PHO1O-CHLMICAL

MACHINING
PHO1O-CHLMICAL
MACHINING
David Smart
UK Sales Manager
David Smart
UK Sales Manager
WHY PHOTOCHEMICAL MILLING ?
(Chemical Milling)
WHY PHOTOCHEMICAL MILLING ?
(Chemical Milling)
Only method of producing a component without
changing the structure of the substrate
Cheap method of manufacture
Flexible tooling
What is Photochemical Machining/
Chemical Milling?
What is Photochemical Machining/
Chemical Milling?
The selective etching of metal substrates to
produce a required component
TYPES OF ETCHANT
TYPES OF ETCHANT
Ferric Chloride
Ferric Nitrate
Used to etch Ferrous metals, Brass,
Copper, Nickel, Aluminium
Used to etch Silver and silver alloys
and Molybdenum
The Photo-Chemical
Milling Industry
has never had a dedicated
chemical supplier
The Photo-Chemical
Milling Industry
forced to use processes designed
for the lesser requirements of the
PCB Industry
Requirements for the
Chemical Milling Industry
more difficult to meet
than those of the
PCB Industry
MacDermid
has the technology
to pass the
Chemical Milling Industries
most stringent requirements
Differences in Copper
Substrates
1. PCB Industry
Formed by electroplating pure
copper/100m thick.
2. Chemical Milling
Hot rolled from ingots
impure copper/200-400 thick
very severe soiling problems.
Types of metals that are
Chemically-milled
Copper
Alloy 42 Kovar
Mild Steel
Stainless Steel
Brass
Aluminium
The use of a properly
formulated alkaline cleaner
is the most cost effective way
to prepare metals for
photo-resist application
Pre-Cleaning Philosophy
Production processes involved in
Manufacture
Production Process - Stage 1
Production Process - Stage 1
Material Storage and Cutting
Production Process - Stage 2
Production Process - Stage 2
Panel Cleaning and Drying
Can be either vertical or horizontal
Production Process - Stage 3
Production Process - Stage 3
Laminating, Exposure and Developing
Production Process - Stage 4
Production Process - Stage 4
Typical photo-tool
Spray Developing of image
Laminating, Exposure and Developing
Etching of Image with Ferric Chloride
Production Process - Stage 5
Production Process - Stage 5
Production Process - Stage 6
Production Process - Stage 6
Strip Dry-film Etch Resist
Cut panel Cleaned Laminated Imaged
Developed Etched Stripped
Panel Appearance After Each Stage
Panel Appearance After Each Stage
Processes for Chemical Milling
Processes for Chemical Milling
Alkaline
Clean
Circamac 104
Rinse
Acid Clean/
Nano-etch
Circamac 115 NE Copper Cleaner or
Circamac 117 KE Cleaner
Rinse Rinse
Photo-resist
Application
and Imaging
Dry
Develop
Circamac 280 HWT
Developer
Aquamer Anti-foam 2
Rinse
Etch
Circamac 290
Etchant CM
Circamac 295
Oxidant
Rinse Resist Strip Rinse Rinse Dry
Aquamer MI 200
Aquamer PR 200
Aquamer MP 500
Circamac 202
Circamac 256
Final Finishing Stage
Final Finishing Stage
Copper and brass can be
required to be finished with
either electro plated
nickel or
nickel and tin or
nickel and gold
Sterling Silver
Etched parts are often formed
e.g. to make boxes or
screens for printed circuit
boards - RF screening cans
Etching Factors
Etching Factors
Solder Paste Stencil Production
Solder Paste Stencil Production
A stencil is ..
A sheet of metal with holes in it
- used to deposit solder paste
An Essential tool,
the design and optimisation of which
is critical to achieving consistent
printed results and product quality
OR
Stencil Manufacturing Technology
Stencil Manufacturing Technology
Electroforming
Accurate,Cost effective stencil solutions
Used for component pitches down to 0.635mm
Improved dimensional accuracy for finer pitch requirements
Used for component pitches down to 0.4mm
Laser-formed Stencil material is electroformed
and the apertures are lasered
Precision Etching(Photo Chemical Machining)
Laser Cutting
Provides the best paste release of all the technologies
Can be used for all components and packages
Processes for Chemical Milling of Stainless
Steel Solder Paste Screens
Alkaline
Clean
Circamac 104
Rinse
Acid Clean/
Nanoetch
Circamac 117 KE
Rinse Rinse
Photoresist
Application
and Imaging
Dry
Develop
Circamac 280 HWT
Developer
Aquamer Anti-foam 2
Rinse
Etch
Circamac 290
Etchant CM
Circamac 295
Oxidant
Rinse Resist Strip
Circamac 202
Circamac 256
Rinse Rinse Dry
Aquamer
Stencil Blank
Etchant
Photo resist
Exposed aperture
Final etched/required size
1
ST
Subtractive process..Precision etching
(PCM)
1
ST
Subtractive process..Precision etching
(PCM)
Latest Manufacturing Technology
Conductive Mandrel
Photo-Resist
Anode Basket
Nickel pellets
Electroforming Process
Electroforming Process
A
Metal deposit
Typical Electroformed aperture profile
Typical Electroformed aperture profile
Trapezoidal Aperture formation
Flexible metal blade
Trapezoidal Apertures
Consistent height Uniform Deposits
Optimised Paste Release for Finer Pitch Printing
Optimised Paste Release for Finer Pitch Printing
Would you choose the bucket or the drainpipe?
Multi-level stencils
Multi- level stencils
Multi- level stencils
Able to achieve the paste volumes required by all components
Standard thickness
Extra height for SM connectors, power devices and PLCCs
Reduced deposits for fine pitch applications
New Technology - Microstructures
New Technology - Microstructures
Manufacturing of high density
circuits -
Manufactured by electroforming
Typical track and gap of 15 - 25
microns
PRODUCTS FOR CHEMICAL MILLING
26104 Circamac 104 Copper Cleaner - Alkali spray cleaner to remove tenacious soils used with Circamac 115 before Photo-mech
26016 Circamac 115 Copper Cleaner NE - Low foaming cleaner / nanoetch also promotes resist adhesion
26017 Circamac 117 Chemcleaner KE - Low foaming cleaner formulated for steel and iron alloys prior to photo resist lamination
19257 MacuPrep G4 - Stabilised micro-etch for copper and brass, provides ultra fine surface
24712 Canclean SPA 2 Aluminium Cleaner - Spray cleaner for aluminium prior to photo resist lamination
26502 Circamac 202 Resist Stripper - Effectively removes full aqueous dry film resist leaving a residue free surface
26015 Circamac 256 Resist Stripper - Removes dry film resist effectively and efficiently from fine line/spacing, for spray applications
26280 Circamac 280 HWT Developer - A concentrated liquid alkaline solution to develop dry film resist with water softening agents
19798 Aquamer Anti-foam 2 - A solvent free, easily dispersed, non silicone defoamer for use in acid and alkaline aqueous solutions
26290 Circamac 290 Etchant CM - Ferric Chloride etch for the rapid etching of all grades of copper, brass, steel, and aluminium
46346 Circamac 295 Re-Gen Sodium Chlorate Solution (40%) - Used to regenerate ferric chloride solutions.
Aquamer MP 500 Series Superior dry-film for acid etching resist available in a variety of thicknesses
Aquamer PR 200 Series Superior dry-film for acid etching resist available in a variety of thicknesses