
----End

1.1.1.1.1030 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring EPL Services on Ethernet
Transparent Transmission Board.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J1/J2 byte: The setting of the J1/J2 byte on the interconnected equipment must be
consistent. Generally, use the default value. The default mode of the J1/J2 to be sent
is 16-Byte CRC Mode and the default value of the J1/J2 to be sent is HuaWei SBS
; the default mode of the J1/J2 to be received is Single-Byte Mode and the default
value of the J1/J2 to be received is 0x00.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

1.1.1.1.1031 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.1032 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

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12.3.10 Configuring the Board Functions


The EGT2 supports multiple Ethernet functions and features such as LCAS and LPT.
Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EGT2 by using the U2000:

LCAS

LPT

Test Frame

12.3.11 Parameter Settings


You can set parameters for the EGT2 by using the U2000.
You can set the following main parameters for the EGT2 by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

12.3.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1033 Troubleshooting
Table 12-44 lists the faults that occur on the EGT2 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EGT2 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

Transient service
interruption

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

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Fault Symptom

Common Fault Cause

Packet loss

The negotiated working mode


of the Ethernet ports is the
half-duplex mode.

Bit errors occur on the line


side.

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Interconnection
fault

Troubleshooting Method
See Troubleshooting Service
Packet Loss.

See Troubleshooting Device


Interconnection Faults.

1.1.1.1.1034 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EGT2, see Replacing an EOS Board.

12.3.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

12.3.13.1 Alarms of N1EGT2


ALM_GFP_dLFD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

B3_SD_VC4

BD_STATUS

BDID_ERROR

COMMUN_FAIL

ETH_LOS

FPGA_ABN

HARD_BAD

HP_RDI

HP_SLM

HP_TIM

HP_UNEQ

LASER_MOD_ERR

LCAS_BAND_DECREAS
ED

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_RDI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LPT_RFI

LSR_NO_FITED

NO_BD_SOFT

TEST_STATUS

TU_AIS_VC3

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TU_LOP_VC3

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

T_LOSEX

TR_LOC

ETH_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.3.13.2 Alarms of N2EGT2


ALM_GFP_dLFD

AU_AIS

AU_LOP

B3_SD_VC3

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC4

BD_STATUS

COMMUN_FAIL

ETH_CFM_RDI

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_RDI

HP_SLM

HP_TIM

HP_UNEQ

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_RDI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LPT_RFI

LSR_NO_FITED

LSR_WILL_DIE

LTEMP_OVER

MOD_TYPE_MISMATC
H

NO_BD_SOFT

PORT_MODULE_OFFLINE

IN_PWR_HIGH

IN_PWR_LOW

OUT_PWR_HIGH

OUT_PWR_LOW

T_LOSEX

TD

TEMP_OVER

TF

TR_LOC

TU_AIS_VC3

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC3

VCAT_LOM_VC4

VCAT_SQM_VC3

VCAT_SQM_VC4

VCTRUNK_NO_FLOW

WRG_BD_TYPE

12.3.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
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performance events are reported according to the logical board on the .

12.3.14.1 Performance Events of N1EGT2


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFECSES

LPFEES

LPFESES

LPSES

DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

FCSErrors

LPUAS

Figure 1.2 RMON alarm

Figure 1.3 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets/s)

Packets Received(65~127
Octets in Length)
(packets/s)

Packets Received(128~255
Octets in Length)(packets/s)

Packets
Received(256~511
Octets in Length)
(packets/s)

Packets
Received(512~1023 Octets
in Length)(packets/s)

Packets Received(1024~1518
Octets in Length)(packets/s)

Multicast Packets
Received(packets/s)

Broadcast Packets
Received(packets/s)

Drop Events(times/s)

Undersize Packets
Received(packets/s)

Oversize Packets
Received(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Octets Received(Byte/s)

Packets Received(packets/s)

Figure 1.4 Statistics of RMON extended performance

Packets Transmitted(64
Octets in Length)(packets/s)
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Packets
Transmitted(256~511 Octets
in Length)(packets/s)

Packets
Transmitted(512~1023
Octets in Length)
(packets/s)

Packets
Transmitted(1024~1518
Octets in Length)(packets/s)

Unicast Packets
Received(packets/s)

Unicast Packets
Transmitted(packets/s)

Multicast Packets
Transmitted(packets/s)

Broadcast Packets
Transmitted(packets/s)

Pause Frames
Received(frames/s)

Pause Frames
Transmitted(frames/s)

FCS Errors(frames/s)

Packets Received and


Transmitted(64 Octets in
Length)(packets/s)

Packets Received and


Transmitted(65~127 Octets in
Length)(packets/s)

Packets Received and


Transmitted(128~255 Octets
in Length)(packets/s)

Packets Received and


Transmitted(256~511
Octets in Length)
(packets/s)

Packets Received and


Transmitted(512~1023 Octets
in Length)(packets/s)

Packets Received and


Transmitted(1024~1518
Octets in Length)(packets/s)

12.3.14.2 Performance Events of N2EGT2


Figure 1.5 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Figure 1.6 RMON alarm


DropEvent
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Fragments

Jabbers

FCSErrors

Figure 1.7 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets/s)

Packets Received(65~127
Octets in Length)
(packets/s)

Packets Received(128~255
Octets in Length)(packets/s)

Packets
Received(256~511
Octets in Length)
(packets/s)

Packets
Received(512~1023 Octets
in Length)(packets/s)

Packets Received(1024~1518
Octets in Length)(packets/s)

Multicast Packets
Received(packets/s)

Broadcast Packets
Received(packets/s)

Drop Events(times/s)

Undersize Packets
Received(packets/s)

Oversize Packets
Received(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Octets Received(Byte/s)

Packets Received(packets/s)

Figure 1.8 Statistics of RMON extended performance

Packets Transmitted(64
Octets in Length)(packets/s)

Packets
Transmitted(65~127
Octets in Length)
(packets/s)

Packets Transmitted(128~255
Octets in Length)(packets/s)

Packets
Transmitted(256~511 Octets
in Length)(packets/s)

Packets
Transmitted(512~1023
Octets in Length)
(packets/s)

Packets
Transmitted(1024~1518
Octets in Length)(packets/s)

Unicast Packets
Received(packets/s)

Unicast Packets
Transmitted(packets/s)

Multicast Packets
Transmitted(packets/s)

Broadcast Packets
Transmitted(packets/s)

Pause Frames
Received(frames/s)

Pause Frames
Transmitted(frames/s)

FCS Errors(frames/s)

Packets Received and


Transmitted(64 Octets in
Length)(packets/s)

Packets Received and


Transmitted(65~127 Octets in
Length)(packets/s)

Packets Received and


Transmitted(128~255 Octets
in Length)(packets/s)

Packets Received and


Transmitted(256~511
Octets in Length)
(packets/s)

Packets Received and


Transmitted(512~1023 Octets
in Length)(packets/s)

Packets Received and


Transmitted(1024~1518
Octets in Length)(packets/s)
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12.3.15 Technical Specifications


The technical specifications of the EGT2 include the parameters specified for optical
interfaces, laser safety class, Ethernet performance specifications, mechanical specifications,
and power consumption.

1.1.1.1.1035 Parameters Specified for Optical Interfaces


Table 12-53 lists the parameters specified for the optical interfaces of the EGT2.
Figure 1.1 Parameters specified for the optical interfaces of the EGT2
Parameter

Value

Type of optical
interface

1000BASEZX (80 km)

1000BASE-VX
(40 km)

1000BASELX (10 km)

1000BASE-SX
(0.5 km)

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

Launched
optical power
range (dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength
range (nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

Receiver
sensitivity
(dBm)

-23

-23

20

-17

Minimum
extinction ratio
(dB)

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression
ratio (dB)

30

30

1.1.1.1.1036 Ethernet Electrical Interfaces


Table 12-54 lists the parameters specified for the electrical interfaces of the EGT2.

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Figure 1.1 Parameters specified for the electrical interfaces of the EGT2
Type of Interface

Code Type

1000BASE-T

4D-PAM5

Only the EGT2 boards of the N2 version supports the GE electrical interfaces.

1.1.1.1.1037 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGT2 board of the N1 version.

Figure 12-15 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, and latency specifications of the N1EGT2.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, and latency specifications of the N1EGT2
Port 1
Tested
equipment 1

Tested
equipment 2
Port 2

Port 1

Port 2

Data network
performance
analyzer

Figure 12-16 shows the connection for testing the back-to-back specifications of the N1EGT2.
Figure 1.2 Connection for testing the back-to-back specifications of the N1EGT2
Tested
equipment 1

Port 1

Port 2

Data network
performance
analyzer

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Table 12-55 lists the throughput specifications of the N1EGT2. Table 12-56 lists the packet
loss ratio in the case of overloading of the N1EGT2. Table 12-57 lists the latency
specifications of the N1EGT2. Table 12-58 lists the back-to-back specifications of the
N1EGT2.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and 24 VC-3s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-55 lists the throughput specifications of the N1EGT2. The values are obtained when
the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Figure 1.1 Throughput specifications of the N1EGT2


Frame Size
(Byte)

Passed Rate
(%)

(01,02,01) to
(01,02,02)
(pks/sec)

(01,02,02) to
(01,02,01)
(pks/sec)

Total (pks/sec)

64

100.00

1488095

1488095

2976190

128

100.00

844595

844595

1689190

256

100.00

452899

452899

905798

512

100.00

234962

234962

469924

1024

100.00

119732

119732

239464

1280

100.00

96154

96154

192308

1518

100.00

81274

81274

162548

Table 12-56 lists the packet loss ratio in the case of overloading of the N1EGT2. The values
are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

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The test duration is set to 60 seconds.

Figure 1.2 Packet loss ratio in the case of overloading of the N1EGT2
Frame Size
(Byte)

Rate Tested
(%)

(01,02,01) to
(01,02,02) (%)

(01,02,02) to
(01,02,01) (%)

Average (%)

64

100.00

0.000

0.000

0.000

128

100.00

0.000

0.000

0.000

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

Table 12-57 lists the latency specifications of the N1EGT2. The values are obtained when the
SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

Figure 1.3 Latency specifications of the N1EGT2


Frame
Size
(Byte)

Rate
Tested
(%)

(01,02,01) to
(01,02,02) (us)CT (us)

Average
(CT) (us)

(01,02,02) to
(01,02,01)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

35.7

35.7

35.2

35.2

128

100.00

37.1

37.1

36.1

36.1

256

100.00

39.5

39.5

37.4

37.4

512

100.00

44.1

44.1

40.1

40.1

1024

100.00

53.2

53.2

45.1

45.1

1280

100.00

57.6

57.6

47.4

47.4

1518

100.00

61.9

61.9

49.7

49.7

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Frame
Size
(Byte)

Rate
Tested
(%)

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(01,02,01) to
(01,02,02) (us)CT (us)

Average
(CT) (us)

(01,02,02) to
(01,02,01)
(us)-S&F (us)

Average
(S&F) (us)

Table 12-58 lists the back-to-back specifications of the N1EGT2. The values are obtained
when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Figure 1.4 Back-to-back specifications of the N1EGT2


Frame Size
(Byte)

Rate Tested
(%)

(01,02,01) to
(01,02,02) Burst
Size (Number of
Frames)

(01,02,02) to
(01,02,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

2976190

2976190

5952380

128

100.00

1689190

1689190

3378380

256

100.00

905798

905798

1811596

512

100.00

469924

469924

939848

1024

100.00

239464

239464

478928

1280

100.00

192308

192308

384616

1518

100.00

162548

162548

325096

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGT2 board of the N2 version.

Figure 12-17 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N2EGT2.

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Figure 1.3 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications of the N2EGT2
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-59 lists the throughput specifications of the N2EGT2. Table 12-60 lists the packet
loss ratio in the case of overloading of the N2EGT2. Table 12-61 lists the latency
specifications of the N2EGT2. Table 12-62 lists the back-to-back specifications of the
N2EGT2.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and two VC-3s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-59 lists the throughput specifications of the N2EGT2. The values are obtained when
the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 15

Maximum rate (%): 15

Mode: Uni-directional

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Figure 1.5 Throughput specifications of the N2EGT2


Frame Size
(byte)

Passed Rate (%)

(01,05,02) to (01,05,01)
(pks/sec)

Total (pks/sec)

64

11.23

167112

334224

128

10.48

88527

177054

256

9.75

44138

88276

512

9.74

22894

45788

1024

9.75

11674

23348

1280

9.75

9373

18746

1518

9.75

7922

15844

Table 12-60 lists the packet loss ratio in the case of overloading of the N2EGT2. The values
are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 11.23

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.6 Packet loss ratio in the case of overloading of the N2EGT2
Frame Size
(byte)

Rate Tested (%)

(01,05,02) to (01,05,01)
(%)

Average (%)

64

11.23

0.000

0.000

128

10.48

0.000

0.000

256

9.75

0.000

0.000

512

9.74

0.000

0.000

1024

9.75

0.000

0.000

1280

9.75

0.000

0.000

1518

9.75

0.000

0.000

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Table 12-61 lists the latency specifications of the N2EGT2. The values are obtained when the
SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 100 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

Measure on one receiving card only

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 11.23

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.7 Latency specifications of the N2EGT2


Frame
Size
(byte)

Rate
Tested
(%)

(01,05,02) to
(01,05,01) (us)CT (us)

Average
(CT) (us)

(01,05,02) to
(01,05,01)
(us)-S&F (us)

Average
(S&F) (us)

64

11.23

92.7

92.7

92.1

92.1

128

10.48

97.7

97.7

96.6

96.6

256

9.75

109.5

109.5

107.5

107.5

512

9.74

133.1

133.1

129.0

129.0

1024

9.75

178.8

178.8

170.6

170.6

1280

9.75

204.1

204.1

193.9

193.9

1518

9.75

224.0

224.0

211.9

211.9

Table 12-62 lists the back-to-back specifications of the N2EGT2. The values are obtained
when the SmartApplication is set as follows:

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The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
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disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 1 on the SmartApplication.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 11.23

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.8 Back-to-back specifications of the N2EGT2


Frame Size
(byte)

Rate Tested (%)

(01,05,02) to (01,05,01)
Burst Size (frames)

Total (frames)

64

11.23

334224

668448

128

10.48

177054

354108

256

9.75

88276

176552

512

9.74

45754

91508

1024

9.75

23348

46696

1280

9.75

18752

37504

1518

9.75

15848

31696

1.1.1.1.1038 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1039 Mechanical Specifications


The mechanical specifications of the EGT2 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.9

1.1.1.1.1040 Power Consumption


The maximum power consumption of the N1EGT2 at room temperature (25C) is 29 W.
The maximum power consumption of the N2EGT2 at room temperature (25C) is 15 W.

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12.4 EFS0
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS0 (8xFE switching and processing board). This topic also
describes how to configure and commission the EFS0.

12.4.1 Version Description


The EFS0 is available in several functional versions. Select a functional board according to
actual requirements.
The EFS0 is available in the following functional versions: N1, N2, N4, and N5. The
N2EFS0/N4EFS0/N1EFS0 is discontinued.
Table 12-63 describes the versions of the EFS0.
Figure 1.1 Versions of the EFS0
Item

Description

Functional
versions

The EFS0 is available in the following functional versions: N1, N2, N4,
and N5.

Differences

Regarding interface specifications: interface types, functions when


being used with an interface board

Regarding service specifications: bound bandwidth, maximum


uplink bandwidth, VCTRUNK specifications

Regarding protection schemes: TPS, LCAS, LPT, LAG

Regarding maintenance features: ETH OAM, test frame, , port


mirroring, loopback capability, warm resets

QoS

Traffic monitoring

Substitution

The N2EFS0 supports the board version replacement function and can
replace the N1EFS0.
The N4EFS0 supports the board version replacement function and can
replace the N2EFS0/N1EFS0.
The N5EFS0 supports the board version replacement function and can
replace the N4EFS0/N2EFS0/N1EFS0.

12.4.2 Application
The EFS0 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 12-18 shows the typical networking and application of the Ethernet switching board.
the Ethernet switching board accesses and converges Ethernet services, and provides the
Ethernet data with the following data features: Layer 2 switching, port isolation, flow
classification, traffic control, VLAN management, and priority configuration. In addition, the
Ethernet switching board performs encapsulation/decapsulation, virtual concatenation, and
SDH mapping/demapping for data. The Ethernet switching board can be interconnected with
the bandwidth access equipment and the data communication equipment at the same time,
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thus to provide a network-level solution.


Figure 1.1 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

12.4.3 Functions and Features


EFS0 boards support the Layer 2 switching, MPLS, and broadcast functions.
Table 12-64 lists the functions and features supported by EFS0 boards.
Figure 1.2 Functions and features supported by EFS0 boards
Function and
Feature

Description

Basic functions

Processes 8xFE services.

Port types

An EFS0 board supports 10BASE-T/100BASE-TX signals when


working with an ETF8 board. The electrical ports comply with
IEEE 802.3u.

An EFS0 board supports 100BASE-FX/LX/VX/ZX signals when


working with an EFF8 board. The optical ports comply with IEEE
802.3u.

An N5EFS0 board supports 10BASE-T/100BASE-TX signals


when working with an ETF8A board. The electrical ports comply
with IEEE 802.3u.

An N5EFS0 board supports 100BASE-FX/LX signals when


working with an EFF8A board. The optical ports comply with

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Description
IEEE 802.3u.

Functions when
being used with an
interface board

Port characteristics

Service categories

Issue 02 (2013-01-18)

An EFS0 board provides eight electrical ports to receive/transmit


FE signals when working with an ETF8 board.

An EFS0 board provides eight optical ports to receive/transmit FE


signals when working with an EFF8 board.

An EFS0 board provides the TPS protection for FE signals


received/transmitted through eight electrical ports when working
with an ETS8 board and a TSB8 board.

An N5EFS0 board provides eight electrical ports to


receive/transmit FE signals when working with an ETF8A board.

An N5EFS0 board provides eight optical ports to receive/transmit


FE signals when working with an EFF8A board.

Workin
g
modes

FE electrical port: auto-negotiation, 100M full-duplex,


100M half-duplex, 10M full-duplex, and 10M halfduplex

FE optical port: 100M full-duplex

An N5EFS0 board supports only the auto-negotiation


and 100M full-duplex working mode when working
with an EFF8A board.

Traffic
control
at ports

Auto-negotiation mode

Supported (Not supported


by FE optical ports)

Non-autonegotiation mode

Supported (not supported if


an EFS0 board works with
an EFF8 board)

Query/
Setting
of port
status

Supported

Query
of port
types

Supported

Setting
of
optical
power
thresho
lds

Not supported

Plugga
ble
optical
module

Not supported

EPL
service

Supports PORT-based transparent transmission.

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Description
EVPL
service

Supports PORT-shared EVPL services.

Supports VCTRUNK-shared EVPL services.

EPLA
N
service

Service
specifications

Issue 02 (2013-01-18)

The services are isolated by


VLAN tags.

The services are isolated by


MPLS tags.

The services are isolated by


QinQ tags.

Supports a maximum of 4096 links.

N4EFS0/N5EFS0 boards support the EPLAN services that


are based on the IEEE 802.1d MAC bridge.

Supports the blacklist that can contain 2K records and


also the static MAC address table that can contain 2K
records. The sum of the number of records in the
blacklist and the number of addresses in the static MAC
address table must not exceed 2K. The blacklist
function of N5EFS0 boards supports verification of
destination MAC addresses only.

Supports the self-learning of the source MAC address.


The capacity of the MAC address table is 16K. The
aging time of the MAC address can be set and queried.

Supports the configuration of static MAC routes.

N4EFS0/N5EFS0 boards support the query of dynamic


MAC addresses.

The maximum number of supported VBs is 16. The


maximum number of logical ports for each VB is 30.

Queries the number of actually learned MAC addresses


based on VB+VLAN or VB+LP.

EVPL
AN
service
s

Supports data isolation based on VB+VLAN.

Supports the setting of a maximum of 4096 VLAN


services.

Supports the EVPLAN services that are based on the


IEEE 802.1q virtual bridge.

Format
s of
Etherne
t data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1 q/p

Supported

Frame
length
range

Supports the setting of the frame length to a value


ranging from 1518 bytes to 9600 bytes.

Supports a jumbo frame with a maximum length of


9600 bytes.

Bound
bandwi

N1EFS0: 12xVC-3, or 63xVC-12 + 9xVC-3

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Description
dth

N2EFS0/N4EFS0/N5EFS0: 24xVC-3, or 126xVC-12 +


18xVC-3

Concat
enation
granula
rities

Supports VC-12, VC-3, VC-12-Xv (X 63), and VC-3-Xv


(X 12) granularities.

Encaps
ulation
formats

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

MPLS
technol
ogy

Supports the MPLS.

VLAN
technol
ogy

Supports a total number of 4094 VLANs, which comply


with IEEE 802.1q/p.

Maxim
um
uplink
bandwi
dth

The maximum uplink bandwidth of an N1EFS0 board


is 622 Mbit/s.

The maximum uplink bandwidth of an


N2EFS0/N4EFS0/N5EFS0 board is 1.25 Gbit/s.

An EFS0 board can adapt to the bandwidth of its slot.

VCTR
UNK
specific
ations

The number of supported VCTRUNKs is as follows:

The number of VCTRUNKs supported by an N1EFS0


board is 12.

The number of VCTRUNKs supported by an


N2EFS0/N4EFS0/N5EFS0 board is 24.

Configuration principles are as follows:

Protection
schemes

Issue 02 (2013-01-18)

TPS

VCTRUNK 1-VCTRUNK 12 can be bound only with


lower order paths in VC-4s numbered 1-4. VCTRUNK
13-VCTRUNK 24 can be bound only with lower order
paths in VC-4s numbered 5-8.

VC-4s numbered 4 and 8 support the binding of VC-3


and VC-12 paths. The other VC-4s support the binding
of VC-3 paths only.

A VC-4 cannot be bound with VC-3 and VC-12 paths at


the same time.

Not supported by N1EFS0 boards


Supported by N2EFS0/N4EFS0/N5EFS0 boards

BPS

Not supported

PPS

Not supported

DLAG

Not supported

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Description
LAG

N1EFS0 boards do not support link aggregation, but


N2EFS0/N4EFS0/N5EFS0 boards support manual link
aggregation and the load sharing mode that comply with
IEEE 802.3ad and IEEE 802.1AX.

LCAS

Not supported by N1EFS0/N2EFS0 boards


Dynamically increases or decreases the bandwidth and
protects the bandwidth in compliance with ITU-T G.7042.
This protection scheme is supported by N4EFS0/N5EFS0
boards.

Clock
synchronization

Maintenance
features

LPT

N1EFS0/N2EFS0 boards support P2P LPT.


N4EFS0/N5EFS0 boards support P2P LPT and P2MP LPT.
LPT functions comply with ITU-T G.7042.

STP/R
STP

Supports the broadcast packet suppression function and


RSTP, which comply with IEEE 802.1w.

MSTP

Not supported

Synchr
onous
Etherne
t

Not supported

IEEE
1588v2

Not supported

ETH
OAM

N1EFS0 and N2EFS0 boards do not support the ETH


OAM function.

N4EFS0 and N5EFS0 boards support CC, LB tests, and


LT tests in compliance with IEEE 802.1ag, LM and DM
in compliance with ITU-T Y.1731, and OAM ping in
compliance with Huawei proprietary protocol.

N4EFS0 and N5EFS0 boards support OAM autodiscovery, remote loopbacks, fault detection, and link
performance detection in compliance with IEEE
802.3ah, and selfloop detection in compliance with
Huawei proprietary protocol.

N1EFS0/N2EFS0 boards support test frames in


Ethernet bearer mode.

N4EFS0/N5EFS0 boards support test frames in


Ethernet/GFP bearer mode.

Test
Frame

Issue 02 (2013-01-18)

Respon
se to
ping

Not supported

Port
mirrori
ng

N1EFS0/N2EFS0/N4EFS0 boards do not support port


mirroring. N5EFS0 boards support ingress mirroring.

Loopba

PHY layer at Ethernet ports

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Supports inloops.
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ck
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QoS

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MAC layer at Ethernet ports

Supports inloops.

VC-4 level

Not supported

VC-3 level

N1EFS0/N2EFS0/N4EFS0
boards support inloops and
outloops. N5EFS0 boards
do not support inloops or
outloops.

VC-12 level

Not supported

RMON

Supports Ethernet performance monitoring at the port


level.

Warm
resets

N1EFS0/N2EFS0/N4EFS0/N5EFS0 boards support warm


resets. If a warm reset is performed on an
N1EFS0/N2EFS0 board, traffic on the board is interrupted,
whereas if a warm reset is performed on an
N4EFS0/N5EFS0 board, traffic on the board is not
interrupted. If an N4EFS0/N5EFS0 board substitutes for an
N1EFS0/N2EFS0 board, traffic on the N4EFS0/N5EFS0
board is not interrupted.

Cold
resets

Supported

Alarms
and
perfor
mance
events

Reports various alarms and performance events, which


facilitates the management and maintenance of the
equipment.

Supports the CAR. The granularity is 64 kbit/s.

N1EFS0 boards support the service classification based on PORT,


PORT+VLAN ID, or PORT+VLAN PRI.

N2EFS0, N4EFS0, and N5EFS0 boards support the flow


classification based on PORT, PORT++VLAN ID, or
PORT+VLAN ID+VLAN PRI.

N5EFS0 boards support the traffic classification based on


PORT+S-VLAN ID.

Protoco
l
enablin
g

Supported

Port
aging
time

Supported

Fast

Not supported by N1EFS0/N2EFS0/N4EFS0 boards

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leave

Supported by N5EFS0 boards

Discard
ing of
unkno
wn
broadca
st
packets

Not supported by N1EFS0/N2EFS0/N4EFS0 boards

Static
broadca
st entry

Not supported

Supported by N5EFS0 boards

Traffic control

Supports the port-based traffic control function that complies with


IEEE 802.3x.

Traffic monitoring

N5EFS0 boards support port-based and VCTRUNK-based traffic


monitoring.

12.4.4 Working Principle and Signal Flow


The EFS0 consists of the Ethernet access module, network processor module, mapping
module, interface converting module, logic and control module, clock module, and power
module.
Figure 12-19 shows the functional block diagram of the EFS0 by describing how to process
1xFE signals.

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Figure 1.1 Functional block diagram of the EFS0


Backplane

Control

Switch
fabric

Data

Cross-connect unit

Cross-connect unit

Mapping module

Network processor module


Laser
shutdown

Interface
converting
module

VCP

Network
processor

DENCP

Ethernet
access
module

ENCP

FE

LOS

Logic and
control module

Communication
Reference clock and frame header
+3.3 V

Clock module

Power
module

50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module

Power Fuse
module

SCC unit
SCC unit
-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

Fuse

DENCP: decapsulation module

VCP: virtual concatenation processing module

1.1.1.1.1041 Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or
routers are converted into electrical signals. If the signals are accessed through electrical
interfaces, O/E conversion is not required. At the PHY layer, the electrical signals are decoded
and the ETH_LOS alarm is detected. The electrical signals are converted from serial signals
into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded and converted from electrical signals to optical signals.

1.1.1.1.1042 Network Processor Module


The network processor module consists of the network processor and switch fabric. The
network processor first performs MAC functions, which include code conversion, framing of
Ethernet packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:

Multi-protocol label switching (MPLS)

L2 MPLS VPN

Ethernet/VLAN

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
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extracted based on the level (P or PE) of the equipment. Services are then routed or
forwarded.
The network processor module supports the following functions:

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

Weighted fair queuing (WFQ)

Four classes of service (CoSs)

1.1.1.1.1043 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in GFP format. The
concatenation is performed. Then, the Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

1.1.1.1.1044 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1045 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

1.1.1.1.1046 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.
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1.1.1.1.1047 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.4.5 Front Panel


The front panel of the EFS0 has indicators and a bar code.

1.1.1.1.1048 Diagram of the Front Panel


Figure 12-20 shows the appearance of the front panel of the EFS0.
Figure 1.1 Front panel of the EFS0

EFS0
STAT
ACT
PROG
SRV

EFS0

1.1.1.1.1049 Indicators
The front panel of the board has the following indicators:
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Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1050 Interfaces
The front panel of the EFS0 has no interfaces. The interfaces are available on the ETF8 or on
the EFF8. When the N5EFS0 is used with the ETF8A or EFF8A, the interfaces are available
on the ETF8A or on the EFF8A.

12.4.6 Jumpers and DIP Switches


The EFS0 does not have any jumpers or DIP switches that are used for board settings.

12.4.7 Valid Slots


The EFS0 must be installed in a valid slot in the subrack. Otherwise, the EFS0 cannot work
normally.
The EFS0 must be used with the ETF8, EFF8, and ETS8. When the ETS8 is used as the
interface board, the TSB8 must be used as the bridging board. For the slots valid for the
EFS0, ETS8, and TSB8 when the EFS0 works with the ETS8 and TSB8, see 12.4.9 Board
Protection.
The N5EFS0 can be used with the ETF8A and EFF8A. When the N5EFS0 works with the
ETF8A or EFF8A, the slots valid for the N5EFS0 are the same as the slots valid for the
N5EFS0 when the N5EFS0 works with the ETF8 or EFF8.
The N1EFS0 can be installed in slots 25 and 1316. In this case, the bandwidth is 622
Mbit/s.
The N2EFS0, N4EFS0, and N5EFS0 can be installed in slots 25 and 1316. In this case, the
bandwidth is 1.25 Gbit/s.
Table 12-65 lists the slots valid for the EFS0 and the corresponding slots for the ETF8 and
EFF8.
Figure 1.1 Slots valid for the EFS0 and the corresponding slots for the ETF8 and EFF8
Slot Valid for the EFS0

Corresponding Slot for the ETF8 and EFF8

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

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Slot Valid for the EFS0

Corresponding Slot for the ETF8 and EFF8

Slot 16

Slot 35

12.4.8 Feature Code


The EFS0 does not have the feature code.

12.4.9 Board Protection


The EFS0 supports the 1:1 TPS protection.
TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing
board. Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Figure 12-21 shows the slot configuration for the 1:1 TPS protection for the EFS0.

S
L
O
T
2
8

S S S S
L L L L
O O O O
T T T T
5 6 7 8

S
L
O
T
9

S
L
O
T
1
0

XCS

Working 1

Protection 1

S S S S
L L L L
O O O O
T T T T
1 2 3 4

S
L
O
T
3
0

S
L
O
T
3
1

S
L
O
T
3
2

S
L
O
T
3
3

S
L
O
T
3
4

FAN

XCS

FAN

S
L
O
T
2
9

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
7

AUX

S
L
O
T
2
7

FAN

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

GSCC

S
L
O
T
2
6

TSB8

S
L
O
T
2
5

Protection 2

S
L
O
T
2
4

Working 2

S
L
O
T
2
3

ETS8

S
L
O
T
2
2

ETS8

S
L
O
T
2
1

PIU

S
L
O
T
2
0

TSB8

S
L
O
T
1
9

PIU

Figure 1.1 Slot configuration for the 1:1 TPS protection for the EFS0

Fiber routing area

In Figure 12-21, the board in slot 2 protects the board in slot 3 and the board in slot 16
protects the board in slot 15. The ETS8 is used with the working EFS0 and the TSB8 is used
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with the protection EFS0. Table 12-66 lists the slots for the EFS0, ETS8, and TSB8.
Figure 1.2 Slots for the EFS0, ETS8, and TSB8
Board

Protection Group 1

Protection Group 2

EFS0 (protection)

Slot 2

Slot 16

EFS0 (working)

Slot 3

Slot 15

TSB8

Slot 19

Slot 35

ETS8

Slot 21

Slot 33

12.4.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1051 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1052 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring Ethernet Services.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

Issue 02 (2013-01-18)

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

Set the Ethernet interface as follows:


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Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the Layer 2 switching management service, including the following
tasks:

Configuring the IGMP Snooping Protocol

Configuring the Spanning Tree

Setting the Aging Time for the Multicast Router Port

Step 9 Optional: Configure the QoS. For details, see Configuring QoS.
Step 10 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Creating a LAG.
Step 11 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

1.1.1.1.1053 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.1054 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 12 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

12.4.11 Configuring the Board Functions


The EFS0 supports multiple Ethernet functions and features such as Layer 2 switching,
LCAS, and QoS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EFS0 by using the U2000:

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QoS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12 EoS Boards

12.4.12 Parameter Settings


You can set parameters for the EFS0 by using the U2000.
You can set the following main parameters for the EFS0 by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

12.4.13 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1055 Troubleshooting
Table 12-67 lists the faults that occur on the EFS0 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EFS0 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

The negotiated working mode

Transient service
interruption

Packet loss
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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


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Fault Symptom

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Common Fault Cause


of the Ethernet ports is the
half-duplex mode.

Interconnection
fault

Bit errors occur on the line


side.

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Troubleshooting Method
Packet Loss.

See Troubleshooting Device


Interconnection Faults.

1.1.1.1.1056 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EFS0, see Replacing an EOS Board.

12.4.14 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

12.4.14.1 Alarms of N1EFS0


ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

LCAS_BAND_DECREASED

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_RFI

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LSR_NO_FITED

NO_BD_SOFT

SUBCARD_ABN

TEMP_OVER

T_LOS

TU_LOP_VC12

TU_AIS_VC12

TU_AIS_VC3

VCAT_LOM_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_SQM_VC3

VCAT_LOM_VC3

VCAT_SQM_VC12

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W_R_FAIL

PROTOCOL_MM

SWDL_PKG_NOBDSOF
T

WRG_BD_TYPE

12.4.14.2 Alarms of N2EFS0


ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

LAG_FAIL

LCAS_BAND_DECREASED

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LSR_NO_FITED

NO_BD_SOFT

SLAVE_WORKING

SUBCARD_ABN

T_LOS

TPS_ALM

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

12.4.14.3 Alarms of N4EFS0


ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

ETHOAM_DISCOVER_FAI
L

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_RMT_CRIT_FAU
LT

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_LOO
P

FLOW_OVER

FPGA_ABN

FCS_ERR

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HP_LOM

LAG_FAIL

HARD_BAD

LCAS_PLCR

LASER_MOD_ERR

LCAS_FOPT

LCAS_TLCT

LCAS_FOPR

LCAS_TLCR

LP_REI_VC12

LCAS_PLCT

LOOP_ALM

LP_SLM_VC3

LP_RDI_VC12

LINK_ERR

LP_UNEQ_VC12

LP_REI_VC3

LP_RDI_VC3

LSR_NO_FITED

LP_TIM_VC12

LP_SLM_VC12

NO_BD_SOFT

LP_UNEQ_VC3

LP_TIM_VC3

SUM_INPWR_HI

LSR_WILL_DIE

LPT_RFI

SUM_OUTPWR_LOW

SLAVE_WORKING

LTEMP_OVER

TF

SUM_INPWR_LOW

SUBCARD_ABN

TU_AIS_VC3

T_LOS

SUM_OUTPWR_HI

VCAT_LOA

TPS_ALM

TD

VCAT_LOM_VC3

TU_LOP_VC12

TU_AIS_VC12

TR_LOC

VCAT_LOM_VC12

TU_LOP_VC3

T_LOSEX

EX_ETHOAM_CC_LO
S

EX_ETHOAM_MPID_CNFL
CT

PATCH_NOT_CONFIRM

ALM_GFP_dCSF

PATCH_ERR

PATCHFILE_NOTEXIST

SWDL_PKG_NOBDSO
FT

WRG_BD_TYPE

12.4.14.4 Alarms of N5EFS0


ALM_GFP_dCSF

ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_FA
ULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FLOW_OVER

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FPGA_ABN

HARD_BAD

HP_LOM

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LPT_RFI

LSR_NO_FITED

LSR_WILL_DIE

LTEMP_OVER

NO_BD_SOFT

SUBCARD_ABN

IN_PWR_HIGH

IN_PWR_LOW

OUT_PWR_HIGH

OUT_PWR_LOW

T_LOSEX

TD

TEMP_OVER

TF

TPS_ALM

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

VCTRUNK_NO_FLOW

WRG_BD_TYPE

PORTMODE_MISMATCH

12.4.15 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

12.4.15.1 Performance Events of N1EFS0


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

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Figure 1.2 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Figure 1.3 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets
Received(256~511
Octets in Length)
(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets
Received(packets)

Broadcast Packets
Received(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets
Received(packets)

Figure 1.4 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)
(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted(128~255
Octets in Length)(packets)

Packets
Transmitted(256~511
Octets in Length)
(packets)

Packets
Transmitted(512~1023
Octets in Length)(packets)

Packets
Transmitted(1024~1518 Octets
in Length)(packets)

Unicast Packets
Received(packets)

Unicast Packets
Transmitted(packets)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Good Octets
Transmitted(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Octets


Transmitted(Byte)

Good Full Frame Octets


Received(Byte)

Good Full Frame Speed


Transmitted(Byte/s)

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12.4.15.2 Performance Events of N2EFS0


Figure 1.5 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

Figure 1.6 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Figure 1.7 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets
Received(256~511
Octets in Length)
(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets
Received(packets)

Broadcast Packets
Received(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets
Received(packets)

Figure 1.8 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)
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(packets)
Packets
Transmitted(256~511
Octets in Length)
(packets)

Packets
Transmitted(512~1023
Octets in Length)(packets)

Packets
Transmitted(1024~1518 Octets
in Length)(packets)

Unicast Packets
Received(packets)

Unicast Packets
Transmitted(packets)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Good Octets
Transmitted(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Octets


Transmitted(Byte)

Good Full Frame Octets


Received(Byte)

Good Full Frame Speed


Transmitted(Byte/s)

12.4.15.3 Performance Events of N4EFS0


Figure 1.9 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

Figure 1.10 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Figure 1.11 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets

Packets Received(512~1023

Packets Received(1024~1518

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Received(256~511
Octets in Length)
(packets)

Octets in Length)(packets)

Octets in Length)(packets)

Multicast Packets
Received(packets)

Broadcast Packets
Received(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets
Received(packets)

Figure 1.12 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)
(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted(128~255
Octets in Length)(packets)

Packets
Transmitted(256~511
Octets in Length)
(packets)

Packets
Transmitted(512~1023
Octets in Length)(packets)

Packets
Transmitted(1024~1518 Octets
in Length)(packets)

Unicast Packets
Received(packets)

Unicast Packets
Transmitted(packets)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Good Octets
Transmitted(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Octets


Transmitted(Byte)

Good Full Frame Octets


Received(Byte)

Good Full Frame Speed


Transmitted(Byte/s)

12.4.15.4 Performance Events of N5EFS0


Figure 1.13 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

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LPSES

LPUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Figure 1.14 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Figure 1.15 Statistics of RMON basic performance


ETHCOL

ETHDROP

ETHFRG

ETHJAB

ETHOVER

ETHUNDER

RXBRDCAST

RXMULCAST

RXOCTETS

RXPKT1024

RXPKT128

RXPKT256

RXPKT512

RXPKT64

RXPKT65

RXPKTS

Figure 1.16 Statistics of RMON extended performance


ETHALI

ETHFCS

RXFULLBGOOD

RXGOODFULLFRAMESP
EED

RXUNICAST

TXBGOOD

TXBRDCAST

TXFULLBGOOD

TXGOODFULLFRAMESP
EED

TXMULCAST

TXPKT1024

TXPKT128

TXPKT256

TXPKT512

TXPKT64

TXPKT65

TXUNICAST

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12.4.16 Technical Specifications


The technical specifications of the EFS0 include the dimensions, weight, and power
consumption.

1.1.1.1.1057 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFS0 board of the N4 version.

Figure 12-22 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N4EFS0.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications of the N4EFS0
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-84 lists the throughput specifications of the N4EFS0. Table 12-85 lists the packet
loss ratio in the case of overloading of the N4EFS0. Table 12-86 lists the latency
specifications of the N4EFS0. Table 12-87 lists the back-to-back specifications of the
N4EFS0.

The specifications vary according to the configuration and networking of the test environment, port
rate, and VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and five VC-12s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-84 lists the throughput specifications of the N4EFS0. The values are obtained when
the SmartApplication is set as follows:

Issue 02 (2013-01-18)

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.
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The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 10.00

Maximum rate (%): 12.00

Mode: bidirectional

Figure 1.1 Throughput specifications of the N4EFS0


Frame Size
(Byte)

Passed Rate
(%)

(01,02,03) to
(01,02,05)
(pks/sec)

(01,02,05) to
(01,02,03)
(pks/sec)

Total (pks/sec)

64

11.48

17088

17088

34176

128

11.25

9502

9502

19004

256

11.13

5042

5042

10084

512

11.12

2613

2613

5226

1024

11.07

1326

1326

2652

1280

11.10

1067

1067

2134

1518

11.12

904

904

1808

Table 12-85 lists the packet loss ratio in the case of overloading of the N4EFS0. The values
are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

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Figure 1.2 Packet loss ratio in the case of overloading of the N4EFS0
Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) (%)

(01,02,05) to
(01,02,03) (%)

Average (%)

64

100.00

88.507

88.507

88.507

128

100.00

88.730

88.745

88.737

256

100.00

88.851

88.831

88.841

512

100.00

88.876

88.846

88.861

1024

100.00

88.901

88.890

88.895

1280

100.00

88.878

88.878

88.878

1518

100.00

88.850

88.844

88.847

Table 12-86 lists the latency specifications of the N4EFS0. The values are obtained when the
SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 10.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

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Figure 1.3 Latency specifications of the N4EFS0


Frame
Size
(Byte)

Rate
Tested
(%)

(01,02,03) to
(01,02,05) (us)CT (us)

Average
(CT) (us)

(01,02,03) to
(01,02,05)
(us)-S&F (us)

Average
(S&F) (us)

64

10.00

561.4

561.4

556.2

556.2

128

10.00

644.4

644.4

634.2

634.2

256

10.00

738.4

738.4

718.0

718.0

512

10.00

948.8

948.8

907.9

907.9

1024

10.00

1371.5

1371.5

1289.6

1289.6

1280

10.00

1604.1

1604.1

1501.7

1501.7

1518

10.00

1790.4

1790.4

1669.0

1669.0

Table 12-87 lists the back-to-back specifications of the N4EFS0. The values are obtained
when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.4 Back-to-back specifications of the N4EFS0


Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) Burst
Size (Number of
Frames)

(01,02,05) to
(01,02,03)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

1333

1335

2668

128

100.00

848

850

1698

256

100.00

586

587

1173

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Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) Burst
Size (Number of
Frames)

(01,02,05) to
(01,02,03)
(Number of
Frames)

Total
(Number of
Frames)

512

100.00

445

447

892

1024

100.00

224

224

448

1280

100.00

211

212

423

1518

100.00

201

201

402

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFS0 board of the N5 version.

Figure 12-23 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N5EFS0.
Figure 1.2 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications of the N5EFS0
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-88 lists the throughput specifications of the N5EFS0. Table 12-89 lists the packet
loss ratio in the case of overloading of the N5EFS0. Table 12-90 lists the latency
specifications of the N5EFS0. Table 12-91 lists the back-to-back specifications of the
N5EFS0.

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The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured 3 VC-3s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-88 lists the throughput specifications of the N5EFS0. The values are obtained when
the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 1%.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): None

Mode: Uni-directional

Figure 1.5 Throughput specifications of the N5EFS0


Frame Size
(byte)

Passed Rate (%)

(01,06,01) to (01,06,02)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

128

100.00

84459

84459

256

100.00

45290

45290

512

100.00

23496

23496

1024

100.00

11973

11973

1280

100.00

9615

9615

1518

100.00

8127

8127

Table 12-89 lists the packet loss ratio in the case of overloading of the N5EFS0. The values
are obtained when the SmartApplication is set as follows:

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The specifications in the table are obtained in the scenario wherein point-to-point
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transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.6 Packet loss ratio in the case of overloading of the N5EFS0
Frame Size
(byte)

Rate Tested (%)

(01,06,01) to (01,06,02)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-90 lists the latency specifications of the N5EFS0. The values are obtained when the
SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 5 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: Cut Through (or FIFO),S&F: Store & Forward (or LIFO)

Measure on one receiving card only, Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

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Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

12 EoS Boards

Figure 1.7 Latency specifications of the N5EFS0


Frame
Size
(byte)

Rate
Tested
(%)

(01,06,01) to
(01,06,02) (us)CT (us)

Average
(CT) (us)

(01,06,01) to
(01,06,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

124.3

124.3

119.2

119.2

128

100.00

137.4

137.4

127.2

127.2

256

100.00

169.6

169.6

149.2

149.2

512

100.00

211.5

211.5

170.6

170.6

1024

100.00

294.4

294.4

212.4

212.4

1280

100.00

334.5

334.5

232.1

232.1

1518

100.00

368.7

368.7

247.3

247.3

Table 12-91 lists the back-to-back specifications of the N5EFS0. The values are obtained
when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 50 on the SmartApplication.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

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Figure 1.8 Back-to-back specifications of the N5EFS0


Frame Size
(byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
Burst Size (frames)

Total (frames)

64

100.00

297620

297620

128

100.00

168918

168918

256

100.00

90580

90580

512

100.00

46992

46992

1024

100.00

23946

23946

1280

100.00

19230

19230

1518

100.00

16254

16254

1.1.1.1.1058 Mechanical Specifications


The mechanical specifications of the EFS0 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1EFS0 (kg): 1.0

Weight of the N2EFS0 (kg): 1.0

Weight of the N4EFS0 (kg): 1.0

Weight of the N5EFS0 (kg): 0.6

1.1.1.1.1059 Power Consumption


The maximum power consumption of the N1EFS0 at room temperature (25C) is 35 W.
The maximum power consumption of the N2EFS0 at room temperature (25C) is 35 W.
The maximum power consumption of the N4EFS0 at room temperature (25C) is 35 W.
The maximum power consumption of the N5EFS0 at room temperature (25C) is 22 W.

12.5 EFS0A
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS0A (16xFE switching and processing board). This topic
also describes how to configure and commission the EFS0A.

12.5.1 Version Description


The EFS0A is available in one functional version, namely, N1.

12.5.2 Application
The EFS0A is used to transmit/receive Ethernet services, manage bandwidths, and realize
Layer 2 switching of Ethernet services.
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Figure 12-24 shows the typical networking and application of the Ethernet switching board.
the Ethernet switching board accesses and converges Ethernet services, and provides the
Ethernet data with the following data features: Layer 2 switching, port isolation, flow
classification, traffic control, VLAN management, and priority configuration. In addition, the
Ethernet switching board performs encapsulation/decapsulation, virtual concatenation, and
SDH mapping/demapping for data. The Ethernet switching board can be interconnected with
the bandwidth access equipment and the data communication equipment at the same time,
thus to provide a network-level solution.
Figure 1.1 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

12.5.3 Functions and Features


EFS0A boards support the Layer 2 switching, MPLS, and broadcast functions.
Table 12-92 lists the functions and features supported by EFS0A boards.
Figure 1.1 Functions and features supported by EFS0A boards
Functi
on
and
Featu
re

Description

Basic
functi
ons

Processes 16xFE services.

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Functi
on
and
Featu
re

Description

Port
types

Supports 10BASE-T/100BASE-TX signals when working with an ETF8


board.

Supports 100BASE-FX signals when working with an EFF8 board. The


optical ports comply with IEEE 802.3u.

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides 16 electrical ports to receive/transmit FE signals when working with


an ETF8 board.

Provides 16 optical ports to receive/transmit FE signals when working with an


EFF8 board.

Provides 8 electrical ports to receive/transmit FE signals when working with


an ETF8 board, and provides 8 optical ports to receive/transmit FE signals
when working with an EFF8 board.

Provides the TPS protection for FE signals received/transmitted through 16


electrical ports when working with an ETS8 board and a TSB8 board.

Port
charac
teristic
s

Working
modes

Servic
e
catego
ries

FE electrical port: auto-negotiation, 100M full-duplex, 100M halfduplex, 10M full-duplex, and 10M half-duplex

FE optical port: 100M full-duplex

Traffic
control at
ports

Auto-negotiation mode

Supported (Not supported by FE


optical ports)

Non-autonegotiation mode

Supported

Query/Se
tting of
port
status

Supported

Query of
port
types

Supported

Setting
of optical
power
threshold
s

Not supported

Pluggabl
e optical
module

Not supported

EPL
service

Supports PORT-based transparent transmission.

EVPL
service

Supports PORT-shared EVPL services.

Supports VCTRUNK-shared EVPL services.

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The services are isolated by VLAN tags.

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Description

EPLAN
service

EVPLA
N service

Servic
e
specifi
cation
s

Issue 02 (2013-01-18)

12 EoS Boards

The services are isolated by MPLS tags.

The services are isolated by QinQ tags.

Supports a maximum of 4096 links.

Supports the blacklist that can contain 2K records and also the
static MAC address table that can contain 2K records. The sum of
the number of records in the blacklist and the number of addresses
in the static MAC address table must not exceed 2K. The blacklist
function supports verification of destination MAC addresses only.

Supports the self-learning of the source MAC address. The


capacity of the MAC address table is 16K. The aging time of the
MAC address can be set and queried.

Supports the configuration of static MAC routes.

N1EFS0, N2EFS0, and N5EFS0 boards support the query of


dynamic MAC addresses.

Supports the query of dynamic MAC addresses.

The maximum number of supported VBs is 16. The maximum


number of logical ports for each VB is 48.

Queries the number of actually learned MAC addresses based on


VB+VLAN or VB+LP.

Supports the EPLAN services that are based on the IEEE 802.1d
MAC bridge.

Supports data isolation based on VB+VLAN.

Supports the setting of a maximum of 4096 VLAN services.

Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge and IEEE 802.1ad provider bridge.

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1 q/p

Supported

Frame
length
range

Supports the setting of the frame length to a value ranging from


1518 bytes to 9600 bytes.

Supports a jumbo frame with a maximum length of 9600 bytes.

Bound
bandwidt
h

48xVC-3, or 252xVC-12 + 36xVC-3

Concaten
ation
granulari
ties

Supports VC-12, VC-3, VC-12-Xv (X 63), and VC-3-Xv (X 12)


granularities.

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Description

Encapsul
ation
formats

Protec
tion
schem
es

Synch
ronizat
ion

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HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

MPLS
technolo
gy

Supports the MPLS.

VLAN
technolo
gy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

The maximum uplink bandwidth is 2.5 Gbit/s.

VCTRU
NK
specifica
tions

Number of supported VCTRUNKs: 32

An EFS0A board can adapt to the bandwidth of its slot.

Configuration principles are as follows:

VC-4s numbered 4, 8, 12, and 16 support the binding of VC-3 and


VC-12 paths. The other VC-4s support the binding of VC-3 paths
only.

A VC-4 cannot be bound with VC-3 and VC-12 paths at the same
time.

TPS

Supported

BPS

Not supported

PPS

Not supported

DLAG

Not supported

LAG

Supports manual link aggregation and the load sharing mode that
comply with IEEE 802.3ad and IEEE 802.1AX.

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT and P2MP LPT in compliance with ITU-T G.7042.

STP/RS
TP

Supports the broadcast packet suppression function and RSTP, which


comply with IEEE 802.1w.

MSTP

Not supported

Synchro
nous
Ethernet

Not supported

IEEE

Not supported
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Description

1588v2
Maint
enance
feature
s

QoS

IGMP
snoopi
ng

Issue 02 (2013-01-18)

ETH
OAM

Supports CC, LB tests, and LT tests in compliance with IEEE


802.1ag, LM and DM in compliance with ITU-T Y.1731, and
OAM ping in compliance with Huawei proprietary protocol.

Supports OAM auto-discovery, remote loopbacks, fault detection,


and link performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei proprietary
protocol.

Test
Frame

Supports test frames in ETH and GFP bearer modes.

Respons
e to ping

Not supported

Port
mirrorin
g

Supports ingress mirroring.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Supports inloops.

MAC layer at Ethernet ports

Supports inloops.

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

RMON

Supports RMON of the Ethernet performance of Ethernet ports.

Warm
resets

Supported (Warm resets do not affect services.)

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Supports the CAR. The granularity is 64 kbit/s.

Supports the flow classification based on PORT, PORT+VLAN ID,


PORT+SVLAN ID, or PORT+VLAN ID+VLAN PRI.

Protocol
enabling

Supported

Port
aging

Supported
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Description

time
Fast
leave

Not supported

Discardi
ng of
unknown
broadcas
t packets

Not supported

Static
broadcas
t entry

Not supported

Traffic
contro
l

Supports the port-based traffic control function that complies with IEEE 802.3x.

Traffic
monit
oring

Supports port-based and VCTRUNK-based traffic monitoring.

12.5.4 Working Principle and Signal Flow


The EFS0A consists of the Ethernet access module, network processor module, mapping
module, interface converting module, logic and control module, clock module, and power
module.
Figure 12-25 shows the functional block diagram of the EFS0A by describing how to process
1xFE signals.

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Figure 1.1 Functional block diagram of the EFS0A


Backplane

Control

Switch
fabric

Data
Network processor module

Laser
shutdown

Interface
converting
module

VCP

Network
processor

DENCP

Ethernet
access
module

ENCP

FE

Cross-connect unit

Cross-connect unit

Mapping module

LOS

Logic and
control module

Communication
Reference clock and frame header
+3.3 V

Clock module

Power
module

50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module

Power Fuse
module

SCC unit
SCC unit
-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

Fuse

DENCP: decapsulation module

VCP: virtual concatenation processing module

1.1.1.1.1060 Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or
routers are converted into electrical signals. If the signals are accessed through electrical
interfaces, O/E conversion is not required. At the PHY layer, the electrical signals are decoded
and the ETH_LOS alarm is detected. The electrical signals are converted from serial signals
into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded and converted from electrical signals to optical signals.

1.1.1.1.1061 Network Processor Module


The network processor module consists of the network processor and switch fabric. The
network processor first performs MAC functions, which include code conversion, framing of
Ethernet packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:

MPLS

L2 MPLS VPN

Ethernet/VLAN

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
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extracted based on the level (P or PE) of the equipment. Services are then routed or
forwarded.
The network processor module supports the following functions:

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

1.1.1.1.1062 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP
format. The concatenation is performed. Then, the Ethernet signals are converted into SDH
signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

1.1.1.1.1063 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1064 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

1.1.1.1.1065 Clock Module


The clock module traces the system reference clock and generates the required working clock
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for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

1.1.1.1.1066 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.5.5 Front Panel


The front panel of the EFS0A has indicators and a bar code.

1.1.1.1.1067 Diagram of the Front Panel


Figure 12-26 shows the appearance of the front panel of the EFS0A.
Figure 1.1 Front panel of the EFS0A

EFS0A
STAT
ACT
PROG
SRV

EFS0A

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1.1.1.1.1068 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1069 Interfaces
The front panel of the EFS0A has no interfaces. The interfaces are available on the ETF8
board or on the EFF8 board.

12.5.6 Jumpers and DIP Switches


The EFS0A does not have any jumpers or DIP switches that are used for board settings.

12.5.7 Valid Slots


The EFS0A must be installed in a valid slot in the subrack. Otherwise, the EFS0A cannot
work normally.
The EFS0A can be used with the ETF8, EFF8, and ETS8. When the ETS8 is used as the
interface board, the TSB8 must be used as the bridging board. For the slots valid for the
EFS0A, ETS8, and TSB8 when the EFS0A works with the ETS8 and TSB8, see 12.5.9 Board
Protection.
The slots valid for the EFS0A are as follows:

The EFS0A can be installed in slots 25 and 1316 in the subrack. In this case, the
bandwidth is 2.5 Gbit/s.

Table 12-93 lists the slots valid for the EFS0A and the corresponding slots for the ETF8 and
EFF8.
Figure 1.1 Slots valid for the EFS0A and the corresponding slots for the ETF8 and EFF8
Slot Valid for the EFS0A

Corresponding Slot for the ETF8 and EFF8

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

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12.5.8 Feature Code


The EFS0A does not have the feature code.

12.5.9 Board Protection


The EFS0A supports the 1:1 TPS protection.
TPS trigger conditions on the OptiX OSN equipment are detected by the cross-connect and timing
board. Therefore, TPS is successful even though the system control board cannot be detected or is faulty.

Figure 12-27 shows the slot configuration for the 1:1 TPS protection for the EFS0A.

S
L
O
T
2
7

S
L
O
T
2
8

S
L
O
T
9

S
L
O
T
1
0

XCS

S S S S
L L L L
O O O O
T T T T
5 6 7 8

Working 1

Protection 1

S S S S
L L L L
O O O O
T T T T
1 2 3 4

S
L
O
T
3
0

S
L
O
T
3
1

FAN

XCS

FAN

S
L
O
T
2
9

S
L
O
T
3
2

S
L
O
T
3
5

S
L
O
T
3
6

S
L
O
T
3
7

AUX

S
L
O
T
2
6

S
L
O
T
3
3

S
L
O
T
3
4

FAN

S
L
O
T
1
1

S
L
O
T
1
2

S S S S S S
L L L L L L
O O O O O O
T T T T T T
1 1 1 1 1 1
3 4 5 6 7 8

GSCC

S
L
O
T
2
5

TSB8

S
L
O
T
2
4

Protection 2

S
L
O
T
2
3

ETS8
ETS8
TSB8

S
L
O
T
2
2

Working 2

TSB8
ETS8
ETS8

S
L
O
T
2
1

PIU

S
L
O
T
2
0

PIU

S
L
O
T
1
9

TSB8

Figure 1.1 Slot configuration for the 1:1 TPS protection for the EFS0A

Fiber routing area

The board in slot 2 protects the board in slots 3 and the board in slot 16 protects the board in
slot 15. The ETS8 is used with the working EFS0A and the TSB8 is used with the protection
EFS0A. Table 12-94 lists the slots for the EFS0A, ETS8, and TSB8.
Figure 1.2 Slots for the EFS0A, ETS8, and TSB8
Board

Protection Group 1

Protection Group 2

EFS0A (protection)

Slot 2

Slot 16

EFS0A (working)

Slot 3

Slot 15

TSB8

Slots 19 and 20

Slots 35 and 36

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Board

Protection Group 1

Protection Group 2

ETS8

Slots 21 and 22

Slots 33 and 34

12.5.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1070 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1071 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring Ethernet Services.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.

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For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the Layer 2 switching management service, including the following
tasks:

Configuring the IGMP Snooping Protocol

Configuring the Spanning Tree

Setting the Aging Time for the Multicast Router Port

Step 9 Optional: Configure the QoS. For details, see Configuring QoS.
Step 10 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Creating a LAG.
Step 11 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

1.1.1.1.1072 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.1073 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 12 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

12.5.11 Configuring the Board Functions


The EFS0A supports multiple Ethernet functions and features such as Layer 2 switching,
LCAS, and QoS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EFS0A by using the U2000:

LCAS

QoS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

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12.5.12 Parameter Settings


You can set parameters for the EFS0A by using the U2000.
You can set the following main parameters for the EFS0A by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

12.5.13 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1074 Troubleshooting
Table 12-95 lists the faults that occur on the EFS0A frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EFS0A frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

The negotiated working mode


of the Ethernet ports is the
half-duplex mode.

Bit errors occur on the line


side.

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault

Transient service
interruption

Packet loss

Interconnection
fault

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


Packet Loss.

See Troubleshooting Device


Interconnection Faults.

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Fault Symptom

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Common Fault Cause

Troubleshooting Method

occurs on the VCG port.

The LCAS interconnection


fault occurs.

1.1.1.1.1075 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EFS0A, see Replacing an EOS Board.

12.5.14 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

12.5.14.1 Alarms of N1EFS0A


ALM_GFP_dLFD

ALM_GFP_dCSF

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

HP_LOM

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LPT_RFI

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LSR_NO_FITED

NO_BD_SOFT

TEMP_OVER

TD

T_LOSEX

TU_LOP_VC12

TU_AIS_VC12

TU_AIS_VC3

VCAT_LOM_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_SQM_VC3

VCAT_LOM_VC3

VCAT_SQM_VC12

VCTRUNK_NO_FLOW

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_NO_FLOW

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_FA
ULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF

FLOW_OVER

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LCT
LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LSR_WILL_DIE

LTEMP_OVER

IN_PWR_HIGH

IN_PWR_LOW

OUT_PWR_HIGH

OUT_PWR_LOW

SUBCARD_ABN

TF

TPS_ALM

TR_LOC

WRG_BD_TYPE

PORTMODE_MISMATCH

12.5.15 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

12.5.15.1 Performance Events of N1EFS0A


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

BDTEMPCUR

BDTEMPMAX

BDTEMPMIN

Figure 1.2 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

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AlignmentErrors

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FCSErrors

Figure 1.3 Statistics of RMON basic performance


ETHCOL

ETHDROP

ETHFRG

ETHJAB

ETHOVER

ETHUNDER

RXBRDCAST

RXMULCAST

RXOCTETS

RXPKT1024

RXPKT128

RXPKT256

RXPKT512

RXPKT64

RXPKT65

RXPKTS

Figure 1.4 Statistics of RMON extended performance


ETHALI

ETHFCS

RXFULLBGOOD

RXGOODFULLFRAMESP
EED

RXUNICAST

TXBGOOD

TXBRDCAST

TXFULLBGOOD

TXGOODFULLFRAMESP
EED

TXMULCAST

TXPKT1024

TXPKT128

TXPKT256

TXPKT512

TXPKT64

TXPKT65

TXUNICAST

Figure 1.5 Statistics of RMON VCG performance


VCG_RXGOODPACKETS

VCG_RXOCTETS

VCG_RXPACKETS

VCG_RXSPEED

VCG_TXGOODPACKETS

VCG_TXOCTETS

VCG_TXPACKETS

VCG_TXSPEED

12.5.16 Technical Specifications


The technical specifications of the EFS0A include the dimensions, weight, and power
consumption.

1.1.1.1.1076 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFS0A board of the N1 version.

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Figure 12-28 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
EFS0A.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-101 lists the throughput specifications of the EFS0A. Table 12-102 lists the packet
loss ratio in the case of overloading of the EFS0A. Table 12-103 lists the latency
specifications of the EFS0A. Table 12-104 lists the back-to-back specifications of the EFS0A.

The specifications vary according to the configuration and networking of the test environment, port
rate, and VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured, one VC-3 is bound on the FE port, and the MAC port is set to auto-negotiation mode.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-101 lists the throughput specifications of the EFS0A. The values are obtained when
the SmartApplication is set as follows:

Test duration (sec): 3

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 53.33

Maximum rate (%): 54.00

Resolution rate (%): 0.01

Mode: bidirectional

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Figure 1.1 Throughput specifications of the EFS0A


Frame Size
(Byte)

Passed Rate
(%)

(01,11,01) to
(01,11,02)
(pks/sec)

(01,11,02) to
(01,11,01)
(pks/sec)

Total (pks/sec)

64

53.50

79618

79618

159236

128

51.21

43253

43253

86506

256

49.95

22624

22624

45248

512

49.31

11585

11585

23170

1024

49.14

5884

5884

11768

1280

49.15

4726

4726

9452

1518

49.19

3998

3998

7996

Table 12-102 lists the packet loss ratio in the case of overloading of the EFS0A. The values
are obtained when the SmartApplication is set as follows:

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.2 Packet loss ratio in the case of overloading of the EFS0A
Frame Size
(Byte)

Rate Tested
(%)

(01,11,01) to
(01,11,02) (%)

(01,11,02) to
(01,11,01) (%)

Average (%)

64

100.00

46.497

46.497

46.497

128

100.00

48.820

48.820

48.820

256

100.00

50.127

50.127

50.127

512

100.00

50.804

50.804

50.804

1024

100.00

51.115

51.115

51.115

1280

100.00

51.159

51.159

51.159

1518

100.00

51.176

51.176

51.176

Table 12-103 lists the latency specifications of the EFS0A. The values are obtained when the
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SmartApplication is set as follows:

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Test duration (sec): 100

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.3 Latency specifications of the EFS0A


Frame
Size
(Byte)

Rate
Tested
(%)

(01,11,01) to
(01,11,02) (us)CT (us)

Average
(CT) (us)

(01,11,01) to
(01,11,02) (us)S&F (us)

Average
(S&F) (us)

64

40.00

164.3

164.3

159.2

159.2

128

40.00

199.0

199.0

188.8

188.8

256

40.00

247.0

247.0

226.6

226.6

512

40.00

357.6

357.6

357.6

357.6

1024

40.00

514.8

514.8

432.9

432.9

1280

40.00

613.1

613.1

510.7

510.7

1518

40.00

699.4

699.4

578.0

578.0

Table 12-104 lists the back-to-back specifications of the EFS0A. The values are obtained
when the SmartApplication is set as follows:

Test duration (sec): 2

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

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Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

12 EoS Boards

Figure 1.4 Back-to-back specifications of the EFS0A


Frame Size
(Byte)

Rate Tested
(%)

(01,11,01) to
(01,11,02) Burst
Size (Number of
Frames)

(01,11,02) to
(01,11,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

353

353

706

128

100.00

342

342

684

256

100.00

380

380

761

512

100.00

368

368

736

1024

100.00

282

282

564

1280

100.00

279

279

559

1518

100.00

291

291

582

1.1.1.1.1077 Mechanical Specifications


The mechanical specifications of the EFS0A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.7

1.1.1.1.1078 Power Consumption


The maximum power consumption of the EFS0A at room temperature (25C) is 32 W.

12.6 EFS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EFS4 (4xFE switching and processing board). This topic also
describes how to configure and commission the EFS4.

12.6.1 Version Description


The EFS4 is available in three functional versions, namely, N1, N2 and N3. The difference
between the three versions is their different maximum uplink bandwidths. The N1EFS4 and
N2EFS4 are discontinued.
Table 12-105 describes the versions of the EFS4.

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Figure 1.1 Versions of the EFS4


Item

Description

Functional versions

The EFS4 is available in three functional versions, namely, N1, N2


and N3.

Differences

Regarding service specifications: bound bandwidth, maximum


uplink bandwidth, VCTRUNK specifications

Regarding protection schemes: LCAS, LPT, LAG

Regarding maintenance features: ETH OAM, test frame, port


mirroring, loopback capability, warm resets

QoS

Traffic monitoring

The N2EFS4 can substitute for the N1EFS4.

The N3EFS4 can substitute for the N2EFS4 and N1EFS4.

Substitution

12.6.2 Application
The EFS4 is used to transmit/receive Ethernet services, manage bandwidths, and realize Layer
2 switching of Ethernet services.
Figure 12-29 shows the typical networking and application of the Ethernet switching board.
the Ethernet switching board accesses and converges Ethernet services, and provides the
Ethernet data with the following data features: Layer 2 switching, port isolation, flow
classification, traffic control, VLAN management, and priority configuration. In addition, the
Ethernet switching board performs encapsulation/decapsulation, virtual concatenation, and
SDH mapping/demapping for data. The Ethernet switching board can be interconnected with
the bandwidth access equipment and the data communication equipment at the same time,
thus to provide a network-level solution.

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Figure 1.1 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

12.6.3 Functions and Features


EFS4 boards support the Layer 2 switching, MPLS, and broadcast functions.
Table 12-106 lists the functions and features supported by EFS4 boards.
Figure 1.2 Functions and features supported by EFS4 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Processes 4xFE services.

Port
types

Supports 10BASE-T/100BASE-TX signals. The optical ports comply with IEEE


802.3u.

Functi
ons
when
being
used
with

Provides ports on the front panel to receive/transmit 4xFE signals.

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Funct
ion
and
Featu
re

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Description

an
interfa
ce
board
Port
charac
teristic
s

Servic
e
catego
ries

Working
modes

Auto-negotiation, 100M full-duplex, 100M half-duplex, 10M fullduplex, and 10M half-duplex

Traffic
control
at ports

Auto-negotiation mode

Supported

Non-autonegotiation mode

Supported

Query/S
etting of
port
status

Supported

Query of
port
types

Supported

Setting
of
optical
power
threshol
ds

Not supported

Pluggabl
e optical
module

Not supported

EPL
service

Supports PORT-based transparent transmission.

EVPL
service

Supports PORT-shared EVPL services.

Supports VCTRUNK-shared EVPL services.

EPLAN
service

Issue 02 (2013-01-18)

The services are isolated by VLAN tags.

The services are isolated by MPLS tags.

The services are isolated by QinQ tags.

Supports a maximum of 4096 links.

N2EFS4/N3EFS4 boards support the EPLAN services that are based


on the IEEE 802.1d MAC bridge.

Supports switching on the client and SDH sides.

Supports the blacklist that can contain 2K records and also the
static MAC address table that can contain 2K records. The sum of
the number of records in the blacklist and the number of addresses
in the static MAC address table must not exceed 2K. The blacklist

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ion
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Description

function of N3EFS4 boards supports verification of destination


MAC addresses only.

EVPLA
N
services

Servic
e
specifi
cation
s

Supports the self-learning of the source MAC address. The


capacity of the MAC address table is 16K. The aging time of the
MAC address can be set and queried.

Supports the configuration of static MAC routes.

N2EFS4 and N3EFS4 boards support the query of dynamic MAC


addresses.

N1EFS4 boards do not support the query of dynamic MAC


addresses.

The maximum number of supported VBs is 16. The maximum


number of logical ports for each VB is 30.

Queries the number of actually learned MAC addresses based on


VB+VLAN or VB+LP.

Supports data isolation based on VB+VLAN.

Supports the setting of a maximum of 4096 VLAN services.

Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge.

N3EFS4 boards support the EVPLAN services that are based on


the IEEE 802.1ad provider bridge.

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1 q/p

Supported

Frame
length
range

Supports the setting of the frame length to a value ranging from


1518 bytes to 9600 bytes.

Supports a jumbo frame with a maximum length of 9600 bytes.

Bound
bandwid
th

N1EFS4: 12xVC-3, or 63xVC-12 + 9xVC-3

N2EFS4/N3EFS4: 24xVC-3 or 126xVC-12 + 18xVC-3

Concate
nation
granulari
ties

Supports VC-12, VC-3, VC-12-Xv (X 63), and VC-3-Xv (X 12)


granularities.

Encapsul
ation
formats

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

MPLS
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Supports the MPLS.


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Description

technolo
gy
VLAN
technolo
gy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maximu
m uplink
bandwid
th

The maximum uplink bandwidth of an N1EFS4 board is 622


Mbit/s.

The maximum uplink bandwidth of an N2EFS4 or N3EFS4 board


is 1.25 Gbit/s.

An EFS4 board can adapt to the bandwidth of its slot.

The number of VCTRUNKs supported by an N1EFS4 board is 12.

The number of VCTRUNKs supported by an N2EFS4 or N3EFS4


board is 24.

VCTRU
NK
specifica
tions

Protec
tion
schem
es

Configuration principles are as follows:

VCTRUNK 1-VCTRUNK 12 can be bound only with lower order


paths in VC-4s numbered 1-4. VCTRUNK 13-VCTRUNK 24 can
be bound only with lower order paths in VC-4s numbered 5-8.

VC-4s numbered 4 and 8 support the binding of VC-3 and VC-12


paths. The other VC-4s support the binding of VC-3 paths only.

A VC-4 cannot be bound with VC-3 and VC-12 paths at the same
time.

TPS

Not supported

BPS

Not supported

PPS

Not supported

DLAG

Not supported

LAG

N1EFS4 boards do not support this protection scheme. N2EFS4 and


N3EFS4 boards support manual link aggregation and the load sharing
mode that comply with IEEE 802.3ad and IEEE 802.1AX.

LCAS

Not supported by N1EFS4 boards


Dynamically increases or decreases the bandwidth and protects the
bandwidth in compliance with ITU-T G.7042. This protection scheme
is supported by N2EFS4/N3EFS4 boards.

LPT

STP/RS
TP
Issue 02 (2013-01-18)

N1EFS4 boards support P2P LPT.

N2EFS4 and N3EFS4 boards support P2P LPT and P2MP LPT.

LPT complies with ITU-T G.7042.

Supports the broadcast packet suppression function and RSTP, which


comply with IEEE 802.1w.
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ion
and
Featu
re

Synch
roniza
tion

Maint
enanc
e
featur
es

12 EoS Boards

Description

MSTP

Not supported

Synchro
nous
Ethernet

Not supported

IEEE
1588v2

Not supported

ETH
OAM

N1EFS4 boards do not support the ETH OAM function.

N2EFS4 and N3EFS4 boards support CC, LB tests, and LT tests in


compliance with IEEE 802.1ag, LM and DM in compliance with
ITU-T Y.1731, and OAM ping in compliance with Huawei
proprietary protocol.

N2EFS4 and N3EFS4 boards support OAM auto-discovery, remote


loopbacks, fault detection, and link performance detection in
compliance with IEEE 802.3ah, and selfloop detection in
compliance with Huawei proprietary protocol.

Test
Frame

N1EFS4 boards support test frames in Ethernet bearer mode.

N2EFS4/N3EFS4 boards support test frames in Ethernet/GFP


bearer mode.

Respons
e to ping

Not supported

Port
mirrorin
g

N3EFS4 boards support ingress mirroring.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Supports inloops

MAC layer at Ethernet ports

Supports inloops

VC-4 level

Not supported

VC-3 level

Not supported by N3EFS4 boards


N1EFS4/N2EFS4 boards support
inloops and outloops.

VC-12 level

Issue 02 (2013-01-18)

Not supported

RMON

Supports Ethernet performance monitoring at the port level.

Warm
resets

N1EFS4/N2EFS4/N3EFS4 boards support warm resets. If a warm


reset is performed on an N1EFS4 board, traffic on the board is
interrupted, whereas if a warm reset is performed on an
N2EFS4/N3EFS4 board, traffic on the board is not interrupted. If an
N2EFS4/N3EFS4 board substitutes for an N1EFS4 board, traffic on
the N2EFS4/N3EFS4 board is not interrupted.

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Funct
ion
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Featu
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QoS

IGMP
snoopi
ng

12 EoS Boards

Description

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Supports the CAR. The granularity is 64 kbit/s.

N1EFS4 boards support the service classification based on PORT,


PORT+VLAN ID, or PORT+VLAN PRI.

N2EFS4 and N3EFS4 boards support the flow classification based on PORT,
PORT+VLAN ID, or PORT+VLAN ID+VLAN PRI.

N3EFS4 boards support the flow classification based on PORT+S-VLAN ID.

Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Not supported

Discardi
ng of
unknow
n
broadcas
t packets

Not supported

Static
broadcas
t entry

Not supported

Traffic
contro
l

Supports the port-based traffic control function that complies with IEEE 802.3x.

Traffic
monit
oring

N3EFS4 boards support port-based and VCTRUNK-based traffic monitoring.

12.6.4 Working Principle and Signal Flow


The EFS4 consists of the Ethernet access module, network processor module, mapping
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module, interface converting module, logic and control module, clock module, and power
module.
Figure 12-30 shows the functional block diagram of the EFS4 by describing how to process
1xFE signals.
Figure 1.1 Functional block diagram of the EFS4
Backplane

Switch
fabric

Data
Network processor module

Interface
converting
module

VCP

Control

DENCP

Network
processor

ENCP

Ethernet
FE
access
module

Cross-connect unit

Cross-connect unit

Mapping module

LOS
Logic and
control module

Communication
Reference clock and frame header
+3.3 V
Power
module

Clock module
50 77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module

Power Fuse
module

SCC unit
SCC unit
-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

Fuse

DENCP: decapsulation module

VCP: virtual concatenation processing module

1.1.1.1.1079 Ethernet Access Module


In the receive direction, the Ethernet access module receives the Ethernet electrical signals
from Ethernet equipment such as switches or routers. At the PHY layer, the electrical signals
are decoded and the ETH_LOS alarm is detected. The electrical signals are converted from
serial signals into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded.

1.1.1.1.1080 Network Processor Module


The network processor module consists of the network processor and switch fabric. The
network processor first performs MAC functions, which include code conversion, framing of
Ethernet packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:

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L2 MPLS VPN

Ethernet/VLAN

12 EoS Boards

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
extracted based on the level (P or PE) of the equipment. Services are then routed or
forwarded.
The network processor module supports the following functions:

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

1.1.1.1.1081 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP
format. The concatenation is performed. Then, the Ethernet signals are converted into SDH
signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

1.1.1.1.1082 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1083 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Implements communication.

Controls indicators.

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1.1.1.1.1084 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

1.1.1.1.1085 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.6.5 Front Panel


The front panel of the EFS4 has indicators, interfaces, and a bar code.

1.1.1.1.1086 Diagram of the Front Panel


Figure 12-31 shows the appearance of the front panel of the EFS4.
Figure 1.1 Front panel of the EFS4

EFS4
STAT
ACT
PROG
SRV

FE1

FE2

FE3

FE4

EFS4

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1.1.1.1.1087 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1088 Interfaces
The front panel of the EFS4 has four FE interfaces. Table 12-107 describes the types and
usage of the interfaces of the EFS4. For information about the cables connected to the
interfaces, see 22.4.6 Straight-Through Cable and 22.4.7 Crossover Cable.
Figure 1.1 Interfaces of the EFS4
Interface

Type of Interface

Usage

FE1

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE2

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE3

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE4

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

Table 12-108 describes the pins of the RJ45 connector.


Figure 1.2 Pins of the RJ45 connector
Pin

Description

Positive data transmit end

Negative data transmit end

Positive data receive end

Grounding

Grounding

Negative data receive end

Grounding

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Pin

Description

Grounding

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12.6.6 Jumpers and DIP Switches


The EFS4 does not have any jumpers or DIP switches that are used for board settings.

12.6.7 Valid Slots


The EFS4 must be installed in a valid slot in the subrack. Otherwise, the EFS4 cannot work
normally.
The relationship between the slots valid for the EFS4 and the bandwidth is as follows:

When the N1EFS4 is installed in slots 18 and 1117, the bandwidth is 622 Mbit/s.

When the N2EFS4/N3EFS4 is installed in slots 18 and 1117, the bandwidth is 1.25
Gbit/s.

12.6.8 Feature Code


The EFS4 does not have the feature code.

12.6.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1089 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1090 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
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Step 6 Required: Configure services. For details, see Configuring Ethernet Services.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the L2 switching management service. Perform the following tasks:

Configuring the IGMP Snooping Protocol

Configuring the Spanning Tree

Setting the Aging Time for the Multicast Router Port

Step 9 Optional: Configure the aggregation function for the Ethernet port. For details, see Creating a
LAG.
Step 10 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

1.1.1.1.1091 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.1092 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 11 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

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12.6.10 Configuring the Board Functions


The EFS4 supports multiple Ethernet functions and features such as Layer 2 switching,
LCAS, and QoS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EFS4 by using the U2000:

LCAS

QoS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12.6.11 Parameter Settings


You can set parameters for the EFS4 by using the U2000.
You can set the following main parameters for the EFS4 by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

12.6.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1093 Troubleshooting
Table 12-109 lists the faults that occur on the EFS4 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EFS4 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

Transient service
interruption
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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.
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Fault Symptom

12 EoS Boards

Common Fault Cause

Packet loss

Interconnection
fault

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

The negotiated working mode


of the Ethernet ports is the
half-duplex mode.

Bit errors occur on the line


side.

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Troubleshooting Method

See Troubleshooting Service


Packet Loss.

See Troubleshooting Device


Interconnection Faults.

1.1.1.1.1094 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EFS4, see Replacing an EOS Board.

12.6.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

12.6.13.1 Alarms of N1EFS4


ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

LCAS_BAND_DECREASED

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_RFI

LP_SLM_VC12

LP_SLM_VC3

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LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

TU_AIS_VC12

NO_BD_SOFT

TU_LOP_VC12

TU_LOP_VC3

T_LOS

VCAT_LOM_VC12

VCAT_LOM_VC3

TU_AIS_VC3

VCAT_SQM_VC3

W_R_FAIL

VCAT_LOA

PATCH_ERR

PATCHFILE_NOTEXIST

VCAT_SQM_VC12

PATCH_NOT_CONFIRM

PROTOCOL_MM

SWDL_PKG_NOBDSOF
T

WRG_BD_TYPE

12.6.13.2 Alarms of N2EFS4


ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

ETHOAM_DISCOVER_F
AIL

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_RMT_CRIT_F
AULT

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNFL
CT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_LOM

LAG_FAIL

LCAS_FOPT

LCAS_PLCR

LCAS_FOPR

LCAS_TLCR

LCAS_TLCT

LCAS_PLCT

LP_RDI_VC12

LP_RDI_VC3

LOOP_ALM

LP_REI_VC3

LP_SLM_VC12

LP_REI_VC12

LP_TIM_VC12

LP_TIM_VC3

LP_SLM_VC3

LP_UNEQ_VC3

LPT_RFI

LP_UNEQ_VC12

NO_BD_SOFT

SLAVE_WORKING

TU_AIS_VC3

T_LOS

TU_AIS_VC12

VCAT_LOA

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOM_VC3

VCAT_LOM_VC12

TR_LOC

T_LOSEX

ALM_GFP_dCSF

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

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SWDL_PKG_NOBDSOF
T

12 EoS Boards

WRG_BD_TYPE

12.6.13.3 Alarms of N3EFS4


ALM_GFP_dCSF

ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_FA
ULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_LOM

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC12

LP_RDI_VC3

LP_REI_VC12

LP_REI_VC3

LP_SLM_VC12

LP_SLM_VC3

LP_TIM_VC12

LP_TIM_VC3

LP_UNEQ_VC12

LP_UNEQ_VC3

LPT_RFI

NO_BD_SOFT

T_LOSEX

TEMP_OVER

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

VCTRUNK_NO_FLOW

WRG_BD_TYPE

PORTMODE_MISMATCH

12.6.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .
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12.6.14.1 Performance Events of N1EFS4


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

Figure 1.2 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Figure 1.3 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets
Received(256~511
Octets in Length)
(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets Received(1024~1518
Octets in Length)(packets)

Multicast Packets
Received(packets)

Broadcast Packets
Received(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets
Received(packets)

Figure 1.4 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)
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(packets)
Packets
Transmitted(256~511
Octets in Length)
(packets)

Packets
Transmitted(512~1023
Octets in Length)(packets)

Packets
Transmitted(1024~1518 Octets
in Length)(packets)

Unicast Packets
Received(packets)

Unicast Packets
Transmitted(packets)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Good Octets
Transmitted(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Octets


Transmitted(Byte)

Good Full Frame Octets


Received(Byte)

Good Full Frame Speed


Transmitted(Byte/s)

12.6.14.2 Performance Events of N2EFS4


Figure 1.5 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

Figure 1.6 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Figure 1.7 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets

Packets Received(512~1023

Packets Received(1024~1518

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Received(256~511
Octets in Length)
(packets)

Octets in Length)(packets)

Octets in Length)(packets)

Multicast Packets
Received(packets)

Broadcast Packets
Received(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Fragments(packets)

Jabbers(packets)

Collisions(times)

Octets Received(Byte)

Packets
Received(packets)

Figure 1.8 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)
(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets Transmitted(128~255
Octets in Length)(packets)

Packets
Transmitted(256~511
Octets in Length)
(packets)

Packets
Transmitted(512~1023
Octets in Length)(packets)

Packets
Transmitted(1024~1518 Octets
in Length)(packets)

Unicast Packets
Received(packets)

Unicast Packets
Transmitted(packets)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Good Octets
Transmitted(Byte)

Alignment Errors(frames)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Octets


Transmitted(Byte)

Good Full Frame Octets


Received(Byte)

Good Full Frame Speed


Transmitted(Byte/s)

12.6.14.3 Performance Events of N3EFS4


Figure 1.9 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

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LPSES

LPUAS

XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

Figure 1.10 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Figure 1.11 Statistics of RMON basic performance


ETHCOL

ETHDROP

ETHFRG

ETHJAB

ETHOVER

ETHUNDER

RXBRDCAST

RXMULCAST

RXOCTETS

RXPKT1024

RXPKT128

RXPKT256

RXPKT512

RXPKT64

RXPKT65

RXPKTS

Figure 1.12 Statistics of RMON extended performance


ETHALI

ETHFCS

RXFULLBGOOD

RXGOODFULLFRAMESP
EED

RXUNICAST

TXBGOOD

TXBRDCAST

TXFULLBGOOD

TXGOODFULLFRAMESP
EED

TXMULCAST

TXPKT1024

TXPKT128

TXPKT256

TXPKT512

TXPKT64

TXPKT65

TXUNICAST

12.6.15 Technical Specifications


The technical specifications of the EFS4 include the dimensions, weight, and power
consumption.

1.1.1.1.1095 Parameters Specified for Electrical Interfaces


Table 12-122 lists the parameters specified for the electrical interfaces of the EFS4.
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Figure 1.1 Parameters specified for the optical interfaces of the EFS4
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

1.1.1.1.1096 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFS4 board of the N2 version.

Figure 12-32 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N2EFS4.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications of the N2EFS4
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-123 lists the throughput specifications of the N2EFS4. Table 12-124 lists the packet
loss ratio in the case of overloading of the N2EFS4. Table 12-125 lists the latency
specifications of the N2EFS4. Table 12-126 lists the back-to-back specifications of the
N2EFS4.

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The specifications vary according to the configuration and networking of the test environment, port
rate, and VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and five VC-12s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-123 lists the throughput specifications of the N2EFS4. The values are obtained when
the SmartApplication is set as follows:

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 10.00

Maximum rate (%): 15.00

Resolution rate (%): 0.01

Mode: bidirectional

Figure 1.1 Throughput specifications of the N2EFS4


Frame Size
(Byte)

Passed Rate
(%)

(01,02,03) to
(01,02,05)
(pks/sec)

(01,02,05) to
(01,02,03)
(pks/sec)

Total (pks/sec)

64

11.41

16984

16984

33968

128

11.18

9441

9441

18882

256

11.10

5026

5026

10052

512

11.09

2605

2605

5210

1024

11.00

1317

1317

2634

1280

11.09

1066

1066

2132

1518

11.07

900

900

1800

Table 12-124 lists the packet loss ratio in the case of overloading of the N2EFS4. The values
are obtained when the SmartApplication is set as follows:

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

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Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.2 Packet loss ratio in the case of overloading of the N2EFS4
Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) (%)

(01,02,05) to
(01,02,03) (%)

Average (%)

64

100.00

88.510

88.513

88.512

128

100.00

88.724

88.729

88.726

256

100.00

88.858

88.859

88.859

512

100.00

88.858

88.861

88.859

1024

100.00

88.888

88.914

88.901

1280

100.00

88.895

88.875

88.885

1518

100.00

88.870

88.871

88.870

Table 12-125 lists the latency specifications of the N2EFS4. The values are obtained when the
SmartApplication is set as follows:

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 10.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

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Figure 1.3 Latency specifications of the N2EFS4


Frame
Size
(Byte)

Rate
Tested
(%)

(01,02,03) to
(01,02,05) (us)CT (us)

Average
(CT) (us)

(01,02,03) to
(01,02,05)
(us)-S&F (us)

Average
(S&F) (us)

64

10.00

586.1

586.1

581.0

581.0

128

10.00

644.4

644.4

634.2

634.2

256

10.00

726.3

726.3

705.9

705.9

512

10.00

969.0

969.0

928.1

928.1

1024

10.00

1382.6

1382.6

1300.6

1300.6

1280

10.00

1609.0

1609.0

1506.6

1506.6

1518

10.00

1804.9

1804.9

1683.4

1683.4

Table 12-126 lists the back-to-back specifications of the N2EFS4. The values are obtained
when the SmartApplication is set as follows:

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.4 Back-to-back specifications of the N2EFS4


Frame Size
(Byte)

Rate Tested
(%)

(01,02,03) to
(01,02,05) Burst
Size (Number of
Frames)

(01,02,05) to
(01,02,03)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

1337

1339

2676

128

100.00

852

852

1704

256

100.00

583

583

1166

512

100.00

441

441

882

1024

100.00

225

228

453

1280

100.00

210

210

420

1518

100.00

200

200

400

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The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EFS4 board of the N3 version.

Figure 12-33 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N3EFS4.
Figure 1.2 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications of the N3EFS4
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-127 lists the throughput specifications of the N3EFS4. Table 12-128 lists the packet
loss ratio in the case of overloading of the N3EFS4. Table 12-129 lists the latency
specifications of the N3EFS4. Table 12-130 lists the back-to-back specifications of the
N3EFS4.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and three VC-3s are bound on the FE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-127 lists the throughput specifications of the N3EFS4. The values are obtained when
the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 1%.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

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Number of pairs: 1

Initial rate (%): 100

Maximum rate (%): None

Mode: Uni-directional

12 EoS Boards

Figure 1.5 Throughput specifications of the N3EFS4


Frame Size
(byte)

Passed Rate (%)

(01,04,01) to (01,04,02)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

128

100.00

84459

84459

256

100.00

45290

45290

512

100.00

23496

23496

1024

100.00

11973

11973

1280

100.00

9615

9615

1518

100.00

8127

8127

Table 12-128 lists the packet loss ratio in the case of overloading of the N3EFS4. The values
are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.6 Packet loss ratio in the case of overloading of the N3EFS4
Frame Size
(byte)

Rate Tested (%)

(01,04,01) to (01,04,02)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

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Frame Size
(byte)

Rate Tested (%)

(01,04,01) to (01,04,02)
(%)

Average (%)

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-129 lists the latency specifications of the N3EFS4. The values are obtained when the
SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 5 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

Measure on one receiving card only

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.7 Latency specifications of the N3EFS4


Frame
Size
(byte)

Rate
Tested
(%)

(01,04,01) to
(01,04,02) (us)CT (us)

Average
(CT) (us)

(01,04,01) to
(01,04,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

129.3

129.3

124.2

124.2

128

100.00

142.6

142.6

132.4

132.4

256

100.00

171.1

171.1

150.6

150.6

512

100.00

215.7

215.7

174.7

174.7

1024

100.00

298.4

298.4

216.5

216.5

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Frame
Size
(byte)

Rate
Tested
(%)

(01,04,01) to
(01,04,02) (us)CT (us)

Average
(CT) (us)

(01,04,01) to
(01,04,02)
(us)-S&F (us)

Average
(S&F) (us)

1280

100.00

339.8

339.8

237.4

237.4

1518

100.00

374.7

374.7

253.3

253.3

Table 12-130 lists the back-to-back specifications of the N3EFS4. The values are obtained
when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 1 on the SmartApplication.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.8 Back-to-back specifications of the N3EFS4


Frame Size
(byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
Burst Size (frames)

Total (frames)

64

100.00

297620

297620

128

100.00

168918

168918

256

100.00

90580

90580

512

100.00

46992

46992

1024

100.00

23946

23946

1280

100.00

19230

19230

1518

100.00

16254

16254

1.1.1.1.1097 Mechanical Specifications


The mechanical specifications of the EFS4 are as follows:

Issue 02 (2013-01-18)

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)


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Weight of the N1EFS4 (kg): 1.0

Weight of the N2EFS4 (kg): 1.0

Weight of the N3EFS4 (kg): 0.6

12 EoS Boards

1.1.1.1.1098 Power Consumption


The maximum power consumption of the N1EFS4 at room temperature (25C) is 30 W.
The maximum power consumption of the N2EFS4 at room temperature (25C) is 30 W.
The maximum power consumption of the N3EFS4 at room temperature (25C) is 18 W.

12.7 EGS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGS2 (2xGE switching and processing board). This topic also
describes how to configure and commission the EGS2.

12.7.1 Version Description


The EGS2 is available in two functional versions, namely, N2 and N3. The N2EGS2 is
discontinued.
Table 12-131 describes the versions of the EGS2.
Figure 1.1 Versions of the EGS2
Item

Description

Functional version

The EGS2 is available in two functional versions, namely, N2 and


N3.

Difference

Regarding interface specifications: interface types

Regarding protection schemes: , LPT

Regarding maintenance features: ETH OAM, , , port mirroring,


loopback capability, warm resets

IGMP snooping

Traffic monitoring

Substitution

The N3EGS2 can substitute for the N2EGS2.

12.7.2 Application
The EGS2 is used to transmit/receive Ethernet services, manage bandwidths, and realize
Layer 2 switching of Ethernet services.
Figure 12-34 shows the typical networking and application of the Ethernet switching board.
the Ethernet switching board accesses and converges Ethernet services, and provides the
Ethernet data with the following data features: Layer 2 switching, port isolation, flow
classification, traffic control, VLAN management, and priority configuration. In addition, the
Ethernet switching board performs encapsulation/decapsulation, virtual concatenation, and
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SDH mapping/demapping for data. The Ethernet switching board can be interconnected with
the bandwidth access equipment and the data communication equipment at the same time,
thus to provide a network-level solution.
Figure 1.1 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

When the service converging FE services into GE services is configured, the GE switching board can be
set to the 1000M full-duplex mode or auto-negotiation mode, the VLAN of the convergence service is
variable, and the binding granularity can be at the VC-3 or VC-12 level.

12.7.3 Functions and Features


EGS2 boards support the Layer 2 switching, MPLS, and broadcast functions.
Table 12-132 lists the functions and features supported by EGS2 boards.
Figure 1.2 Functions and features supported by EGS2 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Processes 2xGE services.

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Funct
ion
and
Featu
re

Description

Port
types

EGS2 boards support 1000BASE-SX/LX/ZX/VX Ethernet optical ports. The


optical ports support the auto-negotiation function in compliance with IEEE
802.3z. The optical ports use SFP optical modules and support hot swapping.
When the multi-mode optical fiber is used, the maximum transmission
distance is 550 m. When the single-mode optical fiber is used, the maximum
transmission distance is 10 km. The optical modules that can meet different
requirements for the transmission distance such as 40 km and 80 km can also
be used.

N3EGS2 boards also support 1000BASE-T RJ-45 Ethernet electrical ports.


The electrical ports support the auto-negotiation function. The negotiated rate
can be 10 Mbit/s, 100 Mbit/s, or 1000 Mbit/s. N3EGS2 boards support SFP
electrical ports and hot swapping. The maximum transmission distance is 100
m.

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides ports on the front panel.

Port
charac
teristic
s

Working
modes

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GE electrical port: auto-negotiation, 1000M full-duplex, 100M


full-duplex, and 10M full-duplex (only N3EGS2 boards support
GE electrical port.)

GE optical port: auto-negotiation and 1000M full-duplex

Traffic
control at
ports

Auto-negotiation mode

Supported

Non-autonegotiation mode

Supported

Query/Se
tting of
port
status

Supported

Query of
port
types

Supported

Setting
of optical
power
threshold
s

Not supported

Pluggabl

Supports SFP optical modules.


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Description

e optical
module
Servic
e
catego
ries

EPL
service

Supports PORT-based transparent transmission.

EVPL
service

Supports PORT-shared EVPL services.

Supports VCTRUNK-shared EVPL services.

Issue 02 (2013-01-18)

The services are isolated by VLAN tags.

The services are isolated by MPLS tags.

The services are isolated by QinQ tags.

Supports a maximum of 4096 links.

Supports the blacklist that can contain 2K records and also the
static MAC address table that can contain 2K records. The sum of
the number of records in the blacklist and the number of addresses
in the static MAC address table must not exceed 2K. The blacklist
function of N3EGS2 boards supports verification of destination
MAC addresses only.

Supports the self-learning of the source MAC address. The


capacity of the MAC address table is 16K. The aging time of the
MAC address can be set and queried.

Supports the configuration of static MAC routes.

The maximum number of supported VBs is 2. The maximum


number of logical ports for each VB is 30.

N3EGS2 supports the EPLAN services that are based on the IEEE
802.1d MAC bridge.

EVPLA
N
services

Supports data isolation based on VB+VLAN.

Supports the setting of a maximum of 4096 VLAN services.

Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge.

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1 q/p

Supported

Frame
length
range

Supports the setting of the frame length to a value ranging from


1518 bytes to 9600 bytes.

Supports a jumbo frame with a maximum length of 9600 bytes.

Bound
bandwidt
h

N2EGS2: 48xVC-3, or 252xVC-12 + 36xVC-3.

EPLAN
service

Servic
e
specifi
cation
s

N3EGS2: 48xVC-3, or 252xVC-12 + 36xVC-3, 16xVC-4.

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Funct
ion
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Featu
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Protec
tion
schem
es

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Description

Concaten
ation
granulari
ties

N2EGS2: VC-12, VC-3, VC-12-Xv (X 63), VC-3-Xv (X 24).

Encapsul
ation
formats

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

N3EGS2: VC-12, VC-3, VC-12-Xv (X 63), VC-3-Xv (X 24), VC4-Xv (x 8).

MPLS
technolo
gy

Supported

VLAN
technolo
gy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

The maximum uplink bandwidth is 2.5 Gbit/s. An EGS2 board can


adapt to the bandwidth of its slot.

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 48


Configuration principles are as follows:

In the case of N2EGS2 boards, VCTRUNK 1VCTRUNK 12 can


be bound only with lower order paths in VC-4s numbered 14.
VCTRUNK 13VCTRUNK 24 can be bound only with lower
order paths in VC-4s numbered 58. VCTRUNK 25VCTRUNK
36 can be bound only with lower order paths in VC-4s numbered
912. VCTRUNK 37VCTRUNK 48 can be bound only with
lower order paths in VC-4s numbered 1316.

In the case of N3EGS2 boards, there is no requirement regarding


VCTRUNK binding. One VCTRUNK can be bound with up to 24
VC-3s.

VC-4s numbered 4, 8, 12, and 16 support the binding of VC-3 and


VC-12 paths. The other VC-4s support the binding of VC-3 paths
only.

A VC-4 cannot be bound with VC-3 and VC-12 paths at the same
time.

TPS

Not supported

BPS

Not supported

PPS

Not supported

DLAG

Not supported

LAG

Supports manual link aggregation and the load sharing mode that
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comply with IEEE 802.3ad and IEEE 802.1AX.

Synch
roniza
tion

Maint
enanc
e
featur
es

Issue 02 (2013-01-18)

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

N2EGS2 boards support P2P LPT.

N3EGS2 boards support P2P LPT and P2MP LPT.

Complies with ITU-T G.7042.

STP/RST
P

Supports the broadcast packet suppression function and RSTP, which


comply with IEEE 802.1w.

MSTP

Not supported

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported

ETH
OAM

N2EGS2 boards do not support the ETH OAM function.

N3EGS2 boards support CC, LB tests, and LT tests in compliance


with IEEE 802.1ag, LM and DM in compliance with ITU-T
Y.1731, and OAM ping in compliance with Huawei proprietary
protocol.

N3EGS2 boards support OAM auto-discovery, remote loopbacks,


fault detection, and link performance detection in compliance with
IEEE 802.3ah, and selfloop detection in compliance with Huawei
proprietary protocol.

Test
Frame

Supports test frames in Ethernet bearer mode.

Response
to ping

Not supported

Port
mirroring

N3EGS2 boards support ingress mirroring.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Supports inloops.

MAC layer at Ethernet ports

Supports inloops.

VC-4 level

Not supported

VC-3 level

N2EGS2 boards support inloops


and outloops. N3EGS2 boards do
not support inloops or outloops.

VC-12 level

Not supported

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IGMP
snoopi
ng

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Description

RMON

Supports Ethernet performance monitoring at the port level.

Warm
resets

N2EGS2/N3EGS2 boards support warm resets. If a warm reset is


performed on an N2EGS2 board, traffic on the board is interrupted,
whereas if a warm reset is performed on an N3EGS2 board, traffic on
the board is not interrupted. If an N3EGS2 board substitutes for an
N2EGS2 board, traffic on the N3EGS2 board is not interrupted.

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Supports the CAR. The granularity is 64 kbit/s.

Supports the flow classification based on PORT, PORT+VLAN ID, or


PORT+VLAN ID+VLAN PRI.

Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Supported by N3EGS2 boards

Discardi
ng of
unknown
broadcast
packets

Supported by N3EGS2 boards

Static
broadcast
entry

Supported by N3EGS2 boards

NOTE
N3EGS2 boards support the IGMP snooping fast-leave function when they
substitute for N2EGS2 boards using the board version replacement function.

Traffic
contro
l

Supports the port-based traffic control function that complies with IEEE 802.3x.

Traffic
monit
oring

N3EGS2 boards support port-based and VCTRUNK-based traffic monitoring.

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12.7.4 Working Principle and Signal Flow


The EGS2 consists of the Ethernet access module, network processor module, mapping
module, interface converting module, logic and control module, clock module, and power
module.
Figure 12-35 shows the functional block diagram of the EGS2 by describing how to process
1xGE signals.
Figure 1.1 Functional block diagram of the EGS2
Backplane

Cross-connect unit
Interface
converting
module

VCP

Laser
shutdown

DENCP

Network processor module

ENCP

Network Control Switch


processor
fabric
Data

GE Ethernet
access
module

Cross-connect unit

Mapping module

LOS

Communication

Logic and
control module

Reference clock and frame header

+3.3 V
Clock module
50
77
MHz MHz

Power
module

125 155
MHz MHz

ENCP: data encapsulation module

Power
module

Fuse

SCC unit
SCC unit

-48 V/-60 V
-48 V/-60 V

Fuse
+3.3 V backup power

DENCP: decapsulation module

VCP: virtual concatenation processing module

1.1.1.1.1099 Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or
routers are converted into electrical signals. If the signals are accessed through electrical
interfaces, O/E conversion is not required. At the PHY layer, the electrical signals are decoded
and the ETH_LOS alarm is detected. The electrical signals are converted from serial signals
into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded and converted from electrical signals to optical signals.

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1.1.1.1.1100 Network Processor Module


The network processor module consists of the network processor and switch fabric. The
network processor first performs MAC functions, which include code conversion, framing of
Ethernet packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:

MPLS

L2 MPLS VPN

Ethernet/VLAN

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
extracted based on the level (P or PE) of the equipment. Services are then routed or
forwarded.
The network processor module supports the following functions:

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

1.1.1.1.1101 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP
format. The concatenation is performed. Then, the Ethernet signals are converted into SDH
signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

1.1.1.1.1102 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1103 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
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functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

1.1.1.1.1104 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

1.1.1.1.1105 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.7.5 Front Panel


The front panel of the EGS2 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1106 Diagram of the Front Panel


Figure 12-36 shows the appearance of the front panel of the N2EGS2/N3EGS2 that has the
GE optical interface.

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Figure 1.1 Front panel of the N2EGS2/N3EGS2 that has the GE optical interface

EGS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

EGS2

The N3EGS2 can also be installed with the GE electrical interface. Figure 12-37 shows the
appearance of the front panel of the N3EGS2 that has the GE electrical interface.

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Figure 1.2 Front panel of the N3EGS2 that has the GE electrical interface

EGS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

OUT1
IN1
OUT2
IN2

EGS2

1.1.1.1.1107 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1108 Interfaces
The front panel of the N2EGS2/N3EGS2 has two GE optical interfaces. Table 12-133
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describes the types and usage of the optical interfaces of the N2EGS2/N3EGS2.
Figure 1.1 Optical interfaces of the N2EGS2/N3EGS2
Interface

Type of Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASESX/LX/ZX/VX signals.

OUT2/IN2

LC (swappable)

Transmits and receives 1000BASESX/LX/ZX/VX signals.

When the N3EGS2 has the electrical interfaces, the two GE electrical interfaces are of the
same type and have the same usage. Table 12-134 describes the types and usage of the
electrical interfaces of the N3EGS2.
Figure 1.2 Electrical interfaces of the N3EGS2
Interface

Type of Interface

Usage

GE

RJ-45 (swappable)

Transmits and receives 1000BASE-T signals.

Table 12-135 provides the pin assignments of the RJ-45 interface of the N3EGS2.
Figure 1.3 Pin assignments of the RJ-45 interface of the N3EGS2
Pin

Description

BI_DA+

BI_DA

BI_DB+

BI_DC+

BI_DC

BI_DB

BI_DD+

BI_DD

12.7.6 Jumpers and DIP Switches


The EGS2 does not have any jumpers or DIP switches that are used for board settings.

12.7.7 Valid Slots


The EGS2 must be installed in a valid slot in the subrack. Otherwise, the EGS2 cannot work
normally.
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The N2EGS2 can be installed in slots 18 and 1116. When the N2EGS2 is installed in
slots 14, 15, and 16, the bandwidth is 1.25 Gbit/s. When the N2EGS2 is installed in
slots 58 and 1114, the bandwidth is 2.5 Gbit/s.

The N3EGS2 can be installed in slots 18 and 1116. In this case, the bandwidth is 2.5
Gbit/s.

12.7.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EGS2 indicates the type of interface.
Table 12-136 provides the relationship between the feature code of the EGS2 and the type of
interface.
Figure 1.4 Relationship between the feature code of the EGS2 and the type of interface
Board

Feature Code

Type of Interface

SSN2EGS210 and
SSN2EGS310

10

1000BASE-SX (0.5 km)

SSN2EGS211 and
SSN2EGS311

11

1000BASE-LX (10 km)

SSN2EGS212 and
SSN2EGS312

12

1000BASE-VX (40 km)

SSN2EGS213 and
SSN2EGS213

13

1000BASE-ZX (80 km)

SSN3EGS214

14

1000BASE-T (100 m)

12.7.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1109 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
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correct.
----End

1.1.1.1.1110 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring Ethernet Services.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the Layer 2 switching management service, including the following
tasks:

Configuring the IGMP Snooping Protocol

Configuring the Spanning Tree

Setting the Aging Time for the Multicast Router Port

Step 9 Optional: Configure the QoS. For details, see Configuring QoS.
Step 10 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Creating a LAG.
Step 11 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

1.1.1.1.1111 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.1112 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
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Boards.
Step 12 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

12.7.10 Configuring the Board Functions


The EGS2 supports multiple Ethernet functions and features such as Layer 2 switching,
LCAS, and QoS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EGS2 by using the U2000:

LCAS

QoS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12.7.11 Parameter Settings


You can set parameters for the EGS2 by using the U2000.
You can set the following main parameters for the EGS2 by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

12.7.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1113 Troubleshooting
Table 12-137 lists the faults that occur on the EGS2 frequently and the troubleshooting
methods.

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Figure 1.1 Methods used to troubleshoot the faults that occur on the EGS2 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

The negotiated working mode


of the Ethernet ports is the
half-duplex mode.

Bit errors occur on the line


side.

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Transient service
interruption

Packet loss

Interconnection
fault

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


Packet Loss.

See Troubleshooting Device


Interconnection Faults.

1.1.1.1.1114 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EGS2, see Replacing an EOS Board.

12.7.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

12.7.13.1 Alarms of N2EGS2


ALM_GFP_dLFD

AU_AIS

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

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FCS_ERR

FPGA_ABN

HARD_BAD

HP_LOM

LAG_FAIL

LASER_MOD_ERR

LCAS_FOPR

LCAS_PLCT

LCAS_FOPT

LCAS_PLCR

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC3

LP_REI_VC12

LP_RDI_VC12

LP_SLM_VC12

LP_SLM_VC3

LP_REI_VC3

LP_TIM_VC3

LP_UNEQ_VC12

LP_TIM_VC12

LSR_NO_FITED

NO_BD_SOFT

LP_UNEQ_VC3

SUBCARD_ABN

T_LOS

SLAVE_WORKING

TU_AIS_VC12

TU_AIS_VC3

TPS_ALM

TU_LOP_VC3

VCAT_LOA

TU_LOP_VC12

VCAT_LOM_VC3

PATCHFILE_NOTEXIST

VCAT_LOM_VC12

PATCH_NOT_CONFIRM

TR_LOC

PATCH_ERR

T_LOSEX

ETH_NO_FLOW

SWDL_PKG_NOBDSOF
T

WRG_BD_TYPE

12.7.13.2 Alarms of N3EGS2


ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

ETHOAM_DISCOVER_FA
IL

ETHOAM_RMT_CRIT_FAU
LT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNFL
CT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_LOM

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_RDI_VC12

HP_RDI

LP_REI_VC12

HP_REI

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LP_SLM_VC12

HP_SLM

LP_TIM_VC12

HP_TIM

LP_UNEQ_VC12

HP_UNEQ

LPT_RFI

LSR_NO_FITED

LSR_WILL_DIE

LTEMP_OVER

MOD_TYPE_MISMATCH

NO_BD_SOFT

PORT_MODULE_OFFLI
NE

IN_PWR_HIGH

IN_PWR_LOW

OUT_PWR_HIGH

OUT_PWR_LOW

T_LOSEX

TD

TEMP_OVER

TF

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

WRG_BD_TYPE

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_SQM_VC12

VCAT_SQM_VC3

VCTRUNK_NO_FLOW

ALM_GFP_dCSF

12.7.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

12.7.14.1 Performance Events of N2EGS2


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

Figure 1.2 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments Jabbers

AlignmentErrors

FCSErrors

AlignmentErrors
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Figure 1.3 Statistics of RMON basic performance


Packets Received(64
Octets in Length)
(packets/s)

Packets Received(65~127
Octets in Length)
(packets/s)

Packets Received(128~255
Octets in Length)(packets/s)

Packets Received(256~511
Octets in Length)
(packets/s)

Packets
Received(512~1023 Octets
in Length)(packets/s)

Packets Received(1024~1518
Octets in Length)(packets/s)

Multicast Packets
Received(packets/s)

Broadcast Packets
Received(packets/s)

Drop Events(times/s)

Undersize Packets
Received(packets/s)

Oversize Packets
Received(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Octets Received(Byte/s)

Packets Received(packets/s)

Figure 1.4 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)
(packets/s)

Packets
Transmitted(65~127
Octets in Length)
(packets/s)

Packets Transmitted(128~255
Octets in Length)(packets/s)

Packets
Transmitted(256~511
Octets in Length)
(packets/s)

Packets
Transmitted(512~1023
Octets in Length)
(packets/s)

Packets
Transmitted(1024~1518 Octets
in Length)(packets/s)

Unicast Packets
Received(packets/s)

Unicast Packets
Transmitted(packets/s)

Multicast Packets
Transmitted(packets/s)

Broadcast Packets
Transmitted(packets/s)

Good Octets
Transmitted(Byte/s)

Alignment Errors(frames/s)

FCS Errors(frames/s)

12.7.14.2 Performance Events of N3EGS2


Figure 1.5 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

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LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

RPLMAX

RPLMIN

RPLCUR

TPLMAX

TPLMIN

TPLCUR

TLBMAX

TLBMIN

TLBCUR

BDTEMPCUR

BDTEMPMAX

BDTEMPMIN

VC3BBE

VC3ES

VC3UAS

VC3CSES

VC3SES

VC3FEBBE

VC3FEES

VC3FESES

VC3FECSES

VC3FEUAS

DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

AlignmentErrors

Figure 1.6 RMON alarm

FCSErrors

Figure 1.7 Statistics of RMON basic performance


ETHDROP

ETHFRG

ETHJAB

ETHOVER

ETHUNDER

RXBRDCAST

RXMULCAST

RXOCTETS

RXPKT1024

RXPKT128

RXPKT256

RXPKT512

RXPKT64

RXPKT65

RXPKTS

Figure 1.8 Statistics of RMON extended performance


ETHALI

ETHFCS

RXUNICAST

TXBGOOD

TXBRDCAST

TXMULCAST

TXPKT1024

TXPKT128

TXPKT256

TXPKT512

TXPKT64

TXPKT65

TXUNICAST
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Figure 1.9 Statistics of RMON VCG performance


VCG_RXGOODPACKETS

VCG_RXOCTETS

VCG_RXPACKETS

VCG_RXSPEED

VCG_TXGOODPACKETS

VCG_TXOCTETS

VCG_TXPACKETS

VCG_TXSPEED

12.7.15 Technical Specifications


The technical specifications of the EGS2 include the parameters specified for optical
interfaces, laser safety class, Ethernet performance specifications, mechanical specifications,
and power consumption.

1.1.1.1.1115 Parameter Specified for Optical Interfaces


Table 12-147 lists the parameters specified for the optical interfaces of the EGS2.
Figure 1.1 Parameters specified for the optical interfaces of the EGS2
Parameter

Value

Type of optical
interface

1000BASE-ZX
(80 km)

1000BASEVX (40 km)

1000BASELX (10 km)

1000BASE-SX
(0.5 km)

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

Launched optical
power range
(dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength range
(nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

Receiver
sensitivity (dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

Maximum -20
dB spectral width
(nm)

Minimum side
mode
suppression ratio

30

30

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Value

(dB)

1.1.1.1.1116 Ethernet Electrical Interfaces


Table 12-148 lists the parameters specified for the electrical interfaces of the EGS2.
Figure 1.1 Parameters specified for the electrical interfaces of the EGS2
Type of Interface

Code Type

1000BASE-T

4D-PAM5

Only the EGS2 boards of the N3 version supports the GE electrical interfaces.

1.1.1.1.1117 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1118 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGS2 board of the N2 version.

Figure 12-38 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N2EGS2.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications of the N2EGS2
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-149 lists the throughput specifications of the N2EGS2. Table 12-150 lists the packet
loss ratio in the case of overloading of the N2EGS2. Table 12-151 lists the latency
specifications of the N2EGS2. Table 12-152 lists the back-to-back specifications of the
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N2EGS2.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and five VC-12s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-149 lists the throughput specifications of the N2EGS2. The values are obtained
when the SmartApplication is set as follows:

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 1.00

Maximum rate (%): 2.00

Resolution rate (%): 0.01

Mode: bidirectional

Figure 1.1 Throughput specifications of the N2EGS2


Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,01,02)
(pks/sec)

(01,01,02) to
(01,01,01)
(pks/sec)

Total (pks/sec)

64

1.15

17086

17086

34172

128

1.12

9501

9501

19002

256

1.12

5094

5094

10188

512

1.13

2660

2660

5320

1024

1.12

1346

1346

2692

1280

1.13

1088

1088

2176

1518

1.14

925

925

1850

Table 12-150 lists the packet loss ratio in the case of overloading of the N2EGS2. The values
are obtained when the SmartApplication is set as follows:

Test duration (sec): 10

Minimum frame size (byte): 64

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Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.2 Packet loss ratio in the case of overloading of the N2EGS2
Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) (%)

(01,01,02) to
(01,01,01) (%)

Average (%)

64

100.00

98.846

98.846

98.846

128

100.00

98.869

98.868

98.868

256

100.00

98.874

98.875

98.874

512

100.00

98.866

98.863

98.865

1024

100.00

98.870

98.870

98.870

1280

100.00

98.863

98.861

98.862

1518

100.00

98.855

98.855

98.855

Table 12-151 lists the latency specifications of the N2EGS2. The values are obtained when
the SmartApplication is set as follows:

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 1.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

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Figure 1.3 Latency specifications of the N2EGS2


Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,01) to
(01,01,02) (us)CT (us)

Average
(CT) (us)

(01,01,01) to
(01,01,02)
(us)-S&F (us)

Average
(S&F) (us)

64

1.00

555.8

555.8

555.3

555.3

128

1.00

615.2

615.2

614.2

614.2

256

1.00

734.6

734.6

732.6

732.6

512

1.00

914.0

914.0

909.9

909.9

1024

1.00

1313.7

1313.7

1305.6

1305.6

1280

1.00

1523.1

1523.1

1512.9

1512.9

1518

1.00

1706.6

1706.6

1694.4

1694.4

Table 12-152 lists the back-to-back specifications of the N2EGS2. The values are obtained
when the SmartApplication is set as follows:

Test duration (sec): 10

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.4 Back-to-back specifications of the N2EGS2


Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,01,02) Burst
Size (Number of
Frames)

(01,01,02) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

1236

1236

2472

128

100.00

1321

1323

2644

256

100.00

1070

1070

2140

512

100.00

934

934

1868

1024

100.00

468

468

936

1280

100.00

458

458

916

1518

100.00

450

453

903

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The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGS2 board of the N3 version.

Figure 12-39 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N3EGS2.
Figure 1.2 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications of the N3EGS2
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-153 lists the throughput specifications of the N3EGS2. Table 12-154 lists the packet
loss ratio in the case of overloading of the N3EGS2. Table 12-155 lists the latency
specifications of the N3EGS2. Table 12-156 lists the back-to-back specifications of the
N3EGS2.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and 12 VC-3s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-153 lists the throughput specifications of the N3EGS2. The values are obtained
when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 1%.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

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Number of pairs: 1

Initial rate (%): 58

Maximum rate (%): 65

Mode: Uni-directional

12 EoS Boards

Figure 1.5 Throughput specifications of the N3EGS2


Frame Size
(byte)

Passed Rate (%)

(01,04,01) to (01,04,02)
(pks/sec)

Total (pks/sec)

64

60.00

892857

892857

128

58.73

496032

496032

256

57.98

262605

262605

512

58.08

136463

136463

1024

58.00

69444

69444

1280

58.04

55804

55804

1518

58.04

47170

47170

Table 12-154 lists the packet loss ratio in the case of overloading of the N3EGS2. The values
are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.6 Packet loss ratio in the case of overloading of the N3EGS2
Frame Size
(byte)

Rate Tested (%)

(01,04,01) to (01,04,02)
(%)

Average (%)

64

100.00

39.033

39.033

128

100.00

40.323

40.323

256

100.00

41.081

41.081

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Frame Size
(byte)

Rate Tested (%)

(01,04,01) to (01,04,02)
(%)

Average (%)

512

100.00

41.492

41.492

1024

100.00

41.703

41.703

1280

100.00

41.744

41.744

1518

100.00

41.769

41.769

Table 12-155 lists the latency specifications of the N3EGS2. The values are obtained when
the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 10 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: Cut Through (or FIFO),S&F: Store & Forward (or LIFO)

Measure on one receiving card only, Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 1.00

Maximum rate (%): 60.00

Step rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.7 Latency specifications of the N3EGS2


Frame
Size
(byte)

Rate
Tested
(%)

(01,04,01) to
(01,04,02) (us)CT (us)

Average
(CT) (us)

(01,04,01) to
(01,04,02)
(us)-S&F (us)

Average
(S&F) (us)

64

60.00

89.9

89.9

89.4

89.4

128

58.73

94.8

94.8

93.8

93.8

256

57.98

97.4

97.4

95.3

95.3

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Frame
Size
(byte)

Rate
Tested
(%)

(01,04,01) to
(01,04,02) (us)CT (us)

Average
(CT) (us)

(01,04,01) to
(01,04,02)
(us)-S&F (us)

Average
(S&F) (us)

512

58.08

108.9

108.9

104.9

104.9

1024

58.00

123.4

123.4

115.3

115.3

1280

58.04

129.2

129.2

119.0

119.0

1518

58.04

138.0

138.0

125.8

125.8

Table 12-156 lists the back-to-back specifications of the N3EGS2. The values are obtained
when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 1 on the SmartApplication.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 60.00

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.8 Back-to-back specifications of the N3EGS2


Frame Size
(byte)

Rate Tested (%)

(01,04,01) to (01,04,02)
Burst Size (frames)

Total (frames)

64

60.00

1785714

1785714

128

58.73

992064

992064

256

57.98

525210

525210

512

58.08

272926

272926

1024

58.00

138888

138888

1280

58.04

111608

111608

1518

58.04

94340

94340

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1.1.1.1.1119 Mechanical Specifications


The mechanical specifications of the EGS2 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N2EGS2 (kg): 1.0

Weight of the N3EGS2 (kg): 0.6

1.1.1.1.1120 Power Consumption


The maximum power consumption of the N2EGS2 at room temperature (25C) is 43 W.
The maximum power consumption of the N3EGS2 at room temperature (25C) is 25 W.

12.8 EMS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMS2 (2xGE and 16xFE switching and processing board). This
topic also describes how to configure and commission the EMS2.

12.8.1 Version Description


The EMS2 is available in one functional version, namely, N1.

12.8.2 Application
The EMS2 is used to transmit/receive Ethernet services, manage bandwidths, and realize
Layer 2 switching of Ethernet services.
Figure 12-40 shows the typical networking and application of the Ethernet switching board.
the Ethernet switching board accesses and converges Ethernet services, and provides the
Ethernet data with the following data features: Layer 2 switching, port isolation, flow
classification, traffic control, VLAN management, and priority configuration. In addition, the
Ethernet switching board performs encapsulation/decapsulation, virtual concatenation, and
SDH mapping/demapping for data. The Ethernet switching board can be interconnected with
the bandwidth access equipment and the data communication equipment at the same time,
thus to provide a network-level solution.

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Figure 1.1 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

When the service converging FE services into GE services is configured, the GE switching board can be
set only to the 1000M full-duplex mode, the VLAN of the convergence service is variable, and the
binding granularity can be at the VC-3 or VC-12 level.

12.8.3 Functions and Features


EMS2 boards support the Layer 2 switching, link convergence, and multicast functions.
Table 12-157 lists the functions and features supported by EMS2 boards.
Figure 1.1 Functions and features supported by EMS2 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 2xGE and 16xFE services.

Port
types

Issue 02 (2013-01-18)

Supports 1000BASE-SX/LX/ZX/VX Ethernet optical ports. The optical ports


support the auto-negotiation function in compliance with IEEE 802.3z. The
optical ports use pluggable SFP optical modules. When the multi-mode optical
fiber is used, the maximum transmission distance is 550 m. When the singlemode optical fiber is used, the maximum transmission distance is 10 km. The
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ion
and
Featu
re

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Description

optical modules that can meet different requirements for the transmission
distance such as 40 km and 80 km can also be used.

Supports 1000BASE-T RJ-45 Ethernet electrical ports. The electrical ports


support the auto-negotiation function. The negotiated rate can be 10 Mbit/s,
100 Mbit/s, or 1000 Mbit/s. The board supports pluggable SFP electrical ports.
The maximum transmission distance is 100 m.

Supports 10BASE-T/100BASE-TX signals when working with an ETF8 board


and supports 100BASE-FX signals when working with an EFF8 board. The
electrical ports comply with IEEE 802.3u.

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides 16 electrical ports to receive/transmit FE signals when working with


an ETF8 board.

Provides 16 optical ports to receive/transmit FE signals when working with an


EFF8 board.

Provides 8 electrical ports to receive/transmit FE signals when working with


an ETF8 board, and provides 8 optical ports to receive/transmit FE signals
when working with an EFF8 board.

Port
charac
teristic
s

Working
modes

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GE electrical port: auto-negotiation, 1000M full-duplex, 100M


full-duplex, and 10M full-duplex

GE optical port: auto-negotiation and 1000M full-duplex

FE electrical port: auto-negotiation, 100M full-duplex, 100M halfduplex, 10M full-duplex, and 10M half-duplex (This working
mode is supported only when the EMS2 board works with the
ETF8 board.)

FE optical port: 100M full-duplex (This working mode is


supported only when the EMS2 board works with the EFF8
board.)

Traffic
control at
ports

Auto-negotiation mode

Supported (Not supported by FE


optical ports)

Non-autonegotiation mode

Supported

Query/Se
tting of
port
status

Supported

Query of
port
types

Supported

Setting
of optical
power

Not supported

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Description

threshold
s

Servic
e
catego
ries

Pluggabl
e optical
module

Supports SFP optical modules.

EPL
service

Supports PORT-based transparent transmission.

EVPL
service

Supports PORT-shared EVPL services.

Supports VCTRUNK-shared EVPL services.

EPLAN
service

EVPLA
N service

Servic
e
specifi
cation
s

Issue 02 (2013-01-18)

The services are isolated by VLAN tags.

The services are isolated by MPLS tags.

The services are isolated by QinQ tags.

Supports a maximum of 4096 links.

Supports the blacklist that can contain 2K records and also the
static MAC address table that can contain 2K records. The sum of
the number of records in the blacklist and the number of addresses
in the static MAC address table must not exceed 2K. The blacklist
function supports verification of destination MAC addresses only.

Supports the self-learning of the source MAC address. The


capacity of the MAC address table is 16K. The aging time of the
MAC address can be set and queried.

Supports the configuration of static MAC routes.

Supports the query of dynamic MAC addresses.

The maximum number of supported VBs is 16. The maximum


number of logical ports for each VB is 66.

Supports the EPLAN services that are based on the IEEE 802.1d
MAC bridge.

Supports data isolation based on VB+VLAN.

Supports the configuration of up to 4096 VLAN services.

Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge and IEEE 802.1ad virtual bridge.

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1q/p

Supported

Frame
length
range

Supports the setting of the frame length to a value ranging from


1518 bytes to 9600 bytes.

Supports a jumbo frame with a maximum length of 9600 bytes.

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Funct
ion
and
Featu
re

Protec
tion
schem
es

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Description

Bound
bandwidt
h

48xVC-3, or 252xVC-12 + 36xVC-3

Concaten
ation
granulari
ties

VC-3, VC-12-Xv (X 63), VC-3-Xv (X 12).

Encapsul
ation
formats

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

2.5 Gbit/s

VCTRU
NK
specificat
ions

Number of supported VCTRUNKs: 48


Configuration principles are as follows:

VC-4s numbered 4, 8, 12, and 16 support the binding of VC-3 and


VC-12 paths. The other VC-4s support the binding of VC-3 paths
only.

A VC-4 cannot be bound with VC-3 and VC-12 paths at the same
time.

TPS

Not supported

BPS

Not supported

PPS

Not supported

DLAG

Not supported

LAG

Supports manual link aggregation and load sharing link aggregation


in compliance with IEEE 802.3ad and IEEE 802.1AX.

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT and P2MP LPT in compliance with ITU-T G.7042.

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Funct
ion
and
Featu
re

Synch
roniza
tion

Maint
enanc
e
featur
es

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Description

STP/RST
P

Supports the broadcast packet suppression function and RSTP, which


comply with IEEE 802.1w.

MSTP

Not supported

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported

ETH
OAM

Supports CC, LB tests, and LT tests in compliance with IEEE


802.1ag, LM and DM in compliance with ITU-T Y.1731, and
OAM ping in compliance with Huawei proprietary protocol.

Supports OAM auto-discovery, remote loopbacks, fault detection,


and link performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei proprietary
protocol.

Test
Frame

Supports test frames in Ethernet/GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

Supports ingress mirroring.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Supports inloops.

MAC layer at Ethernet ports

Supports inloops.

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

RMON

Supports RMON of the Ethernet performance of Ethernet ports and


VCTRUNKs.

Warm
resets

Supported (Warm resets do not affect services.)

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

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QoS

Supports the CAR. The granularity is 64 kbit/s.

Supports the flow classification based on PORT, PORT+VLAN,


PORT+SVLAN, and PORT+VLAN+PRI.

IGMP
snoopi
ng

Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Supported

Discardi
ng of
unknown
broadcast
packets

Supported

Static
broadcast
entry

Supported

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Traffic
contro
l

Supports the port-based traffic control function that complies with IEEE 802.3x.

Traffic
monit
oring

Supports port-based and VCTRUNK-based traffic monitoring.

12.8.4 Working Principle and Signal Flow


The EMS2 consists of the Ethernet access module, network processor module, mapping
module, interface converting module, logic and control module, clock module, and power
module.
Figure 12-41 shows the functional block diagram of the EMS2 by describing how to process
1xGE/FE signals.

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Figure 1.1 Functional block diagram of the EMS2


Backplane

Cross-connect unit
Interface
converting
module

VCP

DENCP

Network processor module


Laser
shutdown

ENCP

Network Control Switch


processor
fabric
Data

GE/FE Ethernet
access
module

Cross-connect unit

Mapping module

LOS

Communication

Logic and
control module

Reference clock and frame header

+3.3 V
Clock module
50
77
MHz MHz

Power
module

Power
module

Fuse

SCC unit
SCC unit

-48 V/-60 V
-48 V/-60 V

125 155
MHz MHz

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

1.1.1.1.1121 Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or
routers are converted into electrical signals. If the signals are accessed through electrical
interfaces, O/E conversion is not required. At the PHY layer, the electrical signals are decoded
and the ETH_LOS alarm is detected. The electrical signals are converted from serial signals
into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded and converted from electrical signals to optical signals.

1.1.1.1.1122 Network Processor Module


The network processor module consists of the network processor and switch fabric. The
network processor first performs MAC functions, which include code conversion, framing of
Ethernet packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The Ethernet/VLAN format is supported.
The network processor module supports the following functions:

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Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

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1.1.1.1.1123 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP-F, or
HDLC format. The concatenation is performed. The LCAS function is supported. Then, the
Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

1.1.1.1.1124 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1125 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

1.1.1.1.1126 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

1.1.1.1.1127 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
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require.

12.8.5 Front Panel


The front panel of the EMS2 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1128 Diagram of the Front Panel


Figure 12-42 shows the appearance of the front panel of the EMS2 that has the GE optical
interface.
Figure 1.1 Front panel of the EMS2 that has the GE optical interface

EMS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

EMS2

Figure 12-43 shows the appearance of the front panel of the EMS2 that has the GE electrical
interface.

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Figure 1.2 Front panel of the EMS2 that has the GE electrical interface

EMS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

OUT1
IN1
OUT2
IN2

EMS2

1.1.1.1.1129 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1130 Interfaces
The front panel of the EMS2 has two interfaces. Table 12-158 describes the types and usage
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of the interfaces of the EMS2 when the EMS2 has the optical interfaces. When the EMS2 has
the electrical interfaces, the two GE electrical interfaces are of the same type and have the
same usage. Table 12-159 describes the types and usage of the electrical interfaces of the
EMS2.
Figure 1.1 Optical interfaces of the EMS2
Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT2/IN2

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

Figure 1.2 Electrical interfaces of the EMS2


Interface

Type of
Interface

Usage

GE

RJ-45
(swappable)

Transmits and receives 1000BASE-T signals.

Table 12-160 provides the pin assignments of the RJ-45 interface of the EMS2.
Figure 1.3 Pin assignments of the RJ-45 interface of the EMS2
Pin

Description

BI_DA+

BI_DA

BI_DB+

BI_DC+

BI_DC

BI_DB

BI_DD+

BI_DD

12.8.6 Jumpers and DIP Switches


The EMS2 does not have any jumpers or DIP switches that are used for board settings.

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12.8.7 Valid Slots


The EMS2 must be installed in a valid slot in the subrack. Otherwise, the EMS2 cannot work
normally.
The EMS2 can be used with the ETF8 and EFF8.
The EMS2 can be installed in slots 16 and 1316. In this case, the bandwidth is 2.5 Gbit/s.
Table 12-161 lists the slots valid for the EMS2 and the corresponding slots for the ETF8 and
EFF8.
Figure 1.4 Slots valid for the EMS2 and the corresponding slots for the ETF8 and EFF8
Slot Valid for the EMS2

Corresponding Slots for the ETF8 and EFF8

Slot 1

Without an interface board

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 6

Without an interface board

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

12.8.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EMS2 indicates the type of interface.
Table 12-162 provides the relationship between the feature code of the EMS2 and the type of
interface.
Figure 1.5 Relationship between the feature code of the EMS2 and the type of interface
Board

Feature Code

Type of Interface

SSN1EMS210

10

1000BASE-ZX (80 km)

SSN1EMS211

11

1000BASE-SX (0.5 km)

SSN1EMS212

12

1000BASE-LX (10 km)

SSN1EMS213

13

1000BASE-VX (40 km)

SSN1EMS214

14

1000BASE-T (100 m)

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12.8.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1131 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1132 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring Ethernet Services.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the Layer 2 switching management service, including the following
tasks:
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Configuring the IGMP Snooping Protocol

Configuring the Spanning Tree

Setting the Aging Time for the Multicast Router Port

12 EoS Boards

Step 9 Optional: Configure the QoS. For details, see Configuring QoS.
Step 10 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Creating a LAG.
Step 11 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

1.1.1.1.1133 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.1134 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 12 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

12.8.10 Configuring the Board Functions


The EMS2 supports multiple Ethernet functions and features such as Layer 2 switching,
LCAS, and LPT. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EMS2 by using the U2000:

LCAS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

IGMP Snooping

12.8.11 Parameter Settings


You can set parameters for the EMS2 by using the U2000.
You can use set the following main parameters for the EMS2 by using the U2000:
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Working mode

LCAS

Maximum frame length

Mapping protocol

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For information about more parameters and the description of each parameter, see 26
Parameter Settings.

12.8.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1135 Troubleshooting
Table 12-163 lists the faults that occur on the EMS2 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EMS2 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

The negotiated working mode


of the Ethernet ports is the
half-duplex mode.

Bit errors occur on the line


side.

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Transient service
interruption

Packet loss

Interconnection
fault

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


Packet Loss.

See Troubleshooting Device


Interconnection Faults.

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1.1.1.1.1136 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EMS2, see Replacing an EOS Board.

12.8.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

12.8.13.1 Alarms of N1EMS2


ALM_GFP_dCSF

ALM_GFP_dLFD

B3_EXC_VC3

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

COMMUN_FAIL

ETH_LOS

ETH_NO_FLOW

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETHOAM_RMT_LOOP

ETHOAM_DISCOVER_FAI
L

ETHOAM_RMT_CRIT_FA
ULT

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

ETHOAM_RMT_SD

FPGA_ABN

HARD_BAD

FLOW_OVER

HP_LOM

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_RDI_VC3

LP_RDI_VC12

LP_REI_VC3

LP_REI_VC12

LP_SLM_VC3

LP_SLM_VC12

LP_TIM_VC3

LP_TIM_VC12

LP_UNEQ_VC3

LP_UNEQ_VC12

LPT_RFI

LSR_NO_FITED

LTEMP_OVER

MOD_TYPE_MISMATCH

NO_BD_SOFT

PORT_MODULE_OFFLIN
E

SUBCARD_ABN

IN_PWR_HIGH

IN_PWR_LOW

OUT_PWR_HIGH

OUT_PWR_LOW

T_LOSEX

TD

TEMP_OVER

TF

TR_LOC

TU_AIS_VC12

TU_AIS_VC3

TU_LOP_VC12

TU_LOP_VC3

LSR_WILL_DIE

VCAT_LOM_VC12

VCAT_LOM_VC3

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VCAT_LOA

VCAT_SQM_VC12

VCAT_SQM_VC3

VCTRUNK_NO_FLOW

FCS_ERR

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_LO
OP

VCAT_LOM_VC4

WRG_BD_TYPE

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

AU_AIS

AU_LOP

B3_EXC_VC4

B3_SD_VC4

VCAT_SQM_VC4

PORTMODE_MISMATCH

12.8.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

12.8.14.1 Performance Events of N1EMS2


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

BDTEMPCUR

BDTEMPMAX

BDTEMPMIN

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

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Figure 1.2 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

Figure 1.3 Statistics of RMON basic performance


ETHCOL

ETHDROP

ETHFRG

ETHJAB

ETHOVER

ETHUNDER

RXBRDCAST

RXMULCAST

RXOCTETS

RXPKT1024

RXPKT128

RXPKT256

RXPKT512

RXPKT64

RXPKT65

RXPKTS

Figure 1.4 Statistics of RMON extended performance


ETHALI

ETHFCS

RXFULLBGOOD

RXGOODFULLFRAMESP
EED

RXUNICAST

TXBGOOD

TXBRDCAST

TXFULLBGOOD

TXGOODFULLFRAMESP
EED

TXMULCAST

TXPKT1024

TXPKT128

TXPKT256

TXPKT512

TXPKT64

TXPKT65

TXUNICAST

12.8.15 Technical Specifications


The technical specifications of the EMS2 include the parameters specified for optical
interfaces, laser safety class, dimensions, weight, and power consumption.

1.1.1.1.1137 Parameters Specified for Optical Interfaces


Table 12-168 lists the parameters specified for the optical interfaces of the EMS2.
Figure 1.1 Parameters specified for the optical interfaces of the EMS2
Parameter

Value

Type of optical

1000BASE-ZX

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1000BASE-SX
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Parameter

Value

interface

(80 km)

VX (40 km)

LX (10 km)

(0.5 km)

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

Launched optical
power range
(dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength range
(nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

Receiver
sensitivity (dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

Maximum -20
dB spectral width
(nm)

Minimum side
mode
suppression ratio
(dB)

30

30

1.1.1.1.1138 Ethernet Electrical Interfaces


Table 12-169 lists the parameters specified for the electrical interfaces of the EMS2.
Figure 1.1 Parameters specified for the electrical interfaces of the EMS2
Type of Interface

Code Type

1000BASE-T

4D-PAM5

1.1.1.1.1139 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EMS2 board of the N1 version.

Figure 12-44 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
EMS2.
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Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-170 and Table 12-171 list the throughput specifications of the EMS2. Table 12-172
and Table 12-173 list the packet loss ratio in the case of overloading of the EMS2. Table 12174 and Table 12-175 list the latency specifications of the EMS2. Table 12-176 and Table 12177 list the back-to-back specifications of the EMS2.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and three VC-3s is bound on the FE port, or EPL services are configured and 48 VC-12s
are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-170 lists the throughput specifications of the EMS2 (three VC-3s is bound on the FE
port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): none

Mode: Uni-directional

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Figure 1.1 Throughput specifications of the EMS2 (three VC-3s is bound on the FE port)
Frame Size
(byte)

Passed Rate (%)

(01,09,01) to (01,09,02)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

128

100.00

84459

84459

256

100.00

45290

45290

512

100.00

23496

23496

1024

100.00

11973

11973

1280

100.00

9615

9615

1518

100.00

8127

8127

Table 12-171 lists the throughput specifications of the EMS2 (48 VC-12s are bound on the
GE port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: Uni-directional

Figure 1.2 Throughput specifications of the EMS2 (48 VC-12s are bound on the GE port)
Frame Size
(byte)

Passed Rate (%)

(01,05,01) to (01,05,02)
(pks/sec)

Total (pks/sec)

64

11.41

169837

339674

128

10.82

91374

182748

256

10.19

46160

92320

512

10.20

23965

47930

1024

10.20

12212

24424

1280

10.20

9809

19618

1518

10.20

8288

16576

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Table 12-172 lists the packet loss ratio in the case of overloading of the EMS2 (three VC-3s is
bound on the FE port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 5 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.3 Packet loss ratio in the case of overloading of the EMS2 (three VC-3s is bound on the
FE port)
Frame Size
(byte)

Rate Tested (%)

(01,09,01) to (01,09,02)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-173 lists the packet loss ratio in the case of overloading of the EMS2 (48 VC-12s are
bound on the GE port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

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Initial rate (%): 11.41

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

12 EoS Boards

Figure 1.4 Packet loss ratio in the case of overloading of the EMS2 (48 VC-12s are bound on the
GE port)
Frame Size
(byte)

Rate Tested (%)

(01,05,01) to (01,05,02)
(%)

Average (%)

64

11.41

0.000

0.000

128

10.82

0.000

0.000

256

10.19

0.000

0.000

512

10.20

0.000

0.000

1024

10.20

0.000

0.000

1280

10.20

0.000

0.000

1518

10.20

0.000

0.000

Table 12-174 lists the latency specifications of the EMS2 (three VC-3s is bound on the FE
port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 10 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

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Figure 1.5 Latency specifications of the EMS2 (three VC-3s is bound on the FE port)
Frame
Size
(byte)

Rate
Tested
(%)

(01,09,01) to
(01,09,02) (us)CT (us)

Average
(CT) (us)

(01,09,01) to
(01,09,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

127.1

127.1

121.9

121.9

128

100.00

144.1

144.1

133.9

133.9

256

100.00

172.2

172.2

151.8

151.8

512

100.00

215.3

215.3

174.4

174.4

1024

100.00

299.8

299.8

217.8

217.8

1280

100.00

341.7

341.7

239.3

239.3

1518

100.00

377.1

377.1

255.7

255.7

Table 12-175 lists the latency specifications of the EMS2 (48 VC-12s are bound on the GE
port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 100 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 11.41

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.6 Latency specifications of the EMS2 (48 VC-12s are bound on the GE port)
Frame
Size
(byte)
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Rate
Tested
(%)

(01,03,01) to
(01,03,02) (us)CT (us)

Average
(CT) (us)

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(01,03,01) to
(01,03,02)
(us)-S&F (us)

Average
(S&F) (us)
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Frame
Size
(byte)

Rate
Tested
(%)

(01,03,01) to
(01,03,02) (us)CT (us)

Average
(CT) (us)

(01,03,01) to
(01,03,02)
(us)-S&F (us)

Average
(S&F) (us)

128

10.82

663.9

663.9

662.8

662.8

256

10.19

683.6

683.6

681.6

681.6

512

10.20

717.3

717.3

713.3

713.3

1024

10.20

789.6

789.6

781.5

781.5

1280

10.20

822.1

822.1

811.9

811.9

1518

10.20

846.9

846.9

834.8

834.8

Table 12-176 lists the back-to-back specifications of the EMS2 (three VC-3s is bound on the
FE port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 1 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 2 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.7 Back-to-back specifications of the EMS2 (three VC-3s is bound on the FE port)
Frame Size
(byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
Burst Size (frames)

Total (frames)

64

100.00

297620

297620

128

100.00

168918

168918

256

100.00

90580

90580

512

100.00

46992

46992

1024

100.00

23946

23946

1280

100.00

19230

19230

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Frame Size
(byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
Burst Size (frames)

Total (frames)

1518

100.00

16254

16254

Table 12-177 lists the back-to-back specifications of the EMS2 (48 VC-12s are bound on the
GE port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 1 on the Smart Application.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 11.41

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.8 Back-to-back specifications of the EMS2 (48 VC-12s are bound on the GE port)
Frame Size
(byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
Burst Size (frames)

Total (frames)

64

11.41

339674

679348

128

10.82

182748

365496

256

10.19

92320

184640

512

10.20

47930

95860

1024

10.20

24424

48848

1280

10.20

19610

39220

1518

10.20

16576

33152

1.1.1.1.1140 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

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1.1.1.1.1141 Mechanical Specifications


The mechanical specifications of the EMS2 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.8

1.1.1.1.1142 Power Consumption


The maximum power consumption of the EMS2 at room temperature (25C) is 40 W.

12.9 EMS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMS4 (4xGE and 16xFE switching and processing board). This
topic also describes how to configure and commission the EMS4.

12.9.1 Version Description


The EMS4 is available in one functional version, namely, N1.

12.9.2 Application
The EMS4 is used to transmit/receive Ethernet services, manage bandwidths, and realize
Layer 2 switching of Ethernet services.
Figure 12-45 shows the typical networking and application of the Ethernet switching board.
the Ethernet switching board accesses and converges Ethernet services, and provides the
Ethernet data with the following data features: Layer 2 switching, port isolation, flow
classification, traffic control, VLAN management, and priority configuration. In addition, the
Ethernet switching board performs encapsulation/decapsulation, virtual concatenation, and
SDH mapping/demapping for data. The Ethernet switching board can be interconnected with
the bandwidth access equipment and the data communication equipment at the same time,
thus to provide a network-level solution.

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Figure 1.1 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

When the service converging FE services into GE services is configured, the GE switching board can be
set only to the 1000M full-duplex mode, the VLAN of the convergence service is variable, and the
binding granularity can be at the VC-3 or VC-12 level.

12.9.3 Functions and Features


EMS4 boards support the Layer 2 switching, link convergence, and multicast functions.
Table 12-178 lists the functions and features supported by EMS4 boards.
Figure 1.1 Functions and features supported by EMS4 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 4xGE and 16xFE services

Port
types

Issue 02 (2013-01-18)

Supports 1000BASE-SX/LX/ZX/VX Ethernet optical ports. The optical ports


support the auto-negotiation function in compliance with IEEE 802.3z. The
optical ports use SFP optical modules. When the multi-mode optical fiber is
used, the maximum transmission distance is 550 m. When the single-mode
optical fiber is used, the maximum transmission distance is 10 km. The optical
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Funct
ion
and
Featu
re

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Description

modules that can meet different requirements for the transmission distance
such as 40 km and 80 km can also be used.

Supports 1000BASE-T RJ-45 Ethernet electrical ports. The electrical ports


support the auto-negotiation function. The negotiated rate can be 10 Mbit/s,
100 Mbit/s, or. 1000 Mbit/s. EMS4 boards support SFP electrical ports and hot
swapping. The maximum transmission distance is 100 m.

Supports 10BASE-T/100BASE-TX signals when working with an ETF8 board


and supports 100BASE-FX signals when working with an EFF8 board. The
electrical/optical ports comply with IEEE 802.3u.

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides 16 electrical ports to receive/transmit FE signals when working with


an ETF8 board.

Provides 16 optical ports to receive/transmit FE signals when working with an


EFF8 board.

Provides 8 electrical ports to receive/transmit FE signals when working with


an ETF8 board, and provides 8 optical ports to receive/transmit FE signals
when working with an EFF8 board.

Port
charac
teristic
s

Working
modes

1000M full-duplex

Traffic
control at
ports

Auto-negotiation mode

Supported

Non-autonegotiation mode

Not supported

Query/Se
tting of
port
status

Supported

Query of
port
types

Supported

Setting
of optical
power
threshold
s

Not supported

Pluggabl
e optical
module

Supports SFP optical modules.

EPL
service

Supports PORT-based transparent transmission.

EVPL

Servic
e
catego
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Supports PORT-shared EVPL services.

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Funct
ion
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Featu
re

Description

ries

service

EPLAN
service

EVPLA
N service

Servic
e
specifi
cation
s

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12 EoS Boards

Supports VCTRUNK-shared EVPL services.

The services are isolated by VLAN tags.

The services are isolated by MPLS tags.

The services are isolated by QinQ tags.

Supports a maximum of 8000 links.

Supports the blacklist that can contain 512 records and also the
static MAC address table that can contain 512 records. The
blacklist function supports verification of destination MAC
addresses only.

Supports the self-learning of the source MAC address. The


capacity of the MAC address table is 128K. The aging time of the
MAC address can be set and queried.

Supports the configuration of static MAC routes.

Supports the query of dynamic MAC addresses.

The maximum number of supported VBs is 2. The maximum


number of logical ports for each VB is 40.

Supports the EPLAN services that are based on the IEEE 802.1d
MAC bridge.

Supports data isolation based on VB+VLAN.

Supports the setting of a maximum of 4000 VLAN services.

Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge and IEEE 802.1ad provider bridge.

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1 q/p

Supported

Frame
length
range

Supports the setting of the frame length to a value ranging from


1518 bytes to 9216 bytes.

Supports a jumbo frame with a maximum length of 9216 bytes.

Bound
bandwidt
h

16xVC-4, or 48xVC-3, or 1008xVC-12

Concaten
ation
granulari
ties

VC-12, VC-3, VC-4, VC-12-Xv (X 64), VC-3-Xv (X 24), and


VC-4-Xv (X 8).

Encapsul

HDLC

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Funct
ion
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Featu
re

Protec
tion
schem
es

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Description

ation
formats

LAPS

Supported

GFP-F

Supported

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

2.5 Gbit/s.

VCTRU
NK
specificat
ions

Number of VCTRUNKs: 64

TPS

Not supported

BPS

Supported

PPS

Supported

DLAG

Supported

LAG

Supports manual link aggregation and static link aggregation.

Notes for configuration:


The maximum bandwidth of a VCTRUNK is 1.256 Gbit/s. A
VCTRUNK can be bound to a maximum of eight VC-4s, 24 VC-3s,
or 63 VC-12s.

Supports the load sharing mode and load non-sharing mode.


Complies with IEEE 802.3ad and IEEE 802.1AX.

Synch
roniza
tion

Issue 02 (2013-01-18)

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT and P2MP LPT in compliance with ITU-T G.7042.

STP/RST
P

Supports the broadcast packet suppression function and RSTP, which


comply with IEEE 802.1w.

MSTP

Supported

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported

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Funct
ion
and
Featu
re

Description

Maint
enanc
e
featur
es

ETH
OAM

QoS

IGMP
snoopi
ng

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Supports CC, LB tests, and LT tests in compliance with IEEE


802.1ag, LM and DM in compliance with ITU-T Y.1731, and
OAM ping in compliance with Huawei proprietary protocol.

Supports OAM auto-discovery, remote loopbacks, fault detection,


and link performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei proprietary
protocol.

Test
Frame

Supports test frames in GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

Not supported

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Supports inloops.

MAC layer at Ethernet ports

Not supported

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

RMON

Supports RMON of the Ethernet performance of Ethernet ports and


VCTRUNKs.

Warm
resets

Supported

Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Supports the CAR. The granularity is 64 kbit/s.

Supports the flow classification based on PORT, PORT+VLAN, or


PORT+SVLAN.

Protocol
enabling

Supported

Port
aging
time

Supported

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Funct
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Featu
re

Traffic
contro
l

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Description

Fast
leave

Supported

Discardi
ng of
unknown
broadcast
packets

Supported

Static
broadcast
entry

Supported

Supports the port-based traffic control function that complies with IEEE 802.3x.

12.9.4 Working Principle and Signal Flow


The EMS4 consists of the Ethernet access module, network processor module, mapping
module, interface converting module, logic and control module, clock module, and power
module.
Figure 12-46 shows the functional block diagram of the EMS4 by describing how to process
1xGE/FE signals.

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Figure 1.1 Functional block diagram of the EMS4


Backplane

Cross-connect unit
Interface
converting
module

VCP

DENCP

Network processor module


Laser
shutdown

ENCP

Network Control Switch


processor
fabric
Data

GE/FE Ethernet
access
module

Cross-connect unit

Mapping module

LOS

Communication

Logic and
control module

Reference clock and frame header

+3.3 V
Clock module
50
77
MHz MHz

Power
module

Power
module

Fuse

SCC unit
SCC unit

-48 V/-60 V
-48 V/-60 V

125 155
MHz MHz

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

1.1.1.1.1143 Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or
routers are converted into electrical signals. If the signals are accessed through electrical
interfaces, O/E conversion is not required. At the PHY layer, the electrical signals are decoded
and the ETH_LOS alarm is detected. The electrical signals are converted from serial signals
into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded and converted from electrical signals to optical signals.

1.1.1.1.1144 Network Processor Module


The network processor module consists of the network processor and switch fabric. The
network processor first performs MAC functions, which include code conversion, framing of
Ethernet packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The Ethernet/VLAN format is supported.
The network processor module supports the following functions:

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Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

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1.1.1.1.1145 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP-F, or
HDLC format. The concatenation is performed. The LCAS function is supported. Then, the
Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

1.1.1.1.1146 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1147 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

1.1.1.1.1148 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

1.1.1.1.1149 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
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require.

12.9.5 Front Panel


The front panel of the EMS4 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1150 Diagram of the Front Panel


Figure 12-47 shows the appearance of the front panel of the EMS4 that has the GE optical
interface.
Figure 1.1 Front panel of the EMS4 that has the GE optical interface

EMS4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
LINK ACT
1
2
3
4

EMS4

Figure 12-48 shows the appearance of the front panel of the EMS4 that has the GE electrical
interface.

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Figure 1.2 Front panel of the EMS4 that has the GE electrical interface

EMS4
STAT
ACT
PROG
SRV

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
LINK ACT
1
2
3
4

EMS4

1.1.1.1.1151 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1152 Interfaces
The front panel of the EMS4 has four interfaces. Table 12-179 describes the types and usage
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of the optical interfaces of the EMS4. When the EMS4 has the electrical interfaces, the four
GE electrical interfaces are of the same type and have the same usage. Table 12-180 describes
the types and usage of the electrical interfaces of the EMS4.
Figure 1.1 Optical interfaces of the EMS4
Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT2/IN2

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT3/IN3

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT4/IN4

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

Figure 1.2 Electrical interfaces of the EMS4


Interface

Type of
Interface

Usage

GE

RJ-45
(swappable)

Transmits and receives 1000BASE-T signals.

Table 12-181 provides the pin assignments of the RJ-45 interface of the EMS4.
Figure 1.3 Pin assignments of the RJ-45 interface of the EMS4
Pin

Description

BI_DA+

BI_DA

BI_DB+

BI_DC+

BI_DC

BI_DB

BI_DD+

BI_DD

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12.9.6 Jumpers and DIP Switches


The EMS4 does not have any jumpers or DIP switches that are used for board settings.

12.9.7 Valid Slots


The EMS4 must be installed in a valid slot in the subrack. Otherwise, the EMS4 cannot work
normally.
The EMS4 can be used with the ETF8 and EFF8.
The EMS4 can be installed in slots 16 and 1316. When the EMS4 is installed in slots 14,
15, and 16, the bandwidth is 1.25 Gbit/s. When the EMS4 is installed in slots 5, 6, 13, and 14,
the bandwidth is 2.5 Gbit/s.
Table 12-182 lists the slots valid for the EMS4 and the corresponding slots for the ETF8 and
EFF8.
Figure 1.4 Slots valid for the EMS4 and the corresponding slots for the ETF8 and EFF8
Slot Valid for the EMS4

Corresponding Slots for the ETF8 and EFF8

Slot 1

Without an interface board

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 6

Without an interface board

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

12.9.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EMS4 indicates the type of interface.
Table 12-183 provides the relationship between the feature code of the EMS4 and the type of
interface.
Figure 1.5 Relationship between the feature code of the EMS4 and the type of interface
Board

Feature Code

Type of Interface

SSN1EMS410

10

1000BASE-LX (0.5 km)

SSN1EMS411

11

1000BASE-SX (10 km)

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Board

Feature Code

Type of Interface

SSN1EMS412

12

1000BASE-VX (40 km)

SSN1EMS413

13

1000BASE-ZX (80 km)

SSN1EMS414

14

1000BASE-T (100 m)

12.9.9 Board Protection


The EMS4 supports the BPS, PPS, and distributed link aggregation group (DLAG) protection.

1.1.1.1.1153 Protection Principle


When the BPS protection is provided for the EMS4, the GE and FE ports are protected by
using the single-fed and selective-receiving scheme. The EMS4 has four GE ports and 16 FE
ports and hence may be connected to many sets of communication equipment. Normally, the
active board is working and services are transmitted in two directions of the active link. On
the standby link, the EMS4 disables the transmission of all ports. In this case, the ports of the
opposite board are in the link-down state. In addition, the opposite board enables the
transmission but does not transmit services. In this manner, the receive ports of the standby
EMS4 are not in the link-down state. The solid lines in Figure 12-49 show how the EMS4
normally works.

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Figure 1.1 Normal working of the EMS4

No.1

Active
EMS4

Active
communication
equipment

Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EMS4

No.3

Active
communication
equipment
Standby
communication
equipment

BPS Protection

When the BPS protection is provided, if the active board detects the link-down state of any
link, any fault in the board, or the offline state of any board, the cross-connect board switches
all the services to the standby board. In this manner, services are protected. The solid lines in
Figure 12-50 show how the BPS protection functions. The services numbered 1, 2 and 3 are
all switched to the standby EMS4 and the corresponding communication equipment.

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Figure 1.2 Principle of the BPS protection for the EMS4

No.1

Active
EMS4

Active
communication
equipment
Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EMS4

No.3

Active
communication
equipment
Standby
communication
equipment

PPS Protection

When the PPS protection is provided, if the active board detects the link-down state of any
link, the cross-connect board switches all the services to the standby board. In this manner,
services are protected. The solid lines in Figure 12-51 show how the PPS protection functions.
Only the service numbered 1 is switched to the standby EMS4 and the standby
communication equipment.

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Figure 1.3 Principle of the PPS protection for the EMS4

No.1

Active
communication
equipment

Active
EMS4

Standby
communication
equipment

No.2

No.3
Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EMS4

No.3

Active
communication
equipment

Standby
communication
equipment

In the case of the PPS, when a link failure occurs on a port, only the link services on the port are
switched generally. If the services of two ports are associated, for example, the services of port IP1 and
port IP2 are converged into the same VCTRUNK, port IP1 and port IP2 are defined as associated ports.
When one port of the associated ports is faulty, the services of the entire associated port group are
switched.

DLAG Protection

The DLAG is a group where the two mapping ports on two identical boards are aggregated to
from a protection group, providing 1+1 protection for the ports. By default, the port on the
active board is working, and the port on the standby board is protecting the working port.
When the DLAG is configured, the cross-connect board switches all services from the active
board to the standby board if the active board detects a link failure on a port, a board offline
event, or a board hardware failure. As shown in Figure 12-52, the services carried on port 1
are switched to port 1 of the standby EMS4 and the associated equipment.

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Figure 1.4 Principle of the DLAG protection for the EMS4

PORT1

Active

PORT2

EMS4

PORT3

Active
communication
equipment

1#

A
2#

Standby
communication
equipment

VCG
3#

XCS
1#

Active
communication
equipment
Standby
communication
equipment

VCG
2#
PORT1

Standby
EMS4

PORT2
PORT3
3#

Active
communication
equipment
Standby
communication
equipment

When the board-level BPS/PPS protection is performed, the FE ports support only the 100M
full-duplex mode and the GE optical ports support the auto-negotiation and 1000M fullduplex mode.

1.1.1.1.1154 Board Configuration


Two EMS4 boards should be configured on an NE to provide the board-level protection. One
EMS4 is the active board and the other is the standby board. When you configure the EMS4
board protection, ensure that the access capacity of the slot that houses the standby board
must not be less than the access capacity of the slot that houses the active board.

12.9.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1155 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

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All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1156 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring Ethernet Services.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the Layer 2 switching management service, including the following
tasks:

Configuring the IGMP Snooping Protocol

Configuring the Spanning Tree

Setting the Aging Time for the Multicast Router Port

Step 9 Optional: Configure the QoS. For details, see Configuring QoS.
Step 10 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Creating a LAG.
Step 11 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

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1.1.1.1.1157 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.1158 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 12 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

12.9.11 Configuring the Board Functions


The EMS4 supports multiple Ethernet functions and features such as Layer 2 switching,
LCAS, and LPT. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EMS4 by using the U2000:

LCAS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

MSTP

IGMP Snooping

12.9.12 Parameter Settings


You can set parameters for the EMS4 by using the U2000.
You can set the following main parameters for the EMS4 by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

12.9.13 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
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also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1159 Troubleshooting
Table 12-184 lists the faults that occur on the EMS4 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EMS4 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

The negotiated working mode


of the Ethernet ports is the
half-duplex mode.

Bit errors occur on the line


side.

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Transient service
interruption

Packet loss

Interconnection
fault

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


Packet Loss.

See Troubleshooting Device


Interconnection Faults.

1.1.1.1.1160 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EMS4, see Replacing an EOS Board.

12.9.14 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .
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12.9.14.1 Alarms of N1EMS4


B3_SD_VC4

ALM_GFP_dCSF

ALM_GFP_dLFD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

BD_STATUS

BIP_EXC

BIP_SD

BOOTROM_BAD

COMMUN_FAIL

ETH_LOS

ETHOAM_RMT_LOOP

ETHOAM_DISCOVER_FAI
L

ETHOAM_RMT_CRIT_FA
ULT

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

ETHOAM_RMT_SD

FPGA_ABN

HARD_BAD

FLOW_OVER

HP_LOM

HP_RDI

HP_CROSSTR

HP_SLM

HP_TIM

HP_REI

LASER_MOD_ERR

LCAS_PLCR

HP_UNEQ

LCAS_TLCR

LCAS_TLCT

LCAS_PLCT

LOOP_ALM

LP_CROSSTR

LINK_ERR

LP_RDI_VC3

LP_REI

LP_RDI

LP_SLM

LP_SLM_VC3

LP_REI_VC3

LP_TIM_VC3

LP_UNEQ

LP_TIM

LPT_RFI

LSR_NO_FITED

LP_UNEQ_VC3

LTEMP_OVER

NO_BD_SOFT

LSR_WILL_DIE

SUBCARD_ABN

LAG_PORT_FAIL

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

TD

TEMP_OVER

TF

TU_AIS

TU_AIS_VC3

TU_LOP

TU_LOP_VC3

VC3_CROSSTR

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_LOM_VC4

VCAT_SQM_VC12

VCAT_SQM_VC3

VCAT_SQM_VC4

ETH_NO_FLOW

VCTRUNK_NO_FLOW

W_R_FAIL

TR_LOC

T_LOSEX

PORTMODE_MISMATCH

ETHOAM_VCG_SELF_LO
OP

DLAG_PROTECT_FAIL

ETHOAM_SELF_LOOP

MOD_TYPE_MISMATCH

PORT_MODULE_OFFLI
NE

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IN_PWR_HIGH

IN_PWR_LOW

OUT_PWR_HIGH

OUT_PWR_LOW

SWDL_PKG_NOBDSOFT

ETH_CFM_MISMERGE

ETH_CFM_UNEXPERI

ETH_CFM_LOC

ETH_CFM_RDI

WRG_BD_TYPE

12.9.15 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

12.9.15.1 Performance Events of N1EMS4


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

TPLCUR

RPLMAX

RPLMIN

RPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Figure 1.2 RMON alarm


UndersizePkts

OversizePkts

LateCollisions

DeferredTransmissions

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Figure 1.3 Statistics of RMON basic performance


Broadcast Packets
Received(packets)

Multicast Packets
Received(packets)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Figure 1.4 Statistics of RMON extended performance


Unicast Packets
Received(packets)

Unicast Packets
Transmitted(packets)

Pause Frames Received(frames)

Pause Frames
Transmitted(frames)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Good Octets
Received(Byte)

Good Octets
Transmitted(Byte)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Figure 1.5 Statistics of RMON VCG performance


Octets Received(Byte)

Octets Transmitted(Byte)

Packets Received(packets)

Packets
Transmitted(packets)

Good Packets
Received(packets)

Good Packets
Transmitted(packets)

Full Frame Speed


Received(Byte/s)

Full Frame Speed


Transmitted(Byte/s)

12.9.16 Technical Specifications


The technical specifications of the EMS4 include the parameters specified for optical
interfaces, laser safety class, Ethernet performance specifications, mechanical specifications,
and power consumption.

1.1.1.1.1161 Parameters Specified for Optical Interfaces


Table 12-190 lists the parameters specified for the optical interfaces of the EMS4.
Figure 1.1 Parameters specified for the optical interfaces of the EMS4
Parameter

Value

Type of optical
interface

1000BASE-ZX
(80 km)

1000BASEVX (40 km)

1000BASELX (10 km)

1000BASE-SX
(0.5 km)

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

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Parameter

Value

Launched optical
power range
(dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength range
(nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

Receiver
sensitivity (dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

Maximum -20
dB spectral width
(nm)

Minimum side
mode
suppression ratio
(dB)

30

30

1.1.1.1.1162 Ethernet Electrical Interfaces


Table 12-191 lists the parameters specified for the electrical interfaces of the EMS4.
Figure 1.1 Parameters specified for the electrical interfaces of the EMS4
Type of Interface

Code Type

1000BASE-T

4D-PAM5

1.1.1.1.1163 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1164 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EMS4 board of the N1 version.

Figure 12-53 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
EMS4.
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Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-192 and Table 12-193 list the throughput specifications of the EMS4. Table 12-194
and Table 12-195 list the packet loss ratio in the case of overloading of the EMS4. Table 12196 and Table 12-197 list the latency specifications of the EMS4. Table 12-198 and Table 12199 list the back-to-back specifications of the EMS4.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and one VC-4 is bound on the FE port, or EPL services are configured and 24 VC-3s are
bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-192 lists the throughput specifications of the EMS4 (one VC-4 is bound on the FE
port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): none

Mode: Uni-directional

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Figure 1.1 Throughput specifications of the EMS4 (one VC-4 is bound on the FE port)
Frame Size
(Byte)

Passed Rate (%)

(01,01,03) to (01,01,06)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

128

100.00

84459

84459

256

100.00

45290

45290

512

100.00

23496

23496

1024

100.00

11973

11973

1280

100.00

9615

9615

1518

100.00

8127

8127

Table 12-193 lists the throughput specifications of the EMS4 (24 VC-3s are bound on the GE
port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: Uni-directional

Figure 1.2 Throughput specifications of the EMS4 (24 VC-3s are bound on the GE port)
Frame Size
(Byte)

Passed Rate (%)

(01,03,01) to (01,03,02)
(pks/sec)

Total (pks/sec)

64

100.00

1488095

1488095

128

100.00

844595

844595

256

100.00

452899

452899

512

100.00

234962

234962

1024

100.00

119732

119732

1280

100.00

96154

96154

1518

100.00

81274

81274

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Table 12-194 lists the packet loss ratio in the case of overloading of the EMS4 (one VC-4 is
bound on the FE port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.3 Packet loss ratio in the case of overloading of the EMS4 (one VC-4 is bound on the FE
port)
Frame Size
(Byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-195 lists the packet loss ratio in the case of overloading of the EMS4 (24 VC-3s are
bound on the GE port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

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Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

12 EoS Boards

Figure 1.4 Packet loss ratio in the case of overloading of the EMS4 (24 VC-3s are bound on the
GE port)
Frame Size
(Byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-196 lists the latency specifications of the EMS4 (one VC-4 is bound on the FE port).
The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

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Figure 1.5 Latency specifications of the EMS4 (one VC-4 is bound on the FE port)
Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,03) to
(01,01,06) (us)CT (us)

Average
(CT) (us)

(01,01,03) to
(01,01,06)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

110.6

110.6

105.5

105.5

128

100.00

123.8

123.8

113.6

113.6

256

100.00

149.2

149.2

128.8

128.8

512

100.00

195.5

195.5

154.6

154.6

1024

100.00

285.6

285.6

203.7

203.7

1280

100.00

344.6

344.6

240.5

240.5

1518

100.00

373.1

373.1

251.7

251.7

Table 12-197 lists the latency specifications of the EMS4 (24 VC-3s are bound on the GE
port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.6 Latency specifications of the EMS4 (24 VC-3s are bound on the GE port)
Frame
Size
(Byte)
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Rate
Tested
(%)

(01,03,01) to
(01,03,02) (us)CT (us)

Average
(CT) (us)

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(01,03,01) to
(01,03,02)
(us)-S&F (us)

Average
(S&F) (us)
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Frame
Size
(Byte)

Rate
Tested
(%)

(01,03,01) to
(01,03,02) (us)CT (us)

Average
(CT) (us)

(01,03,01) to
(01,03,02)
(us)-S&F (us)

Average
(S&F) (us)

128

100.00

83.0

83.0

82.0

82.0

256

100.00

86.9

86.9

84.9

84.9

512

100.00

94.9

94.9

90.9

90.9

1024

100.00

108.8

108.8

100.7

100.7

1280

100.00

115.2

115.2

105.0

105.0

1518

100.00

120.7

120.7

108.6

108.6

Table 12-198 lists the back-to-back specifications of the EMS4 (one VC-4 is bound on the FE
port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.7 Back-to-back specifications of the EMS4 (one VC-4 is bound on the FE port)
Frame Size
(Byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
Burst Size (Number of
Frames)

Total (Number of
Frames)

64

100.00

1488100

1488100

128

100.00

844590

844590

256

100.00

452900

452900

512

100.00

234960

234960

1024

100.00

119730

119730

1280

100.00

96150

96150

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Frame Size
(Byte)

Rate Tested (%)

(01,01,03) to (01,01,06)
Burst Size (Number of
Frames)

Total (Number of
Frames)

1518

100.00

81270

81270

Table 12-199 lists the back-to-back specifications of the EMS4 (24 VC-3s are bound on the
GE port). The values are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 50 on the Smart Application.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.8 Back-to-back specifications of the EMS4 (24 VC-3s are bound on the GE port)
Frame Size
(Byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
Burst Size (Number of
Frames)

Total (Number of
Frames)

64

100.00

2976190

2976190

128

100.00

1689190

1689190

256

100.00

905798

905798

512

100.00

469924

469924

1024

100.00

239464

239464

1280

100.00

192308

192308

1518

100.00

162548

162548

1.1.1.1.1165 Mechanical Specifications


The mechanical specifications of the EMS4 are as follows:
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Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.1

12 EoS Boards

1.1.1.1.1166 Power Consumption


The maximum power consumption of the EMS4 at room temperature (25C) is 65 W.

12.10 EGS4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGS4 (4xGE switching and processing board). This topic also
describes how to configure and commission the EGS4.

12.10.1 Version Description


The EGS4 is available in three functional versions, namely, N1, N3 and N4. The N3EGS4 is
discontinued.
Table 12-200 describes the versions of the EGS4.
Figure 1.1 Versions of the EGS4
Item

Description

Functional versions

The EGS4 is available in three functional versions, namely, N1, N3


and N4.

Differences

Regarding interface specifications: interface types

Regarding service specifications: bound bandwidth, VCTRUNK


specifications

Protection schemes: MSTP

Regarding maintenance features: ETH OAM

QoS

Traffic monitoring

Substitution

The N4EGS4 can substitute for the N3EGS4.

12.10.2 Application
The EGS4 is used to transmit/receive Ethernet services, manage bandwidths, and realize
Layer 2 switching of Ethernet services.
Figure 12-54 shows the typical networking and application of the Ethernet switching board.
the Ethernet switching board accesses and converges Ethernet services, and provides the
Ethernet data with the following data features: Layer 2 switching, port isolation, flow
classification, traffic control, VLAN management, and priority configuration. In addition, the
Ethernet switching board performs encapsulation/decapsulation, virtual concatenation, and
SDH mapping/demapping for data. The Ethernet switching board can be interconnected with
the bandwidth access equipment and the data communication equipment at the same time,
thus to provide a network-level solution.
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Figure 1.1 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

When the service converging FE services into GE services is configured, the GE switching board can be
set only to the 1000M full-duplex mode, the VLAN of the convergence service is variable, and the
binding granularity can be at the VC-3 or VC-12 level.

12.10.3 Functions and Features


EGS4 boards support the Layer 2 switching, link aggregation, and multicast functions.
Table 12-201 lists the functions and features supported by EGS4 boards.
Figure 1.2 Functions and features supported by EGS4 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits and processes 4xGE services.

Port
types

Issue 02 (2013-01-18)

EGS4 boards support 1000BASE-SX/LX/ZX/VX Ethernet optical ports. The


optical ports support the auto-negotiation function in compliance with IEEE
802.3z. The optical ports use SFP optical modules. When the multi-mode
optical fiber is used, the maximum transmission distance is 550 m. When the
single-mode optical fiber is used, the maximum transmission distance is 10
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ion
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Featu
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Description

km. The optical modules that can meet different requirements for the
transmission distance such as 40 km and 80 km can also be used.

N1EGS4 and N4EGS4 boards also support 1000BASE-T Ethernet electrical


ports. The electrical ports support the auto-negotiation function. N1EGS4
boards support the negotiated rate of 1000 Mbit/s and N4EGS4 boards support
the negotiated rate of 10 Mbit/s, 100 Mbit/s, or 1000 Mbit/s. N1EGS4 and
N4EGS4 boards support SFP electrical ports and hot swapping. The maximum
transmission distance is 100 m.

Functi
ons
when
being
used
with
an
interfa
ce
board

Provides ports on the front panel.

Port
charac
teristic
s

Working
modes

Servic
e
Issue 02 (2013-01-18)

GE electrical port (available only on N1EGS4 and N4EGS4


boards): auto-negotiation, 1000M full-duplex, 100M full-duplex,
and 10M full-duplex.

GE optical port: auto-negotiation and 1000M full-duplex.

Traffic
control at
ports

Auto-negotiation mode

Supported

Non-autonegotiation mode

Supported

Query/Se
tting of
port
status

Supported

Query of
port
types

Supported

Setting
of optical
power
threshold
s

Not supported

Pluggabl
e optical
module

Supports SFP optical modules.

EPL
service

Supports PORT-based transparent transmission.

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Funct
ion
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Description

catego
ries

EVPL
service

EPLAN
service

EVPLA
N service

Servic
e
specifi
cation
s

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12 EoS Boards

Supports PORT-shared EVPL services.

Supports VCTRUNK-shared EVPL services.

The services are isolated by VLAN tags.

The services are isolated by QinQ tags.

Supports a maximum of 8000 links.

Supports switching on the client and SDH sides.

Supports the blacklist that can contain 512 records and also the
static MAC address table that can contain 512 records. The
blacklist function supports verification of destination MAC
addresses only.

Supports the self-learning of the source MAC address. The


capacity of the MAC address table is 128K. The aging time of the
MAC address can be set and queried.

Supports the configuration of static MAC routes.

Supports the query of dynamic MAC addresses.

N1EGS4/N3EGS4 supports a maximum of two VBs. The


maximum number of logical ports for each VB is 68.

N4EGS4 supports a maximum of 16 VBs. The maximum number


of logical ports for each VB is 68.

Queries the number of actually learned MAC addresses based on


VB+VLAN or VB+LP.

Supports the EPLAN services that are based on the IEEE 802.1d
MAC bridge.

Supports data isolation based on VB+VLAN.

Supports the setting of a maximum of 4000 VLAN services.

Supports the EVPLAN services that are based on the IEEE 802.1q
virtual bridge and IEEE 802.1ad provider bridge.

Formats
of
Ethernet
data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1 q/p

Supported

Frame
length
range

Supports the setting of the frame length to a value ranging from


1518 bytes to 9216 bytes.

Supports a jumbo frame with a maximum length of 9216 bytes.

Bound
bandwidt
h

N1EGS4: 16xVC-4, or 48xVC-3, or 1008xVC-12

N3EGS4/N4EGS4: 16xVC-4, or 48xVC-3, or 504xVC-12

Concaten
ation

VC-12, VC-3, VC-4, VC-12-Xv (X 64), VC-3-Xv (X 24), and

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ion
and
Featu
re

Protec
tion
schem
es

12 EoS Boards

Description

granulari
ties

VC-4-Xv (X 8).

Encapsul
ation
formats

HDLC

Supported

LAPS

Supported

GFP-F

Supported

MPLS
technolo
gy

Not supported

VLAN
technolo
gy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maximu
m uplink
bandwidt
h

2.5 Gbit/s

VCTRU
NK
specificat
ions

64
Configuration principles are as follows:

VC-4s numbered 1-4 and 9-12 of the N3EGS4/N4EGS4 support


the binding of VC-3 and VC-12 paths. The other VC-4s support
the binding of VC-3 paths only.

VC-4s numbered 1-8 and VC-4s numbered 9-16 of the


N3EGS4/N4EGS4 belong to two areas. VC-4 binding must not
span the two areas. A maximum of 8 VC-4s can be bound to one
VCTRUNK.

VC-4s numbered 1-4 and VC-4s numbered 9-12 of the


N3EGS4/N4EGS4 belong to two areas. VC-12 binding must not
span the two areas.

TPS

Not supported

BPS

Supported

PPS

Supported

DLAG

Supported

LAG

Supports manual link aggregation and static link aggregation.


Supports the load sharing mode and load non-sharing mode.
Complies with IEEE 802.3ad and IEEE 802.1AX.

Issue 02 (2013-01-18)

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT and P2MP LPT in compliance with ITU-T G.7042.
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Funct
ion
and
Featu
re

Synch
roniza
tion

Maint
enanc
e
featur
es

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Description

STP/RST
P

Supports the RSTP, which complies with IEEE 802.1w.

MSTP

The N1EGS4 supports the MSTP.

Synchron
ous
Ethernet

Not supported

IEEE
1588v2

Not supported

ETH
OAM

N1EGS4/N3EGS4 boards support CC and LB tests in compliance


with IEEE 802.1ag.

N4EGS4 boards support CC, LB tests, and LT tests in compliance


with IEEE 802.1ag, LM and DM in compliance with ITU-T
Y.1731, and OAM ping in compliance with Huawei proprietary
protocol.

Supports OAM auto-discovery, remote loopbacks, fault detection,


and link performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei proprietary
protocol (N1EGS4/N3EGS4 boards can only initiate remote
loopbacks).

Test
Frame

Supports test frames in GFP bearer mode.

Response
to ping

Not supported

Port
mirroring

N4EGS4 boards support ingress mirroring.

Loopbac
k
capabilit
y

PHY layer at Ethernet ports

Supports inloops.

MAC layer at Ethernet ports

Not supported

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

RMON

Supports RMON of the Ethernet performance of Ethernet ports and


VCTRUNKs.

Warm
resets

Supported (Warm resets do not affect services.)

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ion
and
Featu
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QoS

IGMP
snoopi
ng

12 EoS Boards

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Cold
resets

Supported

Alarms
and
performa
nce
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Supports the CAR. The granularity is 64 kbit/s. N1EGS4 boards support 512
rate modes, and N3EGS4 and N4EGS4 boards support 60 rate modes.

Supports the flow classification based on PORT, PORT+VLAN, or


PORT+SVLAN.

Protocol
enabling

Supported

Port
aging
time

Supported

Fast
leave

Supported by N4EGS4 boards

Discardi
ng of
unknown
broadcast
packets

Supported by N4EGS4 boards

Static
broadcast
entry

Not supported

Traffic
contro
l

Supports the port-based traffic control function that complies with IEEE 802.3x.

Traffic
monit
oring

N4EGS4 boards support port-based and VCTRUNK-based traffic monitoring.

12.10.4 Working Principle and Signal Flow


The EGS4 consists of the Ethernet access module, network processor module, mapping
module, interface converting module, logic and control module, clock module, and power
module.
Figure 12-55 shows the functional block diagram of the EGS4 by describing how to process
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1xGE signals.
Figure 1.1 Functional block diagram of the EGS4
Backplane

Cross-connect unit
Interface
converting
module

VCP

Laser
shutdown

DENCP

Network processor module

ENCP

Network Control Switch


processor
fabric
Data

GE Ethernet
access
module

Cross-connect unit

Mapping module

LOS

Communication

Logic and
control module

Reference clock and frame header

+3.3 V
Clock module
50
77
MHz MHz

Power
module

Power
module

Fuse

SCC unit
SCC unit

-48 V/-60 V
-48 V/-60 V

125 155
MHz MHz

1.1.1.1.1167 Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or
routers are converted into electrical signals. If the signals are accessed through electrical
interfaces, O/E conversion is not required. At the PHY layer, the electrical signals are decoded
and the ETH_LOS alarm is detected. The electrical signals are converted from serial signals
into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded and converted from electrical signals to optical signals.

1.1.1.1.1168 Network Processor Module


The network processor module consists of the network processor and switch fabric. The
network processor first performs MAC functions, which include code conversion, framing of
Ethernet packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The Ethernet/VLAN format is supported.
The network processor module supports the following functions:

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

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Setting of data priorities

WFQ

Three CoSs

12 EoS Boards

1.1.1.1.1169 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP-F, or
HDLC format. The concatenation is processed. The LCAS function is supported. Then, the
Ethernet signals are converted into SDH signals.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the network processor module in packets.

1.1.1.1.1170 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1171 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module has the following functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

1.1.1.1.1172 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 155 MHz.

1.1.1.1.1173 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

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12.10.5 Front Panel


The front panel of the EGS4 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1174 Diagram of the Front Panel


Figure 12-56 shows the appearance of the front panel of the N1EGS4/N3EGS4/N4EGS4 that
has the optical interface.
Figure 1.1 Front panel of the N1EGS4/N3EGS4/N4EGS4 that has the optical interface

EGS4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
LINK ACT
1
2
3
4

EGS4

The N1EGS4/N4EGS4 can also has the GE electrical interface. Figure 12-57 shows the
appearance of the front panel of the N1EGS4/N4EGS4 that has the GE electrical interface.

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Figure 1.2 front panel of the N1EGS4/N4EGS4 that has the GE electrical interface

EGS4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
LINK ACT
1
2
3
4

EGS4

1.1.1.1.1175 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1176 Interfaces
The front panel of the N1EGS4/N3EGS4/N4EGS4 has four GE optical interfaces. Table 12Issue 02 (2013-01-18)

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202 describes the types and usage of the optical interfaces of the N1EGS4/N3EGS4/N4EGS4.
Figure 1.1 Optical interfaces of the N1EGS4/N3EGS4/N4EGS4
Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT2/IN2

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT3/IN3

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

OUT4/IN4

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX/VX


signals.

The four GE electrical interfaces of the N1EGS4/N4EGS4 are of the same type and have the
same usage. Table 12-203 describes the types and usage of the electrical interfaces of the
N1EGS4/N4EGS4.
Figure 1.2 Electrical interfaces of the N1EGS4/N4EGS4
Interface

Type of
Interface

Usage

GE

RJ-45
(swappable)

Transmits and receives 1000BASE-T signals.

Table 12-204 provides the pin assignments of the RJ-45 interface of the N1EGS4/N4EGS4.
Figure 1.3 Pin assignments of the RJ-45 interface of the N1EGS4/N4EGS4
Pin

Description

BI_DA+

BI_DA

BI_DB+

BI_DC+

BI_DC

BI_DB

BI_DD+

BI_DD

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12.10.6 Jumpers and DIP Switches


The EGS4 does not have any jumpers or DIP switches that are used for board settings.

12.10.7 Valid Slots


The EGS4 must be installed in a valid slot in the subrack. Otherwise, the EGS4 cannot work
normally.
When the EGS4 is installed in slots 14, 15, and 16, the bandwidth is 1.25 Gbit/s. When the
EGS4 is installed in slots 58 and 1114, the bandwidth is 2.5 Gbit/s.

12.10.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EGS4 indicates the type of interface.
Table 12-205 provides the relationship between the feature code of the EGS4 and the type of
interface.
Figure 1.4 Relationship between the feature code of the EGS4 and the type of interface
Board

Feature Code

Type of Interface

SSN1EGS410,
SSN3EGS410, and
SSN4EGS10

10

1000BASE-SX (0.5 km)

SSN1EGS411,
SSN3EGS411, and
SSN4EGS411

11

1000BASE-LX (10 km)

SSN1EGS412,
SSN3EGS412, and
SSN4EGS412

12

1000BASE-VX (40 km)

SSN1EGS413,
SSN3EGS413, and
SSN4EGS413

13

1000BASE-ZX (80 km)

SSN1EGS414 and
SSN4EGS414

14

1000BASE-T (100 m)

12.10.9 Board Protection


The EGS4 supports the BPS, PPS, and DLAG protection.

1.1.1.1.1177 Protection Principle


When the BPS protection is provided for the EGS4, the GE and FE ports are protected by
using the single-fed and selective-receiving scheme. The EGS4 may be connected to many
sets of communication equipment. Normally, the active board is working and services are
transmitted in two directions of the active link. On the standby link, the EGS4 disables the
transmission of all ports. In this case, the ports of the opposite board are in the link-down
state. In addition, the opposite board enables the transmission but does not transmit services.
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In this manner, the receive ports of the standby EGS4 are not in the link-down state. The solid
lines in Figure 12-58 show how the EGS4 normally works.
Figure 1.1 Normal working of the EGS4

No.1

Active
EGS4

Active
communication
equipment
Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EGS4

No.3

Active
communication
equipment
Standby
communication
equipment

BPS Protection

When the BPS protection is provided, if the active board detects the link-down state of any
link, any fault in the board, or the offline state of any board, the cross-connect board switches
all the services to the standby board. In this manner, services are protected. The solid lines in
Figure 12-59 show how the BPS protection functions. The services numbered 1, 2 and 3 are
all switched to the standby EGS4 and the corresponding communication equipment.

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Figure 1.2 Principle of the BPS protection for the EGS4

No.1

Active
EGS4

Active
communication
equipment
Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EGS4

No.3

Active
communication
equipment
Standby
communication
equipment

PPS Protection

When the PPS protection is provided, if the active board detects the link-down state of any
link, the cross-connect board switches all the services to the standby board. In this manner,
services are protected. The solid lines in Figure 12-60 show how the PPS protection functions.
Only the service numbered 1 is switched to the standby EGS4 and the standby communication
equipment.

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Figure 1.3 Principle of the PPS protection for the EGS4

No.1

Active
communication
equipment

Active
EGS4

Standby
communication
equipment

No.2

No.3
Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EGS4

No.3

Active
communication
equipment

Standby
communication
equipment

In the case of the PPS, when a link failure occurs on a port, only the link services on the port are
switched generally. If the services of two ports are associated, for example, the services of port IP1 and
port IP2 are converged into the same VCTRUNK, port IP1 and port IP2 are defined as associated ports.
When one port of the associated ports is faulty, the services of the entire associated port group are
switched.

DLAG Protection

The DLAG is a group where the two mapping ports on two identical boards are aggregated to
from a protection group, providing 1+1 protection for the ports. By default, the port on the
active board is working, and the port on the standby board is protecting the working port.
When the DLAG is configured, the cross-connect board switches all services from the active
board to the standby board if the active board detects a link failure on a port, a board offline
event, or a board hardware failure. As shown in Figure 12-61, the services carried on port 1
are switched to port 1 of the standby EGS4 and the associated equipment.

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Figure 1.4 Principle of the DLAG protection for the EGS4

PORT1

Active

PORT2

EGS4

PORT3

1#

A
2#

Active
communication
equipment
Standby
communication
equipment

VCG
3#

XCS
1#

VCG
2#

Active
communication
equipment
Standby
communication
equipment

PORT1

Standby
EGS4

PORT2
PORT3
3#

Active
communication
equipment
Standby
communication
equipment

When the board-level protection is performed, the GE optical ports support the autonegotiation and 1000M full-duplex mode.

1.1.1.1.1178 Board Configuration


Two EGS4 boards should be configured on an NE to provide the board-level protection. One
EGS4 is the active board and the other is the standby board. When you configure the EGS4
board protection, ensure that the access capacity of the slot that houses the standby board
must not be less than the access capacity of the slot that houses the active board.

12.10.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1179 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

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Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1180 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring Ethernet Services.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the Layer 2 switching management service, including the following
tasks:

Configuring the IGMP Snooping Protocol

Configuring the Spanning Tree

Setting the Aging Time for the Multicast Router Port

Step 9 Optional: Configure the QoS. For details, see Configuring QoS.
Step 10 Optional: Configure the link aggregation function on the Ethernet port. For details, see
Creating a LAG.
Step 11 Optional: Configure the test frame. For details, see Configuring Test Frames.
----End

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1.1.1.1.1181 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.1182 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 12 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

12.10.11 Configuring the Board Functions


The EGS4 supports multiple Ethernet functions and features such as Layer 2 switching,
LCAS, and LPT. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EGS4 by using the U2000:

LCAS

LPT

LAG

ETH OAM

Test Frame

STP/RSTP

MSTP

IGMP Snooping
Only N1EGS4 supports MSTP.

12.10.12 Parameter Settings


You can set parameters for the EGS4 by using the U2000.
You can set the following main parameters for the EGS4 by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

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12.10.13 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1183 Troubleshooting
Table 12-206 lists the faults that occur on the EGS4 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EGS4 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

The negotiated working mode


of the Ethernet ports is the
half-duplex mode.

Bit errors occur on the line


side.

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Transient service
interruption

Packet loss

Interconnection
fault

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


Packet Loss.

See Troubleshooting Device


Interconnection Faults.

1.1.1.1.1184 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EGS4, see Replacing an EOS Board.

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12.10.14 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

12.10.14.1 Alarms of N1EGS4


ALM_GFP_dCSF

ALM_GFP_dLFD

ETHOAM_RMT_SD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_SD_VC4

B3_EXC_VC4

B3_SD_VC3

BIP_SD

BD_STATUS

BIP_EXC

ETH_LOS

BOOTROM_BAD

COMMUN_FAIL

FLOW_OVER

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

HP_CROSSTR

FPGA_ABN

HARD_BAD

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LCAS_PLCT

LASER_MOD_ERR

LCAS_PLCR

LINK_ERR

LCAS_TLCR

LCAS_TLCT

LP_RDI

LOOP_ALM

LP_CROSSTR

LP_REI_VC3

LP_RDI_VC3

LP_REI

LP_TIM

LP_SLM

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ

LSR_WILL_DIE

LPT_RFI

LSR_NO_FITED

OUT_PWR_HIGH

LTEMP_OVER

NO_BD_SOFT

IN_PWR_LOW

OUT_PWR_LOW

IN_PWR_HIGH

TD

ETHOAM_DISCOVER_FAIL

ETHOAM_RMT_CRIT_FA
ULT

TU_AIS

TEMP_OVER

TF

TU_LOP_VC3

TU_AIS_VC3

TU_LOP

VCAT_LOM_VC12

VC3_CROSSTR

VCAT_LOA

VCAT_SQM_VC12

VCAT_LOM_VC3

VCAT_LOM_VC4

VCAT_SQM_VC3

VCAT_SQM_VC4

ETHOAM_RMT_LOOP

W_R_FAIL

ETH_NO_FLOW

VCTRUNK_NO_FLOW

TR_LOC

T_LOSEX

LAG_PORT_FAIL

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_LOO

DLAG_PROTECT_FAIL

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P
PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

MOD_TYPE_MISMAT
CH

PORT_MODULE_OFFLINE

SWDL_PKG_NOBDSOFT

ETH_CFM_MISMERGE

ETH_CFM_UNEXPERI

ETH_CFM_LOC

ETH_CFM_RDI

WRG_BD_TYPE

12.10.14.2 Alarms of N3EGS4


ALM_GFP_dCSF

ALM_GFP_dLFD

ETHOAM_RMT_SD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_SD_VC4

B3_EXC_VC4

B3_SD_VC3

BIP_SD

BD_STATUS

BIP_EXC

ETH_LOS

BOOTROM_BAD

COMMUN_FAIL

FLOW_OVER

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNFL
CT

HP_CROSSTR

FPGA_ABN

HARD_BAD

HP_REI

HP_LOM

HP_RDI

HP_UNEQ

HP_SLM

HP_TIM

LCAS_PLCT

LASER_MOD_ERR

LCAS_PLCR

LINK_ERR

LCAS_TLCR

LCAS_TLCT

LP_RDI

LOOP_ALM

LP_CROSSTR

LP_REI_VC3

LP_RDI_VC3

LP_REI

LP_TIM

LP_SLM

LP_SLM_VC3

LP_UNEQ_VC3

LP_TIM_VC3

LP_UNEQ

LSR_WILL_DIE

LPT_RFI

LSR_NO_FITED

OUT_PWR_HIGH

LTEMP_OVER

NO_BD_SOFT

IN_PWR_LOW

OUT_PWR_LOW

IN_PWR_HIGH

TD

ETHOAM_DISCOVER_F
AIL

ETHOAM_RMT_CRIT_FAU
LT

TU_AIS

TEMP_OVER

TF

TU_LOP_VC3

TU_AIS_VC3

TU_LOP

VCAT_LOM_VC12

VC3_CROSSTR

VCAT_LOA

VCAT_SQM_VC12

VCAT_LOM_VC3

VCAT_LOM_VC4

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VCAT_SQM_VC3

VCAT_SQM_VC4

ETHOAM_RMT_LOOP

W_R_FAIL

DLAG_PROTECT_FAIL

VCTRUNK_NO_FLOW

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

ETH_NO_FLOW

LAG_PORT_FAIL

T_LOSEX

TR_LOC

SWDL_PKG_NOBDSOF
T

WRG_BD_TYPE

12.10.14.3 Alarms of N4EGS4


ALM_GFP_dCSF

ALM_GFP_dLFD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

B3_SD_VC4

BD_STATUS

BIP_EXC

BIP_SD

BOOTROM_BAD

COMMUN_FAIL

DLAG_PROTECT_FAIL

ETH_CFM_LOC

ETH_CFM_MISMERGE

ETH_CFM_RDI

ETH_CFM_UNEXPERI

ETH_LOS

ETH_NO_FLOW

ETHOAM_DISCOVER_FAI
L

ETHOAM_RMT_CRIT_FA
ULT

ETHOAM_RMT_LOOP

ETHOAM_RMT_SD

ETHOAM_SELF_LOOP

ETHOAM_VCG_SELF_L
OOP

EX_ETHOAM_CC_LOS

EX_ETHOAM_MPID_CNF
LCT

FCS_ERR

FLOW_OVER

FPGA_ABN

HARD_BAD

HP_CROSSTR

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_HIGH

IN_PWR_LOW

LAG_PORT_FAIL

LASER_MOD_ERR

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LINK_ERR

LOOP_ALM

LP_CROSSTR

LP_RDI

LP_RDI_VC3

LP_REI

LP_REI_VC3

LP_SLM

LP_SLM_VC3

LP_TIM

LP_TIM_VC3

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LP_UNEQ

LP_UNEQ_VC3

LPT_RFI

LSR_NO_FITED

LSR_WILL_DIE

LTEMP_OVER

MOD_TYPE_MISMATCH

NO_BD_SOFT

OUT_PWR_HIGH

OUT_PWR_LOW

PORT_MODULE_OFFLI
NE

T_LOSEX

TD

TEMP_OVER

TF

TR_LOC

TU_AIS

TU_AIS_VC3

TU_LOP

TU_LOP_VC3

VC3_CROSSTR

VCAT_LOA

VCAT_LOM_VC12

VCAT_LOM_VC3

VCAT_LOM_VC4

VCAT_SQM_VC12

VCAT_SQM_VC3

VCAT_SQM_VC4

VCTRUNK_NO_FLOW

W_R_FAIL

WRG_BD_TYPE

12.10.15 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

12.10.15.1 Performance Events of N1EGS4


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

RPLMAX

RPLMIN

RPLCUR

TPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

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XCSTMPCUR

12 EoS Boards

XCSTMPMAX

XCSTMPMIN

Figure 1.2 RMON alarm


UndersizePkts

OversizePkts

LateCollisions

DeferredTransmissions

FCSErrors

Figure 1.3 Statistics of RMON basic performance


Broadcast Packets
Received(packets)

Multicast Packets
Received(packets)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Figure 1.4 Statistics of RMON extended performance


Unicast Packets
Received(packets)

Unicast Packets
Transmitted(packets)

Pause Frames Received(frames)

Pause Frames
Transmitted(frames)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Good Octets
Received(Byte)

Good Octets
Transmitted(Byte)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Figure 1.5 Statistics of RMON VCG performance


Octets Received(Byte)

Octets Transmitted(Byte)

Packets Received(packets)

Packets
Transmitted(packets)

Good Packets
Received(packets)

Good Packets
Transmitted(packets)

Full Frame Speed


Received(Byte/s)

Full Frame Speed


Transmitted(Byte/s)

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12.10.15.2 Performance Events of N3EGS4


Figure 1.6 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

TLBMAX

TLBMIN

TLBCUR

TPLMAX

TPLMIN

RPLMAX

RPLMIN

RPLCUR

TPLCUR

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

XCSTMPCUR

XCSTMPMAX

XCSTMPMIN

Figure 1.7 RMON alarm


UndersizePkts

OversizePkts

LateCollisions

DeferredTransmissions

FCSErrors

Figure 1.8 Statistics of RMON basic performance


Broadcast Packets
Received(packets)

Multicast Packets
Received(packets)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Figure 1.9 Statistics of RMON extended performance


Unicast Packets
Received(packets)
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Pause Frames
Transmitted(frames)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Good Octets
Received(Byte)

Good Octets
Transmitted(Byte)

FCS Errors(frames)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Figure 1.10 Statistics of RMON VCG performance


Octets Received(Byte)

Octets Transmitted(Byte)

Packets Received(packets)

Packets
Transmitted(packets)

Good Packets
Received(packets)

Good Packets
Transmitted(packets)

Full Frame Speed


Received(Byte/s)

Full Frame Speed


Transmitted(Byte/s)

12.10.15.3 Performance Events of N4EGS4


Figure 1.11 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPFEUAS

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPFEUAS

LPSES

LPUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3FEUAS

VC3SES

VC3UAS

BDTEMPCUR

BDTEMPMAX

BDTEMPMIN

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Figure 1.12 RMON alarm


UndersizePkts

OversizePkts

FCSErrors

Figure 1.13 Statistics of RMON basic performance


ETHOVER

ETHUNDER

RXBRDCAST

RXMULCAST

Figure 1.14 Statistics of RMON extended performance


ETHFCS

RXBGOOD

RXGOODFULLFRAMESP
EED

RXPAUSE

RXUNICAST

TXBGOOD

TXBRDCAST

TXGOODFULLFRAMESP
EED

TXMULCAST

TXPAUSE

TXUNICAST

Figure 1.15 Statistics of RMON VCG performance


VCG_RXGOODPACKETS

VCG_RXOCTETS

VCG_RXPACKETS

VCG_RXSPEED

VCG_TXGOODPACKETS

VCG_TXOCTETS

VCG_TXPACKETS

VCG_TXSPEED

12.10.16 Technical Specifications


The technical specifications of the EGS4 include the parameters specified for optical
interfaces, laser safety class, Ethernet performance specifications, mechanical specifications,
and power consumption.

1.1.1.1.1185 Parameters Specified for Optical Interfaces


Table 12-222 lists the parameters specified for the optical interfaces of the EGS4.
Figure 1.1 Parameters specified for the optical interfaces of the EGS4
Parameter

Value

Type of optical
interface

1000BASE-ZX
(80 km)

1000BASEVX (40 km)

1000BASELX (10 km)

1000BASE-SX
(0.5 km)

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

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Parameter

Value

Launched optical
power range
(dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength range
(nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

Receiver
sensitivity (dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

30

1.1.1.1.1186 Parameters Specified for Electrical Interfaces


Table 12-223 lists the parameters specified for the electrical interfaces of the EGS4.
Figure 1.1 Parameters specified for the electrical interfaces of the EGS4
Type of Electrical Interface

Code Pattern

1000BASE-T

4D-PAM5

Only the EGS4 boards of the N1 and N4 versions support the GE electrical interfaces.

1.1.1.1.1187 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1188 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGS4 board of the N1 version.

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Figure 12-62 shows the connection for testing the throughput specifications, packet loss ratio
in the case of overloading, latency specifications, and back-to-back specifications of the
N1EGS4.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications of the N1EGS4
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-224 lists the throughput specifications of the N1EGS4. Table 12-225 lists the packet
loss ratio in the case of overloading of the N1EGS4. Table 12-226 lists the latency
specifications of the N1EGS4. Table 12-227 lists the back-to-back specifications of the
N1EGS4.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured 24 VC-3s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-224 lists the throughput specifications of the N1EGS4. The values are obtained
when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 0.1%.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 100.00

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Resolution rate (%): 1.00

Mode: Uni-directional

12 EoS Boards

Figure 1.1 Throughput specifications of the N1EGS4


Frame Size
(Byte)

Passed Rate (%)

(01,03,01) to (01,03,02)
(pks/sec)

Total (pks/sec)

64

100.00

1488095

1488095

128

100.00

844595

844595

256

100.00

452899

452899

512

100.00

234962

234962

1024

100.00

119732

119732

1280

100.00

96154

96154

1518

100.00

81274

81274

Table 12-225 lists the packet loss ratio in the case of overloading of the N1EGS4. The values
are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 60 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.2 Packet loss ratio in the case of overloading of the N1EGS4
Frame Size
(Byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
(%)

Average (%)

64

100.00

0.000

0.000

128

100.00

0.000

0.000

256

100.00

0.000

0.000

512

100.00

0.000

0.000

1024

100.00

0.000

0.000

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Frame Size
(Byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
(%)

Average (%)

1280

100.00

0.000

0.000

1518

100.00

0.000

0.000

Table 12-226 lists the latency specifications of the N1EGS4. The values are obtained when
the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 60 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.3 Latency specifications of the N1EGS4


Frame
Size
(Byte)

Rate
Tested
(%)

(01,03,01) to
(01,03,02) (us)CT (us)

Average
(CT) (us)

(01,03,01) to
(01,03,02)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

80.9

80.9

80.4

80.4

128

100.00

83.0

83.0

82.0

82.0

256

100.00

86.9

86.9

84.9

84.9

512

100.00

94.9

94.9

90.9

90.9

1024

100.00

108.8

108.8

100.7

100.7

1280

100.00

115.2

115.2

105.0

105.0

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Frame
Size
(Byte)

Rate
Tested
(%)

(01,03,01) to
(01,03,02) (us)CT (us)

Average
(CT) (us)

(01,03,01) to
(01,03,02)
(us)-S&F (us)

Average
(S&F) (us)

1518

100.00

120.7

120.7

108.6

108.6

Table 12-227 lists the back-to-back specifications of the N1EGS4. The values are obtained
when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 2 seconds, and the number of repetitions is
set to a value more than 50 on the SmartApplication.

The tested traffic is set to the wire speed.

The test duration is set to 10 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: Uni-directional

Figure 1.4 Back-to-back specifications of the N1EGS4


Frame Size
(Byte)

Rate Tested (%)

(01,03,01) to (01,03,02)
Burst Size (Number of
Frames)

Total (Number of
Frames)

64

100.00

2976190

2976190

128

100.00

1689190

1689190

256

100.00

905798

905798

512

100.00

469924

469924

1024

100.00

239464

239464

1280

100.00

192308

192308

1518

100.00

162548

162548

The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGS4 board of the N4 version.

Figure 12-63 shows the connection for testing the throughput specifications, packet loss ratio
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in the case of overloading, latency specifications, and back-to-back specifications of the


N4EGS4.
Figure 1.2 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications of the N4EGS4
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-228 lists the throughput specifications of the N4EGS4. Table 12-229 lists the packet
loss ratio in the case of overloading of the N4EGS4. Table 12-230 lists the latency
specifications of the N4EGS4. Table 12-231 lists the back-to-back specifications of the
N4EGS4.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and one VC-4 are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 12-228 lists the throughput specifications of the N4EGS4. The values are obtained
when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The permitted packet loss ratio is set to 0% and the resolution rate is set to 1%.

The test duration is set to 30 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 16.54

Maximum rate (%): 16.54

Mode: Uni-directional

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Figure 1.5 Throughput specifications of the N4EGS4


Frame Size
(byte)

Passed Rate (%)

(01,01,02) to (01,01,01)
(pks/sec)

Total (pks/sec)

64

16.54

246063

492126

128

15.81

133547

267094

256

15.40

69754

139508

512

15.20

35714

71428

1024

15.10

18074

36148

1280

15.07

14488

28976

1518

15.06

12238

24476

Table 12-229 lists the packet loss ratio in the case of overloading of the N4EGS4. The values
are obtained when the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The tested traffic starts from the throughput and increases to 100% in 10% steps.

The test duration is set to 30 seconds.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 16.54

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.6 Packet loss ratio in the case of overloading of the N4EGS4
Frame Size
(byte)

Rate Tested (%)

(01,01,02) to (01,01,01)
(%)

Average (%)

64

16.54

0.000

0.000

128

15.81

0.000

0.000

256

15.40

0.000

0.000

512

15.20

0.000

0.000

1024

15.10

0.000

0.000

1280

15.07

0.000

0.000

1518

15.06

0.000

0.000

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Table 12-230 lists the latency specifications of the N4EGS4. The values are obtained when
the SmartApplication is set as follows:

The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The test duration is set to 30 seconds.

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the tested
equipment and the time when the first bit of the transmitted frame reaches the input port
of the tested equipment. In store forward mode, the analyzer calculates the difference
between the time when the first bit of the transmitted frame reaches the output port of the
tested equipment and the time when the last bit of the transmitted frame reaches the input
port of the tested equipment. In the table, the CT values are obtained in cut through mode
and the S&F values are obtained in store forward mode.

CT: Cut Through (or FIFO),S&F: Store & Forward (or LIFO)

Measure on one receiving card only, Mode: SmartMetrics Comp. Mode

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 16.54

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.7 Latency specifications of the N4EGS4


Frame
Size
(byte)

Rate
Tested
(%)

(01,01,02) to
(01,01,01) (us)CT (us)

Average
(CT) (us)

(01,01,02) to
(01,01,01)
(us)-S&F (us)

Average
(S&F) (us)

64

16.54

103.3

103.3

102.8

102.8

128

15.81

115.2

115.2

114.2

114.2

256

15.40

126.7

126.7

124.7

124.7

512

15.20

154.4

154.4

150.4

150.4

1024

15.10

3721.4

3721.4

3713.3

3713.3

1280

15.07

223.9

223.9

213.7

213.7

1518

15.06

3447.5

3447.5

3435.4

3435.4

Table 12-231 lists the back-to-back specifications of the N4EGS4. The values are obtained
when the SmartApplication is set as follows:

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The specifications in the table are obtained in the scenario wherein point-to-point
transparent transmission services are configured and the flow control function is
disabled.

The frame size is set to the range from 64 bytes to 1518 bytes, the packet transmission
rate is set to 100%, the test duration is set to 30 seconds, and the number of repetitions is
set to a value more than 1 on the SmartApplication.

The tested traffic is set to the wire speed.

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): Custom

Number of pairs: 1

Initial rate (%): 16.54

Maximum rate (%): 10.00

Resolution rate (%): None

Mode: Uni-directional

Figure 1.8 Back-to-back specifications of the N4EGS4


Frame Size
(byte)

Rate Tested (%)

(01,01,02) to (01,01,01)
Burst Size (frames)

Total (frames)

64

16.54

7381890

14763780

128

15.81

4006410

8012820

256

15.40

2092620

4185240

512

15.20

1071420

2142840

1024

15.10

542220

1084440

1280

15.07

434640

869280

1518

15.06

367140

734280

1.1.1.1.1189 Mechanical Specifications


The mechanical specifications of the EGS4 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1EGS4 or N3EGS4 (kg): 1.1

Weight of the N4EGS4 (kg): 0.7

1.1.1.1.1190 Power Consumption


The maximum power consumption of the N1EGS4 and N3EGS4 at room temperature (25C)
is 70 W.
The maximum power consumption of the N4EGS4 at room temperature (25C) is 34 W.

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12.11 EAS2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EAS2 (2-port 10xGE switching and processing board). This
topic also describes how to configure and commission the EAS2.

12.11.1 Version Description


The EAS2 is available in the following functional versions: N1 and N3.
Table 12-232 describes the versions of the EAS2.
Figure 1.1 Versions of the EAS2
Item

Description

Functional
versions

The EAS2 is available in the following functional versions: N1 and


N3.

Differences

The N3EAS2 supports the ERPS function.

The maximum number of VCTRUNKs supported by the N1EAS2


differs from that supported by the N3EAS2. In addition, the
VCTRUNK configuration principles for the N1EAS2 also differ
from those for the N3EAS2. For details, see 12.11.3 Functions and
Features.

The N3EAS2 supports a maximum of 4096 link services, whereas


the N1EAS2 supports a maximum of 2048 link services.

The N3EAS2 supports the MPLS function, whereas the N1EAS2


does not.

Substitution

None

12.11.2 Application
The EAS2 is used to transmit/receive Ethernet services, manage bandwidths, and realize
Layer 2 switching of Ethernet services.
Figure 12-64 shows the typical networking and application of the Ethernet switching board.
the Ethernet switching board accesses and converges Ethernet services, and provides the
Ethernet data with the following data features: Layer 2 switching, port isolation, flow
classification, traffic control, VLAN management, and priority configuration. In addition, the
Ethernet switching board performs encapsulation/decapsulation, virtual concatenation, and
SDH mapping/demapping for data. The Ethernet switching board can be interconnected with
the bandwidth access equipment and the data communication equipment at the same time,
thus to provide a network-level solution.

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Figure 1.1 Networking and application of the Ethernet switching board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

12.11.3 Functions and Features


EAS2 boards support the transmission of 10 GE Ethernet services, LCAS, and test frame
functions.
Table 12-233 lists the functions and features supported by EAS2 boards.
Figure 1.2 Functions and features supported by EAS2 boards
Funct
ion
and
Featu
re

Description

Basic
functi
ons

Receives/Transmits 2x10 GE Ethernet services.

Port
types

Supports 10GBASE-LR and 10GBASE-LW Ethernet optical ports, which comply


with IEEE 802.3ae.

Functi
ons
when
being
used

Provides ports on the front panel.

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Funct
ion
and
Featu
re

12 EoS Boards

Description

with
an
interfa
ce
board
Port
charac
teristic
s

Servic
e
catego
ries

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Worki
ng
mode

10GE full-duplex in both WAN mode and LAN mode

Traffic
contro
l at
ports

Auto-negotiation mode

Not supported

Non-autonegotiation mode

Supported

Query
/Settin
g of
port
status

Supported

Query
of port
types

Supported

Settin
g of
optical
power
thresh
olds

Not supported

Plugg
able
optical
modul
e

XFP optical modules supported on N1EAS2 boards

Ethern
et
privat
e line
(EPL)
servic
e

Supports PORT-based transparent transmission.

Ethern
et
virtual
privat
e line

Supports PORT-shared EVPL services.

Supports VCTRUNK-shared EVPL services.

SFP+ optical modules supported on N3EAS2 boards

The services are isolated by VLAN tags.

The services are isolated by QinQ tags.

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Funct
ion
and
Featu
re

Servic
e
specifi
cation
s

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Description

(EVP
L)
servic
e

Supports a maximum of 2048 links in the case of the N1EAS2;


supports a maximum of 4096 links in the case of the N3EAS2.

Ethern
et
privat
e LAN
(EPL
AN)
servic
e

Supports a maximum of one virtual bridge (VB) on N1EAS2 boards.


The maximum number of logical ports for each VB is 26.

Supports a maximum of one VB on N3EAS2 boards. The maximum


number of logical ports for each VB is 19 (slot bandwidth: 10G bit/s)
or 36 (slot bandwidth: 20G bit/s)

Supports the blacklist that can contain 512 records and also the static
media access control (MAC) address table that can contain 512
records.

Supports the self-learning of the source MAC address. The capacity


of the MAC address table is 16K. The aging time of the MAC
address can be set and queried.

Supports the configuration of static MAC routes.

Supports the query of the aging time of an MAC address.

Supports the query of learned MAC addresses by VB+VLAN or


VB+LP.

Supports EPLAN services that are based on IEEE 802.1d MAC


bridges.

Ethern
et
virtual
privat
e LAN
(EVP
LAN)
servic
e

Supports EVPLAN services that use stack VLAN encapsulation.

Supports data isolation based on VB+VLAN.

Supports EVPLAN services based on IEEE 802.1q virtual bridges


and IEEE 802.1ad provider bridges.

Forma
ts of
Ethern
et data
frames

IEEE 802.3

Supported

Ethernet II

Supported

IEEE 802.1q TAG

Supported

Frame
length
range

Supports the setting of the frame length to a value ranging from 1518
bytes to 9600 bytes.

Supports a jumbo frame with a maximum length of 9600 bytes.

Bound
bandw
idth

N1EAS2: 64xVC-4 or 192xVC-3

Conca

The following adjacent concatenation granularities are supported on

N3EAS2: 128xVC-4

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ion
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Description

tenatio
n
granul
arities

N1EAS2 boards: VC-4-Xv (X8), VC-3-Xv (X24), and VC-4-4c.

Encap
sulatio
n
format
s

HDLC

Not supported

LAPS

Not supported

GFP-F

Supported

MPLS
techno
logy

Not supported on N1EAS2 boards

VLA
N
techno
logy

Supports a total number of 4094 VLANs, which comply with IEEE


802.1q/p.

Maxi
mum
uplink
bandw
idth

An N1EAS2 board supports a maximum of 10 Gbit/s upstream


bandwidth and can adapt to the bandwidth of its slot.

VCTR
UNK
specifi
cation
s

An N1EAS2 board supports a maximum of 24 VCTRUNKs.

The following adjacent concatenation granularities are supported on


N3EAS2 boards: VC-4-Xv (X64) and VC-4-4c/16c/64c.
NOTE
For N3EAS2 boards, VCTRUNK1 and VCTRUNK18 support VC-4-16c/64c
adjacent concatenation. Other VCTRUNKs only support VC-4-4c adjacent
concatenation.

Tunnel-based EVPL (transit) supported on N3EAS2 boards

An N3EAS2 board supports a maximum of 20 Gbit/s upstream


bandwidth and can adapt to the bandwidth of its slot.

Configuration guidelines are as follows:

A VCTRUNK can be bound with a maximum of 8 VC-4s or a


maximum of 24 VC-3s.

A VCTRUNK can be bound only with VC-4 paths or VC-3 paths.


Different VCTRUNKs, however, can be bound with paths at different
levels.

N1EAS2 boards support VC-4-4c adjacent concatenation and VC3/VC-4 virtual concatenation.

Only VCTRUNKs numbered 1-4 support the Jumbo frame with a


length of 9600 bytes. The other VCG ports do not support the Jumbo
frame.

The maximum number of VCTRUNKs supported by the N3EAS2 board


is as follows:

Issue 02 (2013-01-18)

If the slot bandwidth is 10 Gbit/s, the maximum number is 17


(VCTRUNK1 to VCTRUNK17).

If the slot bandwidth is 20 Gbit/s, the maximum number is 34


(VCTRUNK1 to VCTRUNK34).

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Description

Configuration guidelines are as follows:

Protec
tion
schem
es

VCTRUNK 1 and VCTRUNK 18 can be bound with a maximum of


64 VC-4s, and other VCTRUNKs can be bound with a maximum of
8 VC-4s.

VCTRUNK 1 to VCTRUNK 17 can be bound only with VC-4-1 to


VC-4-64, and VCTRUNK 18 to VCTRUNK 34 can be bound only
with VC-4-65 to VC-4-128.

TPS

Not supported

BPS

Not supported

PPS

Not supported

DLA
G

Supported

LAG

Supports manual link aggregation and static link aggregation.


Supports the load sharing mode and load non-sharing mode.
Complies with IEEE 802.3ad and IEEE 802.1AX.

LCAS

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT

Supports P2P LPT and P2MP LPT in compliance with ITU-T G.7042.

STP/R
STP

Supports the broadcast packet suppression function and RSTP, which


comply with IEEE 802.1w.

MSTP

Not supported on N1EAS2 boards


Supported on N3EAS2 boards

ERPS

Not supported on N1EAS2 boards


Supported on N3EAS2 boards
NOTE
ERPS does not support the following bridges:

Synch
roniza
tion

Maint
enanc
Issue 02 (2013-01-18)

IEEE 802.1d bridge

IEEE 802.1ad bridge with SVL/ingress filter disabled

Synch
ronous
Ethern
et

Not supported

IEEE
1588v
2

Not supported

ETH
OAM

Supports CC, LB tests, and LT tests in compliance with IEEE


802.1ag, LM and DM in compliance with ITU-T Y.1731, and OAM

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e
featur
es

ping in compliance with Huawei proprietary protocol.

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Supports OAM auto-discovery, remote loopbacks, fault detection,


and link performance detection in compliance with IEEE 802.3ah,
and selfloop detection in compliance with Huawei proprietary
protocol.

Test
Frame

Supports test frames in ETH and GFP bearer modes.

Respo
nse to
ping

Supported

Port
mirror
ing

Supports ingress and egress mirroring.

Loopb
ack
capabi
lity

PHY layer at Ethernet ports

Supports inloops.

MAC layer at Ethernet ports

Supports inloops.

VC-4 level

Not supported

VC-3 level

Not supported

VC-12 level

Not supported

RMO
N

QoS

12 EoS Boards

Supports Ethernet performance monitoring at the port level.

Supports the query of the rate of a port.

Reports an alarm when the volume of traffic at a port exceeds the


threshold (this function is available on N3EAS2 boards).

Warm
resets

Supported (Warm resets do not affect services.)

Cold
resets

Supported

Alarm
s and
perfor
mance
events

Reports various alarms and performance events, which facilitates the


management and maintenance of the equipment.

Supports traffic classification based on PORT, PORT+VLAN ID,


PORT+VLAN ID+VLAN PRI, PORT+SVLAN ID, PORT+SVLAN
ID+CVLAN ID, MPLS labels, or MPLS label+EXP value.

Supports the CAR. The granularity is 64 kbit/s.

Each port supports eight priority queues.

Supports shaping based on ports or queues.


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IGMP
snoopi
ng

Protoc
ol
enabli
ng

Supported

Port
aging
time

Supported

Fast
leave

Not supported

Discar
ding
of
unkno
wn
broadc
ast
packet
s

Not supported

Static
broadc
ast
entry

Supported

Traffic
contro
l

12 EoS Boards

Supports the port-based traffic control function that complies with IEEE 802.3x.

12.11.4 Working Principle and Signal Flow


The EAS2 consists of the interface processing module, mapping module, interface converting
module, logic and control module, clock module, and power module.
Figure 12-65 shows the functional block diagram of the EAS2 by describing how to process
1x10 GE signals.

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Figure 1.1 Functional block diagram of the EAS2


Backplane

10GE

Interface
processing
module

Laser
shutdown

Service
processing
module

Interface
converting
module

Encapsulation
module
Digital encapsulation module
Mapping module

Virtual
concatenation
processing
module

Cross-connect unit

Cross-connect unit

LOS
Communication

Logic and
control module

Clock reference and frame delimitation

+3.3 V
Clock module

Power
module

Power
module

Fuse

SCC unit
SCC unit
-48 V/-60 V
-48 V/-60 V

1.1.1.1.1191 In the Transmit Direction


The encapsulation or conversion module demaps and decapsulates the signals received from
the cross-connect unit. Then, the interface converting module performs the interface
converting operations and transmits the signals to the service processing module. The service
processing module implements the functions of the Layer 2 switching and private line service.
After the interface processing module converts parallel signals to serial signals and encodes
the serial signals, the Ethernet interface module transmits the serial signals.

1.1.1.1.1192 In the Receive Direction


The XFP/SFP+ optical module performs O/E conversion on the 10 GE Ethernet signals, and
then transmits the signals to the Ethernet interface module. The Ethernet interface module
transmits the parallel signals to the service processing module to realize the functions of the
Layer 2 switching and private line service. The encapsulation module encapsulates and maps
the Ethernet GFP-F frames, and then transmits the signals to the cross-connect unit.

1.1.1.1.1193 Logic and Control Module


The logic and control module provides the communication, control, and service configuration
functions of the board.

1.1.1.1.1194 Clock Module


The clock module traces the system reference clock, and generates the required clock signals
when the board is working.

1.1.1.1.1195 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

12.11.5 Front Panel


The front panel of the EAS2 has indicators, interfaces, a bar code, and a laser safety class
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label.

1.1.1.1.1196 Diagram of the Front Panel


Figure 12-66 shows the appearance of the front panel of the EAS2.
Figure 1.1 Front panel of the EAS2

EAS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1

IN1
OUT2

IN2

EAS2

1.1.1.1.1197 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

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Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1198 Interfaces
The front panel of the EAS2 has two 10 GE interfaces. Table 12-234 describes the types and
usage of the interfaces of the EAS2.
Figure 1.1 Interfaces of the EAS2
Interface

Type of Interface

Usage

IN1IN2

LC

Receives 10 GE signals.

OUT1OUT2

LC

Transmits 10 GE signals.

12.11.6 Jumpers and DIP Switches


The EAS2 does not have any jumpers or DIP switches that are used for board settings.

12.11.7 Valid Slots


An EAS2 board must be installed in a valid slot in a subrack.
An N1EAS2 board can be installed in any of slots 5-8 and 11-14 in a subrack and provides a
bandwidth of 10 Gbit/s. An N3EAS2 board can also be installed in any of slots 5-8 and 11-14
in a subrack. When an N3EAS2 board is installed in slot 5, 6, 13, or 14, it provides a
bandwidth of 10 Gbit/s; when an N3EAS2 board is installed in slot 7, 8, 11, or 12, it provides
a bandwidth of 20 Gbit/s.

12.11.8 Feature Code


The EAS2 does not have the feature code.

12.11.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1199 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
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locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1200 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring Ethernet Services.
Step 7 Required: Configure the Ethernet interface.

Set the overhead byte as follows:

J1 byte: The setting of the J1 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J1 byte to be sent
is Huawei SBS
and the default value of the J1 byte is Disabled.

Set the parameters of the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same mode. If the working modes on two sides do not
match, packets may be lost or the bit rate may decrease. In the case of large volume
of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the Layer 2 switching management service. Perform the following tasks:

Configuring the IGMP Snooping Protocol

Configuring the Spanning Tree

Setting the Aging Time for the Multicast Router Port

Step 9 Optional: Configure the QoS. For details, see Configuring QoS.
Step 10 Optional: Configure the aggregation function for the Ethernet port. For details, see Creating a
LAG.
Step 11 Optional: Configure test frames. For details, see Configuring Test Frames.
----End

1.1.1.1.1201 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

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1.1.1.1.1202 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 12 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

12.11.10 Configuring the Board Functions


The EAS2 supports multiple Ethernet functions and features such as Layer 2 switching,
LCAS, and LAG. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EAS2 by using the U2000:

LCAS

LPT

LAG

DLAG

ETH OAM

Test Frame

STP/RSTP

MSTP

IGMP Snooping

QoS

ERPS

12.11.11 Parameter Settings


You can set parameters for the EAS2 by using the U2000.
You can set the following main parameters for the EAS2 by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

12.11.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

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1.1.1.1.1203 Troubleshooting
Table 12-235 lists the faults that occur on the EAS2 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EAS2 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

The negotiated working mode


of the Ethernet ports is the
half-duplex mode.

Bit errors occur on the line


side.

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Transient service
interruption

Packet loss

Interconnection
fault

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


Packet Loss.

See Troubleshooting Device


Interconnection Faults.

1.1.1.1.1204 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EAS2, see Replacing an EOS Board.

12.11.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

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12.11.13.1 Alarms of N1EAS2


ALM_GFP_dCSF

ALM_GFP_dLFD

AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

B3_SD_VC4

BD_STATUS

BDID_ERROR

BOOTROM_BAD

CHIP_ABN

COMMUN_FAIL

DLAG_PROTECT_FAIL

EX_ETHOAM_MPID_C
NFLCT

ETH_LOS

EX_ETHOAM_CC_LOS

HP_RDI

FCS_ERR

HARD_BAD

IN_PWR_ABN

HP_SLM

HP_UNEQ

LASER_MOD_ERR

LAG_PORT_FAIL

LAG_VC_PORT_FAIL

LCAS_PLCR

LCAS_FOPR

LCAS_FOPT

LCAS_TLCT

LCAS_PLCT

LCAS_TLCR

LP_RDI_VC3

LINK_ERR

LOOP_ALM

LPT_RFI

LP_SLM_VC3

LP_UNEQ_VC3

LSR_WILL_DIE

LSR_BCM_ALM

LSR_NO_FITED

SLAVE_WORKING

NO_BD_SOFT

OUT_PWR_ABN

TEM_HA

SO_SK_MISMATCH

T_LOSEX

TEST_STATUS

TEM_LA

TEMP_OVER

TU_AIS_VC3

TF

TR_LOC

VCAT_LOM_VC3

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC4

VCTRUNK_NO_FLOW

ETH_NO_FLOW

SWDL_PKG_NOBDSOF
T

WRG_BD_TYPE

12.11.13.2 Alarms of N3EAS2


LCAS_FOPR

LOOP_ALM

HARD_BAD

HARD_ERR

B3_SD_VC4

B3_EXC_VC4

HP_UNEQ

HP_SLM

HP_RDI

AU_AIS

AU_LOP

VCAT_LOM_VC4

TU_AIS_VC3

TU_LOP_VC3

LP_SLM_VC3

LP_UNEQ_VC3

LP_RDI_VC3

B3_SD_VC3

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B3_EXC_VC3

VCAT_LOM_VC3

HP_TIM

MULTI_RPL_OWNER

LP_TIM_VC3

12.11.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

12.11.14.1 Performance Events of N1EAS2


Figure 1.1 SDH
HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFEUAS

HPFECSES

VC3BBE

VC3ES

VC3SES

VC3UAS

VC3CSES

VC3FEBBE

VC3FEES

VC3FESES

VC3FECSES

VC3FEUAS

OSPITMPMAX

OSPITMPMIN

OSPITMPCUR

TPLMAX

TPLMIN

TPLCUR

TLBMAX

TLBMIN

TLBCUR

RPLMAX

RPLMIN

RPLCUR

XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

Figure 1.2 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

FCSErrors

Figure 1.3 Statistics of RMON basic performance


Packets Received(64 Octets
in Length)(packets)

Packets Received(65~127
Octets in Length)(packets)

Packets Received(128~255
Octets in Length)(packets)

Packets Received(256~511
Octets in Length)(packets)

Packets Received(512~1023
Octets in Length)(packets)

Packets
Received(1024~1518
Octets in Length)(packets)

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Multicast Packets
Received(packets)

Broadcast Packets
Received(packets)

Drop Events(times)

Undersize Packets
Received(packets)

Oversize Packets
Received(packets)

Fragments(packets)

Jabbers(packets)

Octets Received(Byte)

Packets Received(packets)

Figure 1.4 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)
(packets)

Packets Transmitted(65~127
Octets in Length)(packets)

Packets
Transmitted(128~255 Octets
in Length)(packets)

Packets
Transmitted(256~511
Octets in Length)
(packets)

Packets Transmitted(512~1023
Octets in Length)(packets)

Packets
Transmitted(1024~1518
Octets in Length)(packets)

Unicast Packets
Received(packets)

Unicast Packets
Transmitted(packets)

Multicast Packets
Transmitted(packets)

Broadcast Packets
Transmitted(packets)

Pause Frames
Received(frames)

Pause Frames
Transmitted(frames)

FCS Errors(frames)

Packets Received and


Transmitted(64 Octets in
Length)(packets)

Packets Received and


Transmitted(65~127 Octets
in Length)(packets)

Packets Received and


Transmitted(128~255
Octets in Length)
(packets)

Packets Received and


Transmitted(256~511 Octets in
Length)(packets)

Packets Received and


Transmitted(512~1023
Octets in Length)(packets)

Packets Received and


Transmitted(1024~1518
Octets in Length)
(packets)

Good Full Frame Speed


Received(Byte/s)

Good Full Frame Speed


Transmitted(Byte/s)

Good Full Frame Octets


Received(Byte)

Good Full Frame Octets


Transmitted(Byte)

Control Frames
Received(frames)

Control Frames
Transmitted(frames)

Packets Transmitted(packets)

Octets Transmitted(Byte)

Figure 1.5 Statistics of RMON VCG performance


Octets Received(Byte)

Octets Transmitted(Byte)

Packets Received(packets)

Packets
Transmitted(packets)

Good Packets
Received(packets)

Good Packets
Transmitted(packets)

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Full Frame Speed


Received(Byte/s)

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Full Frame Speed


Transmitted(Byte/s)

12.11.14.2 Performance Events of N3EAS2


Figure 1.6 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

HPFEUAS

TPLMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

BDTEMPMAX

BDTEMPMIN

BDTEMPCUR

Figure 1.7 Statistics of RMON basic performance


RXOCTETS

RXPKTS

RXBRDCAST

RXMULCAST

RXPKT64

RXPKT65

RXPKT128

RXPKT256

RXPKT512

RXPKT1024

ETHJAB

ETHDROP

ETHUNDER

ETHOVER

ETHFRG

Figure 1.8 Statistics of RMON extended performance


RXUNICAST

TXUNICAST

TXBRDCAST

RXCTLPKTS

PKT64

TXOCTETS

TXPKTS

RXPAUSE

TXPAUSE

RXFULLBGOOD

TXFULLBGOOD

TXGOODFULLFRAMES
PEED

RXGOODFULLFRAMESPE
ED

TXPKT64

TXPKT65

TXPKT128

TXPKT256

TXPKT512

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TXPKT1024

TXMULCAST

ETHFCS

PKT65

PKT128

PKT256

PKT512

PKT1024

Figure 1.9 VCG RMON


VCG_TXGOODPACKETS

VCG_TXPACKETS

VCG_TXOCTETS

VCG_RXGOODPACKETS

VCG_RXPACKETS

VCG_RXOCTETS

VCG_TXSPEED

VCG_RXSPEED

12.11.15 Technical Specifications of EAS2


The technical specifications of the EAS2 include the parameters specified for optical
interfaces, safety class of the laser, Ethernet performance specifications, mechanical
specifications, and power consumption.

1.1.1.1.1205 Parameters Specified for Optical Interfaces


Table 12-245 lists the parameters specified for the optical interfaces of the N1EAS2.
Table 12-246 lists the parameters specified for the optical interfaces of the N3EAS2.
Figure 1.1 Parameters specified for the optical interfaces of the N1EAS2
Parameter

Value

Transmission rate

10.3125 Gbit/s or 9.953 Gbit/s

Processing capability

2x10GE signals

Type of optical interface

10GBASE-LR/LW

Type of fiber

Single-mode LC

Operating wavelength
range (nm)

1290 to 1330

Transmission distance
(km)

10

Maximum mean launched


power (dBm)

-1

Minimum mean launched


power (dBm)

-6

Receiver sensitivity (dBm)

-11

Minimum extinction ratio


(dB)

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Parameter

Value

Connector type

LC

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

Figure 1.2 Parameters specified for the optical interfaces of the N3EAS2
Parameter

Value

Transmission rate

10.3125 Gbit/s or 9.953 Gbit/s

Processing capability

2x10GE signals

Type of optical interface

10GBASE-LR/LW

Type of fiber

Single-mode LC

Operating wavelength
range (nm)

1290 to 1330

Transmission distance
(km)

10

Maximum mean launched


power (dBm)

0.5

Minimum mean launched


power (dBm)

-8.2

Receiver sensitivity (dBm)

-12.6

Minimum extinction ratio


(dB)

3.5

Connector type

LC

Maximum -20 dB spectral


width (nm)

Minimum side mode


suppression ratio (dB)

30

1.1.1.1.1206 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1207 Ethernet Performance Specifications


Figure 12-67 shows the connection for testing the throughput specifications, packet loss ratio
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in the case of overloading, latency specifications, and back-to-back specifications of the


EAS2.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading and latency specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 12-247 lists the throughput specifications of the N1EAS2. Table 12-249 lists the packet
loss ratio in the case of overloading of the N1EAS2. Table 12-251 lists the latency
specifications of the N1EAS2.
Table 12-248 lists the throughput specifications of the N3EAS2. Table 12-250 lists the packet
loss ratio in the case of overloading of the N3EAS2. Table 12-252 lists the latency
specifications of the N3EAS2.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EPL services are
configured and 64 VC-4s are bound on the 10xGE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Figure 1.1 Throughput specifications of the N1EAS2


Frame Size
(Byte)

Passed Rate
(%)

Number of Tx
Frames (pks/sec)

Number of Rx
Frames (pks/sec)

Total (%)

64

100.00000

148809440

148613326

99.29688

128

100.00000

84459360

84457314

99.29688

256

99.29687

44974080

44719807

98.59375

512

97.89062

23001600

22892340

97.1875

1024

96.48437

11552000

11552000

96.48438

1280

96.48437

9277280

9277280

96.48438

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Frame Size
(Byte)

Passed Rate
(%)

Number of Tx
Frames (pks/sec)

Number of Rx
Frames (pks/sec)

Total (%)

1518

96.48437

7841440

7831693

95.78125

Figure 1.2 Throughput specifications of the N3EAS2


Frame Size
(byte)

Passed Rate
(%)

Tx Frames
(pks/sec)

Rx Frames
(pks/sec)

Total (%)

64

98.00000

14534882

14534882

100.00000

128

98.00000

8278145

8278145

100.00000

256

98.00000

4432624

4432624

100.00000

512

98.00000

2302025

2286388

99.32000

1024

97.00000

1161710

1156436

99.55000

1280

97.00000

932835

927296

99.41000

1518

97.00000

788146

783050

99.35000

Figure 1.3 Packet loss ratio in the case of overloading of the N1EAS2
Frame Size
(Byte)

Rate Tested
(%)

Number of Tx
Frames (pks/sec)

Number of Rx
Frames (pks/sec)

Total (%)

64

100.00000

148809440

148614523

0.13

128

100.00000

84459360

84457396

0.00

256

100.00000

45289760

44709723

1.28

512

100.00000

23496160

22868728

2.67

1024

100.00000

11973120

11566750

3.39

1280

100.00000

9615360

9274900

3.54

1518

100.00000

8127360

7832064

3.63

Figure 1.4 Packet loss ratio in the case of overloading of the N3EAS2
Frame Size
(byte)

Rate Tested
(%)

Tx Frames
(pks/sec)

Rx Frames
(pks/sec)

Total (%)

64

97.00000

14367816

14367816

0.00

128

97.00000

8169934

8169934

0.00

256

97.00000

4385964

4385964

0.00

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Frame Size
(byte)

Rate Tested
(%)

Tx Frames
(pks/sec)

Rx Frames
(pks/sec)

Total (%)

512

97.00000

2281021

2281021

0.00

1024

97.00000

1161710

1156431

0.45

1280

97.00000

932835

927296

0.59

1518

97.00000

788146

783050

0.64

Figure 1.5 Latency specifications of the N1EAS2


Frame
Size
(Byte)

Rate
Tested
(%)

Number
of Tx
Frames
(pks/sec)

Number of
Rx Frames
(pks/sec)

Minimum
Latency
(us)

Average
Latency
(us)

Maximu
m
Latency
(us)

64

100.0000
0

14880950

14880950

59.7

90.798

98.2

128

100.0000
0

8445940

8445940

55.9

92.201

99.5

256

100.0000
0

4528980

4528980

61

96.178

103.7

512

100.0000
0

2349620

2349620

72.7

102.403

109.9

1024

100.0000
0

1197310

1197310

81.8

116.101

123.7

1280

100.0000
0

961530

961530

88.2

122.479

130.2

1518

100.0000
0

812740

812740

99.1

128.928

136.3

Figure 1.6 Latency specifications of the N3EAS2


Frame
Size
(byte)

Rate
Tested
(%)

Tx
Frames
(pks/sec)

Rx Frames
(pks/sec)

Min
Latency
(us)

Ave
Latency
(us)

Max
Latency
(us)

64

97.00000

14367816

14367816

15.9

17.158

18.4

128

97.00000

8169934

8169934

16.3

17.485

18.9

256

97.00000

4385964

4385964

16.9

18.099

21.0

512

97.00000

2281021

2281021

18.2

19.163

20.5

1024

96.00000

1148897

1148897

19.6

20.780

22.2

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Frame
Size
(byte)

Rate
Tested
(%)

Tx
Frames
(pks/sec)

Rx Frames
(pks/sec)

Min
Latency
(us)

Ave
Latency
(us)

Max
Latency
(us)

1280

96.00000

923190

923190

20.5

21.649

23.1

1518

96.00000

780274

780274

21.2

22.410

23.9

1.1.1.1.1208 Mechanical Specifications


The mechanical specifications of the EAS2 board are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg):

N1EAS2: 1.2

N3EAS2: 1.1

1.1.1.1.1209 Power Consumption


The maximum power consumption of the N1EAS2 is 70 W at room temperature (25C).
The maximum power consumption of the N3EAS2 is 83 W at room temperature (25C).

12.12 EFF8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EFF8 (8x100M Ethernet optical interface board).

12.12.1 Version Description


The EFF8 is available in one functional version, namely, N1.

12.12.2 Application
The EFF8 is an Ethernet optical interface board. The EFF8 can be used on the OptiX OSN
equipment series to transmit and receive 100M Ethernet optical signals for the data board.

12.12.3 Functions and Features


The EFF8 receives and transmits 8x100M Ethernet optical signals. The EFF8 must work with
the Ethernet processing board.

12.12.4 Working Principle and Signal Flow


The EFF8 consists of the interface module and power module.
Figure 12-68 shows the functional block diagram of the EFF8 by describing how to process
1x100 Mbit/s Ethernet signals.

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Figure 1.1 Functional block diagram of the EFF8


Backplane

100 Mbit/s
Ethernet signal

EFT8/EFS0/EMS4/EMR0
Interface
module

100 Mbit/s
Ethernet signal

+3.3 V

EFT8/EFS0/EMS4/EMR0

Power
module

Fuse

+3.3 V backup power

1.1.1.1.1210 Interface Module


In the receive direction, the interface module performs O/E conversion for the Ethernet
signals and transmits the signals to the EFT8, EFS0, EMS4, or EMR0.
In the transmit direction, the interface module performs E/O conversion for the Ethernet
signals and transmits the signals to the optical interface.

1.1.1.1.1211 Power Module


The power module provides all the modules of the EFF8 with the required DC voltages.

12.12.5 Front Panel


The front panel of the EFF8 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1212 Diagram of the Front Panel


Figure 12-69 shows the appearance of the front panel of the EFF8.

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Figure 1.1 Front panel of the EFF8

EFF8
1
2
3
4
5
6
7
8
LINK ACT
OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4
OUT5 IN5
OUT6 IN6
OUT7 IN7
OUT8 IN8
CLASS 1
LASER
PRODUCT

EFF8

1.1.1.1.1213 Indicators
The front panel of the board has the following indicators:

Eight connection status indicators (LINK) one color (green)

Eight data receiving and transmission indicators (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1214 Interfaces
The front panel of the EFF8 has eight optical interfaces.
Table 12-253 describes the types and usage of the interfaces of the EFF8.

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Figure 1.1 Interfaces of the EFF8


Interface

Type of Interface

Usage

IN1IN8

LC

Receives the 1st to the 8th channels of Ethernet


optical signals.

OUT1OUT8

LC

Transmits the 1st to the 8th channels of Ethernet


optical signals.

12.12.6 Valid Slots


The EFF8 can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the subrack and works
as the interface board of the EFT8, EFS0 or EMR0. The EFF8 can be installed in slots 1926
and 2936 in the subrack and works as the interface board of the EMS4, EMS2 or EFS0A.
Table 12-254 lists the slots valid for the EFT8/EFS0/EMR0 and the corresponding slots for
the EFF8.
Figure 1.2 Slots valid for the EFT8/EFS0/EMR0 and the corresponding slots for the EFF8
Slot Valid for the EFT8/EFS0/EMR0

Corresponding Slot for the EFF8

Slot 2

Slots 19

Slot 3

Slots 21

Slot 4

Slots 23

Slot 5

Slots 25

Slot 13

Slots 29

Slot 14

Slots 31

Slot 15

Slots 33

Slot 16

Slots 35

Table 12-255 lists the slots valid for the EMS4/EMS2/EFS0A and the corresponding slots for
the EFF8.
Figure 1.3 Slots valid for the EMS4/EMS2/EFS0A and the corresponding slots for the EFF8
Slot Valid for the EMS4/EMS2/EFS0A

Corresponding Slot for the EFF8

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

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Slot Valid for the EMS4/EMS2/EFS0A

Corresponding Slot for the EFF8

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

12.12.7 Technical Specifications


The technical specifications of the EFF8 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1215 Parameters Specified for Optical Interfaces


Table 12-256 lists the parameters specified for the optical interfaces of the EFF8.
Figure 1.1 Parameters specified for the optical interfaces of the EFF8
Parameter

Value

Nominal bit rate

100 Mbit/s

Line code pattern

NRZI encoding signal (100M)

Type of optical interface

100BASE-LX

100BASE-FX

Operating wavelength
range (nm)

1261 to 1360

1270 to 1380

Type of fiber

Single-mode LC (15 km)

Multi-mode LC (2 km)

Mean launched optical


power (dBm)

-15 to -8

-19 to -14

Receiver sensitivity
(dBm)

-28

-30

Minimum overload
(dBm)

-8

-14

Minimum extinction
ratio (dB)

8.2

10

1.1.1.1.1216 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1217 Mechanical Specifications


The mechanical specifications of the EFF8 are as follows:

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Weight (kg): 0.4

1.1.1.1.1218 Power Consumption


The maximum power consumption of the EFF8 at room temperature (25C) is 6 W.

12.13 EFF8A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the EFF8A (8x100M Ethernet optical interface board).

12.13.1 Version Description


The EFF8A is available in one functional version, namely, N1.

12.13.2 Application
The EFF8A is an Ethernet optical interface board. The EFF8A can be used on the OptiX OSN
equipment series to transmit and receive 100M Ethernet optical signals for the data board.

12.13.3 Functions and Features


The EFF8A receives and transmits 8x100M Ethernet optical signals. The EFF8A must work
with the N5EFS0.

12.13.4 Working Principle and Signal Flow


The EFF8A consists of the interface module and power module.
Figure 12-70 shows the functional block diagram of the EFF8A by describing how to process
1x100 Mbit/s Ethernet signals.
Figure 1.1 Functional block diagram of the EFF8A
Backplane

100 Mbit/s
Ethernet signal

N5EFS0
Interface
module

100 Mbit/s
Ethernet signal

+3.3 V

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Power
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Fuse

+3.3 V backup power

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1.1.1.1.1219 Interface Module


In the receive direction, the interface module performs O/E conversion for the Ethernet
signals and transmits the signals to the N5EFS0.
In the transmit direction, the interface module performs E/O conversion for the Ethernet
signals and transmits the signals to the optical interface.

1.1.1.1.1220 Power Module


The power module provides all the modules of the EFF8A with the required DC voltages.

12.13.5 Front Panel


The front panel of the EFF8A has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1221 Diagram of the Front Panel


Figure 12-71 shows the appearance of the front panel of the EFF8A.

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Figure 1.1 Front panel of the EFF8A

EFF8
1
2
3
4
5
6
7
8
LINK ACT
OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4
OUT5 IN5
OUT6 IN6
OUT7 IN7
OUT8 IN8
CLASS 1
LASER
PRODUCT

EFF8

1.1.1.1.1222 Indicators
The front panel of the board has the following indicators:

Eight connection status indicators (LINK) one color (green)

Eight data receiving and transmission indicators (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1223 Interfaces
The front panel of the EFF8A has eight optical interfaces.
Table 12-257 describes the types and usage of the interfaces of the EFF8A.

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Figure 1.1 Interfaces of the EFF8A


Interface

Type of Interface

Usage

IN1IN8

LC

Receives the 1st to the 8th channels of Ethernet


optical signals.

OUT1OUT8

LC

Transmits the 1st to the 8th channels of Ethernet


optical signals.

12.13.6 Valid Slots


The EFF8A can be installed in slots 19, 21, 23, 25, 29, 31, 33, 35 in the subrack and works as
the interface board of the N5EFS0.
Table 12-258 lists the slots valid for the N5EFS0 and the corresponding slots for the EFF8A.
Figure 1.2 Slots valid for the N5EFS0 and the corresponding slots for the EFF8A
Slot Valid for the N5EFS0

Corresponding Slot for the EFF8A

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

12.13.7 Technical Specifications


The technical specifications of the EFF8A include the parameters specified for optical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.1224 Parameters Specified for Optical Interfaces


Table 12-259 lists the parameters specified for the optical interfaces of the EFF8A.
Figure 1.1 Parameters specified for the optical interfaces of the EFF8A
Parameter

Value

Nominal bit rate

100 Mbit/s

Line code pattern

MLT-3 encoding signal (100M)

Type of optical

100BASE-FX/LX

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Parameter

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Value

interface
Operating
wavelength range
(nm)

100BASE-LX (15 km): 1261 to 1360

Type of fiber

Single-mode LC (10 km), Multi-mode LC (2 km)

Mean launched
optical power (dBm)

100BASE-LX (15 km): -15 to -8

Receiver sensitivity
(dBm)

100BASE-LX (15 km): -28

Minimum overload
(dBm)

100BASE-LX (15 km): -8

Minimum extinction
ratio (dB)

100BASE-LX (15 km): 8.2

100BASE-FX (2 km): 1270 to 1380

100BASE-FX (2 km): -19 to -14

100BASE-FX (2 km): -30

100BASE-FX (2 km): -14

100BASE-FX (2 km): 10

1.1.1.1.1225 Mechanical Specifications


The mechanical specifications of the EFF8A are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.1226 Power Consumption


The maximum power consumption of the EFF8A at room temperature (25C) is 15 W.

12.14 ETF8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETF8 (8x100M Ethernet twisted pair interface board).

12.14.1 Version Description


The ETF8 is available in one functional version, namely, N1.

12.14.2 Application
The ETF8 is an Ethernet electrical interface board. The ETF8 can be used on the OptiX OSN
equipment series to transmit and receive 100M Ethernet electrical signals for the data board.

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12.14.3 Functions and Features


The ETF8 receives and transmits 8x100M Ethernet electrical signals. The ETF8 must work
with the Ethernet processing board.

12.14.4 Working Principle and Signal Flow


The ETF8 consists of the interface module and power module.
Figure 12-72 shows the functional block diagram of the ETF8 by describing how to process
1x100 Mbit/s Ethernet signals.
Figure 1.1 Functional block diagram of the ETF8
Backplane

100 Mbit/s
Ethernet signal

EFT8/EFS0/EMS4/EMR0
Interface
module

100 Mbit/s
Ethernet signal

+3.3 V

EFT8/EFS0/EMS4/EMR0

Power
module

Fuse

+3.3 V backup power

1.1.1.1.1227 Interface Module


In the receive direction, the interface module performs O/E conversion for the Ethernet
signals and transmits the signals to the EFT8, EFS0, EMS4, or EMR0.
In the transmit direction, the interface module performs E/O conversion for the Ethernet
signals and transmits the signals to the optical interface.

1.1.1.1.1228 Power Module


The power module provides all the modules of the ETF8 with the required DC voltages.

12.14.5 Front Panel


The front panel of the ETF8 has interfaces and a bar code.

1.1.1.1.1229 Diagram of the Front Panel


Figure 12-73 shows the appearance of the front panel of the ETF8.

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Figure 1.1 Front panel of the ETF8

ETF8

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8

ETF8

1.1.1.1.1230 Interfaces
The front panel of the ETF8 has eight electrical interfaces.
Table 12-260 describes the types and usage of the interfaces of the ETF8. For information
about the cables connected to the interfaces, see 22.4.6 Straight-Through Cable and 22.4.7
Crossover Cable.
Figure 1.1 Interfaces of the ETF8
Interface

Type of Interface

Usage

FE1FE8

RJ-45

Receives the 1st to the 8th channels of Ethernet


electrical signals.

Table 12-261 provides the pin assignments of the RJ45 connector of the ETF8.
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Figure 1.2 Pin assignments of the RJ45 connector of the ETF8


Front View

8 7

6 5

3 2

Pin

Description

Transmitting (+)

Transmitting ()

Receiving (+)

Grounding

Grounding

Receiving ()

Grounding

Grounding

12.14.6 Valid Slots


The ETF8 can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the subrack and works
as the interface board of the EFT8, EFS0 or EMR0. The ETF8 can be installed in slots 1926
and 2936 in the subrack and works as the interface board of the EMS4, EMS2 or EFS0A.
Table 12-262 lists the slots valid for the EFT8/EFS0/EMR0 and the corresponding slots for
the ETF8.
Figure 1.3 Slots valid for the EFT8/EFS0/EMR0 and the corresponding slots for the ETF8
Slot Valid for the EFT8/EFS0/EMR0

Corresponding Slot for the ETF8

Slot 2

Slots 19

Slot 3

Slots 21

Slot 4

Slots 23

Slot 5

Slots 25

Slot 13

Slots 29

Slot 14

Slots 31

Slot 15

Slots 33

Slot 16

Slots 35

Table 12-263 lists the slots valid for the EMS4/EMS2/EFS0A and the corresponding slots for
the ETF8.

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Figure 1.4 Slots valid for the EMS4/EMS2/EFS0A and the corresponding slots for the ETF8
Slot Valid for the EMS4/EMS2/EFS0A

Corresponding Slot for the ETF8

Slot 2

Slots 19 and 20

Slot 3

Slots 21 and 22

Slot 4

Slots 23 and 24

Slot 5

Slots 25 and 26

Slot 13

Slots 29 and 30

Slot 14

Slots 31 and 32

Slot 15

Slots 33 and 34

Slot 16

Slots 35 and 36

12.14.7 Technical Specifications


The technical specifications of the ETF8 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.1231 Parameters Specified for Electrical Interfaces


Table 12-264 lists the parameters specified for the electrical interfaces of the ETF8.
Figure 1.1 Parameters specified for the optical interfaces of the ETF8
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

1.1.1.1.1232 Mechanical Specifications


The mechanical specifications of the ETF8 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.1233 Power Consumption


The maximum power consumption of the ETF8 at room temperature (25C) is 2 W.

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12.15 ETF8A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETF8A (8x100M Ethernet twisted pair interface board).

12.15.1 Version Description


The ETF8A is available in one functional version, namely, N1.

12.15.2 Application
The ETF8A is an Ethernet electrical interface board. The ETF8A can be used on the OptiX
OSN equipment series to transmit and receive 100M Ethernet electrical signals for the data
board.

12.15.3 Functions and Features


The ETF8A receives and transmits 8x100M Ethernet electrical signals. The ETF8A must
work with the N5EFS0.

12.15.4 Working Principle and Signal Flow


The ETF8A consists of the interface module and power module.
Figure 12-74 shows the functional block diagram of the ETF8A by describing how to process
1x100 Mbit/s Ethernet signals.
Figure 1.1 Functional block diagram of the ETF8A
Backplane

100 Mbit/s
Ethernet signal

N5EFS0
Interface
module

100 Mbit/s
Ethernet signal

+3.3 V

N5EFS0

Power
module

Fuse

+3.3 V backup power

1.1.1.1.1234 Interface Module


In the receive direction, the interface module performs O/E conversion for the Ethernet
signals and transmits the signals to the N5EFS0.
In the transmit direction, the interface module performs E/O conversion for the Ethernet
signals and transmits the signals to the optical interface.

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1.1.1.1.1235 Power Module


The power module provides all the modules of the ETF8A with the required DC voltages.

12.15.5 Front Panel


The front panel of the ETF8A has interfaces and a bar code.

1.1.1.1.1236 Diagram of the Front Panel


Figure 12-75 shows the appearance of the front panel of the ETF8A.
Figure 1.1 Front panel of the ETF8A

ETF8A

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8

ETF8A

1.1.1.1.1237 Interfaces
The front panel of the ETF8A has eight electrical interfaces.
Table 12-265 describes the types and usage of the interfaces of the ETF8A. For information
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about the cables connected to the interfaces, see 22.4.6 Straight-Through Cable and 22.4.7
Crossover Cable.
Figure 1.1 Interfaces of the ETF8A
Interface

Type of Interface

Usage

FE1FE8

RJ-45

Receives the 1st to the 8th channels of Ethernet


electrical signals.

Table 12-266 provides the pin assignments of the RJ45 connector of the ETF8A.
Figure 1.2 Pin assignments of the RJ45 connector of the ETF8A
Front View

8 7

6 5

3 2

Pin

Description

Transmitting (+)

Transmitting ()

Receiving (+)

Grounding

Grounding

Receiving ()

Grounding

Grounding

12.15.6 Valid Slots


The ETF8A can be installed in slots 19, 21, 23, 25, 29, 31, 33, 35 in the subrack and works as
the interface board of the N5EFS0.
Table 12-267 lists the slots valid for the N5EFS0 and the corresponding slots for the ETF8A.
Figure 1.3 Slots valid for the N5EFS0 and the corresponding slots for the ETF8A
Slot Valid for the N5EFS0

Corresponding Slot for the ETF8A

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

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Slot Valid for the N5EFS0

Corresponding Slot for the ETF8A

Slot 16

Slot 35

12.15.7 Technical Specifications


The technical specifications of the ETF8A include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.1238 Parameters Specified for Electrical Interfaces


Table 12-268 lists the parameters specified for the electrical interfaces of the ETF8A.
Figure 1.1 Parameters specified for the optical interfaces of the ETF8A
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

1.1.1.1.1239 Mechanical Specifications


The mechanical specifications of the ETF8A are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.1240 Power Consumption


The maximum power consumption of the ETF8A at room temperature (25C) is 11 W.

12.16 ETS8
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the ETS8 (8x10/100M Ethernet twisted pair interface switching
board).

12.16.1 Version Description


The ETS8 is available in one functional version, namely, N1.

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12.16.2 Application
The ETS8 is an Ethernet electrical interface protection switching board. The ETS8 can be
used on the OptiX OSN equipment series to realize the TPS protection on the data board.

12.16.3 Functions and Features


The ETS8 is used to provide the TPS protection for 8xFE signals at the electrical interface.
The ETS8 must work with the EFS0 or EFS0A.

12.16.4 Working Principle and Signal Flow


The ETS8 consists of the interface module, switch matrix module, and power module.
Figure 12-76 shows the functional block diagram of the ETS8 by describing how to process
1x100 Mbit/s Ethernet signals.
Figure 1.1 Functional block diagram of the ETS8
Backplane
Cross-connect board
100 Mbit/s
Ethernet signal

Interface
module

100 Mbit/s
Ethernet signal
+3.3 V

Switch
matrix
module

Power
module

Fuse

EFS0
TSB8
TSB8
EFS0

+3.3 V backup power

1.1.1.1.1241 Interface Module


The interface module receives and transmits the Ethernet optical signals.

1.1.1.1.1242 Switch Matrix Module


In the receive direction, the switch matrix module receives the signal sent from the interface
module and selects the output direction of the signal according to the TPS protection control
signal sent from the cross-connect board. When the TPS is not performed, the switch matrix
module transmits the signal to the EFS0. When the TPS is performed, the switch matrix
module transmits the signal to the TSB8 for bridging.
In the transmit direction, the switch matrix module performs the reverse process.

1.1.1.1.1243 Power Module


The power module provides all the modules of the ETS8 with the required DC voltages.

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12.16.5 Front Panel


The front panel of the ETS8 has interfaces and a bar code.

1.1.1.1.1244 Diagram of the Front Panel


Figure 12-77 shows the appearance of the front panel of the ETS8.
Figure 1.1 Front panel of the ETS8

ETS8

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8

ETS8

1.1.1.1.1245 Interfaces
The front panel of the ETS8 has eight electrical interfaces.
Table 12-269 describes the types and usage of the interfaces of the ETS8. For information
about the cables connected to the interfaces, see 22.4.6 Straight-Through Cable and 22.4.7
Crossover Cable.

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Figure 1.1 Interfaces of the ETS8


Interface

Type of
Interface

Usage

FE1FE8

RJ-45

Receives the 1st to the 8th channels of Ethernet


electrical signals.

Table 12-270 provides the pin assignments of the RJ45 connector of the ETS8.
Figure 1.2 Pin assignments of the RJ45 connector of the ETS8
Front View

8 7 6 5 4

Pin

Description

Transmitting (+)

Transmitting ()

Receiving (+)

Grounding

Grounding

3 2

Receiving ()

Grounding

Grounding

12.16.6 Valid Slots


The ETS8 can be installed in slots 19, 21, 23, 25, 29, 31, 33, and 35 in the subrack and works
as the interface board of the EFS0. The ETS8 can be installed in slots 19, 21, 22, 23, 25, 29,
31, 33, 34, and 35 in the subrack and works as the interface board of the EFS0A.
Table 12-271 lists the slots valid for the EFS0 and the corresponding slots for the ETS8.
Figure 1.3 Slots valid for the EFS0 and the corresponding slots for the ETS8
Slot Valid for the EFS0

Corresponding Slot for the ETS8

Slot 2

Slot 19

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

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Slot Valid for the EFS0

Corresponding Slot for the ETS8

Slot 16

Slot 35

Table 12-272 lists the slots valid for the EFS0A and the corresponding slots for the ETS8.
Figure 1.4 Slots valid for the EFS0A and the corresponding slots for the ETS8
Slot Valid for the EFS0A

Corresponding Slot for the ETS8

Slot 2

Slot 19

Slot 3

Slot 21 and 22

Slot 4

Slot 23

Slot 5

Slot 25

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33 and 34

Slot 16

Slot 35

12.16.7 Technical Specifications


The technical specifications of the ETS8 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.1246 Parameters Specified for Electrical Interfaces


Table 12-273 lists the parameters specified for the electrical interfaces of the ETS8.
Figure 1.1 Parameters specified for the optical interfaces of the ETS8
Parameter

Value

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code pattern

Manchester encoding signal (10M) or MLT-3 encoding signal


(100M)

Specifications of the
interface

Complies with IEEE 802.3u.

1.1.1.1.1247 Mechanical Specifications


The mechanical specifications of the ETS8 are as follows:

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Weight (kg): 0.4

1.1.1.1.1248 Power Consumption


At room temperature (25C), the maximum power consumption of the ETS8 is 0 W.

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13

ATM Boards

About This Chapter


The ATM boards include STM-1 and STM-4 ATM service processing boards.
13.1 ADL4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the ADL4 (1xSTM-4 ATM service processing board). This topic
also describes how to configure and commission the ADL4.
13.2 ADQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the ADQ1 (4xSTM-1 ATM service processing board). This topic
also describes how to configure and commission the ADQ1.
13.3 IDL4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the IDL4 (1xSTM-4 ATM service processing board). This topic
also describes how to configure and commission the IDL4.
13.4 IDQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the IDQ1 (4xSTM-1 ATM service processing board). This topic
also describes how to configure and commission the IDQ1.

13.1 ADL4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the ADL4 (1xSTM-4 ATM service processing board). This topic
also describes how to configure and commission the ADL4.

13.1.1 Version Description


The ADL4 is available in one functional version, namely, N1.

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13.1.2 Application
The ATM board is used in the network that is based on ATM switching and transmission. The
ATM board can carry various types of ATM services.
The ADL4 provides one standard STM-4 optical interface and can be interconnected with the
switch or DSLAM to transmit the ATM services. In addition, the ADL4 can switch cell
headers to converge and multiplex bandwidths so that the bandwidths are not wasted. The
ADL4 supports the following types of application of the ATM services:

Application of the ATM services that occupy bandwidths exclusively

Application of the ATM services that share bandwidths

1.1.1.1.1249 Application of the ATM Services That Occupy Bandwidths Exclusively


When the ATM services do not share bandwidths, only the ATM service processing boards on
the source NE and sink NE perform ATM layer processing for the ATM services. The
intermediate NEs that the ATM services traverse do not perform ATM layer processing and
only pass through the ATM services on the SDH timeslots. In this case, each ATM service
occupies the VC-3 or VC-4 channel exclusively. The ATM services can be converged at the
central node and then transmitted on the STM-4 optical interface. Figure 13-1 shows the
networking and application of the ATM services that occupy bandwidths exclusively.
Figure 1.1 Networking and application of the ATM services that occupy bandwidths exclusively
DSLAM

34 Mbit/s
ATM traffic

Service
convergence

NE1
155 Mbit/s
ATM traffic

622 Mbit/s
ATM traffic

2.5 Gbit/s
SDH ring
NE2

NE4

DSLAM

Router

NE3

34 Mbit/s
ATM traffic
DSLAM

1.1.1.1.1250 Application of the ATM Services That Share Bandwidths


The VP-ring and VC-ring realize bandwidth sharing and statistical multiplexing for the ATM
services. The ATM services on each NE share one VC (VC-3, VC-4, or VC-4-Xv) channel. In
this case, each NE performs ATM layer processing for the ATM services. Figure 13-2 shows
the networking and application of the ATM services that share bandwidths.
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Figure 1.2 Networking and application of the ATM services that share bandwidths
The ATM services on NE1 are
dropped on NE2, then converged DSLAM
with the other ATM services, and
finally sent to the VP/VC-ring.
NE1

34 Mbit/s
ATM traffic

155 Mbit/s
ATM traffic

NE4
VC4-Xv
VP/VC-ring

DSLAM

Router

622 Mbit/s
ATM traffic

NE2

NE3
34 Mbit/s
ATM traffic
DSLAM

13.1.3 Functions and Features


The ADL4 supports the ATM switching and ATM protection.
Table 13-1 provides the functions and features of the ADL4.
Figure 1.1 Functions and features of the ADL4
Function and Feature

ADL4

Basic functions

Transmits/Receives and processes 1xSTM-4 ATM services.

Type of optical
interface

Supports the following types of optical interfaces: S-4.1, L-4.1,


L-4.2 and Ve-4.2.

Connector type

LC

Type of optical module

SFP

E3 ATM interface

Supports 12xE3 signals, which are accessed through the PD3,


PL3, or N1PL3A.

IMA function

Does not support the IMA function.

Maximum uplink
bandwidth

Supports a bandwidth of 8xVC-4s, or a bandwidth of 12xVC-3s


and 4xVC-4s.
NOTE
Only VC-4s numbered 5-8 support the binding of VC-3 paths.

ATM switching
capability
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Function and Feature

ADL4

Mapping granularities

Supports VC-3, VC-4, and VC4-Xv (X = 14) granularities.

Service types

Supports the CBR, rt-VBR, nrt-VBR, and UBR.

Number of supported
ATM connections

2048

Statistical multiplexing

Supports the statistical multiplexing.

Flow types and QoS

Complies with IETF RFC2514 and ATM forum TM4.0.

ATM multicast
connection

Supports the spatial multicast and logical multicast.

ATM protection (ITUT I.630)

Supports the unidirectional/bidirectional 1+1,


unidirectional/bidirectional 1:1, VP-Ring, and VC-Ring
protection schemes.

OAM functions (ITUT I.610)

Supports the AIS, RDI, LB, and CC.

Maintenance features

Supports inloops at the ATM layer and on optical interfaces.


Supports outloops at the ATM layer.
These features can be used to locate faults quickly.

Alarms and
performance events

Reports various alarms and performance events, which can be


used to locate faults and maintain the equipment.

13.1.4 Working Principle and Signal Flow


The ADL4 consists of the O/E converting module, physical layer module, ATM module, E3
module, mapping module, logic and control module, clock module, and power module.
Figure 13-3 shows the functional block diagram of the ADL4 by describing how to process
1xSTM-4 signals.

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Figure 1.1 Functional block diagram of the ADL4


Backplane
622
Mbit/s

E/O

622
Mbit/s

O/E

622
Mbit/s

High-speed
bus

Physical
layer
622 module
Mbit/s

Cross-connect unit

Mapping
module

ATM
module
E3
module

High-speed
bus

Cross-connect unit

O/E converting
module

Reference clock and frame header

LOS
Laser shutdown

Logic and
control module

Communication

Cross-connect unit
SCC unit

50 MHz
77 MHz
100 MHz

Clock
module

+3.3 V

Power
module

Fuse

Fuse
Power
module

-48 V/-60 V
-48 V/-60 V

+3.3 V backup power

1.1.1.1.1251 O/E Converting Module


In the receive direction, optical signals are converted into electrical signals. In the transmit
direction, electrical signals are converted into optical signals.

1.1.1.1.1252 Physical Layer Module


The physical layer module mainly performs the following functions:

Maps ATM cells into SDH frames.

Demaps SDH frames to ATM cells.

Implements the following functions at the ATM service physical layer: cell delimitation,
and test and generation of header error control (HEC) sequence.

1.1.1.1.1253 ATM Module


The ATM module mainly performs the following ATM layer functions that are specified in
ATM protocols:

Flow control

Extraction and generation of cell headers

ATM switching

1.1.1.1.1254 E3 Module
The E3 module mainly processes ATM services at the E3 rate. This module performs the
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following functions:

Maps the ATM cells into E3 containers.

Demaps E3 containers to ATM cells.

Implements functions at the ATM physical layer for ATM services at the E3 rate.

1.1.1.1.1255 Mapping Module


The mapping module performs the following functions:

Maps ATM cells into SDH frame payloads.

Demaps SDH frame payloads to ATM cells.

Implements functions at the ATM physical layer.

Implements the VC4-Xv (X4) virtual concatenation.

1.1.1.1.1256 Logic and Control Module


The logic and control module performs the following functions:

Controls writing and reading of each chip.

Communicates with the NE.

Issues configured services.

Reports alarms of each functional module.

Detects R_LOS alarms of optical modules.

Controls the shutting down of the laser.

1.1.1.1.1257 Clock Module


This module mainly generates the required working clock for each chip. The frequency of the
clock can be 50 MHz, 77 MHz, or 100 MHz.

1.1.1.1.1258 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

13.1.5 Front Panel


The front panel of the ADL4 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1259 Diagram of the Front Panel


Figure 13-4 shows the appearance of the front panel of the ADL4.

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Figure 1.1 Front panel of the ADL4

ADL4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1

ADL4

1.1.1.1.1260 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1261 Interfaces
The front panel of the ADL4 has one optical interface. Table 13-2 describes the type and
usage of the optical interface of the ADL4.

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Figure 1.1 Optical interface of the ADL4


Interface

Type of
Interface

Usage

OUT1/IN1

LC
(swappable)

Transmits and receives STM-4 optical signals.

13.1.6 Jumpers and DIP Switches


The ADL4 does not have any jumpers or DIP switches that are used for board settings.

13.1.7 Valid Slots


The ADL4 must be installed in a valid slot in the subrack. Otherwise, the ADL4 cannot work
normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the ADL4 vary with the cross-connect capacity of the subrack. The slots
valid for the ADL4 are as follows:

When the cross-connect capacity is 200 Gbit/s, the ADL4 can be installed in slots 18
and 1117. In this case, the bandwidth is 1.25 Gbit/s.

13.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the ADL4 indicates the type of optical interface.
Table 13-3 provides the relationship between the feature code of the ADL4 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the ADL4 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1ADL410

10

S-4.1

SSN1ADL411

11

L-4.1

SSN1ADL412

12

L-4.2

SSN1ADL413

13

Ve-4.2

13.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
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board, commissioning the board, and checking the operation of the board.

1.1.1.1.1262 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1263 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring ATM and IMA Services.
Step 7 Required: Set the interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

C2 byte: Check whether the ATM parameter is set on both ends. The setting of the
C2 byte on the interconnected equipment must be consistent.

For details, see 27.7 Checking Board Parameters.


----End

1.1.1.1.1264 Commissioning the Board


Step 1 Connect the ATM instrument to the external optical interface of the board.
Step 8 Perform an outloop at the ATM port on the cross-connect side of the board. For the settings,
see 27.7 Checking Board Parameters.
Step 9 Configure the basic ATM services on the instrument.
Step 10 Send the ATM services on the instrument.
Step 11 Check whether the services received on the instrument are normal and check whether certain
cells are discarded.
----End
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1.1.1.1.1265 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 12 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

13.1.10 Parameter Settings


You can set parameters for the ADL4 by using the U2000.
You can set the following main parameters for the ADL4 by using the U2000:

Port type

Flow type

Service type

Peak cell rate (PCR)

Sustainable cell rate (SCR)

Maximum cell burst size

Cell delay variation tolerance (CDVT)

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

13.1.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1266 Troubleshooting
Table 13-4 lists the faults that occur on the ADL4 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the ADL4 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on an ATM port


are interrupted.

The services on all the ATM


ports are interrupted.

Packet loss

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Service


Packet Loss.
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Fault Symptom

Common Fault Cause

Interconnection
fault

The interconnection fault


occurs on a single ATM port.

The interconnection fault


occurs on the VCTRUNK port.

Troubleshooting Method
See Troubleshooting Device
Interconnection Faults.

1.1.1.1.1267 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the ADL4, see Replacing an ATM Board.

13.1.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

13.1.12.1 Alarms of N1ADL4


AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

CC_LOC

CHCS

COMMUN_FAIL

FPGA_ABN

HARD_BAD

HP_LOM

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

J0_MM

LASER_MOD_ERR

LASER_SHUT

LCD

LOOP_ALM

LP_RDI_VC3

LP_REI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LSR_NO_FITED

LSR_WILL_DIE

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OCD

OUT_PWR_ABN

POWER_ABNORMAL

R_LOF

R_LOS

R_LOSYNC

R_OOF

SLAVE_WORKING

TEM_HA

TEM_LA

TF

TU_AIS_VC3

TU_LOP_VC3

UHCS

VC_AIS

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VC_RDI

VCAT_LOA

VCAT_LOM_VC4

VCAT_SQM_VC4

VP_AIS

VP_RDI

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

13.1.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

13.1.13.1 Performance Events of N1ADL4


Figure 1.1 SDH
AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSSES

RSUAS

TUPJCHIGH

TUPJCLOW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3SES

VC3UAS

Figure 1.2 ATM


ATM_INGCELL

ATM_EGCELL

ATM_CORRECTED_HCS
ERR

ATM_UNCORRECTED_HCS
ERR

ATM_RECV_CELL

ATM_RECV_IDLECELL

ATM_TRAN_CELL

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13.1.14 Technical Specifications


The technical specifications of the ADL4 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1268 Parameters Specified for Optical Interfaces


Table 13-7 lists the parameters specified for the optical interfaces of the ADL4.
Figure 1.1 Parameters specified for the optical interfaces of the ADL4
Parameter

Value

Type of optical
interface

S-4.1

L-4.1

L-4.2

Ve-4.2

Type of fiber

Single-mode LC

Single-mode
LC

Single-mode
LC

Single-mode
LC

Operating
wavelength range
(nm)

1274 to 1356

1280 to 1335

1480 to 1580

1480 to 1580

Launched optical
power range
(dBm)

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Minimum
overload (dBm)

-8

-8

-8

-13

Receiver
sensitivity (dBm)

-28

-28

-28

-34

Minimum
extinction ratio
(dB)

8.2

10

10

10.5

Maximum -20 dB
spectral width
(nm)

Minimum side
mode suppression
ratio (dB)

30

30

30

1.1.1.1.1269 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1270 Mechanical Specifications


The mechanical specifications of the ADL4 are as follows:

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Weight (kg): 0.9

1.1.1.1.1271 Power Consumption


The maximum power consumption of the ADL4 at room temperature (25C) is 41 W.

13.2 ADQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the ADQ1 (4xSTM-1 ATM service processing board). This topic
also describes how to configure and commission the ADQ1.

13.2.1 Version Description


The ADQ1 is available in one functional version, namely, N1.

13.2.2 Application
The ATM board is used in the network that is based on ATM switching and transmission. The
ATM board can carry various types of ATM services.
The ADQ1 provides four standard STM-1 optical interfaces and can be interconnected with
the switch or DSLAM to transmit the ATM services. In addition, the ADQ1 can switch cell
headers to converge and multiplex bandwidths so that the bandwidths are not wasted. The
ADQ1 supports the following types of application of the ATM services:

Application of the ATM Services That Occupy Bandwidths Exclusively

Application of the ATM Services That Share Bandwidths

1.1.1.1.1272 Application of the ATM Services That Occupy Bandwidths Exclusively


When the ATM services do not share bandwidths, only the ATM service processing boards on
the source NE and sink NE perform ATM layer processing for the ATM services. The
intermediate NEs that the ATM services traverse do not perform ATM layer processing and
only pass through the ATM services on the SDH timeslots. In this case, each ATM service
occupies the VC-3 or VC-4 channel exclusively. The ATM services can be converged at the
central node and then transmitted on the STM-4 optical interface. Figure 13-5 shows the
networking and application of the ATM services that occupy bandwidths exclusively.

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Figure 1.1 Networking and application of the ATM services that occupy bandwidths exclusively
DSLAM

34 Mbit/s
ATM traffic

Service
convergence

NE1
155 Mbit/s
ATM traffic

622 Mbit/s
ATM traffic

2.5 Gbit/s
SDH ring
NE2

NE4

DSLAM

Router

NE3

34 Mbit/s
ATM traffic
DSLAM

1.1.1.1.1273 Application of the ATM Services That Share Bandwidths


The VP-ring and VC-ring realize bandwidth sharing and statistical multiplexing for the ATM
services. The ATM services on each NE share one VC (VC-3, VC-4, or VC-4-Xv) channel. In
this case, each NE performs ATM layer processing for the ATM services. Figure 13-6 shows
the networking and application of the ATM services that share bandwidths.

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Figure 1.2 Networking and application of the ATM services that share bandwidths
The ATM services on NE1 are
dropped on NE2, then converged DSLAM
with the other ATM services, and
finally sent to the VP/VC-ring.
NE1

34 Mbit/s
ATM traffic

155 Mbit/s
ATM traffic

NE4
VC4-Xv
VP/VC-ring

DSLAM

Router

622 Mbit/s
ATM traffic

NE2

NE3
34 Mbit/s
ATM traffic
DSLAM

13.2.3 Functions and Features


The ADQ1 supports the ATM switching and ATM protection.
Table 13-8 provides the functions and features of the ADQ1.
Figure 1.1 Functions and features of the ADQ1
Function and
Feature

ADQ1

Basic functions

Transmits/Receives and processes 4xSTM-1 ATM services.

Type of optical
interface

Supports different types of standard optical interfaces, namely, the


I-1, Ie-1, S-1.1, L-1.1, L-1.2, and Ve-1.2. The characteristics of
the optical interfaces of the I-1, S-1.1, L-1.1, and L-1.2 types
comply with ITU-T G.957. The characteristics of the optical
interfaces of the Ie-1 and Ve-1.2 types comply with the standards
defined by Huawei.

Connector type

LC

Optical module type

SFP

E3 ATM interface

Supports 12xE3 signals, which are accessed through the PD3,


PL3, or N1PL3A.

IMA function

Does not support the IMA function.

Maximum uplink
bandwidth

Supports a bandwidth of 8xVC-4s, or a bandwidth of 12xVC-3s


and 4xVC-4s.

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Function and
Feature

13 ATM Boards

ADQ1
NOTE
Only VC-4s numbered 5-8 support the binding of VC-3 paths.

ATM switching
capability

Unidirectional: 1.2 Gbit/s; bidirectional: 600 Mbit/s

Mapping granularities

Supports VC-3, VC-4, and VC4-Xv (X = 14) granularities.

Service types

Supports the CBR, rt-VBR, nrt-VBR and UBR.

Number of supported
ATM connections

2048

Statistical
multiplexing

Supports the statistical multiplexing.

Flow types and QoS

Complies with IETF RFC2514 and ATM forum TM4.0.

ATM multicast
connection

Supports the spatial multicast and logical multicast.

ATM protection (ITUT I.630)

Supports the unidirectional/bidirectional 1+1,


unidirectional/bidirectional 1:1, VP-Ring, and VC-Ring protection
schemes.

OAM functions (ITUT I.610)

Supports the AIS, RDI, LB, and CC.

Maintenance features

Supports inloops at the ATM layer and on optical interfaces.


Supports outloops at the ATM layer.
These features can be used to locate faults quickly.

Alarms and
performance events

Reports various alarms and performance events, which can be


used to locate faults and maintain the equipment.

13.2.4 Working Principle and Signal Flow


The ADQ1 consists of the O/E converting module, physical layer module, ATM module, E3
module, mapping module, logic and control module, clock module, and power module.
Figure 13-7 shows the functional block diagram of the ADQ1.

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Figure 1.1 Functional block diagram of the ADQ1


Backplane
4x155
Mbit/s

4x155
Mbit/s

E/O

4x155
Mbit/s

O/E

Physical
layer
4x155 module
Mbit/s

ATM
module

High-speed
bus

Cross-connect unit

High-speed
bus

Cross-connect unit

Mapping
module
E3
module

O/E converting
module

Reference clock and frame header

LOS
Laser shutdown

Logic and
control module

Communication

Cross-connect unit
SCC unit

50 MHz
77 MHz
100 MHz

Clock
module

+3.3 V

Power
module

Fuse

Fuse
Power
module

-48 V/-60 V
-48 V/-60 V

+3.3 V backup power

1.1.1.1.1274 O/E Converting Module


In the receive direction, optical signals are converted into electrical signals. In the transmit
direction, electrical signals are converted into optical signals.

1.1.1.1.1275 Physical Layer Module


The physical layer module mainly performs the following functions:

Maps ATM cells into SDH frames.

Demaps SDH frames to ATM cells.

Implements the following functions at the ATM service physical layer: cell delimitation,
and test and generation of header error control (HEC) sequence.

1.1.1.1.1276 ATM Module


The ATM module mainly performs the following ATM layer functions that are specified in
ATM protocols:

Flow control

Extraction and generation of cell headers

ATM switching

1.1.1.1.1277 E3 Module
The E3 module mainly processes ATM services at the E3 rate. This module performs the
following functions:
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Maps the ATM cells into E3 containers.

Demaps E3 containers to ATM cells.

Implements functions at the ATM physical layer for ATM services at the E3 rate.

1.1.1.1.1278 Mapping Module


The mapping module performs the following functions:

Maps ATM cells into SDH frame payloads.

Demaps SDH frame payloads to ATM cells.

Implements functions at the ATM physical layer.

Implements the VC4-Xv (X4) virtual concatenation.

1.1.1.1.1279 Logic and Control Module


The logic and control module performs the following functions:

Controls writing and reading of each chip.

Communicates with the NE.

Issues configured services.

Reports alarms of each functional module.

Detects R_LOS alarms of optical modules.

Controls the shutting down of the laser.

1.1.1.1.1280 Clock Module


This module mainly generates the required working clock for each chip. The frequency of the
clock can be 50 MHz, 77 MHz, or 100 MHz.

1.1.1.1.1281 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

13.2.5 Front Panel


The front panel of the ADQ1 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1282 Diagram of the Front Panel


Figure 13-8 shows the appearance of the front panel of the ADQ1.

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Figure 1.1 Front panel of the ADQ1

ADQ1
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

ADQ1

1.1.1.1.1283 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1284 Interfaces
The front panel of the ADQ1 has four optical interfaces. Table 13-9 describes the types and
usage of the optical interfaces of the ADQ1.

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Figure 1.1 Optical interfaces of the ADQ1


Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT2/IN2

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT3/IN3

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT4/IN4

LC (swappable)

Transmits and receives STM-1 optical signals.

13.2.6 Jumpers and DIP Switches


The ADQ1 does not have any jumpers or DIP switches that are used for board settings.

13.2.7 Valid Slots


The ADQ1 must be installed in a valid slot in the subrack. Otherwise, the ADQ1 cannot work
normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the ADQ1 vary with the cross-connect capacity of the subrack. The slots
valid for the ADQ1 are as follows:

When the cross-connect capacity is 200 Gbit/s, the ADQ1 can be installed in slots 18
and 1117. In this case, the bandwidth is 1.25 Gbit/s.

13.2.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the ADQ1 indicates the type of optical interface.
Table 13-10 provides the relationship between the feature code of the ADQ1 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the ADQ1 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1ADQ110

10

S-1.1

SSN1ADQ111

11

L-1.1

SSN1ADQ112

12

L-1.2

SSN1ADQ113

13

Ve-1.2

SSN1ADQ114

14

Ie-1

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13.2.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1285 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1286 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring ATM and IMA Services.
Step 7 Required: Set the interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

C2 byte: Check whether the ATM parameter is set on both ends. The setting of the
C2 byte on the interconnected equipment must be consistent.

For details, see 27.7 Checking Board Parameters.


----End

1.1.1.1.1287 Commissioning the Board


Step 1 Connect the ATM instrument to the external optical interface of the board.
Step 8 Perform an outloop at the ATM port on the cross-connect side of the board. For the settings,
see 27.7 Checking Board Parameters.
Step 9 Configure the basic ATM services on the instrument.
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Step 10 Send the ATM services on the instrument.


Step 11 Check whether the services received on the instrument are normal and check whether certain
cells are discarded.
----End

1.1.1.1.1288 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 12 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

13.2.10 Parameter Settings


You can set parameters for the ADQ1 by using the U2000.
You can set the following main parameters for the ADQ1 by using the U2000:

Port type

Flow type

Service type

PCR

SCR

Maximum cell burst size

CDVT

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

13.2.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1289 Troubleshooting
Table 13-11 lists the faults that occur on the ADQ1 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the ADQ1 frequently
Fault Symptom

Common Fault Cause

Service
interruption

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Troubleshooting Method

The services on a VCTRUNK


port are interrupted.

See Troubleshooting TDM Service


Interruptions.

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Fault Symptom

13 ATM Boards

Common Fault Cause

The services on an ATM port


are interrupted.

The services on all the ATM


ports are interrupted.

Troubleshooting Method

Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

The interconnection fault


occurs on a single ATM port.

See Troubleshooting Device


Interconnection Faults.

The interconnection fault


occurs on the VCTRUNK port.

1.1.1.1.1290 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the ADQ1, see Replacing an ATM Board.

13.2.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

13.2.12.1 Alarms of N1ADQ1


AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_EXC_VC3

B3_SD

B3_SD_VC3

BD_STATUS

CC_LOC

CHCS

COMMUN_FAIL

FPGA_ABN

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

J0_MM

LASER_MOD_ERR

LASER_SHUT

LCD

LOOP_ALM

LP_RDI_VC3

LP_REI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LSR_NO_FITED

LSR_WILL_DIE

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OCD

OUT_PWR_ABN

POWER_ABNORMAL

R_LOF

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R_LOS

R_LOSYNC

R_OOF

SLAVE_WORKING

TEM_HA

TEM_LA

TF

TU_AIS_VC3

TU_LOP_VC3

UHCS

VC_AIS

VC_RDI

VCAT_LOA

VCAT_LOM_VC4

VCAT_SQM_VC4

VP_AIS

VP_RDI

W_R_FAIL

PATCHFILE_NOTEXIST

PATCH_ERR

PATCH_NOT_CONFIRM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

13.2.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

13.2.13.1 Performance Events of N1ADQ1


Figure 1.1 SDH
AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSSES

MSUAS

RSBBE

RSCSES

RSES

RSSES

RSUAS

TUPJCHIGH

TUPJCLOW

VC3BBE

VC3CSES

VC3ES

VC3FEBBE

VC3FECSES

VC3FEES

VC3FESES

VC3SES

VC3UAS

Figure 1.2 ATM


ATM_INGCELL
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ERR
ATM_UNCORRECTED_HCS
ERR

ATM_RECV_CELL

ATM_RECV_IDLECELL

ATM_TRAN_CELL

13.2.14 Technical Specifications


The technical specifications of the ADQ1 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1291 Parameters Specified for Optical Interfaces


Table 13-14 lists the parameters specified for the optical interfaces of the ADQ1.
Figure 1.1 Parameters specified for the optical interfaces of the ADQ1
Parameter

Value

Type of optical
interface

Ie-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Type of fiber

Multimode LC

Single-mode
LC

Single-mode
LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1270 to
1380

1261 to 1360

1263 to
1360

1480 to
1580

1480 to 1580

Transmission
distance (km)

0 to 0.5

2 to 15

15 to 40

40 to 80

80 to 100

Launched
optical power
range (dBm)

-19 to -14

-15 to -8

-5 to 0

-5 to 0

-3 to 0

Receive optical
power (dBm)

-30

-28

-34

-34

-34

Minimum
overload
(dBm)

-14

-8

-10

-10

-10

Minimum
extinction ratio
(dB)

10

8.2

10

10

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression

30

30

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Parameter

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Value

ratio (dB)

1.1.1.1.1292 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1293 Mechanical Specifications


The mechanical specifications of the ADQ1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.1294 Power Consumption


The maximum power consumption of the ADQ1 at room temperature (25C) is 41 W.

13.3 IDL4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the IDL4 (1xSTM-4 ATM service processing board). This topic
also describes how to configure and commission the IDL4.

13.3.1 Version Description


The IDL4 is available in one functional version, namely, N1.

13.3.2 Application
The IMA technology demultiplexes the assembled ATM cell flow into multiple low-speed
links, and multiplexed the multiple low-speed links on the remote end to restore the original
assembled cell flow. The IMA technology realizes the interconnection between high-speed
links and low-speed links.
The IMA board is applicable to the transmission of the ATM cells on the E1 interface or
interfaces at the other rates. The IMA board only provides a channel and does not process the
service type or ATM cells. That is, the IMA board transparently transmits the ATM layer
signals and higher-layer signals. Figure 13-9 shows the networking and application of the
IMA services.

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Figure 1.1 Networking and application of the IMA services


RNC
NE1
NMS
25 km
NodeB 1

40 km

NE2

NE4

Two-fiber bidirectional
MSP ring

NodeB 4
35 km

30 km
NE3

NodeB 2

NodeB 3

13.3.3 Functions and Features


The IDL4 supports the ATM switching, IMA, and ATM protection.
Table 13-15 provides the functions and features of the IDL4.
Figure 1.1 Functions and features of the IDL4
Function and
Feature

IDL4

Basic functions

Transmits/Receives and processes 1xSTM-4 ATM services.

Type of optical
interface

Supports the following types of optical interfaces: S-4.1, L-4.1, L4.2 and Ve-4.2.

Connector type

LC

Optical module type

SFP

E3 ATM interface

Does not support the E3 ATM interface.

IMA functions
(ATM Forum IMA
1.1)

Transmits/Receives and processes IMA services when the IDL4


is used with the E1 service processing board N1PQ1 or N1PQM.

Supports a maximum of 63 E1 IMA services.

Supports the mapping between ATM ports and a maximum of 16


IMA groups. Each IMA group supports 132 E1 signals.

Supports the mapping between ATM ports and a maximum of 16


E1 links that belong to non-IMA groups.

Supports the maximum IMA multichannel delay of 226 ms.

Maximum uplink
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Supports a bandwidth of 8xVC-4s, or a bandwidth of 63xVC-12s


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Function and
Feature

IDL4

bandwidth

and 7xVC-4s.

13 ATM Boards

NOTE
Only the first VC-4 supports the binding of VC-12 paths.

ATM switching
capability

Unidirectional: 1.2 Gbit/s; bidirectional: 600 Mbit/s

Mapping
granularities

Supports VC-12, VC-4, VC4-Xc (X = 14), and VC12-Xv (X = 1


32) granularities.

Service types

Supports the CBR, rt-VBR, nrt-VBR and UBR.

Number of
supported ATM
connections

2048

Statistical
multiplexing

Supports the statistical multiplexing.

Flow types and QoS

Complies with IETF RFC2514 and ATM forum TM4.0.

ATM multicast
connection

Supports the spatial multicast and logical multicast.

ATM protection
(ITU-T I.630)

Supports the unidirectional/bidirectional 1+1,


unidirectional/bidirectional 1:1, VP-Ring, and VC-Ring protection
schemes.

Board-level 1+1
protection

Supports the board-level 1+1 protection.

OAM functions
(ITU-T I.610)

Supports the AIS, RDI, LB, and CC.

Maintenance
features

Supports inloops at the ATM layer and on optical interfaces.


Supports outloops at the ATM layer.
These features can be used to locate faults quickly.

Alarms and
performance events

Reports various alarms and performance events, which can be used


to locate faults and maintain the equipment.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can
coexist with a single E1 signal. The IMA group can dynamically increase or decrease the
bandwidth to improve the bandwidth utilization. The IMA group can also be used to
converge 2 Mbit/s services and to interconnect with other IMA equipment.

13.3.4 Working Principle and Signal Flow


The IDL4 consists of the O/E converting module, physical layer module, ATM module, IMA
module, mapping module, logic and control module, clock module, and power module.
Figure 13-10 shows the functional block diagram of the IDL4 by describing how to process
1xSTM-4 signals.
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Figure 1.1 Functional block diagram of the IDL4


Backplane
622
Mbit/s

E/O

622
Mbit/s

O/E

622
Mbit/s

622
Mbit/s

Physical
layer
module

ATM
module

High-speed
bus

Cross-connect unit A

High-speed
bus

Cross-connect unit B

Mapping
module
IMA
module

O/E converting
module

Reference clock and frame header

LOS
Laser shutdown

Logic and
control module

Communication

Cross-connect unit
SCC unit

50 MHz
77 MHz
100 MHz

Clock
module

+3.3 V

Power
module

Fuse

Fuse
Power
module

-48 V/-60 V
-48 V/-60 V

+3.3 V backup power

1.1.1.1.1295 O/E Converting Module


In the receive direction, optical signals are converted into electrical signals. In the transmit
direction, electrical signals are converted into optical signals.

1.1.1.1.1296 Physical Layer Module


The physical layer module mainly performs the following functions:

Maps ATM cells into SDH frames.

Demaps SDH frames to ATM cells.

Implements the following functions at the ATM service physical layer: cell delimitation,
and test and generation of header error control (HEC) sequence.

1.1.1.1.1297 ATM Module


The ATM module mainly performs the following ATM layer functions that are specified in
ATM protocols:

Flow control

Extraction and generation of cell headers

ATM switching

1.1.1.1.1298 IMA Module


This module mainly performs the following functions that are specified in IMA protocols:
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Separation and re-creation of ATM cells

Frame synchronization

Insertion and extraction of IMA control protocol (ICP) cells

Management of IMA groups

13 ATM Boards

1.1.1.1.1299 Mapping Module


The mapping module performs the following functions:

Maps ATM cells into SDH frame payloads.

Demaps SDH frame payloads to ATM cells.

Implements functions at the ATM physical layer.

Implements the VC4-Xv (X4) virtual concatenation.

1.1.1.1.1300 Logic and Control Module


The logic and control module performs the following functions:

Controls writing and reading of each chip.

Communicates with the NE.

Issues configured services.

Reports alarms of each functional module.

Detects R_LOS alarms of optical modules.

Controls the shutting down of the laser.

1.1.1.1.1301 Clock Module


This module mainly generates the required working clock for each chip. The frequency of the
clock can be 50 MHz, 77 MHz, or 100 MHz.

1.1.1.1.1302 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

13.3.5 Front Panel


The front panel of the IDL4 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1303 Diagram of the Front Panel


Figure 13-11 shows the appearance of the front panel of the IDL4.

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Figure 1.1 Front panel of the IDL4

IDL4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1

IDL4

1.1.1.1.1304 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1305 Interfaces
The front panel of the IDL4 has one optical interface. Table 13-16 describes the type and
usage of the optical interface of the IDL4.

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Figure 1.1 Optical interface of the IDL4


Interface

Type of
Interface

Usage

OUT1/IN1

LC
(swappable)

Transmits and receives STM-4 optical signals.

13.3.6 Jumpers and DIP Switches


The IDL4 does not have any jumpers or DIP switches that are used for board settings.

13.3.7 Valid Slots


The IDL4 must be installed in a valid slot in the subrack. Otherwise, the IDL4 cannot work
normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the IDL4 vary with the cross-connect capacity of the subrack. The slots
valid for the IDL4 are as follows:

When the cross-connect capacity is 200 Gbit/s, the IDL4 can be installed in slots 18 and
1117. In this case, the bandwidth is 1.25 Gbit/s.

13.3.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the SL1 indicates the type of optical interface.
Table 13-17 provides the relationship between the feature code of the IDL4 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the IDL4 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1IDL410

10

S-4.1

SSN1IDL411

11

L-4.1

SSN1IDL412

12

L-4.2

SSN1IDL413

13

Ve-4.2

13.3.9 Board Protection


The IDL4 supports the 1+1 board-level protection. The working IDL4 and protection IDL4
should be installed in paired slots.
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The paired slots valid for the IDL4 vary with the cross-connect capacity.

When the cross-connect capacity is 200 Gbit/s: (slot 8, slot 11), (slot 7, slot 12), (slot 6,
slot 13), (slot 5, slot 14), (slot 4, slot 15), (slot 3, slot 16), and (slot 2, slot 17)

13.3.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1306 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1307 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring ATM and IMA Services.
Step 7 Required: Set the interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

C2 byte: Check whether the ATM parameter is set on both ends. The setting of the
C2 byte on the interconnected equipment must be consistent.

For details, see 27.7 Checking Board Parameters.


----End

1.1.1.1.1308 Commissioning the Board


Step 1 Use the ATM instrument (for example, AX4000) to test the ATM services.
1.
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Connect the ATM instrument to the external optical interface of the board.
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2.

Perform an outloop at the ATM port on the cross-connect side of the board. For the
settings, see 27.7 Checking Board Parameters.

3.

Configure the basic ATM services on the instrument.

4.

Send the ATM services on the instrument.

5.

Check whether the services received on the instrument are normal and check whether
certain cells are discarded.

Step 8 Use the IMA instrument (for example, AX4000) to test the IMA services.
1.

Connect the IMA instrument to the cross-connect side of the board. The connection can
be realized by using the E1 tributary board.

2.

Perform an outloop on the optical interface side of the board by using optical fiber pairs.

3.

Configure the basic IMA services on the instrument.

4.

Send the IMA services on the instrument.

5.

Check whether the services received on the instrument are normal and check whether
certain cells are discarded.

----End

1.1.1.1.1309 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

13.3.11 Parameter Settings


You can set parameters for the IDL4 by using the U2000.
You can set the following main parameters for the IDL4 by using the U2000:

Port type

Flow type

Service type

PCR

SCR

Maximum cell burst size

CDVT

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

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13.3.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1310 Troubleshooting
Table 13-18 lists the faults that occur on the IDL4 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the IDL4 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on an ATM port


are interrupted.

The services on all the ATM


ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on an ATM port


are transiently interrupted.

The protocol becomes


abnormal.

Transient service
interruption

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

The interconnection fault


occurs on a single ATM port.

See Troubleshooting Device


Interconnection Faults.

The interconnection fault


occurs on the VCTRUNK port.

The IMA interconnection fault


occurs.

1.1.1.1.1311 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the IDL4, see Replacing an ATM Board.

13.3.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

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13.3.13.1 Alarms of N1IDL4


ALM_E1AIS

ALM_IMA_LIF

ALM_IMA_LINK_LCD

ALM_IMA_LODS

ALM_IMA_RE_RX_UNUSAB
LE

ALM_IMA_RE_TX_UNUSAB
LE

ALM_IMA_RFI

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_SD

BD_STATUS

BIP_EXC

BIP_SD

CC_LOC

CHCS

COMMUN_FAIL

FPGA_ABN

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

J0_MM

LASER_MOD_ER
R

LASER_SHUT

LCD

LFA

LMFA

LOOP_ALM

LP_RDI

LP_REI

LP_SLM

LP_TIM

LP_UNEQ

LSR_NO_FITED

LSR_WILL_DIE

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OCD

OUT_PWR_ABN

POWER_ABNORMAL

R_LOF

R_LOS

R_LOSYNC

R_OOF

SLAVE_WORKIN
G

TEM_HA

TEM_LA

TF

TU_AIS

TU_LOP

UHCS

VC_AIS

VC_RDI

VCAT_LOA

VCAT_LOM_VC4

VCAT_SQM_VC4

VCG_MM

VP_AIS

VP_RDI

VPG_MM

W_R_FAIL

WRG_BD_TYPE

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

SWDL_PKG_NOB
DSOFT

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13.3.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

13.3.14.1 Performance Events of N1IDL4


Figure 1.1 SDH
AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSSES

MSUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

Figure 1.2 ATM


ATM_INGCELL

ATM_EGCELL

ATM_CORRECTED_HCS
ERR

ATM_UNCORRECTED_HCS
ERR

ATM_RECV_CELL

ATM_RECV_IDLECELL

ATM_TRAN_CELL

13.3.15 Technical Specifications


The technical specifications of the IDL4 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.
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1.1.1.1.1312 Parameters Specified for Optical Interfaces


Table 13-21 lists the parameters specified for the optical interfaces of the IDL4.
Figure 1.1 Parameters specified for the optical interfaces of the IDL4
Parameter

Value

Type of optical
interface

S-4.1

L-4.1

L-4.2

Ve-4.2

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Single-mode
LC

Operating
wavelength range
(nm)

1274 to 1356

1280 to 1335

1480 to 1580

1480 to 1580

Launched optical
power range (dBm)

-15 to -8

-3 to +2

-3 to +2

-3 to +2

Receiver sensitivity
(dBm)

-28

-28

-28

-34

Minimum overload
(dBm)

-8

-8

-8

-13

Minimum
extinction ratio (dB)

8.2

10

10

10.5

Maximum -20 dB
spectral width (nm)

Minimum side
mode suppression
ratio (dB)

30

30

30

1.1.1.1.1313 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1314 Mechanical Specifications


The mechanical specifications of the IDL4 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.1315 Power Consumption


The maximum power consumption of the IDL4 at room temperature (25C) is 41 W.

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13.4 IDQ1
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the IDQ1 (4xSTM-1 ATM service processing board). This topic
also describes how to configure and commission the IDQ1.

13.4.1 Version Description


The IDQ1 is available in one functional version, namely, N1.

13.4.2 Application
The IMA technology demultiplexes the assembled ATM cell flow into multiple low-speed
links, and multiplexed the multiple low-speed links on the remote end to restore the original
assembled cell flow. The IMA technology realizes the interconnection between high-speed
links and low-speed links.
The IMA board is applicable to the transmission of the ATM cells on the E1 interface or
interfaces at the other rates. The IMA board only provides a channel and does not process the
service type or ATM cells. That is, the IMA board transparently transmits the ATM layer
signals and higher-layer signals. Figure 13-12 shows the networking and application of the
IMA services.
Figure 1.1 Networking and application of the IMA services
RNC
NE1
NMS
25 km
NodeB 1

40 km

NE2

NE4

Two-fiber bidirectional
MSP ring

NodeB 4
35 km

30 km
NE3

NodeB 2

NodeB 3

13.4.3 Functions and Features


The IDQ1 supports the ATM switching, IMA, and ATM protection.
Table 13-22 provides the functions and features of the IDQ1.

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Figure 1.1 Functions and features of the IDQ1


Function and
Feature

IDQ1

Basic functions

Transmits/Receives and processes 4xSTM-1 ATM services.

Type of optical
interface

Supports different types of standard optical interfaces, namely, the Ie1, S-1.1, L-1.1, L-1.2, and Ve-1.2. The characteristics of the optical
interfaces of the I-1, S-1.1, L-1.1, and L-1.2 types comply with ITU-T
G.957. The characteristics of the optical interfaces of the Ie-1 and Ve1.2 types comply with the standards defined by Huawei.

Connector type

LC

Optical module
type

SFP

E3 ATM interface

Does not support the E3 ATM interface.

IMA functions
(ATM Forum
IMA 1.1)

Transmits/Receives and processes IMA services when the IDQ1 is


used with the E1 service processing board N1PQ1 or N1PQM.

Supports a maximum of 63 E1 IMA services.

Supports the mapping between ATM ports and a maximum of 93


IMA groups. Each IMA group supports 132 E1 signals.

Supports the mapping between ATM ports and a maximum of 16


E1 links that belong to non-IMA groups.

Supports the maximum IMA multichannel delay of 226 ms.

Maximum uplink
bandwidth

Supports a bandwidth of 8xVC-4s, or a bandwidth of 63xVC-12s and


7xVC-4s. The IDQ1 can adapt to the bandwidth of the slot.
NOTE
Only the first VC-4 supports the binding of VC-12 paths.

ATM switching
capability

Unidirectional: 1.2 Gbit/s; bidirectional: 600 Mbit/s

Mapping
granularities

Supports VC-12, VC-4, VC4-Xc (X = 14), and VC12-Xv (X = 132)


granularities.

Service types

Supports the CBR, rt-VBR, nrt-VBR, and UBR.

Number of
supported ATM
connections

2048

Statistical
multiplexing

Supports the statistical multiplexing.

Flow types and


QoS

Complies with IETF RFC2514 and ATM forum TM4.0.

ATM multicast
connection

Supports the spatial multicast and logical multicast.

ATM protection
(ITU-T I.630)

Supports unidirectional/bidirectional 1+1, unidirectional/bidirectional


1:1, VP-Ring, and VC-Ring protection schemes.

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Function and
Feature

IDQ1

Board-level 1+1
protection

Supports the board-level 1+1 protection.

OAM functions
(ITU-T I.610)

Supports the AIS, RDI, LB, and CC.

Maintenance
features

Supports inloops at the ATM layer and on optical interfaces.


Supports outloops at the ATM layer.
These features can be used to locate faults quickly.

Alarm and
performance event

Reports various alarms and performance events, which can be used to


locate faults and maintain the equipment.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can
coexist with a single E1 signal. The IMA group can dynamically increase or decrease the
bandwidth to improve the bandwidth utilization. The IMA group can also be used to
converge 2 Mbit/s services and to interconnect with other IMA equipment.

13.4.4 Working Principle and Signal Flow


The IDQ1 consists of the O/E converting module, physical layer module, ATM module, IMA
module, mapping module, logic and control module, clock module, and power module.
Figure 13-13 shows the functional block diagram of the IDQ1.

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Figure 1.1 Functional block diagram of the IDQ1


Backplane
4x155
Mbit/s

4x155
Mbit/s

E/O

4x155
Mbit/s

O/E

Physical
layer
4x155 module
Mbit/s

ATM
module

High-speed
bus

Cross-connect unit A

High-speed
bus

Cross-connect unit B

Mapping
module
IMA
module

O/E converting
module

Reference clock and frame header

LOS
Laser shutdown

Logic and
control module

Communication

Cross-connect unit
SCC unit

50 MHz
77 MHz
100 MHz

Clock
module

+3.3 V

Power
module

Fuse

Fuse
Power
module

-48 V/-60 V
-48 V/-60 V

+3.3 V backup power

1.1.1.1.1316 O/E Converting Module


In the receive direction, optical signals are converted into electrical signals. In the transmit
direction, electrical signals are converted into optical signals.

1.1.1.1.1317 Physical Layer Module


The physical layer module mainly performs the following functions:

Maps ATM cells into SDH frames.

Demaps SDH frames to ATM cells.

Implements the following functions at the ATM service physical layer: cell delimitation,
and test and generation of header error control (HEC) sequence.

1.1.1.1.1318 ATM Module


The ATM module mainly performs the following ATM layer functions that are specified in
ATM protocols:

Flow control

Extraction and generation of cell headers

ATM switching

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1.1.1.1.1319 IMA Module


This module mainly performs the following functions that are specified in IMA protocols:

Separation and re-creation of ATM cells

Frame synchronization

Insertion and extraction of IMA control protocol (ICP) cells

Management of IMA groups

1.1.1.1.1320 Mapping Module


The mapping module performs the following functions:

Maps ATM cells into SDH frame payloads.

Demaps SDH frame payloads to ATM cells.

Implements functions at the ATM physical layer.

Implements the VC4-Xv (X4) virtual concatenation.

1.1.1.1.1321 Logic and Control Module


The logic and control module performs the following functions:

Controls writing and reading of each chip.

Communicates with the NE.

Issues configured services.

Reports alarms of each functional module.

Detects R_LOS alarms of optical modules.

Controls the shutting down of the laser.

1.1.1.1.1322 Clock Module


This module mainly generates the required working clock for each chip. The frequency of the
clock can be 50 MHz, 77 MHz, or 100 MHz.

1.1.1.1.1323 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

13.4.5 Front Panel


The front panel of the IDQ1 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1324 Diagram of the Front Panel


Figure 13-14 shows the appearance of the front panel of the IDQ1.

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Figure 1.1 Front panel of the IDQ1

IDQ1
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

IDQ1

1.1.1.1.1325 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1326 Interfaces
The front panel of the IDQ1 has four optical interfaces. Table 13-23 describes the types and
usage of the optical interfaces of the IDQ1.

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Figure 1.1 Optical interfaces of the IDQ1


Interface

Type of Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT2/IN2

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT3/IN3

LC (swappable)

Transmits and receives STM-1 optical signals.

OUT4/IN4

LC (swappable)

Transmits and receives STM-1 optical signals.

13.4.6 Jumpers and DIP Switches


The IDQ1 does not have any jumpers or DIP switches that are used for board settings.

13.4.7 Valid Slots


The IDQ1 must be installed in a valid slot in the subrack. Otherwise, the IDQ1 cannot work
normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the IDQ1 vary with the cross-connect capacity of the subrack. The slots
valid for the IDQ1 are as follows:

When the cross-connect capacity is 200 Gbit/s, the IDQ1 can be installed in slots 18
and 1117. In this case, the bandwidth is 1.25 Gbit/s.

13.4.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the IDQ1 indicates the type of optical interface.
Table 13-24 provides the relationship between the feature code of the IDQ1 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the IDQ1 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN1IDQ110

10

S-1.1

SSN1IDQ111

11

L-1.1

SSN1IDQ112

12

L-1.2

SSN1IDQ113

13

Ve-1.2

SSN1IDQ114

14

Ie-1

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13.4.9 Board Protection


The IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should be
housed in paired slots.
The valid paired slots for the IDQ1 vary with the cross-connect capacity.

When the cross-connect capacity is 200 Gbit/s: (slot 8, slot 11), (slot 7, slot 12), (slot 6,
slot 13), (slot 5, slot 14), (slot 4, slot 15), (slot 3, slot 16), (slot 2, slot 17)

13.4.10 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1327 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1328 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring ATM and IMA Services.
Step 7 Required: Set the interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

C2 byte: Check whether the ATM parameter is set on both ends. The setting of the
C2 byte on the interconnected equipment must be consistent.

For details, see 27.7 Checking Board Parameters.


----End

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1.1.1.1.1329 Commissioning the Board


Step 1 Use the ATM instrument (for example, AX4000) to test the ATM services.
1.

Connect the ATM instrument to the external optical interface of the board.

2.

Perform an outloop at the ATM port on the cross-connect side of the board. For the
settings, see 27.7 Checking Board Parameters.

3.

Configure the basic ATM services on the instrument.

4.

Send the ATM services on the instrument.

5.

Check whether the services received on the instrument are normal and check whether
certain cells are discarded.

Step 8 Use the IMA instrument (for example, AX4000) to test the IMA services.
1.

Connect the IMA instrument to the cross-connect side of the board. The connection can
be realized by using the E1 tributary board.

2.

Perform an outloop on the optical interface side of the board by using optical fiber pairs.

3.

Configure the basic IMA services on the instrument.

4.

Send the IMA services on the instrument.

5.

Check whether the services received on the instrument are normal and check whether
certain cells are discarded.

----End

1.1.1.1.1330 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 9 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

13.4.11 Parameter Settings


You can set parameters for the IDQ1 by using the U2000.
You can set the following main parameters for the IDQ1 by using the U2000:

Port type

Flow type

Service type

PCR

SCR

Maximum cell burst size

CDVT

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For information about more parameters and the description of each parameter, see 26
Parameter Settings.

13.4.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1331 Troubleshooting
Table 13-25 lists the faults that occur on the IDQ1 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the IDQ1 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on an ATM port


are interrupted.

The services on all the ATM


ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on an ATM port


are transiently interrupted.

The protocol becomes


abnormal.

Transient service
interruption

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

The interconnection fault


occurs on a single ATM port.

See Troubleshooting Device


Interconnection Faults.

The interconnection fault


occurs on the VCTRUNK port.

The IMA interconnection fault


occurs.

1.1.1.1.1332 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the IDQ1, see Replacing an ATM Board.

13.4.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .
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13.4.13.1 Alarms of N1IDQ1


ALM_E1AIS

ALM_IMA_LIF

ALM_IMA_LINK_LCD

ALM_IMA_LODS

ALM_IMA_RE_RX_UNUSAB
LE

ALM_IMA_RE_TX_UNUSAB
LE

ALM_IMA_RFI

AU_AIS

AU_LOP

B1_EXC

B1_SD

B2_EXC

B2_SD

B3_EXC

B3_SD

BD_STATUS

BIP_EXC

BIP_SD

CC_LOC

CHCS

COMMUN_FAIL

FPGA_ABN

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

J0_MM

LASER_MOD_ER
R

LASER_SHUT

LCD

LFA

LMFA

LOOP_ALM

LP_RDI

LP_REI

LP_SLM

LP_TIM

LP_UNEQ

LSR_NO_FITED

LSR_WILL_DIE

MS_AIS

MS_RDI

MS_REI

NO_BD_SOFT

OCD

OUT_PWR_ABN

POWER_ABNORMAL

R_LOF

R_LOS

R_LOSYNC

R_OOF

SLAVE_WORKIN
G

TEM_HA

TEM_LA

TF

TU_AIS

TU_LOP

UHCS

VC_AIS

VC_RDI

VCAT_LOA

VCAT_LOM_VC4

VCAT_SQM_VC4

VCG_MM

VP_AIS

VP_RDI

VPG_MM

W_R_FAIL

WRG_BD_TYPE

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

SWDL_PKG_NOB
DSOFT

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13.4.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

13.4.14.1 Performance Events of N1IDQ1


Figure 1.1 SDH
AUPJCHIGH

AUPJCLOW

AUPJCNEW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

LPBBE

LPCSES

LPES

LPFEBBE

LPFECSES

LPFEES

LPFESES

LPSES

LPUAS

MSBBE

MSCSES

MSES

MSFEBBE

MSFECSES

MSFEES

MSFESES

MSSES

MSUAS

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

RSBBE

RSCSES

RSES

RSSES

RSUAS

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

Figure 1.2 ATM


ATM_INGCELL

ATM_EGCELL

ATM_CORRECTED_HCS
ERR

ATM_UNCORRECTED_HCS
ERR

ATM_RECV_CELL

ATM_RECV_IDLECELL

ATM_TRAN_CELL

13.4.15 Technical Specifications


The technical specifications of the IDQ1 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.
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1.1.1.1.1333 Parameters Specified for Optical Interfaces


Table 13-28 lists the parameters specified for the optical interfaces of the IDQ1.
Figure 1.1 Parameters specified for the optical interfaces of the IDQ1
Parameter

Value

Type of optical
interface

Ie-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Type of fiber

Multimode LC

Singlemode LC

Single-mode
LC

Singlemode LC

Single-mode
LC

Operating
wavelength
range (nm)

1270 to
1380

1261 to
1360

1263 to
1360

1480 to
1580

1480 to
1580

Transmission
distance (km)

0 to 0.5

2 to 15

15 to 40

40 to 80

80 to 100

Launched
optical power
range (dBm)

-19 to -14

-15 to -8

-5 to 0

-5 to 0

-3 to 0

Receiver
sensitivity
(dBm)

-30

-28

-34

-34

-34

Minimum
overload (dBm)

-14

-8

-10

-10

-10

Minimum
extinction ratio
(dB)

10

8.2

10

10

10

Maximum -20
dB spectral
width (nm)

Minimum side
mode
suppression ratio
(dB)

30

30

1.1.1.1.1334 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1335 Mechanical Specifications


The mechanical specifications of the IDQ1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

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1.1.1.1.1336 Power Consumption


The maximum power consumption of the IDQ1 at room temperature (25C) is 41 W.

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14

RPR Boards

About This Chapter


The RPR boards include FE/GE Ethernet ring processing boards.
14.1 EGR2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGR2 (2xGE ring processing board). This topic also describes
how to configure and commission the EGR2.
14.2 EMR0
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMR0 (12xFE and 1xGE ring processing board). This topic
also describes how to configure and commission the EMR0.

14.1 EGR2
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EGR2 (2xGE ring processing board). This topic also describes
how to configure and commission the EGR2.

14.1.1 Version Description


The EGR2 is available in one functional version, namely, N2.

14.1.2 Application
The EGR2 is used to transmit/receive Ethernet services, manage bandwidths, and realize
Layer 2 switching of Ethernet services.
Figure 14-1 shows the typical networking and application of the RPR board. The RPR board
accesses and converges Ethernet services, and provides the Ethernet data with the following
data features: Layer 2 switching, port isolation, flow classification, traffic control, VLAN
management, and priority configuration. In addition, the RPR board performs
encapsulation/decapsulation, virtual concatenation, and SDH mapping/demapping for data.
The RPR board can be interconnected with the bandwidth access equipment and the data
communication equipment at the same time, thus to provide a network-level solution.
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When the service converging FE services into GE services is configured, the GE switching board can be
set to the 1000M full-duplex mode or auto-negotiation mode, the VLAN of the convergence service is
variable, and the binding granularity is at the VC-3 or VC-4 level.

Figure 1.1 Networking and application of the RPR board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

14.1.3 Functions and Features


The EGR2 supports the Layer 2 switching, port aggregation, and RPR functions.
Table 14-1 provides the functions and features of the EGR2.
Figure 1.1 Functions and features of the EGR2
Function and
Feature

EGR2

Basic functions

Transmits/Receives and processes 2xGE services.


Supports the RPR feature.

Functions when
being used with the
interface board

Transmits/Receives 2xGE signals by providing interfaces on the


front panel.

Specifications of the
optical interface

The optical interfaces are 1000BASE-SX/LX/ZX/VX Ethernet


optical interfaces.

The optical interfaces support the auto-negotiation function in

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EGR2
compliance with IEEE 802.3z.

Format of service
frames

The optical interfaces use the SFP optical module and support
hot swapping.

When the multi-mode optical fiber is


used, the maximum transmission
distance is 550 m.

When the single-mode optical fiber is


used, the maximum transmission
distance is 10 km.

The optical modules that can meet


different requirements for the
transmission distance such as 40 km
and 80 km can also be used.

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG


formats.

Supports the setting of the frame length to a value ranging from


1518 bytes to 9600 bytes.

Supports the Jumbo frame with a length less than 9600 bytes.

Maximum uplink
bandwidth

2.5 Gbit/s

Mapping
granularities

Supports VC-3, VC3-Xv (X2), VC-4 and VC4-Xv (X8)


granularities.

The EGR2 can adapt to the bandwidth of the slot.

NOTE
VC-3 virtual concatenation on the SDH side supports only one or two VC-3s.
In addition, only the first two VC-3 timeslots of the first VC-4 in the first
STM-4 frame of each VCTRUNK can be used.

Encapsulation
format

Supports the GFP-F and LAPS protocols.

EVPL services

Supports EVPL services. The frame format can be Ethernet II,


IEEE 802.3, IEEE 802.1q TAG, or MPLS Martini.

Supports the MPLS encapsulation and forwarding based on


PORT or PORT+VLAN.

Supports five types of LSPs, including ingress LSP, egress LSP,


transit LSP, RPR ingress LSP, and RPR transit LSP.

Supports a maximum of 512 LSPs.

Supports EVPLAN services that use the stack VLAN


encapsulation.

Supports the self-learning of the source MAC address. The


capacity of the MAC address table in the N2 functional version
is 64K. The aging time of the MAC address can be set and
queried.

Supports the blacklist that can contain 4K records and also the
static MAC address table that can contain 4K records. The sum

EVPLAN services

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14 RPR Boards

EGR2
of the number of records in the blacklist and the number of
addresses in the static MAC address table must not exceed 4K.

Supports the configuration of the static MAC routes. A


maximum of 4K static MAC routes can be configured.

Supports data isolation based on VB+VLAN.

Supports the creation, deletion, and query of the VB. The


maximum number of supported VBs is 16. The maximum
number of logical ports for each VB is 32.

MPLS

Supports MartinioE.

Stack VLAN

Supports the stack VLAN.

VLAN

Supports 4096 VLAN tags, and the addition, deletion, and


exchanging of VLAN tags in compliance with IEEE 802.1q/p.

Supports the replacement of VLAN tags in Ethernet signal


frames.

Link aggregation
function

Supports the aggregation of the links of two GE ports.

RPR

Supports the RPR feature that complies with IEEE 802.17.

Supports a maximum of 255 nodes on the ring network, and


supports stripping at the destination node and weighted fairness
algorithm.

Supports five priority levels, including A0, A1, B_EIR, B_CIR,


and C, and supports automatic discovery of topologies, which
can display the network status in real time.

Supports three protection modes, including Steering, Wrapping,


and Wrapping+Steering. Hence, the signal failure time is less
than 50 ms.

Supports the manual configuration of routes for the services on


the RPR ring network.

Supports the self-learning of routes on the ring, that is, supports


the learning of mapping between MAC addresses and node
numbers.

RSTP

Supports the broadcast packet suppression and RSTP, which comply


with IEEE 802.1w.

IGMP snooping

Supports the IGMP snooping function.

QoS

Supports the CAR. The granularity is 64 kbit/s.

Supports the flow classification based on PORT, PORT+VLAN


ID, or PORT+VLAN ID+VLAN PRI.

LCAS function

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

LPT function

Supports the P2MP LPT.

Flow control

Supports the port-based flow control function that complies with

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Function and
Feature

EGR2

function

IEEE 802.3x.

IEEE 1588v2

Not supported.

Echo test frames

Supports the echo function specified in the RPR OAM function,


which is used to test the connectivity of the link.

Port mirroring

Does not support port mirroring.

Loopback function

Supports inloops on Ethernet ports (at the PHY layer or MAC


layer).

Protection schemes

Supports the following protection schemes at the Ethernet network


level:

STP/RSTP

LCAS

LPT

LAG

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarms and
performance events

Reports various alarms and performance events, which facilitates


the management and maintenance of the equipment.

Warm resets

EGR2 boards support warm resets. If a warm reset is performed on


an EGR2 board, traffic on the board is interrupted.

Cold resets

Supported

Weighted fairness
algorithm

Supports the weighted fairness algorithm.

Automatic discovery
of topologies

Supports the automatic discovery of topologies.

Maximum number
of supported nodes

255

Service priority
levels

Supports A0, A1, B_CIR, B_EIR, and C.

14.1.4 Working Principle and Signal Flow


The EGR2 consists of the Ethernet access module, network processor module, RPR protocol
processing module, mapping module, interface converting module, logic and control module,
clock module, and power module.
Figure 14-2 shows the functional block diagram of the EGR2 by describing how to process
1xGE/FE signals.

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Figure 1.1 Functional block diagram of the EGR2


Backplane

RPR
MAC
(west)

RPR protocol
processing module

Logic and
control module

Cross-connect unit

Cross-connect unit

Mapping module

Laser shutdown
LOS

Interface
converting
module

VCP

Network processor module

RPR
MAC
(east)

DENCP

Control
Network signal Switch
processor
fabric
Data

ENCP

GE/FE Ethernet
access
module

Communication

SCC unit

Reference clock and frame header

50 MHz
77 MHz
125 MHz Clock module
100 MHz

+3.3 V
Power
module

Power
module

Fuse
Fuse

Cross-connect unit

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

RPR: resilient package ring

1.1.1.1.1337 Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or
routers are converted into electrical signals. If the signals are accessed through electrical
interfaces, O/E conversion is not required. At the PHY layer, the electrical signals are decoded
and the ETH_LOS alarm is detected. The electrical signals are converted from serial signals
into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded and converted from electrical signals to optical signals.

1.1.1.1.1338 Network Processor Module


The network processor module consists of the network processor and switch fabric. The
network processor first performs MAC functions, which include code conversion, framing of
Ethernet packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:

MPLS

L2 MPLS VPN

Ethernet/VLAN

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
extracted based on the level (P or PE) of the equipment. Services are then routed or
forwarded.
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The network processor module supports the following functions:

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

1.1.1.1.1339 RPR Protocol Processing Module


The RPR implements the weighted fairness algorithm and statistical multiplexing for the ring
bandwidth. In addition, the RPR provides protection switching schemes. By using the RPR
protocol and RPR weighted fairness algorithm, the RPR protocol processing module controls
the bandwidth of each node accessed by the ring network. In addition, the RPR ring has the
features of spatial reuse and statistical multiplexing. Hence, the bandwidth utilization is
improved.
Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for
topology auto-discovery provides correct and reliable ways of discovering topologies of all
nodes and changes occurring on these topologies.
RPR unicast frames are striped at the destination node and thus the bandwidth on the ring is
reused spatially.
The RPR ring supports a maximum of 255 nodes.

1.1.1.1.1340 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, virtual concatenation services support the LCAS function. The
encapsulation formats are LAPS and GFP-F.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the RPR protocol processing module in
packets.

1.1.1.1.1341 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1342 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
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Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

14 RPR Boards

1.1.1.1.1343 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 100 MHz.

1.1.1.1.1344 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

14.1.5 Front Panel


The front panel of the EGR2 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1345 Diagram of the Front Panel


Figure 14-3 shows the appearance of the front panel of the EGR2.

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Figure 1.1 Front panel of the EGR2

EGR2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2
CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2

EGR2

1.1.1.1.1346 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1347 Interfaces
The front panel of the EGR2 has two optical interfaces. Table 14-2 describes the types and
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usage of the optical interfaces of the EGR2.


Figure 1.1 Optical interfaces of the EGR2
Interface

Type of Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASESX/LX/ZX/VX signals.

OUT2/IN2

LC (swappable)

Transmits and receives 1000BASESX/LX/ZX/VX signals.

14.1.6 Jumpers and DIP Switches


The EGR2 does not have any jumpers or DIP switches that are used for board settings.

14.1.7 Valid Slots


The EGR2 must be installed in a valid slot in the subrack. Otherwise, the EGR2 cannot work
normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The EGR2 can be installed in slots 18 and 1116 in the subrack. The relationship between
the slots valid for the EGR2 and the bandwidth is as follows:

When the cross-connect capacity is 200 Gbit/s, the EGR2 can be installed in slots 18
and 1116. When the EGR2 is installed in slots 14, 15, and 16, the bandwidth is 1.25
Gbit/s. When the EGR2 is installed in slots 58 and 1114, the bandwidth is 2.5 Gbit/s.

14.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EGR2 indicates the type of optical interface.
Table 14-3 provides the relationship between the feature code of the EGR2 and the type of
optical interface.
Figure 1.2 Relationship between the feature code of the EGR2 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN2EGR210

10

1000BASE-SX (0.5 km)

SSN2EGR211

11

1000BASE-LX (10 km)

SSN2EGR212

12

1000BASE-VX (40 km)

SSN2EGR213

13

1000BASE-ZX (80 km)

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14.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1348 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1349 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring Ethernet Services.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the L2 switching management service. Perform the following tasks:

Configuring the IGMP Snooping Protocol

Configuring the Spanning Tree

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Setting the Aging Time for the Multicast Router Port

Step 9 Optional: Configure the QoS. For details, see Configuring QoS.
Step 10 Optional: Configure the aggregation function for the Ethernet port. For details, see Creating a
LAG.
----End

1.1.1.1.1350 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

1.1.1.1.1351 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 11 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

14.1.10 Configuring the Board Functions


The EGR2 supports multiple Ethernet functions and features such as Layer 2 switching and
LCAS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EGR2 by using the U2000:

STP/RSTP

LCAS

LPT

LAG

Test Frame

IGMP Snooping

14.1.11 Parameter Settings


You can set parameters for the EGR2 by using the U2000.
You can set the following main parameters for the EGR2 by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

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For information about more parameters and the description of each parameter, see 26
Parameter Settings.

14.1.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1352 Troubleshooting
Table 14-4 lists the faults that occur on the EGR2 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the EGR2 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

Transient service
interruption

Packet loss

Bit errors occur on the line side.

Interconnection
fault

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


Packet Loss.
See Troubleshooting Device
Interconnection Faults.

1.1.1.1.1353 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EGR2, see Replacing an EOS Board.

14.1.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
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according to the logical board on the .

14.1.13.1 Alarms of N2EGR2


AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

B3_SD_VC4

BD_STATUS

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

LAG_FAIL

LCAS_BAND_DECREASE
D

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC3

LP_REI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LSR_NO_FITED

NO_BD_SOFT

RPR_DUPLICATE_MAC

RPR_ECHO_DLOC

RPR_ECHO_LOC

RPR_MISCONFIG

RPR_NB_INCONSIS

RPR_PM_INCONSIS

RPR_PS_CHANGE

RPR_STATIONS_EXCEED

RPR_SUM_A0_EXCEED

SLAVE_WORKING

T_LOS

TU_AIS_VC3

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC3

VCAT_LOM_VC4

LASER_MOD_ERR

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

LINK_ERR

LPT_RFI

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

14.1.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

14.1.14.1 Performance Events of N2EGR2


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

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Figure 1.2 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

rprSpanErrorUnavailableSeconds

rprSpanErrorTtlExpFram
es

rprSpanErrorTooLongF
rames

rprSpanErrorTooShortFrames

rprSpanErrorBadHecFra
mes

rprSpanErrorBadFcsFr
ames

rprSpanErrorSelfSrcUcastFrames

rprSpanErrorPmdAbortF
rames

rprSpanErrorBadAddrF
rames

rprSpanErrorBadParityFrames

rprSpanErrorContainedF
rames

rprSpanErrorBadDataF
csFrames

rprSpanErrorBadCtrlFcsFrames

rprSpanErrorScffErrors

rprSpanErrorErroredSe
conds

rprSpanErrorSeverelyErroredSecond
s

Figure 1.3 Statistics of RMON basic performance


Packets Received(64 Octets
in Length)(packets/s)

Packets Received(65~127
Octets in Length)(packets/s)

Packets Received(512~1023
Octets in Length)(packets/s)

Packets Received(256~511
Octets in Length)
(packets/s)

Packets Received(128~255
Octets in Length)(packets/s)

Packets
Received(1024~1518 Octets
in Length)(packets/s)

Multicast Packets
Received(packets/s)

Broadcast Packets
Received(packets/s)

Drop Events(times/s)

Undersize Packets
Received(packets/s)

Oversize Packets
Received(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Collisions(times/s)

Octets Received(Byte/s)

Packets
Received(packets/s)

Figure 1.4 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)
(packets/s)

Packets Transmitted(65~127
Octets in Length)(packets/s)

Packets
Transmitted(128~255 Octets
in Length)(packets/s)

Packets
Transmitted(256~511
Octets in Length)

Packets
Transmitted(512~1023
Octets in Length)(packets/s)

Packets
Transmitted(1024~1518
Octets in Length)(packets/s)

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(packets/s)
Unicast Packets
Received(packets/s)

Unicast Packets
Transmitted(packets/s)

Multicast Packets
Transmitted(packets/s)

Broadcast Packets
Transmitted(packets/s)

Good Octets
Transmitted(Byte/s)

Alignment Errors(frames/s)

FCS Errors(frames/s)

Figure 1.5 Statistics of RMON VCG performance (receive frame count at Span side)
rprSpanRxUcastClassAFra
mes(frames/s)

rprSpanRxUcastClassAByt
es(Byte/s)

rprSpanRxUcastClassBCirFr
ames(frames/s)

rprSpanRxUcastClassBCirB
ytes(Byte/s)

rprSpanRxUcastClassBEirF
rames(frames/s)

rprSpanRxUcastClassBEirBy
tes(Byte/s)

rprSpanRxUcastClassCFra
mes(frames/s)

rprSpanRxUcastClassCByte
s(Byte/s)

rprSpanRxMcastClassAFram
es(frames/s)

rprSpanRxMcastClassAByt
es(Byte/s)

rprSpanRxMcastClassBCir
Frames(frames/s)

rprSpanRxMcastClassBCirB
ytes(Byte/s)

rprSpanRxMcastClassBEirF
rames(frames/s)

rprSpanRxMcastClassBEir
Bytes(Byte/s)

rprSpanRxMcastClassCFram
es(frames/s)

rprSpanRxMcastClassCByte
s(Byte/s)

Figure 1.6 Statistics of RMON VCG performance (transmit frame count at Span side)
rprSpanTxUcastClassAFra
mes(frames/s)

rprSpanTxUcastClassAByte
s(Byte/s)

rprSpanTxUcastClassBCirFr
ames(frames/s)

rprSpanTxUcastClassBCirB
ytes(Byte/s)

rprSpanTxUcastClassBEirF
rames(frames/s)

rprSpanTxUcastClassBEirBy
tes(Byte/s)

rprSpanTxUcastClassCFram
es(frames/s)

rprSpanTxUcastClassCByte
s(Byte/s)

rprSpanTxMcastClassAFram
es(frames/s)

rprSpanTxMcastClassAByte
s(Byte/s)

rprSpanTxMcastClassBCir
Frames(frames/s)

rprSpanTxMcastClassBCirB
ytes(Byte/s)

rprSpanTxMcastClassBEirF
rames(frames/s)

rprSpanTxMcastClassBEir
Bytes(Byte/s)

rprSpanTxMcastClassCFram
es(frames/s)

rprSpanTxMcastClassCByte
s(Byte/s)

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Figure 1.7 Statistics of RMON VCG performance (count of control layer frames)
rprSpanTxCtrlFrames(frame
s/s)

rprSpanTxOamEchoFrames
(frames/s)

rprSpanTxOamFlushFrames(
frames/s)

rprSpanTxOamOrgFrames(f
rames/s)

rprSpanTxTopoAtdFrames(
frames/s)

rprSpanTxTopoChkSumFra
mes(frames/s)

rprSpanTxTopoTpFrames(fr
ames/s)

rprSpanRxCtrlFrames(fram
es/s)

rprSpanRxOamEchoFrames(
frames/s)

rprSpanRxOamFlushFrames
(frames/s)

rprSpanRxOamOrgFrames(
frames/s)

rprSpanRxTopoAtdFrames(fr
ames/s)

rprSpanRxTopoChkSumFra
mes(frames/s)

rprSpanRxTopoTpFrames(f
rames/s)

Figure 1.8 Statistics of RMON VCG performance (frames received by Client)


rprClientTxUcastClassAFra
mes(frames/s)

rprClientTxUcastClassAByt
es(Byte/s)

rprClientTxUcastClassBCirF
rames(frames/s)

rprClientTxUcastClassBCir
Bytes(Byte/s)

rprClientTxUcastClassBEir
Frames(frames/s)

rprClientTxUcastClassBEirB
ytes(Byte/s)

rprClientTxUcastClassCFra
mes(frames/s)

rprClientTxUcastClassCByt
es(Byte/s)

rprClientTxMcastClassAFra
mes(frames/s)

rprClientTxMcastClassAByt
es(Byte/s)

rprClientTxMcastClassBCir
Frames(frames/s)

rprClientTxMcastClassBCir
Bytes(Byte/s)

rprClientTxMcastClassBEir
Frames(frames/s)

rprClientTxMcastClassBEir
Bytes(Byte/s)

rprClientTxMcastClassCFra
mes(frames/s)

rprClientTxMcastClassCByt
es(Byte/s)

rprClientTxBcastFrames(fra
mes/s)

Figure 1.9 Statistics of RMON VCG performance (frames transmitted by client)


rprClientRxUcastClassAFra
mes(frames/s)

rprClientRxUcastClassABy
tes(Byte/s)

rprClientRxUcastClassBCirF
rames(frames/s)

rprClientRxUcastClassBCir
Bytes(Byte/s)

rprClientRxUcastClassBEir
Frames(frames/s)

rprClientRxUcastClassBEirB
ytes(Byte/s)

rprClientRxUcastClassCFra
mes(frames/s)

rprClientRxUcastClassCByt
es(Byte/s)

rprClientRxMcastClassAFra
mes(frames/s)

rprClientRxMcastClassABy
tes(Byte/s)

rprClientRxMcastClassBCir
Frames(frames/s)

rprClientRxMcastClassBCir
Bytes(Byte/s)

rprClientRxMcastClassBEir
Frames(frames/s)

rprClientRxMcastClassBEir
Bytes(Byte/s)

rprClientRxMcastClassCFra
mes(frames/s)

rprClientRxMcastClassCByt

rprClientRxBcastFrames(fr

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es(Byte/s)

14 RPR Boards

ames/s)

Figure 1.10 Statistics of RMON VCG performance (count of error frames)


rprSpanErrorTtlExpFrames(
frames/s)

rprSpanErrorTooLongFram
es(frames/s)

rprSpanErrorTooShortFrame
s(frames/s)

rprSpanErrorBadHecFrames
(frames/s)

rprSpanErrorBadFcsFrames
(frames/s)

rprSpanErrorSelfSrcUcastFra
mes(frames/s)

rprSpanErrorPmdAbortFra
mes(frames/s)

rprSpanErrorBadAddrFram
es(frames/s)

rprSpanErrorBadParityFrame
s(frames/s)

rprSpanErrorContainedFram
es(frames/s)

rprSpanErrorBadDataFcsFr
ames(frames/s)

rprSpanErrorBadCtrlFcsFra
mes(frames/s)

rprSpanErrorScffErrors(fra
mes/s)

rprSpanErrorErroredSecond
s(seconds/s)

rprSpanErrorSeverelyErrored
Seconds(seconds/s)

rprSpanErrorUnavailableSe
conds(seconds/s)

14.1.15 Technical Specifications


The technical specifications of the EGR2 include the parameters specified for optical
interfaces, laser safety class, Ethernet performance specifications, mechanical specifications,
and power consumption.

1.1.1.1.1354 Parameters Specified for Optical Interfaces


Table 14-15 lists the parameters specified for the optical interfaces of the EGR2.
Figure 1.1 Parameters specified for the optical interfaces of the EGR2
Parameter

Value

Type of optical
interface

1000BASE-ZX
(80 km)

1000BASEVX (40 km)

1000BASELX (10 km)

1000BASE-SX
(0.5 km)

Type of fiber

Single-mode
LC

Single-mode
LC

Single-mode
LC

Multi-mode LC

Launched optical
power range
(dBm)

-2 to 5

-5 to 0

-9 to -3

-9.5 to -2.5

Operating
wavelength range
(nm)

1500 to 1580

1275 to 1350

1270 to 1355

770 to 860

Minimum
overload (dBm)

-3

-3

-3

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Parameter

Value

Receiver
sensitivity (dBm)

-23

-23

-20

-17

Minimum
extinction ratio
(dB)

Maximum -20
dB spectral width
(nm)

Minimum side
mode
suppression ratio
(dB)

30

30

1.1.1.1.1355 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1356 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EGR2 board of the N2 version.

Figure 14-4 shows the connection for testing the throughput specifications, packet loss ratio in
the case of overloading, latency specifications, and back-to-back specifications of the EGR2.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 14-16 lists the throughput specifications of the EGR2. Table 14-17 lists the packet loss
ratio in the case of overloading of the EGR2. Table 14-18 lists the latency specifications of the
EGR2. Table 14-19 lists the back-to-back specifications of the EGR2.

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The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EVPL bidirectional
unicast services are configured and eight VC-4s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 14-16 lists the throughput specifications of the EGR2. The values are obtained when the
SmartApplication is set as follows:

Test duration (sec): 3

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 90.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: bidirectional

Figure 1.1 Throughput specifications of the EGR2


Frame Size
(Byte)

Passed Rate
(%)

(01,08,01) to
(01,08,02)
(pks/sec)

(01,08,02) to
(01,08,01)
(pks/sec)

Total (pks/sec)

64

80.77

1201923

1201923

2403846

128

94.87

801282

801282

1602564

256

100.00

452899

452899

905798

512

100.00

234962

234962

469924

1024

100.00

119732

119732

239464

1280

100.00

196154

96154

192308

1518

100.00

81274

81274

162548

Table 14-17 lists the packet loss ratio in the case of overloading of the EGR2. The values are
obtained when the SmartApplication is set as follows:

Test duration (sec): 4

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

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Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.2 Packet loss ratio in the case of overloading of the EGR2
Frame Size
(Byte)

Rate Tested
(%)

(01,08,01) to
(01,08,02) (%)

(01,08,02) to
(01,08,01) (%)

Average (%)

64

100.00

16.719

16.720

16.719

128

100.00

4.315

4.328

4.321

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

Table 14-18 lists the latency specifications of the EGR2. The values are obtained when the
SmartApplication is set as follows:

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the equipment
and the time when the first bit of the transmitted frame reaches the input port of the
equipment. In store forward mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the equipment
and the time when the last bit of the transmitted frame reaches the input port of the
equipment. In the table, the CT values are obtained in cut through mode and the S&F
values are obtained in store forward mode.

CT: cut through or FIFO; S&F: store forward or LIFO

Measure on one receiving card only. Mode: SmartMetrics Comp. Mode

Test duration (sec): 4

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 80.77

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

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Figure 1.3 Latency specifications of the EGR2


Frame
Size
(Byte)

Rate
Tested
(%)

(01,08,01) to
(01,08,02) (us)CT (us)

Average
(CT) (us)

(01,08,01) to
(01,08,02)
(us)-S&F (us)

Average
(S&F) (us)

64

80.77

117.8

117.8

117.3

117.3

128

94.87

121.2

121.2

120.2

120.2

256

100.00

126.6

126.6

124.6

124.6

512

100.00

137.7

137.7

133.7

133.7

1024

100.00

159.9

159.9

151.8

151.8

1280

100.00

170.2

170.2

160.0

160.0

1518

100.00

182.9

182.9

170.8

170.8

Table 14-19 lists the back-to-back specifications of the EGR2. The values are obtained when
the SmartApplication is set as follows:

Test duration (sec): 2

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.4 Back-to-back specifications of the EGR2


Frame Size
(Byte)

Rate Tested
(%)

(01,08,01) to
(01,08,02) Burst
Size (Number of
Frames)

(01,08,02) to
(01,08,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

298

300

598

128

100.00

650

650

1300

256

100.00

905798

905798

1811596

512

100.00

469924

469924

939848

1024

100.00

239464

239464

478928

1280

100.00

192308

192308

384616

1518

100.00

162548

162548

325096

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1.1.1.1.1357 Mechanical Specifications


The mechanical specifications of the EGR2 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.1

1.1.1.1.1358 Power Consumption


The maximum power consumption of the EGR2 at room temperature (25C) is 40 W.

14.2 EMR0
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the EMR0 (12xFE and 1xGE ring processing board). This topic
also describes how to configure and commission the EMR0.

14.2.1 Version Description


The EMR0 is available in one functional version, namely, N2.

14.2.2 Application
The EMR0 is used to transmit/receive Ethernet services, manage bandwidths, and realize
Layer 2 switching of Ethernet services.
Figure 14-5 shows the typical networking and application of the RPR board. The RPR board
accesses and converges Ethernet services, and provides the Ethernet data with the following
data features: Layer 2 switching, port isolation, flow classification, traffic control, VLAN
management, and priority configuration. In addition, the RPR board performs
encapsulation/decapsulation, virtual concatenation, and SDH mapping/demapping for data.
The RPR board can be interconnected with the bandwidth access equipment and the data
communication equipment at the same time, thus to provide a network-level solution.
When the service converging FE services into GE services is configured, the GE switching board can be
set to the 1000M full-duplex mode or auto-negotiation mode, the VLAN of the convergence service is
variable, and the binding granularity is at the VC-3 or VC-4 level.

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Figure 1.1 Networking and application of the RPR board

NMS

NE1

User A2
PORT 1
VLAN 100

NE2

MSP ring

NE4

NE3

PORT 2
VLAN 100

PORT 2
User B2

VLAN 100
Service flow

PORT 1 VLAN 100

User B1

Line board
Data board
Cross-connect and
timing board

User A1

14.2.3 Functions and Features


The EMR0 supports the Layer 2 switching, port aggregation, and RPR functions.
Table 14-20 provides the functions and features of the EMR0.
Figure 1.1 Functions and features of the EMR0
Function and
Feature

EMR0

Basic functions

Transmits/Receives and processes 12xFE services and 1xGE


services.
Supports the RPR feature.

Functions when
being used with the
interface board

Specifications of the
optical interface

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Supports four FE ports and one GE port.

Transmits/Receives 12xFE signals through the electrical


interface when the EMR0 is used with the ETF8.

Transmits/Receives 8xFE signals through the optical interface


when the EMR0 is used with the EFF8.

Supports 10BASE-T/100BASE-TX signals when the EMR0 is


used with the ETF8. The maximum transmission distance is 100
m.

Supports 100BASE-FX signals in compliance with IEEE 802.3u


when the EMR0 is used with the EFF8.

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Function and
Feature

EMR0

Format of service
frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG


formats.

Supports the setting of the packet length, which ranges from


1518 bytes to 9600 bytes.

Supports the Jumbo frame with a length less than 9600 bytes.

Maximum uplink
bandwidth

2.5 Gbit/s

Mapping
granularities

Supports VC-3, VC3-Xv (X2), VC-4 and VC4-Xv (X8)


granularities.

The EMR0 can adapt to the bandwidth of the slot.

NOTE
VC-3 virtual concatenation on the SDH side supports only one or two VC3s. In addition, only the first two VC-3 timeslots of the first VC-4 in the first
STM-4 frame of each VCTRUNK can be used.

Encapsulation
format

Supports the GFP-F and LAPS protocols.

EPL services

Supports the PORT-based transparent transmission.

EVPL services

Supports EVPL services. The frame format can be Ethernet II,


IEEE 802.3, IEEE 802.1q TAG, or MPLS Martini.

Supports the MPLS encapsulation and forwarding based on


PORT or PORT+VLAN.

Supports five types of LSPs, including ingress LSP, egress LSP,


transit LSP, RPR ingress LSP, and RPR transit LSP.

Supports a maximum of 512 LSPs.

Supports EVPLAN services that use the stack VLAN


encapsulation.

Supports the self-learning of the source MAC address. The


capacity of the MAC address table in the N2 functional version
is 64K. The capacity of the MAC address table in the N1
functional version is 16K. The aging time of the MAC address
can be set and queried.

Supports the blacklist that can contain 4K records and also the
static MAC address table that can contain 4K records. The sum
of the number of records in the blacklist and the number of
addresses in the static MAC address table must not exceed 4K.

Supports the configuration of the static MAC routes. A


maximum of 4K static MAC routes can be configured.

Supports data isolation based on VB+VLAN.

Supports the creation, deletion, and query of the VB. The


maximum number of VBs supported by the N2EMR0 is 16. The
maximum number of logical ports for each VB is 32.

Supports the EVPLAN services that are based on the IEEE


802.1q virtual bridge.

EVPLAN services

MPLS
Issue 02 (2013-01-18)

Supports MartinioE.
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Function and
Feature

EMR0

Stack VLAN

Supports the stack VLAN.

VLAN

Supports 4096 VLAN tags, and the addition, deletion, and


exchanging of VLAN tags in compliance with IEEE 802.1q/p.

Supports the replacement of VLAN tags in Ethernet signal


frames.

Link aggregation
function

Supports the aggregation of the links of a maximum of eight FE


ports.

RPR

Supports the RPR feature that complies with IEEE 802.17.

Supports a maximum of 255 nodes on the ring network, and


supports stripping at the destination node and weighted fairness
algorithm.

Supports five priority levels, including A0, A1, B_EIR, B_CIR,


and C, and supports automatic discovery of topologies, which
can display the network status in real time.

Supports three protection modes, including Steering, Wrapping,


and Wrapping+Steering. Hence, the signal failure time is less
than 50 ms.

Supports the self-learning of routes on the ring, that is, supports


the learning of mapping between MAC addresses and node
numbers.

The N2EMR0 supports the manual configuration of routes for


the services on the RPR ring network.

RSTP

Supports the broadcast packet suppression and RSTP, which


comply with IEEE 802.1w.

IGMP snooping

Supports the IGMP snooping function.

QoS function

Supports the CAR. The granularity is 64 kbit/s.

The N2EMR0 supports the flow classification based on PORT,


PORT+VLAN ID, or PORT+VLAN ID+VLAN PRI.

LCAS function

Dynamically increases or decreases the bandwidth and protects the


bandwidth in compliance with ITU-T G.7042.

Flow control
function

Supports the port-based flow control function that complies with


IEEE 802.3x.

Echo test frames

Supports the echo function specified in the RPR OAM function,


which is used to test the connectivity of the link.

Loopback function

Supports inloops on Ethernet ports (at the PHY layer or MAC


layer).

Protection schemes

Supports the following protection schemes at the Ethernet network


level:

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Feature

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EMR0

LCAS

LAG

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarms and
performance events

Reports various alarms and performance events, which facilitates


the management and maintenance of the equipment.

Warm resets

EMR0 boards support warm resets. If a warm reset is performed on


an EMR0 board, traffic on the board is interrupted.

Cold resets

Supported

Weighted fairness
algorithm

Supports the weighted fairness algorithm.

Automatic discovery
of topologies

Supports the automatic discovery of topologies.

Maximum number
of supported nodes

255

Service priority
levels

Supports A0, A1, B_CIR, B_EIR, and C.

14.2.4 Working Principle and Signal Flow


The EMR0 consists of the Ethernet access module, network processor module, RPR protocol
processing module, mapping module, interface converting module, logic and control module,
clock module, and power module.
Figure 14-6 shows the functional block diagram of the EMR0 by describing how to process
1xGE/FE signals.

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Figure 1.1 Functional block diagram of the EMR0


Backplane

RPR
MAC
(west)

RPR protocol
processing module

Logic and
control module

Cross-connect unit

Cross-connect unit

Mapping module

Laser shutdown
LOS

Interface
converting
module

VCP

Network processor module

RPR
MAC
(east)

DENCP

Control
Network signal Switch
processor
fabric
Data

ENCP

GE/FE Ethernet
access
module

Communication

SCC unit

Reference clock and frame header

50 MHz
77 MHz
125 MHz Clock module
100 MHz

+3.3 V
Power
module

Power
module

Fuse
Fuse

Cross-connect unit

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

RPR: resilient package ring

1.1.1.1.1359 Ethernet Access Module


In the receive direction, the optical signals from Ethernet equipment such as switches or
routers are converted into electrical signals. If the signals are accessed through electrical
interfaces, O/E conversion is not required. At the PHY layer, the electrical signals are decoded
and the ETH_LOS alarm is detected. The electrical signals are converted from serial signals
into parallel signals and then sent to the network processor module.
In the transmit direction, the parallel signals are converted into serial signals. At the PHY
layer, signals are encoded and converted from electrical signals to optical signals.

1.1.1.1.1360 Network Processor Module


The network processor module consists of the network processor and switch fabric. The
network processor first performs MAC functions, which include code conversion, framing of
Ethernet packets, CRC check, and Ethernet performance statistics.
After the striped Ethernet frames enter the core of network processor, the flow is classified
according to the service type and configuration requirement. The frames are encapsulated or
decapsulated. The following formats are supported:

MPLS

L2 MPLS VPN

Ethernet/VLAN

In the receive direction, services are mapped and forwarded after the Tunnel and VC tags are
added according to the service configuration. In the transmit direction, the Tunnel or VC tag is
extracted based on the level (P or PE) of the equipment. Services are then routed or
forwarded.
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The network processor module supports the following functions:

Flow sense and flow classification

Unicast, multicast, and broadcast of the flow

Setting of data priorities

WFQ

Four CoSs

1.1.1.1.1361 RPR Protocol Processing Module


The RPR implements the weighted fairness algorithm and statistical multiplexing for the ring
bandwidth. In addition, the RPR provides protection switching schemes. By using the RPR
protocol and RPR weighted fairness algorithm, the RPR protocol processing module controls
the bandwidth of each node accessed by the ring network. In addition, the RPR ring has the
features of spatial reuse and statistical multiplexing. Hence, the bandwidth utilization is
improved.
Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for
topology auto-discovery provides correct and reliable ways of discovering topologies of all
nodes and changes occurring on these topologies.
RPR unicast frames are striped at the destination node and thus the bandwidth on the ring is
reused spatially.
The RPR ring supports a maximum of 255 nodes.

1.1.1.1.1362 Mapping Module


The mapping module performs encapsulation and mapping functions.
In the upstream direction, virtual concatenation services support the LCAS function. The
encapsulation formats are LAPS and GFP-F.
In the downstream direction, SDH signals are demapped. The delay of virtual concatenation is
compensated. After aligning, packets are decapsulated according to the encapsulation format.
The decapsulated data is finally transmitted to the RPR protocol processing module in
packets.

1.1.1.1.1363 Interface Converting Module


The interface converting module converts the 622 Mbit/s LVDS bus of the SDH system into
the parallel bus. The high-rate backplane interface is connected to the low-rate interface chip
of the transmit system through the interface converting module.

1.1.1.1.1364 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through the bus. The logic and
control module performs the following functions:

Manages and configures other modules of the board.

Implements inter-board communication through the internal Ethernet interface.

The control module also contains basic logic units. This module performs the following
functions:
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Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

14 RPR Boards

1.1.1.1.1365 Clock Module


The clock module traces the system reference clock and generates the required working clock
for each chip. The frequency of the clock can be 50 MHz, 77 MHz, 125 MHz, or 100 MHz.

1.1.1.1.1366 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

14.2.5 Front Panel


The front panel of the EMR0 has indicators, interfaces, a bar code, and a laser safety class
label.

1.1.1.1.1367 Diagram of the Front Panel


Figure 14-7 shows the appearance of the front panel of the EMR0.

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Figure 1.1 Front panel of the EMR0

EMR0
STAT
ACT
PROG
SRV
LINK
ACT

CLASS 1
LASER
PRODUCT

OUT1
IN1
FE1

FE2

FE3

FE4

EMR0

1.1.1.1.1368 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1369 Interfaces
The front panel of the EMR0 has five interfaces. Table 14-21 describes the types and usage of
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the interfaces of EMR0.


Figure 1.1 Interfaces of the EMR0
Interface

Type of
Interface

Usage

OUT1/IN1

LC (swappable)

Transmits and receives 1000BASE-SX/LX/ZX


signals.

FE1

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE2

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE3

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

FE4

RJ-45

Transmits and receives 10BASE-T/100BASE-TX


signals.

14.2.6 Jumpers and DIP Switches


The EMR0 does not have any jumpers or DIP switches that are used for board settings.

14.2.7 Valid Slots


The EMR0 must be installed in a valid slot in the subrack. Otherwise, the EMR0 cannot work
normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The EMR0 can be used with the ETF8 and EFF8.


The slots valid for the EMR0 are as follows:

When the cross-connect capacity is 200 Gbit/s, the EMR0 can be installed in slots 16
and 1316. When the EMR0 is installed in slots 14, 15, and 16, the bandwidth is 1.25
Gbit/s. When the EMR0 is installed in slots 5, 6, 13, and 14, the bandwidth is 2.5 Gbit/s.

Table 14-22 lists the slots valid for the EMR0 and the corresponding slots for the ETF8 and
EFF8.
Figure 1.2 Slots valid for the EMR0 and the corresponding slots for the ETF8 and EFF8
Slot Valid for the EMR0

Corresponding Slot for the ETF8 and EFF8

Slot 1

Without an interface board

Slot 2

Slot 19

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Slot Valid for the EMR0

Corresponding Slot for the ETF8 and EFF8

Slot 3

Slot 21

Slot 4

Slot 23

Slot 5

Slot 25

Slot 6

Without an interface board

Slot 13

Slot 29

Slot 14

Slot 31

Slot 15

Slot 33

Slot 16

Slot 35

14.2.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the EMR0 indicates the type of optical interface.
Table 14-23 provides the relationship between the feature code of the EMR0 and the type of
optical interface.
Figure 1.3 Relationship between the feature code of the EMR0 and the type of optical interface
Board

Feature Code

Type of Optical Interface

SSN2EMR010

10

1000BASE-SX (0.5 km)

SSN2EMR011

11

1000BASE-LX (10 km)

SSN2EMR012

12

1000BASE-VX (40 km)

SSN2EMR013

13

1000BASE-ZX (80 km)

14.2.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1370 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
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Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1371 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring Ethernet Services.
Step 7 Required: Set the Ethernet interface.

Set the overhead byte as follows:

J2 byte: The setting of the J2 byte on the interconnected equipment must be


consistent. Generally, use the default value. The default value of the J2 to be sent is
HuaWei SBS
and the default value of the J2 to be received is Disabled.

Set the Ethernet interface as follows:

Port enabled/disabled: When you configure services on a port of the Ethernet board,
the port must be set to Enabled.

Working mode: Generally, the Ethernet interfaces of the interconnected equipment


are required to work in the same working mode. If the working modes on two sides
do not match, packets may be lost or the bit rate may decrease. In the case of large
volume of traffic, services may be completely interrupted.

For details, see 27.7 Checking Board Parameters.


For more information about the parameters of the board, see 26.4.2 Ethernet Parameters.

Step 8 Optional: Configure the L2 switching management service. Perform the following tasks:

Configuring the IGMP Snooping Protocol

Configuring the Spanning Tree

Setting the Aging Time for the Multicast Router Port

Step 9 Optional: Configure the QoS. For details, see Configuring QoS.
Step 10 Optional: Configure the aggregation function for the Ethernet port. For details, see Creating a
LAG.
----End

1.1.1.1.1372 Commissioning the Board


Step 1 Required: Test the Ethernet service channel. For details, see Testing EoS Services.
----End

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1.1.1.1.1373 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 11 Required: Query the alarms and performance events of the board. Modify the connections or
configurations of the board according to the alarms and performance events until the alarms
are cleared. For the method for querying the alarms and performance events of a board, see
Viewing the Current Alarms.
----End

14.2.10 Configuring the Board Functions


The EMR0 supports multiple Ethernet functions and features such as Layer 2 switching and
LCAS. Configure the functions according to actual requirements.
You can configure the following Ethernet functions for the EMR0 by using the U2000:

STP/RSTP

LCAS

LAG

Test Frame

IGMP Snooping

14.2.11 Parameter Settings


You can set parameters for the EMR0 by using the U2000.
You can set the following main parameters for the EMR0 by using the U2000:

Working mode

LCAS

Maximum frame length

Mapping protocol

For information about more parameters and the description of each parameter, see 26
Parameter Settings.

14.2.12 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1374 Troubleshooting
Table 14-24 lists the faults that occur on the EMR0 frequently and the troubleshooting
methods.

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Figure 1.1 Methods used to troubleshoot the faults that occur on the EMR0 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on all the


Ethernet ports are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The services on a single


Ethernet port are transiently
interrupted.

The protocol becomes


abnormal.

Transient service
interruption

Packet loss

Bit errors occur on the line side.

Interconnection
fault

The interconnection fault


occurs on a single Ethernet
port.

The interconnection fault


occurs on the VCG port.

The LCAS interconnection


fault occurs.

Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

See Troubleshooting Service


Packet Loss.
See Troubleshooting Device
Interconnection Faults.

1.1.1.1.1375 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the EMR0, see Replacing an EOS Board.

14.2.13 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

14.2.13.1 Alarms of N2EMR0


AU_AIS

AU_LOP

B3_EXC_VC3

B3_EXC_VC4

B3_SD_VC3

B3_SD_VC4

BD_STATUS

COMMUN_FAIL

ETH_LOS

FCS_ERR

FPGA_ABN

HARD_BAD

HP_RDI

HP_REI

HP_SLM

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HP_TIM

HP_UNEQ

LAG_FAIL

LCAS_BAND_DECREASE
D

LCAS_FOPR

LCAS_FOPT

LCAS_PLCR

LCAS_PLCT

LCAS_TLCR

LCAS_TLCT

LOOP_ALM

LP_RDI_VC3

LP_REI_VC3

LP_SLM_VC3

LP_TIM_VC3

LP_UNEQ_VC3

LSR_NO_FITED

NO_BD_SOFT

RPR_DUPLICATE_MAC

RPR_ECHO_DLOC

RPR_ECHO_LOC

RPR_MISCONFIG

RPR_NB_INCONSIS

RPR_PM_INCONSIS

RPR_PS_CHANGE

RPR_STATIONS_EXCEED

RPR_SUM_A0_EXCEED

SLAVE_WORKING

SUBCARD_ABN

T_LOS

TU_AIS_VC3

TU_LOP_VC3

VCAT_LOA

VCAT_LOM_VC3

VCAT_LOM_VC4

LASER_MOD_ERR

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

ETH_NO_FLOW

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

14.2.14 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

14.2.14.1 Performance Events of N2EMR0


Figure 1.1 SDH
HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

Figure 1.2 RMON alarm


DropEvent

UndersizePkts

OversizePkts

Fragments

Jabbers

Collisions

AlignmentErrors

FCSErrors

rprSpanErrorUnavailableSeconds

rprSpanErrorTtlExpFram
es

rprSpanErrorTooLongF
rames

rprSpanErrorTooShortFrames

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rprSpanErrorBadHecFra
mes

rprSpanErrorBadFcsFr
ames

rprSpanErrorSelfSrcUcastFrames

rprSpanErrorPmdAbortF
rames

rprSpanErrorBadAddrF
rames

rprSpanErrorBadParityFrames

rprSpanErrorContainedF
rames

rprSpanErrorBadDataF
csFrames

rprSpanErrorBadCtrlFcsFrames

rprSpanErrorScffErrors

rprSpanErrorErroredSe
conds

rprSpanErrorSeverelyErroredSecond
s

Figure 1.3 Statistics of RMON basic performance


Packets Received(64 Octets
in Length)(packets/s)

Packets Received(65~127
Octets in Length)(packets/s)

Packets Received(512~1023
Octets in Length)(packets/s)

Packets Received(256~511
Octets in Length)
(packets/s)

Packets Received(128~255
Octets in Length)(packets/s)

Packets
Received(1024~1518 Octets
in Length)(packets/s)

Multicast Packets
Received(packets/s)

Broadcast Packets
Received(packets/s)

Drop Events(times/s)

Undersize Packets
Received(packets/s)

Oversize Packets
Received(packets/s)

Fragments(packets/s)

Jabbers(packets/s)

Collisions(times/s)

Octets Received(Byte/s)

Packets
Received(packets/s)

Figure 1.4 Statistics of RMON extended performance


Packets Transmitted(64
Octets in Length)
(packets/s)

Packets Transmitted(65~127
Octets in Length)(packets/s)

Packets
Transmitted(128~255 Octets
in Length)(packets/s)

Packets
Transmitted(256~511
Octets in Length)
(packets/s)

Packets
Transmitted(512~1023
Octets in Length)(packets/s)

Packets
Transmitted(1024~1518
Octets in Length)(packets/s)

Unicast Packets
Received(packets/s)

Unicast Packets
Transmitted(packets/s)

Multicast Packets
Transmitted(packets/s)

Broadcast Packets
Transmitted(packets/s)

Good Octets
Transmitted(Byte/s)

Alignment Errors(frames/s)

FCS Errors(frames/s)

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Figure 1.5 Statistics of RMON VCG performance (receive frame count at Span side)
rprSpanRxUcastClassAFra
mes(frames/s)

rprSpanRxUcastClassAByt
es(Byte/s)

rprSpanRxUcastClassBCirFr
ames(frames/s)

rprSpanRxUcastClassBCirB
ytes(Byte/s)

rprSpanRxUcastClassBEirF
rames(frames/s)

rprSpanRxUcastClassBEirBy
tes(Byte/s)

rprSpanRxUcastClassCFra
mes(frames/s)

rprSpanRxUcastClassCByte
s(Byte/s)

rprSpanRxMcastClassAFram
es(frames/s)

rprSpanRxMcastClassAByt
es(Byte/s)

rprSpanRxMcastClassBCir
Frames(frames/s)

rprSpanRxMcastClassBCirB
ytes(Byte/s)

rprSpanRxMcastClassBEirF
rames(frames/s)

rprSpanRxMcastClassBEir
Bytes(Byte/s)

rprSpanRxMcastClassCFram
es(frames/s)

rprSpanRxMcastClassCByte
s(Byte/s)

Figure 1.6 Statistics of RMON VCG performance (transmit frame count at Span side)
rprSpanTxUcastClassAFra
mes(frames/s)

rprSpanTxUcastClassAByte
s(Byte/s)

rprSpanTxUcastClassBCirFr
ames(frames/s)

rprSpanTxUcastClassBCirB
ytes(Byte/s)

rprSpanTxUcastClassBEirF
rames(frames/s)

rprSpanTxUcastClassBEirBy
tes(Byte/s)

rprSpanTxUcastClassCFram
es(frames/s)

rprSpanTxUcastClassCByte
s(Byte/s)

rprSpanTxMcastClassAFram
es(frames/s)

rprSpanTxMcastClassAByte
s(Byte/s)

rprSpanTxMcastClassBCir
Frames(frames/s)

rprSpanTxMcastClassBCirB
ytes(Byte/s)

rprSpanTxMcastClassBEirF
rames(frames/s)

rprSpanTxMcastClassBEir
Bytes(Byte/s)

rprSpanTxMcastClassCFram
es(frames/s)

rprSpanTxMcastClassCByte
s(Byte/s)

Figure 1.7 Statistics of RMON VCG performance (count of control layer frames)
rprSpanTxCtrlFrames(frame
s/s)

rprSpanTxOamEchoFrames
(frames/s)

rprSpanTxOamFlushFrames(
frames/s)

rprSpanTxOamOrgFrames(f
rames/s)

rprSpanTxTopoAtdFrames(
frames/s)

rprSpanTxTopoChkSumFra
mes(frames/s)

rprSpanTxTopoTpFrames(fr
ames/s)

rprSpanRxCtrlFrames(fram
es/s)

rprSpanRxOamEchoFrames(
frames/s)

rprSpanRxOamFlushFrames
(frames/s)

rprSpanRxOamOrgFrames(
frames/s)

rprSpanRxTopoAtdFrames(fr
ames/s)

rprSpanRxTopoChkSumFra

rprSpanRxTopoTpFrames(f

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mes(frames/s)

14 RPR Boards

rames/s)

Figure 1.8 Statistics of RMON VCG performance (frames received by Client)


rprClientTxUcastClassAFra
mes(frames/s)

rprClientTxUcastClassAByt
es(Byte/s)

rprClientTxUcastClassBCirF
rames(frames/s)

rprClientTxUcastClassBCir
Bytes(Byte/s)

rprClientTxUcastClassBEir
Frames(frames/s)

rprClientTxUcastClassBEirB
ytes(Byte/s)

rprClientTxUcastClassCFra
mes(frames/s)

rprClientTxUcastClassCByt
es(Byte/s)

rprClientTxMcastClassAFra
mes(frames/s)

rprClientTxMcastClassAByt
es(Byte/s)

rprClientTxMcastClassBCir
Frames(frames/s)

rprClientTxMcastClassBCir
Bytes(Byte/s)

rprClientTxMcastClassBEir
Frames(frames/s)

rprClientTxMcastClassBEir
Bytes(Byte/s)

rprClientTxMcastClassCFra
mes(frames/s)

rprClientTxMcastClassCByt
es(Byte/s)

rprClientTxBcastFrames(fra
mes/s)

Figure 1.9 Statistics of RMON VCG performance (frames transmitted by client)


rprClientRxUcastClassAFra
mes(frames/s)

rprClientRxUcastClassABy
tes(Byte/s)

rprClientRxUcastClassBCirF
rames(frames/s)

rprClientRxUcastClassBCir
Bytes(Byte/s)

rprClientRxUcastClassBEir
Frames(frames/s)

rprClientRxUcastClassBEirB
ytes(Byte/s)

rprClientRxUcastClassCFra
mes(frames/s)

rprClientRxUcastClassCByt
es(Byte/s)

rprClientRxMcastClassAFra
mes(frames/s)

rprClientRxMcastClassABy
tes(Byte/s)

rprClientRxMcastClassBCir
Frames(frames/s)

rprClientRxMcastClassBCir
Bytes(Byte/s)

rprClientRxMcastClassBEir
Frames(frames/s)

rprClientRxMcastClassBEir
Bytes(Byte/s)

rprClientRxMcastClassCFra
mes(frames/s)

rprClientRxMcastClassCByt
es(Byte/s)

rprClientRxBcastFrames(fr
ames/s)

Figure 1.10 Statistics of RMON VCG performance (count of error frames)


rprSpanErrorTtlExpFrames(
frames/s)

rprSpanErrorTooLongFram
es(frames/s)

rprSpanErrorTooShortFrame
s(frames/s)

rprSpanErrorBadHecFrames
(frames/s)

rprSpanErrorBadFcsFrames
(frames/s)

rprSpanErrorSelfSrcUcastFra
mes(frames/s)

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rprSpanErrorPmdAbortFra
mes(frames/s)

rprSpanErrorBadAddrFram
es(frames/s)

rprSpanErrorBadParityFrame
s(frames/s)

rprSpanErrorContainedFram
es(frames/s)

rprSpanErrorBadDataFcsFr
ames(frames/s)

rprSpanErrorBadCtrlFcsFra
mes(frames/s)

rprSpanErrorScffErrors(fra
mes/s)

rprSpanErrorErroredSecond
s(seconds/s)

rprSpanErrorSeverelyErrored
Seconds(seconds/s)

rprSpanErrorUnavailableSe
conds(seconds/s)

14.2.15 Technical Specifications


The technical specifications of the EMR0 include the parameters specified for optical
interfaces, laser safety class, Ethernet performance specifications, mechanical specifications,
and power consumption.

1.1.1.1.1376 Parameters Specified for Optical Interfaces


Table 14-35 lists the parameters specified for the optical interfaces of the EMR0.
Figure 1.1 Parameters specified for the optical interfaces of the EMR0
Parameter

Value

Type of optical
interface

1000BASE-ZX (80
km)

1000BASE-LX
(10 km)

1000BASE-SX (0.5
km)

Type of fiber

Single-mode LC

Single-mode LC

Multi-mode LC

Launched optical
power range (dBm)

-2 to 5

-9 to -3

-9.5 to -2.5

Operating wavelength
range (nm)

1500 to 1580

1270 to 1355

770 to 860

Minimum overload
(dBm)

-3

-3

Receiver sensitivity
(dBm)

-23

-20

-17

Minimum extinction
ratio (dB)

Maximum -20 dB
spectral width (nm)

Minimum side mode


suppression ratio (dB)

30

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1.1.1.1.1377 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1378 Ethernet Performance Specifications


The following part lists the throughput specifications, packet loss ratio in the case of overloading, delay
specifications, and back-to-back specifications of the EMR0 board of the N2 version.

Figure 14-8 shows the connection for testing the throughput specifications, packet loss ratio in
the case of overloading, latency specifications, and back-to-back specifications of the EMR0.
Figure 1.1 Connection for testing the throughput specifications, packet loss ratio in the case of
overloading, latency specifications, and back-to-back specifications
Tested
equipment 1

Tested
equipment 2

Port 1

Port 2
Data network
performance
analyzer

Table 14-36 and Table 14-37 list the throughput specifications of the EMR0. Table 14-38 and
Table 14-39 list the packet loss ratio in the case of overloading of the EMR0. Table 14-40 and
Table 14-41 list the latency specifications of the EMR0. Table 14-42 and Table 14-43 list the
back-to-back specifications of the EMR0.

The specifications vary according to the configuration and networking of the test environment and
the VC services bound on the VCG side. The specifications that are obtained in the actual
environment are used.

The specifications in the following tables are obtained in the following scenario: EVPL bidirectional
unicast services are configured and eight VC-4s are bound on the FE port, or EVPL bidirectional
unicast services are configured and eight VC-4s are bound on the GE port.

The data network performance is measured by using the SmartBits. The specification values in the
following tables are obtained by using the SmartApplication software of the SmartBits analyzer.

The specific test results depend on the settings on the SmartApplication. The values listed in the
following tables are the values displayed on the SmartBits analyzer.

In the following tables, the value such as (01,01,01) indicates the equipment No., slot No., and port
No. "(01,01,01) to (01,01,02)" and "(01,01,02) to (01,01,01)", however, indicate the forward and
reverse tests values, respectively. For details about the parameters, see SmartApplications Help.

Table 14-36 lists the throughput specifications of the EMR0 (eight VC-4s are bound on the FE
port). The values are obtained when the SmartApplication is set as follows:

Test duration (sec): 5

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

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Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: bidirectional

Figure 1.1 Throughput specifications of the EMR0 (eight VC-4s are bound on the FE port)
Frame Size
(Byte)

Passed Rate
(%)

(01,06,05) to
(01,06,06)
(pks/sec)

(01,06,06) to
(01,06,05)
(pks/sec)

Total (pks/sec)

64

100.00

148810

148810

297620

128

100.00

84459

84459

168918

256

100.00

45290

45290

90580

512

100.00

23496

23496

46992

1024

100.00

11973

11973

23946

1280

100.00

9615

9615

19230

1518

100.00

8127

8127

16254

Table 14-37 lists the throughput specifications of the EMR0 (eight VC-4s are bound on the
GE port). The values are obtained when the SmartApplication is set as follows:

Test duration (sec): 20

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Maximum rate (%): 100.00

Resolution rate (%): 1.00

Mode: bidirectional

Figure 1.2 Throughput specifications of the EMR0 (eight VC-4s are bound on the GE port)
Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,04,01)
(pks/sec)

(01,04,01) to
(01,01,01)
(pks/sec)

Total (pks/sec)

64

72.41

1077586

1077586

2155172

128

94.87

801282

801282

1602564

256

100.00

452899

452899

905798

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Frame Size
(Byte)

Passed Rate
(%)

(01,01,01) to
(01,04,01)
(pks/sec)

(01,04,01) to
(01,01,01)
(pks/sec)

Total (pks/sec)

512

100.00

234962

234962

469924

1024

100.00

119732

119732

239464

1280

100.00

96154

96154

192308

1518

100.00

81274

81274

162548

Table 14-38 lists the packet loss ratio in the case of overloading of the EMR0 (eight VC-4s
are bound on the FE port). The values are obtained when the SmartApplication is set as
follows:

Test duration (sec): 5

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.3 Packet loss ratio in the case of overloading of the EMR0 (eight VC-4s are bound on the
FE port)
Frame Size
(Byte)

Rate Tested
(%)

(01,06,05) to
(01,06,06) (%)

(01,06,06) to
(01,06,05) (%)

Average (%)

64

100.00

0.000

0.000

0.000

128

100.00

0.000

0.000

0.000

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

Table 14-39 lists the packet loss ratio in the case of overloading of the EMR0 (eight VC-4s
are bound on the GE port). The values are obtained when the SmartApplication is set as
follows:

Test duration (sec): 5

Minimum frame size (byte): 64

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Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.4 Packet loss ratio in the case of overloading of the EMR0 (eight VC-4s are bound on the
GE port)
Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,04,01) (%)

(01,04,01) to
(01,01,01) (%)

Average (%)

64

100.00

29.833

29.827

29.830

128

100.00

4.306

4.309

4.307

256

100.00

0.000

0.000

0.000

512

100.00

0.000

0.000

0.000

1024

100.00

0.000

0.000

0.000

1280

100.00

0.000

0.000

0.000

1518

100.00

0.000

0.000

0.000

Table 14-40 lists the latency specifications of the EMR0 (eight VC-4s are bound on the FE
port). The values are obtained when the SmartApplication is set as follows:

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the equipment
and the time when the first bit of the transmitted frame reaches the input port of the
equipment. In store forward mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the equipment
and the time when the last bit of the transmitted frame reaches the input port of the
equipment. In the table, the CT values are obtained in cut through mode and the S&F
values are obtained in store forward mode.

Test duration (sec): 5

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

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Figure 1.5 Latency specifications of the EMR0 (eight VC-4s are bound on the FE port)
Frame
Size
(Byte)

Rate
Tested
(%)

(01,06,05) to
(01,06,06) (us)CT (us)

Average
(CT) (us)

(01,06,05) to
(01,06,06)
(us)-S&F (us)

Average
(S&F) (us)

64

100.00

126.1

126.1

121.0

121.0

128

100.00

131.0

131.0

120.8

120.8

256

100.00

149.2

149.2

128.8

128.8

512

100.00

176.9

176.9

136.0

136.0

1024

100.00

237.0

237.0

155.1

155.1

1280

100.00

266.7

266.7

164.3

164.3

1518

100.00

289.3

289.3

167.9

167.9

Table 14-41 lists the latency specifications of the EMR0 (eight VC-4s are bound on the GE
port). The values are obtained when the SmartApplication is set as follows:

The latency modes are classified into two modes, namely, cut through mode and store
forward mode. In cut through mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the equipment
and the time when the first bit of the transmitted frame reaches the input port of the
equipment. In store forward mode, the analyzer calculates the difference between the
time when the first bit of the transmitted frame reaches the output port of the equipment
and the time when the last bit of the transmitted frame reaches the input port of the
equipment. In the table, the CT values are obtained in cut through mode and the S&F
values are obtained in store forward mode.

Test duration (sec): 20

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 72.41

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.6 Latency specifications of the EMR0 (eight VC-4s are bound on the GE port)
Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,01) to
(01,04,01) (us)CT (us)

Average
(CT) (us)

(01,01,01) to
(01,04,01)
(us)-S&F (us)

Average
(S&F) (us)

64

72.41

130.1

130.1

129.6

129.6

128

94.87

143.1

143.1

142.1

142.1

256

100.00

123.4

123.4

121.4

121.4

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Frame
Size
(Byte)

Rate
Tested
(%)

(01,01,01) to
(01,04,01) (us)CT (us)

Average
(CT) (us)

(01,01,01) to
(01,04,01)
(us)-S&F (us)

Average
(S&F) (us)

512

100.00

130.7

130.7

126.7

126.7

1024

100.00

154.4

154.4

146.3

146.3

1280

100.00

164.6

164.6

154.4

154.4

1518

100.00

174.4

174.4

162.3

162.3

Table 14-42 lists the back-to-back specifications of the EMR0 (eight VC-4s are bound on the
FE port). The values are obtained when the SmartApplication is set as follows:

Test duration (sec): 2

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.7 Back-to-back specifications of the EMR0 (eight VC-4s are bound on the FE port)
Frame Size
(Byte)

Rate Tested
(%)

(01,06,05) to
(01,06,06) Burst
Size (Number of
Frames)

(01,06,06) to
(01,06,05)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

297620

297620

595240

128

100.00

168918

168918

337836

256

100.00

90580

90580

181160

512

100.00

46992

46992

93984

1024

100.00

23946

23946

47892

1280

100.00

19230

19230

38460

1518

100.00

16254

16254

32508

Table 14-43 lists the back-to-back specifications of the EMR0 (eight VC-4s are bound on the
GE port). The values are obtained when the SmartApplication is set as follows:

Test duration (sec): 2

Minimum frame size (byte): 64

Maximum frame size (byte): 1518

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Step frame size (byte): custom

Number of pairs: 1

Initial rate (%): 100.00

Step rate: 10.00

Resolution rate (%): none

Mode: bidirectional

Figure 1.8 Back-to-back specifications of the EMR0 (eight VC-4s are bound on the GE port)
Frame Size
(Byte)

Rate Tested
(%)

(01,01,01) to
(01,04,01) Burst
Size (Number of
Frames)

(01,04,01) to
(01,01,01)
(Number of
Frames)

Total
(Number of
Frames)

64

100.00

3410

3410

6820

128

100.00

29054

29054

58108

256

100.00

905798

905798

1811596

512

100.00

469924

469924

939848

1024

100.00

239464

239464

478928

1280

100.00

192308

192308

384616

1518

100.00

162548

162548

325096

1.1.1.1.1379 Mechanical Specifications


The mechanical specifications of the EMR0 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.2

1.1.1.1.1380 Power Consumption


The maximum power consumption of the EMR0 at room temperature (25C) is 50 W.

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15

SAN/Video Boards

About This Chapter


The SAN boards are multi-service transparent transmission processing boards.
15.1 MST4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MST4 (4-port multi-service transparent transmission board).
This topic also describes how to configure and commission the MST4.
15.2 VST4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the VST4 (4-port video-service transparent transmission board).
This topic also describes how to configure and commission the VST4.

15.1 MST4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the MST4 (4-port multi-service transparent transmission board).
This topic also describes how to configure and commission the MST4.

15.1.1 Version Description


The MST4 is available in one functional version, namely, N1.

15.1.2 Application
The MST4 is a multi-service transparent transmission board. The MST4 is used in remote
disaster recovery, remote backup and data centralization, and integration of storage resources.
The MST4 is used in the fields of the SAN services and video services. The MST4 can
transmit/receive the FC100/FICON, FC200, ESCON, and DVB-ASI services, and provides
the FC100 and FC200 services with the distance extension function. Hence, the MST4 is
applicable to the long-distance transmission of the FC services on the SDH network. In
addition, the MST4 meets the transmission requirements of the storage network and extends
the types of services supported by the equipment. Figure 15-1 shows the networking and
application of the SAN services.
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Figure 1.1 Networking and application of the SAN services


NE1

NE2

MST4

MST4

FC Switch

FC Switch

15.1.3 Functions and Features


The MST4 supports the access of multiple services, alarms, and other maintenance functions.
Table 15-1 provides the functions and features of the MST4.
Figure 1.1 Functions and features of the MST4
Function and
Feature

MST4

Basic functions

Provides four independent ports to transmit/receive multiple services.


Supports the transparent transmission of the SAN and Video services.

Connector type

LC

Optical module
type

SFP

Service types

Supports FC100/FICON, FC200, ESCON, and DVB-ASI services.


Table 15-2 describes types and rates of the services.

Transmits/Receives four-channel FC services (FC100/FICON and


FC200) at the same time, and the total bandwidth is less than 2.5
Gbit/s.

Supports the full-rate transmission of FC services (one-channel


FC200 services or two-channel FC100 services).

Transmits/Receives four-channel ESCON or DVB-ASI services, and


the total bandwidth is less than 2.5 Gbit/s.

Distance
extension

Maximum
uplink
bandwidth

The first and second ports support the distance extension function on the
SDH side.

FC100 services: 3000 km

FC200 services: 1500 km

2.5 Gbit/s
The backplane provides four 622 Mbit/s buses that are directly
connected to the cross-connect unit.
The MST4 can adapt to the bandwidth of the slot.

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Function and
Feature

MST4

Mapping
granularity

Supports the VC-4-Xc (X = 4, 8, or 16) granularity.

ESCON
services

Transmits/Receives four-channel ESCON services, and the total


bandwidth is less than 2.5 Gbit/s.

DVB-ASI
services

Transmits/Receives four-channel DVB-ASI services, and the total


bandwidth is less than 2.5 Gbit/s.

Encapsulation
format

Supports the GFP-T protocol, which complies with ITU-T G.7041.

Maintenance
features

Supports inloops and outloops on ports on the customer side, which can
be used to locate faults quickly.
Supports port-based RMON performance management.

Alarms and
performance
events

Reports various alarms and performance events, which can be used to


locate faults and maintain the equipment.

Figure 1.2 Service types and service rates supported by the MST4
Service Type

Rate

Remarks

FC100/FICON

1062.5 Mbit/s

SAN service

FC200

2125 Mbit/s

SAN service

ESCON

200 Mbit/s

SAN service

DVB-ASI

270 Mbit/s

Video service

15.1.4 Working Principle and Signal Flow


The MST4 consists of the client-side access module, FC protocol processing module,
encapsulation and mapping module, logic and control module, clock module, and power
module.
Figure 15-2 shows the functional block diagram of the MST4 by describing how to process
1xFC100 signals, 1xFC200 signals, 1xFICON signals, 1xDVB-ASI signals, or 1xESCON
signals.

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Figure 1.1 Functional block diagram of the MST4


Backplane

FC100
FC200
FICON
DVB-ASI
ESCON

Clientside
access
module

FC1_
RCV
FC1_
SND

FC2
FC2

FC1_
SND
FC1_
RCV

FC protocol
processing module

Logic and control module


100 MHz
125 MHz
135 MHz
212.5 MHz
622 MHz

Clock
module

Encapsulation
Decapsulation

Interface
converting
module

Mapping

Encapsulation and
mapping module

Communication

Reference clock and frame header

+3.3 V
Power
module

Power
module

Fuse
Fuse

Cross-connect unit A/B


Cross-connect unit A/B

SCC unit
Cross-connect unit

-48 V/-60 V
-48 V/-60 V
+3.3 V backup power

1.1.1.1.1381 Client-Side Access Module


The client-side access module transmits/receives FC100, FC200, FICON, DVB-ASI, and
ESCON services. The client-side interface unit performs O/E conversion for services and
monitors the optical signals on the client side.
In the upstream direction, the client-side data interface (CDI) receives serial data signals
accessed through the SFP optical module. The serial data signals are then transmitted to the
PCS functional module for physical layer and 8B/10B line performance monitoring.
In the downstream direction, 8B/ 10B conversion is performed for the signals from FC. The
signals are then adapted into client reference clocks by inserting or discarding idle packets.
After being converted from parallel signals into serial signals, the signals are transmitted
through the CDI interface to the optical module on the client side.

1.1.1.1.1382 FC Protocol Processing Module


The FC protocol processing unit mainly extends the distance of FC service transmission. This
module supports the maximum transmission distance of 3000 km for 2xFC100 services or the
maximum transmission distance of 1500 km for 1xFC200 services.
The FC protocol processing unit performs FC1 layer and FC2 layer functions. The FC1 layer
functions include the following:

8B/10B conversion

Synchronous processing

Extraction of primitive signal and primitive sequence

The FC2 layer functions include the following:

Check and counting of all special frames

Modification of values of certain special frames (FLOG1, PLOG1, and ELP)

CRC check

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1.1.1.1.1383 Encapsulation and Mapping Module


The encapsulation and mapping module mainly performs the following functions:

Encapsulates and maps data.

Decapsulates and demaps data.

According to the direction of the signal flow, the functional modules inside the chip can be
classified into modules in the ingress direction and modules in the egress direction. In the
ingress direction, signals from the client side to the line side are processed. In the egress
direction, signals from the line side to the client side are processed.
Ingress direction
Through GFP encapsulation, 64B/65B conversion is performed for data bytes after decoding.
The data bytes are then mapped in compliance with the GFP protocol.
Egress direction
SDH data frames are received from the line-side interface module. After overheads are
processed, GFP data frames are extracted from SDH concatenated channels and are then
transmitted to the decapsulation module for decapsulation.

1.1.1.1.1384 Logic and Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through buses. The logic and
control module manages and configures other modules of the board. This module contains
basic logic units and performs the following functions:

Writes and reads the register.

Provides interfaces for the CPU.

Checks and selects the clock.

Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Controls the shutting down of the optical module.

Implements communication.

Controls indicators.

1.1.1.1.1385 Clock Module


This module provides required reference clocks for boards. The clock frequency can be 100
MHz or 125 MHz.

1.1.1.1.1386 Power Module


It converts the 48 V/60 V power supply into the DC voltages that the modules of the board
require.

15.1.5 Front Panel


The front panel of the MST4 has indicators, interfaces, and a bar code.

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1.1.1.1.1387 Diagram of the Front Panel


Figure 15-3 shows the appearance of the front panel of the MST4.
Figure 1.1 Front panel of the MST4

MST4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

MST4

1.1.1.1.1388 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

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1.1.1.1.1389 Interfaces
The front panel of the MST4 has four pair of optical interfaces. Table 15-3 describes the types
and usage of the optical interfaces of the MST4.
Figure 1.1 Optical interfaces of the MST4
Interface

Type of
Interface

Usage

IN1IN4

LC

Receives multi-service optical signals.

OUT1OUT4

LC

Transmits multi-service optical signals.

15.1.6 Jumpers and DIP Switches


The MST4 does not have any jumpers or DIP switches that are used for board settings.

15.1.7 Valid Slots


The MST4 must be installed in a valid slot in the subrack. Otherwise, the MST4 cannot work
normally.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The MST4 can be installed in slots 18 and 1116 in the subrack.

When the cross-connect capacity is 200 Gbit/s, the MST4 can be installed in slots 18
and 1116. When the MST4 is installed in slots 14, 15, and 16, the bandwidth is 1.25
Gbit/s. When the MST4 is installed in slots 58 and 1114, the bandwidth is 2.5 Gbit/s.

15.1.8 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the MST4 indicates the type of supported services, type of optical
interface, and transmission distance.
Table 15-4 provides the relationship between the feature code of the MST4, the type of
supported services, type of optical interface, and transmission distance.
Figure 1.2 Relationship between the feature code of the MST4, the type of supported services,
type of optical interface, and transmission distance
Board

Feature
Code

Type of Supported Services


(Type of Optical Interface)

Transmission
Distance

SSN1MST410

10

2xFC (SM)

2 km

SSN1MST411

11

2xFC (SM)

15 km

SSN1MST412

12

2xFC (MM)

0.5 km

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Board

Feature
Code

Type of Supported Services


(Type of Optical Interface)

Transmission
Distance

SSN1MST413

13

4xESCON/DVB-ASI (SM)

15 km

SSN1MST414

14

4xESCON/DVB-ASI (MM)

2 km

SSN1MST415

15

1xFC2 (MM)

ESCON/DVB-ASI (MM)
SSN1MST416

16

1xFC2 (MM)

ESCON/DVB-ASI (SM)
SSN1MST417

SSN1MST418

17

18

1xFC (SM)

2 km

2xESCON/DVB-ASI (SM)

1xFC (SM)

2 km

2xESCON/DVB-ASI (MM)

15.1.9 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1390 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1391 Configuring the Board


Step 1 Required: Add the logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring the SAN Service.
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----End

1.1.1.1.1392 Commissioning the Board


Step 1 Required: Test the SAN service channel. For details, see 27.8 Testing the SAN Service
Channel.
----End

1.1.1.1.1393 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to ensure that the
board starts to work normally. When all the indicators are on and green, the board operates
normally. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 7 Required: Query the alarms of the board. Modify the connections or configurations of the
board according to the alarms until the alarms are cleared. For the method for querying the
alarms of a board, see Viewing the Current Alarms.
----End

15.1.10 Parameter Settings


You can set parameters for the MST4 by using the U2000.
You can set the following parameters for the MST4 by using the U2000:

J1 byte

C2 byte

For the description of each parameter, see 26 Parameter Settings.

15.1.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1394 Troubleshooting
Table 15-5 lists the faults that occur on the MST4 frequently and the troubleshooting methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the MST4 frequently
Fault Symptom

Common Fault Cause

Service
interruption

The services on a VCTRUNK


port are interrupted.

The services on a single


Ethernet port are interrupted.

The services on a VCTRUNK


port are transiently interrupted.

The protocol becomes

Transient service
interruption

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Troubleshooting Method
See Troubleshooting TDM Service
Interruptions.

See Troubleshooting Transient


Service Interruptions.

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Fault Symptom

15 SAN/Video Boards

Common Fault Cause

Troubleshooting Method

abnormal.
Packet loss

Bit errors occur on the line side.

Interconnection
fault

The interconnection fault


occurs on a single service port.

The interconnection fault


occurs on the VCG port.

See Troubleshooting Service


Packet Loss.
See Troubleshooting Device
Interconnection Faults.

1.1.1.1.1395 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the MST4, see Replacing an SAN/Video Board.

15.1.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the .

15.1.12.1 Alarms of N1MST4


AU_AIS

AU_CMM

AU_LOP

B3_EXC

B3_SD

BD_STATUS

BDID_ERROR

COMMUN_FAIL

HARD_BAD

HP_RDI

HP_REI

HP_SLM

HP_TIM

HP_UNEQ

IN_PWR_ABN

LASER_MOD_ERR

LOOP_ALM

LSR_COOL_ALM

LSR_NO_FITED

LSR_WILL_DIE

NO_BD_SOFT

NO_LSR_PARA_FILE

PLL_FAIL

POWER_ABNORMAL

R_LOC

R_LOS

TEM_LA

T_LOSEX

TEM_HA

PATCHFILE_NOTEXIST

TF

TR_LOC

PATCH_NOT_CONFIRM

PATCH_ERR

SPARE_PATH_ALM

SWDL_PKG_NOBDSOFT

WRG_BD_TYPE

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15.1.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the .

15.1.13.1 Performance Events of N1MST4


Figure 1.1 SDH
AUPJCHIGH

AUPJCLOW

HPBBE

HPCSES

HPES

HPFEBBE

HPFECSES

HPFEES

HPFESES

HPSES

HPUAS

OSPICCVCUR

OSPICCVMAX

OSPICCVMIN

OSPITMPCUR

OSPITMPMAX

OSPITMPMIN

RPLCUR

RPLMAX

RPLMIN

TLBCUR

TLBMAX

TLBMIN

TPLCUR

TPLMAX

TPLMIN

Figure 1.2 FC
WSys_los_cnt

Client_Invld_Words

Client_Crc_Err

LinkRst_Cnt

Client_RxFrmCnt_C1

Client_RxFrmCnt_C2

Client_RxFrmCnt_C3

Client_RxFrmCnt_C4

Client_RxFrmCnt_Cf

Client_RxFrmCnt_Sum

Client_TxFrmCnt_C1

Client_TxFrmCnt_C2

Client_TxFrmCnt_C3

Client_TxFrmCnt_C4

Client_TxFrmCnt_Cf

Client_TxFrmCnt_Sum

Client_RxByteCnt_sum

Client_TxByteCnt_sum

Client_unsupos_cnt

15.1.14 Technical Specifications


The specifications of the MST4 include the parameters specified for optical interfaces, laser
safety class, dimensions, weight, and power consumption.

1.1.1.1.1396 Parameters Specified for Optical Interfaces


The optical interfaces of the MST4 can use several types of optical modules. Table 15-8 lists
the parameters specified for the optical interfaces of the MST4.

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Figure 1.1 Parameters specified for the optical interfaces of the MST4
Parameter

Value

Service type

ESCON/DVB-ASI

Service rate

Optical interface type

ESCON: 200
Mbit/s

FC200/FC100/FICON

FC200: 2125 Mbit/s

FC100/FICON: 1062.5 Mbit/s

DVB-ASI: 270
Mbit/s

X3.296/(DVB-ASI)
EN50083-9
200-M5-SN-I

200-SM-LC-I

Fiber type

Singlemode LC

Multimode LC

Single-mode LC

Operating wavelength
range (nm)

1310

850

1310

Transmission distance
(km)

15

0.5

15

Maximum launched
optical power (dBm)

-8

-14

-2.5

-3

Minimum launched
optical power (dBm)

-15

-19

-9.5

-10

-5

Receiver sensitivity
(dBm)

-31

-30

-17

-21

Minimum overload
(dBm)

-8

-14

-3

Multimode LC

1.1.1.1.1397 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1398 Mechanical Specifications


The mechanical specifications of the MST4 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.9

1.1.1.1.1399 Power Consumption


The maximum power consumption of the MST4 at room temperature (25C) is 26 W.

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15.2 VST4
This topic describes the version, application, functions, working principle, front panel, and
technical specifications of the VST4 (4-port video-service transparent transmission board).
This topic also describes how to configure and commission the VST4.

15.2.1 Version Description


The VST4 is available in one functional version, namely, N1.

15.2.2 Application
The VST4 is a transparent transmission board used for receiving/transmitting various types of
video services.
The VST4 can transmit/receive DVB-ASI, SD-SDI, and HD-SDI services. Figure 15-4 shows
the networking and application of the VST4.
Figure 1.1 Networking and application of the VST4
NE1

NE2

VST4

VST4

SDI/DVB-ASI
Switch

SDI/DVB-ASI
Switch

15.2.3 Functions and Features


The VST4 receives/transmits video services, alarms, and other maintenance functions.
Table 15-9 provides the functions and features of the VST4.
Figure 1.1 Functions and features of the VST4
Function and
Feature

VST4

Basic functions

Provides four independent ports to transmit/receive services; supports


the transparent transmission of four-channel video services.

Interface type

SMB (SMB interfaces can be converted into BNC interfaces by means


of transit cables.)

Service types

Supports DVB-ASI, SD-SDI, and HD-SDI services. Table 15-10


describes types and rates of the services.

Maximum

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Function and
Feature

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VST4

upstream
bandwidth

the maximum upstream bandwidth is 5 Gbit/s. A VST4 board can


adapt to the bandwidth of the slot.

When a VST4 board is installed in any slot of slots 5-8 and 11-14,
the maximum upstream bandwidth is 10 Gbit/s. A VST4 board can
adapt to the bandwidth of the slot.

Concatenation
granularity

VC-4-Xc (X=4 or 16)

DVB-ASI

Transmits/Receives four-channel DVB-ASI services.

SD-SDI

Transmits/Receives four-channel SD-SDI services.

HD-SDI

When a VST4 is installed in any slot of slots 1-4 and 15-16, it


transmits/receives two-channel HD-SDI services. The VST4 can
adapt to the bandwidth of the slot.

When a VST4 is installed in any slot of slots 5-8 and 11-14, it


transmits/receives four-channel HD-SDI services. The VST4 can
adapt to the bandwidth of the slot.

Encapsulation
format

Supports the GFP protocol, which complies with ITU-T G.7041.

Maintenance
features

Supports inloops and outloops on electrical ports for locating faults


quickly.
Supports port-based RMON performance management.

Alarms and
performance
events

Reports various alarms and performance events, which can be used to


locate faults and maintain the equipment.

Figure 1.2 Service types and service rates supported by the VST4
Service Type

Rate

Remarks

DVB-ASI

270 Mbit/s

Video service

SD-SDI

270 Mbit/s

Video service

HD-SDI

1.485 Gbit/s

Video service

15.2.4 Working Principle and Signal Flow


The VST4 consists of the client-side access module, encapsulation and mapping module,
logic and control module, clock module, and power module.
Figure 15-5 shows the functional block diagram of the VST4 with the processing of 1xSDSDI signal, 1xHD-SDI signal, or 1xDVB-ASI signal.

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Figure 1.1 Functional block diagram of the VST4


Backplane
Encaps
ulation
SD- SDI
HD- SDI
DVB- ASI

Clientside
access
module

Bus
converting
module

Mapping

Decaps
ulation

Cross-connect unit A/B

Cross-connect unit A/B


Encapsulation and
mapping module
Communication

Logic and control module

66 MHz
100 MHz
155 MHz

Reference clock and frame header

SCC unit
Cross-connect unit A/B

Clock
module

+3.3V
Power
module

Power
module

Fuse

- 48 V/- 60 V
- 48V/- 60V

Fuse
+3.3 V backup power

1.1.1.1.1400 Client-Side Access Module


The client-side access module transmits/receives SD-SDI, HD-SDI, and DVB-ASI services.
The client-side interface unit processes input/output electrical signals.
In the upstream direction, the client-side access module receives serial data signals received
through the SMB interface. The serial data signals are then transmitted to the encapsulation
and mapping module and finally to the backplane through the bus conversion module.
In the downstream direction, bus conversion is performed for the signals from the backplane.
The signals are then transmitted to the encapsulation and mapping module. After being
decapsulated and demapped, the signals are transmitted to the client-side access module.

1.1.1.1.1401 Encapsulation and Mapping Module


The encapsulation and mapping module mainly performs the following functions:
encapsulating/mapping data, decapsulating/demapping data, processing LCAS and
SDH/SONET overheads, converging services, and encapsulating services.

1.1.1.1.1402 Logic Control Module


The logic and control module consists of the CPU, register, oscillator, Ethernet port, and
HDLC controller. This module is connected to external circuits through buses. The logic and
control module manages and configures other modules of the board. This module contains
basic logic units and performs the following functions:

Writes into and reads from the register.

Provides interfaces for the CPU.

Checks and selects the clock.

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Performs phase discrimination and frequency division on the clock.

Checks the in-service state of the cross-connect, SCC, and line boards.

Implements communication.

Controls indicators.

1.1.1.1.1403 Clock Module


This module provides required reference clocks for the board.

1.1.1.1.1404 Power Module


This module converts the -48 V/-60 V power supply into the DC voltages that the modules of
the board require.

15.2.5 Front Panel


The front panel of the VST4 has indicators, interfaces, and a bar code.

1.1.1.1.1405 Diagram of the Front Panel


Figure 15-6 shows the appearance of the front panel of the VST4.

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Figure 1.1 Front panel of the VST4

VST4
STAT
ACT
PROG
SRV

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4

VST4

1.1.1.1.1406 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) - two colors (red and green)

Service activation status indicator (ACT) - one color (green)

Board software status indicator (PROG) - two colors (red and green)

Service alarm indicator (SRV) - three colors (red, green, and yellow)

For the meanings of indicator states, see 23 Indicators.

1.1.1.1.1407 Interfaces
The front panel of the VST4 has four electrical interfaces. Table 15-11 describes the types and
usage of the electrical interfaces of the VST4.

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Figure 1.1 Electrical interfaces of the VST4


Interface

Type of Interface

Usage

IN1-IN4

SMB (BNC
interfaces can also
be provided after
conversion cables
are connected to
the SMB
interfaces.)

75-ohm interfaces that are used to receive


electrical signals.

OUT1-OUT4

SMB (BNC
interfaces can also
be provided after
conversion cables
are connected to
the SMB
interfaces.)

75-ohm interfaces that are used to transmits


electrical signals.

15.2.6 Jumpers and DIP Switches


The VST4 does not have any jumpers or DIP switches that are used for board settings.

15.2.7 Valid Slots


The VST4 must be installed in a valid slot in the subrack. Otherwise, the VST4 cannot work
properly.
The VST4 can be installed in slots 1-8 and 11-16. When the VST4 is installed in slots 1-4, 15,
and 16, the bandwidth is 5 Gbit/s. When the VST4 is installed in slots 5-8 and 11-14, the
bandwidth is 10 Gbit/s.

15.2.8 Feature Code


VST4 boards do not have feature codes.

15.2.9 Configuring and Commissioning a Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the board hardware, configuring the board,
commissioning the board, and checking the operation of the board.

1.1.1.1.1408 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check and record the bandwidth and slot information of the board.
Step 3 Required: Check whether the interface board and cable match the board. Ensure that the
cable matches the board.
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Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
Step 5 Required: Check whether the version of the board software matches the version of the NE
software and the version of the software. Ensure that the version of the board software is
correct.
----End

1.1.1.1.1409 Configuring the Board


Step 1 Required: Add a logical board. For details, see Adding Boards.
Step 6 Required: Configure services. For details, see Configuring Video Services.
----End

1.1.1.1.1410 Commissioning the Board


Step 1 Required: Test SDI service channels. For details, see 27.9 Testing the SDI Service Channel.
----End

1.1.1.1.1411 Checking the Operation of the Board


Step 1 Required: Check the status of the indicators on the front panel of the board to check whether
the board starts working properly. If all the indicators are on and green, the board operates
properly. For the meanings of the status of the indicators, see 23.2 Alarm Indicators on the
Boards.
Step 7 Required: Query the board alarms. Modify the connections or configurations of the board
according to the alarms until the alarms are cleared. For the method of querying the alarms of
a board, see Viewing the Current Alarms.
----End

15.2.10 Parameter Settings


You can set parameters for the VST4 by using the U2000.
You can set the following parameters for the VST4 by using the U2000:

J1 byte

C2 byte

For the description of each parameter, see 26 Parameter Settings.

15.2.11 Maintaining the Board


This topic describes the alarms and faults that may occur when the board operates. This topic
also provides the methods and precautions to be taken for rectifying the faults.

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1.1.1.1.1412 Troubleshooting
Table 15-12 lists the faults that occur on the VST4 frequently and the troubleshooting
methods.
Figure 1.1 Methods used to troubleshoot the faults that occur on the VST4 frequently
Fault Symptom

Common Fault Cause

Troubleshooting Method

Service
interruption

The services on a VCTRUNK port


are interrupted.

See Troubleshooting TDM Service


Interruptions.

Transient service
interruption

The services on a VCTRUNK


port are transiently interrupted.

The protocol becomes


abnormal.

See Troubleshooting Transient


Service Interruptions.

Packet loss

Bit errors occur on the line side.

See Troubleshooting Service


Packet Loss.

Interconnection
fault

The interconnection fault occurs


on a single service port.

See Troubleshooting Device


Interconnection Faults.

1.1.1.1.1413 Replacing the Board


See General Precautions to get familiar with the precautions to be taken for replacing a board before you
replace the board.

For information on how to replace the VST4, see Replacing an SAN/Video Board.

15.2.12 List of Alarms


This topic lists the alarms that may occur when the board operates. The alarms are reported
according to the logical board on the U2000.

15.2.12.1 Alarms of N1VST4


BD_STATUS

COMMUN_FAIL

R_LOS

R_LOC

AU_AIS

AU_LOP

HP_TIM

HP_SLM

HP_UNEQ

HP_RDI

HP_REI

B3_EXC

B3_SD

AU_CMM

LOOP_ALM

NO_BD_SOFT

TR_LOC

T_LOSEX

SPARE_PATH_ALM

BDID_ERROR

PLL_FAIL

HARD_BAD

PATCH_ERR

PATCH_NOT_CONFIRM

PATCHFILE_NOTEXIST

WRG_BD_TYPE

POWER_ABNORMAL

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TEMP_OVER

15 SAN/Video Boards

TEST_STATUS

15.2.13 List of Performance Events


This topic lists the performance events that may occur when the board operates. The
performance events are reported according to the logical board on the U2000.

15.2.13.1 Performance Events of N1VST4


AUPJCHIGH

AUPJCLOW

HPBBE

HPES

HPSES

HPUAS

HPCSES

HPFEBBE

HPFEES

HPFESES

HPFECSES

XCSTMPMAX

XCSTMPMIN

XCSTMPCUR

15.2.14 Technical Specifications


The technical specifications of the VST4 include the parameters specified for electrical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.1414 Parameters Specified for Electrical Interfaces


Table 15-13 lists the parameters specified for the electrical interfaces of the VST4.
Figure 1.1 Parameters specified for the electrical interfaces of the VST4
Parameter

Value

Rate

270 Mbit/s

1.485 Gbit/s

270 Mbit/s

Code type

NRZI

NRZI

MPEG-2

Interface type

SD-SDI

HD-SDI

DVB-ASI

Connector

SMB (A BNC connector is available by connecting a


conversion cable to the SMB connector.)

Transmission distance (m)

100

100

100

Interface standard
compliance

SMPTE
259M

SMPTE 292M

EN 50083-9

1.1.1.1.1415 Mechanical Specifications


The mechanical specifications of the VST4 are:

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Weight: 0.8 kg

1.1.1.1.1416 Power Consumption


The maximum power consumption of the VST4 at room temperature (25C) is 37 W.

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16

WDM Boards

About This Chapter


The WDM boards include the CMR2, CMR4, MR2, MR2A, MR2C, MR4, LWX, and FIB.
16.1 CMR2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11CMR2 (2-channel optical add/drop multiplexing board).
16.2 CMR4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11CMR4 (4-channel optical add/drop multiplexing board).
16.3 CMD2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the CMD2 (2-channel bidirectional CWDM optical add/drop
multiplexing board).
16.4 MR2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11MR2 (2-channel optical add/drop multiplexing board).
16.5 MR2A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MR2A (2-channel optical add/drop multiplexing board).
16.6 MR2C
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MR2C (2-channel optical add/drop multiplexing board).
16.7 MR4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11MR4 (4-channel optical add/drop multiplexing board).
16.8 LWX
This topic describes the version, functions, working principle, front panel, valid slots, and
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technical specifications of the LWX (arbitrary bit rate wavelength conversion board).
16.9 FIB
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the FIB (filter isolating board).

16.1 CMR2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11CMR2 (2-channel optical add/drop multiplexing board).

16.1.1 Version Description


The CMR2 is available in one functional version, namely, TN11.

16.1.2 Application
The CMR2 is mainly used to add/drop and multiplex two channels of wavelength signals
to/from the multiplexed signals.
Figure 16-1 shows the application of the CMR2 in the CWDM system.
Figure 1.1 Application of the CMR2 in the CWDM system

Optical transmission
network

CMR2

CMR2

Line
board

Line
board

Line
board

Remarks: The line board in this figure supports CWDM wavelength signals.

16.1.3 Functions and Features


The CMR2 is applied to the coarse wavelength division multiplexing (CWDM) system. The
channel spacing is 20 nm. The CMR2 supports the add/drop multiplexing function and
channel expansion function.
Table 16-1 provides the functions and features of the CMR2.
Figure 1.1 Functions and features of the CMR2
Function and
Feature

CMR2

Basic functions

Adds/Drops and multiplexes two signals to/from the multiplexed

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Function and
Feature

16 WDM Boards

CMR2
signals.

Channel expansion

Provides the interface to cascade another optical add/drop


multiplexing board to realize the expansion of the add/drop channel.

16.1.4 Working Principle and Signal Flow


The CMR2 consists of the OADM module, communication and control module, and power
module.
Figure 16-2 shows the functional block diagram of the CMR2.
Figure 1.1 Functional block diagram of the CMR2
D1

IN

D2

MO

MI

Drop optical
module

A1

A2

Add optical
module

OUT

OADM optical
module
Control
Memory

CPU

Communication

Control and communication module


Power supply
module
Fuse

Required
voltage

DC power supply
from a backplane

Backplane
(controlled by SCC)
SCC

The CMR2 contains the OADM module that adds, drops, and multiplexes two channels of
signals. In addition, the CMR2 provides the interface to cascade another optical add/drop
multiplexing board to increase the add/drop capability. The CMR2 is a passive board and does
not have an interface with the backplane.

1.1.1.1.1417 OADM Module


The board receives one multiplexed optical signal that is sent by the upstream station on the
IN interface. Then, the drop optical module drops two wavelengths from the signal through
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optical interfaces D01 and D02. The two dropped wavelengths are transmitted through the
MO optical interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds two wavelengths through optical
interfaces A01 and A02 and multiplexes them with the signal on the main optical path into
one signal. This multiplexed signal is transmitted through the OUT interface.

1.1.1.1.1418 Communication and Control Module

Controls the operations of the entire board.

Collects the following information of each functional module of the board: alarms,
performance events, working status, and voltage detection.

Communicates data with the SCC.

1.1.1.1.1419 DC/DC Converter


It converts 48 V DC or 60 V DC into a voltage required by each module of the board.

16.1.5 Front Panel


The front panel of the CMR2 has indicators, interfaces, and a laser safety class label.

1.1.1.1.1420 Diagram of the Front Panel


Figure 16-3 shows the appearance of the front panel of the CMR2.

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Figure 1.1 Front panel of the CMR2


CMR2
STAT
LASER
RADIATION
DO NOT V IEW DIRE CT LY
WITH OPT ICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2
A2

CMR2

1.1.1.1.1421 Indicator
The front panel of the CMR2 has one indicator as follows: board hardware status indicator
(STAT) two colors (red and green)
For the meanings of the status of the indicator, see 23 Indicators.

1.1.1.1.1422 Interfaces
The front panel of the CMR2 has eight optical interfaces. Table 16-2 describes the types and
usage of the optical interfaces of the CMR2.
Figure 1.1 Optical interfaces of the CMR2
Interface

Type of
Interface

Usage

A1A2

LC

Receives the signals sent from the optical wavelength


converting board or centralized client-side equipment.

D1D2

LC

Transmits signals to the optical wavelength converting


board or centralized client-side equipment.

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Interface

Type of
Interface

Usage

IN

LC

Receives the multiplexed signals.

OUT

LC

Transmits the multiplexed signals.

MO

LC

Works as a cascading output optical interface and is


connected to the input optical interface of an OADM board.

MI

LC

Works as a cascading input optical interface and is


connected to the output optical interface of an OADM
board.

16.1.6 Valid Slots


The CMR2 can be installed in slots 18 and 1117 in the main subrack.

16.1.7 Feature Code


The feature code of the CMR2 contains eight characters, which indicate the wavelengths of
the two channels of optical signals processed by the CMR2.
Table 16-3 describes the feature code of the CMR2.
Figure 1.2 Feature code of the CMR2
Feature Code

Indication

Description

First four characters

Wavelength of optical
signals

Indicates the wavelength of


the first channel of optical
signals processed by the
CMR2.

Last four characters

Wavelength of optical
signals

Indicates the wavelength of


the second channel of
optical signals processed by
the CMR2.

Consider the TN11CMR2 whose feature code is "14711571" as an example. The meaning of
the feature code of the TN11CMR2 is as follows:

"1471" indicates that the wavelength of the first channel of optical signals is 1471 nm.

"1571" indicates that the wavelength of the second channel of optical signals is 1571 nm.

16.1.8 Technical Specifications


The technical specifications of the CMR2 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1423 Parameters Specified for Optical Interfaces


Table 16-4 lists the parameters specified for the optical interfaces of the CMR2.
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Figure 1.1 Parameters specified for the optical interfaces of the CMR2
Optical Interface

Parameter

Value

Operating wavelength range


(nm)

1271 to 1611

Channel spacing (nm)

20

IN-D1

0.5 dB passband bandwidth


(nm)

6.5

Insertion loss (dB) on the


drop channel

1.5

Adjacent channel isolation


(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

0.5 dB passband bandwidth


(nm)

6.5

Insertion loss (dB) on the


add channel

1.5

IN-MO

Insertion loss (dB)

1.0

MI-OUT

Isolation (dB)

> 13

Return loss (dB)

> 40

IN-D2

A1-OUT
A2-OUT

1.1.1.1.1424 Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power
of the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

1.1.1.1.1425 Mechanical Specifications


The mechanical specifications of the CMR2 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.8

1.1.1.1.1426 Power Consumption


The power consumption of the CMR2 at room temperature (25C) is 0 W.

16.2 CMR4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11CMR4 (4-channel optical add/drop multiplexing board).

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16.2.1 Version Description


The CMR4 is available in one functional version, namely, TN11.

16.2.2 Application
The CMR4 is mainly used to add/drop and multiplex four channels of wavelength signals
to/from the multiplexed signals.
Figure 16-4 shows the application of the CMR4 in the CWDM system.
Figure 1.1 Application of the CMR4 in the CWDM system

Optical transmission
network

CMR4

Line
board

Line
board

CMR4

Line
board

Line
board

Remarks: The line board in this figure supports CWDM wavelength signals.

16.2.3 Functions and Features


The CMR4 is applied to the CWDM system. The channel spacing is 20 nm. The CMR4
supports the add/drop multiplexing function and channel expansion function.
Table 16-5 provides the functions and features of the CMR4.
Figure 1.1 Functions and features of the CMR4
Function and
Feature

CMR4

Basic functions

Adds/Drops and multiplexes four signals to/from the multiplexed


signals.

Channel expansion

Provides the interface to cascade another optical add/drop


multiplexing board to realize the expansion of the add/drop channel.

16.2.4 Working Principle and Signal Flow


The CMR4 consists of the OADM module, communication and control module, and power
module.
Figure 16-5 shows the functional block diagram of the CMR4.

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Figure 1.1 Functional block diagram of the CMR4


D01 D02 D03 D04

MO

MI

A01 A02 A03 A04

Drop

IN

Add

OUT

OADM module

Communication and control module

Pow er module
DC/DC
converter
Delayed
startup
Fuse
SCC

Backplane

-48 V/-60 V

-48 V/-60 V

SCC

1.1.1.1.1427 OADM Module


The board receives one multiplexed optical signal that is sent by the upstream station on the
IN interface. Then, the drop optical module drops four wavelengths from the signal through
optical interfaces D01D04. The four dropped wavelengths are transmitted through the MO
optical interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds four wavelengths through optical
interfaces A01A04 and multiplexes them with the signal on the main optical path into one
signal. This multiplexed signal is transmitted through the OUT interface.

1.1.1.1.1428 Communication and Control Module

Controls the operations of the entire board.

Collects the following information of each functional module of the board: alarms,
performance events, working status, and voltage detection.

Communicates data with the SCC.

1.1.1.1.1429 DC/DC Converter


It converts 48 V DC or 60 V DC into a voltage required by each module of the board.

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16.2.5 Front Panel


The front panel of the CMR4 has indicators, interfaces, and a laser safety class label.

1.1.1.1.1430 Diagram of the Front Panel


Figure 16-6 shows the appearance of the front panel of the CMR4.
Figure 1.1 Front panel of the CMR4
CMR4
STAT
LASER
RADIATION
DO NOT V IEW DIRE CT LY
WIT H OP TICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2
A2
D3
A3
D4
A4

CMR4

1.1.1.1.1431 Indicators
The front panel of the CMR4 has one indicator as follows: board hardware status indicator
(STAT) two colors (red and green)
For the meanings of the status of the indicator, see 23 Indicators.

1.1.1.1.1432 Interfaces
The front panel of the CMR4 has 12 optical interfaces. Table 16-6 describes the types and
usage of the optical interfaces of the CMR4.

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Figure 1.1 Optical interfaces of the CMR4


Interface

Type of
Interface

Usage

A1A4

LC

Receives the signals sent from the optical wavelength


converting board or centralized client-side equipment.

D1D4

LC

Transmits signals to the optical wavelength


converting board or centralized client-side equipment.

IN

LC

Receives the multiplexed signals.

OUT

LC

Transmits the multiplexed signals.

MO

LC

Works as a cascading output optical interface and is


connected to the input optical interface of an OADM
board.

MI

LC

Works as a cascading input optical interface and is


connected to the output optical interface of an OADM
board.

16.2.6 Valid Slots


The CMR4 can be installed in slots 18 and 1117 in the main subrack.

16.2.7 Feature Code


The feature code of the CMR4 contains eight characters, which indicate the wavelengths of
the four channels of optical signals processed by the CMR4.
Table 16-7 describes the feature code of the CMR4.
Figure 1.2 Feature code of the CMR4
Feature Code

Indication

Description

1st and 2nd characters

Wavelength of optical
signals

The two characters are the


two middle characters of the
figure that indicates the
wavelength of the first
channel of optical signals
processed by the CMR4.

3rd and 4th characters

Wavelength of optical
signals

The two characters are the


two middle characters of the
figure that indicates the
wavelength of the second
channel of optical signals
processed by the CMR4.

5th and 6th characters

Wavelength of optical
signals

The two characters are the


two middle characters of the
figure that indicates the
wavelength of the third

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Indication

Description
channel of optical signals
processed by the CMR4.

7th and 8th characters

Wavelength of optical
signals

The two characters are the


two middle characters of the
figure that indicates the
wavelength of the fourth
channel of optical signals
processed by the CMR4.

Consider the TN11CMR4 whose feature code is "47495961" as an example. The meaning of
the feature code of the TN11CMR4 is as follows:

"47" indicates that the wavelength of the first channel of optical signals is 1471 nm.

"49" indicates that the wavelength of the second channel of optical signals is 1491 nm.

"59" indicates that the wavelength of the third channel of optical signals is 1591 nm.

"61" indicates that the wavelength of the fourth channel of optical signals is 1611 nm.

16.2.8 Technical Specifications


The technical specifications of the CMR4 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1433 Parameters Specified for Optical Interfaces


Table 16-8 lists the parameters specified for the optical interfaces of the CMR4.
Figure 1.1 Parameters specified for the optical interfaces of the CMR4
Optical Interface

Parameter

Value

Operating wavelength range


(nm)

1291 to 1611 (1371 nm excluded)

Channel spacing (nm)

20

IN-D1

0.5 dB passband bandwidth


(nm)

6.5

Insertion loss (dB) on the


drop channel

Adjacent channel isolation


(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

0.5 dB passband bandwidth


(nm)

6.5

Insertion loss (dB) on the


add channel

IN-D2
IN-D3
IN-D4

A1-OUT
A2-OUT
A3-OUT

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Parameter

Value

IN-MO

Insertion loss (dB)

1.5

MI-OUT

Isolation (dB)

> 13

Return loss (dB)

> 40

A4-OUT

1.1.1.1.1434 Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power
of the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

1.1.1.1.1435 Mechanical Specifications


The mechanical specifications of the CMR4 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.9

1.1.1.1.1436 Power Consumption


The power consumption of the CMR4 at room temperature (25C) is 0 W.

16.3 CMD2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the CMD2 (2-channel bidirectional CWDM optical add/drop
multiplexing board).

16.3.1 Version Description


The CMD2 is available in one functional version, namely, SSN1.

16.3.2 Application
The CMD2 adds/drops two channels of signals to/from the multiplexed channel in two
directions. The CMD2 complies with CWDM technical specifications.
The CMD2 supports two-fiber bidirectional transmission. Figure 16-7 shows the application
of the CMD2 in a CWDM system.

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Figure 1.1 Application of the CMD2 in a CWDM system

Optical transmission
network

CMD2

Line board

Line board

CMD2

Line board

Line board

Remarks: The line board in this figure supports CWDM wavelength signals.

16.3.3 Functions and Features


The CMD2 is used to add/drop two channels of signals in a CWDM system.
Table 16-9 provides the functions and features of the CMD2.
Figure 1.1 Functions and features of the CMD2
Function and
Feature

CMD2

Basic functions

Adds/Drops two channels of signals to/from the multiplexed


channel in two directions.

CWDM
specifications

Complies with CWDM technical specifications.

16.3.4 Working Principle and Signal Flow


The CMD2 consists of an OADM module and a communication module.
Figure 16-8 shows the functional block diagram of the CMD2.

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Figure 1.1 Functional block diagram of the CMD2


D11 D12

A11

Drop

IN1

A12

Add

A21 A22

D21 D22

Add

OADM
module

Drop

IN2

OADM
module

OUT1

OUT2

1.1.1.1.1437 Signal Flow


Optical port IN1 receives a multiplexed channel of signals from an upstream station and sends
the signals to the OADM module. The OADM module then demultiplexes two channels of
signals from the multiplexed channel, and sends one channel of signals to optical port D11
and the other channel of signals to optical port D12.
Optical ports A11 and A12 each receive one channel of signals from the local station and send
the received signals to the OADM module. The OADM module then multiplexes the two
channels of signals and sends the multiplexed channel of signals to optical port OUT1.
Optical ports IN2 and OUT2 process signals in the same way as optical ports IN1 and OUT1
do, but in different directions.

1.1.1.1.1438 Functions of the Board Modules

OADM module

Adds/Drops two CWDM channels of signals to/from the multiplexed channel.

16.3.5 Front Panel


The front panel of the CMD2 has optical interfaces.

1.1.1.1.1439 Diagram of the Front Panel


Figure 16-9 shows the appearance of the front panel of the CMD2.

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Figure 1.1 Front panel of the CMD2

CMD2

CAUTION
HAZARDLEVEL 1M INVISIBLE
LASER RADIATION
DO NOT VIEW DIRECTLY WITH
NON-ATTENUATING OPTICAL
INSTRUMENTS

IN1 OUT1 A11 D11 A12 D12 IN2 OUT2 A21 D21 A22 D22

CMD2

The number in the silkscreen under an optical interface on the front panel indicates one of the
wavelengths that are supported by the optical interface.

1.1.1.1.1440 Indicators
The front panel of the CMD2 does not have any indicators.

1.1.1.1.1441 Interfaces
The front panel of the CMD2 has 12 optical interfaces. Table 16-10 describes the types and
usage of the optical interfaces of the CMD2.
Figure 1.1 Optical interfaces of the CMD2
Interface

Type of
Interface

Usage

IN1

LC

Receives the first multiplexed channel of signals.

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Interface

Type of
Interface

Usage

OUT1

LC

Transmits the first multiplexed channel of signals.

A11/A12

LC

Receives the first channel of signals transmitted from an


optical transponder board or the integrated client equipment.

D11/D12

LC

Transmits the first channel of signals to an optical


transponder board or the integrated client equipment.

IN2

LC

Receives the second multiplexed channel of signals.

OUT2

LC

Transmits the second multiplexed channel of signals.

A21/A22

LC

Receives the second channel of signals transmitted from an


optical transponder board or the integrated client equipment.

D21/D22

LC

Transmits the second channel of signals to an optical


transponder board or the integrated client equipment.

16.3.6 Valid Slots


The CMD2 occupies one slot.
The CMD2 can be installed in slots 19-26 and 29-36 in a main subrack. If an extended
subrack is connected to the main subrack, the CMD2 can also be installed in slots 69-76 and
79-86 in the extended subrack.

16.3.7 Feature Code


No feature code is defined for the CMD2.

16.3.8 Configuring and Commissioning the Board


After you select a correct board, you need to configure and commission the board. The
following tasks need to be performed: checking the hardware of the board, configuring the
board, commissioning the board, and checking the operation of the board.

1.1.1.1.1442 Checking the Hardware of the Board


Step 1 Required: Check the hardware of the board.

The labels on the front panel of the board must be correct and clear.

The daughter board of the board must be properly installed.

All the components on both surfaces of the board must be available and intact.

Step 2 Required: Check whether the active board and standby board are installed in the correct slots.
Step 3 Required: Check whether the wavelength specified on the label, attached to the front panel of
the board, is the same as the actually used wavelength.
Step 4 Required: Check whether the board is properly installed. The board must be pushed to the
bottom of the subrack along the guide rails, and the front panel of the board must be properly
locked. For the method for installing a board, see Replacing Boards Onsite.
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----End

1.1.1.1.1443 Configuring the Board


Step 1 Required: The CMD2 is a passive board, and therefore a logical board needs to be added for
it on the NMS. For information on how to add a logical board for the CMD2 on the NMS, see
Adding Boards.
----End

1.1.1.1.1444 Commissioning the Board


Step 1 Required: Test the insertion loss of the board. For details, see 16.3.10 Maintaining the Board.
----End

1.1.1.1.1445 Checking the Operation of the Board


Step 1 Required: Verify that the input/output directions of fibers connected to the board are correct.
Step 5 Required: Verify that the optical wavelength used by each optical port on the board is the
same as the information specified on the label.
----End

16.3.9 Parameter Settings


The CMD2 does not have any parameters to be set.

16.3.10 Maintaining the Board


This topic describes the faults that may occur when the board operates. This topic also
provides the methods and precautions to be taken for rectifying the faults.

1.1.1.1.1446 Testing Insertion Loss


Insertion loss is a key specification of an optical add/drop multiplexing board. If the insertion
loss of a board is normal, the board is not faulty; otherwise, the board is faulty or optical ports
on the board need to be cleaned. The methods of testing the insertion loss of an optical
multiplexer and demultiplexer board are as follows.
Figure 16-10 shows the diagram for testing the insertion loss of the CMD2.

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Figure 1.1 Diagram for testing the insertion loss of the CMD2
D11 D12

D21 D22

IN1

IN2
CMD2

OUT1

OUT2

A11 A12

A21 A22

Step 1 Required: Measure the input optical power Pi at the A11 port and the output optical power Po
at the OUT1 port on the CMD2. The optical power is expressed in dBm.
The value obtained by subtracting Po from Pi represents the insertion loss from the A11 port
to the OUT1 port.
In the case of the CMD2, use the preceding method to measure the insertion loss of IN1-D11,
A11-OUT1, IN1-D12, A12-OUT1, IN2-D21, A21-OUT2, IN2-D22, and A22-OUT2.
For the normal insertion loss value of the board, see 16.3.13 Technical Specifications.
----End

1.1.1.1.1447 Troubleshooting
When all services on an NE are interrupted or a service on a WDM-side channel of the CMD2
is interrupted, the CMD2 may be faulty.
Step 1 Required: Check whether the insertion loss of the CMD2 is normal. For details, see the
insertion loss specification of the CMD2. If the insertion loss is excessively high, go to the
next step.
Step 2 Required: Use a fiber cleaning tool to clean the internal and external fibers and optical ports
on the CMD2. Then, test the insertion loss again. If the insertion loss returns to normal, the
fault is rectified; if the insertion loss is still excessively high, go to the next step.
Step 3 Optional: The CMD2 is faulty. In this case, replace the CMD2.
----End

16.3.11 List of Alarms


No alarm is defined for the CMD2.

16.3.12 List of Performance Events


No performance event is defined for the CMD2.

16.3.13 Technical Specifications


The technical specifications of the CMD2 include the parameters specified for optical
interfaces, mechanical specifications, and power consumption.
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1.1.1.1.1448 Parameters Specified for Optical Interfaces


Table 16-11 lists the parameters specified for the optical interfaces of the CMD2.
Figure 1.1 Parameters specified for the optical interfaces of the CMD2
Optical Interface

Parameter

Value

Operating wavelength range


(nm)

1471 to 1611

Channel spacing (nm)

20

IN1-D11

1.0 dB passband bandwidth


(nm)

13.0

Insertion loss (dB) on the


drop channel

< 1.5

Adjacent channel isolation


(dB)

> 30

Non-adjacent channel
isolation (dB)

> 40

1.0 dB passband bandwidth


(nm)

13.0
< 1.5

A22-OUT2

Insertion loss (dB) on the


add channel

Reflectance (dB)

< -40

IN1-D12
IN2-D21
IN2-D22

A11-OUT1
A12-OUT1
A21-OUT2

1.1.1.1.1449 Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power
of the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

1.1.1.1.1450 Mechanical Specifications


The mechanical specifications of the CMD2 are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.6

1.1.1.1.1451 Power Consumption


The power consumption of the CMD2 at room temperature (25C) is 0 W.

16.4 MR2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11MR2 (2-channel optical add/drop multiplexing board).
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16.4.1 Version Description


The MR2 is available in one functional version, namely, TN11.

16.4.2 Application
The MR2 is mainly used to add/drop and multiplex two channels of wavelength signals
to/from the multiplexed signals.
Figure 16-11 shows the application of the MR2 in the DWDM system.
Figure 1.1 Application of the MR2 in the DWDM system

Optical transmission
network

MR2

Line
board

Line
board

MR2

Line
board

Line
board

Remarks: The line board in this figure supports DWDM wavelength signals.

16.4.3 Functions and Features


The MR2 is applied to the dense wavelength division multiplexing (DWDM) system. The
channel spacing is 0.8 nm. The MR2 supports the add/drop multiplexing function and channel
expansion function.
Table 16-12 provides the functions and features of the MR2.
Figure 1.1 Functions and features of the MR2
Function and
Feature

MR2

Basic functions

Adds/Drops and multiplexes any two signals to/from the


multiplexed signals.

Channel expansion

Provides the interface to cascade another optical add/drop


multiplexing board to realize the expansion of the add/drop channel.

16.4.4 Working Principle and Signal Flow


The MR2 consists of the OADM module, communication and control module, and power
module.

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Figure 16-12 shows the functional block diagram of the MR2.


Figure 1.1 Functional block diagram of the MR2
D1

IN

D2

MO

MI

Drop optical
module

A1

A2

Add optical
module

OUT

OADM optical
module
Control
CPU

Memory

Communication

Control and communication module


Power supply
module
Fuse

Required
voltage

DC power supply
from a backplane

Backplane
(controlled by SCC)
SCC

1.1.1.1.1452 OADM Module


The board receives one multiplexed optical signal that is sent by the upstream station on the
IN interface. Then, the drop optical module drops two wavelengths from the signal through
optical interfaces D01 and D02. The two dropped wavelengths are transmitted through the
MO optical interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds two wavelengths through optical
interfaces A01 and A02 and multiplexes them with the signal on the main optical path into
one signal. This multiplexed signal is transmitted through the OUT interface.

1.1.1.1.1453 Communication and Control Module

Controls the operations of the entire board.

Collects the following information of each functional module of the board: alarms,
performance events, working status, and voltage detection.

Communicates data with the SCC.

1.1.1.1.1454 DC/DC Converter


It converts 48 V DC or 60 V DC into a voltage required by each module of the board.
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16.4.5 Front Panel


The front panel of the MR2 has indicators, interfaces, and a laser safety class label.

1.1.1.1.1455 Diagram of the Front Panel


Figure 16-13 shows the appearance of the front panel of the MR2.
Figure 1.1 Front panel of the MR2
MR2
STAT

LASER
RADIATION
DO NOT VIEW DIRECTL Y
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2
A2

MR2

1.1.1.1.1456 Indicators
The front panel of the MR2 has one indicator as follows: board hardware status indicator
(STAT) two colors (red and green)
For the meanings of the status of the indicator, see 23 Indicators.

1.1.1.1.1457 Interfaces
The front panel of the MR2 has eight optical interfaces. Table 16-13 describes the types and
usage of the optical interfaces of the MR2.

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Figure 1.1 Optical interfaces of the MR2


Interface

Type of
Interface

Usage

A1A2

LC

Receives the signals sent from the optical wavelength


converting board or centralized client-side equipment.

D1D2

LC

Transmits signals to the optical wavelength


converting board or centralized client-side equipment.

IN

LC

Receives the multiplexed signals.

OUT

LC

Transmits the multiplexed signals.

MO

LC

Works as a cascading output optical interface and is


connected to the input optical interface of an OADM
board.

MI

LC

Works as a cascading input optical interface and is


connected to the output optical interface of an OADM
board.

16.4.6 Valid Slots


The MR2 can be installed in slots 18 and 1117 in the main subrack.

16.4.7 Feature Code


The feature code of the MR2 contains eight characters, which indicate the frequencies of the
two channels of optical signals processed by the MR2.
Table 16-14 describes the feature code of the MR2.
Figure 1.2 Feature code of the MR2
Feature Code

Indication

Description

First four (14) characters

Frequency of optical signals

The four characters are the


last four characters of the
figure that indicates the
frequency of the first
channel of optical signals
processed by the MR2.

Last four (58) characters

Frequency of optical signals

The four characters are the


last four characters of the
figure that indicates the
frequency of the second
channel of optical signals
processed by the MR2.

Consider the TN11MR2 whose feature code is "93609370" as an example. The meaning of
the feature code of the TN11MR2 is as follows:
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"9360" indicates that the frequency of the first channel of optical signals is 193.60 THz.

"9370" indicates that the frequency of the second channel of optical signals is 193.70
THz.

16.4.8 Technical Specifications


The technical specifications of the MR2 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1458 Parameters Specified for Optical Interfaces


Table 16-15 lists the parameters specified for the optical interfaces of the MR2.
Figure 1.1 Parameters specified for the optical interfaces of the MR2
Optical Interface

Parameter

Value

Operating wavelength range


(nm)

1529 to 1561

Channel spacing (GHz)

100

IN-D1

0.5 dB passband bandwidth


(nm)

0.11

Insertion loss (dB) on the


drop channel

1.5

Adjacent channel isolation


(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

0.5 dB passband bandwidth


(nm)

0.11

Insertion loss (dB) on the


add channel

1.5

IN-MO

Insertion loss (dB)

1.0

MI-OUT

Isolation (dB)

> 13

Return loss (dB)

> 40

IN-D2

A1-OUT
A2-OUT

1.1.1.1.1459 Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power
of the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

1.1.1.1.1460 Mechanical Specifications


The mechanical specifications of the MR2 are as follows:

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Weight (kg): 0.9

1.1.1.1.1461 Power Consumption


The power consumption of the MR2 at room temperature (25C) is 0 W.

16.5 MR2A
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MR2A (2-channel optical add/drop multiplexing board).

16.5.1 Version Description


The MR2A is available in one functional version, namely, N1. The N1MR2A is discontinued.

16.5.2 Application
The MR2A is mainly used to add/drop and multiplex two channels of wavelength signals
to/from the multiplexed signals.
Figure 16-14 shows the application of the MR2A in the DWDM system.
Figure 1.1 Application of the MR2A in the DWDM system

Optical transmission
network

MR2A

Line
board

MR2A

Line
board

Line
board

Line
board

Remarks: The line board in this figure supports DWDM wavelength signals.

16.5.3 Functions and Features


The MR2A is applied to the DWDM system. The channel spacing is 0.8 nm. The MR2A
supports the add/drop multiplexing function between any two adjacent wavelengths.
Table 16-16 provides the functions and features of the MR2A.
Figure 1.1 Functions and features of the MR2A
Function and
Feature

MR2A

Basic functions

Adds/Drops any two adjacent standard wavelengths defined in ITU-

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Function and
Feature

16 WDM Boards

MR2A
T G.692 (DWDM). The signals are transparently transmitted and the
operating wavelength ranges from 1535.82 nm to 1560.61 nm.

OTM function

One MR2A board can work as a two-channel add/drop OTM station,


as shown in Figure 16-15. Two MR2A boards can be cascaded to
work as a four-channel add/drop OTM station, as shown in Figure
16-16.

OADM function

Works as a two-channel add/drop OADM station when working with


the LWX. For details, see Figure 16-17.

Central wavelength

Supports the standard wavelengths defined in ITU-T


Recommendations. The channel spacing is 100 GHz.

Figure 1.1 One MR2A board working as a two-channel add/drop OTM station
D1

IN

D2

MO

Drop

OUT

MI

Add
MR2A
A1

A2

Figure 1.2 Two MR2A boards being cascaded to work as a four-channel add/drop OTM station
D1

IN

D2

MO IN

Drop

OUT
MR2A

D2

Drop

MI OUT

Add

MO

MI

Add
MR2A

A1

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A2

A1

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Figure 1.3 MR2A and LWX working as a two-channel add/drop OADM station

LWX
A2

D2
MO

Out
MR2A

In
D1

MI
A1

LWX

16.5.4 Working Principle and Signal Flow


The MR2A consists of the OADM module.
Figure 16-18 shows the functional block diagram of the MR2A.
Figure 1.1 Functional block diagram of the MR2A
D01

IN

D02

MO

MI

A01

Drop

A02

Add

OUT

OADM
module

The MR2A contains the OADM module that adds, drops, and multiplexes two channels of
signals. In addition, the MR2A provides the interface to cascade another optical add/drop
multiplexing board to increase the add/drop capability. The MR2A is a passive board and does
not have an interface with the backplane.

1.1.1.1.1462 OADM Module


The board receives one multiplexed optical signal that is sent by the upstream station on the
IN interface. Then, the drop optical module drops two wavelengths from the signal through
optical interfaces D01 and D02. The two dropped wavelengths are transmitted through the
MO optical interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds two wavelengths through optical
interfaces A01 and A02 and multiplexes them with the signal on the main optical path into
one signal. This multiplexed signal is transmitted through the OUT interface.
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16.5.5 Front Panel


The front panel of the MR2A has interfaces and a laser safety class label.

1.1.1.1.1463 Diagram of the Front Panel


Figure 16-19 shows the appearance of the front panel of the MR2A.
Figure 1.1 Front panel of the MR2A

MR2A

CLASS 1
LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2 A2

MR2A

1.1.1.1.1464 Interfaces
The front panel of the MR2A has four LC optical interfaces. Table 16-17 describes the types
and usage of the optical interfaces of the MR2A.

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Figure 1.1 Optical interfaces of the MR2A


Interface

Type of
Interface

Usage

A01A02

LC

Adds two wavelengths of signals from the local


equipment.

D01D02

LC

Drops two wavelengths of signals to the local equipment.

IN

LC

Receives the multiplexed signals of two wavelengths.

OUT

LC

Transmits the multiplexed signals of two wavelengths.

MO/MI

LC

Works as a cascading interface and cascades several


MR2A boards.

16.5.6 Valid Slots


The slots valid for the MR2A vary with the cross-connect capacity and subrack of the
equipment.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the MR2A are as follows:

When the cross-connect capacity is 200 Gbit/s, the MR2A can be installed in slots 18
and 1117 in the subrack.

16.5.7 Technical Specifications


The technical specifications of the MR2A include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1465 Parameters Specified for Optical Interfaces


Table 16-18 lists the parameters specified for the optical interfaces of the MR2A.
Figure 1.1 Parameters specified for the optical interfaces of the MR2A
Parameter

Value

Operating wavelength
range (nm)

The operating wavelength range is from 1535.82 nm to


1560.61 nm. The working wavelengths can be any two
adjacent standard wavelengths defined in ITU-T G.692
(DWDM).

Line code pattern

NRZ

Channel spacing (GHz)

100

Insertion loss on the add

<2

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Value

channel or drop channel


(dB)
Adjacent channel isolation
(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

-0.5 dB channel bandwidth


(nm)

< 0.11

1.1.1.1.1466 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1467 Mechanical Specifications


The mechanical specifications of the MR2A are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.1468 Power Consumption


The maximum power consumption of the MR2A at room temperature (25C) is 0 W.

16.6 MR2C
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the MR2C (2-channel optical add/drop multiplexing board).

16.6.1 Version Description


The MR2C is available in one functional version, namely, N1.

16.6.2 Application
The MR2C is mainly used to add/drop and multiplex two channels of wavelength signals
to/from the multiplexed signals.
Figure 16-20 shows the application of the MR2C in the DWDM system.

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Figure 1.1 Application of the MR2C in the DWDM system

Optical transmission
network

MR2C

Line
board

Line
board

MR2C

Line
board

Line
board

Remarks: The line board in this figure supports DWDM wavelength signals.

16.6.3 Functions and Features


The MR2C is applied to the DWDM system. The channel spacing is 0.8 nm. The MR2C
supports the add/drop multiplexing function between any two adjacent wavelengths.
Table 16-19 provides the functions and features of the MR2C.
Figure 1.1 Functions and features of the MR2C
Function and
Feature

MR2C

Basic functions

Adds/Drops any two adjacent standard wavelengths defined in ITUT G.692 (DWDM). The signals are transparently transmitted and
the operating wavelength ranges from 1535.82 nm to 1560.61 nm.

OTM function

One MR2C board can work as a two-channel add/drop OTM


station, as shown in Figure 16-21. Two MR2C boards can be
cascaded to work as a four-channel add/drop OTM station, as
shown in Figure 16-22.

OADM function

Works as a two-channel add/drop OADM station when working


with the LWX. For details, see Figure 16-23.

Central wavelength

Supports the standard wavelengths defined in ITU-T


Recommendations. The channel spacing is 100 GHz.

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Figure 1.1 One MR2C board working as a two-channel add/drop OTM station
D1

IN

D2

MO

Drop

OUT

MI

Add
MR2C
A1

A2

Figure 1.2 Two MR2C boards being cascaded to work as a four-channel add/drop OTM station
D1

IN

D2

D1

MO IN

Drop

OUT

Drop

MI OUT

Add
MR2C

D2

MO

MI

Add

MR2C
A1

A2

A1

A2

Figure 1.3 MR2C and LWX working as a two-channel add/drop OADM station

LWX
A2

D2
MO

Out
MR2C

In
D1

MI
A1

LWX

16.6.4 Working Principle and Signal Flow


The MR2C consists of the OADM module.
Figure 16-24 shows the functional block diagram of the MR2C.

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Figure 1.1 Functional block diagram of the MR2C


D01

IN

D02

MO

MI

A01

Drop

A02

Add

OUT

OADM
module

The MR2C contains the OADM module that adds, drops, and multiplexes two channels of
signals. In addition, the MR2C provides the interface to cascade another optical add/drop
multiplexing board to increase the add/drop capability. The MR2C is a passive board and does
not have an interface with the backplane.

1.1.1.1.1469 OADM Module


The board receives one multiplexed optical signal that is sent by the upstream station on the
IN interface. Then, the drop optical module drops two wavelengths from the signal through
optical interfaces D01 and D02. The two dropped wavelengths are transmitted through the
MO optical interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds two wavelengths through optical
interfaces A01 and A02 and multiplexes them with the signal on the main optical path into
one signal. This multiplexed signal is transmitted through the OUT interface.

16.6.5 Front Panel


The front panel of the MR2C has interfaces and a laser safety class label.

1.1.1.1.1470 Diagram of the Front Panel


Figure 16-25 shows the appearance of the front panel of the MR2C.

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Figure 1.1 Front panel of the MR2C

MR2C

OUT AO1
AO2
MI
MO
DO2
DO1
IN
CLASS 1
LASER
PRODUCT

MR2C

1.1.1.1.1471 Interfaces
The front panel of the MR2C has four pairs of LC optical interfaces. Table 16-20 describes
the types and usage of the optical interfaces of the MR2C.
Figure 1.1 Optical interfaces of the MR2C
Interface

Type of
Interface

Usage

A01A02

LC

Adds two wavelengths of signals from the local


equipment.

D01D02

LC

Drops two wavelengths of signals to the local equipment.

IN

LC

Receives the multiplexed signals of two wavelengths.

OUT

LC

Transmits the multiplexed signals of two wavelengths.

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Interface

Type of
Interface

Usage

MO/MI

LC

Works as a cascading interface and cascades several


MR2C boards.

16.6.6 Valid Slots


The slots valid for the MR2C vary with the cross-connect capacity and subrack of the
equipment.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the MR2C are as follows:

When the cross-connect capacity is 200 Gbit/s, the MR2C can be installed in slots 1926
and 2936 in the subrack.

16.6.7 Technical Specifications


The technical specifications of the MR2C include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1472 Parameters Specified for Optical Interfaces


Table 16-21 lists the parameters specified for the optical interfaces of the MR2C.
Figure 1.1 Parameters specified for the optical interfaces of the MR2C
Parameter

Value

Operating wavelength
range (nm)

The operating wavelength range is from 1535.82 nm to


1560.61 nm. The working wavelengths can be any two
adjacent standard wavelengths defined in ITU-T G.692
(DWDM).

Line code pattern

NRZ

Channel spacing (GHz)

100

Insertion loss on the add


channel or drop channel
(dB)

<2

Adjacent channel isolation


(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

-0.5 dB channel bandwidth

< 0.11

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Value

(nm)

1.1.1.1.1473 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1474 Mechanical Specifications


The mechanical specifications of the MR2C are as follows:

Dimensions (mm): 22.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.1475 Power Consumption


The maximum power consumption of the MR2C at room temperature (25C) is 0 W.

16.7 MR4
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN11MR4 (4-channel optical add/drop multiplexing board).

16.7.1 Version Description


The MR4 is available in one functional version, namely, TN11.

16.7.2 Application
The MR4 is mainly used to add/drop and multiplex four channels of wavelength signals
to/from the multiplexed signals.
Figure 16-26 shows the application of the MR4 in the DWDM system.

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Figure 1.1 Application of the MR4 in the DWDM system

Optical transmission
network

MR4

Line
board

Line
board

MR4

Line
board

Line
board

Remarks: The line board in this figure supports DWDM wavelength signals.

16.7.3 Functions and Features


The MR4 is applied to the DWDM system. The channel spacing is 0.8 nm. The MR4 supports
the add/drop multiplexing function and channel expansion function.
Table 16-22 provides the functions and features of the MR4.
Figure 1.1 Functions and features of the MR4
Function and
Feature

MR4

Basic functions

Adds/Drops and multiplexes four continuous signals to/from the


multiplexed signals.

Channel expansion

Provides the interface to cascade another optical add/drop


multiplexing board to realize the expansion of the add/drop channel.

16.7.4 Working Principle and Signal Flow


The MR4 consists of the OADM module, communication and control module, and power
module.
Figure 16-27 shows the functional block diagram of the MR4.

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Figure 1.1 Functional block diagram of the MR4


D01 D02 D03 D04

MO

MI

A01 A02 A03 A04

Drop

IN

Add

OUT

OADM module

Communication and control module

Pow er module
DC/DC
converter
Delayed
startup
Fuse
SCC

Backplane

-48 V/-60 V

-48 V/-60 V

SCC

1.1.1.1.1476 OADM Module


The board receives one multiplexed optical signal that is sent by the upstream station on the
IN interface. Then, the drop optical module drops four wavelengths from the signal through
optical interfaces D01D04. The four dropped wavelengths are transmitted through the MO
optical interface.
The board receives one multiplexed signal that travels over the main optical path on the MI
optical interface. Then, the add optical module adds four wavelengths through optical
interfaces A01A04 and multiplexes them with the signal on the main optical path into one
signal. This multiplexed signal is transmitted through the OUT interface.

1.1.1.1.1477 Communication and Control Module

Controls the operations of the entire board.

Collects the following information of each functional module of the board: alarms,
performance events, working status, and voltage detection.

Communicates data with the SCC.

1.1.1.1.1478 DC/DC Converter


It converts 48 V DC or 60 V DC into a voltage required by each module of the board.

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16.7.5 Front Panel


The front panel of the MR4 has indicators, interfaces, and a laser safety class label.

1.1.1.1.1479 Diagram of the Front Panel


Figure 16-28 shows the appearance of the front panel of the MR4.
Figure 1.1 Front panel of the MR4
MR4
STAT

OUT
IN
MO
IN
D1
A1
D2
A2
D3
A3
D4
A4
LASER
RADIATION
DO NOT V IEW DIRECTL Y
WITH OP TICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

MR4

1.1.1.1.1480 Indicators
The front panel of the MR4 has one indicator as follows: board hardware status indicator
(STAT) two colors (red and green)
For the meanings of the status of the indicator, see 23 Indicators.

1.1.1.1.1481 Interfaces
The front panel of the MR4 has 12 optical interfaces. Table 16-23 describes the types and
usage of the optical interfaces of the MR4.

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Figure 1.1 Optical interfaces of the MR4


Interface

Type of
Interface

Usage

A1A4

LC

Receives the signals sent from the optical wavelength


converting board or centralized client-side equipment.

D1D4

LC

Transmits signals to the optical wavelength


converting board or centralized client-side equipment.

IN

LC

Receives the multiplexed signals.

OUT

LC

Transmits the multiplexed signals.

MO

LC

Works as a cascading output optical interface and is


connected to the input optical interface of an OADM
board.

MI

LC

Works as a cascading input optical interface and is


connected to the output optical interface of an OADM
board.

16.7.6 Valid Slots


The MR4 can be installed in slots 18 and 1117 in the subrack.

16.7.7 Feature Code


The feature code of the MR4 contains eight characters, which indicate the frequencies of the
first channel and fourth channel of optical signals processed by the MR4.
Table 16-24 describes the feature code of the MR4.
Figure 1.2 Feature code of the MR4
Feature Code

Indication

Description

First four (14) characters

Frequency of optical signals

The four characters are the


last four characters of the
figure that indicates the
frequency of the first
channel of optical signals
processed by the MR4.

Last four (58) characters

Frequency of optical signals

The four characters are the


last four characters of the
figure that indicates the
frequency of the fourth
channel of optical signals
processed by the MR4.

Consider the TN11MR4 whose feature code is "92109240" as an example. The meaning of
the feature code of the TN11MR4 is as follows:
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"9210" indicates that the frequency of the first channel of optical signals is 192.10 THz.

"9240" indicates that the frequency of the fourth channel of optical signals is 192.40
THz.

The four channels of optical signals processed by the MR4 are successive. Hence, we can
infer the following:

The frequency of the second channel of optical signals is 192.20 THz.

The frequency of the third channel of optical signals is 192.30 THz.

16.7.8 Technical Specifications


The technical specifications of the MR4 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1482 Parameters Specified for Optical Interfaces


Table 16-25 lists the parameters specified for the optical interfaces of the MR4.
Figure 1.1 Parameters specified for the optical interfaces of the MR4
Optical Interface

Parameter

Value

Operating wavelength range (nm)

1529 to 1561

Channel spacing (GHz)

100

IN-D1

0.5 dB passband bandwidth (nm)

0.11

IN-D2

Insertion loss on the drop channel (dB)

2.2

Adjacent channel isolation (dB)

> 25

Non-adjacent channel isolation (dB)

> 35

A1-OUT

0.5 dB passband bandwidth (nm)

0.11

A2-OUT

Insertion loss on the add channel (dB)

2.2

IN-MO

Insertion loss (dB)

1.5

MI-OUT

Isolation (dB)

> 13

Return loss (dB)

> 40

IN-D3
IN-D4

A3-OUT
A4-OUT

1.1.1.1.1483 Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power
of the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

1.1.1.1.1484 Mechanical Specifications


The mechanical specifications of the MR4 are as follows:
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Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.9

1.1.1.1.1485 Power Consumption


The power consumption of the MR4 at room temperature (25C) is 0 W.

16.8 LWX
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the LWX (arbitrary bit rate wavelength conversion board).

16.8.1 Version Description


The LWX is available in one functional version, namely, N1. The N1LWX is discontinued.

16.8.2 Application
The LWX is a wavelength conversion board. The LWX converts a wavelength at an arbitrary
rate (10 Mbit/s to 2.7 Gbit/s) into a standard wavelength defined in ITU-T G.692, and
performs the reverse process.
Figure 16-29 shows the application of the LWX in the DWDM system.
Figure 1.1 Application of the LWX in the DWDM system

Multiplexing

LWX

10 Mbit/s-2.7 Gbit/s

Client side

Demultiplexing

G.692

WDM side

G.692
LWX

WDM side

Client s ide

16.8.3 Functions and Features


The LWX converts a wavelength at an arbitrary rate (10 Mbit/s to 2.7 Gbit/s, NRZ code) on
the client side into a standard wavelength defined in ITU-T G.692, and performs the reverse
process.
The LWX supports the optical wavelength conversion, 3R function, protection, and loopback
function.
Table 16-26 provides the functions and features of the LWX.

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Figure 1.1 Functions and features of the LWX


Function
and Feature

LWX

Basic
functions

Converts a wavelength on the client side into a standard wavelength


defined in ITU-T G.692 (DWDM), and performs the reverse process.
Transparently transmits signals.

3R function

Provides the 3R function for the signals at a rate ranging from 10 Mbit/s to
2.7 Gbit/s on the client side, restores the clock, and monitors the rate.

Protection
schemes

Single fed and single


receiving

Supports the inter-board protection and 1+1 interboard hot standby protection. The protection
switching time is less than 50 ms.

Dual fed and


selective receiving

Supports the intra-board protection. One board can


realize the optical channel protection. The
protection switching time is less than 50 ms.

ALS function

Supports the ALS function. When the LWX does not receive light, the
LWX automatically turns off the corresponding optical transmit module.

Loopback
function

Supports inloops and outloops at optical interfaces so that faults can be


located quickly.

Performance
and alarm
monitoring

Reports various alarms and performance events, which facilitates the


maintenance of the equipment.

Central
wavelength

Supports the standard wavelengths defined in ITU-T Recommendations.


The channel spacing is 100 GHz.

16.8.4 Working Principle and Signal Flow


The LWX consists of the O/E converting module, cross-connect module, CDR module, logic
and control module, DC/DC converter, and other modules.
Figure 16-30 shows the functional block diagram of the LWX.

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Figure 1.1 Functional block diagram of the LWX


Loopback control

Reference clock

10 Mbit/s to 2.7
Gbit/s
Optical module on
the client side
10 Mbit/s to 2.7
Gbit/s

O/E

E/O

2x2 crossconnection

WDM side
loopback

Data
LOS
Laser
Communication
shutdown
and control
module
LOS

10 Mbit/s to 2.7
Gbit/s
Optical module 2
on the WDM side

Multi-rate
CDR

Client side
loopback
O/E
2x2 crossconnection

Multi-rate
CDR

Loopback control
10 Mbit/s to 2.7
Gbit/s
Optical module 1
on the WDM side

O/E
Clock

10 Mbit/s to 2.7
Gbit/s
Optical
splitter

Reference
clock

E/O

Data

LOS

Communication
and control
module
Communication

Laser shutdown

+3.3
V
DC/DC
converter

DC/DC
converter

Fuse

SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

1.1.1.1.1486 O/E Converting Module

The optical module on the client side applies SFP encapsulation and can be configured as
different types of optical modules. This module can transmit/receive the optical signals at
a rate ranging from 10 Mbit/s to 2.7 Gbit/s.

The optical module on the WDM side can be configured as an optical transceiver
module, or both an optical transceiver module and an optical receiver module. When two
modules are configured on the WDM side, an optical splitter is used to perform dual
feeding.

In the receive direction, the module converts the received optical signals into electrical

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signals.

In the transmit direction, the module converts the electrical signals into SDH optical
signals and sends the SDH optical signals to fibers for transmission.

Detects the R_LOS alarm and provides the function of shutting down the laser.

1.1.1.1.1487 Cross-Connect Module

Supports the data selection from the client side to the WDM side and the data selection
from the WDM side to the client side.

Supports the selection of WDM-side optical modules.

Supports the loopback of client-side signals.

Supports the loopback of WDM-side signals.

1.1.1.1.1488 CDR Module

Restores the data and clock signals from the signals that are at a rate ranging from 10
Mbit/s to 2.7 Gbit/s.

Reads the rates of the accessed services.

1.1.1.1.1489 Logic and Control Module

Supports Ethernet communication.

Supports the reference clock of the CDR module.

Selects and configures the services of the other modules.

Controls the laser.

Selects the clock signal from the active and standby cross-connect boards.

Controls the indicators on the board.

1.1.1.1.1490 DC/DC Converter


It converts the 48/60 V power supply into the DC voltages that the modules of the board
require.

16.8.5 Front Panel


The front panel of the LWX has indicators, interfaces, and a laser safety class label.

1.1.1.1.1491 Diagram of the Front Panel


Figure 16-31 shows the appearance of the front panel of the LWX.

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Figure 1.1 Front panel of the LWX

LWX
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

TX
RX
OUT1 IN1
OUT2 IN2

LWX

1.1.1.1.1492 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1493 Interfaces
The front panel of the LWX has six optical interfaces. Table 16-27 describes the types and
usage of the optical interfaces of the LWX.

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Figure 1.1 Optical interfaces of the LWX


Interface

Type of
Interface

Usage

IN1IN2

LC

Receives the signals sent from the MR2A.

OUT1OUT2

LC

Transmits signals to the MR2A.

TX

LC

Transmits signals to the client-side equipment.

RX

LC

Receives the signals sent from the client-side


equipment.

16.8.6 Valid Slots


The slots valid for the LWX vary with the cross-connect capacity and subrack of the
equipment.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the LWX are as follows:

When the cross-connect capacity is 200 Gbit/s, the LWX can be installed in slots 18 and
1117 in the subrack.

16.8.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the LWX indicates the scheme that the optical interfaces use to receive
and transmit signals.
Table 16-28 provides the relationship between the feature code of the LWX and the signal
receive/transmit scheme.
Figure 1.2 Relationship between the feature code of the LWX and the signal receive/transmit
scheme
Board

Feature Code

Signal Receive/Transmit Scheme

SSN1LWX01

01

Single fed and single receiving

SSN1LWX02

02

Dual fed and selective receiving

16.8.8 Parameter Settings


You can set the parameters for the LWX by using the U2000.
You can set the following parameters for the LWX by using the U2000:

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Path use status

Optical interface loopback

Service type

Client service bearer rate (M)

Laser status

Automatic laser shutdown

Current bearer rate (M)

Actual wavelength No./wavelength (nm)/frequency (THz)

Actual band type

Configure wavelength No./wavelength (nm)/frequency (THz)

Configure band type

SD trigger condition

16.8.9 Technical Specifications


The technical specifications of the LWX include the parameters specified for optical
interfaces, the safety class of the laser, mechanical specifications and power consumption.

1.1.1.1.1494 Parameters Specified for Optical Interfaces


Table 16-29 and Table 16-30 list the parameters specified for the client-side and WDM-side
optical interfaces of the LWX.
Figure 1.1 Parameters specified for the client-side optical interfaces of the LWX
Parameter

Value

Nominal bit rate

10 Mbit/s to 2.7 Gbit/s

Line code pattern

NRZ

Type of fiber

Single-mode LC

Single-mode LC

Single-mode LC

Transmission
distance (km)

15

40

80

Characteristics of the transmitter at point S


Operating
wavelength range
(nm)

1260 to 1360

1260 to 1360

1500 to 1580

Maximum mean
launched power
(dBm)

+3

+3

Minimum mean
launched power
(dBm)

-5

-2

-2

Minimum extinction
ratio (dB)

+8.2

+8.2

+8.2

Minimum side mode

30

30

30

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Parameter

16 WDM Boards

Value

suppression ratio
(dB)
Eye pattern mask

Complies with the


mask defined in
ITU-T G.957.

Complies with the


mask defined in
ITU-T G.957.

Complies with the


mask defined in
ITU-T G.957.

Characteristics of the receiver at point S


Receiver type

PIN

APD

APD

Receiver wavelength
range (nm)

1200 to 1600

1200 to 1600

1200 to 1600

Receiver sensitivity
(dBm)

-18

-27

-28

Minimum overload
(dBm)

-9

-9

Maximum
reflectance (dB)

-27

-27

-27

Figure 1.2 Parameters specified for the WDM-side optical interfaces of the LWX
Parameter

Value

Channel
spacing (GHz)

100

Line code
pattern

NRZ

Characteristics of the transmitter at point Sn


Transmission
distance (km)

640

170 (2 mW)

170 (10 mW)

360

Maximum
mean launched
power (dBm)

+3

+3

+7

+3

Minimum mean
launched power
(dBm)

-2

-2

-2

Minimum
extinction ratio
(dB)

+10

+10

+10

+10

Nominal central
frequency
(THz)

192.10 to
196.00

192.10 to
196.00

192.10 to
196.00

192.10 to
196.00

Central

12.5

12.5

12.5

12.5

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Parameter

16 WDM Boards

Value

frequency
deviation (GHz)
Maximum -20
dB spectral
width (nm)

0.2

0.4

0.4

0.4

Minimum side
mode
suppression
ratio (dB)

35

35

35

35

Dispersion
compensation
(ps/nm)

12800

3400

3400

7200

Eye pattern
mask

Complies with
the mask
defined in ITUT G.957.

Complies with
the mask
defined in ITUT G.957.

Complies with
the mask
defined in ITUT G.957.

Complies with
the mask
defined in ITUT G.957.

Characteristics of the receiver at point Rn


Receiver type

APD

PIN

Receiver
wavelength
range (nm)

1200 to 1600

1200 to 1600

Receiver
sensitivity
(dBm)

-28

-18

Minimum
overload (dBm)

-9

Maximum
reflectance (dB)

-27

-27

1.1.1.1.1495 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1496 Mechanical Specifications


The mechanical specifications of the LWX are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.1

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1.1.1.1.1497 Power Consumption


The maximum power consumption of the LWX at room temperature (25C) is 30 W.

16.9 FIB
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the FIB (filter isolating board).

16.9.1 Version Description


The FIB is available in one functional version, namely, N1.

16.9.2 Application
The FIB is used in the remote optical pumping amplifier system. The FIB can realize longdistance optical regeneration transmission when it works with the single-wavelength longdistance board ROP.
Figure 16-32 shows the position of the FIB in an optical transmission system.
Figure 1.1 Position of the FIB in an optical transmission system
C (single span)

Optical
transmitter

BA17

G.652 fiber

FIB

b (18 dB)

a (54 dB)

Erbium
ROP
doped fiber G.652 fiber

->

ISO

Filter
1550.12

Optical
receiver

16.9.3 Functions and Features


The FIB filters and isolates one optical signals.
Table 16-31 provides the functions and features of the FIB.
Figure 1.1 Functions and features of the FIB
Function and
Feature

FIB

Optical isolator

The isolator allows optical signals to pass in a single direction. The


operating wavelength ranges from 1529 nm to 1561 nm.

Optical filter

The filter filters out the wavelengths other than the 1550.12 nm
wavelength.

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16.9.4 Working Principle and Signal Flow


The FIB consists of an isolator and a filter.
Figure 16-33 shows the functional block diagram of the FIB.
Figure 1.1 Functional block diagram of the FIB
Isolator

Filter

Optical signals are heavily attenuated and degraded after they travel for a long distance in
fibers. The degraded signals cannot be normally received by an optical receiver. Hence, an
ROP needs to be used to amplify the gain of the optical signals. To prevent other factors from
affecting the ROP because the ROP has high optical power, the FIB needs to be used to filter
wavelengths.
The isolator of the FIB allows the optical signals to pass in a single direction. The filter of the
FIB filters out the wavelengths other than the 1550.12 nm wavelength. As a result, the optical
receiver receives the optical signals normally.

16.9.5 Front Panel


The front panel of the FIB has one channel of optical interface.

1.1.1.1.1498 Diagram of the Front Panel


Figure 16-34 shows the appearance of the front panel of the FIB.

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Figure 1.1 Front panel of the FIB

FIB

CLASS 1
LASER
PRODUCT

OUT
IN

FIB

1.1.1.1.1499 Interfaces
The front panel of the FIB has one optical interface. The optical interface is used to receive
and transmit one channel of optical signals. Table 16-32 describes the types and usage of the
optical interfaces of the FIB.
Figure 1.1 Optical interfaces of the FIB
Interface

Type of
Interface

Usage

IN

LSH

Receives one channel of optical signals.

OUT

LC

Transmits one channel of optical signals.

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16.9.6 Valid Slots


The slots valid for the FIB vary with the cross-connect capacity and subrack of the equipment.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the FIB are as follows:

When the cross-connect capacity is 200 Gbit/s, the FIB can be installed in slots 18 and
1117 in the main subrack.

16.9.7 Technical Specifications


The technical specifications of the FIB include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.

1.1.1.1.1500 Parameters Specified for Optical Interfaces


Table 16-33 lists the parameters specified for the optical interfaces of the FIB.
Figure 1.1 Parameters specified for the optical interfaces of the FIB
Parameter

Value

Nominal bit rate

2488320 kbit/s

Line code pattern

NRZ

Central wavelength
(nm)

1550.120.05

-0.5 dB bandwidth
(nm)

> 0.4

1.1.1.1.1501 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1502 Mechanical Specifications


The mechanical specifications of the FIB are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.1503 Power Consumption


The maximum power consumption of the FIB at room temperature (25C) is 0 W.
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17 Auxiliary Boards

17

Auxiliary Boards

About This Chapter


This topic describes the auxiliary boards including the AUX and FAN.
17.1 AUX
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the AUX (system auxiliary interface board).
17.2 FAN
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the FAN (fan board).

17.1 AUX
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the AUX (system auxiliary interface board).

17.1.1 Version Description


The AUX is available in one functional version, namely, N1.

17.1.2 Application
The AUX is a system auxiliary interface board. The AUX can be used on the OptiX OSN
equipment series to provide various management interfaces and auxiliary interfaces.

17.1.3 Functions and Features


The AUX provides various management and auxiliary interfaces for the system, and provides
the centralized backup for the +3.3 V power supply of the boards in the subrack.
Table 17-1 provides the functions and features of the AUX.

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Figure 1.1 Functions and features of the AUX


Item

AUX

Management
interface

Provides the OAM interface, which supports the X.25 protocol.

Provides the management serial interface F&f.

Provides the 10M/100M NM interface.

Provides the serial interfaces Serial 1Serial 4, which can


function as four broadcast data interfaces or two pairs of time
interfaces. The two functions of the interfaces are mutually
exclusive.

The two pairs of time interfaces work in full-duplex mode and


support synchronous time input and output of two channels.

Both the time interface and the broadcast data interface support
the RS-422 level and RS-232 level.

Provides one F1 interface for the 64 kbit/s codirectional data


channel.

Supports the input and output of two channels of time signals,


with the external time transmitted in 1pps+TOD mode.

For details about the external time input and output interfaces,
see Table 17-2 and Table 17-3.

Provides two BITS clock input interfaces and two BITS clock
output interfaces (impedance: 120 ohms).

Provides two BITS clock input interfaces and two BITS clock
output interfaces (impedance: 75 ohms).

Provides 16-input and 4-output alarm interfaces.

Provides 4-output alarm cascading interfaces.

Cabinet alarm
indicator

Provides four cabinet alarm indicator output interfaces.

Provides four cabinet alarm indicator input cascading


interfaces.

Orderwire interface

Provides two NNI connection signaling interfaces.

Provides one orderwire phone interface.

Provides two NNI voice interfaces.

Auxiliary interface

External time
interface

Clock interface

Alarm interface

Commissioning
interface

Provides one commissioning interface COM.

Internal
communication

Realizes communication between boards in the subrack.

Power supply backup


and checking

Monitors the two independent 48 V power supplies, detects


the overvoltage (72 V) and undervoltage (38.4 V) conditions,
and reports alarms to the SCC unit in the case of overvoltage or
undervoltage occurs.

Provides the centralized backup for the +3.3 V power supply of


the boards in the subrack, which realizes the 1:N protection for
the secondary power supply of each board.

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Item

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AUX

Detects the overvoltage (+3.8 V) and undervoltage (+3.1 V)


conditions for the +3.3 V backup power supply.

Audible alarm

Supports the audible alarm and the clearing of the audible alarm.

Ethernet port
connection status
checking

Supports the checking of the Ethernet port connection status.

Note: The COM interface is used for internal commissioning only. That is, the COM
interface cannot be used for equipment monitoring. Otherwise, the Ethernet communication
between boards may become abnormal.

Figure 1.2 External time input interfaces


External Time Input

TOD-Related Interfacea

1pps-Related Interface

Channel 1

S1

S3 (using the RS422 level)

S1

ALMI4 (using the TTL


level)

S2

S4 (using the RS422 level)

S2

ALMI4 (using the TTL


level)

Channel 2

a: The TOD-related interfaces can use the RS232 level or RS422 level as required.

Figure 1.3 External time input interfaces


External Time Output

TOD-Related Interfacea

1pps-Related Interface

Channel 1

S1

S3 (using the RS422 level)

Channel 2

S2

S4 (using the RS422 level)

a: The TOD-related interfaces can use the RS232 level or RS422 level as required.

17.1.4 Working Principle and Signal Flow


The AUX consists of the communication module, interface module, and power module.
Figure 17-1 shows the functional block diagram of the AUX.

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17 Auxiliary Boards

Figure 1.1 Functional block diagram of the AUX


Backplane

F&f
OAM
One orderwire phone
interface
Two NNI voice interfaces
S1~S4
F1
16-input and 4-output alarm
interfaces
2-input and 2-output clock
interfaces

SCC A

SCC B

Interface
module

Cross-connect
unit

Four channels of subrack


indicator interface
Alarm cascading interface
ETH interface
(VLAN A)
COM interface
(VLAN B)

100/10 Mbit/s

EXT interface
(VLAN B)

100/10 Mbit/s

100/10 Mbit/s

19x100/10 Mbit/s
Ethernet bus
Communication
module

100/10 Mbit/s
100/10 Mbit/s

Power supply
module

Other units (VLAN B)


SCC A (VLAN A)
SCC B (VLAN A)

-48 V/-60 V
+3.3 V backup
power supply

1.1.1.1.1504 Communication Module


This module provides the network management interface for the active and standby GSCC
boards, OAM interface for remote maintenance, and interface for communication between
boards.

1.1.1.1.1505 Interface Module


This module provides various auxiliary interfaces, including the F&f interface, OAM
interface, F1 interface, and clock input\output interface.

1.1.1.1.1506 Power Module


This module provides the working power supply for the board and centralized +3.3 V backup
power supply for the other boards.

17.1.5 Jumpers
The jumper J9 is available in the lower right corner of the side panel of the AUX. The jumper
J9 is used to specify the subrack that works as the main subrack or extended subrack.
Figure 17-2 and Figure 17-3 show the position of the jumper J9 on the AUX.

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Figure 1.1 Position of the jumper J9 on the AUX(version B)

Power
Module
J9

Figure 1.2 Position of the jumper J9 on the AUX(version C)

The AUX is available in two versions: version B and version C. For the AUX of version C, jumper J9 is
under the daughter board. You can find it only after the daughter board is removed.

Set the jumper J9 as follows:

To enable the subrack to work as the main subrack, cap the jumper J9.

To enable the subrack to work as the extended subrack, do not cap the jumper J9.

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17.1.6 Front Panel


The front panel of the AUX has indicators and interfaces of various types.

1.1.1.1.1507 Diagram of the Front Panel


Figure 17-4 shows the appearance of the front panel of the AUX.
Figure 1.1 Front panel of the AUX

AUX
STAT

CLKI2

CLKO2

CLKI1

CLKO1

CLK2

CLK1

ETH

REV

COM

F&f

EXT

F1

LAMP1

PHONE

LAMP2 ALMO1 ALMO2

V1
V2
OAM

ALMI1

S1

ALMI2

S2

ALMI3

S3

ALMI4

S4

AUX

1.1.1.1.1508 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Connection status indicator (LINK) one color (green)

Data receiving and transmission indicator (ACT) one color (orange)

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For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1509 Interfaces
The front panel of the AUX has 28 interfaces. Table 17-4 describes the types and usage of the
interfaces of the AUX.
Figure 1.1 Interfaces of the AUX
Interface

Type of
Interface

Usage

CLKO1

SMB

75-ohm clock output interface 1

CLKO2

SMB

75-ohm clock output interface 2

CLK1

RJ-45

120-ohm clock input/output interface 1

REV

RJ-45

Reserved

F&f

RJ-45

F&f interface

F1

RJ-45

F1 interface

PHONE

RJ-45

Orderwire phone interface

V1

RJ-45

NNI voice interface 1

V2

RJ-45

NNI voice interface 2

OAM

RJ-45

OAM interface

S1

RJ-45

Serial 1

S2

RJ-45

Serial 2

S3

RJ-45

Serial 3

S4

RJ-45

Serial 4

CLKI1

SMB

75-ohm clock input interface 1

CLKI2

SMB

75-ohm clock input interface 2

CLK2

RJ-45

120-ohm clock input/output interface 2

ETH

RJ-45

NM interface

COM

RJ-45

Commissioning interface

EXT

RJ-45

Interface for connection to the extended subrack

LAMP1

RJ-45

Cabinet alarm indicator output interface

LAMP2

RJ-45

Cabinet alarm indicator cascading input interface

ALMO1

RJ-45

Interface for the 1st to the 4th channels of alarm


outputs

ALMO2

RJ-45

Alarm signal cascading interface

ALMI1

RJ-45

Interface for the 1st to the 4th channels of alarm

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Interface

17 Auxiliary Boards

Type of
Interface

Usage
inputs

ALMI2

RJ-45

Interface for the 5th to the 8th channels of alarm


inputs

ALMI3

RJ-45

Interface for the 9th to the 12th channels of alarm


inputs

ALMI4

RJ-45

Interface for the 13th to the 16th channels of


alarm inputs

Note: S1/S3 and S2/S4 form a pair of time input and output interfaces.

Table 17-5 describes the pins of the CLK1 and CLK2 interfaces.
Figure 1.2 Pins of the CLK1 and CLK2 interfaces
Front View

Pin

Usage

Receiving ()

Receiving (+)

Grounding

Transmitting ()

Transmitting (+)

Grounding

7, 8

Unspecified

Table 17-6 describes the pins of the ETH, COM, EXT, and F1 interfaces.
Figure 1.3 Pins of the ETH, COM, EXT, and F1 interfaces
Front View

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Pin

Usage

Transmitting (+)

Transmitting ()

Receiving (+)

Unspecified

Unspecified

Receiving ()

7, 8

Unspecified

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Table 17-7 describes the pins of the F&f interface.


Figure 1.4 Pins of the F&f interface
Front View

Pin

Usage

Receive end for RS-232 data

Grounding

Transmit end for RS-232 data

1, 2, 3, 6, 7

Unspecified

Table 17-8 describes the pins of the PHONE, V1, and V2 interfaces.
Figure 1.5 Pins of the PHONE, V1, and V2 interfaces
Front View

Pin

Usage

Signal 1

Signal 2

1, 2, 3, 6, 7, 8

Unspecified

Table 17-9 describes the pins of the LAMP1 and LAMP2 interfaces.
Figure 1.6 Pins of the LAMP1 and LAMP2 interfaces
Front View

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Pin

Usage

Critical alarm signal (+)

Critical alarm signal ()

Major alarm signal (+)

Power indicator driving signal


(+)

Power indicator driving signal


()

Major alarm signal ()

Minor alarm signal (+)

Minor alarm signal ()

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Table 17-10 describes the pins of the ALM01 and ALM02 interfaces.
Figure 1.7 Pins of the ALM01 and ALM02 interfaces
Front View

Pin

Usage

Critical and major alarm signal output


(+)

Critical and major alarm signal output


()

Minor and warning alarm signal


output (+)

Alarm signal output 1 (+)

Alarm signal output 1 ()

Minor and warning alarm signal


output ()

Alarm signal output 1 (+)

Alarm signal output 1 ()

Table 17-11 describes the pins of the OAM interface.


Figure 1.8 Pins of the OAM interface
Front View

Pin

Usage

Requests for transmission.

Transmits the DTE ready signal.

Transmits data.

Grounding

Grounding

Receives data.

Transmits the DCE ready signal.

Ready for receiving signals.

Table 17-12 describes the pins of the S1, S2, S3, and S4 interfaces.

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Figure 1.9 Pins of the S1, S2, S3, and S4 interfaces of the AUX
Front View

Pin

Usage

RS-422 data transmitting (+)

RS-422 data transmitting ()

RS-422 data receiving (+)

Receive end for RS-232 data

Grounding

RS-422 data receiving ()

Unspecified

Transmit end for RS-232 data

Table 17-13 describes the pins of the ALMI1 interface.


Figure 1.10 Pins of the ALMI1 interface
Front View

Pin

Usage

Alarm input 1

Ground for alarm input 1

Alarm input 2

Alarm input 3

Ground for alarm input 3

Ground for alarm input 2

Alarm input 4

Ground for alarm input 4

Table 17-14 lists the pins of the ALMI2 interface.


Figure 1.11 Pins of the ALMI2 interface
Front View

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Pin

Usage

Alarm input 5

Ground for alarm input 5

Alarm input 6

Alarm input 7

Ground for alarm input 7

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Front View

17 Auxiliary Boards

Pin

Usage

Ground for alarm input 6

Alarm input 8

Ground for alarm input 8

Table 17-15 describes the pins of the ALMI3 interface.


Figure 1.12 Pins of the ALMI3 interface
Front View

Pin

Usage

Alarm input 9

Ground for alarm input 9

Alarm input 10

Alarm input 11

Ground for alarm input 11

Ground for alarm input 10

Alarm input 12

Ground for alarm input 12

Table 17-16 describes the pins of the ALMI4 interface.


Figure 1.13 Pins of the ALMI4 interface
Front View

Pin

Usage

Alarm input 13

Ground for alarm input 13

Alarm input 14

Alarm input 15

Ground for alarm input 15

Ground for alarm input 14

Alarm input 16

Ground for alarm input 16

1.1.1.1.1510 Connections for Alarm Cascading

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Connections for alarm signal cascading


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Figure 17-5 shows the connections when one or multiple cabinets input or output alarm
signals. Connect the alarm output interface to the alarm cascading interface of a lower level.
Make the connections one by one until the alarm output is connected to the centralized alarm
system.
Figure 1.2 Connections for alarm input, alarm cascading, and alarm output
Cabinet1

Cabinet2

Subrack1

Centralized
alarm system

Subrack3

ALMO1

ALMO1

ALMO2

ALMO2

ALMI1

ALMI1

Subrack2

Subrack4

ALMO1

ALMO1

ALMO2

ALMO2

ALMI1

ALMI1

Connections of cabinet alarm indicators

Figure 17-6 shows the connections of the 4-channel cabinet alarm indicators. Connect
LAMP1 of subrack 2 to LAMP2 of subrack 1. Finally, connect LAMP1 of subrack 1 to the
indicator interface at the top of the cabinet.
Figure 1.3 Connections of cabinet alarm indicators
4 cabinet
alarm indicators

Cabinet indicator
subrack 1

LAMP1
LAMP2

subrack 2
LAMP1
LAMP2

17.1.7 Valid Slots


The AUX can be installed in slot 37 in the subrack.
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17.1.8 Technical Specifications


The technical specifications of the AUX include the mechanical specifications and power
consumption.

1.1.1.1.1511 Mechanical Specifications


The mechanical specifications of the AUX are as follows:

Dimensions (mm): 44.0 (W) x 125.2 (D) x 261.4 (H)

Weight: 1.0 kg

1.1.1.1.1512 Power Consumption


At room temperature (25C), the maximum power consumption of the AUX is 19 W.

17.2 FAN
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the FAN (fan board).

17.2.1 Version Description


The FAN is available in one functional version, namely, N1.
The logical board of fan tray assembly XE1FAN is displayed as N1FAN on the . The
XE1FAN is of the two-layer structure. The one-layer fan is no longer manufactured.

17.2.2 Application
The FAN is a system fan board. The FAN can be used on the OptiX OSN equipment series to
provide the heat dissipation function.

17.2.3 Functions and Features


The FAN adjusts the fan speed, checks the fan status, reports the fault of the fan control
board, and reports the off-position alarm of the fan.
Table 17-17 provides the functions and features of the FAN.
Figure 1.1 Functions and features of the FAN
Function and
Feature

FAN

Function of
intelligent speed
adjustment

Provides the following functions of intelligent speed adjustment:

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Automatically adjusts the fan speed.

When the temperature difference in the


local area is more than 43C, the fans
operate at low speed.

When the temperature difference in the


local area is less than 43C, the fans

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Feature

17 Auxiliary Boards

FAN
operate at medium speed.

When the temperature difference in the


local area is less than 33C, the fans
operate at high speed.

Ensures that the fan operates at full speed when the speed
adjustment signal is abnormal.

In normal situations, all the fan tray assemblies operate normally.


When one fan tray assembly reports an alarm, the other fan tray
assemblies adjust the fan speed to operate at full speed.

Hot swapping
function

Provides the hot swapping function for the fan tray assembly.

Backup function

Provides the mutual backup function for the power supplies of the
fans in the fan tray assemblies.

Status checking

Supports the checking of the fan status.

Alarm function

Reports the fan alarm and in-service information.

Fan backup

The two fans in the fan tray assembly function as a backup for each
other. The two fans operate at the same time. When one fan is faulty,
the other fan adjusts the speed to operate at full speed.

When one fan of the three fan tray assemblies fails, the system can work normally for 96 hours at the
ambient temperature ranging from 0C to 45C.

The fan tray assembly must be replaced when one of the following situations occurs.

One or more fans in each fan tray assembly of the three fan tray assemblies are faulty.

Two fans in a fan tray assembly are faulty.

When a fan tray assembly works normally, the upper fan and lower fan in the fan tray assembly
operate at the same speed.

17.2.4 Working Principle and Signal Flow


The FAN consists of the fan control unit and fan power supply unit.
Figure 17-7 shows the functional block diagram of the XE1FAN.

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Figure 1.1 Functional block diagram of the XE1FAN


Status signal
Speed adjusting signal
Status signal

Fan control
unit
Fan

Alarm signal
Power
Fan power
supply
unit

External power supply 1


External power supply 2

1.1.1.1.1513 Fan Power Supply Unit


This unit provides the driving voltage for the fan to operate.

1.1.1.1.1514 Fan Control Unit


The fan control unit controls the operation speed of the fan through the speed adjusting signal.
The fan control unit also detects its faults, faults in the fans, and faults in the fan power supply
unit. When detecting any fault, the fan control unit reports alarm information and the SCC
then issues commands to enable other fans to operate at full speed. The fan control unit also
receives commands from the SCC when the temperature is very low, and stops the fans. The
fan control unit detects the fault in the fan power supply unit, speed adjusting signal, fan state,
and in-position state of the FAN.

17.2.5 Front Panel


The front panel of the FAN has indicators.

1.1.1.1.1515 Diagram of the Front Panel


The OptiX OSN equipment series use a modular fan platform.
One subrack uses three fan tray assemblies, as shown in Figure 17-8.

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Figure 1.1 Modular fan tray assembly

1.1.1.1.1516 Indicators
The indicator (STATE) on the front panel of the board indicates the running state of the
hardware. This indicator is red, green, or yellow when it is on.
For the meanings of the status of the indicator, see 23 Indicators.

17.2.6 Valid Slots


The FAN can be installed in slots 3840 in the subrack.

17.2.7 Technical Specifications


The technical specifications of the FAN include the mechanical specifications, power
consumption, and working voltages.

1.1.1.1.1517 Mechanical Specifications


The mechanical specifications of the FAN are as follows:

Dimensions (mm): 63.8 (W) x 144.0 (D) x 249.6 (H)

Weight of the XE1FAN: 1.5 kg

1.1.1.1.1518 Power Consumption


At room temperature (25C), the maximum power consumption of each fan assembly of the
XE1FAN is 16 W when the input voltage is -48 V.

1.1.1.1.1519 Working Voltages


The working voltages of the FAN can be -48 V20% DC or -60 V20% DC.

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18

18 Optical Amplifier Boards and Dispersion


Compensation Boards

Optical Amplifier Boards and Dispersion


Compensation Boards

About This Chapter


This topic describes the optical amplifier boards such as the and the dispersion compensation
boards.
18.1 BA2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the BA2 (optical booster amplifier board).
18.2 BPA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the BPA (optical booster and pre-amplifier board).
18.3 COA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the COA (case-shaped optical amplifier).
18.4 RPC01
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the RPC01 (forward Raman driving board).
18.5 RPC02
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the RPC02 (backward Raman driving board).
18.6 OBU1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the OBU1 (optical booster amplifier board).
18.7 OBU2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN12OBU2 (optical booster amplifier board).
18.8 DCU
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18 Optical Amplifier Boards and Dispersion


Compensation Boards

This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DCU (dispersion compensation board).

18.1 BA2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the BA2 (optical booster amplifier board).

18.1.1 Version Description


The BA2 is available in one functional version, namely, N1.

18.1.2 Application
The BA2 is a two-channel optical power amplifier board. The BA2 amplifies the power of
optical signals and is applicable to the long-distance optical fiber transmission.
Figure 18-1 shows the position of the BA in an optical transmission system.
Figure 1.1 Position of the BA in an optical transmission system

Tx

BA

Rx

18.1.3 Functions and Features


During the long-haul transmission of optical signals, the attenuation of the signals is high.
Hence, the BA is required to ensure that the optical receiver can receive normal optical
signals.
The BA2 amplifies the power of two-channel optical signals. Table 18-1 provides the
functions and features of the BA2.
Figure 1.1 Functions and features of the BA2
Function and
Feature

BA2

Basic functions

Increases the launched optical power of the line board to 1315


dBm or 1518 dBm. As a result, when the G.652 optical fiber with a
loss of 0.275 dB/km is used, the transmission distance can be 120
km, 130 km, or above.

Supporting the
EDFA

Supports the automatic control of the laser temperature and optical


power of the EDFA module.
Supports the automatic monitoring of the input and output optical
power of the EDFA module and query of the optical power of the
EDFA module.
Supports the protection function of the EDFA module. When no
optical signals are received, the laser is automatically turned off.

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Function and
Feature

18 Optical Amplifier Boards and Dispersion


Compensation Boards

BA2
When optical signals are received, the laser is automatically turned
on.

Performance events
and alarms
monitoring

Supports the reporting of the performance parameters of the laser.


Reports various alarms and performance events, which facilitates
the management and maintenance of the equipment.

Software upgrade

Supports the software upgrade and expansion without interrupting


services.

The wavelength of the optical signal transmitted to the BA2 must be within the range from
1530 nm to 1565 nm. Otherwise, the input optical signal cannot be amplified correctly.
Hence, make sure that the output wavelength of the line board that is interconnected with the
BA2 is within the required range.
The BA2 provides the intelligent power adjustment (IPA) function. When the IPA function is enabled
and no input signals are detected on the receive side of a line board, the pumping laser is turned off to
prevent high laser power from damaging the eyes.

18.1.4 Working Principle and Signal Flow


The BA2 consists of the EDFA module, control module, communication module, and DC/DC
converter module.
Figure 18-2 shows the functional block diagram of the BA2.

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Compensation Boards

Figure 1.1 Functional block diagram of the BA2


Optical
input

Fiber
distributor

EDFA module
Doped
erbium
fiber
WDM
Input
Output
isolate
isolate
coupler

Input
power
monitor
(Pin1)
Input
power

Optical
splitter

Filter

Optical
output

Output
power
monitor
(Pin2)

Laser pump

Pump Pump Temperat


current
ure
current detect
Laser
shutdown
Manual
LOS in
control
AD/DA

Output
power
Pump
temperature
control

Control&Generation alarms
Control module

Communication
module
+3.3 V
DC/DC
converter
module

DC/DC
converter
module

Communication
SCC unit

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V
backup
power

1.1.1.1.1520 EDFA Module


The optical amplifier unit consists of two EDFA modules. One module is the BA and the other
module is the PA. When the board is used as a PA, an optical filter with 1550.12 nm as the
central wavelength is added to the optical output end of the module. A BA does not have the
filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the erbium
fiber inside the EDFA module. Bump light and input signal light are coupled into the erbium
fiber through an optical coupler. The input and output optical signals of the module are led out
by two fiber splitters according to a specific coupling ratio. Then, the optical signals are
converted into optical current by two PIN photoelectrical diodes. The input and output power
of the EDFA module is determined according to the optical signals. The module also applies
optical isolating measures at the input and output ends to improve the performance of the
module.

1.1.1.1.1521 Control Module


The control module performs the following functions:

Detects and drives bump electricity.

Controls the temperature of the bump laser.

Detects the input and output power.

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Compensation Boards

Reports alarms.

The control module consists of the A/D converting unit, D/A converting unit, and CPU. The
A/D converting unit converts the temperature value of the cooling electricity and the
input/output optical power from analog values into digital values. The converted values are
sent to the CPU, which generates performance reporting events or alarms. The A/D converting
unit also converts bump electricity from analog values into digital values. The converted
values are also sent to the CPU. After the CPU processes the converted values, the D/A
converting unit precisely controls the driving analog circuit of the bump laser of the EDFA
optical module. The internal temperature of the bump laser module remains at 25C. The
temperature sensor inside the bump laser outputs temperature change to drive the cooler to
keep the internal temperature of the bump laser module at 25C.

1.1.1.1.1522 Communication Module


The communication module supports Ethernet communication.

1.1.1.1.1523 DC/DC Converter Module


It converts the 48/60 V power supply into the DC voltages that the modules of the board
require.

18.1.5 Front Panel


The front panel of the BA2 has indicators and interfaces.

1.1.1.1.1524 Diagram of the Front Panel


The BA2 is available in two types, namely, one-interface BA2 and two-interface BA2.
Figure 18-3 shows the appearance of the front panel of the one-interface BA2.

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Compensation Boards

Figure 1.1 Front panel of the one-interface BA2

BA2
STAT
ACT
PROG
SRV

LASER
RADIATION
DO NOT V IEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT1
IN1

BA2

Figure 18-4 shows the appearance of the front panel of the two-interface BA2.

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Figure 1.2 Front panel of the two-interface BA2

BA2
STAT
ACT
PROG
SRV

LASER
RADIATION
DO NOT V IEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT1
IN1
OUT2 IN2

BA2

1.1.1.1.1525 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1526 Interfaces
The front panel of the one-interface BA2 has one optical interface. The optical interface
transmits and receives one channel of optical signals. The one-interface BA2 uses the
swappable optical module, which facilitates the maintenance and upgrading of the optical
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module.
The front panel of the two-interface BA2 has two optical interfaces. The optical interfaces
transmit and receive two channels of optical signals. The two-interface BA2 uses the
swappable optical module, which facilitates the maintenance and upgrading of the optical
module.

If the front panel of the one-interface BA2 has two LC optical interfaces, only the upper
optical interface (IN1/OUT1) is valid. In the case of the BA2 whose front panel has two LC
optical interfaces, determine whether the BA2 is a one-interface BA2 or a two-interface BA2
according to 18.1.7 Feature Code.
Table 18-2 describes the type and usage of the optical interface of the one-interface BA2.
Figure 1.1 Optical interface of the one-interface BA2
Interface

Type of Interface

Usage

IN

LC

Receives one channel of optical signals.

OUT

LC

Transmits one channel of optical signals.

Table 18-3 describes the types and usage of the optical interfaces of the two-interface BA2.
Figure 1.2 Optical interfaces of the two-interface BA2
Interface

Type of Interface

Usage

IN1

LC

Receives the first channel of optical signals.

OUT1

LC

Transmits the first channel of optical signals.

IN2

LC

Receives the second channel of optical signals.

OUT2

LC

Transmits the second channel of optical signals.

18.1.6 Valid Slots


The slots valid for the BA2 vary with the cross-connect capacity and subrack of the OptiX
OSN equipment.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the BA2 are as follows:

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1117 in the subrack.

18.1.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the BA2 indicates the output optical power of the optical interfaces.
Table 18-4 provides the relationship between the feature code of the BA2 and the output
optical power.
Figure 1.3 Relationship between the feature code of the BA2 and the output optical power
Board

Feature Code

Output Optical Power

SSN1BA201

01

Dual-channel optical power


amplification: 14 dBm

SSN1BA202

02

Dual-channel optical power


amplification: 17 dBm

SSN1BA203

03

Optical power amplification:


14 dBm

SSN1BA204

04

Optical power amplification:


17 dBm

SSN1BA205

05

Dual-channel optical power


amplification: 14 dBm and 17
dBm

18.1.8 Technical Specifications


The technical specifications of the BA2 include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.

1.1.1.1.1527 Parameters Specified for Optical Interfaces


Table 18-5 lists the parameters specified for the optical interfaces of the BA2.
Figure 1.1 Parameters specified for the optical interfaces of the BA2
Parameter

Value

Input wavelength
(nm)

1530 to 1565

Input optical power


(dBm)

-6 to +3

Output optical power


(dBm)

14 to 14.5 or 17 to 17.5

Noise figure (dB)

< 6.5

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1.1.1.1.1528 Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power
of the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

1.1.1.1.1529 Mechanical Specifications


The mechanical specifications of the BA2 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.0

1.1.1.1.1530 Power Consumption


The maximum power consumption of the BA2 at room temperature (25C) is 20 W.

18.2 BPA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the BPA (optical booster and pre-amplifier board).

18.2.1 Version Description


The BPA is available in the following functional versions: N1 and N2. The N1BPA is
discontinued.
Table 18-6 describes the versions of the BPA.
Figure 1.1 Versions of the BPA
Item

Description

Functional Versions

The BPA is available in two functional versions, namely, N1


and N2.

Differences

The N1BPA consists of two EDFA optical modules, whereas


the N2BPA has only one EDFA optical module.

Substitution

The two versions can substitute for each other when certain
conditions are met. If the ALS function is required and the
N2BPA is used to substitute for the N1BPA, enable the ALS
function on the N2BPA. If the ALS function is required and
the N1BPA is used to substitute for the N2BPA, enable the
ALS function on the line board. If the ALS function is not
required, this restriction is not applicable.

18.2.2 Application
The BPA is an optical booster and pre-amplifier board. The BPA provides a BA and a PA,
which are respectively used at the transmit end and receive end of the OptiX OSN equipment.
Figure 18-5 shows the position of the BA and PA in an optical transmission system.
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Figure 1.1 Position of the BA and PA in an optical transmission system

Optical
transmitter

BA

PA

Optical
receiver

1550.12nm

18.2.3 Functions and Features


During the long-haul transmission of optical signals, the attenuation of the signals is high.
Hence, the BA and PA are required to ensure that the optical receiver can receive normal
optical signals.
Table 18-7 provides the functions and features of the BPA.
Figure 1.2 Functions and features of the BPA
Function and Feature

BPA

Basic functions

Increases the launched optical power of the line board to 1315


dBm or 1517 dBm. As a result, when the G.652 optical fiber
with a loss of 0.275 dB/km is used, the transmission distance can
be 120 km, 130 km, or above.

Pre-amplification
function

Provides the PA module to pre-amplify the received optical


signals. Increases the power of the small-volume optical signals
by 22-25 dB (N1BPA) or 22-33 dB (N2BPA).

Supporting the EDFA

Supports the automatic control of the laser temperature and


optical power of the EDFA module.

Supports the automatic monitoring of the input and output


optical power of the EDFA module and query of the optical
power of the EDFA module.

Supports the protection function of the EDFA module. When


no optical signals are received, the laser is automatically
turned off. When optical signals are received, the laser is
automatically turned on.

Performance events
and alarms monitoring

Supports the reporting of the performance parameters of the laser.


Reports various alarms and performance events, which facilitates
the management and maintenance of the equipment.

Software upgrade

Supports the software upgrade and expansion without


interrupting services.

18.2.4 Working Principle and Signal Flow


The BPA consists of the optical part, driving and detecting part, and data processing and
communication part.
Figure 18-6 shows the functional block diagram of the N1BPA.

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Figure 1.1 Functional block diagram of the N1BPA


Optical output

Optical input

Optical input

Drive
module

Optical
part

EDFA optical module 2

EDFA optical module 1

Pump current
check

Optical output

Module
temperature
control

Input/output
power
check

Pump
Drive
current
module
check

Module
temperature
control

Output
power
check

Input
power
check

Driving
and
detecting
Fixed filter
part

A/D or D/A conversion

Communication
module

SCC

Data processing and


communication part

Control
module

Figure 18-7 shows the functional block diagram of the N2BPA.


Figure 1.2 Functional block diagram of the N2BPA
Optical input

Optical output

Optical input

Optical output

Fixed
filter

For pre-amplification

Optical part

EDFA optical module

Pump current
check

Drive
module

Module
temperature
control

Input/output
power
check

Pump
current
check

Module
Drive
temperature
module
control

Input/output
power
check

Driving and
detecting part

A/D or D/A conversion

SCC

Communication
module

Control
module

Data processing and


communication part

1.1.1.1.1531 Optical Part


The N1BPA consists of two EDFA optical modules. The N2BPA has only one EDFA optical
module. The EDFA optical module magnifies the optical power.

1.1.1.1.1532 Driving and Detecting Part


The driving and detecting part provides the EDFA optical module with the driving current. It
also checks the working status of each part in the EDFA optical module. In addition, it
predicts and handles possible faults.

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The driving and detecting part performs the following functions: checking the pump current,
driving the optical module, controlling the temperature of the optical module, and checking
the input and output optical power.

1.1.1.1.1533 Data Processing and Communication Part


The data processing and communication part consists of the CPU and peripheral chips. The
data processing and communication part analyzes the test result of the tested circuit. Then, it
adjusts the driving circuit based on the analysis result so that the gain or output optical power
of the EDFA optical module remains in the range of the rated value. It also classifies the
abnormal states represented by the measured values and reports the abnormal states to the
NMS.

18.2.5 Front Panel


The front panel of the BPA has indicators, interfaces, and a laser safety class label.

1.1.1.1.1534 Diagram of the Front Panel


Figure 18-8 shows the appearance of the front panel of the BPA.

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Figure 1.1 Front panel of the BPA

BPA
STAT
ACT
PROG
SRV

LASER
RADIATION
DO NOT V IEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

BOUT
BIN
POUT
PIN

BPA

1.1.1.1.1535 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1536 Interfaces
The front panel of the BPA has two LC optical interfaces. Table 18-8 describes the types and
usage of the optical interfaces of the BPA.

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Figure 1.1 Optical interfaces of the BPA


Interface

Type of
Interface

Usage

BIN

LC

Receives one channel of optical signals for


amplification.

BOUT

LC

Transmits one channel of amplified optical signals.

PIN

LC

Receives one channel of optical signals for preamplification.

POUT

LC

Transmits one channel of pre-amplified optical


signals.

18.2.6 Valid Slots


The slots valid for the BPA vary with the cross-connect capacity and subrack of the OptiX
OSN equipment.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the BPA are as follows:

When the cross-connect capacity is 200 Gbit/s, the BPA can be installed in slots 18 and
1117 in the subrack.

18.2.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the BPA indicates the output optical power of the optical interfaces.
Table 18-9 provides the relationship between the feature code of the BPA and the output
optical power.
Figure 1.2 Relationship between the feature code of the BPA and the output optical power
Board

Feature Code

Description

SSN1BPA01 and
SSN2BPA01

01

The output optical power of the BA


module is 14 dBm.

SSN1BPA02

02

The output optical power of the BA


module is 17 dBm.

18.2.8 Technical Specifications


The technical specifications of the BPA include the parameters specified for optical interfaces,
mechanical specifications, and power consumption.
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1.1.1.1.1537 Parameters Specified for Optical Interfaces


Table 18-10 lists the parameters specified for the optical interfaces of the BPA.
Figure 1.1 Parameters specified for the optical interfaces of the BPA
Parameter

Value

Input wavelength (nm)

BA: 1530 to 1565


PA: 1550.12

Input optical power


(dBm)

BA: -6 to +3

Output optical power


(dBm)

N1BPA: 14 to 14.5 or 17 to 17.5 (BA)

PA: -44 to -10


N1BPA: -16 to +15 (PA)
N2BPA: 14 to 14.5 (BA)
N2BPA: -16 to +23 (PA)

Noise figure (dB)

BA: < 6.5


PA: < 6

Minimum signal gain


(dB)

+22

When you perform a loopback on the PA module of the BPA, prevent the damage caused by high input
optical power to the optical module.

1.1.1.1.1538 Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power
of the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

1.1.1.1.1539 Mechanical Specifications


The mechanical specifications of the BPA are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight of the N1BPA (kg): 1.0

Weight of the N2BPA (kg): 1.2

1.1.1.1.1540 Power Consumption


The maximum power consumption of the N1BPA at room temperature (25C) is 20 W.
The maximum power consumption of the N2BPA at room temperature (25C) is 11 W.

18.3 COA
This topic describes the version, functions, working principle, front panel, valid slots, and
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technical specifications of the COA (case-shaped optical amplifier).

18.3.1 Version Description


The COA is available in three functional versions, namely, 61, 62, and N1.
The working principle of the 62COA is basically the same as the working principle of the
61COA or N1COA. The difference between the 62COA and the 61COA (N1COA) is with
regard to the used optical amplifier modules. The 62COA uses the Raman optical amplifier
module, whereas the 61COA and N1COA use the EDFA optical amplifier module.
The COA that occurs in the following text includes the 61COA, N1COA, and 62COA. The
characteristics of the COA are the common characteristics of the three types of COAs.

Table 18-11 describes the versions of the COA.


Figure 1.1 Versions of the COA
Item

Description

Functional versions

The COA is available in three functional versions, namely, 61, 62,


and N1.

Differences

The 61COA can function as a BA or a PA. The BA is the EDFA


optical amplifier in the 1530 nm to 1560 nm fiber communication
window; the PA is the EDFA optical amplifier in the 1550 nm fiber
communication window.
The N1COA can function as a PA. The PA is the EDFA optical
amplifier in the 1530 nm to 1560 nm fiber communication window.
The N1COA does not have a filter and is a multi-wavelength
amplifier.
The 62COA uses the Raman optical amplifier module.

Substitution

The versions cannot be substituted with each other.

18.3.2 Application
The COA is a case-shaped optical amplifier that is not installed in a slot of the subrack. The
COA is mainly used to amplify optical signals and is applicable to the long-distance optical
fiber transmission.
The application of the COA is the same as that of the BA and PA on the OptiX OSN
equipment series. For details, see Figure 18-5.

18.3.3 Functions and Features


The COA integrates the optical amplifier module, the driving circuit, and the communication
circuit in an aluminium case.
The COA is an external and independent amplifier and does not occupy a slot in the subrack.
The COA can work independently. The equipment supports a maximum of two 61COAs, two
N1COAs, or one 62COA.

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1.1.1.1.1541 61COA and N1COA


The 61COA/N1COA is equipped with only one EDFA optical module. The 61COA/N1COA
can work as a power amplifier, a pre-amplifier, or a line amplifier. Figure 18-9 shows the
appearance of the 61COA/N1COA.
The optical characteristics of the 61COA/N1COA are the same as the optical characteristics of
the optical amplifier boards such as the BPA and BA2. The difference between the
61COA/N1COA and the optical amplifier boards is that the 61COA/N1COA is an external
optical amplifier unit, which does not occupy a slot in the subrack. The 61COA/N1COA can
be directly installed in the ETSI cabinet but requires separate power supply.
Figure 1.1 Appearance of the 61COA/N1COA (PA)

The application of the 61COA/N1COA in the optical transmission system is the same as the
application of the BA2 and BPA in the optical transmission system. Table 18-12 provides the
functions and features of the 61COA/N1COA.
Figure 1.1 Functions and features of the 61COA/N1COA
Function and
Feature

61COA/N1COA

Power amplification
function

The 61COA increases the launched optical power of the line


board. As a result, the valid transmission distance of optical
signals is extended.

Pre-amplification
function

The 61COA/N1COA provides the pre-amplification function.

ALS function

Supports the ALS function.

Communication
through serial ports

Communicates with the GSCC through the RS-232 serial port,


reports the alarms and performance events of the COA to the
NMS, and receives the configuration commands issued by the
NMS.

1.1.1.1.1542 62COA
The 62COA is a case-shaped Raman optical amplifier and is used at the receive end of the
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SDH equipment.
The 62COA transmits counter-propagated pumping optical signals to fibers for distributed
Raman amplification. The gain medium of distributed Raman amplification is the line fiber
that can realize better noise performance. This is different from the 61COA. Hence, the
62COA can extend the transmission distance, reduce the signal-to-noise ratio, and realize ultra
long hop transmission for a single span.
Figure 18-10 shows the appearance of the 62COA.
Figure 1.2 Appearance of the 62COA
4

2
3

1. Captive screw
4. ESD jack

2. Ejector lever
5. Power access board

3. COA board

The 62COA is a case-shaped Raman optical amplifier and is used at the receive end of the
optical transmission system. The optical signals are amplified during transmission based on
the stimulated Raman scattering effect of the fiber. The 62COA needs to work with the EDFA
to realize the transmission of optical signals for more than 170 km. For details, see Figure 1811.
Figure 1.3 Application of the 62COA
Raman amplifier
Signal light
EDFA

Pump light

Fiber
Transmitting end

Pump light
Coupler

EDFA

Laser
Receiving end

The Raman amplifier amplifies optical signals during transmission by transmitting counterpropagated pumping optical signals to fibers for distributed Raman amplification. As a result,
the phase of optical signals is significantly different from the phase of pump signals. The
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power fluctuation of the Raman pumping is offset in the counter-propagation. Hence, the
noise caused by the pump can be effectively suppressed.
Table 18-13 provides the functions and features of the 62COA.
Figure 1.1 Functions and features of the 62COA
Function and
Feature

62COA

Basic functions

Is configured at the receive end of the SDH system, and realizes


extra long-haul transmission (more than 170 km) when working
with an EDFA whose output power is 17 dBm at the transmit end.

Pre-amplification
function

The 62COA provides the pre-amplification function.

ALS function

Supports the ALS function.

Communication
through serial ports

Communicates with the GSCC through the RS-232 serial port,


reports the alarms and performance events of the COA to the
NMS, and receives the configuration commands issued by the
NMS.

18.3.4 Working Principle and Signal Flow


The 61COA and N1COA consist of the EDFA module, control module, communication
module, and DC/DC converter module.
The working principle of the N1COA is similar to the working principle of the 61COA. The
61COA has the filter unit, whereas the N1COA does not have the filter unit.
Figure 18-12 shows the functional block diagram of the 61COA/N1COA.

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Figure 1.1 Functional block diagram of the 61COA/N1COA


Optical output
Optical input
Fixed
filter

For pre-amplification

EDFA optical
module

Pump
power check

Drive
module

Module
temperature
control

Optical part

Input/Output
Power check

Driving and
detecting part

A/D or D/A conversion

SCC

Communication
module

Control
module

Data processing and


communication part

1.1.1.1.1543 EDFA Module


The optical amplifier unit consists of two EDFA modules. One module is the BA and the other
module is the PA. When the board is used as a PA, an optical filter with 1550.12 nm as the
central wavelength is added to the optical output end of the module. A BA does not have the
filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the erbium
fiber inside the EDFA module. Bump light and input signal light are coupled into the erbium
fiber through an optical coupler. The input and output optical signals of the module are led out
by two fiber splitters according to a specific coupling ratio. Then, the optical signals are
converted into optical current by two PIN photoelectrical diodes. The input and output power
of the EDFA module is determined according to the optical signals. The module also applies
optical isolating measures at the input and output ends to improve the performance of the
module.

1.1.1.1.1544 Control Module


The control module performs the following functions:

Detects and drives bump electricity.

Controls the temperature of the bump laser.

Detects the input and output power.

Reports alarms.

The control module consists of the A/D converting unit, D/A converting unit, and CPU. The
A/D converting unit converts the temperature value of the cooling electricity and the
input/output optical power from analog values into digital values. The converted values are
sent to the CPU, which generates performance reporting events or alarms. The A/D converting
unit also converts bump electricity from analog values into digital values. The converted
values are also sent to the CPU. After the CPU processes the converted values, the D/A
converting unit precisely controls the driving analog circuit of the bump laser of the EDFA
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optical module. The internal temperature of the bump laser module remains at 25C. The
temperature sensor inside the bump laser outputs temperature change to drive the cooler to
keep the internal temperature of the bump laser module at 25C.

1.1.1.1.1545 Communication Module


The communication module supports Ethernet communication.

1.1.1.1.1546 DC/DC Converter Module


It converts the 48/60 V power supply into the DC voltages that the modules of the board
require.

18.3.5 Front Panel


The front panel of the COA has indicators and interfaces.

1.1.1.1.1547 Diagram of the Front Panel


Figure 18-13 shows the appearance of the front panel of the 61COA/N1COA.
Figure 1.1 Front panel of the 61COA/N1COA
9

10

1. ID DIP switch

2. Running indicator

4. RS-232-1
7. MONITOR-2

5. RS-232-2
6. MONITOR-1
8. IN: input optical interface

9. OUT: output optical interface 10. Power switch

11

3. Alarm indicator

11. -48 V power interface

Figure 18-14 shows the appearance of the front panel of the 62COA.

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Figure 1.2 Front panel of the 62COA

1. SC/PC optical interface (OUT)

2. LSH optical interface (IN)

3. Air filter

4. Fan board

5. RJ-45 interface

6. RS-232-1

7. RS-232-2

8. DIP switch (bits 8-5)

9. DIP switch (bits 4-1)

10. Power input interface

11. Power switch

1.1.1.1.1548 Indicators
The front panel of the board has the following indicators:

Board running status indicator (RUN) one color (green)

Fan alarm indicator (ALM) one color (red)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1549 Interfaces
The front panel of the 61COA/N1COA has one SC/PC optical interface. The optical interface
receives and transmits one channel of optical signals. The input optical interface of the
62COA is connected to the LSH flange and the output optical interface is connected to the SC
flange. Figure 18-15 shows the SC/PC fiber connector that the SC/PC optical interfaces of the
61COA and N1COA use.
Figure 1.3 SC/PC fiber connector

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Figure 18-16 shows the flange and fiber connector that the input optical interface of the
62COA uses.
Figure 1.4 LSH flange and fiber connector

The protective cap of the LSH fiber jumper is specially designed. When you connect the LSH fiber
jumper to an LSH flange, do not remove the protective cap but insert the LSH fiber jumper into the LSH
flange directly.

The COA has two RS-232 serial ports, which function as the control and communication
ports. The serial ports communicate with the SCC unit and report alarms and performance
events.
Table 18-14 provides the pin assignments of the RS-232 serial port.
Figure 1.1 Pin assignments of the RS-232 serial port
Front View

Pin of RS-232-2

Definition

Used to receive
data.

Used to transmit
data.

Used for common


grounding.

Pin of RS-232-1

To realize the communication between the COA and the GSCC, use a serial port control line to connect
the RS-232-1 serial port of the COA to the F&f port of the subrack.

The RS-232-2 serial port is used in the scenario where several COAs are used at a single
station.
To enable each COA to communicate with the SCC unit, use a serial port line to connect the
RS-232-2 port of COA 1 to the RS-232-1 port of COA 2, and use another serial port line to
connect the RS-232-2 port of COA 2 to the RS-232-1 port of COA 3. Connect the other COAs
similarly. In this case, each COA communicates with the SCC unit through the RS-232-1
serial port of COA 1.
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When you cascade COAs, set the last four digits of the DIP switch on the front panel of each COA to a
unique value. The values are used to identify the COAs. One OptiX OSN 3500 subrack supports a
maximum of two COAs. When bit 1 of the DIP switch is set downwards, the logical slot of the COA on
the NMS is slot 101. When bit 2 of the DIP switch is set downwards, the logical slot of the COA on the
NMS is slot 102.

The COA has two MONITOR interfaces. When the 61COA is used alone, the MONITOR-1
interface and MONITOR-2 interface are the alarm output interfaces. In this case, the two
MONITOR interfaces have the same functions. Table 18-15 provides the pin assignments of
the MONITOR interfaces.
Figure 1.2 Pin assignments of the MONITOR interfaces
Front View

Pin of
MONITOR-2

Definition

1 and 6

1 and 6

The input optical power of the


EDFA module is very low.

2 and 7

2 and 7

The working current of the


pump laser of the EDFA module
exceeds the threshold.

3 and 8

3 and 8

The cooling current of the pump


laser of the EDFA module
exceeds the threshold.

4 and 9

4 and 9

The ambient temperature of the


EDFA module exceeds the
threshold.

Digital ground

Pin of
MONITOR-1

The 62COA has one RJ45 connector, through which the 62COA is connected to the computer
for software loading. Table 18-16 provides the pin assignments of the RJ45 connector of the
62COA.
Figure 1.3 Pin assignments of the RJ45 connector of the 62COA
Front View

8 7 6 5 4 3 2 1

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Pin

Description

Transmitting (+)

Transmitting ()

Receiving (+)

Not defined

Not defined

Receiving ()

78

Not defined

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The COA has one 48 V power interface. The 48 V power interface receives the 48 V
power provided by the PIU in the OptiX OSN 3500 subrack or the PDU at the top of the
cabinet. The working voltage under normal working conditions ranges from 38.4 V to 57.6
V (48 V20%).
The COA has one DIP switch.

The DIP switches of the 61COA/N1COA are in the lower left corner of the front panel.
The DIP switches are used to set the ID of the 61COA/N1COA. When a bit of the DIP
switch is set upwards, the bit is in the OFF position. When the bit is set downwards, the
bit is in the ON position. The SCC identifies a 61COA/N1COA through the ID of the
61COA/N1COA. The SCC communicates with the 61COAs/N1COAs whose IDs are
different in the master-slave calling mode.

The DIP switch of the 62COA is used to set the ID of the 62COA and the type of fiber.
The DIP switch has eight bits. The bit on the leftmost side is numbered "8" and the bit on
the rightmost side is numbered "1". When a bit of the DIP switch is set upwards, the bit
indicates "0". When the bit is set downwards, the bit indicates "1". The first four bits (1
4) are used to set the board ID, which ranges from 20 to 35. In actual situations, the first
four bits indicate only the range from 20 to 27. The fifth bit is used to set the type of
fiber. When bit 5 indicates "0", the fiber is of the G.652 type. When bit 5 indicates "1",
the fiber is of the G.655 type.

18.3.6 Valid Slots


The COA adopts the case-shape design. Hence, the COA does not require a slot in the
subrack.
In the ETSI cabinet, the 61COA or N1COA is installed on a special bracket, and the 62COA is
installed directly in the cabinet through the mounting ears. On the NMS, the logical slots of
the 61COA, N1COA, and 62COA are slots 101 and 102.

1.1.1.1.1550 Installation Position of the 61COA or N1COA


The installation of the 61COA is considered as an example. The bracket is fixed on the
crossbars on both sides of the cabinet. There are guide rails on the bracket. The 61COA is
pushed onto the bracket along the guide rails and is fixed on the bracket. One bracket can hold
two 61COAs horizontally. The front panels of the two 61COAs are on the front side of the
cabinet, as shown in Figure 18-17.
Figure 1.1 Position of the 61COA in the ETSI cabinet

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1.1.1.1.1551 Installation Position of the 62COA


The case-shaped 62COA can be installed in the 300 mm or 600 mm ETSI cabinet through
mounting ears and screws. If the upward-wiring scheme is applied, the 62COA is installed at
the bottom of the ETSI cabinet (positions of the first and third floating nuts). If the
downward-wiring scheme is applied, the 62COA is installed in any idle place of the 2.6 m
high cabinet or in the ETSI cabinet that is not fully configured.

18.3.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the 61COA indicates the output optical power of the optical interfaces.
Table 18-17 provides the relationship between the feature code of the 61COA and the output
optical power.
Figure 1.1 Relationship between the feature code of the 61COA and the output optical power
Board

Feature Code

Description

SS61COA01

01

The output optical power of


the BA module is 14 dBm.

SS61COA02

02

The output optical power of


the BA module is 17 dBm.

18.3.8 Technical Specifications


The technical specifications of the COA include the parameters specified for optical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.1552 Parameters Specified for Optical Interfaces


Table 18-18 lists the parameters specified for the optical interfaces of the COA.
Figure 1.1 Parameters specified for the optical interfaces of the COA
Parameter

Value
61COA

N1COA

62COA

Operating
wavelength range
(nm)

BA: 1530 to 1565

PA: 1550.12

1550.12

Input optical
power range
(dBm)

BA: -6 to +3

PA: -28 to -10


(when the BPA
works with the line
board at the rate of
10 Gbit/s)

-43 to -20

PA: 1550.12

PA: -28 to -10


(when the BPA
works with the line
board at the rate of
10 Gbit/s)
PA: -38 to -10
(when the BPA
works with the line

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(The LOS alarm is


reported when the input
optical power reaches
-45 dBm.)

PA: -38 to -10


(when the BPA
works with the line
board at the rate

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Value

Launched optical
power range
(dBm)

61COA

N1COA

board at the rate less


than 10 Gbit/s)

less than 10 Gbit/s)

BA: 14 to 14.5 or
17 to 17.5

PA: -2 to +16
(when the BPA
works with the line
board at the rate of
10 Gbit/s)

PA: -2 to +16 (when


the BPA works with
the line board at the
rate of 10 Gbit/s)
PA: -12 to +16
(when the BPA
works with the line
board at the rate less
than 10 Gbit/s)

Signal gain (dB)

PA: > 22

Noise figure (dB)

<6

62COA

PA: -12 to +16


(when the BPA
works with the line
board at the rate
less than 10 Gbit/s)
> 22

13
< -1.5

1.1.1.1.1553 Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power
of the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

1.1.1.1.1554 Mechanical Specifications


The mechanical specifications of the 61COA and N1COA are as follows:

Dimensions (mm): 240 (W) x 190 (D) x 50 (H)

Weight (kg): 3.5

The mechanical specifications of the 62COA are as follows:

Dimensions (mm): 294 (W) x 436 (D) x 86 (H)

Weight (kg): 8.0

1.1.1.1.1555 Power Consumption


The maximum power consumption of the 61COA at room temperature (25C) is 10 W.
The maximum power consumption of the 62COA at room temperature (25C) is 75 W.
The maximum power consumption of the N1COA at room temperature (25C) is 10 W.

18.4 RPC01
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the RPC01 (forward Raman driving board).
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18.4.1 Version Description


The RPC01 is available in one functional version, namely, N1.

18.4.2 Application
The RPC01 is an external forward Raman driving board that must work with the EDFA.
Figure 18-18 shows the position of the RPC01 in an optical transmission system.
Figure 1.1 Position of the RPC01 in an optical transmission system

Transmitting

Receiving

RPC01

18.4.3 Functions and Features


The RPC01 supports the online optical performance monitoring function and other functions.
Table 18-19 provides the functions and features of the RPC01.
Figure 1.1 Functions and features of the RPC01
Function and
Feature

RPC01

Basic functions

Generates multi-channel pump light of high power, which


provides energy for the amplification of signals in the fiber.

Realizes the distributed online amplification of signals over long


distance with wide bandwidth and low noise.

Online optical
performance
monitoring function

Provides the online monitoring interface. A small amount of optical


signal can be transmitted to the spectrum analyzer through the
interface so that the spectrum and optical performance of the
multiplexed optical signal can be monitored without a service
interruption.

Performance events
and alarms
monitoring

Detects the pump optical power, temperature control current,


pump current, and back facet current.

Supports the setting of the LOS value to disable the output port
of the laser.

18.4.4 Working Principle and Signal Flow


The RPC01 consists of the Raman pump optical module, driving and detecting module,
communication and control module, and power supply module.
The RPC01 is used at the transmit end of the system. The RPC01 utilizes the stimulated
Raman scattering effect of the fiber to amplify the optical signals during transmission.

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Figure 1.1 Functional block diagram of the RPC01 (forward pump)


Splitter Signal light

Signal light

LINE

Pump light
Pump source

Control the
pumping current
and temperature.

SYS
MON

Raman pump optical module

Detect the pump


light power and
current.

PIN

Detect the
temperature.

Driving and detecting module

Control
Memory

CPU

Communication

Communication and control module


Power supply
module
Fuse

Voltages required
by the board

DC power provided
by the backplane

SCC

Backplane
(controlled by
the SCC)

1.1.1.1.1556 Signal Flow


The signal light is received at the SYS interface and transmitted to the optical line through the
LINE interface. A few supervisory signals are transmitted to the test instrument through the
MON interface for online optical performance monitoring. The pump light that is generated
by the RPC01 is transmitted to the optical line through the LINE interface in the same
direction of the signal light, to realize the distributed amplification of the optical signal. The
Ethernet interface of the RPC01 is connected to the COM interface of an NE directly or
through a hub to realize the communication with the SCC.

1.1.1.1.1557 Functional Modules

Raman pump optical module

The laser in the pump source module generates the pump light and sends the pump
light to the optical line for transmission. The Raman pump optical module utilizes the
stimulated Raman scattering effect of the fiber to amplify the optical signals during
transmission.

The splitter splits one channel of optical signals from the pump source module into
two channels of signals of different power. One channel of signals are transmitted
through the SYS interface to the main optical path. The other channel of signals are
transmitted to the MON interface for spectrum detection and supervising.

Driving and detecting module

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Detects the optical power of the service signals in real time.


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Detects the driving current, back facet current, cooling current, and operating
temperature of the pump inside the pump optical module in real time.

Drives the pump laser inside the pump optical module.

Reports alarms and performance events to the logic and control module.

Communication and control module

Controls the operations on the board.

Controls the operations on each module of the board according to the CPU
instructions.

Collects the alarms, performance events, working status, and voltage detection
information of each functional module of the board.

Communicates with the SCC.

Power supply module


Converts the DC power provided by the backplane into the power required by each
module of the board.

18.4.5 Front Panel


The front panel of the RPC01 has indicators, interfaces, and a laser safety class label.

1.1.1.1.1558 Diagram of the Front Panel


Figure 18-20 shows the appearance of the front panel of the RPC01.
Figure 1.1 Front panel of the RPC01

03793010860000002 Y SSN1 RPC 01

Board manufacturing
information
MON

SYS

Board serial
number and name
LINE

LASER
RADIA TION
AVOID EYE OR SKIN
EXPOSURE TO DIRECT O R
SCATTERED RADIATION

CRPC

CLASS 4 LASER
PRODUCT

ALM

RUN

WARNING: FIBERS MUST


BE CONNECTED SEFORE
POWER UP

RS232-1

RS232-2

LAN

1.1.1.1.1559 Indicators
The front panel of the board has the following indicators:

Board running status indicator (RUN) one color (green)

Fan alarm indicator (ALM) one color (red)

For the meanings of the status of the indicators, see 23 Indicators.

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1.1.1.1.1560 Interfaces
The front panel of the RPC01 has six interfaces. Table 18-20 describes the types and usage of
the interfaces of the RPC01.
Figure 1.1 Interfaces of the RPC01
Interface

Type of
Interface

Usage

LINE

LSH/APC

Transmits the amplified signals to the fibers.

SYS

LC

Is connected to the BA and receives the optical


signals transmitted from the BA.
NOTE
The permissible input power for the SYS interface on the
RPC01 board ranges from +5 dBm to +8 dBm. Therefore,
when the output power of a BA is +14 dBm or +17 dBm,
you need to add an optical attenuator ranging from 5 dB to
10 dB in front of the SYS interface.

MON

LC

Monitors the optical performance.


The power of the MON interface is 1/99 of the power
of the SYS interface. That is, the power of the MON
interface is 20 dB less than the power of the SYS
interface.

LAN

RJ-45

Is connected to the COM interface of an NE directly


or through a hub to realize the communication with
the SCC.

RS2321/RS232-2

Is an RS-232 communication interface.

18.4.6 Valid Slots


The RPC01 is an external forward Raman driving board. Hence, the RPC01 is not installed in
the subrack. The RPC01 is connected to the COM interface of an NE directly or through a
hub to realize the communication with the SCC. The logical slot of the RPC01 on the NMS is
slot 104/106.

18.4.7 Jumpers and DIP Switches


The RPC01 has two groups of jumpers, namely, group J3 and group J4.
Figure 18-21 shows the jumpers of the RPC01.

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Figure 1.1 Jumpers of the RPC01


RPC01

10

10

J3

J4

CPU

To ensure that the board can operate normally, set the jumpers as follows:

Short-circuit jumpers 1 and 2 of group J4.

Short-circuit jumpers 3 and 4 of group J4.

Short-circuit jumpers 5 and 6 of group J4.

Short-circuit jumpers 9 and 10 of group J3.


When jumpers 9 and 10 of group J4 are short-circuited, the logical slot of the RPC01 on the NMS is slot
106. When jumpers 9 and 10 of group J4 are not short-circuited, the logical slot of the RPC01 on the
NMS is slot 104.

18.4.8 Feature Code


The feature code of the RPC01 contains three characters, which indicate the gain of the
optical signal processed by the RPC01.
Table 18-21 describes the feature code of the RPC01.
Figure 1.2 Feature code of the RPC01
Feature Code

Indication

Description

The first character

Is always "G".

The second and third


characters

Gain

Indicates the gain.

Consider the N1RPC01 whose feature code is "G10" as an example. "G10" indicates that the
maximum gain of the optical signal is 10 dB.

18.4.9 Parameter Settings


You can set the parameters for the RPC01 by using the U2000.
You can set the following parameters for the RPC01 by using the U2000:

Laser status

Board work type

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Fixed Pump Optical Power (dBm)

Min. Fixed Pump Optical Power (dBm)

Max. Fixed Pump Optical Power (dBm)

18 Optical Amplifier Boards and Dispersion


Compensation Boards

For the description of each parameter, see 26.9 Optical Amplifier Boards.

1.1.1.1.1561 Interface Display


Table 18-22 shows the serial numbers of the optical interfaces on the front panel of the
RPC01 on the NMS.
Figure 1.1 Serial numbers of the optical interfaces on the front panel of the RPC01 on the NMS
Interface on the Front Panel

Serial Number of the NMS Interface

LINE

SYS

MON

18.4.10 Technical Specifications


The technical specifications of the RPC01 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1562 Parameters Specified for Optical Interfaces


Table 18-23 lists the parameters specified for the optical interfaces of the RPC01.
Figure 1.1 Parameters specified for the optical interfaces of the RPC01
Parameter

Value

Pump wavelength (nm)

1400 to 1500

Operating wavelength (nm)

1529 to 1561

Maximum pump power (dBm)

29

Gain on the G.652 fiber (dB)

10

Gain on the LEAF fiber (dB)

12

Equivalent noise figure on the G.652 fiber


(dB)

Equivalent noise figure on the LEAF fiber


(dB)

-1

Polarization dependent loss (dB)

0.5

Type of output connector

LSH/APC or LC/PC

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1.1.1.1.1563 Laser Safety Class


The safety class of the laser on the board is Class 4. The maximum launched optical power of
the optical interfaces is more than 27 dBm (500 mW).

1.1.1.1.1564 Mechanical Specifications

Dimensions (mm): 76.0 (W) x 218.5 (D) x 345.0 (H)

Weight (kg): 4.0

1.1.1.1.1565 Power Consumption


The maximum power consumption of the RPC01 at room temperature (25C) is 70 W.

18.5 RPC02
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the RPC02 (backward Raman driving board).

18.5.1 Version Description


The RPC02 is available in one functional version, namely, N1.

18.5.2 Application
The RPC02 is an external backward Raman driving board that must work with the EDFA.
Figure 18-22 shows the position of the RPC02 in an optical transmission system.
Figure 1.1 Position of the RPC02 in an optical transmission system

Transmitting

RPC02

Receiving

18.5.3 Functions and Features


The RPC02 supports the online optical performance monitoring function and other functions.
Table 18-24 provides the functions and features of the RPC02.
Figure 1.1 Functions and features of the RPC02
Function and
Feature

RPC02

Basic functions

Generates multi-channel pump light of high power, which


provides energy for the amplification of signals in the fiber.

Realizes the distributed online amplification of signals over long


distance with wide bandwidth and low noise.

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Function and
Feature

RPC02

Online optical
performance
monitoring function

Provides the online monitoring interface. A small amount of optical


signal can be transmitted to the spectrum analyzer through the
interface so that the spectrum and optical performance of the
multiplexed optical signal can be monitored without a service
interruption.

Performance events
and alarms
monitoring

Detects the pump optical power, temperature control current,


pump current, and back facet current.

Supports the setting of the LOS value to disable the output port
of the laser.

18.5.4 Working Principle and Signal Flow


The RPC02 consists of the Raman pump optical module, driving and detecting module,
communication and control module, and power supply module.
The RPC02 is used at the receive end of the system. The RPC02 utilizes the stimulated
Raman scattering effect of the fiber to amplify the optical signals during transmission. The
pump light travels in the reverse direction of the signal light. The RPC02 must work with the
EDFA.
Figure 18-23 shows the functional block diagram of the RPC02.

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Figure 1.1 Functional block diagram of the RPC02 (backward pump)


Splitter Signal light

Signal light

LINE

Pump light
Pump source

Control the
pumping current
and temperature.

SYS
MON

Raman pump optical module

Detect the pump


light power and
current.

PIN

Detect the
temperature.

Driving and detecting module

Control
Memory

CPU

Communication

Communication and control module


Power supply
module
Fuse

Voltages required
by the board

DC power provided
by the backplane

SCC

Backplane
(controlled by
the SCC)

1.1.1.1.1566 Signal Flow


The pump source of the RPC02 sends the pump light to the WDM side through the LINE
optical interface. On the line, the signals that are amplified through the distributed
amplification are received through the LINE interface. Then, the splitter splits the signals into
two channels. The service optical signals are transmitted through the SYS interface. A few
supervisory signals are transmitted to the test instrument through the MON interface for
online optical performance monitoring. The Ethernet interface of the RPC02 is connected to
the COM interface of an NE directly or through a hub to realize the communication with the
SCC.

1.1.1.1.1567 Functional Modules

Raman pump optical module

The laser in the pump source module generates the pump light and sends the pump
light to the optical line for transmission. The Raman pump optical module utilizes the
stimulated Raman scattering effect of the fiber to amplify the optical signals during
transmission.

The splitter splits one channel of optical signals from the pump source module into
two channels of signals of different power. One channel of signals are transmitted
through the SYS interface to the main optical path. The other channel of signals are
transmitted to the MON interface for spectrum detection and supervising.

Driving and detecting module

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Detects the driving current, back facet current, cooling current, and operating
temperature of the pump inside the pump optical module in real time.

Drives the pump laser inside the pump optical module.

Reports alarms and performance events to the logic and control module.

Communication and control module

Controls the operations on the board.

Controls the operations on each module of the board according to the CPU
instructions.

Collects the alarms, performance events, working status, and voltage detection
information of each functional module of the board.

Communicates with the SCC.

Power supply module


Converts the DC power provided by the backplane into the power required by each
module of the board.

18.5.5 Front Panel


The front panel of the RPC02 has indicators, interfaces, and a laser safety class label.

1.1.1.1.1568 Diagram of the Front Panel


Figure 18-24 shows the appearance of the front panel of the RPC02.
Figure 1.1 Front panel of the RPC02

03793010860000002 Y SSN1 RPC02

Board manufacturing
information
MON

Board serial
number and name

SYS

LINE

LASER
RADIATION
AVOID EYE OR SKIN
EXPOSURE TO DIRECT OR
SCATTERED RADIATION

CRPC

CLASS 4 LASER
PRODUCT

ALM

RUN

WARNING: FIBERS MUST


BE CONNECTED SEFORE
POWER UP

RS232-1

RS232-2

LAN

1.1.1.1.1569 Indicators
The front panel of the board has the following indicators:

Board running status indicator (RUN) one color (green)

Fan alarm indicator (ALM) one color (red)

For the meanings of the status of the indicators, see 23 Indicators.

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1.1.1.1.1570 Interfaces
The front panel of the RPC02 has six interfaces. Table 18-25 describes the types and usage of
the interfaces of the RPC02.
Figure 1.1 Interfaces of the RPC02
Interface

Type of
Interface

Usage

LINE

LSH/APC

Receives the optical signals transmitted from the line.

SYS

LC

Is connected to the BA and transmits the amplified


signals to the fibers.

MON

LC

Monitors the optical performance.


The power of the MON interface is 1/99 of the power
of the SYS interface. That is, the power of the MON
interface is 20 dB less than the power of the SYS
interface.

LAN

RJ-45

Is connected to the COM interface of an NE directly


or through a hub to realize the communication with
the SCC.

RS2321/RS232-2

Is an RS-232 communication interface.

18.5.6 Valid Slots


The RPC02 is an external backward Raman driving board. Hence, the RPC02 is not installed
in the subrack. The RPC02 is connected to the COM interface of an NE directly or through a
hub to realize the communication with the SCC. The logical slot of the RPC02 on the NMS is
slot 105/107.

18.5.7 Jumpers and DIP Switches


The RPC02 has two groups of jumpers, namely, group J3 and group J4.
Figure 18-25 shows the jumpers of the RPC02.

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Figure 1.1 Jumpers of the RPC02


RPC02

10

10

J3

J4

CPU

To ensure that the board can operate normally, set the jumpers as follows:

Short-circuit jumpers 1 and 2 of group J4.

Short-circuit jumpers 3 and 4 of group J4.

Short-circuit jumpers 5 and 6 of group J4.

Do not short-circuit jumpers 9 and 10 of group J3.


When jumpers 9 and 10 of group J4 are short-circuited, the logical slot of the RPC02 on the NMS is slot
107. When jumpers 9 and 10 of group J4 are not short-circuited, the logical slot of the RPC02 on the
NMS is slot 105.

18.5.8 Feature Code


The feature code of the RPC02 contains three characters, which indicate the gain of the
optical signal processed by the RPC02.
Table 18-26 describes the feature code of the RPC02.
Figure 1.2 Feature code of the RPC02
Feature Code

Indication

Description

The first character

Is always "G".

The second and third


characters

Gain

Indicates the gain.

Consider the N1RPC02 whose feature code is "G10" as an example. "G10" indicates that the
maximum gain of the optical signal is 10 dB.

18.5.9 Parameter Settings


You can set the parameters for the RPC02 by using the U2000.
You can set the following parameters for the RPC02 by using the U2000:

Laser status

Board work type

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Fixed Pump Optical Power (dBm)

Min. Fixed Pump Optical Power (dBm)

Max. Fixed Pump Optical Power (dBm)

18 Optical Amplifier Boards and Dispersion


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For the description of each parameter, see 26.9 Optical Amplifier Boards.

1.1.1.1.1571 Interface Display


Table 18-27 shows the serial numbers of the optical interfaces on the front panel of the
RPC02 on the NMS.
Figure 1.1 Serial numbers of the optical interfaces on the front panel of the RPC02 on the NMS
Interface on the Front Panel

Serial Number of the NMS Interface

LINE

SYS

MON

18.5.10 Technical Specifications


The technical specifications of the RPC02 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1572 Parameters Specified for Optical Interfaces


Table 18-28 lists the parameters specified for the optical interfaces of the RPC02.
Figure 1.1 Parameters specified for the optical interfaces of the RPC02
Parameter

Value

Pump wavelength (nm)

1400 to 1500

Operating wavelength (nm)

1529 to 1561

Maximum pump power (dBm)

29.5

Gain on the G.652 fiber (dB)

> 10

Gain on the LEAF fiber (dB)

NA

Equivalent noise figure on the G.652 fiber (dB)

NA

Equivalent noise figure on the LEAF fiber (dB)

NA

Polarization dependent loss (dB)

0.5

Type of output connector

LSH/APC or LC/PC

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1.1.1.1.1573 Laser Safety Class


The safety class of the laser on the board is Class 4. The maximum launched optical power of
the optical interfaces is more than 27 dBm (500 mW).

1.1.1.1.1574 Mechanical Specifications


The mechanical specifications of the RPC02 are as follows:

Dimensions (mm): 76.0 (W) x 218.5 (D) x 345.0 (H)

Weight (kg): 4.2

1.1.1.1.1575 Power Consumption


The maximum power consumption of the RPC02 at room temperature (25C) is 110 W.

18.6 OBU1
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the OBU1 (optical booster amplifier board).

18.6.1 Version Description


The OBU1 is available in the following functional version: TN11.

18.6.2 Application
The OBU1 is an optical booster amplifier board that amplifies optical signals.
The OBU1 is available in two types, namely, OBU101 and OBU103. The OBU101 is used at
the receive end and the OBU103 is used at the transmit end. Figure 18-26 shows the position
of the OBU1 in an optical transmission system.
Figure 1.1 Position of the OBU1 in an optical transmission system
Transmitting

Transmitting

OBU103

OBU101

Receiving

Receiving

18.6.3 Functions and Features


The OBU1 supports the online optical performance monitoring function, gain lock, transient
control, and other functions.
Table 18-29 provides the functions and features of the OBU1.

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Figure 1.1 Functions and features of the OBU1


Function and
Feature

OBU1

Basic functions

Amplifies a maximum of 40 channels of optical signals with the


channel spacing of 100 GHz at the same time.
Supports the system to transmit services over different fiber spans
without electrical regeneration.

Typical gain

The typical gain of the OBU101 is 20 dB and the typical gain of the
OBU103 is 23 dB.

Online optical
performance
monitoring
function

Provides the online monitoring interface. A small amount of optical


signal can be transmitted to the spectrum analyzer through the
interface so that the spectrum and optical performance of the
multiplexed optical signal can be monitored without a service
interruption.

Gain lock function

The EDFA inside the board has the gain lock function. When one or
more channels are added or dropped, or optical signals of certain
channels fluctuate, the signal gain of other channels is not affected.

Transient control
function

The EDFA inside the board has the transient control function. When
channels are added or dropped, the board can suppress the fluctuation
of the optical power in the path to realize the smooth upgrading and
expansion.

Performance
events and alarms
monitoring

Checks and reports the optical power.


Controls the temperature of the pump laser.
Detects the pump driving current, back facet current, cooling current,
temperature of the pump laser, and ambient temperature of the board.

The OBU1 is available in two types, namely, OBU101 and OBU103. The OBU101 is used at the receive
end and the OBU103 is used at the transmit end.

18.6.4 Working Principle and Signal Flow


The OBU1 consists of the EDFA optical module, splitter, driving and detecting module,
communication and control module, and power supply module.
Figure 18-27 shows the functional block diagram of the OBU1.

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Figure 1.1 Functional block diagram of the OBU1

Splitter

EDFA optical module


IN

OUT
Driving
current

MON

Detect the pump


current and
temperature.

PIN

Driving and detecting module

Control
Memory

CPU

Communication

Communication and control module


Power supply
module
Voltages required
by the board

Fuse

DC power provided
by the backplane

Backplane
(controlled
by the
SCC
SCC)

1.1.1.1.1576 Signal Flow


The OBU1 receives the multiplexed optical signals, which are amplified by the EDFA optical
module. Then, the OBU1 sends the amplified optical signals to the splitter and transmits the
signals through the OUT interface. The OBU1 also sends a few supervisory signals to the test
instrument for online optical performance monitoring.

1.1.1.1.1577 EDFA Optical Module


The EDFA optical module amplifies the input optical signals. The EDFA optical module
adopts the automatic gain control technology. Hence, the gain of each operating wavelength
signal can remain in the allowed range.

1.1.1.1.1578 Splitter
The splitter splits one channel of optical signals from the EDFA optical module into two
channels of signals of different power. One channel of signals is transmitted through the OUT
interface to the main optical path. The other channel of signals is transmitted to the MON
interface for spectrum detection and supervising.
The power of the MON interface is 1/99 of the power of the OUT interface. That is, the power
of the MON interface is 20 dB less than the power of the OUT interface.

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1.1.1.1.1579 Driving and detecting module

Detects the optical power of the service signals in real time.

Detects the driving current, back facet current, cooling current, and operating
temperature of the pump inside the pump optical module in real time.

Drives the pump laser inside the pump optical module.

Reports alarms and performance events to the logic and control module.

1.1.1.1.1580 Communication and control Module

The communication and control module controls and monitors the functional modules of
the board, and manages the communication.

The communication and control module collects the alarms, performance events,
working status, voltage detection information, and other information of each functional
module of the board, and reports the collected information to the SCC.

The communication and control module receives the commands issued by the SCC to
control and coordinate the operation of each functional module.

1.1.1.1.1581 Power supply module


Converts the DC power provided by the backplane into the power required by each module of
the board.

18.6.5 Front Panel


The front panel of the OBU1 has indicators, interfaces, and a laser safety class label.

1.1.1.1.1582 Diagram of the Front Panel


Figure 18-28 shows the appearance of the front panel of the OBU1.

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Figure 1.1 Front panel of the OBU1

OBU1
STAT
ACT
PROG
SRV
LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

MON
OUT
IN

OBU1

1.1.1.1.1583 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1584 Interfaces
The front panel of the OBU1 has three optical interfaces. Table 18-30 describes the types and
usage of the optical interfaces of the OBU1.

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Figure 1.1 Optical interfaces of the OBU1


Interface

Type of
Interface

Usage

IN

LC

Receives the multiplexed signals to be amplified.

OUT

LC

Transmits the amplified multiplexed signals.

MON

LC

Is connected to the test instrument to monitor the inservice performance.

18.6.6 Valid Slots


The OBU1 can be installed in slots 18 and 1117 in the main subrack.

18.6.7 Feature Code


The feature code of the OBU1 contains six characters, which indicate the gain and maximum
nominal input optical power of the optical signals processed by the OBU1.
Table 18-31 describes the feature code of the OBU1.
Figure 1.2 Feature code of the OBU1
Feature Code

Indication

Description

The first character

Is always "G".

The second and third


characters

Gain

Indicates the gain.

The fourth character

Is always "I".

The fifth and sixth


characters

Maximum nominal input


optical power

Indicates the maximum


nominal input optical power.

Consider the TN11OBU1 whose feature code is "G23I-3" as an example. "G23I-3" indicates
that the gain is 23 dB and the maximum nominal input optical power is -3 dBm.

18.6.8 Parameter Settings


You can set the parameters for the OBU1 by using the U2000.
You can set the following parameters for the OBU1 by using the U2000:

Threshold of input power loss

Laser status

Gain

Nominal gain upper threshold

Nominal gain lower threshold

Rated optical power

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Configure band

Configure working band parity

Actual band

Actual working band parity

18 Optical Amplifier Boards and Dispersion


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For the description of each parameter, see 26 Parameter Settings.

18.6.9 Technical Specifications


The technical specifications of the OBU1 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1585 Parameters Specified for Optical Interfaces


Table 18-32 lists the parameters specified for the optical interfaces of the OBU1.
Figure 1.1 Parameters specified for the optical interfaces of the OBU1
Parameter

Value
TN11OBU101

TN11OBU103

Operating wavelength range


(nm)

1529 to 1561

1529 to 1561

Nominal input power range


(dBm)

-32 to -4

-32 to -3

Input power range per


channel (dBm)

40
channe
ls

-32 to -20

-32 to -19

80
channe
ls

-32 to -23

-32 to -22

40
channe
ls

-20

-19

80
channe
ls

-23

-22

40
channe
ls

80
channe
ls

-3

Noise figure (dB)

5.5

6.0

Nominal gain (dB)

20

23

Gain response time on

< 10

< 10

Nominal singlewavelength input


optical power (dBm)

Nominal singlewavelength output


optical power (dBm)

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Parameter

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Compensation Boards

Value
TN11OBU101

TN11OBU103

Channel gain (dB)

201.5

231.5

Gain flatness (dB)

2.0

2.0

Input reflectance (dB)

< -40

< -40

Output reflectance (dB)

< -40

< -40

Pump leakage at input (dBm)

< -30

< -30

Maximum reflectance tolerance


at input (dB)

-27

-27

Maximum reflectance tolerance


at output (dB)

-27

-27

Maximum total output optical


power (dBm)

16

20

Multi-channel gain slope


(dB/dB)

2.0

2.0

Polarization dependent loss (dB)

0.5

0.5

VI-VO (dB)

Inhere
nt
inserti
on loss

1.5

Dyna
mic
attenua
tion
range

20

adding/dropping of channels
(ms)

Adjustment accuracy (dB)

1.1.1.1.1586 Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power
of the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

1.1.1.1.1587 Mechanical Specifications


The mechanical specifications of the OBU1 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.3

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1.1.1.1.1588 Power Consumption

The maximum power consumption of the TN11OBU101 at room temperature (25C) is


16 W.

The maximum power consumption of the TN11OBU103 at room temperature (25C) is


13 W.

18.7 OBU2
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the TN12OBU2 (optical booster amplifier board).

18.7.1 Version Description


The OBU2 is available in the following functional version: TN12.

18.7.2 Application
OBU2 boards are optical booster amplifier boards, and they are available in only one type:
OBU205.
Figure 18-29 shows the position of OBU2 boards in an optical transmission system.
Figure 1.1 Position of OBU2 boards in an optical transmission system
Transmitting

Transmitting

Receiving

OBU2

OBU2

Receiving

18.7.3 Functions and Features


The OBU2 supports the online optical performance monitoring function, gain lock, transient
control, and other functions.
Table 18-33 provides the functions and features of the OBU2.
Figure 1.1 Functions and features of the OBU2
Function and
Feature

OBU2

Basic functions

Amplifies a maximum of 40 channels of optical signals with the


channel spacing of 100 GHz at the same time.
Supports the system to transmit services over different fiber spans
without electrical regeneration.

Typical gain
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The typical gain of the OBU205 is 23 dB.


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Function and
Feature

OBU2

Online optical
performance
monitoring
function

Provides the online monitoring interface. A small amount of optical


signal can be transmitted to the spectrum analyzer through the
interface so that the spectrum and optical performance of the
multiplexed optical signal can be monitored without a service
interruption.

Gain lock function

The EDFA inside the board has the gain lock function. When one or
more channels are added or dropped, or optical signals of certain
channels fluctuate, the signal gain of other channels is not affected.

Transient control
function

The EDFA inside the board has the transient control function. When
channels are added or dropped, the board can suppress the fluctuation
of the optical power in the path to realize the smooth upgrading and
expansion.

Performance
events and alarms
monitoring

Checks and reports the optical power.


Controls the temperature of the pump laser.
Detects the pump driving current, back facet current, cooling current,
temperature of the pump laser, and ambient temperature of the board.

The OBU2 is available in only one type: OBU205.

18.7.4 Working Principle and Signal Flow


The OBU2 consists of the EDFA optical module, splitter, driving and detecting module,
communication and control module, and power supply module.
Figure 18-30 shows the functional block diagram of the OBU2.

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Figure 1.1 Functional block diagram of the OBU2


Splitter

EDFA optical module

IN

Driving
current

VO

OUT
MON

VOA

Detect the pump


current and
temperature.

PIN

Driving and detecting module

VI

Control
Memory

CPU

Communication

Communication and control module


Power supply
module
Voltages required
by the board

Fuse

DC power provided
by the backplane

Backplane
(controlled by the
SCC
SCC)

1.1.1.1.1589 Signal Flow


One channel of multiplexed optical signal received through the IN interface is input to the
EDFA optical module. The EDFA optical module amplifies the optical power of the signal and
locks the gain of the signal. Then, the amplified multiplexed signal is output through the OUT
interface. The VI interface receives the multiplexed signals sent from the upstream station.
After the optical power adjustment by VOA, the signals are transmitted through the VO
interface. Then the IN interface receives the adjusted multiplexed signals too.

1.1.1.1.1590 EDFA Optical Module


The EDFA optical module amplifies the input optical signals. The EDFA optical module
adopts the automatic gain control technology. Hence, the gain of each operating wavelength
signal can remain in the allowed range.

1.1.1.1.1591 Splitter
The splitter splits one channel of optical signals from the EDFA optical module into two
channels of signals of different power. One channel of signals is transmitted through the OUT
interface to the main optical path. The other channel of signals is transmitted to the MON
interface for spectrum detection and supervising.
The power of the MON interface is 1/99 of the power of the OUT interface. That is, the power
of the MON interface is 20 dB less than the power of the OUT interface.

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1.1.1.1.1592 Driving and detecting module

Detects the optical power of the service signals in real time.

Detects the driving current, back facet current, cooling current, and operating
temperature of the pump inside the pump optical module in real time.

Drives the pump laser inside the pump optical module.

Reports alarms and performance events to the logic and control module.

1.1.1.1.1593 Communication and control Module

The communication and control module controls and monitors the functional modules of
the board, and manages the communication.

The communication and control module collects the alarms, performance events,
working status, voltage detection information, and other information of each functional
module of the board, and reports the collected information to the SCC.

The communication and control module receives the commands issued by the SCC to
control and coordinate the operation of each functional module.

1.1.1.1.1594 Power supply module


Converts the DC power provided by the backplane into the power required by each module of
the board.

18.7.5 Front Panel


The front panel of the OBU2 has indicators, interfaces, and a laser safety class label.

1.1.1.1.1595 Diagram of the Front Panel


Figure 18-31 shows the appearance of the front panel of the OBU2.

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Figure 1.1 Front panel of the OBU2

OBU2
STAT
ACT
PROG
SRV

CAUTION
HAZARDLEVEL1MINVISIBLE
LASERRADIATION
DONOTVIEWDIRECTLYWITH
NON-ATTENUATINGOPTICALINSTRUMENTS

MO
N
OUT
I
N
V
O
V
I

OBU2

1.1.1.1.1596 Indicators
The front panel of the board has the following indicators:

Board hardware status indicator (STAT) two colors (red and green)

Service activation status indicator (ACT) one color (green)

Board software status indicator (PROG) two colors (red and green)

Service alarm indicator (SRV) three colors (red, green, and yellow)

For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1597 Interfaces
The front panel of the OBU2 has five optical interfaces. Table 18-34 describes the types and
usage of the optical interfaces of the OBU2.

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Figure 1.1 Optical interfaces of the OBU2


Interface

Type of
Interface

Usage

IN

LC

Receives the multiplexed signals to be amplified.

OUT

LC

Transmits the amplified multiplexed signals.

MON

LC

Is connected to the test instrument to monitor the inservice performance.

VO

LC

Transmits the adjusted multiplexed signal to the IN


interface.

VI

LC

Receives the multiplexed signal to be adjusted.

18.7.6 Valid Slots


An OBU2 board occupies two slots and can be installed in slots 2-8 and 12-17 in a subrack.
Although an OBU2 board occupies two adjacent slots, the slot ID shown on the NMS is the ID of the
right-side slot. This is because the connector at the rear of the OBU2 board fits into the backplane
through the right-side slot only.

18.7.7 Feature Code


The feature code of the OBU2 contains six characters, which indicate the gain and maximum
nominal input optical power of the optical signals processed by the OBU2.
Table 18-35 describes the feature code of the OBU2.
Figure 1.2 Feature code of the OBU2
Feature Code

Indication

Description

The first character

Is always "G".

The second and third


characters

Gain

Indicates the gain.

The fourth character

Is always "I".

The fifth and sixth


characters

Maximum nominal input


optical power

Indicates the maximum


nominal input optical power.

Consider the TN12OBU2 whose feature code is "G23I00" as an example. "G23I00" indicates
that the gain is 23 dB and the maximum nominal input optical power is 0 dBm.

18.7.8 Parameter Settings


You can set the parameters for the OBU2 by using the U2000.
You can set the following parameters for the OBU2 by using the U2000:
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Threshold of input power loss

Laser status

Gain

Nominal gain upper threshold

Nominal gain lower threshold

Rated optical power

Configure band

Configure working band parity

Actual band

Actual working band parity

18 Optical Amplifier Boards and Dispersion


Compensation Boards

For the description of each parameter, see 26 Parameter Settings.

18.7.9 Technical Specifications


The technical specifications of the OBU2 include the parameters specified for optical
interfaces, laser safety class, mechanical specifications, and power consumption.

1.1.1.1.1598 Parameters Specified for Optical Interfaces


Table 18-36 lists the parameters specified for the optical interfaces of the OBU2.
Figure 1.1 Parameters specified for the optical interfaces of the OBU2
Parameter

Value
OBU205

Operating wavelength range (nm)

1529 to 1561

Nominal input power range (dBm)

-24 to 0

Input power range per channel


(dBm)

Nominal single-wavelength input


optical power (dBm)

Nominal single-wavelength output


optical power (dBm)

40
channels

-24 to -16

80
channels

-24 to -19

40
channels

-16

80
channels

-19

40
channels

80
channels

Noise figure (dB)

7.0

Nominal gain (dB)

23

Gain response time on adding/dropping of

< 10

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Compensation Boards

Parameter

Value
OBU205

channels (ms)
Channel gain (dB)

231.5

Gain flatness (dB)

2.0

Input reflectance (dB)

< -40

Output reflectance (dB)

< -40

Pump leakage at input (dBm)

< -30

Maximum reflectance tolerance at input (dB)

-27

Maximum reflectance tolerance at output (dB)

-27

Maximum total output optical power (dBm)

23

Multi-channel gain slope (dB/dB)

2.0

Polarization dependent loss (dB)

0.5

VI-VO (dB)

Adjustment accuracy (dB)

Inherent
insertion
loss

1.5

Dynamic
attenuation
range

20

1.1.1.1.1599 Laser Safety Class


The safety class of the laser on the board is Class 1M. The maximum launched optical power
of the optical interfaces is within the range from 10 dBm (10 mW) to 22.15 dBm (164 mW).

1.1.1.1.1600 Mechanical Specifications


The mechanical specifications of the OBU2 are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 1.6

1.1.1.1.1601 Power Consumption

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The maximum power consumption of the TN12OBU205 at room temperature (25C) is


14 W.

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Compensation Boards

18.8 DCU
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the DCU (dispersion compensation board).

18.8.1 Version Description


The DCU is available in the following functional versions: N1 and N2. The difference
between the two versions is with regard to the insertion attenuation and compensation.
Table 18-37 describes the versions of the DCU.
Figure 1.1 Versions of the DCU
Item

Description

Functional versions

The DCU is available in two functional versions, namely, N1 and


N2.

Commonness

The working principle of the N1DCU is the same as the working


principle of the N2DCU.

Differences

The insertion loss of the N2DCU is 3 to 5 dB less than the insertion


loss of the N1DCU.
In the case of the N1DCU, two compensation modes are available,
namely, 60 km and 80 km. In the case of the N2DCU, three
compensation modes are available, namely, 40 km, 60 km, and 80
km.

Substitution

Use attenuators to prevent overloaded optical power when you use


the N2DCU to substitute for the N1DCU.

18.8.2 Application
The DCU is a dispersion compensation board. The DCU compensates for the dispersion that
is accumulated in the fiber during the transmission of the optical signals in the 10 Gbit/s
system, and compresses optical signal pulse. In this manner, the optical signals that are
transmitted can be restored. In addition, the DCU can realize long-haul optical transmission
when it works with an optical amplifier board.
During the long-haul transmission (more than 80 km) of 10 Gbit/s signals, the pulse width of
the optical signals is expanded and the signals are severely distorted due to the impact of
dispersion. As a result, the optical signals cannot be normally received by the optical receiver.
Therefore, the DCU is required to compensate for the dispersion. Figure 18-32 shows the
position of the DCU in an optical transmission system.

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Compensation Boards

Figure 1.1 Position of the DCU in an optical transmission system


Pulse broadening Pulse compression

PA

Optical
receiver

Optical
transmitter

BA

DCU
1550.12 nm

1550.12 nm

The operating wavelength of the chirp grating of the DCU is 1550.12 nm. Therefore, the central
wavelength of the optical signals transmitted by the optical interface board on the opposite end must also
be 1550.12 nm. Otherwise, the dispersion of the optical signals cannot be compensated for and the
insertion loss is high. As a result, no optical signals can be transmitted.

18.8.3 Functions and Features


The DCU can compensate for the dispersion for a maximum of two channels of optical
signals. The DCU can be used with the BA and PA.
Table 18-38 provides the functions and features of the DCU.
Figure 1.2 Functions and features of the DCU
Function
and Feature

N1DCU

N2DCU

Basic
functions

Compensates for the dispersion of a


maximum of two channels of
optical signals at the same time.
Supports the compensated
dispersion of 1020 ps/nm (for the
dispersion caused by the 60 km
G.652 optical fiber), 1360 ps/nm
(for the dispersion caused by the 80
km G.652 optical fiber), or any
combination.

Compensates for the dispersion of a


maximum of two channels of optical
signals at the same time. Supports
the compensated dispersion of 680
ps/nm (for the dispersion caused by
the 40 km G.652 optical fiber), 1020
ps/nm (for the dispersion caused by
the 60 km G.652 optical fiber), 1360
ps/nm (for the dispersion caused by
the 80 km G.652 optical fiber), or
any combination.

Dispersion
compensatio
n method

Compensates for the dispersion accumulated during the transmission by


using the chirp grating and suppresses the pulse signals to restore the
optical signals.

Long haul
transmission
with optical
regeneration

Realizes long haul transmission with optical regeneration when working


with the BA and PA.

18.8.4 Working Principle and Signal Flow


The DCU consists of the dispersion compensation module.
Figure 18-33 shows the functional block diagram of the DCU.
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Figure 1.1 Functional block diagram of the DCU


IN

Dispersion compensation

OUT

module

The dispersion compensation module is used behind the PA to provide optical signals of
required compensation and path penalty.

18.8.5 Front Panel


The front panel of the DCU has interfaces, and a laser safety class label.

1.1.1.1.1602 Diagram of the Front Panel


Figure 18-34 shows the appearance of the front panel of the one-interface DCU.

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Figure 1.1 Front panel of the one-interface DCU

DCU

CLASS 1
LASER
PRODUCT

OUT
IN

DCU

Figure 18-35 shows the appearance of the front panel of the two-interface DCU.

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Figure 1.2 Front panel of the two-interface DCU

DCU

CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2 IN2

DCU

1.1.1.1.1603 Interfaces
The front panel of the one-interface DCU has one optical interface. The optical interface
transmits and receives one channel of optical signals.
The front panel of the two-interface DCU has two optical interfaces. The optical interfaces
transmit and receive two channels of optical signals.

If the front panel of the one-interface DCU has two LC optical interfaces, only the upper
optical interface (IN1/OUT1) is valid. In the case of the DCU whose front panel has two LC
optical interfaces, determine whether the DCU is a one-interface DCU or a two-interface
DCU according to 18.8.7 Feature Code.

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Table 18-39 describes the type and usage of the optical interface of the one-interface DCU.
Figure 1.1 Optical interface of the one-interface DCU
Interface

Type of
Interface

Usage

IN

LC

Receives one channel of optical signals.

OUT

LC

Transmits one channel of optical signals.

Table 18-40 describes the types and usage of the optical interfaces of the two-interface DCU.
Figure 1.2 Optical interfaces of the two-interface DCU
Interface

Type of
Interface

Usage

IN1

LC

Receives the first channel of optical signals.

OUT1

LC

Transmits the first channel of optical signals.

IN2

LC

Receives the second channel of optical signals.

OUT2

LC

Transmits the second channel of optical signals.

18.8.6 Valid Slots


The slots valid for the DCU vary with the cross-connect capacity and subrack of the OptiX
OSN equipment.
The slots valid for a board are determined by the following factors:

Slot bandwidth

Cross-connect capacity

Board version

The slots valid for the DCU are as follows:

When the cross-connect capacity is 200 Gbit/s, the DCU can be installed in slots 18 and
1117 in the subrack.

18.8.7 Feature Code


The number code that follows the board name in the bar code is the feature code of the board.
The feature code of the DCU indicates the compensated dispersion for the optical signals.
Table 18-41 provides the relationship between the feature code of the DCU and the
compensated dispersion.

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Figure 1.3 Relationship between the feature code of the DCU and the compensated dispersion
Board

Feature Code

Compensated Dispersion

SSN1DCU01

01

Compensated dispersion for a single channel: 60


km

SSN1DCU02

02

Compensated dispersion for a single channel: 80


km

SSN1DCU03

03

Compensated dispersion for dual channels: 60


km/60 km

SSN1DCU04

04

Compensated dispersion for dual channels: 80


km/80 km

SSN1DCU05

05

Compensated dispersion for dual channels: 60


km/80 km

SSN2DCU01

01

Compensated dispersion for a single channel: 40


km

SSN2DCU02

02

Compensated dispersion for a single channel: 60


km

SSN2DCU03

03

Compensated dispersion for a single channel: 80


km

SSN2DCU04

04

Compensated dispersion for dual channels: 40


km/40 km

SSN2DCU05

05

Compensated dispersion for dual channels: 60


km/60 km

SSN2DCU06

06

Compensated dispersion for dual channels: 80


km/80 km

SSN2DCU07

07

Compensated dispersion for dual channels: 40


km/60 km

SSN2DCU08

08

Compensated dispersion for dual channels: 40


km/80 km

SSN2DCU09

09

Compensated dispersion for dual channels: 60


km/80 km

18.8.8 Technical Specifications


The technical specifications of the DCU include the parameters specified for optical
interfaces, mechanical specifications, and power consumption.

1.1.1.1.1604 Parameters Specified for Optical Interfaces


Table 18-42 lists the parameters specified for the optical interfaces of the DCU.

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Compensation Boards

Figure 1.1 Parameters specified for the optical interfaces of the DCU
Parameter

Value

Nominal bit rate

9953280 kbit/s

Line code pattern

NRZ

Central wavelength
(nm)

1550.120.05

-0.5 dB bandwidth
(nm)

> 0.4

Compensated
dispersion (ps/nm)

N1DCU: 1020 (60 km); 1360 (80 km)

Insertion loss (dB)

Less than 8.3 dB in the case of the N1DCU and less than 3 dB in
the case of the N2DCU

N2DCU: 680 (40 km); 1020 (60 km); 1360 (80 km)

1.1.1.1.1605 Laser Safety Class


The safety class of the laser on the board is Class 1. The maximum launched optical power of
the optical interfaces is less than 10 dBm (10 mW).

1.1.1.1.1606 Mechanical Specifications


The mechanical specifications of the DCU are as follows:

Dimensions (mm): 25.4 (W) x 235.2 (D) x 261.4 (H)

Weight (kg): 0.4

1.1.1.1.1607 Power Consumption


The maximum power consumption of the DCU at room temperature (25C) is 0 W.

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19 Power Boards

19

Power Boards

About This Chapter


This topic describes the power boards such as the UPM, PIU and PIUA.
19.1 UPM
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the UPM (uninterruptible power module).
19.2 PIU
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PIU (power interface board).
19.3 PIUA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PIUA (power interface board).
19.4 PIUB
The PIUB board is the power interface unit between the DC power distribution box and each
board on the subrack. This section describes the versions, functions, working principle, front
panel, configuration, and technical specifications of the PIUB board.

19.1 UPM
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the UPM (uninterruptible power module).

19.1.1 Version Description


None.

19.1.2 Application
The UPM is an external uninterruptible power module. The UPM can directly convert 110
V/220 V AC mains power into -48 V DC power required by the transmission equipment. The
UPM is suitable for the telecom carriers who cannot provide -48 V DC power supply or
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requires batteries.
Figure 19-1 shows the application of the UPM on the OptiX OSN equipment series.
Figure 1.1 Application of the UPM on the OptiX OSN equipment series
OptiX OSN equipment
110 V/220 V

Backplane

-48 V

UPM

PIU
Board A

-48 V
PIU

Board B
-48 V

Table 19-1 shows different mapping policies of UPM.


Figure 1.1 Mapping policies of UPM on the OptiX OSN 3500
Type of Subrack

Mapping PDU

Mapping PIU

Mapping UPM

General OptiX OSN


3500 subrack

N1PDU, DPD100-28 PDU

N1PIU, N1PIUA

EPS75-4815AF

Enhanced OptiX
OSN 3500 subrack
(1100 W)

N1PDU, DPD100-28 PDU

N1PIUA

EPS75-4815AF

OptiX OSN 3500


type III subrack
(2300 W)

TN51PDU, DPD638-8 PDU

N1PIUB

EPS75-4815AF

19.1.3 Functions and Features


The UPM is a special power supply system and is numbered EPS75-4815AF. The UPM can
directly convert 110 V/220 V AC power into 48 V DC power that the transmission
equipment requires. The UPM is suitable for the telecom carriers who cannot provide 48 V
DC power for the equipment or telecom carriers who require storage batteries.
The UPM consists of the rectifier module, monitoring module, and DC/AC power distribution
frame. The rectifier module and monitoring module are hot-swappable so that faulty modules
can be replaced without the system being shut down.
The output power of a single EPS75-4815AF power system is 1700 W. The EPS75-4815AF
power system is 3U high. Figure 19-2 shows the appearance of the EPS75-4815AF power
system.

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Figure 1.1 Appearance of the EPS75-4815AF power system

The UPM power box can be installed in an ETSI cabinet.


The storage batteries of the UPM work with one EPS75-4815AF power system. When the
external AC power system supplies power normally, the batteries store power. When the 110
V/220 V AC power supply is interrupted, the batteries can supply power for 3 to 4 hours. To
supply power to the OptiX OSN equipment, only one power system is required to be
connected to the batteries.
The full configuration of an EPS75-4815AF power system includes five rectifier modules and
one monitoring module.
The storage batteries do not belong to the EPS75-4815AF power system. They need to be configured
separately. If the batteries are required, a battery cabinet is provided generally or a dedicated space in the
equipment cabinet is reserved for the batteries.

Table 19-2 provide the functions and features of the UPM.


Figure 1.2 Functions and features of the EPS75-4815AF power system
Function and
Feature

EPS75-4815AF

Hot-swappable
function

The AC/DC rectifier module of the UPM is hot-swappable. When


you replace a faulty rectifier module, the other rectifier module can
still work normally. Therefore, the maintainability of the system is
improved.

Storage battery
protection function

The UPM provides the storage battery protection function. When


the mains supply is interrupted, the power system of the equipment
automatically switches to the storage battery, which ensures that the
equipment operates normally. The battery module provides a
capacity of 40 to 500 Ah. The default capacity is 65 Ah.

Lightning-proof
function

The rectifier module is embedded with the lightning-proof


protector. The rectifier module can bear 5 lightning-simulated
surges with an 8/20 s current waveform at the amplitude of 5 kA.
When the lightning current enters the rectifier module along with
the power cable, install category-C and category-B light arresters
before you connect the AC mains supply to the power system to
prevent the overvoltage caused by the direct lightning strike from

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Function and
Feature

19 Power Boards

EPS75-4815AF
damaging the rectifier module.

19.1.4 Working Principle and Signal Flow


The UPM is fed by one 110 V/220 V AC mains power supply. The rectifier module converts
the input power into 48 V DC voltage to provide four DC branches and one battery branch.
The UPM consists of the rectifier module and the monitoring module. Figure 19-3 shows the
block diagram of the UPM.
Figure 1.1 Block diagram of the UPM
110 V/220 V AC

Rectifier
module

48 V DC

PIU

Monitoring
module

System control unit

1.1.1.1.1608 Rectifier Module


The rectifier module converts the 110 V/220 V AC mains power supply into 48 V DC
voltage required by the transmission equipment.

1.1.1.1.1609 Monitoring Module


When the UPM works normally, the monitoring module controls the rectifier module, storage
battery loop, and load loop, which work according to the preset parameters or user settings.
The monitoring module also monitors the status and data of the rectifier module, storage
battery loop, and load loop.
In the case of a mains supply failure, the equipment is fed by the storage battery group that is
connected to the UPM. The battery group must be connected to the UPM before the mains
supply fails. When the batteries start to discharge due to a mains supply failure, the
monitoring module reports the no-mains-supply alarm. With the discharge of the batteries, the
battery voltage starts to drop. When the battery voltage is lower than 45 V, the monitoring
module reports the DC undervoltage alarm. When the battery voltage reaches 43 V, the battery
group enables the power-off protection function to interrupt the connection between the
battery group and the equipment. As a result, the batteries are automatically protected.
When the mains supply is restored, the UPM resumes normal operations.

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19.1.5 Front Panel


The front panel of the UPM has indicators and ports of many types.

1.1.1.1.1610 Diagram of the Front Panel


Figure 19-4 shows the front panel of the EPS75-4815AF power system (subject to the UPM
onsite).
Figure 1.1 Front panel of the EPS75-4815AF power system
1

5 6

14

11

12

10

13

15

1. Control circuit breaker of


the AC input (30 A)

2. Control circuit breaker of


the battery branch (80 A)

3. Control circuit breaker of


load 1 (10 A)

4. Control circuit breaker of


load 2 (30 A)

5. Control circuit breaker of


load 3 (40 A)

6. Control circuit breaker of


load 4 (40 A)

7. AC phase line terminal

8. AC zero line terminal

9. Negative 48 V terminal of
the battery branch

10. Negative 48 V terminal


of the load branch

11. Positive 48 V terminal


of the battery branch

12. Positive 48 V terminal of


the load branch

13. Connecting terminal of


the PGND cable

14. DB44 signal port

15. Communication port


(COM)

1.1.1.1.1611 Indicators of the EPS75-4815AF


The front panel of each rectifier module has the following indicators:

Running status indicator (RUN) one color (green)

Alarm and protection indicator (ALM) one color (yellow)

Faulty state indicator (FAULT) one color (red)

The front panel of the monitoring module has the following indicators:

Power supply system fault indicator (ALM) one color (red)

Power supply system status indicator (RUN) one color (green)

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For the meanings of the status of the indicators, see 23 Indicators.

1.1.1.1.1612 Ports of the EPS75-4815AF Power System


The front panel of the EPS75-4815AF has six ports. Table 19-3 describes the types and usage
of these ports.
Figure 1.1 Ports of the EPS75-4815AF power system
Port

Type

Usage

Power input port

Power port

"7" and "8" indicate the AC mains input


terminals, which receive 110 V/220 V AC
power.

Power output port

Power port

The power output ports are in the lower left


corner on the front panel of the UPM. The
terminals indicated by "9" and "11" form a
battery port, through which the power system
is connected to the battery input socket at the
back of the storage battery box through a
battery cable. "10" and "12" indicate the output
ports of four loads. The output ports can
supply power to the OptiX OSN equipment by
using power cables.

Connecting
terminal of the
PGND cable

Power port

The UPM is grounded through the cabinet.

DB44 signal port

DB44

The backplane of the subrack can be connected


to the sensor transfer box (an optional device)
through the DB44 signal port and to the
monitoring module through the 96-pin DIN
connector. In addition, the sensor transfer box
can be connected to multiple sensors. As a
result, the monitoring function is extended.

Communication
port (COM)

RJ-45

Reserved

Switch button

Button

The switch buttons are on the left of the UPM,


as shown in Figure 19-4. "1" indicates the
control circuit breaker of the AC input (30 A),
which enables and disables the input of the AC
mains supply. "2", "3", "4", and "5" indicate
the load control switches, which enable and
disable the load output.

Table 19-4 provides the definition of DB44 signal pins.

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Figure 1.2 Definition of DB44 signal pins


Pin Diagram

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Pin

Definitio
n

Function

Pin

Definiti
on

Function

24 V

Auxiliary power
output

23

SMOK
E

Smoke sensor

12 V

Auxiliary power
output

24

WATER

Water damage detection

12 V

Auxiliary power
output

25

DOOR

Door status switch (DSS)


signal detection

GND

Signal ground

26

WIRE

Distribution frame
connection

GND

Signal ground

27

JK1+

Positive terminal of dry


contact 1

SIM1

Voltage
detection of the
first battery pack

28

JK1-

Negative terminal of dry


contact 1

SIM2

Voltage
detection of the
second battery
pack

29

JK2+

Positive terminal of dry


contact 2

30

JK2-

Negative terminal of dry


contact 2

31

CONT1
O+

Positive terminal for output


control of optical coupler 1

10

GND

Signal ground

32

CONT1
O-

Negative terminal for output


control of optical coupler 1

11

VHUM

Ambient
humidity
measurement

33

CONT2
O+

Positive terminal for output


control of optical coupler 2

12

VBTEM
1

Battery
temperature
measurement 1

34

CONT2
O-

Negative terminal for output


control of optical coupler 2

13

VBTEM
2

Battery
temperature
measurement 2

35

FANCT
R1+

Positive terminal for fan


rotation control

14

VTEM1

Ambient
temperature
measurement 1

36

FANCT
R1-

Negative terminal for fan


rotation control

15

VTEM2

Ambient
temperature
measurement 2

37

JKM1+

Positive terminal for a surge


protector failure alarm

16

JTD1

Backup 1

38

JKM1-

Negative terminal for a surge

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Pin Diagram

Pin

Definitio
n

Function

19 Power Boards

Pin

Definiti
on

Function
protector failure alarm

17

JTD2

Backup 2

39

JKM2+

Positive terminal for an AC


power-off alarm

18

JTD3

Backup 3

40

JKM2-

Negative terminal for an AC


power-off alarm

19

JTD4

Backup 4

41

JKM3+

Positive terminal for a


battery undervoltage alarm

20

JTD5

Backup 5

42

JKM3-

Negative terminal for a


battery undervoltage alarm

21

JTD6

Backup 6

43

JKM4+

Positive terminal for power


supply system failure

22

JTD7

Backup 7

44

JKM4-

Negative terminal for power


supply system failure

19.1.6 Valid Slots


The UPM is case shaped. Hence, the UPM does not occupy a slot in the subrack.

19.1.7 Technical Specifications


The technical specifications of the UPM include the power parameters and mechanical
specifications.
The equipment supports the 110 V/220 V power supply through an uninterrupted power
modules (UPM). The UPM is used to convert 110 V/220 V AC into -48 V DC, and to provide
power supply for the equipment.
The type of UPM supported by the OptiX OSN equipment is EPS75-4815AF. If the 110
V/220 V AC power fails, the storage battery can provide power supply for 4 hours.

1.1.1.1.1613 Power Parameters


Table 19-5 lists the power parameters of the UPM.
Figure 1.1 Power parameters of the EPS75-4815AF
Parameter

Value

Voltage range of
the AC input

90-290 V AC

AC input

One single-phase three-wire system: 45-65 Hz

Rated input current

28 A

Output nominal
voltage

53.50.5 V

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Parameter

Value

Rated output
current

DC output branches

19 Power Boards

Load MCB 1: 10 A
Load MCB 2: 3 0A
Load MCB 3: 40 A
Load MCB 4: 40 A
Battery MCB: 80 A

Total output DC current

37.53 A to 753 A

Regulated voltage
precision

1%

Non-balance of
load sharing

5% (50%-100% load)

Rated efficiency of
the integrated
equipment

89%

Power factor

0.99 (nominal input or output)

Peak-to-peak noise
voltage

200mV (within the range of 20 MHz)

Electrical network
adjustment rate

0.1%

Lightning
protection
performance

When the UPM works alone, the input end can bear the simulated
lightning surge current whose waveform is 8/20s and amplitude is 5
kA for five times in both directions. The interval between two surges
must not be less than one minute. If the lightning surge current is
higher than the preceding indexes, the UPM may be damaged and
cannot work normally.

Cooling method

The fan that is embedded in the rectifier module cools the module.

1.1.1.1.1614 Mechanical Specifications


The mechanical specifications of the EPS75-4815AF are as follows:

Dimensions of the UPM (mm): 133mm (W) x 255mm (D) x 436mm (H)

Weight: 15 kg

19.2 PIU
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PIU (power interface board).

19.2.1 Version Description


The PIU is available in one functional version, namely, N1. The N1PIU is discontinued.
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19.2.2 Application
The PIU is a power interface board that is mainly used to receive the power supply for the
OptiX OSN equipment.
Figure 19-5 shows the application of the PIU on the OptiX OSN equipment series.
Figure 1.1 Application of the PIU on the OptiX OSN equipment series
OptiX OSN equipment

-48 V

PIU
Backplane

-48 V

PIU

Board A

Board B
-48 V

-48 V

19.2.3 Functions and Features


The PIU is used to receive the power supply and to provide the lightning protection function
and filtering function.
Table 19-6 provides the functions and features of the PIU.
Figure 1.1 Functions and features of the PIU
Function and
Feature

PIU

Lightning
protection function

Provides the lightning protection function and reports the alarm that
indicates a surge protection failure.

Filtering function

Enhances the electromagnetic compatibility of the system by filtering


the power supply interface and shielding the structure of the board.

Power supply
interface

Provides two 50 W power interfaces for external devices such as the


COA.

Power supply of
the FAN

Provides the FAN with normal working voltages.

Alarm monitoring

Reports the board in-position alarm.

Power supply

Supports the 1+1 hot backup. Any one PIU can supply power to an

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Function and
Feature

PIU

backup

entire subrack.

19 Power Boards

One PIU can supply power to an entire subrack.

19.2.4 Working Principle and Signal Flow


The PIU consists of the power access unit, filtering unit, and unit that detects whether the
lightning-proof unit fails.
Figure 19-6 shows the functional block diagram of the PIU.
Figure 1.1 Functional block diagram of the PIU
COA power supply unit

Power
access
unit

Unit that detects


whether the
lightning-proof
unit f ails

Filtering
unit

Filtering
unit

Backplane

Alarm indicating a
lightning-proof unit f ailure
Sy stem controlunit

1.1.1.1.1615 Power Access Unit


This unit receives the 48 V or 60 V power supply for the system.

1.1.1.1.1616 Unit That Detects Whether the Lightning-Proof Unit Fails


This unit protects the equipment from overcurrent and lightning and reports the alarm that
indicates its failure to the SCC unit.

1.1.1.1.1617 Filtering Unit


This unit filters the electromagnetic interference signals to ensure that the equipment operates
stably.

19.2.5 Front Panel


The front panel of the PIU has power interfaces.

1.1.1.1.1618 Diagram of the Front Panel


Figure 19-7 shows the appearance of the front panel of the PIU.

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Figure 1.1 Front panel of the PIU

PIU

PWR

PS1

PS2

PIU

1.1.1.1.1619 Interfaces
The front panel of the PIU has two power interfaces. Table 19-7 describes the types and usage
of the interfaces of the PIU.
Figure 1.1 Interfaces of the PIU
Interface

Type of Interface

Usage

PWR

3V3 terminal

Receives the 48 V power supply.

PS1/PS2

Four-phase socket

Provides the 50 W power output and can supply


power to the COA.

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19.2.6 Valid Slots


The PIU can be installed in slots 27 and 28 in the subrack.

19.2.7 Technical Specifications


The technical specifications of the PIU include the mechanical specifications, power
consumption, input voltage, and fuse.

1.1.1.1.1620 Mechanical Specifications


The mechanical specifications of the PIU are as follows:

Dimensions (mm): 44.0 (W) x 125.2 (D) x 261.4 (H)

Weight: 1.2 kg

1.1.1.1.1621 Power Consumption


At room temperature (25C), the maximum power consumption of the PIU is 8W.

1.1.1.1.1622 Input Voltage


The input voltage range of the PIU is as follows:

If the standard voltage of the input power is -48 V, the power voltage ranges from -38.4
V to -57.6 V.

If the standard voltage of the input power is -60 V, the power voltage ranges from -48 V
to -72 V.

1.1.1.1.1623 Fuse
The main loop fuse F7 of the PIU is 250 V-20 A-0.00355 ohms.

19.3 PIUA
This topic describes the version, functions, working principle, front panel, valid slots, and
technical specifications of the PIUA (power interface board).

19.3.1 Version Description


The PIUA is available in one functional version, namely, N1.

19.3.2 Application
The PIUA is a power interface board that is mainly used to receive the power supply for the
OptiX OSN equipment.
Figure 19-8 shows the application of the PIUA on the OptiX OSN equipment series.

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Figure 1.1 Application of the PIUA on the OptiX OSN equipment series
OptiX OSN equipment

-48 V

PIUA
Backplane

-48 V

PIUA

Board A

Board B
-48 V

-48 V

19.3.3 Functions and Features


The PIUA is used to receive the power supply and to provide the lightning protection function
and filtering function.
Table 19-8 provides the functions and features of the PIUA.
Figure 1.1 Functions and features of the PIUA
Function and
Feature

PIUA

Lightning
protection function

Provides the lightning protection function and reports the alarm that
indicates a surge protection failure.

Filtering function

Enhances the electromagnetic compatibility of the system by filtering


the power supply interface and shielding the structure of the board.

Power supply
interface

Provides two 50 W power interfaces for external devices such as the


COA and hub.

Alarm monitoring

Reports the board in-position alarm.

Power supply
backup

Supports the 1+1 hot backup. Any one PIUA can supply power to the
entire subrack.

19.3.4 Working Principle and Signal Flow


The PIUA consists of the power access unit, filtering unit, and unit that detects whether the
lightning-proof unit fails.
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Figure 19-9 shows the functional block diagram of the PIUA.


Figure 1.1 Functional block diagram of the PIUA
Power
access
unit

Unit that detects


whether the lightningproof unit fails

Filtering
unit

Backplane

Alarm indicating a
lightning-proofunitfailure
System control unit

1.1.1.1.1624 Power Access Unit


This unit receives the 48 V or 60 V power supply for the system.

1.1.1.1.1625 Unit That Detects Whether the Lightning-Proof Unit Fails


This unit protects the equipment from overcurrent and lightning and reports the alarm that
indicates a lightning-proof unit failure to the SCC unit.

1.1.1.1.1626 Filtering Unit


This unit filters the electromagnetic interference signals to ensure that the equipment can
operate stably.

19.3.5 Front Panel


The front panel of the PIUA has indicators and power interfaces.

1.1.1.1.1627 Diagram of the Front Panel


Figure 19-10 shows the appearance of the front panel of the PIUA.

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Figure 1.1 Front panel of the PIUA

PIUA

POWER

NEG(-)
PWR
RTN(+)

PS1
RTN(+)

NEG(-)

PS2
RTN(+)

NEG(-)

PIUA

1.1.1.1.1628 Indicators
The front panel of the board has a power supply indicator (POWER). The POWER indicator
is green when it is on.
For the meanings of the status of the indicator, see 23 Indicators.

1.1.1.1.1629 Interfaces
The front panel of the PIUA has two power interfaces. Table 19-9 describes the types and
usage of the interfaces of the PIUA.
Figure 1.1 Interfaces of the PIUA
Interface

Type of Interface

Usage

PWR

3V3 terminal

Receives the 48 V power supply.

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Interface

Type of Interface

Usage

PS1/PS2

Four-phase socket

Provides the 50 W power output and can supply


power to the COA.

19.3.6 Valid Slots


The PIUA can be installed in slots 27 and 28 in the subrack.

19.3.7 Technical Specifications


The technical specifications of the PIUA include the mechanical specifications, power
consumption, input voltage, and the fuse.

1.1.1.1.1630 Mechanical Specifications


The mechanical specifications of the PIUA are as follows:

Dimensions (mm): 44.0 (W) x 125.2 (D) x 261.4 (H)

Weight: 0.5 kg

1.1.1.1.1631 Power Consumption


At room temperature (25C), the maximum power consumption of the PIUA is 3 W.

1.1.1.1.1632 Input Voltage


The input voltage range of the PIUA is as follows:

If the standard voltage of the input power is -48 V, the power voltage ranges from -38.4
V to -57.6 V.

If the standard voltage of the input power is -60 V, the power voltage ranges from -48V
to -72 V.

1.1.1.1.1633 Fuse
The main loop fuse of the PIUA is 250 V-32 A-0.00355 ohms.

19.4 PIUB
The PIUB board is the power interface unit between the DC power distribution box and each
board on the subrack. This section describes the versions, functions, working principle, front
panel, configuration, and technical specifications of the PIUB board.

19.4.1 Version Description


The PIUB is available in one functional version, namely, N1. The PIUB board only can be
used on a type III subrack (2300 W).

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19.4.2 Application
The PIUB board is a power interface board that provides power supply for the OptiX OSN
3500.
Figure 19-11 shows the application of the PIUB board in the OptiX OSN system.
Figure 1.1 Application of the PIUB board in the OptiX OSN system
OptiX OSN equipment

-48 V

PIU
Backplane

-48 V

PIU

Board A

Board B
-48 V

-48 V

19.4.3 Functions and Features


The PIUB is a power interface board that provides power supply, lightning protection, and
filtering functions.
Table 19-10 provides the functions and features of the PIUB board.
Figure 1.1 Functions and features of the PIUB board
Functions and
Features

Description

Lightning
protection function

Provides the lightning protection function and reports the alarm that
indicates a surge protection failure.

Filtering function

Enhances the electromagnetic compatibility of the system by filtering


the power supply interface and shielding the structure of the board.

Power supply
interface

Provides two 50 W power interfaces for external units such as the


COA.

Alarm monitoring

Reports the board in-position alarm.

Power supply
backup

Supports 1+1 hot backup. Any one PIUB can supply power to an
entire subrack.

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19.4.4 Working Principle and Signal Flow


The PIUB board consists of the filtering unit, protection unit, protection circuit failure
detecting unit, and power detecting unit.
Figure 19-12 shows the functional block diagram of the PIUB.
Figure 1.1 Functional block diagram of the PIUB
COA power supply interface
COA

NEG(-)

NEG(-)

Protection
unit

Filtering
unit
RTN(+)

RTN(+)
Protection
circuit failure
detecting unit

System control unit

Power
detecting
unit

LED
indication

1.1.1.1.1634 Filtering Unit


This unit filters the electromagnetic interference signals to ensure that the equipment operates
stably.

1.1.1.1.1635 Protection Unit


This unit protects the equipment from overcurrent and lightning.

1.1.1.1.1636 Protection Circuit Failure Detecting Unit


This unit monitors the protection unit and reports the alarm that indicates a protection unit
failure to the SCC unit.

1.1.1.1.1637 Power Detecting Unit


This unit checks whether the input power supply is valid, and uses the indicator to indicate the
status of the input power supply.

19.4.5 Front Panel


The front panel of the PIUB has indicators and power interfaces.

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1.1.1.1.1638 Diagram of the Front Panel


Figure 19-13 shows the appearance of the front panel of the PIUB board.
Figure 1.1 Front panel of the PIUB

PIUB
POWER

RTN(+)

NEG(-)

PS1
RTN(+)

NEG(-)

PS2
RTN(+)

NEG(-)

PIUB

1.1.1.1.1639 Indicators
The front panel of the board has a power supply indicator (POWER). The POWER indicator
is green when it is on.
For the meanings of the status of the indicator, see 23 Indicators.

1.1.1.1.1640 Interfaces
The front panel of the PIUB board has two power interfaces. Table 19-11 provides the types
and usage of the power interfaces of the PIUB board.

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Figure 1.1 Description of the interfaces on the PIUB board


Interface

Silkscreen

Type of
Interface

Usage

PWR

RTN(+),
NEG(-)

Dual-OT
terminal

Provides -48 V power input.

PWS

PS1, PS2

Four-phase
socket

Provides two 50 W power outputs for the


COA.

Table 19-12 provides the pin description of the PS1 and PS2 interfaces on the PIUB board.
Figure 1.2 Pin description of the PWS interfaces on the PIUB board
Front View

4
2

Pin

Usage

48 V

48 V

3
4

3
1

Grounding
Not defined

19.4.6 Valid Slots


The PIUB board can be installed in slots 27 and 28 on the subrack.

19.4.7 Technical Specifications


The technical specifications of the PIUB board include the mechanical specifications, power
consumption, input voltage.

1.1.1.1.1641 Mechanical Specifications


The mechanical specifications of the PIUB are as follows:

Dimensions (mm): 44.0 (W) x 125.2 (D) x 261.4 (H)

Weight (kg): 0.6

1.1.1.1.1642 Power Consumption


The maximum power consumption of the PIUB at room temperature (25C) is 6 W.

1.1.1.1.1643 Input Voltage


The input voltage range of the PIUB is as follows:

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If the standard voltage of the input power is -48 V, the power voltage ranges from -38.4
V to -57.6 V.

If the standard voltage of the input power is -60 V, the power voltage ranges from -48 V
to -72 V.

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20 Pluggable Optical Module

Pluggable Optical Module

About This Chapter


Certain boards on the OptiX OSN equipment supports the small form-factor pluggable (SFP),
enhanced small form-factor pluggable (eSFP), and 10 Gigabit small form-factor pluggable
(XFP) optical modules. When you need to adjust the type of accessed services or replace such
a faulty optical module, you just need to directly replace the pluggable optical module without
replacing its board.
20.1 Overview
The SFP/eSFP is a small form-factor pluggable optical transceiver. It is mainly used for SDH
optical communication and Ethernet data communication. The XFP is a 10-Gigabit small
form-factor pluggable optical transceiver. It is mainly for SDH optical communication,
GE/10GE data communication, and DWDM communication.
20.2 SFP/eSFP/SFP+
This topic describes the BOM number, name, specifications, and supported boards of the
SFP/eSFP optical modules.
20.3 XFP
This topic describes the BOM number, name, specifications, and supported boards of the XFP
optical modules.
20.4 CWDM/DWDM
This topic describes the BOM number, name, specifications, and supported boards of the
CWDM/DWDM optical modules.

20.1 Overview
The SFP/eSFP is a small form-factor pluggable optical transceiver. It is mainly used for SDH
optical communication and Ethernet data communication. The XFP is a 10-Gigabit small
form-factor pluggable optical transceiver. It is mainly for SDH optical communication,
GE/10GE data communication, and DWDM communication.

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1.1.1.1.1644 Appearance
Figure 20-1 shows the appearances of the SFP and eSFP optical modules, and Figure 20-2
shows the appearance of the XFP optical module.
Figure 1.1 SFP/eSFP optical module

The dimensions of the SFP and eSFP optical modules are 13.4 mm (W) x 56.5 mm (D) x 8.5
mm (H).
Figure 1.2 XFP optical module

The dimensions of the XFP optical module are 18.3 mm (W) x 78 mm (D) x 8.5 mm (H).

1.1.1.1.1645 BOM
The BOM of a pluggable optical module is used to identify different types of optical modules.
The BOM can be marked on a label that is attached to each pluggable optical module.
Figure 20-3 shows the label of a pluggable optical module.

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Figure 1.3 Label of a pluggable optical module

You can check the specifications of an optical module in this manual according to the BOM of the
optical module.

20.2 SFP/eSFP/SFP+
This topic describes the BOM number, name, specifications, and supported boards of the
SFP/eSFP optical modules.
Table 20-1 lists the BOM numbers and specifications of the SFP/eSFP optical modules.
Figure 1.1 Mapping table of the BOM numbers and the types of the SFP/eSFP optical modules
BOM
Numbe
r

Name

340605
88

2 Mbit/s eSFP
optical module

Optical transceiver, eSFP,


1310 nm, 2.048 Mb/s, 15
dBm, 8 dBm, 26 dBm, LC,
SM, 2 km

N1PFL1

340602
87

155 Mbit/s SFP


optical module

Optical transceiver, SFP,


1310 nm, STM1, -19 to -14
dBm, -30 dBm, LC, MM, 2
km

N1ADQ1, N1EFF8,
N1IDQ1, N1MST4,
N1SLQ1, N1SLQ1A,
N1IDQ1A, N1EFF8A,
N1PEFF8, R1PEF4F

340602
76

155 Mbit/s eSFP


optical module

Optical transceiver, eSFP,


1310 nm, STM1, -15 to -8
dBm, -31 dBm, LC, SM, 15
km

N1OU08, N1SL1, N2SL1,


N1SLQ1, N2SLQ1,
R1SLQ1, R1SL1, N1ADQ1,
N1EFF8, N1IDQ1, N1SLT1,
N2SLO1, N1SL1A,
N1SLQ1A, N1IDQ1A,
N3SLO1, R3SL1, R3SLQ1,
N1EFF8A, R1PCXLN,
N1CQ1, N1PEFF8,
R1PEF4F, N1EDQ41,
TNN1CO1, TNN1AFO1

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Specifications

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output Optical
Power-Maximum Output
Optical Power-Receiver
Sensitivity-Optical
Interface Type-Optical
Fiber Type-Transmission
Distance)

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BOM
Numbe
r

Name

20 Pluggable Optical Module

Specifications

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output Optical
Power-Maximum Output
Optical Power-Receiver
Sensitivity-Optical
Interface Type-Optical
Fiber Type-Transmission
Distance)

340602
81

Optical transceiver, eSFP,


1310 nm, STM1, -5 to 0
dBm, -37 dBm, LC, SM, 40
km

N1SL1, N2SL1, N1SLQ1,


N2SLQ1, N1ADQ1,
N1IDQ1, N2SLO1,
N1SL1A, N1SLQ1A,
N3SLO1, R1SL1, R3SL1,
R1SLQ1, R3SLQ1,
N1SLT1, R1PCXLN,
N1PEFF8, R1PEF4F,
N1EDQ41, TNN1CO1,
TNN1AFO1

340602
82

Optical transceiver, eSFP,


1550 nm, STM1, -5 to 0
dBm, -37 dBm, LC, SM, 80
km

N1SL1, N2SL1, N1SLQ1,


N2SLQ1, R1SLQ1, R1SL1,
N1ADQ1, N1IDQ1,
N1SL1A, N1SLQ1A,
N3SLO1, R3SL1, R3SLQ1,
N1SLT1, N1PEFF8,
R1PEF4F, N1EDQ41,
TNN1CO1, TNN1AFO1

Optical transceiver, eSFP,


1310 nm, STM4, -15 to -8
dBm, -30 dBm, LC, SM, 15
km

N1SL4, N2SL4, N1SL4A,


N1SLD4, N2SLD4,
N1SLD4A, N1SLQ4,
N2SLQ4, N1SLQ4A,
R1PCXLN, N1EDQ41,
R1SL4, R3SL4, R1SLD4,
R3SLD4, MST4

340602
80

Optical transceiver, eSFP,


1310 nm, STM4, -3 to 2
dBm, -30 dBm, LC, SM, 40
km

N2SLQ4, N2SL4, N1SL4,


N1SLD4, N2SLD4,
N1SLQ4, N2SLQ4, R1SL4,
R1SLD4, N1ADL4,
N1IDL4, N1MST4,
N1SL4A, N1SLD4A,
N1SLQ4A, R3SL4,
R3SLD4, R1PCXLN,
N1EDQ41

340602
84

Optical transceiver, eSFP,


1550 nm, STM4, -3 to
2dBm, -30 dBm, LC, SM,
80 km

N1SL4, N2SL4, N1SLD4,


N2SLD4, N1SLQ4,
N2SLQ4, R1SL4, R1SLD4,
N1ADL4, N1IDL4,
N1SL4A, N1SLD4A,
N1SLQ4A, N1SL4A,

340602
77

Issue 02 (2013-01-18)

622 Mbit/s eSFP


optical module

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1423

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

Specifications

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output Optical
Power-Maximum Output
Optical Power-Receiver
Sensitivity-Optical
Interface Type-Optical
Fiber Type-Transmission
Distance)
N1SLD4A, N1SLQ4A,
R3SL4, R3SLD4,
R1PCXLN, N1EDQ41

340602
85

Optical transceiver, eSFP,


1550 nm, STM4, -3 to +2
dBm, -36 dBm, LC, SM,
100 km

N1SL4, N2SL4, N1SL4A,


N1SLD4, N2SLD4,
N1SLD4A, N2SLQ4,
N1SLQ4A, R1SL4, R3SL4,
R1SLD4, R3SLD4

Optical transceiver, eSFP,


1310 nm, 1.25 Gbit/s, -9 to
-3 dBm, -20 dBm, LC, SM,
10 km

N2EGS2, N1EGT2,
N2EGR2, N2EMR0,
N1EGS4, N1EMS4,
N3EGS4, N2EGT2,
N3EGS2, N4EGS4,
N1EMS2, N1PEG16,
N1PEG8, R1PEGS1,
Q1PEGS2, TNN1EG8

340602
98

Optical transceiver, eSFP,


1310 nm, 1.25 Gbit/s, -5 to
-0 dBm, -23 dBm, LC, SM,
40 km

N2EGS2, N3EGS2,
N1EGT2, N2EGT2,
N2EGR2, N2EMR0,
N1EGS4, N3EGS4,
N4EGS4, N1EMS4,
N1EMS2, N1PEG16,
N1PEG8, R1PEGS1,
Q1PEGS2, TNN1EG8

340603
60

Optical transceiver, eSFP,


1550 nm, 1.25 Gbit/s, -2 to
5 dBm, -23 dBm, LC, SM,
80 km

N1EGT2, N3EGS2,
N2EGT2, N4EGS4,
N1PEG16, N1PEG8,
R1PEGS1, Q1PEGS2,
TNN1EG8

340604
87

Optical transceiver, eSFP,


1310 nm, 1.25 Gbit/s, -9.5
to -3 dBm, -20 dBm, LC,
SM, 10 km

TNN1EG16

Optical transceiver, eSFP,


850 nm, 2.125 Gbit/s (multi
rate), -9.5 to -2.5 dBm,
-17dBm, LC, MM, 0.5 km

N2EGS2, N1EGT2,
N2EMR0, N1EGS4,
N1EMS4, N3EGS4,
N2EGT2, N3EGS2,
N4EGS4, N1EMS2,

340604
73

340602
86

Issue 02 (2013-01-18)

1.25 Gbit/s eSFP


optical module

2.125 Gbit/s eSFP


optical module

Huawei Proprietary and Confidential


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Technologies Co., Ltd.

1424

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

Specifications

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output Optical
Power-Maximum Output
Optical Power-Receiver
Sensitivity-Optical
Interface Type-Optical
Fiber Type-Transmission
Distance)
N1PEG16, N1PEG8,
R1PEGS1, Q1PEGS2,
TNN1EG8

340603
17

Optical transceiver, eSFP,


850 nm, 2.125 Gbit/s (multi
rate), -9 to -3.5 dBm,
-18dBm, LC, MM, 0.5 km

TNN1EG16

Optical Transceiver, eSFP,


1310 nm, STM16, -5 to 0
dBm, -21 dBm, LC, SM, 15
km

N1SLD16, N2SLQ16

340602
88

Optical transceiver, eSFP,


1310 nm, STM16, -10 to -3
dBm, -21 dBm, LC, SM, 2
km

N1SLQ16, N2SLQ16,
N1SLD16

340604
84

Optical Transceiver, eSFP,


1310 nm, 155 Mbit/s to 2.67
Gbit/s, -10 to -3 dBm, -21
dBm, LC, SM, 2 km

N1SLO16, N4SLO16,
N4SLQ16, N3SL16A

340604
85

Optical transceiver, eSFP,


1310 nm, 155 Mbit/s to 2.67
Gbit/s, -5 to 0 dBm, -21
dBm, LC, SM, 15 km

N2SL16A, N3SL16A,
N1SLO16, N4SLO16,
R1PCXLN

340604
88

Optical transceiver, eSFP,


1550 nm, STM16, -2 to 3
dBm, -30 dBm, LC, SM, 80
km

N1SLQ16, N2SLQ16,
N2SL16A, N3SL16A,
N1SLD16, N1SLO16,
N4SLQ16, R1PCXLN

03030
GGV

OptiX HPLAT,
SSX2T1SA02, 2.5 Gbit/s
ESFP transceiver (-30 dBm
to -9 dBm, 1310 nm, 40 km,
-2 dBm to +3 dBm, LC)

N1SLD16, N1SLO16,
N4SLO16, N1SLQ16,
N2SLQ16, N4SLQ16,
N3SL16A

03030
GBQ

OptiX HPLAT,
SSX2T1SA01, 2.5 Gbit/s
ESFP transceiver (-31 dBm
to -9 dBm, 1550 nm, 1600
ps/nm, 80 km, -2 to +3

N4SLO16, N4SLQ16

340602
78

Issue 02 (2013-01-18)

2.5 Gbit/s eSFP


optical module

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Technologies Co., Ltd.

1425

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

Specifications

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output Optical
Power-Maximum Output
Optical Power-Receiver
Sensitivity-Optical
Interface Type-Optical
Fiber Type-Transmission
Distance)
dBm, LC)

1.1.1.1.1646 SFP+
Table 20-2 lists the BOM numbers and specifications of the SFP+ optical modules.
Figure 1.1 Mapping table of the BOM numbers and the types of the SFP+ optical modules
BOM
Numbe
r

Name

Specifications

340604
95

10 Gbit/s SFP+
optical module

Compatible Board

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output Optical
Power-Maximum Output
Optical Power-Receiver
Sensitivity-Optical
Interface Type-Optical
Fiber Type-Transmission
Distance)
Optical transceiver, SFP+,
1310 nm, 10 Gbit/s, -8.2 to
+0.5 dBm, -12.6 dBm, LC,
SM, 10 km

N3EAS2

1.1.1.1.1647 Single-Fiber Bidirectional Optical Module


Table 20-3 lists the BOM numbers and specifications of the single-fiber bidirectional eSFP
optical modules.

Issue 02 (2013-01-18)

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Copyright Huawei
Technologies Co., Ltd.

1426

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

20 Pluggable Optical Module

Figure 1.1 Mapping table of the BOM numbers and the types of the single-fiber bidirectional
SFP/eSFP optical modules
BOM
Numbe
r

Name

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output Optical
Power-Maximum Output
Optical Power-Receiver
Sensitivity-Optical
Interface Type-Optical
Fiber Type-Transmission
Distance)

Compatible Board

340606
39

155 Mbit/s singlefiber bidirectional


eSFP optical
module

BiDi transceiver, eSFP, Tx


1550 nm/Rx 1310 nm, 0.1 to
1.25Gb/s, -3 dBm, -2 dBm,
-25 dBm, LC, SM, 40 km

R1PEF4F, N1PEFF8,
TNN1EFF8

340606
38

BiDi transceiver, eSFP, Tx


1310 nm/Rx 1550 nm, 0.1 to
1.25Gb/s, -3 dBm, -2 dBm,
-25 dBm, LC, SM, 40 km

340603
64

BiDi transceiver, eSFP, Tx


1550 nm/Rx 1310 nm,
STM1, -15 dBm, -8 dBm,
-32 dBm, LC/PC, SM, 15
km

340603
63

BiDi transceiver, eSFP, Tx


1310 nm/Rx 1550 nm,
155M, -15 dBm, -8 dBm,
-32 dBm, LC/PC, SM, 15
km

340603
29

BiDi transceiver, eSFP, Tx


1550 nm/Rx 1310 nm,
155M, -5 dBm, -0 dBm, -32
dBm, LC/PC, SM, 40 km

340603
28

BiDi transceiver, eSFP, Tx


1310 nm/Rx 1550 nm,
155M, -5 dBm, -0 dBm, -32
dBm, LC/PC, SM, 40 km

340604
75

340604
70

340605
39
Issue 02 (2013-01-18)

1.25 Gbit/s
single-fiber
bidirectional
eSFP optical
module

BiDi transceiver, eSFP, Tx


1490 nm/Rx 1310 nm, 1.25
Gbit/s, -9 dBm, -3 dBm,
-19.5 dBm, LC, SM, 10 km

N1SLQ1, N1SLT1,
N1SLH1, R1SLQ1,
N1SL1A, N1OU08,
N3SLQ41

N1SLD4, N1SLQ4,
N1SL4A, N3SLQ41,
R1PEGS1, R1PEGS2,
N1PEG8, TNN1EG8

BiDi transceiver, eSFP, Tx


1310 nm/Rx 1490 nm, 1.25
Gbit/s, -9 dBm, -3 dBm,
-19.5 dBm, LC, SM, 10 km
BiDi transceiver, eSFP, Tx
1310 nm/Rx 1490 nm, 1.25

Huawei Proprietary and Confidential


Copyright Huawei
Technologies Co., Ltd.

R1PEGS1, R1PEGS2,
1427

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output Optical
Power-Maximum Output
Optical Power-Receiver
Sensitivity-Optical
Interface Type-Optical
Fiber Type-Transmission
Distance)

Compatible Board

Gbit/s, -2 dBm, -3 dBm, -23


dBm, LC, SM, 40 km

N1PEG8, TNN1EG8

340605
40

BiDi transceiver, eSFP, Tx


1490 nm/Rx 1310 nm, 1.25
Gbit/s, -2 dBm, -3 dBm, -23
dBm, LC, SM, 40 km

340605
95

BiDi transceiver, eSFP, Tx


1570 nm/Rx 1490 nm, 1.25
Gbit/s, -2 dBm, -4 dBm, -26
dBm, LC, SM, 80 km

340605
96

BiDi transceiver, eSFP, Tx


1490 nm/Rx 1570 nm, 1.25
Gbit/s, -2 dBm, -4 dBm, -26
dBm, LC, SM, 80 km

340606
21

340606
22

2.5 Gbit/s singlefiber bidirectional


SFP optical
module

BiDi transceiver, SFP, Tx


1490 nm/Rx 1310 nm, 2.5G,
-5 dBm to 0 dBm, -18 dBm,
LC, SMF, 15 km

N4SLQ16, N4SLO16

BiDi transceiver, SFP, Tx


1310 nm/Rx 1490 nm, 2.5G,
-5 dBm, 0 dBm, -18 dBm,
LC, SMF, 15 km

Optical module data is subject to product versions, so contact Huawei local office for latest data.

20.3 XFP
This topic describes the BOM number, name, specifications, and supported boards of the XFP
optical modules.
Table 20-4 lists the BOM numbers and specifications of the XFP optical modules.

Issue 02 (2013-01-18)

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Copyright Huawei
Technologies Co., Ltd.

1428

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

20 Pluggable Optical Module

Figure 1.2 Mapping table of the BOM numbers and the types of the XFP optical modules
BOM
Numbe
r

Name

Specifications

Compatible Board

340603
13

9.95 Gbit/s to
10.71 Gbit/s XFP
optical module

Optical transceiver, XFP,


1310 nm, 9.95 Gbit/s to
10.71 Gbit/s, -6 dBm to -1
dBm, -11 dBm, LC, SM, 10
km

N1SLD64, N1EAS2,
N4SL64, N1PEX1,
N2PEX1, N1PEX2,
TNN1EX2

03030J
CB

9.95 Gbit/s to
11.1 Gbit/s XFP
optical module

Optical transceiver, XFP,


1550 nm, 9.95 Gbit/s to 11.1
Gbit/s, -1 dBm to 2 dBm,
-17 dBm, LC, SM, 40 km

N1SLD64, N4SL64

340603
62

10.3 Gbit/s XFP


optical module

Optical transceiver, XFP,


850 nm, 10.3 Gbit/s, -7.3
dBm to -1.3 dBm, -7.5 dBm,
LC, MM, 0.3 km

N1PEX1

340603
22

9.95 Gbit/s to
11.1 Gbit/s XFP
optical module

Optical transceiver, XFP,


1550 nm, 9.95 Gbit/s to 11.1
Gbit/s, -1 dBm to 2 dBm,
-15 dBm, LC, SM, 40 km

N1PEX1, N2PEX1,
N1PEX2, TNN1EX2

340603
61

9.95 Gbit/s to
11.1 Gbit/s XFP
optical module

Optical transceiver, XFP,


1550 nm, 9.95 Gbit/s to 11.1
Gbit/s, 0 dBm to 4 dBm, -24
dBm, LC, SM, 80 km

N1PEX1, N2PEX1,
N1PEX2, TNN1EX2,
N4SL64

03030J
HE

10.71 Gbit/s XFP


optical module

Optical transceiver (-19


dBm to 0 dBm, 1550 nm,
800 ps/nm, -1 dBm to +2
dBm, 193.4 THz, LC/PC),
100 GHz spacing
wavelength, FEC, EA

N4SL64

(Name-Encapsulation
Form-Operating
Wavelength-RateMinimum Output Optical
Power-Maximum Output
Optical Power-Receiver
Sensitivity-Optical
Interface Type-Optical
Fiber Type-Transmission
Distance)

20.4 CWDM/DWDM
This topic describes the BOM number, name, specifications, and supported boards of the
CWDM/DWDM optical modules.

Issue 02 (2013-01-18)

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Technologies Co., Ltd.

1429

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

20 Pluggable Optical Module

1.1.1.1.1648 CWDM Optical Module


Table 20-5 lists the BOM numbers and specifications of the 2.5 Gbit/s CWDM eSFP optical
modules. Table 20-6 lists the BOM numbers and specifications of the 10 Gbit/s CWDM XFP
optical modules.
Figure 1.1 Mapping table of the BOM numbers and the types of the 2.5 Gbit/s CWDM eSFP
optical modules
BOM
Numbe
r

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

340604
83

2.5 Gbit/s
CWDM eSFP
optical module

Transceiver, eSFP, 1471 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

N3SLH41, N1SL4A,
N3SLQ41, N3SL16A,
N1PEG8, N4SLO16,
N4SLQ16, TNN1EG8

340604
81

Transceiver, eSFP, 1491 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
79

Transceiver, eSFP, 1511 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
82

Transceiver, eSFP, 1531 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
78

Transceiver, eSFP, 1551 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
76

Transceiver, eSFP, 1571 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
77

Transceiver, eSFP, 1591 nm,


100 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -28 dBm, LC,
80 km

340604
80

Transceiver, eSFP, 1611 nm,


100 Mbit/s to 2.67 Gbit/s, 0

Issue 02 (2013-01-18)

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Technologies Co., Ltd.

1430

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

dBm, 5 dBm, -28 dBm, LC,


80 km
340604
16

Transceiver, eSFP, 1471 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
17

Transceiver, eSFP, 1491 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
18

Transceiver, eSFP, 1511 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
19

Transceiver, eSFP, 1531 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
20

Transceiver, eSFP, 1551 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
21

Transceiver, eSFP, 1571 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
22

Transceiver, eSFP, 1591 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

340604
23

Transceiver, eSFP, 1611 nm,


125 Mbit/s to 2.67 Gbit/s, 0
dBm, 5 dBm, -19 dBm, LC,
single mode, 40 km

Issue 02 (2013-01-18)

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Technologies Co., Ltd.

N1PEG16, R1PEGS1,
Q1PEGS2, N1PEG8,
TNN1EG8

1431

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

20 Pluggable Optical Module

Figure 1.2 Mapping table of the BOM numbers and the types of the 10 Gbit/s CWDM XFP
optical modules
BOM
Numbe
r

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

340605
47

9.95 Gbit/s to
11.1 Gbit/s
CWDM XFP
optical module

Transceiver, XFP, 1471 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

TNN1EX2, N4SL64,
N4SLD64, N1PEX2,
N2PEX1

340605
48

Transceiver, XFP, 1491 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

340605
49

Transceiver, XFP, 1511 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

340605
50

Transceiver, XFP, 1531 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

340605
51

Transceiver, XFP, 1551 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

340605
52

Transceiver, XFP, 1571 nm,


9.95 Gbit/s to 11.1 Gbit/s, 1
dBm, 4 dBm, -23 dBm, LC,
70 km

340605
53

Transceiver, XFP, 1591 nm,


9.95 Gbit/s to 11.1 Gbit/s, 0
dBm, 3 dBm, -21 dBm, LC,
70 km

340605
54

Transceiver, XFP, 1611 nm,


9.95 Gbit/s to 11.1 Gbit/s, 0
dBm, 3 dBm, -21 dBm, LC,
70 km

Issue 02 (2013-01-18)

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Technologies Co., Ltd.

1432

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

20 Pluggable Optical Module

1.1.1.1.1649 DWDM Optical Module


Table 20-7 lists the BOM numbers and specifications of the 2.5 Gbit/s DWDM eSFP optical
modules. Table 20-8 lists the BOM numbers and specifications of the 10 Gbit/s DWDM XFP
optical modules.
Figure 1.1 Mapping table of the BOM numbers and the types of the 2.5 Gbit/s DWDM eSFP
optical modules
BOM
Numbe
r

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

340603
66

2.5 Gbit/s
DWDM eSFP
optical module

Optical transceiver, eSFP,


1560.61 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

N3SLH41, N1SL4A,
N3SLQ41, N3SL16A,
N1PEG8, TNN1EG8,
N1SF16E, N4SLO16,
N4SLQ16

340603
72

Optical transceiver, eSFP,


1559.79 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
73

Optical transceiver, eSFP,


1558.98 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
74

Optical transceiver, eSFP,


1558.17 nm, 125 Mbit/s to
2.67 G bit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
75

Optical transceiver, eSFP,


1557.36 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
76

Optical transceiver, eSFP,


1556.55 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
77

Optical transceiver, eSFP,


1555.75 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
78

Optical transceiver, eSFP,


1554.94 nm, 125 Mbit/s to

Issue 02 (2013-01-18)

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Technologies Co., Ltd.

1433

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

2.67 Gbit/s, 1 dBm, 3 dBm,


-28 dBm, LC, 120 km
340603
79

Optical transceiver, eSFP,


1554.13 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
80

Optical transceiver, eSFP,


1553.33 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
81

Optical transceiver, eSFP,


1552.52 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
82

Optical transceiver, eSFP,


1551.72 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
83

Optical transceiver, eSFP,


1550.92 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
84

Optical transceiver, eSFP,


1550.12 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
85

Optical transceiver, eSFP,


1549.32 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
86

Optical transceiver, eSFP,


1548.51 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
87

Optical transceiver, eSFP,


1547.72 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,

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1434

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

-28 dBm, LC, 120 km


340603
88

Optical transceiver, eSFP,


1546.92 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
89

Optical transceiver, eSFP,


1546.12 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
90

Optical transceiver, eSFP,


1545.32 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
91

Optical transceiver, eSFP,


1544.53 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
92

Optical transceiver, eSFP,


1543.73 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
93

Optical transceiver, eSFP,


1542.94 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
94

Optical transceiver, eSFP,


1542.14 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
95

Optical transceiver, eSFP,


1541.35 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
96

Optical transceiver, eSFP,


1540.56 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

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1435

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

340603
97

Optical transceiver, eSFP,


1539.77 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
98

Optical transceiver, eSFP,


1538.98 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340603
99

Optical transceiver, eSFP,


1538.19 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
00

Optical transceiver, eSFP,


1537.40 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
01

Optical transceiver, eSFP,


1536.61 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
02

Optical transceiver, eSFP,


1535.82 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
03

Optical transceiver, eSFP,


1535.04 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
04

Optical transceiver, eSFP,


1534.25 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
05

Optical transceiver, eSFP,


1533.47 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604

Optical transceiver, eSFP,

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Compatible Board

1436

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

06

1532.68 nm, 125 Mbit/s to


2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
07

Optical transceiver, eSFP,


1531.90 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
08

Optical transceiver, eSFP,


1531.12 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
09

Optical transceiver, eSFP,


1530.33 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

340604
10

Optical transceiver, eSFP,


1529.55 nm, 125 Mbit/s to
2.67 Gbit/s, 1 dBm, 3 dBm,
-28 dBm, LC, 120 km

Compatible Board

Figure 1.2 Mapping table of the BOM numbers and the types of the 10 Gbit/s DWDM XFP
optical modules
BOM
Numbe
r

Name

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

03030J
GQ

9.95 Gbit/s to
11.1 Gbit/s
DWDM XFP
optical module

Optical transceiver, XFP,


1560.61 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

N1SL64, N1PEX2,
N2PEX1, N4SL64,
TNN1EX2

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1437

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

03030J
GR

Optical transceiver, XFP,


1559.79 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GS

Optical transceiver, XFP,


1558.98 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GT

Optical transceiver, XFP,


1558.17 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GU

Optical transceiver, XFP,


1557.36 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GV

Optical transceiver, XFP,


1556.55 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GW

Optical transceiver, XFP,


1555.75 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GX

Optical transceiver, XFP,


1554.94 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
GY

Optical transceiver, XFP,


1554.13 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HA

Optical transceiver, XFP,


1553.33 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J

Optical transceiver, XFP,

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Compatible Board

1438

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

HB

1552.52 nm, 9.95 Gbit/s to


11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HC

Optical transceiver, XFP,


1551.72 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HD

Optical transceiver, XFP,


1550.92 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HE

Optical transceiver, XFP,


1550.12 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HF

Optical transceiver, XFP,


1549.32 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HG

Optical transceiver, XFP,


1548.51 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HH

Optical transceiver, XFP,


1547.72 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HJ

Optical transceiver, XFP,


1546.92 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HK

Optical transceiver, XFP,


1546.12 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HL

Optical transceiver, XFP,


1545.32 nm, 9.95 Gbit/s to

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Compatible Board

1439

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

11.1 Gbit/s, -1 dBm, 2 dBm,


-19 dBm, LC, SM, 40 km
03030J
HM

Optical transceiver, XFP,


1544.53 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HN

Optical transceiver, XFP,


1543.73 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HP

Optical transceiver, XFP,


1542.94 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HQ

Optical transceiver, XFP,


1542.14 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HR

Optical transceiver, XFP,


1541.35 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HS

Optical transceiver, XFP,


1540.56 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HT

Optical transceiver, XFP,


1539.77 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HU

Optical transceiver, XFP,


1538.98 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HV

Optical transceiver, XFP,


1538.19 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,

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1440

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

Compatible Board

-19 dBm, LC, SM, 40 km


03030J
HW

Optical transceiver, XFP,


1537.40 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HX

Optical transceiver, XFP,


1536.61 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
HY

Optical transceiver, XFP,


1535.82 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JA

Optical transceiver, XFP,


1535.04 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JB

Optical transceiver, XFP,


1534.25 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JC

Optical transceiver, XFP,


1533.47 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JD

Optical transceiver, XFP,


1532.68 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JE

Optical transceiver, XFP,


1531.90 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JF

Optical transceiver, XFP,


1531.12 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

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1441

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

03030J
JG

Optical transceiver, XFP,


1530.33 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

03030J
JH

Optical transceiver, XFP,


1529.55 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 2 dBm,
-19 dBm, LC, SM, 40 km

340605
33

Optical transceiver, XFP,


1551.72 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
01

Optical transceiver, XFP,


1550.92 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
02

Optical transceiver, XFP,


1550.12 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
14

Optical transceiver, XFP,


1549.32 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
31

Optical transceiver, XFP,


1548.51 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
34

Optical transceiver, XFP,


1532.68 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
03

Optical transceiver, XFP,


1531.90 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605

Optical transceiver, XFP,

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Compatible Board

N1PEX2, N2PEX1,
N4SLD64, N4SL64,
TNN1EX2

1442

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

BOM
Numbe
r

Name

20 Pluggable Optical Module

(Name, Encapsulation
Form, Operating
Wavelength, Rate,
Minimum Output Optical
Power, Maximum Output
Optical Power, Receiver
Sensitivity, Optical
Interface Type, Optical
Fiber Type, Transmission
Distance)

04

1531.12 nm, 9.95 Gbit/s to


11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
15

Optical transceiver, XFP,


1530.33 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

340605
32

Optical transceiver, XFP,


1529.55 nm, 9.95 Gbit/s to
11.1 Gbit/s, -1 dBm, 3 dBm,
-24 dBm, LC, SM, 80 km

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Compatible Board

1443

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

21

21 Pluggable Electrical Module

Pluggable Electrical Module

A pluggable electrical module is used at an SFP interface to transmit/receive electrical signals.

1.1.1.1.1650 Appearance
Figure 21-1 and Figure 21-2 show the appearance of the SFP electrical module.
Figure 1.1 Appearance of the GE SFP electrical module

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1444

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

21 Pluggable Electrical Module

Figure 1.2 Appearance of the STM-1 SFP electrical module

1.1.1.1.1651 SFP electrical module


Table 21-1lists the BOM numbers and specifications of the pluggable electrical modules.
Figure 1.1 Mapping table of the BOM numbers and the types of the electrical modules
BOM Number

Name

Specifications

Compatible Board

34100052

1000BASE-T SFP
electrical module

1000BASE-T
(RJ45) SFP
electrical module,
100 m

TNN1EG8,
N1PEG8,
TNN1ETMC,
Q1PEGS2,
R1PEGS1, N3EGS2,
N2EGT2, N1EGS4,
N4EGS4, N1EMS4,
N1EMS2

34100104

STM-1 SFP
electrical module

Electrical active
module, electrical
transceiver, SFP,
STM-1e

N1OU08

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OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

22 Cables

22

Cables

About This Chapter


This topic describes the cables that the equipment uses, including the fiber jumper, power
cable, alarm cable, management cable, signal cable, and clock cable.
22.1 Fiber Jumper
This topic describes the categories and connectors of the fiber jumpers.
22.2 Power Cable and Ground Cable
The power cables and ground cables include the cabinet power cable, subrack power cable,
COA power cable, and ground cable of the cabinet door.
22.3 Alarm Cable
The alarm cables that the equipment uses include the cabinet indicator cable, alarm cascading
cable, and alarm input/output cable.
22.4 Management Cable
The management cables include the serial cable, ordinary phone line, COA cascading cable,
and network cable.
22.5 Signal Cable
The signal cables include the E1/E3 signal cable, framed E1 signal cable, and Nx64 kbit/s
signal cable.
22.6 Clock Cable
The clock cables include the 75-ohm/120-ohm clock cable and clock transit cable.

22.1 Fiber Jumper


This topic describes the categories and connectors of the fiber jumpers.

22.1.1 Categories of the Fiber Jumpers


The OptiX OSN equipment uses various types of fiber jumpers.
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OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

22 Cables

Table 22-1 lists the categories of the fiber jumpers that the OptiX OSN equipment uses.
Figure 1.2 Categories of the fiber jumpers that the OptiX OSN equipment uses
Usage

Connector
1

Connector
2

Fiber

Available Length

Used to connect
the OptiX OSN
equipment to the
ODF or to
connect an
interface board
of the OptiX
OSN equipment
to other
equipment

LC/PC

FC/PC

2 mm singlemode fiber

6 m, 10 m, 20 m, 30
m, and 50 m

2 mm multimode fiber

3 m, 5 m, 10 m, 20 m,
30 m, and 50 m

2 mm singlemode fiber

5 m, 10 m, 20 m, 30
m, and 50 m

2 mm multimode fiber

10 m, 20 m, 30 m,
and 50 m

Used to connect
the OptiX OSN
equipment

LC/PC

SC/PC

SC/PC

SC/PC

2 mm singlemode fiber

2 m, 5 m, 10 m, 20 m,
30 m, 50 m, and 80 m

LC/PC

LC/PC

2 mm singlemode fiber

1.5 m, 3 m, 5 m, 10
m, 20 m, and 30 m

2 mm multimode fiber

3 m, 5 m, 10 m, 20 m,
and 30 m

LC/PC

FC/PC

2 mm singlemode fiber

6 m, 10 m, 20 m, 30
m, and 50 m

LC/PC

SC/PC

2 mm multimode fiber

5 m, 10 m, 20 m, 30
m, and 50 m

Select the fiber connector and fiber length according to the on-site survey.

22.1.2 Connector
The OptiX OSN equipment uses various types of fiber connectors.
The four types of fiber connectors are described as follows:

Most of the optical interfaces on the front panels of the boards are the LC/PC optical
interfaces. See Figure 22-1.

The N2OU08 and 61COA provide the SC/PC optical interfaces.

The "IN" interface on the case-shaped 62COA that is externally installed uses the
LSH/APC connector. See Figure 22-4.

Generally, the ODF on the client side provides the FC/PC or SC/PC optical interface.
Figure 22-3 and Figure 22-2 show the corresponding FC/PC and SC/PC fiber connectors.

Table 22-2 describes the four types of fiber connectors.

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1447

OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

22 Cables

Figure 1.3 Types of fiber connectors


Type of Internal
Fiber Connector

Description

LC/PC

Plug-in square fiber connector/protruding polished

LSH/APC

Connector with a dust-proof cover/protruding polished (eight


degrees)

FC/PC

Round fiber connector/protruding polished

SC/PC

Square fiber connector/protruding polished

1.1.1.1.1652 LC/PC Fiber Connector


Figure 22-1 shows the appearance of the LC/PC fiber connector.
Figure 1.1 Appearance of the LC/PC fiber connector

The axial operation instead of rotation is required to insert or remove an LC/PC fiber
connector.
To insert a fiber jumper that uses an LC/PC connector, align the head of the fiber jumper with
the optical interface and apply proper force. To remove the fiber jumper, first, press the clip,
then, slightly push the fiber connector inward, and finally, pull out the connector.

1.1.1.1.1653 SC/PC Fiber Connector


Figure 22-2 shows the appearance of the SC/PC fiber connector.

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Figure 1.2 Appearance of the SC/PC fiber connector

1.1.1.1.1654 FC/PC Fiber Connector


Figure 22-3 shows the appearance of the FC/PC fiber connector.
Figure 1.3 Appearance of the FC/PC fiber connector

1.1.1.1.1655 LSH/APC Fiber Connector


Figure 22-4 shows the appearance of the LSH/APC fiber connector.
Figure 1.4 Appearance of the LSH/APC fiber connector

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22.2 Power Cable and Ground Cable


The power cables and ground cables include the cabinet power cable, subrack power cable,
COA power cable, and ground cable of the cabinet door.

22.2.1 Power Cable of the Cabinet


The -48 V power cable, BGND power cable, and PGND power cable are used to supply
power to the equipment in a cabinet. One end of the power cable is connected to the power
distribution cabinet and the ground bar in the equipment room, and the other end is connected
to the DC PDU at the top of the cabinet.

1.1.1.1.1656 Structure
Figure 22-5 shows the structure of the -48 V/BGND power cable of the cabinet. Figure 22-6
and Figure 22-7 show the structure of the PGND power cable of the cabinet.
Figure 1.1 Structure of the -48 V/BGND power cable of the cabinet
1

1. Cord end terminal

2. Bare crimping terminal - type OT

3. Cable tie

Figure 1.2 Structure of the PGND power cable of the cabinet (JG2)

1. Bare crimping terminal - type OT

2. Cable tie

3. Bare crimping terminal (JG2)

4. Heat shrink tubing

5. Main label

6. Wire

7. Heat shrink tubing

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Figure 1.3 Structure of the PGND power cable of the cabinet (OT)

1. Bare crimping terminal - type OT

2. Cable tie

3. Bare crimping terminal (OT)

4. Heat shrink tubing

5. Main label

6. Wire

7. Heat shrink tubing

1.1.1.1.1657 Technical Specifications


Figure 1.1 Technical specifications of the cabinet power cable
Item
-48 V power
cable of the
cabinet

BGND power
cable of the
cabinet

PGND power
cable of the
cabinet

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Description
Terminal 2
(telecommu
nications
room side)

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2

Terminal 1
(PDU side)

Single cord end terminal - 0.024 m - insertion depth of 12


mm - 80 A - green - 16 mm2/25 mm2

Cable type

Power cable - 450 V/750 V - blue - 85 A - 16 mm2/25 mm2

Terminal 2

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2

Terminal 1

Single cord end terminal - 0.024 m - insertion depth of 12


mm - 80 A - green - 16 mm2/25 mm2

Cable type

Power cable - 450 V/750 V - black - 16 mm2/25 mm2

Terminal 1

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2

Terminal 3

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2

Cable type

Power cable - 450 V/750 V - yellow/green - 16 mm2/25


mm2

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Item

Description

Fireproof class

IEC60332-3A

Length

Determined by the site survey result.

1.1.1.1.1658 Structure
Figure 22-8 shows the structure of the -48 V/BGND power cable of the cabinet. Figure 22-9
shows the structure of the PGND power cable of the cabinet.
Figure 1.4 Structure of the -48 V/BGND power cable

1. Bare crimping terminal (OT)

2. Cord end terminal

Figure 1.5 Structure of the PGND power cable

1. Bare crimping terminal (OT)

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1.1.1.1.1659 Technical Specifications


Figure 1.1 Technical specifications of the cabinet power cable
Item
-48 V power
cable of the
cabinet

BGND power
cable of the
cabinet

PGND power
cable of the
cabinet

Description
Terminal 2
(telecommu
nications
room side)

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2/35 mm2

Terminal 1
(PDU side)

Bare crimping terminal - type JG2 - M6 - tin plated round bare terminal - 16 mm2/25 mm2/35 mm2

Cable type

Power cable - 450 V/750 V - blue - 16 mm2/25 mm2/35


mm2

Terminal 2

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2/35 mm2

Terminal 1

Bare crimping terminal - type JG2 - M6 - tin plated round bare terminal - 16 mm2/25 mm2/35 mm2

Cable type

Power cable - 450 V/750 V - black - 16 mm2/25 mm2/35


mm2

Terminal 1

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2/35 mm2

Terminal 3

Bare crimping terminal - type OT - M8 - tin plated - round


bare terminal - 16 mm2/25 mm2/35 mm2

Cable type

Power cable - 450 V/750 V - yellow/green - 16 mm2/25


mm2/35 mm2

Fireproof class

IEC60332-3A

Length

Determined by the site survey result.

1.1.1.1.1660 Structure
Figure 22-10 shows the structure of the -48 V/BGND power cable of the cabinet. Figure 2211 shows the structure of the PGND power cable of the cabinet.
Figure 1.6 Structure of the -48 V/BGND power cable
Bare crimping terminal (JG2)

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Bare crimping terminal (type OT)

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Figure 1.7 Structure of the PGND power cable

1. Bare crimping terminal (OT)

2. Cord end terminal

1.1.1.1.1661 Technical Specifications


Figure 1.1 Technical specifications of the cabinet power cable
Item

Description

Terminal

Bare crimping terminal - type JG2 - 25 mm2 -M6 - 95 A - in plated


Bare crimping terminal - type OT - 25 mm2- M8 - tin plated - round
bare terminal

Select cables with proper cross-sectional areas according to the required length of cabinet power cables:

If the length of the cabinet power cable is required to be not more than 20 m, select the cable with a
cross-sectional area of 16 mm2.

If the length of the cabinet power cable is required to be in the range from 21 m to 30 m, select the
cable with a cross-sectional area of 25 mm 2.

If the length of the cabinet power cable is required to be in the range from 31 m to 50 m, select the
cable with a cross-sectional area of 35 mm 2.

1.1.1.1.1662 Pin Assignments


None.

22.2.2 Ground Cable of the Cabinet Door


The ground cable of the cabinet door grounds the front door, rear door and side panels of the
cabinet. The ground cables of the cabinet door are correctly connected before delivery.

1.1.1.1.1663 Structure
Figure 22-12 shows the structure of the ground cable of the cabinet door.

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Figure 1.1 Structure of the ground cable of the cabinet door

1. Bare crimping terminal - type OT

2. Heat shrink tubing

3. Main label

1.1.1.1.1664 Pin Assignments


None.

1.1.1.1.1665 Technical Specifications


Item

Description

Terminal X1/X2

Bare crimping terminal - OT - 6 mm2 - M6 - tin plated - round


insulated terminal - 12 to 10 AWG

Cable

Type

Wire - 600 V - UL1015 - 10 AWG - 105-core twisted pair yellow and green, round - 50 A

Fireproof
class

UL1015

Length

0.35 m

22.2.3 Subrack Power Cable


The subrack power cable connects the DC PDU at the top of the cabinet and the PIU in the
subrack. The subrack power cable leads the -48 V power from the top of the cabinet to the
subrack. The subrack power cable is correctly connected before delivery.
A type III subrack (2300 W) uses different power cables from those used by a general subrack or an
enhanced subrack (1100 W).

1.1.1.1.1666 Structure
Figure 22-13 shows the structure of the power cable for the general subrack and enhanced
subrack (1100 W).

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Figure 1.1 Structure of the power cable for the general subrack and enhanced subrack (1100 W)

1. Cable connector

2. Main label

3. Cable tie

4. Label

5. Cord end terminal

Figure 22-14 shows the structure of the power cable for the type III subrack (2300 W).
Figure 1.2 Structure of the power cable for the type III subrack (2300 W)

1
W1

W1

W2

W2

X1

X2

1. Bare crimping terminal - type OT

1.1.1.1.1667 Pin Assignments


Table 22-6 provides the pin assignments of the power cable for the general subrack and
enhanced subrack (1100 W).
Figure 1.1 Pin assignments of the power cable for the general subrack and enhanced subrack
(1100 W)
Cable
Connector

Bare Crimping
Terminal

Connection

Color of the Core

X1.A1

X2

A1 is connected to X2.

Blue (-48 V power)

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Cable
Connector

Bare Crimping
Terminal

Connection

Color of the Core

X1.A3

X3

A3 is connected to X3.

Black (power ground)

1.1.1.1.1668 Technical Specifications


Figure 1.1 Technical specifications of the power cable for the general subrack and enhanced
subrack (1100 W)
Item

Description

Cable connector X1

Cable connector - type D - 3-pin - female - without intermediate


male terminals

Bare crimping terminals


X2 and X3

Single cord end terminal - 4 mm2 - 20 A - insertion depth of 10


mm - gray

Cable

Type

Power cable - 600 V - 5.26 mm2 - 10 AWG - black (the core is in


blue and black) - 41 A

Number of
cores

Fireproof
class

CM

Color

The core is in blue and black.

Length

2.5 m, 3 m, and 3.5 m

Figure 1.2 Technical specifications of the power cable for the type III subrack (2300 W)
Item

Description

Cable connector

Bare crimping terminal - OT2- 10 mm2 - 60 A - tin plated

Cable

Wire - 450 V/750 V - H07Z - K UL3386 - 10 mm2 - blue

Wire - 450 V/750 V - H07Z - K UL3386 - 10 mm2 - black

Type

22.2.4 COA Power Cable


The PIU can supply power to a maximum of two pieces of external equipment (for example,
the COA).
The COA power cable connects a power interface on the PIU to a power interface of the
external equipment. Both ends of the COA power cable use the 4-pin connector. One end of
the COA power cable is connected to the PIU and the other end is connected to the power
interface of the external equipment (for example, the COA).

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1.1.1.1.1669 Structure
Figure 22-15 shows the structure of the COA power cable.
Figure 1.1 Structure of the COA power cable
1

A-A

W1

3 1

4 2

X1
A 2
X3

W2
X2
W1.1
W1
W1.2
W2.1

B
W2

X3

W2.2

1. Common terminal female

2. Common connector
- 4-pin

3. Main
label

A-A. Sectional view in


direction A

1.1.1.1.1670 Pin Assignments


Table 22-9 provides the pin assignments of the COA power cable.
Figure 1.1 Pin assignments of the COA power cable
Connectors X1
and X2

Cables W1 and W2

Color

Connector X3

X1.1

W1.1

Brown

X3.1

X2.1

W2.1

X1.3

W1.2

Black

X3.3

X2.3

W2.2

1.1.1.1.1671 Technical Specifications


Item

Description

Connector X3

Common connector - 4-pin - double rows/4.20 mm

Connector X1/X2

Common terminal - female - 4-pin - 18/26 AWG - 13.7 mm in


length

Model of wire W1/W2

Symmetrical twisted-pair cable - 0 ohms - UL2464 - 0.64 mm -

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Item

22 Cables

Description
22 AWG - one pair - black

Number of cores

Fireproof class

CM

Color

Black

Length

1.8 m

22.2.5 RPC Power Cable


One end of the RPC power cable is connected to the power input interface of the case-shaped
Raman amplifier, and the other end is connected to the output interface of the DC power
distribution box at the top of the cabinet.

1.1.1.1.1672 Structure
Figure 22-16 shows the structure of the RPC power cable.
Figure 1.1 Structure of the RPC power cable

Label 3

Main label

Label 1

Label 2

1. Bare crimping
terminal

2. Common
connector - 4-pin

3. Common terminal
- female

A-A. Sectional view in


direction A

1.1.1.1.1673 Pin Assignments


Table 22-10 provides the pin assignments of the RPC power cable.
Figure 1.1 Pin assignments of the RPC power cable
Connectors X1
and X2

Cables W1 and W2

Color

Connector X3

X1

W1

Blue

X3.1

X2

W1

Black

X3.3

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Connectors X1
and X2

22 Cables

Cables W1 and W2

Color

Connector X3

1.1.1.1.1674 Technical Specifications


Table 22-11 lists the technical specifications of the RPC power cable.
Figure 1.1 Technical specifications of the RPC power cable
Item

Description

Connector X3

Common terminal - female - 18/26 AWG 13.7 mm in length, common connector - 4pin - double rows - 4.2 mm

Connector X1/X2

Bare crimping terminal - single cord end


terminal - 1 mm2 - 5 A - tin plated - insertion
depth of 6 mm - yellow

Model of wire W1/W2

Power cable - 600 V - UL1015 - 18 AWG black - OA

Number of cores

Fireproof class

VM-1

Color

Blue and black

Length

3.5 m

22.3 Alarm Cable


The alarm cables that the equipment uses include the cabinet indicator cable, alarm cascading
cable, and alarm input/output cable.

22.3.1 Cabinet Indicator Cable


The cabinet indicator cable is used to connect the AUX in the subrack to the cabinet
indicators. The cabinet indicator cable leads the indicator signal from the AUX to the cabinet
indicators.

1.1.1.1.1675 Structure
Figure 22-17 shows the structure of the cabinet indicator cable.

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Figure 1.1 Structure of the cabinet indicator cable

X2

X3
X1
X4

X5

A-A. Sectional view in direction A

B-B. Sectional view in direction B

1.1.1.1.1676 Pin Assignments


Table 22-12 provides the pin assignments of the cabinet indicator cable.
Figure 1.1 Pin assignments of the cabinet indicator cable
Connector
X1

Direction

Connector X2/X3/X4/X5

Relationshi
p

Print on the
Label

X1.4

Out

X2.2

Green

X1.5

Out

X2.1

Twisted
pair

X1.1

Out

X3.2

Red

X1.2

Out

X3.1

Twisted
pair

X1.3

Out

X4.2

Orange

X1.6

Out

X4.1

Twisted
pair

X1.7

Out

X5.2

Yellow

X1.8

Out

X5.1

Twisted
pair

1.1.1.1.1677 Technical Specifications


Item

Description

Connector X1

Network interface connector - 8-pin - 8-bit - shielded RJ45 connector

Connector X2/X3/X4/X5

Common connector - 2-pin - single row/2.5 mm

Cable type

Symmetrical twisted-pair cable - 120 ohms SEYPVPV - 0.5 mm - 24 AWG - 8-core - PANTONE
430U

Number of cores

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Item

Description

Fireproof class

CM

Diameter of the core

0.5 mm

Length

2.5 m, 3 m, and 3.5 m

22.3.2 Indicator Cascading Cable Between Subracks or Alarm


Cascading Cable Between the OptiX OSN Equipment
The indicator cascading cable between subracks or the alarm cascading cable between the
OptiX OSN equipment cascades the indicator signals or alarm signals between the subracks of
the OptiX OSN equipment.
Both ends of the cable use the RJ45 connector. One end of the cable is connected to the
LAMP1 or ALMO2 interface of the AUX in one subrack. The other end of the cable is
connected to the LAMP2 or ALMO1 interface of the AUX in another subrack.

1.1.1.1.1678 Structure
Figure 22-18 shows the structure of the indicator cascading cable between subracks or the
alarm cascading cable between the OptiX OSN equipment.
Figure 1.1 Structure of the indicator cascading cable between subracks or the alarm cascading
cable between the OptiX OSN equipment

1. RJ-45 network interface connector

2. Label 1

A-A. Sectional view in direction A

1.1.1.1.1679 Pin Assignments


Table 22-13 provides the pin assignments of the indicator cascading cable between subracks
or the alarm cascading cable between the OptiX OSN equipment.
Figure 1.1 Pin assignments of the indicator cascading cable between subracks or the alarm
cascading cable between the OptiX OSN equipment
Connecto
r X1

Direction

Connecto
r X2

Relationship

Alarm Output

X1.1

Out

X2.1

Twisted pair

Critical alarm output and major


alarm output (+)

X1.2

Out

X2.2

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Connecto
r X1

Direction

Connecto
r X2

22 Cables

Relationship

Alarm Output
major alarm signal output (-)

X1.3

Out

X2.3

X1.6

Out

X2.6

X1.4

Out

X2.4

X1.5

Out

X2.5

X1.7

Out

X2.7

X1.8

Out

X2.8

Twisted pair

Minor alarm signal output and


warning alarm signal output (+)
Minor alarm signal output and
warning alarm signal output (-)

Twisted pair

Alarm signal output 1 (+)


Alarm signal output 1 (-)

Twisted pair

Alarm signal output 2 (+)


Alarm signal output 2 (-)

1.1.1.1.1680 Technical Specifications


Item

Description

Connector
X1/X2

Network interface connector - 8-pin - 8-bit - shielded - RJ45 connector

Cable type

Symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.5 mm - 24


AWG - 8-core - PANTONE 430U

Number of
cores

Fireproof class

CM

Diameter of the
core

0.5 mm

Length

3 m, 5 m, 10 m, and 20 m

22.3.3 Alarm Cascading Cable Between the OptiX OSN Equipment


and the Other Huawei Transmission Equipment
The alarm cascading cable cascades the alarm signals of the OptiX OSN equipment and the
alarm signals of the other Huawei transmission equipment such as the OptiX 2500+ and
OptiX OSN 9500.
Both ends of the cable use the RJ45 connector. One end of the cable is connected to the
ALMO1 or ALMO2 interface of the OptiX OSN subrack. The other end of the cable is
connected to the alarm output interface or the alarm cascading interface of the subrack of the
other Huawei transmission equipment.

1.1.1.1.1681 Structure
Figure 22-19 shows the structure of the alarm cascading cable between the OptiX OSN
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equipment and the other Huawei transmission equipment.


Figure 1.1 Structure of the alarm cascading cable between the OptiX OSN equipment and the
other Huawei transmission equipment

1. RJ-45 network interface


connector

2. Main
label

3. Label
1

4. Cable connector - type D - 9pin - female

L: 5 m, 10 m, and 20 m

1.1.1.1.1682 Pin Assignments


Table 22-14 provides the pin assignments of the alarm cascading cable between the OptiX
OSN equipment and the other Huawei transmission equipment.
Figure 1.1 Pin assignments of the alarm cascading cable between the OptiX OSN equipment and
the other Huawei transmission equipment
Connector
X1

Direction

Connector
X2

Relationsh
ip

Description

X1.1

Out

X2.7

Critical alarm signal output (+)

X1.2

Out

X2.3

Twisted
pair

X1.3

Out

X2.6

Major alarm signal output (+)

X1.6

Out

X2.1

Twisted
pair

Critical alarm signal output (-)

Major alarm signal output (-)

1.1.1.1.1683 Technical Specifications


Item

Description

Connector
X1

Network interface connector - 8-pin - 8-bit - shielded - RJ45 connector

Connector
X2

Cable connector - type D - 9-pin - female

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Item

Description

Cable type

Symmetrical twisted-pair cable - 100 ohms - SEYVP - 0.48 mm - 26 AWG


- 4-core - black

Number of
cores

Fireproof
class

CM

Diameter of
the core

0.5 mm

Length

5 m, 10 m, and 20 m

22.3.4 Alarm Input/Output Cable


The alarm input cable transmits the alarm signals of the external equipment to the OptiX OSN
equipment. The alarm output cable transmits the alarm signals of the OptiX OSN equipment
to the centralized alarm monitoring equipment.
The alarm input/output cable uses an RJ45 connector at one end to connect to the alarm
input/output interface of the equipment. The other end of the alarm input/output cable is
connected to the external equipment or the centralized alarm monitoring equipment. The
connector needs to be prepared on site as required. Each alarm input/output cable transmits
four channels of alarm signals.

1.1.1.1.1684 Structure
Figure 22-20 shows the structure of the alarm input/output cable.
Figure 1.1 Structure of the alarm input/output cable

1. RJ-45 network interface connector

2. Main label

A-A. Sectional view in direction A

1.1.1.1.1685 Pin Assignments


Table 22-15 provides the pin assignments of the alarm input/output cable.
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Figure 1.1 Pin assignments of the alarm input/output cable


Connector X1

Color

Relationship

Usage

X1.1

Blue

Twisted pair

Critical or major alarm


input/output (+)

X1.2

White

X1.3

Orange

X1.6

White

X1.4

Green

X1.5

White

X1.7

Brown

X1.8

White

Critical or major alarm


input/output (-)
Twisted pair

Minor or warning alarm


input/output (+)
Minor or warning alarm
input/output (-)

Twisted pair

Alarm signal input/output 1 (+)


Alarm signal input/output 1 (-)

Twisted pair

Alarm signal input/output 2 (+)


Alarm signal input/output 2 (-)

X1.1 to X1.8 can be set to alarm signal input or alarm signal output as required.

1.1.1.1.1686 Technical Specifications


Item

Description

Connector X1

Network interface connector - 8-pin - 8-bit - shielded - RJ45 connector

Cable type

Symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.5 mm - 24


AWG - 8-core - PANTONE 430U

Number of
cores

Fireproof
class

CM

Core diameter

0.5 mm

Length

10 m, 20 m, and 30 m

22.4 Management Cable


The management cables include the serial cable, ordinary phone line, COA cascading cable,
and network cable.

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22.4.1 OAM Serial Cable


The OAM serial cable is used for the management and remote maintenance of the OptiX OSN
equipment.
The OAM serial cable uses an RJ45 connector at one end to connect to the OAM interface of
the equipment and uses a DB25 connector at the other end to connect to a laptop computer,
serial NMS, or modem.

1.1.1.1.1687 Structure
Figure 22-21 shows the structure of the OAM serial cable (using the DB25 connector).
Figure 1.1 Structure of the OAM serial cable

1. RJ-45 network
interface connector

2. Main
label

3. Cable
connector DB25 male

A-A. Sectional
view in direction
A

B-B. Sectional
view in direction
B

1.1.1.1.1688 Pin Assignments


Table 22-16 provides the pin assignments of the OAM serial cable.
Figure 1.1 Pin assignments of the OAM serial cable
Connector
X1

Direction

Connector X2

Relationship

Description

X1.2

Out

X2.20

Single

Data terminal ready (DTR)

X1.3

Out

X2.2

Single

Transmitting data (TD)

X1.6

In

X2.3

Single

Receiving data (RD)

X1.4

X2.7

Twisted pair

Signaling ground (SG)

X1.5

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1.1.1.1.1689 Technical Specifications


Item

Description

Connector X1

Network interface connector - RJ45 connector - 8-pin - 8-bit - shielded connector

Connector X2

Cable connector - type D - 25-pin - male, or cable connector - type D - 9pin - male

Type

Symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.5 mm - 24


AWG - 8-core - PANTONE 430U

Number of
cores

Fireproof class

CM

Length

5000 mm

22.4.2 Serial 1 to 4/F1/F&f Serial Cable


The serial 1-4/F1/F&f serial cable uses an RJ45 connector at one end to connect to the serial
1-4 interfaces, F1 serial port, or F&f serial port, and uses a DB9 connector at the other end to
connect to the external detecting equipment or external managed equipment.
The serial 1-4/F1/F&f serial cable performs the following functions:

Transparently transmits the environment monitoring data signal.

Manages external devices such as the COA.

1.1.1.1.1690 Structure
Figure 22-22 shows the structure of the serial 1-4/F1/F&f serial cable.
Figure 1.1 Structure of the serial 1-4/F1/F&f serial cable

1. RJ-45 network
interface connector

Issue 02 (2013-01-18)

2. Main
label

3. Cable
connector - DB9
male

A-A. Sectional
view in direction
A

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view in direction
B

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1.1.1.1.1691 Pin Assignments


Table 22-17 provides the pin assignments of the serial 1-4/F1/F&f serial cable.
Figure 1.1 Pin assignments of the serial 1-4/F1/F&f serial cable
Connector
X1

Direction

Connector X2

Relationshi
p

Description

X1.1

Out

X2.8

Twisted pair

RS422TX+

X1.2

Out

X2.9

X1.3

In

X2.6

X1.6

In

X2.7

X1.4

In

X2.3

X1.8

Out

X2.2

X1.5

X2.5

RS422TXTwisted pair

RS422RX+
RS422RX-

Twisted pair

RS232RX
RS232TX

Single

SG

1.1.1.1.1692 Technical Specifications


Item

Description

Connector X1

Network interface connector - RJ45 connector - 8-pin - 8-bit - shielded connector

Connector X2

Cable connector - type D - 9-pin - male

Cable type

(1) Symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.5 mm - 24


AWG - 8-core - PANTONE 430U (2) Symmetrical twisted-pair cable 100 ohms - SEYVP - 0.48 mm - 26 AWG - 8-core - black

Number of
cores

Fireproof
class

CM

Length

15 m in the case of cable type 1 and 3 m in the case of cable type 2

22.4.3 RS-232/RS-422 Serial Cable


The RS-232/RS-422 serial cable is used to transport the management signals between subnets.
Both ends of the RS-232/RS-422 serial cable use the RJ45 connector. One end of the RS232/RS-422 serial cable is connected to the RS-232/RS-422 serial port of the equipment. The
other end is connected to the RS-232/RS-422 serial port of another piece of equipment that
needs to make orderwire calls to the other equipment.
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1.1.1.1.1693 Structure
Figure 22-23 shows the structure of the RS-232/RS4-22 serial cable.
Figure 1.1 Structure of the RS-232/RS-422 serial cable

1. RJ-45 network interface connector

2. Main label

A-A. Sectional view in direction A

1.1.1.1.1694 Pin Assignments


Table 22-18 provides the pin assignments of the RS-232/RS-422 serial cable.
Figure 1.1 Pin assignments of the RS-232/RS-422 serial cable
Connector
X1

Direction

Connector X2

Relationship

Description

X1.3

In

X2.1

Twisted pair

RX+

X1.6

In

X2.2

X1.1

Out

X2.3

X1.2

Out

X2.6

X1.5

Out

X2.5

X1.4

In

X2.8

X1.8

X2.4

RXTwisted pair

TX+
TX-

Twisted pair

232TX
232RX

Single

SG

1.1.1.1.1695 Technical Specifications


Item

Description

Connector X1/X2

Network interface connector - RJ45 connector - 8-pin - 8-bit shielded - connector

Cable type

Symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.5 mm 24 AWG - 8-core - PANTONE 430U

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Item

Description

Number of cores

Fireproof class

CM

Length

15 m

22 Cables

22.4.4 Ordinary Telephone Line


The ordinary telephone line is used to connect the orderwire phone. Both ends of the ordinary
telephone line use the RJ45 connector. One end of the ordinary telephone line is connected to
the PHONE interface of the equipment, and the other end is connected to the interface of the
orderwire phone.

1.1.1.1.1696 Structure
Figure 22-24 shows the structure of the ordinary telephone line.
Figure 1.1 Structure of the ordinary telephone line

1. RJ45 connector

2. Main label

1.1.1.1.1697 Pin Assignments


Table 22-19 provides the pin assignments of the ordinary telephone line.
Figure 1.1 Pin assignments of the ordinary telephone line
Connector X1

Connector X2

Description

X1.1

X2.1

Not connected

X1.2

X2.2

Not connected

X1.3

X2.3

TIP

X1.4

X2.4

RING

X1.5

X2.5

Not connected

X1.6

X2.6

Not connected

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1.1.1.1.1698 Technical Specifications


Item

Description

Connector X1/X2

Network interface connector - 6-pin - 26 to 28 AWG

Cable type

Power cable - 150 V - UL20251 - 0.08 mm2 - 28 AWG - black - 1


A - 2-core telephone line

Number of cores

Fireproof class

CM

Length

15 m

22.4.5 COA Cascading Cable


When multiple COAs are installed in a cabinet, use COA cascading cables to cascade the
COAs.
Both ends of the COA cascading cable use the DB9 connector. One end of the COA cascading
cable is connected to the RS232-1 serial port of one COA, and the other end is connected to
the RS232-2 serial port of another COA.

1.1.1.1.1699 Structure
Figure 22-25 shows the structure of the COA cascading cable.
Figure 1.1 Structure of the COA cascading cable

1. Cable connector - DB9 male

2. Label

A-A. Sectional view in direction A

1.1.1.1.1700 Pin Assignments


Table 22-20 provides the pin assignments of the COA cascading cable.
Figure 1.1 Pin assignments of the COA cascading cable
Connector X1

Connector X2

Remarks

One pair

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Connector X1

Connector X2

Remarks

Grounding

1.1.1.1.1701 Technical Specifications


Item

Description

Connector X1/X2

Cable connector - type D - 9-pin - male

Cable type

Symmetrical twisted-pair cable - 100 ohms - UL2464 - 0.32 mm 28 AWG - 2P - Huawei gray

Number of cores

Two pairs

Fireproof class

CM

Length

0.6 m and 2.5 m

22.4.6 Straight-Through Cable


The straight-through cable is used to connect the OptiX OSN equipment to an NM computer.
Both ends of the straight-through cable use the RJ45 connector. One end of the straightthrough cable is connected to the ETH interface of the equipment, and the other end is
connected to the network interface of the NM computer.
As the ETH interface of the OptiX OSN equipment supports the auto-sensing function, the ETH
interface can use a straight-through cable or a crossover cable.

1.1.1.1.1702 Structure
Figure 22-26 shows the structure of the straight-through cable.
Figure 1.1 Structure of the straight-through cable

1. RJ-45 network interface connector


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2. Label 1

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3. Main label

4. Label 2
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1.1.1.1.1703 Pin Assignments


Table 22-21 provides the pin assignments of the straight-through cable.
Figure 1.1 Pin assignments of the straight-through cable
Connector X1

Connector X2

Color

Relationship

X1.1

X2.1

White/Orange

Twisted pair

X1.2

X2.2

Orange

X1.3

X2.3

White/Green

X1.6

X2.6

Green

X1.4

X2.4

Blue

X1.5

X2.5

White/Blue

X1.7

X2.7

White/Brown

X1.8

X2.8

Brown

Twisted pair

Twisted pair

Twisted pair

1.1.1.1.1704 Technical Specifications


Item

Description

Connector X1/X2

Network interface connector - RJ45 connector - 8-pin - 8-bit shielded - connector - 24 to 26 AWG - CAT 6/configured with the
SFTP network cable

Cable type

Communication cable - 10015 ohms - CAT5E SFTP 24 AWG - 8core - PANTONE 445U

Number of cores

Fireproof class

CM

Length

5 m, 10 m, 20 m, and 30 m

22.4.7 Crossover Cable


The crossover cable is used to connect the OptiX OSN equipment, network management
computer, and Ethernet to achieve communication. Both ends of the crossover cable use the
RJ45 connector.

1.1.1.1.1705 Structure
Figure 22-27 shows the structure of the crossover cable.

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Figure 1.1 Structure of the crossover cable

1. RJ-45 network interface


connector

2. Label
1

3. Main
label

4. Network
cable

5. Label
2

1.1.1.1.1706 Pin Assignments


Table 22-22 provides the pin assignments of the crossover cable.
Figure 1.1 Pin assignments of the crossover cable
Connector X1

Connector X2

Color

Relationship

X1.6

X2.2

Orange

Twisted pair

X1.3

X2.1

White/Orange

X1.1

X2.3

White/Green

X1.2

X2.6

Green

X1.4

X2.4

Blue

X1.5

X2.5

White/Blue

X1.7

X2.7

White/Brown

X1.8

X2.8

Brown

Twisted pair

Twisted pair

Twisted pair

1.1.1.1.1707 Technical Specifications


Item

Description

Connector X1/X2

Network interface connector - RJ45 connector - 8-pin - 8-bit shielded - connector - 24 to 26 AWG - CAT 6/configured with the
SFTP network cable

Cable type

Communication cable - 1005 ohms - CAT5E SFTP 24 AWG - 8core - PANTONE 646U

Number of cores

Fireproof class

CM

Length

5 m and 30 m

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22.5 Signal Cable


The signal cables include the E1/E3 signal cable, framed E1 signal cable, and Nx64 kbit/s
signal cable.

22.5.1 75-ohm 8xE1 Cable


The 75-ohm 8xE1 cable is used to receive and transmit E1 signals.
The 75-ohm 8xE1 cable uses a DB44 connector at one end to connect to the D75S. The other
end of the 75-ohm 8xE1 cable is connected to the digital distribution frame (DDF). The
connector needs to be prepared on site as required. Each 75-ohm 8xE1 cable can transmit
8xE1 signals.

1.1.1.1.1708 Structure
Figure 22-28 shows the structure of the 75-ohm 8xE1 cable.
Figure 1.1 Structure of the 75-ohm 8xE1 cable
View A

Pos.1

Pos.44

MO55

Main label
W

1. Cable connector - type D - 44-pin - male

2. Main label

1.1.1.1.1709 Pin Assignments


Table 22-23 provides the pin assignments of the 75-ohm 8xE1 cable.

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Figure 1.1 Pin assignments of the 75-ohm 8xE1 cable


Connect
or

Cable W

Rema
rks

Direct
ion

Connecto
r

Cable W

Cor
e

No.

38

Rin
g

23

Tip

37

Rin
g

Cor
e

No.

R1

In

34

Rin
g

In

19

Tip

In

33

Rin
g

22

Tip

In

18

Tip

36

Rin
g

In

32

Rin
g

21

Tip

In

17

Tip

35

Rin
g

In

31

Rin
g

20

Tip

In

16

Tip

15

Rin
g

Out

11

Rin
g

30

Tip

Out

26

Tip

14

Rin
g

Out

10

Rin
g

29

Tip

Out

25

Tip

13

Rin
g

Out

Rin
g

28

Tip

Out

24

Tip

12

Rin
g

Out

Rin
g

27

Tip

Out

Tip

Out

Shell

External braid shield


layer/Without the
external braid shield
layer

Shell

External braid shield


layer/Without the
external braid shield
layer

R2

R3

R4

T1

T2

T3

T4

Rema
rks

Directi
on

R5

In
In

11

R6

In
In

13

R7

In
In

15

R8

In
In

10

T5

Out
Out

12

T6

Out
Out

14

T7

Out
Out

16

T8

Out

1.1.1.1.1710 Technical Specifications


The external layer of the 75-ohm E1 cable may be of the shielded type or unshielded type.
The specifications of the 75-ohm E1 cable with the shielded layer are different from the
specifications of the 75-ohm E1 cable with the unshielded layer. Table 22-24 lists the
specifications of the 75-ohm E1 cable with the external braid shield layer. Table 22-25 lists
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the specifications of the 75-ohm E1 cable without the external braid shield layer.
Figure 1.1 Specifications of the 75-ohm E1 cable with the external braid shield layer
Item

Description

Connector X

Connector accessories- type D - 44-pin - male - cable welding type


- 3-row pins

Cable type

Coaxial cable - SYFVZP-LC 75-1-1x16 - 75 ohms - 13.10 mm 1.2 mm - 0.254 mm - Pantone Warm Gray 1U

Fireproof class

Complies with IEC60332-3C.

Number of cores

16 cores, 8xE1

Diameter of the shield


layer - diameter of the
internal insulation
layer - diameter of the
internal conductor

13.10 mm - 1.2 mm - 0.254 mm

Length

3 m, 10 m, 15 m, 20 m, 25 m, 30 m, 35 m, 40 m, 45 m, and 50 m

Figure 1.2 Specifications of the 75-ohm E1 cable without the external braid shield layer
Item

Description

Connector X

Connector accessories- type D - 44-pin - male - cable welding type


- 3-row pins

Cable type

Coaxial cable - SYFVZP-LC 75-1-1x16 - 75 ohms - 12.40 mm 1.2 mm - 0.254 mm - Pantone Warm Gray 1U

Fireproof class

Complies with IEC60332-3C.

Number of cores

16 cores, 8xE1

Diameter of the shield


layer - diameter of the
internal insulation
layer - diameter of the
internal conductor

12.40 mm - 1.2 mm - 0.254 mm

Length

5 m, 10 m, 15 m, 20 m, 25 m, 30 m, 35 m, 40 m, 45 m, and 50 m

The pin assignment table is delivered with the 75-ohm 8xE1 cable in a packing bag. You must
keep the table carefully.

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22.5.2 120-ohm 8xE1 Cable


The 120-ohm 8xE1 cable is used to receive and transmit E1 signals.
The 120-ohm 8xE1 cable uses a DB44 connector at one end to connect to the 120-ohm E1
electrical interface board. The other end of the 120-ohm 8xE1 cable is connected to the DDF.
The connector needs to be prepared on site as required. Each 120-ohm 8xE1 cable can
transmit 8xE1 signals.

1.1.1.1.1711 Structure
Figure 22-29 shows the structure of the 120-ohm 8xE1 cable.
Figure 1.1 Structure of the 120-ohm 8xE1 cable

1. Cable connector - type D - 44-pin - male

2. Label 1, marked with "W1 (TX1-8)"

3. Label 3, marked with "W2 (RX1-8)"

4. Main label

1.1.1.1.1712 Pin Assignments


Table 22-26 provides the pin assignments of the 120-ohm 8xE1 cable.
Figure 1.1 Pin assignments of the 120-ohm 8xE1 cable
Connec
tor

Cable W1
Cor
e

No.

15

Blue

30

Whi
te

14

Ora
nge

29

Whi
te

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Rema
rks

Direct
ion

Connect
or

Cable W2
Core

No.

Twist
ed
pair

TX1

Out

38

Blue

Out

23

Whit
e

Twist
ed
pair

TX2

Out

37

Oran
ge

Out

22

Whit
e

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Rema
rks

Direct
ion

Twisted
pair

RX1

In

Twisted
pair

RX2

In
In
In

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Connec
tor

Cable W1
Cor
e

No.

13

Gree
n

28

Whi
te

12

Bro
wn

27

Whi
te

11

Gra
y

26

Whi
te

10

Blue

25

Red

Ora
nge

24

Red

Gree
n

Red

Shell

External braided
shield

22 Cables

Rema
rks

Direct
ion

Connect
or

Cable W2

Rema
rks

Direct
ion

Core

No.

Twist
ed
pair

TX3

Out

36

Gree
n

Twisted
pair

RX3

In

Out

21

Whit
e

Twist
ed
pair

TX4

Out

35

Bro
wn

Out

20

Whit
e

Twist
ed
pair

TX5

Out

34

Gray

Out

19

Whit
e

Twist
ed
pair

TX6

Out

33

Blue

Out

18

Red

Twist
ed
pair

TX7

Out

32

Oran
ge

Out

17

Red

Twist
ed
pair

TX8

Out

31

Gree
n

Out

16

Red

In

Shell

External braided shield

In
Twisted
pair

RX4

In
In

Twisted
pair

RX5

In
In

Twisted
pair

RX6

Twisted
pair

RX7

In
In
In
In

Twisted
pair

RX8

In

1.1.1.1.1713 Technical Specifications


Item

Description

Connector X

Cable connector - type D - 44-pin - male

Cable type

Communication cable - 120 ohms - SEYPVPV - 0.5 mm - 24 AWG 16-core - PANTONE 430U

Number of cores

16

Diameter of the
internal conductor

0.5 mm

Fireproof class

CM

Length

10 m, 15 m, 20 m, 30 m, and 40 m

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22.5.3 E3/T3/STM-1 Cable


The E3/T3/STM-1 cable is used to receive and transmit E3/T3/STM-1 electrical signals. The
E3/T3/STM-1 cable uses an SMB connector at one end to connect to the E3/T3/STM-1
electrical access board. The other end of the E3/T3/STM-1 cable is connected to the DDF. The
connector needs to be chosen on site as required.

1.1.1.1.1714 Structure
Figure 22-30 shows the structure of the E3/T3/STM-1 cable.
Figure 1.1 Structure of the E3/T3/STM-1 cable

1. Coaxial connector - SMB

2. Main label

3. Coaxial cable

1.1.1.1.1715 Pin Assignments


None.

1.1.1.1.1716 Technical Specifications


Item

Description

Connector

Coaxial connector - SMB connector - 75 ohms - straight - female

Cable I

Coaxial cable - 75 ohms - 3.9 mm - 2.1 mm - 0.34 mm - shielded


Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 3.9 mm - 2.1 mm - 0.34 mm
Length: 10 m, 15 m, 20 m, and 30 m

Cable II

Coaxial cable - 75 ohms - 4.4 mm - 2.4 mm - 0.4 mm - shielded - gray


Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 4.4 mm - 2.4 mm - 0.4 mm
Length: 15 m, 20 m, 25 m, 30 m, and 40 m

Cable III

Coaxial cable - 75 ohms - 6.7 mm - 3.8 mm - 0.61 mm - shielded - gray


Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 6.7 mm - 3.8 mm - 0.61 mm
Length: 15 m, 20 m, 25 m, 30 m, and 130 m

Cable IV
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Coaxial cable - 75 ohms - 5.80 mm - 3.71 mm - 0.643 mm - black


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Description

Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 5.80 mm - 3.71 mm - 0.643 mm
Length: 30 cm
Cable V

Coaxial cable - 75 ohms - 3.9 mm - 2.1 mm - 0.34 mm - shielded


Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 3.9 mm - 2.1 mm - 0.34 mm
Length: 10 m

Fireproof class

CM

22.5.4 Framed E1 Cable


The framed E1 cable is connected to the DB44 connector of the DM12 to transmit/receive
eight channels of framed E1 signals.
The framed E1 cables are available in two types, namely, 75-ohm framed E1 cable and 120ohm framed E1 cable.

For the structure, pin assignments, and technical specifications of the 75-ohm framed E1
cable, see the topic that describes the 75-ohm 8xE1 cable.

For the structure, pin assignments, and technical specifications of the 120-ohm framed
E1 cable, see the topic that describes the 120-ohm 8xE1 cable.

22.5.5 Nx64 kbit/s Cable


The Nx64 kbit/s cable is connected to the DB28 connector of the DM12 to transmit/receive
one channel of Nx64 kbit/s signals.
Table 22-27 provides the pin assignments of the DB28 connector.
Figure 1.1 Pin assignments of the DB28 connector of the DM12
Pin

Signal

Direction

Description

TXD+

--->

Transmits data.

TXD-

--->

Transmits data.

TXC+

<-->

Transmits the clock signal provided by the


DCE to the DTE.

TXC-

<-->

Transmits the clock signal provided by the


DCE to the DTE.

NC

GND

-----

Circuit_GND

MODE0

<---

Receives the signal that identifies the type

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Pin

Signal

22 Cables

Direction

Description
of cable.

MODE1

<---

Receives the signal that identifies the type


of cable.

MODE2

<---

Receives the signal that identifies the type


of cable.

10

MODE_DC
E

<---

Receives the signal that identifies the type


of DCE/DTE cable.

11

DCD+

<-->

Detects the carrier.

12

DCD-

<-->

Detects the carrier.

13

RTS+

--->

Requests for transmission.

14

RTS-

--->

Requests for transmission.

15

TXCE+

--->

Transmits the data clock in the case of the


DCE and loops back the clock in the case of
the DTE.

16

TXCE-

--->

Transmits the data clock in the case of the


DCE and loops back the clock in the case of
the DTE.

17

RXC+

<---

Receives clock signals.

18

RXC-

<---

Receives clock signals.

19

RXD+

<---

Receives data.

20

RXD-

<---

Receives data.

21

GND

-----

Shield_GND

22

LL

<-->

Receives the loopback control signal.

23

CTS+

<---

Permits the transmission.

24

CTS-

<---

Permits the transmission.

25

DSR+

<---

Receives the DCE ready signal.

26

DSR-

<---

Receives the DCE ready signal.

27

DTR+

--->

Transmits the DTE ready signal.

28

DTR-

--->

Transmits the DTE ready signal.

The Nx64 kbit/s cables are classified into the following categories according to the protocol,
which the Nx64 kbit/s signals comply with:

V.35 DCE cable

V.35 DTE cable

V.24 DCE cable

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V.24 DTE cable

X.21 DCE cable

X.21 DTE cable

RS-449 DCE cable

RS-449 DTE cable

RS-530 DCE cable

RS-530 DTE cable

22 Cables

1.1.1.1.1717 V.35 DCE Cable


Figure 22-31 shows the structure of the V.35 DCE cable.
Figure 1.1 Structure of the V.35 DCE cable
A-A

B-B

Pos.28
W

Pos.1
C
H

X1

X2

M
S
W
AA
EE
KK

BB

CC
HH
MM

1. Cable connector - D28 - male

2. Main label

3. Cable connector - D34 - female + D34 plastic shell

FF
LL

B
F
L
R
V
Z
DD
JJ
NN

Table 22-28 provides the pin assignments of the V.35 DCE cable.
Figure 1.1 Pin assignments of the V.35 DCE cable
Connector X1

Connector X2

Relationship

19

Twisted pair

20

15

16

AA

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Connector X1

Connector X2

Relationship

17

Twisted pair

18

11

22

23

13

25

27

21

6+7+8

Pins 6, 7, and 8 are shortcircuited.

The technical specifications of the V.35 DCE cable are as follows.


Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight male - cable welding type - spacing 0.80 mm - matching with 28 to
30 AWG, exclusively used by the OEM

Connector X2

Cable connector - V35 plug - 34-pin - molding shell - kit, exclusively


used by the OEM
Cable connector - V35 DCE plug - 34-pin - female - cable crimping
type - housing core, exclusively used by the OEM

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5


pairs - 8 cores - PANTONE 296U - exclusively used by the OEM

Number of cores

Five pairs and eight cores

Diameter of the
core

0.32 mm

Length

3m

1.1.1.1.1718 V.35 DTE Cable


Figure 22-32 shows the structure of the V.35 DTE cable.

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Figure 1.2 Structure of the V.35 DTE cable


A-A

B-B

Pos.28

Pos.1

X1

X2

1. Cable connector - D28


- male

2. Main label

4. Ordinary terminal

5. Cable connector - D34


- male

B
A
D
C
F J E H
L N K M
R T P S
V X U W
Z BB Y AA
DD FF CC EE
JJ LL HH KK
NN MM

3. Cable connector - D34 plastic shell

Table 22-29 provides the pin assignments of the V.35 DTE cable.
Figure 1.1 Pin assignments of the V.35 DTE cable
Connector X1

Connector X2

Relationship

Twisted pair

19

20

17

18

AA

15

16

11

22

13

23

27

25

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Connector X1

Connector X2

Relationship

21

6 + 10 + 7 + 8

Pins 6, 7, 8, and 10 are


short-circuited.

The technical specifications of the V.35 DTE cable are as follows.


Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - V35 plug - 34-pin - molding shell - kit, exclusively used
by the OEM
Cable connector - V35 DTE plug - 34-pin - female - cable crimping type housing core, exclusively used by the OEM

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5 pairs


- 8 cores - PANTONE 296U - exclusively used by the OEM

Number of
cores

Five pairs and eight cores

Diameter of
the core

0.32 mm

Length

3m

1.1.1.1.1719 V.24 DCE Cable


Figure 22-33 shows the structure of the V.24 DCE cable.
Figure 1.3 Structure of the V.24 DCE cable
A-A

B-B

Pos.25
Pos.1

Pos.28
Pos.1

X1

X2

1. Cable connector - D25 - female

2. Main label

3. Cable connector - D28 - male

Table 22-30 provides the pin assignments of the V.24 DCE cable.
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Figure 1.1 Pin assignments of the V.24 DCE cable


Connector X1

Connector X2

Relationship

19

Twisted pair

23

13

25

20

27

11

22

18

15

17

24

15

17

21

Single

6+7

Pins 6 and 7 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the V.24 DCE cable are as follows.


Figure 1.2 Technical specifications of the V.24 DCE cable
Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight male - cable welding type - spacing 0.80 mm - matching with 28 to 30
AWG, exclusively used by the OEM

Connector X2

Cable connector - type D - 25-pin - female - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5


pairs - 8 cores - PANTONE 296U - exclusively used by the OEM

Number of
cores

Five pairs and eight cores

Diameter of the
core

0.32 mm

Length

3m

1.1.1.1.1720 V.24 DTE Cable


Figure 22-34 shows the structure of the V.24 DTE cable.
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Figure 1.4 Structure of the V.24 DTE cable


A-A

B-B
1

Pos.1
Pos.1

Pos.28
Pos.25

X1

X2

1. Cable connector - D25 - male

2. Main label

3. Cable connector - D28 - male

Table 22-32 provides the pin assignments of the V.24 DTE cable.
Figure 1.1 Pin assignments of the V.24 DTE cable
Connector X1

Connector X2

Relationship

Twisted pair

19

13

23

27

20

25

11

22

18

15

15

24

17

17

21

Single

6 + 10 + 7

Pins 6, 10, and 7 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the V.24 DTE cable are as follows.


Figure 1.2 Technical specifications of the V.24 DTE cable
Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,

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Item

22 Cables

Description
exclusively used by the OEM

Connector X2

Cable connector - type D - 25-pin - male - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5 pairs


- 8 cores - PANTONE 296U - exclusively used by the OEM

Number of
cores

Five pairs and eight cores

Diameter of
the core

0.32 mm

Length

3m

1.1.1.1.1721 X.21 DCE Cable


Figure 22-35 shows the structure of the X.21 DCE cable.
Figure 1.5 Structure of the X.21 DCE cable
A-A

B-B
1

Pos.15

Pos.1

Pos.28

Pos.1

X1

X2

1. Cable connector - D15 - female

2. Main label

3. Cable connector - D28 - male

Table 22-34 provides the pin assignments of the X.21 DCE cable.
Figure 1.1 Pin assignments of the X.21 DCE cable
Connector X1

Connector X2

Relationship

13

Twisted pair

14

12

23

24

10

19

20

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Connector X1

Connector X2

Relationship

Twisted pair

11

15

16

13

21

6+9

Pins 6 and 9 are shortcircuited.

Twisted pair

The technical specifications of the X.21 DCE cable are as follows.


Figure 1.2 Technical specifications of the X.21 DCE cable
Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - type D - 15-pin - female - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5 pairs


- 8 cores - PANTONE 296U - exclusively used by the OEM

Number of
cores

Five pairs and eight cores

Diameter of
the core

0.32 mm

Length

3m

1.1.1.1.1722 X.21 DTE Cable


Figure 22-36 shows the structure of the X.21 DTE cable.

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Figure 1.6 Structure of the X.21 DTE cable


A-A

B-B
2

Pos.1

Pos.1

Pos.28

Pos.15

X2

X1

1. Cable connector - D15 - male

2. Main label

3. Cable connector - D28 - male

Table 22-36 provides the pin assignments of the X.21 DTE cable.
Figure 1.1 Pin assignments of the X.21 DTE cable
Connector X1

Connector X2

Relationship

13

Twisted pair

14

10

23

24

12

19

20

11

15

16

13

17

18

13

21

6 + 10 + 9

Pins 6, 10, and 9 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the X.21 DTE cable are as follows.

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Figure 1.2 Technical specifications of the X.12 DTE cable


Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight male - cable welding type - spacing 0.80 mm - matching with 28 to 30
AWG, exclusively used by the OEM

Connector X2

Cable connector - type D - 15-pin - male - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - 0.38 mm - 28 AWG - 5


pairs - 8 cores - PANTONE 296U - exclusively used by the OEM

Number of
cores

Five pairs and eight cores

Diameter of the
core

0.32 mm

Length

3m

1.1.1.1.1723 RS-449 DCE Cable


Figure 22-37 shows the structure of the RS-449 DCE cable.
Figure 1.7 Structure of the RS-449 DCE cable
A-A

B-B
2

Pos.1

Pos.1

Pos.28

Pos.15

X2

X1

1. Cable connector - D28 male

2. Main
label

3. Cable connector - D37 - female I

Table 22-38 provides the pin assignments of the RS-449 DCE cable.
Figure 1.1 Pin assignments of the RS-449 DCE cable
Connector X1

Connector X2

Relationship

27

11

Twisted pair

28

29

25

12

26

30

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Connector X1

Connector X2

Relationship

13

Twisted pair

14

27

23

24

25

11

13

12

31

19

20

22

24

15

16

26

17

17

18

35

23

22

10

21

6+8

19

Pins 6 and 8 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the RS-449 DCE cable are as follows.


Figure 1.2 Technical specifications of the RS-449 DCE cable
Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight male - cable welding type - spacing 0.80 mm - matching with 28 to
30 AWG, exclusively used by the OEM

Connector X2

Cable connector - type D - 37-pin - female - cable welding type,


exclusively used by the OEM

Cable type

Symmetrical twisted-pair cable - 100 ohms - communication cable 0.32 mm - 28 AWG - 26-core - PANTONE 296U - exclusively used
by the OEM

Number of cores

26

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Item

Description

Diameter of the
core

0.32 mm

Length

3m

1.1.1.1.1724 RS-449 DTE Cable


Figure 22-38 shows the structure of the RS-449 DTE cable.
Figure 1.8 Structure of the RS-449 DTE cable
A-A

B-B
1

3
Pos.37

Pos.28

Pos.1

X1
X2

1. Cable connector - D28 - male

2. Main label

Pos.1

3. Cable connector - D37 - male - I

Table 22-40 provides the pin assignments of the RS-449 DTE cable.
Figure 1.1 Pin assignments of the RS-449 DTE cable
Connector X1

Connector X2

Relationship

27

12

Twisted pair

28

30

25

11

26

29

13

14

25

23

24

27

11

13

12

31

19

20

24

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Connector X1

Connector X2

Relationship

Twisted pair

22

15

17

16

35

17

18

26

23

22

10

21

6 + 8 + 10

19

Pins 6, 8, and 10 are shortcircuited.

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the RS-449 DTE cable are as follows.


Figure 1.2 Technical specifications of the RS-449 DTE cable
Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight - male


- cable welding type - spacing 0.80 mm - matching with 28 to 30 AWG,
exclusively used by the OEM

Connector X2

Cable connector - type D - SUB plug - 37-pin - straight - male - cable


welding type - two rows, standard installation holes, exclusively used by
the OEM

Cable type

Symmetrical twisted-pair cable - 100 ohms - communication cable - 0.32


mm - 28 AWG - 26-core - PANTONE 296U - exclusively used by the
OEM

Number of
cores

26

Diameter of
the core

0.32 mm

1.1.1.1.1725 RS-530 DCE Cable


Figure 22-39 shows the structure of the RS-530 DCE cable.

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Figure 1.9 Structure of the RS-530 DCE cable


A-A
Pos.25

B-B
2

3
Pos.1

X1
Pos.1

Pos.28

X2

1. Cable connector - D25 - female

2. Main label

3. Cable connector - D28 - male

Table 22-42 provides the pin assignments of the RS-530 DCE cable.
Figure 1.1 Pin assignments of the RS-530 DCE cable
Connector X1

Connector X2

Relationship

28

22

Twisted pair

27

26

23

25

20

24

19

23

22

18

Single

21

Single

20

14

Twisted pair

19

18

11

17

24

16

15

17

14

13

13

12

10

11

12

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Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

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Connector X1

Connector X2

15

16

6+7+9

Relationship

Twisted pair

Pins 6, 7, and 9 are shortcircuited.

The technical specifications of the RS-530 DCE cable are as follows.


Figure 1.2 Technical specifications of the RS-530 DCE cable
Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight male - cable welding type - spacing 0.80 mm - matching with 28 to 30
AWG, exclusively used by the OEM

Connector X2

Cable connector - type D - 25-pin - female - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - communication cable - 0.32


mm - 28 AWG - 26-core - PANTONE 296U - exclusively used by the
OEM

Number of
cores

26

Diameter of the
core

0.32 mm

Length

3m

1.1.1.1.1726 RS-530 DTE Cable


Figure 22-40 shows the structure of the RS-530 DTE cable.
Figure 1.10 Structure of the RS-530 DTE cable
A-A

B-B
1

Pos.1
Pos.1

X1
Pos.25

X2

1. Cable connector - D25 - male

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Pos.28

2. Main label

3. Cable connector - D28 - male

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Table 22-44 provides the pin assignments of the RS-530 DTE cable.
Figure 1.1 Pin assignments of the RS-530 DTE cable
Connector X1

Connector X2

Relationship

27

20

Twisted pair

28

23

25

26

22

13

14

19

23

24

13

11

12

10

19

20

16

14

15

24

16

11

17

17

18

15

12

22

18

21

6 + 7 + 9 + 10

Pins 6, 7, 9, and 10 are


short-circuited.

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the RS-530 DTE cable are as follows.

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Figure 1.2 Technical specifications of the RS-530 DTE cable


Item

Description

Connector X1

Cable connector - type-D dual-edge subassembly - 28-pin - straight male - cable welding type - spacing 0.80 mm - matching with 28 to 30
AWG, exclusively used by the OEM

Connector X2

Cable connector - type D - 25-pin - male - cable welding type

Cable type

Symmetrical twisted-pair cable - 100 ohms - communication cable - 0.32


mm - 28 AWG - 26-core - PANTONE 296U - exclusively used by the
OEM

Number of
cores

26

Diameter of
the core

0.32 mm

Length

3m

22.6 Clock Cable


The clock cables include the 75-ohm/120-ohm clock cable and clock transit cable.

22.6.1 75-ohm/120-ohm Clock Cable


The clock cables are available in two types, namely, 75-ohm clock cable and 120-ohm clock
cable. The clock cable is used to receive and transmit external clock signals. In the case of the
75-ohm clock cable, the cable uses an SMB connector at one end to connect to the external
clock interface of the OptiX OSN equipment. The other end of the cable is connected to the
external clock equipment. The connector needs to be prepared on site as required. In the case
of the 120-ohm clock cable, the cable uses an RJ45 connector at one end to connect to the
external clock interface of the OptiX OSN equipment. The other end of the cable is connected
to the external clock equipment. The connector needs to be prepared on site as required.

1.1.1.1.1727 Structure
Figure 22-41 shows the structure of the 75-ohm clock cable. Figure 22-42 shows the structure
of the 120-ohm clock cable.

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Figure 1.1 Structure of the 75-ohm clock cable

1. Coaxial connector - SMB

2. Label

Figure 1.2 Structure of the 120-ohm clock cable

1. Label 1 (R) and


label 2 (T)

2. Communication
cable

3. Main
label

4. Network interface
connector - RJ-45

1.1.1.1.1728 Pin Assignments


Table 22-46 provides the pin assignments of the 120-ohm clock cable.
Figure 1.1 Pin assignments of the 120-ohm clock cable
X1

Remarks

X1.1

Blue

W1

X1.2

White

X1.4

Orange

X1.5

White

W2

Figure 1.2 Pin assignments of the 120-ohm clock cable


X1

Relationship

Description
External Clock Mode

External Time Mode


(1 PPS + Time
Information)

X1.1
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CLK receive end (-)

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X1

Relationship

22 Cables

Description
External Clock Mode

External Time Mode


(1 PPS + Time
Information)

X1.2
X1.3

Twisted pair

X1.6
X1.4

Twisted pair

X1.5
X1.7

Twisted pair

X1.8

CLK receive end (+)

Not defined

Not defined

1 PPS signal (-)

Not defined

1 PPS signal (+)

CLK transmit end (-)

Grounding end

CLK transmit end (+)

Grounding end

Not defined

Time information (-)

Not defined

Time information (+)

1.1.1.1.1729 Technical Specifications


Item

Description

75-ohm
clock cable

Connector: coaxial connector - SMB - 75 ohms - straight - female


Cable type: coaxial cable - 75 ohms - 3.9 mm - 2.1 mm - 0.34 mm - shielded
Diameter of the shield layer - diameter of the internal insulation layer diameter of the internal conductor: 3.9 mm - 2.1 mm - 0.34 mm
Length: 10 m, 15 m, 20 m, and 30 m

120-ohm
clock cable

Connector X: network interface connector - 8-pin - 8-bit - shielded - crystal


model connector
Cable type: symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.4
mm - 26 AWG - 2 pairs - PANTONE 430U
Diameter of the internal conductor: 0.4 mm/26 AWG
Length: 5 m, 10 m, 20 m, 30 m, 40 m, 50 m, 70 m, and 100 m

22.6.2 One-Channel Clock Transit Cable and Two-Channel Clock


Transit Cable
The clock transit cables are available in two types, namely, one-channel 75-ohm-to-120-ohm
clock transit cable and two-channel 75-ohm-to-120-ohm clock transit cable.

1.1.1.1.1730 Structure
Figure 22-43 shows the structure of the one-channel 75-ohm-to-120-ohm clock transit cable.
Figure 22-44 shows the structure of the two-channel 75-ohm-to-120-ohm clock transit cable.
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22 Cables

Figure 1.1 Structure of the one-channel 75-ohm-to-120-ohm clock transit cable

1. Coaxial connector - SMB - 75 ohms straight/plug - female

2. Main
label

3. 75-ohm-to-120-ohm transit
PCB

Figure 1.2 Structure of the two-channel 75-ohm-to-120-ohm clock transit cable

1. Coaxial connector - SMB - 75 ohms straight/plug - female

2. Label 1:
"1#"

3. Label 2:
"2#"

5. 75-ohm-to-120-ohm transit PCB

6. Label 3:
"1#"

7. Label 4:
"2#"

4. Main
label

1.1.1.1.1731 Pin Assignments


Table 22-48 provides the pin assignments of the two-channel 75-ohm-to-120-ohm clock
transit cable.
Figure 1.1 Pin assignments of the two-channel 75-ohm-to-120-ohm clock transit cable
Connector

75-ohm Cable

Color

120-ohm Cable

X1

Core

Blue

W3

Shield layer

White

Core

Blue

Shield layer

White

X2

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22 Cables

1.1.1.1.1732 Technical Specifications


Item

Description

One
channel

Connector: coaxial connector - SMB - 75 ohms - straight - female


75-ohm cable: coaxial cable - 75 ohms - 3.9 mm - 2.1 mm - 0.34 mm shielded
75-ohm cable: diameter of the shield layer (3.9 mm) - diameter of the internal
insulation layer (2.1 mm) - diameter of the internal conductor (0.34 mm)
120-ohm cable: symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.4
mm - 26 AWG - 2 pairs - PANTONE 430U
Diameter of the internal conductor of the 120-ohm cable: 0.4 mm/26 AWG
Length: 30 m

Two
channels

Connector X1/X2: coaxial connector - SMB - 75 ohms - straight - female


75-ohm cable: coaxial cable - 75 ohms - 3.9 mm - 2.1 mm - 0.34 mm shielded
75-ohm cable: diameter of the shield layer (3.9 mm) - diameter of the internal
insulation layer (2.1 mm) - diameter of the internal conductor (0.34 mm)
120-ohm cable: symmetrical twisted-pair cable - 120 ohms - SEYPVPV - 0.4
mm - 26 AWG - 2 pairs - PANTONE 430U
Diameter of the internal conductor of the 120-ohm cable: 0.4 mm/26 AWG
Length: 30 m

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23 Indicators

23

Indicators

About This Chapter


This topic describes the indicators on the OptiX OSN equipment and the indicators on the
boards of the OptiX OSN equipment.
23.1 Indicators on the Cabinet
This topic describes the indicators on the cabinet of the OptiX OSN equipment.
23.2 Alarm Indicators on the Boards
This topic describes the alarm indicators on the boards.

23.1 Indicators on the Cabinet


This topic describes the indicators on the cabinet of the OptiX OSN equipment.
Indicator

Description

Power indicator Power (green)

On: Power is supplied to the equipment.


Off: Power is not supplied to the equipment.

Critical alarm indicator Critical


(red)

On: A critical alarm occurs on the equipment.

Major alarm indicator Major


(orange)

On: A major alarm occurs on the equipment.

Minor alarm indicator Minor


(yellow)

On: A minor alarm occurs on the equipment.

Issue 02 (2013-01-18)

Off: No critical alarm occurs on the equipment.

Off: No major alarm occurs on the equipment.

Off: No minor alarm occurs on the equipment.

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23 Indicators

23.2 Alarm Indicators on the Boards


This topic describes the alarm indicators on the boards.

1.1.1.1.1733 Board Hardware Status Indicator (STAT)


Status

Meaning

On (green)

The board operates properly.

On (red)

The hardware of the board is faulty or does not


match the equipment.

Off

The board is not powered on or does not start to


work.

STAT indicators are designed for non-service alarms such as alarms related to power, temperature,
abnormal communication, or absent optical modules.

1.1.1.1.1734 Service Activation Status Indicator/Board Status (Active/Standby)

Indicator (ACT)
Status

Meaning of the Service


Activation Status Indicator

Meaning of the Board Status


(Active/Standby) Indicator

On (green)

The services are activated. The


board is in the working state.

The board works as the working


board.

Off

The services are not activated.

The board works as the


protection board.

1.1.1.1.1735 Board Software Status Indicator (PROG)


Status

Meaning

On (green)

The board software or FPGA in the flash is


successfully loaded and stored, or the board
software is successfully initiated.

On for 100 ms and off for 100 ms


repeatedly (green)

The board software is being loaded to the flash or


the FPGA software is being loaded to the FPGA.

On for 300 ms and off for 300 ms


repeatedly (green)

The board software is being initialized and is in


the BIOS boot state.

The board is in the BIOS state because the board


is reset for three times in five minutes.

The board software or FPGA in the flash is lost.

The board software fails to be loaded.

The board software fails to be initialized.

On (red)

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23 Indicators

Status

Meaning

Off

No power is accessed.

The high-power-consumption board enters the


low-power-consumption mode.

1.1.1.1.1736 Service Alarm Indicator (SRV)


Type of Board

Status

Meaning

Service board

On (green)

The services are normal and no


service alarm is generated.

On (red)

A critical or major alarm occurs in


the services.

On (yellow)

A minor or remote alarm occurs in


the services.

Off

The services are not configured and


no alarm is generated, or no power
is supplied to the board.

On (green)

The services are normal and no


service alarm is generated.

On (red)

A critical alarm occurs.

On (yellow)

A minor alarm occurs.

Off

The services are not configured and


no alarm is generated, or no power
is supplied to the board.

On (green)

The services are normal and no


service alarm is generated.

On (red)

A critical or major alarm occurs in


the subrack.

On (yellow)

A minor or remote alarm occurs in


the subrack.

Off

The services are not configured and


no alarm is generated, or no power
is supplied to the board.

Cross-connect and
timing board

System control board

1.1.1.1.1737 Synchronization Clock Status Indicator (SYNC)


Status

Meaning

On (green)

Issue 02 (2013-01-18)

The clock works in free-run mode and the


system clock priority list is not set. By default,
the system clock priority list contains only

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23 Indicators

Status

Meaning
internal sources.

On (red)

The clock works in locked mode and is tracing a


clock source other than the internal sources in
the priority list.

The system clock priority list is set. All the clock


sources, however, are lost except for the internal
clock sources. The clock works in holdover mode or
free-run mode.

1.1.1.1.1738 Alarm Mute Indicator (ALMC)


Status

Meaning

On (yellow)

The board is in the alarm mute state.

Off

When an alarm is generated, the equipment emits an alarm


sound.

1.1.1.1.1739 Power Monitoring Indicators


Indicator

Status

Meaning

48 V power supply indicator of


channel A (PWRA)

On (green)

The 48 V power supply of channel


A is normal.

On (red)

The 48 V power supply of channel


A is faulty (lost or failed).

On (green)

The 48 V power supply of channel


B is normal.

On (red)

The 48 V power supply of channel


B is faulty (lost or failed).

On (green)

The +3.3 V backup power supply of


the system is normal.

On (red)

The +3.3 V backup power supply of


the system is lost.

48 V power supply indicator of


channel B (PWRB)

+3.3 V backup power supply


indicator of the system (PWRC)

1.1.1.1.1740 Ethernet Indicators


Indicator

Status

Meaning

Connection status indicator


LINK (green)

On

The fiber cable is successfully


connected to the equipment.

Off

The fiber cable is not connected to the

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Indicator

23 Indicators

Status

Meaning
equipment.

Data receiving and


transmission indicator ACT
(orange)

Flashing

The Ethernet interface is receiving or


transmitting data.

Off

The Ethernet interface is not receiving


or transmitting data.

1.1.1.1.1741 FAN Running Status Indicator (STATE)


Status

Meaning

On (green)

The fan operates properly.

On (red)

The fan, fan power supply board, or fan control


board is abnormal.

On (yellow)

The fan stops when the temperature is very low.

1.1.1.1.1742 Indicators on the Front Panel of the COA


Indicator

Status

Meaning

Running indicator
RUN (green)

Flashing once every two


seconds (green)

The COA operates properly.

Flashing once every four


seconds (green)

The COA is in database protection


mode. The communication between the
COA and the SCC is interrupted.

Flashing five times every


second (green)

The program is being started or loaded.

On (red)

Errors occur during the memory selfcheck.

Flashing thrice every other


second (red)

A critical alarm occurs.

Flashing twice every other


second (red)

A major alarm occurs.

Flashing once every other


second (red)

A minor alarm occurs.

Alarm indicator
ALM

1.1.1.1.1743 Power Indicator (POWER)


Status

Meaning

On (green)

The input of the power supply is normal.

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23 Indicators

Status

Meaning

Off

No power is supplied or the power supply fails.

1.1.1.1.1744 Indicators on the UPM


Module

Indicator

Status

Meaning

Rectifier
module

RUN
(green)

On

The rectifier module operates properly.

Off

The rectifier module is faulty or is


disabled.

ALM
(yellow)

Off

The rectifier module operates properly.

On

An alarm and revertive protection occur on


the module.

Flashing

The communication is interrupted.

FAULT
(red)

On

The rectifier module is faulty.

RUN

Flashing
(green)

Flashing slowly (on for 1s and off for 1s


repeatedly): The entire power system is
normal.

Monitoring
module

Flashing quickly (on for 125 ms and off for


125 ms repeatedly): The power system is
not registered or the communication is
interrupted.
ALM

Issue 02 (2013-01-18)

On (red)

The entire power system is faulty. In


normal situations, the indicator is off.

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24 Labels

24

Labels

About This Chapter


This topic describes the safety labels and engineering labels on the OptiX OSN equipment.
24.1 Safety Labels
Various safety labels are attached to the equipment. This topic provides the indications and
positions of the safety labels.
24.2 Engineering Labels
The engineering labels should be prepared according to the local engineering specifications or
Huawei engineering specifications.

24.1 Safety Labels


Various safety labels are attached to the equipment. This topic provides the indications and
positions of the safety labels.

24.1.1 Label Description


Labels, such as the ESD protection label, grounding label, and fan warning label are attached
to the subrack.
Figure 1.1 Labels on the equipment
Label

Issue 02 (2013-01-18)

Label Name

Indication

ESD protection
label

The equipment is
sensitive to static
electricity.

Laser safety
class label

The power class of


the laser source

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Label

! ATTENTION
CLEAN PERIODICALLY

DON'T TOUCH THE


FAN LEAVESBEFORE
THEYSLOW DOWN !

APD

24 Labels

Label Name

Indication

Grounding label

The grounding
position

Periodic
cleaning label

The air filter should


be cleaned
periodically.

Fan warning
label

The fan blades


should not be
touched when the
fan is rotating.

APD warning
label

The overload point


of the indicator is
9 dBm.

RoHS label

The equipment may


contain some of the
poisonous
substances
specified by the
regulations in
China, but can be
safely used within a
period of 50 years.
The equipment
should be recycled
or reused after 50
years.

Product
nameplate label

The product name


and certification

Receiver
MAX:-9dBm

In the case of the enhanced subrack:

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Label

24 Labels

Label Name

Indication

Certificate of
qualification
label

The equipment is
qualified.

24.1.2 Label Position


The ESD protection label and grounding label are attached to the subrack. The laser safety
class label and APD warning label are attached to the front panel of the board.

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24 Labels

Figure 1.1 Positions of the labels attached to the OptiX OSN 3500 subrack (1)

50

DON'T

TOUCH THE

FAN LEAVES BEFORE


THEY SLOW DOWN !

ATTENTION
CLEAN PERIODICALLY

Figure 1.2 Positions of the labels attached to the OptiX OSN 3500 subrack (2)

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24 Labels

Figure 1.3 Positions of the labels attached to the board


SL16

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

BA2
LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS
CLASS 1M LASER
PRODUCT

24.2 Engineering Labels


The engineering labels should be prepared according to the local engineering specifications or
Huawei engineering specifications.
Table 24-2 provides the engineering specifications of Huawei.
For information on how to prepare and attach labels, see the OptiX OSN 3500 Intelligent
Optical Transmission System Installation Guide.
Figure 1.2 Huawei specifications for the engineering labels
Label
Engineer
ing label
for the
power
cable

Illustration
TO:
A01
B08

(1)

-48V2

Description
TO:
B03

-48V2

(2)

(1) Label on the loaded cabinet side, that is,


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On the loaded cabinet side, the


label marked with "A01/B08
48V2" on the cable indicates
that the cable supplies the 48
V2 power. This cable is led out
from the eighth connector in the
second row of the 48 V bus bar
in the power distribution cabinet
in row A and column 01 in the
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Label

24 Labels

Illustration

Description

the position of the cable on the power


distribution cabinet side

equipment room.

(2) Label on the power distribution cabinet


side, that is, the position of the cable on the
loaded cabinet side

Engineer
ing label
for the
external
alarm
cable

On the power distribution


cabinet side, the label marked
with "B0348V2" on the
cable indicates that the cable
supplies the 48 V2 power. This
cable is led out from the loaded
cabinet in row B and column 03
in the equipment room. In the
case of the PGND cable and
BGND cable, specify only the
row number and column number
of the power distribution
cabinet. It is not required to
specify the connector on the bus
bar.
The external alarm cable is
connected to the power
distribution cabinet (the first
cabinet in each row used for
power distribution). Attach
labels to the terminals of the
power distribution cabinet to
indicate the equipment that uses
the terminals. No engineering
label needs to be attached to the
equipment side, unless otherwise
specified.
"A01" indicates that the alarm
cable connects the power
distribution cabinet and the
cabinet in row A and column 01
in the equipment room.

Engineer
ing label
for the
network
cable

"A01-03-06-05" indicates that


the local end of the network
cable is connected to network
port 05 in slot 06 of subrack 03
in the cabinet in row A and
column 01 in the equipment
room.
"B02-03-12" indicates that the
opposite end of the network
cable is connected to network
port 12 in subrack 03 in the
cabinet in row B and column 02
in the equipment room. It is not
required to specify the slot
number.

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Label

Illustration

24 Labels

Description

Engineer
ing label
for the
fiber that
connects
two
pieces of
equipme
nt

"A01-01-05-05-R" indicates that


the local end of the fiber is
connected to optical receiving
port 05 in slot 05 of subrack 01
in the cabinet in row A and
column 01 in the equipment
room.

Engineer
ing label
for the
fiber that
connects
the
equipme
nt and
the ODF

"ODF-G01-01-01-R" indicates
that the local end of the fiber is
connected to the optical
receiving terminal in row 01 and
column 01 of the ODF in row G
and column 01 in the equipment
room.

Engineer
ing label
for the
trunk
cable
that
connects
the
equipme
nt and
the DDF

"A01-03-01-01-R" indicates that


the local end of the trunk cable
is connected to the receiving
terminal of trunk cable 01 in slot
01 of subrack 03 in the cabinet
in row A and column 01 in the
equipment room.

Engineer
ing label
for the
subscrib
er cable

"A01-03-01-01" indicates that


the local end of the subscriber
cable is connected to cable 01 in
slot 01 of subrack 03 in the
cabinet in row A and column 01

"A01-01-05-05-R" indicates that


the opposite end of the fiber is
connected to optical receiving
port 05 in slot 05 of subrack 01
in the cabinet in row A and
column 01 in the equipment
room.

"DDF-G01-01-01-AR" indicates
that the opposite end of the trunk
cable is connected to the
receiving terminal of direction A
(connected to the optical
transmission equipment) in row
01 and column 01 of the DDF in
row G and column 01 in the
equipment room.

TO:

Issue 02 (2013-01-18)

"G01-01-01-01-T" indicates that


the opposite end of the fiber is
connected to optical transmitting
port 01 in slot 01 of subrack 01
in the cabinet in row G and
column 01 in the equipment
room.

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Label

Illustration

24 Labels

Description
in the equipment room.
"MDF-G01-01-01" indicates
that the opposite end of the
subscriber cable is connected to
the terminal in row 01 and
column 01 of the MDF in row G
and column 01 in the equipment
room.

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25

25 Board Information Quick Reference

Board Information Quick Reference

About This Chapter


This topic provides information about whether a board is supported by the OptiX OSN
products, the parameters specified for the interfaces of the boards (including the parameters
specified for optical interfaces, electrical interfaces, and auxiliary interfaces), the loopback
capability of each board, the functions supported by each board, and the protection schemes
supported by each board.
25.1 Board Version Replacement
The board version replacement function is used only for some specified boards. Before using
this function, you should be familiar with the mapping between boards and their substitute
boards.
25.2 Quick Reference Table for Optical Interfaces
This topic lists the common parameters specified for the interfaces of boards.
25.3 Quick Reference of Board Functions
This topic describes the functions supported by SDH boards, PDH boards, data boards, and
packet boards.
25.4 Loopback Capability of the Boards
The SDH boards, PDH boards, and data boards of the OptiX OSN equipment support various
types of loopbacks.
25.5 Protection Schemes Supported by Each Board
The SDH boards, PDH boards, data boards, and packet boards of the OptiX OSN equipment
support various protection schemes.
25.6 Quick Reference of Power Consumption and Weight of Each Board
This section lists the power consumption and weight of each board of the OptiX OSN series
equipment.

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25 Board Information Quick Reference

25.1 Board Version Replacement


The board version replacement function is used only for some specified boards. Before using
this function, you should be familiar with the mapping between boards and their substitute
boards.
Table 25-1 provides the mapping between boards and their substitute boards.
Figure 1.3 Mapping between boards and their substitute boards
Substitute Board

To-Be-Substituted Board

Physical Board

Logical Board

Physical Board

N1PSXCS

N1SXCSA

N1SXCSA

N1PSXCS
N1SXCSA

N1EXCSA

N1EXCSA

N1SXCSA

N1UXCSA

N1UXCSA
N1SXCSB

N1UXCSB

N1UXCSB

N1SXCSB
N2PSXCSA

N1PSXCS

N1PSXCS

N2PSXCSA
N3PSXCSA

N1SXCSA

N1SXCSA

N1PSXCS

N1PSXCS

N2PSXCSA
N3PSXCSA
N1SL1A

N1SL1

N2PSXCSA
N1SL1

N1SL1A
N1SL4A

N1SL4

N1SL4

N1SL4A
N1SL64

N1SL64

N2SL64

N2SL64

T2SL64

T2SL64
N1SLD4A

N1SLD4

N1SLD4

N1SLD4A
N1SLQ1A

N1SLQ1

N1SLQ1

N1SLQ1A
N1SLQ4A

N1SLQ4

N1SLQ4

N1SLQ4A
N2SLQ16

N1SLQ16

N1SLQ16

N2SLQ16
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25 Board Information Quick Reference

Substitute Board

To-Be-Substituted Board

Physical Board

Logical Board

Physical Board

N3SL16

N1SL16

N1SL16

N3SL16
N3SL16A

N1SL16

N1SL16A

N3SL16
N3SLQ41

N1SLQ1

N1SLQ1

N1SLQ4

N1SLQ4

N2SLQ1
N2SLQ4
N4SF64

N2SLQ1

N3SLQ41

N2SLQ4

N1SF64

N1SF64

N4SF64
N4SL64

N1SL64

N1SL64

N2SL64

N2SL64

T2SL64
N4SL64
N4SLD64

N1SLD64

T2SL64
N1SLD64

N4SLD64
N4SLO16

N1SLO16

N1SLO16

N4SLO16
N4SLQ16

N1SLQ16

N1SLQ16

N2SLQ16

N2SLQ16

N4SLQ16
N2PD3

N1PD3

N1PD3

N2PD3
N2PL3

N1PL3

N1PL3

N2PL3
N2PL3A

N1PL3A

N1PL3A

N2PL3A
N2PQ1

N1PQ1

N1PQ1

N2PQ1
N2PQ1A

N2PQ1

N1PQ1A

N2PQ1B

N2PQ1

N1PQ1B

N2SPQ4

N1SPQ4

N1SPQ4

N2SPQ4
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25 Board Information Quick Reference

Substitute Board

To-Be-Substituted Board

Physical Board

Logical Board

Physical Board

R2PD1

R1PD1

R1PD1

R2PD1
R2PD1A

R2PD1

R1PD1A

R2PD1B

R2PD1

R1PD1B

N2EFS0

N1EFS0

N1EFS0

N2EFS0
N2EFS4

N1EFS4

N1EFS4

N2EFS4
N2EFT8

N1EFT8

N1EFT8

N2EFT8
N2EFT8A

N1EFT8A

N1EFT8A

N2EFT8A
N2EGS2

N1EGS2

N1EGS2

N2EGS2
N2EGT2

N1EGT2

N1EGT2

N2EGT2
N3EFS4

N1EFS4

N1EFS4

N2EFS4

N2EFS4

N3EFS4
N3EGS2

N1EGS2

N1EGS2

N2EGS2

N2EGS2

N3EGS2
N4EFS0

N1EFS0

N1EFS0

N2EFS0

N2EFS0

N4EFS0
N4EGS4

N3EGS4

N3EGS4

N4EGS4
N5EFS0

N1EFS0

N1EFS0

N2EFS0

N2EFS0

N4EFS0
N5EFS0
Q2SAP

Q1SAP

N4EFS0
Q1SAP

Q2SAP
TN12OBU1
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25 Board Information Quick Reference

A substitute board may not support all the functions of its to-be-substituted board. Therefore,
when you replace a board with its substitute board, consider the differences between the two
boards. If a substitute board does not support an enabled function of its to-be-substituted
board and the enabled function may be used on the live network, the board cannot be
replaced. For restrictions on board replacement, see Table 25-2.
Figure 1.4 Restrictions on board replacement
Board That Supports the
Board Version
Replacement Function

Board That Cannot Be


Substituted

Condition

N1SL16A

N2SL16A

The TCM function is


enabled for the
N2SL16A/N3SL16A.

N3SL16A
N1SL64

N2SL64
T2SL64

The TCM function is


enabled or AU-3 services are
configured for the
N2SL64/T2SL64.

N1SLQ16

N2SLQ16

The TCM function is


enabled or AU-3 services are
configured for the
N2SLQ16.

N3SL16

N2SL16

The TCM function is


enabled or AU-3 services are
configured for the N2SL16.

N3SL16A

N2SL16A

AU-3 services are


configured for the
N2SL16A.

N3SLO1

N2SLO1

AU-3 services are


configured for the N2SLO1.

N4SL64

N2SL64
T2SL64

The TCM function is


enabled or AU-3 services are
configured for the
N2SL64/T2SL64.

N1EFS0

The N1EFS0 is
configured with QoS
functions.

If an N4EFS0/N2EFS0 is
configured as an
N1EFS0 and the
simulation package
loading method is used,
the board software of the
N1EFS0 is loaded. As a
result, a cold reset is
performed on the board
and the board version

N2EFS0
N4EFS0

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Board That Supports the


Board Version
Replacement Function

25 Board Information Quick Reference

Board That Cannot Be


Substituted

Condition

replacement function
becomes ineffective.
Therefore, an
N4EFS0/N2EFS0 must
not be configured as an
N1EFS0.
N2EFS4

N1EFS4

If an N2EFS4 is configured
as an N1EFS4 and the
simulation package loading
method is used, the board
software of the N1EFS4 is
loaded. As a result, a cold
reset is performed on the
board and the board version
replacement function
becomes ineffective.
Therefore, an N2EFS4 must
not be configured as an
N1EFS4.

N4EFS0

N2EFS0

If an N4EFS0 is configured
as an N2EFS0 and the
simulation package loading
method is used, the board
software of the N2EFS0 is
loaded. As a result, a cold
reset is performed on the
board and the board version
replacement function
becomes ineffective.
Therefore, an N4EFS0 must
not be configured as an
N2EFS0.

N2EGS2

N1EGS2

The N1EGS2 is configured


with QoS functions.

N1BPA

N2BPA

The ALS function is


required but not enabled on
the line board.

N2BPA

N1BPA

The ALS function is


required but not enabled on
the N2BPA.

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25 Board Information Quick Reference

25.2 Quick Reference Table for Optical Interfaces


This topic lists the common parameters specified for the interfaces of boards.

25.2.1 Common Parameters Specified for Optical Interfaces of SDH


Boards
This topic describes common parameters specified for optical interfaces of SDH boards.
Table 25-3 lists the common parameters specified for the white optical interfaces of the SDH
boards.
Table 25-4 lists the common parameters specified for the white optical interfaces of the SDH
boards with FEC function.
Table 25-5 lists the parameters specified for the colored optical interfaces of the SDH boards.
Figure 1.5 Common parameters specified for the white optical interfaces of the SDH boards
Board Name

SL1 and SL1A

SLQ1 and
SLQ1A

Issue 02 (2013-01-18)

Optical Module
Type of
Support
ed
Optical
Interfac
e

Mean Launched
Optical Power
Minimu
m (dBm)

Maximu
m (dBm)

I-1

-15

S-1.1

Type
of
Fiber

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d (dBm)

-8

-23

-8

Singlemode
LC

-15

-8

-28

-8

Singlemode
LC

L-1.1

-5

-34

-10

Singlemode
LC

L-1.2

-5

-34

-10

Singlemode
LC

Ve-1.2

-3

-34

-10

Singlemode
LC

I-1

-15

-8

-23

-8

Singlemode
LC

S-1.1

-15

-8

-28

-8

Singlemode
LC

L-1.1

-5

-34

-10

Singlemode

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Board Name

25 Board Information Quick Reference

Optical Module
Type of
Support
ed
Optical
Interfac
e

Mean Launched
Optical Power

L-1.2

-5

-34

-10

Singlemode
LC

Ve-1.2

-3

-34

-10

Singlemode
LC

Ie-1

-19

-14

-30

-14

Multimode
LC

SLT1

S-1.1

-15

-8

-28

-8

Singlemode
LC

SL4, SL4A,
SLD4, SLD4A,
SLQ4, and
SLQ4A

I-4

-15

-8

-23

-8

Singlemode
LC

S-4.1

-15

-8

-28

-8

Singlemode
LC

L-4.1

-3

-28

-8

Singlemode
LC

L-4.2

-3

-28

-8

Singlemode
LC

Ve-4.2

-3

-34

-13

Singlemode
LC

L-16.2

-2

-28

-9

Singlemode
LC

L-16.2Je

-28

-9

Singlemode
LC

V-16.2Je
(BA)

-2
(without
the BA)

3 (without
the BA)

-28

-9

Singlemode
LC

SL16

Minimu
m (dBm)

Minimu
m
Overloa
d (dBm)

LC

13 (with
Issue 02 (2013-01-18)

Maximu
m (dBm)

Receiver
Sensitivit
y (dBm)

Type
of
Fiber

15 (with
the BA)

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Board Name

25 Board Information Quick Reference

Optical Module
Type of
Support
ed
Optical
Interfac
e

Mean Launched
Optical Power

U-16.2Je
(BA+PA)

-2
(without
the BA or
PA)

Minimu
m (dBm)

SLD16

SLQ16

Issue 02 (2013-01-18)

Minimu
m
Overloa
d (dBm)

-28
(without
the BA or
PA)

-9
(without
the BA
or PA)

-32 (with
the PA)

-10 (with
the PA)

the BA)

15 (with
the BA)
SL16A

Maximu
m (dBm)

Receiver
Sensitivit
y (dBm)

Type
of
Fiber

3 (without
the BA or
PA)
18 (with
the BA)

Singlemode
LC

I-16

-10

-3

-18

-3

Singlemode
LC

S-16.1

-5

-18

Singlemode
LC

L-16.1

-2

-27

-9

Singlemode
LC

L-16.2

-2

-28

-9

Singlemode
LC

I-16

-10

-3

-18

-3

Singlemode
LC

S-16.1

-5

-18

Singlemode
LC

L-16.1

-2

-27

-9

Singlemode
LC

L-16.2

-2

-28

-9

Singlemode
LC

I-16

-10

-3

-18

-3

Singlemode
LC

S-16.1

-5

-18

Singlemode
LC

L-16.1

-2

-27

-9

Single-

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Board Name

SLO16

SL64

25 Board Information Quick Reference

Optical Module
Type of
Support
ed
Optical
Interfac
e

Mean Launched
Optical Power

L-16.2

-2

-28

-9

Singlemode
LC

I-16

-10

-3

-18

-3

Singlemode
LC

S-16.1

-5

-18

Singlemode
LC

L-16.1

-2

-27

-9

Singlemode
LC

L-16.2

-2

-28

-9

Singlemode
LC

I-64.1

-6

-1

-11

-1

Singlemode
LC

I-64.2

-5

-1

-14

-1

Singlemode
LC

S-64.2b

-1

-14

-1

Singlemode
LC

L-64.2b
(BA)

-4
(without
the BA)

2 (without
the BA)

-14

-1

Singlemode
LC

Minimu
m (dBm)

Minimu
m
Overloa
d (dBm)

mode
LC

13 (with
the BA)

Issue 02 (2013-01-18)

Maximu
m (dBm)

Receiver
Sensitivit
y (dBm)

Type
of
Fiber

15 (with
the BA)

P1L12D2

-24

-7

Singlemode
LC

Le-64.2

-21

-8

Singlemode
LC

Ls-64.2

-21

-8

Single-

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Board Name

SL64A

25 Board Information Quick Reference

Optical Module
Type of
Support
ed
Optical
Interfac
e

Mean Launched
Optical Power

V-64.2b
(BA+PA
+DCU)

-4
(without
the BA,
PA, or
DCU)

-1
(without
the BA,
PA, or
DCU)

-14
(without
the BA,
PA, or
DCU)

13 (with
the BA)

15 (with
the BA)

-26 (with
the PA)

I-64.2

-5

-1

S-64.2b

-1

L-64.2b
(BA)

-4
(without
the BA)

Minimu
m (dBm)

Issue 02 (2013-01-18)

Minimu
m
Overloa
d (dBm)

mode
LC

13 (with
the BA)

SLD64

Maximu
m (dBm)

Receiver
Sensitivit
y (dBm)

Type
of
Fiber

-1

Singlemode
LC

-14

-1

Singlemode
LC

-14

-1

Singlemode
LC

2 (without
the BA)

-14

-1

Singlemode
LC

15 (with
the BA)

Le-64.2

-21

-8

Singlemode
LC

Ls-64.2

-21

-8

Singlemode
LC

V-64.2b
(BA+PA
+DCU)

-4
(without
the BA,
PA, or
DCU)

-1
(without
the BA,
PA, or
DCU)

-14
(without
the BA,
PA, or
DCU)

-1

Singlemode
LC

13 (with
the BA)

15 (with
the BA)

-26 (with
the PA)

I-64.1

-6

-1

-11

-1

Singlemode
LC

S-64.2b

-1

-14

-1

Singlemode
LC

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25 Board Information Quick Reference

Board Name

Optical Module
Mean Launched
Optical Power

SLQ41

Type of
Support
ed
Optical
Interfac
e
I-1

SLH41

Issue 02 (2013-01-18)

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d (dBm)

Type
of
Fiber

Minimu
m (dBm)

Maximu
m (dBm)

-15

-8

-23

-8

Singlemode
LC

S-1.1

-15

-8

-28

-8

Singlemode
LC

L-1.1

-5

-34

-10

Singlemode
LC

L-1.2

-5

-34

-10

Singlemode
LC

Ve-1.2

-3

-34

-10

Singlemode
LC

I-4

-15

-8

-23

-8

Singlemode
LC

S-4.1

-15

-8

-28

-8

Singlemode
LC

L-4.1

-3

-28

-8

Singlemode
LC

L-4.2

-3

-28

-8

Singlemode
LC

Ve-4.2

-3

-34

-13

Singlemode
LC

S-1.1

-15

-8

-28

-8

Singlemode
LC

L-1.1

-5

-34

-10

Singlemode
LC

S-4.1

-15

-8

-28

-8

Singlemode

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Board Name

25 Board Information Quick Reference

Optical Module
Type of
Support
ed
Optical
Interfac
e

Mean Launched
Optical Power
Minimu
m (dBm)

Maximu
m (dBm)

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d (dBm)

Type
of
Fiber

LC

Figure 1.6 Common parameters specified for the white optical interfaces of the SDH boards with
FEC function
Board
Name

SF16

Optical Module
Type of
Supporte
d Optical
Interface

Mean Launched
Optical Power
Minimum
(dBm)

Maximum
(dBm)

Ue-16.2c

-5 (without
the BA or
PA)

Receiver
Sensitivity
(dBm)

Minimu
m
Overload
(dBm)

-1 (without
the BA or
PA)

-27.5
(without the
BA or PA)

-10

Singlemode
LC

13 (with
the BA)

15 (with
the BA)

-37 (with
the PA)

-5 (without
the BA or
PA)

-1 (without
the BA or
PA)

-27.5
(without the
BA or PA)

-10

Singlemode
LC

13 (with
the BA)

15 (with
the BA)

-37 (with
the PA)

-5 (without
the BA,
RA, or PA)

-1 (without
the BA,
RA, or PA)

-10

Singlemode
LC

15 (with
the BA)

18 (with
the BA)

-27.5
(without the
BA, RA, or
PA)

Ue-64.2c

-3

-14

-1

Singlemode
LC

Ue-64.2d

-3

-14

-1

Singlemode
LC

Ue-64.2e

-3

-14

-1

Singlemode
LC

Ue-64.2c

-4

-1

-14

-1

Singlemode

Ue-16.2d

Ue-16.2f

SF64

SF64A

Issue 02 (2013-01-18)

Type of
Fiber

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Board
Name

25 Board Information Quick Reference

Optical Module
Type of
Supporte
d Optical
Interface

Mean Launched
Optical Power
Minimum
(dBm)

Maximum
(dBm)

Receiver
Sensitivity
(dBm)

Minimu
m
Overload
(dBm)

Type of
Fiber

LC

SFD64

Ue-64.2d

-4

-1

-14

-1

Singlemode
LC

Ue-64.2e

-4

-1

-14

-1

Singlemode
LC

Ue-64.2c

-4

-1

-14

-1

Singlemode
LC

Ue-64.2d

-4

-1

-14

-1

Singlemode
LC

Ue-64.2e

-4

-1

-14

-1

Singlemode
LC

Figure 1.7 Common parameters specified for the colored optical interfaces of the SDH boards
Board Name

Optical Module
Type of
Support
ed
Optical
Interfac
e

Mean Launched
Optical Power
Minimu
m (dBm)

Maximu
m (dBm)

N3SLQ41,
N3SL16A,
N3SLH41,
N4SLO16,
N4SLQ16, and
N1SL4A

CWDM
(80 km)

DWDM
(120
km)

N4SLD64 and
N4SL64

CWDM
(70 km)

Issue 02 (2013-01-18)

Type
of
Fiber

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d (dBm)

-28

-9

Singlemode
LC

-1

-28

-9

Singlemode
LC

-23
(1451
nm to
1551
nm)

-9

Singlemode
LC

-22

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Board Name

25 Board Information Quick Reference

Optical Module
Type of
Support
ed
Optical
Interfac
e

Mean Launched
Optical Power
Minimu
m (dBm)

Maximu
m (dBm)

Receiver
Sensitivit
y (dBm)

Minimu
m
Overloa
d (dBm)

Type
of
Fiber

(1571
nm)

-21
(1591
nm to
1611
nm)

DWDM
(40 km)

-1

-17

-1

Singlemode
LC

DWDM
(80 km)

-1

-24

-9

Singlemode
LC

N4SFD64,
N1SF64,
N1SF64A,
N4SF64, N1SL64,
T2SL64, T2SL64A,
and N2SL64

DWDM
(40 km)

-1

-17

-1

Singlemode
LC

N3SL16

DWDM
(170
km)

-2

-28

-9

Singlemode
LC

DWDM
(640
km)

-2

2.5

-28

10

Singlemode
LC

N1SF16

DWDM
(640
km)

-2

2.5

-28

10

Singlemode
LC

N1SF16E

DWDM
(120
km)

-1

-28

-9

Singlemode
LC

25.2.2 Parameters Specified for the Optical Ports of PDH Boards


This topic lists parameters specified for optical ports of PDH boards.
Table 25-6 lists the common parameters specified for the optical interfaces of the PDH
boards.

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25 Board Information Quick Reference

Figure 1.8 Common parameters specified for the optical interfaces of the PDH boards
Board
Name

PFL1

Optical Module
Type of
Supporte
d Optical
Interface

Mean Launched Optical


Power
Minimum
(dBm)

Maximum
(dBm)

I-2M

-15

-8

Receiver
Sensitivity
(dBm)

Minimu
m
Overload

-23

-8

Type of
Fiber

Singlemode
LC

25.2.3 Common Parameters Specified for Optical Interfaces of Packet


Boards
This topic describes common parameters specified for optical interfaces of packet boards.
Table 25-7 lists common parameters specified for optical interfaces of packet processing
boards.Table 25-8 lists common parameters specified for optical interfaces of packet interface
boards.
Figure 1.9 Parameters specified for optical interfaces of packet processing boards
Board Name

N1PEX1

Issue 02 (2013-01-18)

Optical Module
Type
of
Interfa
ce

Mean Launched
Optical Power
Minimu
m
(dBm)

Maximu
m
(dBm)

10GB
ASESR/SW

-7.3

10GB
ASELR/L
W

Type
of
Fiber

Trans
missio
n
Dista
nce
(km)

Receive
r
Sensitivi
ty
(dBm)

Minim
um
Overlo
ad
(dBm)

-1.3

-7.5

-1

Multimode
LC

0.3

-6

-1

-11

-1

Single
-mode
LC

10

10GB
ASEER/E
W

-1

-15

-1

Single
-mode
LC

40

10GB
ASEZR/Z
W

-24

-7

Single
-mode
LC

80

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Board Name

N2PEX1

PEG16

PEX2

PEG8

Issue 02 (2013-01-18)

25 Board Information Quick Reference

Optical Module
Type
of
Interfa
ce

Mean Launched
Optical Power
Minimu
m
(dBm)

Maximu
m
(dBm)

10GB
ASELR

-6

10GB
ASEER

Type
of
Fiber

Trans
missio
n
Dista
nce
(km)

Receive
r
Sensitivi
ty
(dBm)

Minim
um
Overlo
ad
(dBm)

-1

-11

-1

Single
-mode
LC

10

-1

-15

-1

Single
-mode
LC

40

10GB
ASEZR

-24

-7

Single
-mode
LC

80

1000B
ASEZX

-2

-23

-3

Single
-mode
LC

80

1000B
ASEVX

-5

-23

-3

Single
-mode
LC

40

1000B
ASELX

-9

-3

-20

-3

Single
-mode
LC

10

1000B
ASESX

-9.5

-2.5

-17

Multimode
LC

0.5

10GB
ASELR

-6

-1

-11

-1

Single
-mode
LC

10

10GB
ASEER

-1

-15

-1

Single
-mode
LC

40

10GB
ASEZR

-24

-7

Single
-mode
LC

80

1000B
ASEZX

-2

-23

-3

Single
-mode
LC

80

1000B
ASEVX

-5

-23

-3

Single
-mode
LC

40

1000B
ASE-

-9

-3

-20

-3

Single
-mode

10

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Board Name

25 Board Information Quick Reference

Optical Module
Type
of
Interfa
ce

Mean Launched
Optical Power
Minimu
m
(dBm)

Maximu
m
(dBm)

Receive
r
Sensitivi
ty
(dBm)

Minim
um
Overlo
ad
(dBm)

LX
1000B
ASESX

Type
of
Fiber

Trans
missio
n
Dista
nce
(km)

LC
-9.5

-2.5

-17

Multimode
LC

0.5

Figure 1.10 Parameters specified for optical interfaces of packet interface boards
Board
Name

CQ1

PEFF8

Issue 02 (2013-01-18)

Optical Module
Type of
Interfac
e

Mean Launched
Optical Power
Minimu
m
(dBm)

Maximu
m
(dBm)

S-1.1

-15

L-1.1

Type of
Fiber

Transmi
ssion
Distance
(km)

Receive
r
Sensitivi
ty
(dBm)

Minimu
m
Overloa
d (dBm)

-8

-28

-8

Singlemode
LC

2 to 15

-5

-34

-10

Singlemode
LC

15 to 40

L-1.2

-5

-34

-10

Singlemode
LC

40 to 80

100BAS
E-ZX

-5

-34

-10

Singlemode
LC

80

100BAS
E-VX

-5

-34

-10

Singlemode
LC

40

100BAS
E-LX

-15

-8

-28

-8

Singlemode
LC

15

100BAS
E-FX

-19

-14

-30

-14

Multimode
LC

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25 Board Information Quick Reference

25.2.4 Common Parameters Specified for Optical Interfaces of Packet


Boards
This topic describes common parameters specified for optical interfaces of the EoD.
Table 25-9 lists the parameters specified for optical interfaces of the EoD.
Figure 1.11 Parameters specified for optical interfaces of the EoD
Board
Name

EDQ41

Optical Module
Type of
Interface

Mean Launched Optical


Power

Receiver
Sensitivity
(dBm)

Minimu
m
Overload
(dBm)

Type of
Fiber

Maximum
(dBm)

Minimum
(dBm)

S-1.1

-8

-15

-28

-8

Singlemode
LC

L-1.1

-5

-34

-10

Singlemode
LC

L-1.2

-5

-34

-10

Singlemode
LC

S-4.1

-8

-15

-28

-8

Singlemode
LC

L-4.1

-2

-3

-28

-8

Singlemode
LC

L-4.2

-2

-3

-28

-8

Singlemode
LC

Ve-4.2

-2

-3

-34

-13

Singlemode
LC

25.2.5 Common Parameters Specified for Optical Interfaces of Data


Boards
This topic describes common parameters specified for optical interfaces of data boards.
Table 25-10 lists the common parameters specified for the optical interfaces of the data
boards.

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25 Board Information Quick Reference

Figure 1.12 Common parameters specified for the optical interfaces of the data boards
Board Name

Optical Module
Type
of
Suppo
rted
Optica
l
Interf
ace

Mean Launched
Optical Power

Receive
r
Sensitiv
ity
(dBm)

Minim
um
Overlo
ad
(dBm)

Type
of
Fiber

Minim
um
(dBm)

Maxim
um
(dBm)

EGS2, EGS4, EGR2, EGT2, 1000B


EMS2, EMS4, EGS4, EGS4A ASEand EMR0
ZX (80
km)

-2

-23

-3

Singl
emode
LC

1000B
ASEVX
(40
km)

-5

-23

-3

Singl
emode
LC

1000B
ASELX (10
km)

-9

-3

-20

-3

Singl
emode
LC

1000B
ASESX
(0.5
km)

-9.5

-2.5

-17

Multi
mode
LC

EAS2

10GB
ASELR/L
W

-6

-1

-11

-1

Singl
emode
LC

EFF8, EFF8A

100BA
SELX(15
km)

-15

-8

-28

-8

Singl
emode
LC

100BA
SEFX(2
km)

-19

-14

-30

-14

Multi
mode
LC

S-4.1

-15

-8

-28

-8

Singl
emode
LC

L-4.1

-3

-28

-8

Singl
emode

ADL4, IDL4

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Board Name

ADQ1, IDQ1

MST4

25 Board Information Quick Reference

Optical Module
Type
of
Suppo
rted
Optica
l
Interf

Mean Launched
Optical Power

L-4.2

-3

-28

-8

Singl
emode
LC

Ve-4.2

-3

-34

-13

Singl
emode
LC

Ie-1

-19

-14

-30

-14

Multi
mode
LC

S-1.1

-15

-8

-28

-8

Singl
emode
LC

L-1.1

-5

-34

-10

Singl
emode
LC

L-1.2

-5

-34

-10

Singl
emode
LC

Ve-1.2

-3

-34

-10

Singl
emode
LC

X3.29
6/
(DVBASI)
EN500
83-9

-15

-8

-31

-8

Singl
emode
LC

-19

-14

-30

-14

Singl
emode
LC

-9.5

-2.5

-17

Singl
e-

Minim
um
(dBm)

Maxim
um
(dBm)

Receive
r
Sensitiv
ity
(dBm)

Minim
um
Overlo
ad
(dBm)

LC

200M5SN-I
200SMIssue 02 (2013-01-18)

Type
of
Fiber

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25 Board Information Quick Reference

Board Name

Optical Module
Type
of
Suppo
rted
Optica
l
Interf
LC-I

Mean Launched
Optical Power
Minim
um
(dBm)

Maxim
um
(dBm)

Receive
r
Sensitiv
ity
(dBm)

Minim
um
Overlo
ad
(dBm)

Type
of
Fiber

mode
LC
-10

-3

-21

-3

Multi
mode
LC

-5

-21

Singl
emode
LC

25.3 Quick Reference of Board Functions


This topic describes the functions supported by SDH boards, PDH boards, data boards, and
packet boards.

25.3.1 Information Quick Reference of SDH Boards


This topic describes the functions supported by different types of SDH boards.
Table 25-11 provides the functions supported by SDH boards.
Figure 1.13 Basic functions of SDH boards
Funct
ion

ALS

REG
Specif
icatio
ns

PRBS

AU-3

TCM

FEC

Fixed
Wavel
ength

Color
ed
Wave
lengt
h

Tuna
ble
Wavel
ength

N1SL
64

N2SL
64

N4SL
64

T2SL
64

T2SL

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System
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Funct
ion

25 Board Information Quick Reference

ALS

REG
Specif
icatio
ns

PRBS

AU-3

TCM

FEC

Fixed
Wavel
ength

Color
ed
Wave
lengt
h

Tuna
ble
Wavel
ength

N1SF
64

N1SF
64A

N1SL
D64

N4SL
D64

N1SL
16

N2SL
16

N3SL
16

N1SL
16A

N2SL
16A

N3SL
16A

N1SL
D16

N1SL
Q16

N2SL
Q16

N4SL
Q16

N1SL
O16

N4SL
O16

N1SF
16

N1SF

64A

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System
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Funct
ion

ALS

REG
Specif
icatio
ns

25 Board Information Quick Reference

PRBS

AU-3

TCM

16E

FEC

Fixed
Wavel
ength

Color
ed
Wave
lengt
h

Tuna
ble
Wavel
ength

NOTE
The
N1S
F16E
supp
orts
the
outband
EFE
C
funct
ion.

N3SL
Q41

N3SL
H41

N1SL
4

N2SL
4

R1SL
4

N1SL
4A

N1SL
Q4

N2SL
Q4

N1SL
Q4A

N1SL
D4

N2SL
D4

R1SL
D4

R3SL
D4

N1SL

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OptiX OSN 3500 Intelligent Optical Transmission


System
Hardware Description

Funct
ion

25 Board Information Quick Reference

ALS

REG
Specif
icatio
ns

PRBS

AU-3

TCM

FEC

Fixed
Wavel
ength

Color
ed
Wave
lengt
h

Tuna
ble
Wavel
ength

N1SL
T1

N1SL
Q1

N2SL
Q1

R1SL
Q1

N1SL
Q1A

R3SL
Q1

N1SL
1

N2SL
1

N1SL
1A

R1SL
1

R3SL
1

N1SL
H1

N1SE
P1

N2SL
O1

N3SL
O1

D4A

25.3.2 Information Quick Reference of PDH Boards


This topic describes the functions supported by different types of PDH boards.

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25 Board Information Quick Reference

Table 25-12 provides the functions supported by PDH boards.


Figure 1.14 Basic functions of PDH boards
Function

PRBS

TPS

E13

M13

R1PL1

R1PD1

R2PD1

R3PD1

YNote

N1PQ1

N2PQ1

N1PQM

N1PL3

N2PL3

N1PL3A

N2PL3A

N1PD3

N2PD3

N2PQ3

N1DX1

N1DXA

N1SPQ4

N2SPQ4

N1PFL1

NOTE
The R3PD1 supports the E13 function only in server mode.

25.3.3 Information Quick Reference of Data Boards


This topic describes the functions supported by different types of data boards.
Table 25-13 provides the functions supported by Ethernet boards.

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25 Board Information Quick Reference

Figure 1.15 Basic functions of Ethernet boards


Fu
ncti
on

EP
L

EV
PL

EP
LA
N

EV
PL
AN

MP
LS

VC
TR
UN
K
spe
cifi
cati
ons

Qo
S

ET
H
OA
M
(80
2.1
ag)

ET
H
OA
M
(80
2.3
ah)

Tes
t
Fra
me
s

Qin
Q

R
M
ON

IG
MP
Sno
opi
ng

R1
EF
T4

N1
EF
T8

16

N2
EF
T8

16

N1
EF
T8
A

N2
EF
T8
A

N1
EG
T2

N2
EG
T2

N1
EF
S0

12

N2
EF
S0

24

N4
EF
S0

24

N5
EF
S0

24

N1
EF

32

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Fu
ncti
on

25 Board Information Quick Reference

EP
L

EV
PL

EP
LA
N

EV
PL
AN

MP
LS

VC
TR
UN
K
spe
cifi
cati
ons

Qo
S

ET
H
OA
M
(80
2.1
ag)

ET
H
OA
M
(80
2.3
ah)

Tes
t
Fra
me
s

Qin
Q

R
M
ON

IG
MP
Sno
opi
ng

N1
EF
S4

12

N2
EF
S4

24

N3
EF
S4

24

N2
EG
S2

48

N3
EG
S2

48

N1
EM
S4

64

N1
EM
S2

48

N1
EG
S4

64

N3
EG
S4

64

N4
EG
S4

64

N2
EG
R2

N2
EM

S0
A

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Fu
ncti
on

25 Board Information Quick Reference

EP
L

EV
PL

EP
LA
N

EV
PL
AN

MP
LS

VC
TR
UN
K
spe
cifi
cati
ons

Qo
S

ET
H
OA
M
(80
2.1
ag)

ET
H
OA
M
(80
2.3
ah)

Tes
t
Fra
me
s

Qin
Q

R
M
ON

IG
MP
Sno
opi
ng

N1
EA
S2

24

N3
EA
S2

1 Y
7

R0

(
s
l
o
t
b
a
n
d
w
i
d
t
h
:
1
0
G
b
i
t
/
s
)

3
4
(
s
l
o
t
b
a
n
d

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Hardware Description

Fu
ncti
on

EP
L

EV
PL

EP
LA
N

EV
PL
AN

25 Board Information Quick Reference

MP
LS

VC
TR
UN
K
spe
cifi
cati
ons

Qo
S

ET
H
OA
M
(80
2.1
ag)

ET
H
OA
M
(80
2.3
ah)

Tes
t
Fra
me
s

Qin
Q

R
M
ON

IG
MP
Sno
opi
ng

w
i
d
t
h
:
2
0
G
b
i
t
/
s
)
NOTE
For the ETH OAM functions supported by data boards, see "Availability" in the Feature Description.

Table 25-14 provides basic functions supported by SAN/Video boards.


Figure 1.16 Basic functions supported by SAN/Video boards
Functio
n

FC100

FC200

FICON

ESCON

DVBASI

SD-SDI

HD-SDI

N1MST
4

N1VST4

25.3.4 Information Quick Reference of Packet Boards


This topic describes the functions supported by different types of packet boards.
Table 25-15 provides the functions supported by packet Ethernet boards.

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25 Board Information Quick Reference

Figure 1.17 Basic functions of packet Ethernet boards


F
u
n
ct
io
n

E
L
i
n
e

E
L
A
N

E
A
G
G
R

H
Q
o
S

L
A
G

M
P
L
S
T
u
n
n
el
A
P
S

P D
W is
tr
A ib
P ut
S e
d
M
P
L
S
O
A
M

C
e
n
tr
al
iz
e
d
M
P
L
S
O
A
M
/
M
P
L
S
T
P
O
A
M

M
C
L
A
G

M L
S P
T T
P

M
SP
W

E
T
H
O
A
M

Q
i
n
Q

I
G
M
P
S
n
o
o
pi
n
g

1
5
8
8
v
2

I
n
b
a
n
d
D
C
N

R
M
O
N

T
N
N
1
E
G
8

T
N
N
1
E
X
2

N
1
P
E
G
1
6

N
1
P

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F
u
n
ct
io
n

25 Board Information Quick Reference

E
L
i
n
e

E
L
A
N

E
A
G
G
R

H
Q
o
S

L
A
G

M
P
L
S
T
u
n
n
el
A
P
S

P D
W is
tr
A ib
P ut
S e
d
M
P
L
S
O
A
M

C
e
n
tr
al
iz
e
d
M
P
L
S
O
A
M
/
M
P
L
S
T
P
O
A
M

M
C
L
A
G

M L
S P
T T
P

M
SP
W

E
T
H
O
A
M

Q
i
n
Q

I
G
M
P
S
n
o
o
pi
n
g

1
5
8
8
v
2

I
n
b
a
n
d
D
C
N

R
M
O
N

T
N
N
1
E
G
1
6

N
1
P
E
X
1

N
2
P
E
X
1

N
1

E
G
8

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F
u
n
ct
io
n

25 Board Information Quick Reference

E
L
i
n
e

E
L
A
N

E
A
G
G
R

H
Q
o
S

L
A
G

M
P
L
S
T
u
n
n
el
A
P
S

P D
W is
tr
A ib
P ut
S e
d
M
P
L
S
O
A
M

C
e
n
tr
al
iz
e
d
M
P
L
S
O
A
M
/
M
P
L
S
T
P
O
A
M

M
C
L
A
G

M L
S P
T T
P

M
SP
W

E
T
H
O
A
M

Q
i
n
Q

I
G
M
P
S
n
o
o
pi
n
g

1
5
8
8
v
2

I
n
b
a
n
d
D
C
N

R
M
O
N

N
1
P
E
T
F
8

N
1
P
E
F
F
8

N
1
E
D
Q
4
1

P
E
X
2

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25 Board Information Quick Reference

F
u
n
ct
io
n

E
L
i
n
e

E
L
A
N

E
A
G
G
R

H
Q
o
S

L
A
G

M
P
L
S
T
u
n
n
el
A
P
S

P D
W is
tr
A ib
P ut
S e
d
M
P
L
S
O
A
M

C
e
n
tr
al
iz
e
d
M
P
L
S
O
A
M
/
M
P
L
S
T
P
O
A
M

M
C
L
A
G

M L
S P
T T
P

M
SP
W

E
T
H
O
A
M

Q
i
n
Q

I
G
M
P
S
n
o
o
pi
n
g

1
5
8
8
v
2

I
n
b
a
n
d
D
C
N

R
M
O
N

Q
1
P
E
G
S
2

R
1
P
E
G
S
1

R
1
P
E
F
4
F

R
1
P
E
F

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F
u
n
ct
io
n

25 Board Information Quick Reference

E
L
i
n
e

E
L
A
N

E
A
G
G
R

H
Q
o
S

L
A
G

M
P
L
S
T
u
n
n
el
A
P
S

P D
W is
tr
A ib
P ut
S e
d
M
P
L
S
O
A
M

C
e
n
tr
al
iz
e
d
M
P
L
S
O
A
M
/
M
P
L
S
T
P
O
A
M

M
C
L
A
G

M L
S P
T T
P

M
SP
W

E
T
H
O
A
M

Q
i
n
Q

I
G
M
P
S
n
o
o
pi
n
g

1
5
8
8
v
2

I
n
b
a
n
d
D
C
N

R
M
O
N

T Y
N
N
1
E
T
M
C

T
N
N
1
E
F
F
8

S
8

25.4 Loopback Capability of the Boards


The SDH boards, PDH boards, and data boards of the OptiX OSN equipment support various
types of loopbacks.
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25 Board Information Quick Reference

Table 25-16 provides the loopback capability of the SDH boards of the OptiX OSN
equipment.
Figure 1.18 Loopback capability of the SDH boards
Board

Inloop at an
Interface

Outloop at
an Interface

Inloop on a
VC-4 Path

Outloop on
a VC-4 Path

Outloop on
a VC-3 or
VC-12 Path

N1SL1

Supported

Supported

Supported

Not
supported

Not
supported

R1SL1

Supported

Supported

Supported

Not
supported

Not
supported

N2SL1

Supported

Supported

Not
supported

Not
supported

Not
supported

N1SL4

Supported

Supported

Supported

Not
supported

Not
supported

R1SL4

Supported

Supported

Supported

Not
supported

Not
supported

N1SL16

Supported

Supported

Supported

Not
supported

Not
supported

N3SL16

Supported

Supported

Supported

Supported

Not
supported

N1SL64

Supported

Supported

Supported

Supported

Not
supported

N2SL64

Supported

Supported

Not
supported

Not
supported

Not
supported

N4SL64

Supported

Supported

Supported

Supported

Not
supported

N1SF64

Supported

Supported

Supported

Supported

Not
supported

N1SF64A

Supported

Supported

Supported

Supported

Not
supported

N4SF64

Supported

Supported

Supported

Supported

Not
supported

N4SFD64

Supported

Supported

Supported

Supported

Not
supported

N1SLD64

Supported

Supported

Supported

Supported

Not
supported

N4SLD64

Supported

Supported

Supported

Supported

Not
supported

N1SL16

Supported

Supported

Supported

Not
supported

Not
supported

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25 Board Information Quick Reference

Board

Inloop at an
Interface

Outloop at
an Interface

Inloop on a
VC-4 Path

Outloop on
a VC-4 Path

Outloop on
a VC-3 or
VC-12 Path

N2SL16

Supported

Supported

Not
supported

Not
supported

Not
supported

N3SL16

Supported

Supported

Supported

Supported

Not
supported

N1SL16A

Supported

Supported

Supported

Not
supported

Not
supported

N2SL16A

Supported

Supported

Not
supported

Not
supported

Not
supported

N3SL16A

Supported

Supported

Supported

Supported

Not
supported

N1SLD16

Supported

Supported

Supported

Supported

Not
supported

N1SLQ16

Supported

Supported

Supported

Supported

Not
supported

N2SLQ16

Supported

Supported

Not
supported

Not
supported

Not
supported

N4SLQ16

Supported

Supported

Supported

Supported

Not
supported

N1SLO16

Supported

Supported

Supported

Supported

Not
supported

N4SLO16

Supported

Supported

Supported

Supported

Not
supported

N1SF16

Supported

Supported

Supported

Not
supported

Not
supported

N1SF16E

Supported

Supported

Supported

Supported

Not
supported

N3SLQ41

Supported

Supported

Supported

Supported

Not
supported

N3SLH41

Supported

Supported

Supported

Supported

Not
supported

N1SL4

Supported

Supported

Supported

Not
supported

Not
supported

N2SL4

Supported

Supported

Not
supported

Not
supported

Not
supported

N1SL4A

Supported

Supported

Supported

Supported

Not
supported

R1SL4

Supported

Supported

Supported

Not

Not

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Board

Inloop at an
Interface

25 Board Information Quick Reference

Outloop at
an Interface

Inloop on a
VC-4 Path

Outloop on
a VC-4 Path

Outloop on
a VC-3 or
VC-12 Path

supported

supported

N1SLQ4

Supported

Supported

Supported

Not
supported

Not
supported

N1SLQ4A

Supported

Supported

Supported

Supported

Not
supported

N2SLQ4

Supported

Supported

Not
supported

Not
supported

Not
supported

N1SLD4

Supported

Supported

Supported

Not
supported

Not
supported

N1SL4DA

Supported

Supported

Supported

Supported

Not
supported

N2SLD4

Supported

Supported

Not
supported

Not
supported

Not
supported

R1SLD4

Supported

Supported

Supported

Not
supported

Not
supported

N1SLT1

Supported

Supported

Supported

Supported

Not
supported

N1SLQ1

Supported

Supported

Supported

Not
supported

Not
supported

N1SLQ1A

Supported

Supported

Supported

Supported

Not
supported

N2SLQ1

Supported

Supported

Not
supported

Not
supported

Not
supported

R1SLQ1

Supported

Supported

Supported

Not
supported

Not
supported

N1SL1

Supported

Supported

Supported

Not
supported

Not
supported

N1SL1A

Supported

Supported

Supported

Supported

Not
supported

N2SL1

Supported

Supported

Not
supported

Not
supported

Not
supported

R1SL1

Supported

Supported

Supported

Not
supported

Not
supported

N1SLH1

Supported

Supported

Supported

Supported

Not
supported

N1SEP1

Supported

Supported

Supported

Not
supported

Not
supported

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25 Board Information Quick Reference

Board

Inloop at an
Interface

Outloop at
an Interface

Inloop on a
VC-4 Path

Outloop on
a VC-4 Path

Outloop on
a VC-3 or
VC-12 Path

N2SLO1

Supported

Supported

Not
supported

Not
supported

Not
supported

N3SLO1

Supported

Supported

Supported

Supported

Not
supported

Table 25-17 provides information on whether each SDH board of the OptiX OSN equipment
supports the insertion of the AU_AIS when the board is looped back.
Figure 1.19 Information on whether each SDH board of the OptiX OSN equipment supports the
insertion of the AU_AIS when the board is looped back
Board

Insertion of the
AU_AIS to the
Port Side
(Inloop at an
Interface)

Insertion of the
AU_AIS to the
Cross-Connect
Side (Outloop at
an Interface)

Insertion of the
AU_AIS to the
Cross-Connect
Side (Inloop on
a VC-4 Path)

Insertion of
the AU_AIS to
the Port Side
(Outloop on a
VC-4 Path)

N1SL64

Supported

Supported

Supported

Supported

N4SL64

Supported

Supported

Supported

Supported

N2SL64

Not supported

Supported

Not supported

Not supported

N1SF64

Supported

Supported

Supported

Supported

N4SF64

Supported

Supported

Supported

Supported

N1SF64A

Supported

Supported

Supported

Supported

N4SFD64

Supported

Supported

Supported

Supported

N1SLD64

Supported

Supported

Supported

Supported

N4SLD64

Supported

Supported

Supported

Not supported

N1SL16

Not supported

Supported

Not supported

Not supported

N2SL16

Not supported

Supported

Not supported

Not supported

N3SL16

Supported

Supported

Supported

Supported

N1SL16A

Not supported

Supported

Not supported

Not supported

N2SL16A

Not supported

Supported

Not supported

Not supported

N3SL16A

Supported

Supported

Supported

Supported

N1SLD16

Supported

Supported

Supported

Supported

N1SLQ16

Supported

Supported

Supported

Supported

N2SLQ16

Not supported

Supported

Not supported

Not supported

N4SLQ16

Not supported

Supported

Not supported

Not supported

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25 Board Information Quick Reference

Board

Insertion of the
AU_AIS to the
Port Side
(Inloop at an
Interface)

Insertion of the
AU_AIS to the
Cross-Connect
Side (Outloop at
an Interface)

Insertion of the
AU_AIS to the
Cross-Connect
Side (Inloop on
a VC-4 Path)

Insertion of
the AU_AIS to
the Port Side
(Outloop on a
VC-4 Path)

N1SLO16

Supported

Supported

Supported

Supported

N4SLO16

Supported

Supported

Supported

Supported

N1SF16

Not supported

Supported

Not supported

Not supported

N1SF16E

Not supported

Supported

Not supported

Not supported

N3SLQ41

Supported

Supported

Supported

Supported

N3SLH41

Supported

Supported

Supported

Supported

N1SL4

Not supported

Supported

Not supported

Not supported

N1SL4A

Supported

Supported

Supported

Supported

N2SL4

Not supported

Supported

Not supported

Not supported

R1SL4

Not supported

Supported

Not supported

Not supported

N1SLQ4

Not supported

Supported

Not supported

Not supported

N1SLQ4A

Supported

Supported

Supported

Supported

N2SLQ4

Not supported

Supported

Not supported

Not supported

N1SLD4

Not supported

Supported

Not supported

Not supported

N1SLD4A

Supported

Supported

Supported

Supported

N2SLD4

Not supported

Supported

Not supported

Not supported

R1SLD4

Not supported

Supported

Not supported

Not supported

N1SLT1

Supported

Supported

Supported

Supported

N1SLQ1

Not supported

Supported

Not supported

Not supported

N1SLQ1A

Supported

Supported

Supported

Supported

N2SLQ1

Not supported

Supported

Not supported

Not supported

R1SLQ1

Not supported

Supported

Not supported

Not supported

N1SL1

Not supported

Supported

Not supported

Not supported

N1SL1A

Supported

Supported

Supported

Supported

N2SL1

Not supported

Supported

Not supported

Not supported

R1SL1

Not supported

Supported

Not supported

Not supported

N1SLH1

Supported

Supported

Supported

Supported

N1SEP1

Not supported

Supported

Not supported

Not supported

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25 Board Information Quick Reference

Board

Insertion of the
AU_AIS to the
Port Side
(Inloop at an
Interface)

Insertion of the
AU_AIS to the
Cross-Connect
Side (Outloop at
an Interface)

Insertion of the
AU_AIS to the
Cross-Connect
Side (Inloop on
a VC-4 Path)

Insertion of
the AU_AIS to
the Port Side
(Outloop on a
VC-4 Path)

N2SLO1

Not supported

Supported

Not supported

Not supported

N3SLO1

Supported

Supported

Supported

Supported

Table 25-18 provides the loopback capability of the PDH boards of the OptiX OSN
equipment.
Figure 1.20 Loopback capability of the PDH boards
Board

Inloop at an Interface

Outloop at an Interface

R1PL1

Supported

Supported

R1PD1

Supported

Supported

N1PQ1

Supported

Supported

N1PQM

Supported

Supported

N1PD3

Supported

Supported

N1PL3

Supported

Supported

N2PQ3

Supported

Supported

N2SPQ4

Supported

Supported

N1PFL1

Supported

Supported

Table 25-19 provides the loopback capability of the data boards of the OptiX OSN equipment.
Figure 1.21 Loopback capability of the data boards of the OptiX OSN equipment
Board

Outloop
at the
MAC
Layer

Inloop at
the MAC
Layer

Outloop
at the
PHY
Layer

Inloop at
the PHY
Layer

Inloop
and
Outloop
on a VC4 Path

Inloop
and
Outloop
on a VC-3
Path

N1EFS4

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N2EFS4

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N3EFS4

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

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25 Board Information Quick Reference

Board

Outloop
at the
MAC
Layer

Inloop at
the MAC
Layer

Outloop
at the
PHY
Layer

Inloop at
the PHY
Layer

Inloop
and
Outloop
on a VC4 Path

Inloop
and
Outloop
on a VC-3
Path

N1EFS0

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N2EFS0

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N4EFS0

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N5EFS0

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1EFS0A

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1EGT2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N2EGT2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1EFT8

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N2EFT8

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N1EFT8A

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N2EFT8A

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

R1EFT4

Not
supported

Supported

Not
supported

Supported

Not
supported

Supported

N1EMS4

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

N1EMS2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1EGS4

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

N3EGS4

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

N2EGS4

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

N4EGS4

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

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25 Board Information Quick Reference

Board

Outloop
at the
MAC
Layer

Inloop at
the MAC
Layer

Outloop
at the
PHY
Layer

Inloop at
the PHY
Layer

Inloop
and
Outloop
on a VC4 Path

Inloop
and
Outloop
on a VC-3
Path

N2EGS2

Not
supported

Not
supported

Not
supported

Supported

Not
supported

Supported

N3EGS2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N2EGR2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1EAS2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N3EAS2

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N2EMR0

Not
supported

Supported

Not
supported

Supported

Not
supported

Not
supported

Table 25-20 provides the loopback capability of the ATM/IMA boards of the OptiX OSN
equipment.
Figure 1.22 Loopback capability of the ATM/IMA boards of the OptiX OSN equipment
Board

Outloop at an
External
Interface

Inloop at an
External
Interface

Outloop at an
Internal
Interface

Inloop at an
Internal
Interface

N1ADL4

Not supported

Supported

Supported

Supported

N1ADQ1

Not supported

Supported

Supported

Supported

N1IDL4

Not supported

Supported

Supported

Supported

N1IDL4A

Not supported

Supported

Supported

Supported

N1IDQ1

Not supported

Supported

Supported

Supported

N1IDQ1A

Not supported

Supported

Supported

Supported

Table 25-21 provides the loopback capability of the packet Ethernet boards of the OptiX OSN
equipment.

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25 Board Information Quick Reference

Figure 1.23 Loopback capability of the packet Ethernet boards of the OptiX OSN equipment
Board

Outloop
at the
MAC
Layer

Inloop at
the MAC
Layer

Outloop
at the
PHY
Layer

Inloop at
the PHY
Layer

Inloop
and
Outloop
on a VC4 Path

Inloop
and
Outloop
on a VC-3
Path

N1PEX1

Not
supported

Supported

Supported

Supported

Not
supported

Not
supported

N2PEX1

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

N1PEX2

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

N1PEG16

Not
supported

Supported

Supported

Supported

Not
supported

Not
supported

N1PEG8

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

N1PETF8

Supported

Supported

Not
supported

Supported

Not
supported

Not
supported

N1PEFF8

Supported

Supported

Not
supported

Supported

Not
supported

Not
supported

R1PEFS8

Supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

R1PEF4F

Supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

R1PEGS1

Supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

Q1PEGS2

Supported

Not
supported

Not
supported

Supported

Not
supported

Not
supported

TNN1EG8

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

TNN1EG1
6

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

TNN1EX2

Supported

Supported

Not
supported

Not
supported

Not
supported

Not
supported

TNN1ETM
C

Supported

Supported

Supported
(only by
GE ports)

Supported

Not
supported

Not
supported

TNN1EFF
8

Supported

Supported

Not
supported

Supported

Not
supported

Not
supported

Table 25-22 provides the loopback capability of the channelized STM-1 CES boards of the
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OptiX OSN equipment.


Figure 1.24 Loopback capability of the channelized STM-1 CES boards of the OptiX OSN
equipment
Board

Inloop
at a
Port

Outloo
p at a
Port

Inloop
on a
VC-4
Path

Outloo
p on a
VC-4
Path

Inloop on a
VC-12 Path

Outloop on a
VC-12 Path

N1CQ1

Support
ed

Support
ed

Not
support
ed

Not
support
ed

Supported

Supported

TNN1CO1

Support
ed

Support
ed

Not
support
ed

Not
support
ed

Supported

Supported

Table 25-23 provides the loopback capability of the packet ATM boards of the OptiX OSN
equipment.
Figure 1.25 Loopback capability of the packet ATM boards of the OptiX OSN equipment
Board

Inloop at a
Port

Outloop at
a Port

Inloop on a VC-4
Path

Outloop on a VC4 Path

TNN1AFO1

Supported

Supported

Not supported

Not supported

Table 25-24 provides the loopback capability of the dual-domain boards of the OptiX OSN
equipment.
Figure 1.26 Loopback capability of the dual-domain boards of the OptiX OSN equipment
Board

Inloop at
a Port

Outloop
at a Port

Inloop on
a VC-4
Path

Outloop
on a VC4 Path

Outloop on a VC3/VC-12 Path

N1EDQ41

Supported

Supported

Supported

Supported

Not supported

Table 25-25 provides the loopback capability of the SAN/Video boards of the OptiX OSN
equipment.
Figure 1.27 Loopback capability of the SAN/Video boards of the OptiX OSN equipment
Board

Inloop at
a Port

Outloop
at a Port

Inloop on
a VC-4
Path

Outloop
on a VC4 Path

Outloop on a VC3/VC-12 Path

N1MST4

Supported

Supported

Not
supported

Not
supported

Not supported

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25 Board Information Quick Reference

Board

Inloop at
a Port

Outloop
at a Port

Inloop on
a VC-4
Path

Outloop
on a VC4 Path

Outloop on a VC3/VC-12 Path

N1VST4

Supported

Supported

Not
supported

Not
supported

Not supported

25.5 Protection Schemes Supported by Each Board


The SDH boards, PDH boards, data boards, and packet boards of the OptiX OSN equipment
support various protection schemes.
Table 25-26 lists the protection schemes that the SDH boards of the OptiX OSN equipment
support.
Figure 1.28 Protection schemes that the SDH boards of the OptiX OSN equipment support
Board

Protection Scheme
TwoFiber
Ring
MSP

FourFiber
Ring
MSP

Linear
MSP

SNCP

SNCT
P

SNC
MP

MS
P
and
SNC
P
Fibe
rSha
red
Prot
ectio
n

TPS
Prote
ction

N1SL64

N2SL64

N4SL64

N1SF64
A

N4SF64

N4SFD6
4

N1SLD6
4

N4SLD6
4

N1SL16

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Board

25 Board Information Quick Reference

Protection Scheme
TwoFiber
Ring
MSP

FourFiber
Ring
MSP

Linear
MSP

SNCP

SNCT
P

SNC
MP

MS
P
and
SNC
P
Fibe
rSha
red
Prot
ectio
n

TPS
Prote
ction

N2SL16

N3SL16

N1SL16
A

N2SL16
A

N3SL16
A

N1SLD1
6

N1SLQ1
6

N4SLQ1
6

N1SLO1
6

N4SLO1
6

N1SF16

N1SF16E

N3SLQ4
1

N3SLH4
1

N1SL4

N2SL4

N1SL4A

R1SL4

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Board

25 Board Information Quick Reference

Protection Scheme
TwoFiber
Ring
MSP

FourFiber
Ring
MSP

Linear
MSP

SNCP

SNCT
P

SNC
MP

MS
P
and
SNC
P
Fibe
rSha
red
Prot
ectio
n

TPS
Prote
ction

N1SLQ4

N2SLQ4

N1SLQ4
A

N2SLD4

N1SLD4
A

R1SLD4

N1SLT1

N1SLQ1

N2SLQ1

R1SLQ1

N1SL1

N2SL1

N1SL1A

N1SLH1

N1SEP1

N3SLO1

Note: "" means that the board supports the protection scheme and "x" means that the
board does not support the protection scheme.

Table 25-27 lists the protection schemes that the PDH boards of the OptiX OSN equipment
support.

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Figure 1.29 Protection schemes that the PDH boards of the OptiX OSN equipment support
Board

Protection Scheme
TPS
Protection
for the E1
Services

TPS
Protection
for the
E1/T1
Services

TPS
Protection
for the
E3/T3
Services

TPS
Protection
for the
E4/STM-1
Services

TPS
Protection
for the DDN
Services

R1PL1

R1PD1

N1PQ1

N1PQM

N1PL3

N2PL3

N1PL3A

N2PL3A

N1PD3

N2PD3

N2PQ3

N1DX1

N1DXA

N2SPQ4

N1PFL1

Table 25-28 lists the protection schemes that the data boards of the OptiX OSN equipment
support.
Figure 1.30 Protection schemes that the data boards of the OptiX OSN equipment support
Board

R1EFT
4
Issue 02 (2013-01-18)

Protection Scheme
LCA
S

STP/
RST
P

MST
P

TP
S
Pr
ote
cti
on

B
P
S
Pr
ot
ec
ti
on

P
P
S
Pr
ot
ec
ti
on

L
A
G

D
L
A
G

L
P
T

R
P
R

MSP,
SNCP,
SNCM
P, and
SNCT
P

ATM
Protect
ion

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Board

25 Board Information Quick Reference

Protection Scheme
LCA
S

STP/
RST
P

MST
P

TP
S
Pr
ote
cti
on

B
P
S
Pr
ot
ec
ti
on

P
P
S
Pr
ot
ec
ti
on

L
A
G

D
L
A
G

L
P
T

R
P
R

MSP,
SNCP,
SNCM
P, and
SNCT
P

ATM
Protect
ion

N1EFT
8

N2EFT
8

N1EFT
8A

N2EFT
8A

N1EG
T2

N2EG
T2

N1EFS
0

N2EFS
0

N4EFS
0

N5EFS
0

N1EFS
0A

N1EFS
4

N2EFS
4

N3EFS
4

N2EG
S2

N3EG
S2

N1EM

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Board

25 Board Information Quick Reference

Protection Scheme
LCA
S

STP/
RST
P

MST
P

TP
S
Pr
ote
cti
on

B
P
S
Pr
ot
ec
ti
on

P
P
S
Pr
ot
ec
ti
on

L
A
G

D
L
A
G

L
P
T

R
P
R

MSP,
SNCP,
SNCM
P, and
SNCT
P

ATM
Protect
ion

N1EM
S2

N3EG
S4

N4EG
S4

N2EG
R2

N2EM
R0

N1EA
S2

N3EA
S2

N1AD
L4

N1AD
Q1

N1IDL
4

N1IDQ
1

N1MS
T4

N1VS
T4

S4

Table 25-29 lists the protection schemes that the packet boards of the OptiX OSN equipment
support.

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25 Board Information Quick Reference

Figure 1.31 Protection schemes that the packet boards of the OptiX OSN equipment support
Board

Protection Scheme
MPLS
Tunnel
1+1/1:1
Protecti
on

Packetbased
linear
MSP

LPT

LAG

MPLS
PW
1+1/1:1

MC-LAG

N1PEX1

N2PEX1

N1PEX2

N1PEG16

N1PEG8

TNN1EG8

TNN1EG16

TNN1EX2

N1PETF8

N1PEFF8

TNN1ETMC

R1PEFS8

R1PEF4F

R1PEGS1

Q1PEGS2

TNN1EFF8

Table 25-30 lists the protection schemes that the dual-domain boards of the OptiX OSN
equipment support.
Figure 1.32 Protection schemes that the dual-domain boards of the OptiX OSN equipment support
Board

Protection Scheme
SDH Protection

N1ED
Q41
Issue 02 (2013-01-18)

Packet
Protection

Twofiber
MSP
ring

Fourfiber
MSP
ring

Linear
MSP

SNCP

SNCM
P

SNCT
P

LAG

MCLAG

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25 Board Information Quick Reference

25.6 Quick Reference of Power Consumption and Weight of


Each Board
This section lists the power consumption and weight of each board of the OptiX OSN series
equipment.
Table 25-31 lists the power consumption and weight of each board.
Figure 1.33 Power consumption and weight of each board
Board

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

N1SLQ41

12

0.6

N1SLD4

17

0.6

N1SF64A

33(the OptiX
OSN 3500
supports)

1.1

N2SLD4

15

1.0

1.1

R1SLD4

11

0.5

SDH boards

26(the OptiX
OSN 7500
supports)
N1SF64

33(the OptiX
OSN 3500
supports)
26(the OptiX
OSN 7500
supports)

N1SL64A

40

1.1

N1SL4A

17

0.6

N1SL64

30(the OptiX
OSN 3500
supports)

1.1

N1SL4

17

0.6

22(the OptiX
OSN 7500
supports)
N2SL64

32

1.1

N2SL4

15

1.0

T2SL64

40

1.1

R1SL4

10

0.5

N1SF16

26

1.1

R3SL4

11

0.5

N1SLO16

38

1.0

N1SEP1

15

1.0

N1SLQ16

20

0.9

N1SLH1

27

1.0

N2SLQ16

35

1.3

N1SLT1

22

1.3

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25 Board Information Quick Reference

Board

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

N1SLD16

23

0.9

N2SLO1

26

1.1

N1SL16A

20

0.6

N3SLO1

20

1.2

N2SL16A

20

1.1

N1SLQ1A

15

1.0

N3SL16A

22

0.9

N1SLQ1

15

1.0

N1SL16

19

1.1

N2SLQ1

15

1.0

N2SL16

19

1.1

R1SLQ1

12

0.4

N3SL16

22

1.1

N1SL1A

17

0.6

N1SLQ4A

17

1.0

N1SL1

17

0.6

N1SLQ4

17

1.0

N2SL1

14

1.0

N2SLQ4

16

1.0

R1SL1

10

0.3

N1SLD4A

17

0.6

R3SL1

11

0.3

T2SL64A

40

1.1

N3SLQ41

12

0.7

N1EU08

11

0.4

N1EU04

0.4

N1OU08

0.4

N2OU08

0.4

N3SLH41

49

1.5

N1SLD64

41

1.2

N4SL64

15(the OptiX
OSN 3500/7500
II supports)

1.1

N1SF16E

19.6

0.6

14(the OptiX
OSN 7500
supports)
N4SLQ16

12

0.7

N4SLO16

21

1.0

N4SLD64

19

1.2

N4SF64

26

1.2

N4SFD64

37

1.1

N1SPQ4

24

0.9

N2PL3

12

0.9

N2SPQ4

24

0.9

N1PQM

22

1.0

N1DXA

10

0.8

N1PQ1

19

1.0

N1DX1

15

1.0

N2PQ1

13

1.0

N1PQ3

13

0.9

R1PD1

15

0.6

N1PD3

19

1.1

R2PD1

15

0.6

N2PD3

12

1.1

R3PD1

0.4

PDH boards

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25 Board Information Quick Reference

Board

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

N1PL3A

15

1.0

N1PL1

0.5

N2PL3A

12

0.9

R1PL1

0.5

N1PL3

15

1.0

N2PQ3

13

0.9

N1DM12

0.4

N1TSB8

0.3

N1TSB4

0.3

N1MU04

0.4

N1C34S

0.3

R1L12S

0.3

N1D34S

0.4

N1D12B

0.3

N1D75S

0.4

N1L75S

0.3

N1D12S

0.4

N1PFL1

17

Data boards (TDM mode)


N1MST4

26

0.9

N2EFS4

30

1.0

N1IDQ1

41

1.0

N3EFS4

18

0.6

N1IDL4

41

1.0

N1EFS0A

17

0.7

N1ADQ1

41

1.0

N1EFS0

35

1.0

N1ADL4

41

0.9

N2EFS0

35

1.0

N1EAS2

70

1.2

N4EFS0

35

1.0

N1EMR0

47

1.2

N5EFS0

22

0.6

N2EGR2

40

1.1

N1EGT2

29

0.9

N1EGS4

70

1.1

N1EFT8A

26

1.0

N3EGS4

70

1.1

N1EFT8

26

1.0

N4EGS4

34

0.7

N1EFT4

14

0.5

N1EMS4

65

1.1

N1EFT8

26

1.0

N1EMS2

40

0.8

N1EFT4

14

0.5

N2EGS2

43

1.0

R1EFT4

14

0.5

N3EGS2

25

0.6

N2EMR0

50

1.2

N1EFS4

30

1.0

N1ETF8A

11

0.4

N1ETS8

0.4

N1EFF8A

15

0.4

N1EFF8

0.4

N1ETF8

0.4

N1IDL4A

46

1.5

N1VST4

37

0.8

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25 Board Information Quick Reference

Board

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

N3EAS2

83

1.1

N2EFT8A

12

0.5

N2EGT2

15

0.9

N2EFT8

16

0.6

Packet boards
R1PEFS8

12

0.3

N1PETF8

0.4

Q1PEGS2

0.6

N1PEG16

137

2.3

R1PEGS1

0.4

N1PEX1

107

2.4

N1PEG8

47

1.2

N1PEX2

49

1.4

N2PEX1

48

1.4

N1PEFF8

13

0.5

TNN1EX2

60

1.3

TNN1EG8

58

1.3

TNN1CO1

17

0.6

TNN1ETM
C

11

0.5

TNN1D75
E

15

0.4

TNN1AFO
1

26

0.8

TNN1D12
E

15

0.4

TNN1EFF
8

16

0.6

R1PEF4F

15

0.4

TNN1EG1
6

51

1.05

70

1.0

N1MD75

12

0.5

N1MD12

12

0.5

N1CQ1

10

0.5

R1ML1A/
B

16

0.4

EoD Boards
N1EDQ41
CES boards

WDM boards
N1FIB

0.4

N1MR2B

1.0

N1MR2A

1.0

N1MR2

0.9

N1LWX

30

1.1

N1CMR4

0.9

N1MR4

0.9

N1CMR2

0.8

N1MR2C

1.0

Cross-Connect and system control boards


N1PSXCS

90

2.1

R1PCXLN

60

1.0

T1PSXCS

95

1.4

N4GSCC

19

1.0

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Board

25 Board Information Quick Reference

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

N2PSXCS
A

80

1.2

N3PSXCS
A

74

1.5

T1SXCSA

96

2.2

N1SXCSA

63

2.0

TNN1SCA

27

1.0

TNN1PSX
CS

140

2.4

N6GSCC

19

0.9

T2PSXCS
A

95

1.8

Auxiliary boards
N1FANA

19

1.2

R1AMU

0.5

XE1FAN

19

1.5

R1AUX

19

1.0

XE3FAN

19

1.2

R2AUX

19

1.0

R1FAN

20

0.8

Q1AUX

10

0.5

Q1SEI

10

0.9

N1AUX

19

1.0

N1SEI

0.9

T1AUX

0.4

Q1SAP

20

0.7

T1EOW

13

0.5

Q2SAP

25

1.0

R1EOW

10

0.4

TN81FAN

21

4.5

Optical amplifier boards and dispersion compensation boards


N1DCU

0.4

62COA

75

8.0

N2DCU

0.4

N1COA

10

3.5

N1RPC02

110

4.2

N1BPA

20

1.0

N1RPC01

70

4.0

N2BPA

11

1.2

61COA

10

3.5

N1BA2

20

1.0

TN11OBU
101

16

1.3

TN11OBU
103

13

1.3

TN12OBU
101

10

1.1

TN12OBU
103

11

1.1

TN12OBU
2

14

1.6

0.5

N1PIU

1.2

Power interface boards


R1PIUA
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25 Board Information Quick Reference

Board

Power
Consumption
(W)

Weight
(kg)

Board

Power
Consumption
(W)

Weight
(kg)

R1PIUB

0.4

Q2PIU

0.3

R1PIUC

0.5

Q1PIU

1.3

N1PIUA

0.5

R1PIU

0.4

T1PIU

1.3

UPM
(EPS304815AF)

10

UPM
(EPS754815AF)

15

UPM
(GIE4805S
)

10

TN81PIU

1.6

N1PIUB

0.6

T1PIUB

0.5

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26 Parameter Settings

26

Parameter Settings

About This Chapter


You can set the parameters for the SDH boards, PDH boards, data boards, packet boards,
WDM boards, optical amplifier boards, and cross-connect and timing unit by using the
U2000.
26.1 Packet Processing Boards
The parameters that need to be set for the packet boards include the working mode and
maximum frame length.
26.2 EoD Boards
The parameters that need to be set for the EoD boards include the SDH parameters and
Ethernet parameters.
26.3 Packet Interface Boards
The parameters that you need to set for packet interface boards include J0 byte, J1 byte, J2
byte, C2 byte, V5 byte, SDH interfaces, PDH interfaces, and recovery value of idle timeslots.
26.4 Data Boards
The parameters that need to be set for the data boards include the SDH parameters, Ethernet
parameters, and ATM parameters.
26.5 SDH Processing Boards
The parameters that need to be set for the SDH processing boards include the J0 byte, J1 byte,
J2 byte, and C2 byte.
26.6 PDH Boards
The parameters that need to be set for the PDH boards include the J1 byte, C2 byte, J2 byte,
V5 byte, and tributary loopback.
26.7 WDM Boards
The parameters that need to be set for the WDM boards include the path use status, optical
interface loopback, service type, client service bearer rate (M), laser status, automatic laser
shutdown, current bearer rate (M), actual wavelength no./wavelength (nm)/frequency (THz),
actual band type, configure wavelength no./wavelength (nm)/frequency (THz), configure
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26 Parameter Settings

band type, and SD trigger condition.


26.8 Cross-Connect and Timing Units
The parameters that need to be set for the cross-connect and timing units include the clock
source parameters and clock subnet parameters.
26.9 Optical Amplifier Boards
The parameters that need to be set for the optical amplifier boards include the laser status,
board work type, configure band, configure working band parity, actual band, actual working
band parity, threshold of input power loss, gain, rated optical power, nominal gain upper
threshold, and nominal gain lower threshold.

26.1 Packet Processing Boards


The parameters that need to be set for the packet boards include the working mode and
maximum frame length.

26.1.1 General Attributes


This topic describes the parameters for configuring the general attributes of an Ethernet port.
The parameters include Port Mode, Enable Port, and Encapsulation Type.
Table 26-1 lists the parameters for configuring the general attributes of an Ethernet port.
Figure 1.34 Parameters for configuring the general attributes of an Ethernet port
Field

Value

Description

Port

For example, 21-N1PETF81(Port-1)

Indicates the port name.

Name

For example, Port1

User-defines a port name.

Enable Port

Enabled, Disabled.

The Enable Port parameter


sets whether the Ethernet
port is usable.

Default: Enabled

Click Enable Port(Ethernet


Interface) for more
information.
Port Mode

Layer 2, Layer 3

Selects the working mode of


the Ethernet port.
Layer 2: The port can
access the user-side
equipment or carry Ethernet
services that use the port
exclusively.
Layer 3: The port can carry
tunnels.

Encapsulation Type

Null, 802.1Q, QinQ


Default: For details, see
configuration guidelines.

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The Encapsulation Type


parameter sets the link layer
encapsulation type of the
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Field

26 Parameter Settings

Value

Description
port, and specifies the link
layer encapsulation type that
can be identified by this
port.
Click Encapsulation
Type(Ethernet Interface) for
more information.

Working Mode

10M Half-Duplex, 10M


Full-Duplex, AutoNegotiation, 100M HalfDuplex, 100M Full-Duplex,
1000M Full-Duplex, 10G
Full-Duplex LAN, 10G
Full-Duplex WAN
Default: Auto-Negotiation

Set the Working Mode


parameter to set the working
mode of the Ethernet port on
the board. The Working
Mode parameter indicates
the maximum transmission
rate and communication
mode of a port.
CAUTION
When configuring a service,
set Working Mode to the same
value if possible for the port
and its interconnected port.
Otherwise, the service may
fail.

Click Working
Mode(Ethernet Interface) for
more information.
Max Frame Length (byte)

For OptiX OSN 3500/7500:


960 to 9600
For other products: 960 to
9000
Default: 1620

The maximum frame length


is also the maximum
transport unit (MTU).
Click Max Frame
Length(byte) for an Ethernet
Port for more information.

26.1.2 Flow Control


This topic describes the parameters, such as autonegotiation and non-autonegotiation, which
are used for configuring flow control function of an Ethernet port.
Table 26-2 lists the parameters for configuring flow control of an Ethernet port.
Figure 1.35 Parameters for configuring flow control of an Ethernet port
Field

Value Range

Description

Port

PORTn

Displays all the available


MAC ports on an Ethernet
board.
Specifies the PORT port. The
letter n indicates the number
of the PORT port.

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26 Parameter Settings

Field

Value Range

Description

Non-Autonegotiation
Flow Control Mode

Disabled, Enable Symmetric


Flow Control, Send Only,
Receive Only

The Non-Autonegotiation
Flow Control Mode
(Ethernet Port Attribute)
specifies the flow control
mode adopted when an
Ethernet port works in nonauto-negotiation mode.

Default value: Disable

Click Non-Autonegotiation
Flow Control Mode (Ethernet
Port Attribute) for more
information.
Autonegotiation Flow
Control Mode

The value ranges of the


parameters are different from
each other for different
boards and products. You can
click the hyperlink in the
description to display the
specific information.

The Autonegotiation Flow


Control Mode (Ethernet
Port Attribute) specifies the
flow control mode adopted
when an Ethernet port works
in auto-negotiation mode.
The N1EMS4 and N1EGS4
boards do not support the
autonegotiation traffic control
attribute.
Click Autonegotiation Flow
Control Mode (Ethernet Port
Attribute) for more
information.

26.1.3 Layer 2 Attributes


This topic describes the parameters for configuring the Layer 2 attributes of an Ethernet port.
The parameters include QinQ Type Domain, Tag, Default VLAN ID, and VLAN Priority
Table 26-3 lists the parameters for configuring the Layer 2 attributes of an Ethernet port.
Figure 1.36 Parameters for configuring the Layer 2 attributes of an Ethernet port
Field

Value

Description

Port

For example, 21-N1PETF81(Port-1)

Displays the port name.

QinQ Type Domain

0x0600 to 0xFFFE

Sets the QinQ type domain.

NOTE
For the PEG8, PEX2, PEX1,
and EDQ41, this parameter
can be set only to 0x88A8.

This parameter is available


only when you set
Encapsulation Type in
General Attributes to
QinQ.

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Field

Value

Description

Tag

Tag Aware, Access, Hybrid

Indicates which type of


packets can be processed.
Tag Aware: The port
transparently transmits the
packet with a VLAN ID
(tagged). If a packet does
not have a VLAN ID
(untagged), the port discards
this packet. In this case,
Default VLAN ID and
VLAN Priority are
meaningless.
Access: The port adds the
default VLAN ID to the
packet without any VLAN
ID (untagged). If the packet
has a VLAN ID (tagged),
the port discards this packet.
Hybrid: The port adds the
default VLAN ID to the
packet without any VLAN
ID (untagged). If the packet
has a VLAN ID (tagged),
the port transparently
transmits the packet.
This parameter is
unavailable when you set
Encapsulation Type in
General Attributes to
QinQ.

Default VLAN ID

1 to 4094

Sets the default VLAN ID of


packets that passes through
the port.
When you set Tag to
Access, packets that have a
VLAN ID the same as the
default VLAN ID are
discarded, and packets
without a VLAN are tagged
with the default VLAN ID
and then pass the port.
When you set Tag to
Hybrid, tagged packets are
allowed to pass, and
untagged packets are tagged
with the default VLAN ID
and then pass the port.
NOTE
If an MPLS tunnel needs to
traverse a Layer 2 network, set

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Field

26 Parameter Settings

Value

Description
the VLAN IDs for the tunnels
connected to the NNI ports at
both ends to the same value
according to the VLAN
planning requirements on the
Layer 2 network.

VLAN Priority

0 to 7

Sets the QoS level. When


the network is busy, packets
of a higher VLAN priority
are processed first and those
of a lower VLAN priority
may be discarded. 0
indicates the lowest priority
and 7 the highest.

26.1.4 Layer 3 Attributes


This topic describes the parameters for configuring the Layer 3 attributes of an Ethernet port.
The parameters include Enable Tunnel, Specify IP, IP Address, and IP Mask
Table 26-4 lists the parameters for configuring the Layer 3 attributes of an Ethernet port.
Figure 1.37 Parameters for configuring the Layer 3 attributes of an Ethernet port
Field

Value

Description

Port

For example, 21-N1PETF81(Port-1)

Displays the port name.

Enable Tunnel

Enabled, Disabled

The Enable
Tunnel(Ethernet Interface)
parameter sets the MPLS
enabling state of the port.
When Enable Tunnel is set
to Enabled, it indicates that
the port can identify and
process the MPLS label.

Default: Enabled

Click Enable
Tunnel(Ethernet
Interface)for more
information.
Max Reserved
Bandwidth(kbit/s)

For example, 102400

Sets the maximum


bandwidth used by the
tunnel.
The maximum reserved
bandwidth should not
exceed the physical
bandwidth of the bearer port.

Available Bandwidth(kbit/s)

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Displays the available


bandwidth of the port. The
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Field

26 Parameter Settings

Value

Description
Available Bandwidth value
is obtained from equipment
and refreshed automatically
when the Max Reserved
Bandwidth value of the port
is modified or the tunnel
traversing the port is
adjusted.

Specify IP

Manually, Unspecified
Default: Unspecified

The Specify IP parameter,


set by port, indicates the
method of specifying the IP
address parameter of a
specified port.
Click Specify IP(Ethernet
Interface) for more
information.

IP Address

For example, 192.168.0.1

Sets the IP address for the


port.

IP Mask

For example, 255.255.255.0

Sets the subnet mask of the


port.

26.1.5 Advanced Attributes


This topic describes the parameters for configuring the advanced attributes of an Ethernet
port. The parameters include Port Physical parameters, MAC Loopback, and Loopback
Check
Table 26-5 lists the parameters for configuring the advanced attributes of an Ethernet port.
Figure 1.38 Parameters for configuring the advanced attributes of an Ethernet port
Field

Value

Description

Port

For example, 21-N1PETF81(Port-1)

Displays the port name.

Port Physical parameters

For example:

Displays physical
parameters of the port.

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Port Enable: Enabled

Working Mode: AutoNegotiation

Non-Autonegotiation
Flow Control Mode:
Disabled

MAC Loopback: NonLoopback

PHY Loopback: NonLoopback

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Field

Value

Description

MAC Loopback

Non-Loopback, Inloop,
Outloop

Sets the loopback state of


the MAC layer.

PHY Loopback

Non-Loopback, Inloop,
Outloop

The PHY Loopback


parameter indicates the
loopback status of the
physical layer of an Ethernet
port. This parameter is an
advanced attribute of the
Ethernet port.

Default: Non-Loopback

Click PHY
Loopback(Ethernet
Interface) for more
information.
MAC Address

For example, 00-5A-3D-034C-1B

Displays the MAC address


of the port.

Default: FF-FF-FF-FF-FFFF
Transmitting Rate(kbit/s)

For example, 1024

Displays the rate at which


packets are transmitted.

Receiving Rate(kbit/s)

For example, 1024

Displays the rate at which


packets are received.

Loopback Check

Enabled, Disabled

Sets loop detection.

Default: Disabled

When this function is


enabled, the equipment
automatically checks
whether a loop is generated
on the link. If a loop is
generated, the related alarm
is reported.
Currently, the OptiX OSN
equipment does not support
this function.

Loopback Port Block

Enabled, Disabled
Default: Disabled

Sets the automatic shutdown


of the port.
When Loopback Check is
set to Enabled and
Loopback Port Block is set
to Enabled, the equipment
automatically checks
whether a loop is generated
on the link. If a loop is
generated, the port is
automatically shut down to
release the loop.

Unidirectional Operation

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Disabled, Enabled

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Set whether a 10GE port


works in unidirectional
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Field

26 Parameter Settings

Value

Description

Default: Enabled

operation mode or not.

Enabled: The port works


in unidirectional
operation mode, in which
the port disables the
function in the direction
where a unidirectional
fault occurs. For
example, upon detecting
a LOS alarm, the port
disables only its receive
function without
affecting its transmit
function.

Disabled: The port does


not work in
unidirectional operation
mode. In nonunidirectional operation
mode, the port will
disable both receive and
transmit functions upon
detecting a unidirectional
fault. For example, upon
detecting a LOS alarm,
the port disables its
receive and transmit
functions.

NOTE
N2PEX1 and N1PEX2
boards on the OptiX OSN
3500/7500 support this
parameter.

Enabling Broadcast Packet


Suppression

Disabled, Enabled
Default value: Disabled

EX2 boards on the OptiX


OSN 7500 II support this
parameter.

Specifies whether the


broadcast packet
suppression function at the
port is enabled to limit the
traffic rate of the incoming
broadcast packets. If the
broadcast packet
suppression function is
enabled, and if the traffic
rate of the incoming
broadcast packets exceeds
the specified value, the last
received broadcast packets
are discarded.
NOTE

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Field

26 Parameter Settings

Value

Description
Enabling Broadcast Packet
Suppression is valid for UNI
ports only.

Broadcast Packet
Suppression Threshold

Example: 3

Allocates the specified


bandwidth to the broadcast
packets according to the
proportion of the broadcast
packets in the total packets
at the port. If the actual
bandwidth of the broadcast
packets exceeds the
specified threshold, the port
discards the last received
broadcast packets.

26.2 EoD Boards


The parameters that need to be set for the EoD boards include the SDH parameters and
Ethernet parameters.

1.1.1.1.1745 SDH Parameters

J0

J1

J2

C2

For the description of the parameter, see 26.5 SDH Processing Boards.

1.1.1.1.1746 Packet Data Parameters

Ethernet interface

For the description of the parameter, see 26.1 Packet Processing Boards.

1.1.1.1.1747 EoS Parameters

Working mode

Maximum frame length

For more parameters and the description of the parameters, see 26.4.2 Ethernet Parameters.

26.3 Packet Interface Boards


The parameters that you need to set for packet interface boards include J0 byte, J1 byte, J2
byte, C2 byte, V5 byte, SDH interfaces, PDH interfaces, and recovery value of idle timeslots.

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26 Parameter Settings

26.3.1 SDH Parameters


The SDH parameters that need to be set for the data boards include the J1 byte, C2 byte, J2
byte, and V5 byte.

1.1.1.1.1748 J1 Byte
J1 is the path trace byte. Successive transmission of the J1 byte at the transmit end helps the
receive end learn that its connection with the specified transmit end is in the continuous
connection state.
When a J1 mismatch is detected at the receive end, the VC-3 path generates an LP_TIM_VC3
alarm and the VC-4 path generates an HP_TIM alarm.
When the J1 byte to be sent is set to the single-byte "" by default, the alarms are not
reported.

In the case of the N1EFS4/MST4/EAS2, the J1 byte to be sent is set to " HuaWei SBS " by
default. In the case of the other boards, the J1 byte to be sent is set to the single-byte "" by default.

In the case of the EMS4/EGS4, it is recommended that you set the J1 byte to be sent to " HuaWei
SBS ".

1.1.1.1.1749 C2 Byte
C2 is the signal label byte, which is used to indicate the multiplexing structure of the VC
frames and the payload property. The C2 byte to be sent must match the C2 byte to be
received.
When a C2 mismatch is detected, the VC-3 path generates an LP_SLM_VC3 alarm and the
VC-4 path generates an HP_SLM alarm.

1.1.1.1.1750 J2 Byte
J2 is the VC-12 path trace byte. This byte is used to transmit repetitively a low order path
access point identifier so that a path receiving terminal can verify its continued connection to
the intended transmitter.
When a J2 mismatch is detected, the VC-12 path generates an LP_TIM_VC12 alarm.
When the J2 byte is set to the single-byte "" by default, the alarms are not reported.

1.1.1.1.1751 V5 Byte
V5 is the path status and signal label byte. This byte is used to detect bit errors and indicate
remote errors or remote failures on lower order paths. The LP_REI and LP_RFI alarms are
generated accordingly.
When a V5 mismatch is detected at the receive end, the VC-12 path generates an
LP_SLM_VC12 alarm.
Table 26-6 shows the relationship between the service type and the value of the V5 byte.

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Figure 1.1 relationship between the service type and the value of the V5 byte
Service Type

Value of the V5 Byte (Hexadecimal)

Unequipped or supervisory-unequipped

00

Equipped-non-specific payload

01

Asynchronous

02

Bit synchronization

03

Byte synchronization

04

Retained signal flag

05

O.181 test signal

06

VC-AIS

07

Other mapping (For test)

08

ATM mapping

09

HDLC/PPP mapping

0A

HDLC/LAPS mapping

0B

Virtual connection test signal (O.181


special mapping)

0C

GFP mapping

0D

26.3.2 Channelized STM-1 Port


Configuring a channelized STM-1 port includes setting of the parameters such as the
encapsulation type of the port, the maximum data packet size, and the enabling status of the
laser.
Figure 1.2 Parameters for the attributes of an SDH port
Field

Value Range

Description

Port

For example, 21-CQ11(PORT-1)

Displays the port name.

Name

For example, port1

Specifies the name of the


port specified by the user.

Port Mode

Layer 1

Displays the working mode


of the CES port Layer 1
indicates the channelized
STM port is currently
available.
The OptiX OSN equipment
currently supports only
Layer 1 in Port Mode. In
this case, the OptiX OSN

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Field

26 Parameter Settings

Value Range

Description
equipment can transmit
channelized STM-1 services.

Encapsulation Type

Null

Indicates the link layer


encapsulation type of the
port. It specifies the link
layer encapsulation type that
can be identified and
processed by the port.
When Encapsulation Type
is set to Null, no link layer
encapsulation is available or
the link layer encapsulation
is not performed.
The OptiX OSN equipment
currently supports only
Layer 1 in Port Mode. For
this reason, Encapsulation
Type can only be set to Null
and cannot be changed.

Channelize

No

Displays whether the port is


a channelized port.
Channelize refers to the use
of the low-speed tributary
signals in the STM-N
service. One fiber is used to
transmit multiple channels
of data that are separated
from each other. Each
channel of data exclusively
occupies the bandwidth, in
addition to the starting point,
terminating point, and
monitoring policy.

Max Data Packet Size (byte)

Specifies the maximum size


of the packets that can be
received by the port.
This parameter is currently
inapplicable to the OptiX
OSN equipment.

Laser Interface Enabling


Status

On, Off

Laser Transmission
Distance(m)

Default: On

Specifies the enabling status


of the laser on the port.
Displays the transmission
distance of the laser on the
port.
This parameter is currently
inapplicable to the OptiX
OSN equipment.

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26 Parameter Settings

Field

Value Range

Description

Scrambling Capability

Suppresses multiple 0s and


1s in the data when the
Scrambling Capability is
enabled.
This parameter is currently
inapplicable to the OptiX
OSN equipment.

CRC Check Length

Specifies the length of the


CRC field in the mapping
protocol.
This parameter is currently
inapplicable to the OptiX
OSN equipment.

Clock Mode

The Clock Mode parameter


specifies the re-timing mode
of a port.
NOTE
This parameter is currently
inapplicable to an SDH port.

Loopback Mode

CES Encapsulation Clock


Mode

Non-loopback, Inloop,
Outloop

Specifies the loopback status


of the port.

Default: Non-loopback

The loopback mode is used


for locating a fault. Outloop
is used for testing whether
the port module and external
fiber or cable of a board are
proper. Inloop is used for
testing whether the crossconnect unit and service
path of the equipment are
proper.

Null, Line Clock Mode,


System Clock Mode

Specifies the encapsulation


mode of the clock signal on
a UNI port on the master
side of the CES service.

Default: Null

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Null: The clock signal is


not encapsulated in the
service packets.

Line Clock Mode: The


clock frequency signal
extracted on a line port is
used as the time stamp,
which is encapsulated in
the RTP packet header
and transmitted to the
downstream.

System Clock Mode:


The system frequency
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Field

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Value Range

Description
signal is used as the time
stamp, which is
encapsulated in the RTP
packet header and
transmitted to the
downstream.

CES Encapsulation Clock


Poke

Specifies the enabling status


of the CES encapsulation
clock poke.
This parameter is currently
inapplicable to the OptiX
OSN equipment.

Figure 1.3 Parameters for an associated service


Field

Value Range

Description

Service Type

For example, CES service

Displays the type of the


service associated with the
port.

Service ID

For example, 20

Displays the ID of the


service associated with the
port.
When you select the value of
the service ID, the active
window changes to the
service management dialog
box of the corresponding
service type.

Service Name

For example, CES

Displays the name of the


service associated with the
port.

Used Resource

For example, 64K


Timeslot1-31

Displays the resource used


by the service associated
with the port.

26.3.3 E1 Port
In addition to the general attributes of an E1 port, you need to set the frame format based on
the advanced attributes to ensure that the frame format specified for the E1 port is the same as
the service encapsulation format.

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Figure 1.4 Parameters for the general attributes of a PDH port


Field

Value Range

Description

Port

Slot ID-Board name-Port


(Port No.)

Displays the port name.

Name

For example, Port 1

Enters the port name


specified by the user.

Port Mode

Layer 1, Layer 2, Layer 3

Specifies the working mode


of the PDH port.

NOTE
For the OptiX OSN
equipment, Port Mode can be
set to only Layer 1.

Encapsulation Type

Null

When this parameter is set to


Layer 1, the port can
transmit TDM signals.
Specifies Encapsulation
Type.
When Port Mode is set to
Layer 1, Encapsulation
Type is defaulted to Null
and cannot be changed.

Max Data Packet Size (byte)

Specifies the maximum size


of the packets.
NOTE
This parameter is not
applicable to an E1 port in the
CES service.

Figure 1.5 Parameters for the advanced attributes of a PDH port


Field

Value Range

Description

Port

Slot ID-Board name-Port


(Port No.)

Displays the port name.

Frame Format

Unframe, Double Frame,


CRC-4 Multiframe

Specifies the frame format.

HDB3

Displays the line encoding


format.

Line Encoding Format

When the E1 port transmits


CES services in CESoPSN
mode, this parameter can be
set to Double Frame or
CRC-4 Multiframe. It is
recommended that you set
this parameter to CRC-4
Multiframe. When the CES
services are in SAToP mode,
this parameter needs to be
set to Unframe.

The HDB3 codes are


transmitted on the E1 port.
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26 Parameter Settings

Field

Value Range

Description

Clock Mode

Master Mode, Slave Mode,


Line Clock Mode

The Clock Mode parameter


specifies the re-timing mode
of a port.

Default: Master Mode

Click Clock Mode for more


information.
Loopback Mode

Non-loopback, Inloop,
Outloop

Specifies the loopback status


of the port.

Impedance

75 ohm, 120 ohm

Displays the impedance of


the port.

NOTE
When the OptiX OSN
3500/7500 uses the N1MD75
board, Impedance is set to 75
ohm and cannot be changed.
When the N1MD12 board is
used, Impedance is set to 120
ohm and cannot be changed.

Frame Mode

Specifies the value of the


frame mode.
The frame modes of the
local port and opposite port
need to be consistent.
NOTE
This parameter is not
applicable to an E1 port in the
CES service.

CES Encapsulation Clock


Mode

Null, Line Clock Mode,


System Clock Mode
Default: Null

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Queries the encapsulation


mode of the clock signal on
a UNI port on the master
side of the CES service.

Null: The clock signal is


not encapsulated in the
service packets.

Line Clock Mode: The


clock frequency signal
extracted on a line port is
used as the time stamp,
which is encapsulated in
the RTP packet header
and transmitted to the
downstream.

System Clock Mode:


The system frequency
signal is used as the time
stamp, which is
encapsulated in the RTP
packet header and
transmitted to the
downstream.
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Field

Value Range

Description

CES Encapsulation Clock


Poke

Queries the encapsulation


time stamp in the CES
service.
NOTE
This parameter is not
applicable to an E1 port in the
CES service.

Idle Timeslot Recovery


Value

Queries the recovery value


of an idle timeslot in the
CES service.
NOTE
This parameter is not
applicable to an E1 port in the
CES service.

Figure 1.6 Parameters for an associated service


Field

Value Range

Description

Service Type

For example, CES service

Displays the type of the


service associated with the
port.

Service ID

For example, 20

Displays the ID of the


service associated with the
port.
When you select the value of
the service ID, the active
window changes to the
service management dialog
box of the corresponding
service type.

Service Name

For example, CES

Displays the name of the


service associated with the
port.

Used Resource

For example, 64K


Timeslot1-31

Displays the resource used


by the service associated
with the port.

26.4 Data Boards


The parameters that need to be set for the data boards include the SDH parameters, Ethernet
parameters, and ATM parameters.

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26.4.1 SDH Parameters


The SDH parameters that need to be set for the data boards include the J1 byte, C2 byte, J2
byte, and V5 byte.

1.1.1.1.1752 J1 Byte
J1 is the path trace byte. Successive transmission of the J1 byte at the transmit end helps the
receive end learn that its connection with the specified transmit end is in the continuous
connection state.
When a J1 mismatch is detected at the receive end, the VC-3 path generates an LP_TIM_VC3
alarm and the VC-4 path generates an HP_TIM alarm.
When the J1 byte to be sent is set to the single-byte "" by default, the alarms are not
reported.

In the case of the N1EFS4/MST4/EAS2, the J1 byte to be sent is set to " HuaWei SBS " by
default. In the case of the other boards, the J1 byte to be sent is set to the single-byte "" by default.

In the case of the EMS4/EGS4, it is recommended that you set the J1 byte to be sent to " HuaWei
SBS ".

1.1.1.1.1753 C2 Byte
C2 is the signal label byte, which is used to indicate the multiplexing structure of the VC
frames and the payload property. The C2 byte to be sent must match the C2 byte to be
received.
When a C2 mismatch is detected, the VC-3 path generates an LP_SLM_VC3 alarm and the
VC-4 path generates an HP_SLM alarm.

1.1.1.1.1754 J2 Byte
J2 is the VC-12 path trace byte. This byte is used to transmit repetitively a low order path
access point identifier so that a path receiving terminal can verify its continued connection to
the intended transmitter.
When a J2 mismatch is detected, the VC-12 path generates an LP_TIM_VC12 alarm.
When the J2 byte is set to the single-byte "" by default, the alarms are not reported.

1.1.1.1.1755 V5 Byte
V5 is the path status and signal label byte. This byte is used to detect bit errors and indicate
remote errors or remote failures on lower order paths. The LP_REI and LP_RFI alarms are
generated accordingly.
When a V5 mismatch is detected at the receive end, the VC-12 path generates an
LP_SLM_VC12 alarm.
Table 26-12 shows the relationship between the service type and the value of the V5 byte.

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Figure 1.1 relationship between the service type and the value of the V5 byte
Service Type

Value of the V5 Byte (Hexadecimal)

Unequipped or supervisory-unequipped

00

Equipped-non-specific payload

01

Asynchronous

02

Bit synchronization

03

Byte synchronization

04

Retained signal flag

05

O.181 test signal

06

VC-AIS

07

Other mapping (For test)

08

ATM mapping

09

HDLC/PPP mapping

0A

HDLC/LAPS mapping

0B

Virtual connection test signal (O.181


special mapping)

0C

GFP mapping

0D

26.4.2 Ethernet Parameters


The Ethernet parameters that need to be set for the data boards include the working mode and
Maximum Frame Length.

26.4.2.1 Basic Attributes


This topic describes the parameters, such as the port attribute, port enabling status, and
maximum frame length, for configuring the basic attributes of an Ethernet port.
Table 26-13 lists the parameters for configuring the basic attributes of an Ethernet port.
Figure 1.2 Parameters for configuring the basic attributes of an Ethernet port
Field

Value Range

Description

Port

PORTn

Displays all the available


ports on an Ethernet port. The
letter n indicates the number
of the PORT port.

Name

For example, PORT-1

Specifies the name of a PORT


port. The name can contain up
to 32 characters in English or
16 characters in Chinese.

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Field

Value Range

Description

Enable Port

Disabled, Enabled

"Enabled" indicates that this


port is used and services are
available. "Disabled"
indicates that the services on
this port are not processed.
Hence, when configuring a
service, you need to enable
the port to be used.

Default value: Disabled

Click Enable Port (Ethernet


Port Attribute) for more
information.
Working Mode

Auto-Negotiation, 10M HalfDuplex, 10M Full-Duplex,


100M Half-Duplex, 100M
Full-Duplex, 1000M HalfDuplex, 1000M Full-Duplex,
10GE Full-Duplex LAN,
10GE Full-Duplex WAN

Specifies the working mode


of the Ethernet port on a
board. This parameter
determines the maximum
transmission rate and
communication mode of the
Ethernet port.
When setting this parameter,
you must ensure the working
modes of the interconnected
ports are the same. Otherwise,
the services are not available.

Force Autonegotiation
Flow Control Mode

Max. Frame Length

MAC Loopback

10M Half-Duplex, 10M FullDuplex, 100M Half-Duplex,


100M Full-Duplex, 1000M
Half-Duplex, 1000M FullDuplex

Values of parameters vary


with different boards and
products.

N4EGS4: 10M FullDuplex, 100M FullDuplex, 1000M FullDuplex

N1EFS0A: 10M HalfDuplex, 10M Full-Duplex,


100M Half-Duplex, 100M
Full-Duplex

The value ranges of the


parameters are different from
each other for different
boards and products. You can
click the hyperlink in the
description to display the
specific information.

The Max. Frame Length


(Ethernet Port Attribute)
parameter specifies the
maximum frame length that is
supported at an Ethernet port.

Non-Loopback, Inloop

The MAC Loopback


(Ethernet Port Attribute)
parameter specifies the MAC

Default value: Non-Loopback


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Indicates the Ethernet port


works in the forced autonegotiation mode.

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Click Max. Frame Length


(Ethernet Port Attribute) for
more information.

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Field

26 Parameter Settings

Value Range

Description
loopback state at an Ethernet
port. Port loopback setting is
applied to locating faults only.
Click MAC Loopback
(Ethernet Port Attribute) for
more information.

PHY Loopback

Non-Loopback, Inloop
Default value: Non-Loopback

The PHY Loopback


(Ethernet Port Attribute)
parameter specifies the PHY
loopback state at an Ethernet
port. Port loopback setting is
applied to locating faults only.
Click PHY Loopback
(Ethernet Port Attribute) for
more information.

Logic Type

SDH-OPPORT, SDH-EPORT

Displays the logic type of


port.

26.4.2.2 Flow Control


This topic describes the parameters, such as autonegotiation and non-autonegotiation, which
are used for configuring flow control function of an Ethernet port.
Table 26-14 lists the parameters for configuring flow control of an Ethernet port.
Figure 1.3 Parameters for configuring flow control of an Ethernet port
Field

Value Range

Description

Port

PORTn

Displays all the available


MAC ports on an Ethernet
board.
Specifies the PORT port. The
letter n indicates the number
of the PORT port.

Non-Autonegotiation
Flow Control Mode

Disabled, Enable Symmetric


Flow Control, Send Only,
Receive Only
Default value: Disable

The Non-Autonegotiation
Flow Control Mode
(Ethernet Port Attribute)
specifies the flow control
mode adopted when an
Ethernet port works in nonauto-negotiation mode.
Click Non-Autonegotiation
Flow Control Mode (Ethernet
Port Attribute) for more
information.

Autonegotiation Flow
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The value ranges of the

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Field

Value Range

Description

Control Mode

parameters are different from


each other for different
boards and products. You can
click the hyperlink in the
description to display the
specific information.

Control Mode (Ethernet


Port Attribute) specifies the
flow control mode adopted
when an Ethernet port works
in auto-negotiation mode.
The N1EMS4 and N1EGS4
boards do not support the
autonegotiation traffic control
attribute.
Click Autonegotiation Flow
Control Mode (Ethernet Port
Attribute) for more
information.

26.4.2.3 Network Attributes


This topic describes the parameters, such as port attribute and P port encapsulation format,
which are used for configuring network attributes of an Ethernet port.
Table 26-15 lists the parameters for configuring network attributes of an Ethernet port.
Figure 1.4 Parameters for configuring network attributes of an Ethernet port
Field

Value Range

Description

Port

PORTn or VCTRUNKn

Specifies the PORT or


VCTRUNK port. The letter n
indicates the number of the
port.

Port Attribute

The value ranges of the


parameters are different from
each other for different
boards and products. You can
click the hyperlink in the
description to display the
specific information.

The Port Attribute (Ethernet


Port) parameter specifies the
position of a port in the
network. Different port
attributes support different
packets.

MartinioE, stack VLAN

Encapsulation Format of P
Port (Network Attributes)
indicates that the board
supports receiving of data
packets in the MPLS
encapsulation format and
normal Ethernet data packets.
The port needs to process
different types of packets in
different ways, so you need to
set the port to a PE port or a P
port. The PE port is not

Encapsulation Format of
P Port

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Default value: MartinioE

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Click Port Attribute (Ethernet


Port) for more information.

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Field

26 Parameter Settings

Value Range

Description
configured with the
encapsulation format, while
the P port is configured with
the encapsulation format. The
P port indicates a port for
connecting the equipment of
the network provider, so the P
port receives data packets in
the MPLS encapsulation
format. You can set the packet
encapsulation format of the P
port by running the
configuration command.
This parameter is not
supported by a board that
supports the QinQ function.
Click Encapsulation Format
of P Port (Network Attributes)
for more information.

26.4.2.4 Advanced Attributes


This topic describes the parameters, such as the loop detection, loop port shutdown, and
traffic threshold (Mbit/s), which are used for configuring the advanced attributes of an
Ethernet port.
Table 26-16 lists the parameters for configuring the advanced attributes of an Ethernet port.
Figure 1.5 Parameters for configuring the advanced attributes of an Ethernet port
Field

Value Range

Description

Port

PORTn or VCTRUNKn

Indicates the PORT or


VCTRUNK port. The
letter n indicates the
number of the PORT port.

Enabling Broadcast Packet


Suppression

Enabled, Disabled

The Enabling Broadcast


Packet Suppression
(Ethernet Interface
Attributes) parameter
specifies whether to enable
the function for a port to
suppress the broadcast
packets and to control the
traffic of the broadcast
data packets that enter the
port. If the broadcast
packet suppression
function is enabled, and if
the broadcast traffic

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Default value: Disabled

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Field

26 Parameter Settings

Value Range

Description
exceeds the specified
threshold value, the
broadcast packets that
enter the port are
discarded.
Click Enabling Broadcast
Packet Suppression
(Ethernet Interface
Attributes) for more
information.

Broadcast Packet Suppression


Threshold

1-10
Default value: 3

The Broadcast Packet


Suppression
Threshold(Ethernet
Interface Attributes)
parameter allocates the
specified bandwidth to the
broadcast packets. The
bandwidth is allocated on
the basis of the traffic
proportion at the port. If
the bandwidth allocated to
the broadcast packets
reaches the specified
threshold, the port discards
the broadcast data packets
that are received.
Click Broadcast Packet
Suppression Threshold
(Ethernet Interface
Attributes) for more
information.

Traffic Threshold(Mpbs)

0-100 (FE), 0-1000 (GE),


in step length of 1
Default value: 100 (FE),
1000 (GE)

The Traffic
Threshold(Mpbs)
(External Ethernet Port
Attribute) parameter
specifies the data flow
threshold at external
physical ports.
Click Traffic
Threshold(Mpbs)(External
Ethernet Port Attribute) for
more information.

Port Traffic Threshold Time


Window(Min)

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1-30
Default value: 0

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The Port Traffic


Threshold Time
Window(Min) parameter
specifies the duration for a
VCTRUNK or an IP port
to monitor the traffic after
the zero traffic monitoring
function of the port is
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Field

26 Parameter Settings

Value Range

Description
enabled.
Click Port Traffic
Threshold Time
Window(Min) for more
information.

Loop Detection

Enabled, Disabled
Default value: Disabled

The Loop Detection


(Ethernet Port Attribute)
parameter specifies the
function of reporting the
self-loop alarms after one
of the following loopback
cases is detected.
Click Loop Detection
(Ethernet Port Attribute)
for more information.

Loop Port Shutdown

Enabled, Disabled
Default value: Enabled

The Loop Port Shutdown


(Ethernet Port Attribute)
parameter is set to disable
the self-loop port after a
self-loop port is detected if
the loop port shutdown
function is enabled. After
the self-loop port is shut
down, the self-loop port
only transmits or receives
the self-loop detection
packets rather than any
other packets. If the port is
not a self-loop port, it
starts to work again.
Click Loop Port Shutdown
(Ethernet Port Attribute)
for more information.

Zero-Flow Monitor

Enabled, Disabled
Default value: Disabled

The Zero-Flow Monitor


parameter specifies
whether the traffic on a
port is monitored.
Click Zero-Flow Monitor
(Ethernet Interface
Attributes) for more
information.

Jumbo Frame Type

0 to 65535
Default value: 34928

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The Jumbo Frame Type


parameter specifies the
value of the jumbo frame
type on an Ethernet port.
The jumbo frame indicates
the oversized Ethernet
frame, whose maximum
length is 65535 bytes. The
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Field

26 Parameter Settings

Value Range

Description
Ethernet service board
determines whether the
Ethernet frame is a jumbo
frame according to the
value of the jumbo frame
type.
Click Jumbo Frame Type
for more information.

DNI Status

Enabled, Disabled

Indicates whether to enable


the DNI status of the
VCTRUNK port on a data
board.

26.4.2.5 TAG Attributes


Tag attributes are important attributes for configuring Ethernet services, including the
parameters such as the default VLAN ID, VLAN priority, ingress detection setting, and tag
ID.
Table 26-17 lists the parameters for configuring the tag attributes of an Ethernet port.
Figure 1.6 Parameters for configuring the tag attributes of an Ethernet port
Field

Value Range

Description

Port

PORTn or VCTRUNKn

Specifies the PORT or


VCTRUNK port. The letter n
indicates the number of the port.

Tag Identifier

Access, Tag Aware, Hybrid

The Tag Identifier parameter


indicates that the Ethernet port
supports IEEE 802.1Q Ethernet
packets that contain VLAN tags.
You can set three attributes to
differentiate the packets from
each other so that these packets
can be transmitted efficiently.

Default value: Tag Aware

Click Tag Identifier for more


information.
Default VLAN ID

1-4095
Default value: 1

The Default VLAN ID (Ethernet


Port Attribute) parameter
specifies the default VLAN ID of
a port.
Click Default VLAN ID (Ethernet
Port Attribute) for more
information.

VLAN Priority

0-7
Default value: 0

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The VLAN Priority (Ethernet


Port Attribute) parameter
specifies the priority of the default
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Field

26 Parameter Settings

Value Range

Description
VLAN ID of a port. It indicates
the priority of the service quality.
Click VLAN Priority (Ethernet
Port Attribute) for more
information.

Entry Detection

Enabled, Disabled
Default value: Enabled

The Entry Detection (Ethernet


Port Attribute) parameter
specifies whether to identify the
tag labels in the data packets.
Click Entry Detection (Ethernet
Port Attribute) for more
information.

26.4.2.6 Encapsulation/Mapping
The equipment supports the setting of encapsulation and mapping protocols for Ethernet
packets, including the parameters such as mapping protocol, scrambling code, and CRC or
not.
Table 26-18 lists the parameters for configuring the encapsulation and mapping of an Ethernet
port.
Figure 1.7 Parameters for configuring the encapsulation and mapping of an Ethernet port
Field

Value Range

Description

Port

VCTRUNKn

Indicates the VCTRUNK


port. The letter n indicates
the number of the
VCTRUNK port.

Mapping Protocol

The value ranges of the


parameters are different
from each other for different
boards and products. You
can click the hyperlink in
the description to display the
specific information.

The Mapping Protocol


parameter specifies the
mapping protocol of the
VCTRUNK port.

The value ranges of the


parameters are different
from each other for different
boards and products. You
can click the hyperlink in
the description to display the
specific information.

The Scramble parameter


specifies whether to
scramble the payload area of
the encapsulation protocol
and the scramble mode.

Scramble

Click Mapping Protocol for


more information.

You can set this parameter


only when the mapping
protocol is GFP, HDLC, or
LAPS.
Click Scramble for more
information.

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Field

Value Range

Description

Set Inverse Value for CRC

Yes, No

The Set Inverse Value for


CRC parameter specifies
whether to set an inverse
value for the CRC field of
the HDLC or LAPS
protocol.

Default value: Yes

You can set this parameter


only when the mapping
protocol is HDLC or LAPS.
Click Set Inverse Value for
CRC for more information.
Check Field Length

The value ranges of the


parameters are different
from each other for different
boards and products. You
can click the hyperlink in
the description to display the
specific information.

The Check Field Length


parameter specifies the
length of the CRC field of
the mapping protocol.
You can set this parameter
only when the mapping
protocol is GFP, HDLC, or
LAPS.
Click Check Field Length for
more information.

FCS Calculated Bit


Sequence

The value ranges of the


parameters are different
from each other for different
boards and products. You
can click the hyperlink in
the description to display the
specific information.

The FCS Calculated Bit


Sequence parameter
specifies the sequence of
storing the bits in the CRC
field of the mapping
protocol.
You can set this parameter
only when the mapping
protocol is GFP, HDLC, or
LAPS.
Click FCS Calculated Bit
Sequence for more
information.

Extension Header Option

The value ranges of the


parameters are different
from each other for different
boards and products. You
can click the hyperlink in
the description to display the
specific information.

The Extension Header


Option parameter specifies
whether Mapping Protocol
of the GFP protocol supports
the extension header.
You can set this parameter
only when the mapping
protocol is GFP.
Click Extension Header
Option for more information.

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26 Parameter Settings

26.4.2.7 Bound Paths


This topic describes the parameters, such as available resources, available timeslots, and
service direction, which are used for binding a path with an Ethernet port.
The configured cross-connections must correspond to the bound bandwidth timeslots. Otherwise, the
services are unavailable.

Table 26-19 lists the parameters that are used for binding a path.
Figure 1.8 Parameters for binding paths
Field

Value Range

Description

Configurable Ports

For example, VCTRUNKn

Displays all the available


VCTRUNK ports on the
board.

Available Resources

For example, VC4-1

Displays all the available


VC-4s.

Available Timeslots

For example, VC12-1

Displays all the available


timeslots.

VCTRUNK Port

VCTRUNKn

Displays the number (n) of


the VCTRUNK port.

Level

For example, VC12-xv

Specifies the level of a path


that is bound with the
VCTRUNK.

Service Direction

Bidirectional, Uplink,
Downlink

Specifies the direction of the


Ethernet service.

Default value: Bidirectional


Bound Path

For example, VC4-1VC12(1-3)

Specifies the number of the


path to be bound, for
example, VC4-1-VC12(1-3).

Number of Bound Paths

Displays the number of


VCTRUNKs to be bound.

The Used Channel

For example, VC4-1VC12(1)

Displays the actually used


channel.

Activation Status

Active, Deactive

Displays whether the path is


active.

Display in Combination

If you select Display in


Combination, the bound
paths are displayed in a
centralized manner.
Otherwise, the bound paths
are displayed in a distributed
manner.

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26 Parameter Settings

26.4.3 ATM Parameters


The ATM parameters that need to be set for the ATM boards include the port type and traffic
type.

1.1.1.1.1756 Port Type


The port types include NNI and UNI. The default port type is UNI.

1.1.1.1.1757 Traffic Type


The traffic type must meet the requirements of the port.

1.1.1.1.1758 Service Type


Five service types are available, namely, CBR, rt-VBR, nrt-VBR, UBR, and UBR+.

1.1.1.1.1759 Peak Cell Rate


Set the peak cell rate of the ATM services. This parameter must be set for each service type.

1.1.1.1.1760 Sustainable Cell Rate


Set the sustainable cell rate of the ATM services. In the case of the rt-VBR and nrt-VBR
services, set this parameter.

1.1.1.1.1761 MBS
Set the MBS of the ATM services. In the case of the rt-VBR and nrt-VBR services, set this
parameter.

1.1.1.1.1762 CDVT
Set the CDVT of the ATM services. In the case of the CBR, rt-VBR, and UBR services, set
this parameter.

26.5 SDH Processing Boards


The parameters that need to be set for the SDH processing boards include the J0 byte, J1 byte,
J2 byte, and C2 byte.

1.1.1.1.1763 J0 Byte
The J0 byte is used to transmit repetitively a section access point identifier so that a section
receiver can verify its continued connection to the intended transmitter. It is recommended
that you set the J0 byte to the default value, namely, single-byte "Disabled".

1.1.1.1.1764 J1 Byte
J1 is the higher order path trace byte. This byte is used to transmit repetitively a path access
point identifier so that a path receiving terminal can verify its continued connection to the
intended transmitter. When a J1 mismatch is detected at the receive end, the corresponding
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VC-4 path generates an HP_TIM alarm.


Generally, the J1 byte retains the default. However, when Huawei equipment is interconnected with
third-party equipment, the J1 byte must be set to the same value at both ends.

1.1.1.1.1765 J2 Byte
J2 is the lower order path trace byte. This byte is used to transmit repetitively a low order path
access point identifier so that a path receiving terminal can verify its continued connection to
the intended transmitter.
To set and query the J2 byte to be received, enable the lower order monitoring function.
In the case of the SDH processing boards, the J2 byte to be sent cannot be set.

1.1.1.1.1766 C2 Byte
C2 is the signal label byte, which is used to indicate the multiplexing structure of the VC
frames and the payload property. The C2 byte to be sent must match the C2 byte to be
received. When a C2 mismatch is detected, the corresponding VC-4 path at the local end
generates an HP_SLM alarm.
Table 26-20 shows the relationship between the service type and the value of the C2 byte.
Figure 1.1 relationship between the service type and the value of the C2 byte
Service Type

Value of the C2 Byte (Hexadecimal)

TUG structure

02

34M/45M into C-3

04

140M into C-4

12

Unequipped

00

26.6 PDH Boards


The parameters that need to be set for the PDH boards include the J1 byte, C2 byte, J2 byte,
V5 byte, and tributary loopback.

1.1.1.1.1767 J1 Byte
J1 is the path trace byte. This byte is used to transmit repetitively a path access point identifier
so that a path receiving terminal can verify its continued connection to the intended
transmitter. When a J1 mismatch is detected at the receive end, the corresponding VC-4 path
generates an HP_TIM alarm.
The J1 byte is set to the single-byte "" by default.
The J1 byte was set to " HuaWei SBS

Issue 02 (2013-01-18)

" by default.

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1.1.1.1.1768 C2 Byte
C2 is the signal label byte, which is used to indicate the multiplexing structure of the VC
frames and the payload property. The C2 byte to be sent must match the C2 byte to be
received. When a C2 mismatch is detected, the corresponding VC-4 path at the local end
generates an HP_SLM alarm.
Table 26-21 shows the relationship between the service type and the value of the C2 byte.
Figure 1.1 relationship between the service type and the value of the C2 byte
Service Type

Value of the C2 Byte (Hexadecimal)

TUG structure

02

34M/45M into C-3

04

140M into C-4

12

Unequipped

00

1.1.1.1.1769 J2 Byte
J2 is the VC-12 path trace byte. This byte is used to transmit repetitively a low order path
access point identifier so that a path receiving terminal can verify its continued connection to
the intended transmitter.

1.1.1.1.1770 V5 Byte
V5 is the path status and signal label byte. This byte is used to detect bit errors and indicate
remote errors or remote failures on lower order paths. The LP_REI and LP_RFI alarms are
generated accordingly. Table 26-22 shows the relationship between the service type and the
value of the V5 byte.
Figure 1.1 relationship between the service type and the value of the V5 byte
Service Type

Value of the V5 Byte (Hexadecimal)

Unequipped or supervisory-unequipped

00

Equipped-non-specific payload

01

Asynchronous

02

Bit synchronization

03

Byte synchronization

04

Retained signal flag

05

O.181 test signal

06

VC-AIS

07

Other mapping (For test)

08

ATM mapping

09

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26 Parameter Settings

Service Type

Value of the V5 Byte (Hexadecimal)

HDLC/PPP mapping

0A

HDLC/LAPS mapping

0B

Virtual connection test signal (O.181


special mapping)

0C

GFP mapping

0D

1.1.1.1.1771 Equipping Indication


When a service channel only carries the service and does not process the service, select
Unequipped or Supervisory-Unequipped.
When a service channel carries the service and also processes the service, select EquippedUnspecific Payload.

1.1.1.1.1772 Tributary Loopback


The tributary loopback function is used to locate faults in the service channels.
The tributary loopback is also a diagnosis function. When the tributary loopback is performed,
related services are interrupted.

1.1.1.1.1773 Path Service Type


This parameter is set to specify service type for the channel.

Select E1 or T1 for E1/T1 processing boards according to the actual service type in the
channel.

Select E3 or T3 for E3/T3 processing boards according to the actual service type in the
channel.

1.1.1.1.1774 Serial Port Protocol Mode


For the DX1, select the protocol mode of the N x 64 kbit/s signals. The protocol mode
includes V.35, V.24, X.21, RS449, RS530 and RS530A.

1.1.1.1.1775 DDN Clock Source Management


The timing scheme and working clock source can be set for the DX1.

Set the timing scheme of the DDN channels 1012 and 1416 to the DCE internal
scheme, DCE slave scheme or DTE external scheme.

Set the timing scheme of the DDN channels 9 and 13 to the DCE internal scheme, DCE
slave scheme, DTE external scheme, DTE internal scheme, DTE slave scheme or DCE
external scheme. By default, the timing scheme is the DCE internal scheme for channels
9 and 13 is the DCE internal scheme.

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26.7 WDM Boards


The parameters that need to be set for the WDM boards include the path use status, optical
interface loopback, service type, client service bearer rate (M), laser status, automatic laser
shutdown, current bearer rate (M), actual wavelength no./wavelength (nm)/frequency (THz),
actual band type, configure wavelength no./wavelength (nm)/frequency (THz), configure
band type, and SD trigger condition.

1.1.1.1.1776 Path Use Status


Item

Description

Parameter description

Used to set the path use status

Parameter values

Used and Unused

Parameter value description

Default value: Used

Recommended value

Used

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

When the Path Use Status of an optical


interface is set to Unused, service alarms at this
interface are suppressed, which disables the
automatic laser turn on function.

Relevant boards

LWX

Configuration requirements

When the channel is not required, its Path Use


Status can be set to Unused. In this case, a
command should be issued to shut down the
laser of this path; otherwise, an alarm indicates
that the laser is forcibly turned on is reported.

1.1.1.1.1777 Optical Interface Loopback


Item

Description

Parameter description

Used to set the loopback mode of the current


optical interface.

Parameter values

Non-Loopback, Outloop, and Inloop

Parameter value description

Default value: Non-Loopback


Non-Loopback: indicates that the equipment is
in normal state. Optical interface loopback is not
required when the equipment normally operates.
Inloop: indicates a mode that signals to be
output from the output interface of the local-end
equipment are looped back to the signal input
interface of this equipment. Inloop is used to test

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Item

26 Parameter Settings

Description
the signal processing on the board.
Outloop: indicates a mode that unprocessed
signals accessed to the local-end equipment are
directly looped back to the corresponding output
interface without the signal structure changed.
Outloop is used to test connections between fiber
lines and connectors.

Recommended value

Non-Loopback

Application scenarios

In commissioning and maintenance stages

Impact on the system

When the loopback mode is set to Inloop or


Outloop, services are interrupted.

Relevant boards

RPC01 and RPC02

Configuration requirements

None

1.1.1.1.1778 Service Type


Item

Description

Parameter description

Used to set the type of services at a client-side


optical interface.

Parameter values

LWX: GE, FE, STM-1, STM-16, OC-3, OC-12,


OC-48, FC-100, FC-200 FICON, FICON
Express, DVB-ASI DVB-SDI, and ESCON

Parameter value description

Default value: Any

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

LWX

Configuration requirements

The type of actually accessed services must be


the same as the type of configured services.
Otherwise, the services are not available.

1.1.1.1.1779 Client Service Bearer Rate (M)


Item

Description

Parameter description

Used to set the bearer rate of client-side services.

Parameter values(M)

16 to 2500

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26 Parameter Settings

Item

Description

Parameter value
description

The bearer rate of client-side services can be set only when the
client-side services are of Any type. The set value should equal
to the maximum rate of actually accessed services.

Recommended value

None

Application scenarios

In configuration, commissioning, and maintenance stages

Impact on the system

A SPEED_OVER alarm is reported when the rate of actually


accessed services exceeds the set value.

Relevant boards

LWX

Configuration
requirements (the set
value of bearer rate
should be the same as
the rate of actually
accessed services)

Actually
accessed
services

Set value
(M)

Actually
accessed
services

Set value (M)

STM-1

155.5

GE

1250

STM-4

622

FE

125

STM-16

2488.3

FC100

1062

OC3

155.5

FC200

2124

OC12

622

FICON

1062

OC48

2488.3

FICON
Express

2124

HDTV

270

ESCON

200

DVB-SDI

270

FDDI

125

DVB-ASI

270

1.1.1.1.1780 Laser Status


Item

Description

Parameter description

Used to set the laser Open/Close status.

Parameter values

Open and Close


Default value: Open

Parameter value description

Open: The laser is turned on to start transmitting


services.
Close: The laser is turned off to stop service
transmitting.

Recommended value

Open

Application scenarios

In configuration, commissioning, and

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26 Parameter Settings

Description
maintenance stages

Impact on the system

When the laser is set to Close, services are


interrupted.

Relevant boards

LWX

Configuration requirements

When an optical interface is unused or is not


connected to a fiber, the laser at this interface
should be set to Open.

1.1.1.1.1781 Automatic Laser Shutdown


Item

Description

Parameter description

Used to set whether to enable automatic laser


shutdown (ALS) of the downstream laser of the
local board in the case of loss of received
signals. If ALS is enabled, when the received
signals are lost, the laser is automatically shut
down and stops transmitting signals. ALS
prolongs the service life of a laser and avoids
personal injury from the laser.

Parameter values

Enabled and Disabled

Parameter value description

By default, ALS of optical interfaces on client


sides is set to Enabled and ALS of optical
interfaces on WDM sides is set to Disabled.

Recommended value

ALS of optical interfaces on client sides is set to


Enabled and ALS of optical interfaces on WDM
sides is set to Disabled.

Application scenarios

In configuration and maintenance stages

Impact on the system

None

Relevant boards

LWX

Configuration requirements

If the optical interface on a WDM side does not


use the ESC as the network management channel
or no fiber is connected, you can set ALS of the
optical interface to Enabled to prolong the
service life of the laser.

1.1.1.1.1782 Current Bearer Rate (M)


Item

Description

Parameter description

Used to query the current bearer rate of client-

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Item

26 Parameter Settings

Description
side services.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

LWX

Configuration requirements

None

1.1.1.1.1783 Actual Wavelength No./Wavelength (nm)/Frequency (THz)


Item

Description

Parameter description

Used to query the operating wavelength at the


WDM-side optical interface of a board.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

LWX

Configuration requirements

None

1.1.1.1.1784 Actual Band Type


Item

Description

Parameter description

Used to query the band type.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

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26 Parameter Settings

Item

Description

Relevant boards

LWX

Configuration requirements

None

1.1.1.1.1785 Configure Wavelength No./Wavelength (nm)/Frequency (THz)


Item

Description

Parameter description

Used to configure the operating wavelength at


the WDM-side optical interface of a board.

Parameter values

C-band wavelength spacing: 100G (192.100196.00 THz)


CWDM-band wavelength spacing: 20 nm (12711611 nm)

Parameter value description

The operating wavelength of a fixed-wavelength


OTU should be set to the actual wavelength of
the OTU. The operating wavelength of a tunablewavelength OTU should be set according to the
network wavelength planning.

Recommended value

None

Application scenarios

In configuration stage

Impact on the system

The same wavelength should be used for a


service in the receive and transmit directions.

If a service travels through multiple


regenerating stations, it is recommended that
these regenerating sections use the same
wavelength.

It is recommended that the active and standby


channels use the same wavelength when the
inter-board channel protection or client-side
path protection is adopted.

Relevant boards

LWX

Configuration requirements

The configured logic wavelength must be the


same as the actual physical wavelength.
Otherwise, a CFGDATA_OUTRANGE alarm is
reported. In the case of tunable optical modules,
issuing the captioned command directly changes
their physical wavelengths (but does not change
the band). In the case of non-tunable optical
modules, issuing this command changes their
logic wavelengths only.

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26 Parameter Settings

1.1.1.1.1786 Configure Band Type


Item

Description

Parameter description

Used to configure the band type.

Parameter values(dBm)

C and CWDM

Parameter value description

None

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

LWX

Configuration requirements

The configured logic band must be the same as


the actual physical band. Otherwise, a
CFGDATA_OUTRANGE alarm is reported.

1.1.1.1.1787 SD Trigger Condition


Item

Description

Parameter description

Used to configure the trigger condition to


perform SD switching on the board.

Parameter values(dBm)

B1_SD, OTUk_DEG, ODUk_PM_DEG, and


None

Parameter value description

B1_SD: Regeneration section (B1) signal


degrade
OTUk_DEG: OTUk signal degrade
ODUk_PM_DEG: ODUk_PM signal degrade
None: No condition is configured for SD
switching.

Recommended value

Set the value to None.

Application scenarios

In commissioning and maintenance stages

Impact on the system

When the B1_SD, OTUk_DEG, or


ODUk_PM_DEG alarm occurs, the protection
group might be triggered to perform protection
switching.

Relevant boards

LWX

Configuration requirements

Set the value to B1_SD, OTUk_DEG, or


ODUk_PM_DEG if the protection mechanism
needs such a trigger condition.

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26 Parameter Settings

26.8 Cross-Connect and Timing Units


The parameters that need to be set for the cross-connect and timing units include the clock
source parameters and clock subnet parameters.
Table 26-23 lists the parameters that need to be set for the cross-connect and timing units.
Figure 1.1 Parameters that need to be set for the cross-connect and timing units
Domain

Parameter

Value

Configuration

Clock
Synchroni
zation
Status

NE Name

Displays the name of an NE.

NE Clock
Working Mode

Tracing Mode,
Holdover Mode,
Free-Run Mode

This field shows the current working


mode of the clock function board on
the NE. This field is read-only.
Tracing Mode: It is the normal
working mode and indicates that the
clock is synchronized with the input
reference clock source under the
actual service conditions.
Holdover Mode: Indicates that the
clock works with the stored
frequency information as the timing
reference after all the timing
references are lost.
Free-Run Mode: Indicates that the
clock works through the internal
oscillator.

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S1 Byte
Synchronization
Quality
Information

For example: NA

Displays the S1 byte synchronous


quality information in the clock
function on the current NE. For
query only.

S1 Byte Clock
Synchronous
Source

For example: NA

Displays the trace source of the


current NE clock. For query only.

Synchronous
Source

For example:
External Clock
Source 1

This field displays no information


until the S1 byte (clock protection
function) is activated. Similarly, this
field displays NA until you press the
Query button, and then it displays
the related information.

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Displays the trace source of the


current NE clock. For query only.
Normally, the synchronous source
should be a clock source with the
highest priority among the clock
stratums. If the synchronous source
cannot be traced, try to trace a clock
source with a lower priority level
according to the sequence of the
clock stratums.
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Domain

26 Parameter Settings

Parameter

Value

Configuration

Data Output
Method in
Holdover Mode

Normal Data
Output Mode,
Keep the Latest
Data

Displays the data output method.

Default: Normal
Data Output
Mode
Clock
source
priority

Clock
source
switching
condition

Phaselocked
source
output by
external
clock

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Clock source

The clock sources currently used by


the NE are listed in sequence. The
top clock source is of the highest
priority.

External clock
source mode

2 MHz and 2
Mbit/s

Select the mode only for the input


external clock source.

Synchronous
status byte

Sa4, Sa5, Sa6,


Sa7, and Sa8

Select the synchronous status byte


only for the input external clock
source that is in 2 Mbit/s mode.

AlS alarm
generated

Selected and not


selected

This parameter specifies the


condition for determining the clock
source switching. When an AIS
alarm occurs on an NE, the NE
determines whether to perform the
clock source switching.

B1 BER
thresholdcrossing
generated

Selected and not


selected

This parameter specifies the


condition for determining the clock
source switching. When the B1 BER
on an NE crosses the threshold, the
NE determines whether to perform
the clock source switching.

RLOS, RLOF
and OOF alarms
generated

Selected

When an RLOS, RLOF, or OOF


alarm occurs on an NE, the NE
considers that the corresponding
clock source fails.

External clock
output mode
when 2M output
synchronous
source is invalid

Synchronization
quality
unavailable,
output AIS, and
shut off

This parameter is used to set the


operation to be performed by the
system when the output of the
synchronous clock (that is, 2M
phase-locked source) fails.

Default value:
Shut off
Output mode of
external clock
source 1

2 Mbit/s and 2
MHz

The NE provides two external clock


outputs. This parameter is used to
set the output mode for external
clock source 1.

Output mode of
external clock
source 2

2 Mbit/s and 2
MHz

The NE provides two external clock


outputs. This parameter is used to
set the output mode for external

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Domain

Parameter

26 Parameter Settings

Value

Configuration
clock source 2.

Clock
source
switching

Clock
source
reversion
parameter

Clock
subnet

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Clock source
threshold

No threshold
value, G.813
SDH equipment
timing source
(SETS) signal,
G.812 local clock
signal, G.812
transit clock
signal, G.811
clock signal, and
unknown

Set a threshold for the 2M


synchronous output sources. The
threshold is set for the clock
protection function of the S1 byte.
The NE clock system uses this
threshold as the basis for ensuring
the quality of the output clock. If a
clock is of a quality higher than the
threshold, the clock system transmits
clock signals.

Lock status

Lockout and
unlock

This parameter is used to set


whether the clock source switching
is allowed.

Switching
operation

Forced switching,
manual switching,
and clear
switching

This parameter specifies the


switching operation to be performed
on the clock source.

Higher priority
clock source
reversion mode

Auto-revertive
and non-revertive

When the clock source of a higher


priority degrades, the NE
automatically switches to the clock
source of a lower priority. When this
parameter is set to "Auto-revertive",
the NE automatically switches back
to the clock source of a higher
priority when the clock source of the
higher priority is restored. When this
parameter is set to "Non-revertive",
the NE does not automatically
switch back to the clock source of a
higher priority when the clock
source of the higher priority is
restored.

Clock source
WTR time

0 to 12 minutes

This parameter is used to set the


period from the time when the
recovery of the clock is detected to
the time when the clock selector
responds. This setting prevents
repeated switching from occurring
in the case of unstable signals.

Affiliated subnet

Default value: 0

This parameter is used to set the


subnet ID.

Protection status

Start extended
SSM protocol,
start standard
SSM protocol,
and stop SSM

This parameter specifies whether to


start up the SSM protocol.

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Domain

Parameter

26 Parameter Settings

Value

Configuration

protocol
Clock source ID

1 to 15

Huawei equipment uses the first


four bits of the S1 byte to identify
the clock source. Hence, the subnet
clock source ID is the four bits.

SSM
output
control

Line port

All the line ports


of the current NE

This parameter displays the line


ports that can be controlled.

Control status

Enabled and
disabled

This parameter specifies whether the


line port allows the output of the
quality information carried by the
S1 byte. Generally, set this
parameter to "Disabled" at edges of
a network to prevent impact on the
other equipment.

Clock
quality

Configuration
quality

Unknown
synchronization
quality, G.811
clock signal,
G.812 transit
clock signal,
G.812 local clock
signal, G.813
SDH equipment
timing source
(SETS) signal, do
not use for
synchronization,
and automatic
extraction

This parameter is used to set the


clock quality. Specify the clock
quality of the clock source listed in
the priority table. If an option other
than "Automatic extraction" is
selected, the NE considers the
specified clock quality (other than
the actual clock quality) as the
criteria.

Default value:
Automatic
extraction

Clock ID
Issue 02 (2013-01-18)

Clock quality

Unknown
synchronization
quality, G.811
clock signal,
G.812 transit
clock signal,
G.812 local clock
signal, G.813
SDH equipment
timing source
(SETS) signal, do
not use for
synchronization,
and automatic
extraction

The clock source quality


information actually received by the
NE is extracted by the NE from the
S1 byte of each clock source. When
the customer queries the actual clock
quality and the NE successfully
returns the result, the quality can be
displayed. Otherwise, it displays "no
information".

Line port

All the line ports

This parameter displays the line

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Domain

Parameter

status
Enabled status

26 Parameter Settings

Value

Configuration

of the current NE

ports that can be configured with the


clock ID.

Enabled and
disabled

This parameter specifies whether to


enable the setting of the clock ID.

Default value:
Enabled

26.9 Optical Amplifier Boards


The parameters that need to be set for the optical amplifier boards include the laser status,
board work type, configure band, configure working band parity, actual band, actual working
band parity, threshold of input power loss, gain, rated optical power, nominal gain upper
threshold, and nominal gain lower threshold.

1.1.1.1.1788 Laser Status


Item

Description

Parameter description

Used to set the laser Open/Close status.

Parameter values

Open and Close


Default value of the OBU1: Open
Default value of the RPC01/RPC02: Close

Recommended value

Close

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

When the laser is set to Close, services are


interrupted.

Relevant boards

OBU1, RPC01, and RPC02

Configuration requirements

When services are normal, the laser of the optical


amplifying unit should be set to Open.

1.1.1.1.1789 Board Work Type


Item

Description

Parameter description

Used to query and set the Board Work Type.

Parameter values

C, C+L, and L

Parameter value description

None

Recommended value

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26 Parameter Settings

Item

Description

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

RPC01 and RPC02

Configuration requirements

None

1.1.1.1.1790 Configure Band


Item

Description

Parameter description

Used to configure the type of the working band


of a board.

Parameter values

Parameter value description

Supports only C band.

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

OBU1, RPC01, and RPC02

Configuration requirements

None

1.1.1.1.1791 Configure Working Band Parity


Item

Description

Parameter description

Selects the required parity of the working band.

Parameter values

All, Even, and Odd

Parameter value description

All: All 192.10 THz to 196.05 THz odd and even


wavelengths at 50 GHz channel spacing in C
band. There are 80 wavelengths in total. It is
applicable for the OBU1, RPC01, and PRC02
boards.
Even: All 192.10 THz to 196.00 THz even
wavelengths at 100 GHz channel spacing. There
are 40 wavelengths in total. It is applicable for
the RPC01 and PRC02 boards.
Odd: All 192.15 THz to 196.05 THz odd

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Item

26 Parameter Settings

Description
wavelengths at 100 GHz channel spacing. There
are 40 wavelengths in total. It is applicable for
the RPC01 and PRC02 boards.

Recommended value

Corresponding wavelengths are used according


to different requirements.

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1, RPC01, and RPC02

Configuration requirements

When configuring the parity of wavelengths,


make sure that the parity configured is consistent
with the parity of the actual working
wavelengths.

1.1.1.1.1792 Actual Band


Item

Description

Parameter description

Used to query the actual working band of the


board.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

None

1.1.1.1.1793 Actual Working Band Parity


Item

Description

Parameter description

Used to query the parity of the actual working


band of the board.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In commissioning and maintenance stages

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26 Parameter Settings

Item

Description

Impact on the system

None

Relevant boards

OBU1, RPC01, and RPC02

Configuration requirements

None

1.1.1.1.1794 Threshold of Input Power Loss (dBm)


Item

Description

Parameter description

Indicates the lower threshold of input optical


power loss (an MUT_LOS alarm is reported).

Parameter values

Can only be queried

Parameter value description

The default value varies with the boards and


subjects to the on-site queried result.

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

None

1.1.1.1.1795 Gain (dB)


Item

Description

Parameter description

Used to query the optical power gain of the


current optical amplifying unit.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

Normally, the queried result should range from


the nominal gain minus 2.5 dB to the nominal
gain plus 2.5 dB.

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26 Parameter Settings

1.1.1.1.1796 Nominal Gain Upper Threshold (dB)


Item

Description

Parameter description

Used to query the nominal gain upper threshold.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

None

1.1.1.1.1797 Nominal Gain Lower Threshold (dB)


Item

Description

Parameter description

Used to query the nominal gain lower threshold.

Parameter values

Can only be queried

Parameter value description

None

Recommended value

None

Application scenarios

In commissioning and maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

None

1.1.1.1.1798 Rated Optical Power (dBm)


Item

Description

Parameter description

Used to set and query the single-wavelength


rated optical power as the reference value for
automatic optical power adjustment.

Parameter values (dBm)

30.0 to 30.0

Parameter value description

Default value at the input optical interface: 19


dBm
Default value at the output optical interface: 4
dBm

Recommended value
Issue 02 (2013-01-18)

OBUC01: input interface: 20 dBm; output

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Item

26 Parameter Settings

Description
interface: 0 dBm
OBUC03: input interface: 19 dBm; output
interface: 4 dBm

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

None

Relevant boards

OBU1

Configuration requirements

The rated input and output optical power should


be configured by referring to the actual
configurable input and output range of the
optical amplifying unit and should be the same
as the input and output values measured when
the optical amplifying unit operates normally.

1.1.1.1.1799 Fixed Pump Optical Power (dBm)


Item

Description

Parameter description

Used to set or query the output optical power of


an optical amplifier board.

Parameter values (dBm)

5 to 30.0 (continuously tunable)

Parameter value description

Normally, the fixed pump optical power of the


RPC board should be larger than 23 dBm. The
value is related to the system specifications.

Recommended value

None

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

Fixed Pump Optical Power (dBm) must be set


within a range between Min. Fixed Pump
Optical Power (dBm) and Max. Fixed Pump
Optical Power (dBm). If the fixed pump optical
power value is beyond the range, the board
might work abnormally.

Relevant boards

RPC01 and RPC02

Configuration requirements

None

1.1.1.1.1800 Min. Fixed Pump Optical Power (dBm)


Item

Description

Parameter description

Used to query the minimum pump optical power

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Item

26 Parameter Settings

Description
that an optical amplifier board can fix. If the
fixed pump optical power value is smaller than
the minimum value, the board might work
abnormally.

Parameter values (dBm)

5 to 30.0

Parameter value description

None

Recommended value

Default value: 20 dBm

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

If the configured value of Fixed Pump Optical


Power (dBm) is smaller than the value of Min.
Fixed Pump Optical Power (dBm), the board
might work abnormally.

Relevant boards

RPC01 and RPC02

Configuration requirements

None

1.1.1.1.1801 Max. Fixed Pump Optical Power (dBm)


Item

Description

Parameter description

Used to query the maximum pump optical power


that an optical amplifier board can fix. If the
fixed pump optical power value is larger than the
maximum value, the board might work
abnormally.

Parameter values (dBm)

5 to 30.0

Parameter value description

None

Recommended value

Default value: 26 dBm

Application scenarios

In configuration, commissioning, and


maintenance stages

Impact on the system

If the configured value of Fixed Pump Optical


Power (dBm) is larger than the value of Max.
Fixed Pump Optical Power (dBm), the board
might work abnormally.

Relevant boards

RPC01 and RPC02

Configuration requirements

None

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27 Task Collection

27

Task Collection

About This Chapter


This topic describes the operation tasks to be performed during board commissioning and
board configuration.
27.1 Querying the Protection Subnet
You can know the network protection schemes by querying the protection subnet to which an
NE belongs. Then, you can configure services for the board according to the protection
schemes.
27.2 Troubleshooting Service Unavailability
In certain cases, the services become unavailable after the cross-connections related to the
services are configured. This topic describes the methods of troubleshooting service
unavailability.
27.3 Troubleshooting the Clock Tracing Failure
In many cases, the equipment still fails to trace the clock after you configure the clock source
priority list. To locate the clock tracing problem, you need to check all the stations that the
clock travels along the clock tracing direction and from the source station to the sink station.
27.4 Configuring the F&f Debugging Serial Port and OAM NM Port
The OAM NM port provides the network management function and is used for remote
maintenance. The F&f debugging serial port is used for managing the external equipment
such as the COA, TDA, and DCU. The F&f debugging serial port supports a maximum
transmission distance of 15 m. The AUX board provides the ports for connecting the F&f
debugging serial port and OAM NM port.
27.5 Testing the Frequency Accuracy of the Free-Run Clock
The frequency accuracy indicates the deviation of the actual clock frequency from the
nominal clock frequency, which is a highly stable frequency. Generally, the frequency
accuracy is represented by the relative frequency deviation.
27.6 Testing the Clock Holdover Accuracy
The SDH equipment supports the clock holdover function. That is, the SDH equipment can
retain the clock accuracy of 0.37 ppm or a higher clock accuracy (at a temperature from
20C to 30C) relative to the clock frequency at the service interruption moment, within 24
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27 Task Collection

hours after the external clock source is interrupted.


27.7 Checking Board Parameters
To learn about board parameter status, you can check board parameters. Before actual
configuration operations in networking, you need to check board parameters, to make sure
that the board parameter status meets the requirements of actual networking.
27.8 Testing the SAN Service Channel
When a network carries services, you need to check the availability of the service channels.
27.9 Testing the SDI Service Channel
When a network carries services, you need to check the availability of the service channels.

27.1 Querying the Protection Subnet


You can know the network protection schemes by querying the protection subnet to which an
NE belongs. Then, you can configure services for the board according to the protection
schemes.

1.1.1.1.1802 Prerequisites

You must be an NM user with "NE operator" authority or higher.

The SDH board must be created.

1.1.1.1.1803 Procedure
Step 1 Choose Protection Subnet > SDH Protection Subnet Maintenance from the Main Menu to
display the Protection Subnet Attributes dialog box.
Step 2 In Protection Subnet Attributes, the left pane displays the protection subnet to which the NE
belongs, and the right pane displays the attribute information of the protection subnet.
----End

27.2 Troubleshooting Service Unavailability


In certain cases, the services become unavailable after the cross-connections related to the
services are configured. This topic describes the methods of troubleshooting service
unavailability.

1.1.1.1.1804 Context
After the cross-connections are configured, the services are unavailable.

1.1.1.1.1805 Impacts on the System


The services are unavailable.

1.1.1.1.1806 Possible Causes

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Cause 2: The services are configured incorrectly.

Cause 3: The other boards on the NE do not operate normally.

27 Task Collection

1.1.1.1.1807 Tools, Instruments, and Materials


1.1.1.1.1808 Procedure
Step 1 Ensure that the type of the logical board configured on the is the same as the type of the
physical board. If the type of the logical board configured on the U2000 is different from the
type of the physical board, delete the current logical board and then add the correct logical
board. For the operations of deleting a logical board, see Deleting Boards. For the operations
of adding a logical board, see Adding Boards.
Step 2 Ensure that the cross-connect services are configured correctly and that the cross-connect
services are activated. If the cross-connect services are configured correctly, modify the
configuration of the cross-connect services. For details, see Modifying the Service
Configuration Data.
Step 3 Check whether all the boards on the NE operate normally and whether any critical or major
alarms are generated on the boards.
Step 4 Switch the services from the working cross-connect board to the protection cross-connect
board. If the services are restored after the switching, replace the working cross-connect
board. If the services are still unavailable after the switching, perform Step 5.
Step 5 Contact Huawei technical support personnel.
----End

27.3 Troubleshooting the Clock Tracing Failure


In many cases, the equipment still fails to trace the clock after you configure the clock source
priority list. To locate the clock tracing problem, you need to check all the stations that the
clock travels along the clock tracing direction and from the source station to the sink station.

1.1.1.1.1809 Prerequisites

The NE must be connected to the NMS through an NMS port or using a DCC
communication management device.

The software must be installed on the PC and the PC must be started.

1.1.1.1.1810 Procedure
Step 1 Ensure that the clock source priority list is configured correctly.
If the problems are detected in Steps 113, correct the configurations according to the
operations in Configuring Clocks.
Step 2 Query the input mode of the external clock and ensure that the input mode of the external
clock source is set correctly. That is, ensure that the input mode of the external clock source is
set to the 2 MHz or 2 Mbit/s.
Step 3 Ensure that the SSM mode is enabled.
Step 4 Ensure that the clock source to be traced is available.
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Step 5 If the line source is unavailable, check whether the LOS or LOF alarm occurs on the
corresponding optical port. If the LOS or LOF alarm occurs on the corresponding optical port,
clear the alarm. If the LOS or LOF alarm does not occur on the corresponding optical port,
run the test command to check whether the inter-board communication is normal. If the interboard communication is not normal, it indicates that the equipment fails to trace the clock due
to the abnormal inter-board communication.
Step 6 Check whether the external clock is derived from the BITS or other NEs. If the source of the
external clock is incorrect, set the correct external clock source.
Step 7 Check whether the clock source is locked. If the clock source is locked, unlock the clock
source.
Step 8 Check whether the switching mode of the clock source is non-revertive on the . If the
switching mode of the clock source is non-revertive, change the switching mode to revertive.
Step 9 Check whether any forced switching or manual switching is performed for other clock
sources. If a forced switching or manual switching is performed for other clock sources, clear
the switching.
Step 10 Check whether the S1 byte that carries the clock source signal is DNU. If the S1 byte that
carries the clock source signal is DNU, go to step 13.
Step 11 Check whether the S1 byte is correct. If the S1 byte is incorrect, set the correct S1 byte.
Step 12 If the S1 byte is correct, check whether the external clock is derived from the BITS or other
NEs. If the source of the external clock is incorrect, set the correct external clock source.
Check whether the clock source is locked. If the clock source is locked, unlock the clock
source. Check whether any forced switching or manual switching is performed for other clock
sources. If a forced switching or manual switching is performed for other clock sources, clear
the switching.
Step 13 In the case of the line clock source, check whether the timeslot for receiving the S1 byte is
any of sa4sa8. If the timeslot for receiving the S1 byte is not any of sa4sa8, set the timeslot
for receiving the S1 byte to any of sa4sa8.
----End

27.4 Configuring the F&f Debugging Serial Port and OAM


NM Port
The OAM NM port provides the network management function and is used for remote
maintenance. The F&f debugging serial port is used for managing the external equipment
such as the COA, TDA, and DCU. The F&f debugging serial port supports a maximum
transmission distance of 15 m. The AUX board provides the ports for connecting the F&f
debugging serial port and OAM NM port.

1.1.1.1.1811 Prerequisites

The PC must be connected to the equipment through a network cable. The PC must be
started.

The U2000 must be started.

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27 Task Collection

1.1.1.1.1812 Procedure
Step 1 Open the NE whose F&f debugging serial port and OAM NM port need to be configured on
the U2000.
Step 2 Choose Communication > Access Control from the Function Tree. See Figure 27-1.
Figure 1.1 Configuring the F&f debugging serial port and OAM NM port

Step 3 Configure the OAM NM port. Select Enable OAM Access. This operation is optional.
Step 4 Configure the F&f debugging serial port. Select Enable Serial Port Access and set the baud
rate to 38400.
Step 5 Click Apply so that the settings can take effect.
----End

27.5 Testing the Frequency Accuracy of the Free-Run Clock


The frequency accuracy indicates the deviation of the actual clock frequency from the
nominal clock frequency, which is a highly stable frequency. Generally, the frequency
accuracy is represented by the relative frequency deviation.

1.1.1.1.1813 Tools and Instruments


Frequency meter

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27 Task Collection

1.1.1.1.1814 Test Connection Diagram


Connect the frequency meter to the NE as shown in Figure 27-2.
Figure 1.1 Connection for testing the frequency accuracy of the free-run clock
2 MHz
Equipment

Standard clock

Frequency meter

1.1.1.1.1815 Procedure
Step 1 Use the frequency meter to measure the frequency of the standard clock.
Step 2 Set the clock to be in free-run mode. Set the output mode of the external clock to the 2 MHz
or 2 Mbit/s mode. Connect the output clock signal to the frequency meter for measurement.
Step 3 Use the frequency meter to measure the frequency of the free-run clock. Compare the actual
frequency of the free-run clock with the frequency of the standard clock to calculate the
frequency accuracy of the free-run clock.
Step 4 You can calculate the frequency deviation and determine the frequency accuracy only after
you check the clock frequencies at different time periods within several months and perform
frequency tests under different conditions. In addition, you need to perform the frequency
tests at appropriate time periods based on the actual situations.
----End

27.6 Testing the Clock Holdover Accuracy


The SDH equipment supports the clock holdover function. That is, the SDH equipment can
retain the clock accuracy of 0.37 ppm or a higher clock accuracy (at a temperature from
20C to 30C) relative to the clock frequency at the service interruption moment, within 24
hours after the external clock source is interrupted.

1.1.1.1.1816 Prerequisites
The following operations must be performed:

The U2000 LCT must be started.

You must log in to the NE.

1.1.1.1.1817 Tools and Instruments


Frequency meter, SDH analyzer, and U2000 LCT

1.1.1.1.1818 Test Connection Diagram


Connect the testing tools to the NE as shown in Figure 27-3.
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Figure 1.1 Connection for testing the clock holdover accuracy


K

Standard clock

Frequency
meter

Equipment

SDH
analyzer

1.1.1.1.1819 Procedure
Step 1 Turn on Switch K. Configure the standard clock source for the OptiX OSN 3500 on the
U2000 LCT.
Step 2 After performing all the preparations before locking the clock source, record the frequency.
Then, the equipment locks the standard clock source for 24 hours. Turn off Switch K. Then,
the clock of the OptiX OSN 3500 changes to holdover mode. Then, record the clock
frequency every other hour.
Step 3 Check the records in 24 hours. The test requires that the frequency stability of the standard
clock should be higher than 1x1010/day.
----End

27.7 Checking Board Parameters


To learn about board parameter status, you can check board parameters. Before actual
configuration operations in networking, you need to check board parameters, to make sure
that the board parameter status meets the requirements of actual networking.

1.1.1.1.1820 Procedure
Step 1 Check SDH board parameters. For the SDH board parameters, see Table 27-1.
Figure 1.1 SDH board parameters
Boar
d
Type
SDH

Paramete
r
MSP
sharing
Laser
Switch
Optical(El
ectrical)Int
erface
Loopback

Issue 02 (2013-01-18)

Navigation Path

Application Scenario

1. In the NE
Explorer,
select a board.
2. Choose
Configuratio
n > SDH
Interface
from the
Function Tree.
3. Click By

When configuring MSP shared services on an


optical interface of a board, enable this
parameter.
When configuring services on an optical
interface of a board, enable this parameter.

Non-loopback: It is a normal state. When


the equipment runs normally, set this
parameter to non-loopback.

Inloop: The loop is performed toward the

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Boar
d
Type

Paramete
r

Navigation Path
Board/Port(c
hannel) and
select Port
from the dropdown list.

Hardware
REG
Enable

27 Task Collection

Application Scenario
local NE.

Outloop: The loop is performed toward the


opposite NE. Inloop and outloop of an
optical interface affect services. They are
used to locate faults.

In the REG working mode, the board processes


only the framer header and regenerator section
overheads. In the case of the non-REG service
configuration, set this parameter to Disabled.

Step 2 Check PDH board parameters. For the PDH board parameters, see Table 27-2.
Figure 1.2 PDH board parameters
Boar
d
Type

Paramete
r

PDH

J2 byte

V5 byte

Service
Load
Indication

Tributary
Loopback

Issue 02 (2013-01-18)

Navigation Path

Application Scenario

1. In the NE
Explorer,
select a board.
2. Choose
Configuratio
n > Overhead
Management
from the
Function Tree.
3. Click By
Board/Port(c
hannel) and
select VC12
Path
Overhead
from the dropdown list.

The J2 byte is a trace byte. Ensure that a device


has the same J2 byte as its interconnected
device.

1. In the NE
Explorer,
select a board.
2. Choose
Configuratio
n > PDH
Interface
from the
Function Tree.
3. Click By
Board/Port(c
hannel) and

The V5 byte is a path status and signal label


byte. It is used to detect bit errors and indicate
remote errors or failures on lower order paths.
V5 values must match service types.

Non-loaded: The service path does not


process the services that are carried, to
suppress alarms in non-loaded service paths.

Load: The service path processes the


services that are carried. In the case of a
tributary board that has services, set this
parameter to Load.

Non-loopback: It is a normal state. When


the equipment runs normally, set this
parameter to non-loopback.

Inloop: When input service signals reach the

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Boar
d
Type

Paramete
r

Navigation Path

27 Task Collection

Application Scenario

select Port
from the dropdown list.

tributary board of the target NE, the signals


revert to the original trail. This function is
used to locate faults of each service path.

Outloop: When input service signals reach


the tributary board through the input port of
the local NE, the signals are looped back
directly to the service output end.

Step 3 Check data board parameters. For the data board parameters, see Table 27-3.
Figure 1.3 Data board parameters
Board
Type

Paramet
er

Ethern
et

Enabled/
Disabled

When configuring Ethernet board port


services, set the port to Enabled.

Working
Mode

Set the working mode of Ethernet ports


according to networking configuration
requirements.

Maximu
m Frame
Length

When a packet exceeds the maximum


frame length that is set, the packet is
discarded. Alternatively, the packet length
is minimized to satisfy the specified frame
length. By default, the value is set to
1522, unless otherwise specified.

MAC
Loopbac
k

Navigation Path

1. In the NE Explorer,
select a board.
2. Choose
Configuration >
Ethernet Interface
Management >
Ethernet Interface
from the Function
Tree.
3. Click External
Port.
4. Click the Basic
Attributes tab.

PHY
Loopbac
k

TAG

Issue 02 (2013-01-18)

1. In the NE Explorer,
select a board.
2. Choose

Application Scenario

Non-loopback: It is a normal state.


When the equipment runs normally,
set this parameter to non-loopback.

Inloop: Inside the equipment, services


from the cross-connect side are looped
back to the cross-connect side. This
operation affects services configured
on ports and is used to locate faults.

Non-loopback: It is a normal state.


When the equipment runs normally,
set this parameter to non-loopback.

Inloop: Inside the equipment, services


from the cross-connect side are looped
back to the cross-connect side. This
operation affects services configured
on ports and is used to locate faults.

Tag Aware: If the client-side


equipment sends tag packets, set the
TAG attribute of external ports to Tag

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Board
Type

Paramet
er

27 Task Collection

Navigation Path

Application Scenario

Configuration >
Ethernet Interface
Management >
Ethernet Interface
from the Function
Tree.
3. Click External
Port.
4. Click the TAG
Attributes tab.

Access: If the client-side equipment


sends untagged packets, set the TAG
attribute of external ports to Access.

Hybrid: If the client-side equipment


sends tag and untagged packets, set the
TAG attribute of external ports to
Hybrid.

Aware.

Entry
Detection

Port Type

ATM

UPC/NP
C
Enabled/
Disabled

1. In the NE Explorer,
select a board.
2. Choose
Configuration >
ATM Interface
Management >
ATM Interface
Management from
the Function Tree.
3. Click External
Port.

This parameter is used to identify tags in


data packets. During the configuration of
VLAN services, set this parameter to
Enabled.

UNI: The maximum number of VPI


bits is 8. The UNI is used on edge
nodes between the user network and
ATM network.

NNI: The maximum number of VPI


bits is 12. The NNI is used between
ATM networks.

Enabled: When the traffic parameter is


valid and strict control of traffic is
required, set this parameter to
Enabled.

Disabled: When the traffic parameter


is invalid (excepting the PCR of CBR
services) and service burst and
grooming are permitted, set this
parameter to Disabled.

Loopbac
k

Inloop is used to locate faults. During


normal service configuration, set this
parameter to No Loopback.

Laser
Switch

This parameter is used to set the on/off


status of a laser. During normal service
configuration, set this parameter to Open.

----End

27.8 Testing the SAN Service Channel


When a network carries services, you need to check the availability of the service channels.

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1.1.1.1.1821 Testing the Loopback Function When the FC Flow Control Function Is

Disabled
Step 1 Connect the optical fibers to the equipment according to Figure 27-4. Ensure that the mode of
the GBIC optical module of the SmartBits and the mode of the SFP optical module of the
MST4 match the mode of the optical fibers.
Figure 1.1 Connection for testing the loopback function when the FC flow control function is
disabled
NE1

NE2
SDH
network

SmartBits

Signal flow

Step 2 Disable the FC flow control function on both the local and remote MST4 boards.
Step 3 Loop back the port of the remote MST4 by using an optical fiber or set an inloop on the port
of the remote MST4.
Step 4 Connect the SmartBits to NE1 and set the SmartBits to the private Pt-2-Pt mode.
Step 5 Check whether the services are normal on the SmartBits.
Step 6 If the services are unavailable, configure a loopback to the remote MST4 on the cross-connect
board of NE1 and a loopback to the local MST4 on the cross-connect board of NE2. Then,
perform the test section by section to locate the fault.
----End

1.1.1.1.1822 Testing the Connection to the FC Switch When the FC Flow Control

Function Is Disabled
Step 1 Connect the optical fibers to the equipment according to Figure 27-5 after ensuring that
services are available on the SmartBits when the FC flow control function is disabled. In
addition, do not modify the configuration of the boards.

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Figure 1.1 Connection for testing the connection to the FC switch when the FC flow control
function is disabled
Switch A

NE1

NE2

Switch B

SDH
network

SmartBits

SmartBits

Step 7 Set the port of the SmartBits to the public Pt-2-Pt mode. Then, perform the following
operations: link_up, login, public, commit, and packet transmission.

If an error occurs when you perform the link_up or login operation, check the connection
between the SmartBits and the switch. In addition, check the port rate.

If an error occurs when you perform the public operation, check whether the mode of the
SFP optical module of the MST4, the mode of the SFP optical module that is installed on
the FC port to which the MST4 is connected, and the mode of the optical fibers match
each other. If the connection is correct, log in to the switch and issue the portcfgshow
command to check the configuration status of the switch port. The configuration of the
port must meet the requirement and the configurations of the ports at both ends must be
consistent. Then, issue the switchshow command to check the status of the FC switch
and check whether the port is in the Online state. In addition, you need to check whether
WWW of the switch at the opposite end, the downstream information, and the upstream
information are displayed.

If the configuration of the switch port is correct and WWW of the switch at the opposite
end is displayed but the downstream information and upstream information are not
displayed, check whether the configuration of the SmartBits is correct. In addition, check
whether WWN Src and WWN Dst are correctly set on the SmartBits.

If the configuration of the SmartBits is correct, check whether network segments are set
on the FC switches. If network segments are set on the FC switches, ensure that the
switch ports to which the SmartBits is connected are in the same network segment.

----End

27.9 Testing the SDI Service Channel


When a network carries services, you need to check the availability of the service channels.

1.1.1.1.1823 SDI Service Loopback Test


Step 1 Connect the cables to the equipment according toFigure 27-6.
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Figure 1.1 Connection for an SDI service loopback test


NE1
SDH
network
Video generator

NE2

Video analyzer

Signal flow

Step 2 Set the service type on a video generator.


Step 3 Set the eye diagram, image, BER, and jitter on a video analyzer.
Step 4 Before the test, set the BER window to 0. Observe the video analyzer to check whether the
service is available.
Step 5 If the service is unavailable, configure a loopback from the local cross-connect board to the
opposite VST4 board and a loopback from the opposite cross-connect board to the local VST4
board. Perform a test section by section to locate the fault.
----End

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A Glossary

Glossary

Numerics
2DM

two-way delay measurement

3G

See 3rd Generation.

3R

reshaping, retiming, regenerating

3rd Generation (3G)

The third generation of digital wireless technology, as defined by the


International Telecommunications Union (ITU). Third generation technology is
expected to deliver data transmission speeds between 144 kbit/s and 2 Mbit/s,
compared to the 9.6 kbit/s to 19.2 kbit/s offered by second generation
technology.

802.1Q in 802.1Q (QinQ)

A VLAN feature that allows the equipment to add a VLAN tag to a tagged
frame. The implementation of QinQ is to add a public VLAN tag to a frame with
a private VLAN tag to allow the frame with double VLAN tags to be transmitted
over the service provider's backbone network based on the public VLAN tag.
This provides a layer 2 VPN tunnel for customers and enables transparent
transmission of packets over private VLANs.

A
AAL

See ATM Adaptation Layer.

ABR

See available bit rate.

AC

alternating current

ACH

associated channel header

ACL

See access control list.

ACR

allowed cell rate

ADM

add/drop multiplexer

ADMC

automatically detected and manually cleared

ADSL

asymmetric digital subscriber line

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A Glossary

AF

See assured forwarding.

AGC

automatic gain control

AIS

alarm indication signal

ALC

See automatic level control.

ALS

See automatic laser shutdown.

AM

See adaptive modulation.

AMI

See alternate mark inversion.

AMU

ATM cell multiplex unit

ANSI

See American National Standards Institute.

APD

See avalanche photodiode.

APS

automatic protection switching

ARP

See Address Resolution Protocol.

ASCII

American Standard Code for Information Interchange

ASK

amplitude shift keying

ATM

asynchronous transfer mode

ATM Adaptation Layer


(AAL)

An interface between higher-layer protocols and Asynchronous Transfer Mode


(ATM). The AAL provides a conversion function to and from ATM for various
types of information, including voice, video, and data.

ATPC

See automatic transmit power control.

AU

See administrative unit.

AUG

See administrative unit group.

AWG

arrayed waveguide grating

Address Resolution
Protocol (ARP)

An Internet Protocol used to map IP addresses to MAC addresses. It allows hosts


and routers to determine the link layer addresses through ARP requests and ARP
responses.

American National
Standards Institute
(ANSI)

An organization that defines U.S standards for the information processing


industry. ANSI participates in defining network protocol standards.

access control list (ACL)

A list of entities, together with their access rights, which are authorized to have
access to a resource.

adaptive modulation
(AM)

A technology that is used to automatically adjust the modulation mode according


to the channel quality. When the channel quality is favorable, the equipment uses
a high-efficiency modulation mode to improve the transmission efficiency and
the spectrum utilization of the system. When the channel quality is degraded, the
equipment uses the low-efficiency modulation mode to improve the antiinterference capability of the link that carries high-priority services.

administrative unit (AU)

The information structure which provides adaptation between the higher order
path layer and the multiplex section layer. It consists of an information payload
(the higher order VC) and an AU pointer which indicates the offset of the

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payload frame start relative to the multiplex section frame start.


administrative unit group
(AUG)

One or more administrative units occupying fixed, defined positions in an STM


payload. An AUG consists of AU-4s.

alternate mark inversion


(AMI)

A synchronous clock encoding technique which uses bipolar pulses to represent


logical 1 values.

assured forwarding (AF)

One of the four per-hop behaviors (PHB) defined by the Diff-Serv workgroup of
IETF. It is suitable for certain key data services that require assured bandwidth
and short delay. For traffic within the bandwidth limit, AF assures quality in
forwarding. For traffic that exceeds the bandwidth limit, AF degrades the service
class and continues to forward the traffic instead of discarding the packets.

automatic laser shutdown


(ALS)

A technique (procedure) to automatically shutdown the output power of laser


transmitters and optical amplifiers to avoid exposure to hazardous levels.

automatic level control


(ALC)

A feature that identifies speech signals and adjusts the sound volume to stay
within a comfortable range, improving user experience.

automatic transmit power


control (ATPC)

A method of adjusting the transmit power based on fading of the transmit signal
detected at the receiver

available bit rate (ABR)

A kind of service categories defined by the ATM forum. ABR only provides
possible forwarding service and applies to the connections that does not require
the real-time quality. It does not provide any guarantee in terms of cell loss or
delay.

avalanche photodiode
(APD)

A semiconductor photodetector with integral detection and amplification stages.


Electrons generated at a p/n junction are accelerated in a region where they free
an avalanche of other electrons. APDs can detect faint signals but require higher
voltages than other semiconductor electronics.

B
B-ISDN

See broadband integrated services digital network.

BA

booster amplifier

BBE

background block error

BC

boundary clock

BCD

binary coded decimal

BDI

See backward defect indication.

BE

See best effort.

BER

bit error rate

BFD

See Bidirectional Forwarding Detection.

BGP

Border Gateway Protocol

BIOS

See basic input/output system.

BIP

See bit interleaved parity.

BIP-8

See bit interleaved parity-8.

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BIP-X

bit interleaved parity-X

BITS

See building integrated timing supply.

BMC

best master clock

BNC

See bayonet-neill-concelman.

BPDU

See bridge protocol data unit.

BPS

board protection switching

BRAS

See broadband remote access server.

BSC

binary synchronous communication

BSS

base station subsystem

BTS

base transceiver station

BWS

backbone wavelength division multiplexing system

Bidirectional Forwarding
Detection (BFD)

A fast and independent hello protocol that delivers millisecond-level link failure
detection and provides carrier-class availability. After sessions are established
between neighboring systems, the systems can periodically send BFD packets to
each other. If one system fails to receive a BFD packet within the negotiated
period, the system regards that the bidirectional link fails and instructs the upper
layer protocol to take actions to recover the faulty link.

backplane

An electronic circuit board containing circuits and sockets into which additional
electronic devices on other circuit boards or cards can be plugged.

backward defect
indication (BDI)

A function that the sink node of a LSP, when detecting a defect, uses to inform
the upstream end of the LSP of a downstream defect along the return path.

basic input/output system


(BIOS)

A firmware stored in the computer mainboard. It contains basic input/output


control programs, power-on self test (POST) programs, bootstraps, and system
setting information. The BIOS provides hardware setting and control functions
for the computer.

bayonet-neill-concelman
(BNC)

A connector used for connecting two coaxial cables.

best effort (BE)

A traditional IP packet transport service. In this service, the diagrams are


forwarded following the sequence of the time they reach. All diagrams share the
bandwidth of the network and routers. The amount of resource that a diagram
can use depends of the time it reaches. BE service does not ensure any
improvement in delay time, jitter, packet loss ratio, and high reliability.

bit interleaved parity


(BIP)

A method of error monitoring. With even parity an X-bit code is generated by


equipment at the transmit end over a specified portion of the signal in such a
manner that the first bit of the code provides even parity over the first bit of all
X-bit sequences in the covered portion of the signal, the second bit provides
even parity over the second bit of all X-bit sequences within the specified
portion, and so on. Even parity is generated by setting the BIP-X bits so that
there is an even number of 1s in each monitored partition of the signal. A
monitored partition comprises all bits which are in the same bit position within
the X-bit sequences in the covered portion of the signal. The covered portion
includes the BIP-X.

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bit interleaved parity-8


(BIP-8)

Consists of a parity byte calculated bit-wise across a large number of bytes in a


transmission transport frame. Divide a frame is into several blocks with 8 bits
(one byte) in a parity unit and then arrange the blocks in matrix. Compute the
number of "1" or "0" over each column. Then fill a 1 in the corresponding bit for
the result if the number is odd, otherwise fill a 0.

bridge protocol data unit


(BPDU)

The data messages that are exchanged across the switches within an extended
LAN that uses a spanning tree protocol (STP) topology. BPDU packets contain
information on ports, addresses, priorities and costs and ensure that the data ends
up where it was intended to go. BPDU messages are exchanged across bridges to
detect loops in a network topology. The loops are then removed by shutting
down selected bridges interfaces and placing redundant switch ports in a backup,
or blocked, state.

broadband integrated
services digital network
(B-ISDN)

A standard defined by the ITU-T to handle high-bandwidth applications, such as


voice. It currently uses the ATM technology to transmit data over SONNETbased circuits at 155 to 622 Mbit/s or higher speed.

broadband remote access


server (BRAS)

A new type of access gateway for broadband networks. As a bridge between


backbone networks and broadband access networks, BRAS provides methods
for fundamental access and manages the broadband access network. It is
deployed at the edge of network to provide broadband access services,
convergence, and forwarding of multiple services, meeting the demands for
transmission capacity and bandwidth utilization of different users. BRAS is a
core device for the broadband users' access to a broadband network.

building integrated timing


supply (BITS)

In the situation of multiple synchronous nodes or communication devices, one


can use a device to set up a clock system on the hinge of telecom network to
connect the synchronous network as a whole, and provide satisfactory
synchronous base signals to the building integrated device. This device is called
BITS.

built-in WDM

A function which integrates some simple WDM systems into products that
belong to the OSN series. That is, the OSN products can add or drop several
wavelengths directly.

C
CAR

committed access rate

CAS

See channel associated signaling.

CAS multiframe

A multiframe set up based on timeslot 16. Each CAS multiframe contains 16 E1


PCM frames. Among the 8 bits of timeslot 16 in the first frame, the first 4 bits
are used for multiframe synchronization. The multiframe alignment signal
(MFAS) for synchronization is 0000. The last 4 bits are used as the not
multiframe alignment signal (NMFAS). The NMFAS is XYXX. For the other 15
frames, timeslot 16 is used to transmit exchange and multiplexing (E&M)
signaling corresponding to each timeslot.

CAU

See client automatic upgrade.

CBR

See constant bit rate.

CBS

See committed burst size.

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CC

See continuity check.

CDVT

cell delay variation tolerance

CE

See customer edge.

CES

See circuit emulation service.

CFM

connectivity fault management

CFR

cell fill rate

CGMP

Cisco Group Management Protocol

CIR

committed information rate

CISPR

International Special Committee on Radio Interference

CIST

See Common and Internal Spanning Tree.

CLEI

common language equipment identification

CLNP

connectionless network protocol

CLP

See cell loss priority.

CMI

coded mark inversion

CRC

See cyclic redundancy check.

CRC-4 multiframe

A multiframe recommended by ITU-T G.704 and set up based on the first bit of
timeslot 0. The CRC-4 multiframe is different from the CAS multiframe in
principle and implementation. Each CRC-4 multiframe contains 16 PCM
frames. Each CRC-4 multiframe consists of two CRC-4 sub-multiframes. Each
CRC-4 sub-multiframe is a CRC-4 check block that contains 2048 (256 x 8) bits.
Bits C1 to C4 of a check block can check the previous check block.

CSA

Canadian Standards Association

CSES

consecutive severely errored second

CSF

Client Signal Fail

CSMA/CD

See carrier sense multiple access with collision detection.

CSPF

constraint shortest path first

CST

See common spanning tree.

CV

connectivity verification

CW

control word

CWDM

See coarse wavelength division multiplexing.

Common and Internal


Spanning Tree (CIST)

The single spanning tree jointly calculated by STP and RSTP, the logical
connectivity using MST bridges and regions, and MSTP. The CIST ensures that
all LANs in the bridged local area network are simply and fully connected.

Coordinated Universal
Time (UTC)

The world-wide scientific standard of timekeeping. It is based upon carefully


maintained atomic clocks and is kept accurate to within microseconds
worldwide.

carrier sense multiple

Carrier sense multiple access with collision detection (CSMA/CD) is a computer

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access with collision


detection (CSMA/CD)

A Glossary

networking access method in which:

A carrier sensing scheme is used.

A transmitting data station that detects another signal while transmitting a


frame, stops transmitting that frame, transmits a jam signal, and then waits
for a random time interval before trying to send that frame again.

cell loss priority (CLP)

A field in the ATM cell header that determines the probability of a cell being
dropped if the network becomes congested. Cells with CLP = 0 are insured
traffic, which is unlikely to be dropped. Cells with CLP = 1 are best-effort
traffic, which might be dropped.

channel associated
signaling (CAS)

A signaling system in which signaling information is transmitted within a


dedicated voice channel. China Signaling System No. 1 is a type of CAS
signaling.

circuit emulation service


(CES)

A function with which the E1/T1 data can be transmitted through ATM
networks. At the transmission end, the interface module packs timeslot data into
ATM cells. These ATM cells are sent to the reception end through the ATM
network. At the reception end, the interface module re-assigns the data in these
ATM cells to E1/T1 timeslots. The CES technology guarantees that the data in
E1/T1 timeslots can be recovered to the original sequence at the reception end.

client automatic upgrade


(CAU)

A function that enables a user to automatically detect the update of the client
version and upgrade the client. This keeps the version of the client is the same as
that of the server.

coarse wavelength division


multiplexing (CWDM)

A signal transmission technology that multiplexes widely-spaced optical


channels into the same fiber. CWDM widely spaces wavelengths at a spacing of
several nm. CWDM does not support optical amplifiers and is applied in shortdistance chain networking.

collision

A condition in which two packets are being transmitted over a medium at the
same time. Their interference makes both unintelligible.

committed burst size


(CBS)

A parameter used to define the capacity of token bucket C, that is, the maximum
burst IP packet size when the information is transferred at the committed
information rate. This parameter must be larger than 0. It is recommended that
this parameter should be not less than the maximum length of the IP packet that
might be forwarded.

common spanning tree


(CST)

A single spanning tree that connects all the MST regions in a network. Every
MST region is considered as a switch; therefore, the CST can be considered as
their spanning tree generated with STP/RSTP.

constant bit rate (CBR)

A kind of service categories defined by the ATM forum. CBR transfers cells
based on the constant bandwidth. It is applicable to service connections that
depend on precise clocking to ensure undistorted transmission.

continuity check (CC)

Ethernet CFM can detect the connectivity between MEPs. The detection is
achieved after MEPs transmit Continuity Check Messages (CCMs) periodically.

customer edge (CE)

A part of BGP/MPLS IP VPN model. It provides interfaces for direct connection


to the Service Provider (SP) network. A CE can be a router, switch, or host.

cyclic redundancy check


(CRC)

A procedure used in checking for errors in data transmission. CRC error


checking uses a complex calculation to generate a number based on the data
transmitted. The sending device performs the calculation before transmission
and includes it in the packet that it sends to the receiving device. The receiving

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device repeats the same calculation after transmission. If both devices obtain the
same result, it is assumed that the transmission was error free. The procedure is
known as a redundancy check because each transmission includes not only data
but extra (redundant) error-checking values.

D
DC

direct current

DC-C

See DC-return common (with ground).

DC-I

See DC-return isolate (with ground).

DC-return common (with


ground) (DC-C)

A power system, in which the BGND of the DC return conductor is shortcircuited with the PGND on the output side of the power supply cabinet and also
on the line between the output of the power supply cabinet and the electric
equipment.

DC-return isolate (with


ground) (DC-I)

A power system, in which the BGND of the DC return conductor is shortcircuited with the PGND on the output side of the power supply cabinet and is
isolated from the PGND on the line between the output of the power supply
cabinet and the electric equipment.

DCC

See data communications channel.

DCE

data connection equipment

DCM

See dispersion compensation module.

DCN

See data communication network.

DDF

digital distribution frame

DDN

See digital data network.

DE

discard eligible

DEI

device emulation interrupt

DHCP

See Dynamic Host Configuration Protocol.

DIP switch

dual in-line package switch

DLAG

See distributed link aggregation group.

DM

See delay measurement.

DNI

dual node interconnection

DRDB

dynamic random database

DSCP

See differentiated services code point.

DSL

See digital subscriber line.

DSLAM

See digital subscriber line access multiplexer.

DTE

See data terminal equipment.

DTMF

See dual tone multiple frequency.

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DVB-ASI

digital video broadcast-asynchronous serial interface

DVMRP

See Distance Vector Multicast Routing Protocol.

DWDM

See dense wavelength division multiplexing.

DiffServ

See Differentiated Services.

Differentiated Services
(DiffServ)

An IETF standard that defines a mechanism for controlling and forwarding


traffic in a differentiated manner based on CoS settings to handle network
congestion.

Distance Vector Multicast


Routing Protocol
(DVMRP)

An Internet gateway protocol mainly based on the RIP. The protocol implements
a typical dense mode IP multicast solution. The DVMRP protocol uses IGMP to
exchange routing datagrams with its neighbors.

Dynamic Host
Configuration Protocol
(DHCP)

A client-server networking protocol. A DHCP server provides configuration


parameters specific to the DHCP client host requesting, generally, information
required by the host to participate on the Internet network. DHCP also provides
a mechanism for allocation of IP addresses to hosts.

data communication
network (DCN)

A communication network used in a TMN or between TMNs to support the data


communication function.

data communications
channel (DCC)

The data channel that uses the D1D12 bytes in the overhead of an STM-N
signal to transmit information about operation, management, maintenance and
provision (OAM&P) between NEs. The DCC channels that are composed of
bytes D1D3 are referred to as the 192 kbit/s DCC-R channel. The other DCC
channels that are composed of bytes D4D12 are referred to as the 576 kbit/s
DCC-M channel.

data terminal equipment


(DTE)

A user device composing the UNI. The DTE accesses the data network through
the DCE equipment (for example, a modem) and usually uses the clock signals
produced by DCE.

delay measurement (DM)

The time elapsed since the start of transmission of the first bit of the frame by a
source node until the reception of the last bit of the loopbacked frame by the
same source node, when the loopback is performed at the frame's destination
node.

dense wavelength division


multiplexing (DWDM)

The technology that utilizes the characteristics of broad bandwidth and low
attenuation of single mode optical fiber, employs multiple wavelengths with
specific frequency spacing as carriers, and allows multiple channels to transmit
simultaneously in the same fiber.

differentiated services
code point (DSCP)

According to the QoS classification standard of the Differentiated Service (DiffServ), the type of services (ToS) field in the IP header consists of six most
significant bits and two currently unused bits, which are used to form codes for
priority marking. Differentiated services code point (DSCP) is the six most
important bits in the ToS. It is the combination of IP precedence and types of
service. The DSCP value is used to ensure that routers supporting only IP
precedence can be used because the DSCP value is compatible with IP
precedence. Each DSCP maps a per-hop behavior (PHB). Therefore, terminal
devices can identify traffic using the DSCP value.

digital data network


(DDN)

A high-quality data transport tunnel that combines the digital channel (such as
fiber channel, digital microwave channel, or satellite channel) and the cross
multiplex technology.

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digital subscriber line


(DSL)

A technology for providing digital connections over the copper wire or the local
telephone network. DSL performs data communication over the POTS lines
without affecting the POTS service.

digital subscriber line


access multiplexer
(DSLAM)

A network device, usually situated in the main office of a telephone company


that receives signals from multiple customer Digital Subscriber Line (DSL)
connections and puts the signals on a high-speed backbone line using
multiplexing techniques.

dispersion

The maximum error of the local clock compared with the reference clock.

dispersion compensation
module (DCM)

A module, which contains dispersion compensation fibers to compensate for the


dispersion of transmitting fiber.

distributed link
aggregation group
(DLAG)

A board-level port protection technology used to detect unidirectional fiber cuts


and to negotiate with the opposite end. Once a link down failure occurs on a port
or a hardware failure occurs on a board, the services can automatically be
switched to the slave board, achieving 1+1 protection for the inter-board ports.

dual tone multiple


frequency (DTMF)

In telephone systems, multifrequency signaling in which standard set


combinations of two specific voice band frequencies, one from a group of four
low frequencies and the other from a group of four higher frequencies, are used.

E
E-Aggr

See Ethernet aggregation.

E-LAN

See Ethernet local area network.

E-Line

See Ethernet line.

EBS

See excess burst size.

ECC

See embedded control channel.

EDFA

See erbium-doped fiber amplifier.

EEPROM

See electrically erasable programable read-only memory.

EF

See expedited forwarding.

EFM

Ethernet in the First Mile

EFM OAM

Ethernet in the first mile OAM

EIA

See Electronic Industries Alliance.

EIR

See excess information rate.

EMC

See electromagnetic compatibility.

EPD

early packet discard

EPL

See Ethernet private line.

EPLAN

See Ethernet private LAN service.

EPON

See Ethernet passive optical network.

ERPS

Ethernet ring protection switching

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ESC

See electric supervisory channel.

ESCON

See enterprise system connection.

ESD

electrostatic discharge

ESN

See equipment serial number.

ETS

European Telecommunication Standards

ETSI

See European Telecommunications Standards Institute.

EVC

Ethernet virtual connection

EVPL

See Ethernet virtual private line.

EVPLAN

See Ethernet virtual private LAN service.

Electronic Industries
Alliance (EIA)

An association based in Washington, D.C., with members from various


electronics manufacturers. It sets standards for electronic components. RS-232C, for example, is the EIA standard for connecting serial components.

EoD

See Ethernet over dual domains.

Ethernet

A LAN technology that uses Carrier Sense Multiple Access/Collision Detection.


The speed of an Ethernet interface can be 10 Mbit/s, 100 Mbit/s, 1000 Mbit/s or
10000 Mbit/s. An Ethernet network features high reliability and is easy to
maintain.

Ethernet aggregation (EAggr)

A type of Ethernet service that is based on a multipoint-to-point EVC (Ethernet


virtual connection).

Ethernet line (E-Line)

A type of Ethernet service that is based on a point-to-point EVC (Ethernet


virtual connection).

Ethernet local area


network (E-LAN)

A type of Ethernet service that is based on a multipoint-to-multipoint EVC


(Ethernet virtual connection).

Ethernet over dual


domains (EoD)

A type of boards. EoD boards bridge the PSN and TDM networks, enabling
Ethernet service transmission across PSN and TDM networks.

Ethernet passive optical


network (EPON)

A passive optical network based on Ethernet. It is a new generation broadband


access technology that uses a point-to-multipoint structure and passive fiber
transmission. It supports upstream/downstream symmetrical rates of 1.25 Gbit/s
and a reach distance of up to 20 km. In the downstream direction, the bandwidth
is shared based on encrypted broadcast transmission for different users. In the
upstream direction, the bandwidth is shared based on TDM. EPON meets the
requirements for high bandwidth.

Ethernet private LAN


service (EPLAN)

A type of Ethernet service provided by SDH, PDH, ATM, or MPLS networks.


This service is carried over a dedicated bridge and point-to-multipoint
connections.

Ethernet private line


(EPL)

A type of Ethernet service that is provided with dedicated bandwidth and pointto-point connections on an SDH, PDH, ATM, or MPLS server layer network.

Ethernet virtual private


LAN service (EVPLAN)

A type of Ethernet service provided by SDH, PDH, ATM, or MPLS networks.


This service is carried over a shared bridge and point-to-multipoint connections.

Ethernet virtual private


line (EVPL)

A type of Ethernet service provided by SDH, PDH, ATM, or MPLS networks.


This service is carried over a shared bridge and point-to-point connections.

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European
Telecommunications
Standards Institute
(ETSI)

A standards-setting body in Europe. Also the standards body responsible for


GSM.

eSFP

enhanced small form-factor pluggable

electric supervisory
channel (ESC)

A technology that implements communication among all the nodes and


transmission of monitoring data in an optical transmission network. The
monitoring data of ESC is introduced into DCC service overhead and is
transmitted with service signals.

electrically erasable
programable read-only
memory (EEPROM)

A type of EPROM that can be erased with an electrical signal. It is useful for
stable storage for long periods without electricity while still allowing
reprograming. EEPROMs contain less memory than RAM, take longer to
reprogram, and can be reprogramed only a limited number of times before
wearing out.

electromagnetic
compatibility (EMC)

A condition which prevails when telecommunications equipment is performing


its individually designed function in a common electromagnetic environment
without causing or suffering unacceptable degradation due to unintentional
electromagnetic interference to or from other equipment in the same
environment.

embedded control channel


(ECC)

A logical channel that uses a data communications channel (DCC) as its physical
layer, to enable transmission of operation, administration, and maintenance
(OAM) information between NEs.

encapsulation

A technology for layered protocols, in which a lower-level protocol accepts a


message from a higher-level protocol and places it in the data portion of the
lower-level frame. Protocol A's packets have complete header information, and
are carried by protocol B as data. Packets that encapsulate protocol A have a B
header, an A header, followed by the information that protocol A is carrying.
Note that A could equal to B, as in IP inside IP.

enterprise system
connection (ESCON)

A path protocol which connects the host with various control units in a storage
system. It is a serial bit stream transmission protocol. The transmission rate is
200 Mbit/s.

equalization

A method of avoiding selective fading of frequencies. Equalization can


compensate for the changes of amplitude frequency caused by frequency
selective fading.

equipment serial number


(ESN)

A string of characters that identify a piece of equipment and ensures correct


allocation of a license file to the specified equipment. It is also called
"equipment fingerprint".

erbium-doped fiber
amplifier (EDFA)

An optical device that amplifies the optical signals. The device uses a short
length of optical fiber doped with the rare-earth element Erbium and the energy
level jump of Erbium ions activated by pump sources. When the amplifier passes
the external light source pump, it amplifies the optical signals in a specific
wavelength range.

excess burst size (EBS)

A parameter related to traffic. In the single rate three color marker (srTCM)
mode, the traffic control is achieved by the token buckets C and E. Excess burst
size is a parameter used to define the capacity of token bucket E, that is, the
maximum burst IP packet size when the information is transferred at the
committed information rate. This parameter must be larger than 0. It is

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recommended that this parameter should be not less than the maximum length of
the IP packet that might be forwarded.
excess information rate
(EIR)

The bandwidth for excessive or burst traffic above the CIR; it equals the result
of the actual transmission rate without the safety rate.

exercise switching

An operation to check whether the protection switching protocol functions


properly. The protection switching is not really performed.

expedited forwarding
(EF)

The highest order QoS in the Diff-Serv network. EF PHB is suitable for services
that demand low packet loss ratio, short delay, and broad bandwidth. In all the
cases, EF traffic can guarantee a transmission rate equal to or faster than the set
rate. The DSCP value of EF PHB is "101110".

F
FC

See fiber channel.

FCC

Federal Communications Commission

FDD

See frequency division duplex.

FDDI

See fiber distributed data interface.

FDI

See forward defect indication.

FDI packet

See forward defect indication packet.

FDV

See frame delay variation.

FEC

See forwarding equivalence class.

FFD

fast failure detection

FIB

See forward information base.

FICON

See Fiber Connect.

FIFO

See first in first out.

FLR

See frame loss ratio.

FPGA

See field programmable gate array.

FPS

See fast protection switching.

FRR

See fast reroute.

FTN

FEC to NHLFE

FTP

File Transfer Protocol

Fiber Connect (FICON)

A new generation connection protocol which connects the host to various control
units. It carries single byte command protocol through the physical path of fiber
channel, and provides higher rate and better performance than ESCON.

fast protection switching


(FPS)

A type of pseudo wire automatic protection switching (PW APS). When the
working PW is faulty, the source transmits services to the protection PW and the
sink receives the services from the protection PW. FPS generally works with the
interworking function (IWF) to provide end-to-end protection for services.

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fast reroute (FRR)

A technology which provides a temporary protection of link availability when


part of a network fails. The protocol enables the creation of a standby route or
path for an active route or path. When the active route is unavailable, the traffic
on the active route can be switched to the standby route. When the active route is
recovered, the traffic can be switched back to the active route. FRR is
categorized into IP FRR, VPN FRR, and TE FRR.

fiber channel (FC)

A high-speed transport technology used to build storage area networks (SANs).


Fiber channel can be on the networks carrying ATM and IP traffic. It is primarily
used for transporting SCSI traffic from servers to disk arrays. Fiber channel
supports single-mode and multi-mode fiber connections. Fiber channel signaling
can run on both twisted pair copper wires and coaxial cables. Fiber channel
provides both connection-oriented and connectionless services.

fiber distributed data


interface (FDDI)

A standard developed by the American National Standards Institute (ANSI) for


high-speed fiber-optic local area networks (LANs). FDDI provides
specifications for transmission rates of 100 megabits (100 million bits) per
second on networks based on the token ring network.

field programmable gate


array (FPGA)

A type of semi-customized circuit used in the application specific integrated


circuit (ASIC) field. It is developed on the basis of the programmable
components, such as the PAL, GAL, and EPLD. It not only remedies the defects
of customized circuits but also overcomes the disadvantage of the original
programmable components in terms of the limited number of gate arrays.

first in first out (FIFO)

A stack management mechanism. The first saved data is first read and invoked.

forward defect indication


(FDI)

A packet generated and traced forward to the sink node of the LSP by the node
that first detects defects. It includes fields to indicate the nature of the defect and
its location. Its primary purpose is to suppress alarms being raised at affected
higher level client LSPs and (in turn) their client layers.

forward defect indication


packet (FDI packet)

A packet that responds to the detected failure event. It is used to suppress alarms
of the upper layer network where failure has occurred.

forward information base


(FIB)

A table that provides information for network hardware (bridges and routers) for
them to forward data packets to other networks. The information contained in a
routing table differs according to whether it is used by a bridge or a router. A
bridge relies on both the source (originating) and destination addresses to
determine where and how to forward a packet.

forwarding equivalence
class (FEC)

A class-based forwarding technology that classifies the packets with the same
forwarding mode. Packets with the same FEC are processed similarly on an
MPLS network. The division of FECs is flexible, and can be a combination of
the source address, destination address, source port, destination port, protocol
type, and VPN.

frame delay variation


(FDV)

A measurement of the variations in the frame delay between a pair of service


frames, where the service frames belong to the same CoS instance on a point to
point ETH connection.

frame loss ratio (FLR)

A ratio, is expressed as a percentage, of the number of service frames not


delivered divided by the total number of service frames during time interval T,
where the number of service frames not delivered is the difference between the
number of service frames arriving at the ingress ETH flow point and the number
of service frames delivered at the egress ETH flow point in a point-to-point ETH
connection.

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frequency division duplex


(FDD)

A Glossary

An application in which channels are divided by frequency. In an FDD system,


the uplink and downlink use different frequencies. Downlink data is sent through
bursts. Both uplink and downlink transmission use frames with fixed time
length.

G
G-ACH

generic associated channel header

GAL

generic associated channel header label

GCC

general communication channel

GCP

GMPLS control plan

GCRA

generic cell rate algorithm

GFC

generic flow control

GFP

See Generic Framing Procedure.

GMPLS

generalized multiprotocol label switching

GNE

See gateway network element.

GPON

gigabit-capable passive optical network

GPS

See Global Positioning System.

GRE

See Generic Routing Encapsulation.

GSM

See Global System for Mobile Communications.

Generic Framing
Procedure (GFP)

A framing and encapsulation method which can be applied to any data type. It
has been standardized by ITU-T SG15.

Generic Routing
Encapsulation (GRE)

A mechanism for encapsulating any network layer protocol over any other
network. GRE is used for encapsulating IP datagrams tunneled through the
Internet. GRE serves as a Layer 3 tunneling protocol and provides a tunnel for
transparently transmitting data packets.

Global Positioning System


(GPS)

A global navigation satellite system. It provides reliable positioning, navigation,


and timing services to worldwide users.

Global System for Mobile


Communications (GSM)

The second-generation mobile networking standard defined by European


Telecommunications Standards Institute (ETSI). It is aimed at designing a
standard for global mobile phone networks. The standard allows a subscriber to
use a phone globally. GSM consists of three main parts: mobile switching
subsystem (MSS), base station subsystem (BSS), and mobile station (MS).

gain

The difference between the optical power from the input optical interface of the
optical amplifier and the optical power from the output optical interface of the
jumper fiber, which expressed in dB.

gateway network element


(GNE)

A network element that is used for communication between the NE application


layer and the NM application layer.

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H
HCS

higher order connection supervision

HD

high definition

HD-SDI

See high definition-serial digital interface signal.

HDB3

See high density bipolar of order 3 code.

HDLC

High-Level Data Link Control

HDTV

See high definition television.

HEC

See header error control.

HPA

high order path adaptation

HPT

higher order path termination

HQoS

See hierarchical quality of service.

HSDPA

See High Speed Downlink Packet Access.

HSI

high-speed Internet

HSL

See high-level script language.

High Speed Downlink


Packet Access (HSDPA)

A modulating-demodulating algorithm put forward in 3GPP R5 to meet the


requirement for asymmetric uplink and downlink transmission of data services.
It enables the maximum downlink data service rate to reach 14.4 Mbit/s without
changing the WCDMA network topology.

header error control


(HEC)

A field within the ATM frame whose purpose is to correct any single bit error in
the cell Header and also to detect any multi-bit errors. It actually performs a
CRC check in the first four header bits and also at the receiving end.

hierarchical quality of
service (HQoS)

A type of QoS that controls the traffic of users and performs the scheduling
according to the priority of user services. HQoS has an advanced traffic statistics
function, and the administrator can monitor the usage of bandwidth of each
service. Hence, the bandwidth can be allocated reasonably through traffic
analysis.

high definition television


(HDTV)

A type of TV that is capable of displaying at least 720 progressive or 1080


interlaced active scan lines. It must be capable of displaying a 16:9 image using
at least 540 progressive or 810 interlaced active scan lines.

high definition-serial
digital interface signal
(HD-SDI)

High definition video signal transported by serial digital interface.

high density bipolar of


order 3 code (HDB3)

A code used for baseband transmissions between telecommunications devices.


The HDB3 code has the following feature: high capability of clock extraction,
no direct current component, error-checking capability, and a maximum of three
consecutive zeros.

high-level script language


(HSL)

A script language. Based on python, the HSL syntax is simple, clear, and
extendable.

hot patch

A patch that is used to repair a deficiency in the software or add a new feature to
a program without restarting the software and interrupting the service. For the
equipment using the built-in system, a hot patch can be loaded, activated,

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confirmed, deactivated, deleted, or queried.

I
IAE

incoming alignment error

IANA

See Internet Assigned Numbers Authority.

IC

See integrated circuit.

ICC

See ITU carrier code.

ICMP

See Internet Control Message Protocol.

ICP

IMA Control Protocol

IEEE

See Institute of Electrical and Electronics Engineers.

IETF

See Internet Engineering Task Force.

IF

See intermediate frequency.

IGMP

See Internet Group Management Protocol.

IGMP snooping

A multicast constraint mechanism running on a layer 2 device. This protocol


manages and controls the multicast group by listening to and analyzing Internet
Group Management Protocol (IGMP) packets between hosts and Layer 3
devices. In this manner, the spread of the multicast data on layer 2 network can
be prevented efficiently.

IGP

See Interior Gateway Protocol.

ILM

incoming label map

IMA

See inverse multiplexing over ATM.

IN

intelligent network

IP

Internet Protocol

IPA

See intelligent power adjustment.

IPTV

See Internet Protocol television.

IPv4

See Internet Protocol version 4.

IPv6

See Internet Protocol version 6.

IS-IS

See Intermediate System to Intermediate System.

ISDN

integrated services digital network

ISO

International Organization for Standardization

ISP

See Internet service provider.

IST

internal spanning tree

ITC

independent transmit clock

ITU

See International Telecommunication Union.

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ITU carrier code (ICC)

A code assigned to a network operator/service provider, maintained by the ITUT Telecommunication Standardization Bureau (TSB).

ITU-T

See International Telecommunication Union-Telecommunication


Standardization Sector.

Institute of Electrical and


Electronics Engineers
(IEEE)

A society of engineering and electronics professionals based in the United States


but boasting membership from numerous other countries. The IEEE focuses on
electrical, electronics, computer engineering, and science-related matters.

Interior Gateway Protocol


(IGP)

A routing protocol that is used within an autonomous system. The IGP runs in
small-sized and medium-sized networks. The commonly used IGPs are the
routing information protocol (RIP), the interior gateway routing protocol
(IGRP), the enhanced IGRP (EIGRP), and the open shortest path first (OSPF).

Intermediate System to
Intermediate System (ISIS)

A protocol used by network devices (routers) to determine the best way to


forward datagram or packets through a packet-based network.

International
Telecommunication Union
(ITU)

A United Nations agency, one of the most important and influential


recommendation bodies, responsible for recommending standards for
telecommunication (ITU-T) and radio networks (ITU-R).

International
Telecommunication
Union-Telecommunication
Standardization Sector
(ITU-T)

An international body that develops worldwide standards for


telecommunications technologies. These standards are grouped together in series
which are prefixed with a letter indicating the general subject and a number
specifying the particular standard. For example, X.25 comes from the "X" series
which deals with data networks and open system communications and number
"25" deals with packet switched networks.

Internet Assigned
Numbers Authority
(IANA)

A department operated by the IAB. IANA delegates authority for IP addressspace allocation and domain-name assignment to the NIC and other
organizations. IANA also maintains a database of assigned protocol identifiers
used in the TCP/IP suite, including autonomous system numbers.

Internet Control Message


Protocol (ICMP)

A network-layer (ISO/OSI level 3) Internet protocol that provides error


correction and other information relevant to IP packet processing. For example,
it can let the IP software on one machine inform another machine about an
unreachable destination. See also communications protocol, IP, ISO/OSI
reference model, packet (definition 1).

Internet Engineering Task


Force (IETF)

A worldwide organization of individuals interested in networking and the


Internet. Managed by the Internet Engineering Steering Group (IESG), the IETF
is charged with studying technical problems facing the Internet and proposing
solutions to the Internet Architecture Board (IAB). The work of the IETF is
carried out by various working groups that concentrate on specific topics such as
routing and security. The IETF is the publisher of the specifications that led to
the TCP/IP protocol standard.

Internet Group
Management Protocol
(IGMP)

One of the TCP/IP protocols for managing the membership of Internet Protocol
multicast groups. It is used by IP hosts and adjacent multicast routers to establish
and maintain multicast group memberships.

Internet Protocol
television (IPTV)

A system in which video is transmitted in IP packets. Also called "TV over IP",
IPTV uses streaming video techniques to deliver scheduled TV programs or
video-on-demand (VOD). Unlike transmitting over the air or through cable to a
TV set, IPTV uses the transport protocol of the Internet for delivery and requires
either a computer and software media player or an IPTV set-top box to decode

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the images in real time.


Internet Protocol version
4 (IPv4)

The current version of the Internet Protocol (IP). IPv4 utilizes a 32bit address
which is assigned to hosts. An address belongs to one of five classes (A, B, C, D,
or E) and is written as 4 octets separated by periods and may range from 0.0.0.0
through to 255.255.255.255. Each IPv4 address consists of a network number,
an optional subnetwork number, and a host number. The network and
subnetwork numbers together are used for routing, and the host number is used
to address an individual host within the network or subnetwork.

Internet Protocol version


6 (IPv6)

An update version of IPv4, which is designed by the Internet Engineering Task


Force (IETF) and is also called IP Next Generation (IPng). It is a new version of
the Internet Protocol. The difference between IPv6 and IPv4 is that an IPv4
address has 32 bits while an IPv6 address has 128 bits.

Internet service provider


(ISP)

An organization that offers users access to the Internet and related services.

integrated circuit (IC)

A combination of inseparable associated circuit elements that are formed in


place and interconnected on or within a single base material to perform a
microcircuit function.

intelligent power
adjustment (IPA)

A mechanism used to reduce the optical power of all the amplifiers in an


adjacent regeneration section in the upstream to a safety level if the system
detects the loss of optical signals on the link. If the fiber is broken, the device
performance degrades, or the connector is not plugged well, the loss of optical
signals may occur. With IPA, maintenance engineers will not be hurt by the laser
sent out from the slice of broken fiber.

intermediate frequency
(IF)

The transitional frequency between the frequencies of a modulated signal and an


RF signal.

inverse multiplexing over


ATM (IMA)

A technique that involves inverse multiplexing and de-multiplexing of ATM


cells in a cyclical fashion among links grouped to form a higher bandwidth
logical link whose rate is approximately the sum of the link rates.

L
L2VPN

Layer 2 virtual private network

L3VPN

Layer 3 virtual private network

LACP

See Link Aggregation Control Protocol.

LACPDU

Link Aggregation Control Protocol data unit

LAG

See link aggregation group.

LAN

See local area network.

LAPD

link access procedure on the D channel

LAPS

Link Access Protocol-SDH

LB

local battery

LC

Lucent connector

LCAS

See link capacity adjustment scheme.

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LCK

See Locked signal function.

LCN

local communications network

LDP

Label Distribution Protocol

LED

See light emitting diode.

LER

See label edge router.

LIFO

See last in first out.

LLC

See logical link control.

LLID

local loopback ID

LM

See loss measurement.

LMP

link management protocol

LOC

loss of clock

LOM

loss of multiframe

LOP

loss of pointer

LOS

See loss of signal.

LPA

low order path adaptation

LPT

link-state pass through

LSP

See label switched path.

LSR

See label switching router.

LT

linktrace

LVDS

See low voltage differential signal.

Layer 2 switching

A data forwarding method. In a LAN, a network bridge or 802.3 Ethernet switch


transmits and distributes packet data based on the MAC address. Since the MAC
address is at the second layer of the OSI model, this data forwarding method is
called Layer 2 switching.

Link Aggregation Control


Protocol (LACP)

A dynamic link aggregation protocol that improves the transmission speed and
reliability. The two ends of the link send LACP packets to inform each other of
their parameters and form a logical aggregation link. After the aggregation link
is formed, LACP maintains the link status in real time and dynamically adjusts
the ports on the aggregation link upon detecting the failure of a physical port.

Locked signal function


(LCK)

A function administratively locks an MEG end point (MEP) at the server layer,
informs consequential data traffic interruption to the peer MEP at the client
layer, and suppresses the alarm at the client layer.

label edge router (LER)

A device that sits at the edge of an MPLS domain, that uses routing information
to assign labels to datagrams and then forwards them into the MPLS domain.

label switched path (LSP)

A sequence of hops (R0...Rn) in which a packet travels from R0 to Rn through


label switching mechanisms. A label-switched path can be chosen dynamically,
based on common routing mechanisms or through configuration.

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label switching router


(LSR)

Basic element of an MPLS network. All LSRs support the MPLS protocol. The
LSR is composed of two parts: control unit and forwarding unit. The former is
responsible for allocating the label, selecting the route, creating the label
forwarding table, creating and removing the label switch path; the latter
forwards the labels according to groups received in the label forwarding table.

last in first out (LIFO)

A play mode of the voice mails, the last voice mail is played firstly.

light emitting diode (LED)

A display and lighting technology used in almost every electrical and electronic
product on the market, to from a tiny on/off light to digital readouts, flashlights,
traffic lights and perimeter lighting. LEDs are also used as the light source in
multimode fibers, optical mice and laser-class printers.

linear MSP

linear multiplex section protection

link aggregation group


(LAG)

An aggregation that allows one or more links to be aggregated together to form a


link aggregation group so that a MAC client can treat the link aggregation group
as if it were a single link.

link capacity adjustment


scheme (LCAS)

LCAS in the virtual concatenation source and sink adaptation functions provides
a control mechanism to hitless increase or decrease the capacity of a link to meet
the bandwidth needs of the application. It also provides a means of removing
member links that have experienced failure. The LCAS assumes that in cases of
capacity initiation, increases or decreases, the construction or destruction of the
end-to-end path is the responsibility of the network and element management
systems.

local area network (LAN)

A network formed by the computers and workstations within the coverage of a


few square kilometers or within a single building. It features high speed and low
error rate. Ethernet, FDDI, and Token Ring are three technologies used to
implement a LAN. Current LANs are generally based on switched Ethernet or
Wi-Fi technology and running at 1,000 Mbit/s (that is, 1 Gbit/s).

logical link control (LLC)

According to the IEEE 802 family of standards, Logical Link Control (LLC) is
the upper sublayer of the OSI data link layer. The LLC is the same for the
various physical media (such as Ethernet, token ring, WLAN).

loss measurement (LM)

A method used to collect counter values applicable for ingress and egress service
frames where the counters maintain a count of transmitted and received data
frames between a pair of MEPs.

loss of signal (LOS)

No transitions occurring in the received signal.

low voltage differential


signal (LVDS)

A low noise, low power, low amplitude method for high-speed (gigabits per
second) data transmission over copper wire.

M
MA

maintenance association

MAC

See Media Access Control.

MADM

multiple add/drop multiplexer

MAN

See metropolitan area network.

MBS

maximum burst size

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MCF

message communication function

MCR

minimum cell rate

MD

See maintenance domain.

MDF

See main distribution frame.

MDP

message dispatch process

MDU

See multi-dwelling unit.

ME

See maintenance entity.

MEG

See maintenance entity group.

MEL

maintenance entity group level

MEP

maintenance end point

MFAS

See multiframe alignment signal.

MIB

See management information base.

MIP

maintenance intermediate point

MLD

See multicast listener discovery.

MP

maintenance point

MPLS

See Multiprotocol Label Switching.

MPLS TE

multiprotocol label switching traffic engineering

MPLS TP

See Multiprotocol Label Switching traffic policing.

MPLS VPN

See multiprotocol label switching virtual private network.

MPLS-TP

See multiprotocol label switching transport profile.

MS

multiplex section

MSA

multiplex section adaptation

MSB

most significant bit

MSOH

multiplex section overhead

MSP

See multiplex section protection.

MST

See multiplex section termination.

MSTI

See multiple spanning tree instance.

MSTP

See Multiple Spanning Tree Protocol.

MTBF

See mean time between failures.

MTTR

See mean time to repair.

MTU

See maximum transmission unit.

MUX

See multiplexer.

Media Access Control


(MAC)

A protocol at the media access control sublayer. The protocol is at the lower part
of the data link layer in the OSI model and is mainly responsible for controlling

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and connecting the physical media at the physical layer. When transmitting data,
the MAC protocol checks whether to be able to transmit data. If the data can be
transmitted, certain control information is added to the data, and then the data
and the control information are transmitted in a specified format to the physical
layer. When receiving data, the MAC protocol checks whether the information is
correct and whether the data is transmitted correctly. If the information is correct
and the data is transmitted correctly, the control information is removed from the
data and then the data is transmitted to the LLC layer.
Multiple Spanning Tree
Protocol (MSTP)

A protocol that can be used in a loop network. Using an algorithm, the MSTP
blocks redundant paths so that the loop network can be trimmed as a tree
network. In this case, the proliferation and endless cycling of packets is avoided
in the loop network. The protocol that introduces the mapping between VLANs
and multiple spanning trees. This solves the problem that data cannot be
normally forwarded in a VLAN because in STP/RSTP, only one spanning tree
corresponds to all the VLANs.

Multiprotocol Label
Switching (MPLS)

A technology that uses short tags of fixed length to encapsulate packets in


different link layers, and provides connection-oriented switching for the network
layer on the basis of IP routing and control protocols. It improves the cost
performance and expandability of networks, and is beneficial to routing.

Multiprotocol Label
Switching traffic policing
(MPLS TP)

It is a scheme that supervises the specific traffic entering the communication


devices. By policing the speed of traffic that enters the network, it "punishes" the
traffic out of the threshold, so the traffic going into network is limited to a
reasonable range, protecting the network resources and the interests of the
carriers.

main distribution frame


(MDF)

A device at a central office, on which all local loops are terminated.

maintenance domain
(MD)

The network or the part of the network for which connectivity is managed by
connectivity fault management (CFM). The devices in a maintenance domain are
managed by a single Internet service provider (ISP).

maintenance entity (ME)

An ME consists of a pair of maintenance entity group end points (MEPs), two


ends of a transport trail, and maintenance association intermediate points (MIPs)
on the trail.

maintenance entity group


(MEG)

A MEG consists of MEs that meet the following criteria:

Exist within the same management edges.

Have the same MEG hierarchy.

Belong to the same P2P or P2MP connection.

management information
base (MIB)

A type of database used for managing the devices in a communications network.


It comprises a collection of objects in a (virtual) database used to manage
entities (such as routers and switches) in a network.

maximum transmission
unit (MTU)

The largest packet of data that can be transmitted on a network. MTU size
varies, depending on the network576 bytes on X.25 networks, for example,
1500 bytes on Ethernet, and 17,914 bytes on 16 Mbit/s token ring.
Responsibility for determining the size of the MTU lies with the link layer of the
network. When packets are transmitted across networks, the path MTU, or
PMTU, represents the smallest packet size (the one that all networks can
transmit without breaking up the packet) among the networks involved.

mean time between

The average time between consecutive failures of a piece of equipment. It is a

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failures (MTBF)

measure of the reliability of the system.

mean time to repair


(MTTR)

The average time that a device will take to recover from a failure.

metropolitan area
network (MAN)

A network that interconnects users with computer resources in a geographic area


or region larger than that covered by even a large LAN but smaller than the area
covered by an WAN. The term is applied to the interconnection of networks in a
city into a single larger network (which may then also offer efficient connection
to a wide area network). It is also used to mean the interconnection of several
local area networks by bridging them with backbone lines. The latter usage is
also sometimes referred to as a campus network.

mirror

An action to store a copy of a file to another archive site to release the load of
the original site, or to provide an archive site closer to the users geographically.

mirroring

The duplication of data for backup or to distribute network traffic among several
computers with identical data.

multi-dwelling unit
(MDU)

A network access unit used for multi-dwelling units. It provides Ethernet and IP
services and optionally VoIP or CATV services; has multiple broadband
interfaces on the user side and optionally POTS ports or CATV RF ports. It is
mainly applicable to FTTB, FTTC, or FTTCab networks.

multicast listener
discovery (MLD)

A protocol used by an IPv6 router to discover the multicast listeners on their


directly connected network segments, and to set up and maintain member
relationships. On IPv6 networks, after MLD is configured on the receiver hosts
and the multicast router to which the hosts are directly connected, the hosts can
dynamically join related groups and the multicast router can manage members
on the local network.

multiframe alignment
signal (MFAS)

A distinctive signal inserted in every multiframe or once in every n multiframes,


always occupying the same relative position within the multiframe, and used to
establish and maintain multiframe alignment.

multiple spanning tree


instance (MSTI)

A type of spanning trees calculated by MSTP within an MST Region, to provide


a simply and fully connected active topology for frames classified as belonging
to a VLAN that is mapped to the MSTI by the MST Configuration. A VLAN
cannot be assigned to multiple MSTIs.

multiplex section
protection (MSP)

A function, which is performed to provide capability for switching a signal


between and including two multiplex section termination (MST) functions, from
a "working" to a "protection" channel.

multiplex section
termination (MST)

A function, which is performed to generate the MSOH during the process of


forming an SDH frame signal and terminates the MSOH in the reverse direction.

multiplexer (MUX)

Equipment which combines a number of tributary channels onto a fewer number


of aggregate bearer channels, the relationship between the tributary and
aggregate channels being fixed.

multiprotocol label
switching transport
profile (MPLS-TP)

A packet transport technology proposed by IETF that combines the packet


experience of MPLS with the operational experience of transport networks.

multiprotocol label
switching virtual private
network (MPLS VPN)

An Internet Protocol (IP) virtual private network (VPN) based on the


multiprotocol label switching (MPLS) technology. It applies the MPLS
technology for network routers and switches, simplifies the routing mode of core
routers, and combines traditional routing technology and label switching

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technology. It can be used to construct the broadband Intranet and Extranet to


meet various service requirements.

N
NAS

network access server

NDF

new data flag

NHLFE

next hop label forwarding entry

NMC

network management center

NNI

network-to-network interface

NPC

See network parameter control.

NPE

network provider edge

NRT-VBR

non-real-time variable bit rate

NRZ

non-return to zero

NRZI

non-return to zero inverted

NSAP

See network service access point.

NSF

non-stop forwarding

NTP

Network Time Protocol

network parameter
control (NPC)

During communications, UPC is implemented to monitor the actual traffic on


each virtual circuit that is input to the network. Once the specified parameter is
exceeded, measures will be taken to control. NPC is similar to UPC in function.
The difference is that the incoming traffic monitoring function is divided into
UPC and NPC according to their positions. UPC locates at the user/network
interface, while NPC at the network interface.

network service access


point (NSAP)

A network address defined by ISO, at which the OSI Network Service is made
available to a Network service user by the Network service provider.

O
O&M

operation and maintenance

OA

optical amplifier

OADM

See optical add/drop multiplexer.

OAM

See operation, administration and maintenance.

OAMPDU

operation, administration and maintenance protocol data unit

OAU

See optical amplifier unit.

OC

ordinary clock

OCP

optical channel protection

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OCS

optical core switching

ODF

optical distribution frame

ODU

See outdoor unit.

OLT

optical line terminal

ONT

See optical network terminal.

ONU

See optical network unit.

OPEX

operating expense

OPU

optical channel payload unit

OSC

See optical supervisory channel.

OSI

See open systems interconnection.

OSN

optical switch node

OSNR

See optical signal-to-noise ratio.

OSPF

See Open Shortest Path First.

OTDR

See optical time domain reflectometer.

OTM

optical terminal multiplexer

OTN

optical transport network

OTU

See optical transponder unit.

OTUk

optical channel transport unit-k

Open Shortest Path First


(OSPF)

A link-state, hierarchical interior gateway protocol (IGP) for network routing.


Dijkstra's algorithm is used to calculate the shortest path tree. It uses cost as its
routing metric. A link state database is constructed with the network topology
which is identical on all routers in the area.

open systems
interconnection (OSI)

A framework of ISO standards for communication between different systems


made by different vendors, in which the communications process is organized
into seven different categories that are placed in a layered sequence based on
their relationship to the user. Each layer uses the layer immediately below it and
provides a service to the layer above. Layers 7 through 4 deal with end-to-end
communication between the message source and destination, and layers 3
through 1 deal with network functions.

operation, administration
and maintenance (OAM)

A group of network support functions that monitor and sustain segment


operation, support activities that are concerned with, but not limited to, failure
detection, notification, location, and repairs that are intended to eliminate faults
and keep a segment in an operational state, and support activities required to
provide the services of a subscriber access network to users/subscribers.

optical add/drop
multiplexer (OADM)

A device that can be used to add the optical signals of various wavelengths to
one channel and drop the optical signals of various wavelengths from one
channel.

optical amplifier unit


(OAU)

A board that is mainly responsible for amplifying optical signals. The OAU can
be used in both the transmitting direction and the receiving direction.

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optical network terminal


(ONT)

A device that terminates the fiber optical network at the customer premises.

optical network unit


(ONU)

A form of Access Node that converts optical signals transmitted via fiber to
electrical signals that can be transmitted via coaxial cable or twisted pair copper
wiring to individual subscribers.

optical signal-to-noise
ratio (OSNR)

The ratio of signal power and noise power in a transmission link. OSNR is the
most important index of measuring the performance of a DWDM system. OSNR
= signal power/noise power.

optical supervisory
channel (OSC)

A technology that uses specific optical wavelengths to realize communication


among nodes in optical transmission network and transmit the monitoring data
in a certain channel.

optical time domain


reflectometer (OTDR)

A device that sends a very short pulse of light down a fiber optic communication
system and measures the time history of the pulse reflection to measure the fiber
length, the light loss and locate the fiber fault.

optical transponder unit


(OTU)

A device or subsystem that converts the accessed client signals into the
G.694.1/G.694.2-compliant WDM wavelength.

orderwire

A channel that provides voice communication between operation engineers or


maintenance engineers of different stations.

outdoor unit (ODU)

The outdoor unit of the split-structured radio equipment. It implements


frequency conversion and amplification for radio frequency (RF) signals.

P
P2MP

point-to-multipoint

P2P

See point-to-point service.

PADR

PPPoE active discovery request

PBS

See peak burst size.

PCB

See printed circuit board.

PCM

See pulse code modulation.

PCR

See peak cell rate.

PDH

See plesiochronous digital hierarchy.

PDU

See power distribution unit.

PE

See provider edge.

PHB

See per-hop behavior.

PHP

penultimate hop popping

PIM-DM

Protocol Independent Multicast - Dense Mode

PIM-SM

Protocol Independent Multicast - Sparse Mode

PIR

peak information rate

PLL

See phase-locked loop.

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PM

performance monitoring

PMS

Product Management System

POH

path overhead

PON

passive optical network

POS

See packet over SDH/SONET.

PPD

partial packet discard

PPI

PDH physical interface

PPP

Point-to-Point Protocol

PPPoE

Point-to-Point Protocol over Ethernet

PPS

port protection switching

PQ

See priority queuing.

PRBS

See pseudo random binary sequence.

PRC

primary reference clock

PRI

primary rate interface

PSD

See power spectrum density.

PSN

See packet switched network.

PSTN

See public switched telephone network.

PSU

power supply unit

PT

payload type

PTI

payload type indicator

PTN

packet transport network

PTP

See point to point.

PVID

See port default VLAN ID.

PVP

See permanent virtual path.

PW

See pseudo wire.

PWE3

See pseudo wire emulation edge-to-edge.

packet over SDH/SONET


(POS)

A MAN and WAN technology that provides point-to-point data connections. The
POS interface uses SDH/SONET as the physical layer protocol, and supports the
transport of packet data (such as IP packets) in MAN and WAN.

packet switched network


(PSN)

A telecommunications network that works in packet switching mode.

packet switching

A network technology in which information is transmitted by means of


exchanging packets and the bandwidth of a channel can be shared by multiple
connections.

parity check

A method for character level error detection. An extra bit is added to a string of
bits, usually a 7-bit ASCII character, so that the total number of bits 1 is odd or

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even (odd or even parity). Both ends of a data transmission must use the same
parity. When the transmitting device frames a character, it counts the numbers of
1s in the frame and attaches the appropriate parity bit. The recipient counts the
1s and, if there is parity error, may ask for the data to be retransmitted.
peak burst size (PBS)

A parameter that is used to define the capacity of token bucket P, that is, the
maximum burst IP packet size when the information is transferred at the peak
information rate. This parameter must be larger than 0. It is recommended that
PBS should be not less than the maximum length of the IP packet that might be
forwarded. See also CIR, CBS, and PIR.

peak cell rate (PCR)

The maximum rate at which an ATM connection can accept cells.

per-hop behavior (PHB)

IETF Diff-Serv workgroup defines forwarding behaviors of network nodes as


per-hop behaviors (PHB), such as, traffic scheduling and policing. A device in
the network should select the proper PHB behaviors, based on the value of
DSCP. At present, the IETF defines four types of PHB. They are class selector
(CS), expedited forwarding (EF), assured forwarding (AF), and best-effort (BE).

permanent virtual path


(PVP)

Virtual path that consists of PVCs.

phase-locked loop (PLL)

A circuit that consists essentially of a phase detector which compares the


frequency of a voltage-controlled oscillator with that of an incoming carrier
signal or reference-frequency generator; the output of the phase detector, after
passing through a loop filter, is fed back to the voltage-controlled oscillator to
keep it exactly in phase with the incoming or reference frequency.

plesiochronous digital
hierarchy (PDH)

A multiplexing scheme of bit stuffing and byte interleaving. It multiplexes the


minimum rate 64 kit/s into the 2 Mbit/s, 34 Mbit/s, 140 Mbit/s, and 565 Mbit/s
rates.

point to point (PTP)

A type of service in which data is sent from a single network termination to


another network termination.

point-to-point service
(P2P)

A service between two terminal users. In P2P services, senders and recipients are
terminal users.

port default VLAN ID


(PVID)

A default VLAN ID of a port. It is allocated to a data frame if the data frame


carries no VLAN tag when reaching the port.

power distribution unit


(PDU)

A unit that performs AC or DC power distribution.

power spectrum density


(PSD)

The power layout of random signals in the frequency domain.

printed circuit board


(PCB)

A board used to mechanically support and electrically connect electronic


components using conductive pathways, tracks, or traces, etched from copper
sheets laminated onto a non-conductive substrate.

priority queuing (PQ)

A queue scheduling algorithm based on the absolute priority. According to the


PQ algorithm, services of higher priorities are ensured with greater bandwidth,
lower latency, and less jitter. Packets of lower priorities must wait to be sent till
all packets of higher priorities are sent. In this manner, services of higher
priorities are processed earlier than others.

provider edge (PE)

A device that is located in the backbone network of the MPLS VPN structure. A
PE is responsible for managing VPN users, establishing LSPs between PEs, and

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exchanging routing information between sites of the same VPN. A PE performs


the mapping and forwarding of packets between the private network and the
public channel. A PE can be a UPE, an SPE, or an NPE.
pseudo random binary
sequence (PRBS)

A sequence that is random in a sense that the value of an element is independent


of the values of any of the other elements, similar to real random sequences.

pseudo wire (PW)

An emulated connection between two PEs for transmitting frames. The PW is


established and maintained by PEs through signaling protocols. The status
information of a PW is maintained by the two end PEs of a PW.

pseudo wire emulation


edge-to-edge (PWE3)

An end-to-end Layer 2 transmission technology. It emulates the essential


attributes of a telecommunication service such as ATM, FR or Ethernet in a
packet switched network (PSN). PWE3 also emulates the essential attributes of
low speed time division multiplexing (TDM) circuit and SONET/SDH. The
simulation approximates to the real situation.

public switched telephone


network (PSTN)

A telecommunications network established to perform telephone services for the


public subscribers. Sometimes it is called POTS.

pulse code modulation


(PCM)

A method of encoding information in a signal by changing the amplitude of


pulses. Unlike pulse amplitude modulation (PAM), in which pulse amplitude can
change continuously, pulse code modulation limits pulse amplitudes to several
predefined values. Because the signal is discrete, or digital, rather than analog,
pulse code modulation is more immune to noise than PAM.

Q
QAM

See quadrature amplitude modulation.

QPSK

See quadrature phase shift keying.

QinQ

See 802.1Q in 802.1Q.

QoS

See quality of service.

quadrature amplitude
modulation (QAM)

Both an analog and a digital modulation scheme. It conveys two analog message
signals, or two digital bit streams, by changing (modulating) the amplitudes of
two carrier waves, using the amplitude-shift keying (ASK) digital modulation
scheme or amplitude modulation (AM) analog modulation scheme. These two
waves, usually sinusoids, are out of phase with each other by 90 and are thus
called quadrature carriers or quadrature components hence the name of the
scheme.

quadrature phase shift


keying (QPSK)

A modulation method of data transmission through the conversion or modulation


and the phase determination of the reference signals (carrier). It is also called the
fourth period or 4-phase PSK or 4-PSK. QPSK uses four dots in the star
diagram. The four dots are evenly distributed on a circle. On these phases, each
QPSK character can perform two-bit coding and display the codes in Gray code
on graph with the minimum BER.

quality of service (QoS)

A commonly-used performance indicator of a telecommunication system or


channel. Depending on the specific system and service, it may relate to jitter,
delay, packet loss ratio, bit error ratio, and signal-to-noise ratio. It functions to
measure the quality of the transmission system and the effectiveness of the
services, as well as the capability of a service provider to meet the demands of

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users.

R
RADIUS

See Remote Authentication Dial In User Service.

RAN

See radio access network.

RDI

remote defect indication

RED

See random early detection.

REG

See regenerator.

REI

remote error indication

RIP

See Routing Information Protocol.

RMEP

remote maintenance association end point

RMON

remote network monitoring

RNC

See radio network controller.

ROPA

See remote optical pumping amplifier.

RPR

resilient packet ring

RSOH

regenerator section overhead

RST

regenerator section termination

RSTP

See Rapid Spanning Tree Protocol.

RSVP

See Resource Reservation Protocol.

RSVP-TE

See Resource ReserVation Protocol-Traffic Engineering.

RTN

radio transmission node

RTP

real-time performance

RTS

request to send

Rapid Spanning Tree


Protocol (RSTP)

An evolution of the Spanning Tree Protocol, providing for faster spanning tree
convergence after a topology change. The RSTP protocol is backward
compatible with the STP protocol.

Remote Authentication
Dial In User Service
(RADIUS)

A networking protocol that provides centralized Authentication, Authorization,


and Accounting (AAA) management for computers to connect and use a
network service.

Resource ReserVation
Protocol-Traffic
Engineering (RSVP-TE)

An extension to the RSVP protocol for setting up label switched paths (LSPs) in
MPLS networks. The RSVP-TE protocol is used to establish and maintain the
LSPs by initiating label requests and allocating label binding messages. It also
supports LSP rerouting and LSP bandwidth increasing.

Resource Reservation
Protocol (RSVP)

A network control protocol like Internet Control Message Protocol (ICMP) and
designed for Integrated Service and used to reserve resources on every node
along a path. RSVP operates on the transport layer; however, RSVP does not
transport application data.

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RoHS

restriction of the use of certain hazardous substances

Routing Information
Protocol (RIP)

A simple routing protocol that is part of the TCP/IP protocol suite. It determines
a route based on the smallest hop count between source and destination. RIP is a
distance vector protocol that routinely broadcasts routing information to its
neighboring routers and is known to waste bandwidth.

radio access network


(RAN)

The network that provides the connection between CPEs and the CN. It isolates
the CN from wireless network.

radio network controller


(RNC)

A piece of equipment in the RNS which is in charge of controlling the use and
the integrity of the radio resources.

random early detection


(RED)

A packet loss algorithm used in congestion avoidance. It discards the packet


according to the specified higher limit and lower limit of a queue so that global
TCP synchronization resulting from traditional tail drop can be prevented.

real-time variable bit rate


(rt-VBR)

A parameter intended for real-time applications, such as compressed voice over


IP (VoIP) and video conferencing. The rt-VBR is characterized by a peak cell
rate (PCR), sustained cell rate (SCR), and maximum burst size (MBS). You can
expect the source device to transmit in bursts and at a rate that varies with time.

receiver sensitivity

The minimum acceptable value of average received power at point R to achieve


a 1 x 10-12 BER (The FEC is open).

reflectance

The ratio of the reflected optical power to the incident optical power.

regenerator (REG)

A piece of equipment or device that regenerates electrical signals.

remote optical pumping


amplifier (ROPA)

A remote optical amplifier subsystem designed for applications where power


supply and monitoring systems are unavailable. The ROPA subsystem is a power
compensation solution to the ultra-long distance long hop (LHP) transmission.

rt-VBR

See real-time variable bit rate.

S
SAI

service area identifier

SAN

storage area network

SAToP

Structure-Agnostic Time Division Multiplexing over Packet

SC

square connector

SCR

sustainable cell rate

SD

See signal degrade.

SD-SDI

See standard definition-serial digital interface signal.

SDH

See synchronous digital hierarchy.

SDI

See serial digital interface.

SDP

serious disturbance period

SDRAM

See synchronous dynamic random access memory.

SELV

safety extra-low voltage

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SEMF

synchronous equipment management function

SES

severely errored second

SF

See signal fail.

SFP

small form-factor pluggable

SFTP

See Secure File Transfer Protocol.

SHDSL

See single-pair high-speed digital subscriber line.

SLA

See service level agreement.

SLIP

See Serial Line Interface Protocol.

SMB

Server Message Block

SMSR

side mode suppression ratio

SNCMP

subnetwork connection multipath protection

SNCP

subnetwork connection protection

SNCTP

subnetwork connection tunnel protection

SNMP

See Simple Network Management Protocol.

SOH

section overhead

SONET

See synchronous optical network.

SP

See service provider.

SPC

soft permanent connection

SPE

See superstratum provider edge.

SPI

SDH physical interface

SRG

See shared risk group.

SRLG

shared risk link group

SSH

See Secure Shell.

SSL

See Secure Sockets Layer.

SSM

See Synchronization Status Message.

SSMB

synchronization status message byte

SSU

synchronization supply unit

STP

Spanning Tree Protocol

Secure File Transfer


Protocol (SFTP)

A network protocol designed to provide secure file transfer over SSH.

Secure Shell (SSH)

A set of standards and an associated network protocol that allows establishing a


secure channel between a local and a remote computer. A feature to protect
information and provide powerful authentication function for a network when a
user logs in to the network through an insecure network. It prevents IP addresses
from being deceived and plain text passwords from being captured.

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Secure Sockets Layer


(SSL)

A security protocol that works at a socket level. This layer exists between the
TCP layer and the application layer to encrypt/decode data and authenticate
concerned entities.

Serial Line Interface


Protocol (SLIP)

A protocol that defines the framing mode over the serial line to implement
transmission of messages over the serial line and provide the remote host
interconnection function with a known IP address.

Simple Network
Management Protocol
(SNMP)

A network management protocol of TCP/IP. It enables remote users to view and


modify the management information of a network element. This protocol
ensures the transmission of management information between any two points.
The polling mechanism is adopted to provide basic function sets. According to
SNMP, agents, which can be hardware as well as software, can monitor the
activities of various devices on the network and report these activities to the
network console workstation. Control information about each device is
maintained by a management information block.

Synchronization Status
Message (SSM)

A message that carries quality levels of timing signals on a synchronous timing


link. Nodes on an SDH network and a synchronization network acquire
upstream clock information through this message. Then the nodes can perform
proper operations on their clocks, such as tracing, switching, or converting to
holdoff, and forward the synchronization information to downstream nodes.

serial digital interface


(SDI)

An interface that transmits data in a single channel in sequence.

service level agreement


(SLA)

A service agreement between a customer and a service provider. SLA specifies


the service level for a customer. The customer can be a user organization (source
domain) or another differentiated services domain (upstream domain). An SLA
may include traffic conditioning rules which constitute a traffic conditioning
agreement as a whole or partially.

service provider (SP)

An entity that offers service subscriptions to individual subscribers and contracts


with carriers to implement services for a specific DN. A service provider may
contract with more than one carrier.

shared risk group (SRG)

A group of resources that share a common risk component whose failure can
cause the failure of all the resources in the group.

signal degrade (SD)

A signal indicating that associated data has degraded in the sense that a degraded
defect condition is active.

signal fail (SF)

A signal indicating that associated data has failed in the sense that a near-end
defect condition (non-degrade defect) is active.

single-pair high-speed
digital subscriber line
(SHDSL)

A symmetric digital subscriber line technology developed from HDSL, SDSL,


and HDSL2, which is defined in ITU-T G.991.2. The SHDSL port is connected
to the user terminal through the plain telephone subscriber line and uses trellis
coded pulse amplitude modulation (TC-PAM) technology to transmit high-speed
data and provide the broadband access service.

span

The physical reach between two pieces of WDM equipment. The number of
spans determines the signal transmission distance supported by a piece of
equipment and varies according to transmission system type.

standard definition-serial
digital interface signal
(SD-SDI)

Standard definition video signal transported by serial digital interface.

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superstratum provider
edge (SPE)

Core devices that are located within a VPLS full-meshed network. The UPE
devices that are connected with the SPE devices are similar to the CE devices.
The PWs set up between the UPE devices and the SPE devices serve as the ACs
of the SPE devices. The SPE devices must learn the MAC addresses of all the
sites on UPE side and those of the UPE interfaces that are connected with the
SPE. SPE is sometimes called NPE.

synchronous digital
hierarchy (SDH)

A transmission scheme that follows ITU-T G.707, G.708, and G.709. It defines
the transmission features of digital signals such as frame structure, multiplexing
mode, transmission rate level, and interface code. SDH is an important part of
ISDN and B-ISDN. It interleaves the bytes of low-speed signals to multiplex the
signals to high-speed counterparts, and the line coding of scrambling is used
only for signals. SDH is suitable for the fiber communication system with high
speed and a large capacity since it uses synchronous multiplexing and flexible
mapping structure.

synchronous dynamic
random access memory
(SDRAM)

A new type of DRAM that can run at much higher clock speeds than
conventional memory. SDRAM actually synchronizes itself with the CPU's bus
and is capable of running at 100 MHz, about three times faster than conventional
FPM RAM, and about twice as fast as EDO DRAM or BEDO DRAM. SDRAM
is replacing EDO DRAM in computers.

synchronous optical
network (SONET)

A high-speed network that provides a standard interface for communications


carriers to connect networks based on fiber optical cable. SONET is designed to
handle multiple data types (voice, video, and so on). It transmits at a base rate of
51.84 Mbit/s, but multiples of this base rate go as high as 2.488 Gbit/s.

T
TCI

tag control information

TCM

See trellis coded modulation scheme.

TCP/IP

Transmission Control Protocol/Internet Protocol

TDC

tunable dispersion compensator

TDM

See time division multiplexing.

TE

See traffic engineering.

TFTP

See Trivial File Transfer Protocol.

TIM

trail trace identifier mismatch

TLV

See type-length-value.

TM

See terminal multiplexer.

TMN

See telecommunications management network.

TOD

time of day

TPID

tag protocol identifier

TPS

See tributary protection switching.

TST

See Test.

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TTI

trail trace identifier

TTSI

See trail termination source identifier.

TUG

tributary unit group

Telnet

A standard terminal emulation protocol in the TCP/IP protocol stack. Telnet


allows users to log in to remote systems and use resources as if they were
connected to a local system. Telnet is defined in RFC 854.

Test (TST)

A function which is used to perform one-way on-demand in-service or out-ofservice diagnostics tests. This includes verifying bandwidth throughput, frame
loss, bit errors, and so on.

Trivial File Transfer


Protocol (TFTP)

A small and simple alternative to FTP for transferring files. TFTP is intended for
applications that do not need complex interactions between the client and server.
TFTP restricts operations to simple file transfers and does not provide
authentication. TFTP is small enough to be contained in ROM to be used for
bootstrapping diskless machines.

tail drop

A congestion management mechanism, in which packets arrive later are


discarded when the queue is full. This policy of discarding packets may result in
network-wide synchronization due to the TCP slow startup mechanism.

telecommunications
management network
(TMN)

A protocol model defined by ITU-T for managing open systems in a


communications network. An architecture for management, including planning,
provisioning, installation, maintenance, operation and administration of
telecommunications equipment, networks and services.

terminal multiplexer (TM)

A device used at a network terminal to multiplex multiple channels of low rate


signals into one channel of high rate signals, or to demultiplex one channel of
high rate signals into multiple channels of low rate signals.

throughput

The maximum transmission rate of the tested object (system, equipment,


connection, service type) when no packet is discarded. Throughput can be
measured with bandwidth.

time division multiplexing


(TDM)

A multiplexing technology. TDM divides the sampling cycle of a channel into


time slots (TSn, n=0, 1, 2, 3), and the sampling value codes of multiple
signals engross time slots in a certain order, forming multiple multiplexing
digital signals to be transmitted over one channel.

traceroute

A program that prints the path to a destination. Traceroute sends a sequence of


datagrams with the time-to-live (TTL) set to 1,2, and so on, and uses ICMP time
exceeded messages that return to determine routers along the path.

traffic engineering (TE)

A technology that is used to dynamically monitor the traffic of the network and
the load of the network elements, to adjust in real time the parameters such as
traffic management parameters, route parameters and resource restriction
parameters, and to optimize the utilization of network resources. The purpose is
to prevent the congestion caused by unbalanced loads.

trail termination source


identifier (TTSI)

A TTSI uniquely identifies an LSP in the network. A TTSI is carried in the


connectivity verification (CV) packet for checking the connectivity of a trail. If
it matches the TTSI received by the sink point, the trail has no connectivity
defect.

trellis coded modulation


scheme (TCM)

A modulation scheme which allows highly efficient transmission of information


over band-limited channels such as telephone lines.

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tributary protection
switching (TPS)

A function that uses a standby tributary processing board to protect N tributary


processing boards.

tunnel

A channel on the packet switching network that transmits service traffic between
PEs. In VPN, a tunnel is an information transmission channel between two
entities. The tunnel ensures secure and transparent transmission of VPN
information. In most cases, a tunnel is an MPLS tunnel.

type-length-value (TLV)

An encoding type that features high efficiency and expansibility. It is also called
Code-Length-Value (CLV). T indicates that different types can be defined
through different values. L indicates the total length of the value field. V
indicates the actual data of the TLV and is most important. TLV encoding
features high expansibility. New TLVs can be added to support new features,
which is flexible in describing information loaded in packets.

U
UART

universal asynchronous receiver/transmitter

UAS

unavailable second

UAT

See unavailable time event.

UBR

unspecified bit rate

UBR+

Unspecified Bit Rate Plus

UDP

See User Datagram Protocol.

UNI

See user-to-network interface.

UPC

See usage parameter control.

UPE

user-end provider edge

UPI

user payload identifier

UPM

uninterruptible power module

UPS

uninterruptible power supply

UTC

See Coordinated Universal Time.

User Datagram Protocol


(UDP)

A TCP/IP standard protocol that allows an application program on one device to


send a datagram to an application program on another. User Datagram Protocol
(UDP) uses IP to deliver datagram. UDP provides application programs with the
unreliable connectionless packet delivery service. There is a possibility that UDP
messages will be lost, duplicated, delayed, or delivered out of order. The
destination device does not confirm whether a data packet is received.

unavailable time event


(UAT)

An event that is reported when the monitored object generates 10 consecutive


severely errored seconds (SES) and the SESs begin to be included in the
unavailable time. The event will end when the bit error ratio per second is better
than 10-3 within 10 consecutive seconds.

usage parameter control


(UPC)

During communications, UPC is implemented to monitor the actual traffic on


each virtual circuit that is input to the network. Once the specified parameter is
exceeded, measures will be taken to control. NPC is similar to UPC in function.
The difference is that the incoming traffic monitoring function is divided into

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UPC and NPC according to their positions. UPC locates at the user/network
interface, while NPC at the network interface.
user-to-network interface
(UNI)

The interface between user equipment and private or public network equipment
(for example, ATM switches).

V
V-NNI

virtual network-network interface

V-UNI

See virtual user-network interface.

VB

virtual bridge

VBR

See variable bit rate.

VCC

See virtual channel connection.

VCCV

virtual circuit connectivity verification

VCG

See virtual concatenation group.

VCI

virtual channel identifier

VDSL

very-high-data-rate digital subscriber line

VDSL2

See very-high-speed digital subscriber line 2.

VLAN

virtual local area network

VOA

variable optical attenuator

VP

See virtual path.

VPI

See virtual path identifier.

VPLS

See virtual private LAN service.

VPN

virtual private network

VPWS

See virtual private wire service.

VRRP

See Virtual Router Redundancy Protocol.

VSI

See virtual switch instance.

Virtual Router
Redundancy Protocol
(VRRP)

A protocol used for multicast or multicast LANs such as an Ethernet. A group of


routers (including an active router and several backup routers) in a LAN is
regarded as a virtual router, which is called a backup group. The virtual router
has its own IP address. The host in the network communicates with other
networks through this virtual router. If the active router in the backup group
fails, one of the backup routers in this backup group becomes active and
provides routing service for the host in the network.

VoIP

See voice over IP.

variable bit rate (VBR)

One of the traffic classes used by ATM (Asynchronous Transfer Mode). Unlike a
permanent CBR (Constant Bit Rate) channel, a VBR data stream varies in
bandwidth and is better suited to non real time transfers than to real-time streams
such as voice calls.

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very-high-speed digital
subscriber line 2 (VDSL2)

An extension of the VDSL technology, which complies with ITU G.993.2,


supports multiple spectrum profiles and encapsulation modes, and provides
short-distance and high-speed access solutions to the next-generation FTTx
access service.

virtual channel connection


(VCC)

A VC logical trail that carries data between two end points in an ATM network.
A point-to-multipoint VCC is a set of ATM virtual connections between two or
multiple end points.

virtual concatenation
group (VCG)

A group of co-located member trail termination functions that are connected to


the same virtual concatenation link

virtual path (VP)

A bundle of virtual channels, all of which are switched transparently across an


ATM network based on a common VPI.

virtual path identifier


(VPI)

The field in the Asynchronous Transfer Mode (ATM) cell header that identifies
to which virtual path the cell belongs.

virtual private LAN


service (VPLS)

A type of point-to-multipoint L2VPN service provided over the public network.


VPLS enables geographically isolated user sites to communicate with each other
through the MAN/WAN as if they are on the same LAN.

virtual private wire


service (VPWS)

A technology that bears Layer 2 services. VPWS emulates services such as


ATM, FR, Ethernet, low-speed TDM circuit, and SONET/SDH in a PSN.

virtual switch instance


(VSI)

An instance through which the physical access links of VPLS can be mapped to
the virtual links. Each VSI provides independent VPLS service. VSI has
Ethernet bridge function and can terminate PW.

virtual user-network
interface (V-UNI)

A virtual user-network interface, works as an action point to perform service


classification and traffic control in HQoS.

voice over IP (VoIP)

An IP telephony term for a set of facilities used to manage the delivery of voice
information over the Internet. VoIP involves sending voice information in a
digital form in discrete packets rather than by using the traditional circuitcommitted protocols of the public switched telephone network (PSTN).

W
WAN

See wide area network.

WCDMA

See Wideband Code Division Multiple Access.

WDM

wavelength division multiplexing

WEEE

waste electrical and electronic equipment

WFQ

See weighted fair queuing.

WLAN

See wireless local area network.

WRED

See weighted random early detection.

WRR

weighted round robin

WTR

See wait to restore.

Wideband Code Division


Multiple Access

A standard defined by the ITU-T for the third-generation wireless technology


derived from the Code Division Multiple Access (CDMA) technology.

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(WCDMA)
wait to restore (WTR)

The number of minutes to wait before services are switched back to the working
line.

weighted fair queuing


(WFQ)

A fair queue scheduling algorithm based on bandwidth allocation weights. This


scheduling algorithm allocates the total bandwidth of an interface to queues,
according to their weights and schedules the queues cyclically. In this manner,
packets of all priority queues can be scheduled.

weighted random early


detection (WRED)

A packet loss algorithm used for congestion avoidance. It can prevent the global
TCP synchronization caused by traditional tail-drop. WRED is favorable for the
high-priority packet when calculating the packet loss ratio.

wide area network (WAN)

A network composed of computers which are far away from each other which
are physically connected through specific protocols. WAN covers a broad area,
such as a province, a state or even a country.

wireless local area


network (WLAN)

A hybrid of the computer network and the wireless communication technology.


It uses wireless multiple address channels as transmission media and carriers out
data interaction through electromagnetic wave to implement the functions of the
traditional LAN.

Z
Z interface extension

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Extending the analogue subscriber to another place by extending the Z interface.

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