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Part 4:

Advanced MRAM concepts

Bernard.Dieny@cea.fr

July 2013

Part 4

inMRAM
2013

OUTLINE Part 4: Advanced MRAM concepts

Ultrafast precessional STTRAM Race track memories 3-terminal devices Voltage controlled MRAM Comparison of STTRAM with resistive RAM

Bernard.Dieny@cea.fr

July 2013 Part 4

inMRAM
2013

OUTLINE Part 4: Advanced MRAM concepts

Ultrafast precessional STTRAM Race track memories 3-terminal devices Voltage controlled MRAM Comparison of STTRAM with resistive RAM

Bernard.Dieny@cea.fr

July 2013 Part 4

inMRAM
2013

Several families of MRAM


Field-driven STT (STT MRAM)
Planar Perpendicular

DW motion

Hx

Hy

Thermally Assisted (TAS)

STT-TAS

Precessional

Spin-orbit torque (spin-Hall, Rashba)

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Need for ultrafast STTRAM for SRAM-like applications


Idea: elaborateaSpinTransferTorque MRAM withanultrafast switchingtoachievethesubnano secondscale writingtime
Density ~100MHz
Cache SRAM kB MB ~0.5 2ns Register

Memory Hierarchy

Storage disk drive TB ~ms

Main memory DRAM GB 5010ns

Processor

2GHz

Speed p-STTRAM

UltrafastMRAM:

Need for a sub-ns switching MRAM

ReplacingSRAMmemory Buildingnonvolatilelogiccircuitswithlowenergyconsumption
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Stochastic switching in conventional STTRAM approaches


In-plane Out-of-plane

Spin-transfer torque:

Reference layer MgO

r P r M

r P r M

= a j M ( P M )
Stochastic reversal incubation time preceding a large thermal fluctuation Slows down the STTRAM writing

Transmitted voltage (mV)

Devolder et al. Phys. Rev. Let. vol 100 (2008)

MgO based in-plane MTJ


Time after pulse (ns)
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MRAM with orthogonal polarizer and analyzer

Reference Layer (Analyzer) MgO FreeLayer


MgO (lower RA) or Cu

r A r M r P

Equationofmotion

2 STT contributions

dM dM = 0 M H eff + M + a JLong M ( A M )+ a jPerp M ( P M ) dt MS dt

STTfrominplaneanalyzer: Bipolarswitchingoffreelayer magnetization STTfromPerpendicularpolarizer: Outofplaneoscillationsoffreelayer magnetization


9 Switchinginlessthan1ns 9 Noincubationdelay(PM)
July 2013 Part 4

Perpendicular Polarizer

O.Redon,B.Dienyand B.Rodmacq,USPatentFR0015893(2000), US6532164B2 A.Kent etal,APL84,3897(2004)

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RF oscillator with perpendicular to plane polarizer


Cu PtMn J
Al2O3

CoFe CoFe (Pt/Co)

Cu

D.Houssamedine et al, Nat.Mat 2007

Injection of electrons with out-of-plane spins; Steady precession of the magnetization of the soft layer adjacent to the tunnel barrier. Precession (2GHz-40GHz) + Tunnel MR RF voltage Interesting for frequency tunable RF oscillators Radio opportunism
(SPINTEC patent + Lee et al, Appl.Phys.Lett.86, 022505 (2005) )
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MRAM with orthogonal polarizer and analyzer


dM dM = 0 M H eff + + a jPerp M ( P M )+ a jLong M ( A M ) M dt dt MS

Reference Layer (Analyzer)

r A

Depending on the relative influence of STT from perpendicular polarizer and in-plane analyzer, different switching behaviors can be observed: -If STT from in-plane Analyzer dominates Non-oscillatory switching probability vs pulse duration. Final state determined by current direction. No need to read before write. -If STT from perpendicular Polarizer dominates Oscillatory switching probability versus current pulse duration. Switching whatever the current direction. More difficult to control in STTRAM devices since requires controlling the current pulse duration at 50ps. Requires read before write.

FreeLayer

Perpendicular Polarizer

r P

How to conveniently tune the relative influence of these two STT contributions?
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Tuning the relative STT influence of perp polarizer and in-plane analyzer by playing on the cell aspect ratio

STTfrominplaneanalyzer:
2e t M jcLong = F 0 s g(0) h
2 M s 2e t F 0 M s H K+ 2 h 2g(0)

J.Sun, PRB 62, 570 (2000)

(SI units)

STTfromperpendicularpolarizer:
2e t M H jcPerp = F 0 s K h g(/2) 2
Hk = in-plane shape anisotropy field
K.J.Lee et al, APL 86, 022505 (2005)

To get bipolar non-oscillatory switching probability versus pulse duration:

Perp c

> j> j

Long c

implying

jcLong <1 jcPerp

i.e

g (0 ) H K

( 2) M

<1

Typically,

~ 0.01, 0 M s ~ 1.6T , 0 H K ~ 0.01T , g ( / 2) / g (0) 0.7 with AR~2 so that ratio~1.1


The easiest way to fulfill this relationship is to increase HK by increasing the cell aspect ratio (AR)
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MRAM with orthogonal polarizer and analyzer


Ellipticalnanopillars 270x80nm

TMR~65% and RA~16 .m2


Annealing300oC;90minutesunderinplanefield

Synthetic antiferromagnetic layers reduce the magnetostatic interactions between layers


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Dynamics dominated by the STT contribution from perpendicular polarizer (AR=2)


Cell size : 80nm*160nm Out-of-plane precession of the free layer magnetization due to STT from perpendicular polarizer
Macrospin simulation: Proba of switching under STT from perp polarizer only

Current density (x1010 A/m2)

100% 50%

AP P

0% Pulse width (ns)

Magnetoresistance (a.u.)

Frequency (GHz)

20 10 0 0 5 10 15

time (ns)
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Current density (1010 A/m2)


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Single-shot transmitted signal (AR=2)


Pstate Cell size : 80nm*160nm

APinitialstate AP and P reference signals measured under sufficiently large magnetic field to maintain the AP and P configurations during the current pulse. Field switched off afterwards.

As expected, the perpendicular polarizer induces a large amplitude precession around the normal to the plane
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Frequency vs current density (AR=2)


0.01 0.00 -0.01 -0.02

500mV

0.01 0.00 -0.01 -0.02

0,6GHz

563mV
Frequency (GHz)

1.2 1.1 1.0 0.9 0.8 0.7 7 8 9 10 11 10 12

Voltage (V)

-0.03 -0.04 -0.05 -0.06 -0.07 -0.08 2.00E-008

Voltage (V)

-0.03 -0.04 -0.05 -0.06 -0.07 -0.08

Single pulse Average of 100 traces Reference signal

Single pulse Average of 100 traces Reference signal


2.50E-008 3.00E-008 3.50E-008 4.00E-008 4.50E-008

2.50E-008

3.00E-008

3.50E-008

4.00E-008

4.50E-008

time after pulse

2.00E-008

time after pulse (s)

Current Density (x10

A/m)

0.01 0.00 -0.01 -0.02 -0.03 -0.04 -0.05 -0.06 -0.07 2.00E-008 2.50E-008 3.00E-008

630mV

0.01 0.00 -0.01 -0.02 -0.03 -0.04 -0.05 -0.06 -0.07

1GHz

708mV

Voltage (V)

Single pulse Average of 100 traces Reference signal


3.50E-008 4.00E-008 4.50E-008

Voltage (V)

Precession frequency depends linearly on the current density

Single pulse Average of 100 traces Reference signal


2.50E-008 3.00E-008 3.50E-008 4.00E-008 4.50E-008

time after pulse (s)

2.00E-008

time after pulse (s)

Lee et al, APL86, 022505 (2005)

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Precession decoherence (AR=2)


Single shot traces at 1.4V

De-phasing of precessional motion explains the probability amplitude decay observed in probability measurements
Switching probability (%)

Pulse duration (ns)

9 10
AcknowledgementtoT.DevolderatIEF inParisforrealtimemeasurements
July 2013 Part 4 15

Time after pulse (ns)


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Precession decoherence also seen in STT oscillators: contribution to linewidth


Cu PtMn J
Cu
D.Houssamedine et al, Nat.Mat 2007

CoFe CoFe (Pt/Co)

Cu

f~200MHz

1 / f 5ns
Time evolution of spectrum
x 10
-7

Time domain measurement


0 .0 2 0 .0 1 5 0 .0 1 0 .0 0 5

F re q u e n c y vs T im e

0.90 mA

12

V (V)

0 -0 .0 0 5 -0 .0 1 -0 .0 1 5 -0 .0 2

t (s)

Sliding 1 window FFT t(s)

10

0.90 mA 1.25 s

10 time t (s )

x 10

15 150 ns
-8

7.1

7 .2

7 .3

7.1

f(GHz)
July 2013 Part 4

7 .4 f (H z )

7.5

7.6

7.7

7 .8

7.8
x 10
9

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Dynamics dominated by STT contribution from in-plane analyzer (AR=5)


Cell size = 50nm*250nm Switching probability (initial=P) Switching probability (initial=AP)

Current density (x1010 A/m2)

Current density (x1010 A/m2)

100% 50%

AP

AP

0% Pulse width (ns)

Pulse width (ns)


jcPerp > j > jcLong is fulfilled:

When the condition

9Non-oscillatory bipolar switching can be achieved. 9 If the current is too large, oscillatory switching probability is recovered 9Ultrafast reversal without incubation time
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Dynamics dominated by STT contribution from in-plane analyzer (AR=5)


Without perpendicular polarizer (STT from in-plane analyzer only) J = 25 1010 A/m
magnetoresistance (a.u.) AP

STT from both in-plane and perpendicular polarizer


magnetoresistance (a.u.) AP

Incubation time

P 0.0 0.2 0.4 0.6 0.8 time (ns) 1.0 1.2

P 0.0 0.2 0.4 0.6 0.8 time (ns)

4.5e10 A/m2 5.5e10 A/m2 6.5e10 A/m2 7.5e10 A/m2 1.0 1.2

9 No stochastic incubation time 9 Reduced switching current 9 Switching time is reduced to 300ps by increasing the current density

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Dynamics dominated by STT contribution from in-plane analyzer (AR=5)


Cell size = 50nm*250nm
Switching Probability
Marins de castro Sousa et al, Journal of Applied Physics 111 (2012) 07C912

1 .0 0 .8 0 .6 0 .4 0 .2 0 .0 0 2
500m V 562m V 6 3 1 m V c e n te re d b ia s 6 3 1 m V A P b ia s 6 3 1 m V P b ia s 708 794m V

Similar results: Liu et al, APL97, 242510 (2010)

Switching with 90fJ

4 6 8 P u ls e w id th (n s )

10

Fullfilling the condition jcPerp > j > jcLong allows for bipolar non-oscillatory switching of the storage layer magnetization suitable for SRAM type of applications

precessionstopsatstablestateafterhalfaprecessionperiod.
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Summary on ultrafast STTRAM with orthogonal polarizers Ultrafast STT switching with combined STT influences from perpendicular polarizer and in-plane analyzer Successful integration of a perpendicular polarizer in an in-plane magnetized MTJ with good TMR signal (~6070%). Oscillation of the switching probability associated with dominant STT influence from perpendicular polarizer Bipolar non-oscillatory switching can be achieved for ultrafast reliable writing in STTRAM by using elongated cells. Drawback is larger footprint. Sub-ns switching and low energy consumption can be achieved (90fJ range)
Bernard.Dieny@cea.fr July 2013 Part 4

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OUTLINE Part 4: Advanced MRAM concepts

Ultrafast precessional STTRAM

Race track memories


3-terminal devices Voltage controlled MRAM Comparison of STTRAM with resistive RAM

Bernard.Dieny@cea.fr

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Current Induced Domain Wall (DW) motion


(a)

Field driven DW motion

Current driven DW motion

(b)

(c) (d)

Magnetic field H = -20mT

Positive current
H=0
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Negative current

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Current Induced Domain Wall (DW) motion


STT used to push domain walls:

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Race-track memories
Shift register based on coherent domain wall displacements induced by current

C
Reading

Parkin et al, IBM (2004)

Writing

Vertical racetrack

Racetrack storage array

Horizontal racetrack

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Race-track memories
Injection of domain walls:

Injection by STT through a tunnel barrier can also be used or using the fringing field from a domain wall in an underlying wire (see
previous slide).

Injection by field

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Race-track memories
Race-track: a multibit MRAM with extended storage layer.

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Race-track memories
Successful demonstration on a 8m long shift register:

Parkin et al, IEDM 2011

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Race-track memories
Remaining challenges:
-Use perpendicular-to-plane materials for narrower domain walls and weak pinning energies. -Avoid pinning defects which locally trap domain walls. One single pinning defect along a given track may prevent that whole track to properly work. -Homogeneity of properties if using vertical dimension.

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OUTLINE Part 4: Advanced MRAM concepts

Ultrafast precessional STTRAM Race track memories

3-terminal devices
Voltage controlled MRAM Comparison of STTRAM with resistive RAM

Bernard.Dieny@cea.fr

July 2013 Part 4

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2013

Several families of MRAM


Field-driven STT (STT MRAM)
Planar Perpendicular

DW motion

Hx

Hy

Thermally Assisted (TAS)

STT-TAS

Precessional

Spin-orbit torque (spin-Hall, Rashba)

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3-terminal MRAM cell based on current-induced domain wall propagation

DW velocity (m/s)

reference barrier Storage stripe

400 300 200 100 0

1 2 3 12 2 Current density (x 10 A/m )

V~250m/s 100nm ~ 400ps Advantages : -Less electrical stress on the barrier during write (improved reliability) -Less current required to write since thickness<<width -Multibit possible

Disadvantage : Larger cell


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3-terminal MRAM cell based on current-induced domain wall propagation

NEC
The memory cell has a shape such that a magnetic wall is necessarily exist. Domain wall moved by STT influence from in-plane current.

Potential of 0.1-mA and 2-ns writing with sufficient thermal stability,

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3-terminal MRAM cell based on current-induced domain wall propagation

Multibit MRAM (shift register) based on DW propagation

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Several families of MRAM


Field-driven STT (STT MRAM)
Planar Perpendicular

DW motion

Hx

Hy

Thermally Assisted (TAS)

STT-TAS

Precessional

Spin-orbit torque (spin-Hall, Rashba)

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Rashba effect in MTJ electrodes with in-plane current

AlOx 2nm Co0.5 nm Pt3nm

r J

r E

O-pz

Co-dz

Charge transfer at Co/MOx interface Interfacial E field

r J

r E

r 1 1 r r vE B= c 1 v2 / c2

Breaking of inversion symmetry Rashba effect


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Magnetization reversal by Rashba effect in MTJ electrode with in-plane current Switching induced by spin-orbit torque: Rashba or Spin-Hall

Writing with in-plane current Reading with current through barrier


M.Miron et al, Nature 476,189 (2011)

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OUTLINE Part 4: Advanced MRAM concepts

Ultrafast precessional STTRAM Race track memories 3-terminal devices

Voltage controlled MRAM


Comparison of STTRAM with resistive RAM

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Voltage controlled MRAM


STTRAM are written by a pulse of current flowing through the MTJ. The main source of energy consumption during write is the Joule dissipation:

E = RI 2t

In STTRAM, the energy per write event is in the range 0.1pJ-10pJ (depending on the retention).

If we could control the magnetic properties of the storage layer by voltage without significant current flow through the MTJ, then the energy consumption could be reduced to

1 2 E = CV 2
Bernard.Dieny@cea.fr

Could be in the range of fJ provided V is below 1V


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Voltage controlled MRAM


Several approaches: -Using multiferroc materials : materials which exhibit coupled structural, electrical and magnetic properties (piezoelectric, magneto-electric, magneto-elastic). Example: BiFeO3 -Using synthetic multiferroc materials :
Magneto-elastic Piezo-electric

-Using the influence of interfacial electric field on the perpendicular anisotropy at magnetic metal/oxide interface

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Voltage controlled MRAM


At metal/oxide interface, density of states at Fermi energy can be tuned by electrical field. However very short penetration depth of electrical field in metal (<2): interfacial effect. Can be used to tune the CoFeB/MgO anisotropy by electrical field. Can very much reduce the power consumption compared to STT if operates at V<1V

Endo et al, APL96, 212503(2010)

Intrinsically weak effect. Large manifestation if close to condition of anisotropy reorientation (for instance compensation between in-plane demagnetizing energy and perp interfacial energy). But difficult to use in actual device because condition fulfilled at only one temperature.
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OUTLINE Part 4: Advanced MRAM concepts

Ultrafast precessional STTRAM Race track memories 3-terminal devices Voltage controlled MRAM

Comparison of STTRAM with resistive RAM


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ITRS ERD Roadmap 2010

STT-MRAM

ReRAM

Vwr0~-0.9V

Vwr1~0.9V@5ns Vread~0.3V
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COMPARISON MRAM / ReRAM


STT-MRAM ReRAM

(2011)

F1
EF

F2 eV
EF

R = Rmin + R

(1 cos )
2
Statistical phenomenon associated with migration of vacancies or metallic ions
J.Lee et al, Gwanju IST, Korea (IEDM2010)

Spin-dependent quantum mechanical tunneling of electrons (as polarizer/analyzer in optics). Switching of magnetization described by LLG equation:
dM dM = M (H eff + bI .M p ) + aI .M (M M p ) + M dt dt

R distributions:
Normalised Count

10

10

-1

Rmin

Rmax

10

-2

8kbit ReRAM
(K.Kit, SAIT, Samsung IEDM 2010)

1Mbit chip TA-MRAM

10

-3

10

-4

10

-5

>25
0 100 200 300 400 500 600 Resistance 700 800 900 1000

10

-6

0.5 1 Resistance (k) Bernard.Dieny@cea.fr

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COMPARISON MRAM / ReRAM


Multilevel capability:
160 MgO based MTJ

(2011)

TMR(%)

120 80 40 0 -300 -200 -100 0 100 200 300

H(Oe)

Binary resistance levels Multilevel and memristor possible but with much less R amplitude than with ReRAM. Not so easy to implement (R(), DW or stacking of several MTJ)

Multilevel capability Memristor functionality with large R amplitude


J.Lee et al, Gwanju IST, Korea (IEDM2010)

Cyclability:
240

Resistance ()

220 200 180 160 140 120


10
6 7 8 9 10 11

Rmax Rmin

10

10

10

10

10

10 12

Vwrite

Number of pulses

W.C.Chien et al, Macronix, Hsinchu, Taiwan, (IEDM2010) >1016 cycles Bernard.Dieny@cea.fr July 2013 Part 4

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COMPARISON MRAM / ReRAM


Speed:
STT switching in MTJ

(2011)

Y.T.Cui et la, PRL104, 097201(2010) W.C.Chien et al, Macronix, Hsinchu, Taiwan, (IEDM2010)

Retention:
E I cell t Fchip = 1 exp m exp k T 1 I 0 WR B

E/KBT>67
OK with perpendicular MTJ OK with TAS

W.C.Chien et al, Macronix, Hsinchu, Taiwan, (IEDM2010)


Takemura et al, IEEE Journ of Solid State Circuits, 45, 869 (2010)

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COMPARISON MRAM / ReRAM


Possibility of crossbar architecture:

(2011)

http://www.unitysemi.com/

MTJ+diode

Difficulty is the in-stack diode


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Summary of differences MRAM / ReRAM


Cyclability ~ 108 cycles, more than FLASH Larger distribution of Rmin 6Kbit: / Rmax

Unlimited cyclability (>1016 cycles) Narrow distribution of Rmin 1Mbit: / Rmax

5k0.3k / 12k0.8k

3-6k / 10k - 300k

Bilevel resistance Natural continuous change of R Multilevel possible but not straighforward Multilevel capability easier to implement Moderate R : Rmax/Rmin ~2-3 Large R : Rmax/Rmin ~5 - 50
Applications

DRAM, SRAM, e-SRAM, logic-in-memory, Embedded-NVM

e-SRAM, Embedded-NVM, FLASH, Memristor, neuromorphic architecture


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Acknowledgements

R.Sousa S.Bandiera Y.Hadj-Larbi B.Rodmacq S.Auffret M.Souza L.Nistor JP Nozieres

L.Buda-Prejbeanu M.Chshiev H.Bea S.Amara V.Baltz J.Moritz P.Y.Clement C.Baraduc L.Cuchet B.Lacoste Q.Stainer G.Vinai

B.Cambou I.L.Prejbeanu K.Mackay L.Lombard E.Gapihan C.Ducruet Y.Conraux C.Portemont

B.Delaet M.T.Delaye M.C.Cyrille

Work partly supported by the projects


NANOINNOV SPIN (2009) HYMAGINE (ERC2009)

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