Cbga Assy Rework

CBGA Surface Mount Assembly and Rework Users Guide
May 23, 2002
Copyright International Business Machines Corporation 2002.

Copyright and Disclaimer
All Rights Reserved Printed in the United States of America May 23, 2002. The following are trademarks of International Business Machines Corporation in the United States, or other countries, or both: IBM IBM Logo Other company, product and service names may be trademarks or service marks of others. All information contained in this document is subject to change without notice. The products described in this document are NOT intended for use in implantation or other life support, space, nuclear, or military applications where malfunction may result in injury or death to persons. The information contained in this document does not affect or change IBM product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of IBM or third parties. All information contained in this document was obtained in specific environments, and is presented as an illustration. The results obtained in other operating environments may vary. THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN AS IS BASIS. In no event will IBM be liable for damages arising directly or indirectly from any use of the information contained in this document. IBM Microelectronics Division 1580 Route 52, Bldg. 504 Hopewell Junction, NY 12533-6351 The IBM home page can be found at http://www.ibm.com The IBM Microelectronics Division home page can be found at http://www.chips.ibm.com CBGA Surface Mount Assembly and Rework Users Guide May 23, 2002
Contents
Figures .......................................................................................................................................... 7 1. Introduction .............................................................................................................................. 9 2. Assembly ................................................................................................................................ 11
2.1 Package Description ....................................................................................................................... 2.2 Card Considerations ....................................................................................................................... 2.2.1 Card Pad Design ................................................................................................................... 2.2.2 Card Warping ........................................................................................................................ 2.2.3 Other Card Considerations .................................................................................................... 2.2.3.1 Component Compatibility ............................................................................................... 2.2.3.2 Tented Vias .................................................................................................................... 2.2.3.3 Card Quality ................................................................................................................... 2.3 General SMT Process ..................................................................................................................... 2.4 Solder-Paste Screening .................................................................................................................. 2.4.1 Paste ..................................................................................................................................... 2.4.2 Print Requirements ................................................................................................................ 2.4.2.1 1.27 mm Pitch CBGA ..................................................................................................... 2.4.2.2 1.00 mm Pitch CBGA ..................................................................................................... 2.4.3 Process Controls ................................................................................................................... 2.4.4 Stencils .................................................................................................................................. 2.5 Print Inspection ............................................................................................................................... 2.6 Placement ....................................................................................................................................... 2.6.1 Accuracy ................................................................................................................................ 2.6.2 Placement Force ................................................................................................................... 2.6.3 Placement Techniques .......................................................................................................... 2.6.3.1 Body Recognition ........................................................................................................... 2.6.3.2 Mechanical Alignment .................................................................................................... 2.6.3.3 Visual Recognition .......................................................................................................... 2.6.3.4 Placement Accuracy ....................................................................................................... 2.7 Solder Reflow .................................................................................................................................. 2.7.1 Reflow Requirements ............................................................................................................ 2.7.2 Thermal Profiling ................................................................................................................... 2.7.3 Reflow Techniques ................................................................................................................ 2.8 Cleaning .......................................................................................................................................... 2.9 Wave Solder .................................................................................................................................... 2.9.1 Secondary Reflow ................................................................................................................. 2.9.2 Card Warping ........................................................................................................................ 2.10 Fixtures ......................................................................................................................................... 2.11 Assembly Inspection ..................................................................................................................... 2.12 Joint Reliability .............................................................................................................................. 2.12.1 Solder Fatigue ..................................................................................................................... 2.12.2 Design Variations ................................................................................................................ 2.12.2.1 Finite Element Model .................................................................................................... 2.12.2.2 Joint Standoff ............................................................................................................... 2.12.2.3 1.27 mm Pitch CBGA ................................................................................................... 11 12 12 13 14 14 14 14 15 17 17 17 17 18 18 18 19 20 20 22 22 22 22 23 23 24 24 25 26 28 28 28 28 29 30 30 30 33 33 33 34
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2.12.2.4 High-Performance Glass Ceramic ................................................................................ 2.12.2.5 1.00 mm Pitch CBGA ................................................................................................... 2.12.2.6 Double-Side CBGA ....................................................................................................... 2.12.2.7 Stress Database (DLA, 25 mm CBGA, 1.0 mm Pitch) ................................................. 2.13 Voids ............................................................................................................................................. 2.14 Assembly Summary ......................................................................................................................
41 41 43 44 49 50
3. Rework .................................................................................................................................... 51
3.1 Process Flow ................................................................................................................................... 3.2 Material Sets ................................................................................................................................... 3.3 Tooling Requirements ..................................................................................................................... 3.3.1 PCB Preheater ....................................................................................................................... 3.3.2 Nozzle Design ........................................................................................................................ 3.3.3 Thermal Profiling .................................................................................................................... 3.3.3.1 Method One .................................................................................................................... 3.3.3.2 Method Two .................................................................................................................... 3.3.3.3 Method Three ................................................................................................................. 3.3.4 Module Removal .................................................................................................................... 3.3.5 Site Dress .............................................................................................................................. 3.3.6 Solder Vacuum ...................................................................................................................... 3.3.7 Clean ...................................................................................................................................... 3.3.8 Solder Application .................................................................................................................. 3.3.8.1 Module Screening ........................................................................................................... 3.3.8.2 Site Screening ................................................................................................................ 3.3.8.3 Solder Preforms .............................................................................................................. 3.3.8.4 Solder Paste Dispense ................................................................................................... 3.3.9 Module Placement ................................................................................................................. 3.4 Module Reflow ................................................................................................................................. 3.5 Rework Inspection ........................................................................................................................... 3.6 1.00 mm Pitch CBGA Rework ......................................................................................................... 3.7 Forced Rework ................................................................................................................................ 3.7.1 NiAu Card Rework ................................................................................................................. 3.7.2 Double-Side Module Rework ................................................................................................. 3.7.3 Close-Proximity Module Rework ............................................................................................ 3.8 Summary ......................................................................................................................................... 51 52 52 53 53 54 54 55 55 55 56 56 57 58 58 60 60 61 61 62 64 64 65 65 65 65 66
4. Revision Log .......................................................................................................................... 67 Appendix A. References ........................................................................................................... 69 Appendix B. Glossary ............................................................................................................... 71 Appendix C. Test Vehicles ........................................................................................................ 73 Appendix D. Coffin-Manson Acceleration Factor ................................................................... 75
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Appendix E. Solder Reflow ....................................................................................................... 77

E.1 Alpha 1208 Paste ........................................................................................................................... 77 E.2 Kester R244 No-Clean Reflow Profile ............................................................................................ 77
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Figures
Figure 2-1. CBGA Cross Section .................................................................................................................. 12 Figure 2-2. Card Pad with Dogbone ............................................................................................................. 13 Figure 2-3. Rework Tooling Forbidden Zone ............................................................................................. 14 Figure 2-4. CBGA Process Flow .................................................................................................................. 15 Figure 2-5. Double-Sided CBGA Process Flow ............................................................................................ 16 Figure 2-6. Hybrid CBGA Process Flow ....................................................................................................... 16 Figure 2-7. Printed Solder-Paste Volume versus Aspect Ratio .................................................................... 19 Figure 2-8. Typical BGA Print ....................................................................................................................... 20 Figure 2-9. Placement Tolerances ............................................................................................................... 21 Figure 2-10. Tilted Module Experiment ........................................................................................................ 22 Figure 2-11. Mechanical Alignment Nests .................................................................................................... 23 Figure 2-12. Placement Accuracy ................................................................................................................ 24 Figure 2-13. Convection Oven Reflow and Thermal Mass Effects ............................................................... 25 Figure 2-14. 25 mm CBGA Thermal Profile in Convection Oven ................................................................. 26 Figure 2-15. 25 mm CBGA Thermal Profile in IR Oven ................................................................................ 27 Figure 2-16. Vapor-Phase Reflow Oven Thermal Profile ............................................................................. 27 Figure 2-17. 25 mm CBGA Aqueous Clean Profile ...................................................................................... 29 Figure 2-18. Outer Row Solder-Joint Visual Inspection (1.00 mm Pitch) ..................................................... 30 Figure 2-19. 25 mm CBGA Deformation at 100C ....................................................................................... 31 Figure 2-20. 32.5 mm CBGA Moire Interferometry Pattern ......................................................................... 31 Figure 2-21. Joint After 3000 Cycles 0 to 100C. ........................................................................................ 32 Figure 2-22. 25 mm CBGA Corner Joint Stress Distribution at 100C ......................................................... 33 Figure 2-23. Number of Cycles to Failure for Eutectic and 10/90 Sn/Pb Solder Balls .................................. 34 Figure 2-24. 32.5 mm ATC and SIR Test Vehicle Card Layout .................................................................... 35 Figure 2-25. 32.5 mm CBGA Module Site on Test Vehicle with DNP Rings ................................................ 35 Figure 2-26. Coffin-Manson Relationship Verified Using Two Test Conditions ............................................ 36 Figure 2-27. 32.5 mm CBGA Cycles-to-Fail for Various DNPs .................................................................... 38 Figure 2-28. 32.5 mm CBGA Cycles-to-Fail for Various Pad Sizes ............................................................. 38 Figure 2-29. 32.5 mm CBGA Cycles-to-Fail for Various Solder Volumes .................................................... 39 Figure 2-30. N50 and N5 for Solder-Paste Volume and Pad Size with Fixed DNP ...................................... 39 Figure 2-31. Small Fillet and Optimized Fillet ............................................................................................... 40 Figure 2-32. Simulated Cycles-to-Fail .......................................................................................................... 40 Figure 2-33. Test Card Layout ...................................................................................................................... 41 Figure 2-34. 1.00 mm Daisy Chain Ring Pattern Showing the Module and Card Wiring ............................. 42 Figure 2-35. Front and Back Solder Joint Structure ..................................................................................... 44 Figure 2-36. Direct Lid Attach CBGA ............................................................................................................ 45 Figure 2-37. Twelve-Zone Convection Furnace Reflow (Profile A) .............................................................. 47
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Figure 2-38. Ten-Zone Convection Furnace Reflow (Profile B) ....................................................................48 Figure 2-39. Z-Axis Cross Section of Voids in Eutectic Solder .....................................................................50 Figure 3-1. CBGA Rework Process Flow ......................................................................................................51 Figure 3-2. PCB Preheater for CBGA Rework ..............................................................................................53 Figure 3-3. Hot-Gas Rework Nozzle .............................................................................................................54 Figure 3-4. CBGA Solder Joints Simultaneously Reflowed at Removal .......................................................55 Figure 3-5. CBGA Balls Remaining on the PCB after Module Removal .......................................................56 Figure 3-6. CBGA Site-after-Site Dress Process ..........................................................................................57 Figure 3-7. CBGA Clamshell Screening Fixture ...........................................................................................58 Figure 3-8. Solder Paste Print onto CBGA Balls in a Clamshell Fixture .......................................................59 Figure 3-9. Schematic of Placement Tool Picking CBGA out of Screening Fixture ......................................61 Figure 3-10. Thermal Profile for 32.5 mm CBGA Rework Hot-Gas Reflow ..................................................63 Figure 3-11. Reworked CBGA Solder Joint Cross-Section ...........................................................................63
Figures
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1. Introduction
Ceramic ball grid array (CBGA) modules are high density, high-performance surface mount (SMT) packages. These packages differ from standard SMT packages, which use peripheral leads that are easy to inspect and touch-up. The use of a full or partial array of interconnections under the CBGA package body presents some design and process considerations. Because the ball array cannot be inspected, the design and assembly process must be understood and controlled to obtain the high yields and reliability characteristics that make CBGA packages attractive. All CBGA packages described in this users guide are IBM packages. The card assembly and rework process is an integral part of the evolution of package requirements. The objectives of the assembly and rework process are: Ensure that design and process requirements are compatible with standard SMT equipment Ensure that the design and process requirements are compatible with total assembly requirements, as driven by other product components Determine critical joint assembly requirements Determine critical assembly yield parameters Establish reliability database for second-level assembly Develop the rework process to help ensure high yields and reliability Document specifications for the assembly and rework processes as determined by the activities listed above The CBGA card assembly design and process factors that influence reliability and yields are summarized in this users guide, along with specific information related to successfully completing each process step. Using the process outlined here produces the required product reliability along with very high yields, typically 13 parts per million (ppm) per lead. CBGA reliability projections for specific applications are provided by IBM as part of the overall module design.
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Introduction
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2. Assembly
2.1 Package Description
IBM CBGA packages are very robust. Some of their characteristics are listed below: Lidless and direct lid attach (DLA) CBGA packages are not moisture sensitive; lidded CBGA packages are typically qualified to the JEDEC level 2 or 3 moisture-sensitivity specifications. CBGA package have a very long shelf life, while maintaining the solder balls ability to wet the surface to which it will be attached (wettability). The solder balls are not easily damaged, and as a result, are not overly sensitive to handling. The CBGA module is a multi layer ceramic product, and is available with or as: White and dark ceramic No lid (bare chips), DLA (a flat lid joined directly to the back side of the chip), or standard lid (a custom lid solution with a thermal compound inside) Ceramic thicknesses ranging from 1.4 mm to 4.2 mm Body sizes up to 33 mm Coplanarity: 0.15 mm (The distance from the worst-case ball to the coplanarity reference plane.) JEDEC-registered package [reference 1] Flip-chip C4 devices Multi-chip modules (MCMs), with discrete components as needed Custom ball grid array (BGA) depopulation 1.27 mm and 1.00 mm pitch grid array The interconnection is a high-melt 10/90 tin/lead (Sn/Pb) solder ball that is 0.89 mm (0.035 inches) in diameter for 1.27 mm pitch packages, or 0.80 mm (0.031 inches) in diameter for 1.00 mm pitch packages. The high-melt ball does not melt during card assembly, creating a predetermined standoff height of 0.89 mm or 0.80 mm for 1.27 mm pitch or 1.00 mm pitch packages, respectively. See Figure 2-1 on page 12. The interconnection is joined to the ceramic with eutectic solder. The package is mounted to the printed circuit board (PCB) with eutectic solder paste.
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Figure 2-1. CBGA Cross Section

Chip Ceramic Substrate
6/5 ppm/C
63/37 Sn/Pb Fillet Card/Board
10/90 Sn/Pb Ball 18 ppm/C
2.2 Card Considerations

CBGA packages are qualified for PCBs that have a coefficient of thermal expansion (CTE) less than or equal to 22 ppm/C. A typical PCB has a CTE of 1620 ppm/C. 2.2.1 Card Pad Design A CBGA module is mounted to a card using a dogbone pad design [reference 2]. Note the following design considerations: The solder dam between the landing pad and the via is required to prevent loss of solder paste to the via. The solder mask opening is larger than the copper pad. This prevents creation of a high-stress point in the eutectic solder due to solder-mask interference. The eutectic can make a smooth fillet to the highmelting point ball without any interference. The nominal pad diameter is at the top of the pad: For the 1.27 mm pitch CBGA, the nominal pad diameter is 0.72 mm (0.0285 inches). See Figure 2-2 on page 13. This parameter is critical for joint reliability. See Critical Reliability Parameters on page 36. For the 1.00 mm pitch CBGA, the nominal pad diameter is 0.68 mm (0.0275 inches). See Figure 2-2 on page 13. Reliability tests were performed on cards with pad sizes ranging from 0.025690.02746 inches. For the 1.27 mm pitch high-performance glass ceramic (HPGC) BGA, the optimum nominal pad diameter is 0.81 mm (0.032 inches) with a solder mask opening of 0.91 mm (0.036 inches). If the BGA array is depopulated, vias can be eliminated in the card, and the escape wiring can be optimized to reduce the number of signal layers required. However, if the vias are removed, consider wires entering the landing pads as potential high-stress points. To prevent these areas from becoming high-stress points, flare the lines under the procoat to mimic the dogbone lines, 0.30 mm (0.012 inches), as they join the landing pads.
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2.2.2 Card Warping PCB warping is a major contributor to SMT package z-axis tolerances, including quad flat packages (QFPs) as well as all BGA packages. In general, card-warping issues can be overcome by good paste print and inherent solder-ball movement during reflow. However, weigh the following design considerations to help prevent the local warping that can occur during assembly and rework processes: Use symmetrical card cross sections (especially important during reflow processes). Avoid using adjacent components that anchor the PCB, such as large pin-in-hole (PIH) connectors. Maximize assembly thermal-mass uniformity across the PCB. Consider card form factors; large, thin cards warp more readily than smaller, thicker cards, and might require fixtures. See Fixtures on page 29. Utilize a reliable PCB supplier to help ensure card flatness [reference 2] The card site for a 32.5 mm CBGA package has a typical flatness of 0.0250.076 mm (0.0010.003 inches), for example. Figure 2-2. Card Pad with Dogbone
Solder mask window (diameter a) Mounting pad (diameter b)2 Via solder mask window (diameter d) A Via (diameter e) 3 mm line h b diameter2 A 45 typical c diameter Solderable surface1
Section AA Feature a b c 1.27 mm Pitch 1.00 mm Pitch 0.851 mm 0.749 mm 0.72 mm 0.483 mm 0.305 mm 0.56 mm 0.635 mm 0.635 mm 0.8 mm 0.68 mm 0.68 mm 0.38 mm 0.20 mm 0.46 mm 0.50 mm 0.50 mm
Land (diameter f)
d g typical e f g h
All dimensions are in mm unless otherwise specified. Notes: 1. Functional surface 2. Nominal diameter at copper/FR4 interface with typical IBM manufacturing etch angle.
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2.2.3 Other Card Considerations 2.2.3.1 Component Compatibility Cards should be designed to be compatible with all the components that will be placed on the cards. For example, if a fine-pitch component and a CBGA are placed next to each other, is there a clearance area for a step-down stencil (reduction in thickness)? A 5.08 mm (0.200 inches) clearance around the BGA for rework tooling is required [reference 2], with the exception of discrete components. Discrete components require only a 2.54 mm (0.100 inches) spacing, assuming they can be manually replaced. See Figure 2-3. Figure 2-3. Rework Tooling Forbidden Zone
6.35 mm reference gridgrid 0.250
5.08 mm min 0.200
2.2.3.2 Tented Vias Tented or plugged vias that are filled or capped with solder-mask material can be used to help ensure that there is no solder loss from the landing pad to the via. However, there are several potential disadvantages to using tented vias: If only one side of the via is covered, it is more difficult to prevent flux materials and contaminants from being trapped in the via. If the back-side vias are covered, the modules cannot be tested through the back-side vias. However, creating a back-side dogbone pattern, in which the landing pad is used solely for test purposes, can circumvent this drawback. IBM does not use via tenting in the dogbone design. 2.2.3.3 Card Quality Monitor card quality, especially with respect to pad-solder wettability. When the pad solder does not properly wet the surface, creating a non-wet (solder open), rework is required. CBGA packages can be mounted to cards with organic, hot-air solder leveling (HASL), and nickel-gold (NiAu) coatings. Wettability issues can occur when surfaces are oxidized, when HASL surfaces are not uniform, or when low-quality NiAu is used. Higher card-pad quality can help increase process yields. Note: IBM generally uses Entek Cu-56 surfaces. Most of the IBM reliability testing has been performed on assemblies with Entek-coated copper pads.
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2.3 General SMT Process

CBGA packages are mounted to PCBs using standard SMT tools and processes [reference 4]. The process flow is shown in Figure 2-4. CBGA packages are compatible with both double-sided and hybrid circuits in which PIH components requiring wave solder are used. These two process flows are depicted in Figure 2-5 on page 16 and Figure 26 on page 16. A module should be tested, and reworked if necessary, prior to attaching a heat sink whenever possible. CBGA packages are placed on the top and bottom, front and back of a PCB using the process flow shown in Figure 2-5 on page 16. However, the screening fixture and the weight of the module must be taken into account to perform secondary reflow in an inverted position in the process. The maximum weight per lead for backside modules in reflow was experimentally determined to be 0.08 grams/lead. Although the solder-joint structure of back-side versus top-side modules is similar, reliability is reduced when modules are placed directly back-to-back with shared vias. See Double-Side CBGA on page 43. Figure 2-4. CBGA Process Flow
Process Step Description Raw Card Apply solder paste Water-soluble or no-clean eutectic Sn/Pb solder paste Cap MLC Eutectic Sn/Pb 10/90 Sn/Pb Ball
Place component
Reflow solder Clean flux Test card Rework component Attach heatsink
All eutectic reflows
Heatsink Heatsink adhesive
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Figure 2-5. Double-Sided CBGA Process Flow
Cards and Components
Clean (if required)
Backside Solder-Paste Application
Topside Solder-Paste Application
Solder-Paste Verification
Place Components (BGA, SMT, and PIH connectors)
Component Placement (BGA, SMT)
Clean
Reflow
Inspect
Figure 2-6. Hybrid CBGA Process Flow
Cards and Components
Clean (if required)
Topside Solder-Paste Application
Backside Adhesive Dispense
Solder-Paste Verification
Place Components and PIH Connectors
Component Placement (BGA, SMT)
Wave Solder
Reflow
Clean
Inspect
Assembly
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2.4 Solder-Paste Screening

Solder-paste deposition is the most critical process with respect to CBGA reliability. Attention to material, stencil, and print properties will help ensure a reliable package. 2.4.1 Paste CBGA packages do not require a special paste. However, when choosing a solder paste, consider the following points: The thermal mass must meet the recommended vendor profile. The paste must be suitable for all components; for example, a type 4 paste might be needed for fine-pitch components. Consistency between paste lots, and the way in which the paste prints is important, because CBGA reliability is dependant on proper solder deposition. Pastes more prone to fluxed-induced voids in the reflowed solder should be avoided, although small voids are not considered a reliability exposure. See Voids on page 49. A typical paste is eutectic solder (63/37 Sn/Pb), and 90% solder by weight, 50% solder by volume. IBM uses both type 3 and type 4 particle sizes. IBM has qualified no-clean and water-soluble pastes. Both pastes are used in high-volume CBGA production. 2.4.2 Print Requirements 2.4.2.1 1.27 mm Pitch CBGA IBM specifies the following solder-paste print characteristics for 1.27 mm pitch CBGA packages: A minimum paste volume of 0.089 cubic mm (4800 cubic mils). This reliability criteria is discussed in more detail in Critical Reliability Parameters on page 36. A maximum volume of 0.16 cubic mm (10,000 cubic mils). At this point, bridging occurs, because solder balls will float in the large area of molten solder and touch one another. The bridging does not occur along the card, only between the solder balls. A minimum print height of 0.018 mm (0.007 inches). This criteria is a z-axis requirement to prevent opens and facilitate higher yields. See Assembly Summary on page 50. The minimum becomes more critical as the package size increases. While a 21 mm package might be able to tolerate a slightly shorter print height, a 32.5 mm package is more susceptible to opens if this minimum requirement is violated. A print registration of 0.10 mm (0.004 inches), determined by tolerance analysis, including ball radial position and placement accuracy. An optimal solder-paste volume of 0.100.12 cubic mm (65007500 cubic mils) is recommended to help ensure reliability and to provide an optimal operating point. Typically, the solder-paste volume has standard deviation of approximately 710% in a good print.
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2.4.2.2 1.00 mm Pitch CBGA IBM specifies the following solder-paste print characteristics for 1.00 mm pitch CBGA packages: A minimum solder-paste volume of 0.038 cubic mm (2500 cubic mils). This reliability criteria is discussed in more detail in Critical Reliability Parameters on page 36. A maximum solder-paste volume of 0.07 cubic mm (4600 cubic mils). Solder bridging can occur at volumes greater than 4600 cubic mils when large quantities of cards are assembled, because there is a greater variability in paste-print quality and the card pad diameter. At lower quantities, which do not have this variability, a maximum solder-paste volume of 5500 cubic mils has been used with no occurrences of solder bridging. A minimum print height of 0.018 mm (0.007 inches). This criteria is a z-axis requirement to prevent opens and facilitate higher yields (see Assembly Summary on page 50). The minimum becomes more critical as the package size increases, as discussed in 1.27 mm Pitch CBGA on page 17. A print registration of 0.10 mm (0.004 inches), determined by tolerance analysis, including ball radial position and placement accuracy. An optimal solder-paste volume of 0.050.07 cubic mm (30004500 cubic mils) is recommended to help ensure reliability and to provide an optimal operating point. 2.4.3 Process Controls Implementing good process controls helps ensure robust CBGA yields and improve print quality for all SMT components. When CBGAs are included in an SMT line, stencil design and print monitoring are key considerations. 2.4.4 Stencils Good, repeatable printing using stainless-steel stencils with either chemical etch and electropolishing, or laser-cut fabrication. Typical stencil parameters are shown in Table 2-1. Table 2-1. Stencil Design
Stencil Thickness Ball Pitch mm 0.20 1.27 mm 0.075 0.20 1.00 mm 0.075 0.028 Note: BGA apertures are circular, with a 0.001-inch taper from top to bottom to facilitate paste release. 0.008 0.036 0.027 inch 0.008 mm 0.86 inch 0.035 Stencil Aperture
A stencil thickness of at least 0.007 inches is recommended to produce a 0.007 inch print height. This print height compensates for the z-tolerance total, consisting of module and card site coplanarity. Stencil step-downs (thickness reductions) are usually required to accommodate fine-pitch component requirements. The possible exception is for small CBGA packages where the z-axis tolerance might not be as severe, and a 0.150.18 mm (0.0060.007 inch) print height is acceptable. However, the solder-paste volume
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requirements still apply, and the aperture must be adjusted on the order of 0.91 mm (0.036 inches) for a 0.15 mm (0.006 inches) stencil. In cases like this, the print requirements are more critical in preventing bridging to vias. Stencil designs, driven by solder-paste volume requirements, result in screen printing on the solder mask to some extent. This has caused a small amount of solder balling in the materials IBM uses, because the overlap of the print on the procoat is only a few mils. In water-soluble processes, any solder balls are washed away anyway. The stencil aspect ratio (aperture/thickness) is an important design parameter. An aspect ratio of 4 produces an easy-to-print design. Aspect ratios of 3 or less result in printed solder-paste volumes significantly below the ideal. Tapered designs are recommended. Figure 2-7 depicts the percent of ideal volume as a function of aspect ratio for several different BGA stencils (none have tapered apertures). The ideal volume is defined as the volume filling the stencil aperture. Paste volume was measured automatically by the tool used. Note that the large aspect ratio provides volumes above the ideal; this is because the print is taller (0.025 mm typical) than the stencil. Figure 2-7. Printed Solder-Paste Volume versus Aspect Ratio
120
Percent Perfect Volume
100
80
60
4 Aspect Ratio
2.5 Print Inspection

IBM strongly recommends 100% visual inspection for gross defects, such as print misregistration and clogged stencil openings. Any defective print should be stripped, because these gross flaws can result in defects and rework. Solder-paste volume measurements should be implemented. Cost-effective measurement techniques are specific to each manufacturing line. Commercially available automated paste-measurement tools can highlight specific deposit defects based on height, area, or volume criteria. In addition, paste measurement tools are fast, can be used on a sampling basis or a total site, and provide statistical results that are vital to statistical process control (SPC) [reference 6].
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Manual methods, using z-axis scopes or manual laser-scanning microscopes, are a lower capital investment, but introduce the potential for more operator error. However, these manual methods have been acceptable in conjunction with SPC control techniques. SPC should account for the average solder volume and the standard deviation in print volume. The standard deviation indicates the likelihood of a poor print. Even though the average volume is good, a large standard deviation indicates poor process control and a potential for low reliability and yields. Figure 2-8. Typical BGA Print
2.6 Placement
2.6.1 Accuracy CBGA modules are very forgiving during placement. As long as the solder balls can touch solder paste, they will self align during reflow. The eutectic solder at both the module and card will reflow. This allows the highmelt solder ball to float, move up and down, rotate, and reach an equilibrium between the module and card pads, as driven by the surface tension of the molten solder. The CBGA modules self-aligning capability allows a placement specification for the center of the ball to be 0.28 mm (0.011 inches) from the center of the pad. This specification considers the tolerance of the paste print and ensures the balls are touching paste on the appropriate pad [reference 7]. See Figure 2-9 on page 21.
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Figure 2-9. Placement Tolerances

17.5 mil Solder Ball
Paste
Pad 3 mil 5 mil 3 mil 22 mil Note: Pad diameter is 28 mil; paste diameter is 30 mil, ball diameter is 35 mil, registration requirement is 11 mil.
Because of the closer proximity of the adjacent pads on a 1.00 mm CGBA module, there is a higher risk of solder bridging or actual module jumping to the next row when off-placement occurs. After testing the selfalignment capability of 1.00 mm pitch CBGA packages by placing solder balls 0.30 mm (0.012 inches) off the card-pad center, IBM determined that the best results are achieved when CBGA balls had 60% of the ball alignment on the card pad or in the solder-paste print. This can be observed by visual inspection after placement. Another IBM evaluation considered the solder-ball misregistration with respect to the module pad. In this study, the modules were purposely selected for the worst-case tilt, or misalignment on the module pad. The modules were deliberately misplaced using a split-optics tool, and then processed through solder reflow. Even using modules that grossly violated the radial-error specification, the module tendency to self-align was pronounced, and supported the placement specification criteria. Limited accelerated thermal cycling (ATC) testing on these modules, using crack propagation as the defect criteria, indicates that there is no difference between the highly-tilted versus no-tilt modules with respect to alignment after reflow. See Figure 2-10 on page 22.
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Figure 2-10. Tilted Module Experiment

Nominal Ball Tilted Ball
Tilt
Placement
With Final
Against
Positive
Negative
2.6.2 Placement Force Several independent IBM experiments concluded that placement force is not a significant variable with respect to package performance. For the range of placement forces studied (0.55.4 pounds for 32 mm modules), paste displacement due to solder balls is independent of the placement force. Typical placement force is 1.04.0 pounds. Based on these experiments, placement force at the first pass and rework process steps is not a critical process control. 2.6.3 Placement Techniques Proper tooling does not need to be expensive to ensure reliable and repeatable placement. The placement techniques described in the following paragraphs can be used to meet the specified placement accuracy. 2.6.3.1 Body Recognition For small packages, the centroid of the package can be defined from the body outline. This body recognition technique is similar to the plastic-leaded chip carrier (PLCC) recognition method. The body recognition technique is limited to the maximum field-of-view of the tools camera and registration of the ball array to the package outline. However, for small packages, this technique is adequate despite these limitations. 2.6.3.2 Mechanical Alignment A second placement technique is mechanical alignment to the solder-ball array. This technique calculates the centroid of the package using the array instead of the package body to accurately place the part. Global or local reference points are commonly used to define the module site on the PCB. The mechanical alignment technique is very repeatable and independent of ceramic type (white or dark).
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The mechanical alignment is generally a two-step placement technique. Modules are picked from the tray feeder or stacker and placed in the mechanical alignment nest [reference 11]. The part is adjusted within the nest and then picked and placed on the card. Mechanical nest examples are shown in Figure 2-11. Figure 2-11. Mechanical Alignment Nests
2.6.3.3 Visual Recognition Visual recognition provides the fastest placement of the three techniques described here. This technique uses a camera to view the solder balls directly. One of the advantages of using this technique is that the placement tool can reject any parts that do not meet the component definition (for example, a missing solder ball). However, the lighting contrast between the solder and white ceramic can be difficult to tune, and the placement tool might fail to recognize packages and reject them erroneously. The visual recognition technique can be sensitive to lot-to-lot product variations, including ceramic color and solder ball versus solder column parts. 2.6.3.4 Placement Accuracy Placement accuracy can be verified by placing double-sided stick tape on the card surface, seating the modules, inspecting peripheral rows, and then adjusting the tool-placement program until the modules are properly seated. This process is dependent on tool accuracy and component specifications. An experiment was conducted in which the card solder balls were inked and modules were then placed on the card. A comparator was used to measure the distance from the pad center to the ink dot. These studies used reasonable sample sizes as well as glass modules. Placement accuracy for one mechanical nest is illustrated in Figure 2-12 on page 24 [reference 5].
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Figure 2-12. Placement Accuracy
0.20 Relative Frequency 0.15 0.10 0.05 0.00
4 Off Nominal (mils)
2.7 Solder Reflow

2.7.1 Reflow Requirements Maintaining the solder reflow profile recommended by the paste supplier is important. IBM uses both no-clean and water-soluble paste. Example recommended reflow profile parameters are shown in Appendix E. Solder Reflow on page 77. The 220C peak temperature is driven by the requirement to limit the dissolution of lead from the high-melt ball to the eutectic solder. Too much lead increases the effective melting point of the cardside joint, and makes it much more difficult to remove the part if module rework is required. However, the ATC life is unaffected by increased lead dissolution [reference 11]. Cool-down rates and methods affect CBGA assembly yield and reliability. Typical convection ovens use either chilled-air or room-temperature air blown by fans inside the oven or at the oven exit to cool boards. Two conditions can be induced during board cooling: 1. Picking up the cards or opening the oven while solder joints are in a molten state can disturb the solder joints. This condition can be caused when the reflow oven is short (eight zones or less) and reflow occurs in the last oven zone. Cards should not be picked up until the solder joints have fully solidified. 2. Uneven cooling of top and bottom card surfaces causes card warping, potentially inducing balls to lift off pads. The amount of warping depends on the board layout and thickness. Uneven cooling can also cause column cracking in CCGA assembly. Both conditions can be prevented by using even top and bottom cooling, and ensuring that reflow occurs in the next-to-last oven zone.
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2.7.2 Thermal Profiling Thorough thermal profiling is required to establish proper reflow under the module (no cold solder joints) and to ensure that all solder joints meet profile specifications. The most accurate thermal profiling is achieved by placing the thermocouple directly in the solder-ball joint. Thermocouples can be placed in the solder-ball joint in the following ways: Drill from the back-side of the card to the ball joint and plug the hole with thermal epoxy. Place the thermocouple in the solder paste prior to module placement. Allowing the thermocouple to float next to the solder ball generates readings 23C too high for the first-pass assembly. This discrepancy can be larger in rework process steps, where local, not global, heating is used, depending on the thermal mass of the assembly. Strategic thermocouple placement can help ensure that the entire card assembly meets reflow specifications. Cards should be fully populated to reflect true thermal mass. Recommended placement considerations include the following factors: Center of module(s) Corner of module(s) Modules in high thermal-mass area, or brick-walled pattern PCB surface in sparce SMT area Card leading edge versus trailing edge Any moisture-sensitive component(s) with body-temperature limits CBGA reflow is very dependent on card cross-section, module design (ceramic thickness, color, lidless or capped, body size), oven type, and proximity to other components. Whenever possible, thermal profiles should be verified for each card part number, especially if there is a significant design variation; one profile does not fit all designs. Figure 2-13 shows a profile established for a 25 mm CBGA, and then used for different SMT components. The effect of thermal mass is very obvious. Figure 2-13. Convection Oven Reflow and Thermal Mass Effects
200 225 Dwell > 138C (seconds) 155 150 150 100 96 87 68 50 100 Dwell 208 Peak 195 193 250 200
50
0 SOJ2B 32.5 mm SBC 25 mm SBC 44 mm SCC
Peak Temperature (C)
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2.7.3 Reflow Techniques Solder reflow can be accomplished in convection, vapor-phase, and infrared (IR) ovens. Convection ovens are the type most widely used within IBM, and provide very uniform temperatures across a module. The temperature delta is typically 35C from the center to the edge of a 32.5 mm module with uniform ramp rates. IR ovens often provide less uniform heating, and are affected more by package emissivity and areas of large thermal mass. As a result, the module temperature from the center to the edge of the module is less uniform. For example, on one card design in which 50 CBGA modules created a very high thermal mass, the unpopulated area of the card had to be shielded in the IR oven to prevent laminate overheating. However, this does not preclude using IR ovens with CBGA modules; simply use caution to ensure that all assembly joints are within the appropriate reflow specification. Thermal profiles for 25 mm CBGA module in a convection and IR oven are shown in Figure 2-14 and Figure 2-15 on page 27, respectively. The profiles shown were established using the same high thermal-mass profile card. The peak profile trace is the card surface, and the other traces are for different CBGA module joints. Note that the IR profile is less uniform and has a longer dwell time above reflow for this particular card. Figure 2-14. 25 mm CBGA Thermal Profile in Convection Oven
267
183 Temperature (C)
99
15 -->
1 Sample 1 = 45
2 3 4 Sample 3 = 367 Sample 2 = 339 Sample 4 = 480
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Figure 2-15. 25 mm CBGA Thermal Profile in IR Oven

265
Temperature (C)
181
97
13 -->
1 Sample 1 = 45
3 4 Sample 3 = 367 Sample 4 = 480 Sample 2 = 339
The IR profile shown in Figure 2-15 includes an additional trace for the thermal grease under the CBGA cap. In this case, the peak temperature for the thermal grease is 152C. A study determined that the use of anodized aluminum caps increases heating rates in IR reflow ovens, and significantly improves module-temperature uniformity. Using the anodized aluminum caps is an example of package emissivity improving heating characteristics [reference 14]. Although anodized caps are not required in any application, understanding this concept could be beneficial in future packages. Similar results were observed with workboard holders (board fixtures) designed specifically to facilitate IR oven heat transfer. Vapor-phase ovens were used in early development work. In another study, a solder-joint reliability comparison using IR and vapor-phase reflow ovens found no ATC performance difference [reference 8]. A typical vapor-phase oven thermal profile is shown in Figure 2-16. Figure 2-16. Vapor-Phase Reflow Oven Thermal Profile
250 200 Temperature (C) 150 100 50 0 Centach VPS Fully-populated DSDP TC on SOT pad Conveyor = 30 fpm PH = 575F Preheat = 120C Rampdown = 0.70C/second Dwell at 183C = 74 seconds Peak = 218C
50
100 150 200 Time (seconds)
250
Note that IBMs 32.5 mm CBGA package technology qualification used a convection reflow oven. IBM typically uses nitrogen atmospheres to facilitate good solder wetting and proper fillet formation. Choosing air or nitrogen atmospheres is specific to manufacturing philosophy, paste and solder mask choices, and so on.
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2.8 Cleaning
IBM uses the Electrovert DI cleaner to clean under the 32 mm CBGA packages. Cleaning is strongly dependent on the flux materials to be removed. Cleanliness was verified by surface-insulation resistance (SIR) test results in which there where no fails [references 13 and 14]. See Figure 2-17 on page 29 for a typical clean profile through IBMs assembly process development (APD) line Electrovert DI cleaner. Drying temperatures have been increased to 175C (350F) for CBGA products in APDs lab without detrimental effects on other SMT components. Optimizing cleaning and drying parameters are manufacturer-specific. Assume that some fine tuning is required, and that standard SMT parameters might not be sufficient.
2.9 Wave Solder

CBGA modules are often used in conjunction with PIH components requiring wave solder. The following paragraphs describe some wave-solder considerations. 2.9.1 Secondary Reflow If vias are not tented, the wave-solder molten solder can rise through the vias, transferring heat to BGA sites. The wave solder rarely fills all vias or causes the BGA sites to reach a molten state (secondary reflow). It is important to profile cards in the wave solder to determine if secondary reflow is occurring, especially when using thin cards or very thin modules. This secondary reflow can cause joint cracks. The reflow can be prevented by taping the back of the vias with polyimide tape or by using other shielding methods. BGA reflow during wave solder is not a concern in most card designs, and special precautions are unnecessary. The 25 mm and 32 mm CBGA packages were both qualified on test vehicles that incorporated functional card features, and did not require any wave-solder protection. 2.9.2 Card Warping Certain card designs might require fixtures or support to prevent severe warping as the card passes over the wave solder. Severe card warping can cause joint cracks.
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Figure 2-17. 25 mm CBGA Aqueous Clean Profile

120 Panel Leading Edge SOIC Lead SBC Edge max = 106.9C max = 102.3C max = 77.2C Panel Back Side max = 112.2C 80 Temperature (C) Panel Trailing Edge max = 100.6C
100
60
40
20 PW 0 0 100 SMT1 200 SMT2 PRR FR DIRD1 DIRD2 400 500
Water temp = 160 5C Conveyor speed = 5.0 fpm Dryer heaters = 375 4C
300 Time (seconds)
Severe warping seldom occurs, but can be influenced by several factors, including card thickness, card size, and module location relative to PIH components. PIH components can stabilize areas of the card and create severe local warping. However, most card designs are unaffected by warping during wave solder and do not require any special precautions.
2.10 Fixtures
In general, CBGA assemblies do not require special fixtures through the assembly process. However, fixtures might be required in the following circumstances: To nest back-side modules while the front side of the card is being screened in a double-side process. To prevent severe warping across the wave solder (see Card Warping on page 13), and to protect backside BGA modules, if required. To prevent handling damage as parts proceed through the line if the cards are thin and prone to bending, especially when being removed from reflow ovens. As a manufacturing preference to standardize panel sizes with workboard holders. Fixtures typically consist of a simple frame with several support bars across the bottom of the frame. Fixtures can also be designed to enhance thermal characteristics, as described in Reflow Requirements on page 24. Note: Card assemblies are tested using torque testing at 0.024/mm (0.6/inch) for 25 cycles to ensure that all components can tolerate typical handling through card assembly, test, and next-level assembly. If the cards cannot withstand this torque testing, fixtures are recommended.
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2.11 Assembly Inspection

Visual inspection of all BGA joints is impossible for area-array products. However, a well-controlled SMT manufacturing line has such a low level of CBGA assembly defects that even if a 100% visual inspection were possible, it is likely that only a sampling inspection plan would be used. Outer-row inspection can be used to check for solder wetting, fillet size, and self-aligning. Proper oven profiling and solder paste control help ensure good joint formation under the module. An ideal CBGA solder joint is characterized by a smooth transition between the CBGA ball and the edge of the solder, indicating positive solder wetting. The solder is smooth and shiny, filling the area under the ball completely. See Figure 2-18. Figure 2-18. Outer Row Solder-Joint Visual Inspection (1.00 mm Pitch)
Transmission X-ray can be used to identify solder bridges (an extremely low-level defect) or to track product through line ramp-up. X-ray laminography is more sophisticated, and can also be used to detect opens [reference 6]. However, both techniques are expensive, and are not necessary for high-volume CBGA manufacturing. These techniques are often used on a sampling or maverick lot basis, such as a card solderability problem. Electrical or in-circuit test can be used to detect assembly defects as well as module fails. In summary, good process control is required to achieve high product yield and reliability in the absence of 100% visual inspection.
2.12 Joint Reliability

2.12.1 Solder Fatigue The reliability of solder-ball connections is driven by the CTE mismatch between the ceramic (67 ppm/C) and the epoxy-glass PCB (1721 ppm/C) [reference 19]. The stresses in the solder joints are highest at the corners of the ceramic, or at the greatest distance from the neutral point (DNP), and decrease towards the neutral point (typically, the module center), where the stresses are essentially zero. See Figure 2-19 on page 31, which shows displacement modeling for a quadrant of a 25 mm CBGA package. The strain increase is depicted in Figure 2-20 on page 31.
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Figure 2-19. 25 mm CBGA Deformation at 100C

Net shear displacement (MI)
Y di m
0.4 0.3 0.2 0.1 0.0

.f
0.4 ro 0.3 m ce 0. 2 nt ro 0.1 id 0.0 0. 0 (i n )
0.4 0.3 0.2 0.1 id ntro (in) X dim. from ce
Figure 2-20. 32.5 mm CBGA Moire Interferometry Pattern

U Field U Displacement Displacement Field
V Displacement Displacement Field V Field
-9 -9 -8 -8 -7 -7 -6 -6 -5 -5 -4 -4 -3 -3 -2 -2 -1 -1 0 0 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 Solder Ball BallIndex, Index,nn Solder
In Figure 2-20, Moire interferometry is used to measure the displacement of the CBGA joints as the product goes through a thermal cycle. A reference pattern is placed on the module, and the displacement of this pattern is measured during heating. Note that the pattern at the center of the module is essentially undisturbed while the displacement increases dramatically further from the center, and reaches a maximum at the corner joints. The displacement can be used to calculate strain in the joints. Solder joints from a 32.5 mm module, cycled over 3,000 cycles, are shown in Figure 2-21 on page 32. The two joints are from the same module; the highly-fatigued joint is located at the highest DNP (corner), while the unaffected joint is from the center of the module, where the stresses are extremely low.
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Figure 2-21. Joint After 3000 Cycles 0 to 100C. (Top image shows corner joint. Bottom image shows neutral point
joint.)
Because CBGA solder-joint reliability is dependent on the solder ball location within the array, the failure rate of any specific design is a function of the I/O assignment within the array. In most cases, for large-body packages, redundant power pins are relegated to the corner pins. Module layout should be completed in conjunction with IBM so that joint reliability is considered along with module performance. Thermal-cycle fatigue under accelerated testing (0 to 100C ATC) occurs through the eutectic fillets at the module and card joints. Highest strains occur on the outboard side of the module-side joint, and on the inboard side of the card-side joint. The first failure is usually on the card-side fillet. See Figure 2-21 and Figure 2-22 on page 33. The card-side joint should be optimized to maximize product reliability. High firstpass yields are a beneficial by-product of the higher reliability.
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Figure 2-22. 25 mm CBGA Corner Joint Stress Distribution at 100C

Critical Critical Region: Region: Outboard Outboard at at ceramic ceramic
Critical Region: Inboard at card
Solder fatigue is also a function of application conditions. Product-life predictions vary with application environments, and are provided by IBM. CBGA products have been qualified for a wide range of application conditions. 2.12.2 Design Variations 2.12.2.1 Finite Element Model The finite element model (FEM) was exercised to examine both geometry and material properties to promote sound package design. This model predicts the high strains at the corner joints, which in turn is verified by Moire interferometry measurements and ATC empirical data. The data from these three techniques can be used to develop a very robust design, one that can be easily evaluated for deviations; for example, changes in material or pad diameter. The FEM was used to evaluate alternate paste compositions, which could potentially change joint stiffness. The study concluded that the 10/90 Sn/Pb high-melt ball with eutectic solder joining the module and card provided the most robust design. 2.12.2.2 Joint Standoff CTE mismatch must be accommodated by the CBGA interconnection. Modeling shows that the higher the joint standoff, the greater the ability to accommodate the CTE mismatch. The 0.89 mm (0.035 inches) highmelt ball creates a standoff suitable for high reliability, while preventing the likelihood of shorting between the solder balls.
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Plastic ball grid array (PBGA) packages use eutectic solder, which provides a collapsible joint, similar to a C4. Studies [reference 9] have shown that the all-eutectic joint on the ceramic material have markedly less reliable performance than the IBM-qualified high-melt ball. The lack of a standoff when the eutectic ball collapses makes it difficult to accommodate CTE mismatch. When an artificial standoff is used to stretch the eutectic solder (preventing collapse and fixing the joints at 0.89 mm), the eutectic-joint reliability is very similar to highmelt solder ball reliability. See Figure 2-23. Reducing the standoff height is not recommended. However, an increase in standoff height could be beneficial with respect to reliability. Ceramic column grid array (CCGA) packages provide a solution. A tall, flexible, high-melt solder column is used instead of a solder ball in these packages, and can increase solder-joint reliability by 10x. These packages allow ceramic packages to be used for larger package-body sizes and in more aggressive application conditions. More information on CCGA assembly is available in the IBM Ceramic Column Grid Array Assembly and Rework Users Guide. 2.12.2.3 1.27 mm Pitch CBGA Test Vehicle Design Test hardware used for card-assembly development and reliability testing incorporates information from modeling and known product applications. Continuity rings are stitched in concentric circles at various DNP levels to collect test data as a function of location. Most CBGA reliability data was collected from test-card thicknesses of 1.4 mm (0.054 inches), 1.8 mm (0.072 inches), and 2.3 mm (0.090 inches). Although fourpoint readouts are available on some designs, most test vehicles are designed from both ATC and SIR testing. The process flows used include double-side surface mount with BGAs on the top side, double-side with CBGA on both sides, and a hybrid in which the BGA used must be compatible with wave-solder processing. Figure 2-23. Number of Cycles to Failure for Eutectic and 10/90 Sn/Pb Solder Balls
Test 0 to 100C, 3 cycles/hour 100 Ball Cumulative Fail (%) 80 60 40 20 0 34/24 pad ratio 4-point data 0 200 400 600 800 Cycles 1000 1200 1400 Group I 3/97 Sn/Pb Ball Group II 10/90 Sn/Pb Ball Eutectic without standoff Eutectic with standoff
One of the most widely-used CBGA test vehicles in IBM is the 32.5 mm CBGA test vehicle. See Figure 2-24 on page 35 and Figure 2-25 on page 35. This test vehicle includes: Six 32 mm CBGA modules. Each module has 625 I/Os (25 x 25 array on a 1.27 mm pitch). Twenty DNP stitch rings per module. ATC and SIR testing.
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A standard 1.8 mm card thickness. A 6S4P cross section. PIH connectors. SMT dummy components on both sides of the cards. For a listing of other available test vehicles, see Appendix C. Test Vehicles on page 73. Figure 2-24. 32.5 mm ATC and SIR Test Vehicle Card Layout
Figure 2-25. 32.5 mm CBGA Module Site on Test Vehicle with DNP Rings
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Stress Database The 1.27 mm pitch CBGA reliability databases include the information described in the following paragraphs. ATC (1.27 mm Pitch CBGA) Accelerated thermal cycling (0 to 100C and 20 to 80C) has been used for the majority of CBGA stressing [references 13 and 14]; two cycles/hour is typical. The cycle extremes were chosen to ensure that the failure mechanism occurring is the same as that occurring under field conditions. Because this is the case, the cycles-to-fail data can predict field life using the Coffin-Manson relationship. This relationship was verified by comparing the predicted acceleration factor to that obtained empirically between two test conditions. See Figure 2-26. The data shown in the figure fits a lognormal distribution characterized by the parameters mu and sigma ( and ). Coffin-Manson predicts a 3.2x acceleration factor between cycles-to-fail for the two test conditions; this prediction is supported by the empirical data using a 25 mm CBGA (see Appendix D. Coffin-Manson Acceleration Factor on page 75). A standard ship shock of 40 to 60C for 10 cycles is used to precondition all test hardware. CBGAs on the test vehicles are purposely cycled until they fail to obtain the data necessary for extrapolation using the Coffin-Manson relationship. These failures do not indicate low reliability; in fact, the ATC fatigue failures occur in a very predictable and repeatable manner, correlating to product design and the assembly process. This correlation indicates that assembly process controls help ensure highly reliable and predictable product. SIR (1.27 mm Pitch CBGA) Assemblies from both water-soluble and no-clean processes are routinely tested at 50C, 80% relative humidity (RH), and 15 V for at least 300 hours. No fails have occurred for the qualified materials (paste, solder mask) and cleaning processes. Figure 2-26. Coffin-Manson Relationship Verified Using Two Test Conditions
2 1 Cumulative Module Fails 0 (1) (2) (3) (4) 84.1% 50% 3.6x 15.9% 2.3% 0.14% 32 ppm 2.0 2.5 0 to 100C data, 80 modules 2.86x 3.0 Log Cycles 3.5 20 to 80C data, 40 modules 4.0
Critical Reliability Parameters As described in Finite Element Model on page 33, the FEM was used to evaluate variations in product design. The model predicts that pad size can significantly affect reliability.
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To verify this prediction, a 25 mm CBGA evaluation included pad sizes ranging from 0.610.71 mm (0.024 0.028 inches). The evaluation concluded that pad sizes less than 0.66 mm (0.026 inches) produced unsatisfactory product reliability. The study also included two solder-paste volumes, controlled by the stencil design and monitored by total paste weight. Although determining the solder-paste volume using these techniques is not as accurate as using solder-paste volume measurement tools (which were not available at the time of the study), there was an obvious relationship between solder volume and reliability. For example, a lower solder-paste volume reduces the number of cycles to failure (increases the cycle-to-fail sigma), which in turn increases the probability of early failures. A thorough evaluation of the solder-paste volume and pad sizes using a 32.5 mm ATC test vehicle [reference 11] was conducted. Earlier studies indicated that for small pad sizes, pad size was a more significant impact on reliability than solder-paste volume, but the evaluation for larger pad sizes was incomplete. The objectives of the evaluation for the larger pad sizes were to: Verify critical parameters, solder-paste volume, and pad size for the card joint Establish a predictive model for cycles-to-fail based on the critical parameter distributions Optimize the critical parameters within manufacturing-line constraints The evaluation design matrix is shown in Table 2-2 on page 37. Note that because it was difficult to obtain the entire range of solder-paste volumes on one stencil without using a step-down stencil, two stencils were used. The first stencil, used for the lower solder-paste volumes, was 0.20 mm (0.008 inches) thick. The second stencil, used for the higher solder-paste volumes, was 0.25 mm (0.010 inches) thick. The apertures in both stencils were 0.34 mm (0.025 inches), 0.76 mm (0.030 inches), and 0.89 mm (0.035 inches) in diameter to achieve the desired solder-paste volumes. Table 2-2. Critical Parameters Matrix
Printer Solder Volume (cubic mm) Pad Diameter (mm) Module Target 1 2 0.69 3 4 0.79 5 0.110 6 0.69 0.66 0.110 0.76 0.100 0.140 0.141 0.166 0.66 0.078 0.072 0.075 0.110 0.100 0.102 0.79 Actual 0.76 0.047 0.67 0.050 Target Stencil One Actual 0.049 Target Stencil Two Actual
The parts were cycled from 0 to 100C at 1.5 cycles/hour until enough failures occurred to make the analysis statistically valid. After cycling, the cycles-to-fail data for each DNP ring was fit to a lognormal distribution using the multiple-censored maximum likelihood analysis method. Typical lognormal probability plots are shown in Figure 2-27 on page 38 through Figure 2-29 on page 39. These plots also illustrate the relative effects of DNP, pad size, and solder-paste volume.
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Figure 2-27. 32.5 mm CBGA Cycles-to-Fail for Various DNPs

99 95 90 Cumulative Fails (%) 75 50 25 10 5 1 0.1 0.01 100 1000 ATC Cycles to Fail DNP = 21.6 mm DNP = 16.3 mm DNP = 15.5 mm 10000
Regression analysis was performed on the lognormal mu and sigma parameters. Models for the number of cycles to 50% fail (N50) and the number of cycles to 5% fail (N5) were derived using solder-paste volume, pad size, and DNP as independent variables. Figure 2-30 on page 39 shows three-dimensional surface plots predicting N50 and N5 for pad size and solder-paste volume at a fixed DNP. These plots illustrate that solderpaste volume is the most critical parameter. Figure 2-28. 32.5 mm CBGA Cycles-to-Fail for Various Pad Sizes
99 95 90 Cumulative Fails (%) 75 50 25 10 5 1 Small Pad (0.660 mm) Large Pad (0.762 mm) 1000 ATC Cycles to Fail 10000
0.1 0.01 100
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Figure 2-29. 32.5 mm CBGA Cycles-to-Fail for Various Solder Volumes

99 95 90 75 50 25 10 5 1 0.1 0.01 100 Low Solder Volume Medium Solder Volume High Solder Volume 1000 ATC Cycles to Fail 10000
Figure 2-30. N50 and N5 for Solder-Paste Volume and Pad Size with Fixed DNP
N50 Surface Plot 3000 Attached Cycles-to-Failure 2500 Attached Cycles-to-Failure 2000 1500 1000 500 3000 2500 2000 1500 1000 500 N5 Surface Plot
Cumulative Fails (%)
High .66 Medium (26) .71 .76 Lo w (28) (30) .81 (32) Pad Size Solder in mm (mils) Volume
High .66 Medium (26) .71 .76 Low (28) (30) .81 (32) Pad Size Solder in mm (mils) Volume
Increasing solder-paste volume increases reliability, but only to a point. When the paste volume passes 0.16 cubic mm (10,000 cubic mils), reliability no longer increases because the solder paste has filled the area between the ball and the card. Additional solder paste moves up the ball toward the module, making the ball look like a column. When the fillet dimension at the card surface is maximized, so is the reliability. See Figure 2-31 on page 40, in which small and maximized solder fillets are illustrated. The minimum fillet diameter specification is 0.61 mm (0.024 inches). This specification is met with a 56 sigma repeatability when the specified pad diameter and solder-paste volumes are used. Note that if the pad diameter increases, the required solder volume increases to prevent neck-down of the fillet as the solder wets the larger pad. The 0.16 mm solder-paste volume corresponds to the volume at which solder bridging can occur. See Print Requirements on page 17.
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The second-order polynomial regression models described on page 38 were constructed using average solder-paste volumes and pad diameters. These parameters vary in actual product. To reflect this variability in the N50 and N5 models, a Monte Carlo simulation was developed to predict ATC cycles-to-fail given solder volume distribution, pad diameter distribution, and DNP. Figure 2-31. Small Fillet and Optimized Fillet (Top image shows a small fillet. Bottom image shows an optimized
fillet.)
Figure 2-32 shows a sample output in which the pad-size distribution is the same for all three curves, but the solder-paste volume distribution is changed by altering the standard deviation of the distribution. A low solder-paste volume was used for demonstration. Note that a very high standard deviation, indicating poor print control, increases the probability of early fails. Figure 2-32. Simulated Cycles-to-Fail
99.99 98.99 99 95 90 75 50 25 10 5 1 0.1 0.01 0.001 0.0001 10 100 1000 Low Solder-Paste Volume Medium Solder-Paste Volume High Solder-Paste Volume
Cumulative % Fail
ATC Cycles-to-Fail
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2.12.2.4 High-Performance Glass Ceramic High-performance glass ceramic (HPGC) CBGA substrate material has a low dielectric constant and CTE match of the package to the device which allow for packaging large, high-power devices. Recently, HPGC has been assembled with standard CBGA assembly parameters and tested in the 32.5 mm package size. Testing of the package assembled on two card pad sizes, 28.5 mm and 32.0 mm, at 0/100C ATC, resulted in a higher fatigue life (N50) for the larger pad size: Table 2-3. Fatigue Life Test for TV738 CBGA
Card Pad 28.5 mm 32.0 mm N50 480 710
2.12.2.5 1.00 mm Pitch CBGA Test Vehicle Design A white ceramic 32.5 mm CBGA test vehicle with a 31 x 31 ball array pattern (937 I/Os) was developed to test the structure and processes for a 1.00 mm pitch CBGA package. Each of the four corners was depopulated by six balls, similar to the 1.00 mm pitch CCGA. The substrate thickness is 2.4 mm. IBM chose to use a 0.8 mm diameter solder ball for improved reliability over the 0.7 mm diameter solder ball that is specified by JEDEC in MO-156 and MO-157. Other physical dimensions contained in the JEDEC outline specifications are followed. The PCB ground rules and dogbone pad dimensions for this test card were the same as those optimized for the 1.00 mm pitch CCGA. (See Figure 2-2 on page 13.) The 6S4P (9 x 11 inches) test card included: Five sites for 1.00 mm pitch 32.5 mm CBGAs One control 1.27 mm pitch CBGA site See Figure 2-33. Figure 2-33. Test Card Layout
1.00 mm U3
1.00 mm U6
1.00 mm U2
1.27 mm U5
1.00 mm U1
1.00 mm U4
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Nine daisy chain rings were wired to connect the pairs of I/Os on the package with pairs of I/Os on this card. The outermost ring contained the I/Os on the diagonal of each corner. The other rings were design concentrically with similar DNP in each ring. See Figure 2-34. Figure 2-34. 1.00 mm Daisy Chain Ring Pattern Showing the Module and Card Wiring
A01
Stress Database The 1.00 mm pitch CBGA reliability databases include the information described in the following paragraphs. ATC Initial testing indicated that solder-paste volume affected fatigue life, so a qualification matrix was defined to further evaluate the effect of card-side solder-paste volume and to compare the 0.8 mm and 0.7 mm diameter assemblies. See Table 2-4 on page 43. Table 2-5 on page 43 shows the results of the 55 to 110C, 1 cycle-per-hour cell with lidded 0.8 mm diameter assemblies. The high solder-paste volume cell is statistically better than the medium solder-paste volume cell; however the higher solder-paste volume produced some solder bridging.
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Table 2-4. Assembly Card-Side Solder-Paste Volume Comparison (0.8 mm and 0.7 mm Diameter)
Solder-Side Pad/Ball Diameter Lid Shock and Vibration Preconditioning Ball Attach Process Card Attach Process Solder-paste Volume Thermal Cycle Stress Conditions Total Quantity Yes Yes Prime Prime 5500 cubic mils max 0 to 100C, 2 cycles/hour 140 0.8 mm/0.8 mm No No Rework Rework 4500 cubic mils max Yes Prime Prime 4000 cubic mils max 0 to 100C 40 0.7 mm/0.7 mm Yes No
55 to 110C,
1 cycle/hour 35
Table 2-5. Thermal Cycle Stress Results (32.5 mm, 55 to 110C)

Cell 1.27 mm Controls 1.0 mm, Medium Solder-Paste Volume 1.0 mm, High Solder-Paste Volume Quantity 7 10 25 First Fail (Cycles) 200 150 150 N50 (Cycles) 260 220 260 Sigma 0.18 0.13 0.18
SIR No IR fails were generated by the qualification matrix testing. Results are shown in Table 2-6. Table 2-6. Cycles-to-Fail Data, N50/Sigma
Solder-Side Pad/Diameter Lid Shock and Vibration Preconditioning Ball Attach Process Card Attach Process Solder-Paste Volume Temperature Humidity Bias Stress Conditions Duration Total Quantity Prime Prime 5500 cubic mils max 50C, 80% RH, 15 V bias 600 hours 30 0.8 mm/0.8 mm Yes No Rework
2.12.2.6 Double-Side CBGA Tests performed on CBGA modules placed on the front and back of PCBs included the following parameters: 32.5 mm CBGA placed on the front and back of a circuit test card, spaced apart 32.5 mm CBGA placed on the front and back of a circuit test card, directly back-to-back with shared vias 119 I/O SRAM CBGA placed on the front and back of a circuit test card, back-to-back with shared vias.
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The results of 32.5 mm CBGA stress testing are shown in Table 2-7. The calculated N50 for the shared-via module is lower than the N50 for the module without a module directly behind it. However, the modules that are spaced apart show little significant difference in cycles-to-fail to the modules placed front-to-back. In Figure 2-35, the front and back solder joints show little difference with respect to standoff, joint structure, and lead dissolution. The same trend was observed in smaller SRAM CBGA modules. IBM believes that the presence of a CBGA module directly opposite another on the other side of the card creates higher solder-joint stress during ATC cycling, and as a result, the number of cycles-to-fail is lower. Consequently, do not assume that modules placed back-to-back on a PCB will match the single-sided CBGA reliability. Table 2-7. Cycles-to-Fail Data, N50/Sigma
Card FR4 Thin Thick 32.5 mm CBGA 972 / .7895 719 / .8197 812 / .4980 32.5 mm CBGA Shared Via 497 / .3588 521 / .3185 433 / .2903
Figure 2-35. Front and Back Solder Joint Structure
2.12.2.7 Stress Database (DLA, 25 mm CBGA, 1.0 mm Pitch) The variables used for ATC testing on a 25 mm CBGA with a 1.0 mm pitch, 1.65 mm thick ceramic, and 552 solder balls included: Thermal cycle conditions DLA (in contrast to no lid) Anchoring effect of corner solder balls Ball-attach rework Card-assembly solder-paste volume Card-assembly reflow profile Card-assembly rework Comparison to 1.27 mm pitch 25 mm CBGA Comparison to 1.00 mm pitch 32.5 mm CBGA
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Thermal Cycle Conditions While most of the thermal cycling was performed at 0 to 100C at 2 cycles/hour, the thermal cycling on one cell was performed at 55 to 110C at 2 cycles/hour to compare the expectations based on the modified Coffin-Manson relationship. The modified Coffin-Manson relationship describes the solder-fatigue behavior, where Nf is the number of cycles-to-failure, A is a constant, is the strain per cycle, f is the frequency, k is the Boltzmanns constant in eV, and Tmax is the maximum temperature of the cycle in Kelvin. The equation is shown below:
Nf = ( A )
1.9
(f
13
)e
0.123 kT max
A simplified version of the modified Coffin-Manson equation was evaluated to compare the two stress conditions, with temperature as the only variable. The equation is shown below:
AF 1 2 = [ T 2 T 2 ]
1.9
1414 ( 1 T 1 1 T 2 )
The expected 2.9x difference in the number of cycles to 50% failure (N50) was similar to the actual difference of 3.4x. See Table 2-8. Table 2-8. N50 Results Comparing Thermal Cycle Conditions
55 to 110C N50 (Cycles) 540 0 to 100C N50 (Cycles) 1870 Actual Difference 3.4 Expected Difference 2.9
Direct Lid Attach versus No Lid A DLA CBGA module has a flat lid attached to the back of the chip (see Figure 2-36), and uses a siliconbased adhesive to provide a thermal path and add mechanical strength. The 25 mm CBGA test vehicle was designed with a dummy chip footprint to evaluate the effect of the DLA structure. Since the DLA lid does not contact the ceramic surface, but is joined only to the chip, the lid was not expected to cause the same stiffening effect and the decrease in fatigue life that a conventional lid can have on thin ceramic packages. The test results showed a 20% difference in fatigue life with a DLA N50 of 1870 cycles and a no lid N50 of 2240 cycles. Figure 2-36. Direct Lid Attach CBGA
Adhesive Aluminum Plate
Silicon Chip Ceramic Substrate
C4 Chip Interconnect
Epoxy Encapsulation
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Effect of Corner Solder Balls All 1.0 mm pitch CBGA modules are depopulated by six solder balls in each corner. The anchoring effect of populating these solder balls on the next lower DNP locations was evaluated as a comparison to the depopulated CBGA modules. The hypothesis was that the presence of the outer solder balls improves the fatigue life of the inner solder balls. This trend has been observed in area-array flip-chip fatigue testing. The test showed that the presence of the corner solder balls improves the fatigue life of the inner solder balls by approximately 25%. See Table 2-9. Table 2-9. Anchoring Effect Corner Solder Balls
Depopulated N50 (Cycles) 1870 With Corner Solder Balls N50 (Cycles) 2340 Actual Difference 1.25
Ball Attach Rework Studies show that CBGA packages having solder balls attached after the hot-oil bath removal process have equivalent reliability to those using the initial solder-ball attach process. Twelve CBGA test vehicles were subjected to two cycles through the ball removal and reattachment process The thermal cycle results on these packages were no different than the standard initial-join samples. Card Assembly Solder Volume Card-assembly solder-paste volume effects the CBGA fatigue life on both 1.27 mm pitch and 1.00 mm pitch packages [reference 1 and 2]. Because of the risk of solder-bridging at a higher solder-paste volume, the recommended maximum solder-paste volume for 1.0 mm pitch CBGA is limited to 4600 cubic mils. One group of packages was assembled to cards with a higher solder-paste volume of 5200 cubic mils. This higher solder-paste volume had resulted in better fatigue life results when testing the 32.5 mm, 1.0 mm pitch CBGA. The test vehicles that were joined with 5200 cubic mils of solder paste had a better fatigue life than those built with the standard 4600 cubic mils of solder paste. Parts assembled with a lower solder-paste volume had an N50 of 1870 cycles, while parts assembled with a higher solder-paste volume had an N50 of 2000 cycles. The improvement is less than 10%, where a similar solder-paste volume comparison study on the 32.5 mm, 1.0 mm pitch CBGAs showed an improvement range of 1520%. One explanation for the reduced effect of solder-paste volume is the relatively thin 25 mm substrate. This might be explained by the theory that not only do thin substrates have improved fatigue life, but they are also less sensitive to card-assembly variables. Card Assembly Reflow Profile Reflow profiles were developed in two convection furnaces, both with nitrogen atmosphere. Profile A used a 12-zone convection furnace, allowing for a longer reflow profile (see Figure 2-37 on page 47). Profile B used a 10-zone convection furnace with a faster time to reflow (see Figure 2-38 on page 48). The locations monitored during the furnace profiling were: 1.0 mm CBGA package outer row joint 1.0 mm CBGA package inner row joint Top card surfacecenter card position Bottom card surfacecenter card position
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Figure 2-37. Twelve-Zone Convection Furnace Reflow (Profile A)
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Figure 2-38. Ten-Zone Convection Furnace Reflow (Profile B)
The shorter reflow profile of the 10-zone furnace is expected to provide a more optimum time of flux activation for this particular solder paste. The longer time to reflow indicates a high flux consumption prior to liquidity, causing less-optimal coalescing of solder particles. Test cards going through thermal cycling and assembled using the shorter reflow profile (B) had a greater fatigue life (N50 = 2560), while test cards assembled using the longer reflow profile (A) resulted in a lower fatigue life (N50 = 1870). Card Assembly Rework Process Testing on 32.5 mm, 1.0 mm pitch CBGA packages mounted on cards using the card rework process showed that the reliability of these packages was equivalent to the CBGA packages mounted using the initial-join reflow process. The cards were subjected to two package removal cycles. The assemblies from the final package placement were then thermal cycled. There was no difference in the fatigue life of these samples when compared to those joined using the initial card assembly process. 25 mm CBGA, 1.27 mm Pitch Package Comparison The results for the 25 mm, 1.0 mm pitch CBGA package were compared to the established database for the 25 mm, 1.27 mm pitch CBGA package. The 1.27 mm pitch CBGA test vehicle was slightly thinner (0.8 mm), had no lid, and was populated the corner solder balls, resulting in a higher DNP. The test vehicles were mounted on a similar test card and thermal cycled. Modeling and experimental data suggests that the thinner ceramic should cause an increased fatigue life as compared to the 1.65 mm thick, 1.0 mm pitch test vehicle
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[reference 7]. Based on the Coffin-Manson relationship, the higher DNP of the 1.27 mm test vehicle should result in a decreased fatigue life. The combination of these factors predicts that the 1.27 mm pitch package would have 1.4x higher fatigue life than the 1.0 mm pitch test vehicle. Thermal cycling showed a 1.6x difference between the 1.27 mm pitch test vehicle and the 1.00 mm pitch test vehicle (see Table 2-10). Table 2-10. N50 Comparison, 25 mm CBGA, 1.00 mm and 1.27 mm Pitch (0 to 100C, 2 cycles/hour)
1.0 mm Pitch N50 (Cycles) 2240 1.27 mm Pitch N50 (Cycles) 3700 Actual Difference 1.65 Expected Difference 1.4
32.5 mm CBGA, 1.0 mm Pitch Package Comparison The thermal cycling results for the 25 mm CBGA, 1.0 mm pitch package were compared to the thermal cycle data for the 32.5 mm CBGA, 1.0 mm pitch package. The 32.5 mm package was predicted to have a shorter fatigue life, because of its larger DNP and thicker ceramic (2.4 mm). Considering these two factors, the 25 mm package should have a 2.4x longer fatigue life. The experimental results (on no lid packages in both cases) demonstrated a 3.1x longer fatigue life for the 25 mm CBGA package (see Table 2-11). Table 2-11. N50 Comparison: 25 mm and 32.5 mm CBGA, 1.0 mm Pitch (0 to 100C, 2 cycles/hour)
25 mm N50 (Cycles) 2240 32.5 mm N50 (cycles) 719 Actual Difference 3.1 Expected Difference 2.4
2.13 Voids
During the 32.5 mm CBGA qualification, solder voids in the solder joints were observed. It was initially believed that the 32.5 mm product had very small voids, or no voids at all. However, an investigation of the 25 mm product revealed similar voids. Voids range in size from 0.010.15 mm (0.00050.006 inches), with an average size of 0.05 mm (0.002 inches). Voids 0.08 mm (0.003 inches) and larger can be seen using x-rays. A more complete view of the voids can be obtained by a cross-section in the z-axis thorough the PCB, up through the eutectic at the card joint. The cross-section plane is very important, because voids can be missed if polishing stops too soon or overshoots into the high-melt ball (see Figure 2-39 on page 50). All SMT and BGA components have paste voids. The voids are caused by flux in the paste. IBM's evaluation of different reflow profiles and pastes (no-clean and water-soluble) showed that all of the pastes had similar void sizes and numbers with the exception of one paste that had more voids than the others. No combination of profiles or pastes completely eliminated the voids. While all reliability testing showed small voids in solder joints, the joints with voids, mapped using x-rays, showed that they behave similarly to void-free joints in stress tests.
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Figure 2-39. Z-Axis Cross Section of Voids in Eutectic Solder
Z-Axis Cross Section from Card Side
Solder Ball Connect

Z-Section from Card Side
Ball Ball
Voids Voids
mm Module Solder Paste Senju 201 Solder Paste Senju 201 32 32 mm Module
2.14 Assembly Summary

CBGA high I/O components are beneficial in the SMT process flow. The large 1.27 mm (0.050 inch) pitch is easy to screen and simple to place. Proper controls at paste printing and reflow must be implemented to help ensure defect-free product, because joints are inaccessible. If a defect is found, the BGA component must be removed and replaced (see Rework on page 51). Most of the rework in an efficient manufacturing line is driven by engineering changes or module electrical performance requirements versus CBGA assembly defects. A specification has been established for CBGA surface-mount assembly. Attention to critical parameters, good card quality, and process control can produce defect rates comparable to 3 ppm/lead.
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3. Rework
CBGA rework is substantially different than peripheral-leaded surface-mount component repair or rework. Because the CBGA interconnections are under the package and inaccessible, individual joint touch-up is impossible. CBGA modules have very high assembly yields. Assembly defects, at very low levels, include package misorientation, misregistration, general solderability, and solder bridging. Required rework is often caused by non-assembly factors, such as module electrical performance, component or chip upgrades, and engineering changes. The objective of the rework process is to create CBGA joints, that after one to two rework processes, are equivalent in reliability to joints at first-pass assembly. Consequently, many artificially forced reworks have been processed and stressed during CBGA qualification to determine the reliability of the reworked parts compared to first-pass assembly parts. It is important to understand the critical requirements of the initial assembly (see Assembly on page 11) because the same requirements are critical during rework. The most important factors are solder-paste volume, PCB planarity, and reflow profile control.
3.1 Process Flow

The CBGA rework process flow is shown in Figure 3-1 for both water-soluble and no-clean processing. Figure 3-1. CBGA Rework Process Flow
Site Thermal Profiling
Solder Application
Module Removal
Module Replacement
Site Dress and Touch-Up
Module Reflow
Inline Aqueous Clean (if water-soluble process)
Inline Aqueous Clean (if water-soluble process)
Inspection and Electrical Test
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3.2 Material Sets

Rework is qualified for both no-clean and water processes. The materials used for water-soluble process are: Alpha 1208 water-soluble solder paste flux for pad touch-up and manual site dress Alpha 1208 water-soluble solder paste The materials used for no-clean process are: Kester 244 no-clean solder paste flux for site dress and touch-up Kester 244 no-clean solder paste
3.3 Tooling Requirements

CBGA rework involves the following generalized equipment set: Hot-gas tool for module removal and reflow Hand-held solder vacuum for site dress (with an alternate) Stereomicroscope Inline aqueous cleaner if using a water-soluble process Laser profilometer, or equivalent, for measuring site warping Solder-paste screener and stencils to apply paste Module-screening fixture and base plate for screener Monocular scope or camera for screening operation alignment Weighing scale (400-gram capacity, 1-milligram resolution) Module placement tool The surface mount automated rework tool (SMART) is the machine used throughout the CBGA rework process development and qualification. Designed by IBM, the SMART capabilities include: Hot-gas heating Computer-controlled temperature profiles Calibrated vision system Automatic vacuum pick-up and component placement Menu-driven software control Complete PC data logging
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SMART incorporates the functions of the hot-gas, card-flattening, and module-placement tools shown in the tooling equipment list. The rework processes using these tools are described in Module Removal on page 55 through Rework Inspection on page 64. SMART is not required for the rework process. The process parameters are specified so that a comparable automated rework tools can provide the required heating profiles, placement accuracy, and other critical parameters. 3.3.1 PCB Preheater The key rework process variables are preheat temperature, peak joint temperature, and solder reflow time. To remove an area-array module, a hot-gas reflow tool with a bottom PCB heater (bias bay) is required. An example of a PCB heater is shown in Figure 3-2. Figure 3-2. PCB Preheater for CBGA Rework
The entire carrier is preheated between 75 to 125C prior to the application of hot gas from the top heater. The bias-bay heater allows for a back-side component standoff between the PCB and the heater surface. Preheating is a critical operation that minimizes PCB warping during removal, and limits the thermal shock to the PCB. The maximum preheat temperature is determined by the thermal expansion of the PCB. In order to maintain the integrity of the PCB laminate, the maximum preheat temperature is set approximately 10C below the glass transition temperature (Tg) of the PCB material. High Tg PCB laminate tolerates a higher preheat temperature, which aids the hot-gas reflow process by decreasing the additional thermal energy required for reflow. Higher preheat temperatures also minimize the thermal distortion and shock to the PCB. After the global-PCB preheat temperature is attained, the hot-gas top heater is used to remove the module. The module joints must be profiled to between 190 to 220C prior to applying the vacuum pick-up force to ensure that all joints are reflowed. Limit the adjacent CBGA module temperature to less than 150C (shielding might be required); limit adjacent heat-sensitive components to the specified temperature. Moisture-sensitive components require a bake-out of 24 hours at 125C prior to the rework hot-gas exposure. This baking gradually eliminates absorbed moisture and prevents the rapid moisture evaporation, which can lead to cracking or popcorning. 3.3.2 Nozzle Design IBM has experimented with different hot-gas nozzle designs to reflow the solder underneath the CBGA module. The nozzle design can tailor the gas flow. Traditionally, the hot gas is directed toward the solder to be reflowed, as is the case for a QFP, where the nozzle has four ducts (or vents) to direct the hot gas to the soldered leads.
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An area-array module is significantly different because its leads are shielded underneath the body of the component. The flow of gas can be deflected underneath the module, directed onto the top of the module, and conducted through the body to the joints underneath. Any attempt to deflect the gas flow underneath is affected by the heat-sinking capability of the module. The gas flow must exhaust on at least one side to minimize dead spots under the module. Directing the hot gas under the CBGA tends to create a non-uniform solder temperatures across the array pattern. An example of a floating or spring-loaded nozzle design commonly used in IBM is shown in Figure 3-3. The floating nozzle assists in preventing z-axis movement of the PCB during heating cycles. Figure 3-3. Hot-Gas Rework Nozzle
3.3.3 Thermal Profiling Thermal profiling is required for module removal, site flattening, and module reflow. Each CBGA site to be reworked on a specific PCB must be individually profiled, because of the heat-sinking variations of the PCB internal layers and adjacent components. The risk of exposure to over- or under-heating, lifted pads, and unreliable joints is minimized in this manner. After profiles for a specific PCB and site have been documented, the same parameters can be used for future rework, as long as the same hot-gas conditions are used. There are several ways to correctly build a profile PCB. No matter how the profile PCB is built, it is critical to have the thermocouple read the joint temperature. Thermocouples that are floating in air or attached to the PCB surface next to a joint might not provide accurate solder temperatures. 3.3.3.1 Method One Using a profile PCB, the recommended method for thermocouple1 placement is to remove the module of interest and attach the required thermocouples to the side of the CBGA ball. The thermocouple weld is attached with eutectic (63/37 Sn/Pb) solder, coated with a thermally-conductive epoxy, or both, to ensure thermal contact. The thermocouple wires are routed out from under the module between the balls. Stress relief is added to the path to limit the force on the tip of the thermocouple. After all the desired thermocouple wires are positioned, the module is hand-placed and reattached to the same site.
1.
A 0.08 mm/0.003 inch or 0.12 mm/0.005 inch insulated wire, Type K thermocouple.
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3.3.3.2 Method Two Drill through the backside of the profile PCB until the CBGA joint is exposed (PCB pad and eutectic Sn/Pb). Remove as little of PCB material as possible. IBM has successfully used drill-bit diameters between 0.40.5 mm (0.0150.20 inches). Place the thermocouple in the joint, and fill the drilled hole with a thermally-conductive epoxy. 3.3.3.3 Method Three If no dedicated thermal profile PCB is available, a 0.12 mm (0.005 inch) insulated thermocouple can be pushed under a CBGA module to approximate joint temperatures. Accurate temperatures are measured only toward the center of the CBGA component. The impinging hot gas directly affects thermocouple readings. However, this effect is limited to the outside rows of solder joints when using the hot-gas nozzles previously described. As a result, the center CBGA solder joints (which tend to be lower in temperature than the outside rows) are thermally profiled by pushing a thermocouple under the CBGA module to be reworked. The reflow profile must be established during the module removal operation using this method. When reflow profiling with a hot gas tool, monitor the following parameters: CBGA module center-joint temperature CBGA module edge-joint temperature Adjacent CBGA module nearest-joint temperature (if applicable) Adjacent component nearest-body temperature (if heat sensitive) PCB temperature (not directly affected by the hot gas from the upper heater). Shielding adjacent heat-sensitive components might be required. 3.3.4 Module Removal A hot-gas tool with vacuum pick-up is used to remove the CBGA module (see Figure 3-4). A full-carrier preheater is also required (see Figure 3-2 on page 53). The objective of this step is to remove the component while minimizing the impact to the PCB (that is, no lifted pads and minimal site warping). Figure 3-4. CBGA Solder Joints Simultaneously Reflowed at Removal
The process requirements for this operation include: Preheat the entire PCB between 75 to 125C. Establish a temperature greater than 190C in all joints. Limit the temperature to less than 220C in all joints, which limits Pb dissolution from 10/90 ball and aids in the subsequent module-reclamation process.
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Avoid smeared solder on the module bottom or edge to aid in module reclamation. Limit the effects on adjacent components by keeping their joint temperatures below 183C. 3.3.5 Site Dress After removing the CBGA, the module site on the PCB must be dressed. Since the high-melt balls are eutectically soldered to both the module and the PCB, some of the balls remain on the PCB after module removal. See Figure 3-5. The solder remaining on the PCB is non-uniform in both volume and composition. The volume varies due to how the molten solder separates between the ball and carrier-pad surfaces. The remaining solder composition varies due to the lead dissolution from the high-melt ball. This high-lead residue elevates the solder reflow temperature. At SMT reflow temperatures of 200220C, the high-lead-content solder can be sluggish, and impede the replacement CBGAs self alignment CBGA. Consequently, this high-lead-content solder is usually removed. Figure 3-5. CBGA Balls Remaining on the PCB after Module Removal
The process requirements for the site-dress operation include: Remove all high melt balls Remove high-lead solder residue Dress all pads 3.3.6 Solder Vacuum PCB copper dissolution and thermal warping must be minimized, so the primary site-dress method utilizes a hand-held solder-vacuum tool. Prior to manual site dress, the touch-up is applied using a brush or spray technique. Do not set the temperatures too high. High temperatures can create excessive growth and oxidation of intermetallics, which result in non-solderable surfaces. The temperature is limited by the maximum that the PCB material can withstand. For FR-4 material, the accepted maximum allowable temperature is 245C.
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Manual site dress entails a pad by pad removal of excessive solder and solder balls by using the solder vacuum. The resulting surface is similar to a HASL surface, with 0.120.025 mm (0.00050.001 inches) of remaining solder (see Figure 3-6). The process set points used in CBGA qualification include: Gas temperature: 370C Tip temperature: 260C Gas flow: 10 SCFH While the manual solder vacuum technique can be slow and tedious, it causes very little PCB warping, if any. Figure 3-6. CBGA Site-after-Site Dress Process
3.3.7 Clean If a water-soluble flux is used for site dress and touch-up, a cleaning operation in the inline aqueous cleaner is required. Cleaning parameters are the same as those used in the initial assembly.
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3.3.8 Solder Application Eutectic solder must be applied to either the PCB site or the CBGA module to attach the high-melt ball to the PCB. Solder paste is preferred over solid solder, because it provides a tack vehicle for CBGA placement, while also providing an excellent z-axis compensator to assist in minimizing warping and coplanarity concerns. As previously described, eutectic solder volume is critical to reliability. The same volume criteria that apply to initial assembly also apply to CBGA modules mounted using the rework process. There are several ways to apply the solder, including: Screen paste on the CBGA module Screen paste on the PCB site Solid preforms or decals Dispense paste on the PCB site
3.3.8.1 Module Screening Module screening is the solder application process that is qualified by IBM for CBGA modules. This application process was initially chosen because it is similar to the process used for placing the solder balls on the ceramic. In addition, if a poor print is the result, only the module is stripped, as opposed to the entire PCB if site screening is used. The module is placed into a specially-designed clamshell screening fixture (see Figure 3-7). Figure 3-7. CBGA Clamshell Screening Fixture
The clamshell screening fixture: Provides a CBGA location for screening Supports the stencil and holds the CBGA at a consistent height Provides a transport mechanism for the screened module Provides a CBGA location for placement
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The CBGA module is loaded in the clamshell screening fixture. By design, the high-melt solder balls protrude 0.0250.15 mm (0.0010.006 inches) through the cover plate. During screening, the cover plate supports the stencil while the solder paste is deposited on the top of each ball. There is a definite correlation between the cover-plate thickness and the resulting solder-paste volume for a given stencil thickness and aperture diameter. For a CBGA module having a ball diameter of 0.89 mm (0.035 inches), IBM used a cover-plate thickness between 0.740.86 mm (0.02960.034 inches). The thicker cover plate produces a higher solder-paste volume. As the cover plate thickness is reduced and allows the balls to protrude further above the top surface, the balls extend into the stencil aperture and reduce the applied solder-paste volume. Too much extension into the stencil eventually produces too little solderpaste volume. Conversely, if the cover plate thickness is increased so that the balls only protrude 0.025 mm, the maximum solder-paste volume is achieved. Increasing the cover-plate thickness beyond this point will recess the ball below the top surface of the cover plate, causing the entire cover-plate hole to fill with solder paste during the screening. During module removal, the paste remains clogged in the cover-plate holes. Back pressure (foam or leaf spring) is used to ensure the module is held tight in the fixture. The module is screened in this fixture, and not removed until it is picked from the clamshell and placed on the PCB. This minimizes handling damage to the printed paste (see Figure 3-8). The module is screened on a benchtop printer using a 0.25 mm (0.010 inch) thick stainless-steel stencil with 0.80 mm (0.032 inch) apertures. For solder volume control, the clamshell is weighed before and after screening. The weight of solder paste applied is a critical process control parameter. The required solder paste volumes per ball for CBGA rework is listed in Table 3-1. Figure 3-8. Solder Paste Print onto CBGA Balls in a Clamshell Fixture
Table 3-1. Module Rework Specifications Summary (1.27 mm Pitch)

Grid # 19 25 25 33 I/O 361 625 325 1089 Name 25 mm CBGA 32.5 mm CBGA 32.5 mm CBGA 44 mm CBGA End Stencil 8 x 34 mil 8 x 34 mil 8 x 25 mil 8 x 25.5 mil End Volume 7259 cu mil 7259 cu mil 3927 cu mil 4085 cu mil End Weight/Lead 0.330.688 mg 0.330.688 mg 0.2060.523 mg 0.2060.523 mg End Total Weight 110248 mg 210430 mg 129326 mg 224569 mg
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The following information should be considered when module screening: Alpha is 8890% metal loaded by weight Alpha volume reduction is 4850% respectively Kester 244 density is 4.2 g/cc or 14,529 cubic mil/mg Alpha 1208 density is 4.86 g/cc or 12,556 cubic mil/mg Solid solder density is 8.3 g/cc Screening reduction is 7080% 3 sigma range is 2540% The low end of the specification was determined by the minimum volume requirement for reliability. The high end was set to minimize the probability of solder bridging. Visually inspect print for uniformity, no paste on top of fixture, no balls with missing paste, and good alignment in the clamshell. Note that the module screening is highly dependent on visual controls and solder-paste weight. Skipping the required inspections might cause low solder-paste volumes. A summary of clamshell tooling dimensions is listed in Table 3-2. Table 3-2. Tooling Dimensions
Clamshell Stencil Side CBGA 32.5 mm CBGA 44 mm CBGA 42 mils 22.5 mils 28 mils Clamshell Module Side 42 mils 50 mils 45 mils Clamshell Thickness 29 mils 87 mils 87 mils Stencil 1032 822 825 Typical Solder Volume 6950 mil3 2790 mil3 5000 mil3
3.3.8.2 Site Screening Solder paste can also be added directly to the PCB site using a manual site-screening method. The advantages of this method are the elimination of the clamshell tooling and the ability to inspect and measure the solder deposits on the board (similar to initial assembly). The disadvantages are that there is limited room for local screening, poor print release when lifting the local site stencil, and the need to clean the entire PCB if the print has to be stripped. 3.3.8.3 Solder Preforms IBM has studied solder preform, in which a web of solid solder pads is placed with flux on the CBGA site. Initial tests show poor yields due to bridging, in which the web does not separate cleanly. The difficulty in uniform separation of the web, combined with tolerance challenges on the preform design, creates a tendency for poor solder-paste volume control on a per pad basis. In general, when the use of solder preform was investigated, the requirements for preform dimensions and performance could not be met.
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3.3.8.4 Solder Paste Dispense Solder paste is dispensed to each pad individually using a nozzle or syringe. This process requires specialized tooling and paste appropriate for dispense. The advantages are that the paste is applied with precision to each pad and deposits can be measured (similar to initial assembly) prior to module placement. The disadvantages are the need for special tooling, paste specific for dispensing, and the need to clean the entire PCB if the deposit has to be stripped. 3.3.9 Module Placement After the proper solder-paste volume has been applied, the CBGA module is accurately placed on the PCB pads. The most common rework method to place ball grid array components is a split-optics prism system. Using a prism, optical images of both the CBGA solder balls and the PCB pads are superimposed in a stereomicroscope field of view on a video monitor. The two images are manually aligned by X, Y, and theta (rotation) adjustments. Ball grid array modules larger than 25 mm require a split-mirror prism system that magnifies diagonally-opposite corner balls and pads for alignment. These systems are commercially available from several vendors. Other placement methods are also available, which use software-driven visionalignment systems. These systems tend to be more automated and more costly than the manual split-prism systems. If the solder paste is deposited on the PCB, the placement accuracy criteria is the same as that for initial assembly: 0.28 mm (0.011 inches) of the ball off the pad. If solder paste is applied to the module, as qualified by IBM for CBGA products, the placement process incorporates the clamshell screening fixtures. Because the module to be placed already has the solder paste aligned to the balls, the placement accuracy required for this method is less than 50% off the pad. Because the screening fixture is aligned to the CBGA module balls, this fixture is also used as a placement tool alignment nest (for IBMs internally-used system). The placement tool picks the module out of the fixture (by vacuum) from a known coordinate position (see Figure 3-9). In this manner, the placement tool accurately knows were the CBGA module balls are located. PCB alignment is automatically achieved by proper coordinate system calibration, with a final manual adjustment using the vision system. Figure 3-9. Schematic of Placement Tool Picking CBGA out of Screening Fixture
Vacuum Pick-up
Pliable Backer
Workboard Holder
When the solder paste is on the module, it is important to ensure that no paste is left behind in the clamshell prior to placing the module. In addition, the module paste must not contact any surface prior to placement. After module pick-up, but before placement, the clamshell should be inspected (with a stereomicroscope) for
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remaining solder paste. All fixture holes must have less than 1/3 of the circumference showing evidence of solder paste. The clamshell can be reweighed to determine if the paste weight removed with the clamshell lowers the remaining paste below the minimum requirement. The module should be placed with a force between 0.21.7 kg (0.54.0 lbs), such that the solder paste must contact 50% of the PCB pad and must not contact the vias. Placement accuracy should be tested using a setup PCB with double-stick tape applied to the CBGA site. The CBGA module is placed onto the site, firmly held in place, and examined on an angle under a stereomicroscope for accuracy.
3.4 Module Reflow

The applied eutectic solder must be reflowed to attach the CBGA to the PCB after module placement. Preheating the entire PCB to between 70C and 125C is critical to minimize the PCB distortion during the hot-gas heat cycle. The rework profile has the same limitations as the initial assembly phase (see Assembly on page 11). These limitations include: A peak joint temperature of 220C to minimize lead dissolution A minimum joint temperature of 200C to ensure proper wetting All solder joints in the 200 to 220C temperature range Dwell time above the reflow temperature meets paste manufacturer specifications During rework, take care to avoid damaging adjacent components (for example, moisture-sensitive packages that might require a pre-bake prior to hot-gas exposure) and overheating the CBGA thermal grease (capped packages). The thermal grease temperature limitations are: Peak temperature of 245C Total time above 220C of 8 minutes cumulative (to allow for 2x rework) Prior experimentation with thermocouples embedded in the CBGA thermal grease showed that under worstcase solder-joint conditions (220C for 150 seconds above reflow temperature), the peak thermal grease temperature reached 241C. The corresponding dwell time above 220C was 98 seconds. These experiments also showed that pin-fin CBGA modules experienced the highest thermal grease temperatures. Pin-fin modules include a heat sink in the cap. The thermal grease in flat-cap CBGA modules under worst-case solder-joint conditions reached a peak temperature of 225C, with a corresponding dwell time above 220C of 2040 seconds. This testing was conducted using a hot-gas temperature of 290C. The tooling for module reflow is the same as for module removal. Proper thermal profiling is required prior to reflow, and the maximum hot-gas temperature is 300C. A representative reflow thermal profile is shown in Figure 3-10 on page 63. A photo of a CBGA solder joint cross-section after 2x module replacement is shown in Figure 3-11 on page 63.
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Figure 3-10. Thermal Profile for 32.5 mm CBGA Rework Hot-Gas Reflow
186C
Edge joint
131 C Center joint 73C 1 2 3 4
Figure 3-11. Reworked CBGA Solder Joint Cross-Section
After successfully attaching the CBGA module to the PCB, the perimeter row of solder joints should be visually examined following cooldown. The solder joint between the ball and the PCB should be similar in size and shape to the top joint (between the ball and module). The joints appearance should also duplicate the initial assemble condition (Assembly Inspection on page 30). If a water-soluble paste is used, a cleaning operation in the inline aqueous cleaner is also required. Cleaning parameters are the same as those used in the initial assembly. An additional module reflow consideration is the amount of local card warping or bowing that occurs during the solder reflow cycle. The warping potential can be very severe for thin PCBs. Bowing can be further aggravated by the proximity of other components, such as PIH connectors, which can anchor areas of the PCB and as a result, enhance the local bowing potential under the CBGA module. The bowing or warping can be severe enough to cause opens.
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3.5 Rework Inspection

Inspection techniques are similar to those available during the initial assembly process. Since joints are not visible, an electrical test is usually employed. See the initial assembly inspection criteria described in Assembly Inspection on page 30.
3.6 1.00 mm Pitch CBGA Rework

The standard rework process developed for 1.00 mm pitch CBGA modules was verified and optimized specifically for these modules using 16 PCBs. During this study, the package site was monitored at four locations during thermal profiling: 1. Center solder joint 2. Northwest-corner solder joint 3. Southeast-corner solder joint 4. West center-edge solder joint The entire card was preheated prior to lowering the hot-gas nozzle for the initial module removal. After module removal, one solder ball remained on two cards, and no solder balls were left behind on the remaining 14 cards used in the study. Manual or automated site dress was used to remove excess solder from the PCB pads to prepare the site for the new module. Note that eutectic solder must be applied between the PCB pads and high-temperature solder balls on the module in order to form CBGA joints. Solder paste provides a tack material to place the CBGAs on the PCB pads, and allows for z-axis compensation to minimize warping and coplanarity concerns. During this study, the solder balls were screened-on. This process consists of placing the package in an open-face clamshell. The clamshell serves several purposes: Provides a location for the CBGA during screening Supplies a support for the stencil over the module Acts as a transport mechanism for the module as it is transferred to the rework tool Provides a CBGA location for placement on the rework tool The packages in this study were screened with Alpha 1208 water-soluble paste using a 7-mil thick electroformed stencil with 27-mil diameter apertures. The desired solder-paste volume per ball location was 2500 4000 cubic mils. The low end of this specification represents the minimum weight to ensure reliability; the high end of the specification minimizes solder bridging. The actual solder-paste volume ranged from 2500 3758 cubic mils, with an average of 3000 cubic mils. Although solder bridging occurred on one site, this was probably the result of a screening defect rather than solder-paste volume. During the second package removal, five cards had ten or fewer balls remaining, while one card had as many as 165 balls remaining. Only four cards had no balls remaining. However, this result was expected because there is a tendency for a higher number of balls to remain on the PCB after the second package removal due to the increased intermetallic growth on the PCB pads caused by multiple reflow cycles. The joints between the card pads and the 10/90 Sn/Pb solder balls have a higher melting point than the joints between the 10/90 Sn/Pb solder balls and the ceramic pads.
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Each card site was dressed again, and solder paste was screened on the solder balls of the new packages. During the second module placement, the solder volume ranged from 25453862 cubic mils, with an average solder volume of 2900 cubic mils. Some solder bridging in each of two corners occurred on the two cards with solder paste-volume over 3800 cubic mils. Note that the electroformed stencils used in this stage of the experiment had better solder-paste release characteristics than the laser-cut stencils used in the first phase. After two module removals and two module replacements, the assemblies were thermal cycled. Testing results indicated no difference in the fatigue life compared to non-reworked parts.
3.7 Forced Rework

Forced rework was performed in conjunction with the CBGA module and assembly qualification testing. Overall yields for the forced rework are specified at greater than 90%. The process includes many individual steps that must be properly controlled to achieve yields this high. The primary causes for defects observed during forced rework include: Screening-related opens (due to clogging in the clamshell fixture) PCB distortion during heating cycles on PCBs less than 1.37 mm (0.054 inches) thick Forced-rework parts were thermal cycled from 0 to 100C in conjunction with CBGA qualification. ATC test results showed that forced-rework joints were equivalent to the initial-assembly product with respect to resistance to thermal fatigue (see Close-Proximity Module Rework). CBGA modules with forced rework have successfully completed SIR testing [reference 14]. 3.7.1 NiAu Card Rework Rework problems associated with NiAu surface PCBs stem from inadequate solder mask or procoat adhesion to the NiAu surface. If the NiAu surface plating is low quality, there is poor solder mask adhesion, and the solder-mask dam in the dogbone pad design has a high potential of lifting during the manual solder-vacuum site dress operation. Solder-mask lifting issues are not created if a solder mask is used prior to NiAu plating at the card vendor. 3.7.2 Double-Side Module Rework Consider the appropriate tool bias-bay clearance for back-side modules as well as the correct reflow profile for replacement modules when reworking CBGA modules placed directly opposite each other (with shared vias). IBM has achieved successful results using the hot-gas SMART. The data currently available indicates that front-side and back-side module joint structures are comparable and acceptable when the top-side module is reworked, even though the back-side module undergoes a secondary reflow as it is heated through the vias. This testing, although limited, indicates that there is no reliability exposure, although IBM plans to perform independent testing to confirm this. Results will be supplied when available. 3.7.3 Close-Proximity Module Rework When reworked modules have other components nearby (0.2000.400 inch spacing), there is a potential for the nearby components to experience secondary reflow due to the hot-gas heat transfer from the rework nozzle. This heat transfer is more likely to occur when the card contains many copper layers, which promote heat conduction.
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A temperature gradient appears between the reworked module and the nearby module, with the joints closest to the reworked module reaching temperatures of up to 183C, with the joints furthest away from the reworked module 510C lower in temperature. This phenomenon is termed partial secondary reflow. Partial secondary reflow is undesirable because it can cause early temperature cycle fails due to the increased stress on the nearby modules solder joints. IBM is currently conducting studies to reduce card thermal gradients and to minimize the associated stresses on nearby modules. Note that nearby module reliability is unaffected if their solder joints are kept below 170C during adjacent-module rework. To keep temperatures below this 170C limit, shielding and module cooling methods are sometimes required, particularly when the components are less than 0.200 inches from one another.
3.8 Summary
The CBGA rework process utilizes a hot-gas rework tool for module removal and replacement, along with various methods of solder replenishment. When proper procedures and controls are implemented, rework yields are equivalent to initial assembly yields and reworked modules exhibit equivalent reliability. Reflow profile, card preheat temperature, and solder paste volume are all critical parameters to the CBGA rework process.
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4. Revision Log
Date May 23, 2002
Page
Description Initial publication
Revision Log May 23, 2002
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Revision Log
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Appendix A. References
1. JEDEC Product Outline, Ceramic Ball Grid Array, MO-156 and MO-157, Issue B, 4/00. 2. M. Ries, et al., Attachment of Solder Ball Connect Packages to Circuit Cards, IBM Journal of Research and Development, 9/93, pp. 597608. 3. IPC-D-275, Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies. 4. K. Puttlitz, et al., Material Technologies for CBGA Packages, 1994. 5. V. Mahaney, Thermal Modeling of the Infrared Reflow Process for Solder Ball Connect, IBM Journal of Research and Development, 9/93, pp. 609620. 6. S. Rooks, et al., Development of an Inspection Process for CBGA and Scanned-Beam X-ray Laminography, NEPCON WEST, 3/94, pp. 277292. 7. Y. Guo, et al., Solder Ball Connect Assemblies Under Thermal Loading: 1. Deformation Measurements via Moire Interferometry, and its interpretation, IBM Journal of Research and Development, 9/93, pp. 635648. 8. J. Corbin, Finite Element Analysis for Solder Ball Connect Structural Design Optimization, IBM Journal of Research and Development, 9/93, pp. 585596. 9. D. Banks, et al., Reliability and Comparison of Two Metallurgies for CBGA, ICMM Proceedings, 4/94, pp. 529534. 10. A. Zubelewicz, et al., An Innovative Test Method for SMT Assemblies, International Intersociety Electronics Packaging Conference, Hawaii, 5/95. 11. G. Phelan and S. Wang, Solder Ball Connection Reliability Model and Critical Parameter Optimization, ECTC Proceedings, 6/93, pp. 858-862. 12. D. Kelly, Qualification Testing, Qualification Testing for the 25/19C Solder Ball Connection Technology, 12/91. 13. J. Tomaine, T1 Test Report for Harrisburg Package, Document #9203-029, 4/92. 14. D. Banks, et al., Effects of Assembly Variable on SBC Macrostructure and Thermal Fatigue, ITL at IBM Austin, 1991. 15. SBC 25/19C Factorial Experiment, 1/91. 16. Y. Guo, et al., Experimental Analysis of Thermal Strains in Solder Ball Connections by Moire Interferometry, TR 01.B787, 5/91. 17. J. Tomaine, T2 Test Report for Harrisburg Package, Document #9207-085, 10/92. 18. T. Caufield, SBC Technology Review, 11/91. 19. G. Phelan, Technical Summary of 32 mm SBC Card Side Voids, 7/92. 20. M. Cole, et al., Design and Process Optimization for 1.0 mm Pitch CCGA, Surface Mount International Proceedings, 8/98, pp. 713. 21. M. Cole, P. Isaacs, and C. Milkovich, Card Assembly Process Implementation of 1.0 mm Pitch CCGA, Semicon West Proceedings, 7/99.
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References
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Appendix B. Glossary
APD ATC Au BGA Card CBGA CCGA CTE DLA DNP DSDP FEM HASL HPGC IR MCM MDS module N5 N50 Ni Pb PBGA PCB PIH PLCC ppm assembly process design accelerated thermal cycling gold ball grid array printed circuit board ceramic ball grid array ceramic column grid array coefficient of thermal expansion direct lid attach distance to neutral point double-side, double-pass SMT assembly finite element model hot-air solder level high-performance glass ceramic infrared multi-chip module mechanical deflection system ceramic package number of cycles to 5% fail number of cycles to 50% fail nickel lead plastic ball grid array printed circuit board pin-in-hole plastic-leaded chip carrier parts per million
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PTH QFP RH SBC SCC SIR SMART SMT Sn SPC Tg
plated-through hole quad flat packages relative humidity solder-ball connection (same as CBGA) solder-column connection (same as CCGA) surface-insulation resistance surface mount automated rework tool surface mount tin statistical process control glass transition temperature
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Appendix C. Test Vehicles

Table C-1 and Table C-2 show the test vehicles used for the data presented in this users guide. Table C-1. Module Test Vehicles
Size 25 mm 32.5 mm 42.5 mm 25 mm 32.5 mm 42.5 mm 1.0 1.27 Pitch (mm) Number of I/O 361 Yes 625 1089 552 Yes 937 1657 No No Yes Yes No Yes 99F2306 44mmsc 05L3901 8640776 8640789 8640795 Daisy chain Stitch pattern CBGA CCGA White N Dark Test Card 8640756 Function Daisy chain
Table C-2. Test Cards

Card 8640756 2.5 x 4.0 05L3901 99F2306 9 x 11 8640776 44mmscc 8640789 9 x 11 8640795 11 x 14 0.110 0.093 (modified from 0.082) 0.060 4S8P 12S10P 5 6S4P 0.072 6S4P 5 6 Reliability 0.062 4S6P 6 Size (Inches) Thickness (Inches) Layers 4S2P 1 Sites/Card Function
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Test Vehicles
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Appendix D. Coffin-Manson Acceleration Factor

The Coffin-Manson acceleration factor relationship is shown in Figure D-1. Figure D-1. Coffin-Manson Relationship
T L AF = -------- T F
1.9
fF --- f L
13
EXP
1- ----1 1414 ----T T L

F
where F = field, L = lab
Table D-1. Field Use Conditions versus 0100C

Parameter T Peak T Frequency Field 26C 51C 6 cycles/day Lab 100C 100C 72 cycles/day 10x Acceleration
Table D-2. 2080C versus 0100C

Parameter T Peak T Frequency Field 60C 80C 72 cycles/day Lab 100C 100C 72 cycles/day 3.2x Acceleration
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Coffin-Manson Acceleration Factor
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Appendix E. Solder Reflow

E.1 Alpha 1208 Paste
All solder-joints must fall within the specified profile, shown in Table E-1. The recommended maximum lead temperature for CBGA, CCGA, and TBGA packages is 220C to facilitate rework; however, a 235C maximum is allowed, provided that the module temperature and time restrictions are honored. Table E-1. Alpha 1208 Paste Profile
Parameter Average ramp-up Preheat (160C) Time above 183C Minimum lead temperature Maximum lead temperature Maximum board temperature Specification 0.481.8C per second 2 minutes nominal 45 to 145 seconds 200C 235C 245C
E.2 Kester R244 No-Clean Reflow Profile

Figure E-1. Kester R244 No-Clean Reflow Profile
240 220 200 180 160 Temperature (C) 140 120 100 80 60 40 20 0 0 30 60 90 120 150 180 210 240 270 300 Time (seconds) (11.5 minutes) Preheating Zone (2.03.0 minutes) <2.5C per second 0.50.6C per second Soaking Zone (max 2.5 minutes) Reflow Zone (4080 seconds) 1.31.6C per second Peak Temp (210235C per second)
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Solder Reflow
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CBGA Surface Mount Assembly and Rework Users Guide

May 23, 2002

Copyright International Business Machines Corporation 2002.

CBGA Surface Mount Assembly and Rework Users Guide

Contents May 23, 2002

CBGA Surface Mount Assembly and Rework Users Guide

May 23, 2002

CBGA Surface Mount Assembly and Rework Users Guide

Appendix E. Solder Reflow ....................................................................................................... 77

Contents May 23, 2002

CBGA Surface Mount Assembly and Rework Users Guide

May 23, 2002

CBGA Surface Mount Assembly and Rework Users Guide

Figures May 23, 2002

CBGA Surface Mount Assembly and Rework Users Guide

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CBGA Surface Mount Assembly and Rework Users Guide

Introduction May 23, 2002

CBGA Surface Mount Assembly and Rework Users Guide

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CBGA Surface Mount Assembly and Rework Users Guide

Assembly May 23, 2002

CBGA Surface Mount Assembly and Rework Users Guide

Figure 2-1. CBGA Cross Section

63/37 Sn/Pb Fillet Card/Board

10/90 Sn/Pb Ball 18 ppm/C

2.2 Card Considerations

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CBGA Surface Mount Assembly and Rework Users Guide

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CBGA Surface Mount Assembly and Rework Users Guide

6.35 mm reference gridgrid 0.250

5.08 mm min 0.200

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CBGA Surface Mount Assembly and Rework Users Guide

2.3 General SMT Process

All eutectic reflows

Heatsink Heatsink adhesive

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CBGA Surface Mount Assembly and Rework Users Guide

Figure 2-5. Double-Sided CBGA Process Flow

Cards and Components

Clean (if required)

Backside Solder-Paste Application

Topside Solder-Paste Application

Place Components (BGA, SMT, and PIH connectors)

Component Placement (BGA, SMT)

Figure 2-6. Hybrid CBGA Process Flow

Cards and Components

Clean (if required)

Topside Solder-Paste Application

Backside Adhesive Dispense

Place Components and PIH Connectors

Component Placement (BGA, SMT)

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CBGA Surface Mount Assembly and Rework Users Guide

2.4 Solder-Paste Screening

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CBGA Surface Mount Assembly and Rework Users Guide

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CBGA Surface Mount Assembly and Rework Users Guide

Percent Perfect Volume

2.5 Print Inspection