LED LAMP

INDEX

SL.NO. CONTENT PAGE NO.

1. INTRODUCTION
2. BLOCK DIAGRAM
3. BLOCK DIAGRAM
DESCRIPTION
4. CIRCUIT DIAGRAM
5. BILL OF MATERIALS
6. CIRCUIT DESCRIPTION
7. PCB DESIGN AND LAYOUT
8. PCB DESCRIPTION AND
FABRICATION
9. APPLICATIONS
10. ADVANTAGES
11. DISADVANTAGES
12. FUTURE
IMPLEMENTATION
13. COST OF PROJECT
14. PHOTOGRAPH OF
PROJECT
15. DATA SHEETS
16. BIBILOGRAPHY

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SYNOPSIS

INTRODUCTION

A Light Emitting Diode lamp is a solid state lamp (SSL) that

uses light-emitting diodes (LEDs) as the source of light. Since
the light output of individual light-emitting diodes is small
compared to incandescent and compact fluorescent lamps,

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multiple diodes are used together. LED lamps can be made

interchangeable with other types, but the presently available
light output is small. LED lamps must include internal
circuits to operate from standard AC voltages. LED lamps
offer long life and high efficiency, but initial costs are higher
than for fluorescent lamps.

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BLOCK DIAGRAM

BLOCK DIAGRAM

INPUT 230V AC

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TRANSFORMER

POWER SUPPLY

LED LAMP

BLOCK DIAGRAM DESCRIPTION

The BLOCK DIAGRAM consist of a step down Transformer

(12-0-12), Rectifier which converts AC to DC, Filter which filters the
ripple, and it gives out put voltage of 5V is connected to the LED

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LAMP which is having 100 LEDs

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CIRCUIT DIAGRAM

CIRCUIT DIAGRAM

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BILL OF MATERIALS:

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SL.NO DESCRIPTION SPECIFICATIO REFERENCE QTY

N DESIGNATOR
01 7805 5V Regulator IC1 1
02. 1N4007 PIV=1000V D1-D7 7
03. Resistor 1kΩ , ¼ w R1 1
04. Resistor 10kΩ , ¼w R2 1
05. Ceramic 0.1uf C3-C4 2
capacitor
06. Electrolyte 1000uf,63v C1 1
capacitor
07. LED White LEDs Ds1-Ds100 100
08. Transformer 09-0-09, 1A X1 1

CIRCUIT DESCRIPTION

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The circuit consists of step down transformer which step downs

the voltage from 230V to 09V-0V-09V. the primary side is given to
AC supply and secondary side is connected to the rectifier circuit is
provided to convert the AC to DC and the filter also given to filter the
ripple content in the output voltage. 7805 regulator IC is given to
regulate the voltage to 5V. Switch is given to the output voltage.
The out put is given to resistor to limit the current from the supply
anodes of LED’s is connected to the resistor end Cathode is given to
the ground. The all the LEDs are connected in parallel so it required
more current and low voltage

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PCB DESIGN AND LAYOUT

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PCB DESCRIPTION AND FABRICATION

PRINTED CIRCUIT BOARD

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A printed circuit board, or PCB, is used to mechanically support and

electrically connect electronic components using conductive
pathways, or traces, etched from copper sheets laminated onto non
conductive substrate. It is also referred to as printed wiring board
(PWB) or a etched wiring board.
A PCB populated with electronic components is a printed circuit
assembly (PCA), also known as a printed circuit board assembly
(PCBA).
PCB’s are rugged, inexpensive and can be highly reliable. They
require much more layout effort and higher initial cost than either or
point-point constructed wire wrapped circuits, but are much cheaper
and faster for high volume production. Much of the electronics
industries PCB design, assembly and quality control needs are set by
standards that are published by the IPC organization.

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MANUFACTURING

Conducting layers are typically made of thin copper foil. Insulating

layers are typically laminated together with epoxy resin. The board is
typically green in colour and made of materials
polytetrafluoroethylene, FR-4,FR-1,CEM-1 or CEM-3. Well known
prepreg materials used in PCB industry are FR-2 ( phenolic cotton
paper ) , FR-3 ( cotton paper and epoxy) , FR-4 ( woven glass and
epoxy , FR-5 ( woven glass and epoxy), FR-6 ( matte glass and
polyester ) ,G-10 ( woven glass and epoxy), CEM-1 ( cotton paper
and epoxy ) , CEM-2 ( cotton paper and epoxy),CEM-3 ( woven glass
and epoxy), CEM-4 ( woven glass and epoxy), CEM-5 (woven glass
and polyester ).
A PCB as a design on a computer (left) and realiazed as a
board assembly with populated components (right). The board is
double sided, with through-hole plating, green solder resist , and
white silk screen printing. Both surface mount through-hole
components have been used.

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PATTERNING (ETCHING)

A few PCB’s are made by adding traces to the bare substrate (or
a substrate with a vary thin layer of copper)
Usually by a complex process of multiple steps.

There are three common “ subtractive” methods (methods that

remove copper) used for the production printed circuit boards :
silkscreen printing uses etch-resistant inks to protect the copper
foil . Subsequent etching removes the unwanted copper .
Alternatively , the ink may be conductive, printed on a blank ( non-
conductive) board. The latter technique is also used in the
manufacture of hybrid circuits.
Photoengraving uses a photo mask and chemical etching to remove
copper foil from the substrate. The photo mask is usually prepared
with a photo plotter from data produced by a technician using CAM ,
or computer aided manufacturing software. Laser printed
transparencies are typically employed for photo tools ; however ,
direct laser imaging techniques are being employed to replace photo
tools for high resolution requirements .

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PCB milling uses a two or three axis mechanical milling system to

mill away the copper foil from the substrate. A PCB milling machine
( referred to as a ‘PCB prototyped’ ) operates in a similar way to a
plotter, receiving commands from the host software that control the
position of the milling head in the X,Y and ( if relevant ) Z axis. Data
to drive the prototyper is extracted from files generated in PCB
design software and stored in HPGL or Gerber file format.
“Additive” processes also exists. The most common is the
“semi-additive” process. In this version, the unpatterned board has a
thin layer of copper already on it. A reverse mask is then applied .
(Unlike a subtractive process mask , this mask exposes those parts of
the substrate that will eventually become the traces ) . Additional
copper is then plated onto the board in the unmasked areas; copper
may be plated. Any desired weight. Tin-lead or other surface plating
are then applied . The mask is stripped away and a brief etching step
removes the now-exposed original copper laminate from the board,
isolating the individual traces.

The additive process is commonly used for multi-layer boards as

it facilitates the plating-through of the holes in the circuit board.

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DRILLING

Holes, or vias, through a PCB are typically drilled with tiny drill
bits made of solid tungsten carbide. Automated drilling machines
perform the drilling with placement controlled by a drill tape or drill
file. These computer – generated files are also called numerically
controlled drill (NCD) files or “Execution files”. The drill file
describes the location and size of each drilled hole.

When very small vias are required, drilling with mechanical bits is
costly because of high rates of wear and breakage. In this case, the
vias may be evaporated by lasers. Laser-drilled vias typically have an
inferior surface finish inside the hole. These holes are called micro
vias.

It is also possible with controlled-depth drilling, laser drilling, or by

pre-drilling the individual sheets of the PCB before lamination, to
produce holes that connect only some of the copper layers, rather than
passing through the entire board. These holes are called blind vias
when they connect an internal copper layer to an outer layer, or
buried vias when they connect two or more internal copper layers and
no outer layers.

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The walls of the holes, for boards with 2 or more layers, are plated
with copper to form plated-through holes that electrically connect the
conducting layers of the PCB. For multilayer boards, those with 4
layers or more, drilling typically produces a smear comprised of the
bonding agent in the laminate system. Before the holes can be plated
through, this smear must be removed by a chemical de-smear process,
or by plasma-etch.

The Exposed Conductor plating and coating

Places to which components will be mounted are typically plated,

because bare copper oxidizes quickly, and therefore is not readily
solder able. Traditionally, any exposed copper was plated with solder
by hot air solder leveling (HASL). This solder was a tin-lead alloy,
however new solder compounds are now used to achieve compliance
with the RoHS directive in the EU, which restricts the use of lead,
other platings used are OSP ( organic surface protectant), immersion
gold coating (ENIG), and direct gold. Edge connectors, placed along
one edge of some boards, are often gold plated.

Electrochemical migration (ECM) is the growth of conductive metal

filaments on or in a printed circuit board (PCB) under the influence of a DC
voltage bias.

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SOLDER RESIST

Areas that should not be soldered to may be covered with a polymer

solder resist (solder mask) coating. The solder resist prevents solder
from bridging between conductors and thereby creating short circuits.
Solder resist also provides some protection from the environment.

SCREEN PRINTING

Line art and text may be printed onto the outer surfaces of a PCB by
screen printing. When space permits, the screen print text can indicate
component designations, switch setting requirements, test points, and
other features helpful in assembling, testing and servicing the circuit
board.

Screen print is also known as the silk screen or, in one sided PCB’s
the red print.

Lately some digital printing solutions have been developed to

substitute the traditional screen printing process. This technology
allows printing variable data onto the PCB, including serialization
and barcode information for traceability purposes.

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TEST

Unpopulated boards may be subjected to a bare-

board test where each circuit connection is verified as correct on the
finished board. For high-volume production, a Bed of nails tester, a
fixture or a rigid needle adapter is used to make contact with copper
lands or holes on one or both sides of the board to facilities testing. A
computer will instruct the electrical test unit to send a small amount
of current through each contact point on the other appropriate contact
points. A “short” on a board would be a solid connection where there
should be no connection. An “open” is between two points that
should be connected and are not. For small or medium volume
boards, flying probe and flying-grid testers use moving test heads to
make contact with the copper/ silver/ gold/ solder lands or holes to
verify the electrical connectivity of the board under test.

After the printed circuit board (PCB) is completed, electronic

components must be attached to from a functional printed circuit
assembly. In through–holes construction, component leads are
inserted in holes. In surface-mount construction, the components are
placed on pads or lands on the outer surfaces of the PCB. In both
kinds of construction, component leads are electrically and
mechanically fixed to the board with a molten metal solder.

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There are a variety of soldering techniques used to attach

components to a PCB. High volume production is usually done with
machine placement and bulk wave soldering or reflow ovens, but
skilled technicians are able to solder very tiny parts by hand under a
microscope, using tweezers and a fine tip soldering iron for small
volume prototypes. Some parts are impossible to solder by hand, such
as ball grid array (BGA) packages.

Often, through- holes and surface mount construction must be

combined in a single PCA because some required components are
available only in surfaces- mount packages, while others are available
only in through holes packages. Another reason to use both methods
is that through holes mounting can provide needed strength for
component that are expected to go untouched will take up less space
using surface mount techniques.

After the board has been populated it may be tested in a variety of

ways:
While the power is off, visual inspection, automated optical
inspection. (JEDEC) guidelines for the PCB component placement,
soldering, & inspection are commonly used to maintain quality
control in this stage of PCB manufacturing.

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While the power is off, analog signature analysis, power- off

testing .While the power is on, in- circuit test, where physical
measurements can be done.

To facilitate these tests, PCBs may be designed with extra pads to

make temporary connections. Sometimes these pads must be isolated
with resistors. The in-circuit test may also exercise boundary scan test
features of some components. In-circuit test systems may also be
used to program nonvolatile memory components on the board.
In boundary scan testing, test circuits integrated into various ICs on
the board form temporary connections between the PCB traces to test
that the ICs are mounted correctly. Boundary scan testing requires
that all the ICs to be to be tested use a standard test configuration
procedure, the most common one being the Joint Test Action Group
(JTAG) standard. When boards fail the test, a technicians may
desolder and replace failed components, a task known as “rework”.

PROTECTION AND PACKAGING

PCBs intended for extreme environments often have a conformal

coating, which is applied by dipping or spraying after the components
have been soldered. The coat prevents corrosion and leakages

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currents or shorting due to condensation. The earliest conformal coats

were wax. Modern conformal coats are usually dips of dilute
solutions of silicone rubber, polyurethane, acrylic or epoxy. Some are
engineering plastics sputtered on to the PCB in a vacuum chamber.

Many assembled PCBs are static sensitive, and therefore must be

placed in antistatic bags during transport. When handling these
boards, the user must be earthed; failure to do this might transmit an
accumulated static charge through the board, damaging or destroyed
it. Even bare boards are sometimes static sensitive. Traces have
gotten so fine that it’s quite possible to blow an etch off the board
with a static charge. This is especially true on non-traditional PCBs
such as MCMs and microwave PCBs.

SAFETY CERTIFICATION (U S)

Safety standard UL 796 cover component safety requirement for

printed wiring boards for use as components in devices or appliances.
Testing analyzes characteristics such as flammability, maximum
operating temperature, electrical tracking, heat deflection and direct
support of live electrical parts.

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The boards may use organic or inorganic base materials in a single or

multilayer, rigid or flexible form. Circuitry construction may include
etched, die stamped, precut, flush press, additive, and plated
conductor techniques. Printed component parts may be used.

The suitability of the pattern parameters, temperature and maximum

solder limits shall be determined in accordance with the applicable
end-product construction and requirement

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TRANSFORMER

A transformer is a device that transfers electrical energy from one

circuit to another through inductively coupled conductors—the
transformer's coils. A varying current in the first or primary winding
creates a varying magnetic flux in the transformer's core, and thus a
varying magnetic field through the secondary winding. This varying
magnetic field induces a varying electromotive force (EMF) or
"voltage" in the secondary winding. This effect is called mutual
induction.

If a load is connected to the secondary, an electric current will flow in

the secondary winding and electrical energy will be transferred from
the primary circuit through the transformer to the load. In an ideal
transformer, the induced voltage in the secondary winding (VS) is in

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proportion to the primary voltage (VP), and is given by the ratio of the
number of turns in the secondary (NS) to the number of turns in the
primary (NP) as follows:

By appropriate selection of the ratio of turns, a transformer thus

allows an alternating current (AC) voltage to be "stepped up" by
making NS greater than NP, or "stepped down" by making NS less than
NP.

In the vast majority of transformers, the coils are wound around a

ferromagnetic core, air-core transformers being a notable exception.

Transformers come in a range of sizes from a thumbnail-sized

coupling transformer hidden inside a stage microphone to huge units
weighing hundreds of tons used to interconnect portions of national
power grids. All operate with the same basic principles, although the
range of designs is wide. While new technologies have eliminated the
need for transformers in some electronic circuits, transformers are
still found in nearly all electronic devices designed for household
("mains") voltage. Transformers are essential for high voltage power
transmission, which makes long distance transmission economically
practical.

Transformer Construction:
There are two general types of transformers
1. Core type transformer
2. Shell type transformer
These two differ by the manner in which the windings are
wound around the magnetic core.
The magnetic core is a stack of thin silicon-steel
laminations about 0.35 mm thick for 50 Hz transformer. In

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order to reduce the eddy current losses, these laminations are

insulated from one another by thin layers of varnish. In order to
reduce the core losses, transformers have their magnetic core
made from cold-rolled grain-oriented sheet steel (C.R.G.O).
This material, when magnetized in the rolling direction, has low
core loss and high permeability.
Core Type Transformer:

(a) core-type Transformer

In the core-type, the windings surround a considerable

part of steel core as shown in fig (a). The core type
transformers require more conductor material and less iron
when compared to shell-type. The vertical portions of the core
are usually called limbs or legs and the top and bottom portions
are called the yoke. For single phase transformers, core-type

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has two legged core. In order to reduce leakage flux, half of the
L.V. winding is placed over one leg and other half over other
leg. For H.V. winding also, half of the winding is placed over
one leg and the other half over the other leg. L.V. winding is
placed adjacent to the steel core and H.V. winding outside, in order to
minimize the amount of insulation required.
Shell Type Transformer:
In the core-type, the steel core surrounds a considerable part of
the windings as shown in fig (b). Shell-type transformer has three
legged core. The L.V. and H.V. windings are wound on the central limb.
In order to reduce leakage flux, the windings are interleaved or
sandwiched. The shell type transformers require more iron and less
conductor material when compared to core-type.
There are two types of windings employed for transformers.
1. concentric coils.
2. Interleaved coils.
The concentric coils are used for core-type transformers and interleaved
coils for shell-type transformer.
.

(b) Shell type transformer

Regulation of a transformer
• Voltage regulation is defined as: “the change in
secondary

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voltage when rated load at a specified power is

removed”.
• Let, E2 = sec. terminal voltage at no load
V2 = sec. terminal voltage at full load

Then, % regulation = V2 - E2 x100

V2

Principle of Transformer Action:

A transformer works on the principle of
electromagnetic induction.
According to this principle, an emf is induced in a coil if
it links a changing flux.

T
he primary winding is connected to an alternating
voltage source, an alternating current I1 starts flowing
through N1 turns. The alternating mmf N1I1 sets up
alternating flux Ø which is confined to the high
permeability iron path as shown above. The alternating

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flux induces voltage E1 in the primary winding and E2

in the secondary winding. If
the load is connected across the secondary, a load
current starts flowing.
In addition to the secondary winding, there may be a
third winding on the same iron core. The transformer
action requires the existence of
alternating mutual flux linking the various windings on
a common magnetic core.

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ADVANTAGES
• High efficiency - LEDs are now available that reliably offer
over 100 lumens from a one-watt device, or much higher
outputs at higher drive currents
• Small size - provides design flexibility, arranged in rows, rings,
clusters, or individual points
• High durability - no filament or tube to break
• Life span - in properly engineered lamps, LEDs can last 50,000
- 60,000 hours
• Full dimmability – unlike fluorescent lamps, LEDs can be
dimmed using pulse-width modulation (PWM - turning the light
on and off very quickly at varying intervals).
• Mercury-free - unlike fluorescent and most HID technologies,
LEDs contain no hazardous mercury or halogen gases
• We can replace the LED’S if they are not working.

DISADVANTAGES
• A very limited variety and selection for your home compared to
other types of lighting.

• Hard to find in smaller towns where consumers may have a

smaller interest in this lighting alternative.
• Significantly more expensive than regular lighting and not
budget conscious.
• Not good for residential flood lighting. You will need extra
equipment to make this work
• Although they are available in many colors, the quality of the
colors is not quite as good as with regular lighting

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APPLICATIONS

• It is used in home lighting purpose.

• It is also used in hospital and labs

FEATURE IMPLEMENTATION
• If we increase the LED’s we can increase intensity.

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APPROXIMATION COST

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SL.NO ITEM QUANTITY PRICE TOTAL

1. IC 7805 1
2. Resistor 1

3. Diodes 4
4. LEDs 100
5. Transformer 1
6. Switches 1

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DATASHEETS

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BIBLIOGRAPHY

BOOKS

• ELECTRONIC DEVICE AND CIRCUIT THEROY

• PRINTED CIRCUIT BOARD(WALTER C BOSSHART)

MAGAZINE

• ELECTRONICS FOR YOU

(JUNE 2007)

WEBSITE

• WWW.ELECTRONICSFORU.COM
• WWW.GOGGLE.COM
• WWW.WIKIPEDIA.COM

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