Device qualification at ISIT

Solder Ball Attach WB-300

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

Device qualification at ISIT

Solder Ball Attach WB-300

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

Vakuum Feeding
Placement

Gravity Feeding
Alignment

number of balls limited tooling expensive, long supply time throughput ca. 4 substrates / h ball diameter : 760 300 m prototyping

unlimited umber of balls standard SMD stencil tooling throughput ca. 20 substrates / h ball diameter : 760 250 m series production

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

Wagenbrett WB-300
application of solder spheres 300 m - 760 m wafer 4- 300 mm, PCB qualified for WLP-CSP production at Fraunhofer ISIT 52.000 solder balls per 6-wafer, 500 m Pitch, 300 m throughput: typ. 21 wafer/h Yield: 99,994 %
ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

Wagenbrett WB-300
ball attach after UBM and grinding ball fixation with stencil printed tacky flux positioned balls are tolerant to wafer handling rework is possible after flux print and ball attach

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

Wagenbrett WB-300
Gravity Feeding works with excessive ball numbers multiple balling runs with the same balls is uncritical 3 point adjust is very effective for fast substrate exchange surplus balls run off the stencil by tilting stencil cleaning is usually not required during the processing!

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

Wagenbrett WB-300
cameras cross hairs generator (optional) monitor stencil X,Y, adjust machine control

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

semi automatic machine concept

simplified process control concept for ease of operation robust substrate vacuum fixation controlled roll off of surplus solder balls without operator intervention

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

substrate preadjust
universal fixation of different substrate diameters up to 300 mm preadjust with 3 points customer specific vacuum plates on request cavity for vacuum tweezer ESD-conform design

exchangable vacuum plate

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

solder ball mangement

solder ball stencil distance

wafer

flux deposit

Surplus balls are removed by stencil tilting!

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

solder ball mangement

ESD-conform ball container for surplus balls very low risk of ball defects reduced number of manual handling solder ball management works with SAC lead free alloys, tested with 300 m , 500 m

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

machine setup

easy machine setup with precision height adjust gauge available as option

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

Experience in balling througput WB-300 solder ball attach tool

processing time for ball attach < 3 minutes/wafer new tooling setup < 10 minutes number of missing balls in mean: 2 balls per 52000 balls placed, equals 99,994 % yield quality is nearly independet of operator low demand on operator qualification attached balls can be reworked if necessary

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

statistics of missing balls for ball attach with WB-300

Example of 2 lots 24 wafers
6 5
Number of 4 missing balls after reflow 52000 solder balls per wafer, 6, 300 m , pitch 500 m

Yield
99,990 % 99,992 % 99,994 % 99,996 % 99,998 %

3 2 1 0
W1 W2 W3 W4 W5 W6 W7 W8 W9 W10 W11 W12 W13 W14 W15 W16 W17 W18 W19 W20 W21 W22 W23 W24

100 %

Wafer Nummer
ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

solder ball attach on alternative substrates

FR4 substrate

silicon die
ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie

application specific modifications WB-300

machine options: ESD-blower cross hair generator custom design vacuum plate reduction frame precision height adjust gauge application training at ISIT

ISIT

Fraunhofer Institut

www.wagenbrett.de

Siliziumtechnologie