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Topics Covered
ANSYS/Multiphysics: The Big - Picture Overview Selected Physics:
Structural & thermal Electrostatics & Capacitance Charged Particle Tracing Electrostatic-structural coupling Electro-thermal-structural coupling FLOTRAN CFD
Micro fluidics Conjugate heat transfer Fluid structural Interaction Fluid Structural Damping
Reduced Order Macro- modeling & Circuit Coupling Piezoelectrics HF Electromagnetics Probabilistic Design Customization
ANSYS MEMS 7.0 10/10/02
ANSYS/Multiphysics
Unique in the Analysis Industry
ANSYS invented the Multiphysics philosophy 10 years ago. No other analysis tool provides as many physics under one roof! Greatest breadth and technical depth of physics. Allows extremely sophisticated analysis capability. Fully parametric models across physics, geometry, materials, loads. Perform Design Optimization across physics, geometry, materials and loads. Seamless integration with ANSYS Probabilistic Design System (PDS).
ANSYS/Multiphysics
Factoring in more than one physics gets you closer to reality!
Magnetic
Electrostatic Structural
RF Filters - Resonators
Thermal
Automotive
Information Technology
Analytical Chemistry
Aerospace
Biotechnology
Defense Telecommunications
Pharmaceutical
Other Technology
Hewlett Packard Seiko Epson Delphi - Delco SensoNor Vaisala Lucas Novasensor TI, Nortel, JDS Uniphase,Lucent Siemens MEMSCAP
Micromirrors
Seagate
5 day training course. Two parts: 2 days introduction, 3 days intermediate level. Covers:
Use of ANSYS/Multiphysics product for coupled field MEMS analysis. Classic MEMS technology such as electro thermal actuators,
electrostatic structural devices, and piezo-electrics.
Initial stress Pre-stressed modal analysis Sub-structuring, reduced order macro modeling and lumped parameter
extraction for system level modeling.
Devices are inherently Multiphysics. Unique Material properties. Meshing of high aspect ratio devices & features Lumped Parameter Extraction (into SPICE, VHDL-A/MS) Reduced Order Macro Modeling (ROM2) Capability to model large Field domains associated with electromagnetics & CFD. Need a system of units applicable to small scale.
ANSYS MEMS 7.0 10/10/02
STRUCTURAL CAPABILITIES
Types of Analysis: Static, Modal, Harmonic, Spectrum, Transient.
Geometric non-linearities, such as stress stiffening and large strain, etc. Nonlinear material properties, such as plasticity, hyperelasticity, creep, swelling, etc. Modal analysis, including pre-stressed modal Dynamic analyses, including harmonic, random vibration, and nonlinear transient, etc. Contact problems, including surface to surface, node to surface, and node to node contact
Composite Beams:
Arbitrary Cross Sections & multiple Materials. e.g. Polysilicon & oxide layers
Composite Beams:
Arbitrary Cross Sections & multiple Materials. e.g. Polysilicon & oxide layers
Composite Beams:
Arbitrary Cross Sections & multiple Materials. e.g. Polysilicon & oxide layers
Analysis Example:
Linear Resonator Modal Analysis
Analysis Example:
Inertial Sensor - Accelerometer
Analysis Example:
Torsional Resonator - Gyroscope
Initial Stress
ISTRESS
MEMS devices after fabrication typically posses significant residual stresses. The initial stress function has been enhanced to allow specification of a constant state of residual stress. Applicable to beam, shell, and solid structural elements.
Analysis Example:
Electro-thermal actuator
SEM Image courtesy of Victor Bright, U Col. Boulder. ANSYS MEMS 7.0 10/10/02
Analysis Example:
Electro-thermal actuator
SEM Image courtesy of Victor Bright, U Col. Boulder. ANSYS MEMS 7.0 10/10/02
BGA Package
Thermal Mechanical Fatigue Simulation Differential thermal expansion
Images courtesy of Allen Miller, Nortel Networks ANSYS MEMS 7.0 10/10/02
3D Electrostatics
Adaptive P-element study on comb drive structure
Analysis Example:
Accelerometer Comb Drive
Analysis Example:
Model of Single Tooth of Comb
Analysis Example:
Electrostatic Potential Solution of Single Tooth of Comb
Analysis Example:
Torsional Resonator - Gyroscope
Analysis Example 3:
Torsional Resonator / Gyroscope
Trefftz Example:
Capacitance of a sphere in free-space
9 8
% Error (Capacitance)
7 6 5 4 3 2 1 0 1 2 3 4 5 6
10
Automated computation of capacitance matrix Applicable to any number of conductors Computes self and mutual capacitance Computes ground and lumped matrices Useful for extracting lumped capacitance for use in system level circuit-simulation
Electrostatics
Parasitic Capacitance Calculation using CMATRIX
Electrostatics
Parasitic capacitance calculation using CMATRIX
Image courtesy of Andreas Hieke, Siemens Microelectronics. ANSYS MEMS 7.0 10/10/02
Electrostatic-Structural Overview
2D & 3D Sequential coupled physics via ESSOLV 2D & 3D Directly coupled physics via 1D transducer
lumped element. Steady state or time transient
Electrostatic-Structural Coupling
ESSOLV Command Macro
Solves coupled electrostatic-structural static analysis Useful for obtaining pull-in voltage (voltage at which structure snaps through), deflections, fields, forces, etc. Requires Electrostatic & Structural Physics Environments. Macro automates a sequential solution process:
1 2 3 4 Electrostatic solution Structural solution (LDREAD of forces from electrostatics) Mesh Morphing of electrostatic mesh Convergence monitoring
Electrostatic-Structural Coupling
ESSOLV GUI
Electrostatic-Structural Coupling
Automated Mesh Morphing
Electrostatic-Structural Coupling
Pull in simulation of MEMS Switch
0.7 0.6 0.5 Displacement 0.4 0.3 0.2 0.1 0 0 5 10 Voltage 15 20 25
Analysis Example:
Electrostatic Micro Mirror
Analysis Example:
Linear resonator / RF Filter Electrostatic Structural Analysis
ANSYS/Multiphysics
Coupled Electro-thermal simulation.
Detail of Integrated Circuit via & aluminum trace
Current Density Electrical Power Thermal Stress
Voids
Reduced order macro modeling enables rapid prototyping of complex MEMS structures in a fast and efficient manner Reduced order models are simplified representations complex models derived from: Approximations of mechanical device response:
Transducers
Accurate condensation of multi-degree of freedom systems:
Substructures
Electrical feed characterization:
Finite element based Lumped elements for single physics Transducer elements for coupled physics Substructures for reducing complex FEA systems
Transducer TRANS126
Fully coupled macro element for electrostatic-structural simulation. Uni-directional structural DOF and voltage potential DOF. Can combine EMT elements to represent up to 3 structural DOFs with voltage coupling. Characterized by Capacitance vs. Displacement curve Couples directly to: FEA Solid models (solid elements, shell elements, beams) Reduced Order models:
Mechanical models (spring, mass, dampers) Electro-mechanical models (spring, mass, damper, resistor, capacitors, inductors,
Static analysis: Pull-in simulation, force, voltage, displacement, current excitation. Modal analysis: Pre-stressed eigenvalue analysis (due to dc bias voltage excitation), damped and undamped systems) Pre-stressed small-signal Harmonic analysis (due to dc bias voltage or mechanical excitation) Time Transient excitation analysis. Applicable to many MEMS devices: Comb drives Cantilever actuators Pressure sensors RF Switches
The mass and spring system FE mesh is replaced by a substructure with 200 DOFs.
Substructure ensures accurate 3-D representation of the dynamic response of the structure is preserved for the modes that are excited.
Completely Reduced!
Reduced Order Macro Modeling
MASS
SPRING
DAMPER
Electromechanical element Spring element Mass element Damper Element Couples with Circuit Elements
ANSYS MEMS 7.0 10/10/02
Here is the TRANS126 element. The DC voltage is applied as a load and it will move, applying a force to the finite element model.
ANSYS MEMS 7.0 10/10/02
Mode 1 2 3
NoPre-stress Case Pre-stress Case Analytic ANSYS Analytic ANSYS 343.1 343.1 351.7 351.7 1372.5 1372.1 1381.2 1380.8 3088.1 3086.2 3096.8 3094.9
ROM144
six degree of freedom, n-port fluidic, electrostatic-structural & fluidic damping reduced order macro model element Modal ports Nodal ports
EMF1 EMF2 EMF3
ROM144
Electrostatic - structural domain
Voltage ports
+ -
CIRCU124
ROM144 Results
Piezoelectric Capabilities
Geometric non-linearities: Large deflections (large rotations) Stress stiffening Pre-stressed modal and harmonic analyses Accurately accounts for changes in the electromechanical field in bending motion. Direct input of the piezoelectric strain matrix [d] Calculation of the correction to the permittivity matrix [epsT]-[epsS]
0.002 m
Silicon
The finite element model consists of 7,194 nodes and 4,176 eight-node brick elements.
Functionality
Some Recent FLOTRAN Enhancements Changes to ANSYS/FLOTRAN default settings
User Experience has shown that several input parameters are routinely modified in order to achieve convergence.
Functionality
FLOTRAN Default Changes for SUPG Advection Algorithm Streamline Upwind Petrov Galerkin
more accurate (especially for energy equation!) eliminates solution stall (leveling of convergence monitors) in many cases becomes default choice for momentum, turbulence and energy
Functionality
FLOTRAN Convergence Monitors
A typical case with tetrahedral elements
Previous Defaults
Functionality
FLOTRAN ALE Mesh Morphing Algorithm
The Elasticity based morphing algorithm has replaced the Laplacian algorithm for FLOTRAN analyses where the boundary of the fluid region moves. The algorithm is in effect for a FLOTRAN analysis when the ALE formulation is invoked The new algorithm provides a much smoother internal mesh motion.
Analysis Example:
Microfluidic Channel - Non Newtonian flow
120 m
Analysis Example:
Microfluidic Valve / Oscillator
VOF technology applicable for modeling time transient problems involving moving liquids with a free surface.
ANSYS MEMS 7.0 10/10/02
Package temperatures
Images courtesy of Fujitsu. ANSYS MEMS 7.0 10/10/02
What is FSI?
Fluid-Solid interaction (FSI) scenarios are those that involve the coupling of fluid mechanics and structural/ thermal/ coupled field mechanics Deformations/temperature of a given solid are computed simultaneously with the flow and heattransfer variables of a fluid that surrounds the solid FSI plays an important role in many different types of real-world situations and industrial applications:
Automotive, Biomedical, Material Processing, MEMS etc..
Fluid Mechanics
Piezoelectric Micropump
Dissimilar meshes
Fluid-Structure Interface
Piezoelectric Micropump
Displacements at FSI Interface
Piezoelectric Micropump
Fluid Velocity Vectors
Squeeze-Film
Couette
ANSYS MEMS 7.0 10/10/02
F0 sin d X + X 0
X = Fnonfluid
Spring constant K
Damping Coefficient C
ROM Parameter Extraction for Linear Motion Imposed Displacement d Pressure Force
The integrated pressure force on the body can be obtained Using the INTSRF command in Post1 for each time point
ANSYS MEMS 7.0 10/10/02
Prescribed motion
= 0 sin t
Oscillating plate Pivot
= 0 cos t = 0 2 sin t
h0
Air
Stationary plate
T0 cos + 0
= Tnonfluid
T p = T0 sin (t + )
The integrated torque (moment) on the body can be obtained Using the INTSRF command in Post1 for each time point
ANSYS MEMS 7.0 10/10/02
Interior Phenomena: Electromagnetic wave propagates or resonates within a closed structure. Cavity - microwave oven RF/Microwave passive components and circuits High-speed electronic digital circuits Exterior Phenomena: Electromagnetic wave propagates in open domain. Electromagnetic wave radiation (radio, optical) Object identification - (Radar Cross Section- RCS) Electromagnetic interference (EMI) Electromagnetic compatibility (EMC) Biomedical applications - CAT / NMR scans
ANSYS MEMS 7.0 10/10/02
Analysis Applications
The Electromagnetic Spectrum
Analysis Applications
Problem Size Limits Inherent in HF FEA
Problem size is limited by physical RAM & disk space. First & second order elements are available. First order elements are fine for most applications. 160,000 elements require approximately 1-1.5 Gbyte of RAM 300,000 elements require approximately 2-3 Gbyte of RAM 10 15 elements are required per wavelength for accuracy For a 1 Gbyte RAM system: 1 MHz represents 300m wavelength. Each element can be 30m! i.e. Can mesh a cube of 1630m 1 GHz represents 30 cm wavelength. Each element can be 3cm ! i.e. Can mesh a cube of 1.63 m Now to put the optical problem into perspective, red light is approx 600 nm (or 5E14 Hz!). Each element can be 60 nm ! i.e. At this frequency we can only mesh a 3.25 um cube. This is what we call an electrically large problem. Making use of symmetry and PMA goes a long way to reduce problem sizes, but realistically, you cannot use FEA technology for the analysis of large objects/systems at very high frequencies.
ANSYS MEMS 7.0 10/10/02
PEC or PMC
Feeding aperture f
Current volume s
HF EMAG Features
Material Properties & Boundary Conditions
Material Properties: Lossy/lossless isotropic material Lossy/lossless anisotropic material Boundary Conditions:
Perfect electric conductor (PEC) Perfect magnetic conductor (PMC) Impedance boundary conditions (IBC) NEW Perfectly matched layers (PMA) NEW
PMA Example
Abrupt Waveguide Transition
PMA Elements
H sum
E sum
ANSYS MEMS 7.0 10/10/02
PMA Example
Abrupt Waveguide Transition Comparison of S11 Results with Integral Equation Method
0.55 Emag HF IE
0.5
0.45 |S11| 0.4 0.35 0.3 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Frequency (GHz)
Product Features
Near & Far Fields
Far Field Radiative Near Field Far Field
See http://www.eurisco.com/jack/anttool/regions-e.html
ANSYS MEMS 7.0 10/10/02
HF EMAG Features
Excitation Sources & Solvers
Excitation Sources: Waveguide modal source ENHANCED Plane wave source ENHANCED Surface, line electric field source NEW Surface magnetic field source NEW Volume, surface, line and point current density source NEW Solver: LANCZOS eigenvalue solver SPARSE direct solver FRONTAL direct solver ICCG iterative solver
ANSYS MEMS 7.0 10/10/02
HF EMAG Features
Post Processing
Electromagnetic field vector and contour plots Quality factor (Q-factor) S-parameters Voltage, current & characteristic impedance Near & far electromagnetic fields extension Radar cross section (RCS) Antenna patterns Coupling to ANSYS Thermal SOLUTION
Substrate
PMA
|S11| (dB)
-20
-30
S11
Emag HF FDTD
0 -10
-40
|S21| (dB)
11
13
15
17
19
S21
-20 -30
Frequency (GHz)
Emag HF
-40 -50 1 3 5 7 9 11 13 15 17 19
FDTD
Frequency (GHz)
PMA
Substrate
CPW
Metallic Via
S21
Magnitude (dB)
S11
30
35
40
45
50
55
60
Frequency (GHz)
ANSYS MEMS 7.0 10/10/02
E sum
E Field vectors
Patch Microstrip
Coax Feed
Substrate
ANSYS MEMS 7.0 10/10/02
E sum iso-surfaces
= 0o
E-Field on H- Plane
Einc
Customization of ANSYS
Defining common processes and implementing best design practices
APDL *ASK command. /OPT Design Optimization PDS Probabilistic Design Studies UIDL (Weedull) Menu Customization. Tcl/Tk GUI. ANSYS Professional & ANSYS Mechanical Toolbar ANSYS HTML report generator
Customization of ANSYS
Defining common processes, implementing best design practices
Substrate
Cu plane
Solder resist
Die
Thermal vias
0.012
0.008
Experiment
0.004
FEA
Time (hr)
Mold Compound
Solder Mask
Solid Model
Die Cu
Moisture profile
Y Displacement
MEMS Xplorer & MEMS Pro Multiple Platform Solutions Windows and Unix based Products couple with ANSYS via APDL / file transfer.
Press release: www.ansys.com/corporate/press_releases/archives/pr040599.htm www.memscap.com ANSYS MEMS 7.0 10/10/02
EDA platform:
MEMS Xplorer
ANSYS
Multiphysics
MEMS Foundries
ANSYS
Multiphysics
Fabrication
MEMS Xplorer-ANSYS/Multiphysics
Layout Import/Export
CIF,GDSII DXF
Design flow.
MEMS Xplorer
Layout Process Emulation Macro Models VHDL-A/MS SPICE Mentor Cadence Tanner
ANSYS Multiphysics
CIF File
ANSYS Database
Inertial Mass Folded spring to provide restoring force Acceleration produces deflection Deflection measured via change in capacitance of combs.
MEMS Gyroscopes
RF MEMS Telecomms
Array of very sharp micro tips Each tip is a micro-electron gun Each tip is a Pixel of a display
Loading & Metering structures Blood separation Valving structures Mixing Electro-chemical Analysis High density assays Clinical diagnostics DNA analysis
www.tecan.com www.acs.ohio-state.edu/units/research/archive/labcdvid.htm
ANSYS MEMS 7.0 10/10/02
/FINISH