PCB MAKING

STEPS I N P C B M A K I N G . PREPARING A R T W O R K For preparing the artwork we have used Eagle Software version 6.2,0. The sequence of operation from schematic design to layout using Eagle is given below: 1. Go to File-new schematic. Give suitable name to your schematic file. 2. There is A d d command given in Eagle which contains Library. Prepare your schematic by using components given in Hbrary. If you want to stop use of any command, you can use command STOP. 3. Now using wire and wirepad command you can connect the lead of the component. Wire width should be 0.016. 4. After making of schematic, next step is Layout preparation. There is broad tool for making Layout of P C B . Y o u can use grid command for giving proper measurement to the circuit. 5. Go into Auto command. If we don't require top portion make it not applicable. (N/A). If we require bottom portion then make it applicable (-). 6. Now go into View- Display and Hide Layers and make none as selected, then select 16, 17 and 18. Now'Vou will have only tracks on board which is known as Positive of Layout. 7. Y o u can give the name to your P C B by using T E X T command. 8. Go into DRC-clearance. In different signals option make all contain of the wire option as 40mil which make all contain of the pad and via option as 20mil and apply it to the layout.

9. Process for making Negative: - Go into File-Export-Image. Select the monochrome option and make resolution as 750. N o w for saving file, browse option is there. Click on browse, give suitable name to your file and save it. This file is known as Negative of Layout. 10. For pasting negative in M S Word: - Go into M S Word and click on insert picture. N o w select your file which contains the negative. 11 .Now you can take print out of your negative which is in M S Word. Then take a copper board and perform the hardware procedure.

P R O C E D U R E IS A S F O L L O W S : CUTTING L A M I N A T E

IN Y E L L O W R O O M DIP C O A T I N G ( P H O T O R E S I S T ) PRE-BAKING(5 MINUTES) U L T R A - V I O L E T E X P O S U R E O N L A M I N A T E ( 2 . 5 MRvrUTES) DIPPING I N D E V E L O P E R S O L U T I O N ( l ETCHING(5-8 M I N U T E S ) PCB DRILLING MINUTE) (30 S E C O N D S )

PREPARING A R T W O R K FIRST A R T W O R K O F C I R C U I T IS P R E P A R E D IT C A N B E D O N E U S I N G A N Y P C B D E S I G N I N G S O F T W A R E T A K E PRINT O U T OF D E S I G N E D C I R C U I T O N T R A C I N G P A P E R

PCB P R E P A R A T I O N CUTTING THE L A M O I N A T E

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C L E A N I N G THE L A M I N A T E WIH STEEL WOOD COATING P H O T O R E S I S T IS A P P L I E D B Y U S I N G A DIPPING P R O C E S S I N PHOTORESIST DIP C O A T E R THIS P R O C E S S IS D O N E T I L L T H E P H O T O R E S I S T IS U N I F O R M L Y APPLIED C A R R Y O U T THIS P R O C E S S S T R I C T L Y I N Y E L L O W L I G H T

pl^tEBAKING

A F T E R C O A T I N G T H E L A M I N A T E IS D R I E D I N P H O T O R E S I S T D R Y E R M A C H I N E (5 M I N U T E S ) C O O L IT A T R O O M T E M P E R A T U R E THIS PROCESS IS C A R R I E D O U T S T R I C T L Y IN Y E L L O W L I G H T

. .

ULTRA-VIOLET EXPOSURE ON LAMINATE C O A T E D L A M I N A T E IS E X P O S E D I N C O N T A C T W I T H PHOTOGRAPHIC NEGATIVE P H O T O R E S I S T IS S E N S I T I V E T O U L T R A V I O L E T R A D I A T I O N U L T R A V I O L E T TUBES B A S E D , U V E X P O S U R E UNIT FOR E X P O S U R E . SET T I M E T O (2.5 M I N U T E S ) pEVELOPMENT E X P O S E D L A M I N A T E IS P L A C E D I N T O S O L V E N T B A S E D DEVELOPER

THIS W I L L R E M O V E U N E X P O S E D A R E A S OF T H E PHOTORESIST T O T A L D E V E L O P M E N T T I M E IS 60 T O 90 S E C O N D S

WASHING I M M E D I A T E L Y A F T E R D E V E L O P M E N T IS O V E R , W A S H IT IN R U N N I N G WATER(1 M I N U T E )

ETCHING THIS IS A N I M P O R T A N T A N D C R I T I C A L STEP I N C H E M I C A L PROCESSING THIS O P E R A T I O N ATMS A T C H E M I C A L R E M O V A L ( E T C H I N G ) OF U N W A N T E D COPPER PORTION E T C H T H E L A M I N A T E T I L L T H E U N W A N T E D C O P P E R IS T O T A L L Y REMOVED(5-8 MINUTES)

W A S H IT IN R U N N I N G W A T E R

DRILLING T H E D R I L L I N G OF P C B IS D O N E F O R M A K I N G H O L E S IN T H E CONDUCTOR P A T T E R N FOR INSERTING THE C O M P O N E N T S , L E A D S T O T H E S O L D E R SIDE OF T H E P C B S E L E C T I O N OF D R I L L BIT M U S T B E A P P R O P R I A T E ( I C 0.8MM,COMPONENTS-1MM).MANHALNDLING C A N CAUSE D A M A G E TO D R I L L BIT N O W Y O U R P C B IS R E A D Y F O R A S S E M B L Y