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1. General description
1.1 SmartMX family approach
The new CMOS14 SmartMX family members feature a modular set of devices with:
12 KB to 144 KB EEPROM 200 KB user ROM 6144 B RAM High-performance secured Public Key Infrastructure (PKI) coprocessor (RSA, ECC) Secured dual/triple-DES coprocessor Secured AES coprocessor Memory Management Unit (MMU) ISO/IEC 7816 contact interface Optional ISO/IEC 14443 A Contactless Interface Unit (CIU) Optional S2C interface for NFC communication link 5-metal-layer 0.14 m CMOS technology EEPROM with typical 500000 cycles endurance and minimum 20 years retention time Broad spectrum of delivery types Optional certied crypto library modules for RSA, ECC, DES, AES, SHA and PRNG
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
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Various algorithms
AES encryption and decryption using the AES coprocessor DES and Triple-DES encryption and decryption using the DES coprocessor RSA encryption and decryption, signature generation and verication for straightforward and CRT keys up to 5024 bits RSA key generation ECC over GF(p) signature generation and verication (ECDSA) and Dife-Hellman key exchange for keys up to 544 bits ECC over GF(p) key generation ECC over GF(2n) signature generation and verication (ECDSA) and Dife-Hellman key exchange for keys up to 571 bits ECC over GF(2n) key generation SHA-1, SHA-224 and SHA-256 hash algorithm Pseudo-Random Number Generator (PRNG)
Easy to use API for all algorithms Secure operation in contact as well as in the contactless mode Latest built-in security features to avoid power (SPA/DPA), timing and fault attacks
(DFA)
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Common criteria CC EAL5+ certication planned [except ECC over GF(2n)] according
to BSI-PP-0002 protection prole
2. Features
2.1 Standard family features
I EEPROM: choice of 12 KB, 20 KB, 40 KB, 72 KB, 80 KB or 144 KB N Data retention time: 20 years minimum N Endurance: 500000 cycles typical I ROM: 200 KB I RAM: 6144 B N 256 B IRAM + 3.25 KB standard RAM usable for CPU N 2560 B FXRAM usable for FameXE I Dedicated Secure_MX51 Smart Card CPU (Memory eXtended/enhanced 80C51) N 5-metal-layer 0.14 m CMOS technology N Operating in Contact and Contactless mode (dependent on family type option) N Featuring a 24-bit universal memory space, 24-bit program counter N Combined universal program and data linear address range up to 16 MB N Additional instructions to improve: - Pointer operations - Performance - Code density of both C and Java source code I ISO/IEC 7816 contact interface I PKI coprocessor FameXE I Support of major Public Key Cryptography (PKC) systems like RSA, Elgamel, DSS, Dife-Hellman, Guillou-Quisquater, Fiat-Shamir and Elliptic Curves N 8192 bits maximum key length for RSA with randomly chosen modulus N 4096 bits maximum key length for calculation within RAM N 32-bit interface N Boolean operations for acceleration of standard, symmetric cipher algorithms I High speed Triple-DES coprocessor (64-bit parallel processing DES engine) N Two or three keys loadable N DES3 performance < 40 s I High speed AES coprocessor (128-bit parallel processing AES engine) I Memory Management Unit (MMU) I Low power and low voltage design using NXP Semiconductors handshaking technology I Multiple source vectorized interrupt system with four priority levels I Watch exception provides software debugging facility I Multiple source RESET system I Two 16-bit timers I High reliable EEPROM for both data storage and program execution I Bytewise EEPROM programming and read access
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I Versatile EEPROM programming of 1 B to 64 B at a time or, optionally 1 B to 128 B at a time I Typical EEPROM page erasing time: 1.7 ms I Typical EEPROM page programming time: 1.0 ms N Power-saving Idle mode N Wake-up from Idle mode by RESET or any activated interrupt N Power-saving Sleep (power-down) mode or Clockstop mode N Wake-up from Sleep or Clockstop mode by RESET or external interrupt I Contact conguration and serial interface according to ISO/IEC 7816: GND, VDD, CLK, RST_N, IO1 I ISO/IEC 7816 UART supporting standard protocols T = 0 and T = 1 as well as high speed personalization up to 1 Mbit/s I External or internally generated congurable CPU clock I 1 MHz to 10 MHz operating external clock frequency range N Internal CPU clock up to 30 MHz with synchronous operation N Internal clocking independent of externally applied frequency I High speed 16-bit CRC engine according to ITU-T polynomial denition I Low power Random Number Generator (RNG) in hardware, AIS-31 compliant I 1.62 V to 5.5 V extended operating voltage range for class C, B and A I Optional extended Class B operation mode (targeted for battery supplied applications) I 25 C to +85 C ambient temperature I Broad spectrum of delivery types: N Wafers N Modules
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3. Applications
3.1 Application areas
I I I I I I Banking Java cards E-passports ID cards Secure access Trusted platform modules
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Unit V V V V
In case of extended Class B (Class BE) operation mode (targeted for battery supplied applications), the class C is not supported.
5. Ordering information
Table 3. Ordering information Package Name P5CC021UA P5CC040UA P5CC073UA P5CC080UA P5CC144UA P5CD012UA P5CD020UA P5CD040UA P5CD080UA P5CD144UA P5CN080UA P5CN144UA P5CD012UE P5CD020UE P5CD040UE P5CD080UE P5CD144UE P5CC021XS P5CC040XS P5CC073XS P5CC080XS P5CC144XS P5CD012X1 P5CD020X1 P5CD040X1 P5CD080X1 P5CD144X1
P5CX012_02X_40_73_80_144_FAM_SDS_3 NXP B.V. 2008. All rights reserved.
Type number
Description 8 inch wafer (sawn; 150 m thickness; on lm frame carrier; electronic fail die marking according to SECSII format)
Version <tbd>
FFC
FFC
8 inch wafer (sawn; 75 m thickness; on lm frame <tbd> carrier; electronic fail die marking according to SECSII format)
PCM1.1
SOT658
PDM1.1
SOT658
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Ordering information continued Package Name Description Version PDM1.1 contactless chip card module (super 35 mm format, SOT658 8-contact)
Table 3.
Type number P5CD012X0 P5CD020X0 P5CD040X0 P5CD080X0 P5CD144X0 P5CD012A4 P5CD020A4 P5CD040A4 P5CD080A4 P5CD144A4 P5CD012A6 P5CD020A6 P5CD040A6 P5CD080A6 P5CD144A6 Table 4. Product type P5CD012 P5CC021 P5CD020 P5CC040 P5CD040 P5CC073 P5CN080 P5CC080 P5CD080 P5CN144 P5CC144 P5CD144 Feature table EEPROM [KB] 12 20 20 40 40 72 80 80 80 144 144 144 User ROM [KB] 200 200 200 200 200 200 200 200 200 200 200 200 Total RAM [KB] 6 6 6 6 6 6 6 6 6 6 6 6
MOB4
SOT500-2
MOB6
SOT500-3
CXRAM [KB] 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5
FXRAM Coprocessor [KB] FameXE DES 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes
AES yes yes yes yes yes yes yes yes yes yes yes yes
ISO 7816 Interface option IO pads 3 3 3 3 3 3 3 3 3 2 3 3 dual interface contact dual interface contact dual interface contact contact + S2C interface for NFC contact dual interface contact + S2C interface for NFC contact dual interface
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Objective short data sheet Rev. 03 24 January 2008
NXP B.V. 2008. All rights reserved. P5CX012_02X_40_73_80_144_FAM_SDS_3
6. Functional diagram
NXP Semiconductors
ROM
EEPROM 20 KB/40 KB/ 72 KB/80 KB/ 144 KB DATA AND PROGRAM MEMORY
RAM
P5Cx012/02x/40/73/80/144 family
CLK
CLOCK FILTER
CLOCK GENERATION
SECURE_MX51 CPU
RST_N
TIMERS
AES COPROCESSOR
VDD
VSS
001aae954
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Objective short data sheet Rev. 03 24 January 2008
NXP B.V. 2008. All rights reserved. P5CX012_02X_40_73_80_144_FAM_SDS_3
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
CLK
CLOCK FILTER
CLOCK GENERATION
SECURE_MX51 CPU
RST_N
TIMERS
AES COPROCESSOR
VDD
VSS
001aae953
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Objective short data sheet Rev. 03 24 January 2008
NXP B.V. 2008. All rights reserved. P5CX012_02X_40_73_80_144_FAM_SDS_3
NXP Semiconductors
P5CN080 P5CN144
SIGIN S2C INTERFACE SIGOUT 200 KB PROGRAM MEMORY PROGRAMMABLE IO 1, 2 IO2 UART ISO 7816 CIU ISO 14443 ROM EEPROM 80 KB/ 144 KB DATA AND PROGRAM MEMORY RAM
IO1
P5Cx012/02x/40/73/80/144 family
CLK
CLOCK FILTER
CLOCK GENERATION
SECURE_MX51 CPU
RST_N
TIMERS
AES COPROCESSOR
VDD
VSS
001aae955
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7. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS (ground = 0 V). Symbol Parameter VDD VI II IO Ilu Vesd supply voltage input voltage input current output current latch-up current electrostatic discharge voltage any signal pad pad IO1, IO2 or IO3 pad IO1, IO2 or IO3 VI < 0 V or VI > VDD pads VDD, VSS, CLK, RST_N, IO1, IO2, IO3 pads LA, LB Ptot Tstg
[1] [2] [3]
[1]
Conditions
Unit V V mA mA mA kV
2.0 1 -
kV W
MIL Standard 883-D method 3015; human body model; C = 100 pF, R = 1.5 k; Tamb = 25 C to +85 C. Depending on appropriate thermal resistance of the package. Depending on delivery type, refer to NXP Semiconductors General Specication for 8 Wafer and to NXP Semiconductors Contact & Dual Interface Chip Card Module Specication.
8. Abbreviations
Table 6. Acronym AES API ASK CIU CRC CRT DES DFA DPA DSS ECC ECDSA EEPROM GF MAC MMU
P5CX012_02X_40_73_80_144_FAM_SDS_3
Abbreviations Description Advanced Encryption Standard Application Programming Interface Amplitude Shift Keying Contactless Interface Unit Cyclic Redundancy Check Chinese Remainder Theorem Digital Encryption Standard Differential Fault Analysis Differential Power Analysis Digital Signature Standard Elliptic Curve Cryptography Elliptic Curve Digital Signature Algorithm Electrically Erasable Programmable Read-Only Memory Galois Function Message Authentication Code Memory Management Unit
NXP B.V. 2008. All rights reserved.
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Abbreviations continued Description Near Field Communication Operating System Public Key Cryptography Public Key Infrastructure Pseudo-Random Number Generator Random Number Generator Rivest, Shamir and Adleman SigIn-SigOut-Connection Single Fault Injection Secure Hash Algorithm Surface Mounted Device Simple Power Analysis Trusted Platform Module Universal Asynchronous Receiver/Transmitter
Table 6. Acronym NFC OS PKC PKI PRNG RNG RSA S2C SFI SHA SMD SPA TPM UART
9. Revision history
Table 7. Revision history Release date 20080124 Data sheet status Objective short data sheet Change notice Supersedes P5CX02X_40_73_80_144_ FAM_SDS_2 Document ID P5CX012_02X_40_73_80_ 144_FAM_SDS_3 Modications:
Type number P5CD012 added Table 3 Ordering information corrected and new type number added Figure 2 added Objective short data sheet Objective short data sheet P5CX02X_40_80_144_FAM _SDS_1 -
P5CX02X_40_73_80_144_ FAM_SDS_2
20070424
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Denition This document contains data from the objective specication for product development. This document contains data from the preliminary specication. This document contains the product specication.
Please consult the most recently issued document before initiating or completing a design. The term short data sheet is explained in section Denitions. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
10.2 Denitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofce. In case of any inconsistency or conict with the short data sheet, the full data sheet shall prevail.
to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specied use without further testing or modication. Limiting values Stress above one or more limiting values (as dened in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/prole/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
10.3 Disclaimers
General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. MIFARE is a trademark of NXP B.V. FabKey is a trademark of NXP B.V.
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12. Tables
Table 1. Table 2. Table 3. Table 4. Naming conventions . . . . . . . . . . . . . . . . . . . . . .2 Quick reference data . . . . . . . . . . . . . . . . . . . . .9 Ordering information . . . . . . . . . . . . . . . . . . . . .9 Feature table . . . . . . . . . . . . . . . . . . . . . . . . . .10 Table 5. Table 6. Table 7. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
13. Figures
Fig 1. Functional diagram P5CC021/P5CC040/P5CC073/P5CC080/ P5CC144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Functional diagram P5CD012/P5CD020/P5CD040/P5CD080/ P5CD144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Functional diagram P5CN080/P5CN144 . . . . . . .13
Fig 2.
Fig 3.
continued >>
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14. Contents
1 1.1 1.2 1.3 1.4 1.4.1 1.4.2 1.4.3 1.5 1.5.1 1.5.2 1.5.3 1.6 1.7 1.8 2 2.1 2.2 2.3 2.4 3 3.1 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 13 14 General description . . . . . . . . . . . . . . . . . . . . . . 1 SmartMX family approach . . . . . . . . . . . . . . . . 1 SmartMX family properties . . . . . . . . . . . . . . . . 1 Naming conventions . . . . . . . . . . . . . . . . . . . . . 2 Cryptographic hardware coprocessors . . . . . . . 2 FameXE coprocessor . . . . . . . . . . . . . . . . . . . 2 Triple-DES coprocessor . . . . . . . . . . . . . . . . . . 2 AES coprocessor . . . . . . . . . . . . . . . . . . . . . . . 2 SmartMX interfaces . . . . . . . . . . . . . . . . . . . . . 3 SmartMX contact interface . . . . . . . . . . . . . . . . 3 SmartMX contactless interface . . . . . . . . . . . . 3 SmartMX S2C interface . . . . . . . . . . . . . . . . . . 3 Security features. . . . . . . . . . . . . . . . . . . . . . . . 4 Security evaluation and certicates . . . . . . . . . 4 Optional crypto library. . . . . . . . . . . . . . . . . . . . 4 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Standard family features . . . . . . . . . . . . . . . . . . 5 Product specic family features . . . . . . . . . . . . 6 Security features. . . . . . . . . . . . . . . . . . . . . . . . 7 Design-in support . . . . . . . . . . . . . . . . . . . . . . . 8 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Application areas . . . . . . . . . . . . . . . . . . . . . . . 8 Quick reference data . . . . . . . . . . . . . . . . . . . . . 9 Ordering information . . . . . . . . . . . . . . . . . . . . . 9 Functional diagram . . . . . . . . . . . . . . . . . . . . . 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 24 January 2008 Document identifier: P5CX012_02X_40_73_80_144_FAM_SDS_3