NGFF Huawei

HUAWEI ME906X LTE M.
2 Module
Hardware Guide
Issue Date
05 2013-02-22
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Copyright Huawei Technologies Co., Ltd. 2013. All rights reserved.

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HUAWEI ME906X LTE M.2 Module Hardware Guide
About This Document
About This Document

History
Version 01 Date 2012-11-15 Chapter Descriptions Draft Version. This document is subject to change since ME906X is still under development. All All Deleted WCDMA Band5 and Band19 of ME906J. Added WCDMA Band5 and Band19 of ME906J according to the communication with carrier. Changed pin 60, 62, 64 definitions from Reserved to COEX in Table 3-1. Added Huawei M.2 reference design. Added M.2 Naming Nomenclature. Updated description of Tunable antenna control. Added 1.13mm cable is recommended. Updated CDMA 2000 to CDMA 2100 in Table 4-3. Updated LTE Tx min. from 21 to 22 in Table 4-8. Updated LTE Tx min. from 21 to 22 in Table 4-9. Deleted GSM related information, and updated LTE Tx min. from 21 to 22 in Table 4-10. 5.5.2 Updated Test Value in Table 5-7. Updated Band LTE Band XII to LTE Band VII in Table 5-11. 8.2 Updated the certification list in Table 8-1.
02 03
2012-11-16 2012-11-20
3.2 10 04 2012-12-11 3.2 3.7 3.11.2 4.2 4.4.2
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Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd.
About This Document
Version
Date
Chapter 10
Descriptions Updated SIM_PWR which was missed. Updated RESET# to be 3.3V tolerant in Table 3-1. Updated descriptions of power supply requirements. Updated descriptions of Power_On_Off. Updated descriptions of RESET#. Updated descriptions of USIM ESD protection component requirement. Updated the bottom label. Updated the interface reference design.
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3.2 3.3.2 3.4.2 3.4.3 3.6.2 6.3 10
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Contents
Contents
1 Introduction.................................................................................................................................... 8 2 Overall Description ...................................................................................................................... 9
2.1 About This Chapter ........................................................................................................................... 9 2.2 Function Overview............................................................................................................................ 9 2.3 Circuit Block Diagram ...................................................................................................................... 11
3 Description of the Application Interfaces .............................................................................. 13

3.1 About This Chapter ......................................................................................................................... 13 3.2 75-pin Gold Finger.......................................................................................................................... 13 3.3 Power Interface .............................................................................................................................. 19 3.3.1 Overview ................................................................................................................................ 19 3.3.2 Power Supply 3.3 V Interface ................................................................................................ 19 3.3.3 USIM Power Output UIM_PWR ............................................................................................ 21 3.4 Signal Control Interface .................................................................................................................. 21 3.4.1 Overview ................................................................................................................................ 21 3.4.2 Power_On_Off Control Pin .................................................................................................... 22 3.4.3 RESET# Pins ......................................................................................................................... 26 3.4.4 LED# Pin ............................................................................................................................... 28 3.4.5 W_DISABLE# Pin .................................................................................................................. 29 3.4.6 GPS_DISABLE# Pin.............................................................................................................. 29 3.4.7 Wake_On_WWAN# Pin ......................................................................................................... 30 3.4.8 BodySAR_N Pin .................................................................................................................... 30 3.4.9 SIM_DET Pin ......................................................................................................................... 31 3.5 USB Interface ................................................................................................................................. 33 3.6 USIM Card Interface ...................................................................................................................... 35 3.6.1 Overview ................................................................................................................................ 35 3.6.2 Circuit Recommended for the USIM Card Interface .............................................................. 35 3.7 Tunable Antenna Control ................................................................................................................ 36 3.8 Config Pins ..................................................................................................................................... 37 3.9 Reserved Pins ................................................................................................................................ 38 3.10 NC Pins ........................................................................................................................................ 38 3.11 RF Antenna Interface.................................................................................................................... 38 3.11.1 RF Connector location ......................................................................................................... 38
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3.11.2 Coaxial RF Connector Guidelines ....................................................................................... 39
4 RF Specifications ......................................................................................................................... 43
4.1 About This Chapter ......................................................................................................................... 43 4.2 Operating Frequencies ................................................................................................................... 43 4.3 Conducted RF Measurement ......................................................................................................... 45 4.3.1 Test Environment ................................................................................................................... 45 4.3.2 Test Standards ....................................................................................................................... 46 4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 46 4.4.1 Conducted Receive Sensitivity .............................................................................................. 46 4.4.2 Conducted Transmit Power ................................................................................................... 49 4.5 Antenna Design Requirements ...................................................................................................... 52 4.5.1 Antenna Design Indicators..................................................................................................... 52 4.5.2 Interference ........................................................................................................................... 54 4.5.3 Antenna Requirements .......................................................................................................... 54 4.5.4 Radio Test Environment ........................................................................................................ 58
5 Electrical and Reliability Features ........................................................................................... 60

5.1 About This Chapter ......................................................................................................................... 60 5.2 Absolute Ratings ............................................................................................................................ 60 5.3 Operating and Storage Temperatures and Humidity ...................................................................... 61 5.4 Electrical Features of Application Interfaces .................................................................................. 61 5.5 Power Supply Features .................................................................................................................. 62 5.5.1 Input Power Supply ............................................................................................................... 62 5.5.2 Power Consumption .............................................................................................................. 63 5.6 Reliability Features ......................................................................................................................... 75 5.7 EMC and ESD Features ................................................................................................................. 77
6 Mechanical Specifications ......................................................................................................... 78

6.1 About This Chapter ......................................................................................................................... 78 6.2 Dimensions of ME906X .................................................................................................................. 78 6.3 Label(TBD) ..................................................................................................................................... 79 6.4 Packing System(under development) ............................................................................................ 81
7 Installation.................................................................................................................................... 82
7.1 About This Chapter ......................................................................................................................... 82 7.2 Connect ME906X to board ............................................................................................................. 82 7.3 Antenna Plug .................................................................................................................................. 83
8 Certifications ................................................................................................................................ 85
8.1 About This Chapter ......................................................................................................................... 85 8.2 Certifications ................................................................................................................................... 85
9 Safety Information ...................................................................................................................... 87

9.1 Interference .................................................................................................................................... 87
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9.2 Medical Device ............................................................................................................................... 87 9.3 Area with Inflammables and Explosives ......................................................................................... 87 9.4 Traffic Security................................................................................................................................ 88 9.5 Airline Security................................................................................................................................ 88 9.6 Safety of Children ........................................................................................................................... 88 9.7 Environment Protection .................................................................................................................. 88 9.8 WEEE Approval .............................................................................................................................. 88 9.9 RoHS Approval ............................................................................................................................... 88 9.10 Laws and Regulations Observance ............................................................................................. 89 9.11 Care and Maintenance ................................................................................................................. 89 9.12 Emergency Call ............................................................................................................................ 89 9.13 Specific Absorption Rate (SAR) ................................................................................................... 89 9.14 Regulatory Information ................................................................................................................. 90 9.14.1 CE Approval (European Union) ........................................................................................... 90 9.14.2 FCC Statement .................................................................................................................... 90
10 Appendix A Circuit of Typical Interface .............................................................................. 91 11 Appendix B Acronyms and Abbreviations .......................................................................... 92
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Introduction
1
Table 1-1 ME906X series product name Product name ME906V ME906E ME906J Description LTE M.2 Module for North America. LTE M.2 Module for Europe. LTE M.2 Module for Japan.
Introduction
This document describes the hardware application interfaces and air interfaces that are provided when the HUAWEI ME906X LTE M.2 Module (hereinafter referred to the ME906X module) is used. M.2 is the new name for NGFF (Next Generation Form Factor). This document helps you to understand the interface specifications, electrical features and related product information of the ME906X module. ME906X is a general name for ME906V, ME906E and ME906J.
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Overall Description
2
2.1 About This Chapter

Overall Description
This chapter gives a general description of the ME906X module and provides: Function Overview Circuit Block Diagram
2.2 Function Overview

Table 2-1 Features Feature Physical Features Operating Bands (ME906V) Description Dimensions (L W H): 42 mm 30 mm 2.3 mm Weight: <10 g LTE: FDD Band 1,2,4,5,8,13,17, all bands with diversity WCDMA/HSDPA/HSUPA/HSPA+: Band 1,2,4,5,8, all bands with diversity CDMA 1X/CDMA EVDO Rev.A: BC0,BC1, all bands with diversity GSM/GPRS/EDGE: 850/900/1800/1900MHz GPS/GLONASS: L1 Operating Bands (ME906E) LTE:FDD Band 1,2,3,5,7,8,20, all bands with diversity WCDMA/HSDPA/HSUPA/HSPA+:Band 1,2,5,8, all bands with diversity GSM/GPRS/EDGE: 850/900/1800/1900MHz GPS/GLONASS: L1
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Overall Description
Feature Operating Bands (ME906J)
Description LTE:FDD Band 1,11,18,19,21,all bands with diversity CDMA 1X/CDMA EVDO Rev.B: BC0,BC6, all bands with diversity WCDMA/HSDPA/HSUPA/HSPA+: Band 1,5,6,19, all bands with diversity GPS/GLONASS: L1
Operating Temperature Storage Temperature Moisture Power Voltage
Normal operating temperature: - 10 C ~ + 55 C Extended operating temperature[1]: - 20 C ~ + 70 C - 40 C ~ + 85 C RH5% ~ RH95% 3.135 V ~ 4.4 V (3.3 V is typical) USIM (3.0 V or 1.8 V) USIM Hot Swap Detection(SIM_DET pin) USB 2.0 (High-Speed) Power_On_Off pin RESET# pin
Application Interface (75-pin Gold Finger)
LED# pin W_DISABLE# pin GPS_DISABLE# pin Tunable Antenna control (4 GPIOs) Wake_On_WWAN# pin BodySAR_N pin Power supply (5 pins)
Antenna Connectors SMS
MAIN and AUX(supports Diversity and GPS simultaneously) MM4829-2702RA4 by MURATA or other equivalent parts Supporting MO and MT Supporting formats of PDU Point-to-point and cell broadcast
Data Services (ME906V)
GPRS: DL 85.6 kbps /UL 85.6 kbps EDGE: DL 236.8 kbps/UL: 236.8 kbps WCDMA CS: DL 64 kbps /UL 64 kbps WCDMA PS: DL 384 kbps /UL 384 kbps HSPA+: DL 21.6 Mbps /UL 5.76 Mbps
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Overall Description
Feature
Description DC-HSPA+ :DL 42 Mbps/UL 5.76 Mbps LTE FDD: DL:100 Mbps/UL 50 Mbps @20M BW cat3
Data Services (ME906E)
GPRS: DL 85.6 kbps /UL 85.6 kbps EDGE: DL 236.8 kbps/UL: 236.8 kbps WCDMA CS: DL 64 kbps /UL 64 kbps WCDMA PS: DL 384 kbps /UL 384 kbps HSPA+: DL 21.6 Mbps /UL 5.76 Mbps DC-HSPA+ :DL 42 Mbps/UL 5.76 Mbps LTE FDD: DL:100 Mbps/UL 50 Mbps @20M BW cat3
Data Services (ME906J)
WCDMA PS: DL 384 kbps/UL 384 kbps HSPA+: DL 21.6 Mbps /UL 5.76 Mbps DC-HSPA+: DL 42 Mbps/UL 5.76 Mbps CDMA 1x: DL 153.6 kbps/UL 153.6 kbps EVDO Rev.A: DL 3.1 Mbps /UL 1.8 Mbps EVDO Rev.B: DL 14.7 Mbps/UL 5.4 Mbps LTEDL:100 Mbps/UL 50 Mbps @20M BW cat3
Operating System
[1]:
Windows 8, Windows 7
When the ME906X module works at - 20 C ~ -10and +55~ + 70 C, NOT all its RF performances comply with the 3GPP TS 45.005 specifications.
2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the ME906X module. The application block diagram and major functional units of the ME906X module contain the following parts:

Baseband controller Power manager Multi-chip package (MCP) memory Radio Frequency (RF) transceiver RF Front End
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Overall Description
Figure 2-1 Circuit block diagram of the ME906X module

SIM_DET USIM ANTCTL BodySAR_N Wake_On_WWAN# LED# NGFF Interface W_DISABLE# GPS DISABLE# RESET# USB Power on off Power Manager DRX & GPS signal RF Connector RF Connector BASE BAND Dig RF Tx signal EBU MCP
RF TRANSCEIVER
PRx signal
RF Front End
DRX signal
GPS signal
Power
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Description of the Application Interfaces

This chapter mainly describes the application interfaces of the ME906X module, including:

75-pin Gold Finger Power Interface Signal Control Interface USB Interface USIM Card Interface Tunable Antenna Control Config Pins RF Antenna Interface
3.2 75-pin Gold Finger

The ME906X module has a 75-pin Gold Finger as its external interface. For details about the module dimensions, see 6.2 Dimensions of ME906X.
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Figure 3-1 shows the sequence of pins on the 75-pin signal interface of the ME906X module. Figure 3-1 TOP view of Gold Finger interface pins
Table 3-1 shows the definitions of the 75-pin interface (67 for signals and 8 for notch) of the ME906X module. As M.2 Nomenclature, ME906X is Type 3042-S3-B (30 mm 42 mm, Max Component Height on Top is 1.5 mm and single-sided, Key ID is B.)
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Table 3-1 Definitions of pins on the M.2 interface No Pin Name Normal CONFIG_3 3.3 V Ground 3.3 V Ground I/O Description Connected to Ground internally. 1 2 3 4 5 O PI PI PI PI ME906X is configured as WWAN-SSIC 0. Power supply Ground Power supply Ground A single control to turn On/Off WWAN. When it is Low, WWAN powers off. 6 Power_On_Off I When it is High, WWAN powers on. Its internally pulled to Low. Its 3.3 V tolerant but can be driven by either 1.8 V or 3.3 V GPIO. 7 USB_D+ IO USB Data + defined in the USB 2.0 Specification. WWAN disable function 8 W_DISABLE# I When it is High, WWAN function is determined by Software AT commend. Default enabled. When it is Low, WWAN function will be turned off. 9 USB_DIO USB Data - defined in the USB 2.0 Specification. It is an open drain, active low signal, used to allow the M.2 card to provide status indicators via LED devices that will be provided by the system. Ground -0.3 3.3 3.6 -0.3 1.8 3.6 3.135 3.135 0 3.3 0 3.3 0 4.4 4.4 DC Characteristics (V) Min Typ. Max
10
LED#
Open Drain and requires a pull up resistor on the host 0 -
11 12 13 14 15 16 17 18
Ground Notch Notch Notch Notch Notch Notch Notch
PI
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No 19 20
Pin Name Normal Notch Reserved
I/O
Description
DC Characteristics (V) Min Typ. Max
Reserved for Future Use, please keep it NC in host side. No Connect internally.
-0.3
1.8
2.1
21
CONFIG_0
ME906X is configured as WWAN-SSIC 0. Reserved for Future Use, please keep it NC in host side. WWAN to wake up the host.
-0.3
1.8
2.1
22
Reserved Wake_On_WWAN # Reserved
23
It is open drain and active low. Reserved for Future Use, please keep it NC in host side. Hardware pin for BodySAR Detection
Open Drain and requires a pull up resistor on the host -0.3 1.8 2.1
24
25
BodySAR_N
When it is high, No TX power backoff (default) When it is Low, TX power backoff GPS disable function
-0.3
1.8
3.6
26
GPS_DISABLE#
When it is high, GPS function is determined by Software AT commend. When it is Low, GPS will be turned off
-0.3
3.3
3.6
27 28 29 30 31 32 33 34 35 36
Ground NC NC UIM_RESET NC UIM_CLK Ground UIM_DATA NC UIM_PWR
PI O O PI IO PO
Ground No Connect No Connect USIM Reset No Connect USIM clock Ground USIM DATA No Connect USIM POWER
-0.3 -0.3 -0.3 -0.3
0 1.8/2.85 1.8/2.85 0 1.8/2.85 1.8/2.85
1.98 /3.3 1.98 /3.3 1.98 /3.3 1.98 /3.3
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No 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60
Pin Name Normal NC NC Ground I2C_SCL NC I2C_SDA NC I2C_IRQ Ground SYSCLK NC TX_BLANKING NC NC Ground NC NC NC NC NC Ground NC ANTCTL0 COEX3
I/O PI IO IO I PI O PI PI O -
Description No Connect No Connect Ground I2C clock, This function is under development. No Connect I2C data, This function is under development. No Connect Interrupt signal to wake up the module. This function is under development. Ground System clock output for external GNSS module. This function is under development. No Connect Tx blanking signal for external GNSS module. This function is under development. No Connect No Connect Ground No Connect No Connect No Connect No Connect No Connect Ground No Connect Tunable antenna control signal, bit 0 For coexistence. This function is under development.
DC Characteristics (V) Min -0.3 Typ. 0 1.8 Max 2.1
-0.3
1.8
2.1
-0.3
1.8
2.1
-0.3
0 1.8
2.1
-0.3
1.8
2.1
-0.3 -0.3
0 0 1.8 1.8
2.1 2.1
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No 61 62 63 64 65
Pin Name Normal ANTCTL1 COEX2 ANTCTL2 COEX1 ANTCTL3
I/O O O O
Description Tunable antenna control signal, bit 1 For coexistence. This function is under development. Tunable antenna control signal, bit 2 For coexistence. This function is under development. Tunable antenna control signal, bit 3 SIM hot swap detection pin
DC Characteristics (V) Min -0.3 -0.3 Typ. 1.8 1.8 Max 2.1 2.1
-0.3 -0.3
1.8 1.8
2.1 2.1
-0.3 -0.3
1.8 1.8
2.1 2.1
66
SIM_DET
When SIM is present, SIM_DET is High(pulled up to 1.8V); When SIM is absent, SIM_DET is Low.
67 68 69 70 71 72 73 74 75
RESET# NC CONFIG_1 3.3V Ground 3.3V Ground 3.3V CONFIG_2
I O PI PI PI PI PI O
System reset, active low No Connect Connected to Ground internally. ME906X is configured as WWAN-SSIC 0. Power supply Ground Power supply Ground Power supply Connected to Ground internally. ME906X is configured as WWAN-SSIC 0.
-0.3 3.135 3.135 3.135 -
1.8 0 3.3 0 3.3 0 3.3 0
3.6 4.4 4.4 4.4 -
P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output. The Reserved pins are internally connected to the module. Therefore, these pins should not be used, just keep them disconnected, otherwise they may cause problems. Please contact us for more details about this information.
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3.3 Power Interface

3.3.1 Overview
The power supply part of the ME906X module contains:

3.3V pin for the power supply UIM_PWR pin for USIM card power output
Table 3-2 lists the definitions of the pins on the power supply interface. Table 3-2 Definitions of the pins on the power supply interface Pin No. Signal Name I/O Description DC Characteristics (V) Min. 2,4,70,72,74 36 3.3 V UIM_PWR PI PO Power supply for ME906X, 3.3V is recommended Power supply for USIM card 3.135 -0.3 Typ. 3.3 1.8/ 2.85 0 Max. 4.4 1.98 /3.3 -
3,5,11,27,33 ,39,45,51,57 ,71,73
Ground
PI
Ground
3.3.2 Power Supply 3.3 V Interface

The ME906X module power is supplied through the 3.3 V pins and the voltage ranges from 3.135 V to 4.4 V (typical value is 3.3 V). The ME906X provides 5 power pins, and 11 GND pins. To ensure that the ME906X module works normally, all the pins must be connected. The M.2 connector pin is defined as needing to support 500 mA/Pin continuous. When the ME906X module works at 2G mode, the module transmits at the maximum power, the transient peak current may reach 2.5 A. In this case, the power pin voltage will drop. Make sure that the voltage does not drop below 3.135 V in any case. The traces of the power supply should be as short and wide as possible. It s recommended that at least 220 uF capacitance is added onto the 3.3 V power rails and as close to the M.2 connector as possible. Customer can reduce the capacitance if it can be guaranteed that 3.3 V doesnt drops below 3.135 V in any case. Figure 3-2 shows the recommended power circuit of ME906X module.
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Figure 3-2 Recommended power circuit of ME906X module
3.135 V is the minimum voltage supplied to ME906X by the host, and 3.3 V must never be under 3.135 V in any case, which is shown as follow:
If customer wants to make ME906 power cycled, the 3.3 V must stay below 1.8 V for more than 100 ms. The sequence is shown as below. Figure 3-3 shows the power supply time sequence between restart.
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Figure 3-3 ME906X power supply time sequence between restart
Parameter Toff
Remarks Power off time
Time(Min) 100
Unit ms
3.3.3 USIM Power Output UIM_PWR

Through the UIM_PWR power supply interface, the ME906X module can supply 1.8 V or 2.85 V power to UIM card. The transient current can reach 200 mA, so special attention on PCB design should be taken at the host side.
3.4 Signal Control Interface

3.4.1 Overview
The signal control part of the interface in the ME906X module consists of the following:

Power On/Off (Power_On_Off) pin System reset (RESET#) pin LED control (LED#) pin WWAN disable control (W_DISABLE#) pin GPS disable control (GPS_DISABLE#) pin Wake on out from module (Wake_On_WWAN#) pin BodySAR detection (BodySAR_N) pin UIM detection (SIM_DET) pin
Table 3-3 lists the pins on the signal control interface.
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Table 3-3 Pins on the signal control interface Pin No. Pin Name I/O Description DC Characteristics(V) Min. A single to turn On/Off WWAN. When its Low, WWAN powers off. 6 Power_On_Off I When its High, WWAN powers on. Its internally pulled to Low. Its 3.3 V tolerant but can be driven by either 1.8 V or 3.3 V GPIO. 67 RESET# I System reset, active low It is an open drain, active low signal, used to allow the M.2 card to provide status indicators via LED devices that will be provided by the system. WWAN disable function 8 W_DISABLE# I When its High, WWAN function is determined by Software AT commend. Default enabled. When its low, WWAN function will be turned off. GPS disable function 26 GPS_DISABLE# I When its High, GPS function is determined by Software AT commend. Default enabled. When its low, GPS will be turned off 23 Wake_On_WWAN# O It is Open drain, WWAN to wake up the host, active LOW. Hardware pin for BodySAR Detection. 25 BodySAR_N I When its High, No TX power backoff (default); When its low, TX power backoff. SIM hot swap detection pin 66 SIM_DET I When SIM is present, SIM_DET is High(pulled up to 1.8V); When SIM is absent, SIM_DET is Low. -0.3 1.8 2.1 -0.3 1.8 3.6 Open Drain and requires a pull up resistor on the host -0.3 3.3 3.6 -0.3 3.3 3.6 -0.3 1.8 3.6 -0.3 1.8 3.6 Typ. Max.
10
LED#
Open Drain and requires a pull up resistor on the host
3.4.2 Power_On_Off Control Pin

The ME906X module can be controlled to power on/off by the Power_On_Off pin.
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Table 3-4 Two States of Power_On_Off Item. 1 Pin state High Description ME906X powers on. NOTE: If ME906X needs to power on automatically, the Power_On_Off pin must be pulled up to 3.3 V. 2 Low MU906X powers off. Its internally pulled low with a weak pull-down resistor.
If ME906 is powered by regulated 3.3V

If ME906 is powered by 3.3 V voltage regulator (such as notebook or Ultrabook), Power_On_Off should be pulled up to 3.3 V through a resistor. The pull up resistor should be not larger than 10 k . Following is the power On/Off sequence: 1. 2. 3. The module gets 3.3 V when supply for the module is switched on. The module turns On since Power_On_Off is pulled up to 3.3 V by the host. Host cut off 3.3 V supply to power off the module.
The recommended circuit is as below: Figure 3-4 Recommended connections of Power_On_Off pins (Auto power)
Power on sequence
Do not toggle RESET# during power on sequence. To pull RESET# low will extend time for module startup. Recommend power on timing is as below:
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Figure 3-5 Recommend power on timing
Power off Sequence

To cut off 3.3 V will power off the module. Figure 3-6 Recommend power off timing ( cut off 3.3 V )
If ME906 is connected directly to battery

For use case ME906X is connected directly to battery, such as Tablet platforms, Power_On_Off should be controlled by a GPIO from host to control ME906X power On/Off. Its critical to make sure the module is safely shut off when the Tablet SoC is shut off. There will be current leakage if the module is not shut off properly. So its important to keep Power_On_Off logic low for more than 500ms to shut off the module. The recommended connections are as below:
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Figure 3-7 Recommended connections of Power_On_Off pins (Control)
Power on sequence
Do not toggle RESET# during power on sequence, to pull RESET# low will extend time for module startup. Recommend power on timing is as below: Figure 3-8 Recommend power on timing
Power off Sequence

Keep Power_On_Off logic low for more than 500ms to shut off the module.
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Figure 3-9 Recommend power off timing (connect to battery)
If there is limitation on the controlling GPIO to be programmable 500ms, the below hardware solution can be used: Figure 3-10 Power on off circuit (hardware solution)
3.4.3 RESET# Pins

The ME906X module can be reset through the RESET# pin asynchronous, active low. Whenever this pin is active, the modem will immediately be placed in a Power On reset condition. Care should be taken for this pin unless there is a critical failure and all other methods of regaining control and/or communication with the WWAN sub-system have failed. To pull low RESET# more than 20ms will reset the module. RESET# is optional, it can be no connect. To pull low Power_On_Off for more than 50ms can work as a reset. RESET# is internal pulled up to 1.8V, which is automatically on when 3.3V is applied even though Power_On_Off is low. Cautions should be taken on circuit design or there may be back driving issue. Hardware circuit for RESET# (option 1) GPIO is high-impedance when AP is powered off.
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Hardware circuit for RESET# (option 2) GPIO is not high-impedance when AP is powered off. Use 2 NMOSFET so that the logic of RESET# and GPIO are the same.
Hardware circuit for RESET# (option 3) GPIO is not high-impedance when AP is powered off. Use only one NMOSFET, in this case the logic of RESET# and GPIO1 is reversed.
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As the RESET# signal is relatively sensitive, it is recommended to install a 33 pF capacitor near to the M.2 pin. Triggering the RESET# signal will lead to loss of all data in the modem and the removal of system drivers. It will also disconnect the modem from the network resulting in a call drop.
3.4.4 LED# Pin

ME906X provides an open drain signal to indicate the RF status. Table 3-5 State of the LED# pin No. 1 2 Operating Status RF function is turned on RF function is turned off LED# Outputs Low Outputs High
The figure below shows the recommended circuits of the LED# pin. The brightness of LED can be adjusted by adjusting the resistance of the series resistor.
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Figure 3-11 Driving circuit
3.4.5 W_DISABLE# Pin

ME906X provides a hardware pin (W_DISABLE#) to disable or enable the radio. Besides, the radio can also be enabled or disabled through software AT commands. Table 3-6 Function of the W_DISABLE# pin No. 1 2 3 W_DISABLE# Low High Floating Function WWAN function will be turned off. WWAN function is determined by Software AT commend. Default enabled. WWAN function is determined by Software AT commend. Default enabled.
3.4.6 GPS_DISABLE# Pin

ME906X provides a hardware pin (GPS_DISABLE#) to disable or enable the GPS. Besides, the GPS can also be enabled or disabled through software AT commands. Table 3-7 Function of the GPS_DISABLE# pin No. 1 2 GPS_DISABLE# Low High Function GPS function is disabled. GPS function is determined by Software AT command. Default enabled.
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No. 3
GPS_DISABLE# Floating
Function GPS function is determined by Software AT command. Default enabled.
3.4.7 Wake_On_WWAN# Pin

ME906X provides an open drain output Wake_On_WWAN# pin to wake host, which is low active. Figure 3-12 Wave form of the Wake_On_WWAN# pin
Figure 3-13 Connections of the Wake_On_WWAN# pin
3.4.8 BodySAR_N Pin

ME906X provides an input pin BodySAR_N for Body SAR detection.
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Table 3-8 Function of the BodySAR_N pin No. 1 2 3 BodySAR_N Low High Floating Function MAX TX power will be back off by setting through AT command MAX TX power will NOT be back off (default) MAX TX power will NOT be back off
If BodySAR_N pin is used to monitor the proximity sensor output directly, there are some essential preconditions for this hardware solution. ME906X cant provide any control signal for the proximity sensor, and any control or programming required by the proximity sensor should be handled by the HOST side. Figure 3-14 Connections example of the BodySAR_N pin
3.4.9 SIM_DET Pin

ME906X supports USIM Hot Swap function. ME906X provides an input pin (SIM_DET) to detect whether the USIM card is present or not. This pin is a level trigger pin. Table 3-9 Function of the SIM_DET pin No. 1 SIM_DET High level function USIM Card insertion. If the USIM Card is present, SIM_DET should be High.
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No. 2
SIM_DET Low level
function USIM Card removal. If the USIM Card is absent, SIM_DET should be Low.
Figure 3-15 Connections of the SIM_DET pin
CD is a pin detecting of USIM in the SIM Socket, in normal, there will be a detect pin in the SIM Socket.
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The Normal SHORT SIM connector should be employed. The logic of SIM_DET is shown as below. High represents that SIM is inserted; Low represents that SIM is removed.
WWAN Module
1.8V SIM connector Switch SIM installed = Not Connected SIM_DET SIM not installed = GND Modem Processor
When SIM is inserted (hot), SIM_DET will change from Low to High; When SIM is removed (hot), SIM_DET will change from High to Low; ME906X will detect the level of SIM_DET to support the hot swap.
3.5 USB Interface

The ME906X is compliant with USB 2.0 high speed protocol. The USB input/output lines are following USB 2.0 specifications. Definition of the USB interface: Pin No. 7 9 Pin Name I/O Description DC Characteristics (V) Min. USB_D+ USB_DI/O I/O USB data signal D+ USB data signal DTyp. Max. -
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Figure 3-16 Recommended circuit of USB interface
Figure 3-17 shows the timing sequence between 3.3 V and USB D+. Figure 3-17 ME906X USB D+ and 3.3 V power on timing
3.3 V
Power_On_Off
Tpd
USB D+
Parameter Tpd
Remarks Power Valid to USB D+ high
Time(Nominal value) TBD
Unit s
The layout design of this circuit on the host board should comply with the USB 2.0 high speed protocol, with differential characteristic impedance of 90 .
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3.6 USIM Card Interface

3.6.1 Overview
The ME906X module provides a USIM card interface complying with the ISO 7816-3 standard and supports both 1.8 V and 3.0 V USIM cards. Table 3-10 USIM card interface signals Pin No. 30 32 34 36 Pin Name I/O Description DC Characteristics (V) Min. UIM_RESET UIM_CLK UIM_DATA UIM_PWR O O IO PO USIM Reset USIM clock USIM DATA USIM POWER -0.3 -0.3 -0.3 -0.3 Typ. 1.8/2.85 1.8/2.85 1.8/2.85 1.8/2.85 Max. 1.98/3.3 1.98/3.3 1.98/3.3 1.98/3.3
3.6.2 Circuit Recommended for the USIM Card Interface

As the ME906X module is not equipped with an USIM socket, you need to place an USIM socket on the user interface board. The figure below shows the circuit of the USIM card interface. Figure 3-18 Circuit of the USIM card interface
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The ESD protection component should choose low capacitance. The capacitance of the component should lower than 10pF. To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the USIM socket should be placed near the M.2 interface (it is recommended that the PCB circuit connects the M.2 interface and the USIM socket does not exceed 100 mm), because a long circuit may lead to wave distortion, thus affecting signal quality. It is recommended that you wrap the area adjacent to the SIM_CLK and SIM_DATA signal wires with ground. The Ground pin of the USIM socket and the Ground pin of the USIM card must be well connected to the power Ground pin supplying power to the ME906X module. A 100 nF capacitor (0402 package is recommended so that larger capacitance such as 1 uF can be employed if necessary) and a 33 pF capacitor are placed between the SIM_PWR and Ground pins in parallel. Three 33 pF capacitors are placed between the SIM_DATA and Ground pins, the SIM_RST and Ground pins, and the SIM_CLK and Ground pins in parallel to filter interference from RF signals. It is recommended to take electrostatic discharge (ESD) protection measures near the USIM card socket. Transient voltage suppressor diode should be placed as close as possible to the USIM socket, and the Ground pin of the ESD protection component is well connected to the power Ground pin that supplies power to the ME906X module.
3.7 Tunable Antenna Control

The module provides 4 tunable antenna control pins. Table 3-11 List of ANTCTL pins Pin No. 59 61 63 65 Pin Name I/O Description DC Characteristics(V) Min. ANTCTL0 ANTCTL1 ANTCTL2 ANTCTL3 O O O O Tunable antenna control signal bit 0 Tunable antenna control signal bit 1 Tunable antenna control signal bit 2 Tunable antenna control signal bit 3 -0.3 -0.3 -0.3 -0.3 Typ. 1.8 1.8 1.8 1.8 Max. 2.1 2.1 2.1 2.1
The mapping of each band to ANTCTL outputs is configurable. More information should refer HUAWEI ME906X LTE M.2 Module AT Command Interface Specification (Under Development).
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3.8 Config Pins

The module provides 4 config pins. ME906X is configured as WWAN-SSIC 0. Table 3-12 List of CONFIG pins Pin No. 1 21 69 75 Pin Name I/O Description DC Characteristics(V) Min. CONFIG_3 CONFIG_0 CONFIG_1 CONFIG_2 O O O O Connected to GND internally. No Connect internally. Connected to GND internally. Connected to GND internally. Typ. 0 0 0 Max. -
In the M.2 Spec, the 4 pins are defined as below: Table 3-13 List of Config pins Config_0 (Pin 21) NC Config_1 (Pin 69) Ground Config_2 (Pin 75) Ground Config_3 (Pin 3) Ground Module type and Main host interface WWAN-SSIC Port Configuration 0
The GPIO0~7 pins have configurable assignments. There are 4 possible functional pin out configurations. These 4 configurations are called Port Config0~3. In each Port Configuration each GPIO is defined as a specific functional pin. The GPIO pin assignment can be seen in Table 3-14 below. ME906X supports Config 0. But the audio function is not implemented in ME906X. Table 3-14 GPIO Pin Function Assignment per Port Configuration(not supported default) GPIO Pin GPIO_0 (Pin40) GPIO_1 (Pin 42) GPIO_2 (Pin 44) GPIO_3 (Pin 46) GPIO_4 (Pin 48) GPIO_5 (Pin 20) GPIO_6 (Pin 22) GPIO_7 (Pin 24) Port Config 0 (GNSS+Audio ver1) GNSS_SCL GNSS_SDA GNSS_IRQ SYSCLK TX_Blanking Audio_0 (not supported) Audio_1 (not supported) Audio_2 (not supported)
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3.9 Reserved Pins

The module provides some reserved pins. All of reserved pins cannot be used by the customer. All of them should be Not Connected (NC). If customer wants to have other special functions, please contact us. Table 3-15 List of reserved pins Pin No. 20 22 24 Pin Name I/O Description DC Characteristics(V) Min. Reserved Reserved Reserved Reserved for Future Use Reserved for Future Use Reserved for Future Use -0.3 -0.3 -0.3 Typ. 1.8 1.8 1.8 Max. 2.1 2.1 2.1
3.10 NC Pins
The module has some NC pins. All of NC pins are not connected in the module. Table 3-16 List of NC pins Pin No. Pin Name I/O Description DC Characteristics(V) Min. 28,29,31,35,37,38,41,43,4 7,49,52,53,54,55,56,58,68 NC No Connect Typ. Max. -
3.11 RF Antenna Interface

3.11.1 RF Connector location
ME906X module provides 2 antenna connectors for connecting the external antennas.
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Figure 3-19 RF antenna connectors
3.11.2 Coaxial RF Connector Guidelines

The antenna interface must be used with coaxial cables with characteristic impedance of 50 . The ME906X module supports the buckled RF connector antenna connection methods: buckled RF connector MM4829-2702RA4 by MURATA or other equivalent connectors
Figure 3-20 shows the RF connector dimensions.
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Figure 3-20 RF connector dimensions
Table 3-17 The major specifications of the RF connector Rated Condition Frequency range Characteristic impedance DC to 6 GHz 50 Environmental Condition Temperature range: 40 C to +85 C
There are two kinds of coaxial cables (0.81 mm and 1.13 mm) mating the RF connector in the ME906X. 1.13 mm cable is recommended. Figure 3-21 shows the specifications of 0.81 mm coaxial cable mating the recommended RF connector.
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Figure 3-21 Specifications of 0.81 mm coaxial cable mating with the RF connector
Figure 3-22 shows the connection between the RF connector and the 0.81 mm cable. Figure 3-22 Connection between the RF connector and the 0.81 mm cable
Figure 3-23 shows the specifications of 1.13 mm coaxial cable mating the recommended RF connector.
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Figure 3-23 Specifications of 1.13 mm coaxial cable mating with the RF connector
Figure 3-24 shows the connection between the RF connector and the 1.13 mm cable. Figure 3-24 Connection between the RF connector and the 1.13 mm cable
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4

RF Specifications
This chapter describes the RF specifications of the ME906X module, including: Operating Frequencies Conducted RF Measurement Conducted Rx Sensitivity and Tx Power Antenna Design Requirements
4.2 Operating Frequencies

Table 4-1 to Table 4-3 shows the RF bands supported by ME906X. Table 4-1 RF bands of ME906V Operating Band UMTS Band I UMTS Band II UMTS Band IV(AWS) UMTS Band V UMTS Band VIII GSM 850 GSM 900 GSM 1800(DCS) GSM 1900(PCS) LTE Band I LTE Band II Tx 1920 MHz1980 MHz 1850 MHz1910 MHz 1710 MHz1755 MHz 824 MHz849 MHz 880 MHz915 MHz 824 MHz849 MHz 880 MHz915 MHz 1710 MHz1785 MHz 1850 MHz1910 MHz 1920 MHz1980 MHz 1850 MHz1910 MHz Rx 2110 MHz2170 MHz 1930 MHz1990 MHz 2110 MHz2155 MHz 869 MHz894 MHz 925 MHz960 MHz 869 MHz894 MHz 925 MHz960 MHz 1805 MHz1880 MHz 1930 MHz1990 MHz 2110 MHz2170 MHz 1930 MHz1990 MHz
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Operating Band LTE Band IV LTE Band V LTE Band VIII LTE Band XIII LTE Band XVII CDMA 800(BC0) CDMA 1900(BC1) GPS L1 GLONASS
Tx 1710 MHz1755 MHz 824 MHz849 MHz 880 MHz915 MHz 777 MHz787 MHz 704 MHz716 MHz 824 MHz849 MHz 1850 MHz1910 MHz / /
Rx 2110 MHz2155 MHz 869 MHz894 MHz 925 MHz960 MHz 746 MHz756 MHz 734 MHz746 MHz 869 MHz894 MHz 1930 MHz1990 MHz 1575.42 MHz 1602 MHz
Table 4-2 RF bands of ME906E Operating Band UMTS Band I UMTS Band II UMTS Band V UMTS Band VIII GSM 850 GSM 900 GSM 1800(DCS) GSM 1900(PCS) LTE Band I LTE Band II LTE Band III LTE Band V LTE Band VIII LTE Band VII LTE Band XX GPS L1 GLONASS Tx 1920 MHz1980 MHz 1850 MHz1910 MHz 824 MHz849 MHz 880 MHz915 MHz 824 MHz849 MHz 880 MHz915 MHz 1710 MHz1785 MHz 1850 MHz1910 MHz 1920 MHz1980 MHz 1850 MHz1910 MHz 1710 MHz1785 MHz 824 MHz849 MHz 880 MHz915 MHz 2500 MHz2570 MHz 832 MHz862 MHz / / Rx 2110 MHz2170 MHz 1930 MHz1990 MHz 869 MHz894 MHz 925 MHz960 MHz 869 MHz894 MHz 925 MHz960 MHz 1805 MHz1880 MHz 1930 MHz1990 MHz 2110 MHz2170 MHz 1930 MHz1990 MHz 1805 MHz1880 MHz 869 MHz894 MHz 925 MHz960 MHz 2620 MHz2690 MHz 791 MHz821 MHz 1575.42 MHz 1602 MHz
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Table 4-3 RF bands of ME906J Operating Band UMTS Band I UMTS Band V UMTS Band VI UMTS Band XIX LTE Band I LTE Band XI LTE Band XVIII LTE Band XIX LTE Band XXI CDMA 800(BC0) CDMA 2100(BC6) GPS L1 GLONASS Tx 1920 MHz1980 MHz 824 MHz849 MHz 830 MHz840 MHz 830 MHz845 MHz 1920 MHz1980 MHz 1427.9 MHz1447.9 MHz 815 MHz830 MHz 830 MHz845 MHz 1447.9 MHz1462.9 MHz 824 MHz849 MHz 1920 MHz1980 MHz / / Rx 2110 MHz2170 MHz 869 MHz894 MHz 875 MHz885 MHz 875 MHz890 MHz 2110 MHz2170 MHz 1475.9 MHz1495.9 MHz 860 MHz875 MHz 875 MHz890 MHz 1495.9 MHz1510.9 MHz 869 MHz894 MHz 2110 MHz2170 MHz 1575.42 MHz 1602 MHz + 0.5625*kHz
4.3 Conducted RF Measurement

4.3.1 Test Environment
Test instrument Power supply RF cable for testing Murata coaxial cable R&S CMU200, R&S CMW500 ,Agilent E5515C Keithley 2303, Agilent 66319 Rosenberger Precision Microwave Cable MXHP32HP1000
The compensation for different frequency bands relates to the cable and the test environment. The instrument compensation needs to be set according to the actual cable conditions.
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4.3.2 Test Standards

Huawei modules meet 3GPP TS51.010-1,3GPP TS34.121-1 and 3GPP TS36.521-1 test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed.
4.4 Conducted Rx Sensitivity and Tx Power

4.4.1 Conducted Receive Sensitivity
The conducted receive sensitivity is a key parameter that indicates the receiver performance of ME906X. The conducted receive sensitivity refers to the weakest signal that the module at the antenna port can receive. The BER must meet the 3GPP protocol requirements in the case of the minimum signal. The 3GPP Protocol Claim column in Table 4-4 to Table 4-6 lists the required minimum values, and the Test Value column lists the tested values of ME906X. Table 4-4 ME906V conducted Rx sensitivity (Unit: dBm) Item 3GPP Protocol Claim (dBm) GMSK (BER<2.43%) 8PSK (MCS5, BLER<10%) GSM900 GMSK (BER<2.43%) 8PSK (MCS5, BLER<10%) GSM1800 GMSK (BER<2.43%) 8PSK (MCS5, BLER<10%) GSM1900 GMSK (BER<2.43%) 8PSK (MCS5, BLER<10%) UMTS Band I (BER<0.1%) UMTS Band II (BER<0.1%) UMTS Band IV (BER<0.1%) UMTS Band VIII (BER<0.1%) < 102 < 98 < 102 < - 98 < 102 < 98 < 102 < 98 < 106.7 < 104.7 < 106.7 < 103.7 ME906V Test Value (dBm) Min. -TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD Typ. -TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD Max. 108 101 108 101 108 101 108 101 108 108 108 108
GSM850
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Item
3GPP Protocol Claim (dBm) < 104.7 < 97(10 MHz) < 95(10 MHz) < 97(10 MHz) < 95(10 MHz) < 94(10 MHz) < 94(10 MHz) < 94(10 MHz) 104 104
ME906V Test Value (dBm) Min. - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD Typ. - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD Max. 108 100(10 MHz) 98(10 MHz) 100(10 MHz) 100(10 MHz) 99(10 MHz) 99(10 MHz) 99(10 MHz) 106 106
UMTS Band V (BER<0.1%) LTE Band I (FDD QPSK throughput>95%) LTE Band II (FDD QPSK throughput>95%) LTE Band IV (FDD QPSK throughput>95%) LTE Band V (FDD QPSK throughput>95%) LTE Band VIII (FDD QPSK throughput>95%) LTE Band XIII (FDD QPSK throughput>95%) LTE Band XVII (FDD QPSK throughput>95%) CDMA 800(BC0) (FER<0.5%) CDMA 1900(BC1) (FER<0.5%)
Table 4-5 ME906E conducted Rx sensitivity (Unit: dBm) Item 3GPP Protocol Claim (dBm) GMSK (BER<2.43%) 8PSK (MCS5, BLER<10%) GSM900 GMSK (BER<2.43%) 8PSK (MCS5, BLER<10%) GSM1800 GMSK (BER<2.43%) 8PSK (MCS5, BLER<10%) < 102 < 98 < 102 < - 98 < 102 < 98 ME906E Test Value (dBm) Min. -TBD - TBD - TBD - TBD - TBD - TBD Typ. -TBD - TBD - TBD - TBD - TBD - TBD Max. 108 101 108 101 108 101
GSM850
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Item
3GPP Protocol Claim (dBm) GMSK (BER<2.43%) 8PSK (MCS5, BLER<10%) < 102 < 98 < 106.7 < 104.7 < 106.7 < 103.7 < 97(10 MHz) < 95(10 MHz) < 97(10 MHz) < 95(10 MHz) < 94(10 MHz) < 94(10 MHz) < 94(10 MHz)
ME906E Test Value (dBm) Min. - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD Typ. - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD - TBD Max. 108 101 108 108 108 108 100(10 MHz) 98(10 MHz) 97(10 MHz) 100(10 MHz) 98(10 MHz) 99(10 MHz) 99(10 MHz)
GSM1900
UMTS Band I (BER<0.1%) UMTS Band II (BER<0.1%) UMTS Band V (BER<0.1%) UMTS Band VIII (BER<0.1%) LTE Band I (FDD QPSK throughput>95%) LTE Band II (FDD QPSK throughput>95%) LTE Band III (FDD QPSK throughput>95%) LTE Band V (FDD QPSK throughput>95%) LTE Band VII (FDD QPSK throughput>95%) LTE Band VIII (FDD QPSK throughput>95%) LTE Band XX (FDD QPSK throughput>95%)
Table 4-6 ME906J conducted Rx sensitivity (Unit: dBm) Item 3GPP Protocol Claim (dBm) < 106.7 < 104.7 < 106.7 < 106.7 < 97(10 MHz) ME906J Test Value (dBm) Min. - TBD - TBD - TBD - TBD - TBD Typ. - TBD - TBD - TBD - TBD - TBD Max. 108 108 108 108 100(10 MHz)
UMTS Band I (BER<0.1%) UMTS Band V (BER<0.1%) UMTS Band VI (BER<0.1%) UMTS Band XIX (BER<0.1%) LTE Band I (FDD QPSK throughput>95%)
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Item
3GPP Protocol Claim (dBm) < 97(10 MHz) < 97(10 MHz) < 97(10 MHz) < 97(10 MHz) 104 104
ME906J Test Value (dBm) Min. - TBD - TBD - TBD - TBD - TBD - TBD Typ. - TBD - TBD - TBD - TBD - TBD - TBD Max. 100(10 MHz) 100(10 MHz) 100(10 MHz) 100(10 MHz) 106 106
LTE Band XI (FDD QPSK throughput>95%) LTE Band XVIII (FDD QPSK throughput>95%) LTE Band XIX (FDD QPSK throughput>95%) LTE Band XXI (FDD QPSK throughput>95%) CDMA 800(BC0) (FER<0.5%) CDMA 2100(BC6) (FER<0.5%)
Table 4-7 ME906X GPS specifications TTFF Cold start Warm start Hot Start Sensitivity Cold start Tracking TBD TBD TBD TBD TBD
1. 2.
The test values are the average of some test samples. LTE sensitivity is tested in SIMO.
4.4.2 Conducted Transmit Power

The conducted transmit power is another indicator that measures the performance of ME906X. The conducted transmit power refers to the maximum power that the module tested at the antenna port can transmit. According to the 3GPP protocol, the required transmit power varies with the power class. Table 4-8 to Table 4-10 lists the required ranges of the conducted transmit power of ME906X. The tested values listed in the Test Value column must range from the minimum power to the maximum power.
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Table 4-8 ME906V conducted Tx power (Unit: dBm) Item 3GPP Protocol Claim (dBm) GMSK(1Tx Slot) 8PSK(1Tx Slot) GSM900 GMSK(1Tx Slot) 8PSK(1Tx Slot) GSM1800 GMSK(1Tx Slot) 8PSK(1Tx Slot) GSM1900 GMSK(1Tx Slot) 8PSK(1Tx Slot) WCDMA Band I WCDMA Band II WCDMA Band IV WCDMA Band V WCDMA Band VIII LTE Band I LTE Band II LTE Band IV LTE Band V LTE Band VIII LTE Band XIII LTE Band XVII CDMA 800(BC0) CDMA 1900(BC1) 31 to 35 24 to 30 31 to 35 24 to 30 28 to 32 23 to 29 28 to 32 23 to 29 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 23 to 30 23 to 30 ME906V Test Value (dBm) Min. 31.5 26 31.5 26 28.5 25 28.5 25 22.5 22.5 22.5 22.5 22.5 22 22 22 22 22 22 22 23 23 Typ. 32.5 27 32.5 27 29.5 26 29.5 26 23.5 23.5 23.5 23.5 23.5 23 23 23 23 23 23 23 24 24 Max. 33.5 29 33.5 29 30.5 28 30.5 28 24.5 24.5 24.5 24.5 24.5 24 24 24 24 24 24 24 25 25
GSM850
Table 4-9 ME906E conducted Tx power (Unit: dBm) Item 3GPP Protocol Claim (dBm) GMSK(1Tx Slot) 8PSK(1Tx Slot) 31 to 35 24 to 30 ME906E Test Value (dBm) Min. 31.5 26 Typ. 32.5 27 Max. 33.5 29
GSM850
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Item
3GPP Protocol Claim (dBm) GMSK(1Tx Slot) 8PSK(1Tx Slot) 31 to 35 24 to 30 28 to 32 23 to 29 28 to 32 23 to 29 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25
ME906E Test Value (dBm) Min. 31.5 26 28.5 25 28.5 25 22.5 22.5 22.5 22.5 22 22 22 22 22 22 22 Typ. 32.5 27 29.5 26 29.5 26 23.5 23.5 23.5 23.5 23 23 23 23 23 23 23 Max. 33.5 29 30.5 28 30.5 28 24.5 24.5 24.5 24.5 24 24 24 24 24 24 24
GSM900
GSM1800
GMSK(1Tx Slot) 8PSK(1Tx Slot)
GSM1900
GMSK(1Tx Slot) 8PSK(1Tx Slot)
WCDMA Band I WCDMA Band II WCDMA Band V WCDMA Band VIII LTE Band I LTE Band II LTE Band III LTE Band V LTE Band VIII LTE Band VII LTE Band XX
Table 4-10 ME906J conducted Tx power (Unit: dBm) Item 3GPP Protocol Claim (dBm) 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 21 to 25 ME906J Test Value (dBm) Min. 22.5 22.5 22.5 22.5 22 22 22 22 Typ. 23.5 23.5 23.5 23.5 23 23 23 23 Max. 24.5 24.5 24.5 24.5 24 24 24 24
WCDMA Band I WCDMA Band V WCDMA Band VI WCDMA Band XIX LTE Band I LTE Band XI LTE Band XVIII LTE Band XIX
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Item
3GPP Protocol Claim (dBm) 21 to 25 23 to 30 20 to 24
ME906J Test Value (dBm) Min. 22 23 20 Typ. 23 24 21 Max. 24 25 22
LTE Band XXI CDMA 800(BC0) CDMA 2100(BC6)
4.5 Antenna Design Requirements

4.5.1 Antenna Design Indicators
Antenna Efficiency
Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna. The radiated power of an antenna is always lower than the input power due to the following antenna losses: return loss, material loss, and coupling loss. The efficiency of an antenna relates to its electrical dimensions. To be specific, the antenna efficiency increases with the electrical dimensions. In addition, the transmission cable from the antenna port of ME906X to the antenna is also part of the antenna. The cable loss increases with the cable length and the frequency. It is recommended that the cable loss is as low as possible, for example, U.FL-LP-088 made by HRS or equivalent. The following antenna efficiency (free space) is recommended for ME906X to ensure high radio performance of the module: Efficiency of the master antenna > 50% (3
dB), efficiency of the diversity antenna > 35% ( 5 dB),but especially,>60% in GNSS,
In addition, the efficiency should be tested with the transmission cable, the efficiency of
the diversity antenna should be more than half of the master antenna efficiency.
S11(VSWR) and S21

S11 (return loss) indicates the degree to which the input impedance of an antenna matches the reference impedance (50-ohm). S11 shows the resonance feature and impedance bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector analyzer. The following S11 values are recommended for the antenna of ME906X: S11 of the
master antenna < 7 dB, S11 of the diversity antenna < 6 dB. S21 indicates the isolation between the master antenna and the diversity antenna. The less S21 means the less coupling which is also a kind of antenna losses. S21 can be measured with a vector analyzer. The following S21 values are recommended for the antenna of ME906X: S21 < 15 dB
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Polarization
The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation. The linear polarization is recommended for the antenna of ME906X.
Radiation Pattern
The radiation pattern of an antenna reflects the radiation features of the antenna in the remote field region. The radiation pattern of an antenna commonly describes the power or field strength of the radiated electromagnetic waves in various directions from the antenna. The power or field strength varies with the angular coordinates ( and ), but is independent of the radial coordinates. The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal plane, and the incident waves of base stations are often in the horizontal plane. For this reason, the receiving performance is optimal. The following radiation patterns are recommended for the antenna of ME906X.
Master and diversity antenna: omnidirectional
Gain and Directivity

The radiation pattern of an antenna represents the field strength of the radiated electromagnetic waves in all directions, but not the power density that the antenna radiates in the specific direction. The directivity of an antenna, however, measures the power density that the antenna radiates. Gain, as another important parameter of antennas, correlates closely to the directivity. The gain of an antenna takes both the directivity and the efficiency of the antenna into account. The appropriate antenna gain prolongs the service life of relevant batteries. The following antenna gain is recommended for ME906X. Gain of the master antenna 3 dBi
ECC of the antenna

ECC is short for Envelope Correlation Coefficient. It's the cross-correlation value of the complex patterns of the master and diversity antenna. It indicates how similar the magnitude and the phase patterns of the two antenna are. If two antenna have no similarity, the ECC should be zero. Actually, the less ECC the better diversity performance. The following ECC is recommended for ME906X. ECC < 0.5(below 1GHz); ECC<0.4(above 1GHz)
The antenna consists of the antenna body and the relevant RF transmission cable. Take the RF transmission cable into account when measuring any of the preceding antenna indicators. Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, Pulse, etc.
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RF Specifications
4.5.2 Interference
Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module. To guarantee high performance of the module, the interference sources on the user board must be properly controlled. On the user board, there are various interference sources, such as the LCD, CPU, audio circuits, and power supply. All the interference sources emit interference signals that affect the normal operation of the module. For example, the module sensitivity can be decreased due to interference signals. Therefore, during the design, you need to consider how to reduce the effects of interference sources on the module. You can take the following measures: Use an LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module.
4.5.3 Antenna Requirements

The antenna for ME906X must fulfill the following requirements: Table 4-11 Antenna Requirements of ME906V Antenna Requirements Frequency range Depending on frequency band(s) provided by the network operator, the customer must use the most suitable antenna for that/those band(s) 70 MHz in GSM850 80 MHz in GSM900 170 MHz in DCS 140 MHz in PCS 41 MHz in LTE Band XIII 42 MHz in LTE Band XVII 70 MHZ in WCDMA850/ LTE Band V 80 MHz in WCDMA900/ LTE Band VIII 445 MHz in WCDMA1700 (AWS)/ LTE Band IV 140 MHz in WCDMA1900/ LTE Band II 250 MHz in WCDMA2100/ LTE Band I 70 MHz in CDMA 800 140 MHz in CDMA 1900
Bandwidth of main antenna
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Antenna Requirements Bandwidth of diversity antenna 25MHz in GSM850 35MHz in GSM900 75MHz in DCS 60MHz in PCS 10MHz in LTE Band XIII 12MHz in LTE Band XVII 25MHz in WCDMA850/LTE Band V 35MHz in WCDMA900/LTE Band VIII 45MHz in WCDMA 1700(AWS)/LTE Band IV 60MHz in WCDMA 1900/LTE Band II 60MHz in WCDMA 2100/LTE Band I 25MHz in CDMA 800 60MHz in CDMA 1900 35MHz in GNSS Gain Impedance Input power Gain < 3 dBi 50 > 31.5 dBm peak power in GSM LB > 28.5 dBm peak power in GSM HB > 22.5 dBm Average power in WCDMA > 22 dBm Average power in LTE > 23 dBm Average power in CDMA VSWR absolute max VSWR recommended <= 3:1 <= 2:1
Table 4-12 Antenna Requirements of ME906E Antenna Requirements Frequency range Depending on frequency band(s) provided by the network operator, the customer must use the most suitable antenna for that/those band(s)
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RF Specifications
Antenna Requirements Bandwidth of main antenna 70 MHz in GSM850 80 MHz in GSM900 170 MHz in DCS 140 MHz in PCS 250 MHz in WCDMA /LTE Band 1 140 MHz in WCDMA/LTE Band 2 70 MHz in WCDMA/LTE Band 5 80 MHz in WCDMA/LTE Band 8 170 MHz in LTE Band 3 190 MHz in LTE Band 7 71 MHz in LTE Band 20 Bandwidth of diversity antenna 25MHz in GSM850 35MHz in GSM900 75MHz in DCS 60MHz in PCS 60MHz in WCDMA/LTE Band 1 60MHz in WCDMA/LTE Band 2 25 MHz in WCDMA/LTE Band 5 35 MHz in WCDMA/LTE Band 8 75 MHz in LTE Band 3 70 MHz in LTE Band 7 30 MHz in LTE Band 20 35MHz in GNSS Gain Impedance Input power Gain < 3 dBi 50 > 31.5 dBm peak power in GSM LB > 28.5 dBm peak power in GSM HB > 22.5 dBm Average power in WCDMA > 22 dBm Average power in LTE VSWR absolute max VSWR recommended <= 3:1 <= 2:1
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Table 4-13 Antenna Requirements of ME906J Antenna Requirements Frequency range Depending on frequency band(s) provided by the network operator, the customer must use the most suitable antenna for that/those band(s) 250 MHz in WCDMA Band 1 70 MHZ in WCDMA Band5 55 MHz in WCDMA Band 6 60 MHz in WCDMA Band 19 70 MHz in CDMA 800 250 MHz in CDMA 2100 250 MHz in LTE Band 1 68 MHz in LTE Band 11 60 MHz in LTE Band 18 60 MHz in LTE Band 19 63 MHz in LTE Band 21 Bandwidth of diversity antenna 60 MHz in WCDMA Band 1 25 MHz in WCDMA Band 5 10 MHz in WCDMA Band 6 15MHz in WCDMA Band 19 25 MHz in CDMA 800 60 MHz in CDMA 2100 60 MHz in LTE Band 1 20 MHz in LTE Band 11 15 MHz in LTE Band 18 15 MHz in LTE Band 19 15 MHz in LTE Band 21 35MHz in GNSS Gain Impedance Input power Gain < 3 dBi 50 > 22.5 dBm Average power in WCDMA > 22 dBm Average power in LTE > 23 dBm Average power in CDMA VSWR absolute max VSWR recommended <= 3:1 <= 2:1
Bandwidth of main antenna
Furthermore if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC requirements:
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RF Specifications
This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the UC864-E/G/WD /WDU module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations.
4.5.4 Radio Test Environment

The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP), and TIS can be tested in a microwave testing chamber. Huawei has a complete set of OTA test environments (SATIMO microwave testing chambers and ETS microwave testing chambers). The testing chambers are certified by professional organizations and are applicable to testing at frequencies ranging from 380 MHz to 6 GHz. The test items are described as follows:
Passive Tests

Antenna efficiency Gain Pattern shape Envelope correlation coefficient
Active Tests

TRP: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems TIS: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems
Figure 4-1 shows the SATIMO microwave testing chamber.
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RF Specifications
Figure 4-1 SATIMO microwave testing chamber
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Electrical and Reliability Features

This chapter describes the electrical and reliability features of the interfaces in the ME906X module, including: Absolute Ratings Operating and Storage Temperatures and Humidity Electrical Features of Application Interfaces Power Supply Features Reliability Features EMC and ESD Features
5.2 Absolute Ratings
Table 5-1 lists the absolute ratings for the ME906X module. Using the ME906X module beyond these conditions may result in permanent damage to the module. Table 5-1 Absolute ratings for the ME906X module Symbol 3.3 V VI Specification External power voltage Data pin voltage Min. 0.5 0.5 Max. 5.0 3.6 Unit V V
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5.3 Operating and Storage Temperatures and Humidity

Table 5-2 lists the operating and storage temperatures and humidity for the ME906X module. Table 5-2 Operating and storage temperatures and humidity for the ME906X module Specification Normal operating temperatures[1] Extended temperatures[2] Ambient temperature for storage Moisture Min. 10 -20 40 5 Max. +55 +70 +85 95 Unit C C C %
[1]: When the ME906X module works at this temperature, all its RF indexes comply with the 3GPP TS 45.005 specifications. [2]: When the ME906X module works at this temperature, NOT all its RF indexes comply with the 3GPP TS 45.005 specifications.
5.4 Electrical Features of Application Interfaces

Table 5-3 Electrical features of Digital Pins Parameter BodySAR_N Description VIH VIL RESET VIH VIL Power_On_Off VIH VIL W_DISABLE VIH VIL GPS_DISABLE SIM_DET VIH VIL VIH Min. 1.24 0.3 1.24 0.3 1.24 0.3 1.24 0.3 1.24 0.3 1.24 Max. 3.6 0.3 2.1 0.3 3.6 0.3 3.6 0.3 3.6 0.3 2.1 Note Unit V V V V V V V V V V V
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Parameter
Description VIL
Min. 0.3 1.37 0
Max. 0.3 1.9 0.45
Note
Unit V V V
ANTCTL[3:0]
VOH VOL
Table 5-4 Electrical features of Digital Pins in the I/O supply domain of the USIM Interface Parameter VIH VIL VOH VOL Description High-level input voltage Low-level input voltage High-level input voltage Low-level input voltage Min. 0.65 x VDDP_USIM -0.3 VDDP_USIM0.45 0 Max. 3.3 0.25 x VDDP_USIM 2.85 0.45 Note VDDP_USIM =1.8 V or 2.85 V VDDP_USIM =1.8 V or 2.85 V VDDP_USIM =1.8 V or 2.85 V VDDP_USIM =1.8 V or 2.85 V Unit V
V V V
5.5 Power Supply Features

5.5.1 Input Power Supply
Table 5-5 lists the requirements for input power of the ME906X module. Table 5-5 Requirements for input power for the ME906X module Parameter 3.3V Min. 3.135 Typ. 3.3 Max. 4.4 Ripple 0.05 Unit V
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Figure 5-1 Power Supply During Burst Emission
The 3.3 V Minimum Value must be guaranteed during the burst (with 2.5 A Peak in GSM, GPRS or EGPRS mode).
Table 5-6 Requirements for input current of the ME906X module Power 3.3 V Peak (Maximum) 2500 mA Normal (Maximum) 1100 mA
5.5.2 Power Consumption

The power consumptions of ME906X in different scenarios are respectively listed in Table5-7 to Table5-13. The power consumption listed in this section is tested when the power supply of ME906X module is 3.3 V. Typical values are measured at room temperature, and minimum and maximum values are measured over the entire operating temperature range. Table 5-7 Averaged Power off DC power consumption Description Power off Test Value < 300 Units uA Notes/Configuration 3.3V is ON and Power_on_off pin pulled low.
Table 5-8 Averaged standby DC power consumption Description LTE (Standby) Bands LTE bands Test Value TBD Units mA Notes/Configuration DRX cycle=8 (2.56 s) Module is registered on and not connected to the 4G network. USB is in suspend.
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Description LTE (Connected Standby)
Bands LTE bands
Test Value TBD
Units mA
Notes/Configuration DRX cycle=6 (0.64 s) Module is registered on the 4G network, and PDP is activated, No data transmission. USB is in suspend.
HSPA+/WCDMA (Standby)
UMTS bands
TBD
mA
DRX cycle=8 (2.56 s) Module is registered on and not connected to the 3G network. USB is in suspend.
HSPA+/WCDMA (Connected Standby)
UMTS bands
TBD
mA
DRX cycle=6 (0.64 s) Module is registered on the 3G network, and PDP is activated, No data transmission. USB is in suspend.
CDMA/EVDO (Standby)
CDMA bands
TBD
mA
SCI=2 (5.12s) Module is registered on and not connected to the 3G network. USB is in suspend.
CDMA/EVDO (Connected Standby)
CDMA bands
TBD
mA
SCI=2 (5.12s) Module is registered on the 3G network, and PDP is activated, No data transmission. USB is in suspend.
GSM/ GPRS/EDGE (Standby)
GSM bands
TBD
mA
MFRMS=5 (1.175 s) Module is registered on and not connected to the 2G network. USB is in suspend.
GSM/ GPRS/EDGE (Connected Standby)
GSM bands
TBD
mA
MFRMS=2 (0.47 s) Module is registered on the 2G network, and PDP is activated, No data transmission. USB is in suspend.
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Description LTE (Idle)
Bands LTE bands
Test Value TBD
Units mA
Notes/Configuration Module is powered up and idle DRX cycle=8 (2.56 s) Module is registered on the 4G network, and PDP is activated, No data transmission. USB is no suspend.
HSPA+/WCDMA (Idle)
UMTS bands
TBD
mA
Module is powered up and idle DRX cycle=8 (2.56 s) Module is registered on the 3G network, and PDP is activated, No data transmission. USB is no suspend.
CDMA/EVDO (Idle)
CDMA bands
TBD
mA
Module is powered up and idle SCI=2 (5.12 s) Module is registered on the 3G network, and PDP is activated, No data transmission. USB is no suspend.
GSM/ GPRS/EDGE (Idle)
GSM bands
TBD
mA
Module power up and idle MFRMS=5 (1.175 s) Module is registered on the 2G network, and PDP is activated, No data transmission. USB is no suspend.
Radio Off
Any band
TBD
mA
Flight mode
Table 5-9 DC power consumption of ME906V (WCDMA/ HSDPA /LTE/CDMA/EVDO) (Preliminary data) Description WCDMA Band Band I (IMT2100) Test Value 180 220 Units mA Power (dBm) 1 dBm Tx Power 10 dBm Tx Power
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Description
Band
Test Value 640
Units
Power (dBm) 23.5 dBm Tx Power
Band II (PCS 1900)
190 220 650
mA
1 dBm Tx Power 10 dBm Tx Power 23.5 dBm Tx Power
Band IV (AWS)
190 270 610
mA
Band V (850 MHz)
180 210 500
mA
1 dBm Tx Power 10 dBm Tx Power 23.5dBm Tx Power
Band VIII (900 MHz)
170 220 510
mA
1 dBm Tx Power 10 dBm Tx Power 23.5dBm Tx Power
HSDPA
Band I (IMT2100)
190 240 680
mA
Band II (PCS 1900)
200 250 720
mA
Band IV (AWS)
210 290 680
mA
Band V (850 MHz)
190 220 620
mA
Band VIII (900 MHz)
180 230 630
mA
LTE
LTE Band I
330 370
mA
1 dBm Tx Power 10 dBm Tx Power
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Description
Band
Test Value 760
Units
Power (dBm) 23dBm Tx Power
LTE Band II
310 370 770
mA
1 dBm Tx Power 10 dBm Tx Power 23dBm Tx Power
LTE Band IV
340 400 700
mA
LTE Band V
330 350 630
mA
LTE Band VIII
330 380 590
mA
LTE Band XIII
340 390 720
mA
LTE Band XVII
340 380 650
mA
CDMA
BC0
170 210 610
mA
BC1
190 220 710
mA
EVDO
BC0
190 220
mA
1 dBm Tx Power 10 dBm Tx Power
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Description
Band
Test Value 610
Units
Power (dBm) 24dBm Tx Power
BC1
200 240 720
mA
Table 5-10 DC power consumption (GPRS/EDGE) of ME906V (Preliminary data) Description GPRS850 Test Value 320 550 870 130 180 250 GPRS900 350 580 770 130 180 250 GPRS1800 200 310 490 120 170 210 GPRS1900 200 310 520 120 160 mA 10 mA 0 mA 10 mA 0 mA 10 mA 5 mA 10 Units mA PCL 5 Configuration 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down
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Description
Test Value 210
Units
PCL
Configuration 4 Up/1 Down
EDGE850
210 350 560 150 180 230
mA
1 Up/1 Down 2 Up/1 Down 4 Up/1 Down
mA
15
EDGE900
220 370 630 150 180 250
mA
mA
15
EDGE1800
170 260 420 130 160 230
mA
mA
10
EDGE1900
170 250 390 120 160 220
mA
mA
10
Table 5-11 DC power consumption of ME906E(WCDMA/HSDPA/LTE) (Preliminary data) Description WCDMA Band Band I (IMT2100) Test Value 160 200 Units mA Power (dBm) 1 dBm Tx Power 10 dBm Tx Power
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Description
Band
Test Value 670
Units
Band II (PCS 1900)
160 200 690
mA
Band V (850 MHz)
160 200 530
mA
Band VIII (900 MHz)
180 270 600
mA
HSDPA
Band I (IMT2100)
240 290 680
mA
Band II (PCS 1900)
240 290 700
mA
Band V (850 MHz)
230 270 550
mA
Band VIII (900 MHz)
250 340 620
mA
LTE
LTE Band I
310 350 800
mA
LTE Band II
300 350 740
mA
LTE Band III
300
mA
1 dBm Tx Power
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Description
Band
Test Value 350 770
Units
Power (dBm) 10 dBm Tx Power 23dBm Tx Power
LTE Band V
290 330 620
mA
LTE Band VIII
300 340 690
mA
LTE Band VII
350 470 870
mA
LTE Band XX
300 390 720
mA
Table 5-12 DC power consumption (GSM/GPRS/EDGE) of ME906E (Preliminary data) Description GPRS850 Test Value 300 420 600 120 160 240 GPRS900 300 430 600 130 170 mA 10 mA 5 mA 10 Units mA PCL 5 Configuration 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down
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Description
Test Value 240
Units
PCL
Configuration 4 Up/1 Down
GPRS1800
220 250 330 120 150 200
mA
mA
10
GPRS1900
210 270 360 120 160 210
mA
mA
10
EDGE850
200 300 360 120 170 240
mA
mA
15
EDGE900
200 290 360 120 170 240
mA
mA
15
EDGE1800
160 220 270 120 140 170
mA
mA
10
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Description EDGE1900
Test Value 160 240 290 120 140 170
Units mA
PCL 2
Configuration 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down
mA
10
Table 5-13 DC power consumption of ME906J (WCDMA/ HSDPA /LTE/CDMA/EVDO) (Preliminary data) Description WCDMA Band Band I Test Value 160 200 600 Band V 160 190 560 Band VI 160 190 560 Band XIX 160 190 560 HSDPA Band I 250 340 630 Band V 240 260 mA mA mA mA mA Units mA Power (dBm) 1 dBm Tx Power 10 dBm Tx Power 23.5 dBm Tx Power 1 dBm Tx Power 10 dBm Tx Power 23.5 dBm Tx Power 1 dBm Tx Power 10 dBm Tx Power 23.5 dBm Tx Power 1 dBm Tx Power 10 dBm Tx Power 23.5 dBm Tx Power 1 dBm Tx Power 10 dBm Tx Power 23.5 dBm Tx Power 1 dBm Tx Power 10 dBm Tx Power
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Description
Band
Test Value 580
Units
Band VI
240 260 580
mA
Band XIX
240 260 580
mA
LTE
LTE Band I
280 350 670
mA
LTE Band XI
280 340 680
mA
LTE Band XVIII
270 330 680
mA
LTE Band XIX
280 350 630
mA
LTE Band XXI
290 350 730
mA
CDMA
BC0
170 210 650
mA
BC6
170
mA
1 dBm Tx Power
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Description
Band
Test Value 220 520
Units
Power (dBm) 10 dBm Tx Power 21dBm Tx Power
EVDO
BC0
190 230 650
mA
BC6
190 240 520
mA
The above values are the average of some test samples. LTE test condition: 10MHz bandwidth, QPSK, 1RB when testing max Tx power and full RB when testing 1 dBm or 10 dBm.
5.6 Reliability Features

Table 5-14 lists the test conditions and results of the mechanical reliability of the ME906X module. Table 5-14 Test conditions and results of the mechanical reliability of the ME906X module Item Low-temperature storage High-temperature storage Low-temperature operating High-temperature operating Test Condition Temperature: 40 C 2 C Test duration: 24 h Temperature: 85 C 2 C Test duration: 24 h Temperature: 10 C 2 C Test duration: 24 h Temperature: 55 C 2 C Test duration: 24 h IEC60068 IEC60068 IEC60068 Standard IEC60068
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Item Damp heat cycling
Test Condition High temperature: 55 C 2 C Low temperature: 25 C 2 C Humidity: 95% Repetition times: 6 Test duration: 12 h+12 h Low temperature: 40 2 C High temperature: 85 C 2 C Temperature change interval: < 30s Test duration: 15 min Repetition times: 100
Standard IEC60068
Temperature shock
IEC60068
Salty fog test
Temperature: 35 C Density of the NaCl solution: 5% 1% Spraying interval: 8 h Duration of exposing the module to the temperature of 35 C: 16 h
IEC60068
Sine vibration
Frequency range: 5 Hz to 200 Hz Acceleration: 10 m/s

2
IEC60068
Frequency scan rate: 1 oct/min Test period: 3 axial directions. Five circles for each axial direction. Shock test Half-sine wave shock Peak acceleration: 300 m/s Shock duration: 11 ms Test period: 6 axial directions. One shock for each axial direction. Clash test Half-sine wave Peak acceleration: 180 m/s Pulse duration: 6 ms Repetition time: 6 directions. 1000 times for each direction. Drop test First case: 0.3 m in height. Drop the ME906X module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested. Second case: 0.8 m in height. Drop the ME906X module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested. IEC60068
2 2
IEC60068
IEC60068
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5.7 EMC and ESD Features

EMC tests have to be performed on the application as soon as possible to detect any potential problems. Special attention should be paid to the following:

Possible harmful emissions radiated by the application to the RF receiver in the receiver band. ESD protection is mandatory on all signals which are externally accessible Typically, ESD protection is mandatory for the following:

USIM (if accessible from outside) LED USB
Length of the USIM interface lines (preferably <10 cm). Ground plane: HUAWEI Wireless recommends a common ground plane for analog/digital/RF grounds. A metallic or plastic case with conductive paint is recommended, except for the area around the antenna.
The HUAWEI ME906X Module does not include any protection against over voltage.
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Mechanical Specifications
6

This chapter describes the following aspects of the ME906X module: Dimensions of ME906X Label(TBD) Packing System(under development)
6.2 Dimensions of ME906X

Figure 6-1 shows the dimensions of ME906X in details.
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Figure 6-1 Dimensions of ME906X
6.3 Label(TBD)
HUAWEI M.2 module label is under development. Figure 6-2 shows the dimensions of ME906X label.
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Figure 6-2 Dimensions of label
Label area on top
Shield area on top
Label area on bottom
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6.4 Packing System(under development)

HUAWEI M.2 module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons.
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Installation
7
This chapter describes the assembly of ME906X, including:

Installation
Connect ME906X to board Antenna Plug
7.2 Connect ME906X to board

Figure 7-1 Install ME906X
It refers to M.2 specification. The module will need a mechanical retention at the end of the board. The module specifies a 5.5 mm Dia. keep out zone at the end for attaching a screw. The module Stand-off and mounting screw also serve as part of the module Electrical Ground path. The Stand-off should be connected directly to the ground plane on the platform. So that when the module is mounted and the mounting screw is screwed on to hold the module in place, this will make the electrical ground connection from the module to the platform ground plane. The stand-off must provide a Thermal Ground Path. The design requirements for thermal are a material with a minimum conductivity of 50 watts per meter Kelvin and surface area of 22 Sq mm.
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Installation
7.3 Antenna Plug

To disconnect the antenna plug, insert the extraction side of insertion and extraction as described in the figure below. Figure 7-2 Mating the plug
1. 2. 3. 4. 5.
Align the mating tool or the mating end of the tool over the plug end of the cable assembly. Firmly place the tool over the plug until it is secured in the tool. Place the plug cable assembly (held in the tool) over the corresponding receptacle. Assure that the plug and receptacle are aligned press-down perpendicular to the mounting surface until both connectors are fully mated. Remove the mating tool by pulling it up carefully. Removal of the tool.
Figure 7-3 Unmating the plug
The extraction tool is absolutely mandatory. Any attempt of unmating by pulling on the cable may result in damage and influence the mechanical / electrical performance.
Its recommended that not to apply any pull forces after the bending of the cable, as described in Figure 7-4 .
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Installation
Figure 7-4 Do not apply any pull forces after the bending of the cable
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Certifications
8
8.1 About This Chapter 8.2 Certifications
Certifications
This chapter gives a general description of certifications of ME906X.
The certification of ME906X is testing now. Table 8-1 shows certifications the ME906X will be implemented. For more demands, please contact us for more details about this information.
Table 8-1 Product Certifications Certification ME906V CE FCC CCC NCC A-TICK Jate & Telec IC EU RoHS JGPSSI SGS RoHS Model Name ME906E ME906J
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Certifications
Certification ME906V PVC-Free GCF PTCRB Halogen-free CCF(CTIA/CDG)
Model Name ME906E ME906J
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Safety Information
9
9.1 Interference 9.2 Medical Device

Safety Information
Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed.
Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.
Power off your wireless device and follow the rules and regulations set forth by the hospitals and health care facilities. Some wireless devices may affect the performance of the hearing aids. For any such problems, consult your service provider. Pacemaker manufacturers recommend that a minimum distance of 15 cm be maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker. If you are using an electronic medical device, consult the doctor or device manufacturer to confirm whether the radio wave affects the operation of this device.
9.3 Area with Inflammables and Explosives

To prevent explosions and fires in areas that are stored with inflammable and explosive devices, power off your wireless device and observe the rules. Areas stored with inflammables and explosives include but are not limited to the following:

Gas station Fuel depot (such as the bunk below the deck of a ship) Container/Vehicle for storing or transporting fuels or chemical products Area where the air contains chemical substances and particles (such as granule, dust, or metal powder) Area indicated with the "Explosives" sign
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Safety Information
Area indicated with the "Power off bi-direction wireless equipment" sign Area where you are generally suggested to stop the engine of a vehicle
9.4 Traffic Security

Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving. RF signals may affect electronic systems of motor vehicles. For more information, consult the vehicle manufacturer. In a motor vehicle, do not place the wireless device over the air bag or in the air bag deployment area. Otherwise, the wireless device may hurt you owing to the strong force when the air bag inflates.
9.5 Airline Security

Observe the rules and regulations of airline companies. When boarding or approaching a plane, power off your wireless device. Otherwise, the radio signal of the wireless device may interfere with the plane control signals.
9.6 Safety of Children

Do not allow children to use the wireless device without guidance. Small and sharp components of the wireless device may cause danger to children or cause suffocation if children swallow the components.
9.7 Environment Protection

Observe the local regulations regarding the disposal of your packaging materials, used wireless device and accessories, and promote their recycling.
9.8 WEEE Approval

The wireless device is in compliance with the essential requirements and other relevant provisions of the Waste Electrical and Electronic Equipment Directive 2012/19/EU (WEEE Directive).
9.9 RoHS Approval

The wireless device is in compliance with the restriction of the use of certain hazardous substances in electrical and electronic equipment Directive 2011/65/EU (RoHS Directive).
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Safety Information
9.10 Laws and Regulations Observance

Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others.
9.11 Care and Maintenance

It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device.

Use your wireless device and accessories with care and in clean environment. Keep the wireless device from a fire or a lit cigarette. Protect your wireless device and accessories from water and vapour and keep them dry. Do not drop, throw or bend your wireless device. Clean your wireless device with a piece of damp and soft antistatic cloth. Do not use any chemical agents (such as alcohol and benzene), chemical detergent, or powder to clean it. Do not leave your wireless device and accessories in a place with a considerably low or high temperature. Use only accessories of the wireless device approved by the manufacture. Contact the authorized service center for any abnormity of the wireless device or accessories. Do not dismantle the wireless device or accessories. Otherwise, the wireless device and accessories are not covered by the warranty.
9.12 Emergency Call

This wireless device functions through receiving and transmitting radio signals. Therefore, the connection cannot be guaranteed in all conditions. In an emergency, you should not rely solely on the wireless device for essential communications.
9.13 Specific Absorption Rate (SAR)

Your wireless device is a radio transmitter and receiver. It is designed not to exceed the limits for exposure to radio waves recommended by international guidelines. These guidelines were developed by the independent scientific organization ICNIRP and include safety margins designed to assure the protection of all persons, regardless of age and health. The guidelines use a unit of measurement known as the Specific Absorption Rate, or SAR. The SAR limit for wireless devices is 2.0 W/kg and the highest SAR value for this device when tested complied with this limit.
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Safety Information
9.14 Regulatory Information

The following approvals and notices apply in specific regions as noted.
9.14.1 CE Approval (European Union)

The wireless device is approved to be used in the member states of the EU. The wireless device is in compliance with the essential requirements and other relevant provisions of the Radio and Telecommunications Terminal Equipment Directive 1999/5/EC (R&TTE Directive). Federal Communications Commission Notice (United States): Before a wireless device model is available for sale to the public, it must be tested and certified to the FCC that it does not exceed the limit established by the government-adopted requirement for safe exposure. The SAR limit adopted by the USA and Canada is 1.6 watts/kilogram (W/kg) averaged over one gram of tissue. The highest SAR value reported to the FCC for this device type was compliant with this limit.
9.14.2 FCC Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons. Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment
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Appendix A Circuit of Typical Interface
10
Appendix A Circuit of Typical Interface
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Appendix B Acronyms and Abbreviations
11
CCC CS CSD DC DMA EBU EDGE EIA EMC ESD EU FCC FDD-TDMA GMSK GPIO GPRS GSM HSIC HSDPA HSPA+

Expansion China Compulsory Certification Coding Scheme Circuit Switched Data Direct Current Direct Memory Access External Bus Unit Enhanced Data for GSM Evolution Electronic Industries Association Electromagnetic Compatibility Electrostatic Discharge European Union Federal Communications Commission Frequency Division DuplexingTime Division Multiple Access Gaussian Minimum Shift Keying General-purpose I/O General Packet Radio Service Global System for Mobile communication High Speed Inter-Chip Interface High-Speed Downlink Packet Access Enhanced High Speed Packet Access
Acronym or Abbreviation
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Acronym or Abbreviation HSUPA IPC ISO I2S LCP LDO LED LTE MCP MIPI NGFF NTC PA PBCCH PCB PDU PMU RF RoHS RTC TTL TVS UMTS USB USIM VSWR WCDMA
Expansion High Speed Up-link Packet Access Inter Processor Communications International Standards Organization I2C Sound Liquid Crystal Polyester Low-Dropout Light-Emitting Diode Long Term Evolution Multi-chip Package Mobile Industry Processor Interface Next Generation Form Factor Negative Temperature Coefficient Power Amplifier Packet Broadcast Control Channel Printed Circuit Board Protocol Data Unit Power Management Unit Radio Frequency Restriction of the Use of Certain Hazardous Substances Real-time Clock Transistor-transistor Logic Transient Voltage Suppressor Universal Mobile Telecommunications System Universal Serial Bus Universal Subscriber Identity Module Voltage Standing Wave Ratio Wideband Code Division Multiple Access
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HUAWEI ME906X LTE M.

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HUAWEI ME906X LTE M.2 Module Hardware Guide

About This Document

About This Document

3.2 10 04 2012-12-11 3.2 3.7 3.11.2 4.2 4.4.2

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HUAWEI ME906X LTE M.2 Module Hardware Guide

About This Document

3.2 3.3.2 3.4.2 3.4.3 3.6.2 6.3 10

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HUAWEI ME906X LTE M.2 Module Hardware Guide

3 Description of the Application Interfaces .............................................................................. 13

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HUAWEI ME906X LTE M.2 Module Hardware Guide

3.11.2 Coaxial RF Connector Guidelines ....................................................................................... 39

5 Electrical and Reliability Features ........................................................................................... 60

6 Mechanical Specifications ......................................................................................................... 78

9 Safety Information ...................................................................................................................... 87

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HUAWEI ME906X LTE M.2 Module Hardware Guide

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd.

HUAWEI ME906X LTE M.2 Module Hardware Guide

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd.

HUAWEI ME906X LTE M.2 Module Hardware Guide

2.2 Function Overview

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HUAWEI ME906X LTE M.2 Module Hardware Guide

Feature Operating Bands (ME906J)

Operating Temperature Storage Temperature Moisture Power Voltage

Application Interface (75-pin Gold Finger)

Antenna Connectors SMS

Data Services (ME906V)

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HUAWEI ME906X LTE M.2 Module Hardware Guide

Data Services (ME906E)

Data Services (ME906J)

2.3 Circuit Block Diagram

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HUAWEI ME906X LTE M.2 Module Hardware Guide

Figure 2-1 Circuit block diagram of the ME906X module

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HUAWEI ME906X LTE M.2 Module Hardware Guide

Description of the Application Interfaces

Description of the Application Interfaces

3.1 About This Chapter

3.2 75-pin Gold Finger

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HUAWEI ME906X LTE M.2 Module Hardware Guide

Description of the Application Interfaces

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HUAWEI ME906X LTE M.2 Module Hardware Guide

Description of the Application Interfaces

Open Drain and requires a pull up resistor on the host 0 -

Ground Notch Notch Notch Notch Notch Notch Notch

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HUAWEI ME906X LTE M.2 Module Hardware Guide

Description of the Application Interfaces

Pin Name Normal Notch Reserved

DC Characteristics (V) Min Typ. Max