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DO NOT confuse or interchange the meanings of Thermal Energy, Temperature and Heat Transfer
Quantity Thermal Energy+ Meaning Energy associated with microscopic behavior of matter A means of indirectly assessing the amount of thermal energy stored in matter Symbol Units
Uu or
J or J/kg
Temperature
K or C
Heat Transfer
Thermal energy transport due to temperature gradients Amount of thermal energy transferred over a time interval t 0 Thermal energy transfer per unit time
Heat
J
W
W/m
2
Heat Rate
q
q
Heat Flux
Conduction: Heat transfer in a solid or a stationary fluid (gas or liquid) due to the random motion of its constituent atoms, molecules and /or electrons. Convection: Heat transfer due to the combined influence of bulk and random motion for fluid flow over a surface. Radiation: Energy that is emitted by matter due to changes in the electron configurations of its atoms or molecules and is transported as electromagnetic waves (or photons).
Conduction and convection require the presence of temperature variations in a material medium. Although radiation originates from matter, its transport does not require a material medium and occurs most efficiently in a vacuum.
qkT
Heat flux W/m 2 Thermal conductivity W/mK Temperature gradient C/m or K/m
Application to one-dimensional, steady conduction across a plane wall of constant thermal conductivity:
TT x 21 dxL qkk dT
TT x 12 L qk
(1.2)
qqA
xx
qhTT
(1.3a)
(1.6)
If surface dings net : qETGTT lux , the radiation isfrom due to the heatf exchange with the surroun
radsur 44 bss
(1.7)
(1.8)
(1.9)
qqqhTThTT
srs convradsur
(1.10)
Process Identification
Schematic:
Convection from room air to inner surface of first pane Net radiation exchange between room walls and inner surface of first pane Conduction through first pane Convection across airspace between panes Net radiation exchange between outer surface of first pane and inner surface of second pane (across airspace) Conduction through a second pane Convection from outer surface of single (or second) pane to ambient air Net radiation exchange between outer surface of single (or second) pane and surroundings such as the ground Incident solar radiation during day; fraction transmitted to room is smaller for double pane
Problem 1.40: Power dissipation from chips operating at a surface temperature of 85C and in an enclosure whose walls and air are at 25C for (a) free convection and (b) forced convection.
Schematic:
Assumptions: (1) Steady-state conditions, (2) Radiation exchange between a small surface and a large enclosure, (3) Negligible heat transfer from sides of chip or from back of chip by conduction through the substrate. Analysis:
Pqq
elecconvrad
hATTATT
ss sur 44
2-42 AL 0.015m2.2510m
(a) q If heat transfer is= by natural0.158W convection, 0.065W = elec rad -42-824444 conv 25/4-42 5/45/4 0.602.2510m5.6710W/mK358298K= 0.158W0.065W s P CATT 4.2W/mK2.2510m60K= 0.223W
(b) If heat transfer is by forced convection, qhATT 3.375W0.065W3.44W 250W/mK2.2510m60K3.375W P s elec conv 24-42