Thermal Stress Analysis of An Integrated Circuit Board

Chapter 46: Thermal Stress Analysis of an Integrated Circuit Board
Thermal Stress Analysis of an

46 Integrated Circuit Board

Summary 921

Introduction 922

Modeling Details 922

Solution Highlights 924

Results 925

Modeling Tips 926

Pre- and Postprocess with SimXpert 927

Input File(s) 969
 Video 970
CHAPTER 46 921
Thermal Stress Analysis of an Integrated Circuit Board
Summary
Title Chapter 46: Thermal Stress Analysis of an Integrated Circuit Board
Features Chaining thermal and stress analysis in one execution
Geometry
Chip
Leads
Case
Paste
14 x 14 x 3.22
Units: mm, N, C
Material properties
Material k W   mm  C  E N   mm 2   (1/C)
Lead frame 0.147 6.9x104 1.0x10-6
Chip 0.168 5.52x104 1.0x10-5
Case 0.0714 4.5x104 1.0x10-6
Paste 0.02016 2.0x103 1.0x10-5
Analysis characteristics Nonlinear thermal analysis followed by a stress analysis

Thermal boundary conditions: The heat flux is applied on top surface of the chip with heat flux
equal to 0.025 W/(mm2 oC). Convection heat transfer with ambient (at 70 oC). Top surface of the
case - 4.05x10-5 W/(mm2 oC). Bottom Surface of the case - 2.026x10 -5 W/(mm2 oC) Sides
Boundary conditions
(adjacent to the lead frame where it is fixed) - 7.0x10-5. There is radiation loss on top of the outer
case to ambient at 40 oC with emissivity equal to 0.8 and view factor is 1.0. Structure boundary
conditions: Fix the end of the lead frame.
Element type 8-node CHEXA
FE results Thermal contours and resulting displacement contours
Thermal Contours Displacement Contours
922 MD Demonstration Problems
CHAPTER 46
Introduction
This example demonstrates the chaining of thermal and structural analysis in SOL 400 whereby the first step is a
nonlinear steady state thermal analysis subject to heat flux on the chip, convection and radiation boundary conditions,
and the second step is a nonlinear static analysis using the temperatures from the first step. The thermal stress analysis
chaining has always been available in the linear heat transfer to linear static analysis using param, heatstat,yes in the
SOL 101 run. However, it was not possible previously in Nastran to run a nonlinear heat transfer followed by the static
analysis in a single execution because SOL 101 is a linear heat transfer solution. The only alternative is to run a
nonlinear thermal analysis using SOL 153 and used the resulting temperature punch file as the input thermal load for
your stress analysis. The user can output a punch file by specifying TEMP(PRINT,PUNCH)=all in the first run. This
will create a punch file that consists of temperature for every grids in the model. In the thermal stress run he can use
the TEMP(LOAD)=1 in the case control to use the temperature load in the static run. Chaining of thermal and structural
analyses facilitates design studies based on:
1. changing the materials properties
2. changing the thermal boundary conditions
3. changing structure constraints
whereby the temperatures as well as the corresponding displacements are visualized in a single run.
Modeling Details
Bonded joints are used in the design of a circuit board. A change in temperature due to the equipment operation can
introduce stresses in joined materials of dissimilar thermal expansion coefficient. In this case we have chip heating
due to the applied power, causing thermal gradients in the different materials which, together with the fixed
displacements cause high stresses near the end of the lead frame.
The chip dimension (Figure 46-1) is 3.80 mm by 3.80mm with thickness equal to 0.7 mm. It is mounted on top of
adhesive (paste). The outer case dimension is 14 mm by 14 mm by 3.22 mm.
Chip
Figure 46-1 Chip, Paste, and Lead Frame (Nastran Test File: hybrid_radbc_unit.dat)
CHAPTER 46 923
14 x 14 x 3.22
Figure 46-2 Outer Case
A heat flux is applied to the top surface of the chip with heat flux equal to 0.025 W/(mm2oC). The top surface, bottom
surface and the sides (adjacent to the lead frame where it is fixed) of the case are subjected to convection heat loss.
Heat is convected to the environment at 70oC. The respective heat transfer coefficient for the top, bottom and sides
are 4.05x10-5 W/(mm2oC), 2.026x10-5 W/(mm2oC) and 7.00x10-5 W/(mm2oC). Finally there is a radiation loss on top
of the outer case to ambient environment of 40oC with emissivity equal to 0.8 and view factor is 1.0.
The structural boundary conditions include fixing the end of the lead frame as shown in Figure 46-3.
Figure 46-3 Structural Boundary Conditions
The material properties are shown in Table 46-1.
Table 46-1 Material Properties

Material k W   mm – K  E N   mm 2   (1/C)
Chip 0.147 6.9x104 1.0x10-6
Lead Frame 0.168 5.52x104 1.0x10-5
Case 0.0714 4.5x104 1.0x10-6
Paste 0.02016 2.0x103 1.0x10-5
In running a thermal stress analysis, it is important to check you have specified a thermal coefficient of expansion on
the field 7 on the MAT1 bulk data entry. Otherwise, there will be no thermal expansion in your problem.
CHAPTER 46
It is important that you have a consistent set of units. In this case, the thermal conductivity has units of W/(mm2 K),
and therefore your Young's modulus should be in the unit of N/(mm2). This consistency also applies to the Stefan-
Boltzmann constant also used in the radiation boundary conditions with units of W/(mm2 K).
Solution Highlights
The following are highlights of the Nastran input file necessary to model this problem:
$! NASTRAN Control Section
NASTRAN SYSTEM(316)=19
$! File Management Section
$! Executive Control Section
SOL 400
CEND
ECHO = SORT
$! Case Control Section
TEMPERATURE(INITIAL) = 33
SUBCASE 1
$! Subcase name : NewLoadcase
$LBCSET SUBCASE1
ANALYSIS = NLSTAT
STEP 1
$LBCSET STEP1.1 Thermal
$! Step name : Thermal
ANALYSIS = HSTAT
SPC = 36
LOAD = 37
NLSTEP = 2
TSTRU = 38
THERMAL(SORT1,PRINT)=ALL
FLUX(PRINT)=ALL
STEP 2
$LBCSET STEP1.2 Structural
$! Step name : Structural
SPC = 11
ANALYSIS = NLSTAT
NLSTEP = 3
TEMPERATURE(LOAD) = 38
DISPLACEMENT(SORT1,PRINT,REAL)=ALL
STRESS(SORT1,PRINT,REAL,VONMISES,CORNER)=ALL
BEGIN BULK
$! Bulk Data Pre Section
PARAM SNORM 20.
PARAM K6ROT 100.
PARAM WTMASS 1.
PARAM LGDISP 1
PARAM TABS 273.15
PARAM* SIGMA 5.6699E-14
PARAM POST 1
$! Bulk Data Model Section
CHAPTER 46 925
There are two steps in this analysis. The first step is associated with the thermal boundary conditions as indicated with
ANALY=HSTAT. The second step is the thermal stress analysis and the structure boundary condition which the
ANALY=NLSTAT. The TEMP(load)=1 in the second step will allow the Step 2 to pick up the calculated temperature
from step 1 as the thermal load for the calculation of thermal stress. Please note that the param,lgdisp,1 is required
when chaining thermal and structural analyses. The TEMP(INITIAL)=9 points to the TEMPD,9,0.0 in the bulk data
section. This indicates the initial stress free temperature is at zero degrees. The thermal strain is then equal to the
product of the linear coefficient of thermal expansion times the change in temperature. In this example, the thermal
coefficient of expansion is constant, temperature dependency is also readily possible.
Following is the output from the thermal analysis and thermal stress analysis.
1 JUNE 11, 2010 MD NASTRAN 5/21/10 PAGE 896
0 SUBCASE 1 STEP 1
LOAD STEP = 1.00000E+00
T E M P E R A T U R E V E C T O R
POINT ID. TYPE ID VALUE ID+1 VALUE ID+2 VALUE ID+3 VALUE ID+4 VALUE ID+5 VALUE
6320 S 8.666747E+01 8.661747E+01 8.657528E+01 8.654037E+01 8.651233E+01 8.649082E+01
6327 S 8.697186E+01 8.687786E+01 8.679778E+01 8.672908E+01 8.667010E+01 8.661977E+01
6333 S 8.657732E+01 8.654223E+01 8.651408E+01 8.649251E+01 8.647716E+01
1 JUNE 11, 2010 MD NASTRAN 5/21/10 PAGE 9546
0 SUBCASE 1 STEP 2
LOAD STEP = 1.00000E+00
D I S P L A C E M E N T V E C T O R
POINT ID. TYPE T1 T2 T3 R1 R2 R3

99 G -7.002653E-04 -5.229975E-04 1.484855E-03 0.0 0.0 0.0
100 G -8.090116E-04 -5.227823E-04 1.456455E-03 0.0 0.0 0.0
101 G -8.938556E-04 -5.234344E-04 1.425087E-03 0.0 0.0 0.0
102 G -1.037468E-03 -5.227153E-04 1.400765E-03 0.0 0.0 0.0
103 G -1.272494E-03 -4.961967E-04 1.366653E-03 0.0 0.0 0.0
Results
Figure 46-4 Temperature Contours

CHAPTER 46
Figure 46-5 Resulting Displacements (Magnified Displacements for Deformed Plot)
Figure 46-6 von Mises Stress Contour at Five Seconds
Modeling Tips
Always check consistency of units; the basic units are mm, N, and oC(K).
$watt/mm.C
MAT4 1 .147 1. 1.
$ Material Record : mat1.2
$ Description of Material :
MAT4 2 .168 1. 1.
MAT4 3 .0714 1. 1.
MAT4 4 .02016 1. 1.
$
CHAPTER 46 927
MAT1,1,6.9e4,,0.3,,1.0e-6
$ Material 2 : leadframe
MAT1,2,5.52e4,,0.3,,1.0e-5
$ Material 3 : new
MAT1,3,4.5e4,,0.3,,1.0e-6
$ Material 4 : paste
MAT1,4,2.0e3,,0.3,,1.0e-5
Pre- and Postprocess with SimXpert

This example shows how to use SimXpert for a chained thermal/stress analysis. It will create thermal lbcs for normal
heat flux, normal convection, and radiation to space. It will also create the structural lbc for pinned ends to electrical
leads. The thermal/stress analysis simulation parameter values will be defined. The results can be viewed after the
thermal/stress analysis is performed.
Units
a. For default workspace, select Structures
a
CHAPTER 46
Specify the Model Units
a. Tools: Options
b. Observe the User Options Window
c. Select Units Manager
d. For Basic Units, specify the model units:
e. Length = mm; Mass = g; Time = s; Temperature = celsius, Force = N
f. Click OK
a b
c e
CHAPTER 46 929
Import FE Model into Separate Parts
a. Import finite element model into separate parts

b. Tools: Options
c. General: input/Output/Nastran.Sturctures
d. Unselect Reduce Parts
e. Click OK
2009 MSC.Software Corporation WS9-8

CHAPTER 46
Import MD Nastran Nodes and Elements File
a. Import MD Nastran nodes and elements file

b. File: Import/Nastran
c. Select nug_46_bdf.bdf
d. Click OK
c
CHAPTER 46 931
MD Nastran Nodes and Elements Model
a. MD Nastran nodes and elements model

b. Model Views: Isometric View
c. Render FE Shaded with Edges
d. View Manipulation: Fill
b c
CHAPTER 46
Material Properties
a. Material properties of the imported model

b. Double click, one at a time, on each of the four material names
c. Observe the thermal-mechanical contents of the material forms
d. Click Cancel
b
CHAPTER 46 933
Material Properties (continued)
a. Material properties of the imported model

c. Click Thermal tab
d. Observe the thermal contents of the material forms
e. Click Cancel
b
d
WS9-12
CHAPTER 46
Element Properties
a. Element properties of the imported model

c. Observe the element property contents of the property forms
d. Click Cancel
b
CHAPTER 46 935
Apply Normal Heat Flux
a. Create applied heat flux. Apply it to the top of the chip

b. Display just the chip by hiding everything else. Right click SOLID_5_nug_46_bdf.bdf;
then select Show Only
c. Observe the chip element only
d. Use Model Views: Isometric or Left
e. LBCs tab: Heat Transfer/Normal Flux
f. For Name, enter Normal Flux_Top_Chip
g. For Entities screen, select the nodes at the top of the chip
h. For Heat Flux, enter 9.025
i. Click OK
f
.
b . g
h
g
CHAPTER 46
Normal Heat Flux Applied to Top of Chip
a. Create applied heat flux. Apply it to the top of the chip

b. Observe the heat flux markers
c. Show the entire model
d. Change the color of the markers to red using the Visualize tab for the LBC
c
b
CHAPTER 46 937
Free Convection Applied to Top of Case
a. Create applied free convection. Apply it to the top of the case

b. Model Views: Left
c. LBCs tab: Heat Transfer/Free Convection
d. For Name, enter Free Convection_Top_Case
e. For Ambient temperature, enter 70
f. For Entities screen, select all the nodes at the top of the case
g. Click Advanced
h. For Convection coefficient, enter 4e-5
i. Click OK
e
f
g
f
CHAPTER 46
Model with Heat Flux and Free Convection on Top
a. Observe the entire model with normal heat flux on the chip and free convection on the top
of the case
a
CHAPTER 46 939
Free Convection Applied to Sides of Case

b. Model Views: Top
c. Hide the lead frame
d. LBCs tab: Heat Transfer/Free Convection
e. For Name, enter Free Convection_Sides_Case
f. For Ambient temperature, enter 70
g. For Entities screen, select all the nodes at two sides of the case
h. Click Advanced
l. For Convection coefficient, enter 7e-5
j. Click OK
f
g
h
g
CHAPTER 46
Model with Heat Flux and Free Convection to Sides
a. Observe the entire model with normal heat flux on the chip and free convection on the top
and two sides of the case
a
CHAPTER 46 941
Free Convection Applied to Bottom of Case

c. LBCs tab: Heat Transfer/Free Convection
d. For Name, enter Free Convection_Bottom_Case
e. For Ambient temperature, enter 70
f. For Entities screen, select all the nodes at the bottom of the case
g. Click Advanced
h. For Convection coefficient, enter 2.02e-5
i. Click OK
e
f
g
f
CHAPTER 46
Model with Heat Flux and Free Convection on Case
a. Observe the entire model with normal heat flux on the chip and free convection on the top,
two sides, and bottom of the case
a
CHAPTER 46 943
Entire Model with Lead Frame
a. Observe the entire model with the lead frame

b. Show the lead frame
a
CHAPTER 46
Radiation to Space Applied to Top of Case
a. Create radiation to space. Apply it to the top of the case

c. LBCs tab: Heat Transfer/Rad to Space
d. For Name, enter Rad to Space_Top_Case
e. For Entities screen, select all the nodes at the top of the case
f. For Ambient temperature, enter 40
g. For Viewfactor, enter 1.0
h. Click Advanced
i. For Absorptivity, enter 1
j. For Emissivity, enter 1
k. For Shell surface option, select Front
l. Click OK
c
d
.
e
f
g
h
i
j
k
e
CHAPTER 46 945
Model with Radiation to Space
a. Observe the entire model with normal heat flux, free convection, and radiation to space
on the case
a
CHAPTER 46
Define Structural LBC
a. Create a structural lbc for the stress analysis

b. LBCs tab: LBC Set/LBC Set
c. For Name, enter Structural
d. Click OK
e. This LBD set will be populated subsequently
d
CHAPTER 46 947
Create Pinned Constraint at Toe of Lead Frame
a. Create a structural pinned lbc constraint at the toe of the lead frame
b. LBCs tab: Constraints/Pin
c. For Name, enter Pinned Constraint_Toe_Lead
d. Use Model Views: Left or Front
e. For Entities screen, select the toe lead frame nodes
f. Click OK
e e
CHAPTER 46
Model with Structural Pinned Constraint
a. Observe the model with structural pinned constraints
a
CHAPTER 46 949
Create SimXpert Analysis File
a. Create a SimXpert analysis file for MD Nastran

b. Right click on nug_46_bdf.bdf
c. Select Create new Nastran job
d. For Job Name, enter ch46
e. For Solution TYpe, select SOL400
f. For Solver Input File, select the path
g. Unselect Create Default Layout
h. Click OK
c
d
g
h
CHAPTER 46
Create SimXpert Analysis File (continued)

b. Right click on Load Cases
c. Select Create Loadcase
d. For Name (Title), enter NewLoadcase
e. For Analysis TYpe, select Nonlinear Steady Heat Trans
f. Click OK
f
CHAPTER 46 951

b. Right click on Load Steps
c. Select Create Loadstep
d. For Name (Title), enter Thermal
e. For Analysis TYpe, select Nonlinear Steady Heat Trans
f. Click OK
b
c
f
CHAPTER 46

b. Right click on Load Steps
c. Select Create Loadstep
d. For Name (Title), enter Structural
e. For Analysis TYpe, select Nonlinear Static
f. Click Use Temperature Set from Preceeding Heat Transfer Step
If Applicable
g. Click OK
f
g
CHAPTER 46 953

b. Right click on Load/Boundaries
c. Select Select Lbc Set
d. For Selected Lbc Set, select DefaultLbcSet
e. Click OK
e
CHAPTER 46

b. Double click on Solver Control
c. Select Solution 400 Nonlinear Parameters
d. For Default Init Temperature, enter 0
e. For Large Displacement, select Large Disp and Follower Force
e
CHAPTER 46 955

b. For Absolute Temperature Scale, select 273.15 Degree Celsius
c. For Stefan Boltzmann Constant, select 5.6699E-14 WATTS/mm2/K4
d. Click Apply (not shown)
e. Click Close (not shown)
b
c
CHAPTER 46

c. Select Output File Properties
d. For Text Output, select Print
e. Click Apply
f. Click Cost
d
c
f
CHAPTER 46 957

b. Double click on Loadcase Control
c. Select Subcase Steady State Heat Transfer Parameters
d. Click Temperature Error
e. For Temperature Tolerance, enter 0.01
f. Click Load Error
g. For Load Tolerance, enter 1e05
h. Click Apply (not shown)
i. Click Close (not shown)
d
e
f
g
CHAPTER 46

b. Right click on Output Requests
c. Select Nodal Output Requests
d. Click Create Temperature Output Request
e. Click OK
e
CHAPTER 46 959

b. Right click on Output Requests
c. Select Elements Output Requests
d. Click Create Element Stress Output Request
e. Click OK
e
CHAPTER 46

b. Right click on ch46
c. Select Run
b c
CHAPTER 46 961
Attach SimXpert Results File
a. Attach a SimXpert MD Nastran results file

b. File: Attach Results
c. For File path, select ch46.xdb
d. Click OK
d
CHAPTER 46
Display Thermal Results
a. Display temperature results as a fringe plot

b. Results tab: Results/Fringe
c. For Result Cases, select SC1: Non.-linear: 100 % of Load
d. For Result type, select Temperatures
e. Click Update
c d
CHAPTER 46 963
Display Thermal Results (continued)
a. Observe the temperature results
a
CHAPTER 46
Display Structural Results using OP2 File
a. To display the structural results for the R3.2 release of SimXpert, use an .op2 file
c. Select Output File Properties
d. For Binary Output, select OP2
e. Click Apply
f. Click Cost
f
CHAPTER 46 965
Perform a SimXpert Analysis for OP2 Results File
a. Perform a SimXpert analysis using MD Nastran

b. Right click ch46
c. Select Run
c
CHAPTER 46
Detach .xdb Thermal Results File
a. Before attempting to attach the .op2 file, detach the .xdb file
b. File: Detach Results file
c. Select ch46.xdb
d. Select OK
e. Click Yes
b
CHAPTER 46 967
Attach SimXpert Results OP2 File
a. Attach a SimXpert MD Nastran results file

b. File: Attach Results
c. For File Path, select ch46.op2
d. Click OK
d
CHAPTER 46
Display Structural Results using OP2 File
a. Display von Mises results as a fringe plot

b. Results tab: Results/Fringe
c. For Result Cases, select SC1: Step 2: Non-linear: 100 % of Load
d. For Result type, select Stress Tensor
e. For Derivation, select von Mises
f. Click Update
f
d e
c
CHAPTER 46 969
Display Structural Results using OP2 File (continued)
a. Observe the von Mises stress results
Input File(s)
File Description
nug_46.dat MD Nastran chaining thermal and thermal stress test file.
Ch46.SimXpert SimXpert data corresponding to above
CHAPTER 46
Video
Click on the image or caption below to view a streaming video of this problem; it lasts approximately 28 minutes and
explains how the steps are performed.
Thermal Contours Displacement Contours
Figure 46-7 Video of the Above Steps

Thermal Stress Analysis of An Integrated Circuit Board

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Chapter 46: Thermal Stress Analysis of an Integrated Circuit Board

Thermal Stress Analysis of an

Analysis characteristics Nonlinear thermal analysis followed by a stress analysis

Figure 46-2 Outer Case

Figure 46-3 Structural Boundary Conditions

The material properties are shown in Table 46-1.

Table 46-1 Material Properties

1 JUNE 11, 2010 MD NASTRAN 5/21/10 PAGE 9546

POINT ID. TYPE T1 T2 T3 R1 R2 R3

Figure 46-4 Temperature Contours

Figure 46-5 Resulting Displacements (Magnified Displacements for Deformed Plot)

Figure 46-6 von Mises Stress Contour at Five Seconds

Pre- and Postprocess with SimXpert

a. For default workspace, select Structures

Specify the Model Units

Import FE Model into Separate Parts

a. Import finite element model into separate parts

2009 MSC.Software Corporation WS9-8

Import MD Nastran Nodes and Elements File

a. Import MD Nastran nodes and elements file

MD Nastran Nodes and Elements Model

a. MD Nastran nodes and elements model

a. Material properties of the imported model

Material Properties (continued)

a. Material properties of the imported model

a. Element properties of the imported model

Apply Normal Heat Flux

a. Create applied heat flux. Apply it to the top of the chip

Normal Heat Flux Applied to Top of Chip

a. Create applied heat flux. Apply it to the top of the chip

Free Convection Applied to Top of Case

a. Create applied free convection. Apply it to the top of the case

Model with Heat Flux and Free Convection on Top

Free Convection Applied to Sides of Case

a. Create applied free convection. Apply it to the top of the case

Model with Heat Flux and Free Convection to Sides

Free Convection Applied to Bottom of Case

a. Create applied free convection. Apply it to the top of the case

Model with Heat Flux and Free Convection on Case

Entire Model with Lead Frame

a. Observe the entire model with the lead frame

Radiation to Space Applied to Top of Case

a. Create radiation to space. Apply it to the top of the case

Model with Radiation to Space

Define Structural LBC

a. Create a structural lbc for the stress analysis

Create Pinned Constraint at Toe of Lead Frame

Model with Structural Pinned Constraint

a. Observe the model with structural pinned constraints

Create SimXpert Analysis File

a. Create a SimXpert analysis file for MD Nastran

Create SimXpert Analysis File (continued)

a. Create a SimXpert analysis file for MD Nastran

Create SimXpert Analysis File (continued)

a. Create a SimXpert analysis file for MD Nastran

Create SimXpert Analysis File (continued)

a. Create a SimXpert analysis file for MD Nastran

Create SimXpert Analysis File (continued)

a. Create a SimXpert analysis file for MD Nastran

Create SimXpert Analysis File (continued)

a. Create a SimXpert analysis file for MD Nastran

Create SimXpert Analysis File (continued)

a. Create a SimXpert analysis file for MD Nastran