PD - 91477E

IRF3415
HEXFET Power MOSFET
l l l l l

Advanced Process Technology Dynamic dv/dt Rating 175C Operating Temperature Fast Switching Fully Avalanche Rated

VDSS = 150V RDS(on) = 0.042

G S

Description
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.

ID = 43A

TO-220AB

Absolute Maximum Ratings

Parameter
ID @ TC = 25C ID @ TC = 100C IDM PD @TC = 25C VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting torque, 6-32 or M3 srew

Max.
43 30 150 200 1.3 20 590 22 20 5.0 -55 to + 175 300 (1.6mm from case ) 10 lbfin (1.1Nm)

Units
A W W/C V mJ A mJ V/ns C

Thermal Resistance
Parameter
RJC RCS RJA Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient

Typ.
0.50

Max.
0.75 62

Units
C/W

01/25/05

IRF3415
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)DSS
V(BR)DSS/TJ

RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf LD LS Ciss Coss Crss

Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance Internal Source Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance

Typ. Max. Units Conditions V VGS = 0V, ID = 250A 0.17 V/C Reference to 25C, ID = 1mA 0.042 VGS = 10V, ID = 22A 4.0 V VDS = VGS, ID = 250A S VDS = 50V, ID = 22A 25 VDS = 150V, VGS = 0V A 250 VDS = 120V, VGS = 0V, TJ = 150C 100 VGS = 20V nA -100 VGS = -20V 200 ID = 22A 17 nC VDS = 120V 98 VGS = 10V, See Fig. 6 and 13 12 VDD = 75V 55 ID = 22A ns 71 RG = 2.5 69 RD = 3.3, See Fig. 10 D Between lead, 4.5 6mm (0.25in.) nH G from package 7.5 and center of die contact S 2400 VGS = 0V 640 pF VDS = 25V 340 = 1.0MHz, See Fig. 5

Min. 150 2.0 19

Source-Drain Ratings and Characteristics

IS
ISM

VSD trr Qrr

Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge

Min. Typ. Max. Units 260 2.2 43 A 150 1.3 390 3.3 V ns C

Conditions MOSFET symbol showing the G integral reverse p-n junction diode. TJ = 25C, IS = 22A, VGS = 0V TJ = 25C, IF = 22A di/dt = 100A/s

Notes:

Repetitive rating; pulse width limited by

max. junction temperature. ( See fig. 11 )

ISD 22A, di/dt 820A/s, VDD V(BR)DSS,

TJ 175C

VDD = 25V, starting TJ = 25C, L = 2.4mH

RG = 25, IAS = 22A. (See Figure 12)

Pulse width 300s; duty cycle 2%.

IRF3415
1000
VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.5V 5.0V BOTTOM 4.5V TOP

1000

I D , Drain-to-Source Current (A)

100

I D , Drain-to-Source Current (A)

VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.5V 5.0V BOTTOM 4.5V TOP

100

4.5V
20us PULSE WIDTH TJ = 25 oC
1 10 100

4.5V
20us PULSE WIDTH TJ = 175 o C
1 10 100

10

10

VDS , Drain-to-Source Voltage (V)

VDS , Drain-to-Source Voltage (V)

Fig 1. Typical Output Characteristics

Fig 2. Typical Output Characteristics

1000

3.0

RDS(on) , Drain-to-Source On Resistance (Normalized)

ID = 37A

I D , Drain-to-Source Current (A)

2.5

2.0

TJ = 25 C TJ = 175 C

100

1.5

1.0

0.5

10

V DS = 50V 20s PULSE WIDTH 4 5 6 7 8 9 10

0.0 -60 -40 -20 0

VGS = 10V
20 40 60 80 100 120 140 160 180

VGS , Gate-to-Source Voltage (V)

TJ , Junction Temperature (o C)

Fig 3. Typical Transfer Characteristics

Fig 4. Normalized On-Resistance Vs. Temperature

IRF3415
6000

5000

VGS , Gate-to-Source Voltage (V)

VGS = 0V, f = 1MHz Ciss = Cgs + Cgd , Cds SHORTED Crss = Cgd Coss = Cds + Cgd

20

ID = 22A

16

VDS = 120V VDS = 75V VDS = 30V

C, Capacitance (pF)

4000

3000

Ciss

12

2000

Coss Crss

1000

10

100

FOR TEST CIRCUIT SEE FIGURE 13

0 40 80 120 160 200

VDS , Drain-to-Source Voltage (V)

QG , Total Gate Charge (nC)

Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage

Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage

1000

1000

ISD , Reverse Drain Current (A)

OPERATION IN THIS AREA LIMITED BY RDS(on)

I D , Drain Current (A)

100

100

10us

TJ = 175 o C
10

100us 10

TJ = 25 o C
1

1ms

0.1 0.2

V GS = 0 V
0.6 1.0 1.4 1.8

TC = 25 o C TJ = 175 o C Single Pulse

1 10 100

10ms

1000

VSD ,Source-to-Drain Voltage (V)

VDS , Drain-to-Source Voltage (V)

Fig 7. Typical Source-Drain Diode Forward Voltage

Fig 8. Maximum Safe Operating Area

IRF3415
50

VDS VGS

RD

40

ID , Drain Current (A)

RG 10V
Pulse Width 1 s Duty Factor 0.1 %

D.U.T.
+

-VDD

30

20

Fig 10a. Switching Time Test Circuit

10

VDS 90%

25

50

75

100

125

150

175

TC , Case Temperature ( C)

Fig 9. Maximum Drain Current Vs. Case Temperature

10% VGS
td(on) tr t d(off) tf

Fig 10b. Switching Time Waveforms

Thermal Response (Z thJC )

D = 0.50

0.20 0.1 0.10 0.05 0.02 0.01 PDM t1 SINGLE PULSE (THERMAL RESPONSE) t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJC + TC 0.001 0.01 0.1 1

0.01 0.00001

0.0001

t1 , Rectangular Pulse Duration (sec)

Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case

IRF3415
EAS , Single Pulse Avalanche Energy (mJ)
1400 1200 1000 800 600 400 200 0

15V

ID 9.0A 16A BOTTOM 22A TOP

VDS

DRIVER

RG
20V

D.U.T
IAS tp

+ V - DD

0.01

Fig 12a. Unclamped Inductive Test Circuit

25

50

75

100

125

150

175

V(BR)DSS tp

Starting TJ , Junction Temperature o ( C)

Fig 12c. Maximum Avalanche Energy Vs. Drain Current

I AS

Fig 12b. Unclamped Inductive Waveforms

Current Regulator Same Type as D.U.T.

50K

QG

12V

.2F

.3F

10 V

QGS

QGD
VGS
3mA

D.U.T.

+ V - DS

VG

Charge

IG

ID

Current Sampling Resistors

Fig 13a. Basic Gate Charge Waveform

Fig 13b. Gate Charge Test Circuit

IRF3415
Peak Diode Recovery dv/dt Test Circuit
D.U.T

Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer

RG dv/dt controlled by RG Driver same type as D.U.T. ISD controlled by Duty Factor "D" D.U.T. - Device Under Test

+ VDD

Driver Gate Drive P.W. Period D=

P.W. Period VGS=10V

D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt

VDD

Re-Applied Voltage Inductor Curent

Body Diode

Forward Drop

Ripple 5%

ISD

* VGS = 5V for Logic Level Devices Fig 14. For N-Channel HEXFETS

IRF3415
TO-220AB Package Outline

TO-220AB Part Marking Information

E XAMP L E : T HIS IS AN IR F 1010 L OT CODE 1789 AS S E MB L E D ON WW 19, 1997 IN T HE AS S E MB L Y L INE "C" INT E R NAT IONAL R E CT IF IE R L OGO AS S E MB L Y L OT CODE PAR T NU MB E R

Note: "P" in assembly line position indicates "Lead-Free"

DAT E CODE YE AR 7 = 1997 WE E K 19 L INE C

TO-220AB package is not recommended for Surface Mount Application.

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. 01/05

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/