EMBEDDED CREATORS

PRODUCTS GUIDE

PR ODUCT S GUIDE

INDEX

Qseven
QuadMo747-Z5xx p.10 QuadMo747-EXTREME p.11 QuadMo747-E6xx p.12 QuadMo747-GSeries p.13 QuadMo747-x2000 p.14 QuadMo747-X/OMAP3 p.15 QuadMo747-X/i.MX51 p.16 QuadMo747-X/i.MX6 p.17 QuadMo747-X/T20 p.18 QuadMo747-X/T30 p.19 Cross Platform Development Kit p.23 Cross Platform Starter Kit p.24 SECOCQ7-pITX p.25 SECOCQ7-pITX-Xboard p.26 SECOCQ7-mITX2.0 p.27 SECOCQ7-micro p.28 SECOCQ7-MXM p.29 CARMA DevKit p.30 p.31 NVIDIA Kayla GPU DevKit

Qseven
Q7-OMAP5 p.20 Q7-T30 p.21 Q7-i.MX6 p.22

SBC
SECOnITX-ION p.53 SECOpITX-x2000 p.54 SECOSBC-i.MX6 p.55 SECOSBC-T30 p.56 SECOpITX-GX p.57

COM EXPRESS
SECOMExp-iCORE p.41 SECOMExp-iCore-XT p.42 SECOMExp-iCore/E4690 p.43 SECOMExp-ION p.44 SECOMExp-GSeries p.45 SECOMExp-RSeries p.46 SECOMExp-x2000 p.47 SECOCExp-mITX p.48

ETX 3.0 / XTX

SECOME-945/N270 p.61 SECOMX-945/N270 p.63 SECOCX-mITX p.64

Company
SECO, world-leading company in electronic embedded solutions, over its 30 years of experience has shown the ability to adapt its know-how to new, challenging customers needs, and to provide cutting edge solutions to its partners. On the strength of its know-how and in contrast with recent outsourcing policy, SECO has always set the entire production cycle in Italy, from the development stage to mass distribution. Thanks to new, innovative solutions and great research and design activities together with the partnership with major scientific Universities and worldwide leading companies, SECO went International becoming a global market-leading company providing solutions to modern challenges.

Milestones
1979 SECO Elettronica Snc is set up 1989 SECO introduces its first personal computers onto the Italian market, obtaining the BEST DESIGN award at the SMAU trade show, a success achieved also in 1999 with the introduction of the all-in-one Ellipse Personal Computer 1995 SECO founds PSM (Professional Surface Mounting), which becomes its production unit 2003 Thanks to the constant growth of PSM, the company moves into new facilities (2.000 sqm) and is ISO 9001:2000 certified 2004 While awaiting the introduction of the new RoHS, WEE and Green regulations, the company invests in a new SMT line for Lead Free production 2006 / 2007 SECO invests in a new premises (1.200 sqm) designed for the complete systems assembly by PSM 2008 SECO, congatec and MSC found the new embedded standard: Qseven and the Qseven Consortium 2009 SECO celebrates its 30th Anniversary with a new company logo 2010 SECO proposes some modifications to Qseven pinout, aimed at allowing the integration of the new features for ARM architecture 2011 At the Supercomputing Conference in Seattle (USA), the BSC (Barcelona Supercomputing Center) announces the first cluster in the world based on 256 ARM units, GPU-assisted, featuring a low power consumption HPC powered by SECO technology 2012 SECO Inc. in Boston (USA) is set up SECO is one of the founding members of SGET (Standardization Group for Embedded Technologies) SECO launches CARMA, the first energy-efficient platform for HPC in the world

Our Partners
Over the years, SECO has established and consolidated relationships with major international companies in the electronics industry as well as centers of excellence, universities and research institutes that support the companys direct and dynamic vision for continued research regarding to new technologies to be integrated with its increasingly complex projects.

Technological Partners
AMD Freescale Intel Microsoft Windows Embedded NVIDIA Samsung Texas Instruments

OS Supported
Microsoft Windows Embedded Linux Android

Consortium
SGET (Standardization Group for Embedded Technologies) Qseven Consortium PCI Industrial Computer Manufacturers Group (PICMG) PC/104 Consortium ETX Industrial Group XTX Consortium SFF-SIG HDMI Licensing SD Association

Areas of Application
Automation Automotive Avionics Biomedical Defence Digital signage - Infotainment Domotics Ehealth - Teleassistance Energy Gaming Handheld electronics Home entertainment Industrial Measuring instrument Robotics Surveillance Telco Transportation Wellness Wireless Technologies

Our Strategy
Advanced Innovation Development of High Performance Product Lines Power Consumption Reduction Focus on Quality and Reliability Maximum Integration Customization of Hardware, Firmware and Software Products Long Term and Highly Qualified Technical Support

Qseven STANDARD

Benefits: Module-Based Application Low Power Consumption Interchangeability Among Architectures Low Impact on OS Migration Upgradable Solutions Reduced Time to Market Fields of Application: Industrial: automation and monitoring Data acquisition Medical: data acquisition Portable devices Telecommunication Automotive - Transport: detection systems Retail Industry: point of sales and kiosks Multimedia HMI Gaming Digital Signage Qseven Compact & Cost Efficient Qseven standard has shown itself, as the most compact & cost efficient Computer On Module of the embedded market. The design flexibility of Qseven architecture is the same of the other COMs like ETX, XTX or COM Express: replacing the board it is possible to diversify the product range through the use of different architectures. Qseven standard features PCI Express,ExpressCard, Serial ATA, Secure Digital I/O interface, DisplayPort (or TMDS or SDVO) interfaces, USB 2.0, High Definition Digital Audio, LPC interface, Gigabit Ethernet, LVDS Display interface. All the signals arrive to the carrier through a 230 pins MXM connector. SECO provides complete system solutions with Qseven.

SECO is one of the founding members of SGET.

Qseven STANDARD Rev. 2.0 specification

Mechanic and Cooling Compact size Quadratic 7 cm (~2,76 x ~2,76) Rev. 2.0 allows for a microQseven Size 4 x 7 cm (~2,76 x 1,57) Solid mechanical mounting Cost efficient direct edge connector Rugged 1.2 mm PCB thickness Cooling interface Top edge defined for heat transfer Heat transfer from CPU, Chipset and DRAM enhanced via copper layers Heatspreader defined for high power versions (max. 12 W) MXM Connector MXM2 edge connector Multiple Sources Speedtech, Lotes, Aces and Yamaichi (automotive certified) 230 positions, .020 pitch, SMT 5.5 and 7.8 mm height versions Certified for rugged mobile applications and for high speed serial buses (PEG bus) Low cost connector 30 gold plated versions for industrial applications Automotive certified (Yamaichi)

Changes for Rev. 2.0 (Sep. 2012) Signals Added to Qseven Pinout 2x USB 3.0 4 Wire SDIO Bus on LPC I2S interface shared with HDA UART Interface eDP (embedded Display Port) shared with LVDS I2C clock on SM-Bus One-Wire-Bus

Updates MXM Connectors from Yamaichi (Automotive specified), Foxconn, Aces Shared DisplayPort HDMI hotplug detection

Qseven
QuadMo747-Z5xx
Highlights
Small and Powerful enough to enable Internet experience Power-efficient ideal for mobile devices Passive cooling for fan less applications Extensive connectivity for a turn-key legacy free solution

Computer on Module with Intel Atom Z5xx series US15W Chipset

Technical features
CPU Intel Atom Z5xx series 1.1 GHz and 1,6 GHz Chipset Intel System Controller Hub US15W DRAM Up to 1GB DDR2 400/533MHz CACHE 512KB L2 Graphic Interface integrated Intel GMA500 Graphic accelerator LVDS Single Channel 18/24 Bit LVDS Transmitter Resolution up to 1366 x 768 SDVO Interface PCI-e ports Up to 2 x PCI Express x 1 ports USB 8x USB 2.0 ports ETHERNET Gigabit Ethernet port (optional) SD I/O 1 x 8-bit interface + 1 x SD slot onboard Mass Storage Onboard Flash Disk up to 8GB 1 x S-ATA channel Audio HD Audio Interface Interface Buses I2C Bus LPC BUS for legacy peripherals SM Bus Power management signals Thermal cooling interface Power supply +5VDC 5% TDP Typical 5W with Intel Atom Z510 Dimensions 70x70 mm (2.76 x 2.76)

SSD SLOT on board

10

X86

Qseven
QuadMo747-EXTREME
Highlights
Full BOM certified for the Extended Temperature Range (-40C; +85C) Low power consumption module ideal for industrial, automotive, defense and security applications

Computer on Module with Intel Atom Z5xxPT series US15WPT Chipset, specifically designed for industrial temperature range

Technical features
Industrial Temperature Range, -40C +85C Bill of Material specifically selected for Industrial Temperature Range CPU Intel Atom Z510PT@ 1,1GHz Intel Atom Z520PT@ 1,33 GHz Chipset Intel SCH US15WPT DRAM up to 1GB DDR2 400/533MHz CACHE 512KB L2 Graphic Interface integrated Intel GMA500 Graphic accelerator LVDS Single Channel 18/24 Bit LVDS Transmitter Resolution up to 1366 x 768 SDVO interface PCI-e ports 1 x PCI Express x1 ports USB 8x USB 2.0 ports ETHERNET Gigabit Ethernet port (optional) SD I/O 1 x 4-bit interface Mass Storage Onboard Flash Disk up to 8GB 1 x S-ATA channel Audio HD Audio Interface Interface Buses I2C Bus LPC BUS for legacy peripherals SM Bus Power management signals Thermal cooling interface Power supply +5VDC 5% Dimensions 70x70 mm (2.76 x 2.76)

X86

11

Qseven
QuadMo747-E6xx
Highlights
Intel Atom Processor E6xx series & Intel EG20 Platform Controller Hub chipset Available with full BOM certified for the extended temperature range of -25C to +85C Integrated Intel 3D Graphic with 50% performance enhancement With CAN Bus

Computer on Module with Intel Atom E6xx series CPU+ EG20T Chipset

Technical features
CPU Intel Atom E620/E620T @ 600MHz, 3.3W TDP Intel Atom E640/E640T @ 1.0GHz 3.6W TDP Intel Atom E660/E660T @ 1.3GHz 3.6W TDP Intel Atom E680/E680T @ 1.6GHz 4.5W TDP Platform Controller Hub Intel PCH EG20T Memory up to 2GB DDR2 onboard Graphic Interface integrated Intel 2D and 3D graphic controller Dual independent display support MPEG2, MPEG4, H.264, DivX HW video decoding Display LVDS Single Channel 18/24 Bit interface SDVO Interface Maximum resolution 1280x768 on LVDS Maximum resolution 1920x1080 on SDVO PCI Express 2x PCI-E x1 lanes USB 6 x USB 2.0 ports + 1 x USB client Mass Storage Optional onboard SATA Flash Disk up to 32GB Up to 2 x S-ATA Channels 2 x Express Card interface ETHERNET Gigabit Ethernet Interface Audio HD Audio Interface SD / MMC / SDIO interface CAN BUS Interface Expansion Bus I2C, SM Bus, LPC, SPI FAN Management Interface Power management signals Power supply +5VDC AT/ATX mode Dimensions 70x70 mm (2.76 x 2.76)

12

X86

Qseven
QuadMo747-GSeries
Highlights
The AMD APU Architecture that combines a low power CPU and a discrete-level GPU into a single embedded Accelerated Processing Unit (APU) Single and Dual x86 cores up to 9W TDP HW decode support for H.264, VC-1, MPEG2, WMV, DivX, Adobe Flash Ideal for low power designes in embedded applications such as Digital Signage, xSTB, IP-TV,Thin Clients, Info Kiosks, POS, Gaming

Computer on Module with the new AMD Embedded G-Series Platform

Technical features
APU AMD T56N, Dual Core @ 1.65 GHz, TDP 18W AMD T40N, Dual Core @ 1.0 GHz, TDP 9W AMD T44R, Single Core @ 1.2 GHz, TDP 9W AMD T40E, Dual Core @ 1.0 GHz, TDP 6.4W AMD T40R, Single Core @ 1.0 GHz, TDP 5.5W AMD T16R, Single Core @615MHz, TDP 4.5W Controller Hub AMD A55E Controller Hub Memory Up to 4GB DDR3 / LVDDR3-1066 soldered onboard Graphics integrated AMD GPU Radeon: HD6320 - AMD T56N HD6290 - AMD T40N HD6250 - AMD T44R, T40E, T40R and T16R Dual display support DirectX 11, OpenGL 4.0, OpenCL 1.1 supported Display Single/Dual Channel 18/24 Bit LVDS Interface HDMI interface Additional VGA Interface Max Resolutions: LVDS Interface, up to 1920x1200 HDMI, up to 1920x1200 VGA, up to 1920x1200 (up to 2048x1536 with T56N) Mass Storage 2 x external S-ATA channels SATA Flash Disk soldered onboard, up to 32GB SD Memory Card interface USB 8x USB 2.0 ports PCI-e ports 4 x PCI Express x1 ports (groupable up to 1 x PCI-e x4) 2 x Express Card Interface ETHERNET Gigabit Ethernet port Audio HD Audio Interface Interface Bus I2C Bus LPC BUS for legacy peripherals SM Bus Thermal / FAN management Power supply +5VDC 5% and +5VSB (optional) Dimensions 70x70 mm (2.76 x 2.76)

X86

13

Qseven
QuadMo747-x2000
Highlights
Qseven Rel. 2.0 compliant Based on the new Intel Atom Cedar View dual core N2000 and D2000 CPU families at a 64-bit instruction set and Hyper Threading for an impressive performance/power consumption ratio Up to 4GB DDR3/LPDDR3 RAM Multi video interfaces: HDMI/DisplayPort; LVDS; embedded DP; VGA (opt. external adapter)

Qseven Rel. 2.0 Compliant Module with Intel Atom Cedar View family Processors and Intel NM10 Express Chipset

Technical features
CPU Intel Atom D2550 @1.86GHz, 1MB Cache, 10W TDP Intel Atom N2800 @1.86GHz, 1MB Cache, 6.5W TDP Intel Atom N2600 @1.6GHz, 1MB Cache, 3.5W TDP Chipset Intel NM10 Express Chipset Memory up to 4GB DDR3 / LPDDR3 1066MHz Soldered onboard (up to 2GB with N2600) Graphics Integrated Intel HD Graphics controller Dual independent display support Video interfaces HDMI or Display Port interface 18/24 bit single channel LVDS interface (18bit with N2xxx CPUs) Embedded Display Port (eDP) interface Additional VGA interface (optional external adapter is required) Resolutions N2xxx CPUs D2550CPU HDMI & CRT Up to 19200x1200 Up to 1920x1200 LVDS interface Up to 1366x768 Up to 1440x900 Display Port Up to 1600x1200 Up to 2560x1600 eDP Up to 1366x768 Up to 1920x1080 Mass Storage Up to 2 x external S-ATA channels Optional SATA Flash Disk soldered on board, up to 128GB Optional SD / SDI/O Interface USB Up to 8 x USB 2.0 ports Ethernet Gigabit Ethernet interface Audio HD Audio Interface PCI-express 3 x PCI-e x1 ports Interface Bus I2C Bus LPC BUS SM Bus Thermal / FAN management Optional UART Interface Optional SPI interface FAN connector Dimensions 70 x 70 mm (2,76 x 2,76)

14

X86

Qseven
QuadMo747-X/OMAP3
Highlights
Very low power consumption 3D graphics acceleration to support display and gaming effects Ideal for multimedia devices Available in Extended Temperature Version

Computer on Module based on the Texas Instruments OMAP 37xx Family

Technical features
Applications Processor Texas Instruments OMAP 37xx Family AM3703 (Cortex A8, up to 1 GHz core) DM3730 (Cortex A8, up to 1GHz core + PowerVR SGX Graphics Accelerator + Up to 800MHz TMS320C64x+ DSP Core) Memory Mobile DDR 128 / 256MB / 512 MB onboard Flash Disk 256 MB / 512MB / 1GB NAND Flash eMMC soldered onboard up to 16GB LVDS Single/Dual Channel 18/24 Bit resolution up to 1366 x 768 ETHERNET 10/100 Base-T interface USB 1x USB OTG 2x USB 2.0 Host SERIAL PORTS 2 x COM ports CAN interface MMC/HC MMC/SD/SDHC/SDIO interface Audio AC97 Audio Interface Video Input Port / Camera Connector LPC Bus SM Bus SPI interface I2C bus JTAG Temperature 0C +70C (commercial version) -40C +85C (industrial version) Dimensions 70x70 mm (2.76 x 2.76) Compliant to Qseven Specifications Rel.1.20

OMAP 3 Processors
TM

ARM

15

Qseven
QuadMo747-X/i.MX51
Highlights

Computer on Module based on the Freescale i.MX51 Family

Design approved for Motor Sport Applications Hardware acceleration enables very low power consumption for video and graphics High level of integration reduces overall system BOM Very high-performance processing and multimedia capabilities Available in Extreme Version

Technical features
Applications Processor Freescale i.MX51 Family: Freescale i.MX513 @ 800MHz Freescale i.MX515 @ 800MHz, with OpenGL ES 2.0 3D graphics accelerator and OpenVG 1.1 2D graphics accelerator integrated Memory DDR2 256 MB / 512MB onboard Mass Storage Up to 4GB NAND Flash eMMC soldered onboard MMC / SD / SDHC / SDIO interface SD Card Slot onboard VIDEO LVDS Single/Dual Channel 18/24 Bit interface DVI Single Link interface (optional) resolution up to 1600 x 1200 ETHERNET 10/100 Base-T interface USB 1x USB OTG 4x USB 2.0 Host SERIAL PORTS 2 x COM ports CAN interface (optional) Audio AC97 / I2S Audio Interface Video Input Port / Camera Connector 4-Wire Touch Screen Interface LPC Bus SM Bus SPI / One Wire interface I2C bus Integrated Security Features (i.MX515 only) Temperature 0C +70C (commercial version) -40C +85C (industrial version) Dimensions 70x70 mm (2.76 x 2.76) Compliant to Qseven Specifications Rel.1.20

i.MX51

16

ARM

Qseven
Highlights

QuadMo747-X/i.MX6

Computer on Module with Freescale i.MX6 Processor

The first scalable multi-core ARM Cortex-A9 architecture in Qseven standard modular solution Combines and emphasizes high-graphics performance with power-efficient processing capabilities OpenGL (FULL) and OpenES 2.0 3D Graphics and up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S) Flexible solution enables multi-display platforms to mobile fanless applications Available full BOM in Industrial Temperature range (-40C; +85C)

Technical features
Processor Freescale i.MX6 Family, based on ARM Cortex-A9 processors: Single core (i.MX6S) up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clock Memory up to 4GB DDR3 onboard (up to 2GB with i.MX6S) Graphics integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL ES2.0 3D and OpenVG (OpenVG accelerator only available with i.MX6D and with i.MX6Q) Supports up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S) HDMI interface 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interface Resolution LVDS, up to 1920x1200 HDMI, up to 1080p Mass Storage 1 x SATA interface (only with i.MX6D and i.MX6Q) eMMC soldered onboard MMC/SD/SDIO interface 1 x SD card slot onboard PCI-Express 1 x PCI-Express x1 lane USB 1x USB OTG 4x USB 2.0 Host Ethernet Gigabit Ethernet interface Audio AC97 Audio Interface Video Input Port / Camera Connector Serial ports 2 x serial ports CAN Bus interface Interfaces LPC BUS for legacy peripherals SM Bus SPI I2C bus Also available in industrial temperature range, -40C +85C Dimensions 70x70 mm (2.76 x 2.76)

i.MX6Dual/ 6Quad

ARM

17

Qseven
QuadMo747-X/T20
Highlights

Computer on Module with NVIDIA Tegra T20 Processor

Dual Core System on Chip for Mobile Devices Ideal for Web Browsing and Video HD applications Support for Flash Technology High performance 3D acceleration with high framerates

Technical features
Qseven Standard Features
Processor NVIDIA Tegra T290 w/ Dual ARM CORTEX -A9 MPCore CPU, 1.0GHz per core Memory up to 1GB DDR2 onboard Graphic Interface embedded NVIDIA ULP GeForce GPU Integrated High Definition Audio-Video Processor Display LVDS Single/Dual Channel 18/24 Bit interface HDMI Interface Video Resolution Up to 1080p on HDMI Up to 1680 x 1050 on LVDS PCI Express 2x PCI-E x1 lanes (Relaxed Ordering Mode only) USB 6 x USB 2.0 ports Mass Storage On board IDE Flash Disk up to 2GB eMMC, up to 16GB, soldered onboard 2 x S-ATA Channels ETHERNET 10/100 Mbps Ethernet Interface Audio AC 97 Audio Interface MMC / SDIO interface 4 bit SD/MMC interface Expansion Bus I2C, SM Bus, LPC, SPI CAN Bus Interface Thermal Cooling Interface Power management signals Power supply +5VDC AT/ATX mode Dimensions 70x70 mm (2.76 x 2.76)

QuadMo747-X/T20 Specific Features

Video Input Port / Camera Connector One-Wire Interface JTAG interface Serial ports 2x RS-232 ports

18

ARM

Qseven
QuadMo747-X/T30
Highlights
A Quad-Core ARM Cortex-A9 Low Power CPU for powerful graphics and Extreme Multitasking Graphics engine powered by the 12 cores-ULP GeForce GPU with Dedicated Processors for 1080p Video Playback Capable of reproducing High Resolution 3D Videos

Computer on Module with NVIDIA Tegra T30 Processor

Technical features
NVIDIA Tegra T30 w/ Quad ARM CORTEX -A9 MPCore CPU, 1.3 GHz per core Memory up to 2GB DDR3L onboard Graphic Interface embedded NVIDIA ULP GeForce GPU Integrated High Definition Audio-Video Processor Display LVDS Single/Dual Channel 18/24 Bit interface HDMI 1.4a Interface Video Resolution Up to 1080p on HDMI Up to 1920 x 1080 on LVDS PCI Express 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with support for 2 x PCI-e x 1 devices) USB 6 x USB 2.0 ports Mass Storage eMMC, up to 32GB, soldered onboard 1 x S-ATA Channels microSD Slot onboard 4 bit SD/MMC interface ETHERNET Gigabit Ethernet Interface Audio HD Audio Interface Expansion Bus I2C, SM Bus, LPC, SPI Serial ports 2 serial ports (Tx, Rx signals) CAN Bus Interface

Processor

Video Input Port / Camera Connector One Wire Interface Thermal Cooling Interface Power management signals +5VDC AT/ATX mode Power supply Dimensions 70x70 mm (2.76 x 2.76)

ARM

19

Qseven
Q7-OMAP5
Highlights
ARM Cortex-A15-based module in Qseven standard Energy-efficient architecture in only 7x4 cm (2.76x1.57) Able to drive multiple displays in HD resolution Dedicated graphics cores and integrated DSP @ 466 MHz

Qseven Rel. 2.0 Compliant Module with Texas Instruments OMAP 5 Processor

Technical features
Applications Processor Texas Instruments OMAP5430 processor: 2x ARM Cortex-A15 MPCore, up to 1.7GHz per core for symmetric multiprocessing + 2x ARM CortexM4 cores for low-power offload and real-time responsiveness Memory up to 2GB LPDDR2 PoP Integrated Graphics Image signal processor (ISP) IVA HD video accelerator miniC64x DSP core @ 466MHz PowerVR SGX544-MP2 3D graphics Supports up to three independent displays Video interfaces HDMI interface, resolution up to 1080p60 18/24 bit single/dual channel LVDS interface Mass Storage eMMC soldered onboard 2 x SD/MMC interfaces SATA interface USB 1x USB OTG LS/FS/HS/SS (USB 3.0) 2x USB 2.0 host Networking 10/100Mbps Ethernet interface WiFi 802.11 b/g/n Bluetooth 2.1 Audio I2S / AC97 Audio Interface Serial ports 2 x serial ports 1 x CAN Bus port Camera interface Dedicated connector for serial/parallel camera Other interfaces SPI 2 x I2C bus 3 x PWM Channels 1 x Capture input GPIO Qseven Power management Compliant 40x70 mm (Qseven, 1.57 x 2.76) Dimensions

OMAP 5 Processors
TM

20

ARM

Qseven
Q7-T30
Highlights
Qseven module based on the Tegra 3 SoC, for an energy-efficient and cost effective solution in only 7x4 cm (2.76x1.57) Quad-Core ARM Cortex-A9 Low Power CPU for powerful graphics and extreme multitasking in mobile applications Graphics engine powered by the 12 cores-ULP GeForce GPU with Dedicated Processors for 1080p Video Playback Capable of reproducing high res. 3D Video Designed for digital signage applications

Qseven Rel. 2.0 Compliant Module with NVIDIA Tegra T30 Processor

Technical features
Processor NVIDIA Tegra T30 w/ Quad ARM Cortex-A9 MPCore CPU, 1.3 GHz per core Memory up to 1GB DDR3L onboard Integrated Graphics embedded NVIDIA ULP GeForce GPU Integrated High Definition Audio-Video Processor Video interfaces LVDS Single/Dual Channel 18/24 Bit interface HDMI interface DSI interface Resolution up to 1080p on HDMI up to 1600x1200 on LVDS Mass Storage eMMC, up to 16GB, soldered onboard 2 x SD/SDIO/MMC 4-bit interface SATA interface USB 3 x USB 2.0 host PCI Express 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with support for 2 x PCI-e x 1 devices) Networking Gigabit Ethernet Interface Audio HD Audio Interface Serial ports 2 x serial ports Other interfaces SPI I2C bus 2 x PWM Channels SM Bus Qseven Power management Compliant 40x70 mm (Qseven, 1.57 x 2.76 ) Dimensions

ARM

21

Qseven
Highlights

Qseven Rel. 2.0 Compliant Module with Freescale i.MX6 Processor

Q7-i.MX6

Qseven module based on the ARM Cortex-A9 i.MX6 SoC, a fully scalable solution from a high performance Quad Core CPU to an energy-efficient and cost-effective Solo Core solution OpenGL/ES 2.0 3D Graphics and up to 4 independent displays A flexible solution, suitable for high end, multi display solutions as well as energy-saving smart portable devices Available full BOM in Industrial Temperature range (-40C; +85C)

Technical features
Processor Freescale i.MX6 Family, based on ARM Cortex-A9 processors: Single core (i.MX6S) up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clock Memory up to 2GB DDR3 onboard (up to 1GB with i.MX6S) Graphics Integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL ES2.0 3D and OpenVG (OpenVG accelerator only available with i.MX6D and with i.MX6Q) Supports up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S) HDMI interface 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interface Resolution LVDS, up to 1920x1200 HDMI, up to 1080p Mass Storage 1 x SATA interface (only with i.MX6D and i.MX6Q) eMMC soldered onboard 2 x MMC/SD/SDIO interface PCI-Express 1 x PCI-Express x1 lane USB 1x USB OTG 4x USB 2.0 Host Ethernet Gigabit Ethernet interface Audio I2S / AC97 Audio Interface Serial ports 2 x serial ports CAN Bus interface Interfaces SM Bus SPI I2C bus Dimensions 40x70 mm (Qseven, 1.57 x 2.76)

i.MX6Dual/ 6Quad

22

ARM

DEVELOPMENT KIT

Qseven

Cross Platform Development Kit

Development kit for Qseven philosophy, compatible with both x86 and ARM Qseven modules. Compliant to Qseven specifications rel. 1.20

Highlights
Qseven development board with a wide range of interfaces Available with complete BOM and schematics

Technical features of SECOCQ7-Xboard

The Chameleon Philosophy

Schematics

BOM

Design Review

DEVELOPMENT KIT CONTENTS

The Development kit contains the following material: Cross Platform Carrier Board LVDS Display (7 - 800x480 and/or 10 1024x768, at choice) 4-wire T/S, already assembled on LCD display LVDS to TTL 24-bit display converter TTL to RS-232 Transceiver board 19VDC Notebook Power Adapter, with Power Cords for connection to EU CEE 7/16, US NEMA 1-15, UK BS 1363A, JP JIS8303 FFC cable for interconnection of Cross Platform Carrier Board to ARM Qseven module camera connector USB 2.0 Plug A Plug mini B for USB client connection Connection cables for adapter boards included in the kit Connection cable for LVDS display 4-Wire Touch Screen cable adapter Since the Cross Platform can be used with any SECO Qseven CPU Module, the Development Kit DOESNT CONTAIN any Qseven module. The module has to be purchased separately.

Supported Modules All Qseven CPU Modules Expansion Slots 1 x PCI Express x 1 Slot miniPCI express Slot Gigabit Ethernet Interface Mass Storage 2 x S-ATA connectors Hard Disk Power Connector 2 x SD/MMC slots SDI/O Internal Header I/O 6 x USB 2.0 standard A connector USB Client connector 4 x Serial Ports (2 x DB-9 standard RS-232, 2 x TTL interface) 1 x CAN Interface 4 x GPI/O 3x 4 / 5 Wire T/S interfaces (I2C, SPI and USB controller directly onboard) Internal FPGA, with possibility of defining up to 64 User I/Os JTAG connection LPC Bus interface SPI interface I2C applications included: EEPROM, Light Sensor, I/O Extender, SIM Card slot A/D Converter Audio Triple Audio Jack 2 x S/P-DIF connectors (In & Out) AC97 and HD Audio Codecs integrated, jumper selectable Direct Digital Audio Interface Video VGA DB-15HD + DVI-D Single Link connector LVDS LCD and Backlight connector, with voltage selection Video Camera Interface, NTSC/PAL/SECAM video decoder integrated Power +5VDC/+12VDC for Desktop application, +19VDC for Notebook-like application Smart Battery Management Li-ION Single Cell Battery Management FAN 3 pin Header, +5/+12V configurable with Tachometric signal Temperature Operating: 0 +60C Storage: -20 +80C Dimensions 270 x 170 mm (10,63 x 6,69)

23

Qseven

DEVELOPMENT KIT

Cross Platform Starter Kit

Carrier Board for Qseven QuadMo747 modules on picoITX Form Factor
The Chameleon Philosophy

Technical features of SECOCQ7-pITX-Xboard

Supported Modules All Qseven Rel.1.20 Embedded Computer Modules Expansion Slots 1 x miniPCI Express slot SIM Card slot for miniPCI Express modems Mass Storage 1 x S-ATA connector SD Card Slot I/O Up to 7x USB ports (1 x USB client) 1 x Gigabit/FastEthernet connector 1 x optional additional FastEthernet port 8 x GPIO on 10-Pin Header Connector 1 x RS-232 (RS-422 / RS-485 configurable) 1 x TTL-level serial port CAN Interface 4-Wire Touch Screen controller integrated SM Bus Pin Header I2C Bus, SPI interface Audio AC97 and HD Audio Codec, jumper selectable Line In, Mic In on internal pin headers Earphone pin header Video LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header HDMI Connector CMOS Battery On Board rechargeable Lithium Battery for CMOS Backup and RTC
Power 12V Power jack Internal Pin Header for Power, Lid, Sleep and Reset Button Power On Status LED Temperature Operating: 0 +60C Available in extreme version, -40C +85C Dimensions 100 x 72 mm (3,94 x 2,83) Qseven specifications rel.1.20 compliant

Schematics BOM Design Review

CROSS PLATFORM STARTER KIT CONTAINS: 1x SECOCQ7-pITX-Xboard 1x Notebook Power Adapter, with power cord and adapters for use in Europe, UK, USA and Japan 1x TTL to RS-232 serial converter Connection cables Quick start guide The Development Kit DOES NOT CONTAIN any Qseven module. The module has to be purchased separately.

24

CARRIER BOARD

Qseven
Highlights
Pico ITX standard form factor Qseven carrier board Optimized for x86 modules SDVO to VGA output

Carrier Board for Qseven QuadMo747 modules on picoITX Form Factor

SECOCQ7-pITX

Technical features
Expansion Slots 1 x miniPCI Express (alternative to 1GbE) Mass Storage interface 1 x S-ATA connectors 1 x SD Card Slot I/O 2 x Double USB on the Front Panel 1 x USB Client on the Front Panel 1 x USB internal 2 x GbE on Front Panel (1 alternative to miniPCI Express Slot) 2 x Serial Ports (1 x RS232 full modem, RS-485 configurable, 1x TX/RX signals at TTL level) 9 x GPIO on 10 Pin Header Connector Audio Line In Mic In on 8 Pin Connector Hearphone on 5pin Header Speaker on 5pin Header Video Analog VGA on 12 Pin Header LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header CMOS Battery On Board Lithium Battery for CMOS Backup and RTC Smart Battery Connector Power 12V Power jack 5 Pin Header for Power and Reset Button Optional 12V Micro- Fit jack Temperature Operating: 0 +60C Storage: -20 +80C Dimensions 100 x 72 mm (3,94 x 2,83)

25

Qseven

CARRIER BOARD

Carrier Board for Qseven QuadMo747 modules on picoITX Form Factor

SECOCQ7-pITX-Xboard

Highlights
Pico ITX standard form factor Qseven carrier board Cross Platform (ARM and x86) compatibility Also available in industrial temperature range

Technical features
Expansion Slots 1 x miniPCI Express slot SIM Card slot for miniPCI Express modems Mass Storage 1 x S-ATA connector SD Card Slot I/O Up to 7x USB ports (1 x USB client) 1 x Gigabit/FastEthernet connector 1 x optional additional FastEthernet port 8 x GPIO on 10-Pin Header Connector 1 x RS-232 (RS-422 / RS-485 configurable) 1 x TTL-level serial port CAN Interface 4-Wire Touch Screen controller integrated SM Bus Pin Header I2C Bus, SPI interface Audio AC97 and HD Audio Codec, jumper selectable Line In, Mic In on internal pin headers Earphone pin header Video LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header HDMI Connector CMOS Battery On Board rechargeable Lithium Battery for CMOS Backup and RTC Power 12V Power jack Internal Pin Header for Power, Lid, Sleep and Reset Button Power On Status LED Temperature Operating: 0 +60C Available in extreme version, -40C +85C Dimensions 100 x 72 mm (3,94 x 2,83) Qseven specifications rel. 1.20 compliant

The Chameleon Philosophy

B901
SECOCQ7-pITX-Xboard is available also as boxed solution

26

CARRIER BOARD

Qseven
Highlights
Mini ITX standard form factor Qseven Rev.2.0 carrier board PCI Express x4 connector USB 3.0

mini-ITX form factor Carrier Board for Qseven modules Rel. 2.0 compliant

SECOCQ7-mITX2.0

Technical features
Compliant to Qseven Specifications rel. 2.0 Mass Storage 1 x S-ATA connector 1 x mSATA slot 1 x SD/MMC/SDIO Card Slot Video 1 x Dual Channel 24 bit LVDS / Dual embedded Display port (eDP) connector Backlight Connector 8-pin socket for external DID EEPROM 1 x HDMI connector Audio HD Audio Codec Standard triple audio Stereo Jack S/P-DIF Out 3 Pin Header for Digital Audio Internal Pin Header for I2S Audio interface Internal Pin Header for 2nd Line In + 2nd Mic In USB 2 x USB 2.0 ports + 1 x USB 3.0 port on the front side Factory options: 1 additional USB 3.0 port on front side or 1 x USB Client on front side + 2 x USB 2.0 internal ports PCI Express PCI Express x4 interface on PCI-e x16 slot Ethernet 1 x Gigabit Ethernet RJ-45 connector Serial ports 1 x RS-232 DB-9 male connector 1 x CAN Bus DB-9 connector I/O SPI and LPC internal connectors 1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Thermal Management, Watch Dog) I2C EEPROM Socket Camera Interface connectors CMOS Battery On Board Lithium Battery for CMOS Backup and RTC Power ATX Standard power Connector (AT mode config.) FAN 3 pin Header, with fan speed control, +12V or +5V Temperature Operating: 0 +60C Storage: -20 +80C Dimensions 170 x 170 mm (6,7 x 6,7)

27

Qseven

CARRIER BOARD

SECOCQ7-micro

Highlights
Qseven Rel.2.0 compliant carrier board optimized for Qseven modules Extremely small and cost effective micro Optional Wi-Fi module

Micro carrier Board Rel. 2.0 compliant for Qseven modules

Technical features
Supported Modules Qseven Embedded Computer Modules Mass Storage 1 x S-ATA connector SATA Power 2-pin connector SD Card Slot I/O: Up to 4x USB ports (1 x USB client) Optional WiFI module 1 x Gigabit/FastEthernet connector 1 x RS-232 Serial port I2C Bus Audio Audio interface pin header Video LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header HDMI Connector CMOS Battery Internal connector for cabled rechargeable Lithium Battery for CMOS Backup and RTC Power 12V Power jack Internal Pin Header for Power, Sleep and Reset Button Power On Status LED Temperature Operating: 0 +60C Dimensions 90 x 50 mm (3,54 x 1,97) Qseven specifications rel. 2.0 compliant

28

CARRIER BOARD

Qseven
Highlights
Cross Platform (ARM and x86) compatibility MXM 3.0 connector for mobile GPUs Multi display outputs (3x HDMI; 1x LVDS)

The Qseven Carrier Board SECOCQ7-MXM is the only Carrier Board available in the market able to expand the capabilities offered by Qseven CPU modules with advanced graphical performances given by MXM Graphic cards.

SECOCQ7-MXM

Technical features
Qseven Modules offering HDMI and PCI Express x 4 / x1 interfaces MXM 3.0 compliant Graphic cards, both Type A and Type B 1 x S-ATA connector SD Card Slot PCI-e x4 link between MXM 3.0 and Q7 modules Video HDMI connection from Qseven module Dual HDMI connection derived from Display Ports #A and #C of MXM Graphic Cards LVDS connection from Qseven module Ethernet 1 Ethernet port directly managed by Qseven CPU module 1 x optional embedded PCI-e Gigabit Ethernet controller on the Carrier Board USB 2 x USB 2.0 standard ports Internal Pin header for 2 additional USB 2.0 ports 1 USB On-The Go port Audio Embedded AC97 or HD Audio Codec CMOS Battery On Board Lithium Battery for CMOS Backup and RTC Power 19VDC Power input Temperature Operating: 0 +60C Dimensions 200 x 140 mm (7.87 x 5.51) Supported Modules Mass Storage interface

29

CARMA DevKit
CARMA DevKit

SOFTWARE DEVELOPMENT KIT

The CUDA on ARM DevKit, codename CARMA, is a GPU computing development kit created to support the growing demand for energy-efficient computing initiatives around the world. Powered by an NVIDIA Tegra 3 quad-core ARM-based processor and an NVIDIA CUDA-enabled GPU, the CARMA DevKit supports energy-efficient HPC projects using ARM-based GPU computing.
CARMA specs:

Energy-efficient Tegra 3 quad-core ARM A9 processor with 2 GB processor memory NVIDIA Quadro 1000M GPU with 96 CUDA cores and 2GB DDR3 memory 270 single precision GFlops performance 4x PCIe Gen1 link connecting processor to GPU 1 Gigabit Ethernet network support Direct attach storage support with SATA port HDMI USB ports

PACKAGE CONTENT QuadMo747-X/T30- Qseven 1.2 specs module, NVIDIA TEGRA 3 with 2 GB RAM and 4GB eMMC NVIDIA Quadro 1000M CARMA carrier board Power supply Cable kit

30

SOFTWARE DEVELOPMENT KIT

Qseven

NVIDIA Kayla GPU DevKit

SECO mITX GPU DevKit (P/N SECO_mITX_GPU_DEVKIT)

NVIDIA Tegra 3 SoC on Qseven provided in a standard PC form factor, supporting NVIDIA Graphics Drivers and CUDA 5.0 Toolkit

PRODUCT SPECS:
Energy-efficient Tegra 3 quadcore A9 processor with 2 GB processor memory x16 PCIe mechanical connector (x4 electrical) 1 Gbps Ethernet network support Direct attach storage support with SATA port HDMI USB Ports Camera Interface Connectors ATX Standard Power connector (AT mode)

PACKAGE CONTENT QuadMo747-X/T30 - Qseven v1.2 module, NVIDIA Tegra 3 with 2 GB RAM and 4 GB eMMC SECO mITX Carrier Board Cable Kit

31

32

Technical features
QuadMo747-Z5xx QuadMo747-EXTREME QuadMo747-E6xx

Qseven

CPU Intel Atom Z5xx series 1.1 GHz and 1,6 GHz Chipset Intel System Controller Hub US15W DRAM Up to 1GB DDR2 400/533MHz CACHE 512KB L2 Graphic Interface integrated Intel GMA500 Graphic accelerator LVDS Single Channel 18/24 Bit LVDS Transmitter Resolution up to 1366 x 768 SDVO Interface PCI-e ports Up to 2 x PCI Express x 1 ports USB 8x USB 2.0 ports ETHERNET Gigabit Ethernet port (optional) SD I/O 1 x 8-bit interface + 1 x SD slot onboard Mass Storage Onboard Flash Disk up to 8GB 1 x S-ATA channel Audio HD Audio Interface Interface Buses I2C Bus LPC BUS for legacy peripherals SM Bus Power management signals Thermal cooling interface Power supply +5VDC 5% TDP Typical 5W with Intel Atom Z510 Dimensions 70x70 mm (2.76 x 2.76)

Industrial Temperature Range, -40C +85C Bill of Material specifically selected for Industrial Temperature Range CPU Intel Atom Z510PT@ 1,1GHz Intel Atom Z520PT@ 1,33 GHz Chipset Intel SCH US15WPT DRAM up to 1GB DDR2 400/533MHz CACHE 512KB L2 Graphic Interface integrated Intel GMA500 Graphic accelerator LVDS Single Channel 18/24 Bit LVDS Transmitter Resolution up to 1366 x 768 SDVO interface PCI-e ports 1 x PCI Express x1 ports USB 8x USB 2.0 ports ETHERNET Gigabit Ethernet port (optional) SD I/O 1 x 4-bit interface Mass Storage Onboard Flash Disk up to 8GB 1 x S-ATA channel Audio HD Audio Interface Interface Buses I2C Bus LPC BUS for legacy peripherals SM Bus Power management signals Thermal cooling interface Power supply +5VDC 5% Dimensions 70x70 mm (2.76 x 2.76)

CPU Intel Atom E620/E620T @ 600MHz, 3.3W TDP Intel Atom E640/E640T @ 1.0GHz 3.6W TDP Intel Atom E660/E660T @ 1.3GHz 3.6W TDP Intel Atom E680/E680T @ 1.6GHz 4.5W TDP Platform Controller Hub Intel PCH EG20T Memory up to 2GB DDR2 onboard Graphic Interface integrated Intel 2D and 3D graphic controller Dual independent display support MPEG2, MPEG4, H.264, DivX HW video decoding Display LVDS Single Channel 18/24 Bit interface SDVO Interface Maximum resolution 1280x768 on LVDS Maximum resolution 1920x1080 on SDVO PCI Express 2x PCI-E x1 lanes USB 6 x USB 2.0 ports + 1 x USB client Mass Storage Optional onboard SATA Flash Disk up to 32GB Up to 2 x S-ATA Channels 2 x Express Card interface ETHERNET Gigabit Ethernet Interface Audio HD Audio Interface SD / MMC / SDIO interface CAN BUS Interface Expansion Bus I2C, SM Bus, LPC, SPI FAN Management Interface Power management signals Power supply +5VDC AT/ATX mode Dimensions 70x70 mm (2.76 x 2.76)

X86

33

Qseven

Technical features
QuadMo747-GSeries QuadMo747-x2000

APU AMD T56N, Dual Core @ 1.65 GHz, TDP 18W AMD T40N, Dual Core @ 1.0 GHz, TDP 9W AMD T44R, Single Core @ 1.2 GHz, TDP 9W AMD T40E, Dual Core @ 1.0 GHz, TDP 6.4W AMD T40R, Single Core @ 1.0 GHz, TDP 5.5W AMD T16R, Single Core @615MHz, TDP 4.5W Controller Hub AMD A55E Controller Hub Memory Up to 2GB DDR3 / LVDDR3-1066 soldered onboard Graphics integrated AMD GPU Radeon: HD6320 - AMD T56N HD6290 - AMD T40N HD6250 - AMD T44R, T40E, T40R and T16R Dual display support DirectX 11, OpenGL 4.0, OpenCL 1.1 supported Display Single/Dual Channel 18/24 Bit LVDS Interface HDMI interface Additional VGA Interface Max Resolutions: LVDS Interface, up to 1920x1200 HDMI, up to 1920x1200 VGA, up to 1920x1200 (up to 2048x1536 with T56N) Mass Storage 2 x external S-ATA channels SATA Flash Disk soldered onboard, up to 32GB SD Memory Card interface USB 8x USB 2.0 ports PCI-e ports 4 x PCI Express x1 ports (groupable up to 1 x PCI-e x4) 2 x Express Card Interface ETHERNET Gigabit Ethernet port Audio HD Audio Interface Interface Bus I2C Bus LPC BUS for legacy peripherals SM Bus Thermal / FAN management Power supply +5VDC 5% and +5VSB (optional) Dimensions 70x70 mm (2.76 x 2.76)

CPU Intel Atom D2550 @1.86GHz, 1MB Cache, 10W TDP Intel Atom N2800 @1.86GHz, 1MB Cache, 6.5W TDP Intel Atom N2600 @1.6GHz, 1MB Cache, 3.5W TDP Chipset Intel NM10 Express Chipset Memory up to 4GB DDR3 / LPDDR3 1066MHz Soldered onboard (up to 2GB with N2600) Graphics Integrated Intel HD Graphics controller Dual independent display support Video interfaces HDMI or Display Port interface 18/24 bit single channel LVDS interface (18bit with N2xxx CPUs) Embedded Display Port (eDP) interface Additional VGA interface (optional external adapter is required) Resolutions N2xxx CPUs D2550CPU HDMI & CRT Up to 19200x1200 Up to 1920x1200 LVDS interface Up to 1366x768 Up to 1440x900 Display Port Up to 1600x1200 Up to 2560x1600 eDP Up to 1366x768 Up to 1920x1080 Mass Storage Up to 2 x external S-ATA channels Optional SATA Flash Disk soldered on board, up to 128GB Optional SD / SDI/O Interface USB Up to 8 x USB 2.0 ports Ethernet Gigabit Ethernet interface Audio HD Audio Interface PCI-express 3 x PCI-e x1 ports Interface Bus I2C Bus LPC BUS SM Bus Thermal / FAN management Optional UART Interface Optional SPI interface FAN connector Dimensions 70 x 70 mm (2,76 x 2,76)

34

X86

Technical features
QuadMo747-X/OMAP3 QuadMo747-X/i.MX51 QuadMo747-X/i.MX6

Qseven

OMAP 3 Processors
TM

i.MX51

i.MX6Dual/ 6Quad

Applications Processor Texas Instruments OMAP 37xx Family AM3703 (Cortex A8 up to 1 GHz core) DM3730 (Cortex A8, up to 1GHz core + PowerVR SGX Graphics Accelerator + Up to 800MHz TMS320C64x+ DSP Core) Memory Mobile DDR 128 / 256MB / 512 MB onboard Flash Disk 256 MB / 512MB / 1GB NAND Flash eMMC soldered onboard up to 16GB LVDS Single/Dual Channel 18/24 Bit resolution up to 1366 x 768 ETHERNET 10/100 Base-T interface USB 1x USB OTG 2x USB 2.0 Host SERIAL PORTS 2 x COM ports CAN interface MMC/HC MMC/SD/SDHC/SDIO interface Audio AC97 Audio Interface Video Input Port / Camera Connector LPC Bus SM Bus SPI interface I2C bus JTAG Temperature 0C +70C (commercial version) -40C +85C (industrial version) Dimensions 70x70 mm (2.76 x 2.76) Compliant to Qseven Specifications Rel.1.20

Processor Freescale i.MX6 Family, based on ARM Cortex-A9 processors: Applications Processor Freescale i.MX51 Family: Single core (i.MX6S) up to 1GHz Freescale i.MX513 @ 800MHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Freescale i.MX515 @ 800MHz, with Quad Core (i.MX6Q) up to 1.2GHz clock OpenGL ES 2.0 3D graphics accelerator Memory up to 4GB DDR3 onboard (up to 2GB with i.MX6S) and OpenVG 1.1 2D graphics accelerator integrated Graphics integrated graphics, each processor provides up to 3 separated Memory DDR2 256 MB / 512MB onboard accelerators for 2D, OpenGL ES2.0 3D and OpenVG Mass Storage Up to 4GB NAND Flash (OpenVG accelerator only available with i.MX6D and with i.MX6Q) eMMC soldered onboard Supports up to 4 independent displays (only up to 2 displays with MMC / SD / SDHC / SDIO interface i.MX6DL and i.MX6S) SD Card Slot onboard HDMI interface VIDEO LVDS Single/Dual Channel 18/24 Bit interface 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interface DVI Single Link interface (optional) Resolution LVDS, up to 1920x1200 resolution up to 1600 x 1200 HDMI, up to 1080p ETHERNET 10/100 Base-T interface Mass Storage 1 x SATA interface (only with i.MX6D and i.MX6Q) USB 1x USB OTG eMMC soldered onboard 4x USB 2.0 Host MMC/SD/SDIO interface SERIAL PORTS 2 x COM ports 1 x SD card slot onboard CAN interface (optional) PCI-Express 1 x PCI-Express x1 lane Audio AC97 / I2S Audio Interface USB 1x USB OTG Video Input Port / Camera Connector 4x USB 2.0 Host 4-Wire Touch Screen Interface Ethernet Gigabit Ethernet interface LPC Bus Audio AC97 Audio Interface SM Bus Video Input Port / Camera Connector SPI / One Wire interface Serial ports 2 x serial ports I2C bus CAN Bus interface Integrated Security Features (i.MX515 only) Interfaces LPC BUS for legacy peripherals Temperature 0C +70C (commercial version) SM Bus -40C +85C (industrial version) SPI Dimensions 70x70 mm (2.76 x 2.76) I2C bus Compliant to Qseven Specifications Rel.1.20 Also available in industrial temperature range, -40C +85C Dimensions 70x70 mm (2.76 x 2.76)

ARM

35

Qseven

Technical features
QuadMo747-X/T20 QuadMo747-X/T30

Qseven Standard Features

Processor NVIDIA Tegra T290 w/ Dual ARM CORTEX -A9 MPCore CPU, 1.0GHz per core Memory up to 1GB DDR2 onboard Graphic Interface embedded NVIDIA ULP GeForce GPU Integrated High Definition Audio-Video Processor Display LVDS Single/Dual Channel 18/24 Bit interface HDMI Interface Video Resolution Up to 1080p on HDMI Up to 1680 x 1050 on LVDS PCI Express 2x PCI-E x1 lanes (Relaxed Ordering Mode only) USB 6 x USB 2.0 ports Mass Storage On board IDE Flash Disk up to 2GB eMMC, up to 16GB, soldered onboard 2 x S-ATA Channels ETHERNET 10/100 Mbps Ethernet Interface Audio AC 97 Audio Interface MMC / SDIO interface 4 bit SD/MMC interface Expansion Bus I2C, SM Bus, LPC, SPI CAN Bus Interface Thermal Cooling Interface Power management signals Power supply +5VDC AT/ATX mode Dimensions 70x70 mm (2.76 x 2.76)

NVIDIA Tegra T30 w/ Quad ARM CORTEX -A9 MPCore CPU, 1.3 GHz per core Memory up to 2GB DDR3L onboard Graphic Interface embedded NVIDIA ULP GeForce GPU Integrated High Definition Audio-Video Processor Display LVDS Single/Dual Channel 18/24 Bit interface HDMI 1.4a Interface Video Resolution Up to 1080p on HDMI Up to 1920 x 1080 on LVDS PCI Express 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with support for 2 x PCI-e x 1 devices) USB 6 x USB 2.0 ports Mass Storage eMMC, up to 32GB, soldered onboard 1 x S-ATA Channels microSD Slot onboard 4 bit SD/MMC interface ETHERNET Gigabit Ethernet Interface Audio HD Audio Interface Expansion Bus I2C, SM Bus, LPC, SPI Serial ports 2 serial ports (Tx, Rx signals) CAN Bus Interface

Processor

QuadMo747-X/T20 Specific Features

Video Input Port / Camera Connector One-Wire Interface JTAG interface Serial ports 2x RS-232 ports

Video Input Port / Camera Connector One Wire Interface Thermal Cooling Interface Power management signals +5VDC AT/ATX mode Power supply Dimensions 70x70 mm (2.76 x 2.76)

36

ARM

Technical features
Q7-OMAP5 Q7-T30 Q7-i.MX6

Qseven

OMAP 5 Processors
TM

i.MX6Dual/ 6Quad

Applications Processor Texas Instruments OMAP5430 processor: 2x ARM Cortex-A15 MPCore, up to 1.7GHz per core for symmetric multiprocessing + 2x ARM CortexM4 cores for low-power offload and real-time responsiveness Memory up to 2GB LPDDR2 PoP Integrated Graphics Image signal processor (ISP) IVA HD video accelerator miniC64x DSP core @ 466MHz PowerVR SGX544-MP2 3D graphics Supports up to three independent displays Video interfaces HDMI interface, resolution up to 1080p60 18/24 bit single/dual channel LVDS interface Mass Storage eMMC soldered onboard 2 x SD/MMC interfaces SATA interface USB 1x USB OTG LS/FS/HS/SS (USB 3.0) 2x USB 2.0 host Networking 10/100Mbps Ethernet interface WiFi 802.11 b/g/n Bluetooth 2.1 Audio I2S / AC97 Audio Interface Serial ports 2 x serial ports 1 x CAN Bus port Camera interface Dedicated connector for serial/parallel camera Other interfaces SPI 2 x I2C bus 3 x PWM Channels 1 x Capture input GPIO Qseven Power management Compliant 40x70 mm (Qseven, 1.57 x 2.76) Dimensions

NVIDIA Tegra T30 w/ Quad ARM Cortex-A9 MPCore CPU, 1.3 GHz per core Memory up to 1GB DDR3L onboard Integrated Graphics embedded NVIDIA ULP GeForce GPU Integrated High Definition Audio-VideoProcessor Video interfaces LVDS Single/Dual Channel 18/24 Bit interface HDMI interface DSI interface Resolution up to 1080p on HDMI up to 1600x1200 on LVDS Mass Storage eMMC, up to 16GB, soldered onboard 2 x SD/SDIO/MMC 4-bit interface SATA interface USB 3 x USB 2.0 host PCI Express 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with support for 2 x PCI-e x 1 devices) Networking Gigabit Ethernet Interface Audio HD Audio Interface Serial ports 2 x serial ports Other interfaces SPI I2C bus 2 x PWM Channels SM Bus
Processor

Qseven Power management Compliant Dimensions 40x70 mm (Qseven, 1.57 x 2.76)

Processor Freescale i.MX6 Family, based on ARM Cortex-A9 processors: Single core (i.MX6S) up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clock Memory up to 2GB DDR3 onboard (up to 1GB with i.MX6S) Graphics Integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL ES2.0 3D and OpenVG (OpenVG accelerator only available with i.MX6D and with i.MX6Q) Supports up to 4 independent displays (only up to 2 displays with i.MX6DL and i.MX6S) HDMI interface 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interface Resolution LVDS, up to 1920x1200 HDMI, up to 1080p Mass Storage 1 x SATA interface (only with i.MX6D and i.MX6Q) eMMC soldered onboard 2 x MMC/SD/SDIO interface PCI-Express 1 x PCI-Express x1 lane USB 1x USB OTG 4x USB 2.0 Host Ethernet Gigabit Ethernet interface Audio I2S / AC97 Audio Interface Serial ports 2 x serial ports CAN Bus interface Interfaces SM Bus SPI I2C bus Dimensions 40x70 mm (Qseven, 1.57 x 2.76)

ARM

37

Qseven

Technical features

SECOCQ7-Xboard
CARRIER BOARD

SECOCQ7-pITX
CARRIER BOARD

SECOCQ7-pITX-Xboard
CARRIER BOARD

Supported Modules All Qseven CPU Modules Expansion Slots 1 x PCI Express x 1 Slot miniPCI express Slot Gigabit Ethernet Interface Mass Storage 2 x S-ATA connectors Hard Disk Power Connector 2 x SD/MMC slots SDI/O Internal Header I/O 6 x USB 2.0 standard A connector USB Client connector 4 x Serial Ports (2 x DB-9 standard RS-232, 2 x TTL interface) 1 x CAN Interface 4 x GPI/O 3x 4 / 5 Wire T/S interfaces (I2C, SPI and USB controller directly onboard) Internal FPGA, with possibility of defining up to 64 User I/Os JTAG connection LPC Bus interface SPI interface I2C applications included: EEPROM, Light Sensor, I/O Extender, SIM Card slot A/D Converter Audio Triple Audio Jack 2 x S/P-DIF connectors (In & Out) AC97 and HD Audio Codecs integrated, jumper selectable Direct Digital Audio Interface Video VGA DB-15HD + DVI-D Single Link connector LVDS LCD and Backlight connector, with voltage selection Video Camera Interface, NTSC/PAL/SECAM video decoder integrated Power +5VDC/+12VDC for Desktop application, +19VDC for Notebook-like application Smart Battery Management Li-ION Single Cell Battery Management FAN 3 pin Header, +5/+12V configurable with Tachometric signal Temperature Operating: 0 +60C Storage: -20 +80C Dimensions 270 x 170 mm (10,63 x 6,69)

Expansion Slots 1 x miniPCI Express (alternative to 1GbE) Mass Storage interface 1 x S-ATA connectors 1 x SD Card Slot I/O 2 x Double USB on the Front Panel 1 x USB Client on the Front Panel 1 x USB internal 2 x GbE on Front Panel (1 alternative to miniPCI Express Slot) 2 x Serial Ports (1 x RS232 full modem, RS-485 configurable, 1x TX/RX signals at TTL level) 9 x GPIO on 10 Pin Header Connector Audio Line In Mic In on 8 Pin Connector Hearphone on 5pin Header Speaker on 5pin Header Video Analog VGA on 12 Pin Header LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header CMOS Battery On Board Lithium Battery for CMOS Backup and RTC Smart Battery Connector Power 12V Power jack 5 Pin Header for Power and Reset Button Optional 12V Micro- Fit jack Temperature Operating: 0 +60C Storage: -20 +80C Dimensions 100 x 72 mm (3,94 x 2,83)

Expansion Slots 1 x miniPCI Express slot SIM Card slot for miniPCI Express modems Mass Storage 1 x S-ATA connector SD Card Slot I/O Up to 7x USB ports (1 x USB client) 1 x Gigabit/FastEthernet connector 1 x optional additional FastEthernet port 8 x GPIO on 10-Pin Header Connector 1 x RS-232 (RS-422 / RS-485 configurable) 1 x TTL-level serial port CAN Interface 4-Wire Touch Screen controller integrated SM Bus Pin Header I2C Bus, SPI interface Audio AC97 and HD Audio Codec, jumper selectable Line In, Mic In on internal pin headers Earphone pin header Video LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header HDMI Connector CMOS Battery On Board rechargeable Lithium Battery for CMOS Backup and RTC Power 12V Power jack Internal Pin Header for Power, Lid, Sleep and Reset Button Power On Status LED Temperature Operating: 0 +60C Available in extreme version, -40C +85C Dimensions 100 x 72 mm (3,94 x 2,83) Qseven specifications rel. 1.20 compliant

38

Technical features

Qseven

SECOCQ7-mITX2.0
CARRIER BOARD

SECOCQ7-micro
CARRIER BOARD

SECOCQ7-MXM
CARRIER BOARD

Compliant to Qseven Specifications rel. 2.0 Mass Storage 1 x S-ATA connector 1 x mSATA slot 1 x SD/MMC/SDIO Card Slot Video 1 x Dual Channel 24 bit LVDS / Dual embedded Display port (eDP) connector Backlight Connector 8-pin socket for external DID EEPROM 1 x HDMI connector Audio HD Audio Codec Standard triple audio Stereo Jack S/P-DIF Out 3 Pin Header for Digital Audio Internal Pin Header for I2S Audio interface Internal Pin Header for 2nd Line In + 2nd Mic In USB 2 x USB 2.0 ports + 1 x USB 3.0 port on the front side Factory options: 1 additional USB 3.0 port on front side or 1 x USB Client on front side + 2 x USB 2.0 internal ports PCI Express PCI Express x4 interface on PCI-e x16 slot Ethernet 1 x Gigabit Ethernet RJ-45 connector Serial ports 1 x RS-232 DB-9 male connector 1 x CAN Bus DB-9 connector I/O SPI and LPC internal connectors 1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Thermal Management, Watch Dog) I2C EEPROM Socket Camera Interface connectors CMOS Battery On Board Lithium Battery for CMOS Backup and RTC Power ATX Standard power Connector (AT mode config.) FAN 3 pin Header, with fan speed control, +12V or +5V Temperature Operating: 0 +60C Storage: -20 +80C Dimensions 170 x 170 mm (6,7 x 6,7)

Supported Modules Qseven Embedded Computer Modules Mass Storage 1 x S-ATA connector SATA Power 2-pin connector SD Card Slot I/O: Up to 4x USB ports (1 x USB client) Optional WiFI module 1 x Gigabit/FastEthernet connector 1 x RS-232 Serial port I2C Bus Audio Audio interface pin header Video LVDS Interface, 34 pin 2mm pin header Backlight Connector, 6 pin, 2mm Pin Header HDMI Connector CMOS Battery Internal connector for cabled rechargeable Lithium Battery for CMOS Backup and RTC Power 12V Power jack Internal Pin Header for Power, Sleep and Reset Button Power On Status LED Temperature Operating: 0 +60C Dimensions 90 x 50 mm (3,54 x 1,97) Qseven specifications rel. 2.0 compliant

Supported Modules Qseven Modules offering HDMI and PCI Express x 4 / x1 interfaces MXM 3.0 compliant Graphic cards, both Type A and Type B Mass Storage interface 1 x S-ATA connector SD Card Slot PCI-e x4 link between MXM 3.0 and Q7 modules Video HDMI connection from Qseven module Dual HDMI connection derived from Display Ports #A and #C of MXM Graphic Cards LVDS connection from Qseven module Ethernet 1 Ethernet port directly managed by Qseven CPU module 1 x optional embedded PCI-e Gigabit Ethernet controller on the Carrier Board USB 2 x USB 2.0 standard ports Internal Pin header for 2 additional USB 2.0 ports 1 USB On-The Go port Audio Embedded AC97 or HD Audio Codec CMOS Battery On Board Lithium Battery for CMOS Backup and RTC Power 19VDC Power input Temperature Operating: 0 +60C Dimensions 200 x 140 mm (7.87 x 5.51)

39

COM EXPRESS
Benefits: FAST Development Flexibility Innovative and Upgradable Easy Cabling Fields of Application: Industrial: automation and monitoring; data acquisition Medical: data acquisition; test and monitoring appliances Telecommunication Automotive Transport: detection systems Retail Industry: point of sales and kiosks Multimedia Gaming Machines

High End Bandwidth For High End Performances COM (Computer on Module) Express is a standard form factor introduced in 2005 by PICMG. This standard is an answer to the market request for more performance combined with more flexibility adopting the latest technology improvements available from CPUs and Chipsets. The COM Express module is available in 2 formats: the Basic, with dimensions of 125 x 95 mm, which is suited for highly power sensitive devices, and the Compact, with dimensions of 95x95 mm, which is a good trade-off between performance and small size. COM Express is also designed to accomodate next generations of PCI Express and Serial ATA interfaces, doubling the data rates of actual generation.

COM EXPRESS
SECOMExp-iCORE
Highlights
COM EXPRESS TYPE II (Basic) Intel Core i3, i5, i7 CPUs integrated Intel Turbo Boost Technology Multiple Display Inteface Supported

COM-Express Module with Intel Core i3 / i5 / i7 / Celeron Processor and Intel HM55 Express Chipset with Dual Channel Memory

Technical features
CPU Intel Core i3-330E @ 2.13GHz, 3MB Cache, 35W TDP Intel Core i5-520E/520M@2.4GHz, 3MB Cache, 35W TDP Intel Core i7-660UE @ 1.33GHz, 4MB Cache, 18W TDP Intel Core i7-620LE @ 2GHz, 4MB Cache, 25W TDP Intel Core i7-610E @ 2.53GHz, 4MB Cache, 35W TDP Intel Celeron U3405@ 1.06GHz, 2MB Cache, 18W TDP Intel Celeron P4505@ 1.86GHz, 2MB Cache, 35W TDP Chipset Intel HM55 Express Chipset Memory up to 8GB of 1066MHz DDR3 on two SO-DIMMs Supporting dual channel Graphics integrated Intel HD graphics controller with dual independent display support LVDS Single/Dual Channel 18/24 Bit LVDS Transmitter Resolutions Up to 2048 x 1536 on CRT interface Up to 1920 x 1200 on LVDS interface PEG PCI Express Graphics x16 interface Mass Storage 1 x P-ATA channel 4 x S-ATA channels USB 8x USB 2.0 ports PCI-e ports 4x PCI Express x1 ports ETHERNET Gigabit Ethernet port Audio HD Audio Interface Interface Bus PCI Bus LPC BUS for legacy peripherals SM Bus Power supply +12VDC and +5VSB for ATX mode Dimensions 125x95 mm (COM Express Basic)

41

COM EXPRESS
SECOMExp-iCore-XT
Highlights
COM EXPRESS TYPE II (Basic) Intel Core i3, i5, i7 CPUs integrated Intel Turbo Boost Technology Multiple Display Inteface Supported Temperature range: -40C +85C

Industrial temperature range COM-Express Module with IntelCore i7-660UE Processor and Intel HM55 Express Chipset with Dual Channel Memory

Technical features
TEMPERATURE RANGE: -40C +85C CPU Intel Core i7-660UE @ 1GHz, 4MB Cache Chipset Intel HM55 Express Chipset Memory 1066MHz DDR3 selected modules on two SO-DIMMs Supporting dual channel FSB 100MHz Graphics integrated Intel HD graphics controller Dual independent display support LVDS Single/Dual Channel 18/24 Bit LVDS Transmitter Resolutions Up to 2048 x 1536 on CRT interface Up to 2560 x 1600 @ 60Hz with Display Port Up to 1920 x 1200 @ 60Hz using HDMI/DVI PEG PCI Express Graphics x16 interface Multiplexed with HDMI, DVI and Display Port Mass Storage 1 x P-ATA channel 4 x S-ATA channels USB 8x USB 2.0 ports PCI-e ports 4x PCI Express x1 ports ETHERNET Gigabit Ethernet port Audio HD Audio Interface Interface Bus PCI Bus LPC BUS for legacy peripherals SM Bus Power supply +12VDC and +5VSB for ATX mode Dimensions 125x95 mm (COM Express Basic)

42

COM EXPRESS
SECOMExp-iCore/E4690
Highlights

COM-Express Module Extension (DVI) with Intel Core i7 / Celeron Processor and Intel HM55 Express Chipset with AMD Radeon Graphics E4690 Discrete GPU on board

COM EXPRESS TYPE II (Basic) with Intel Core i3, i5, i7 CPUs Graphic Controller AMD Radeon Graphics E4690 Integrated on board The most powerful graphics COM express solution available in the market High res multi display support Suitable for medical, gaming, digital signage and parallel processing applications

Technical features
CPU Intel Core i7-660UE@1.33GHz, 4MB Cache, 18W TDP Intel Core i7-620LE@2GHz, 4MB Cache, 25W TDP Intel Celeron U3405@1.06GHz, 2MB Cache, 18W TDP Chipset Intel HM55 Express Chipset Memory up to 4GB of 1066MHz DDR3 SO-DIMMs Graphics AMD Radeon Graphics E4690 Discrete GPU on board with 512MB 128-bit GDDR3 dedicated memory; Up to 3 independent displays using ad-hoc Carrier board CRT, Dual LVDS, DVI/HDMI interfaces HDMI max resolution 1080p CRT, max pixel clock 400MHz E4690 24-bit dual channel LVDS interface, max. resolution 2048 x 1536 CPUs LVDS interface, max resolution 1600 x 1200 (available only on ad-hoc Carrier boards) USB 8 x USB 2.0 ports PCIe Ports 6 x PCI Express ports ETHERNET Gigabit Ethernet interface SATA interface 4 x Serial ATA ports Audio HD Audio Interface Interface Bus PCI Bus LPC Expansion Bus for legacy peripherals I2C Bus SM Bus WDT & Real Time Clock Power supply +12VDC and +5VSB (optional) Dimensions 125x95 mm (COM Express Basic Form factor)

43

COM EXPRESS
SECOMExp-ION
Highlights
NVIDIA CUDA technology Full HD video decode and display with true-fidelity 10x Faster Graphics and Video Transcoding 1 Low TDP for thin thermal solution

COM-Express Module with Intel Celeron T3100 / Intel Atom N270 CPU and NVIDIA ION Chipset with Dual Channel Memory

Technical features
CPU Intel Celeron T3100 @ 1,9GHz, 1MB L2 Cache, 800MHz FSB, Dual Core, 64-bit Instruction Set Intel Atom N270 @ 1,6GHz, 512KB L2 Cache, 533 MHz FSB, HyperThreading, 32-bit Instruction Set Chipset NVIDIA MMP9 Embedded ION Chipset Memory up to 4GB of 1066MHz DDR3 on two SO-DIMMs supporting dual channel Graphics integrated NVIDIA GeForce 9400 Graphic Controller, with 16 graphic/computational cores LVDS Single/Dual Channel 18/24 Bit LVDS Transmitter Resolutions Up to 1600 x 1200 on LVDS Up to 1920 x 1440 on CRT interface PEG PCI Express Graphics x16 interface Mass Storage 1 x P-ATA channel 4 x S-ATA channels USB 8x USB 2.0 ports PCI-e ports 3x PCI Express x1 ports ETHERNET Gigabit Ethernet port Audio HD Audio Interface Interface Bus PCI Bus LPC BUS for legacy peripherals SM Bus I2C Bus Power supply +12VDC and +5VSB for ATX mode Power consumption ~ 11W during ACPI O.S. Idle Status 17W average, 20W peak during stress test (with 4GB DDR3) Operating temperature -25C +70C with finned heatsink Dimensions 125x95 mm (COM Express Basic)

44

COM EXPRESS
SECOMExp-GSeries
Highlights
Able to drive two independent displays using the LVDS / HDMI / DisplayPort interfaces An excellent solution for high performance, low power applications DirectX 11 support, OpenGL 3.2 and OpenCL support

Technical features
APU AMD T56N, Dual Core @ 1,65GHz, TDP18W AMD T48N, Dual Core @ 1,4GHz, TDP18W AMD T40N, Dual Core @ 1,0GHz, TDP9W AMD T40E, Dual Core @ 1,0GHz, TDP6.4W AMD T52R, Single Core @ 1,5GHz, TDP18W AMD T44R, Single Core @ 1,2GHz, TDP9W AMD T40R, Single Core @ 1,0GHz, TDP5.5W AMD T16R, Single Core @615MHz, TDP 4.5W Controller Hub AMD A55E Controller Hub Memory up to 8GB of 1033MHz DDR3 on two SO-DIMMs Graphics integrated AMD GPU Radeon: HD6320 - AMD T56N HD6310 - AMD T52R and T48N HD6290 - AMD T40N HD6250 - AMD T44R, T40E, T40R and T16R Dual independent display support DirectX 11, OpenGL 4.0, OpenCL 1.1 supported Video Outputs Dual DisplayPort or HDMI interface 18/24 Bit Single/Dual Channel LVDS (alternative to second DisplayPort / HDMI interface) CRT interface Max Resolutions LVDS Interface, up to 1920x1200 HDMI, up to 1920 x 1200 Display Port: Up to 2560 x 1600 AMD T56N, T48N, T52R Up to 1920 x 1200 AMD T40N, T44R, T40E, T40R CRT: Up to 2048 x 1536 AMD T56N, T48N and T52R Up to 1920 x 1200 AMD T40N, T44R, T40E, T40R USB 8x USB 2.0 ports PCI Bus PCI-e ports 6x PCI Express x1 ports 2x ExpressCard interfaces ETHERNET Gigabit Ethernet port PATA One Ultra DMA 133/100/66/33 Port SATA Four Serial ATA ports Audio HD Audio Interface Interface Bus LPC expansion BUS for legacy peripherals I2C Bus SM Bus 4x GPI, 4xGPO WatchDog Timer Fan/Thermal Management Power Management Real time Clock Power supply +12VDC and +5VSB for ATX mode COM Express Basic Form factor, Type II, Extension HDMI/DisplayPort

COM-Express Module with AMD Embedded G-Series Platform

45

COM EXPRESS
Highlights

COM-Express Type 6 Module based on the AMD Embedded R-Series Platform

SECOMExp-RSeries

Latest AMD R-series APU (CPU+GPU) architecture Up to 4 independent displays, up to 2560x1600 resolution Designed for digital signage, gaming and multimedia applications

Technical features
APU AMD R-460L, Quad Core @ 2.8 GHz, TDP 25W AMD R-452L, Quad Core @ 2,4 GHz, TDP 19W AMD R-260H, Dual Core @ 2,6 GHz, TDP 17W AMD R-252F, Dual Core @ 2.4 GHz, TDP 17W Controller Hub AMD A70M Controller Hub Memory up to 8GB of 1600MHz DDR3 on two SO-DIMMs Graphics integrated AMD GPU Radeon: HD7620G - AMD R-460L HD7600G - AMD R-452L HD7500G - AMD R-260H HD7400G - AMD R-252F 4 independent display support DirectX 11, OpenGL 4.2, OpenCL 1.1 supported Video Outputs 3 x Digital Display Interfaces 18/24 Bit Single/Dual Channel LVDS CRT interface Max Resolutions LVDS Interface, up to 1920x1200 CRT interface, up to 1920x1600 Digital Display interfaces, up to 2560x1600 USB 8 x USB 2.0 ports 4 x USB 3.0 ports PCI-e ports 7x PCI Express x1 ports 2x Express Card interfaces 1 x PCI-e x8 (PEG) interface ETHERNET Gigabit Ethernet interface Serial ports 2 x TX/RX ports @ TTL Level, optional Disk Interface 4 x SATA 6Gb/s ports Audio HD Audio Interface Interface Bus LPC expansion BUS for legacy peripherals I2C Bus SM Bus 4x GPI, 4xGPO WatchDog Timer Fan/Thermal Management SPI Interface Power Management Optional Trusted Platform Module (TPM) Real Time Clock Power supply +12VDC and +5VSB for ATX mode COM Express Basic Form factor, Type 6

46

COM EXPRESS
Highlights

COM-Express Module with Intel Atom Cedar View family Processors and Intel NM10 Express Chipset

SECOMExp-x2000

COM Express Type II (Compact) based on Intel Atom Cedar View CPU family A native dual core multi Threads solution with optimal performance/power consumption ratio New SGX535 graphics engine, DirectX 10.1 and OpenGL 3.0 support Hardware accelerated video decoding for MPEG-2, MPEG-4 part 2, VC1, WMV9 and all important H.264

Technical features
CPU Intel Atom D2550 @ 1.86GHz, 1MB Cache, 10W TDP Intel Atom N2800 @ 1.86GHz, 1MB Cache, 6.5W TDP Intel Atom N2600 @ 1.6GHz, 1MB Cache, 3.5W TDP Chipset Intel NM10 Express Chipset Memory up to 4GB of 1066MHz DDR3 SO-DIMM (up to 2GB with N2600) Graphics integrated Intel HD graphics controller Dual independent display support Video Outputs CRT interface Up to 2 x HDMI / Display Port interface Native Single Channel 18/24 bit LVDS interface OR DP to Single/Dual Channel 18/24bit LVDS bridge Resolutions CRT Interface, up to 1920 x 1200 HDMI/DVI, up to 1920 x 1200 Display Port: Up to 1600 x 1200 with N2xx CPUs Up to 2560 x 1600 with N2xx CPUs Native LVDS: Up to 1366 x 768 with N2xx CPUs Up to 1440 x 900 with D2550 DP-to-LVDS bridge: Up to 1600 x 1200 with N2xx CPUs Up to 1920 x 1200 with D2550 Mass Storage 2 x S-ATA channels USB 8x USB 2.0 ports PCI-e ports Up to 3 x PCI Express x1 ports Ethernet Gigabit Ethernet interface Audio HD Audio Interface Interface Bus PCI Bus 2 x Express Card Interfaces LPC Bus, I2C Bus, SM Bus SPI interface 4 x GPI, 4 x GPO Watch Dog Timer FAN management Power supply +12VDC and +5VSB (optional) Dimensions 95x95 mm (COM Express Compact)

47

COM EXPRESS
SECOCExp-mITX

CARRIER BOARD

Highlights
General Purpose For COM EXPRESS TYPE II (Basic) Mini ITX form factor Extensive Connectivity

Carrier Board for COM-Express modules TYPE II (Basic) on miniITX form factor

Technical features
Supported Modules All COM Express TYPE II Embedded Computer Modules Expansion Slots 1 x PCI 1 x PCI Express x16 2 x miniPCI Express (one connected to SIM Card Slot) Up to 2 Gigabit Ethernet ports on front panel connector Mass Storage interface 2 x S-ATA connectors 1 x P-ATA 44 pin connector 1 x Compact Flash Socket 1 x SD Card Slot I/O 4 x USB on the Front Panel 1 x USB internal connector 2 x Serial Ports (1 x DB-9 male connector on Front Panel, 1 x 10 pin Header Connector) 1 x LPT 26-pin Box header PS/2 Keyboard and Mouse Connector LPC Bus interface 1 x 40 pin connector for additional feature Audio HD Audio Codec 2 x triple audio connector for 7.1 Surround audio 1 x Toslink Fiber Optical SP/DIF connector Video Analogic VGA DB-15HD connector on Front Panel LVDS Interface, 34 pin 2mm pitch header Backlight Connector, 10 pin 2.54mm pitch header TV Out connector (6 pin 2mm pitch header) CMOS Battery On Board Lithium Battery for CMOS Backup and Real Time Clock Power ATX Standard power Connector, 20 + 4 poles, AT mode configurable FAN 3 pin Header, +5/+12V configurable with Tachometric signal Temperature Operating: 0 +60C Storage: -20 +80C Dimensions 170 x 170 mm (6,7 x 6,7)

48

48

COM EXPRESS
SECOMExp-iCORE SECOMExp-iCore-XT

Technical features

CPU Intel Core i3-330E @ 2.13GHz, 3MB Cache, 35W TDP Intel Core i5-520E/520M@2.4GHz, 3MB Cache, 35W TDP Intel Core i7-660UE @ 1.33GHz, 4MB Cache, 18W TDP Intel Core i7-620LE @ 2GHz, 4MB Cache, 25W TDP Intel Core i7-610E @ 2.53GHz, 4MB Cache, 35W TDP Intel Celeron U3405@ 1.06GHz, 2MB Cache, 18W TDP Intel Celeron P4505@ 1.86GHz, 2MB Cache, 35W TDP Chipset Intel HM55 Express Chipset Memory up to 8GB of 1066MHz DDR3 on two SO-DIMMs Supporting dual channel Graphics integrated Intel HD graphics controller with dual independent display support LVDS Single/Dual Channel 18/24 Bit LVDS Transmitter Resolutions Up to 2048 x 1536 on CRT interface Up to 1920 x 1200 on LVDS interface PEG PCI Express Graphics x16 interface Mass Storage 1 x P-ATA channel 4 x S-ATA channels USB 8x USB 2.0 ports PCI-e ports 4x PCI Express x1 ports ETHERNET Gigabit Ethernet port Audio HD Audio Interface Interface Bus PCI Bus LPC BUS for legacy peripherals SM Bus Power supply +12VDC and +5VSB for ATX mode Dimensions 125x95 mm (COM Express Basic)

TEMPERATURE RANGE: -40C +85C CPU Intel Core i7-660UE @ 1GHz, 4MB Cache Chipset Intel HM55 Express Chipset Memory 1066MHz DDR3 selected modules on two SO-DIMMs Supporting dual channel FSB 100MHz Graphics integrated Intel HD graphics controller Dual independent display support LVDS Single/Dual Channel 18/24 Bit LVDS Transmitter Resolutions Up to 2048 x 1536 on CRT interface Up to 2560 x 1600 @ 60Hz with Display Port Up to 1920 x 1200 @ 60Hz using HDMI/DVI PEG PCI Express Graphics x16 interface Multiplexed with HDMI, DVI and Display Port Mass Storage 1 x P-ATA channel 4 x S-ATA channels USB 8x USB 2.0 ports PCI-e ports 4x PCI Express x1 ports ETHERNET Gigabit Ethernet port Audio HD Audio Interface Interface Bus PCI Bus LPC BUS for legacy peripherals SM Bus Power supply +12VDC and +5VSB for ATX mode Dimensions 125x95 mm (COM Express Basic)

49

COM EXPRESS
Technical features
SECOMExp-GSeries SECOMExp-iCore/E4690 SECOMExp-ION

CPU Intel Core i7-660UE@1.33GHz, 4MB Cache, 18W TDP Intel Core i7-620LE@2GHz, 4MB Cache, 25W TDP Intel Celeron U3405@1.06GHz, 2MB Cache, 18W TDP Chipset Intel HM55 Express Chipset Memory up to 4GB of 1066MHz DDR3 SO-DIMMs Graphics AMD Radeon Graphics E4690 Discrete GPU on board with 512MB 128-bit GDDR3 dedicated memory; Up to 3 independent displays using ad-hoc Carrier board CRT, Dual LVDS, DVI/HDMI interfaces HDMI max resolution 1080p CRT, max pixel clock 400MHz E4690 24-bit dual channel LVDS interface, max. resolution 2048 x 1536 CPUs LVDS interface, max resolution 1600 x 1200 (available only on ad-hoc Carrier boards) USB 8 x USB 2.0 ports PCIe Ports 6 x PCI Express ports ETHERNET Gigabit Ethernet interface SATA interface 4 x Serial ATA ports Audio HD Audio Interface Interface Bus PCI Bus LPC Expansion Bus for legacy peripherals I2C Bus SM Bus WDT & Real Time Clock Power supply +12VDC and +5VSB (optional) Dimensions 125x95 mm (COM Express Basic Form factor)

CPU Intel Celeron T3100 @ 1,9GHz, 1MB L2 Cache, 800MHz FSB, Dual Core, 64-bit Instruction Set Intel Atom N270 @ 1,6GHz, 512KB L2 Cache, 533 MHz FSB, HyperThreading, 32-bit Instruction Set Chipset NVIDIA MMP9 Embedded ION Chipset Memory up to 4GB of 1066MHz DDR3 on two SO-DIMMs supporting dual channel Graphics integrated NVIDIA GeForce 9400 Graphic Controller, with 16 graphic/computational cores LVDS Single/Dual Channel 18/24 Bit LVDS Transmitter Resolutions Up to 1600 x 1200 on LVDS Up to 1920 x 1440 on CRT interface PEG PCI Express Graphics x16 interface Mass Storage 1 x P-ATA channel 4 x S-ATA channels USB 8x USB 2.0 ports PCI-e ports 3x PCI Express x1 ports ETHERNET Gigabit Ethernet port Audio HD Audio Interface Interface Bus PCI Bus LPC BUS for legacy peripherals SM Bus I2C Bus Power supply +12VDC and +5VSB for ATX mode Power consumption ~ 11W during ACPI O.S. Idle Status 17W average, 20W peak during stress test (with 4GB DDR3) Operating temperature -25C +70C with finned heatsink Dimensions 125x95 mm (COM Express Basic)

APU AMD T56N, Dual Core @ 1,65GHz, TDP18W AMD T48N, Dual Core @ 1,4GHz, TDP18W AMD T40N, Dual Core @ 1,0GHz, TDP9W AMD T40E, Dual Core @ 1,0GHz, TDP6.4W AMD T52R, Single Core @ 1,5GHz, TDP18W AMD T44R, Single Core @ 1,2GHz, TDP9W AMD T40R, Single Core @ 1,0GHz, TDP5.5W AMD T16R, Single Core @615MHz, TDP 4.5W Controller Hub AMD A55E Controller Hub Memory up to 8GB of 1033MHz DDR3 on two SO-DIMMs Graphics integrated AMD GPU Radeon: HD6320 - AMD T56N HD6310 - AMD T52R and T48N HD6290 - AMD T40N HD6250 - AMD T44R, T40E, T40R and T16R Dual independent display support DirectX 11, OpenGL 4.0, OpenCL 1.1 supported Video Outputs Dual DisplayPort or HDMI interface 18/24 Bit Single/Dual Channel LVDS (alternative to second DisplayPort / HDMI interface) CRT interface Max Resolutions LVDS Interface, up to 1920x1200 HDMI, up to 1920 x 1200 Display Port: Up to 2560 x 1600 AMD T56N, T48N, T52R Up to 1920 x 1200 AMD T40N, T44R, T40E, T40R CRT: Up to 2048 x 1536 AMD T56N, T48N and T52R Up to 1920 x 1200 AMD T40N, T44R, T40E, T40R USB 8x USB 2.0 ports PCI Bus PCI-e ports 6x PCI Express x1 ports 2x ExpressCard interfaces ETHERNET Gigabit Ethernet port PATA One Ultra DMA 133/100/66/33 Port SATA Four Serial ATA ports Audio HD Audio Interface Interface Bus LPC expansion BUS for legacy peripherals I2C Bus SM Bus 4x GPI, 4xGPO WatchDog Timer Fan/Thermal Management Power Management Real time Clock Power supply +12VDC and +5VSB for ATX mode COM Express Basic Form factor, Type II, Extension HDMI/DisplayPort

50

COM EXPRESS
SECOMExp-RSeries SECOMExp-x2000 SECOCExp-mITX
CARRIER BOARD

Technical features

APU AMD R-460L, Quad Core @ 2.8 GHz, TDP 25W AMD R-452L, Quad Core @ 2,4 GHz, TDP 19W AMD R-260H, Dual Core @ 2,6 GHz, TDP 17W AMD R-252F, Dual Core @ 2.4 GHz, TDP 17W Controller Hub AMD A70M Controller Hub Memory up to 8GB of 1600MHz DDR3 on two SO-DIMMs Graphics integrated AMD GPU Radeon: HD7620G - AMD R-460L HD7600G - AMD R-452L HD7500G - AMD R-260H HD7400G - AMD R-252F 4 independent display support DirectX 11, OpenGL 4.2, OpenCL 1.1 supported Video Outputs 3 x Digital Display Interfaces 18/24 Bit Single/Dual Channel LVDS CRT interface Max Resolutions LVDS Interface, up to 1920x1200 CRT interface, up to 1920x1600 Digital Display interfaces, up to 2560x1600 USB 8 x USB 2.0 ports 4 x USB 3.0 ports PCI-e ports 7x PCI Express x1 ports 2x Express Card interfaces 1 x PCI-e x8 (PEG) interface ETHERNET Gigabit Ethernet interface Serial ports 2 x TX/RX ports @ TTL Level, optional Disk Interface 4 x SATA 6Gb/s ports Audio HD Audio Interface Interface Bus LPC expansion BUS for legacy peripherals I2C Bus SM Bus 4x GPI, 4xGPO WatchDog Timer Fan/Thermal Management SPI Interface Power Management Optional Trusted Platform Module (TPM) Real Time Clock Power supply +12VDC and +5VSB for ATX mode COM Express Basic Form factor, Type 6

CPU Intel Atom D2550 @ 1.86GHz, 1MB Cache, 10W TDP Intel Atom N2800 @ 1.86GHz, 1MB Cache, 6.5W TDP Intel Atom N2600 @ 1.6GHz, 1MB Cache, 3.5W TDP Chipset Intel NM10 Express Chipset Memory up to 4GB of 1066MHz DDR3 SO-DIMM (up to 2GB with N2600) Graphics integrated Intel HD graphics controller Dual independent display support Video Outputs CRT interface Up to 2 x HDMI / Display Port interface Native Single Channel 18/24 bit LVDS interface OR DP to Single/Dual Channel 18/24bit LVDS bridge Resolutions CRT Interface, up to 1920 x 1200 HDMI/DVI, up to 1920 x 1200 Display Port: Up to 1600 x 1200 with N2xx CPUs Up to 2560 x 1600 with N2xx CPUs Native LVDS: Up to 1366 x 768 with N2xx CPUs Up to 1440 x 900 with D2550 DP-to-LVDS bridge: Up to 1600 x 1200 with N2xx CPUs Up to 1920 x 1200 with D2550 Mass Storage 2 x S-ATA channels USB 8x USB 2.0 ports PCI-e ports Up to 3 x PCI Express x1 ports Ethernet Gigabit Ethernet interface Audio HD Audio Interface Interface Bus PCI Bus 2 x Express Card Interfaces LPC Bus, I2C Bus, SM Bus SPI interface 4 x GPI, 4 x GPO Watch Dog Timer FAN management Power supply +12VDC and +5VSB (optional) Dimensions 95x95 mm (COM Express Compact)

Supported Modules All COM Express Type II Embedded Computer Modules Expansion Slots 1 x PCI 1 x PCI Express x16 2 x miniPCI Express (one connected to SIM Card Slot) Up to 2 Gigabit Ethernet ports on front panel connector Mass Storage interface 2 x S-ATA connectors 1 x P-ATA 44 pin connector 1 x Compact Flash Socket 1 x SD Card Slot I/O 4 x USB on the Front Panel 1 x USB internal connector 2 x Serial Ports (1 x DB-9 male connector on Front Panel, 1 x 10 pin Header Connector) 1 x LPT 26-pin Box header PS/2 Keyboard and Mouse Connector LPC Bus interface 1 x 40 pin connector for additional feature Audio HD Audio Codec 2 x triple audio connector for 7.1 Surround audio 1 x Toslink Fiber Optical SP/DIF connector Video Analogic VGA DB-15HD connector on Front Panel LVDS Interface, 34 pin 2mm pitch header Backlight Connector, 10 pin 2.54mm pitch header TV Out connector (6 pin 2mm pitch header) CMOS Battery On Board Lithium Battery for CMOS Backup and Real Time Clock Power ATX Standard power Connector, 20 + 4 poles, AT mode configurable FAN 3 pin Header, +5/+12V configurable with Tachometric signal Temperature Operating: 0 +60C Storage: -20 +80C Dimensions 170 x 170 mm (6,7 x 6,7)

51

SBC
Benefits: Compact Dimensions Rugged Solution Cost Effective Fields of Application: Industrial: automation and monitoring; data acquisition Digital Signage: kiosks, info-point, panel PC Security: video surveillance, networking control Clever Turn-key Solutions SECOs Embedded Single Board Computer product line includes a wide range of standard architectures such as nITX and pITX. Typical fields of application are gaming (slot or video poker machines), digital signage (kiosks or info-point devices) and industrial (processes control machines). SECO SBCs are providing all the required I/Os for most industrial applications such as on-board digital and analog I/O, on board bootable flash. SECOs Single board computers are compact and with a high level of integration. Together with their low power consumption they become the obvious choice for a wide range of applications. Plug-cards such as DIMMs or storage units, cables and display interfaces along with pre-loaded operating systems complete the offer of SECOs turn-key solutions with long term availability.

SBC
SECOnITX-ION
Highlights
Highly-integrated compact board Low Power Consumption and low heat dissipation NVIDIA GeForce 9400 graphics

Single Board Computer with Intel Celeron T3100 or Intel Atom N270 CPU and NVIDIA MMP9 Embedded ION Chipset on nano-ITX form factor

Technical features
Processor Intel Celeron T3100 @ 1,9GHz, 1MB L2 Cache, 800MHz FSB, Dual Core, 64-bit Instruction Set Intel Atom N270 @ 1,6GHz, 512KB L2 Cache, 533 MHz FSB, HyperThreading, 32-bit Instruction Set Chipset NVIDIA MMP9 Embedded ION Memory up to 4GB DDR3 on a SO-DIMM socket Graphic Controller integrated controller NVIDIA GeForce 9400M 16x graphics cores max analog resolution 2048 x 1536 max digital resolution 2560 x 1600 Video DVI Interface LVDS Interface HDMI Interface CRT Interface Mass Storage Interface 2x SATA Compact Flash Socket USB 4 x USB 2.0 ports (standard connector) 2 x USB 2.0 ports (internal Pin Headers) ETHERNET Gigabit Ethernet Connector Audio dual jack for HD Audio Expansion Slots 1x miniPCI Express connector 1 x Serial Port (RS-232 / RS-485 configurable) SM Bus Pin Header GPIO Pin Header FAN 3 pin Headers for CPU and Chipset temperature, with Tachometric signal Power supply +12VDC connector, AT/ATX mode Dimensions 120x120 mm (4.72 x 4.72)

53

SBC
SECOpITX-x2000
Highlights
Space and power saving SBC with the long term support of the embedded market Based on Intel Atom Cedar View dual core N2000 and D2000 CPU family at 64-bit instruction set and Hyper Threading for impressive performance/power consumption ratio Suitable for fanless and low cost applications

Single Board Computer with Intel Atom Cedar View family Processors and Intel NM10 Express Chipset in Pico-ITX form factor

Technical features
Intel Atom D2550 @1.86GHz, 1MB Cache, 10W TDP Intel Atom N2800 @1.86GHz, 1MB Cache, 6.5W TDP Intel Atom N2600 @1.6GHz, 1MB Cache, 3.5W TDP Chipset Intel NM10 Express Chipset Memory up to 4GB DDR3 1066MHz SO-DIMM (up to 2GB with N2600) Graphics Integrated Intel HD Graphics controller Dual independent display support Video interfaces HDMI Connector 18/24 bit single channel LVDS internal connector VGA interface (optional external adapter is required) Resolutions Up to 1920x1200 on HDMI and CRT Up to 1366 x 768 on LVDS interface with N2xx CPUs Up to 1440x 900 on LVDS interface with D2550 CPUs Mass Storage 2 x standard S-ATA connector I/O 2 x standard USB 2.0 ports 4 x internal USB 2.0 ports FAN connector Ethernet up to 2 x Gigabit Ethernet connector Audio HD Audio Codec LineOut, Mic In internal connector Power supply +12VDC Power Jack
CPU RTC battery with lead cable and connector Dimensions 100 x 72 mm (3,93 x 2,83)

54

SBC
SECOSBC-i.MX6
Highlights
The power of the Freescale i.MX6 SoC in a credit card sized SBC Scalable multi-core ARM Cortex-A9 architecture It combines and emphasizes the high-graphics performance with the power-efficient processing capabilities Flexible solution suitable for the digital signage applications. A multi-display platform for mobile fanless applications Best benefit-cost ratio

Single Board Computer with Freescale i.MX6 Processor

Technical features
Processor

Memory Graphics

Video interfaces

Resolutions

Mass Storage

I/O

Ethernet Audio

i.MX6Dual/ 6Quad

Serial ports Power supply RTC battery with lead cable and connector 80 x 67 mm (3,15 x 2,64) Dimensions

Freescale i.MX6 Family, based on ARM Cortex-A9 processors: Single core i.MX6S up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clock up to 2GB DDR3 onboard (up to 1GB with i.MX6S) integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL ES2.0 3D and OpenVG (OpenVG accelerator only available with i.MX6D and with i.MX6Q) Supports up to 3 independent displays (up to 2 displays with i.MX6DL and i.MX6S) HDMI Connector 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interface LVDS, up to 1920x1200 HDMI, up to 1080p eMMC soldered onboard mSATA Half-Size slot (shared with miniPCI-Express) 3 x standard USB 2.0 ports 1 x USB OTG Internal USB for optional WiFi module miniPCI-Express Half-Size slot (shared with mSATA) Gigabit Ethernet connector AC97 Audio Codec LineOut, Mic In internal connector 1 x RS-232 serial port +12VDC Power Jack

55

SBC
SECOSBC-T30
Highlights

Single Board Computer with NVIDIA Tegra T30 Processor

The power of the Nvidia Tegra 3 SoC in a credit card sized SBC Impressive graphics capabilities Quad-Core A9 ARM Cortex-A9 Low Power CPU for high graphics and mobile applications Graphics engine powered by the 12 cores ULP GeForce GPU Extreme multitasking, 1080p Video Playback dedicated Processors and able to play high res 3D video A cost effective solution suitable for digital signage apps where a compact size and a low power consumption is necessary

Technical features
Processor NVIDIA Tegra T30 w/ Quad ARM Cortex -A9 MPCore CPU, 1.3 GHz per core Memory up to 1GB DDR3L onboard Graphics embedded NVIDIA ULP GeForce GPU Integrated High Definition Audio-Video Processor Supports up to 2 independent displays Video interfaces HDMI Connector Dual Channel 18/24 bit LVDS interface Resolutions LVDS, up to 1920x1080 HDMI, up to 1080p Mass Storage eMMC soldered onboard mSATA Half-Size slot (shared with miniPCI-Express) I/O 3 x standard USB 2.0 ports 1 x USB OTG Internal USB for optional WiFi module miniPCI-Express Half-Size slot (shared with mSATA) Ethernet Gigabit Ethernet connector Audio HD Audio Codec LineOut, Mic In internal connector Serial ports 1 x RS-232 serial port Power supply +12VDC Power Jack RTC battery with lead cable and connector Dimensions 80 x 67 mm (3,15 x 2,64)

56

SBC
Highlights

SECOpITX-GX

Single Board Computer with the brand new AMD Embedded G-Series SOC in Pico-ITX form factor

The smallest standard SBC in the market in Pico-ITX form factor Connectivity oriented Dual LAN (WiFi+Bluetooth opt.) Multidisplay support (LVDS - HDMI - eDP - VGA) USB 3.0 support

Technical features
AMD GX-420CA, Quad Core @ 2.0GHz, 2MB L2 Cache, TDP 25W AMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15W AMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15W AMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W Up to 8GB on DDR3 1600MHz SO-DIMM @1.5V Memory (DDR3-1333MHz @1.5V with GX-210HA) Embedded AMD HD RADEON GPUs HD8400E @600MHz (GX-420CA), HD8330E @500Mhz (GX-415GA) Graphics HD8280E @450MHz (GX-217GA), HD8210E @300Mhz (GX-210HA) Dual independent display support HDMI Connector Video interfaces 18 bit single channel LVDS or embedded Display Port internal connector VGA interface (requires external optional Video Adapter) Up to 1920x1200 on HDMI Up to 2048x1536 on CRT Resolutions Up to 2560 x1600 with embedded Display Port (eDP) Up to 1440 x 900 on LVDS 18bit interface (up to 1920x1200 through external adapter) 2 x standard S-ATA connectors Mass Storage microSD Card Slot 2 x standard USB 3.0 Type A connectors 4 x internal USB 2.0 ports I/O Half miniPCI-e slot FAN connector Front Header Expansion connector SOC Ethernet Audio Power supply Dimensions Up to 2 x Gigabit Ethernet connector HD Audio Codec LineOut, Mic In internal connector +12VDC Power Jack 100 x 72 mm (3,93 x 2,83)

CO

N I M

O S G

N O

RTC battery with lead cable and connector

57

SBC

Technical features

SECOnITX-ION

SECOpITX-x2000

Processor Intel Celeron T3100 @ 1,9GHz, 1MB L2 Cache, 800MHz FSB, Dual Core, 64-bit Instruction Set Intel Atom N270 @ 1,6GHz, 512KB L2 Cache, 533 MHz FSB, HyperThreading, 32-bit Instruction Set Chipset NVIDIA MMP9 Embedded ION Memory up to 4GB DDR3 on a SO-DIMM socket Graphic Controller integrated controller NVIDIA GeForce 9400M 16x graphics cores max analog resolution 2048 x 1536 max digital resolution 2560 x 1600 Video DVI Interface LVDS Interface HDMI Interface CRT Interface Mass Storage Interface 2x SATA Compact Flash Socket USB 4 x USB 2.0 ports (standard connector) 2 x USB 2.0 ports (internal Pin Headers) ETHERNET Gigabit Ethernet Connector Audio dual jack for HD Audio Expansion Slots 1x miniPCI Express connector 1 x Serial Port (RS-232 / RS-485 configurable) SM Bus Pin Header GPIO Pin Header FAN 3 pin Headers for CPU and Chipset temperature, with Tachometric signal Power supply +12VDC connector, AT/ATX mode Dimensions 120x120 mm (4.72 x 4.72)

Intel Atom D2550 @1.86GHz, 1MB Cache, 10W TDP Intel Atom N2800 @1.86GHz, 1MB Cache, 6.5W TDP Intel Atom N2600 @1.6GHz, 1MB Cache, 3.5W TDP Chipset Intel NM10 Express Chipset Memory up to 4GB DDR3 1066MHz SO-DIMM (up to 2GB with N2600) Graphics Integrated Intel HD Graphics controller Dual independent display support Video interfaces HDMI Connector 18/24 bit single channel LVDS internal connector VGA interface (optional external adapter is required) Resolutions Up to 1920x1200 on HDMI and CRT Up to 1366 x 768 on LVDS interface with N2xx CPUs Up to 1440x 900 on LVDS interface with D2550 CPUs Mass Storage 2 x standard S-ATA connector I/O 2 x standard USB 2.0 ports 4 x internal USB 2.0 ports FAN connector Ethernet up to 2 x Gigabit Ethernet connector Audio HD Audio Codec LineOut, Mic In internal connector Power supply +12VDC Power Jack
CPU RTC battery with lead cable and connector 100 x 72 mm (3,93 x 2,83) Dimensions

58

Technical features

SBC

SECOSBC-i.MX6

SECOSBC-T30

SECOpITX-GX

i.MX6Dual/ 6Quad

M O C
Processor NVIDIA Tegra T30 w/ Quad ARM Cortex -A9 MPCore CPU, 1.3 GHz per core Memory up to 1GB DDR3L onboard Graphics embedded NVIDIA ULP GeForce GPU Integrated High Definition Audio-Video Processor Supports up to 2 independent displays Video interfaces HDMI Connector Dual Channel 18/24 bit LVDS interface Resolutions LVDS, up to 1920x1080 HDMI, up to 1080p Mass Storage eMMC soldered onboard mSATA Half-Size slot (shared with miniPCI-Express) I/O 3 x standard USB 2.0 ports 1 x USB OTG Internal USB for optional WiFi module miniPCI-Express Half-Size slot (shared with mSATA) Ethernet Gigabit Ethernet connector Audio HD Audio Codec LineOut, Mic In internal connector Serial ports 1 x RS-232 serial port Power supply +12VDC Power Jack RTC battery with lead cable and connector Dimensions 80 x 67 mm (3,15 x 2,64)
SOC

S G IN

N O O

Processor

Memory Graphics

Video interfaces

Resolutions

Mass Storage

I/O

Ethernet Audio

Serial ports Power supply RTC battery with lead cable and connector 80 x 67 mm (3,15 x 2,64) Dimensions

Freescale i.MX6 Family, based on ARM Cortex-A9 processors: Single core i.MX6S up to 1GHz Dual Core (i.MX6D), Dual Core Lite (i.MX6DL) up to 1.2GHz Quad Core (i.MX6Q) up to 1.2GHz clock up to 2GB DDR3 onboard (up to 1GB with i.MX6S) integrated graphics, each processor provides up to 3 separated accelerators for 2D, OpenGL ES2.0 3D and OpenVG (OpenVG accelerator only available with i.MX6D and with i.MX6Q) Supports up to 3 independent displays (up to 2 displays with i.MX6DL and i.MX6S) HDMI Connector 1 x Dual Channel or 2 x Single Channel 18/24 bit LVDS interface LVDS, up to 1920x1200 HDMI, up to 1080p eMMC soldered onboard mSATA Half-Size slot (shared with miniPCI-Express) 3 x standard USB 2.0 ports 1 x USB OTG Internal USB for optional WiFi module miniPCI-Express Half-Size slot (shared with mSATA) Gigabit Ethernet connector AC97 Audio Codec LineOut, Mic In internal connector 1 x RS-232 serial port +12VDC Power Jack

AMD GX-420CA, Quad Core @ 2.0GHz, 2MB L2 Cache, TDP 25W AMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15W AMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15W AMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W Up to 8GB on DDR3 1600MHz SO-DIMM @1.5V Memory (DDR3-1333MHz @1.5V with GX-210HA) Embedded AMD HD RADEON GPUs HD8400E @600MHz (GX-420CA), HD8330E @500Mhz (GX-415GA) Graphics HD8280E @450MHz (GX-217GA), HD8210E @300Mhz (GX-210HA) Dual independent display support HDMI Connector Video interfaces 18 bit single channel LVDS or embedded Display Port internal connector VGA interface (requires external optional Video Adapter) Up to 1920x1200 on HDMI Up to 2048x1536 on CRT Resolutions Up to 2560 x1600 with embedded Display Port (eDP) Up to 1440 x 900 on LVDS 18bit interface (up to 1920x1200 through external adapter) 2 x standard S-ATA connectors Mass Storage microSD Card Slot 2 x standard USB 3.0 Type A connectors 4 x internal USB 2.0 ports I/O Half miniPCI-e slot FAN connector Front Header Expansion connector Ethernet Audio Power supply Dimensions Up to 2 x Gigabit Ethernet connector HD Audio Codec LineOut, Mic In internal connector +12VDC Power Jack 100 x 72 mm (3,93 x 2,83)

RTC battery with lead cable and connector

59

ETX 3.0

Benefits: FAST Development Flexibility Innovative and Upgradable Easy Cabling Fields of Application: Industrial: automation and monitoring; data acquisition Medical: data acquisition; test and monitoring appliances Telecommunication Automotive Transport: detection systems Retail Industry: point of sales and kiosks Multimedia - Gaming Machines Winning Formula The ETX (Embedded Technology eXtended) architecture is based upon 2 elements: the ETX CPU Module and the ETX Baseboard. The ETX CPU modules have a compact size ( 95x114mm) and 4 standard high density connectors through which ISA bus, PCI bus and the most common I/O signals in a PC are conveyed to the ETX Baseboard. The connectors are placed on the baseboard which is generally designed on customers requirements. About the ETX baseboards, SECO provides solutions off-the-shelf but also offers its know-how for the design of custom baseboards. This solution enables the customer to maintain the same mechanics or the chassis where the embedded CPU system is positioned and diversify or update the performances of the product simply changing the ETX CPU module. Another possibility is to offer a wider range of final products offering different performances simply using different CPU modules, avoiding additional design costs. The thermal dissipation of the system strictly depends on the mechanics of the final system and the mounted CPU: from the standard heat spreader kit through heat sinks, fans or heat pipes. Flexible and tailored solutions are the benefits of an ETX system.

60

ETX 3.0
SECOME-945/N270
Highlights
ETX 3.0 compliant Cost Sensitive Module Low Power Consumption Available in Extended Temperature Version

ETX Module with Intel Atom N270 and 945GME ICH7-M DH Express Chipset

Technical features
CPU Intel Atom N270 1,6GHz with TDP 2.5W Chipset Intel 82945GME + Intel 82801GHM (ICH7M-DH) Memory up to 2GB of 533/667MHz DDR2 of SO-DIMMs FSB 533MHz Graphics Intel Graphics Media Accelerator 950 Resolutions Up to 2048 x 1536 QXGA 75Hz Dual display supported LVDS 18 or 24 bit, single or dual channel interface USB 4x USB 2.0 ports Expansion bus ISA Bus, PCI bus ETHERNET 10/100Mbps Ethernet port, Realtek RTL8103E PATA One Ultra ATA/100/66/33 Port SATA Up to 2x S-ATA connectors on ETX module Serial Ports 2x (TTL level signals) Parallel Port 1x (optionally, shared with Floppy Disk Drive Port) Audio AC97 Internal Audio Codec VIA VT1613 Watch Dog Timer Real time Clock Temperature, Fan Speed and Voltage Monitoring Power supply +5VDC (+5VSB needed for ATX mode) Temperature Operating: -20C +70 C Dimensions 114x95 mm (4.5 x 3.7)

61

XTX
Benefits: FAST Development High-speed buses support Flexibility Innovative and Upgradable

Fields of Application: Industrial: automation and monitoring; data acquisition Medical: data acquisition; test and monitoring appliances Telecommunication Automotive Transport: detection systems Retail Industry: point of sales and kiosks Multimedia Gaming Machines

EXpress Technology for ETX The XTX (EXpress Technology for ETX ) architecture is based, like the one of ETX, on 2 elements: the XTX CPU Module and the XTX Baseboard. XTX was developed as an evolution of the ETX standard, with the same form factor of 95x114mm and the same 4 standard high-density connectors through which the signals are conveyed to the Baseboard, but adding new features. Following the trend of the new I/O technologies, XTX removes the ISA signals, a bus less and less used in modern embedded applications, and adds the new high-speed serial buses like PCI Express and Serial ATA. The philosophy of the XTX architecture remains the same of the ETX: flexibility in offering different performances in the final application and/or easy upgrade of performances simply using different CPU modules, avoiding additional design costs. The thermal dissipation of the system strictly depends on the mechanics of the final system and the CPU mounted and implies the same solutions of the ETX systems. SECO provides its know-how in developing and manufacturing Baseboards also for the XTX standard, in order to supply to the customer a complete embedded PC system, for fastest and easiest integration on the customers site.

62

XTX
SECOMX-945/N270
Highlights
Cost effective Low Power Consumption Available in Extended Temperature

XTX Module with Intel Atom N270 and 945GME ICH7-M DH Express Chipset

Technical features
CPU Intel Atom N270 1,6GHz with TDP 2.5W Chipset Intel 82945GME + Intel 82801GHM (ICH7M-DH) Memory up to 2GB of 533/667MHz DDR2 of SO-DIMMs FSB 533MHz Graphics Intel Graphics Media Accelerator 950 Resolutions Up to 2048 x 1536 QXGA 75Hz Dual display supported LVDS 18 or 24 bit, single or dual channel interface USB 6x USB 2.0 ports Expansion bus PCI bus, 4x PCI Express x1 ports ETHERNET 10/100Mbps Ethernet port, Realtek RTL8103E PATA One Ultra ATA/100/66/33 Port SATA Up to 2x S-ATA ports Serial Ports 2x (TTL level signals) Parallel Port 1x (optionally, shared with Floppy Disk Drive Port) Audio AC97 Internal Audio Codec VIA VT1613 Watch Dog Timer Real time Clock Temperature, Fan Speed and Voltage Monitoring Power supply +5VDC (+5VSB needed for ATX mode) Temperature Operating: -20C +70 C Dimensions 114x95 mm (4.5 x 3.7)

63

Qseven XTX

CARRIER BOARD

SECOCX-mITX

Highlights
General Purpose for XTX CPU modules Mini ITX form factor Extensive Connectivity

Carrier Board for XTX modules on mini ITX standard

Technical features
Suppored Module All XTX Embedded Computer Modules Expansion Slots 1x PCI 2x PCI Express x 1 1x miniPCI Express 1x Gigabit Ethernet on front panel connector 1x Fast Ethernet on front panel connector Mass Storage Interface 2x SATA 1x PATA 1x Compact Flash Socket 1x SD Card Slot I/O 4x USB on the Front Panel 2x Serial Ports (1x Front Panel Connector, 1x 10 Pin Header Connector) 1x LPT PS/2 Keyboard and Mouse LPC Bus Interface 1x 40 Pin Connector for Additional Features Sound Line In Line Out Mic In on the Front Panel Video Analog VGA on the Front Panel LVDS Interface, 34 Pin 2 mm Header Backlight Connector, 10 Pin 2.54 mm Header TV Out (CN13) CMOS Battery On Board Lithium Battery for CMOS backup and real time clock Power ATX Standard Power Conn. (AT Mode Config.) FAN 3 Pin Header 12 V and Tacho Signal Temperature Operating: 0 .. +60C Storage: -20 .. +80C Dimensions 170 x 170 mm (6,7x6,7)

64

Italy Headquarters Hungary Switzerland

Austria

Slovakia

Czech Republic

Finland

Sweden

Ukraine

Greece

Slovenia

Germany

Estonia

Spain

Poland

Norway

Romania

U.K.

Latvia

Netherlands Lithuania

Israel

France

Russia

Portugal

Turkey

Ireland

Belgium

Denmark

USA

Canada

CHINA

Bangalore

Japan

Singapore

Taiwan

settore8.it

SECO s.r.l. Via Calamandrei, 91 52100 Arezzo - ITALY Ph +39 0575 26979 Fax +39 0575 350210 info@seco.com www.seco.com

207