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S-Bond
Technologies, LLC
S-Bond Technologies
Original technology patent in 1996 within
another company
SBT formed in 2003 to develop
applications in the electronics, aerospace,
defense, and general industrial markets
Small team of scientists/engineers that
develop materials and applications, then
license the technology to OEM’s and
contract assembly service providers
Study Objective
To examine the relative thermal conductivity of
bonded packaging/thermal management
materials in a way that provides relative
performance data to compare active solder
materials to commonly used conventional
solders
elements creates a
Material # 1 Material # 2
self fluxing system
No need to pre-plate, S-Bond® Alloy
metallize, or
add/remove flux
Study Procedure
Test apparatus FORCE
Testing done on
Insulator
Heater
H
substrates T1
Upper
approximately 2”
Meter
Bar
T2
Specimen
Materials were
T4
T5
Reference
consistent in
Calorimeter
T6
between materials
Bonding Methods
Substrates were bonded using 4 materials
– Indium based Active Solder (S-Bond® 130)
– Tin/silver based Active Solder (S-Bond® 220)
– 32.5 tin/67.5 lead conventional solder
– 96 tin/4 silver conventional solder
Active solder materials bonded directly to the substrate
surface
Other materials bonded using flux ---- significant
bonding issues with certain substrates
Bond thickness controlled by weight applied to assembly
prior to cooling
No evaluation of bond strength
Bond quality evaluated by Scanning Acoustic Microscopy
Active Solder Joining
Substrate material is heated to joining
temperature
– Indium based material - 140°C
– Tin/Silver based material - 250°C
Surfaces are coated with thin layer of material
by brushing
Additional material added and parts assembled
Weight is placed on top of assembly during
cooling to establish consistent bond thickness
and minimize voiding
Conventional Solder Joining
Joined using fluxes recommended for
particular material, where available, and
following recommended practices
For certain materials, acceptable bonds
could not be obtained without plating the
surface [testing in progress]
– AlSiC with nickel
– Si with gold
Test Matrix
Si CuW AlSiC Al
Cu X X X X
Si X X X
CuW X X
1 1
0 0
2 2 SB220
1 1 Sn/Pb
0 0 Sn/Ag/Cu
Initial Conclusions
Bulk thermal impedance drives thermal
performance if the bonding material completely
wets the substrate
Active Solders wet and join to a wider variety of
materials than conventional solders, producing
equal or lower thermal impedance
Further study is needed with plated substrates
to fully compare conventional solders to active
solders in silicon, AlSiC, and CuW substrates