Equipment & Materials

for 3DIC and Wafer-Level-Packaging

The second complete REPORT and exhaustive DATABASE analyzing in details the equipment and materials tool-box for packaging at the wafer scale

November - 2012

EVG SUSS

PlanOptikt

DuPont

SPTS

Brewer Science

2012

Table of Content
Scope of the report & definitions ... 4
Objectives, key features, glossary

2) 3DIC & WLP technologies process flows & manufacturing trends analysis ...... 110
Focus on Flip-chip wafer bumping .. 112 o Introduction & background o Typical manufacturing process flows o Equipment & Materials suppliers involved o Key process challenges and issues Focus on WL CSP packaging ... 118 Focus on FO WLP packaging ...... 136 Focus on 2.5D silicon interposers ................... 148 Focus on 3D WLP .... 162 Focus on 3DIC & TSV Via Middle .. 170 Focus on Via first TSV for WLP MEMS Oscillator with TSV..205

Executive Summary . 11

1) 3DIC & WLP Equipment & Materials 2011 2017 market forecasts .... 41
Equipment market forecasts (in units and M$ revenues) .... 48
o Breakdown details for Wafer Bonders / die bonders / C2W Bonders / DRIE etching & other drilling tools / CVD / PVD / ECD Plating / Exposure & Lithography / Spray coating / Cleaning / Temporary Bonding & DeBonding / Grinding-Thinning-CMP / Wafer-molding / Inspection & Metrology / Test tools

Competitive landscape and market share of main equipment suppliers detailed

3) DATABASE in excel format ...... 275

Detailed analysis of the activity of the 375+ key equipment & material suppliers of the wafer-levelpackaging tool-box solutions (activity profiling & key contacts)

Materials market forecasts (in M$ revenues) ........ 86

o Breakdown details for Photoresist & coatings / Adhesive tapes / pre-applied & wafer-level underfills / Molding compounds / Plating & cleaning chemistries / Slurries for CMP / Temporary bonding materials/ Gas & precursors / sputtering targets

Conclusions & Perspectives ...... 281 Appendix ....... 286

Competitive landscape and market share of main material suppliers detailed

2012

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Scope of this report coverage

Wafer-level-packaging Platforms
Wafer-Level
Interface / Encapsulation 3D WLP
For MEMS & sensors
(also called 3D SiP sometimes)

Wafer-Level
Electrical Redistribution

Flip-chip & Wafer-Level

Stacking / Integration
3D IC & TSV
Glass / Silicon

WL CSP
Fan-in

FOWLP
Fan-Out

Embedded IC
in PCB / laminate

2.5D interposers

Flip-chip
wafer bumping on BGA

Complete Equipment & Materials Tool-Box covered in this report!

Photo resist & coatings Gas / Indirect mat. Substrates Dry film & Mold compound (chemistries, cleaning, (carriers, cap, precursors adhesive tapes & underfills CMP slurries) interposers) FE / BE / LCD / PCB related equipments
(litho & exposure, etch, deposition, plating, bonding, handling, molding, thinning , dicing, test, metrology, etc) )

2012

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The emerging flavors of the Mid-end

Mid-end infrastructure is growing and is the main leading driver and the fastest growing semiconductor packaging technology with more than 18% CAGR in units over the next 6 years to come Global Wafer-Level-Packaging demand
(in Munits of 300mm wafer eq.)
40.0

3DIC

Volume (in Munits of 300mm wafer eq.)

Yole Developpement October 2012

35.0

3D SiP FO WLP 3D WLP

30.0
25.0 20.0 15.0 10.0 5.0

WL CSP 2.5D interposers

Flip-chip
0.0 2011 2012 2013 2014 2015 2016 2017

Wafer-level-packaging technologies are a huge business opportunity in the future: historically supported by the market growth in flip-chip wafer bumping with electroplated gold, solder bumps and today copper pillars, wafer-level-packages are actually coming in many different flavors, namely Fan-in WLCSP packages, 3D WLP, FO WLP packages, 2.5D Glass / Silicon interposers and of course 3DIC integration with TSV interconnects. As this wafer-level-packaging industry develops over time, we are noticed that a real infrastructure has emerged by itself into what is now being called the Mid-end of the semiconductor manufacturing environment. Indeed, wafer-levelpackages are true Mid-end technologies in the sense that they can all be served in the blur zone of overlap between the IDMs or CMOS foundries' back-end-of-line (BEOL) wafer fabs and the back-end wafer bumping assembly facilities of the OSATs and wafer bumping houses
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2012

Transforming IC Packaging Supply Chain*

* Existing business models represented in red, new
business models in orange
Substrate material suppliers
(FR4, BT resin, Cu clad, etc)

Package substrate laminate suppliers

PWB suppliers
(motherboard)

Design
of chip & package

Silicon
Manufacturing

Front-end

Wafer Level Packaging

Middle -end

Package Assembly & Final test

Back-end

Sub-Module / Sub-systems
Design & Assembly

System / Product

IDMs (Integrated Device Manufacturers) Fab-smart players (foundry services + focused internal investment in manufacturing & critical IP) Integrated wafer / package manufacturing foundries ODM / EMS / DMS
(electronic design & manufacturing services)

OEMs
(Original Equipment Makers)

Fab-less IC players

OSATs (Open Source Assembly & Test houses) Wafer foundries

WLP houses (no need for traditional substrate)
Wafer Bumping houses SiP design houses

PCB / PWB houses with Embedded die capability

Front-end related materials suppliers

FE related equipment suppliers
2012

BE Packaging materials suppliers

BE Packaging equipment suppliers

Passive comp.
& SMT materials

SMT equipment suppliers

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Detailed 3DIC & WLP Process Flow Analysis

Its worth noting that theres a significant difference in how manufacturing is generally performed in the front-end versus in the back-end worlds
The back-end has generally a much greater cost sensitivity but can face scaling issues with time when semiconductor ICs continue to reduce in chip size while increasing in pin-count number On the other hand, front-end related technologies are more expensive initially but could be preferable because of higher repeatability, yield, throughput and because of better perspectives in the long run when it comes to be able to scale down the technology to smaller pitch dimension while maintaining cost pressure

Yoles analysts have updated the previous report equipment & materials based on the different alternatives offered by the present equipment and material tool-box for waferlevel-packaging
All main scenarios are analyzed, including flip-chip wafer bumping trends, Fan-in WLCSP, 3D WLP, FOWLP, 2.5D silicon interposers, 3DIC Via Middle & Via Last process scenarios

2012

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Market Forecasts
For 3DIC / WLP equipment & materials
The wafer-level-packaging market remains a huge business opportunity and shows the greatest potential for significant future growth in the semiconductor industry.
That can be explain by the 3D IC technology which is fundamentally changing how processing is done and offers the opportunity for new equipment modifications and new materials development

Global Equipment & Material market forecast

for 3DIC & Wafer-Level-Packaging (in M$)
$4 000 M

Yole Developpement October 2012

$3 500 M $3 000 M

Sales forecasts (M$)

$2 500 M $2 000 M $1 500 M $1 000 M $500 M $0 M 2011 $869 M $596 M 2012 $646 M $714 M 2013 $867 M $890 M 2014 $1 208 M $1 190 M 2015 $1 725 M $1 503 M 2016 $2 579 M $1 962 M 2017 $3 773 M $2 186 M

Equipment market

Material market

Equipment market Material market

2012

28% 24%

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2011 Global equipment market for 3D TSV & WLP

TOTAL: ~$870M
Wafer bonding

$52M
Others ~$2M; 3%

TB & Debond $43M

TEL ~$7M 5%

Spin coating/ Developer

Spray coating

~$100M
Others: ~$2M; 2%

~$15M
DNS $1M; 6%

Lithography ~$134M

ECD Plating

DRIE

CVD

PVD

$138M
Novellus/ LAM Research : ~$7M; 5%

$30,5M ~$12M
Others: $3,1M; 10%
Othe rs: $0,6 M

~$81M
Others: ~$2M; 3% LAM Research/ Novellus: $0,5M 0,6%

Inspection/ Metrology ~$72M

Grinding ~$27M

Others:
$1,4M;
Starsbaug 5% h $1,4M; 5

Others: ~$3M

TOK ~$4M 15%

TAZM O/ 3M ~$11M 25%

SPTS $10M 33%

AMAT ~$5M; 40%

SUSS ~$11 M 22%

SAMPLE

EVG ~$2 M 12%

AMA T ~$5M 18%

TEL/NEXX ~$1M; 10%

TEL $6M 12%

DNS $8M 8%

ASML ~$23M 17%

TEL/NEXX ~$28M 20% Ebara ~$35M 25%

Others: ~$6$; 9%
Nanometrics: ~$2M; 3%

SUSS $30M 30%

SUSS ~$51M 38%

SPTS $8M; 10% TEL/ NEXX $9,6M 12% Tango Systems $16M 23%
Oerlikon $20M 28%

FOGALE ~$3M; 4%
KLA Tencor $3M 4%

Okamot o $2,7M 10%

ACCRE TECH ~$4,1M 15%

SUSS ~$11 M 25%

Camtek ~$26M 36%

SPTS ~$5M; 15%

EVG $33M 63%

TEL $60M 60%

SUSS ~$13 M 82%

EVG ~$11 M 25%

Ultratech $57M 43%

AMAT/ Semitool $69M 50%

LAM/
Novellu s

$12M 39%

AMAT $24M 34%

Rudolph Technologi es:~$32M 44%

DISCO ~$17,6 M 65%

2012

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2011 Global materials market for 3D TSV & WLP

TOTAL: ~$590M
Strippable plating resists $130M
Permanent dielectric resists $106,2M
Wafer Molding compound

$11M

Plating chemistries $48M

Others $4,8M 10%

Cleaning chemistries $62M

Others: $1,2M; 2%

Slurries for CMP $48M

Others; $0,5$
Hitachi Chemi $1M; 2%

Solder paste $46M

Others $5M; 5%

Dupont $3M; 2%
Dow electronic materials $3M; 2%

Others $14M 13% AZ Electronis Materials $3M; 3% JSR Micro $4M; 4% Sumito Bakelite/ Promerus $7M; 7% Fujifilm $23M; 22%
Others $3,3M 30%

Honeywell $5,0M; 8% AZ Electronis Materials

Shin-Etsu Micro Si $4M; 3% Shin-Etsu Chemical; $4M 3%

OM Group Ultra Pure Chemicals

$10M 20%

$6; 10%
Shin-Etsu Chemical $6M 10% OM Group Ultra Pure Chemicals

Air Products ~$5M 10%

AGC ~$6M 12%

Indium $7M 15%

TOK $26M 20%

Nippon Micrometal $9M 20%

Enthone (Cookson Elect)

$14M 30%

$12M 20% Sekisui Chemicals $14M 30%

AZ Electronis Materials $39M 30%

DOW Chemical $26M 25%

Nagase $7,7M 70%

ATOTECH $19M 40%

Zeon Chemicals $16M 25%

Cabot Micro $36M 75%

JSR Micro $52M 40%

HD Microsystems/ Dupont $28M 26%

Dynaloy $16M 25%

Mitsubishi Materials $14M 30%

2012

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2011 Spin-Coater/ Developer Equipment Market 3D & WLP Market share per equipment supplier
Spin coating & Developer equipment for 3D & WLP 2011 Market Share Breakdown by supplier (in M$)
Dai Nippon SCREEN $8.0 M 8% Others* $2.3 M 2%

SUSS Microtec $30.0 M 30%

Yole Developpement October 2012

TOT ~
100 M$
TEL (Tokyo Electron LTD.) $60.0 M 60%

* SSEC, EVG, TAZMO, TOK, Toray engineering, Ushio

Total market related to the spin coater & developer equipment market is assessed at $100M in 2011. The key providers active in spin coating & developer equipment are:
TEL, SUSS MicroTec and Dai Nippon Screen TEL has strong leadership in the middle-end packaging market especially related to the coating + developer track equipment set SUSS Micro is a key leader in spinc oater dedicated to WLP applications
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2012

10

2011 Strippable Thick Resists Material Market 3D & WLP Market share per material supplier
Strippable thick resist for WLP applications 2011 Market Share Breakdown by supplier (in M$)
Others* $13.0 M 10%

Yole Developpement October 2012

TOK (Tokyo Ohka Kogyo Co., LTD) $26.0 M 20%

TOT ~
130 M$

JSR Micro $52.0 M 40%

AZ Electronic Materials $39.0 M 30%

*Dow Electronic Materials, Dupont, Shin-Etsu Chemical, Shin-Etsu MicroSi

Total market Strippable Thick Resists materials (including negative and positive resins) is assessed at $130M in 2011. The Strippable Thick Resists materials market is fragmented into 3 main leaders:

2012

JSR Micro, AZ Electronic Materials ,TOK

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11

More slides extracts (1/1)

2012

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DATABASE with 375+ key Equipment & Material Suppliers for 3DIC / WLP
The database wad steadily updated with new key equipment & materials suppliers
Along with this new research and updated report, Yole is delivering an excel database screening and profiling the detailed activity of more than 375+ small to medium to giant equipment & material suppliers coming either from Front-end, Back-end assembly, PCB, LCD or Solar industries and providing actual solutions for the 3DIC & wafer-level-packaging tool-box

One of the main move this year was the acquisition of NEXX by TEL, Tokyo Electron, in March 2012, enabling the company to expand and enhance their position in advanced packaging by being involved in electrochemical deposition (ECD) and physical vapor deposition (PVD) systems.

2012

13

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375+ companies cited in this Report / Database

3M, 3MTS, 4Pico, Ablestik, ACCRETECH, ADEKA CORPORATION, Adtec Engineering, Advanced Chemical Company , Advanced Inquiry Systems, Advantest, AGC, AI TEchnology Inc, Aimsolder, AIR LIQUIDE, Air Products, AJI dvanced Jisso Technology, Ajinomoto Fine Techno Co Inc., Akrion systems, AkroMetrix LLC, Alchimer, ALSI, Altatech Semiconductor, AMEC, Amicra Microtechnologies GmbH, AML, Anji Microelectronics, Applied Materials, Applied Relay Testing, Applied Spectra, Asahi Kasei E-Materials Corporation, ASM Pacific Technologies, ASML Netherlands B.V., Assembleon, AST (Samurai), ASYS GmbH, ATI, ATMI, ATOTECH, Auros Tech, Austin American Technology Corp, Axcelis Technologies, Ayumi Industry Co. Ltd., AZ Electronic Materials, Azores Corp, Barth Electronics, BASF, Bergquist Company, Berliner Glass, Blue-M, Boschman Technologies B.V., Brewer Science, Bruker AXS , Cabot electronics, CAMTEK USA, Canon ANELVA, Cascade Microtech, CHAPMAN, Chomerics, Corning, Corning Incorporated, CSM Instruments, Cyantek, Cyber-Technologies, Daxin Materials Corporation, Datacon Technology GmbH (BESI), DCG Systems, DEK semiconductor, DELO, Delta Design, Denka, Disco Corporation, DJ DevCorp, Dai Nippon SCREEN, Dongjin Semichem Co., Doublecheck Semiconductors, Dow Corning Corporation, Dow Electronic Materials, DRY PLASMA SYSTEMS, D-Tek Technology Co.,Ltd, DuPont Electronic Technologies, Dynaloy, DYNATEX International, Eastman Chemical, EBARA Technologies Corp., Ebina Denka, ECI Technology, EEJA, Electroglas Inc, ENF Technology Co .Ltd, Enterprix, Enthone (Cookson Electronics), Epoxy Technology Inc., ERS gmbh, ESEC AG, ESI, Etched in Time Inc, EV Group, Evest Corp., EXCICO, Exelsius, FASSE CO., LTD., Fico molding (BESI), Finetech, FOGALE Nanotech, Frontier Semiconductor, Frt Of America, FSI International, Fuji Polymers, FUJIFILM Electronic Materials, Furukawa America GE Sensing & Inspection, Gore, GPD Global, Inc., Hamamatsu, HamaTech APE GmbH & Co. KG, HD MicroSystems, Henkel Corporation, Heraeus GmbH, Hesse & Knipps, Hitachi Chemical Co., Ltd., Hitachi High Technologies Corporation, Honeywell Electronic Materials, HORIBA Semiconductor, Hoya, IceMOS Technology, ICOS Vision Systems NV, Ikonix Imaging, Indium Corporation, Ishihara Chemical , Ismeca Europe Semiconductor SA, JENOPTIK, Jet Metal, JSR Micro, Kester, KiyoKawa Plating industry, KLA-TENCOR, Koh Young Technology Inc., Kulicke & Soffa, Kyzen Corporation, Laird Technologies, LAM Research Corporation , Laserod, Lasertec Corporation, Lauffer Presses, Leybold Optics USA Inc, LG Chem., Ltd., Life Bioscience, LincoTec, Linde Gas, Lintec, Loadpoint, LORD Corporation, Mapper Lithography, Materion, Mattson Technology, Mechatronic Systemtechnik, MECO, MEMC Electronic Materials, Inc. , Metryx, MicroChem, MicroFab Technologies Inc, Micronic Laser Systems AB, Micronics Japan Co., Mitshubishi Gas Chemical, Mitsubishi Chemical Corporation, Mitsubishi Electric, Mitsubishi Heavy Industry (MHI), Mitsubishi Materials, Mitsubishi Materials Corporation, Mitsui Chemicals, Momentive performance material, MSG Lithoglas AG, MTK Co, Ltd., Mhlbauer, Nagase & Co., Ltd., Namics, Nanda Tech GmbH, NANOPLAS, Nanovea, NEC / SCHOTT, Newport, NEXX Systems, Nikko Metal, Nikon Corporation, Nippon Electric Glass NEG, Nippon Kayaku Co., Ltd., Nippon Sheet Glass NSG, Nissan Chemical Industries, Nitta Haas Inc., Nitto Denko Corporation, Norcom Systems Inc, Nordson ASYMTEK, Inc., Nordson dage, Nordson March, NOVELLUS, nScrypt Inc., Nusil Silicone Technology, Nypro Inc., oak-mitsui technologies, OEM group, Oerlikon, Okmetic, Olympus-ITA, Inc., OM Group Ultra Pure Chemicals Pte. Ltd., OPS, Orbotech Ltd., Oxford Instrument, Pac Tech, Palomar Technologies Inc., Panasonic Denko, PANASONIC Factory Solutions, Philips Applied Technologies, picoDRILL, Plan Optik AG GmbH, Polymatech, Potomac Laser, Praxair.com, Promerus LLC, Protavic America, Inc., PVA TePla AG, Ramgraber GmbH, rasco, REC Silicon, RENA GmbH, Replisaurus Technologies, Ricmar Technology GmbH, Rorze, Rudolph Technologies, Saint-Gobain, SAMCO Inc. , Schmoll Machinen, Schott AG, SCS - Speciality Coating Systems, Sekisui Chemical Co., Ltd., Semiconductor Technologies & Instruments (ASTI), Semprius, Senju Metal Industry Co., Ltd., SENTECH Instruments, SET - Smart Equipment Technology, Seto Engineering Co., Ltd., Shanghai Micro Electronics Equipment , Shanghai Sinyang, Shibaura Mechatronics Corporation, Shibuya Kogyo, Shin-Etsu Chemical Co.,Ltd. , Shin-Etsu MicroSi, Inc, SHINKAWA LTD., Shinko Seiki, Silecs, Singulus, SOITEC, Sokudo Co. Ltd., SolMateS, Solvay, SolVision, SONIX, SONOSCAN, SPP (Sumitomo Precision Products Co., Ltd.), SPTS, SSEC - Solid State Equipment Corporation, Starfire Systems Inc., STIL SA, Strasbaugh, Sumco Corporation, Sumitomo Bakelite, Sumitomo Chemicals, Surface Science Integartion, SUSS Microtec, Sysmelec, Takada, Takatori Ltd., Tamar Technology, Tamarack Scientific, Tango Systems, tecnisco, TEGAL, TEL (Tokyo Electron LTD.), Teradyne, Thin materials AG, Timbre Technologies, tok, TOK (Tokyo Ohka Kogyo Co., LTD), Toray engineering Co.Ltd, Toray Industries, Inc, TOWA Corporation, TRESKY, TRIOPTICS, Ultraspray, Ultratech , ULVAC Inc., Umicore, Uyemura Co.Ltd, Uyemura International Corporation, Veeco, Verigy, Viscom AG, West-Bond, Inc., Xradia, YAMADA CORPORATION, Young Chang Chemical, YoungTek Electronics Corp., Zebra Optical, Zeon Chemicals L.P., Zetta Core, Zygo Corporation, Zymet, Inc.
2012

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About the authors of this report

Amandine Pizzagalli
Amandine recently joined Yole Development Advanced Packaging and MEMS manufacturing teams after graduating as an engineer in Electronics, with a specialization in Semiconductors and Nano Electronics Technologies. She worked in the past for Air Liquide with an emphasis on CVD and ALD processes for semiconductor applications Contact: pizzagalli@yole.fr

Jerome Baron
Jerome is leading the MEMS & Advanced Packaging market research at Yole Developpement. He has been following the 3D packaging market evolution since its early beginnings at device, equipment and material levels. He was granted a Master of Science degree in Nanotechnologies from the National Institute of Applied Sciences in Lyon, France Contact: baron@yole.fr

2012

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Who should be interested in this report?

Equipment & Material suppliers
Assess the TAM total accessible market of your companys related products in the wafer-level-packaging areas Identify technology trends, challenges and precise requirements for each 3DIC / WLP scenarios Screen competition activity, identify possible partnerships or targets for M&As in areas close to your current business

IDMs, CMOS foundries & OSAT players

Get an exhaustive list of the 350+ equipment & materials companies supplying solutions in the different 3DIC and wafer-level-packaging areas Understand technology trends and benchmark several different 3DIC & WLP scenarios including the future trends for PANEL scale packaging based on LCD / PCB infrastructures

R&D organizations & Investors

Monitor the global activity and consolidation currently happing in the semiconductor equipment & material business in order to identify new partners, targets and take the right decision before committing to one particular supplier

PCB substrate manufacturers

Get the complete list of semiconductor packaging equipment & materials companies supplying solutions in the blooming 3DIC & wafer-level-packaging area Identify technology trends, challenges and issues for each 3D packaging scenario

2012

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Yole Developpement
Company Presentation

2012

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Yole activities in Advanced Packaging

Market research, Technology & Strategy

Market Research

Reports
Media business
News feed / Magazines / Webcasts

Consulting services

www.yole.fr

Technology & Marke t Trends

IR

HB-LED Packaging

Osram

2009
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2012

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Our Global Presence & Activity

40% of our activity is in EU Countries

30% of our activity is in North America

Yole Inc.
perkins@yole.fr

Yole Europe
eloy@yole.fr

30% of our activity is in Asia

Yole Korea
yang@yole.fr

Yole Japan
katano@yole.fr

meiling.tsai@yole.com.tw

Yole Taiwan

Yole Dveloppement Lyon (HQ).

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Supporting the Entire Value Chain

Institutions Investors & Advocates

Material & Equipment Suppliers

Device & Module Makers

Integrators & End Users

Yole consultants provide Market Analysis, Technology Evaluation and Business Plan Assessment for clients along the entire value chain
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