IRLZ44S, SiHLZ44S

Vishay Siliconix

Power MOSFET
PRODUCT SUMMARY
VDS (V) RDS(on) () Qg (Max.) (nC) Qgs (nC) Qgd (nC) Configuration VGS = 5.0 V 66 12 43 Single
D

60 0.028

Halogen-free According to IEC 61249-2-21 Definition Surface Mount Available in Tape and Reel Dynamic dV/dt Rating Logic-Level Gate Drive RDS(on) Specified at VGS = 4 V and 5 V 175 C Operating Temperature Fast Switching Compliant to RoHS Directive 2002/95/EC

FEATURES

DESCRIPTION

D2PAK (TO-263)

G D S

S N-Channel MOSFET

Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK (TO-263) is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.
D2PAK (TO-263) SiHLZ44STRR-GE3a IRLZ44STRRPbFa SiHLZ44STR-E3a

ORDERING INFORMATION
Package Lead (Pb)-free and Halogen-free Lead (Pb)-free Note a. See device orientation. D2PAK (TO-263) SiHLZ44S-GE3 IRLZ44SPbF SiHLZ44S-E3

ABSOLUTE MAXIMUM RATINGS (TC = 25 C, unless otherwise noted)

PARAMETER Drain-Source Voltage Gate-Source Voltage SYMBOL VDS VGS LIMIT 60 10 50 36 200 1.0 0.025 400 150 3.7 4.5 - 55 to + 175 300d UNIT V

TC = 25 C Continuous Drain Currentf VGS at 5.0 V ID TC = 100 C Continuous Drain Current a IDM Pulsed Drain Current Linear Derating Factor Linear Derating Factor (PCB Mount)e EAS Single Pulse Avalanche Energyb Maximum Power Dissipation TC = 25 C PD TA = 25 C Maximum Power Dissipation (PCB Mount)e c dV/dt Peak Diode Recovery dV/dt Operating Junction and Storage Temperature Range TJ, Tstg for 10 s Soldering Recommendations (Peak Temperature)d Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. VDD = 25 V, starting TJ = 25 C, L = 179 H, Rg = 25 , IAS = 51 A (see fig. 12). c. ISD 51 A, dI/dt 250 A/s, VDD VDS, TJ 175 C. d. 1.6 mm from case. e. When mounted on 1" square PCB (FR-4 or G-10 material). f. Current limited by the package, (die current = 51 A).

W/C mJ W V/ns C

* Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 91329 S11-1055-Rev. C, 30-May-11 www.vishay.com 1

This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRLZ44S, SiHLZ44S
Vishay Siliconix

THERMAL RESISTANCE RATINGS

PARAMETER Maximum Junction-to-Ambient Maximum Junction-to-Ambient (PCB Mount)a Maximum Junction-to-Case (Drain) SYMBOL RthJA RthJA RthJC TYP. MAX. 62 40 1.0 C/W UNIT

Note a. When mounted on 1" square PCB (FR-4 or G-10 material).

SPECIFICATIONS (TJ = 25 C, unless otherwise noted)

PARAMETER Static Drain-Source Breakdown Voltage VDS Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current VDS VDS/TJ VGS(th) IGSS IDSS RDS(on) gfs Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf LD LS Between lead, 6 mm (0.25") from package and center of die contact
D

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNIT

VGS = 0, ID = 250 A Reference to 25 C, ID = 1 mA VDS = VGS, ID = 250 A VGS = 10 V VDS = 60 V, VGS = 0 V VDS = 48 V, VGS = 0 V, TJ = 150 C VGS = 5.0 V VGS = 4.0 V ID = 31 Ab ID = 25 Ab

60 1.0 23

0.070 -

2.0 100 25 250 0.028 0.039 -

V V/C V nA A

Drain-Source On-State Resistance Forward Transconductance Dynamic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance Internal Source Inductance Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulsed Diode Forward Currenta Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Forward Turn-On Time

VDS = 25 V, ID = 31 Ab

VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5

3300 1200 200 17 230 42 110 4.5 7.5

66 12 43 nH ns nC pF

VGS = 5.0 V

ID = 51 A, VDS = 48 V, see fig. 6 and 13b

VDD = 30 V, ID = 51 A, Rg = 4.6 , RD = 0.56 , see fig. 10b

IS ISM VSD trr Qrr ton

MOSFET symbol showing the integral reverse p - n junction diode

130 0.84

50c A 200 2.5 180 1.3 V ns C

TJ = 25 C, IS = 51 A, VGS = 0

Vb

TJ = 25 C, IF = 51 A, dI/dt = 100 A/sb

Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)

Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width 300 s; duty cycle 2 %. c. Current limited by the package, (Die Current = 51 A). www.vishay.com 2 Document Number: 91329 S11-1055-Rev. C, 30-May-11

This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRLZ44S, SiHLZ44S
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 C, unless otherwise noted)

Fig. 1 - Typical Output Characteristics, TC = 25 C

Fig. 3 - Typical Transfer Characteristics

Fig. 2 - Typical Output Characteristics, TC = 150 C

Fig. 4 - Normalized On-Resistance vs. Temperature

Document Number: 91329 S11-1055-Rev. C, 30-May-11

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This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRLZ44S, SiHLZ44S
Vishay Siliconix

Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage

Fig. 7 - Typical Source-Drain Diode Forward Voltage

Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage

Fig. 8 - Maximum Safe Operating Area

www.vishay.com 4

Document Number: 91329 S11-1055-Rev. C, 30-May-11

This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRLZ44S, SiHLZ44S
Vishay Siliconix

VDS VGS Rg

RD

D.U.T. + - VDD

5V
Pulse width 1 s Duty factor 0.1 %

Fig. 10a - Switching Time Test Circuit

VDS 90 %

10 % VGS td(on) tr td(off) tf

Fig. 9 - Maximum Drain Current vs. Case Temperature

Fig. 10b - Switching Time Waveforms

Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case

Document Number: 91329 S11-1055-Rev. C, 30-May-11

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IRLZ44S, SiHLZ44S
Vishay Siliconix

L Vary tp to obtain required IAS Rg VDS tp VDD D.U.T. I AS 5V tp 0.01 IAS + V DD VDS VDS

Fig. 12a - Unclamped Inductive Test Circuit

Fig. 12b - Unclamped Inductive Waveforms

Fig. 12c - Maximum Avalanche Energy vs. Drain Current

Current regulator Same type as D.U.T.

50 k 12 V 0.2 F 0.3 F

QG 5V QGS QGD

D.U.T.

VDS

VG

VGS
3 mA

Charge
IG ID Current sampling resistors

Fig. 13a - Basic Gate Charge Waveform www.vishay.com 6

Fig. 13b - Gate Charge Test Circuit Document Number: 91329 S11-1055-Rev. C, 30-May-11

This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRLZ44S, SiHLZ44S
Vishay Siliconix

Peak Diode Recovery dV/dt Test Circuit

+ Circuit layout considerations Low stray inductance Ground plane Low leakage inductance current transformer

D.U.T.

Rg

dV/dt controlled by Rg Driver same type as D.U.T. ISD controlled by duty factor D D.U.T. - device under test

+ VDD

Driver gate drive P.W. Period D= P.W. Period VGS = 10 Va

D.U.T. lSD waveform Reverse recovery current

Body diode forward current dI/dt D.U.T. VDS waveform Diode recovery dV/dt

VDD

Re-applied voltage Inductor current

Body diode forward drop

Ripple 5 % Note a. VGS = 5 V for logic level devices

ISD

Fig. 14 - For N-Channel

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91329.

Document Number: 91329 S11-1055-Rev. C, 30-May-11

www.vishay.com 7

This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

AN826
Vishay Siliconix

RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead

0.420 (10.668)

(16.129)

0.635

0.145 (3.683)

0.135 (3.429)

0.200 (5.080)

0.050 (1.257)

Recommended Minimum Pads Dimensions in Inches/(mm)

Return to Index

Document Number: 73397 11-Apr-05

(9.017)

0.355

www.vishay.com

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Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishays knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customers responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customers technical experts. Product specifications do not expand or otherwise modify Vishays terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.

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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.

Revision: 12-Mar-12

Document Number: 91000