ZXG10 BSC (V2) Installation Manual

ZXG10
Z T E G S M W L L S Y S T E M
GSM WLL SYSTEM
Installation Manual
OF ZXG10-BSC (V2)
SHENZHEN, CHINA
Installation Manual of ZXG10-BSC (V2)
Preface
The ZXG10 is a GSM mobile communication system independently developed by ZTE Corporation. It is composed of the ZXG10-MSS (Mobile Switching System) and ZXG10-BSS (Base Station System). The ZXG10-BSS provides and manages radio transmission in GSM, and consists of such equipment as ZXG10-BSC (Base
Station Controller) and ZXG10-BTS (Base Transceiver Station). This Installation Manual of ZXG10-BSC (V2) mainly introduces the project installation process of the ZXG10-BSC (V2), including the installation preparation, installation methods and procedure, and debugging. Chapter 1, System Overview, briefly introduces the system functions of BSC, composition of each function module and equipment commissioning process; Chapter 2, Equipment Structure, covers the overall structure of the BSC and the equipment parameters; Chapter 3, Preparation for Project Installation, describes requirements to the installation environments, needed instruments and meters, and methods of unpacking and inspection; Chapter 4, Hardware Installation, describes the installation flow and methods; Chapter 5, Inspection and Power-on, explains methods of power-on, power-off and transmission connection, and installation of the maintenance terminals; Chapter 6, Software Installation, briefly describes how the BSC-related software is installed and debugged; and Chapter 7 mainly shows how to operate the installation, storage and transportation. Appendix A lists the alarms, Appendix B collects the UNIX commands and Appendix C offers the abbreviations. Generally the ZXG10-BSC (V2) in this manual is shortened as BSC. This set of documents also contains the following manuals: ZXG10-BSC (V2) Technical Manual ZXG10-BSC (V2) Operation Manual ZXG10-BSC (V2) Maintenance Manual
Statement: The actual product may differ from what is described in this manual due to frequent update of ZTE products and fast development of technologies. Please contact the local ZTE office for the latest updating information of the product.
Contents
1 1.1 1.1.1 1.1.2 1.2 1.2.1 1.2.2 1.2.3 1.3 2 2.1 2.1.1 2.1.2 2.1.3 2.1.4 2.2 2.2.1 2.2.2 2.2.3 2.3 2.4 3 3.1 3.1.1 3.1.2 3.2 3.3 3.4 4 4.1 SYSTEM OVERVIEW......................................................................................................1 SYSTEM STRUCTURE ..........................................................................................................1 GSM network structure ....................................................................................................1 Composition of BSS.........................................................................................................2 HARDWARE SYSTEM STRUCTURE.........................................................................................4 Module introduction .........................................................................................................4 Function structure ............................................................................................................7 Rack structure .................................................................................................................8 EQUIPMENT INSTALLATION AND COMMISSIONING PROCESS .....................................................9 EQUIPMENT STRUCTURE ..........................................................................................11 EQUIPMENT STRUCTURE ...................................................................................................11 Features of single-cabinet structure...............................................................................11 Features of multi-cabinet structure ................................................................................12 Structure features of the plug-in box ..............................................................................13 Structure features of the card ........................................................................................14 BSC RACK CONFIGURATION ..............................................................................................15 No submultiplexing ........................................................................................................15 Rack configuration with submultiplexing ........................................................................18 GPRS rack configuration ...............................................................................................22 BOARD CONFIGURATION OF EACH LAYER OF UNITS ..............................................................22 EQUIPMENT PARAMETERS .................................................................................................25 PREPARATION OF INSTALLATION.............................................................................29 CHECK OF INSTALLATION ENVIRONMENT .............................................................................29 Requirements on equipment room.................................................................................29 Requirements on power supply and grounding..............................................................37 INSTRUMENT AND METER PREPARATION..............................................................................39 TECHNICAL RESOURCES PREPARATION ..............................................................................40 UNPACKING AND INSPECTION ............................................................................................40 HARDWARE INSTALLATION .......................................................................................43 HARDWARE INSTALLATION FLOW ........................................................................................43 Page I of III
Installation Manual of ZXG10-BSC (V2) 4.2 4.2.1 4.2.2 4.2.3 4.2.4 4.3 4.3.1 4.3.2 4.3.3 4.4 4.4.1 4.4.2 4.4.3 4.4.4 4.4.5 4.5 4.5.1 4.5.2 4.5.3 4.6 4.6.1 4.6.2 4.6.3 4.6.4 5 5.1 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 5.2 5.3 5.4 6 INSTALLATION OF THE RACK...............................................................................................43 Rack installation.............................................................................................................43 Connection between racks ............................................................................................46 Connection between the side plate and rack .................................................................47 Installation of the front door and rear door .....................................................................48 INSTALLATION OF THE POWER P (POWP) OF THE RACK .......................................................48 Introduction to functions.................................................................................................48 Functionality ..................................................................................................................49 Input, output and indicators............................................................................................51 INSTALLATION OF INTERNAL WIRES .....................................................................................52 Clock interface board (CKI)............................................................................................52 Digital switching network interface (DSNI) board ...........................................................53 Trunk interface (TIC) board............................................................................................53 Module processor (MP) .................................................................................................54 Configuration of backplane jumpers...............................................................................54 INSTALLATION OF EXTERNAL CABLES ..................................................................................56 Cable connection of the BSC system without sub-multiplexing......................................56 Configurations of cables of the BSC system with sub-multiplexing ................................73 Cable connections of BSC (GPRS) ...............................................................................80 CHECK OF THE HARDWARE INSTALLATION ..........................................................................81 Check of the rack installation .........................................................................................81 Check of base and peripherally installed terminal equipment ........................................82 Check of the array of racks ............................................................................................82 Check of cables .............................................................................................................82 INSPECTION AND POWER-ON ...................................................................................86 DESCRIPTION OF BOARDS .................................................................................................86 Indicators on the panel of the control layer ....................................................................86 Indicators on the panel of the network switching layer ...................................................88 Indicators on the panel of the TC unit ............................................................................94 Indicators on the panels of the POWB and POWP units ................................................96 Indicators on the panel of the GPRS unit .......................................................................97 INSPECTION BEFORE POWER-ON .....................................................................................101 STEPS OF POWER-ON .....................................................................................................102 CHECK OF BOARD STATUS ...............................................................................................104 SOFTWARE INSTALLATION......................................................................................105 Page II of III
Installation Manual of ZXG10-BSC (V2) 6.1 6.2 6.3 6.4 6.4.1 6.4.2 6.4.3 6.4.4 6.4.5 6.4.6 6.4.7 7 7.1 7.2 7.2.1 7.2.2 7.3 INITIAL INSTALLATION FLOW OF THE SYSTEM SOFTWARE .....................................................105 INSTALLATION OF MP .....................................................................................................106 INSTALLATION OF THE BACKGROUND OPERATION AND MAINTENANCE SYSTEM ......................109 SYSTEM DEBUGGING ......................................................................................................119 Contents of BS system debugging...............................................................................119 Debugging of the system setup function ......................................................................120 Troubleshooting test ....................................................................................................120 Service test..................................................................................................................123 Operation and maintenance subsystem test ................................................................125 GPRS test contents .....................................................................................................127 Installation and test records .........................................................................................128 PACKAGING, STORAGE AND TRANSPORTATION..................................................129 PACKING .......................................................................................................................129 STORAGE ......................................................................................................................131 Storage conditions .......................................................................................................131 Placement....................................................................................................................131 EQUIPMENT TRANSPORTATION AND PORTAGE....................................................................132
APPENDIX A BS SYSTEM ALARMS ........................................................................................133 A.1 A.2 A.3 A.4 BSC ALARM LIST ............................................................................................................133 BTS ALARM LIST ............................................................................................................135 GPRS ALARM LIST .........................................................................................................140 NOTIFICATION TYPE LIST .................................................................................................141 UNIX COMMON COMMANDS ............................................................................142 ABBREVIATIONS ...............................................................................................151
APPENDIX B APPENDIX C
Page III of III
1
1.1
System Overview
System structure
The BSC, an important part of the GSM digital mobile communication system, is a component of the BSS (Base Station System). It aims to manage the radio resources on a radio network and is capable of supporting various services of GSM. As an upgraded version of the ZXG10-BSC (V1.x), the ZXG10-BSC (V2) is a multi-module product designed on the basis of ETSI Specification Phase2+, with the capacity and processing capability reaching 2048 TRXs. It inherits all advantages of the ZXG10-BSC (V1.x), featuring high-reliability, high cost performance and excellent functions. The completely opened network platform helps to support various services of GSM, and it has an obvious edge over the similar equipment currently running on various networks.
1.1.1
GSM network structure The composition of a GSM digital mobile communication network is as shown in Fig. 1-1.
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MSC/VLR MAP-E
PSTN
MS Um BTS Abis BSC MAP-F EIR Gf Gb A
MSC/VLR
MAP-D
HLR MAP-C SMC
MAP-H Gs Gr SGSN Gp Gd
Gn GGSN Gi PDN TE
GGSN Other PLMN
Fig. 1-1
Architecture of GSM mobile communication network
The ZXG10-BSC (V2) provides three interfaces in the GSM900/1800 and EGSM900 systems: its Abis interface connects the BTS, its A interface connects the MSC and its Gb interface connects the SGSN. In the system, it is mainly in charge of radio resources management, BS management and monitoring, power control, handover and BS traffic statistics.
1.1.2
Composition of BSS Fig. 1-2 illustrates the structure and equipment of a typical ZXG10-BSS.
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BTS BIE MS Um Interface Abis Interface SM Abis Interface BTS BIE SM BTS BIE TIC Abis Interface TIC
Q3 Interface
OMC SM Ater Interface

TC
MSC A Interface
Acon Interface SM
BSC
PLMN SGSN Gb Interface PDN
Fig. 1-2 Architecture of ZXG10-BSS
Generally the BSS is composed of the BTS, BSC and TC: 1. BTS
The BTS (Base Transceiver Station) is the radio part in the BSS, and it includes the baseband unit, the carrier unit and the control unit. This station, controlled by BSC, serves as the radio transceiving equipment in a certain cell by implementing the conversion between the BSC and wireless channels, the radio transmission between the BTS and MS via the air interface, and other related control functions. The BTS is interconnected with the BSC using the Abis interface, with E1 interface equipment configured at both sides. 2. BSC
Serving as the control part in the BSS, the ZXG10-BSC fulfills the switching function in the BSS. One end of the BSC can be connected with multiple BTSs, while the other with the MSC and OMC. The BSC is oriented to the radio network. Its main functions include radio network management; radio resources management; monitoring and managing wireless BS sites; controlling the establishment, connection and release of
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radio connections between BTSs and MSs; controlling the locating, handover and paging of MSs; providing voice coding, transcoding and rate adaptation; as well as the operation and maintenance of BSS. The quantity of BTSs controlled by the BSC in the BSS varies with the traffic volume. 3. TC (Trans-Coder)
The TC mainly implements the voice conversion between the various voice codes adopted in the radio interface of the GSM system and the 64kb/s A-law PCM codes. In addition, TC is also responsible for the data rate adaptation processing in circuit-type data services. In a typical application pattern, the ZXG10-TC is located between MSC and BSC. With TC located at the side of the MSC, the low voice encoding transmission rate used on the air interface may reduce the cost of transmission lines through the transmission SubMultiplexer SM and BIE between the MSC and BSC and those between the BSC and BTS. If the SM is used between the BSC and TC, the interface between the near end and remote end (BSC and TC) is called Ater interface, while that between the TC and MSC is named A interface.
1.2
1.2.1
Hardware system structure

Module introduction The ZXG10-BSC (V2) is of a multi-module structure and mainly contains the following seven functions: 1. 2. 3. 4. Abis interface function Circuit switching function Packet switching function Land equipment operation management and SS7 transfer function
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5. 6. 7.
Radio resources management function Transcoding and rate adaptation function Sub-multiplexing function (designed for economizing the
transmission equipment) Different function unit names are categorized in the BSC (V2) based on the functions: 1. The function unit of the module that carries the BS interface function
is named BIU (Abis Interface Unit). It is configured in the same shelf to complete the interface processing of the carrier frequency, and distribute traffic timeslots and signaling timeslots. 2. The function unit of the circuit switching module is named NSU (Network Switching Unit). It supports the network switching of 32K 32K bits in frame consistency. 3. The function unit of the packet switching module is named as PCU
(Packet Control Unit). It fulfills the GPRS function. 4. The function unit of the land equipment operation management and SS7 equipment is named SCU (System Control Unit). It implements direct management on the BSC land circuit equipment and transfer of SS7, ensuring consistent working of the BSC system. 5. The function unit of the radio resources management equipment is
named RMU (Radio Management Unit) or RRU (Radio Resources Unit). It fulfills the service processing of 256/240 carrier frequencies. 6. The function unit of the transcoding and rate adaptation equipment is named TCU (Transcoding Unit) and AIU (A Interface Unit). It fulfills transcoding and rate adaptation. Meanwhile, the modular structure enables the system to be configured with corresponding hardware/software according to the user capacity, and number of sites, etc. The module structure of the system is shown in Fig. 1-3.
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RMM1
RMM2 SCM OMM
RMM7
RMM8
...
Fig. 1-3
BSC module structure
1.
OMM
It mainly fulfills configuration, management and maintenance of the foreground equipment through the SERVER.
2.
SCM
As the core of the BSC, this module is mainly for management maintenance of the BSC equipment and allocation of SS7, and it consists of the following parts:
1) SCU (System Control Unit) 2) NSU (Net Switching Unit) 3) TCU (TransCoder Unit) 4) AIU (A Interface Unit) 5) BIU (Abis Interface Unit) 6) FSMU (Far SubMultiplexing Unit) and NSMU (Near SubMultiplexing Unit); 7) PCU (Packet Control Unit) 3. RMM (Radio Management Module)
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It is mainly for radio resources management and consists of RMUs. 1~8 RMMs can be provided by the system.
1.2.2
Function structure The general block diagram of the ZXG10-BSC is shown as Fig. 1-4:
Abis interface RMM#1 8M 2 2M 8 8M 2 PCU
BIU#11 RMU BIU#12
Gb Interface
8M 2 N S U
TCU
A Interface AIU
8M 2 BIU#81 RMM#8 RMU BIU#82 F E1 S M U
8M 2 N S M U
8M 2 N E1 F S S M M U U
TCU 8M 2 TCU TCU
AIU AIU
AIU
2M 16
TCU OMM
BIE
SCM
SCU
Fig. 1-4
BSC system structure
Itemization of each function unit to boards helps to understand the basic structure of the BSC hardware system. Fig. 1-5 provides the basic structure of the BSC hardware system (the submultiplexing unit is omitted).
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kRMU SMB E1 4 Abis Interface PCU SYCK E1 4
A Interface
TIC
#1 BI PP #6
#1 2 8M #1
#1
TIC BIU BI PP
#2
BOSN
#8 #n
#8
DRT
TIC AIU
TCPP
NSU
TCU DRT DTI
MPMP S M E M
LAPD MPMP MP MPMP MPMP 1RMU MPMP S M E M SCU MPMP
MP
MP
MP
Note 1: The shaded blocks represent the boards of the BSC (V2) that are compatible in BSC (V1) Note 2: k8, n15
Fig. 1-5
Basic structure of the BSC hardware system
1.2.3
Rack structure Based on different functions, the BSC system is designed with six types of shelves. The BSC system function can be achieved via the combination of these six shelves. The six types of shelves are as follows: 1. 2. 3. 4. 5. 6. BCTL (Backplane of ConTroL) BNET (Backplane of NET) BATC (Backplane of A interface and TransCoder) BBIU (Backplane of Abis Interface Unit) BSMU (Backplane of SubMultiplexing Unit) GPRS shelf PCU (Packet Control Unit)
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TCPP
DRT
#1
AIPP
TIC
For example, a small-capacity configuration is as shown in Fig. 1-6 (single rack):

6 5 4 3 2 1 Fig. 1-6 BBIU BCTL (RMU) BCTL (SCU) BNET BATC BATC Single-rack configuration
The system capacity can be enlarged through adding the BCTL (RMU) shelves, thus one SCM module can carry a maximum of eight RMM modules, and the BBIU shelves and the BATC shelves should be added correspondingly. There are various modes for TC configuration, e.g., it can be located at the BSC side, or at the MSC side. Such configuration correspondingly determines the plug-in location of the BATC shelf.
1.3
Equipment installation and commissioning process

Normal and reliable operation of the ZXG10-BSC (V2) on the network is closely related to the quality of the project installation. Therefore, it is particularly important to create a set of systematic and proper installation process. The equipment installation process is shown in Fig. 1-7.
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St art
Pr oject p rep aratio n
Sta rt inspec tion
Rac k insta lla tion
Electr ic installatio n
Po we r-on ac ce pted Y Transmiss ion conne ct ion S oftw a re insta lla tion S ystem t est
T roubl es hooting
End
Fig. 1-7
Installation process of the ZXG10-BSC (V2)
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2
2.1
Equipment Structure
Equipment structure
The ZXG10-BSC (V2) is of a multi-module structure, and in accordance with the capacity, it can be physically configured as a single-cabinet structure or a multi-cabinet structure.
2.1.1
Features of single-cabinet structure The dimensions of the single-cabinet are as shown in Fig. 2-1.
870mm 810mm
m 0m 60
Front door (two leaves)
Side board
2200mm
Support arms
Fig. 2-1
Diagram of single-cabinet structure
Rack dimensions: 2200mm 810mm 600mm (height width depth);

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the width varying to 870mm when a side board is added. This single cabinet features the following: 1. Solid structure, cabinet skeleton welded into a whole with section steel, with enough rigidity and strength. 2. Simple and clear-colored in international pop color series, natural combination of navy blue and off-white making the cabinet tidy, lively and vivid. 3. Easily installed/removed, conducive to debugging and maintenance. Both the front and back doors can be opened at either side. And the mounting boards at the two sides can be removed/installed conveniently. 4. Installed on top of the cabinet is the ventilation meshwork. Cabinets adopt forced heat dissipation mode, so that the cool wind enters the cabinet from its bottom, through the crevices between the circuit boards on each layer, while the hot wind goes out from the top meshwork. 5. At most seven plug-in boxes can be installed in the cabinet (including a power plug-in box on top of the cabinet). 2.1.2 Features of multi-cabinet structure The multi-cabinet features the following: 1. The multi-cabinet structure means that many single cabinets with the
same basic structure and dimensions are arrayed in an orderly row. 2. The four support arms under each single cabinet can be adjusted to keep them horizontal and at the same height. The cabinets can be located on the ground of the equipment room directly, or fixed on the section steel base in the equipment room without the four support arms. 3. When the cabinets are arranged in a row, the side boards are mounted at both sides of the array of cabinets while between the cabinets, there is none, as shown in Fig. 2-2. For multi-cabinet in more than one row,
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the side boards should be mounted at both sides of each row.

Side bo ard
Side board
Fig. 2-2
Multi-cabinet in one row
4. When the cabinets are arranged in one row, the upper and lower beams are tightly fixed with bolts between the adjacent cabinets.
2.1.3
Structure features of the plug-in box 1. Dimensions of all the plug-in boxes: 279.5mm 790mm 319mm (height width depth). 2. Simply structured: it is composed of aluminum front beam, aluminum
back beam, right/left side board and guide rail bar. The plug-in boxes with different functions just vary in the back plane and circuit cards. 3. The guide rail of the plug-in box is made of aluminum profile, and
each plug-in box has 27 slots with the interval of 25mm between adjacent slots. The plug-in box structure is shown in Fig. 2-3.
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790mm Al uminum back beam
31 9 m m
Aluminum front be am
279.5mm
25mm Guide rail bar Backplane
Si de board
Fig. 2-3
Plug-in box structure
2.1.4
Structure features of the card The dimensions of all the plug-in PCBs are: 300mm 234mm 1.5mm (height width depth) A card is composed of the panel, ejector lever and PCB. The name on the panel is corresponding to the slot on the plug-in box. On a PCB there are two plugs corresponding to the sockets on the back plane. The plugs are either 64-core or 96-core depending on the number of inlet wires. The structure of a card is shown in Fig. 2-4.
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1.5mm
4 1. 0
234
mm
300mm
Plugs
Panel Ejector lever
Fig. 2-4
Card structure
2.2
2.2.1
BSC rack configuration

No submultiplexing 1. N_trx240
For a small capacity, e.g., 240 TRXs, only one rack is needed, called dual-module BSC (one SCM and one RMM), and Fig. 2-5 illustrates the rack configuration.
Note: The number of the modules here corresponds to that of the BCTLs
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on the rack.
Layer 6 Layer 5 Layer 4 Layer 3 Layer 2 Layer 1
BBIU BCTL (RMU) BCTL (SCU) BNET BATC BATC
Fig. 2-5
N_trx240 rack configuration
If there are not many TRXs, just one layer of BATC might suffice. 2. 240<N_trx480
Here two racks should be configured to meet the capacity requirement, called three-module BSC, and Fig. 2-6 illustrates the rack configuration.
BBIU BCTL (RMU) BCTL (SCU) BNET BATC BATC 1
BBIU BCTL (RMU) BATC BATC
Fig. 2-6
240<N_trx480 rack configuration
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3. 480<N_trx720
Here three racks should be configured to meet the capacity requirement, called four-module BSC, and Fig. 2-7 illustrates the rack configuration.
BBIU BCTL(RMU) BCTL (SCU) BNET BATC BATC 1
BBIU BCTL (RMU) BATC BATC BATC BATC 2
BBIU BCTL (RMU)
Fig. 2-7
4.
720<N_trx960
Here three racks should be configured to meet the capacity requirement, called five-module BSC, and Fig. 2-8 illustrates the rack configuration.
BBIU BCTL (RMU) BCTL (SCU) BNET BATC BATC 1
BBIU BCTL (RMU) BATC BATC BATC BATC 2
BBIU BCTL (RMU) BBIU BCTL (RMU) BATC BATC 3
Fig. 2-8
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2.2.2
Rack configuration with submultiplexing There are two submultiplexing access points in the ZXG10-BSC (V2): Acon interface and Ater interface, respectively as submultiplexing interfaces at the RMM and TC sides selected by users. The number of sub-multiplexing units is calculated according to the number of modules located at the far end. When the Ater interface is a submultiplexing one, all TC units are located at the far end. Then every four layers of TC shelves need one pair of submultiplexing units (one NSMU and one FSMU) and one far-end TC rack. When the Acon interface is a submultiplexing one, every two far-end RMMs need one NSMU and several FSMUs (the number of FSMUs equals to that of the far-end RMM racks). The quantity calculation, according to the specific conditions during implementation, employs the following principles: every two RMMs in the same RMM room can share one far-end RMM rack, while the far-end RMMs in different RMM rooms cannot share the far-end RMM rack and FSMU (although they can share the NSMU). 1. Far-end racks in the case of sub-multiplexing 1) Far-end RMM rack
One far-end RMM rack is composed of one far-end sub-multiplexing shelf and one or two groups of RMMs. The rack diagram is shown in Fig. 2-9.
Layer 6
B B IU -1 B C TL (R M U -1) B B IU -2 B C TL (R M U -2) FS M U
Layer 5 Layer 4 Layer 3 Layer 2 Layer 1
Fig. 2-9
Far-end RMM rack diagram
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As required, one or two RMM modules can be selected.
2) Far-end TC racks
One far-end TC rack is composed of one far-end sub-multiplexing shelf and up to four TC shelves. The rack diagram is shown in Fig. 2-10.
Layer 6 Layer 5 Layer 4 Layer 3 Layer 2 Layer 1 FSMU BATC-1 BATC-2 BATC-3 BATC-4
Fig. 2-10 Far-end TC rack diagram
2.
Near-end BSC racks in the case of sub-multiplexing
The rack diagram of the BSC central rack in the case of sub-multiplexing is illustrated in the following description, where we will use these abbreviations: N13 indicates that the TC is located at the near-end, one RMM is located at the near end, and three RMMs are located at the far end. F21 indicates that the TC is located at the far-end, two RMMs are located at the near end, and one RMM is located at the far end. In addition, for BSMU (), characters in brackets express the connected far-end unit.
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The locating principle of the near-end rack is to place sub-multiplexing shelves on Rack 1 and 2, and the rest by sequence. 1) Near-end BSC rack configuration in the case of N31
In this case, the near-end BSC includes all TCs and three RMMs; and the far-end BSC has two RMMs. The near-end BSC rack configuration diagram is shown in Fig. 2-11.
Layer 6 Layer 5 Layer 4 Layer 3 Layer 2 Layer 1 BSM U BB IU -1 BCTL SCU BN ET B ATC-1 B ATC-2
BBIU -2 BCTL RM U -2 BATC-3 BATC-4 BATC-5 BATC -6
BB IU -3 BC TL R M U -3 BB IU -4 BC TL R M U -4 B ATC-7 B ATC-8
#1
#2
#3
Fig. 2-11 Near-end BSC rack configuration diagram in the case of N31
2) Near-end BSC rack configuration in the case of N22

In this case, the near-end BSC includes all TCs and two RMMs; and the far-end BSC has two RMMs. The near-end BSC rack configuration diagram is shown in Fig. 2-12.
Layer 6 Layer 5 Layer 4 Layer 3 Layer 2 Layer 1 BSM U(BBIU-1~2) BCTL ( SCU) BNET BATC-1 BATC-2
BBIU-3 BCTL(RM U-3) BATC-3 BATC-4 BATC-5 BATC-6
BBIU-4 BCTL(RM U-4) BATC-7 BATC-8
#1
#2
#3
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Fig. 2-12 Near-end BSC rack configuration diagram in the case of N22
3) Near-end BSC rack configuration in the case of F31

In this case, the near-end BSC includes three RMMs; and the far-end BSC includes all TCs and one RMM. The near-end BSC rack configuration diagram is shown in Fig. 2-13.
Layer 6 Layer 5 Layer 4 Layer 3 Layer 2 Layer 1 B SM U (B B IU -1 ) B C T L(S C U ) BNET B S M U (B A TC -1 ~ 4) B S M U (B A TC -5 ~ 8)
B B IU -2 B C TL (R M U -2 ) B B IU -3 B C TL (R M U -3 )
B B IU -4 B C T L(R M U -4)
#1
#2
#3
Fig. 2-13
Near-end BSC rack configuration diagram in the case of F31
4) Near-end BSC rack configuration in the case of F22

In this case, the near-end BSC includes two RMMs; and the far-end BSC has all TCs and two RMMs. The near-end BSC rack configuration diagram is shown in Fig. 2-14.
L ayer 6 L ayer 5 L ayer 4 L ayer 3 L ayer 2 B S M U (B B IU -1 ~ 2 ) B C T L (S C U ) BNET
B B IU -3 B C T L (R M U -3 ) B B IU -4 B C T L (R M U -4 )
B S M U (B A T C -1 ~ 4 ) B S M U (B A T C -5 ~ 8 )
L ayer 1
#1
#2
Fig. 2-14
Near-end BSC rack configuration diagram in the case of F22
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2.2.3
GPRS rack configuration The ZXG10-BSC (V2) GPRS is of standard configuration with only one rack including a set of GIU and eight sets of SPCUs. The rack number is arranged as GPRS rack following BSC rack when the racks are arranged side by side, and the GPRS rack structure diagram is as shown in Fig. 2-15.
L ayer 6 L ayer 5 L ayer 4 L ayer 3 L ayer 2 L ayer 1
B G IU BPCU1 BPCU2 BPCU3 BPCU4
Fig. 2-15
ZXG10-BSC (V2) GPRS shelf diagram
In the ZXG10-BSC (V2) design, one SPCU unit contains up to seven BRP boards, three FPR boards, all of them are N+1 backed up. Of them, one BRP board can support up to 80 cells and 80 PS channels. Thus, one fully configured SPCU unit, containing up to six active BRP boards, can support a maximum of 480 cells or 480 PS channels. One FRP board at the Gb interface can process up to 10 NSVC. Therefore, one fully configured SPCU unit, containing up to two active FRP boards, can be configured with a maximum of 20 NSVCs.
2.3
Board configuration of each layer of units

1. The board configuration of the BBIU is shown in Fig. 2-16.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
P O W B
T T I I C C
T T I I C C
B B C C B B T T T T I I O O I I I I I I P P M M P P C C C C P P I I P P
T T I I C C
T T I I C C
P O W B
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Fig. 2-16 BBIU board configuration
2.
The board configuration of the BCTL (RMU) is shown in Fig. 2-17.

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
P O W B
S M E M
M P
M P
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
P O W B
Fig. 2-17
BCTL (RMU) board configuration
3.
The board configuration of the BCTL (SCU) is shown in Fig. 2-18.

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
P O W B
S M E M
M P
M P
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
C O M M
P M E O P N D
P O W B
Fig. 2-18 BCTL (SCU) board configuration
4.
The board configuration of the BNET is shown in Fig. 2-19.

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
P O W B
S C Y K C I K
S Y C K
B O S N
B D D D D D D D D D D O S S S S S S S S S S S N N N N N N N N N N N I I I I I I I I I I
P O W B
Fig. 2-19
BNET board configuration
5.
The board configuration of the BATC is shown in Fig. 2-20.

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
P O W B
T T C C P P P P
E / D R T
E / D R T
E / D R T
E / D R T
E / D R T
E / D R T
E / D R T
E A A T T / I I I I D P P C C R P P T
T T I I C C
T T I I C C
T T I I C C
P O W B
Fig. 2-20
BATC board configuration
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6.
The board configuration of the NSMU is shown in Fig. 2-21.
The BSMU shelf can provide the near-end sub-multiplexing function, called the NSMU.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
P O W B
N S P P
N T T S I I P C C P
T T I I C C
T T I I C C
T T I I C C
P O W B
Fig. 2-21 NSMU board configuration
7.
The board configuration of the FSMU is shown in Fig. 2-22.
The BSMU shelf can provide the far-end sub-multiplexing function, called the FSMU.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
P O W B
S C Y K C I K
S Y C K
F S P P
F T T S I I P C C P
T T I I C C
T T I I C C
T T I I C C
P O W B
Fig. 2-22 FSMU board configuration
8.
The board configuration of the PCU is shown in Fig. 2-23.

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
P O W B
B B B B B B F F F F P P R R R R R R R R R R U U P P P P P P P P P P C C
P P F F F B B B B B B B U U R R R R R R R R R R C C P P P P P P P P P P
P O W B
Fig. 2-23 PCU board configuration
9.
The board configuration of the GIU is shown in Fig. 2-24.
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1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
P O W B
H H M M S S
G G T T I I I I P P C C P P
T T I I C C
T T I I C C
T T I I C C
P O W B
Fig. 2-24 GIU board configuration
2.4
Equipment parameters
The subsystem of the ZXG10-BSC is designed for the GSM900/1800 and EGSM900 systems, thus to control and monitor the BSs of 900MHz, 1800MHz and extended 900MHz specified in the GSM900/1800 and EGSM900 Specifications. It also fulfills the handover process between two cells in different frequencies of GSM900 and 1800, and implements proper configuration and adjustment to the planning of the two different cells. While as a packet-style data service of the GSM, the GPRS is introduced at the GSM Phase2+, and provides end-to-end mobile data service based on the packet switching and transmission technology. It can utilize the radio resources and network land resources efficiently, and is especially applicable to long-term, small-traffic burst data services. The main technical performance and parameters of the ZXG10-BSC (V2) is as follows: 1. Standard BSC in the switching matrix of 32K 32K capacity.
2. Radio resources management and BS monitoring functions, implementing BSS operation and maintenance management and BS testing. 3. Supporting connection, paging, location and switching of the MS, providing the TRAU and GPRS functions, and supporting the uplink and downlink data service transmission functions of the MS. 4. The TRAU adopts the VAD technology, supporting discontinuously
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sending and receiving the DTX. 5. The TRAU can be set with an independent rack as independent equipment. The TRAU is shared by multiple BSCs or built in the BSC or MSC. 6. The PCU can provide cross connection function of the circuit service, enabling the A interface and Gb interface services to multiplex one PCM line, the timeslot of which can be flexibly configured. 7. Supporting transmission in both acknowledgement non-acknowledgement mode of the uplink and downlink packet data. 8. and
Supporting channel coding modes of the CS1 ~ CS4, and
dynamically adjusting the channel coding mode in accordance with the monitoring and testing results. 9. The MAC is in the dynamic allocation mode.
10. The PDCH coexists with the circuit service channel in the cell, and the dynamic conversion between the PDTCH and TCH channels according to the service status is supported. 11. Supporting the GSM900/1800 MHz and EGSM900M BS, and the automatic switchover of the MS between different modes. 12. Supporting the star, chain, ring and tree networking of the BTS. 13. Support multiple handover modes: Synchronized, asynchronized, pseudo-synchronized and pre-synchronized handover. 14. Supporting CBCH. 15. Supporting the SMS in both Chinese and English (point-to-point SM and cell broadcast SM). 16. Supporting the frequency hopping scheme in the unit of timeslot, and the TDMA frame frequency hopping is an instance of the timeslot frequency hopping. 17. Completely meeting all the data requirements of the power control
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and switching control indicated in the GSM05.08 Specification. 18. Supporting macro cellular, micro cellular and pico cellular systems. 19. Supporting concentric and multi-layer networking technologies. 20. Supporting a maximum of 512 cells, 1024 TRXs, featuring powerful processing capability, and capable of reducing the networking complexity of the system, improving the network quality and economizing the equipment room investment. 21. The largest traffic volume: 2000 Erlang (Erlang is the traffic load unit). 22. BHCA: More than 250K. 23. The interface link capability is as shown in Table 2-1.
Table 2-1 Interface link capability Interface link type Abis interface SS7 link A interface Gb interface 320 * E1 trunks 16 * 64K bit/s links or two 2M SS7 links 256 * E1 trunks 64M bit/s Maximum capacity
24. The number of the A interface and Abis interface links can be flexibly configured as required. 25. The reliability index is the same as that of the switching system, and is compliant with specifications of the Red Papers of the Ministry of Post and Telecommunication and the YDN065-1997: the MTBF 0.1 million hours.
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26. Parameters of the systems working environment and the BSC racks are shown in Table 2-2.
Table 2-2
Parameters of the systems working environment and the BSC racks Parameter index -48VDC 2200mm (H) 810mm (W) 600mm (D) (excluding the left/right side boards) 2200mm (H) 870mm (W) 600mm (D) (including the left/right side boards) 600W 200kg (excluding the left/right side boards) 270kg (including the left/right side boards) 15C~30C (long-term) 40%~65% (long-term) -57V~-40V 198V~242V 50Hz5Hz
Parameter name Power
Rack dimensions
Power consumption Weight Ambient temperature: Relative humidity DC voltage fluctuation range AC voltage fluctuation range Frequency deviation
The software structure of the ZXG10-BSC (V2) features the following: 1. Perfect fault tolerance of the BSS state machine can allow the sequence of various messages of A interface and Gb interface, thus improving the butting capability between the BSC and various types of MSCs/SGSNs. 2. The BSS state machine can enhance the traffic processing capacity of BSC. 3. It has a perfect design in transaction handling, and features high reliability and security. 4. It has an automatic emergency self-protection system, so as to guarantee the user application in case of BCCH carrier frequency failure. 5. The diagnosis and testing system and monitor-alarming system ensure a secure and reliable operation of the system. 6. It can automatically adjust the configuration of the circuit service and packet service in accordance with the practical services, thus ensuring full use of the radio resources.
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3
3.1
3.1.1
Preparation of Installation
Check of installation environment
Requirements on equipment room 1. Layout of equipment room
Generally, the equipment room is classified into main equipment room and auxiliary equipment room. The main equipment room is used to install the principal equipment of the BSC system, while the auxiliary equipment room is used to install such accessories as the operation and maintenance equipment, manual position, UPS, battery set, etc. To make the principal equipment run in an independent environment and at the same time facilitate maintenance and management, the main and auxiliary equipment rooms must be separate but not far from each other to make the connecting line between them as short as possible. The operation and maintenance station is arranged in the way that the operation and maintenance personnel face the front side of the principal equipment. Generally the main equipment room and the operation and maintenance room are separated with a glass wall. And, once conditions permit, the principal equipment and the primary power supply should better not be installed in the same room.
2.
Area of equipment room

The area of the equipment room should be sufficient to hold the principal equipment and auxiliary equipment of the BSC system for the final capacity and to pile materials and equipment. In front of the BSC system cabinet, there should be at least 1.5m clear space for the convenience of opening the door and maintenance. When cabinets are arranged into multiple rows, the front side of the first row of cabinets faces the operation and maintenance console, and two rows of cabinets are arranged back to back. The distance between the back sides of two rows of cabinets is not less than 1.2m, and the distances between the front/back/left/right side of a cabinet row and the wall is not less than 0.8m (the distance between the side with adjusting and testing devices
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and the wall is 1m).
3.
Height of the equipment room

The height of the equipment room refers to the clear height from the beam bottom or wind duct to the upper surface of the floor. It shouldnt be lower than 3m for upper routing and 2.7m for lower routing.
4.
Walls and doors/windows of the equipment room
The walls of the equipment room should be treated with anti-absorbing, fireproof and dampproof coatings or wall paper, or coated with lusterless paint. The layout of the doors and windows of the equipment room should be reasonable with the effective height no less than 2m and width of 1m after opening the door. Doors and windows should better be double-layer glass, sealed with the dust-proof rubber strip, and should be kept clean. 5. Floor of the equipment room
The weight-bearing capacity of the floor in the main equipment room is more than 450kg/m2, and that of the auxiliary equipment room is more than 300kg/m2. The floor must be laid and supported in a flat and firm way. The level error per square meter is no more than 2mm.
The floor must be anti-static. The system resistance value of the floor should comply with YD/T 754-95 General Rules for Anti-Static Protection of Communications Equipment Room (issued in June 1995). The floor must be statically grounded by connected to the grounding facilities with highly conductive line via the 1M current-limiting resistor.
In addition, the optimum height of the floorboard is 300mm to 330mm, without garish patterns. The paints on the surface of the floor shall be lusterless without the volatilization of harmful substances. Dampproof, rodent-resistant and mothproof precautions shall be taken under the floor. If the lower wiring mode is employed, hidden pipes, ground slots and openings shall be reserved under the floor, and their quantities, locations and sizes shall meet the requirements for laying various wires and cables,
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with the convenience for maintenance and laying of cables during future capacity expansion. The equipment environment needs to meet the following requirements as well: 1. Requirements for temperature and relative humidity
The temperature and humidity of the working environment inside the equipment room are measured at the spot of 1.5m above the floor and 0.4m away from the equipment when there is no protective plate in front of or at the back of the equipment rack. The measured value of working environment of the ZXG10-BSC shall meet the following requirements as shown in Table 3-1.
Table 3-1 Requirements of the ambient temperature and relative humidity Name Temperature Relative humidity Long-term working conditions 15C~30C 40%~65% Short-term allowed conditions 0C ~45C 20%~90%
Here short-term working duration means no more than 48 consecutive hours, and no more than 15 accumulated days in one year. 2. Electromagnetic interference resistance design
The equipment room shall be far away from high-power radio transmitting station, radar transmitting station, and high-frequency large-current equipment. The actual electric field intensity radiated to the equipment room shall be controlled below 300mV/m, and the intensity of magnetic field shall be less than 11Gs. Generally, the following anti-radiation measures are recommended: 1) Shield the equipment room or shield electromagnetic radiation interference source. against the definite
2) Install a shielding wall between the principal equipment of the system

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and the equipment containing a transmitter with high-frequency radiation, and using separate power supply lines. 3) The power line and the conductive line in the pipe shall be grounded reasonably and the shield layer of all the cables shall be grounded. 4) Twist the signal lines and return lines so that the conductive voltage caused by the line radiation interference offsets itself. 5) Separate the power supply lines and signal lines as much as possible and avoid laying them down in parallel. 6) Strictly separate the grounding wires of the AC and DC power supplies in the equipment room. 3. Air-conditioning and ventilation design
Too high or too low temperature and humidity in the equipment room will bring about unfavorable effects to the equipments life span. For example, when the temperature is 10C over the normal temperature, the equipment life span will be half reduced. Too low temperature will weaken the performance of the optical components, transistors and other devices. Under long-term high relative humidity, the insulation of some insulating material may degrade or leakage may even happen, and the metal parts of the equipment may corrode. While the low relative humidity in long term will make the insulating gaskets dry and shrink thus the fixed screws may become loose and strong static discharge may be generated, damaging the CMOS circuit on the machine.
In order to guarantee the environment conditions for equipment operation, air-conditioning and ventilation devices must be installed. Generally, the main equipment room shall be equipped with the air-conditioning equipment that runs perennially, and other auxiliary equipment rooms shall also be equipped with the air-conditioning equipment that runs seasonally according to various conditions (including the climate condition and the economic condition of the user). The basic requirements of the air-conditioning equipment are: 1) Air-conditioning humidity: 30% ~ 75%
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2) Air-conditioning temperature: 18C ~ 28C The capacity of the air-conditioning and ventilating system shall be determined on the basis of calculating the quantity of heat produced by the principal equipment of the system plus the quantity of heat produced by external heat sources (such as the heat radiated by the sun to the equipment room through the window or wall, the heat produced by the maintenance personnel inside the equipment room as well as the heat brought by the maintenance personnel when coming in or going out). In order to guarantee the safe and reliable operation of the air-conditioning and ventilation system, the air-conditioning equipment is generally required to be dual systems, with the capacity of each system more than half of the total air-conditioning capacity. The airtight conditions of the equipment room must not be damaged due to the installation of air-conditioning equipment, meanwhile, the content ratio of fresh air delivered to the equipment room shall not be less than 5%, so as to guarantee the appropriate air freshness inside the room.
To ensure the cleanness of the air, the dirt density and particle size, the densities of salts, acids and sulfides should strictly comply with CF 014-95 Communications Equipment Environment Conditions (Provisional Regulations), because these harmful gases may speed up metal corrosion and aging of some parts. Measures shall also be taken to prevent the incursion of such harmful gases as SO2 and H2S into the equipment room, so as to protect the health of the working personnel.
Since hot air generally flows upward, the cooling and heat radiation of the principal equipment also employs the upward exhausting mode. So, when centralized air-conditioning system is installed, the air should be taken in from the bottom and returned to the top. The air inlet is located under the movable floor, which is helpful for the heat radiation of the equipment. The blast pipe is not installed on the top, guaranteeing that no dew will be produced under any circumstance. Generally speaking, large equipment rooms should be equipped with the air-conditioners with humidity regulation, while small equipment rooms
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may just be equipped with the common-type cabinet or window air-conditioners. 4. Fire protection design
The main building of the equipment room must meet corresponding requirements in the national GBJ 16-17 Fire Protection Specifications in Building Engineering. Based on the local fire protection regulations, the corresponding fire equipment shall be equipped and sufficient fire passages shall be reserved. Notice boards bearing Key Fire Protection Site shall be hung at proper locations. It is strictly forbidden to store flammable or explosive articles in the principal or auxiliary equipment room, and notice boards with No Smoking or Smoking and lighting fires strictly forbidden shall be posted up at eye-catching places. Effective fire-fighting equipment shall be equipped and placed within easy access, and effective water supply facilities for fire fighting shall be installed at proper positions. The stored amount of water for fire protection is expected to guarantee the fighting of fire for 2 hours. However, it is inadvisable for the water supply pipes, water drainage ducts and rainwater ducts to pass through the equipment room, and fire hydrants should not be installed in the equipment room. Alarming devices for smog and high temperature shall be installed and inspected frequently to guarantee their good performances.
5.
Illumination design
An incandescent light bulb (or emergency lighting device) should be installed at a proper place between the racks to provide light for equipment installation and maintenance. At the same time, the equipment should be kept from long-time exposure to the light or sunshine lest that the circuit boards or components will easily distort or age due to the long-time high temperature. It is recommended that colored glass and non-tint transparent curtain be used for windows. The principal illumination of the equipment room employs fluorescent lamps that are embedded into the ceiling, with an average illumination of 300~450Lx. 6. Lightning protection design
The lightning protection design is the most important content in security design. When the height of the buildings main-body or its auxiliary facilities (such as chimney, antenna, and water tower) is over 15m, effective lightning protection measures shall be taken according to the lightning protection requirements for Class II civil buildings and
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constructions. In the lightning protection design, measures shall be taken to guard against direct-strike lightning and the incursion of lightning current. Protective measures should also be taken to defend flank attack lightning when a high-rise building serves as the equipment room. Flank attack lightning is often encountered in areas rich in lightning (e.g., Guangxi, Jiangxi, Guangdong, Fujian, Hunan, and Yunnan with more than 80 daily lightnings). Therefore, protective measures against flank attack lightning shall be taken in design in line with the specific conditions, e.g., connect the metal window frame of the building with the lightning protection lead wire, or install horizontal lightning-protection metal straps on the external surface of the wall by separating them with certain spaces along the height of the building. The following lightning protection measures shall be taken for the main building body of the equipment room. 1) Install lightning protection nets or lightning protection straps on the parts of the building that are liable to lightning. 2) Protruding objects such as chimney, antenna and water tower, shall be equipped with overhead conductor or arrestor. 3) The sectional area of the lead wire of the lightning protection device is no less than 200mm2, with a distance not greater than 30m, and the impulse grounding resistance of the lightning protection grounding device for the building is not greater than 10. 4) Outdoor cables and metal pipes are grounded before coming into the building; 5) The grounding entities shall be the metal parts (e.g., walls, reinforcing steel bars inside pillars) of the building itself, which shall be used as the lead wire of the lightning ground, and such lead wires shall be electrically connected with each other to balance the electric potential inside the building.
In the past, the lightning protection ground of the building was separated from the ground of telecom and power supply systems, and large distances were required between various grounding devices. However, due to such reasons as small building
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sites, most of these requirements of distance were not satisfied. In fact, they can not be separated in many circumstances, so it is advisable to employ joint grounding systems for the lightning protection of the buildings. The joint grounding system connects the operating ground and protection ground for telecom use and the lightning protection ground of the building as well as the ground of the industrial frequency AC power supply system together. The requirement for the grounding resistance of joint grounding is quite strict. Since the grounding resistance required for BSS equipment room is less than 10, while the grounding requirements for different telecom equipment vary, the joint grounding resistance shall be determined according to the minimum resistance value of the various grounding devices.
In addition, proper lightning protection devices for the power supply must be installed to the lines of the mains input to the equipment room. 7. Quakeproof ability
The BSC room shall be equipped/installed with quakeproof facilities, so that the switching system room has the ability to withstand the earthquake with a seismic magnitude of 7 on the Richter scale.
8.
Anti-static design
The influence of static electricity on the equipment may often be neglected, but it is a very serious problem, to which great attention must be paid. From the data available from related materials and the failure analysis made to the on-site repaired parts of ZTE Corporation, 50% of the component damage among damaged parts is caused by static electricity. In addition, the destruction of static electricity to the device is often not the once-for-all kind, it will accumulate these damages, and in this course, intermittent failure or performance deterioration will occur in the operation of the equipment. The static electricity may cause software fault, as a result, the electric switches and control circuits may not function properly or even act wrongly. Static induction mainly originates from the following aspects: 1) External electrical fields, such as outdoor high-voltage power transmission lines and lightning.
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2) Internal systems of indoor environment, floor material and overall structure, etc. 3) Discharge of the static electricity on the body of the O&M personnel to the equipment through body contact.
In order to effectively eliminate the harm due to electric static discharge (ESD), the following measures may be taken:
1) Ground the equipment well; 2) Lay anti-static floor and make grounding connection for the floor. 3) The O&M personnel should wear ESD wrist ring in operation, and connect the ESD ring with the electric static discharge hole on the equipment rack. 3.1.2 Requirements on power supply and grounding 1. DC power supply requirements: 1) Voltage range: the nominal voltage of the primary power supply to the equipment room shall be -48V, which has an allowance of -57V~40V. 2) The noise level indices of DC power supply voltages shall meet the general specifications of the former MPT. 3) The DC power supply shall have over-voltage/current protection and indication system. 2. AC power supply requirements: 1) Three-phase power supply: 380V38V, 50Hz2.5V, waveform distortion <5% 2) Single-phase power supply: 220V22V, 50Hz2.5V, waveform distortion <5% 3) The standby generator voltage waveform distortion shall be
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5%~10%. 3. Grounding requirements
Grounding plays an important role in guaranteeing a good electromagnetic condition and anti-interference ability for the operating environments of the principal equipment and auxiliary equipment of the system, so great attention must be paid.
Firstly, it should meet YD/T 1051-2000 General Technology Requirements on Power Support System of Communication Bureau (Station), details of which are mentioned in 6. Lighting protection design of 3.1.1. Next, certain factors that affect the grounding resistance should be taken into consideration such as state of soil, grounding body resistance and grounding cables.
1) The type of the soil has the greatest influence on the grounding resistance. For a place with poor soil state, resistance reducing agent (e.g., propenamide) can be added around the ground pole to reduce the resistance rate of the soil and the contact resistance between the soil and the grounding devices. Temperature and humidity may also affect the grounding resistance. When the temperature is lower than 0oC and the humidity is too low, the grounding resistance varies greatly. So in northern districts, the grounding stake may be buried deeply and the chemical auxiliaries may be added to meet the requirements for grounding resistance. 2) The connecting cables between the grounding stake and the grounding bolt on the principal equipment of the system shall be of copper core, with a sufficiently large sectional area that is generally no less than 50mm2. The length shall be as short as possible and the sectional area of the copper wire shall be increased further when the length exceeds 50m. Both ends of the connection wire shall be processed with tinning or thermal tin dipping, and the coating, varnish, paint and oxidized layer, etc., shall be removed from the fastening points, so as to guarantee good contact between the two metal surfaces. All the grounding connection parts should be protected against rusting, and the grounding bolts must be secured by using the mechanical method to guarantee the connection with low resistance.
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The grounding stake should be of angle iron with a length not less than 2m, and it would be best to use a grounding net if conditions permit. 3) It must be pointed out that, before the commissioning of the equipment, the user should take an accurate measurement of the grounding resistance, and provide data to the engineering personnel of our party. If the grounding resistance does not meet the requirement, principally, the commissioning should be postponed till some measures are taken by the user (our party may dispatch engineering personnel for assistance if necessary) and the grounding resistance meets the requirement. After the equipment is put into operation, the maintenance personnel must measure the grounding resistance regularly and record the results. If the grounding resistance increases, proper measures should be taken to reduce it, so as to meet the requirements for grounding resistance during equipment operation.
3.2
Instrument and meter preparation

1. Mechanical installation toolkit.
Professionals will complete mechanical installation and provide guide for on-site installation.
2.
Electrical installation toolkit. ZTE professionals must participate in
electrical installation. 3. Other related instrument and meters contain the following types: 1) Straight screwdriver and cross screwdriver 2) Tweezers 3) Piers (nipper pliers, slope pliers, and pincer pliers) 4) Iron 5) Extractor
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6) Multimeter 7) Programming card 8) Eraser 9) Anti-static wrist strap 4. Installation notice
Before unpacking and installing the equipment on site, the user should notify ZTE engineers to go to the site.
3.3
Technical resources preparation

The commissioning personnel shall prepare the corresponding technical documents for reference:
1. ZXG10-BSC (V2) Technical Manual 2. ZXG10-BSC (V2) Installation Manual 3. ZXG10-BSC (V2) Operating Manual
4. ZXG10-BSC (V2) Maintenance Manual
3.4
Unpacking and inspection

As the ZXG10-BSC equipment is rather expensive, it should be well packed and attached with clear waterproof and shockproof marks during its transportation. After the equipment arrives at the operators installation site, it should be handled with care and kept away from sunlight and rain.
Before unpacking and inspecting, count the overall number of the components against the attached shipping list, check whether the appearance of the case is intact. If yes, unpack it. If there are cargo mistakes, shortage or the package is severely damaged, stop unpacking immediately and report it to related
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departments to find out the cause.
1.
Notes for the unpacking inspection 1) When the equipment arrives on site, both the engineers of ZTE Corporation and representatives of the user must be present for the unpacking inspection. If the customer unpacks the equipment on his own, ZTE Corporation will not be responsible for any harmful consequences. 2) During the unpacking, the equipment should be handled gently so as to protect the surface paint of the equipment. And please pay attention to the anti-static requirements of circuit boards.
2.
Unpacking
Parts list and technical documentation are put in No. 1 packing box. Connecting bolts between racks are put in the control cabinets.
1) First, open No.1 packing box. The installation personnel should first read the technical documents and check the list. If there is any damages inside the packages, careful inspection should be done and detailed records should be taken. 2) Wooden case for side boards: open the side cover, take out a pair of well-bound side plates, cut the band open and take the plates out. 3) Wooden case for doors: Open the side cover and take out the bound front and back doors, then cut off the binding strap and take out the two pairs of doors. 4) Wooden case for racks: first, open the top cover (cover with the arrow of storage and transportation), make the case upright, note that the support arm is adown, and pull out the racks from the case. 3. Counting the pieces
After unpacking, check the devices with the configuration table and packing list, check whether the accessories are complete, and whether the parts are deformed or damaged.
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Finally, the field engineers of ZTE and the user shall jointly sign the Unpacking and Inspection Report and return it to the Marketing Department and the local office in the specified time.
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4
4.1
Hardware Installation
Hardware installation flow
The installation steps of the ZXG10-BSC (V2) are briefly shown in Fig. 4-1.
Start
Construct environment of equipment room
Preliminary inspection
Y Install racks
Install POWP
Install other equipment
Acceptance inspection
Y End
Fig. 4-1
Installation flow of the ZXG10-BSC (V2)
4.2
4.2.1
Installation of the rack

Rack installation 1. Before rack installation, find out the wire-routing direction. For the top cabling mode, first remove the top cover of the rack. 2. For shockproof considerations, the rack still has to be reinforced. The
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base, as shown in Fig. 4-2, can be produced by the user or customized by ZTE, while the height of the bracket depends on the floor height.
1. Bracket
2. Channel section steel
Fig. 4-2
Schematic diagram of the base
3. Horizontal adjustment of the section steel base: Loosen the fixing bolts between the section steel guide rail and the bracket, and adjust the adjustable bolts between the rail and the bracket until the rail is horizontal; then add proper steel blocks between the rail and the bracket near the fixing bolts and loosen the adjustable bolts; finally, tighten the fixing bolts, as shown in Fig. 4-3.
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1. Standard floor
2. Channel section steel 3. Hexagonal bolt 4. Adjustable bolt
5. Bracket 6. Stand bar bolt 7. Spring washer, plain washer, nut 8. Steel block
Fig. 4-3
Schematic diagram of the bases horizontal adjustment
4. Fixing of a rack: First remove the four stand bars under a rack, and fix the rack to the section steel base with bolts, plain washers, spring washers, and nuts, as shown in Fig. 4-4.
1. Standing column
2. Spring washer, plain washer, nut 3. Nut pad 4. Hexagonal bolt
Fig. 4-4
Schematic diagram of rack fixing
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4.2.2
Connection between racks Racks can be connected in two modes: Fig. 4-5 shows the first mode of rack connection. The short beams of the top and bottom shelves of the rack are equipped with connecting plates, between which four M8 25 hexagonal bolts, four plain washers, four spring washers and four nuts are used respectively to secure the two racks.
1. Spring washer, plain washer, nut 2. Connecting block
3. Hexagonal bolt
4. Shelf
Fig. 4-5
Schematic diagram of rack connection mode I
Fig. 4-6 shows the second connection mode. On the sides of the short beams of the top and bottom shelves of the rack there are mounting holes, where four M10 100 hexagonal bolts, four plain washers, four spring washers and four nuts are used to secure the two racks.
1. Spring washer, plain washer, nut 2. Short beam 3. Hexagonal bolt 4. Long beam
Fig. 4-6
Schematic diagram of connection mode II
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4.2.3
Connection between the side plate and rack Side plates are attached to the left and right sides of the rack. The connection between the upper end of the side plate and the rack is shown in Fig. 4-7. The upper end of the side plate is connected to the short beam on the top via bolts with spring slip rings.
1. Pins, spring
2. Slip ring
3. Hanging board
4. Spring washer, plain washer, nut 5. Shelf of the side plate
6. Upper end
Fig. 4-7
Schematic diagram of connecting the upper end of the side plate to the rack
The lower end of the side plate can be connected to the rack in two modes.
1.
As shown in Fig. 4-8, use M8 25 hexagonal bolts, plain washers,
spring washers and nuts to connect the lower hanging board of the side plate to the connecting plate on the short beam of the bottom frame of the rack.
1.Spring washer, plain washer, nut 2. Beam 3. Connecting block end of the side plate
4. hexagonal bolt 5. Shelf
6. Lower
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Fig. 4-8 Schematic diagram of side plate-rack connection mode I
2. As shown in Fig. 4-9, on the lower hanging board of the side door and on the short beam of the bottom frame, there are mounting holes, where the M8 25 hexagonal bolts, plain washers, spring washers and nuts can be used in the fastening.
1. Washer 2. Hanging board
3. Hexagonal bolt 4. Shelf
5. Lower end of the side plate
Fig. 4-9
Schematic diagram of connection mode II
4.2.4
Installation of the front door and rear door There are eight pivots installed on the rack framework. During installation of the front/rear door, place the bottom hole of the door to the sleeve on the pivot. And on the back of the upper part of the door there is a hook with a spring. Now pull it down till the pivot pin aims at the upper pivot. After the door is installed, it should be easily closed and opened. When the screws of the pivot are loosened, the location of the supporting board of the pivot can be adjusted to the left or right till equal door clearance is reached.
4.3
4.3.1
Installation of the power P (POWP) of the rack

Introduction to functions At the top of the rack is the POWP distribution box, which has two primary inputs, and, after insulation, the two inputs are provided to the whole rack in two channels via the busbar of the rack. The fan inside the POWP
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distribution box cools the whole rack. The fan is also powered by the insulated primary power supply. Inside the power distribution box are three PCBs, two of which, on the left and right respectively, are boards with the same functions for insulating POWP. The POWP distribution box has such functions as detecting the -48V voltage of the input primary power, monitoring the over-/under-voltage as well as monitoring, indicating and giving alarm for the system status and lightning protection.
4.3.2
Functionality 1. Two channels of primary power supply
The main feature of the POWP distribution box of the ZXG10BSC (V2) is the 1+1 protection of the primary power supply. That is, if only one of the two primary power supplies is normal, then the busbars on both sides of the rack will keep a normal power supply, thus the power supply is kept stable. The primary power supply reaches the POWP insulating board via the 30A air switch. 2. POWP insulating board (POWI9806)
The function of the POWP insulating board is to insulate the input 48V from the output -48V to prevent the two primary power supplies from interfering with each other. At the input end of the primary power supply, over-voltage protection is available; while at the output end of the primary power supply, lightning protection is available. This board is especially designed for the safety and reliability of the main lines of the 48V, the 48V ground, and the protection ground (P.GND). The connecting wires between the terminals on the back of the POWP distribution box and the POWP insulating board and the connecting wires between the switch and the POWP insulating board are both soldered. 3. POWP detecting board (POWT9806)
The POWP detecting board functions to detect and display the status of
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the left and right primary power supply inputs and the status of the fans. This board adopts a chip-microprocessor system (89C51), and uses the A/D converter (MAX187) to detect the 48V output voltages of POWP on a real-time basis, monitor the supply of the POWP system and its operation, and report the results to the control layer via the RS485 bus as well. 4. Clear and reliable wire connections
The connecting wire of 48V, 48V ground and protection ground inside the POWP distribution box are reliable, and will not become loose even when the panel of the box is removed. For both the POWP distribution box and the POWP circuit board, wiring descriptions are provided to avoid any wrong installation. The 48V grounding wire and the protection grounding (P.GND) wire on the rear of the box are soldered and then fastened to the terminal. Wires inside the POWP distribution box are fixed with metallic clips so that the wires do not fall off. All slots of the POWP boards have lockers to avoid inverse insertion. The terminals must be safe and reliable. The main connecting wires of the 48V, 48V ground, and protection ground employ the multi-strand soft wires with a diameter of 2.8mm, i.e., 19 strands altogether, each strand having a diameter of 0.06mm. The colors of the 48V, 48V ground and the protection ground connecting wires must keep identical to those of the connecting wires on the busbar. 5. The system will be able to timely detect the output voltages and working statuses and give alarm timely The POWP detection system can timely and accurately detect the 48V output voltage of the POWP through A/D conversion; and can timely report to the control layer via the RS485 bus the working conditions of the POWP and the fan system. Meanwhile, in hardware, it can display the working status on LEDs on a real-time basis and give timely alarms. 6. Reasonable thermal design with a little redundancy
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Against the maximum system load requirements and the worst working environments, the system thermal design is performed. On the basis of reasonable thermal design, and considering the long-time faultless operation of the POWP, the thermal design of the POWP has made adequate redundancy so that the life span of the power devices is prolonged, and system reliability is greatly enhanced. 7. Replacement of devices when power is on
Inside the POWP distribution box, the working status of the fan can be detected timely, and once the fan breaks down, it can be replaced when power is on. 8. Protection functions
When the input power supply is inverted, or the load is shorted, the air switch (30A) can effectively cut off the primary power supply. A fan short-circuit can burn the fans fuse, but the detecting circuit of the POWP board does not affect the -48V power supply. When any of the left and right power supplies fails or shuts down, the detecting board can still work normally.
4.3.3
Input, output and indicators The POWP distribution box has two (left and right) primary power supply inputs on the rear, each consisting of48V, 48V ground and protection ground (P.GND). It has two (left and right) outputs on the rear, each consisting of 48V, 48V ground and the protection ground (P.GND). The output is fulfilled in the parallel dual mode. On the rear of the POWP distribution box there is an RS485 output port. The POWP detecting board has five red fan alarm indicators. In case a fan breaks down, the corresponding indicator will turn on. On the panel of the POWP distribution box there are four LEDs, whose meanings are given in the Table of POWB and POWP Panel Indicators in Section 5.1.4.
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4.4
Installation of internal wires

In the rack of the ZXG10-BSC (V2), there are various boards and backplane jumper cables with different configurations. Functions of boards vary with jumpers, including the clock interface board (CKI), digital switching network interface board (DSNI), trunk interface circuit board (DTI), module processor (MP), etc. In addition, jumper cables on the backplane will cooperate with the system RS485 bus to monitor functions of backplanes of each layer. Listed below are jumper descriptions in the alphabetical order.
4.4.1
Clock interface board (CKI) The CKI board has a total of 20 jumpers ranging from X5 to X24, used to select the matching impedance under different clock references. The jumpers are described in Table 4-1:
Table 4-1 Jumper description for the CKI board Jumper name X5~X8 Jumper description Used respectively to select the line matching impedance for the 2MHz references of 2MHz0, 2MHz1, 2MHz2, and 2MHz3. When pin 1 and pin 2 are connected, it matches with the 120 characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75 characteristic impedance. Used respectively to select the line matching impedance for the 5MHz references of 5MHz0, 5MHz1, 5MHz2 and 5MHz3.When pin 1 and pin 2 are connected, it matches with the 120 characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75 characteristic impedance. Select the characteristic impedance of line 0 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with 120 characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75 characteristic impedance. Select the characteristic impedance of line 1 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with 120 characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75 characteristic impedance. Select the characteristic impedance of line 2 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with the 120 characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75 characteristic impedance. Select the characteristic impedance of line 3 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with the 120 characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75 characteristic impedance.
X9~X12
X13~X15
X16~X18
X19~X21
X22~X24
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4.4.2
Digital switching network interface (DSNI) board The DSNI board has a total of 3 jumpers, X3, X4A, and X4B, which can be configured to connect the COMM board (of MP level) and the PP board (of PP level). The jumper descriptions are listed in Table 4-2:
Table 4-2 Jumper description for the DSNI board Jumper name X3, X4A and X4B Jumper description Used for DSNI configuration; when pin 1 and pin 2 are connected, configure it as DSNI of MP level, connecting with the COMM board; when pin 2 and pin 3 are connected, configure it as DSNI of PP level, connecting with the PP board.
4.4.3
Trunk interface (TIC) board The TIC board has a total of six DIP switches ranging from S2 to S7, which are used to configure the matching impedance and line frame format. Descriptions of DIP switches are listed in Table 4-3.
Table 4-3 Descriptions of DIP switches for the TIC board Line frame format configuration TIC position Software-related configuration S2
on 75 A X X X X
Description
At the Gb interface
off 120 B
, X0XX
There is no E1 frame format on the line. It works in transparent mode.
At the non-Gb interface
on 75
X X
X X
off 120 B
Transmit in the E1 frame format , X1XX
Impedance matching configuration Line impedance 75 Software-related configuration 4-line E1 impedance matching S2
on 75 A X X X X
120
on 75 A X X X X
off 120 B
off 120 B
, 1XXX S3
on 75 75 75 75 on 75 75 75 75
, 0XXX
off 120 120 120 120
off 120 120 120 120
, 1111
, 0000
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on 75 75 75 75 on 75 75 75 75 off 120 120 120 120
Bt8370 of line 1
S4
off 120 120 120 120
, 1111 Bt8370 of line 2 S5

on 75 75 75 75 off 120 120 120 120 on 75 75 75 75 off 120 120 120 120
, 0000
, 1111 Bt8370 of line 3 S6

on 75 75 75 75 off 120 120 120 120 on 75 75 75 75 off 120 120 120 120
, 0000
, 1111 Bt8370 of line 4 S7

on 75 75 75 75 off 120 120 120 120 on 75 75 75 75 off 120 120 120 120
, 0000
, 1111
Note: 1=on; 0=off
, 0000
4.4.4
Module processor (MP) The MP board has one 8-bit DIP switch, which is used to set the MP node number. In BSC, this value indicates the BSC module number in the same NE, within the range of 1 to 32 (on the PCB, 1 indicates the lowest bit, while 8 the highest bit). It will do so far the foreground and background configurations are the same. The DIP switch of MP is shown in Fig. 4-10.
Value: 1
Value: 32
Fig. 4-10 DIP switch of MP
4.4.5
4.4.5.1
Configuration of backplane jumpers

Near-end units
The backplane jumper configurations are shown in Fig. 4-11. The backplane jumpers (6 2) are used to configure the slot numbers on each layer. To cooperate with the RS485 bus monitoring system, there is also a
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1 2 jumper located under the 6 2 jumpers, used to set the terminal matching resistance. The following description is given when facing the rear of the rack.
Top of the back of the rack
Layer 6
SIG6-1=011111
Layer 5
SIG6-1=101111
Layer 4
SIG6-1=110111
Layer 3
SIG6-1=111011
Layer 2
SIG6-1=111101
Layer 1
SIG6-1=111110
Bottom of the back of the rack
Fig. 4-11 Backplane jumper configuration
The 6 2 jumpers on the left side and right side represent signals SIG1~6: They are used to set the slot No. The interior pin is the ground, and the exterior pin is the signal. Short-circuit signal is 0, and open-circuit signal is 1. Configurations of SIG1 ~ SIG6 must be the same. The left and right sides are distinguished by SIG7. This signal is fixed to a high level on the left side, while on the right side, it is fixed to the ground. The 1 2 jumpers on the left and right sides: They are used to set the matching resistance. Short-circuit: using the 120terminal matching resistance; open-circuit: not using the terminal matching resistance. If this layer is at the last node of the RS485 bus link,
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then the matching resistance should be connected. Otherwise, the jumper should be open. On the same RS485 bus link, only one jumper should be configured to be short-circuited.
4.4.5.2
Far-end units
On the SMU backplane of the far-end unit, besides the jumper units the same as mentioned above, there are also jumpers for RS485 configuration, as follows: X140 and X141 are used to configure the slot No. of the GPP board, which can be configured as FSPP, NSPP or GIPP by connecting X140 and X141. For the connection, please refer to the description printed on the backplane. X123, X133, X137 and X138 are used to connect the RS485 bus of POWB to that of GPP; while X149 and X150 are the impedance matching jumpers of the RS485 bus monitored by FSPP. Since FSPP monitors the RS485 buses of its rack, all the RS485 buses of POWB of this rack should be connected to FSPP in the cascading mode; that is, X132, X133, X137 and X138 should be connected while X149 and X150 disconnected. Otherwise, keep X132, X133, X137 and X138 disconnected and short X149 and X150.
4.5
4.5.1
Installation of external cables

Cable connection of the BSC system without sub-multiplexing Connections of cables are almost the same despite the different rack capacities, although the number of cables will increase with the increase of capacity. To avoid repeated discussion, we will only describe the cable connections in detail in the case of N_trx240, and only connection changes will be introduced for other cases.
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4.5.1.1
NN_trx240
1.
The clock and HW cables from BIPP to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from BIPP to the T network; Type: 38 cables. The connections from BIPP to the T network are as shown in Table 4-4. BIPP end CNTn (n=0~1) socket on the BIPP board in the BBIU shelf. DSNI end SPCn (n=54~57) socket on the DSNI board in the BNET shelf.
Table 4-4 DSNI end 1# L3_DSNI3-S_SPC56~57 DN1~8
Connections from BIPP to the T network BIPP end 1# L6_BIPP_L_CNT0 1# L6_BIPP_R_CNT1 UP25~32 UP25~32
1# L3_DSNI3-S_SPC54~55 UP25~32
Signal line 1# L3_DSNI3-S_SPC56~57 DN1~8 is described in Table 4-5.
Table 4-5 Description of the signal line 1# L3_DSNI3-S_SPC56~57 DN1~8 Name 1# L3 DSNI3-S SPC56~57 DN1~8 No.1 rack) Indicating the layer-3 backplane from the bottom of the rack Indicating the symbol name of the 96-pin socket Indicating the symbol name of the specific identifiers on the socket. Indicating the specific positions on the socket: the positions 1~8 of the DOWN 96-pin socket Description Rack No. when racks are assembled (seen from the front, the leftmost rack is
Signal line 1# L6_BIPP_L_CNT0 UP25~32 is described in Table 4-6.
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Table 4-6 Description of the signal line 1# L6_BIPP_L_CNT0 UP25~32 Name 1# L6 BIPP L CNT0 UP25~32 No.1 rack) Indicating the layer-6 backplane from the bottom of the rack Indicating the symbol name of the 96-pin socket Indicating the left side of the backplane (seen from the back of the rack) Indicating the symbol name of the specific identifiers on the socket Indicating the specific positions on the socket: the positions 25~32 of the UP 96-pin socket Description Rack No. when racks are assembled (seen from the front, the leftmost rack is
2.
The clock and HW cables from ATC to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 38 cables. The connections from TCPP to the T network are as shown in Table 4-7. TCPP end CNT socket on the TCPP board in the BATC shelf.
DSNI end SPCn (n=0~3) socket on the DSNI board in the BNET shelf.
Table 4-7 Connections from TCPP to the T network DSNI end 1# L3_DSNI0-S_SPC0~1 UP1~8 1# L3_DSNI0-S_SPC2~3 UP9~16 TCPP end 1# L2_TCPP_CNT UP25~32 1# L1_TCPP_CNT UP25~32
3.
The HW cables for 2M messages from the BCTL (SCU) layer to the
BNET layer Type E cables (2MHWI, 2MHWO); Name: cables from DSNI to COMM; Type: 38 cables. The connections from the COMM end to the DSNI end are as shown in Table 4-8.
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DSNI end - MPCn (n=0~31) socket position on the DSNI0-C (or DSNI1-C) board in the BNET shelf. COMM end - COMMnD1 (or COMMnD2) (n=1~12) socket position on the COMM board in the BCTL (SCU) shelf.
Table 4-8 Connections from the COMM end to the DSNI end COMM end L4_COMM1_COMM1D1 DN25~32 L4_COMM2_COMM2D1 DN25~32 L4_COMM3_COMM3D1 DN17~24 L4_COMM4_COMM4D1 DN17~24 L4_COMM5_COMM5D2 DN25~32 L4_COMM6_COMM6D2 DN25~32 DSNI end L3_DSNI0_C_MPC0.2 L3_DSNI1_C_MPC1.3 L3_DSNI0_C_MPC8.10 L3_DSNI1_C_MPC9.11 L3_DSNI0_C_MPC12.14 L3_DSNI1_C_MPC13.15 UP1~8 UP1~8 UP17~24 UP17~24 UP25~32 UP25~32
(to be continued)
COMM end L4_COMM7_COMM7D2 DN25~32 L4_COMM8_COMM8D2 DN25~32 L4_COMM9_COMM9D2 DN25~32 L4_COMM10_COMM10D2 DN25~32 L4_COMM11_COMM11D2 DN25~32 L4_COMM12_COMM12D2 DN25~32 DSNI end L3_DSNI0_C_MPC16.18 L3_DSNI1_C_MPC17.19 L3_DSNI0_C_MPC20.22 L3_DSNI1_C_MPC21.23 L3_DSNI0_C_MPC24.26 L3_DSNI1_C_MPC25.27 DN1~8 DN1~8 DN17~24 DN17~24 DN9~16 DN9~16
4. Connection control cables from the BCTL (SCU) layer to the BNET layer Type F cables; Name: cables from COMM to BOSN; Type: 1-to-2 38 cables. The connections from the COMM end to the DSN end are as shown in Table 4-9. COMM end COMMnD2 (n=3~4) socket position on the COMM board in the BCTL (SCU) shelf.
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DSN (CLK) end - COMM0 (or COMM0) socket position on the DSN board in the BNET shelf. DSN end - COMM1(or COMM1) socket position on the DSN board in the BNET shelf.
Table 4-9 Connections from the COMM end to the DSN end COMM end L4_COMM3_COMM3D2 DN25~32 L4_COMM4_COMM4D2 DN25~32 DSN end (CLK) L3_DSN_COMM0 DN25~32 L3_DSN'_COMM0' DN25~32 DSN end L3_DSN'_COMM1' DN17~24 L3_DSN_COMM1 DN17~24
5.
2MHW cables from BBIU to BCTL (RMU)
Type E+ cables (2MHWI, 2MHWO); Name: cables from COMI to COMM; Type: 1-to-2 38 cables. The connections from the COMM end to the COMI end are as shown in Table 4-10. COMI end CNCn (n=0~13) socket on the COMI board in the BBIU shelf. COMM end COMMnD2 (n=1~12) socket on the COMM board in the BCTL (RMU) shelf.
Table 4-10 Connections from the COMM end to the COMI end COMM end RMU_COMM1_COMM1D2 RMU_COMM2_COMM2D2 RMU_COMM3_COMM3D2 RMU_COMM4_COMM4D2 RMU_COMM5_COMM5D2 DN25~32 DN25~32 DN25~32 DN25~32 DN25~32 COMI end BBIU_COMI_CNC0.1 UP1~8*
BBIU_COMI_CNC2.3 UP9~16 BBIU_COMI_CNC4.5 UP17~24
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RMU_COMM6_COMM6D2 RMU_COMM7_COMM7D2 RMU_COMM8_COMM8D2 RMU_COMM9_COMM9D2 DN25~32 DN25~32 DN25~32 DN25~32 DN25~32 BBIU_COMI_CNC6.7 UP25~32
RMU_COMM10_COMM10D2
BBIU_COMI_CNC8.9 DN1~8
RMU_COMM11_COMM11D2 DN25~32 RMU_COMM12_COMM12D2 RMU_PEPD_PEPDD2 RMU_MON_MOND2 DN25~32
DN25~32 DN25~32
6.
The clock cables from AIPP of BATC to SYCK of BNET
Type H+ cables (8K); Name: cables from AIPP to SYCK; Type: 1-to-2 38 cables. The connections from the AIPP end to the SYCK end are as shown in Table 4-11. AIPP end 8KREF socket position on the AIPP board in the BATC shelf. SYCK end - E8K socket position on the SYCK board in the BNET shelf.
Table 4-11 Connections from the AIPP end to the SYCK end DTI end L1_BATC_AIPP_8KREF L2_BATC_AIPP_8KREF UP1~8 UP1~8 SYCK end B L3_BNET_SYCK_E8K UP4~11
7.
The 8K clock cables from the BBIU layer to the BCTL (RMU) layer
Type K+ cables (8K); Name: cables from COMI to MP; Type: 1-to-2 38 cables. The connections from the COMI end to the MP end are as shown in Table 4-12.
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COMI end CNC14 or CNC15 socket on the COMI board in the BBIU shelf. MP end - MP-1D1 or MP-2D1 socket on the MP board in the BCTL (SCU) shelf.
Table 4-12 Connections from the COMI end to the MP end COMI end BBIU_COMI_CNC14, 15 DN25~32 MP end BCTL_MP-1_MP-1D1 BCTL_MP-2_MP-2D1 DN14~21 DN14~21
8.
The 8K clock cables the from BNET layer to the BCTL (SCU) layer
Type K cables (8K); Name: cables from DSNI to MP; Type: 38 cables. The connections from the DSNI end to the MP end are as shown in Table 4-13. DSNI end - MPCn (n=28~31) socket position on the DSNI1-C board in the BNET shelf. MP end - MP-1D1 (or MP-2D1) socket position on the MP board in the BCTL (SCU) shelf.
Table 4-13 Connections from the DSNI end to the MP end DSNI end L3_DSNI0-C_MPC28, 30 L3_DSNI1-C_MPC29, 31 DN25~32 DN25~32 MP end L4_MP-1_MP-1D1 DN14~21 L4_MP-2_MP-2D1 DN14~21
9. Cables in the BCTL (SCU) layer from the MON board to DSNI and POWB Type A cables (RS485); Name: cables from MON to DSNI and POWB; Type: 1-to-6 38 cables.
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The connections from the MON end to the POWBn end are as shown in Table 4-14. MON end - MOND2 socket position on the MON board in the BCTL (SCU) shelf. FBI end - RS485 socket position on the FBI1 board in the BNET shelf. POWB end 485-IN socket on the POWB board on the right at layer-6 of rack n (n is the rack No., and ranges 1~6).
Table 4-14 Connections from the MON end to the POWB end MON end 1# DN25~32 L4_MON_MOND2 n# UP1~8 POWB end L6_POWB_R_485-IN DSNI end 1# L3_FBI2'__RS485-IN UP1~8
10. RS485 cables of power supplies on the two adjacent layers Type B cables (RS485); Name: cables from the upper-layer power supply to the lower-layer power supply; Type: 38 cables. The connections from the upper-layer RS485 end to the lower-layer RS485 end are as shown in Table 4-15. Upper-layer RS485 end - 485-OUT socket position on the POWB board on layer Ln+1 (n is the layer No., and ranges 1~6 from bottom up). Lower-layer RS485 end - 485-IN socket position on the POWB board on layer Ln (n is the layer No., and ranges 1~6 from bottom up).
Table 4-15 Connections from the upper-layer RS485 end to the lower-layer RS485 end Upper-layer RS485 end Ln+1_POWB_L (R) _485-OUT UP9~16 Lower-layer RS485 end Ln_POWB_L (R) _485-IN UP1~8
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11.
RS485 cables of power supplies on the same layer
Type C cables (RS485); Name: cables of power supplies on the same layers; Type: 38 cables. Connections from the left RS485 end to the right RS485 end are as shown in Table 4-16. The connections are in the left-right symmetry. The left RS485 end 485_OUT socket position on the left POWB board in the bottom layer. The right RS485 end 485_OUT socket position on the right POWB board in the bottom layer.
Table 4-16 Connections from the left RS485 end to the right RS485 end The left RS485OUT N# POWB_L_485-OUT UP9~16 The right RS485OUT N# POWB_R_485-OUT UP9~16
12.
RS485 cables connecting POWPs
Type Z cables (RS485); Name: POWP cables; Type: 38 cables are used for one end, and round-head cables are used for the other end. The connections of POWB with POWP are as shown in Table 4-17. The last POWB end on the left - 485_OUT socket position on the left POWB board in the top shelf. POWP end - the position of the round-head socket on POWP.
Table 4-17 Connections of POWB with POWP RS485OUT L6_POWB_L_485-IN UP1~8 POWP_485IN RS485IN
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13. Network cables (Type O cables) used to connect the background Connection cables from MP to the Ethernet; Type: 38 cables are used on one end, and RJ45 cables are used on the other end. Connection relations: MP end - MP-1D2 or MP-2D2 socket on the MP board in the BCTL (SCU) shelf. RJ45 end RJ45 socket on HUB. 14. Cables (P-type cables) of sensors Cables from PEPD to sensors. 38 cables are used on one end, and smog, temperature/humidity and infrared sensors are connected to the other end. Connection relations: PEPD end PEPDD2 (SENSOR) socket on the PEPD board in the BCTL (SCU) shelf. 15. 6-pin power supply plug Type Q cable, which powers each board through the backplane, and the power supply plug is as shown in Fig. 4-12.
48VIN
4
GND
GNDP
GNDP
GND
GND48
Fig. 4-12 The power supply plug as seen from the soldering surface of the backplane
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4.5.1.2
240<N_trx480
1.
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from BIPP to the T network; Type: 38 cables. The connections BIPP to the T network are as shown in Table 4-18. BIPP end CNTn (n=0~1) socket on the BIPP board in the BBIU shelf. DSNI end SPCn (n=50~57) socket on the DSNI board in the BNET shelf.
Table 4-18 Connections from BIPP to the T network DSNI end 1# L3_DSNI3-S_SPC56~57 DN1~8 1# L3_DSNI3-S_SPC54~55 UP25~32 1# L3_DSNI3-S_SPC52~53 UP17~24 1# L3_DSNI3-S_SPC50~51 UP9~16 BIPP end 1# L6_BIPP_L_CNT0 1# L6_BIPP_R_CNT1 2# L6_BIPPL-CNT0 UP25~32 UP25~32 UP25~32
2# L6_BIPPR-CNT1 UP25~32
2.
The clock and HW cables from BATC to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 38 cables. The connections from the DSNI end to the TCPP end are as shown in Table 4-19. TCPP end CNT socket on the TCPP board in the BATC shelf. DSNI end SPCn (n=0~7) socket on the DSNI board in the BNET shelf.
Table 4-19 Connections from TCPP to the T network
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DSNI end 1# L3_DSNI0-S_SPC0~1 UP1~8 1# L3_DSNI0-S_SPC2~3 UP9~16 1# L3_DSNI0-S_SPC4~5 UP17~24 1# L3_DSNI0-S_SPC6~7 UP25~32 BATC end 1# L2_TCPP_CNT UP25~32 1# L1_TCPP_CNT UP25~32 2# L4_TCPP-CNT UP25~32 2# L3_TCPP-CNT UP25~32
3.
4.5.1.3
For connections of other cables, please refer to Section 4.5.1.1.
480<N_trx720
1.
Table 4-20 Connections from BIPP to the T network DSNI end 1# L3_DSNI3-S_SPC56~57 DN1~8 1# L3_DSNI3-S_SPC54~55 UP25~32 1# L3_DSNI3-S_SPC52~53 UP17~24 1# L3_DSNI3-S_SPC50~51 UP9~16 1# L3_DSNI3-S_SPC48~49 UP1~8 1# L3_DSNI2-S_SPC46~47 DN25~32 BIPP end 1# L6_BIPP_L_CNT0 1# L6_BIPP_R_CNT1 2# L6_BIPPL-CNT0 UP25~32 UP25~32 UP25~32
2# L6_BIPPR-CNT1 UP25~32 3# L6_BIPPL-CNT0 UP25~32
2.
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 38 cables.
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The connections from the DSNI end to the TCPP end are as shown in Table 4-21. TCPP end CNT socket on the TCPP board in the BATC shelf. DSNI end SPCn (n=0~11) socket on the DSNI board in the BNET shelf.
Table 4-21 Connections from TCPP to the T network DSNI end 1# L3_DSNI0-S_SPC0~1 UP1~8 1# L3_DSNI0-S_SPC2~3 UP9~16 1# L3_DSNI0-S_SPC4~5 UP17~24 1# L3_DSNI0-S_SPC6~7 UP25~32 1# L3_DSNI0-S_SPC8~9 DN1~8 1# L3_DSNI0-S_SPC10~11 DN9~16 BATC end 1# L2_TCPP_CNT UP25~32 1# L1_TCPP_CNT UP25~32 2# L4_TCPP-CNT UP25~32 2# L3_TCPP-CNT UP25~32 2# L2_TCPP-CNT UP25~32 2# L1_TCPP-CNT UP25~32
3.
4.5.1.4
720<N_trx960
1.
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Table 4-22 Connections from BIPP to the T network DSNI end 1# L3_DSNI3-S_SPC56~57 DN1~8 1# L3_DSNI3-S_SPC54~55 UP25~32 1# L3_DSNI3-S_SPC52~53 UP17~24 1# L3_DSNI3-S_SPC50~51 UP9~16 1# L3_DSNI3-S_SPC48~49 UP1~8 1# L3_DSNI2-S_SPC46~47 DN25~32 1# L3_DSNI2-S_SPC44~45 DN17~24 1# L3_DSNI2-S_SPC42~43 DN9~16 BIPP end 1# L6_BIPP_L_CNT0 1# L6_BIPP_R_CNT1 2# L6_BIPPL-CNT0 UP25~32 UP25~32 UP25~32
2.
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 38 cables. The connections from the DSNI end to the TCPP end are as shown in Table 4-23. TCPP end CNT socket on the TCPP board in the BATC shelf. DSNI end SPCn (n=0~15) socket on the DSNI_S board in the BNET shelf.
Table 4-23 Connections from TCPP to the T network DSNI end 1# L3_DSNI0-S_SPC0~1 UP1~8 1# L3_DSNI0-S_SPC2~3 UP9~16 1# L3_DSNI0-S_SPC4~5 UP17~24 1# L3_DSNI0-S_SPC6~7 UP25~32 1# L3_DSNI0-S_SPC8~9 DN1~8 1# L3_DSNI0-S_SPC10~11 DN9~16 1# L3_DSNI0-S_SPC12~13 DN17~24 1# L3_DSNI0-S_SPC14~15 DN25~32 BATC end 1# L2_TCPP_CNT UP25~32 1# L1_TCPP_CNT UP25~32 2# L4_TCPP-CNT UP25~32 2# L3_TCPP-CNT UP25~32 2# L2_TCPP-CNT UP25~32 2# L1_TCPP-CNT UP25~32 3# L2_TCPP-CNT UP25~32 3# L1_TCPP-CNT UP25~32
3.

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4.5.1.5
960<N_trx1200
1.
Table 4-24 Connections from BIPP to the T network DSNI end 1# L3_DSNI3-S_SPC56~57 DN1~8 1# L3_DSNI3-S_SPC54~55 UP25~32 1# L3_DSNI3-S_SPC52~53 UP17~24 1# L3_DSNI3-S_SPC50~51 UP9~16 1# L3_DSNI3-S_SPC48~49 UP1~8 1# L3_DSNI2-S_SPC46~47 DN25~32 1# L3_DSNI2-S_SPC44~45 DN17~24 1# L3_DSNI2-S_SPC42~43 DN9~16 1# L3_DSNI2-S_SPC40~41 DN1~8 1# L3_DSNI2-S_SPC38~39 UP25~32 BIPP end 1# L6_BIPP_L_CNT0 1# L6_BIPP_R_CNT1 2# L6_BIPPL-CNT0 UP25~32 UP25~32 UP25~32
2.
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 38 cables. The connections from the DSNI end to the TCPP end are as shown in Table 4-25.
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TCPP end CNT socket on the TCPP board in the BATC shelf. DSNI end SPCn (n=0~19) socket on the DSNI-S board in the BNET shelf.
Table 4-25 Connections from TCPP to the T network DSNI end 1# L3_DSNI0-S_SPC0~1 UP1~8 1# L3_DSNI0-S_SPC2~3 UP9~16 1# L3_DSNI0-S_SPC4~5 UP17~24 1# L3_DSNI0-S_SPC6~7 UP25~32 1# L3_DSNI0-S_SPC8~9 DN1~8 1# L3_DSNI0-S_SPC10~11 DN9~16 1# L3_DSNI0-S_SPC12~13 DN17~24 1# L3_DSNI0-S_SPC14~15 DN25~32 1# L3_DSNI1-S_SPC16~17 UP1~8 1# L3_DSNI1-S_SPC18~19 UP9~16 BATC end 1# L2_TCPP_CNT UP25~32 1# L1_TCPP_CNT UP25~32 2# L4_TCPP-CNT UP25~32 2# L3_TCPP-CNT UP25~32 2# L2_TCPP-CNT UP25~32 2# L1_TCPP-CNT UP25~32 3# L2_TCPP-CNT UP25~32 3# L1_TCPP-CNT UP25~32 4# L4_TCPP-CNT UP25~32 4# L3_TCPP-CNT UP25~32
3.
4.5.1.6
1200<N_trx1800
1.
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Table 4-26 Connections from BIPP to the T network DSNI end 1# L3_DSNI3-S_SPC56~57 DN1~8 1# L3_DSNI3-S_SPC54~55 UP25~32 1# L3_DSNI3-S_SPC52~53 UP17~24 1# L3_DSNI3-S_SPC50~51 UP9~16 1# L3_DSNI3-S_SPC48~49 UP1~8 1# L3_DSNI2-S_SPC46~47 DN25~32 1# L3_DSNI2-S_SPC44~45 DN17~24 1# L3_DSNI2-S_SPC42~43 DN9~16 1# L3_DSNI2-S_SPC40~41 DN1~8 1# L3_DSNI2-S_SPC38~39 UP25~32 1# L3_DSNI2-S_SPC36~37 UP17~24 1# L3_DSNI2-S_SPC34~35 UP9~16 1# L3_DSNI2-S_SPC32~33 UP1~8 1# L3_DSNI1-S_SPC30~31 DN25~32 1# L3_DSNI1-S_SPC28~29 DN17~24 1# 1# 2# 2# 3# 3# 3# 3# 4# 4# 5# 5# 5# 5# 6# BIPP end L6_BIPP_L_CNT0 L6_BIPP_R_CNT1 L6_BIPPL-CNT0 UP25~32 UP25~32 UP25~32
L6_BIPPR-CNT1 UP25~32 L6_BIPPL-CNT0 UP25~32
2.
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 38 cables. The connections from the DSNI end to the TCPP end are as shown in Table 4-27. TCPP end CNT socket on the TCPP board in the BATC shelf. DSNI end SPCn (n=0~31) socket on the DSNI_S board in the BNET shelf.
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Table 4-27 Connections from TCPP to the T network DSNI end 1# L3_DSNI0-S_SPC0~1 UP1~8 1# L3_DSNI0-S_SPC2~3 UP9~16 1# L3_DSNI0-S_SPC4~5 UP17~24 1# L3_DSNI0-S_SPC6~7 UP25~32 1# L3_DSNI0-S_SPC8~9 DN1~8 1# L3_DSNI0-S_SPC10~11 DN9~16 1# L3_DSNI0-S_SPC12~13 DN17~24 1# L3_DSNI0-S_SPC14~15 DN25~32 1# L3_DSNI1-S_SPC16~17 UP1~8 1# L3_DSNI1-S_SPC18~19 UP9~16 1# L3_DSNI1-S_SPC20~21 UP17~24 1# L3_DSNI1-S_SPC22~23 UP25~32 1# L3_DSNI1-S_SPC24~25 DN1~8 1# L3_DSNI1-S_SPC26~27 DN9~16 BATC end 1# L2_TCPP_CNT UP25~32 1# L1_TCPP_CNT UP25~32 2# L4_TCPP-CNT UP25~32 2# L3_TCPP-CNT UP25~32 2# L2_TCPP-CNT UP25~32 2# L1_TCPP-CNT UP25~32 3# L2_TCPP-CNT UP25~32 3# L1_TCPP-CNT UP25~32 4# L4_TCPP-CNT UP25~32 4# L3_TCPP-CNT UP25~32 4# L2_TCPP-CNT UP25~32 4# L1_TCPP-CNT UP25~32 5# L2_TCPP-CNT UP25~32 5# L1_TCPP-CNT UP25~32
3. Type A+ cables in the BCTL (SCU) layer from the MON board to POWB Type A+ cables (RS485); Name: cables from MON to POWB; Type: 1-to-2 38 cables. Refer to Table 4-28 for the connection relations.
Table 4-28 Connections from MON to POWB MON end 1# L4_MON_MOND1 DN17~24 POWB end 6# L6_POWB_R_485-IN UP1~8
4. 4.5.2
4.5.2.1
Configurations of cables of the BSC system with sub-multiplexing

The case that the Acon interface holds the sub-multiplexing
We will take the rack in the case 240<N_trx480 as an example, its configuration is described in Section 2.2.
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Cables in this configuration include: 1. 2. 3. 4. 5. 6. Type D cables from TCPP to DSNI Type D cables from NSPP to DSNI Type X cables from FSPP to BIPP Type E cables from DSNI to SCU/COMM Type F cables from SCU/COMM to DSN Type E+ cables from COMI to RMU/COMM
7. Type H+ cables from NSPP to SYCK of the BNET layer
8. 9.
Type H+ cables from FSPP to SYCK of this layer Type K cables from DSNI to the 8K clock of MP
10. Type A cables RS485 cables from MON to POWB and FBI. Note that no type A cables are used for the far-end racks. 11. Type B cables RS485 bus cables connecting POWBs on different
layers in a near- or far-end rack 12. Type C cables - RS485 bus cables connecting POWBs on the same layer On a near-end rack, type C cables are used in the bottom shelf with configured parts, that is, they are connected to J1_L1 and J2_L3 with the same connection method as described above for the type C cables; however, on a far-end rack, type C cables wont be used. This is because the RS485 bus of the left and right POWBs can be connected via the jumpers on the FSMU backplane so that the 38 cables wont be necessary. To be more specific, the jumpers X132, X133, X137 and X138 are shorted, thus sparing the type C cables. The following should be paid attention: 1) On a far-end rack, these four jumpers must be shorted.
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2) On a far-end rack, the terminal resistors of the RS485 bus must be connected. For this example, the RS485 bus is terminated at the left and right POWBs of J3_L6 (the top BBIU), so the RS485 matching resistors of the two POWBs will be connected to the bus by merely shorting the two jumpers X42 and X46 of J3_L6. 13. Type O cables connecting background network cables on a near-end rack 14. Type P cables connecting PEPD and sensors on a near-end rack 15. Type Q cables connecting power supplies on a near- or far-end rack 16. Type Z cables connecting POWB and POWP on a near- or far-end rack Now, we will only discuss Items 2, 3, 7 and 8 in detail, for description of other items, please refer to relevant contents in previous sections. 1. The clock and HW cables from NSPP to the T network
Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from NSPP to the T network; Type: 38 cables. The connections from NSPP to the T network are as shown in Table 4-29. NSPP end NSPP0 socket on the NSPP board in the NSMU shelf. DSNI end SPCn (n=0~7) socket on the DSNI board in the BNET shelf.
Table 4-29 Connections from NSPP to the T network DSNI end 1# L3_DSNI0-S_SPC0~1 UP1~8 1# L3_DSNI0-S_SPC2~3 UP9~16 1# L3_DSNI0-S_SPC4~5 UP17~24 1# L3_DSNI0-S_SPC6~7 UP25~32 NSPP end 1# L2_NSMU_NSPP0 1# L2_NSMU_NSPP0 1# L2_NSMU_NSPP0 1# L2_NSMU_NSPP0 UP25~32 DN1~8 DN9~16 DN17~24
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2.
The clock and HW cables from FSMU to BBIU
Type X cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from FSPP to BIPP; Type: 38 cables. The connections from FSPP to BIPP are as shown in Table 4-30. FSPP end HW2~9 sockets on the FSPP0 board in the BSMU shelf. BIPP end CNT socket on the BIPP board in the BBIU shelf.
Table 4-30 Connections from FSPP to BIPP BIPP end L4_TCPP_CNT UP25~32 L3_TCPP_CNT UP25~32 L2_TCPP_CNT UP25~32 L1_TCPP_CNT UP25~32 FSPP end L5_FSPP0_HW2-3 DN1-8 L5_FSPP0_HW4-5 DN9-16 L5_FSPP0_HW6-7 DN17-24 L5_FSPP0_HW8-9 DN25-32
3.
Cables for the 8K clock reference from NSMU to BNET
Type H+ cables (8KREF+, 8KREF-; Name: cables from NSPP to SYCK; Type: 1-to-2 38 cables. Refer to Table 4-31 for the connection relations. NSPP end 8KREF socket on the NSPP board in the BSMU shelf. SYCK end - E8K socket on the SYCK board in the BNET shelf.
Table 4-31 Connections from NSMU to the T network SYCK end L3_BNET_SYCK_E8K UP4~11 NSPP end L2_NSPP0_8KREF UP1~8 L1_NSPP0_8KREF UP1~8
4. Cables for the clock reference from FSPP to SYCK in a far-end BSMU
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Type H+ cables (8KREF+, 8KREF-; Name: cables from FSPP to SYCK; Type: 1-2 38 cables. Refer to Table 4-32 for the connection relations. FSPP end 8KREF socket on the FSPP board in the BSMU shelf. SYCK end - E8K socket on the SYCK board in the BSMU shelf.
Table 4-32 Connections from NSMU to the T network SYCK end L5_FSMU_SYCK_E8K UP4~11 FSPP end L4_BATC_AIPP_8KREF UP1~8 L3_BATC_AIPP_8KREF UP1~8
4.5.2.2
The case that the Ater interface involves the sub-multiplexing
We will take the rack in the case 240<N_trx480 as an example, its configuration is described in Section 2.2. Cables in this configuration include: 1. 2. 3. 4. 5. 6. Type D cables from BIPP to DSNI Type D cables from NSPP to DSNI Type X cables from FSPP to TCPP Type E cables from DSNI to SCU/COMM Type E cables from SCU/COMM to DSN Type E+ cables from COMI to RMU/COMM
7. Type H+ cables from the near-end NSPP to SYCK of the BNET layer 8. Type H+ cables from the far-end AIPP to SYCK of the FSMU layer
9.
8K clock cables from DSNI to MP
10. Type A cables -RS485 bus cables from MON to POWB and FBI. Note
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that no type A cables are used for the far-end racks. 11. Type B cables - RS485 bus cables connecting POWBs on different layers in a near- or far-end rack. 12. Type C cables - RS485 bus cables connecting POWBs on the same layer
On a near-end rack, type C cables are used in the bottom shelf with configured parts, that is, they are connected to J1_L2 and J3_L5 with the same connection method as described above for the type C cables; however, on a far-end rack, type C cables wont be used. This is because the RS485 bus of the left and right POWBs can be connected via the jumpers on the FSMU backplane so that the 38 cables wont be necessary. To be more specific, the jumpers X132, X133, X137 and X138 are shorted, thus sparing the type C cables. The following should be paid attention:
1) On a far-end rack, these four jumpers must be shorted. 2) The terminal resistors of the RS485 bus must be connected to the RS485 bus. For this example, the RS485 bus is terminated at the left and right POWBs of J2_L1, so the RS485 matching resistors of the two POWBs will be connected to the bus by merely shorting the two jumpers X154 and X157 of J2_L1. 13. Type O cables connecting background network cables on a near-end rack 14. Type P cables connecting PEPD and sensors on a near-end rack 15. Type Q cables connecting power supplies on a near- or far-end rack 16. Type Z cables connecting POWB and POWP on a near-end rack 17. Type Z+ cables connecting POWB and POWP on a far-end rack
For the connection methods of Items 1, 4~6, and 9 ~ 15 among the 17 items above, please refer to detailed description in Section 4.5.1, and for those of Items 2 and 7, please refer to Section 4.5.2.1. Now, we will only discuss Items 3, 8 and 17.
1.
The clock and HW cables from BATC to FSMU in the far-end rack
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Type X cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from FSPP to TCPP; Type: 38 cables. The connections from FSPP to TCPP are as shown in Table 4-33. FSPP end HW2~9 sockets on the FSPP0 board in the BSMU shelf. TCPP end CNT socket on the TCPP board in the BATC shelf.
Table 4-33 TCPP end L4_TCPP_CNT UP25~32 L3_TCPP_CNT UP25~32 L2_TCPP_CNT UP25~32 L1_TCPP_CNT UP25~32
Connections from FSPP to TCPP FSPP end L5_FSPP0_HW2-3 DN1-8 L5_FSPP0_HW4-5 DN9-16 L5_FSPP0_HW6-7 DN17-24 L5_FSPP0_HW8-9 DN25-32
2. Cables for the 8K clock reference from AIPP to FSMU in the far-end rack Type H+ cables (8KREF+, 8KREF-); Name: cables from AIPP to SYCK of FSMU; Type: 1-to-2 38 cables. The connections from AIPP to SYCK are as shown in Table 4-34. AIPP end 8KREF socket on the AIPP board in the BATC shelf. SYCK end - E8K socket on the SYCK board in the BSMU shelf.
Table 4-34 Connections from AIPP to SYCK AIPP (end-1 and end-2) L4_BATC_AIPP_8KREF UP1~8 L3_BATC_AIPP_8KREF UP1~8 SYCK end L5_FSMU_SYCK_E8K UP4~11
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3.
RS485 cables connecting POWPs in the far-end rack
Type Z cables (RS485): POWP cables of the last POWB end on the left. Type: 3 8 cables are used for one end, and round-head cables are used for the other end. Refer to the relevant part in Section 4.5.1 for the connection method.
4.5.3
Cable connections of BSC (GPRS) The No. of the GPRS rack depends on the number of BSC racks; if there are four BSC racks, then the GPRS rack is the fifth one. 1. Cables from BNET to BPUC
Type D cables; Name: cables from BNET to BPUC; Type: 38 cables. The connections from BNET to BPUC are as shown in Table 4-35. BNET end SPC socket on the DSNI board in the BNET shelf. BPUC end TNET(V2.0) socket on the BPUC board in the BPUC shelf.
Table 4-35 Connections from BNET to BPUC BNET 1# L3_DSNI2-S_SPC32~33 UP1~8 1# L3_DSNI1-S_SPC30~31 DN25~32 1# L3_DSNI1-S_SPC28~29 DN17~24 1# L3_DSNI1-S_SPC26~27 DN9~16 n# n# n# n# BPUC L2_BPCU-96PIN_TNET (V2.0) L3_BPCU-96PIN_TNET (V2.0) L4_BPCU-96PIN_TNET (V2.0) L5_BPCU_96PIN_TNET (V2.0) UP1~8 UP1~8 UP1~8 UP1~8
2.
Cables from BNET to BGIU
Type D cables; Name: cables from BNET to BGIU; Type: 38 cables. The connections from BNET to BGIU are as shown in Table 4-36.
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BNET end SPC socket on the DSNI board in the BNET shelf. BGIU end TNET socket on the GIPP board in the BGIU shelf.
Table 4-36 Connections from BNET to BGIU BENT end 1# L3_DSNI1-S_SPC24~25 DN1~8 n# BGIU L1_BGIU_GIPP_TNET UP1~8
4.6
4.6.1
Check of the hardware installation

Check of the rack installation 1. Racks must be installed vertically. After installation, both the horizontal and vertical deviation should not exceed 3mm. 2. The layout of racks must meet the design requirements. The main
aisle between rows of racks must be aligned in a straight line with an error lower than 5mm. The adjacent racks should be close to each other and the racks in one row should be on the same plane. 3. Fixing screws must be fastened, and the exposed part (height) of the same kind of screws should be identical. 4. No component on the rack is allowed to go off or be damaged, and
the paint coating should not peel off or be damaged. If the paint coating peels off or is damaged, the relevant part should be re-coated. All the labels should be present and clear. 5. The rack installation shall be reinforced for shock resistance, if
necessary, anchor bolts can be used to secure the rack to the ground. 6. Connectors must have good contact with flexible plugging/unplugging. The surface of the plugged slots should be even and flat.
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4.6.2
Check of base and peripherally installed terminal equipment 1. The installation location of the base should meet the engineering design requirements. 2. Racks shall be aligned in a straight line, adjacent racks shall be put closely together, and the racks shall be in the same plane without obvious unevenness. 3. The peripheral terminal equipment should be all ready and complete, installed at the proper positions, and in normal operation. 4. Alarming devices in the equipment room must be fixed at eye-catching locations and tightly fixed.
4.6.3
Check of the array of racks The configuration of racks depends on the capacity, so no specific restriction is placed on the length of rack rows. However, the connection cables between devices are generally restricted to less than 15m. In addition, the area of the equipment room should also be taken into account. After the total capacity and configuration are determined, the total number of racks and the quantity of various shelves are determined. Furthermore, the adjacent relationship between different racks also counts. With each single module being a group, the central rack is usually placed in the middle of the single module. The number of rack rows, racks in each row, primary passages, and secondary passages, are determined by the total number of racks.
4.6.4
Check of cables
The cables of the system are classified into external cables and internal cables.
The external cables mainly include various trunk cables and power supply (-48V) cables. The external cables of the ZXG10-BSC (V2) include E1 cables connecting with BTS and MSC, and cables connecting with the primary power supply. The connector of the E1 cable connected to BSC is standard RF coaxial connector
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CC4Y-J32//CC4-J32B//CC4Y-J32B//1.0/2.3-J3T, and the connector connected to BTS can be selected as required. The cable is the 75 coaxial cable. Each rack has one set of primary power supply cables connected to the cables of POWP with two signal cables: -48V and 48V ground, the connector connected to POWP employs the lug and the other end can be selected as required. The internal cables mainly include RS485 monitoring cables, 8MHW cables, clock cables, connection control cables, Ethernet cables and sensor cables, etc. Cables inside a rack are already installed before the delivery of the equipment, while those among racks should be installed on site. 1. Laying of the power supply cables 1) Requirements for connection of the power cables and grounding cables Good grounding of BSC is an important guarantee for lightning protection and anti-interference, as well as the basis for stable and reliable operation of the equipment. The grounding resistance should comply with the relevant standards. If necessary, the grounding connectors should be processed against corrosion to ensure low-resistance grounding. To make the power supply cables easier to lead in, each rack has a -48V leading-in box, i.e., the POWP. This part is the inlet for the power supply of the whole rack, and it chiefly implements such functions as the filtering, under-/over-voltage detection, giving alarms and over-voltage protection for the -48V power supply. For easier cabling, the whole POWP is designed into a drawer structure, which is installed on the top of the rack. 2) Requirements for the bundling of power cables and grounding cables The power cables and grounding cables should be laid following the principle that they are separated from other cables. For in-rack cabling, the cables should be bundled separately without being bundled with other cables, and separate bundling is also required for out-rack cabling such as
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in the cable trough or ditch. The power cables and grounding wires should pass through the fixing shelves on both sides of the rack, and be bound at the inner edge on the external side of the fixing shelf. Each fixing shelf should be bound. The cable clips should be located on the external side of the fixing shelf. 3) When the power cables and grounding cables are connected to the terminals of the POWP, a pair of pliers shall be used to twist the cables into the routing shape, with even routing and neat bundling. During cabling, the cables far away from the terminals should be put outside, while those close to the terminals should be put inside. 4) Before laying power cables and grounding cables, length of the needed cables should be measured and some extra length should be taken, for just in case. If the cable is found not long enough during cable layout, stop laying and replace the cable with a new one. It is not allowed to make joints or soldering points in the middle of the cable. 2. Laying of trunk cables 1) When the equipment is installed with a base and the conductive floor is installed inside the equipment room, it is recommended for the user to employ the bottom cabling mode. If no base is installed, then the top cabling mode should be adopted, but a cable tray should be mounted on the top of the rack.
A. Bottom cabling mode In the case of ground installation, as there are four support arms below the rack, there is some space between the bottom shelf of the rack and the ground, which can be used for cabling; in the case of reinforcement installation, the rack is installed on a section steel base instead of support arms, then cables should be laid through the ground ditch under the rack. B. Top cabling mode To implement the top cabling mode, the top mesh of the rack is divided into two parts of different sizes. Loosen the screws that fasten the top mesh and
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remove the small top mesh board from the back of the top cover, so that cables can be led out from the top.
2) The trunk cables should be laid separately from the power cables. 3) The turning radius of coaxial cables should not be less than 40mm, so that the core can be protected from being damaged. 4) The insulating layer of cables cannot be damaged. And the cables should be laid for the convenience of future maintenance and expansion. 5) Cables laid on the cable tray must be bundled. The bundled cables should be close to each other and look straight and neat. The spaces between cable clips should be even and cables should be bundled with appropriate tightness. 6) Cables laid inside the cable trough may be not bundled, but should be arranged in order. No cable is allowed to run over from the trough. Cables should be bundled where they come into or go out from a trough and where they make a turn. 7) The cables should be laid from the rack to the distribution frame. During the laying, the cables should keep somewhat loose and after the laying, some excessive length of the cables should be saved. Please refer to the connector installation position for the cable layout, the cables on the left side of the rack should be placed at the left cabling position, and those on the right side should be placed at the right cabling position. During cabling in a cable trough or under the movable floor, the cables should be bundled as per racks. The cables should be straight and in order, and the laid cables should be arranged neatly without damage on the external sheath, and a margin should be left if necessary. 8) The No. of both ends of a trunk cable should correspond to each other.
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5
5.1
Inspection and Power-on

Description of boards
Listed below are the meanings of status of indicators on the panels of various boards of the ZXG10-BSC (V2) rack, and the functions of various switch buttons.
5.1.1
Indicators on the panel of the control layer Descriptions of indicators on the panel of the control layer are listed in Table 5-1.
Table 5-1 Indicators on the panel of the control layer Board name Legend Indicator or switch Description Indicating the running status of the board. RUN: HL1 Flashing slowly: Normal Constantly on: Abnormal Off: Abnormal Indicating the failure status of the board. FAU: HL2 On: Board fault Off: Normal
HL1 HL2 HL3 HL4

MP
SW1 SW2 SW3
Indicating the active/standby status of the board. MST: HL3 Constantly on: In the active status Off: In the non-active status Indicating the active/standby status of the RES: HL4 board. Constantly on: In the standby status
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(to be continued)
Board name Legend Indicator or switch Description Off: In the non-standby status Lockless button Changeover switch SW: SW1 Press this switch to change over the active/standby status of the board. Lockless button Reset switch Press this switch to reset the board. Power switch with lock button ON/OFF: SW3 Push this switch down to power on and spring up to power off.
RST: SW2
HL1
Indicating the running status of the board. RUN: HL1 Constantly on: Normal
HL2
SMEM
Indicating the running status of the board. RUN: HL1

HL1
Flashing slowly: Normal On together with the FAU indicator: The board has faults Indicating the failure status of the board.
COMM (MPPP) (MPMP)
HL2
FAU: HL2
SW1
On together with the RUN indicator: The board has faults Off: Normal
RST: SW1
Lockless button Reset switch Press this switch to reset the board. Indicating the running status of the board.
HL1 HL2
COMM (MTP)
SW1
RUN: HL1
Flashing slowly: SS7 link obstructed
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(to be continued)
Board name Legend Indicator or switch Description Flashing fast: SS7 link normal Indicating the failure status of the board. FAU: HL2 Flashing slowly: Board fault Off: Normal RST: SW1 Lockless button Reset switch Press this switch to reset the board. Indicating the running status of the board. RUN: HL1
HL1 HL2
Flashing slowly: Normal Flashing slowly together with the FAU indicator: The board has faults. Indicating the failure status of the board.
COMM (LAPD)
SW1
FAU: HL2
Flashing slowly together with the RUN indicator: The board has faults. Off: Normal Lockless button Reset switch
RST: SW1
Press this switch to reset the board. Indicating the running status of the board. Flashing slowly: Normal
HL1 HL2
RUN: HL1
Flashing fast: The sensor is being preheated. Constantly on/off: Abnormal Indicating the failure status of the board.
PEPD (MON)
SW1
FAU: HL2
On: The board has faults Off: Normal
RST:SW1
Lockless button Reset switch Press this switch to reset the board.
Note: There is a keyboard interface and a monitor interface on the MP panel, which are used for the software debugging.
5.1.2
Indicators on the panel of the network switching layer Descriptions of indicators on the panel of the network switching layer are listed in Table 5-2.
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Table 5-2 Indicators on the panel of the network switching layer Board name Legend Indicator or switch Description Indicating the running status of the board. RUN: HL1 Flashing slowly: Normal Flashing fast: The data is being loaded in synchronization mode. Constantly on/off: Abnormal Indicating the failure status of the board.
HL1 HL2 HL3 HL4
On: The board has faults. FAU: HL2 Flashing slowly: communication between this board and the upper-level board has faults. Off: Normal Indicating the active/standby status of the board. MST: HL3 Constantly on: In the active status Off: In the non-active status Indicating the active/standby status of the board. RES: HL4 Constantly on: In the standby status Off: In the non-standby status Lockless button Changeover switch EXCH: SW1 Press this switch to change over the active/standby status of the board.
BOSN
SW1 SW2
(to be continued)
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Board name
Legend
Indicator or switch RST: SW2
Description Lockless button Reset switch Press this switch to reset the board. Indicating the running status of the board.
RUN: HL1
Flashing slowly: Normal Flashing fast: Communication between this board and MP failed Indicating the failure status of the board. On: The board has faults
HL1 HL2 HL3
FAU: HL2
Flashing slowly: Communication between this board and the upper-level board failed Off: Normal Indicating the active/standby status of the board. Constantly on: In the active status Off: In the non-active status Indicating the active/standby status of the board. Constantly on: In the standby status Off: In the non-standby status Lockless button Changeover switch
DSNI/ COMI
HL4 SW1 SW2
MST: HL3
RES: HL4
SW: SW1
Press this switch to change over the active/standby status of the board. Lockless button - Reset switch Press this switch to reset the board. Indicating the running status of the board.
RST: SW2
HL1 HL2 HL3 HL4 HL5 HL6 HL7
RUN: HL1
On: Normal Flashing fast: SYCK failed Communication with
Indicating the failure status of the board. On: The board has faults
CKI
HL8 HL9 H L10 H L11
FAU: HL2 Off: Normal
SW 1 SW 2 SW 3
(to be continued)
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Board name
Legend
Indicator or switch
Description Indicator for 8kHz reference existence
8kHz: HL3
Constantly on: 8kHz reference exists. Off: 8kHz reference does not exist. Indicator for 2MHz reference existence
2MHz: HL4
Constantly on: 2MHz reference exists. Off: 2MHz reference does not exist. Indicator for 5MHz reference existence
5MHz: HL5
Constantly on: 5MHz reference exists. Off: 5MHz reference does not exist. Indicator for 2Mb/s reference existence
2Mb/s: HL6
Constantly on: 2Mb/s reference exists. Off: 2Mb/s reference does not exist. Four indicators indicate the selected ones of the 16 references in the binary system, top one to bottom one respectively indicate the high bit to low bit, 1 for On, 0 for Off. 0~3: 8K0~3; 4~7: 2MHz0~3 8~11: 5MHz0~3; 12~15: 2Mb/s 0~3 Indicating the enabled status of manual selection of the clock reference.
REFI: HL7~HL10
MANEN: HL11
Constantly on: Manual selection of the clock reference is enabled. Off: Manual selection of the clock reference is disabled.
MANSL: SW1
Lockless button Selection switch
(to be continued)
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Board name
Legend
Indicator or switch
Description Clock reference selection switch: Up to 16 references can be selected in turn by pressing this switch. Lockless button Selection switch
MANEN: SW2
Press this switch to set CKI to the manual enabled or manual disabled status alternately. Lockless button Reset switch Press this switch to reset the board. Indicating the running status of the board. Constantly on: Normal Indicating the failure status of the board.
RST: SW3
RUN: HL1
FAU: HL2
HL1 HL2 HL3 HL4 HL5 HL6 HL7
On: The board has faults Off: Normal Indicating the active/standby status of the board.
MST: HL3
Constantly on: In the active status Off: In the non-active status Indicating the active/standby status of the board.
SYCK
HL8 HL9 HL10 HL11 HL12 SW1 SW2 SW3 SW4
MST: HL4
Constantly on: In the standby status Off: In the non-standby status Fast capture mode indicator of the board
CATCH: HL5
Constantly on: The board is working in the fast capture mode. Off: The board is working in the non-fast capture mode. Tracing mode indicator of the board
TRACK: HL6
Constantly on: The board is working in the tracing mode. Off: The board is working in the non-tracing mode.
HOLD: HL7
Hold mode indicator of the board
(to be continued)
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Board name
Legend
Indicator or switch
Description Constantly on: The board is working in the hold mode. Off: The board is working in the non-hold mode. Free mode indicator of the board
FREE: HL8
Constantly on: The board is working in the free mode. Off: The board is working in the non-free mode. Clock reference source indicator of the board Constantly on: The SYCK board uses the clock reference from the CKI board. Off: The SYCK board does not use the clock reference from the CKI board. Clock reference source indicator of the board
REFI: HL9
REFI: HL10
Constantly on: The SYCK board uses the clock reference from itself. Off: The SYCK board does not use the clock reference from the board itself. Clock reference source indicator of the board Constantly on: The SYCK board uses the clock reference from itself. Off: The SYCK board does not use the clock reference from itself. Indicating the enabled status of manual selection of the clock reference.
REFI: HL11
REFI: HL11
SYCK
MANI: HL12
Constantly on: Manual selection of the clock reference is enabled. Off: Manual selection of the clock reference is disabled.
MANSL: SW1
Lockless button Selection switch
(to be continued)
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Board name
Legend
Indicator or switch
Description The clock reference can be manually selected in turn with this switch. Lockless nutton Enable switch
MANSL: SW2
Press this button to turn on/off the indicator that indicates the manual selection of clock reference enabled or disabled. Only when this indicator is on, the manual selection is enabled. Lockless button Changeover switch
SW: SW3
Press this button to change over the active/standby status of the board. Lockless button Reset switch Press this switch to reset the board.
RST: SW4
5.1.3
Indicators on the panel of the TC unit Descriptions of indicators on the panel of the TC unit are listed in Table 5-3.
Table 5-3 Indicators on the panel of the TC unit Board name Legend Indicator or switch Description Indicating the running status of the board.
HL1 HL2 HL3
Flashing slowly: Normal RUN: HL1 Flashing fast: Communication between this board and MP failed Constantly on/off: Abnormal
DRT/ EDRT
SW1
Indicating the failure status of the board. FAU: HL2 On: The board has faults Flashing slowly: Communication between this board and the upper-level board failed
(to be continued)
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Board name Legend Indicator or switch Off: Normal Indicating whether there is traffic to handle on this board. IDLE: HL3 Constantly on: None of DSPs have traffic to handle. Off: There is traffic being handled. RST: SW1 Lockless button Reset switch Press this switch to reset the board. Indicating the running status of the board. Flashing slowly: Normal RUN: HL1 Constantly on/off: Abnormal Flashing fast: Communication between this board and MP failed Indicating the failure status of the board. On: The board has faults FAU: HL2
HL1 HL2 HL3 HL4 HL5 HL6
Description
Flashing slowly: Communication between this board and the upper-level board failed Off: Normal Indicating the status of the first E1 port on the board.
TIC
DT1: HL3
Flashing fast: Normal Constantly on: Alarming
SW1
Off: E1 port is not initialized. DT2: HL4 Indicating the status of the second E1 port on the board; refer to DT1 for the indications of On. Indicating the status of the third E1 port on the board, refer to DT1 for the indications of On. Indicating the status of the fourth E1 port on the board; refer to DT1 for the indications of On. Lockless button Reset switch Press this switch to reset the board.
DT3: HL5
DT4: HL6
RST: SW1
5.1.4
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5.1.5
Indicators on the panels of the POWB and POWP units

Descriptions of indicators on the panels of the POWB and POWP units are listed in Table 5-4.
Table 5-4 Indicators on the panel of the power supply unit Board name Legend Indicator or switch Indicating the running status of the board. RUN: HL1
HL1 HL2
Description
Constantly on: Normal Off: The board has faults Indicating the failure status of the board.
POWB
FAU: HL2
On: The board has faults Off: Normal
Power distributor (POWP) of the rack 1 Fun power indicator Constantly on: Normal -48V indicator Constantly on: Normal Under-voltage indicator 3 Constantly on: Under-voltage input Off: Normal input voltage Over-voltage indicator 4 Constantly on: Over-voltage input Off: Normal input voltage 5 6 Socket of anti-static wrist strap Power switch: Up - on; Down - off
1 2 3 4 5 6
Power distributor (POWP) of the rack
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5.1.6
Indicators on the panel of the GPRS unit Descriptions of indicators on the panel of the GPRS unit are listed in Table 5-5.
Table 5-5 Indicators on the panel of the GPRS unit Board name Legend Indicator or switch Description Combination of these two indicators expresses different status: 1. Both flashing fast: The board is started and waiting for establishment of the HDLC link. 2. HL1 Flashing fast, HL2 Off: RUN: HL1 FAU: HL2 Waiting for DBS to synchronize data or to notify synchronization of data. 3. Both constantly on: After
HL1 HL2 HL3 HL4
correction of inconsistent IP address and unit No., waiting for the manual reset. 4. HL1 Flashing slowly, HL2 - Off: Normal Indicating the active/standby status of the board. MST: HL3 On: Active OFF: Non-active Indicating the active/standby status of the board. MST: HL4 On: Standby Off: Non-standby Lockless button Changeover switch EXCH: SW1 Press this switch to change over the active/standby status of the board. RST: SW2 Lockless button Reset switch
PUC
SW1 SW2
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(to be continued)
Board name Legend Indicator or switch board. Combination indicators status: 1. Both flashing fast: The board is started
HL1 HL2 DSP1 RUN: HL1 DSP2 FAU: HL2
Description Press this switch to reset the of these two
expresses
different
and
waiting
for
establishment of the HDLC link. 2. HL1 Flashing fast, HL2 Off: Waiting for DBS to synchronize data or to notify synchronization of data. 3. Both constantly of on: After IP
GDPP (FRP/BRP)
SW1
correction
inconsistent
address and the unit No., waiting for the manual reset. 4. HL1 Flashing slowly, HL2 - Off: Normal DSP1 (this indicator is unavailable on the FRP board) DSP2 (this indicator GIPP is unavailable on the FRP board) RST: SW1 Indicating the status of DSP1 Flashing slowly: Normal Off: DSP1 does not run. Indicating the status of DSP1 Flashing slowly: Normal Off: DSP2 does not run. Lockless button - Reset switch
(to be continued)
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Board name
Legend
Indicator or switch board.
Description Press this switch to reset the Combination indicators status: 1. Both flashing fast: The board is started and waiting for of these two
expresses
different
RUN: HL1 FAU: HL2
establishment of the HDLC link. 2. HL1 Flashing fast, HL2 Off: Waiting for DBS to synchronize data or to notify synchronization of data. 3. HL1 Flashing slowly, HL2 - Off: Normal Indicating the active/standby status of the board.
HL1 HL2 HL3
GIPP GIPP
HL4 SW1 SW2
MST: HL3
On: Active OFF: Non-active Indicating the active/standby status of the board.
MST: HL4
On: Standby Off: Non-standby Lockless switch button Changeover
EXCH: SW1
Press this switch to change over the active/standby status of the board.
RST: SW2
Lockless button Reset switch
(to be continued)
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Board name
Legend
Indicator or switch board.
Description Press this switch to reset the Combination indicators status: 1. Both flashing fast: The board is started and waiting for of these two
expresses
different
RUN: HL1
HL1 HL2 HL3 HL4 HL5 HL6 SW1
establishment of the HDLC link. 2. HL1 Flashing fast, HL2 Off: Waiting for DBS to synchronize data or to notify synchronization of data. 3. HL1 Flashing slowly, HL2 Off: Normal Indicating the status of the first E1 port on the board.
FAU: HL2
TIC
DT1: HL3
Flashing fast: Normal Constantly on: Alarming Off: E1 port is not initialized. Indicating the status of the second E1 port on the board. Ditto Indicating the status of the third E1
DT2: HL4
DT3: HL5
port on the board. Ditto Indicating the status of the fourth E1 port on the board. Ditto Lockless button - Reset switch
TIC
DT4: HL6
RST: SW1
Press this switch to reset the board.
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5.2
Inspection before power-on

A thorough inspection should be performed before the system is powered on. 1. Requirements for temperature, humidity and power voltage in the equipment room 1) Temperature: 15C ~30C 2) Relative humidity: 40%~65% 3) DC voltage: nominal value -48V (permitted range: -57V~-40V) 2. Check of cables 1) Check whether the power cables and grounding cables of each layer and each rack are connected properly. 2) Whether the connectors are inserted into their position and whether the contact is reliable. 3) Whether jumpers are properly set on each board. 4) Whether the foreground and background are connected properly. 5) Whether the version of the booting program loaded on each board is correct. 3. Check of other hardware 1) Whether equipment labels are complete, clear and correct. 2) Whether PCBs are inserted at the their positions and nothing is absent. 3) Whether various selection and control switches of the equipment are set at their specified start positions. 4) Whether the fuse of the equipment is of the required specifications.
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5) Whether the racks are properly grounded, with the grounding resistance meeting relevant technical requirements. 6) No short-circuit exists between the positive polar and negative polar of the power supply. 7) Whether the racks are aligned tidily and neatly, and whether the rack flags are correct and clear. 8) Whether the pins on backplanes are distorted or short-circuited.
5.3
Steps of power-on
After the above checks, power on the equipment in the following order, otherwise the equipment may fail to begin working normally.
If the hardware passes the check, then power on the equipment in the following steps: 1. Before the power-on, make sure that the power cables are connected properly without damage and short-circuit; and ensure all the boards and power supplies are at their positions (the power switches should be at OFF); and ensure the software hardened on each board is of correct version, and no board is inserted into the slot. 2. Measure whether the primary input of POWP is normal; if not, get it back to normal based on necessary consultation. 3. Switch on the POWP and see whether it is normal and whether the -48V output is in the normal range (if not, find out the cause and ensure normal output). 4. After inserting the power supply (such as POWB) of a certain layer, turn it on, and observe its operation; if no abnormality occurs, turn it off. 5. Repeat step 4 to see if the power supply on each layer of the
equipment is normal. 6. Turn on again a power supply of a certain layer (such as POWB),
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then insert a board of this layer. (Insert the board along the guide rail and make sure that the two connectors on the board align with the sockets on the backplane. After the board is inserted, press the locking lever vertically to the panel of the board, a crack sound will indicate that the board is locked.) Observe the operation of the board, and insert other boards only after making sure that the board is running normally. (The hot-swapping is allowed for all boards other than the power board.) If nothing abnormal happens, turn off the power supply on this layer. 7. Instructions on hot-swapping of boards:
While plugging and unplugging boards, always remember to wear the anti-static wrist strap. Do not forcedly plug/unplug hot-swappable boards by abnormal means or tools. Note especially that to unplug a board, first open the locking levers and then pull out the board once in the direction reverse to the insertion direction. Boards that hot-swapping is not allowed must be plugged or unplugged after the power is cut off. 8. Repeat step 6 till all boards are inserted into their slots.
Then power on the whole system in the following steps: 1. Turn on the primary power distributor on the rack to lead the primary
power supply into the rack. 2. Turn on the secondary power supplies in the following steps: 1) First turn on the secondary power supply of the peripheral interface units at a lower level. 2) Then turn on the secondary power supply on the control layer. 3) Finally turn on the working power supplies on the MP board and the background server.
Note: There is no constraint on the starting-up procedure of the power
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supplies among modules.
If any equipment is faulty or needs maintenance, or in any other case when the power supply of the cabinet should be turned off, then turn off the power in an order reverse to that mentioned above.
Note: Make sure that all secondary power supplies are turned off before turning off the primary power supply.
During the operation of the equipment, if the power-off recovery test of the primary power supply is required, all secondary power supplies and the power supply of the MP background should be turned on.
5.4
Check of board status

1. After power-on, the potential difference between racks shall be less than 0.1V. 2. After the power-on, the outputs of POWBs on various layers shall be within a nominal range. When conditions allow or when it is necessary, the ripple noise of the output voltages should be tested to see if they meet requirements. 3. Simulation test of the load capability of backup power supplies, i.e., when a single power supply is working, measure the power index from the remote end. 4. Check whether the status of each indicator on boards is normal after power-on (for definitions of the indicators on boards, please refer to Section 5.1). 5. Check whether the ventilation fans of the racks are working normally, whether the alarm devices with visual and audible alarms operate normally, and whether the clock device is working normally with nominal precision.
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6
6.1
Software Installation
Initial installation flow of the system software
1. Preparations 1) Engineering information: hardware environment, radio resources, etc. 2) Setup CD of the ZXG10-BSC The setup CD mainly includes the BSC and BTS version software, OMCR (V2) software and GPRS software. 3) OS software, including Windows NT, Solaris 2.5.1 or Solaris2.6 4) ORACLE8.0.5 database software 5) TCPIP.CFG and ZXG10.CFG configuration files 6) Properly configured foreground and background data files 2. Installation flow
Initial installation of the system software includes installation of the MP software and background operation & maintenance system software. The installation of the background operation & maintenance system software is divided into the server installation and client installation. The installation flow is shown in Fig. 6-1.
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St ar t
Install the MP software Install the server software Install the client software
Dubug
End
Fig. 6-1
Initial installation flow of the system software
6.2
Installation of MP
1. Installation flow 1) Copy BSC and BTS version software to the C:\VERSION directory, and change the main version number of BSC into: ZXGBSC. 2) Copy the data files to the \data\work directories of various MPs. 3) Change file C:\USER\SUPER\PROG\LOGON into
:sb:version/zxgbsc, and change the attribute of the LOGON file into read-only and hidden. 4) Copy the TCPIP.CFG and ZXG10.CFG file templates to the C:\CONFIG directory. 5) Change the configuration file TCPIP.CFG under the C:\CONFIG\ directory. 6) Reset and restart MP.
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2. The configuration variables of the communications configuration file TCPIP.CFG are described in the Table 6-1.
Table 6-1 Configuration variable name Sub-item
Configuration variables of TCPIP.CFG Description BSC ID, non-zero value of BYTE type. The foreground is
BscID
[MAIN]
insensitive to this setting, but OMCR uses it to manage multiple BSCs.
IsRemote TcpPort
[MAIN] [MAIN]
Whether this module is put at the far-end. Value: 0 or 1. The port by which MP accepts the link establishment request from TCP, usually set to 5000. Machine No. of server. Multiple servers may be
Server Mno
[SERVER]
configured, but two at most for the time being. The quantity is defined in SYSCFG.INI.
Server IP Test IP LMT Mno LMT IP
[SERVER] [SERVER] [LMT] [LMT]
IP address of the server. IP address of the test server. This address should not be the same as the IP address of any server and LMT. Machine No. of the local maintenance terminal. IP address of the local maintenance terminal. MP module No. If this MP is the same as the module No.,
Module
[MODULE]
then read the IP behind it. No.1 is the central module, and No. 2~9 are peripheral modules.
Left IP Right IP
[MODULE] [MODULE]
IP address of the MP which is inserted into the left slot. IP address of the MP which is inserted into the right slot.
3.
Configuration examples
[MAIN]
BscID IsRemote TcpPort [SERVER]
= 18 =0 = 5000
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Server Mno = 127 Server IP = 192 168 018 065
Server Mno = 138 Server IP Test IP [LMT] LMT Mno LMT IP [MODULE] Module Left IP Right IP Module Left IP Right IP Module =1 = 192 168 018 001 = 192 168 018 033 =2 = 192 168 018 002 = 192 168 018 034 =3 = 200 = 192 168 018 070 = 192 168 018 066 = 192 168 018 179
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Left IP Right IP Module Left IP Right IP Module Left IP Right IP
= 192 168 018 003 = 192 168 018 035 =4 = 192 168 018 004 = 192 168 018 036 =5 = 192 168 018 005 = 192 168 018 037
6.3
Installation of the background operation and maintenance system

Solaris OS is a relatively stable UNIX OS provided by Sun Microsystems. The OMCR (V2) system is the NMS software with Solaris OS as the server and NT as the workstation, and the application core of the whole system service is based on UNIX OS. The installation of the background operation & maintenance system includes the installation of the server software and client software. For the basic UNIX commands to be used in the following installation process, please refer to Appendix B. The installation of the server software includes the following steps: 1. Install the Solaris 2.5.1 or Solaris 2.6 OS.
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2. 3. 4. 5.
Install ORACLE 8.0.5 database. Install OMCR (V2) server program. Import data file. Install the peripherals like printer.
Server OS installation:
1.
System hardware and software requirements
As ORACLE and OMCR will be installed in the Solaris, advanced hardware and software are required 1) Host: Sun SPARC server. 2) Memory: at least 32M, and usually above 512M to effectuate good performance. 3) Hard disk: at least 6G to ensure long-term stable running of the system. 4) OS: Solaris 2.5.1 or Solaris 2.6 (SunOS 5.5.1 or SunOS 5.6). 5) OS patches: the latest patch programs provided by Sun. 6) Other software: ORACLE 8.0.5, OMCR (V2). 2. Install Solaris on Sun
Before installation, you should know the hardware environment of your system, such as the hard disk space and the memory. The installation steps are as follows: 1) Insert Solaris OS installation CD into CD-ROM drive of the system. 2) Restart the system. 3) Switch to root user, and restart the system.
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Press Stop+A (press Stop key and A key at the same time) when the system begins to restart. 4) With the OK prompt, input the command: boot cdrom. 5) Select the language displayed in the installation process, and input the serial No. for the language (English) selected. 6) Input the number of MBs indicating the hard disk space. Select the size of the swap partition to be used during installation. For ORACLE installation in the next step, the swap partition is recommended to be three times of the physical memory, and if there is more than 1G physical memory in the system, the swap space may be two times of the physical memory, or even less. 7) When the system instruct you to select disk partition to be used in Solaris installation, just accept the default partition (/dev/dsk/c0t0d0s1). 8) The installation environment software will be copied to the hard disk, and then the system will reboot, and several minutes later, the system identification window will appear. 9) In the system identification window, input the information about the system, as shown in Table 6-2:
Table 6-2 System information System information to be provided Host name Network connection IP address Network mask (255.255.255.0 by default) Name service NIS+ , NIS , DNS Domain name Name server IP address of server Time zone or None Sun10 Yes 138.1.20.3 255.255.0.0 None (by default) NULL NULL NULL East Asia->PRC Example
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Date and time Root password Power management (to determine whether the system uses this function) 15:03 on November 22, 2000 Sun10omc No
10) Answer questions raised during Solaris installation. See Table 6-3 for details.
Table 6-3 Some questions and suggested answers during Solaris installation Questions to be answered during installation Version to be installed Default installation or self-defined installation Language environment of software installed Software set Partition condition 2.6 5/98 Answers to be selected
Self-defined English Five options in all, and select the second one Not changed
To select the partition, note that the partition needed for installing ORACLE database should be 3.5GB at least, and that for installing OMCR server program should be 2GB at least, and the swap partition of the system should be 512MB at least. 11)Wait for the completion of Solaris installation.
This process may last for one hour, depending on the software to be installed and the speed of the system.
12) Check the Installation abstract shown at the end of Solaris installation process. 13) After the installation is over, the system will automatically eject the installation disk.
6.3.1.1 Installing ORACLE database
1.
Preconditions
In Solaris installation, set up partition "/oracleapp" not smaller than 3.5G as the
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partition for Oracle installation. To install ORACLE in other partitions, just change "/oracleapp" in this document to the corresponding partition path.
2.
Preparations before installation 1) In the identity of root user, create dba user group, and create the oracle user that belongs to this group. 2) In the identity of root user, change the owner of the directory "/oracleapp" to oracle. 3) In the identity of root user, create local bin directory, e.g. /opt/bin directory, and make sure that each user has the right to visit this directory. 4) In the identity of oracle user, create 4 sub-directories as installation points (a software installation point, and three database installation points), such as /oracleapp/u01 /oracleapp/u02 /oracleapp/u03 /oracleapp/u04 5) In the identity of oracle user, create $ORACLE_BASE path, software_mount_point/app/oracle/, such as /oracleapp/u01/app/oracle 6) In the identity of root user, change /etc/profile file. #/etc/profile file ORACLE_OWNER=oracle export ORACLE_OWNER ORACLE_BASE=/oracleapp/u01/app/oracle
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export ORACLE_BASE ORACLE_HOME=$ORACLE_BASE/product/8.0.5 export ORACLE_HOME LD_LIBRARY_PATH=$LD_LIBRARY_PATH:$ORACLE_HOME/lib :/usr/openwin/lib:$ORAC LE_HOME/jdbc/lib:/usr/local/lib (no line feed allowed in actual operations) export LD_LIBRARY_PATH ORACLE_SID=omc export ORACLE_SID ORACLE_TERM=xSun5 export ORACLE_TERM CLASSPATH=$CLASSPATH:$ORACLE_HOME/jdbc/lib export CLASSPATH PATH=$PATH:/usr/bin:/opt/bin:$ORACLE_HOME/bin:/usr/local/bin :/usr/ccs/bin export PATH ORA_NLS33=$ORACLE_HOME/ocommon/nls/admin/data export ORA_NLS33 NLS_LANG=AMERICAN_AMERICA.WE8ISO8859P1 Export NLS_LANG TMP_DIR=/var/tmp export TMP_DIR umask 022
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7) In the identity of root user, change /etc/system file. #/etc/system file set shmsys:shminfo_shmmax=4294967295 set shmsys:shminfo_shmmin=1 set shmsys:shminfo_shmmni=100 set shmsys:shminfo_shmseg=10 set semsys:seminfo_semmns=200 set semsys:seminfo_semmni=70 8) Restart the machine. 9) In the identity of root user, run cdrom_mount_point/orainst/oratab.sh script to create and set oratab file and corresponding rights under /var/opt/oracle directory. The instance information about ORACLE is saved in the oratab file. 3. Installation processes
Log in to Solaris as an oracle user, run the installer orainst in the CD. For specific installation processes, please refer to the related document about oracle installation. A simple installation process is as follows.
1) Select CUSTOM mode for installation. 2) There are several installation modes: Install, Upgrade or De-Install Software Create/Upgrade Database Objects Perform Administrative Tasks For installation for the first time, select the first installation mode above.
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3) Select: Install New Product - Create DB Objects. 4) Reserve the default path: ORACLE_BASE, ORACLE_HOME. 5) Reserve the default path: Installer Log, SQL Log, Makefile Log, OS Log. 6) Select: Install From CD-ROM. 7) Keep the value of ORACLE_SID unchanged. 8) Select: NLS: Native Language American English. 9) Select the desired product for installation. Client Software Net8 Oracle UNIX Installer Oracle8 Enterprise (RDBMS) Oracle8 Partitioning Option PL/SQL 8.0.5.0.0 Pro*C/C++ SQL*Plus TCP/IP Protocol Adapter Oracle Intelligent Agent Solaris Documentation
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JDBC 10) Reserve the default value: Group To Act as DBA: dba.
11)Reserve the default value: OSOPER Group dba. 12) Select: File System-based Database. Database storage type: File System or Raw Devices. 13) Select Y: Distribute Control Files Over 3 Mount Points.
/oracleapp/u02 /oracleapp/u03 /oracleapp/u04 14) Database character set: select WE8ISO8859P1.
This character set is not listed in the installation interface of the installer and therefore needs to be input manually.
15)
NLS Character Set: WE8ISO8859P1.
Select WE8ISO8859P1 as the character set to realize national language support (NLS) function. This character set is not listed in the installation interface of the installer and therefore needs to be input manually.
16)
Input password: Password For system.
During installation, input oracle as password where it is required without exception. And the password may be changed after installation.
17) 18) 19)
Input password: Password For sys. Select N: Do not Set the Password For internal. Input password: Password for the TNS Listener.
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20) 21)
Select N: Multi-Threaded Server (N). Reserve the default value: Control Files.
/oracleapp/u02/oradata/omc(SID)/control01.ctl /oracleapp/u03/oradata/omc(SID)/control02.ctl /oracleapp/u04/oradata/omc(SID)/control03.ctl Reserve the default value: Files: /oracleapp/u01/app/oracle/product/8.0.5/dbs/orapwomc /oracleapp/u02/oradata/omc/system01.dbf /oracleapp/u02/oradata/omc/redoomc01.log /oracleapp/u03/oradata/omc/redoomc02.log /oracleapp/u04/oradata/omc/redoomc03.log /oracleapp/u02/oradata/omc/rbs01.dbf /oracleapp/u02/oradata/omc/temp01.dbf /oracleapp/u02/oradata/omc/users01.dbf /oracleapp/u02/oradata/omc/tools01.dbf 22) 23) Select N: LSM (Legato Storage Manager). JDBC (select all).
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24) 25) 26)
Select Y: Help For SQL *PLUS (Y). Select Y: Demo Table For SQL *PLUS (Y). Reserve the default value: ORACLE_DOC directory:
/oracleapp/u01/app/oracle/doc. 27) 28) 4. Select: Formats For UNIX Documentation (both html and pdf). Start installation.
Work after installation
In the identity of root user, execute $ORACLE_HOME/orainst/root.sh.
6.4
6.4.1
System debugging
Contents of BS system debugging
After BSC software and hardware are installed, overall debugging is performed so as to find possible problems and get prepared for the normal acceptance, cutover and running of the system.
Debugging of the base station system includes the following contents: 1. Equipment installation technical test
For the details, please refer to Chapter 5.2, Inspection before power-on.
2.
System setup functions
System initialization loading. 3. 4. Troubleshooting test Service test 1) Call service

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2) Various switching modes

Operation and maintenance subsystem test
1) Man-machine commands 2) Configuration management 3) Alarm management function 4) Performance measurement and performance management functions 5) Security management 6.4.2 Debugging of the system setup function Initialization: BSC initialization is normal.
6.4.3
Troubleshooting test 1. Active/standby switchover 1) Switchover of active/standby MPs

A. Fault switchover B. Manual switchover C. Man-machine command switchover
Switchover works normally. Subscribers in the status of talking or ringing will not be influenced, but those in the process of connecting may be influenced. MP can realize switchover from active to standby, or standby to active. 2) BOSN board active/standby switchover
A. Fault switchover B. Manual switchover
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C. Man-machine command switchover
Switchover works normally. Subscribers in the status of talking or ringing should not be influenced, but those in the process of connecting may be influenced. BOSN can realize switchover from active to standby, or standby to active. 3) GPP board active/standby switchover
A. Fault switchover B. Manual switchover C. Man-machine command switchover
Switchover works normally. Call connection is not influenced in the process of switchover, and there should be an alarm report in the case of fault switchover. 4) COMI board active/standby switchover.
A. Fault switchover B. Man-machine command switchover
Switchover works normally. Call connection is not influenced in the process of switchover, and there should be an alarm report in the case of fault switchover. 5) DSNI active/standby switchover:
Switchover works normally. Call connection is not influenced in the process of switchover, and there should be an alarm report in the case of fault switchover.
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6) COMI board active/standby switchover

Switchover works normally. Call connection is not influenced in the process of switchover, and there should be an alarm report in the case of fault switchover. 7) POWB hot backup function
POWB hot backup function is implemented normally. Call connection is not affected, and there should be an alarm report when POWB gets faulty.
2.
Restarting the system 1) System restart after power-off

A. Board indicators work normally. B. PCM system returns to normal. C. Link No. 7 can be reactivated. D. LAPD link can return to normal. E. All cells can return to normal. F. OMCR can give the correct alarm content. G. Communication between foreground and background return to normal. H. BSS services return to normal.
2) MTP board restart: NO.7 (SCCP) is interrupted, but it may return to normal. 3) LAPD restart: LAPD link with BTS is broken, but it can return to normal. 4) PEPD board restart: it can return to normal.
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5) MONI board restart: it can return to normal. 6) MPPP board restart: communication between BSC MP and PPs is broken, but it may return to normal. 7) MPMP board restart: communication among BSC modules is broken, but it can return to normal. 8) DRT board restart: The trunk to MSC is broken, but it can return to normal. 9) TIC board restart: The trunk to MSC is broken, but it can return to normal. 6.4.4
6.4.4.1
Service test
Call service
1.
Local MSlocal PSTN subscriber
A local MS calls an idle local PSTN, the called PSTN subscriber will reply, and the call is completed. When a local MS calls an idle local PSTN subscriber, the called rings and the caller hears the ring-back tone, the calling MS will turn off his mobile phone, and the call shall be released properly. MS calls local PSTN subscriber, and when the called is busy, the call should be capable of being released correctly. MS calls local PSTN subscriber, and when the called is a null number, MS should hear null number announcement tone. MS calls an idle local PSTN subscriber, and when the called does not answer or the timer is timeout, the call should be capable of being released successfully. 2. Local MSlong distance PSTN
MS calls an idle distance PSTN subscriber, and the distance PSTN subscriber answers.
3.
Local PSTN subscriberlocal MS
A local PSTN subscriber calls an idle local mobile subscriber, the MS

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answers, and the call should be capable of being completed. Local PSTN calls local busy MS, the caller should be able to release correctly, without affecting the call of the called. Local PSTN subscriber calls MS, and when the called does not answer and the timer is timeout, the call should be capable of being released. Local PSTN subscriber calls local idle MS, but when the radio channel is congested, the call should be capable of being released successfully. Local PSTN subscriber calls local idle MS, but when the ground trunks are all busy, the call should be capable of being released correctly. 4. Local MSlocal MS
An MS calls another idle MS and the called party answers the call, the call shall be completed successfully. MS calls another idle MS, and when the called answers and the caller hooks on first, the call should be capable of being released successfully. An MS calls another idle MS, and when the called answers, the called hooks on first, the call should be capable of being released successfully. An MS calls another local busy MS, the caller should be able to release correctly, without affecting the call of the called. An MS calls another idle MS, and the called party does not answer the call until timeout, the call shall be released. An MS calls another MS, when the called MS gives no paging response, the call should be capable of being released successfully. An MS calls another MS, when the called number is a null number and the caller hears null number announcement tone, the call should be capable of being released successfully. An MS calls another MS, and when the radio channel is congested, the call should be capable of being released successfully. 5. Local PSTN subscribernon-local MS
PSTN calls an MS roaming locally, the MS answers, the call should be capable of being completed. 6. Long-distance PSTN subscriberlocal MS
A long-distance PSTN subscriber calls local MS, the MS answers, the call should be connected.
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7.
Remote MSlocal MS
A remote MS calls an idle local MS, and the local MS answers, then the call shall be connected. A local MS roaming remotely calls local MS, local MS answers, the call should be capable of being completed. Remote MS roaming to the third party calls local MS, local MS answers, the call should be capable of being completed. A local MS roaming remotely calls local MS, local MS answers, the call should be capable of being completed.
8.
Local MSremote MS
A local MS calls an idle remote MS that does not roam, and the called answers, then the call should be connected. A local MS calls a local MS, local MS that roams to a remote network, and the called answers, then the call should be connected. A local MS calls a remote local MS that roams to the local network and the called answers, the call should be connected. A local MS calls an MS that roams to a third-party remote network and calls a local MS, the called answers, then the call should be connected.
6.4.4.2
Handover test
1.
Handover function in the same cell: Handover can be performed
normally. 2. Handover function between two adjacent cells controlled by the same BSC: Handover can be performed normally. 3. Handover function between two adjacent cells controlled by different BSC: Handover can be performed normally. 4. Directed retry controlled by the same BSC: Handover can be
performed normally. 5. Directed retry controlled by different BSCs: Handover can be performed normally. 6.4.5 Operation and maintenance subsystem test 1. Man-machine commands
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BSS can input all commands and configuration data via the remote OMC interface, and transmit them to BSS along X.25 link. It supports local MMIs of all BSCs and BTSs.
2.
Configuration management
The data can be correctly configured in accordance with the radio network of the subscribers. The operation and maintenance center should be able to modify, add and delete data easily and correctly.
3.
Alarm management
The alarm management subsystem should perform various functions: collect various BTS and BSC alarms timely and correctly, and report to OMCR; ensure that no alarm is lost or repeated; correctly send status of each board to OMCR, such as the active/standby status, etc., save the alarm in BSC for certain period of time when the foreground is disconnected from the background, and after communication restores, send the alarm to OMCR; support various man-machine commands for the board, such as reset, switchover; whether to provide hot backup of current alarm information between active/standby MP, and during active MP switchover, no alarm information will be repeated or lost. The alarm function can be tested by simulating all possible alarms in the system environment, and through the alarm background of OMCR, checking whether the alarms can be reported and recovered correctly. We can check whether man-machine commands can be executed correctly by sending various supported commands from the alarm background of OMCR to BSC. 4. Performance management
For the performance measurement sub-system, it should create and terminate various measurement tasks issued by background, i.e. perform correct maintenance according to man-machine commands of background; send measurement data to background timely and correctly. The measurement data collected may truly reflect the running status of the system. When the foreground is disconnected from the background, the
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former saves the data in BSC, and then sends to OMCR after communication restores. The performance is tested mainly through artificial service flows, to observe at the OMCR performance measurement background whether relevant data are correct; and via this background, add to or delete from the foreground the measurement tasks to see whether BSC can handle these operations correctly. 5. Security management
Security management includes various management for authentication, access

control, user, user group, operation log, etc. In addition, BSC has the system restriction function, restricting the input of MMI commands from the local I/O terminal, remote connection terminal or via X.25 data link.
6.4.6
GPRS test contents 1. 2. Hardware function test Software version check
Check the version number of the software manufactured with that of the running software. They should be consistent. 3. Fault test
Once the system is restarted after power-off, the Gb link can be re-activated, and each BVC can become normal again. 4. Switchover and restart test 1) PUC board active/standby switchover
A. Fault switchover B. Manual switchover
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C. Man-machine command switchover
2) GIPP board active/standby switchover. 1 Fault switchover 2 Manual switchover 3 Man-machine command switchover 3) BRP restart: it can return to normal. 4) FRP restart: it can return to normal. 5. Service test 1) Gb interface test NSVC status observation, blocking, unblocking; BVC status observation, blocking, unblocking, signaling BVC resetting. 2) Packet service test GPRS attachment, detachment; PDP activation, deactivation; packet service test (PING, WAP, FTP, HTTP).
6.4.7
Installation and test records When installing and testing BSC software and hardware, please keep careful records of all installation items and test results, especially for the faults and corresponding solvents in the project.
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Packaging, Storage and Transportation

Packing
All parts and components of ZXG10-BSC (V2) are packed by adopting reasonable quakeproof, vibration-free and other precaution measures, so as to protect the equipment during transportation. The whole system of ZXG10-BSC (V2) is packed in separate packages. These packages include rack package, doorplate package, side plate package, MP package, power supply package, cable package, and delivery-attached documentation package. Each package has obvious outside markers, which indicate the product name, model, handling and placing direction, as well as dampproof, fragile, waterproof and piled layer indications, so as to avoid damages, confusion, mismatching, etc., while storing and transporting the equipment. 1. Packing of plug-in units
7.1
Take down the plug-in units from the rack, pack them with anti-static bag and put in large foam-padded carton box. Operate in an order reverse to the above one for assembling racks on site. 2. Rack packing
Rack package contains plug-in boxes, backplanes, power plug-in box on top of the rack, plug-in units, backplane signal lines (excluding cabinet top cover, front and back door plates and side plates). First pack them with anti-static bag and then put in a wooden box. Operate in an order reverse to the above one for assembling racks on site.
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The size of the wooden box is 958mm (length) 2148mm (width) 813mm (depth), as shown in Fig. 7-1.
2148mm
m 3m 81
958mm
Fig. 7-1
Exterior dimensions of the wooden box
3.
Door packing
Wrap the 4 front and back doors separately in EPE packages, separate them with foam boards, and then put them into door packing boxes. Operate in an order reverse to the above one for assembling racks on site. Size of the wooden box: 238mm (length) 1988mm (width) 508mm (depth) 4. Side door packing
Wrap the two left and right side doorplates separately with EPE packages, stack them up by placing foam boards in-between, and then put them into the side doorplate packing box. Operate in an order reverse to the above one for assembling racks on site. Size of the wooden box: 178mm (length)2,123mm (width) 708mm (depth)
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7.2
7.2.1
Storage
Storage conditions Ordinary goods should be placed in special-purpose rooms and taken care of by somebody designated by the user. The room should satisfy the following conditions: 1. Temperature: 0C ~ 35C, relative humidity: 20% ~ 75%, without dense dirt or corrosive materials around. 2. No direct sunshine or other direct thermal radiation.
3. The warehouse should be fixed with a thermometer, hygroscope, air-conditioner, ventilation fan, and facilities providing protection against dust, mold, corrosion and rodents. 4. The warehouse should be installed with fire control and alarm devices. 5. The warehouse keeper should read the thermometer and hygroscope every day and keep proper record. To make the temperature and humidity meet relevant requirements (in case they fail to), proper measures should be taken. 6. The warehouse keeper should keep the warehouse clean and tidy, and open the windows or curtains only when it is necessary. 7.2.2 Placement Keep the following in mind when storing goods: 1. Place the packing box as directed, with the arrow outside the packing
box pointing upward. Do not place it upside down and do not overlap more than two boxes. 2. Usually, place computers and boards on top and cables at the bottom. Do not overlap more than four cartons.
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3. Store boards in cartons and insert isolating plates between the boards, so as to protect the boards against damage due to static electricity. Place no more than 20 boards in a carton to prevent the boards from pressing against each other. Wear anti-static wrist strap when handling the boards. 4. Place the box storing boards on rack to protect board from moisture.
7.3
Equipment transportation and portage

Special containers should be used for product transportation. The products on transportation vehicles shall be placed neat and tidy, compact, safe, and reliable, so as to prevent shake-caused damages during transportation. Do not overlap more than three wooden boxes, no more than two fiber boxes, and no more than four cartons. Note that the computers and boards should be placed on the top of the vehicle, and cables at the bottom. In long-distance transportation, the equipment MUST NOT be loaded in an ship or carload without awnings. In transshipment, equipment MUST NOT be placed in an open warehouse. During the transportation, equipment MUST NOT be loaded with flammable, explosive and erosive goods, and the parts should NOT be exposed to rain, snow, liquids or mechanical damages. During transportation, keep the cargo away from the ferromagnetic and highly radiating objects. Do not place the products and parts packed upside down when they are lifted for transportation. No more than two cabinet packing boxes are allowed in the forklift every time, and the maximum height for lifting must be within the range; and the equipment parts must lie at the gravity center of the forklift. Note the storage and transportation mark on the packing box when handling.
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Appendix A BS System Alarms

After ZXG10 is plunged into operation, start the centralized monitoring over its overall operation status so as to enable real-time maintenance and repairing. This function is implemented by the background alarming system. This Appendix lists alarms of various types for reference.
A.1
BSC alarm list

Table A-1 BSC alarm list Alarm type Alarm level 2 Description DSNI board has been inserted unstably, the board is not in the position, or communication with MP is interrupted or hardware is faulty. Voltage output is over or under voltage. BITS clock reference is lost, or the clock interface board powers off or hardware is faulty, etc. The power supply board can not be monitored, is not in position, or powers off, etc. The communication link quality between BSC and MSC is not good. SS7 link communication quality is poor, and a lot of error signaling is received, etc. When SCCP configures SSN status, the office ID can not be found out by DPC. The standby MP does not work normally, the shared memory board is faulty, etc. Communication between MPPP and MP interrupted, power-off, hardware fault, or clock loss, etc. Communication between MTP and MP interrupted, power-off, hardware fault, or clock loss, etc. Alarm level 3 Description Communication between MON and MP interrupted, power-off, hardware fault, or clock loss, etc.
Net drive board alarm Severe alarm on the power supply board Clock interface board alarm Common alarm of the power supply SS7 access unreachable SS7 L3 alarm SS7 SCCP alarm MP active/standby communication interrupted MPPP board fault SS7 board fault Alarm type MON board fault point
2 3 4 3 3 2
2 3
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SMEM board fault Environment monitoring board fault LAPD board fault Trunk congestion Trunk loading error BIE unit alarm BIE sub-unit alarm SM board fault PCM cable between SM SM sub-unit fault DRT board fault DTI board fault TC sub-unit alarm DSP ring fault on DRT PECM sub-unit alarm PECM board fault BSC equipment room ambient temperature alarm BSC equipment room ambient humidity alarm BSC equipment room smog alarm BSC equipment room infrared alarm MP alarm fault 2 Communication between SMEM and MP interrupted, power-off, hardware fault, or clock loss, etc. Communication between the environment monitoring board and MP interrupted, power-off, hardware fault, or clock loss, etc. Communication between LAPD and MP interrupted, power-off, hardware fault, or clock loss, etc. Trunk congestion Trunk loading error Communication is interrupted, reporting the fault Frame asynchronization Communication between SM and MP power-off, hardware fault, or clock loss, etc. interrupted,
2 3 4 3 4 2 3 3 2 2 3 4 4 3
A chip fault in the SM board or external line fault Frame asynchronization Communication between DRT and MP interrupted, power-off, hardware fault, or clock loss, etc. Communication between DTI and MP power-off, hardware fault, or clock loss, etc. Frame asynchronization Software or hardware fault in DSP Fault of a chip in the SM board or an external line, etc. Communication between PECM and MP interrupted, power-off, hardware fault, or clock loss, etc. Temperature is out of the normal working range of the switching system. Humidity is out of the normal working range of the switching system There is smog in the equipment room. Somebody illegally enters the equipment room. The standby MP is faulty. interrupted,
3 1 1 2
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Alarm type
Alarm level
Description The standby MP powers off The standby MP software is faulty. The standby database restores. Database loading fails The standby MPWatchDog overflows.
Insufficient MP space alarm MP bus alarm
disk
2 1 2 2 1 1 3
Hard disk space is insufficient. The shared memory bus is faulty, and communication board bus is faulty. The database loading failure, the database synchronous failure The switching network hardware, software or clock interface faults Communication with MP interrupted, clock fault, power-off, etc. 8K frame header and 8K clock output faults; 16K frame header and 16M clock output faults. Main D/A conversion is out of range, and it is normally caused by the clock aging.
MP database loading fault Switching network fault Switching network dual faults Clock alarm Clock alarm board board severe general
A.2
BTS alarm list

Table A-2 BSC alarm list Alarm type FUC-CHP0 communication interrupted FUC-CHP1 communication interrupted FUC-CHP2 communication interrupted FUC-CHP3 communication interrupted DSP0 initialization failure DSP1 initialization failure DSP2 initialization failure DSP3 initialization failure There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP0) 4 4 4 4 3 4 4 4 3 Alarm level
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Alarm type There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP1) There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP2) There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP3) Number of the CKU-receiving frame is abnormal. The interface clock of FUC_CKU is faulty. Flash Memory error Other FUC hardware errors WatchDog overflow of DSP0 WatchDog overflow of DSP1 WatchDog overflow of DSP2 WatchDog overflow of DSP3 There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP0) There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP1) There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP2) There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP3) WatchDog overflow of FUC Attempts of programming is beyond limits in Flash Memory of FUC Ch0 parameter configuration error Ch1 parameter configuration error Ch2 parameter configuration error Ch3 parameter configuration error Ch4 parameter configuration error Ch5 parameter configuration error Ch6 parameter configuration error Ch7 parameter configuration error CHP software version inconsistent
Alarm level 4 4 4 4 3 3 4 4 4 4 4 4 4 4 4 3 4 4 4 4 4 4 4 4 4 3
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Alarm type FUC software version inconsistent No response from L3 layer software of FUC temporarily LAPD link between FU and BSC interrupted DLRC_AL downlink check error Receiving RF local oscillator 1 out of lock Receiving RF local oscillator 2 out of lock Transmitting RF local oscillator 3 out of lock Transmitting RF local oscillator 4 out of lock Transmitting IF local oscillator 5 out of lock Receiving IF local oscillator 6 out of lock CU parameter configuration error CU software version error CU L4 layer software without response temporarily CKU main clock alarm CKU frame number alarm CKU phase-locked loop out of lock alarm CKU software version error CKU L3 layer software without response temporarily BIE software version error BIE switching chip 1 fault BIE switching chip 2 fault BIE switching chip 3 fault BIE switching chip 4 fault E1 interface chip 1 read/write fault in BIE E1 interface chip 2 read/write fault in BIE E1 interface chip 3 read/write fault in BIE E1 interface signal 1 loss alarm in BIE E1 interface signal 2 loss alarm in BIE E1 interface signal 3 loss alarm in BIE E1 interface signal 1 forward slip code indication in BIE E1 interface signal 2 forward slip indication in BIE
Alarm level 3 4 3 3 4 4 3 3 3 4 3 3 4 2 3 4 3 4 2 3 3 3 3 4 4 4 3 3 3 4 4
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Alarm type E1 interface signal 3 forward slip code indication in BIE E1 interface signal 1 backward slip indication in BIE E1 interface signal 2 backward slip indication in BIE E1 interface signal 3 backward slip code indication in BIE E1 interface signal 1 frame asynchronization alarm in BIE E1 interface signal 2 frame asynchronization alarm in BIE E1 interface signal 3 frame asynchronization alarm in BIE BIE link parameter configuration error No response from L3 layer software in BIE temporarily. Fan 1 alarm Fan 2 alarm Fan 3 alarm Fan 4 alarm Fan 5 alarm Fan 6 alarm Fan 7 alarm Fan 8 alarm Fan 9 alarm Temperature sensor 1 alarm Temperature sensor 2 alarm Temperature sensor 3 alarm Temperature sensor 4 alarm Temperature sensor 5 alarm Temperature sensor 6 alarm Dry contact 1 alarm Dry contact 2 alarm Dry contact 3 alarm Dry contact 4 alarm Dry contact 5 alarm Dry contact 6 alarm Dry contact 7 alarm Alarm level 4 4 4 4 3 3 3 3 4 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
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Alarm type Dry contact 8 alarm Dry contact 9 alarm Dry contact 10 alarm Dry contact 11 alarm Dry contact 12 alarm L3 layer software version error in EAM Temporarily no response from L3 layer software in EAM Attempts of programming is beyond limits in the FLASH of OMU FLASH programming failure in OMU FUBUS fault (communication between OMU and all FUs is interrupted) OBBUS fault (communication between OMU and BIE/CKU/EAM is interrupted) OMU backup board is not in position. PA output power alarm PA voltage standing wave ratio alarm PA power amplifier tube over current alarm PA power amplifier tube over voltage alarm PA over temperature minor alarm (75C) PA over temperature major alarm (80C) Downlink check error from CHP to CUI Low noise amplifier 1 alarm of the transmitter splitter Low noise amplifier 2 alarm of the transmitter splitter Standing wave minor alarm of the transmitter combiner Standing wave major alarm of the transmitter combiner PSB alarm PSA alarm CKD not in position OMU communication link interrupted BIE communication link interrupted CKU communication link interrupted EAM communication link interrupted FU communication link interrupted
Alarm level 3 3 3 3 3 3 3 4 4 3 3 4 3 3 4 4 4 3 4 4 4 4 3 3 3 3 2 3 3 3 4
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Alarm type CU communication link interrupted RTE communication link interrupted PSA communication link interrupted PSB communication link interrupted PA communication link interrupted MUL communication link interrupted CKD communication link interrupted HYCOM communication link interrupted OMU board timeout has not been reported BIE board timeout has not been reported CKU board timeout has not been reported EAM board timeout has not been reported FU board timeout has not been reported CU board timeout has not been reported RTE board timeout has not been reported PSA board timeout has not been reported PSB board timeout has not been reported PA board timeout has not been reported MUL board timeout has not been reported CKD board timeout has not been reported HYCOM board timeout has not been reported
Alarm level 4 3 3 3 4 4 4 4 3 4 4 4 4 4 4 4 4 4 4 4 4
A.3
GPRS alarm list

Table A-3 BSC alarm list Alarm type HDLC communication is interrupted in FRP board 8M8K clock loss in FRP board 8K clock loss in FRP board FRP board frame relay circuit fault 3 2 2 3 Alarm level
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Alarm type MSVC link reset failure HDLC communication is interrupted in BRP board 8M8K clock loss in BRP board 8K clock loss in BRP board DSP fault in BRP board PUC board failure. PUC unit failure. LAN fault inside SPCU GIPP board failure. LAN fault between SPCUs 3 3 2 2 4 3 3 3 3 2
Alarm level
A.4
Notification type list

Table A-4 Notification type list Notification types Peripheral control unit reset Disk is full. File operation error announcement File is damaged. File bias value error. TUP announcement ISUP announcement SCCP announcement E1 interface slip code announcement BSSAP announcement Cause description
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Appendix B UNIX Common Commands

Under Shell prompt, input UNIX commands. The basic format of UNIX commands is as follows: command parameter 1 parameter 2 ... parameter n
UNIX command consists of one command and 0~several parameters. The command and parameter are separated by a space, so are parameter and parameter. The format of UNIX command is similar to that of DOS command, but UNIX command is case sensitive and the command and parameter must be separated. 1. Login and exit
Input the username when the remote system prompts as login:, press <Enter>, and input the password in accordance with the system prompt. Note that the terminal does not display the password, just input as usual. Upon successful login, the system will give $> prompt or other prompts, indicating you have entered into the systems working environment. Do use logout or exit command to exit the system or leave the terminal for long.
Note: UNIX includes three common Shells: B Shell, C Shell and K Shell, and generally, B Shell is default in the system. The default prompts of B Shell and K Shell are "$", and that of C Shell is "%". The system prompt is "#" if the user logs in as root user.
2.
User management command
Users of UNIX system include common users and super users, and each user belongs to an authority group. After login as root super user, it is possible to add user with useradd and delete user with userdel.
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1) Adding a user
useradd [-c uid comment] [-d dir] [-e expire] [-f inactive] [-g gid] [-G gid [, gid]] [-m [-k skel_dir]] [-s shell] [-u uid [-o]] username
username: the login name of the user, which is an essential parameter uid comment: content saved in user ID explanation domain dir: users HOME directory expire: the exact date when user name expires inactive: the number of days when username hasnt been used before username is locked gid: the name or ID of the group the user belongs to Shell: users initial Shell Skel_dir: the directory of the file copied to the users new HOME directory Uid: users unique ID -o: indicating that the user ID is not necessary to be unique -g: a basic group selected for the user -G: some basic groups selected for the user E.g.: useradd c OMC2.0 d /home/omc g root omc Create a user omc, whose HOME directory is /home/omc, belonging to
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root group. 2) Deleting a user userdel [-r] username -r: delete users HOME directory when deleting a user E.g.: userdel r omc Delete omc user, and delete his HOME directory at the same time userdel omc Delete omc user, but not his HOME directory 3. pwd File and directory operation commands the command to show the current working directory
cd convert the working directory (.. upper-level directory, . current directory) E.g.: cd /home/omcuser
mkdir create sub-directory E.g.: mkdir omctmp Under the current directory, create subdirectory omctmp rm /mv /cp move, copy and delete file
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E.g.: rm r tmp
tmp
delete all files and directories under the sub-directory
rm gpo2001/7/12.log delete the log file of gpo mv junk precious content unchanged. rename the file junk as precious, keeping the
cp junk precious copy file, existing two files with the same content. ls -al list all files and directories in the system. The attributes of each item indicate the read/write and execution attributes of files/directories, including the file/directory number, host user, host group, file size, creation time, file name. vi editor or other editors can be used to create file. cat show the content of a text file
E.g.: cat test.conf or cat test.conf | more tail show the last 10 lines of the file, applicable to large files.
E.g.: tail -f gpoc2001/7/11.log, capable of promptly showing the content of the updated current file find used to search for a certain file
E.g.: find ../ amp2001/7/11.log search for the file named amp2001/7/11.log in the upper-level or included subdirectory. grep search for character string in the whole text file
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E.g.: grep hello world example.txt 4. tar File compression and decompression most common backup commands
E.g.: tar -cvf ./2001/7/12log.tar . back up all files under the current
directory to 2001/7/12 log.tar file
tar xvf directory gzip/gunzip tool
omc20.xxxx-sparc.tar
decompress the file to the current
compress/uncompress
compression and decompression
E.g.: gzip omc20.xxxx-sparc.tar file to omc20.xxxx-sparc.tar.gz file
compress the omc20.xxxx-sparc.tar
gunzip omc20.xxxx-sparc.tar.gz decompress the file to tar file compress omc20.xxxx-sparc.tar compress the .tar file to omc20.xxxx-sparc.tar.Z file uncompress omc20.xxxx-sparc.tar.Z decompress omc20.xxxx-sparc.tar.Z to omc20.xxxx-sparc.tar file 5. Network-related commands
netstat: view the connection status of the current network interface of the server ping view the contection status of the network e.g., ping 138.2.1.235
telnet: log in to other hosts e.g., telnet 138.2.1.235

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ifconfig configure local network interface, ifconfig a is used to show the local IP address 6. How to execute other commands of the program at the background
To make a program run at the background, just add & at the end of the command line.
E.g.: execute find command at the background to search for the file abc under the current directory or its subdirectory. Execute the command, and the following contents will immediately display: $ find . -name abc -print& 10722 $ 10722 stands for process ID (PID).When find command is executed at the background, the result will be displayed. 7. Process-related commands PS shows the process information as in Table B-1.
Table B-1 Process information shown by PS UNIX command ps ps -u username ps e ps f Explanations Show the process information related to the terminal used Show the process of a certain user (e.g. ps -u abc) Show the information of all running processes The long list shows the information of each process
ps ef
the long list shows the information of all running processes
E.g., kill kill the process

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E.g., kill process ID or kill9 process ID 8.
force-kill process
Steps for stopping out-of-control process 1) Log in as root user at the unlocked terminal 2) Use "ps -ef" and "grep keyword" command to search for the pid number of the out-of-control process 3) kill pid number. If it cant be killed, then run "kill -9 pid number" 4) If it still can not be, use shutdown
9.
View disk space
df k show how much the disk spaces of the host are used du sk . show the disk space occupied by the current directory 10. The shutdown command of the system reboot restart the system shutdown the command to shut down and restart the system.E.g., shutdown i6 restart the system 11. Install and uninstall local file system
mount /dev/device /directory/to/mount Here, /dev/device is the file system to be installed; /directory/to/mount is the installation point of the local file system Note: Before installation, the host directory of the installation point must exist
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Options of the mount commands: rw: rewritable ro: read only bg: background installation (if installation fails, the installation process will retry at the background until installation succeeds) intr: installation may be interrupted E.g. mount o rw,bg,intr /dev/hda4 /usr umount /directory/to/mount E.g. unmount /usr unmount the /usr file system from the current directory tree, and restore the original content under the directory 12. Load network file system The most common operation is to visit the file directories of other hosts, provided that this file directory is shared by other hosts in NFS mode. e.g., to visit /export/home/omc directory of 138.2.1.235 machine: $cd /net/138.2.1.235/export/home/omc
13. Other commands
vmstat date
view the use condition of the virtual memory of the system show the current system time
passwd set user password.For example, passwd, change the current user password
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which <filename> command is in E.g., which ls
view which directory of the system a certain
view which directory the command ls is in.
14. Switch to root user su Password 15. Use of man tool The most common help is the man tool in UNIX, whose basic use is man <topic>. In addition, man sX <topic> can be used to specify the topic of Chapter X.man K <topic> can be used to search for the topic containing the keyword <topic>. E.g, man ls view all help topics of the command ls.
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Appendix C Abbreviations
Abbr. AIPP AIU BATC BBIU BCTL BIE BIPP BIU BNET BOSN BRP BSC BSMU BSS BTS CKI COMI COMM DRT DSNI DSP DTI EDRT EGSM FRP FSMU Full name A Interface Peripheral Processor A Interface Unit Backplane of A interface and TransCoder Backplane of Abis Interface Unit Backplane of ConTroL Base station Interface Equipment Abis Interface Peripheral Processor Abis Interface Unit Backplane of NET Bit-Oriented Switching Network BSSGP RLC/MAC Protocol processor Base Station Controller Backplane of SubMultiplexing Unit Base Station System Base Transceiver Station ClocK Interface board COMmunication Interface board COMMunication board Dual-Rate Transcoder Digital Switch Network Interface Digital Signal Processor Digital Trunk Interface Enhanced DRT Enhanced Global System for Mobile communicaion Frame Relay Protocol Processor Far SubMultiplexing Unit
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(to be continued)
Abbr. FSPP GIPP GPP GPRS GSM HW LAPD LED LMT MON MPMP MPPP MS MSC MSS MTP NSMU NSPP NSU PCB PCM PCU PDCH PEPD POWB POWP PUC PSTN RMU RXLE RXQUA Full name Far Submultiplexing Peripheral Processor Gb Interface Peripheral Processor General Peripheral Processor General Packet Radio Service Global System for Mobile communication HighWay Link Access Protocol on the D channel Low Emitting Diode Local Maintain Terminal MONitor board MP To MP MP To PP Mobile Station Mobile Switching Center Mobile Switch System Message Transfer Protocol Near SubMultiplexing Unit Near Submultiplexing Peripheral Processor Net Switching Unit Printed Circuit Board Pulse Code Modulation Packet Control Unit Packet Data CHannel Peripheral Environment &Power Detecting board POWer B POWer P Packet Unit Controller Public Switching Telephone Network Radio Manage Unit Rx Level Rx QUAlity
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(to be continued)
Abbr. SCCP SCM SCU SM SMB SMEM SMPP SMU SUBPP SYCK TC TCP TCPP TCU TIC Full name Signaling Connection Control Part System Control Module System Control Unit SubMultiplexing Subrate Multiplexing to Bts Share MEMory Subchannel Multiplexing Peripheral Processor Subchannel Multiplexing Unit SUB Peripheral Processor SYnchronous ClocK board Trans Coder Transfer Control Protocol TransCoder unit Peripheral Processor TransCoder Unit Trunk Interface Circuit
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ZXG10 BSC (V2) Installation Manual

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ZXG10

GSM WLL SYSTEM

Installation Manual of ZXG10-BSC (V2)

Installation Manual of ZXG10-BSC (V2)

Installation Manual of ZXG10-BSC (V2)

Page III of III

Installation Manual of ZXG10-BSC (V2)

Installation Manual of ZXG10-BSC (V2)

MS Um BTS Abis BSC MAP-F EIR Gf Gb A

HLR MAP-C SMC

GGSN Other PLMN

Architecture of GSM mobile communication network

Installation Manual of ZXG10-BSC (V2)

OMC SM Ater Interface

PLMN SGSN Gb Interface PDN

Fig. 1-2 Architecture of ZXG10-BSS

Installation Manual of ZXG10-BSC (V2)

Hardware system structure

Installation Manual of ZXG10-BSC (V2)

Installation Manual of ZXG10-BSC (V2)

RMM2 SCM OMM

BSC module structure

Installation Manual of ZXG10-BSC (V2)

BIU#11 RMU BIU#12

8M 2 BIU#81 RMM#8 RMU BIU#82 F E1 S M U

TCU 8M 2 TCU TCU

BSC system structure

Installation Manual of ZXG10-BSC (V2)

LAPD MPMP MP MPMP MPMP 1RMU MPMP S M E M SCU MPMP

Basic structure of the BSC hardware system

Installation Manual of ZXG10-BSC (V2)

For example, a small-capacity configuration is as shown in Fig. 1-6 (single rack):

Equipment installation and commissioning process

Installation Manual of ZXG10-BSC (V2)

Pr oject p rep aratio n

Sta rt inspec tion

Rac k insta lla tion

Installation process of the ZXG10-BSC (V2)

Installation Manual of ZXG10-BSC (V2)

Front door (two leaves)

Diagram of single-cabinet structure

Rack dimensions: 2200mm 810mm 600mm (height width depth);

Installation Manual of ZXG10-BSC (V2)

Installation Manual of ZXG10-BSC (V2)

the side boards should be mounted at both sides of each row.

Multi-cabinet in one row

Installation Manual of ZXG10-BSC (V2)

25mm Guide rail bar Backplane

Plug-in box structure

Installation Manual of ZXG10-BSC (V2)

Panel Ejector lever

BSC rack configuration

Installation Manual of ZXG10-BSC (V2)

Layer 6 Layer 5 Layer 4 Layer 3 Layer 2 Layer 1

BBIU BCTL (RMU) BCTL (SCU) BNET BATC BATC

N_trx240 rack configuration

Layer 6 Layer 5 Layer 4 Layer 3 Layer 2 Layer 1

BBIU BCTL (RMU) BCTL (SCU) BNET BATC BATC 1

BBIU BCTL (RMU) BATC BATC

240<N_trx480 rack configuration

Installation Manual of ZXG10-BSC (V2)

Layer 6 Layer 5 Layer 4 Layer 3 Layer 2 Layer 1

BBIU BCTL(RMU) BCTL (SCU) BNET BATC BATC 1