Fractus TVNextTM

Mobile TV VHF Antenna

Antenna Part Number: FR01-B3-V-0-054

February 2013

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1999-2013 FRACTUS, S.A.

TABLE OF CONTENTS
1. ANTENNA DESCRIPTION ______________________________________________________ 3 2. QUICK REFERENCE GUIDE _____________________________________________________ 3 3. ELECTRICAL PERFORMANCE ___________________________________________________ 4 3.1. TVNext EVALUATION BOARD ________________________________________________ 4 3.2. RADIATION PATTERN AND GAIN _____________________________________________ 5 3.3. CAPABILITIES AND MEASUREMENT SYSTEMS ___________________________________ 6 4. MECHANICAL CHARACTERISTICS _______________________________________________ 7 4.1. DIMENSIONS AND TOLERANCES _____________________________________________ 7 4.2. SPECIFICATIONS FOR INK __________________________________________________ 7 5. ASSEMBLY PROCESS _________________________________________________________ 8 6. ANTENNA FOOTPRINT (as used in the evaluation board) ____________________________ 10 7. PACKAGING _______________________________________________________________ 11

Any update on new patents linked to this product will appear in http://www.fractus.com/index.php/fractus/patents All information contained within this document is property of Fractus and is subject to change without prior notice. Information is provided as is and without warranties. It is prohibited to copy or reproduce this information without prior approval. Fractus is an ISO 9001:2008 certified company. All our antennas are lead-free and RoHS compliant.

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1. ANTENNA DESCRIPTION
The TVNextTM is an off-the-shelf internal antenna solution specifically designed for Mobile TV applications operating in the VHF band. TVNextTM minimises your product development cost and time. With its compact size and high performance, the TVNextTM internal antenna is the optimal choice for your portable digital TV application. With its superior performance, small form factor, modularity and high isolation, the TVNextTM antenna solution meets and exceeds all your customer requirements for an internal compact and modular antenna.

20.0 mm 10.0 mm

1.6 mm

TOP

BOTTOM

APPLICATIONS Mobile Phones Personal Media Player (PMP) Ultra Mobile PC (UMPC) Laptops

BENEFITS Reduced Form Factor Modularity - SMD Superior Performance Easy to use (pick and place)

2. QUICK REFERENCE GUIDE

Technical Features
Frequency Range Gain Curve Radiation Pattern Flatness Weight (approx.) Temperature Impedance Dimensions (L x W x H)

180-220 MHz See page 5 Omnidirectional < 2 dB gain variation 0.6 g -40 to 85 C 50 20.0 mm x 10.0 mm x 1.6 mm

Please contact info@fractus.com if you require additional information on antenna integration or optimisation on your PCB.

FRACTUS S.A. www.fractus.com Tel: +34 935442690 Fax: +34 935442691

Table 1 -Technical Features. Measures from the evaluation board (128.0 mm x 60.0 mm x 1.0 mm PCB)

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1999-2013 FRACTUS, S.A.

3. ELECTRICAL PERFORMANCE
3.1. TVNext EVALUATION BOARD
The configuration used in testing the TVNextTM VHF antenna is displayed in Figure 1.

Measure A B C D

mm 112.0 60.0 128.0 47.5

Tolerance: 0.2 mm

Material: The evaluation board is built on laminated substrate 1.0 mm thick (2 layers).

Figure 1 Fractus TVNextTM VHF Evaluation Board

Antenna Feeding Pad

RF Output

Note: Optimal matching network values may vary depending on the antenna environment. Please, contact info@fractus.com for additional support to integrate the antenna in a specific application.

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1999-2013 FRACTUS, S.A.

3.2. RADIATION PATTERN AND GAIN

-10 -15 -20

Gain [dB]

-25 -30 -35 -40 170

GAIN

180

190

200

210

220

230

240

Frequency [MHz]

Note: Please notify that this antenna is designed for reception.

Radiation Pattern

330 310

Radiation Pattern

270

0 -5 -10 -15 -20 -25 -30

0 30 60

90

240 210 180 150

120

200 MHz

Table 2 Typical antenna Gain across VHF bandwidth

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3.3. CAPABILITIES AND MEASUREMENT SYSTEMS

Fractus specialises in the design and manufacture of optimised antennas for wireless applications, and with the provision of RF expertise to a wide range of clients. We offer turn-key antenna products and antenna integration support to minimise your time requirements and maximize return on investment throughout the product development process. We also provide our clients with the opportunity to leverage our in-house testing and measurement facilities to obtain accurate results quickly and efficiently.

0 330

5 0 -5 -10 30

Radiation Pattern & Efficiency

SATIMOs STARGATE 32

300

-15 -20 -25 -30

60

270

90

240 f=5350MHz 210 180 150

120

Anechoic and semi-anechoic chambers and fully equipped in-house lab

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1999-2013 FRACTUS, S.A.

4. MECHANICAL CHARACTERISTICS
4.1. DIMENSIONS AND TOLERANCES

Note: all antenna pads (feed point and mounting pads) have the same dimensions.

Figure 2 Antenna Dimensions and Tolerances

Measure A B

mm 20.0 0.2 10.0 0.2

Measure C D

mm 1.6 0.2 2.0 0.1

The black hole circle located on the front of the antenna, provides a visual cue to mounting the antenna. It is located above the feed point of the antenna and is included to decrease possible manufacturing error.

The TVNextTM VHF antenna is compliant with the directive 2002/95/EC on the restriction of the use of hazardous substances (RoHS).

4.2. SPECIFICATIONS FOR INK

Next figure shows the correct colours of the antenna:

Acceptable colour range

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5. ASSEMBLY PROCESS
Figure 3 shows the back and front view of the TVNextTM VHF antenna, and indicates the location of the feeding point and the mounting pads:
Mounting Pads (2, 3, 4): solder the antenna mounting pads to the soldering pads on the PCB. These pads must NOT be grounded.

4 3 1 2

Feed Pad (1): align the feed point with the feeding line on the PCB.

Figure 3 Pads of the TVNextTM VHF chip antenna As a surface mount device (SMD), this antenna is compatible with industry standard soldering processes. The basic assembly procedure for this antenna is as follows: 1. Apply a solder paste to the pads of the PCB. Place the antenna on the board. 2. Perform a reflow process according to the temperature profile detailed in Table 3, Figure 5 on page 9. 3. After soldering the antenna to the circuit board, perform a cleaning process to remove any residual flux. Fractus recommends conducting a visual inspection after the cleaning process to verify that all reflux has been removed. The drawing below shows the soldering details obtained after a correct assembly process: Antenna Antenna Solder Paste

~ 0.1* mm PCB PCB

Figure 4 - Soldering Details

NOTE: Solder paste thickness after the assembly process will depend on the thickness of the soldering stencil mask. A stencil thickness equal to or larger than 127 microns (5 mils) is required.

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The TVNextTM VHF antenna should be assembled following either Sn-Pb or Pb-free assembly processes. According to the Standard IPC/JEDEC J-STD-020C, the temperature profile suggested is as follows:

Phase RAMP-UP PREHEAT

Profile features Avg. Ramp-up Rate (Tsmax to Tp) - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (tsmin to tsmax) - Temperature (TL) - Total Time above TL (t L) - Temperature (Tp) - Time (tp) Rate

Pb-Free Assembly (SnAgCu) 3 C / second (max.) 150 C 200 C 60-180 seconds 217 C 60-150 seconds 260 C 20-40 seconds 6 C/second max. 8 minutes max.

REFLOW

PEAK

RAMP-DOWN

Time from 25 C to Peak Temperature

Table 3 Recommended soldering temperatures Next graphic shows temperature profile (grey zone) for the antenna assembly process in reflow ovens.

Figure 5 Temperature profile

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6. ANTENNA FOOTPRINT (as used in the evaluation board)

This antenna footprint applies for the reference evaluation board described on page 4 of this User Manual.

Measure A B C D E F

mm 2.0 5.0 15.0 16.0 1.9 0.9

G 4.1 Tolerance: 0.2 mm

Note: all the soldering pads (feed point and mounting pads) on the antenna layout have the same dimensions.

Figure 6 Antenna Footprint Details

Other PCB form factors and configurations may require a different feeding configuration, feeding line dimensions and clearance areas. If you require support for the integration of the antenna in your design, please contact info@fractus.com

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1999-2013 FRACTUS, S.A.

7. PACKAGING
The TVNext chip antenna is available in tape and reel packaging.

Figure 6 Tape Dimensions

Measure TAPE SIZE A0 B0 K0 B1 D D1 32.0 11.5 22.0 1.8

mm E F K P

Measure Wmax 32.3 1.5

mm

14.2 2.1 max 16.5 4.5 2.0

22.0 max 1.6 2.1 min

P0 P2 Tolerance: 0.2 mm

Measure A max G t max

mm 330.0 32.4 38.4

Tolerance: 0.2 mm Reel Capacity: 2000 antennas. Figure 7 Reel Dimensions and Capacity

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1999-2013 FRACTUS, S.A.