Ansys Emag

ANSYS Release 9.
0 Multiphysics & Electromagnetics New Features

Paul Lethbridge Product Manager Rev 2
2004 ANSYS, Inc. ANSYS, Inc. Proprietary
ANSYS Workbench Electromagnetics
2004 ANSYS, Inc.
ANSYS, Inc. Proprietary
Contents
Workbench Electromagnetics
Workbench Emag Roadmap
Design Modeler
Enclosure Symmetry Winding Bodies Winding Tool
Simulation
2004 ANSYS, Inc.

LF Emag capability will be exposed over several release cycles: 3D Magnetostatics (9.0) 3D Electrostatics (10.0) 3D Current conduction Circuit elements Time transient & 2D Workbench v9.0 is the first release with electromagnetic analysis capability. Support solid and stranded (wound) conductors Automated computations of force, torque, inductance, and coil flux linkage. Easily set up simulations to compute results as a function of current, stroke, or rotor angle. Workbench Emag capability is mapped to & accessed via:
ANSYS Emag (stand alone or enabled task) ANSYS Multiphysics license keys.
Workbench Emag Markets

Target markets: Solenoid actuators Permanent magnet devices Sensors Rotating Electric machines
Synchronous machines DC machines Permanent magnet machines
2004 ANSYS, Inc.
Contents
Design Modeler
Enclosure Symmetry Winding bodies Winding Tool
Simulation
2004 ANSYS, Inc.
Enclosure Symmetry
Feature: The Enclosure feature now supports symmetry models when the enclosure shape is a box or a cylinder:
Up to 3 three symmetry planes can be specified.
Full or partial models can be included in the Enclosure. During the model transfer from DesignModeler to Simulation, the enclosure feature with symmetry planes forms two kinds of named selections: Open Domain Symmetry Plane
2004 ANSYS, Inc.
Contents
Design Modeler
Simulation
2004 ANSYS, Inc.
Winding Bodies & Tool

Feature: Design Modeler (DM) includes two new tools to allow a user to easily create current carrying coils: Winding Bodies: Used to represent wound coils for source excitation. The advantage of these bodies is that they are not 3D CAD objects, and hence simplify modeling/meshing of winding structures. Upon attach to Simulation, Winding Bodies are assigned as Conductor bodies. Winding Tool: Used to create more complex coils for motor windings. The Winding Tool uses a Worksheet table format to drive the creation of multiply connected Winding Bodies. Or a user can read in a text file created by MSExcel. Benefits: Very easy to use, rapid creation of coil windings.
2004 ANSYS, Inc.
Winding Bodies
Tangent orientation vector (blue arrow) defines direction of current. Winding cross-section displayed
A line body can be promoted to a winding body. Turns and cross-section (CS) dimensions are entered
Winding Tool
Complex coil windings may be created using the Winding Tool: The Winding Tool inserts a Winding# into the model tree. A Details view is used for geometric placement.
2004 ANSYS, Inc.
Winding Tool
Each Winding consists a number of related Winding Bodies. The related Winding Bodies are shown in the Parts/Bodies branch:
Winding Bodies
2004 ANSYS, Inc.
Winding Table File

Each Winding has a Winding Table File associated with it. The Winding Table File can be created directly in DM The Winding Table File can be exported to or imported from a text file. Each row corresponds to a created Winding Body
2004 ANSYS, Inc.
Winding Table File

The Winding Table File can be exported to or imported from a text file.
2004 ANSYS, Inc.
Winding Tool Example

Winding 1 highlighted with rotor
Complete DC Motor model
2004 ANSYS, Inc.
Winding Options
Coils may have different radii between IN & OUT slots Multiple coils may be stacked in the same slot
2004 ANSYS, Inc.
Winding Options - Skew

A skew angle may be identified for the coil winding slots Many motor designs employ a skewed coil form.
2004 ANSYS, Inc.
Winding Slot Clash Detection

Winding Tool automatically detects if the coil clashed with another part and warns the user
2004 ANSYS, Inc.
Contents
Design Modeler
Simulation
Tools Layout Winding bodies Material Properties Air Gap Mesh Sizing Conductors Solution
2004 ANSYS, Inc.
Simulation Tools Layout
Electromagnetic Toolbar Simulation Environment: Emag boundary conditions Conductor source excitation Solution Results Field Force Torque Inductance Flux linkage
2004 ANSYS, Inc.
Winding Body Transfer in Simulation

Winding bodies are automatically assigned to conductor bodies. From the Winding Tool, each Phase Winding is assigned as a unique conductor. In this example, Conductor A consists of 2 winding bodies.
2004 ANSYS, Inc.
Material Property Support

Both linear & nonlinear Emag materials are supported by Engineering Data: Soft materials (Steel, iron, etc.)
Constant (isotropic) Laminated (orthotropic) Linear/nonlinear (single B-H curve)
Hard materials (NdFeB, SmCo, Alnico)

Linear Nonlinear
2004 ANSYS, Inc.
Materials BH Curves
BH curves with up to 500 data points are supported
2004 ANSYS, Inc.
Materials - Permanent Magnets

Coordinate systems are used to align the polarization axis of a magnet. Cartesian and Radial Magnetization are supported.
2004 ANSYS, Inc.
Air Gap Mesh Sizing

Requirement: . In an electromagnetics analysis models typically include narrow gaps between parts such as rotors and stators. It is important to have a refined mesh in these gaps. Feature: Air Gap Mesh sizing. As for other mesh controls, air gaps are assigned under Advanced Controls in the Mesh Detail. Benefits: Easy to use mesh refinement, resulting in more accurate analysis results.
2004 ANSYS, Inc.
Air Gap Mesh Sizing
2004 ANSYS, Inc.
Conductor Objects
Conductor Objects identify conductors for excitation, inductance, and Post processing. Can be scoped to solid bodies (solid conductors), or Winding Bodies (wound coils)
Excitation: Supports voltage and current loading for solid conductors. Current and phase angle are supported for Winding Bodies.
2004 ANSYS, Inc.
Solution Results
2004 ANSYS, Inc.
Vector & Contour Plots
Vector / Contour is selected in the Solution objects Definition

Inductance & Flux Linkage

Solution branch can insert Inductance & Flux linkage post processing calculations. Self and mutual inductance is computed.
2004 ANSYS, Inc.
Parameter Sweeps
The Emag analysis can be fully parameterized so that a user can easily extract force or torque versus rotor position etc. An example will be available to demonstrate this shortly!
2004 ANSYS, Inc.
ANSYS Multiphysics
2004 ANSYS, Inc.
Contents
ANSYS Multiphysics
Thermoelectric Direct Coupled Field LF Electromagnetics HF Electromagnetics
2004 ANSYS, Inc.
Thermoelectric Analysis
Feature: New thermoelectric analysis option on the series 22X direct coupled-field elements includes:
Seebeck, Peltier, Thomson effects Transient electrical effects (capacitive damping)
Benefit: Addresses new thermoelectric applications where temperature stabilization, temperature cycling, compact or pinpoint cooling are required. Applicable to: PLANE223, SOLID226, SOLID227. Steady-state & transient analysis.
2004 ANSYS, Inc.
Thermoelectric Elements
PLANE223 Name 2-D 8-node SOLID226 3-D 20-node Coupled-field solid Geometry Product KEYOPT(1) DOFs-Reactions Material Properties Loads KEYOPT(3) 0 - Plane 1-Axisymmetric MP,PP,ED 110 (thermoelectric analysis) Temperature (TEMP) Heat flow (HEAT) Electric scalar potential (VOLT) - Electric current (AMPS) KXX, KYY, RSVX, RSVY, SBKX, SBKY, DENS, C, ENTH, PERX, PERY KZZ, RSVZ, SBKZ, PERZ SF: CONV, HFLUX, RDSF BF: HGEN SOLID227 3-D 10-node
2004 ANSYS, Inc.
Thermocouple example
Differential junction temperature results in a 42 mV potential difference
Material B
TC= 0 C TR= 25 C
Voltage distribution
TH= 100 C VS= 0.0425 V

Material A Material B
2004 ANSYS, Inc.
Peltier Cooler Example

10A current flow results in a 57oC temperature differential.
conductor
Iin= 10 A
Temperature distribution: Cold side T= -3 oC
n-type material (= -195Volt/ oC)
Iout
p-type material (=230Volt/ oC)
Hot side T= 54 oC
Markets and Applications

Example markets and applications for the thermoelectric analysis capability: Electronic and optical component cooling
CPU, photo-detectors, low noise amplifiers, laser diodes, fiber optics
Consumer products
Portable food/beverage coolers, automotive seat cooling/heating
Medical, laboratory and scientific equipment

Blood analyzers, thermal cycling devices (blood, lymph, DNA), portable insulin coolers, heart and eye surgery, hypothermia blankets
Military & Space

Night vision equipment, guidance systems, pilot suit temperature regulation
Indoor environmental devices

Conditioners, fans, humidifiers
2004 ANSYS, Inc.
Contents
ANSYS Multiphysics
Direct Coupled Field LF Electromagnetics
Electromagnetic forces & torque Conductance Matrix
HF Electromagnetics
2004 ANSYS, Inc.
Electromagnetic Force & Torque
Feature: New command and underlying numerical (Virtual Work force) calculation to summarize electromagnetic force and torque. Command: EMFT Benefit: Easier to use, faster, & more accurate.
Electric and magnetic methodology are now the same consistency.
Applicable to: SOLID117, PLANE121, SOLID122, SOLID123.

Electromagnetic Forces 2D
Electrostatic Forces, 2D MEMS comb drive example
Potential distribution
Electrostatic forces
2004 ANSYS, Inc.
Electromagnetic Forces 2D
MEMS comb drive example results:
Electrostatic Force (N)
2
Ft arg =
W N r 0V = x g
Driving (x)
Transverse (y)
Simplified analytical [1,2] (Ignores fringing effects) ANSYS (Maxwell Stress Tensor) ANSYS (New Virtual Work)
5.3110-9
0.0
3.5510-9
0.00610-9
5.6510-9
0.00510-9
REFERENCES 1. T.-C. H. Nguyen W.C. Tang and R.T. Howe. Laterally driven polysilicon resonant microstructures. Sensors and Actuators A, 20:2532, 1989. 2. M.W. Judy W.C. Tang, T.-C.H. Nguyen and R.T. Howe. Electrostatic-comb drive of lateral polysilicon resonators. Sensors and Actuators A, 21-23:328331, 1990.
Electromagnetic Forces- 3D
Concentric sphere verification benchmark:
Half symmetry problem description
Electrostatic forces
1/8th symmetry Potential distribution
2004 ANSYS, Inc.
Electromagnetic Forces- 3D
Concentric sphere results:
W 2 r 0V 2 Fa = = 2 a 1 21 a a b
2 r 0V 2 W = Fb = 2 b 1 2 1 b a b
Radial Electrostatic Force (N)
Fa (inner) 2.2310-6
Fb (outer) -0.5610-6
Analytical model ANSYS (Maxwell Stress Tensor) 1.5910-6 -0.7910-6
ANSYS (New Virtual Work)
2.2110-6
-0.5510-6
REFERENCES http://hyperphysics.phy-astr.gsu.edu/hbase/electric/capsph.html#c1
Electromagnetic forces 3D
TEAM20 Solenoid Benchmark Results:
Vertical (z-direction) force (N)
1000 A-turns Experimental (target) ANSYS (Old Virtual Work) ANSYS (New Virtual Work) 3000 A-turns 5000 A-turns
8.10 7.24 7.25
54.4 51.3 51.4
80.1 76.7 76.8
REFERENCES 1. M. Gyimesi, D. F. Ostergaard, Analysis of Benchmark Problem TEAM20 with Various Formulations, Proceedings of TEAM Workshop, COMPUMAG, Rio, 1997. 2. M. Gyimesi, D. F. Ostergaard, Mixed Shape Non-Conforming Edge Elements, IEEE Transactions on Magnetics, Vol. 35 No. 3, 1999, pp. 1407-1409. 3. M. Gyimesi, D. F. Ostergaard, Non-Conforming Hexahedral Edge Elements for Magnetic Analysis, IEEE Transactions on Magnetics, Vol 34 No. 5, 1998, pp. 2481-2484. See also new Verification Example: VM241.
Conductance Matrix
Feature: A new macro is now available to extract conductance from
multi-conductor systems. This macro, which is used much like the CMATRIX macro for capacitance, allows you to extract self and mutual conductance terms so that equivalent circuit lumped conductors can be defined for use in circuit simulators.
Command: GMATRIX Benefit: Provides improved lumped parameter connectivity with

circuit simulators. Combined with CMATRIX, and LMATRIX, a user can now extract L, C & G matrices for subsequent use circuit simulators.
Applicable to:
SOLID5,PLANE67,LINK68,SOLID69,SOLID98 PLANE230,SOLID231,SOLID232 Not available with Trefftz method.
2004 ANSYS, Inc.
Contents
ANSYS Multiphysics
Direct Coupled Field LF Electromagnetics HF Electromagnetics Frequency Selective Surfaces Lumped Circuits Fast Frequency Sweep VT SPICE sub-circuit extraction (Beta) Smith Charts Specific Absorption Rate (SAR) Multi-port Power Calculation
2004 ANSYS, Inc.
Frequency Selective Surfaces

Features: To compliment the Floquet periodic boundary condition (released at 8.1), a plane wave source port (via HFPORT) is now available to launch a plane wave for a scattering analysis of a periodic structure. Such a structure is commonly referred to as a Frequency Selective Surface (FSS). Radar Cross Section (RCS) results can be displayed and listed for 2D TE and TM incident plane waves (via PLHFFAR and PRHFFAR). FSS Reflection and transmission properties are calculated using the new FSSPARM macro. Benefit: A new capability introduced to address a growing market need to analyze FSS. Applicable to: HF119, HF120.(Hex, Tet, Wedge and Pyramid) & PML.
Incident Plane Wave
Periodic Structure
2004 ANSYS, Inc.
Frequency Selective Surfaces

FSS example: Plane wave incident at 45o
z =45
E-Field (x) Contours

y x =90
Far field pattern
2004 ANSYS, Inc.
Lumped HF Circuit Elements

Feature: HF Lumped RLC circuit elements. They are applied to the mid-nodes of element edges using the BF command. Benefit: A new capability that can be used to greatly simplify a HF analysis in a similar manner to our LF Emag circuit elements. The lumped circuit greatly reduces the number of DOFs. Application: Use to simulate passive devices like resistors, or to simplify a structure when fringe effects at discontinuities can be ignored. Applicable to: HF119, HF120 (Hex, Tet, Wedge and Pyramid).
Lumped RLC circuit model Microstrip line FEA Domain (Mesh)
Lumped HF Circuit Elements

Command: BF, <Node>, Lump, <value1> Six types of lumped circuits are available, value1 of the BF command is used to specify which : Complex impedance Shunt RCL circuit Series RL with shunt C Series RCL Series RC with shunt L Series LC with shunt R
2004 ANSYS, Inc.
SPICE Sub-circuit Extraction

Feature: SPICE Compatible Sub-circuit Extraction. Feature synthesizes an RLCG equivalent circuit for passive multi-port electromagnetic structure. Commands: SPICE Benefit: Ability to easily connect ANSYS to system level EDA circuit simulation tools for signal integrity applications. Allows ANSYS to start to address high frequency time domain analysis. Extracted circuit is SPICE compatible. Usage: SPICE sub circuit is extracted from S-parameter frequency sweep. Applicable to: HF119, HF120.(Hex, Tet, Wedge and Pyramid). S parameter extraction only.
9.0 BETA
SPICE Sub-circuit Extraction

Integrating ANSYS HF Emag into Signal Integrity Process Flow:
ANSYS Multiphysics
Parametric Geometry Creation
3rd Party EDA Signal Integrity tool suite
HF Emag solver
Design Rules
S-parameter sweep
Time Transient Waveforms
SPICE circuit extraction
SPICE simulation
9.0 BETA
Fast Frequency Sweep VT

Feature: The fast Frequency Sweep VT module has been enhanced using a perfect absorber. This provides a 20% faster solution than the original VT method. Commands: SPSWP, HROPT Benefit: Fast S-parameter calculations over a wide frequency range. Usage: Frequency Sweep VT is an additional charge module that can be added to ANSYS Multiphysics. Applicable to: HF119, HF120.(Hex, Tet, Wedge and Pyramid). S parameter extraction only.
1 0.8
|S11|
0.6
0.4
0.2
0 10 10.4 10.7 11.1 11.4 11.8 12.1 12.5 12.8 13.2 13.5 13.9 14.2 14.6 14.9 15.3 15.6 16 16.3 16.7 17 17.4 17.7 18.1 18.4 18.8 19.1 19.5 19.8
Frequency (GHz)
2004 ANSYS, Inc.
Smith Chart & Network Parameters

Features: Conversion of scattering (S), admittance (Y) or impedance (Z) parameters for display on a Smith Chart. Display the required network parameters and generate a new Touchstone file for the required parameter. Plot the required network parameters as the response of the frequency on an x-y graph. Commands: PLSCH, PLSYZ, PRSYZ Benefit: Ability to display results in formats that are widely accepted in the industry. Easier for RF engineers to understand ANSYS results! Applicable to: HF119, HF120.(Hex, Tet, Wedge and Pyramid).
2004 ANSYS, Inc.
Smith Chart & Network Parameters
2004 ANSYS, Inc.
Specific Absorption Rate (SAR)

Features: Specific Absorption Rate (SAR) Calculation for lossy materials. Can plot or list SAR distribution using ETABLE of ANSYS postprocessor. Commands: SAR is calculated when a mass density of the material is defined by the MP command. Results are stored in the HF119 and HF120 Item and Sequence Numbers Table. Benefit: Ability to compute SAR is an important capability required for primarily biomedical studies of effects of HF energy on living tissue. Applicable to: HF119, HF120.(Hex, Tet, Wedge and Pyramid).
2004 ANSYS, Inc.
Multi-Port Power Calculation

Feature: Power Calculation for Multi-port High-Frequency networks. Feature provides: Input/Output power at ports Dissipated power in multi-port system Power reflection/transmission coefficient Return loss and insertion loss at ports Command: HFPOWER Benefit: Ability to compute SAR is an important capability required for primarily biomedical studies of effects of HF energy on living tissue. Applicable to: HF119, HF120.(Hex, Tet, Wedge and Pyramid).
2004 ANSYS, Inc.
END
2004 ANSYS, Inc.

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ANSYS Release 9.

0 Multiphysics & Electromagnetics New Features

ANSYS Workbench Electromagnetics

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Workbench Emag Roadmap

Workbench Emag Markets

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Winding Bodies & Tool

2004 ANSYS, Inc.

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Winding Table File

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Winding Table File

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Winding Tool Example

Complete DC Motor model

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Winding Options - Skew

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Winding Slot Clash Detection

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Simulation Tools Layout

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Winding Body Transfer in Simulation

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Material Property Support

Hard materials (NdFeB, SmCo, Alnico)

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Materials - Permanent Magnets

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Air Gap Mesh Sizing

2004 ANSYS, Inc.

ANSYS, Inc. Proprietary

Air Gap Mesh Sizing

2004 ANSYS, Inc.