Final Report Final

INDUSTRIAL AUTOMATION BY ZIGBEE AND GSM TECHNOLOGY
ACKNOWLEDGEMENT
First and foremost we wish to divulge our heart felt thanks to our
honorable Chairman Mr. Lion Dr R.SUDARARAJAN. M.Sc., M.Ed., Secretary
Mr. Lion R.ARUL. B.Sc. and other Trust members for providing all the facilities to
develop our project successfully.
We are intensely obliged to our deep sense of gratitude to our Principal Mr.
Lion Dr R.SUDARARAJAN. M.Sc., M.Ed., for his patronage and excellent
facilities made available to accomplish this project successfully.
We are highly indebted to express our thanks to our Head of the
Department & Guide Mr. M.JAYAPRAKASH. B.E., for his valuable and continuous
guidance, suggestions constructive criticism and encouragement which contributed
immensely in completing this project successfully.
We are to express our thanks to all our Staff members, Lab assistants and
Friends for their kind co-operation and constant encouragement rendered to make our
project successfully.
Last but not the least; we are actually elated in thanking our beloved parents and
family for this virtuous support.
1 SALEM KONGU POLYTECHNIC
COLLEGE, VEERAPANDI
ABSTRACT
Since its inception, the ZigBee Alliance has worked with a singular focus: create a much
needed global wireless language capable of giving voices to the myriad of everyday devices
which surround us as we go about our daily lives. This focus has been aimed at the little devices,
often overlooked in an IT centric world, such as light switches, thermostats, electricity meters,
remote controls as well as more complex sensor devices found abundantly in the health care,
commercial building and industrial automation sectors. As a result, ZigBee Alliance members
have created a wireless standard offering extraordinary control, expandability, security, ease-of-
use and the ability to use ZigBee technology in any country around the world.
Today, organizations use ZigBee to effectively deliver solutions for a variety of areas
including consumer electronic device control, energy management and efficiency, home and
commercial building automation as well as industrial plant management. With this
comprehensive set of attributes, the nonprofit, open membership and volunteer driven Alliance
has become a thriving ecosystem of more than 300 members. As an ecosystem, the Alliance
offers everything prospective product and service companies need to develop ZigBee products
and services and benefit from the Alliances competitive and stable supply chain.
The development of GSM is the first step towards a true personal communication system
that will allow communication anywhere, anytime, and with anyone. The functional architecture
of GSM, employing intelligent networking principles, and its ideology, which provides enough
standardization to ensure compatibility, but still allows manufacturers and operators freedom,
has been widely adopted in the development of future wireless systems.
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CONTENTS
CHAPTER
NO.
TITLE
PAGE
NO.
1
INTRODUCTION
2 CONVENTIONAL METHOD
2.1 Introduction
2.2 Block diagram
2.3 Disadvantages
3 PROPOSED METHOD
3.1 Introduction
3.2 Block Diagram
3.3 Block diagram Explanation
4 CIRCUIT DESIGN
4.1 Circuit Diagram
4.2 Circuit Diagram Explanation
5
HARDWARE USED
5.1. Temperature Sensor-LM35
5.2. Micro controller
5.2.1 Types
5.2.2 AVR Microprocessor
5.2.2.1 ATMega16 Processor
5.2.2.2 ATmega 128 Processor
5.3 Pin diagram
5.3.1 PIN Diagram Atmega128
5.3.2 PIN Diagram ATmega 16
5.4 PIN Descriptions
5.5 AVR core elements
5.6 GSM Modem
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5.6.1 INTRODUCTION
5.6.2 Model of GSM Modem
5.6.3 Features of GSM Kit
5.6.4 GSM Modem-sim300
5.6.4.2 GSM Modem Versions
5.6.4.3 Product concept
5.6.4.4 sim300 Key features
5.6.4.5 Application interface
5.6.4.6 Operational descriptions
5.7 Controlling Circuit
5.7.1 Relay
5.7.2 Advantages
5.8 Wireless communication system
5.8.1 ZigBee
5.8.1.1 Network topologies
5.8.1.2 Star network formation
5.8.1.3 Peer to Peer topologies
5.8.1.4 Secured mode
5.9 Software implementation
5.9.1 Embedded C:
5.9.2 AVR open source programmer
5.9.3 Algorithm
5.9.4 Setting the C compiler options
5.9.5 Transferring the compiled program to the AVR Chip
6 ADVANTAGES AND APPLICTIONS
7
CONCLUSION
8 BIBILOGRAPHY
9 ENTREPRENEURSHIP
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CHAPTER 1
INTRODUCTION
PROLOUGE
The project will act as problem solver in industries where the temperature plays a vital
role for the manufacturing process to get the required quality output of bulk drugs,
pharmaceutical, chemicals etc. The main objective of the project is to monitor, control the load
and temperature during the manufacturing process of the above said industries using the sensor
devices and wireless communication. We are building the setup such that our system gives an
alarm when temperature goes abnormal; it also sends SMS using GSM technology for the
concerned authority. In turn the controlling is done by switching the control devices by a reply
SMS as well as the controlling can also be done using ZigBee protocol in a short distance
communication range.
HIGHLIGHT OF THE WORK
Device controlled by remote places
Effective wireless technologies to be used
Less cost and compact system
Long distance data transmission using wireless technology
SCOPE AND OBJECTIVE
When comes to pharma industries cGMP (current Good Manufacturing Practices)
auditors like USFDA, EU, ISO, TGA, etc., has taken a survey which says that the quality of the
product deviates mainly due to human errors and inadequate controlling system. The main scope
of our project is to fulfill these gaps and to meet the standard quality norms set by these
administrations.
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DESIGN
An embedded system is a special purpose computer system designed to perform one or a
few dedicated functions operating with a real time computing is dedicated constraints. It is
usually embedded as part of a complete device including hardware and mechanical parts. In
contrast, a general-purpose computer, such as a personal computer, can do many different tasks
depending on programming. Embedded systems have become very important today as they
control many of the common devices we use.
Since the embedded system is dedicated to specific tasks, design engineers can optimize
it, reducing the size and cost of the product, or increasing the reliability and performance.
CHARACTERISTICS
Embedded systems are designed to do some special tasks, rather than be general
purpose computers for multiple tasks. Some also have real time performance
constraints that must be met, for reason such as safety, usability; others may have low
or no performance requirements, allowing the system hardware to be simplified to
reduce costs.
Embedded systems are not always a separate device. Most often they are physically
built in to the devices they control.
The software used for embedded is called as firmware. And it is stored in the flash
memory or in the ROM memory.
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CHAPTER 2
CONVENTIONAL METHOD
2.1 INTRODUCTION
At present temperature monitoring and controlling is done by using PLC, SCADA &
DCS systems. This system based on wireless (GSM) and wired system constituting of LAN
system. In the market study we had found that there is one product of this kind and a detailed
study is given below.
2.2 BLOCK DIAGRAM
Figure 2.2 Block diagram of Conventional Method
2.3 DISADVANTAGES
In the above system the sensor nodes are connected to the server using LAN connection
(which is of wire type), here the main disadvantage is to lay LAN cables from the server to all
controlling sensors and devices. It will increase the project cost as well as maintenance and
running cost. Since placing and routing the cables also space constraint. To overcome the above
difficulties we are proposing a complete wireless system.
COLLEGE, VEERAPANDI
CHAPTER 3
PROPOSED METHOD
3.1 INTRODUCTION
The status of the product based on the temperature can be monitored and controlled time
to time by concerned quality control authority in work place using ZigBee as well as anywhere
in the GSM accessing area.
3.2 BLOCK DIAGRAM
Figure 3.2.1 Sensor Unit
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Figure 3.2.2 Remote Unit
3.3 BLOCK DIAGRAM EXPLANATION
The above block diagram consists of sensor unit and remote unit. The sensor unit is
placed in the reactor end and responsible for monitoring the temp and sending it to the remote
unit using Zigbee technology. The remote unit is used for controlling the temperature and
monitoring the same. This unit consists of GSM and Zigbee for communication purpose.
COLLEGE, VEERAPANDI
CHAPTER 4
CIRCUIT DESIGN
4.1 Circuit Diagram: Remote unit
T i t l e
S i z e D o c u m e n t N u m b e r R e v
D a t e : S h e e t o f
0 0 0 3 1 . 0 1
T E M P . C O N T R O L L E R S Y S T E M
B
1 1 S a t u r d a y , M a y 2 1 , 2 0 1 1
R 2 1 0 K 5 V
L 1
L C D
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
1 5
1 6
C 7
0 . 1 u F
C 8
0 . 1 u F
C 1 G S M T X
C 1 G S M R X G S M R X
G S M T X
G N D
V C C
V O
1
2
.
0

M
H
Z
1
2 2 P F 2 2 2 P F 1
L D 7
C 1 G S M R X
P 1
G S M C O N N
5
9
4
8
3
7
2
6
1
B K +
K P 4
B K -
L D 7
L D 6
L D 5
L D 4
K P 3
L R S
L R D
L E
K P 2
K P 1
R 3
2 2 0 E
C 2 C 1
U 1
M A X 2 3 2
C 1 +
1
C 1 -
3
C 2 +
4
C 2 -
5
V +
2
V -
6
R 1 O U T
1 2
R 2 O U T
9
T 1 I N
1 1
T 2 I N
1 0
R 1 I N
1 3
R 2 I N
8
T 1 O U T
1 4
T 2 O U T
7
5 V
C 5
0 . 1 u F
C 6
0 . 1 u F
C 1 3
0 . 1 u F
Z B R X C 2 Z B R X
U 2
M A X 2 3 2
C 1 +
1
C 1 -
3
C 2 +
4
C 2 -
5
V +
2
V -
6
R 1 O U T
1 2
R 2 O U T
9
T 1 I N
1 1
T 2 I N
1 0
R 1 I N
1 3
R 2 I N
8
T 1 O U T
1 4
T 2 O U T
7
L C D
D I S P L A Y
C 1 1
0 . 1 u F
P 2
G P S C O N N
5
9
4
8
3
7
2
6
1
C 1 2
0 . 1 u F
Z B T X
C 1 0
0 . 1 u F
S
W
2
S
W
5
S
W
3
C 2 Z B T X
S
W
4
C 2 Z B T X
K
P
1
K
P
3
K
P
2
C 2 Z B R X
K
P
4
L E
C 1 G S M T X
K
E
Y

P
A
D
G S M R X
G S M T X
Z B T X
Z B R X
Z I G B E E S E R I A L C O M M .
G S M S E R I A L C O M M .
T o G S M
T o Z I G B E E
L R D
L R S
L D 4
L D 5
L D 6
5 V
d e c o u p l i n g c a p a c i t o r s
C 4 C 3
U 3
A T m e g a 1 6 2
P B 2 ( R x D 1 / A I N 0 )
3
X T A L 2
1 8
X T A L 1
1 9
P B 1 ( T 1 / O C 2 )
2
( I N T 0 / X C K 1 ) P D 2
1 2
( I N T 1 / I C P 3 ) P D 3
1 3
( T O S C 1 / X C K 0 / O C 3 A ) P D 4
1 4
( O C 1 A / T O S C 2 ) P D 5
1 5
G N D
2 0
V C C
4 0
P B 7 [ S C K )
8
P B 6 [ M I S O )
7
P B 5 ( M O S I )
6
( A D 4 / P C I N T 4 ) P A 4
3 5
( A D 5 / P C I N T 5 ) P A 5
3 4
( A D 6 / P C I N T 6 ) P A 6
3 3
( A D 7 / P C I N T 7 ) P A 7
3 2
( I C P 1 / I N T 2 ) P E 0
3 1
( A D 3 / P C I N T 3 ) P A 3
3 6
P B 0 ( T 0 / O C 0 )
1
P B 3 ( T x D 1 / A I N 1 )
4
P B 4 ( S S / O C 3 B )
5
R E S E T
9
( R x D 0 ) P D 0
1 0
( T x D 0 ) P D 1
1 1
( W R ) P D 6
1 6
( R D ) P D 7
1 7
( A D 0 / P C I N T 0 ) P A 0
3 9
( A D 1 / P C I N T 1 ) P A 1
3 8
( A D 2 / P C I N T 2 ) P A 2
3 7
( A L E ) P E 1
3 0
( O C 1 B ) P E 2
2 9
( A 1 5 / P C I N T 1 5 / T D I ) P C 7
2 8
( A 1 4 / P C I N T 1 4 / T D O ) P C 6
2 7
( A 1 3 / P C I N T 1 3 / T M S ) P C 5
2 6
( A 1 2 / P C I N T 1 2 / T C K ) P C 4
2 5
( A 1 1 / P C I N T 1 1 ) P C 3
2 4
( A 1 0 / P C I N T 1 0 ) P C 2
2 3
( A 9 / P C I N T 9 ) P C 1
2 2
( A 8 / P C I N T 8 ) P C 0
2 1
Figure 4.1a Circuit diagram Remote unit
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Circuit diagram: Sensor Unit
O U T P U T
S R X
S T X
R S - 2 3 2
U R X D
T A D C 2
U T X D
T A D C 1
+ 5 V
R L Y
J 1
C O N N F L E X 3
1
2
3
+ 5 V
T A D C 1
R 2
7 5 E
C 8
2 . 2 u F
+ 5 V
T A D C 2
R 3
7 5 E
R 1
1 0 K
C 9
2 . 2 u F
J 2
C O N N F L E X 3
1
2
3
+ 5 V
T E M P .
I / P
C K T
U 1
M A X 2 3 2
C 1 +
1
C 1 -
3
C 2 +
4
C 2 -
5
V +
2
V -
6
R 1 O U T
1 2
R 2 O U T
9
T 1 I N
1 1
T 2 I N
1 0
R 1 I N
1 3
R 2 I N
8
T 1 O U T
1 4
T 2 O U T
7
T
o

Z
I
G
B
E
E

m
o
d
u
l
e
C 1
0 . 1 u F
C 2
0 . 1 u F
C 5
0 . 1 u F
C 4
0 . 1 u F
X 1
X 2
X 1
X 2
Y 1
8 . 0 M H z
C 6
2 2 p F
C 7
2 2 p F
P 1
Z I G C O N N
5
9
4
8
3
7
2
6
1
U R X D
U T X D
S R X
S T X
I C 1
A T M e g a 1 6 - D I P 4 0
P B 0 / ( X C K / T 0 )
1
P B 1 / ( T 1 )
2
P B 2 / ( I N T 2 / A I N 0 )
3
P B 3 / ( O C 0 / A I N 1 )
4
P B 4 / ( S S )
5
P B 5 / ( M O S I )
6
P B 6 / ( M I S O )
7
P B 7 / ( S C K )
8
R E S E T
9
X T A L 2
1 2
X T A L 1
1 3
P D 0 / ( R X D )
1 4
P D 1 / ( T X D )
1 5
P D 2 / ( I N T 0 )
1 6
P D 3 / ( I N T 1 )
1 7
P D 4 / ( O C 1 B )
1 8
P D 5 / ( O C 1 A )
1 9
P D 6 / ( I C P )
2 0
P D 7 / ( O C 2 )
2 1
V
C
C
1
0
G
N
D
1
1
G
N
D
3
1
P A 7 / ( A D C 7 )
3 3
P A 6 / ( A D C 6 )
3 4
P A 5 / ( A D C 5 )
3 5
P A 4 / ( A D C 4 )
3 6
P A 2 / ( A D C 2 )
3 7
P A 3 / ( A D C 3 )
3 8
P A 1 / ( A D C 1 )
3 9
P A 0 / ( A D C 0 )
4 0
P C 0 / ( S C L )
2 2
P C 1 / ( S D A )
2 3
P C 2 / ( T C K )
2 4
P C 3 / ( T M S )
2 5
P C 4 / ( T D O )
2 6
P C 5 / ( T D I )
2 7
P C 6 / ( T O S C 1 )
2 8
P C 7 / ( T O S C 2 )
2 9
A V C C
3 0
A R E F
3 2
U
5
P C 8 1 7
1
2
6
4
O U T P U T
+ 5 V
R E L A Y
1 2 V
< >
R E L A Y
P A R T
Figure 4.1b Circuit diagram sensor unit
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4.2 Circuit Diagram Explanation
The above circuit diagram consist of two units
1) Remote unit:
2) Sensor unit:
Remote Unit
The remote unit consists of ATMega162, ZigBee, GSM, LCD and Keypad. The parts are
connected to the microcontroller in the respective pins. The LCD consists of 16 pins. Four data
pins are connected to the microcontroller and command pins are also connected. The command
pins are RST, EN, CS.
Sensor Unit
The sensor unit consists of ATMeag16, Relay, Cooling fan, Temperature sensor and
ZigBee. The sensor unit senses temperature and send to the remote unit. The remote unit
compares the temperature value with the threshold value (which can be settable), when the value
exceeds the buzzer will give beep sound and same time SMS will be sent to the mobile.
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CHAPTER 5
HARDWARE USED
5.1 TEMPERATURE SENSOR-LM35
INTRODUCTION
The LM35 series are precision integrated-circuit temperature sensors, hose output voltage
is linearly proportional to the Celsius (Centigrade) temperature. The LM35 thus has an
advantage over linear temperature sensors calibrated in Kelvin, as the user is not required to
subtract a large constant voltage from its output to obtain convenient Centigrade scaling. The
LM35 does not require any external calibration or trimming to provide typical accuracies of
14C at room temperature and 34C over a full 55 to +150C temperature range.
Low cost is assured by trimming and calibration at the wafer level. The LM35s low
output impedance, linear output, and precise inherent calibration make interfacing to readout or
control circuitry especially easy. It can be used with single power supplies, or with plus and
minus supplies. As it draws only 60 A from its supply, it has very low self-heating, less than
0.1C in still air. The LM35 is rated to operate over a 55 to +150 temperature range, while the
LM35C is rated for a 40 to +110C range (10 with improved accuracy).The LM35 series is
available packaged in hermetic TO-46 transistor packages, while the LM35C, LM35CA, and
LM35D are also available in the plastic TO-92 transistor package. The LM35D is also available
in an 8-lead surface mount small outline package and a plastic TO-220 package.
FEATURES
Calibrated directly in Celsius (Centigrade)
Linear + 10.0 mV/C scale factor
0.5C accuracy guarantee (at +25C)
Rated for full 55 to +150C range
Suitable for remote applications Low cost due to wafer-level trimming
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Operates from 4 to 30 volts Less than 60 A current drain
Low self-heating, 0.08C in still air
Non linearity only 14C typical
Figure 5.1(a) Basic centigrade temperature sensor
Figure 5.1(b) Full range centigrade temperature sensor
APPLICATIONS
The LM35 can be applied easily in the same way as other integrated-circuit temperature
sensors. It can be glued or cemented to a surface and its temperature will be within about
0.01C of the surface temperature. This presumes that the ambient air temperature almost the
same as the surface temperature; if the air temperature were much higher or lower than the
surface temperature, the actual temperature of the LM35 die would be at an intermediate
temperature between the surface temperature and the air temperature. This is especially true
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for the TO-92 plastic package, where the copper leads are the principal thermal path to carry
heat into the device, so its temperature might be closer to the air temperature than to the
surface temperature.
To minimize this problem, be sure that the wiring to the LM35, as it
leaves the device, is held at the same temperature as the surface of interest. The easiest way
to do this is to cover up these wires with a bead of epoxy which will insure that the leads and
wires are all at the same temperature as the surface, and that the LM35 dies temperature will
not be affected by the air temperature. The TO-46 metal package can also be soldered to a
metal surface or pipe without damage. Of course, in that case the V terminal of the circuit
will be grounded to that metal. Alternatively, the LM5 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath o screwed into a threaded hole in a tank. As
with any IC, LM35 accompanying wiring and circuits must be kept insulated and dry to
avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur.
Printed-circuit coatings and varnishes such as Hum seal and epoxy paints
or dips are often used to insure that moisture cannot corrode the LM35 or its connections.
5.2 MICRO CONTROLLER
5.2.1 TYPES
ARM Processor
PIC Micro Controller
8051 Micro controller
AVR Micro Processor
5.2.2 AVR MICROPROCESSOR
In AVR processor we are using two types of processors. They are
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q ATmega 128
q ATmega 16
5.2.2.1. ATmega 16 PROCESSOR
5.2.2.1 (a) INTRODUCTION
The AVR core combines a rich instruction set with 32 general-purpose working registers.
All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two
independent registers to be accessed in one single instruction executed in one clock cycle. The
resulting architecture is more code efficient while achieving throughputs up to ten times faster
than conventional CISC microcontrollers.
The ATmega16 provides the following features: 16 Kbytes of In-System Programmable
Flash Program memory with Read-While-Write capabilities, 512 bytes EEPROM, 1 Kbyte
SRAM, 32 general purpose I/O lines, 32 general purpose working registers, a JTAG interface for
Boundary scan, On-chip Debugging support and programming, three flexible Timer/Counters
with compare modes, Internal and External Interrupts, a serial programmable USART, a byte
oriented Two-wire Serial Interface, an 8-channel, 10-bit ADC with optional differential input
stage with programmable gain (TQFP package only), a programmable Watchdog Timer with
Internal Oscillator, an SPI serial port, and six software selectable power saving modes. The Idle
mode stops the CPU while allowing the USART, Two-wire interface, A/D Converter, SRAM,
Timer/Counters, SPI port, and interrupt system to continue functioning.
The Power-down mode saves the register contents but freezes the Oscillator, disabling all
other chip functions until the next External Interrupt or Hardware Reset. In Power-save mode,
the Asynchronous Timer continues to run, allowing the user to maintain a timer base while the
rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all I/O
modules except Asynchronous Timer and ADC to minimize switching noise during ADC
conversions.

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In Standby mode, the crystal/resonator Oscillator is running while the rest of the device is
sleeping. This allows very fast start-up combined with low-power consumption. In Extended
Standby mode, both the main Oscillator and the Asynchronous Timer continue to run. The
device is manufactured using Atmels high-density non-volatile memory technology. The On
chip ISP Flash allows the program memory to be reprogrammed in-system through an SPI serial
interface, by a conventional non-volatile memory programmer, or by an On-chip Boot program
running on the AVR core.
The boot program can use any interface to download the application program in the
Application Flash memory. Software in the Boot Flash section will continue to run while the
Application Flash section is updated, providing true Read-While-Write operation. By combining
an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel
ATmega16 is a powerful microcontroller that provides a highly flexible and cost-effective
solution to many embedded control applications.
The ATmega16 AVR is supported with a full suite of program and system development
tools including: C compilers, macro assemblers, program debugger/simulators, in-circuit
emulators, and evaluation kits.
They are having three types of IC mounting technology.
DIP
SMT
SMD
We are using SMT technology. Because
Board has to be reduced.
Cost cutting.
Different and economical design.
Heat designation is effective.
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5.2.2.1 (b) FEATURES
High-performance, Low-power Atmel AVR 8-bit Microcontroller
Advanced RISC Architecture
131 Powerful Instructions Most Single-clock Cycle Execution
4 32 8 General Purpose Working Registers
4 Fully Static Operation
4 Up to 16 MIPS Throughput at 16 MHz
4 On-chip 2-cycle Multiplier
High Endurance Non-volatile Memory segments
+ 16bytes of In-System Self-programmable Flash program memory
+ 512Kbyte Internal SRAM
+ Write/Erase Cycles: 10,000 Flash/100,000 EEPROM
+ Data retention: 20 years at 85C/100 years at 25C(1)
JTAG (IEEE std. 1149.1 Compliant) Interface
Boundary-scan Capabilities According to the JTAG SETA
Extensive On-chip Debug Support
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Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface
Peripheral Features
Two 8-bit Timer/Counters with Separate Prescalers and Compare Modes
One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture
Mode
Real Time Counter with Separate Oscillator
Four PWM Channels
8-channel, 10-bit ADC
Single-ended Channels
Differential Channels in TQFP Package Only
Differential Channels with Programmable Gain at 1x, 10x, or 200x
^ Byte-oriented Two-wire Serial Interface
^ Programmable Serial USART
^ Master/Slave SPI Serial Interface
^ Programmable Watchdog Timer with Separate On-chip Oscillator
^ On-chip Analog Comparator
Special Micro controller Features
M Power-on Reset and Programmable Brown-out Detection
M Internal Calibrated RC Oscillator
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M External and Internal Interrupt Sources
M Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby
M and Extended Standby
I/O and Packages
C 32 Programmable I/O Lines
C 40-pin PDIP, 44-lead TQFP, and 44-pad QFN/MLF
Operating Voltages
C 2.7V - 5.5V for ATmega16L
C 4.5V - 5.5V for ATmega16
Speed Grades
0 - 8 MHz for ATmega16L
0 - 16 MHz for ATmega16
Power Consumption @ 1 MHz, 3V, and 25C for ATmega16L
JActive: 1.1 mA
JIdle Mode: 0.35 mA
JPower-down Mode: < 1 mA
5.2.2.2 ATmega 128 PROCESSOR
5.2.2.2 (a) INTRODUCTION
The Atmel AVR core combines a rich instruction set with 32 general purpose
working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit
(ALU), allowing two independent registers to be accessed in one single instruction executed in
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one clock cycle. The resulting architecture is more code efficient while achieving throughputs up
to ten times faster than conventional CISC microcontrollers.
The ATmega128 provides the following features: 128Kbytes of In-System Programmable
Flash with Read-While-Write capabilities, 4Kbytes EEPROM, 4Kbytes SRAM, 53 general
purpose I/O lines, 32 general purpose working registers, Real Time Counter (RTC), four flexible
Timer/Counters with compare modes and PWM, 2 USARTs, a byte oriented Two-wire Serial
Interface, an 8- channel, 10-bit ADC with optional differential input stage with programmable
gain, programmable Watchdog Timer with Internal Oscillator, an SPI serial port, IEEE std.
1149.1 compliant JTAG test interface, also used for accessing the On-chip Debug system and
programming and six software selectable power saving modes. The Idle mode stops the CPU
while allowing the SRAM, Timer/Counters, SPI port, and interrupt system to continue
functioning. The Power-down mode saves the register contents but freezes the Oscillator,
disabling all other chip functions until the next interrupt or Hardware Reset. In Power-save
mode, the asynchronous timer continues to run, allowing the user to maintain a timer base while
the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all I/O
modules except Asynchronous Timer and ADC, to minimize switching noise during ADC
conversions.
In Standby mode, the Crystal/Resonator Oscillator is running while the rest of the device
is sleeping. This allows very fast start-up combined with low power consumption. In Extended
Standby mode, both the main Oscillator and the Asynchronous Timer continue to run.
The device is manufactured using Atmels high-density non-volatile memory technology.
The On chip ISP Flash allows the program memory to be reprogrammed in-system through an
SPI serial interface, by a conventional non-volatile memory programmer, or by an On-chip Boot
program running on the AVR core. The boot program can use any interface to download the
application program in the application Flash memory.
Software in the Boot Flash section will continue to run while the Application Flash
section is updated, providing true Read-While-Write operation. By combining an 8-bit RISC
CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel ATmega128 is a
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powerful microcontroller that provides a highly flexible and cost effective solution to many
embedded control applications.
The ATmega128 device is supported with a full suite of program and system
development tools including: C compilers, macro assemblers, program debugger/simulators, in-
circuit emulators, and evaluation kits.
5.2.2.2 (b) FEATURES
+ High-performance, Low-power AtmelAVR8-bit Microcontroller
Advanced RISC Architecture:
133 Powerful Instructions Most Single Clock Cycle Execution
32 x 8 General Purpose Working Registers + Peripheral Control Registers
Fully Static Operation
Up to 16MIPS Throughput at 16MHz
On-chip 2-cycle Multiplier
High Endurance Non-volatile Memory segments
128Kbytes of In-System Self-programmable Flash program memory
4Kbytes EEPROM
4Kbytes Internal SRAM
Write/Erase cycles: 10,000 Flash/100,000 EEPROM
Data retention: 20 years at 85C/100 years at 25C
Optional Boot Code Section with Independent Lock Bits
In-System Programming by On-chip Boot Program
True Read-While-Write Operation
Up to 64Kbytes Optional External Memory Space
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Programming Lock for Software Security
SPI Interface for In-System Programming
JTAG (IEEE std. 1149.1 Compliant) Interface
Boundary-scan Capabilities According to the JTAG Standard
Extensive On-chip Debug Support
Programming of Flash, EEPROM, Fuses and Lock Bits through the JTAG Interface
Peripheral Features
Two 8-bit Timer/Counters with Separate Prescalers and Compare Modes
Two Expanded 16-bit Timer/Counters with Separate Prescaler, Compare Mode
and Capture Mode
Real Time Counter with Separate Oscillator
Two 8-bit PWM Channels
6 PWM Channels with Programmable Resolution from 2 to 16 Bits
Output Compare Modulator
8-channel, 10-bit ADC Single-ended Channel
Byte-oriented Two-wire Serial Interface
Dual Programmable Serial USARTs
Master/Slave SPI Serial Interface
Programmable Watchdog Timer with On-chip Oscillator
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On-chip Analog Comparator
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Special Micro controller Features
+Power-on Reset and Programmable Brown-out Detection
+Internal Calibrated RC Oscillator
+External and Internal Interrupt Sources
+Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby,
and extended standby
+Software Selectable Clock Frequency
+ATmega103 Compatibility Mode Selected by a Fuse
+Global Pull-up Disable
I/O and Packages
53 Programmable I/O Lines
64-lead TQFP and 64-pad QFN/MLF
Operating Voltages
2.7 - 5.5V ATmega128L
4.5- 5.5V ATmega128
Speed Grades
0 - 8MHz ATmega128L
0 - 16MHz ATmega128
Compatibility mode
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By programming the M103C fuse, the AtmelATmega128 will be compatible with the
ATmega103 regards to RAM, I/O pins and interrupt vectors as described above. However, some
new features in ATmega128 are not available in this compatibility mode, these features are listed
below:
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One USART instead of two, Asynchronous mode only. Only the eight least
significant bits of the Baud Rate Register is available.
One 16-bit Timer/Counter with two compare registers instead of two 16-bit time with
three compare registers.
Two-wire serial interface is not supported.
Port C is output only.
Port G serves alternate functions only (not a general I/O port).
Port F serves as digital input only in addition to analog input to the ADC.
Boot Loader capabilities are not supported.
It is not possible to adjust the frequency of the internal calibrated RC Oscillator.
The External Memory Interface can not release any Address pins for general I/O,
neither configure different wait-states to different External Memory Address sections.
In addition, there are some other minor differences to make it more compatible to
Only EXTRF and PORF exist in MCUCSR.
Timed sequence not required for Watchdog Time-out change.
External Interrupt pins 3 - 0 serve as level interrupt only.
USART has no FIFO buffer, so data overrun comes earlier.
Unused I/O bits in ATmega103 should be written to 0 to ensure same operation in
ATmega128
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PIN DIAGRAM
Figure 5.3.1 PIN Diagram ATmega 128

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AT MEGA 128
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Figure 5.3.2 PIN Diagram ATmega 16
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Figure 5.3.2 (a) ATMeag16 pin diagram SMD package
5.4 PIN DESCRIPTIONS
VCC Digital supply voltage. GND Ground.
Port A (PA7..PA0):
Port A serves as the analog inputs to the A/D Converter. Port A also serves as an 8-bit bi-
directional I/O port, if the A/D Converter is not used. Port pins can provide internal pull-up
resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics
with both high sink and source capability. When pins PA0 to PA7 are used as inputs and are
externally pulled low, they will source current if the internal pull-up resistors are activated. The
Port A pins are tri-stated when a reset condition becomes active, even if the clock is not running.
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Port B (PB7..PB0):
Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port B output buffers have symmetrical drive characteristics with both high sink and
source capability. As inputs, Port B pins that re externally pulled low will source current if the
pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes
active, even if the clock is out running. Port B also serves the functions of various special
features of the ATmega16.
Port C (PC7..PC0):
Port C is an 8-bit bi-directional I/O port with intern pull-up resistors (selected for each
bit). The Port C output buffers have symmetrical drive characteristics with both high sink and
source capability. As inputs, Port C pins that are externally pulled low will source current if the
pull-up resistors are activated. The Port C pins are tri-stated when a reset condition becomes
active, even if the clock is not running. If the JAG interface is enabled, the pull-up resistors on
pins PC5(TDI), C3(TMS) and PC2(TCK) will be activated even if a reset occurs. Port C also
serves the functions of the JTAG interface and other special features of the ATmega16.
Port D (PD7..PD0):
Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port D output buffers have symmetrical drive characteristics with both high sink and
source capability. As inputs, Port D pins externally pulled low will source current if the pull-up
resistors are activated. The Port D pins are tri-stated when a reset condition becomes active, even
if the clock is not running. Port D also serves the functions of various special features of the
ATmega16.
XTAL1
Input to the inverting Oscillator amplifier and input to the internal clock operating
circuit. XTAL2 Output from the inverting Oscillator amplifier.
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VCC
A VCC is the supply voltage pin for Port A and the A/D Converter. It should be
externally connected to VCC, even if the ADC is not used. If the ADC is used, it should be
connected to VCC through a low-pass filter.
5.5 AVR CORE ELEMENTS
This section discusses the AVR core architecture in general. The main function of the
CPU core is to ensure correct program execution. The CPU must therefore be able to access
memories, perform calculations, control peripherals, and handle interrupts.
In order to maximize performance and parallelism, the AVR uses Harvard architecture
with separate memories and buses for program and data. Instructions in the program memory are
executed with a single level pipelining. While one instruction is being executed, the next
instruction is pre-fetched from the program memory. This concept enables instructions to be
executed in every clock cycle. The program memory is In-System Reprogrammable Flash
memory.
Six of the 32 registers can be used as three 16-bit indirect address register pointers for
Data Space addressing enabling efficient address calculations. One of these address pointers
can also be used as an address pointer for look up tables in Flash Program memory. These added
function registers are the 16-bit X-, Y-, and Z-register, described later in this section.
The ALU supports arithmetic and logic operations between registers or between a
constant and a register. Single register operations can also be executed in the ALU. After an
arithmetic operation, the Status Register is updated to reflect information about the result of the
operation. Program flow is provided by conditional and unconditional jump and call instructions,
able to directly address the whole address space. Most AVR instructions have a single 16-bit
word format. Every program memory address contains a 16- or 32-bit instruction.
Program Flash memory space is divided in two sections, the Boot program section and
the Application Program section. Both sections have dedicated Lock bits write and read/write
protection. The SPM instruction that writes into the Application Flash memory section must
reside in the Boot Program section. During interrupts and subroutine calls, the return address
program counter (PC) is stored on the Stack.
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ALU Arithmetic Logic unit
The high-performance AVR ALU operates in direct connection with all the 32 general-
purpose working registers. Within a single clock cycle, arithmetic operations between general-
purpose registers or between a register and an immediate are executed. The ALU operations are
divided into three main categories arithmetic, logical, and bit-functions. Some implementations
of the architecture also provide a powerful multiplier supporting both signed/unsigned
multiplication and fractional format. See the Instruction Set section for a detailed description.
Status Register
The Status Register contains information about the result of the most recently executed
arithmetic instruction. This information can be used for altering program flow in order to
perform conditional operations. Note that the Status Register is updated after all ALU operations,
as specified in the Instruction Set Reference. This will in many cases remove the need for using
the dedicated compare instructions, resulting in faster and more compact code. The status
Register is not automatically stored when entering an interrupt routine and restored when
returning from an interrupt. This must be handled by software.

General Purpose Register File
The Register File is optimized for the AVR Enhanced RISC instruction set. In order to
achieve the required performance and flexibility, the following input /output schemes are
supported by the Register file:
One 8-bit output operand and one 8-bit result input
Two 8-bit output operands and one 8-bit result input Two 8-bit output operands and
one 16-bit result input
One 16-bit output operand and one 16-bit result input.
Stack Pointer
The Stack is mainly used for storing temporary data, for storing local variables and for
storing return addresses after interrupts and subroutine calls. The Stack Pointer Register always
points to the top of the stack. Note that the stack is implemented as growing from higher memory
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locations to lower memory locations. This implies that a stack PUSH command decreases the
Stack Pointer.
The Stack Pointer points to the data SRAM stack area where the Subroutine and Interrupt
Stacks are located. These Stack spaces in the data SRAM must be defined by the program before
any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to
point above $60. The Stack Pointer is decremented by one when data is pushed onto the Stack
with the PUSH instruction; and it is decremented by two when the return address is push onto the
Stack with subroutine call or interrupts.
The Stack Pointer is incremented by one when data is popped from the Stack with the
POP instruction, and it is incremented by two when data is popped rom the Stack with return
from subroutine RET or return from interrupt RETI.
The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The
number of bits actually used is implementation dependent. Note that the data space in some
implementations of the AVR architecture is so small that only SPL is needed. In is case; the SPH
Register will not be present.
5.6 GSM MODEM
5.6.1 INTRODUCTION
Short for Global System for Mobile Communications, GSM is a digital cellular
communications system. It was developed in order to create a common European mobile
telephone standard but it has been rapidly accepted worldwide. GSM is designed to provide a
comprehensive range of services and features to the users not available on analogue cellular
networks and in many cases very much in advance of the old public switched telephone network
(PSTN). In addition to digital transmission, GSM incorporates many advanced services and
features like worldwide roaming in other GSM network.
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5.6.2 MODEL OF GSM MODEM
FIGURE 5.6.2 MODEL OF GSM MODEM
q Sim300 - GSM/GPRS engine.
q Works on frequencies EGSM 900 Mhz, dcs 1800 Mhz and pcs 1900 Mhz.
q Sim300 features GPRS multi-slot class 10/ class 8 (optional) and supports the GPRS
coding schemes.
5.6.3 FEATURES OF GSM KIT
This GSM modem is a highly flexible plug and play quad band GSM modem for direct
and as integration to rs232.
M Supports features like voice, data/fax, SMS, GPRS and integrated TCP/IP stack.
M Control via at commands.
M Use ac dc power adaptor with following ratings dc voltage: 12v /1a.
M Current consumption in normal operation 250ma, can rise up to 1amp while
transmission.
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5.6.4 GSM MODEM-SIM300
5.6.4.1 INTRODUCTION
This document describes the hardware interface of the simcom sim300 module that
connects to the specific application and the air interface. As sim300 can be integrated with a
wide range of applications, all functional components of sim300 are described in great detail.
This document can help you quickly understand sim300 interface specifications,
electrical and mechanical details. With the help of this document and other sim300 application
notes, user guide, you can use sim300 module to design and set-up mobile applications quickly.
5.6.4.2 GSM MODEM VERSIONS
Table 1
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5.6.4.3 PRODUCT CONCEPT
Designed for global market, sim300 is a tri-band GSM/GPRS engine that works on
frequencies EGSM 900 Mhz, dcs 1800 Mhz and pcs1900 Mhz. Sim300 provides GPRS multi-
slot class 10 capability and support the GPRS coding schemes cs-1, cs-2, cs-3 and cs-4.

With a tiny configuration of 40mm x 33mm x 2.85 mm, sim300 can fit almost all the
space requirement in your application, such as smart phone, pda phone and other mobile device.

The physical interface to the mobile application is made through a 60 pins board-to-board
connector, which provides all hardware interfaces between the module and customers boards
except the rf antenna interface.
* The keypad and SPI LCD interface will give you the flexibility to develop
customized applications.
* Two serial ports can help you easily develop your applications.
Two audio channels include two microphones inputs and two speaker outputs. This can
be easily configured by at command.
Sim300 provide RF antenna interface with two alternatives: antenna connector and
antenna pad. The antenna connector is murata mm9329-2700. And customers antenna can be
soldered to the antenna pad. The sim300 is designed with power saving technique, the current
consumption to as low as 2.5ma in sleep mode. The sim300 is integrated with the tcp/ip
protocol extended tcp/ip at commands are developed for customers to use the tcp/ip protocol
easily, which is very useful for those data transfer applications.
5.6.4.4 SIM300 KEY FEATURES
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Table 2
5.6.4.5 APPLICATION INTERFACE
All hardware interfaces except rf interface that connects sim300 to the customers cellular
application platform is through a 60-pin 0.5mm pitch board-to-board connector. Sub-interfaces
included in this board-to-board connector are described in detail in following chapters:
Power supply
Dual serial interface
Two analog audio interfaces
Sim interface
5.6.4.6 OPERATIONAL DESCRIPTIONS
Power supply
The power supply of sim300 is from a single voltage source of vbat= 3.4v...4.5v. In some
case, the ripple in a transmit burst may cause voltage drops when current consumption rises to
typical peaks of 2a, so the power supply must be able to provide sufficient current up to 2a. For
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the vbat input, a local bypass capacitor is recommended. A capacitor (about 100f, low esr) is
recommended. Multi-layer ceramic chip (mlcc) capacitors can provide the best combination of
low esr and small size but may not be cost effective. A lower cost choice may be a 100 f
tantalum capacitor (low esr) with a small (1 f to 10f) ceramic in parallel, which is illustrated as
following figure. And the capacitors should put as closer as possible to the sim300 vbat pins. The
following figure is the recommended circuit.
Figure 5.6.4.6(a) Power supply
The following figure is the vbat voltage ripple wave at the maximum power transmit
phase, the test condition is vbat=4.0v, vbat maximum output current =2a, c
a
=100 f tantalum
capacitor (esr=0.7) and c
b=4.7f.
Power supply pins on the board-to-board connector
Eight vbat pins of the board-to-board connector are dedicated to connect the supply
voltage; four gnd pins are recommended for grounding. Backup can be used to back up the rtc.
Minimizing power losses
Please pay special attention to the supply power when you are designing your
applications. Please make sure that the input voltage will never drops below 3.4v even in a
transmit burst during which the current consumption may rise up to 2a. If the power voltage
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drops below 3.4v, the module may be switched off. Using the board-to-board connector will be
the best way to reduce the voltage drops. You should also take the resistance of the power supply
lines on the host board or of battery pack into account.
Monitoring power supply
To monitor the supply voltage, you can use the at+cbc command which include three
parameters: voltage percent and voltage value (in mv). It returns the battery voltage 1-100
percent of capacity and actual value measured at vbat and gnd.
The voltage is continuously measured at intervals depending on the operating mode. The
displayed voltage (in mv) is averaged over the last measuring period before the at+cbc command
was executed.
Power up and power down scenarios Turn on sim300
Sim300 can be turned on by various ways, which are described in following
Via pwrkey pin: starts normal operating mode
Via rtc interrupt: starts alarm modes
Turn on sim300 using the pwrkey pin (power on)
You can turn on the sim300 by driving the pwrkey to a low level voltage
For period time. The power on scenarios illustrate as following figure.
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Turn on sim300 using the rtc (alarm mode)
Alarm mode is a power-on approach by using the rtc. The alert function of rtc makes the
sim300 wake up while the module is power off. In alarm mode, sim300 will not register to gsm
network and the software protocol stack is close. Thus the parts of at commands related with sim
card and protocol stack will not accessible, and the others can be used as well as in normal mode.
Use the at+calarm command to set the alarm time. The rtc remains the alarm time if sim300 was
power down by at+cpowd=1 or by pwrkey pin. Once the alarm time expires and executed,
sim300 goes into the alarm mode. In this case, sim300 will send out an unsolicited result code
(urc):
Rdy alarm mode
During alarm mode, using at+cfun command to query the status of software protocol
stack; it will return 0 which indicates that the protocol stack is closed. Then after 90s, sim300
will power down automatically. However, during alarm mode, if the software protocol is started
by at+cfun=1, 1 command, the process of automatic power down will not available. In alarm
mode, driving the pwrkey to a low level voltage for a period will cause sim300 to power down
Turn off sim300
Following procedure can be used to turn off the sim300:
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Normal power down procedure: turn off sim300 using the pwrkey pin
Normal power down procedure: turn off sim300 using at command
Under-voltage automatic shutdown: takes effect if under-voltage is detected
Over-temperature automatic shutdown: takes effect if over-temperature is detected
Turn off sim300 using the pwrkey pin (power down)
You can turn off the sim300 by driving the pwrkey to a low level voltage for period time.
The power down scenarios illustrate as following figure.
This procedure will let the module to log off from the network and allow the software to
enter into a secure state and save data before completely disconnect the power supply.
Before the completion of the switching off procedure the module will send out result code:
Power down
After this moment, no any at commands can be executed. Module enters the power down
mode, only the rtc is still active. Power down can also be indicated by vdd_ext pin, which is a
low level voltage in this mode.
Turn off sim300 using at command
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You can use an at command at+cpowd=1 to turn off the module. This command will
let the module to log off from the network and allow the software to enter into a secure state and
safe data before completely disconnect the power supply.
Power down
After this moment, no any at commands can be executed. Module enters the power down
mode, only the rtc is still active. Power down can also be indicated by vdd_ext pin, which is a
low level voltage in this mode
Under-voltage automatic shutdown
Software will constantly monitors the voltage applied on the vbat, if the measured battery
voltage is no more than 3.5v, the following urc will be presented:
Power low warning
If the measured battery voltage is no more than 3.4v, the following urc will be presented:
Power low down
After this moment, no further more at commands can be executed. The module will log
off from network and enters power down mode, only the rtc is still active. Pow
Restart sim300 using the pwrkey pin
You can restart sim300 by driving the pwrkey to a low level voltage for period time,
same as turn on sim300 using the pwrkey pin. Before restart the sim300, you need delay at least
500ms from detecting the vdd_ext low level on. The restart scenarios illustrate as the following
figure.
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Power saving
There are two methods to achieve sim300 module extreme low power. at+cfun is used
to set module into minimum functionality mode and /dtr hardware interface signal can be used to
set system to be sleep mode (or slow clocking mode).
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Minimum functionality mode
Minimum functionality mode reduces the functionality of the module to a minimum and, thus,
minimizes the current consumption to the lowest level. This mode is set with the at+cfun
command which provides the choice of the functionality levels <fun>=014
0: minimum functionality;
1: full functionality (default);
4: disable phone both transmit and receive rf circuits;
If sim300 has been set to minimum functionality by at+cfun=0, then the rf function and
sim card function will be closed, in this case, the serial ports is still accessible, but all at
commands need rf function or sim card function will not accessible.
If sim300 has disable all rf function by at+cfun=4, then rf function will be closed, the
serial ports is still active in this case but all at commands need rf function will not accessible.
When sim300 is in minimum functionality or has been disable all rf functionality by
at+cfun=4, it can return to full functionality by at+cfun=1.
Sleep mode (slow clocking mode)
Through dtr signal control sim300 module to enter or exit the sleep mode in customer
applications.
When dtr is in high level, at the same time there is no on air or audio activity is required
and no hardware interrupt (such as gpio interrupt or data on serial port), sim300 will enter sleep
mode automatically. In this mode, sim300 can still receive paging or sms from network.
In sleep mode, the serial port is not accessible.
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Wake up sim300 from sleep mode
When sim300 is sleep mode, the following method can wake up the module. Enable dtr
pin to wake up sim300; If dtr pin is pull down to a low levelthis signal will wake up sim300
from power saving mode. The serial port will be active after dtr change to low level about 20ms.
Receive a voice or data call from network to wake up sim300; Receive a sms from network to
wake up sim300
5.7 CONTROLLING CIRCUIT
It consists of
Relay driver
Relay
Relay driver is used between microcontroller and relay.
It consists of NPN Transistor which acts as a switch.
5.7.1 RELAY
A relay is an electrically operated switch. Current flowing through the coil of the relay
creates the morganatic filed which attracts a lever and the changes the switch contacts. The coil
current can be ON or OFF so release have two switch positions and they are double throw
switches.
Relay coils produce brief high voltage Spikes when they are switched OFF and this can
destroy transistor and ICs in this circuit. To prevent damage you must connect a protection diode
across the relay coil.
5.7.2 ADVANTAGES
JRelay can switch AC and DC, transistors can only switch DC.
JIts a better choice for switching large current and high voltages.
JIt can switch many contacts at once.
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5.8 WIRELESS COMMUNICATION SYSTEM
5.8.1 ZIGBEE
5.8.1.1 Network topologies
IEEE 802.15.4 can manage two types of networks, i.e., star topology or the peer-to-peer
topology. Both the topologies are illustrated in Figure 5.8.1.2 In ZigBee, these two topologies
can be combined to build so-called mesh networks.
Figure 5.8.1.1 Network topologies
5.8.1.2 STAR NETWORK FORMATION
The rst FFD that is activated may establish its own network and become a Personal Area
Network (PAN) coordinator. Then both FFD and RFD devices can connect to the PAN
coordinator. All networks within the radio sphere of in sequence must have a unique PAN
identity. All nodes in a PAN must talk to the PAN Coordinator.
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5.8.1.3 PEER TO PEER TOPOLOGY
In the peer-to-peer topology there is also a PAN coordinator, but it differs from the star
topology in that any device can communicate with any other device as long as they are in the
range of one another. The peer-to-peer topology allows more complex network formations to be
implemented, such as the mesh topology.
5.8.1.4 SECURED MODE
In the secured mode the devices can use the following security services.
Access control list.
Data encryption using the Advanced Encryption Standard (AES) 128 bit encryption
algorithm
5.9 SOFTWARE IMPLEMENTATION
5.9.1 EMBEDDED C
System software is the core of community property management intelligent system and it
includes computer and network operating system.
q System software should have a very high reliability and security.
q System software should be easy to operate, it uses a Chinese graphical interface and
its function is directly related to the application software and real-time monitoring
software, etc, of the whole system. It uses multimedia technology to make the system
have the ability of processing sounds and images. User operation interface should
adapt to the qualities of householders and property management company staff of
different levels.
q System software should comply with national, industrial and international standards,
convenient for upgrading many times and supporting new hardware products.
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q System software should have expandability in function.
5.9.2 AVR OPEN SOURCE PROGRAMMER
Open source C++ code
Modular design
Reads device information from AVR Studios XML files
Supports the Boot loader in AVR109
Supports the In-System Programmer in AVR910
Command-line equivalent to AVR Studio command-line tools
Expandable to other programmer types
Expandable to other communication channels, e.g. USB
The AVR Open Source Programmer (AVROSP) is an AVR programmer application
equivalent to the AVR Program tool included in AVR Studio. It is a command-line tool, using
the same syntax as the other command-line tools in AVR Studio. The open source code and its
modular design make it easy to port the application to other platforms and to add support for
other programmer types and Communication channels. Currently, AVROSP supports the
programmers described in AVR109 and AVR910 through the standard PC serial port. The
application note describes how to add more support. AVROSP reads and writes Intel HEX files
and can use an existing AVR Studio installation to get required device parameters. This means
that AVROSP automatically supports all devices supported by AVR Studio. No update is
required for future AVR devices other than keeping your AVR Studio installation up to date.
COLLEGE, VEERAPANDI
5.9.3 ALGORITHM
Figure 4.9.3 Algorithm
5.9.4 SETTING THE C COMPILER OPTIONS
To set the C compiler options for the currently opened project you must use the Project
Configure menu command. A Configure Project tabbed dialog window will open. You must
select the C Compiler and Code Generation tabs.
COLLEGE, VEERAPANDI
5.9.5 TRANSFERRING THE COMPILED PROGRAM TO THE AVR CHIP
This option is available if you select the After Make tab in the Project Configure window.
If you check the Program the Chip option, then after successful compilation/assembly
your program will be automatically transferred to the AVR chip using the built-in Programmer
software. The following steps are executed automatically:
Chip erasure FLASH and EEPROM blank check FLASH programming and verification
EEPROM is programming and verification Fuse and Lock Bits programming.
The Merge data from a ROM File for FLASH Programming option, if checked, will
merge in the FLASH programming buffer the contents of the ROM file, created by the compiler
after Make, with the data from the .
ROM file specified in ROM File Path. This is useful, for example, when adding a boot
loader executable compiled in another project, to an application program that will be
programmed in the FLASH memory.
COLLEGE, VEERAPANDI
CHAPTER 6
ADVANTAGES AND APPLICTIONS
6.2 ADVANTAGES
Created by the ZIGBEE Alliance
Low data rate
Low power consumption
Small packet devices
Low cost and easily available
More reliable
6.3 APPLICATIONS
Industrial process
Chemical process
Temperature monitoring and control in any industrial process
Bio medical instrumentation
Home control devices
BSF communication control systems
HVAC systems
COLLEGE, VEERAPANDI
CHAPTER 7
CONCLUSION
Most traditional control networks use wire technology and this kind of scheme has
shortcomings of poor expansibility, complicated wiring and high cost.
The control network established in this paper by using ZIGBEE wireless technology has
a good expansibility and doesnt need extra wiring, and therefore it is completely in conformity
with the establishment principle of network, ZIGBEE technology is a kind of low-speed, low-
cost, low-power consumption and short-range wireless communication technology and it has
irreplaceable advantages in the use of industrial automations.
COLLEGE, VEERAPANDI
CHAPTER 8
BIBILOGRAPHY
1. AJV deshmukh, Micro controllers, second edition.
2. Dr.K.V.K.K Prasad,Embedded/real time systems: concepts, design and programming-
the ultimate reference Dreamtech.
3. Robert l.boylestad, louis nashelsky,electronic devices and circuit theory prentice-hall
India 2001, sixth edition.
4. D.roy choudry, shail jain,linear integrated circuits, new age international Pvt.ltd. 2000.
5. Steve heath, embedded systems design second edition.
6. Wu Chengdong, Zheng Jungang, Liu Daren, Xie Kun, Study on Smart Home Network
Technology Based on Wireless Sensor Network, Academic Journal of Shenyang Jianzhu
University, Vol. 21, No. 6, pp.753-756, Nov. 2005 (in Chinese)
7. Ren Fengyuan, Huang Haining, Lin Chuang, Wireless sensor network, Journal of
Software, Vol. 14, No. 7, pp.1282-1291, March, 2003 (in Chinese)
8. Li Wenzhong, Duan Chaoyu, C8051F Series MCU and Short Distance Wireless Data
Communication, Beijing, Beijing University of Aeronautics & Astronautics Press, 2007,
pp.188-190 (in Chinese).
9. Qiao Qu, Zhao Guohao, Wei Baohua, Design of Home Safeguard System Based on
GSM Technique, Electronic Engineer, vol.32, No.11, pp.76-78, Nov.2006 (in Chinese)
10. TC35 /TC37 Hardware Interface Description, Version 04. 00. 2002.
11. AT Commands GSM Reference Guide, Revision A. 2003.
12.Jin Rencheng, Zhangf Tianchao, Design and Implementation of Security and Defense
System based on GSM, Computer Application, Vol.24 No.12, pp.75-77, Dec. 2004 (in
Chinese)
COLLEGE, VEERAPANDI
WEBSITES
www.microcontroller.com
www.elektropage.com
www.sensormag.com
www.microchip.com
www.pic.com
www.atmel.com
www.ti.com
COLLEGE, VEERAPANDI
CHAPTER 9
ENTREPRENEURSHIP
ENTREPRENEURSHIP:
Entrepreneurship is the practice of starting new organizations and establishing or
revitalizing organizations. Entrepreneurship ranges in scale form solo projects to major
undertakings creating many to opportunities. A dictionary definition of entrepreneurship is the
organizer or promoter of an activity, especially one who assumes the risks of a business. In
practice, entrepreneurship can be starting your own business inventing something new
techniques of production A sprit of creative thinking and innovation that embraces an entire
organization
SUCCESSFUL ENTREPRENEUR:
A successful entrepreneur is a person who has possession of an enterprise and assumes
significant accountability for the inherent risks the outcome. A successful entrepreneur
promoters the vision. A successful is usually a positive thinker and a decision maker.
DECISIONS AN ENTREPRENEUR:
The various stages of decisions an entrepreneur has to make before reaching the goal of
his projected are converging on idea Business plan Business formation Growth Going public or
marketing
LIST THE TYPES OF INDUSTRIES:
Industries can be listed as followed Small Scale Industries SSI Medium Scale of Industries-
MSI Large Scale Industries- LSI
DEFINE- SMALL SCALE INDUSTRIES
Small Scale Industry in an industry in which the investment in fixed assets in plant and
machinery is more than Rs.25 Lacks, but does not exceed Rs.5 Core.
COLLEGE, VEERAPANDI
QUALITIES OF AN ENTREPRENEUR:
The qualities of an entrepreneur are High levels confidence Version and passion in their
dreams Surround themselves with other like-minded people Highly resourceful, creative and
inventive Seize opportunities and create their own whenever possible Know what motivates
them Spend a substantial amount of time on introspection Refuse to let other people dictate how
they should live Take responsibility for their happiness.
EXPECTATIONS OF ENTREPRENEURSHIP:
It is expected for the entrepreneurship that they will help to Increase number of industries
Increase production Increase employment opportunities Earn foreign exchange through exports
Develop the underdeveloped parts of the country.
VARIOUS SSI THAT CAN FLOURISH IN YOUR DISTRICT:
The various SSI that can flourish in my district are Hollow concrete blocks industries
Coir Industries Glass and ceramics Wood and products Textile products
IDENTIFY THE INFRASTRUCTURAL NEEDS FOR AN INDUSTRY.
The infrastructural needs for an industry are (6 MS) Man Machine Material Money
Market Management and Land, Water, Transport, Electricity.
IDENTIFY THE NATURAL RESOURCES AVAILABLE IN YOUR AREA FOR
STARTING A SSI.
Ground water Good Infrastructure Power supply availability abundant labor.
VARIOUS AGENCIES INVOLVED IN THE ESTABLISHMENT AND
DEVELOPMENT OF VARIOUS SSI:
The various agencies involved in the establishment and development of various SSI are
State financial corporations National small Industries Corporation (NSIC)State Small Industries
Corporation (SSIC)State directorates of industries Commercial banks Industrial Development
Bank of India,(IDBI)Regional rural banks of India National Entrepreneurship Development
Board (NEDB)Entrepreneurship and Business Development Centers (EBDCs)District Industries
Centre (DIC)Tamil Nadu Industrial Investments Corporation (TIIC).
COLLEGE, VEERAPANDI
ROLES OF DISTRICT INDUSTRIES CENTRE:
The roles of district industries Centre are Information on sources of machinery and
equipment Provision of power supply/ telephone connection Promotion of new industrial estates/
growth Centre Land/ shed in industrial estate Approval of project reports of special types
Promotion of Electronic Industries Training through Entrepreneurship Development
programmers Assistance of Raw Materials
NAME SOME OF THE AGENCIES FUNDING SSI:
Some of the agencies funding SSI are State financial corporations National Small
Industries Corporation (NSIC) State Small Industries Corporation (SSIC) State directorates of
industries Commercial banks Industrial development bank of India (IDBI) Regional rural banks
of India District industries Centre.
VARIOUS CONCESSIONS AND INCENTIVES AVAILABLE FOR A SSI
The various concessions and incentives available for a SSI are Transparent subsidy
Capital subsidy Central excise duty Stamp duty Sales tax is not charged on machines purchased
for setting up small industries. Important licenses are given to those entrepreneurs who require
raw material, machines and their spares to be purchased from other countries for running their
units successfully. Training courses for entrepreneurs100% important duty free for 100% Eou.
POINTS TO BE CONSIDERED WITH RELATION TO BUILDING, WATER AND
ELECTRICITY BEFORE A SSI IS STARTED:
BUILDING:
Adequate building space should be available SIDCO or industries estate is preferable for
all amenities Good infrastructure.
ELECTRICITY:
Substation or central station should be near by There should not be fluctuation in voltage.
WATER:
Available water should be soft and plenty There should not be scarcity in all seasons If
not, transportation cost of bringing water should be less
COLLEGE, VEERAPANDI
LIST THE POINTS TO BE CONSIDERED WITH RELATION TO HUMAN
RESOURCE BEFORE A SSI IS STARTED:
Adequate man power must be available near by the industry Wages of labour should be
minimum Plant should be located where trained persons are available.
FACILITIES AVAILABLE IN AN INDUSTRIES ESTATE:
The facilities that should be available in an industrial estate are Transport Power supply
Industrial shed Water facilities communication facilities
IDENTIFY THE VARIOUS TRAINING AGENCIES ASSOCIATED WITH SSI:
The various training agencies associated with SSI National institute of small industry
extension training (NISIET)-New Delhi National institute for entrepreneurship and small
business development (NIESBUD), NOIDA National institute of micro, small and medium
enterprises (NIMSME), Hyderabad Indian institute of entrepreneurship (IIE), Gujarat District
industries centre State industries development corporation-(SIDCO) Tamilnadu industrial
investment corporation.
APPLIED TECHNOLOGY:
Applied technology presents the complex technologies of different manufacturing
process. We can get reparing and testing facilities from the following testing centre Government
approved metallurgical testing labs Government approved technical institutions Government
central workshops Government authorized workshops.
VARIOUS TRAINING AGENCIES AVAILABLE FOR ACQUIRING SSI TRAINING:
The various training agencies available for acquiring SSI training are National institute of
small industry extension training National institute for entrepreneurship and small business
development
DIFFERENT VARIOUS CLASSIFICATIONS OF INDUSTRIES:
The various classifications of industries are Oil industries Chemical industries
Automobile industries Sugar industries Steel and iron industries Textile industries Household
appliances industry Food industries Rubber industries Metallurgical industries Fertilizers Product
manufacturing products.
COLLEGE, VEERAPANDI
Large scale industries (LSI) in which investment in fixed assets in plant and machinery is
more than Rs.5 cores and does not exceed Rs.100 core.
FEATURES OF A SSI:
The features of a SSI are Small scale industries provide vast scope of increasing
employment Require comparatively little capital Meets the demand for consumer products Helps
reduction of prices Accelerate the rate of industries growth They help in equitable distribution of
national wealth.
NAME SOME PRODUCTS THAT MAY NOT NEED ELECTRICITY FOR
PRODUCTION:
The products that may not need electricity for production are Candle manufacturing Fire
crackers manufacturing Match boxes manufacturing Small size wood furniture Clay toys
manufacturing Gold Ornaments manufacturing Mud pot manufacturing Black smithy Gold
smithy.
COLLEGE, VEERAPANDI
FACTORS TO BE CONSIDERED FOR STARTING A SSI:
The factors to be considered for starting a SSI are Analyzing the objectives Consulting
publications and agencies Making a decision Choosing a line Deciding in form of ownership
(sole co-operative/company (private/public) Deciding whether to purchases a going concern or to
start a new one Obtaining the project report from SSI or elsewhere or prepare themselves
Deciding in location and site.
ADVANTAGES OF BECOMING AN ENTREPRENEUR:
Entrepreneurs enjoy the freedom of making their own business decisions and becoming
their own bosses In addition, they also gain the stability and control that could never be achieved
as a regular employee Compared to being regular employees entrepreneurs enjoy much
excitement beginning from the planning stage of the business up to development and realization
Thrill-seekers obviously love being entrepreneurs as they are exposed to too much risk.
FACILITIES AVAILABLE FOR A NEW SSI IN AN INDUSTRIES ESTATE:
The facilities available for a new SSI in an industries estate are Transport Power
Industrial shed Water facilities Communication.
LIST THE VARIOUS GOVERNMENT DEPARTMENTS THAT WOULD BE
ASSOCIATED WITH A SSI:
Ministry of micro, small and medium enterprises (government of India) Industrial
development corporation (TIDCO) Industrial explosives limited (TEL) Industrial guidance and
export promotion bureau (GUIDANCE) Industrial Investment Corporation of Tamil Nadu Ltd.
ENTREPRENEURS FAIL:
An entrepreneur will fail due to Unhealthy relationships with people Lack of sufficient
knowledge un marketing Poor management Lack of personal involvement with consumers All
the ideas are ordinary Not thinking outside the box.(thinking of fresh, new, and brilliant ideas
that will(surely amaze people).
COLLEGE, VEERAPANDI
TYPES OF ENTREPRENEURS:
The idealist entrepreneur is the most common type of entrepreneur likes innovation and
enjoys working on something new or creative or something personally meaningful. The
optimizer entrepreneur is content with the personal satisfaction of simply being a business
owner. The hard worker entrepreneur category includes persons who enjoy putting in long hours
to build a larger more profitable business
The juggler entrepreneur handles everything themselves. They The idealist entrepreneur
is the most common type of entrepreneur likes innovation and enjoys working on something new
or creative or something personally meaningful. The optimizer entrepreneur is content with the
personal satisfaction of simply being a business owner. The hard worker entrepreneur category
includes persons who enjoy putting in long hours to build a larger more profitable business
The juggler entrepreneur handles everything themselves. Are people with lots of energy?
The sustainers entrepreneur category consists of people who like the thought of balancing
work and a personal life. Most often they do not wish the business to grow too large where it will
cut into their personal life too much.
COLLEGE, VEERAPANDI
Address for Communication:
A.S.Selvaraja
S/O. C.Sellamuthu
No. 1/54, West Street, Aniyapuram (Post), Namakkal (Dist), Pin : 637 117
D.Sakthivel
S/O. R.Duraisamy
Alankattar Veedu, Ayegounder Palayam, Ganapathi Palayam (Post), Erode (Dist)
Pin : 638 153
M.Ajith Kumar
S/O. K.Manjunathan
No. 1/115B, Balamurugan Kovil Street, Agraharam (Post), Pallipalayam, tiruchengode (Tk)
Namakkal (Dist), Pin : 638 008
A.Ramalingam
S/O. K.Anbhalagan
No. 54, Chandhra Mahal Thirumana Mandapam, G.R. Nagar, Selanaikempatti bye pass
Salem, Pin: 636 201
COLLEGE, VEERAPANDI
KIT PHOTO GRAPH
SENSOR UNIT
REMOTE UNIT
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