Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Features
o Low RON 0.9 max (+3V Supply) 2.5 max (+1.8V Supply) o On-Resistance Flatness: 0.1 max (+3V) o RON Matching 0.12 max (+3V Supply) 0.25 max (+1.8V Supply) o +1.6V to +3.6V Single-Supply Operation o Available in 16-Pin QFN and 3mm 3mm Packages o 1.8V CMOS Logic Compatible (+3V Supply) o High Current-Handling Capacity (100mA Continuous) o Fast Switching: tON = 30ns, tOFF = 25ns
Ordering Information
PART TEMP RANGE PINPACKAGE 14 TSSOP 16 QFN-EP* (3mm 3mm) 14 TSSOP 16 QFN-EP* (3mm 3mm) 14 TSSOP 16 QFN-EP* (3mm 3mm) TOP MARK AAC AAD AAE
Applications
Power Routing Battery-Powered Systems Audio and Video Signal Routing Low-Voltage Data-Acquisition Systems Communications Circuits PCMCIA Cards Cellular Phones Modems Hard Drives
+
14 V+ 13 IN1 12 IN4 11 NC4 10 COM4 9 COM3 8 NC3 NO1 1 COM1 2 NC2 3 COM2 4 IN2 5 IN3 6 GND 7
+
14 V+ 13 IN1 12 IN4 11 NC4 10 COM4 9 COM3 8 NO3
TSSOP
INPUT LOW HIGH SWITCH STATE OFF ON INPUT LOW HIGH
TSSOP
SWITCH STATE ON OFF INPUT LOW HIGH
TSSOP
NO1, NO3 NC2, NC4 OFF ON ON OFF
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrateds website at www.maximintegrated.com.
Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current rating.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
0.6
On-Resistance (Note 4)
RON
RFLAT(ON)
V+ = 2.7V, +25C ICOM_ = 100mA, VNO_ or VNC_ = 1V, 1.5V, 2V TMIN to TMAX V+ = 3.6V, VCOM_ = 0.3V, 3.6V, VNO_ or VNC_ = 3.6V, 0.3V +25C TMIN to TMAX +25C TMIN to TMAX +25C TMIN to TMAX -2.5 -5 -2.5 -5 -2.5 -5
INO_(OFF), INC_(OFF)
0.002
+2.5 nA +5
V+ = 3.6V, VCOM_ = 0.3V, ICOM_(OFF) 3.6V, VNO_ or VNC_ = 3.6V, 0.3V V+ = 3.6V, VCOM_ = 0.3V, 3.6V, VNO_ or VNC_ = 0.3V, 3.6V, or unconnected
0.002
+2.5 nA +5
0.002
+2.5 nA +5
ICOM_(ON)
Maxim Integrated
SWITCH DYNAMIC CHARACTERISTICS Turn-On Time tON VNO_ or VNC_ = 1.5V, RL = 50, CL = 35pF, Figure 1 VNO_ or VNC_ = 1.5V, RL = 50, CL = 35pF, Figure 1 VNO_ and VNC_ = 1.5V, RL = 50, CL = 35pF, Figure 1 VGEN = 0, RGEN = 0, CL = 1.0nF, Figure 2 f = 1MHz, Figure 3 f = 1MHz, Figure 3 f = 1MHz, Figure 3 RL = 50, CL = 5pF, Figure 4 RL = 50, CL = 5pF, Figure 4 THD f = 10MHz f = 1MHz f = 10MHz f = 1MHz +25C TMIN to TMAX +25C TMIN to TMAX +25C TMIN to TMAX +25C +25C +25C +25C +25C +25C +25C +25C +25C 2 21 31 30 75 -51 dB -65 -70 dB -80 0.031 % pC pF pF pF 7 ns 10 6 30 ns 30 25 ns 25
Turn-Off Time
tOFF
Break-Before-Make (Note 8) (MAX4753 Only) Charge Injection NO_ or NC_ Off-Capacitance COM_ Off-Capacitance COM_ On-Capacitance Off-Isolation (Note 9)
tBBM
Crosstalk
Total Harmonic Distortion DIGITAL I/O Input Logic High Input Logic Low Input Leakage Current POWER SUPPLY Power-Supply Range Positive Supply Current
V V A V A
Maxim Integrated
On-Resistance (Note 4)
RON
SWITCH DYNAMIC CHARACTERISTICS Turn-On Time tON VNO_ or VNC_ = 1.0V, RL = 50, CL = 35pF, Figure 1 VNO_ or VNC_ = 1.0V, RL = 50, CL = 35pF, Figure 1 VGEN = 0, RGEN = 0, CL = 1.0nF, Figure 2 +25C TMIN to TMAX +25C TMIN to TMAX +25C 8 20 25 35 ns 35 25 ns 30 pC
Turn-Off Time
tOFF
Charge Injection DIGITAL I/O Input Logic High Input Logic Low Input Leakage Current POWER SUPPLY Power-Supply Range Positive Supply Current
V V A V A
The algebraic convention is used in this data sheet; the most negative value is shown in the minimum column. Parts are tested at +85C and guaranteed by design and correlation over the full temperature range. RON and RON matching specifications for QFN-packaged parts are guaranteed by design. RON = RON(MAX) - RON(MIN) Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal ranges. Note 7: Leakage parameters are 100% tested at the maximum-rated hot operating temperature and guaranteed by correlation at TA = +25C. Note 8: Guaranteed by design, not production tested. Note 9: Off-Isolation = 20log10[VCOM / (VNC or VNO)], VCOM = output, VNC or VNO = input to off switch.
Maxim Integrated
20
TA = +85C
0.5 0.4 0.3 0.2 0.1 0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 VCOM (V) TA = -40C TA = +25C
tON
2.8
3.2
3.6
10
1000
60 50 40 Q (pC) 30 20 10 V+ = 3V
ON 100 OFF
TIME (ns)
tOFF
4 10 2 V+ = +3.0V 0 -40 -15 10 35 60 85 TEMPERATURE (C) 1 -40 V+ = 3.0V 0 -15 10 35 60 85 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 VCOM (V) TEMPERATURE (C)
ICOM (pA)
V+ = 1.8V
FREQUENCY RESPONSE
MAX4751 toc07
10 0 -10 -20 RESPONSE (dB) -30 -40 -50 -60 -70 -80 -90 -100 0.01 0.1 1 10 100 CROSSTALK OFF-ISOLATION ON-RESPONSE
1.1 1.0 LOGIC THRESHOLD (V) 0.9 0.8 FALLING 0.7 0.6 0.5
RISING
1000
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 V+ (V)
FREQUENCY (MHz)
Maxim Integrated
0.034 0.032 0.030 THD (%) 0.028 0.026 0.024 0.022 0.020 1 10 100 1k 10k V+ = 3.0V
0.01 0.001 100k 0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 V+ (V) FREQUENCY (Hz)
Pin Description
PIN MAX4751 TSSOP 1, 3, 8, 11 2, 4, 9, 10 7 13, 5, 6, 12 14 QFN-EP 15, 1, 7, 11 16, 2, 8, 9 6 13, 4, 5, 12 14 3, 10 MAX4752 TSSOP 1, 3, 8, 11 2, 4, 9, 10 7 13, 5, 6, 12 14 QFN-EP 15, 1, 7, 11 16, 2, 8, 9 6 13, 4, 5, 12 14 3, 10 MAX4753 TSSOP 3, 11 1, 8 2, 4, 9, 10 7 13, 5, 6, 12 14 QFN-EP 1, 11 15, 7 16, 2, 8, 9 6 13, 4, 5, 12 14 3, 10 NO1, NO2, NO3, NO4 NC1, NC2, NC3, NC4 NC2, NC4 NO1, NO3 COM1, COM2, COM3, COM4 GND IN1, IN2, IN3, IN4 V+ N.C. EP Switch Normally Open Terminals Switch Normally Closed Terminals Switch Normally Closed Terminals Switch Normally Open Terminals Switch Common Terminals Ground Logic Control Inputs Positive Supply Voltage No Connection. Not internally connected. Exposed Pad (QFN Only). Connect EP to GND. NAME FUNCTION
Maxim Integrated
NO_
VNO_
MAX4751
IN_ COM_
V+ V+ VIH + 0.5V IN_ 0 VCOM_ 50 35pF VNO_ or VNC_ 90% VCOM_ 0 tBBM tBBM = tON(NO_) - tOFF(NC_) OR tBBM = tON(NC_) - tOFF(NO_) tBBM 90%
VNC_
NC_
NO_
VNO_
MAX4753
IN_ GND COM_
Maxim Integrated
V+
V+
VIN
COM_
VOUT CL 1000pF
AS REQUIRED
IN_
NO_ OR NC_
COM_
VOUT
VOUT
VOUT IS THE MEASURED VOLTAGE DUE TO CHARGE TRANSFER ERROR Q WHEN THE CHANNEL TURNS OFF. Q = VOUT x CL
V+
V+
NO_ OR NC_
VIN * VOUT
V+ IN_
MEAS
REF
50
50
MEASUREMENTS ARE STANDARDIZED AGAINST SHORT AT SOCKET TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM AND OFF TERMINAL ON EACH SWITCH. ON-LOSS IS MEASURED BETWEEN COM AND ON TERMINAL ON EACH SWITCH. SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED.
V OFF-ISOLATION = 20log OUT VIN V ON-LOSS = 20log OUT VIN *ADD 50 TERMINATION FOR OFF-ISOLATION
COM Vg
NO
Applications Information
Proper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maximum ratings because stresses beyond the listed ratings can cause permanent damage to the devices. Always sequence V+ on first, followed by NO_, NC_, or COM_. If power-supply sequencing is not possible, add two small-signal diodes (D1, D2) in series with the supply pins for overvoltage protection (Figure 5). Adding these diodes reduces the analog signal by one diode drop below V+ and one diode drop above GND, but does not affect the low switch resistance and low leakage characteristics of the device. Device operation is unchanged, and the difference between V+ and GND should not exceed 4V. Power-supply bypassing is needed to improve noise margin and to prevent switching noise propagation from the V+ supply to other components. A 0.1F capacitor, connected from V+ to GND, is adequate for most applications.
GND D2
resistance (see the Typical Operating Characteristics). The switches are bidirectional, so the NO_, NC_, and COM_ pins can be used as either inputs or outputs.
Layout
High-speed switches require proper layout and design procedures for optimum performance. Reduce stray inductance and capacitance by keeping traces short and wide. Ensure that bypass capacitors are as close to the device as possible. Use large ground planes where possible.
Logic Inputs
The MAX4751/MAX4752/MAX4753 logic inputs can be driven up to +3.6V regardless of the supply voltage. For example, with a +1.8V supply, IN_ may be driven low to GND and high to +3.6V. Driving IN_ rail-to-rail minimizes power consumption.
Chip Information
TRANSISTOR COUNT: 228 PROCESS: CMOS
Maxim Integrated
16
15
14
13
16
15
14
13
16
15
14
+
NO2 COM2 N.C. IN2
+
12 11
MAX4751 IN4 NO4 N.C. COM4 NC2 COM2 N.C. IN2
+
12 11
MAX4752 IN4 NC4 N.C. COM4 NC2 COM2 N.C. IN2
1 2 3
*EP
1 2 3
*EP
1 2
MAX4753
13
12 11 10
*EP
10 9 7 8
10 9 7 8
3 4
9 7
NO3
NO3
COM3
NC3
COM3
QFN
*CONNECT EP TO GND MAX4751 INPUT LOW HIGH SWITCH STATE OFF ON INPUT LOW HIGH
QFN
*CONNECT EP TO GND MAX4752 SWITCH STATE ON OFF INPUT LOW HIGH
QFN
*CONNECT EP TO GND MAX4753 SWITCHES 1, 8 OFF ON SWITCHES 2, 4 ON OFF
Package Information
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE 14 TSSOP 16 QFN PACKAGE CODE U14+1 G1633+2 OUTLINE NO. 21-0066 21-0102 LAND PATTERN NO. 90-0113 90-0215
10
COM3
IN3
IN3
GND
GND
IN3
GND
Maxim Integrated
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 ________________________________ 11
2013 Maxim Integrated Products, Inc. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.