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Ar e Ar 2e
The outer grid is usually kept at ground potential, which is a more negative level than that of the anode.
The second grid is held at a negative potential below the ground value A third grid, which is maintained at the anode potential, is sometimes placed between the plasma and the electron suppressor grid
Mechanism continued
Spencer and Schmidt (1972) explain material removal in terms of the transfer of momentum from the incident ions to atoms on the surface of the material The higher the energy of the incident ion, the more deeply this cascading effect occurs into the material Yield: Number of Atoms Removed per Incident Ion
Spencer and Schmidt (1972) and Somekh (1976) confirmed that the yield depends on: Material being treated Type of Atoms and their Energy Angle of Incidence Gas Pressure
The Current Associated with the Extraction of the Ion may be calculated from Childs law:
I ( 0 V
3/ 2
/ q)(2* q / m) (d / le )
1/ 2
To achieve the highest current, Lowest Spacing between the Grids Grids should have the Largest number of Holes of the Smallest Size
Thermal Type AMPs: Ion Beam Machining (IBM) Dr. Neelesh K. Jain
Fig.6: Effects of Low and High Energies on Atom Removal. (After Spencer and Schmidt, 1972) (a) Low Energy (b) High Energy
Thermal Type AMPs: Ion Beam Machining (IBM) Dr. Neelesh K. Jain
Fig.-7: Variation of yield with ion energy (Spencer and Schmidt, 1972)
Thermal Type AMPs: Ion Beam Machining (IBM) Dr. Neelesh K. Jain
Applications
Smoothing Ion Beam texturing Ion beam Cleaning Shaping, polishing and thinning by IBM Ion milling Material Applications Fair: Al, Steel, Super alloys, Titanium, Refractory, Plastics and Glass Good: Ceramics
4) Widely used for: Cleaning Polishing glass Etching Micromachining Sputter deposition
Thermal Type AMPs: Ion Beam Machining (IBM)
-Removing surface contamination -Not to crystalline -Study of micro structure wire dies -Integrated circkt, bearings -Atomic deposition i.e. thin film deposition
Dr. Neelesh K. Jain
Advantages 1) Process is almost universal. 2) No chemical reagents etchants 3) No under cutting 4) Etching rates controllable Disadvantages
1) Relatively expensive 2) Slow etching rates 3) Little possibility of some thermal or reaction damage
[7] SUMMARY of PROCESS CAPABILITIES and OPERATIONAL Type Capability/Characteristics Finishing Surface Roughness [CLA in m] Capabilities Dimensional Tolerance or Accuracy [ m] Minimum Corner Radii (mm) Minimum Overcut (mm) Minimum Surface Damage Chemical Damage (m) Mechanical Damage Thermal Damage Drilling Hole Diameter (mm) Capabilities Aspect Ratio Hole Depth (mm) Minimum Taper (m /mm) Maximum No. of Holes that can be Drilled Simultaneously Minimum Angle of Inclination Hole Axis with Surface Cutting Width of Cut (mm) Capabilities Thickness of Cut (mm) Range of Cutting Rate (mm/min) Economic Initial Investment or Capital Cost Aspects Tooling and Fixtures Cost Power Consumption Cost Tool Consumption Cost Environmen Safety tal Aspects Toxicity Contamination of Machining Medium Thermal Type AMPs: Ion Beam Machining (IBM)
CHARACTERISTICS of IBM PROCESS Common Value/Range 0.2 0.8 50 125 2 m No No 0.005 m Fair for Micro-holes (d < 0.03 mm) and good for small holes (0.15 < d <0.3)
Good No Normal