Copper Wirebonding OSAT Viewpoint

Tony Panczak Sr. Vice President Leadframe Business Unit May 12th 2011
Enabling a Microelectronic World

Motivation To Use Copper

Benefits of Cu Wire

Concerns

Cost Saving
High Conductivity : 23% up Better HTS Performance : Moderate IMC Growth Workability Drop, UPH lower

Oxidation

Flexible Design : Stiffer Loop

Al Splash

HAST/PCT & F/A Difficulties

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Motivation To Use Copper: Cost

Gold: price per ounce Copper: price per pound

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Barriers to Copper Wire Implementation

Capital Expenditure (CAPEX)?
No, always buying new wirebond equipment and upgrading aged machines

Cost Benefit?
Previously, yes, not now Au price at $400: little Cu wire adoption Au price at $700: some movement Au price at $1000: significant motivation to move to Cu wire

Biggest obstacle? Market Acceptance

Not wanting to be first to change from known Au wire performance and acceptance criteria to lesser known Cu wire performance Adoption rate for multiple markets increasing dramatically

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Concerns With Copper Wire Adoption iNemi Survey Data

Highlights concerns from suppliers, OEMs, and EMS

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Concerns Listed (iNemi January 2011)

Question: What are the major concerns with Cu wire bonding? In-service reliability Process yield Throughput JEDEC reliability spec Unproven historical performance Manufacturing Statistical Process Control Equipment and assembly process parameters Survey Result: Reliability and historical performance are major concerns for the OEM community. Suppliers have concerns in these areas as well but to a lesser degree. Suppliers have additional concerns on throughput and yield.
When In-service Reliability is selected, the major reason is lack of use history (80%), then follow with unknown or poor correlation of JEDEC testing with in-field performance (20%).

Suppliers (31 of 32)

35 30 25 20 15 10 5 0

N/A

High

Medium

Low

In-service reliability

Process yield

Throughput

JEDEC reliability spec.

Unproven Manufacturing Equipment and historical Statistical assembly performance Process process Control parameters

OEM/EMS (18 of 20)

18 16 14 12 10 8 6 4 2 0 In-service reliability Process yield Throughput JEDEC reliability spec. Unproven Manufacturing Equipment and historical Statistical assembly performance Process process Control parameters

N/A

High

Medium

Low

Note difference between Suppliers and Customers

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Copper Wire Adoption for IC Market

Different end markets implementing at different rates, but all
are moving forward
Market Consumer/Computer Mobile Handset Networking/Server Automotive Current Adoption High Mid Mid Low Activity Level High High Mid Initial

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Copper Wire at Amkor

Development Timeline Breadth of Offering Key Best Known Methods (BKM)

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Amkor Qualification and HVM Start Dates

Classification
PBGA SOIC PSOP CABGA MLF TQFP MSOP LQFP TSSOP PoP MQFP 2.0mil 1.0mil 0.9mil 0.8mil 0.7mil KNS IConn ASM Xtreme SOIC PSOP HVM TSSOP, PBGA L/TQFP, MQFP, MLF, CABGA eTQFP

Qualification Item

Date
2004 2004 2004 2006 2006 2007 2008 2008 2009 2009 2010 2007 2004 2009 2006 2010 2010 2010 2006 2007 2009 2010 2011

Related Document #
SQC-BG-04-0125 SQC-SH-04-0066 SQC-SU-04-0093 SQB-CA-06-0102 SQB-MH-06-0082 SQB-TD-07-0003 SQB-TQ-08-0014 SQB-TM-08-0067

Package

Wire

SQC-BG-04-0125 SQB-TQ-08-0014 SQB-CA-06-0101

Wire bonders

Development start prior 2004 First adoption 2006 Fan out 2009/2010
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Amkor Breadth of Copper Wire Offering: Factory and Package Type

HVM in all 7 wirebond manufacturing locations
Korea K1 Leadframe Korea K4 Laminate Philippines P1 Leadframe Philippines P3 Leadframe and Laminate China C3 Leadframe and Laminate Taiwan T1 Leadframe Japan J1 Leadframe

All Customer Regions In HVM

US/North America Europe Japan/Asia

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Amkor Breadth of Copper Wire Offering: Customer Status

Over 66 customers engaging in Cu wirebonding
Evenly split between laminate and leadframe products

Over 275 devices qualified or completed characterization

Large number of wafer fabs and silicon nodes qualified Circuit Under Pad qualified Aluminum metal thickness from 0.6um to 4.0um qualified Wafer 180nm 130nm Fab/Silicon Node 90nm TSMC UMC Chartered/Global Foundries SMIC Dongbu Customer Fabs
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65nm 50 nm X X X

45nm40nm X

X X X X X X

X X X X X

X
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Amkor Breadth of Copper Wire Offering: Capacity

Approximately 65% of Amkor total wirebonder are capable to
support copper wire

Align wirebonder to device complexity

New bonder purchases for higher density and complex designs Retrofit higher end models to support simple device types

KNS Maxum Ultra

KNS IConn

KNS ProCu IConn

ASM Eagle60/AP

ASM Xtreme

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Laminate Copper Wirebonding

2 tier 1.0 mil Bare Cu, 62um BPO 175mil length 2 tier 2.0 mil PCC, 62um BPO 175mil length 3 tier 1.0mil Bare Cu, 67um BPO 210 mil length 3 tier 1.0 mil PCC, 67um BPO 210 mil length

Stacked die with SSB 0.8 mil PCC

SSB 0.8 mil Cu

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Amkor Copper Wirebonding

Leadframe MCM

MCM with SSB

In-board bond

Multi tier bond

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Amkor Copper Wirebond Roadmap

(15um)

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Amkor Copper Wirebond Best Known Methods

Device Characterization
Amkor has established large database of qualified pad structures Up front characterization to establish proper bond parameters still key to reliability
New Cu wire device requested

Review device info

Die Pad Metal

Al thickness from 0.8um to 1.2um preferred Can support outside of range with characterization

Wire bond parameter DOE and corner study

Qual Lot Assembly

Reliability test

Qual report

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Amkor Copper Wirebond Best Known Methods

Wire Type
Amkor in HVM with both Bare Cu as well as Palladium Coated Wire (PCC) PCC primary wire option Recommended for all laminate solutions Recommended for many leadframe solutions with complex wirebonding SSB, die to die bonding Bare Cu wire in HVM production for standard leadframe Longer in service time, HVM for power discrete devices for very long time Softer ball formation compared to PCC Some pad structures respond better with Bare Cu Wire suppliers qualified Hereaus, MKE, and Nippon Micrometal

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Amkor Copper Wirebond Best Known Methods

Wire Type

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Amkor Copper Wirebond Best Known Methods

Forming Gas utilized to ensure good free air ball formation Amkor installation of forming gas generation in factories
Forming gas Bare Cu
Good, No oxidation

Pure N2 gas
Some club ball and small than Forming gas

No inert gas
Oxidation and abnormal ball

PCC

Good

Good sphere shape But Stain on surface and smaller

Oxidation and abnoramal ball

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Amkor Copper Wirebond Best Known Methods

Bond shape
Flat, even bond

Good evenly distributed IMC

Capillary
Granular type used
Conventional Granular capillary

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Amkor Copper Wirebond Best Known Methods

Bill of Materials
Green core material and mold compound Sumitomo G600 series, G700 series materials qualified and in HVM Nitto GE100 series materials qualified and in HVM

Process Flow
Plasma prior wirebond established as BKM Wire exposure control Shelf life of Cu wire controlled to <6 months Working life reduced and monitored

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Conclusions
Market acceptance rapidly increasing as early adopters in
HVM

Amkor growth in copper wire covers broad segment of

customers, end applications, and geographic regions
Fast followers

Ongoing reliability studies and extended reliability testing to

address more risk adverse markets
Slow followers

Amkor facilitized in all wirebond factories to support copper

wire and continued growth

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